WO2017175665A1 - 有機薄膜トランジスタ素子、有機半導体膜形成用組成物、有機半導体膜の製造方法及び有機半導体膜 - Google Patents
有機薄膜トランジスタ素子、有機半導体膜形成用組成物、有機半導体膜の製造方法及び有機半導体膜 Download PDFInfo
- Publication number
- WO2017175665A1 WO2017175665A1 PCT/JP2017/013390 JP2017013390W WO2017175665A1 WO 2017175665 A1 WO2017175665 A1 WO 2017175665A1 JP 2017013390 W JP2017013390 W JP 2017013390W WO 2017175665 A1 WO2017175665 A1 WO 2017175665A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- atom
- organic
- organic semiconductor
- formula
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 205
- 239000010408 film Substances 0.000 title claims abstract description 57
- 239000010409 thin film Substances 0.000 title claims abstract description 50
- 239000000203 mixture Substances 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 150000001875 compounds Chemical class 0.000 claims abstract description 83
- 229910052740 iodine Inorganic materials 0.000 claims abstract description 32
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 31
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 30
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 30
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 26
- 229910052796 boron Inorganic materials 0.000 claims abstract description 25
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 25
- 229910052742 iron Inorganic materials 0.000 claims abstract description 24
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 24
- 229910052718 tin Inorganic materials 0.000 claims abstract description 24
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 21
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 20
- 125000000217 alkyl group Chemical group 0.000 claims description 82
- 125000004429 atom Chemical group 0.000 claims description 81
- 229920000642 polymer Polymers 0.000 claims description 40
- 229910052717 sulfur Inorganic materials 0.000 claims description 33
- 125000004432 carbon atom Chemical group C* 0.000 claims description 32
- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims description 31
- 239000000460 chlorine Substances 0.000 claims description 28
- 125000004434 sulfur atom Chemical group 0.000 claims description 26
- -1 CR A2 Chemical group 0.000 claims description 25
- 229910052757 nitrogen Inorganic materials 0.000 claims description 23
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 23
- 229910052711 selenium Inorganic materials 0.000 claims description 23
- 125000005843 halogen group Chemical group 0.000 claims description 22
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 20
- 125000002947 alkylene group Chemical group 0.000 claims description 19
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 19
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 18
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical group [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 17
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 11
- 125000003367 polycyclic group Chemical group 0.000 claims description 7
- 125000004450 alkenylene group Chemical group 0.000 claims description 6
- 125000004419 alkynylene group Chemical group 0.000 claims description 6
- 125000000962 organic group Chemical group 0.000 claims description 6
- 239000000470 constituent Substances 0.000 claims description 4
- 238000010348 incorporation Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 96
- 238000000034 method Methods 0.000 description 49
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 33
- 125000001424 substituent group Chemical group 0.000 description 32
- 229910052799 carbon Inorganic materials 0.000 description 30
- 239000000758 substrate Substances 0.000 description 29
- 239000000243 solution Substances 0.000 description 23
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 22
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 20
- 238000000576 coating method Methods 0.000 description 20
- 239000011734 sodium Substances 0.000 description 20
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 18
- 239000011135 tin Substances 0.000 description 18
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical class ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 16
- 238000003786 synthesis reaction Methods 0.000 description 16
- 229910052731 fluorine Inorganic materials 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical class ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 11
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 11
- 238000007789 sealing Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 229920000620 organic polymer Polymers 0.000 description 10
- 238000007639 printing Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- PCLIMKBDDGJMGD-UHFFFAOYSA-N N-bromosuccinimide Chemical compound BrN1C(=O)CCC1=O PCLIMKBDDGJMGD-UHFFFAOYSA-N 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000006872 improvement Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- 239000011669 selenium Substances 0.000 description 7
- PBKONEOXTCPAFI-UHFFFAOYSA-N 1,2,4-trichlorobenzene Chemical compound ClC1=CC=C(Cl)C(Cl)=C1 PBKONEOXTCPAFI-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 6
- 125000003342 alkenyl group Chemical group 0.000 description 6
- 125000000304 alkynyl group Chemical group 0.000 description 6
- 125000006841 cyclic skeleton Chemical group 0.000 description 6
- 125000001153 fluoro group Chemical group F* 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 125000005842 heteroatom Chemical group 0.000 description 6
- 229910052809 inorganic oxide Inorganic materials 0.000 description 6
- 125000002950 monocyclic group Chemical group 0.000 description 6
- 125000001624 naphthyl group Chemical group 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 150000001721 carbon Chemical group 0.000 description 5
- 125000004122 cyclic group Chemical group 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000007772 electrode material Substances 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 125000005647 linker group Chemical group 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 4
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 4
- 150000003384 small molecules Chemical class 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- COIOYMYWGDAQPM-UHFFFAOYSA-N tris(2-methylphenyl)phosphane Chemical compound CC1=CC=CC=C1P(C=1C(=CC=CC=1)C)C1=CC=CC=C1C COIOYMYWGDAQPM-UHFFFAOYSA-N 0.000 description 4
- CYPYTURSJDMMMP-WVCUSYJESA-N (1e,4e)-1,5-diphenylpenta-1,4-dien-3-one;palladium Chemical compound [Pd].[Pd].C=1C=CC=CC=1\C=C\C(=O)\C=C\C1=CC=CC=C1.C=1C=CC=CC=1\C=C\C(=O)\C=C\C1=CC=CC=C1.C=1C=CC=CC=1\C=C\C(=O)\C=C\C1=CC=CC=C1 CYPYTURSJDMMMP-WVCUSYJESA-N 0.000 description 3
- SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical group C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- WREOTYWODABZMH-DTZQCDIJSA-N [[(2r,3s,4r,5r)-3,4-dihydroxy-5-[2-oxo-4-(2-phenylethoxyamino)pyrimidin-1-yl]oxolan-2-yl]methoxy-hydroxyphosphoryl] phosphono hydrogen phosphate Chemical compound O[C@@H]1[C@H](O)[C@@H](COP(O)(=O)OP(O)(=O)OP(O)(O)=O)O[C@H]1N(C=C\1)C(=O)NC/1=N\OCCC1=CC=CC=C1 WREOTYWODABZMH-DTZQCDIJSA-N 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000000732 arylene group Chemical group 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 125000001309 chloro group Chemical group Cl* 0.000 description 3
- 229940126543 compound 14 Drugs 0.000 description 3
- 229940125758 compound 15 Drugs 0.000 description 3
- 125000001072 heteroaryl group Chemical group 0.000 description 3
- 150000002391 heterocyclic compounds Chemical class 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- CHLICZRVGGXEOD-UHFFFAOYSA-N 1-Methoxy-4-methylbenzene Chemical compound COC1=CC=C(C)C=C1 CHLICZRVGGXEOD-UHFFFAOYSA-N 0.000 description 2
- HDNRAPAFJLXKBV-UHFFFAOYSA-N 1-ethyl-4-methoxybenzene Chemical compound CCC1=CC=C(OC)C=C1 HDNRAPAFJLXKBV-UHFFFAOYSA-N 0.000 description 2
- QPUYECUOLPXSFR-UHFFFAOYSA-N 1-methylnaphthalene Chemical compound C1=CC=C2C(C)=CC=CC2=C1 QPUYECUOLPXSFR-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- JRNVZBWKYDBUCA-UHFFFAOYSA-N N-chlorosuccinimide Chemical class ClN1C(=O)CCC1=O JRNVZBWKYDBUCA-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PWATWSYOIIXYMA-UHFFFAOYSA-N Pentylbenzene Chemical compound CCCCCC1=CC=CC=C1 PWATWSYOIIXYMA-UHFFFAOYSA-N 0.000 description 2
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GCTFWCDSFPMHHS-UHFFFAOYSA-M Tributyltin chloride Chemical compound CCCC[Sn](Cl)(CCCC)CCCC GCTFWCDSFPMHHS-UHFFFAOYSA-M 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 125000005577 anthracene group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 125000005578 chrysene group Chemical group 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000012043 crude product Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- 125000005549 heteroarylene group Chemical group 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical class [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical group C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920001197 polyacetylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 125000005581 pyrene group Chemical group 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000010898 silica gel chromatography Methods 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229930192474 thiophene Natural products 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- NHDIQVFFNDKAQU-UHFFFAOYSA-N tripropan-2-yl borate Chemical compound CC(C)OB(OC(C)C)OC(C)C NHDIQVFFNDKAQU-UHFFFAOYSA-N 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- UGOMMVLRQDMAQQ-UHFFFAOYSA-N xphos Chemical group CC(C)C1=CC(C(C)C)=CC(C(C)C)=C1C1=CC=CC=C1P(C1CCCCC1)C1CCCCC1 UGOMMVLRQDMAQQ-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- YIUHGBNJJRTMIE-UHFFFAOYSA-N 1,4-dithiophen-2-yl-2,5-dihydropyrrolo[3,4-c]pyrrole-3,6-dione Chemical compound C=12C(=O)NC(C=3SC=CC=3)=C2C(=O)NC=1C1=CC=CS1 YIUHGBNJJRTMIE-UHFFFAOYSA-N 0.000 description 1
- OSIGJGFTADMDOB-UHFFFAOYSA-N 1-Methoxy-3-methylbenzene Chemical compound COC1=CC=CC(C)=C1 OSIGJGFTADMDOB-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- ZMXIYERNXPIYFR-UHFFFAOYSA-N 1-ethylnaphthalene Chemical compound C1=CC=C2C(CC)=CC=CC2=C1 ZMXIYERNXPIYFR-UHFFFAOYSA-N 0.000 description 1
- CWLKTJOTWITYSI-UHFFFAOYSA-N 1-fluoronaphthalene Chemical compound C1=CC=C2C(F)=CC=CC2=C1 CWLKTJOTWITYSI-UHFFFAOYSA-N 0.000 description 1
- BLMBNEVGYRXFNA-UHFFFAOYSA-N 1-methoxy-2,3-dimethylbenzene Chemical compound COC1=CC=CC(C)=C1C BLMBNEVGYRXFNA-UHFFFAOYSA-N 0.000 description 1
- JTPZTKBRUCILQD-UHFFFAOYSA-N 1-methylimidazolidin-2-one Chemical compound CN1CCNC1=O JTPZTKBRUCILQD-UHFFFAOYSA-N 0.000 description 1
- ATRJNSFQBYKFSM-UHFFFAOYSA-N 2,3-dibromothiophene Chemical compound BrC=1C=CSC=1Br ATRJNSFQBYKFSM-UHFFFAOYSA-N 0.000 description 1
- WAQFYSJKIRRXLP-UHFFFAOYSA-N 2,4-dibromothiophene Chemical compound BrC1=CSC(Br)=C1 WAQFYSJKIRRXLP-UHFFFAOYSA-N 0.000 description 1
- KBVDUUXRXJTAJC-UHFFFAOYSA-N 2,5-dibromothiophene Chemical compound BrC1=CC=C(Br)S1 KBVDUUXRXJTAJC-UHFFFAOYSA-N 0.000 description 1
- FGYBDASKYMSNCX-UHFFFAOYSA-N 2,5-dichlorothiophene Chemical compound ClC1=CC=C(Cl)S1 FGYBDASKYMSNCX-UHFFFAOYSA-N 0.000 description 1
- YWIGIVGUASXDPK-UHFFFAOYSA-N 2,7-dioctyl-[1]benzothiolo[3,2-b][1]benzothiole Chemical compound C12=CC=C(CCCCCCCC)C=C2SC2=C1SC1=CC(CCCCCCCC)=CC=C21 YWIGIVGUASXDPK-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- TUCRZHGAIRVWTI-UHFFFAOYSA-N 2-bromothiophene Chemical compound BrC1=CC=CS1 TUCRZHGAIRVWTI-UHFFFAOYSA-N 0.000 description 1
- GSFNQBFZFXUTBN-UHFFFAOYSA-N 2-chlorothiophene Chemical compound ClC1=CC=CS1 GSFNQBFZFXUTBN-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- WOYWLLHHWAMFCB-UHFFFAOYSA-N 2-ethylhexyl acetate Chemical compound CCCCC(CC)COC(C)=O WOYWLLHHWAMFCB-UHFFFAOYSA-N 0.000 description 1
- DTFKRVXLBCAIOZ-UHFFFAOYSA-N 2-methylanisole Chemical compound COC1=CC=CC=C1C DTFKRVXLBCAIOZ-UHFFFAOYSA-N 0.000 description 1
- VGKLVWTVCUDISO-UHFFFAOYSA-N 3,4-dibromothiophene Chemical compound BrC1=CSC=C1Br VGKLVWTVCUDISO-UHFFFAOYSA-N 0.000 description 1
- YNZQOVYRCBAMEU-UHFFFAOYSA-N 3,4-dichloro-1,2,5-thiadiazole Chemical compound ClC1=NSN=C1Cl YNZQOVYRCBAMEU-UHFFFAOYSA-N 0.000 description 1
- QVFXSOFIEKYPOE-UHFFFAOYSA-N 3,4-dichlorothiophene Chemical compound ClC1=CSC=C1Cl QVFXSOFIEKYPOE-UHFFFAOYSA-N 0.000 description 1
- NZWIYPLSXWYKLH-UHFFFAOYSA-N 3-(bromomethyl)heptane Chemical compound CCCCC(CC)CBr NZWIYPLSXWYKLH-UHFFFAOYSA-N 0.000 description 1
- XCMISAPCWHTVNG-UHFFFAOYSA-N 3-bromothiophene Chemical compound BrC=1C=CSC=1 XCMISAPCWHTVNG-UHFFFAOYSA-N 0.000 description 1
- KPOCSQCZXMATFR-UHFFFAOYSA-N 3-butylthiophene Chemical compound CCCCC=1C=CSC=1 KPOCSQCZXMATFR-UHFFFAOYSA-N 0.000 description 1
- QUBJDMPBDURTJT-UHFFFAOYSA-N 3-chlorothiophene Chemical compound ClC=1C=CSC=1 QUBJDMPBDURTJT-UHFFFAOYSA-N 0.000 description 1
- 229940077398 4-methyl anisole Drugs 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- YHBTXTFFTYXOFV-UHFFFAOYSA-N Liquid thiophthene Chemical compound C1=CSC2=C1C=CS2 YHBTXTFFTYXOFV-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- 238000000944 Soxhlet extraction Methods 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 238000006619 Stille reaction Methods 0.000 description 1
- 238000006069 Suzuki reaction reaction Methods 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- APQHKWPGGHMYKJ-UHFFFAOYSA-N Tributyltin oxide Chemical compound CCCC[Sn](CCCC)(CCCC)O[Sn](CCCC)(CCCC)CCCC APQHKWPGGHMYKJ-UHFFFAOYSA-N 0.000 description 1
- YNVDMXDVYHYSEZ-UHFFFAOYSA-N [4-dodecyl-5-(3-dodecyl-5-trimethylstannylthiophen-2-yl)thiophen-2-yl]-trimethylstannane Chemical compound C1=C([Sn](C)(C)C)SC(C2=C(C=C(S2)[Sn](C)(C)C)CCCCCCCCCCCC)=C1CCCCCCCCCCCC YNVDMXDVYHYSEZ-UHFFFAOYSA-N 0.000 description 1
- HIVGXUNKSAJJDN-UHFFFAOYSA-N [Si].[P] Chemical compound [Si].[P] HIVGXUNKSAJJDN-UHFFFAOYSA-N 0.000 description 1
- MXSJNBRAMXILSE-UHFFFAOYSA-N [Si].[P].[B] Chemical compound [Si].[P].[B] MXSJNBRAMXILSE-UHFFFAOYSA-N 0.000 description 1
- IPBVNPXQWQGGJP-UHFFFAOYSA-N acetic acid phenyl ester Natural products CC(=O)OC1=CC=CC=C1 IPBVNPXQWQGGJP-UHFFFAOYSA-N 0.000 description 1
- XFSBVAOIAHNAPC-WSORPINJSA-N acetylbenzoylaconine Chemical compound O([C@H]1[C@]2(O)C[C@H]3C45[C@@H]6[C@@H]([C@@]([C@H]31)(OC(C)=O)[C@@H](O)[C@@H]2OC)[C@H](OC)C4[C@]([C@@H](C[C@H]5OC)O)(COC)CN6CC)C(=O)C1=CC=CC=C1 XFSBVAOIAHNAPC-WSORPINJSA-N 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000004849 alkoxymethyl group Chemical group 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 150000008378 aryl ethers Chemical class 0.000 description 1
- YCOXTKKNXUZSKD-UHFFFAOYSA-N as-o-xylenol Natural products CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical class C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- BNBQRQQYDMDJAH-UHFFFAOYSA-N benzodioxan Chemical compound C1=CC=C2OCCOC2=C1 BNBQRQQYDMDJAH-UHFFFAOYSA-N 0.000 description 1
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- YFNONBGXNFCTMM-UHFFFAOYSA-N butoxybenzene Chemical compound CCCCOC1=CC=CC=C1 YFNONBGXNFCTMM-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- FFSAXUULYPJSKH-UHFFFAOYSA-N butyrophenone Chemical compound CCCC(=O)C1=CC=CC=C1 FFSAXUULYPJSKH-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 229950005499 carbon tetrachloride Drugs 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- KWTSZCJMWHGPOS-UHFFFAOYSA-M chloro(trimethyl)stannane Chemical compound C[Sn](C)(C)Cl KWTSZCJMWHGPOS-UHFFFAOYSA-M 0.000 description 1
- 150000008422 chlorobenzenes Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229920000547 conjugated polymer Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000006880 cross-coupling reaction Methods 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- WMKGGPCROCCUDY-PHEQNACWSA-N dibenzylideneacetone Chemical compound C=1C=CC=CC=1\C=C\C(=O)\C=C\C1=CC=CC=C1 WMKGGPCROCCUDY-PHEQNACWSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- SNHMUERNLJLMHN-UHFFFAOYSA-N iodobenzene Chemical compound IC1=CC=CC=C1 SNHMUERNLJLMHN-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- 235000014413 iron hydroxide Nutrition 0.000 description 1
- 229910000358 iron sulfate Inorganic materials 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- NCNCGGDMXMBVIA-UHFFFAOYSA-L iron(ii) hydroxide Chemical compound [OH-].[OH-].[Fe+2] NCNCGGDMXMBVIA-UHFFFAOYSA-L 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 150000002828 nitro derivatives Chemical class 0.000 description 1
- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 description 1
- DLRJIFUOBPOJNS-UHFFFAOYSA-N phenetole Chemical compound CCOC1=CC=CC=C1 DLRJIFUOBPOJNS-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- WLJVXDMOQOGPHL-UHFFFAOYSA-M phenylacetate Chemical compound [O-]C(=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-UHFFFAOYSA-M 0.000 description 1
- 229940049953 phenylacetate Drugs 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000090 poly(aryl ether) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920003050 poly-cycloolefin Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000015 polydiacetylene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000734 polysilsesquioxane polymer Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- ZYNMJJNWXVKJJV-UHFFFAOYSA-N propan-2-yloxybenzene Chemical compound CC(C)OC1=CC=CC=C1 ZYNMJJNWXVKJJV-UHFFFAOYSA-N 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- DSNYFFJTZPIKFZ-UHFFFAOYSA-N propoxybenzene Chemical compound CCCOC1=CC=CC=C1 DSNYFFJTZPIKFZ-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- FMZQNTNMBORAJM-UHFFFAOYSA-N tri(propan-2-yl)-[2-[13-[2-tri(propan-2-yl)silylethynyl]pentacen-6-yl]ethynyl]silane Chemical compound C1=CC=C2C=C3C(C#C[Si](C(C)C)(C(C)C)C(C)C)=C(C=C4C(C=CC=C4)=C4)C4=C(C#C[Si](C(C)C)(C(C)C)C(C)C)C3=CC2=C1 FMZQNTNMBORAJM-UHFFFAOYSA-N 0.000 description 1
- WRECIMRULFAWHA-UHFFFAOYSA-N trimethyl borate Chemical compound COB(OC)OC WRECIMRULFAWHA-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
- C08G61/126—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/151—Copolymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/10—Definition of the polymer structure
- C08G2261/12—Copolymers
- C08G2261/124—Copolymers alternating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/10—Definition of the polymer structure
- C08G2261/14—Side-groups
- C08G2261/141—Side-chains having aliphatic units
- C08G2261/1412—Saturated aliphatic units
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/10—Definition of the polymer structure
- C08G2261/14—Side-groups
- C08G2261/142—Side-chains containing oxygen
- C08G2261/1424—Side-chains containing oxygen containing ether groups, including alkoxy
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/10—Definition of the polymer structure
- C08G2261/18—Definition of the polymer structure conjugated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/10—Definition of the polymer structure
- C08G2261/22—Molecular weight
- C08G2261/228—Polymers, i.e. more than 10 repeat units
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
- C08G2261/322—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed
- C08G2261/3223—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed containing one or more sulfur atoms as the only heteroatom, e.g. thiophene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
- C08G2261/322—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed
- C08G2261/3225—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed containing one or more Se atoms as the only heteroatom
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
- C08G2261/322—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed
- C08G2261/3229—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed containing nitrogen and sulfur as heteroatoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
- C08G2261/324—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain condensed
- C08G2261/3241—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain condensed containing one or more nitrogen atoms as the only heteroatom, e.g. carbazole
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
- C08G2261/324—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain condensed
- C08G2261/3243—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain condensed containing one or more sulfur atoms as the only heteroatom, e.g. benzothiophene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
- C08G2261/324—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain condensed
- C08G2261/3246—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain condensed containing nitrogen and sulfur as heteroatoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/33—Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain
- C08G2261/334—Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain containing heteroatoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/34—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain
- C08G2261/344—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing heteroatoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/90—Applications
- C08G2261/92—TFT applications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/484—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
Definitions
- the present invention relates to an organic thin film transistor element, a composition for forming an organic semiconductor film, a method for producing an organic semiconductor film, and an organic semiconductor film.
- a minute transistor is integrated as a switching element in a liquid crystal display, a display such as an organic electroluminescence display, a RFID (radio frequency identifier: RF tag), a logic circuit such as a memory.
- An organic thin film transistor (field effect transistor) using an organic semiconductor compound for the semiconductor layer can be reduced in weight, and since a printing process can be applied to its manufacture, cost reduction can also be achieved, and flexibility is also excellent. Therefore, attention is being focused on as a next-generation transistor to replace the transistor having a silicon-based semiconductor layer, and development is in progress.
- the chemical structure of an organic semiconductor compound used for the organic semiconductor layer has been studied to improve the performance of the organic thin film transistor.
- it has been attempted to improve the performance of an organic thin film transistor by forming an organic semiconductor layer using a highly purified organic semiconductor compound.
- the organic semiconductor compound is generally synthesized using a metal complex as a catalyst, and a metal atom derived from the catalyst, a halogen atom derived from the raw material, and the like usually remain as impurities in the synthesized organic semiconductor compound. These impurities are considered to contribute to an excessive leak current, a decrease in on / off ratio, and a decrease in carrier mobility.
- Patent Document 1 describes an organic thin film transistor element having an organic semiconductor layer formed using an organic semiconductor compound from which an impurity has been removed using a solvent in a supercritical state, and in the organic thin film transistor element, leakage current is suppressed and It is stated that the on / off ratio has been improved.
- Patent Document 2 describes an organic thin film transistor element having an organic semiconductor layer formed by using an organic semiconductor compound made of a ⁇ -conjugated polymer with an impurity amount of 100 ppm or less. Patent Document 2 describes that the leak current of the organic thin film transistor element is effectively suppressed, and the on / off ratio is dramatically improved.
- Patent Document 3 describes a method of reducing the palladium content of a synthesized diketopyrrole pyrrole (DPP) copolymer, and by using the DPP copolymer with a reduced palladium content for the organic semiconductor layer of the organic thin film transistor element, It is described that the carrier mobility of the organic thin film transistor element is improved.
- DPP diketopyrrole pyrrole
- an organic semiconductor layer is generally formed using a solution in which an organic semiconductor compound is dissolved in an organic solvent. More specifically, the solution is applied onto a substrate or a gate insulating layer and dried to form an organic semiconductor layer. At this time, the uniformity of the formed layer greatly affects the performance of the device. That is, when a manufacturing method is adopted in which the distribution of the organic semiconductor compound present in the organic semiconductor layer varies, the performance such as carrier mobility will vary among the manufactured organic thin film transistor elements.
- An object of the present invention is to provide an organic thin film transistor element excellent in manufacturing stability (uniformity of performance between elements). Further, the present invention uses the composition for forming an organic semiconductor film which can effectively suppress the dispersion of the performance among the obtained elements by using it for forming the organic semiconductor layer of the organic thin film transistor element, and the composition. It is an object of the present invention to provide a method of manufacturing an organic semiconductor film. Another object of the present invention is to provide an organic semiconductor film capable of providing an organic thin film transistor element excellent in manufacturing stability.
- the present inventors dissolve the organic semiconductor in the solvent of the organic semiconductor used for formation of an organic semiconductor layer by making a specific element contain (coexistence)
- a solution obtained by dissolving the organic semiconductor it is possible to effectively suppress the variation in carrier mobility among the obtained organic thin film transistor elements, It has been found that the manufacturing stability of the device can be enhanced.
- the present invention has been further studied based on these findings and has been completed.
- An organic thin film transistor element comprising an organic semiconductor layer comprising an organic semiconductor compound, wherein the group consisting of Li, Na, P, K, Fe, Pd, Sn, B, Cl, Br and I in the organic semiconductor layer
- An organic thin film transistor element having a content of one or more atoms selected from the group consisting of 300 to 700 ppm;
- D is a group having a single ring structure or a fused polycyclic structure aromatic heterocycle having at least one atom selected from nitrogen atom, oxygen atom, sulfur atom and selenium atom as ring constituent atoms Or a group having a fused polycyclic aromatic hydrocarbon ring.
- A represents a group having a structure represented by any of the following formulas (A-1) to (A-9).
- X A represents an oxygen atom, a sulfur atom, a selenium atom or NR X.
- R X represents an alkyl group or a group represented by the following formula (1-1).
- Y A represents an oxygen atom or a sulfur atom.
- Z A represents a CR A2 or nitrogen atom.
- W A denotes a C (R A2) 2, NR A1, nitrogen atom, CR A2, oxygen atom, sulfur atom or selenium atom.
- R A1 represents an alkyl group, a group represented by the following formula (1-1), or a single bond.
- R A2 represents a hydrogen atom, a halogen atom, an alkyl group or a single bond. * Indicates a binding site for incorporation into A of the above formula (1).
- L a represents an alkylene group having 1 to 20 carbon atoms.
- Ar represents an aromatic heterocyclic group or an aromatic hydrocarbon group having 6 to 18 carbon atoms.
- L b represents an alkyl group having 1 to 100 carbon atoms.
- l is an integer of 1 to 5; * Indicates a binding site.
- X d represents an oxygen atom, a sulfur atom, a selenium atom or NR D1.
- R D1 represents an organic group.
- Z d represents a nitrogen atom or CR D2 .
- R D2 represents a hydrogen atom or an organic group.
- M is a single bond or a divalent group formed by combining an aromatic heterocyclic group, an aromatic hydrocarbon group, an alkenylene group, an alkynylene group or two or more of these groups.
- p and q each represents an integer of 0 to 4; * Indicates a binding site to be incorporated into the structural unit represented by formula (1).
- X A , Y A and Z A are respectively synonymous with X A , Y A and Z A described in the above formulas (A-1) to (A-9).
- X d, Z d, M, p and q are each the same meaning as X d, Z d, M, p and q described in the above formula (D-1).
- the organic thin-film transistor element as described in [2] or [3] whose structural unit represented by said Formula (1) is a structural unit represented by following formula (5).
- R X has the same meaning as R X described in the above formula (A-1) ⁇ (A -9).
- X d , M, p and q are respectively synonymous with X d , M, p and q described in the above formula (D-1).
- the content of one or more atoms selected from the group consisting of Na, P, Fe, Pd, Sn, B, Br and I is 300 to 700 ppm, [1] to [1]
- the organic thin-film transistor element as described in any one of 5].
- An organic semiconductor compound and one or more atoms selected from the group consisting of Li, Na, P, K, Fe, Pd, Sn, B, Cl, Br and I The content of the organic semiconductor compound, and the content of one or more atoms selected from the group consisting of Li, Na, P, K, Fe, Pd, Sn, B, Cl, Br and I, and The ratio of the content of one or more atoms selected from the group consisting of Li, Na, P, K, Fe, Pd, Sn, B, Cl, Br and I in the total of The composition for organic-semiconductor film formation which is 700 ppm.
- D is a group having a single ring structure or a fused polycyclic structure aromatic heterocycle having at least one atom selected from nitrogen atom, oxygen atom, sulfur atom and selenium atom as ring constituent atoms Or a group having a fused polycyclic aromatic hydrocarbon ring.
- A represents a group having a structure represented by any of the following formulas (A-1) to (A-9).
- X A represents an oxygen atom, a sulfur atom, a selenium atom or NR X.
- R X represents an alkyl group or a group represented by the following formula (1-1).
- Y A represents an oxygen atom or a sulfur atom.
- Z A represents a CR A2 or nitrogen atom.
- W A denotes a C (R A2) 2, NR A1, nitrogen atom, CR A2, oxygen atom, sulfur atom or selenium atom.
- R A1 represents an alkyl group, a group represented by the following formula (1-1), or a single bond.
- R A2 represents a hydrogen atom, a halogen atom, an alkyl group or a single bond. * Indicates a binding site for incorporation into A of the above formula (1).
- L a represents an alkylene group having 1 to 20 carbon atoms.
- Ar represents an aromatic heterocyclic group or an aromatic hydrocarbon group having 6 to 18 carbon atoms.
- L b represents an alkyl group having 1 to 100 carbon atoms.
- l is an integer of 1 to 5; * Indicates a binding site.
- a numerical range represented using “to” means a range including numerical values described before and after “to” as the lower limit value and the upper limit value.
- “(meth) acrylate” is used to mean either or both of acrylate and methacrylate.
- (meth) acrylic acid” is used in the meaning of one or both of acrylic acid and methacrylic acid.
- the expression of a compound includes not only the compound itself but also a salt thereof and an ion thereof. In addition, it includes those in which a part of the structure is changed as long as the intended effect is not impaired.
- each of the substituents or the like may be identical to each other unless otherwise specified. It may be different. The same applies to the definition of the number of substituents and the like.
- substituents and the like when a plurality of substituents and the like are adjacent (especially, adjacent), they may be linked to each other to form a ring unless otherwise specified.
- each structural unit present in the polymer when there are a plurality of structural units represented by the same designation in a polymer, each structural unit present in the polymer may be the same or different.
- the number of carbon atoms of the group (also referred to as the number of carbons) is limited, the number of carbon atoms of this group means the total number of carbon atoms including the substituent unless otherwise specified.
- this group when a group can form a non-cyclic skeleton and a cyclic skeleton, this group includes a non-cyclic skeleton and a cyclic skeleton, unless otherwise specified.
- alkyl groups include linear alkyl groups, branched alkyl groups and cyclic (cyclo) alkyl groups.
- the lower limit of the number of atoms forming the cyclic skeleton is 3 or more, preferably 5 or more, regardless of the lower limit of the number of atoms specifically described for this group.
- "ppm" is on a mass basis.
- the variation in performance between elements can be effectively suppressed, and the production stability is excellent.
- the composition for forming an organic semiconductor film of the present invention is excellent in the solubility of the organic semiconductor compound in the composition, and an element obtained by forming an organic semiconductor layer of an organic thin film transistor element using this composition Can effectively suppress the variation in performance.
- an organic semiconductor film having more uniform film properties can be obtained, and it becomes possible to provide an organic thin film transistor element excellent in manufacturing stability.
- the organic semiconductor film of the present invention enables provision of an organic thin film transistor element excellent in manufacturing stability.
- FIG. 1 is a schematic cross-sectional view showing an embodiment of a bottom gate-bottom contact type organic thin film transistor element as an example of the semiconductor element of the present invention.
- FIG. 2 is a schematic cross-sectional view showing an embodiment of a bottom gate-top contact type organic thin film transistor element as an example of the semiconductor element of the present invention.
- the organic thin film transistor element of the present invention contains an organic semiconductor compound in the organic semiconductor layer, and in this organic semiconductor layer, Li, Na, P, K, Fe, Pd, Sn, B, Cl, Br and One or two or more atoms selected from the group consisting of I are contained at 300 to 700 ppm.
- the above-mentioned “one or two or more atoms selected from the group consisting of Li, Na, P, K, Fe, Pd, Sn, B, Cl, Br and I” is an organic semiconductor compound It is not an atom that constitutes the molecular structure, but an atom that exists separately from the organic semiconductor compound in the organic semiconductor layer.
- These atoms are usually present in the ionized state or in the form of a complex or a compound.
- the content of one or more atoms selected from the group consisting of Li, Na, P, K, Fe, Pd, Sn, B, Cl, Br and I is measured by the method described in the examples described later. Be done.
- the content of one or more atoms selected from the group consisting of Li, Na, P, K, Fe, Pd, Sn, B, Cl, Br and I is 300 to 700 ppm”
- the content of one atom is 300 to It means that it is 700 ppm, and when two or more types of atoms are contained, it means that the total of the content of two or more types of atoms is 300 to 700 ppm.
- the content of one or more atoms selected from the group consisting of Na, P, Fe, Pd, Sn, B, Br and I is 300 to 700 ppm.
- atom AT one or more atoms selected from the group consisting of Li, Na, P, K, Fe, Pd, Sn, B, Cl, Br and I.
- the atom AT is preferably one or more atoms selected from the group consisting of Na, P, Fe, Pd, Sn, B, Br and I.
- the organic thin film transistor (also referred to as organic TFT) element of the present invention has the above-described organic semiconductor layer of the present invention, and can further have a source electrode, a gate insulating layer, a drain electrode, and a gate electrode. .
- the organic TFT device of the present invention is provided on a substrate in contact with a gate electrode, an organic semiconductor layer, a gate insulating layer provided between the gate electrode and the organic semiconductor layer, and an organic semiconductor layer, and an organic semiconductor layer And source and drain electrodes connected to each other.
- the organic semiconductor layer and the gate insulating layer are provided adjacent to each other.
- the structure of the organic TFT element of the present invention is not particularly limited as long as the above layers are provided.
- the organic TFT element of the present invention is more preferably a bottom gate-bottom contact type or a bottom gate-top contact type (these are collectively referred to as a bottom gate type).
- a bottom gate type bottom gate-bottom contact type or top gate-top contact type
- FIG. 1 is a schematic cross-sectional view of a bottom gate-bottom contact type organic TFT device 100 which is an example of the semiconductor device of the present invention.
- the organic TFT element 100 is sealed with a substrate (base material) 10, a gate electrode 20, a gate insulating film 30, a source electrode 40 and a drain electrode 42, an organic semiconductor film 50, and The layers 60 are provided in this order.
- a substrate (base material), a gate electrode, a gate insulating layer (film), a source electrode, a drain electrode, an organic semiconductor layer (film) and a sealing layer, and respective manufacturing methods will be described in detail.
- the substrate plays a role of supporting a gate electrode, a source electrode, a drain electrode and the like described later.
- the type of substrate is not particularly limited, and examples thereof include a plastic substrate, a silicon substrate, a glass substrate or a ceramic substrate. Among them, a silicon substrate, a glass substrate or a plastic substrate is preferable from the viewpoint of versatility, applicability to each device, and cost.
- the thickness of the substrate is not particularly limited, but is preferably 10 mm or less, more preferably 2 mm or less, and particularly preferably 1.5 mm or less. On the other hand, it is preferably 0.01 mm or more, and more preferably 0.05 mm or more.
- the gate electrode can apply the general electrode currently used as a gate electrode of an organic TFT element, without being restrict
- the material for forming the gate electrode is not particularly limited, and, for example, metals such as gold, silver, aluminum, copper, chromium, nickel, cobalt, titanium, platinum, magnesium, calcium, barium or sodium, InO 2 Conductive oxides such as SnO 2 or indium tin oxide (ITO), conductive polymers such as polyaniline, polypyrrole, polythiophene, polyacetylene, polyacetylene or polydiacetylene, semiconductors such as silicon, germanium or gallium arsenide, or fullerene And carbon materials such as carbon nanotubes or graphite.
- metals such as gold, silver, aluminum, copper, chromium, nickel, cobalt, titanium, platinum, magnesium, calcium, barium or sodium, InO 2 Conductive oxides such as SnO 2 or indium tin oxide (ITO), conductive polymers such as
- the above metals are preferable, and silver or aluminum is more preferable.
- the thickness of the gate electrode is not particularly limited, but is preferably 20 to 200 nm.
- the gate electrode may function as the above substrate like a silicon substrate, and in this case, the above substrate may be omitted.
- the method of forming the gate electrode is not particularly limited.
- coating or printing an object etc. are mentioned.
- printing methods such as inkjet printing, screen printing, offset printing, or relief printing (flexo printing), a photolithographic method, the mask vapor deposition method etc. are mentioned, for example.
- the gate insulating layer is not particularly limited as long as it is a film (layer) provided between the gate electrode and the organic semiconductor layer and has an insulating property, and may be a single layer or a multilayer.
- the gate insulating layer is preferably formed of an insulating material, and examples of the insulating material preferably include an organic material such as an organic polymer, and an inorganic material such as an inorganic oxide. In the case of using a plastic substrate or a glass substrate as the substrate, it is preferable to use an organic material in terms of handleability and the like.
- the organic polymer, the inorganic oxide and the like are not particularly limited as long as they have insulating properties, and a thin film, for example, one capable of forming a thin film having a thickness of 1 ⁇ m or less is preferable.
- the organic polymer and the inorganic oxide may be used alone or in combination of two or more.
- the gate insulating layer may be a hybrid layer in which an organic polymer and an inorganic oxide which will be described later are mixed.
- the organic polymer is not particularly limited, and, for example, polyvinylphenol, polystyrene (PS), polyalkyl (meth) acrylate typified by polymethyl methacrylate, polyvinyl alcohol, polyvinyl chloride (PVC), polyfluorinated Cyclic fluoroalkyl polymers represented by vinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE), CYTOP (trade name, manufactured by AGC Asahi Glass Co., Ltd.), polycycloolefin, polyester, polyether sulfone, polyether ketone, polyimide, poly Examples thereof include (meth) acrylic acid, polybenzoxazole, epoxy resin, polyorganosiloxane represented by polydimethylsiloxane (PDMS), polysilsesquioxane, butadiene rubber and the like.
- PVC polyvinyl chloride
- PVDF polyfluorinated Cyclic fluoroalkyl polymers represented
- thermosetting resins such as phenol resins, novolak resins, cinnamate resins, acrylic resins and polyparaxylylene resins can also be mentioned.
- the organic polymer can also be used in combination with a compound having a reactive substituent such as an alkoxysilyl group, a vinyl group, an acryloyloxy group, an epoxy group or a methylol group.
- the gate insulating layer is formed of an organic polymer
- Crosslinking is preferably carried out by generating an acid or a radical using light, heat or both.
- radical generator which generates radicals by light or heat
- the thermal polymerization initiator (H1) and the photopolymerization initiation described in [0182] to [0186] of JP2013-214649A for example, the thermal polymerization initiator (H1) and the photopolymerization initiation described in [0182] to [0186] of JP2013-214649A.
- Agent (H2), a photo radical generator described in [0046] to [0051] of JP-A-2011-186069, photo radical polymerization initiation described in [0042]-[0056] of JP-A-2010-285518 An agent etc. can be used suitably, Preferably these contents are included in this-application specification.
- number average molecular weight (Mn) is 140 to 5,000, has a crosslinkable functional group, and does not have a fluorine atom It is also preferred to use the compounds (G), the content of which is preferably incorporated herein.
- the photocationic polymerization initiator as described in-of Unexamined-Japanese-Patent No. 2010-285518, for example, Unexamined-Japanese-Patent No. 2012-163946
- the acid generators described in [0120] to [0136] of the publication, particularly sulfonium salts, iodonium salts and the like can be preferably used, and the contents thereof are preferably incorporated in the present specification.
- thermal acid generator that generates an acid by heat
- thermal cationic polymerization initiators described in JP-A-2010-285518, [0035] to [0038], particularly onium salts, etc., JP-A-2005-
- crosslinking agents described in JP-A-2005-354012 [0032] to [0033] in particular, epoxy compounds having a functionality of two or more, oxetane compounds, JP-A-2006-303465, [0046] to [0062].
- the method of coating and hardening organic polymer is mentioned, for example.
- the coating method is not particularly limited, and the respective printing methods described above may be mentioned. Among them, wet coating methods such as microgravure coating method, dip coating method, screen coat printing, die coating method or spin coating method are preferable.
- the inorganic oxide is not particularly limited, but, for example, silicon oxide, silicon nitride (SiN Y ), hafnium oxide, titanium oxide, tantalum oxide, aluminum oxide, niobium oxide, zirconium oxide, copper oxide, oxide oxides such as nickel, also, SrTiO 3, CaTiO 3, BaTiO 3, MgTiO 3, SrNb perovskite such as 2 O 6 or a composite oxide thereof, or a mixture thereof.
- silicon oxide in addition to silicon oxide (SiO x ), BPSG (Boron Phosphorus Silicon Glass), PSG (Phosphorus Silicon Glass), BSG (borosilicate glass), AsSG (arsenic silicate glass), PbSG (lead silicate) Glass), silicon oxynitride (SiON), SOG (spin-on glass), low dielectric constant SiO 2 -based materials (eg, polyarylethers, cycloperfluorocarbon polymers and benzocyclobutenes, cyclic fluorocarbon resins, polytetrafluoroethylene, fluorocarbons) Arylethers, fluorinated polyimides, amorphous carbon, organic SOG).
- SiO 2 -based materials eg, polyarylethers, cycloperfluorocarbon polymers and benzocyclobutenes, cyclic fluorocarbon resins, polytetrafluoroethylene, fluorocarbons
- Arylethers fluorinated
- a vacuum deposition method such as a vacuum deposition method, a sputtering method, an ion plating, or a CVD (chemical vapor deposition) method can be used.
- Assisting may be performed by plasma, ion gun, radical gun or the like using any gas.
- precursors corresponding to the respective metal oxides specifically, metal halides such as chlorides and bromides, metal alkoxides, metal hydroxides, etc., alcohols, such as hydrochloric acid, sulfuric acid, nitric acid, etc. You may form by making it react with bases, such as sodium hydroxide and potassium hydroxide, and hydrolyzing.
- bases such as sodium hydroxide and potassium hydroxide, and hydrolyzing.
- the gate insulating layer can also be provided by a method in which any of lift-off method, sol-gel method, electrodeposition method and shadow mask method is combined with the patterning method according to need, in addition to the above method.
- the gate insulating film not have a rough surface.
- arithmetic mean roughness Ra or root mean square roughness R MS of the gate insulating layer surface is 0.5 nm or less. Also in the case of carrying out surface treatment, treatment in which the surface of the insulating film is not roughened is preferable.
- the source electrode is an electrode into which charge flows from the outside through the wiring.
- the drain electrode is an electrode that sends out the charge to the outside through the wiring.
- materials forming the source electrode and the drain electrode the same materials as the electrode materials forming the gate electrode described above can be used. Among them, metals are preferred, and gold or silver is more preferred.
- the thickness of the source electrode and the drain electrode is not particularly limited, but is preferably 1 nm or more and particularly preferably 10 nm or more.
- the distance (gate length) between the source electrode and the drain electrode can be appropriately determined, but for example, 200 ⁇ m or less is preferable and 100 ⁇ m or less is particularly preferable. Also, the gate width can be determined appropriately, but for example, 5000 ⁇ m or less is preferable, and 1000 ⁇ m or less is particularly preferable.
- the method of forming the source electrode and the drain electrode is not particularly limited. For example, a method of vacuum depositing or sputtering an electrode material on a substrate on which a gate electrode and a gate insulating film are formed, a composition for electrode formation is applied Or the method of printing etc. are mentioned. In the case of patterning, the method of patterning is the same as the method of the gate electrode described above.
- the organic semiconductor layer contains the atom AT of 300 to 700 ppm (preferably 320 to 650 ppm, more preferably 340 to 630 ppm) as described above.
- the organic-semiconductor layer contains the organic-semiconductor compound and atom AT, And containing of atom AT which occupies in the sum total of content of this organic-semiconductor compound and content of atom AT It can be formed using a composition in which the proportion of the amount is 300 to 700 ppm (preferably 320 to 650 ppm, more preferably 340 to 630 ppm).
- the composition is prepared by containing the atom AT in the concentration of 300 to 700 ppm (preferably 320 to 650 ppm, more preferably 340 to 630 ppm) in the organic semiconductor compound constituting the organic semiconductor layer.
- a composition (coating solution) is prepared by dissolving the organic semiconductor compound containing the atom AT in an organic solvent, and the composition serving as the lower layer of the organic semiconductor layer (usually a gate insulation Layer) can be formed by drying if necessary.
- the organic semiconductor compound is prepared such that the ratio of the amount of atomic AT is 300 to 700 ppm (preferably 320 to 650 ppm, more preferably 340 to 630 ppm) with respect to the total of the amount of organic semiconductor compound and the amount of atomic AT.
- the atom AT may be dissolved in an organic solvent to prepare a coating solution.
- a binder resin and / or an insulating resin may be contained in the composition (coating solution), and from the viewpoint of enhancing the effect of the present invention, an organic semiconductor compound in the composition (coating solution) It is preferable not to contain other polymers (binder resin, insulating resin, etc.).
- “when the content of the atom AT in the organic semiconductor compound is 300 to 700 ppm” or “the content of the atom AT in the organic semiconductor compound is 300 to 700 ppm” This means that the ratio of the amount of atomic AT to the total of the amount of organic semiconductor compound and the amount of atomic AT is 300 to 700 ppm.
- a source of the atom AT used for containing the atom AT a compound containing the atom AT, a complex, an ionic compound and the like can be widely used, and a composition (coating liquid) using these for forming the organic semiconductor layer
- the atom AT can be contained in the organic semiconductor layer by incorporating it into the organic semiconductor layer.
- a Li source for example, metal lithium, lithium halide, lithium carbonate and the like can be used.
- a Na source for example, metallic sodium, sodium halide, sodium carbonate and the like can be used.
- P source for example, tri (o-tolyl) phosphine, triphenylphosphine, potassium phosphate, 2-dicyclohexylphosphino-2 ', 4', 6'-triisopropylbiphenyl (Xphos) etc. are used. be able to.
- K source potassium halide, potassium carbonate, potassium nitrate or the like can be used.
- iron oxide, iron hydroxide, iron sulfate or the like can be used as the Fe supply source.
- Pd source tris (dibenzylideneacetone) dipalladium, palladium acetate, palladium chloride and the like can be used.
- a Sn source trimethyltin chloride, tributyltin chloride, tributyltin oxide or the like can be used.
- B source trimethyl borate, triisopropyl borate, various boronic acid compounds and the like can be used.
- a Cl source salts of chlorobenzene, chloroform, N-chlorosuccinimide, lithium chloride and the like can be used.
- bromine, N-bromosuccinimide, bromide and the like can be used as a Br source.
- a source of I iodine, iodobenzene, iodide salt and the like can be used as a source of I.
- I iodine, iodobenzene, iodide salt and the like can be used as a source of I.
- the organic solvent used in the coating solution is not particularly limited, and examples thereof include hexane, octane, decane, toluene, xylene, mesitylene, ethylbenzene, amylbenzene, decalin, 1-methylnaphthalene, 1-ethylnaphthalene and 1,6-dimethyl Hydrocarbon compounds such as naphthalene and tetralin, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, ketone compounds such as acetophenone, propiophenone and butyrophenone, dichloromethane, chloroform, tetrachloromethane, dichloroethane, trichloroethane, tetrachloroethane, chlorobenzene, 1, Halogenated hydrocarbon compounds such as 2-dichlorobenzene, 1,2,4-trichlorobenzene,
- N N-dimethylformamide, N, N-dimethylacetamide, 1-methyl-2-pyrrolidone, 1-methyl-2-imidazolidinone, 1,3-dimethyl-2-imidazolidinone and the like
- sulfoxide compound such as dimethyl sulfoxide
- phosphoric acid ester compounds such as trimethyl phosphate, acetonitrile, nitrile compounds such as benzonitrile, nitromethane, nitro compounds and / or water, such as nitrobenzene.
- the solvents may be used alone or in combination of two or more. It is preferable to select an appropriate solvent in accordance with the printing method. Among these, one or more selected from hydrocarbon compounds, halogenated hydrocarbon compounds, heterocyclic compounds, halogenated heterocyclic compounds and ether compounds are preferable.
- the content of the organic semiconductor compound (content excluding Li, Na, P, K, Fe, Pd, Sn, B, Cl, Br and I) in the above coating solution is 0.2 to 10% by mass. Is preferable, and 0.3 to 5% by mass is more preferable.
- the content of the organic solvent in the coating solution is preferably 50 to 99.8% by mass, more preferably 70 to 99.7% by mass, and still more preferably 80 to 99.5% by mass, and 90 to 99. 5% by mass is more preferable, and 95 to 99.5% by mass is particularly preferable.
- 50 mass% or more is preferable, as for the ratio of the organic-semiconductor compound which occupies in the remainder except the organic solvent and atom AT in the said coating liquid, 70 mass% or more is more preferable, 80 mass% or more is more preferable, 90 mass% Is particularly preferable, and may be 95% by mass or more, and may be 97% by mass or more.
- the content of the organic semiconductor compound in the organic semiconductor layer is preferably 50% by mass or more, more preferably 70% by mass or more, and further preferably 80% by mass or more.
- the content is preferably 90% by mass or more, particularly preferably 95% by mass or more, and may be 97% by mass or more.
- the organic semiconductor layer does not contain a polymer (a binder resin, an insulating resin, etc.) which is not an organic semiconductor compound.
- the layer thickness of the organic semiconductor layer is appropriately adjusted in accordance with the applied organic TFT element, and can not be uniquely determined. For example, 10 to 500 nm is preferable, and 20 to 200 nm is more preferable. .
- a coating method of the above-mentioned coating liquid a usual method can be used, for example, bar coat method, spin coat method, knife coat method, doctor blade method, ink jet printing method, flexographic printing method, gravure printing method or screen printing The law is mentioned. Furthermore, as a coating method of the said coating liquid, the formation method (what is called gap casting method) of the organic-semiconductor film of Unexamined-Japanese-Patent No. 2013-207085, The manufacturing method of the organic-semiconductor thin film of international publication 2014/175351 is described. (So-called edge cast method or continuous edge cast method) or the like is also suitably used.
- Drying can select suitable conditions according to the kind of each component contained in an organic-semiconductor composition (composition used for formation of an organic-semiconductor layer). Although natural drying may be used, heat treatment is preferable from the viewpoint of improving productivity.
- the heat treatment conditions can not be determined uniquely, but for example, the heating temperature is preferably 30 to 250 ° C., more preferably 40 to 200 ° C., still more preferably 50 to 150 ° C., and the heating time is 10 to 300 minutes. Preferably, 20 to 180 minutes are more preferable.
- an organic semiconductor compound that can be used to form the organic semiconductor layer of the organic TFT element can be used without particular limitation.
- the organic semiconductor compound may be a low molecular weight compound or a high molecular weight compound.
- a condensed polycyclic aromatic compound can be suitably used.
- a fused polycyclic aromatic compound for example, compounds described in paragraphs [0055] to [0077] of Japanese Patent No. 5480510 can be used.
- D is a group having an aromatic heterocyclic ring having a single ring structure or a fused polycyclic structure, or a fused group having at least one atom selected from N, O, S and Se as a ring member atom
- D is preferably a donor structural unit (electron donor unit) in relation to A.
- A is preferably an acceptor structural unit (electron acceptor unit) in relation to D.
- an aromatic heterocycle having a single ring structure is also referred to as a "monocyclic aromatic heterocycle”.
- an aromatic heterocycle having a fused polycyclic structure is also referred to as a "fused polycyclic aromatic heterocycle”.
- D is a group having a heteroaromatic ring
- this heteroaromatic ring preferably has at least one S as a ring member atom.
- D is a group formed by linking a monocyclic aromatic heterocycle through a single bond or a divalent linking group, or a monocyclic aromatic heterocycle It is preferably a group formed by linking a ring and a fused polycyclic aromatic heterocycle via a single bond or a divalent linking group.
- the divalent linking group is preferably a conjugated chain, and more preferably an ethenylene group, an arylene group or a heteroarylene group, or a combination of two or more of these.
- the divalent linking group is a combination of two or more selected from an ethenylene group, an arylene group and a heteroarylene group
- a combination of an arylene group (preferably a phenylene group or a naphthylene group) and ethenylene is preferred.
- the number of aromatic heterocycles constituting D (when D has a fused polycyclic aromatic heterocycle, the number of aromatic heterocycles is 1 for one fused polycyclic aromatic heterocycle) is 2 or more 2 to 6 is more preferable, and 2 to 4 is more preferable.
- such an aromatic heterocycle is preferably a fused polycyclic aromatic heterocycle.
- the heteroaromatic ring constituting D is a monocyclic heteroaromatic ring, it is preferably a 5- or 6-membered ring, more preferably a 5-membered ring, and still more preferably a thiophene ring or a furan It is a ring, particularly preferably a thiophene ring.
- the aromatic heterocycle constituting D is a fused polycyclic aromatic heterocycle
- the single ring structure composing the fused polycyclic aromatic heterocycle is preferably a 5- or 6-membered ring, More preferably, it is a 5-membered ring.
- the aromatic heterocycle constituting D is a fused polycyclic aromatic heterocycle, it is preferably a bicyclic aromatic heterocycle.
- the aromatic heterocyclic ring constituting D may have a substituent, and examples of such a substituent (hereinafter referred to as “substituent D S1 ”) include an alkyl group, an alkenyl group, an alkynyl group and an aromatic hydrocarbon group. And aromatic heterocyclic groups, halogen atoms and groups represented by the following formula (1-1).
- Alkyl group which may take as substituents D S1 may have a either linear or branched, may be cyclic.
- the carbon number of this alkyl group is preferably 1 to 30, and more preferably 1 to 20.
- the alkyl group may have a group selected from -O-, -S- and -NR D3- incorporated in the carbon chain of the alkyl group, and -O-,-at the end of the binding site of the alkyl group. S- and -NR D3- may be incorporated. R D3 has the same meaning as R 1S described later, and the preferred embodiment is also the same.
- the alkenyl or alkynyl group that can be taken as the substituent D S1 may be linear or branched.
- the carbon number of the alkenyl group and the alkynyl group is preferably 2 to 30, and more preferably 2 to 20.
- the carbon number of the aromatic hydrocarbon group that can be taken as the substituent D S1 is preferably 6 to 30.
- substituent aromatic heterocyclic group which may take as D S1 is a monocyclic aromatic heterocyclic group, more preferably a monocyclic aromatic heterocyclic group having 5 to 7-membered ring.
- the aromatic heterocyclic group preferably has a hetero atom selected from O, N, S and Se as a ring-constituting hetero atom.
- Halogen atoms which can be taken as substituents D S1 is F, Cl, Br or I, more preferably F or Cl, F are particularly preferred.
- the group represented by the formula (1-1) which can be taken as the substituent D S1 is a group having the following structure.
- L a represents an alkylene group.
- the alkylene group may contain at least one of -O-, -S- and -NR 1S- in the carbon chain.
- that the alkylene group contains -O- in the carbon chain means an embodiment in which -O- is introduced into the carbon-carbon bond of the alkylene group, -O- at one end or both ends of the alkylene group It means the introduced aspect and the aspect in which -O- is introduced in the middle of the carbon-carbon bond of the alkylene group and at one end or both ends of the alkylene group.
- the case where the alkylene group contains -S- or -NR 1S- also has the same meaning.
- the alkylene group that can be taken as L a may be linear, branched or cyclic, but is preferably a linear or branched alkylene group.
- the carbon number of the alkylene group is preferably 1 to 20, more preferably 1 to 15, and still more preferably 1 to 10, from the viewpoint of carrier mobility.
- the alkylene group that can be taken as L a is a branched chain, the carbon number of the branched portion is included in the carbon number of the alkylene group that represents L a .
- L a is -NR 1S - include, and if the R 1S contains a carbon atom, the carbon number of R 1S shall not be included in the carbon number of the alkylene group can take as L a.
- Ar represents an aromatic heterocyclic group or an aromatic hydrocarbon group having 6 to 18 carbon atoms.
- the aromatic heterocyclic group that can be taken as Ar may be a monocyclic group or a condensed ring group of two or more rings, and is preferably a monocyclic from the viewpoint of carrier mobility. When it is a single ring group, its ring number is preferably 5 to 7 members.
- the ring-constituting hetero atom contained in the aromatic heterocyclic group is preferably a nitrogen atom, an oxygen atom, a sulfur atom or a selenium atom, and more preferably a sulfur atom.
- the aromatic hydrocarbon group having 6 to 18 carbon atoms which can be taken as Ar is not particularly limited, and examples thereof include an aromatic hydrocarbon in which a benzene ring group, a naphthalene ring group, or a ring having three or more rings is condensed (eg, fluorene And groups in which two or more hydrogen atoms have been removed from the ring).
- a benzene ring group or a naphthalene ring group is preferable, and a benzene ring group is preferable.
- L b represents an alkyl group.
- the alkyl group may contain at least one of -O-, -S- and -NR 2S- in the carbon chain.
- that the alkyl group contains -O- in the carbon chain means an embodiment in which -O- is introduced in the middle of the carbon-carbon bond of the alkyl group, -O at the end of the bonding site of the alkyl group. It means an embodiment in which-is introduced, and an embodiment in which -O- is introduced in the middle of the carbon-carbon bond of the alkyl group and at the terminal of the binding site of the alkyl group.
- the case where the alkyl group contains -S- or -NR 2S- also has the same meaning.
- the alkyl group includes -O-, -S- and -NR 2S- , the number thereof is at least one, and the upper limit thereof is not particularly limited, and is, for example, five.
- the alkyl group that can be taken as L b may be linear, branched or cyclic, but from the viewpoint of carrier mobility, it is preferably a linear or branched alkyl group, and branched alkyl Groups are more preferred.
- the alkyl group may be a halogenated alkyl group having a halogen atom (preferably, a fluorine atom, a chlorine atom, a bromine atom or an iodine atom, more preferably a fluorine atom) as a substituent.
- the carbon number of the alkyl group that can be taken as L b is 1 to 100, and preferably 9 to 100.
- the group represented by the formula (1-1) has a plurality of L b , at least one L b is preferably the above alkyl group having 9 to 100 carbon atoms, from the viewpoint of carrier mobility.
- the alkyl group is more preferably 20 to 100, and still more preferably 20 to 40.
- the carbon number of the branched portion is included in the carbon number of the alkyl group that can be taken as L b .
- L b contains —NR 2S — and R 2 S contains carbon atoms
- the carbon number of R 2 S is not included in the carbon number of the alkyl group that can be taken as L b .
- R 1S and R 2S represent a hydrogen atom or a substituent.
- the substituent that can be taken as R 1S and R 2S is not particularly limited, and examples thereof include an alkyl group (preferably, a linear or branched alkyl group having 1 to 10 carbon atoms), a halogen atom (a fluorine atom, a chlorine atom And a bromine atom or an iodine atom) or an aryl group (preferably an aryl group having a carbon number of 6 to 20).
- R 1S and R 2S are preferably a hydrogen atom or an alkyl group, and more preferably an alkyl group.
- the position of Ar (ring member atom) to which L b is bonded is not particularly limited.
- L when L a is the 1-position of the ring members to bind
- a preferably 2 to 4-position more preferably at least one L b is bonded to the 4-position .
- l is an integer of 1 to 5, preferably 1 or 2. When l is 2 or more, a plurality of L b may be the same or different.
- * indicates a binding site.
- the carbon number of the fused polycyclic aromatic hydrocarbon ring is preferably 10 to 20.
- Preferred examples of such a fused polycyclic aromatic hydrocarbon ring include a fluorene ring, a naphthalene ring, or a fused polycyclic aromatic hydrocarbon ring having three or four rings, among which a fluorene ring, A naphthalene ring, an anthracene ring, a phenanthrene ring, a chrysene ring, or a pyrene ring is preferable.
- D is a group having a fused polycyclic aromatic hydrocarbon ring
- the number of fused polycyclic aromatic hydrocarbon rings in D is preferably 1 to 6, more preferably 1 to 4, and still more preferably 1 or 2. , 1 is particularly preferred.
- D is more preferably a group consisting of the above-mentioned fused polycyclic aromatic hydrocarbon ring (that is, a fused polycyclic aromatic hydrocarbon group).
- the aromatic hydrocarbon group may further have a substituent, and as such a substituent (hereinafter referred to as “substituent D S2 ”), for example, an alkyl group, a halogen atom, and the above formula (1-1) The group represented is mentioned.
- Preferred forms of the alkyl group that can be taken as the substituent D S2 , a halogen atom and the group represented by the above formula (1-1) are an alkyl group that can be taken as the above-mentioned substituent D S1 , a halogen atom, It is the same as the preferred embodiment of the group represented by (1-1).
- D in the formula (1) is a group represented by the following formula (D-1).
- R D1 represents an organic group.
- R D1 is preferably an alkyl group (wherein the alkyl group in the carbon chain is -O-, -S-, and -NR D3- (R D3 has the same meaning as R 1S above, and the preferred embodiment is also the same)
- the alkyl group may have at least one carbon number of 1 to 30, preferably 1 to 20, an alkynyl group (preferably 2 to 30 carbons), and an alkenyl group (number of carbons).
- an aromatic hydrocarbon group preferably having a carbon number of 6 to 30
- an aromatic heterocyclic group a 5 to 7-membered ring is preferable.
- a halogen atom F, Cl, Br or I, more preferably F or Cl, particularly preferably F
- a group represented by the above formula (1-1) An alkyl group, a halogen atom, or the above More preferably a group represented by (1-1), more preferably a group represented by the formula (1-1).
- Z d represents a nitrogen atom or CR D2 and is preferably CR D2 .
- R D2 represents a hydrogen atom or an organic group.
- R D2 is preferably a hydrogen atom, an alkyl group (the alkyl group in the carbon chain is -O-, -S-, and -NR D3- (R D3 has the same meaning as R 1S above, and preferred embodiments are also the same)
- the alkyl group preferably has 1 to 30 carbon atoms, and more preferably 1 to 20 carbon atoms), an alkynyl group (preferably 2 to 30 carbon atoms), and an alkenyl group.
- a carbon number of 2 to 30 is preferable
- an aromatic hydrocarbon group (a carbon number of 6 to 30 is preferable)
- an aromatic heterocyclic group (a 5 to 7-membered ring is preferable.
- the ring constituting hetero atom is O, N, S or Se is preferred), a halogen atom (F, Cl, Br or I, more preferably F or Cl, particularly preferably F), or a group represented by the above formula (1-1) Group, a hydrogen atom, an alkyl group, More preferably Gen atom, or a group represented by the formula (1-1), more preferably a group represented by the formula (1-1).
- M represents a single bond, an aromatic heterocyclic group, an aromatic hydrocarbon group, an alkenylene group, an alkynylene group, or a divalent group formed by combining these.
- the structural unit in parentheses and the above M are rotatably coupled at the coupling axis.
- the aromatic heterocyclic group that can be taken as M may be monocyclic or polycyclic.
- an aromatic heterocyclic ring which comprises this aromatic heterocyclic group the group which consists of the monocyclic aromatic heterocyclic ring which may comprise D mentioned above, or a fused polycyclic aromatic heterocyclic ring is mentioned.
- an aromatic hydrocarbon group that can be taken as M an aromatic hydrocarbon group having 6 to 20 carbon atoms is preferable.
- the aromatic hydrocarbon ring constituting such an aromatic hydrocarbon group is preferably a benzene ring, a biphenylene ring, a fluorene ring, a naphthalene ring, or another aromatic hydrocarbon ring in which three or four rings are fused, and a fluorene ring A naphthalene ring, an anthracene ring, a phenanthrene ring, a chrysene ring or a pyrene ring is more preferable.
- the aromatic heterocyclic group or aromatic hydrocarbon group which can be taken as M may be in a form having a substituent, and as such a substituent, an alkyl group (the alkyl group is preferably -O- or -S- in the carbon chain) And -NR D3- (R D3 may have the same meaning as R 1S and the preferred form is also the same) and may contain at least one of the following: a halogen atom (F, Cl, Br or I) And F and Cl are more preferable, and F is particularly preferable), and groups represented by the above formula (1-1) can be mentioned.
- the alkenylene group that can be taken as M is preferably an alkenylene group having 2 to 10 carbon atoms, more preferably an alkenylene group having 2 to 4 carbon atoms, and still more preferably an ethenylene group.
- the alkynylene group that can be taken as M is preferably an alkynylene group having 2 to 10 carbon atoms, more preferably an alkynylene group having 2 to 4 carbon atoms, and still more preferably an ethynylene group.
- p and q are integers of 0 to 4, preferably 1 to 3, and more preferably 1 to 2.
- p and q have the same value.
- p + q is preferably 2 to 4.
- M has a monocyclic or polycyclic aromatic heterocyclic ring having at least one hetero atom selected from N, O, S and Se as a ring member atom, Alternatively, it is preferable to have a fused polycyclic aromatic hydrocarbon ring.
- a hydrogen atom may contain at least one of an alkyl group (the alkyl group in the carbon chain includes -O-, -S-, and -NR D3-.
- R D3 is the above R. has the same meaning as 1S, preferred forms are also the same.
- the number of carbon atoms of the alkyl group is preferably 1 to 30, 1 to 20 is more preferable.
- a in the above formula (1) represents a group having an aromatic heterocyclic group represented by any one of the following formulas (A-1) to (A-9), and is represented by the following formulas (A-1) to (A) It is preferable that it is an aromatic heterocyclic group represented by any one of -9).
- * indicates a binding site (for example, a binding site to be incorporated into A of Formula (1)) with another group forming the structural unit represented by Formula (1).
- the broken circle in the 5-membered ring indicates that the 5-membered ring is an aromatic ring.
- X A represents an oxygen atom, a sulfur atom, a selenium atom or NR X, a sulfur atom or NR X are preferred.
- R X represents an alkyl group or a group represented by the above formula (1-1). The said alkyl group which can be taken as R X is synonymous with the alkyl group which can be taken as R A1 mentioned later, and its preferable range is also the same.
- Y A represents an oxygen atom or a sulfur atom, preferably an oxygen atom.
- Z A represents a CR 2 atom or a nitrogen atom, preferably a CR 2 atom.
- R A2 is a hydrogen atom, a halogen atom, an alkyl group (the alkyl group may contain at least one of -O-, -S- and -NR A3-in the carbon chain), or , Indicates a single bond. That R A2 is a single bond means that R A2 is a binding site to another structure.
- R A2 is preferably a hydrogen atom or a single bond.
- R A2 is a halogen atom, it is a fluorine atom, a chlorine atom, a bromine atom or an iodine atom, and a fluorine atom is preferable.
- R A2 is the above alkyl group
- an alkyl group having 2 to 35 carbon atoms is preferable, and an alkyl group having 8 to 25 carbon atoms is more preferable.
- the alkyl group may be linear or branched.
- R A3 represents a hydrogen atom or a substituent.
- the substituent that can be taken as R A3 is not particularly limited, and has the same meaning as the substituent of R 1S and R 2S , and the preferred range is also the same.
- CR A2 when R A2 is a single bond, C atoms CR A2 is, the formula (A-3), in the combining site (the formulas in each (A-7) and (A-8), in * Show).
- the ring structure containing Z A, 1 single Z A is CR A2, and its R A2 becomes a single bond.
- the CR A2 (carbon atom) having this single bond is a binding site shown by * in each formula.
- 2 two Z A of the eight is CR A2, and their R A2 is a single bond.
- the CR A2 (carbon atom) having these single bonds is a binding site shown by * in Formula (A-8).
- W A are each independently, C (R A2) 2, NR A1, nitrogen atom, CR A2, an oxygen atom, a sulfur atom or a selenium atom, C (R A2) 2, CR A2 or sulfur atom are preferable, More preferred is CR A2 or a sulfur atom.
- R A1 is an alkyl group (the alkyl group may contain at least one of -O-, -S- and -NR A3-in the carbon chain), the above formula (1-1) Or a single bond.
- R A1 an alkyl group or a group represented by the above formula (1-1) is preferable.
- the alkyl group which can be taken as R A1 may be linear or branched.
- the carbon number of the alkyl group is preferably 2 to 35, and more preferably 8 to 25.
- R A2 and R A3 in the W A respectively, have the same meaning as R A2 and R A3 in the Z A, it is preferable also the same.
- one W A is an aspect of any of the following aspects 1 to 3, and it is preferable that the aspect 1 is obtained.
- Embodiments 1 W A is CR A2, and the R A2 is a single bond.
- Embodiment 2 W A is NR A1, and the R A1 is a single bond.
- Aspect 3 W A is C (R A2 ) 2 , and one of R A2 is a single bond, and the other is a hydrogen atom, a halogen atom or the above alkyl group.
- the CR A2 (carbon atom), NR A1 (nitrogen atom) or C (R A2 ) 2 (carbon atom) having the single bond is a bonding site (in the formula, *) in the formula (A-4) Show).
- A is one of the formulas (A-1) to (A-4), the formula (A-6), the formula (A-7) or the formula (A)
- the structural unit represented by the above formula (1) is preferably a structural unit represented by any of the following formulas (2) to (4).
- X A , Y A and Z A are respectively synonymous with X A , Y A and Z A described in the above formulas (A-1) to (A-9).
- X d, Z d, M, p and q are each the same meaning as X d, Z d, M, p and q described in the above formula (D-1).
- the structural unit represented by the above formula (1) is more preferably a structural unit represented by the following formula (5).
- R X has the same meaning as R X described in the above formulas (A-1) to (A-9), and the preferred embodiment is also the same.
- X d , M, p and q are respectively synonymous with X d , M, p and q described in the above formula (D-1).
- n represents a molar ratio of repeating units.
- the organic semiconductor polymer having a structural unit represented by the above formula (1) may contain the structural unit represented by the formula (1) singly or in combination of two or more.
- the organic semiconductor polymer which has a structural unit represented by the said Formula (1) has two or more repeating units represented by Formula (1).
- the organic semiconductor polymer having a structural unit represented by the above formula (1) may be a random copolymer or a block copolymer.
- the organic semiconductor polymer having a structural unit represented by the above formula (1) may be an oligomer having a repeating unit number (degree of polymerization) n of 2 to 9 and a polymer compound having a repeating unit number n of 10 or more It may be.
- a polymer compound is preferable from the viewpoint of carrier mobility and physical properties of the obtained organic semiconductor layer.
- the degree of polymerization n can be roughly estimated from the weight average molecular weight described later and the mass of each repeating unit.
- the organic semiconductor polymer having a structural unit represented by the above formula (1) may have a structural unit other than the structural unit represented by the above formula (1).
- the content of the structural unit represented by the above formula (1) is preferably 60% by mass or more, and is 80% by mass or more Is more preferably 90% by mass or more. It is preferable that the organic-semiconductor polymer which has a structural unit represented by the said Formula (1) is a polymer which consists of a structural unit represented by the said Formula (1).
- the organic semiconductor polymer having a structural unit represented by the above formula (1) preferably has a weight average molecular weight of 2,000 or more, more preferably 10,000 or more, from the viewpoint of carrier mobility. It is more preferably 20,000 or more, particularly preferably 30,000 or more, and most preferably 45,000 or more. Also, from the viewpoint of solubility, the weight average molecular weight is preferably 1,000,000 or less, more preferably 300,000 or less, still more preferably 200,000 or less, and 150,000 or less Is particularly preferred. In the present invention, the weight average molecular weight and the number average molecular weight are measured by gel permeation chromatography (GPC (Gel Permeation Chromatography)) method, and determined by converting them into standard polystyrene.
- GPC Gel Permeation Chromatography
- GPC is HLC-8121GPC (manufactured by Tosoh Corp.), and two columns of TSKgel GMH HR- H (20) HT (manufactured by Tosoh Corp., 7.8 mm ID ⁇ 30 cm) are used for elution.
- TSKgel GMH HR- H (20) HT manufactured by Tosoh Corp., 7.8 mm ID ⁇ 30 cm
- the conditions are a sample concentration of 0.02% by mass, a flow rate of 1.0 mL / min, a sample injection amount of 300 ⁇ L, a measurement temperature of 160 ° C., and an IR (infrared) detector.
- the calibration curve is “Tosoh's standard sample TSK standard, polystyrene”: “F-128”, “F-80”, “F-40”, “F-20”, “F-10”, “ Twelve samples of F-4 “,” F-2 “,” F-1 “,” A-5000 “,” A-2500 “,” A-1000 "and” A-500 "are used.
- the terminal structure of the organic semiconductor polymer having the structural unit represented by the above formula (1) is not particularly limited, and the presence or absence of other repeating units, the type of substrate used at the time of synthesis, or the quenching agent at the time of synthesis (reaction Depending on the type of terminator, it can not be determined uniquely.
- the terminal structure is, for example, a hydrogen atom, a hydroxy group, a halogen atom, an ethylenically unsaturated group, an alkyl group, an aromatic heterocyclic group (preferably a thiophene ring) or an aromatic hydrocarbon group (a benzene ring). Can be mentioned.
- the synthesis method of the organic semiconductor polymer having the structural unit represented by the above formula (1) is not particularly limited, and the synthesis can be carried out with reference to a common method.
- the precursor compound which leads each structural unit which comprises a polymer is synthesize
- JP-A-2010-527327, JP-A-2007-516315, JP-A-2014-515043, JP-A-2014-507488, JP-2011- Each reference can be referred to, for example, the 5501 451 patent, the JP 2010-18790 A, the International Publication 2012/174561, the Japanese Patent Application Publication 2011-514399, and the Japanese Patent Application Publication 2011-514913.
- the organic TFT element of the present invention preferably has a sealing layer as the outermost layer.
- a sealing agent composition for forming a sealing layer
- the thickness of the sealing layer is not particularly limited, but is preferably 0.2 to 10 ⁇ m.
- FIG. 2 is a schematic cross-sectional view showing a bottom gate-top contact type organic TFT device 200 which is an example of the semiconductor device of the present invention.
- the organic TFT device 200 includes a substrate 10, a gate electrode 20, a gate insulating layer (film) 30, an organic semiconductor layer (film) 50, a source electrode 40 and a drain electrode 42, The sealing layer 60 is provided in this order.
- the organic TFT element 200 is the same as the organic TFT element 100 except that the layer configuration (lamination mode) is different. Therefore, the substrate, gate electrode, gate insulating layer, source electrode, drain electrode, organic semiconductor layer, and sealing layer are the same as those in the above-described bottom gate-bottom contact type organic TFT device, so I omit it.
- the configurations of the gate electrode, the gate insulating layer, the organic semiconductor layer, the source electrode, the drain electrode, the sealing layer and the like described above are not limited to the bottom gate type organic TFT element but apply to top gate type organic TFT elements. be able to.
- the content of the atom AT in the organic semiconductor compound was determined by the following method.
- the organic semiconductor compound and nitric acid are added in a Teflon (registered trademark) container, ashed by heating in a microwave oven, and then dissolved in nitric acid, and this solution is used as a sample for ICP-MS HP 7700 (manufactured by Agilent).
- the atomic AT was quantified using.
- composition example The following organic semiconductor compounds (polymers 1 to 13 and low molecular weight compounds 14 and 15 consisting of the following structural units) were synthesized.
- Synthesis Example 1 Synthesis of Polymer 1 Polymer 1 was synthesized according to the following scheme. In the following scheme, DMF is N, N-dimethylformamide, NBS is N-bromosuccinimide, and dba is dibenzylideneacetone.
- the atomic AT content in polymer 1 was 1090 ppm. This polymer was purified according to the method described in paragraph [0238] of JP-A-2014-189721. In the organic semiconductor polymer 1 after this purification, the content of atomic AT was 10 ppm.
- Synthesis Examples 2 to 13 Synthesis of Organic Semiconductor Polymers 2 to 13
- Organic semiconductor polymers 2 to 13 were synthesized and purified in the same manner as in Synthesis Example 1 except that the monomers used in the above Synthesis Example 1 were changed.
- the resulting organic semiconductor polymers 2 to 13 all had the content of the atom AT in the range of 10 to 50 ppm, except for the polymer 6.
- Synthesis Example 15 Synthesis of Low Molecular Weight Organic Semiconductor Compound 15
- the low molecular weight organic semiconductor compound 15 was purchased from 6,13-bis (triisopropylsilylethynyl) pentacene (manufactured by Aldrich, product number 716006), and was purified by sublimation. The content of the atom AT was 20 ppm in the organic semiconductor compound 15 after the above purification.
- solubility Y The solubility of the organic semiconductor compound in chlorobenzene when the organic semiconductor compound and the atom AT are added in chlorobenzene so that the ratio (ppm) shown in the compositions 1 to 21 is achieved and the atom AT is made to coexist in such a ratio It measured (this solubility is called "solubility Y").
- the solubility improvement rate (%) was calculated by the following formula, and evaluated based on the following evaluation criteria.
- Solubility improvement rate (%) 100 x (solubility Y / solubility X) ⁇ Solubility improvement rate evaluation criteria> A: Solubility improvement rate is 120% or more B: Solubility improvement rate is 110% or more and less than 120% C: Solubility improvement rate is 101% or more and less than 110% D: Solubility improvement rate is 100% or less It is shown in the column of composition 1 to 21 for film formation.
- Na source sodium carbonate
- P source triphenylphosphine
- Fe source iron oxide
- Pd source tris (dibenzylideneacetone) dipalladium
- Sn source tributyltin chloride
- B source triisopropyl borate
- Br source bromine I source: iodine
- compositions 1 to 21 for forming an organic semiconductor film shown in Table 1 below the ratio (ppm) of the content of the atom AT to the total of the content of the organic semiconductor compound and the content of the atom AT is shown in the following table.
- concentration of the organic semiconductor compound in the chlorobenzene is further determined in the coexistence of the atom AT in the ratio described in Table 1.
- a composition prepared by adding to a glass vial so as to have the same concentration as the solubility of the organic semiconductor compound, stirring and mixing at 60 ° C. for 24 hours with a mix rotor (manufactured by As One Corporation), and cooling to room temperature (20 ° C. or more) (Ie, a composition obtained by dissolving the organic semiconductor compound in chlorobenzene in the coexistence of the atomic AT at a ratio described in Table 1 at 20 ° C. to the limit that can be dissolved A.).
- a bottom gate-bottom contact type organic thin film transistor having the structure shown in FIG. 1 was produced.
- Al serving as a gate electrode was vapor-deposited (thickness: 50 nm).
- the resultant was coated and baked at 150 ° C. for 60 minutes to form a gate insulating film having a thickness of 400 nm.
- source electrode and drain electrode (channel length 40 ⁇ m, channel width) It drew to 100 micrometers. After that, baking was performed at 180 ° C. for 30 minutes in an oven and sintering was performed to form a source electrode and a drain electrode, whereby an element substrate for TFT characteristic evaluation was obtained.
- the composition for forming an organic semiconductor film shown in Table 1 below was spin coated (200 rpm, on a device substrate for TFT characteristic evaluation in a nitrogen glove box and cooled to room temperature (20 ° C. or higher) after the above heating. 30 seconds).
- Example 1 Comparative Example 1, Example 2, Comparative Example 2, Comparative Example 3, Example 3, Example 4, Example 4, Comparative Example 4, Example 5, Comparative Example 5, Example 6, Comparative
- the organic TFT elements of Example 6 and Examples 7 to 15 correspond to the organic TFT elements produced using the compositions 1 to 21 for forming an organic semiconductor film in order, respectively.
- I d (w / 2 L) ⁇ C i (V g -V th ) 2
- L represents a gate length
- w represents a gate width
- C i represents a capacity per unit area of an insulating layer
- V g represents a gate voltage
- V th represents a threshold voltage
- Variation coefficient 100 ⁇ [standard deviation of carrier mobility of 10 elements] / [average value of carrier mobility of 10 elements] Evaluation criteria of variation in carrier mobility are shown below. Practically, A or B is preferable, and A is more preferable.
- the solubility of the organic semiconductor compound in the solvent in the composition for forming an organic semiconductor film used for forming the semiconductor layer improve.
- the variation in carrier mobility of the obtained organic TFT element was large (Comparative Example 3). This is considered to be caused by generation of excessive leak current and the like due to the atoms AT present in excess in the organic semiconductor layer.
- the composition for forming an organic semiconductor film used for forming this semiconductor layer In the material, the solubility of the organic semiconductor compound in the solvent can be effectively improved, and the variation in carrier mobility can be favorably suppressed.
- the organic-semiconductor compound to be used is a polymer which has a structural unit represented by Formula (5), it turned out that the dispersion
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Thin Film Transistor (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Abstract
Description
特許文献1には、超臨界状態の溶媒を用いて不純物を除去した有機半導体化合物を用いて形成した有機半導体層を有する有機薄膜トランジスタ素子が記載され、この有機薄膜トランジスタ素子はリーク電流が抑えられ、またオン/オフ比が向上したことが記載されている。
また、特許文献2には不純物量を100ppm以下としたπ共役系ポリマーからなる有機半導体化合物を用いて形成した有機半導体層を有する有機薄膜トランジスタ素子が記載されている。特許文献2には、この有機薄膜トランジスタ素子のリーク電流が有効に抑えられ、オン/オフ比が飛躍的に向上したことが記載されている。
また特許文献3には、合成したジケトピロールピロール(DPP)コポリマーのパラジウム含有量を低減する方法が記載され、パラジウム含有量を低減したDPPコポリマーを有機薄膜トランジスタ素子の有機半導体層に用いることにより、有機薄膜トランジスタ素子のキャリア移動度が向上したことが記載されている。
しかし、上記各特許文献をはじめ従来の有機半導体化合物は溶媒中への溶解性が十分とはいえず、この有機半導体化合物を溶解した溶液を用いて有機半導体層を形成した場合、製造安定性の要求に十分に対応することは困難であった。
本発明はこれらの知見に基づきさらに検討を重ね、完成されるに至ったものである。
〔1〕
有機半導体化合物を含有してなる有機半導体層を有する有機薄膜トランジスタ素子であって、上記有機半導体層中、Li、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる1種又は2種以上の原子の含有量が300~700ppmである、有機薄膜トランジスタ素子。
〔2〕
上記有機半導体化合物が下記式(1)で表される構造単位を有する有機半導体ポリマーである、〔1〕に記載の有機薄膜トランジスタ素子。
XAは酸素原子、硫黄原子、セレン原子又はNRXを示す。RXはアルキル基又は下記式(1-1)で表される基を示す。
YAは酸素原子又は硫黄原子を示す。
ZAはCRA2又は窒素原子を示す。
WAはC(RA2)2、NRA1、窒素原子、CRA2、酸素原子、硫黄原子又はセレン原子を示す。RA1は、アルキル基、下記式(1-1)で表される基又は単結合を示す。RA2は水素原子、ハロゲン原子、アルキル基又は単結合を示す。
*は上記式(1)のA中に組み込まれるための結合部位を示す。
Laは炭素数1~20のアルキレン基を示す。
Arは芳香族複素環基又は炭素数6~18の芳香族炭化水素基を示す。
Lbは炭素数1~100のアルキル基を示す。
lは1~5の整数である。
*は結合部位を示す。
〔3〕
上記式(1)中のDが下記式(D-1)で表される基である、〔2〕に記載の有機薄膜トランジスタ素子。
Xdは酸素原子、硫黄原子、セレン原子又はNRD1を示す。RD1は有機基を示す。
Zdは窒素原子又はCRD2を示す。RD2は水素原子又は有機基を示す。
Mは単結合であるか、又は、芳香族複素環基、芳香族炭化水素基、アルケニレン基、アルキニレン基もしくはこれらの基を2つ以上組み合わせてなる2価の基を示す。
p及びqは0~4の整数を示す。
*は式(1)で表される構造単位中に組み込まれるための結合部位を示す。
〔4〕
上記式(1)で表される構造単位が、下記式(2)~(4)のいずれかで表される構造単位である、〔2〕又は〔3〕に記載の有機薄膜トランジスタ素子。
XA、YA及びZAは、それぞれ、上記式(A-1)~(A-9)において説明したXA、YA及びZAと同義である。
Xd、Zd、M、p及びqは、それぞれ、上記式(D-1)において説明したXd、Zd、M、p及びqと同義である。
〔5〕
上記式(1)で表される構造単位が、下記式(5)で表される構造単位である、〔2〕又は〔3〕に記載の有機薄膜トランジスタ素子。
RXは上記式(A-1)~(A-9)において説明したRXと同義である。
Xd、M、p及びqは、それぞれ、上記式(D-1)において説明したXd、M、p及びqと同義である。
〔6〕
上記有機半導体層中、Na、P、Fe、Pd、Sn、B、Br及びIからなる群から選ばれる1種又は2種以上の原子の含有量が300~700ppmである、〔1〕~〔5〕のいずれか1つに記載の有機薄膜トランジスタ素子。
〔7〕
有機半導体化合物と、Li、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる1種又は2種以上の原子とを含有し、
上記有機半導体化合物の含有量と、上記のLi、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる1種又は2種以上の原子の含有量との合計に占める、上記のLi、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる1種又は2種以上の原子の含有量の割合が300~700ppmである、有機半導体膜形成用組成物。
〔8〕
上記有機半導体化合物が下記式(1)で表される構造単位を有する有機半導体ポリマーである、〔7〕に記載の有機半導体膜形成用組成物。
XAは酸素原子、硫黄原子、セレン原子又はNRXを示す。RXはアルキル基又は下記式(1-1)で表される基を示す。
YAは酸素原子又は硫黄原子を示す。
ZAはCRA2又は窒素原子を示す。
WAはC(RA2)2、NRA1、窒素原子、CRA2、酸素原子、硫黄原子又はセレン原子を示す。RA1は、アルキル基、下記式(1-1)で表される基又は単結合を示す。RA2は水素原子、ハロゲン原子、アルキル基又は単結合を示す。
*は上記式(1)のA中に組み込まれるための結合部位を示す。
Laは炭素数1~20のアルキレン基を示す。
Arは芳香族複素環基又は炭素数6~18の芳香族炭化水素基を示す。
Lbは炭素数1~100のアルキル基を示す。
lは1~5の整数である。
*は結合部位を示す。
〔9〕
溶媒を含有する、〔7〕又は〔8〕に記載の有機半導体膜形成用組成物。
〔10〕
〔7〕~〔9〕のいずれか1つに記載の有機半導体膜形成用組成物を用いて成膜することを含む、有機半導体膜の製造方法。
〔11〕
有機半導体化合物と、Li、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる少なくとも1種の原子とを含有し、膜中の、Li、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる少なくとも1種の原子の含有量が300~700ppmである、有機半導体膜。
本明細書において、「(メタ)アクリレート」とは、アクリレートとメタクリレートの一方または両方の意味で用いられる。また、「(メタ)アクリル酸」は、アクリル酸とメタクリル酸の一方または両方の意味で用いられる。
本明細書において、化合物の表示については、化合物そのもののほか、その塩、そのイオンを含む。また、目的とする効果を損なわない範囲で、構造の一部を変化させたものを含む。
また、置換又は無置換を明記していない化合物については、目的とする効果を損なわない範囲で、任意の置換基を有するものを含む。このことは、置換基及び連結基等(以下、置換基等という)についても同様である。
本明細書において、ポリマー中に同一の表示で表された複数の構造単位が存在する場合は、ポリマー中に存在する各構造単位は同一でも異なっていてもよい。
また、基の炭素原子数(炭素数ともいう。)が限定されている場合、この基の炭素原子数は、特段の断りがない限り、置換基を含めた全炭素原子数を意味する。
本発明において、基が非環状骨格及び環状骨格を形成しうる場合、特段の断りがない限り、この基は、非環状骨格の基と環状骨格の基を含む。例えば、アルキル基は、直鎖アルキル基、分岐アルキル基及び環状(シクロ)アルキル基を含む。基が環状骨格を形成しうる場合、環状骨格を形成する基の原子数の下限は、この基について具体的に記載した原子数の下限にかかわらず、3以上であり、5以上が好ましい。
本明細書において「ppm」は質量基準である。
本発明の上記および他の特徴および利点は、適宜添付の図面を参照して、下記の記載からより明らかになるであろう。
本明細書において、上記の「Li、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる1種又は2種以上の原子」は、有機半導体化合物の分子構造を構成している原子ではなく、有機半導体層中において有機半導体化合物とは別に存在する原子である。またこれらの原子は通常、イオン化された状態、あるいは錯体ないし化合物の状態で存在する。Li、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる1種又は2種以上の原子の含有量は、後述する実施例に記載の方法により測定される。
本発明の効果をより高める観点から上記原子ATは、Na、P、Fe、Pd、Sn、B、Br及びIからなる群から選ばれる1種又は2種以上の原子であることが好ましい。
本発明の有機薄膜トランジスタ素子の好ましい実施形態について以下に説明する。
本発明の有機薄膜トランジスタ(有機TFTともいう)素子は、上述した本発明の有機半導体層を有し、更に、ソース電極と、ゲート絶縁層と、ドレイン電極と、ゲート電極と、を有することができる。
本発明の有機TFT素子は、基板上に、ゲート電極と、有機半導体層と、ゲート電極及び有機半導体層の間に設けられたゲート絶縁層と、有機半導体層に接して設けられ、有機半導体層を介して連結されたソース電極及びドレイン電極とを有する。この有機TFT素子においては、有機半導体層とゲート絶縁層が隣接して設けられる。
本発明の有機TFT素子は、上記各層を備えていればその構造については特に限定されない。例えば、ボトムコンタクト型(ボトムゲート-ボトムコンタクト型及びトップゲート-ボトムコンタクト型)、又は、トップコンタクト型(ボトムゲート-トップコンタクト型及びトップゲート-トップコンタクト型)などのいずれの構造を有していてもよい。本発明の有機TFT素子は、より好ましくは、ボトムゲート-ボトムコンタクト型又はボトムゲート-トップコンタクト型(これらを総称してボトムゲート型という。)である。
以下、本発明の有機TFT素子の一例について、図面を参照して説明する。
図1は、本発明の半導体素子の一例であるボトムゲート-ボトムコンタクト型の有機TFT素子100の断面模式図である。
有機TFT素子100は、図1に示されるように、基板(基材)10と、ゲート電極20と、ゲート絶縁膜30と、ソース電極40及びドレイン電極42と、有機半導体膜50と、封止層60とを、この順で、有する。
以下、基板(基材)、ゲート電極、ゲート絶縁層(膜)、ソース電極、ドレイン電極、有機半導体層(膜)及び封止層、並びに、それぞれの作製方法について詳述する。
基板は、後述するゲート電極、ソース電極及びドレイン電極等を支持する役割を果たす。
基板の種類は、特に制限されず、例えば、プラスチック基板、シリコン基板、ガラス基板又はセラミック基板等が挙げられる。中でも、汎用性、各デバイスへの適用性及びコストの観点から、シリコン基板、ガラス基板又はプラスチック基板であることが好ましい。
基板の厚みは、特に限定されないが、例えば、10mm以下であるのが好ましく、2mm以下であるのが更に好ましく、1.5mm以下であるのが特に好ましい。一方、0.01mm以上であるのが好ましく、0.05mm以上であるのが更に好ましい。
ゲート電極は、有機TFT素子のゲート電極として用いられている通常の電極を特に制限されることなく適用できる。
ゲート電極を形成する材料(電極材料)としては、特に限定されず、例えば、金、銀、アルミニウム、銅、クロム、ニッケル、コバルト、チタン、白金、マグネシウム、カルシウム、バリウム若しくはナトリウム等の金属、InO2、SnO2若しくはインジウム錫酸化物(ITO)等の導電性の酸化物、ポリアニリン、ポリピロール、ポリチオフェン、ポリアセチレン若しくはポリジアセチレン等の導電性高分子、シリコン、ゲルマニウム若しくはガリウム砒素等の半導体、又は、フラーレン、カーボンナノチューブ若しくはグラファイト等の炭素材料等が挙げられる。中でも、上記金属が好ましく、銀又はアルミニウムがより好ましい。
ゲート電極の厚みは、特に限定されないが、20~200nmであることが好ましい。
ゲート電極は、シリコン基板のように上記基板として機能するものでもよく、この場合、上記基板はなくてもよい。
ゲート絶縁層は、ゲート電極と有機半導体層との間に設けられ、絶縁性を有する膜(層)であれば特に限定されず、単層であってもよいし、多層であってもよい。
ゲート絶縁層は、絶縁性の材料で形成されるのが好ましく、絶縁性の材料として、例えば、有機高分子などの有機材料、無機酸化物などの無機材料等が好ましく挙げられる。取り扱い性などの点から、基板にプラスチック基板やガラス基板を用いる場合には有機材料を用いることが好ましい。
有機高分子及び無機酸化物等は、絶縁性を有するものであれば特に限定されず、薄膜、例えば厚み1μm以下の薄膜を形成できるものが好ましい。
有機高分子及び無機酸化物は、ぞれぞれ、1種を用いても、2種以上を併用してもよい。また、ゲート絶縁層は、それぞれ後述する有機高分子と無機酸化物とを混合させたハイブリッド層としてもよい。
有機高分子は、アルコキシシリル基やビニル基、アクリロイルオキシ基、エポキシ基、メチロール基等の反応性置換基を有する化合物と併用することもできる。
また、特開2013-214649号公報の[0167]~[0177]に記載の「数平均分子量(Mn)が140~5,000であり、架橋性官能基を有し、フッ素原子を有さない化合物(G)」を用いるのも好ましく、これらの内容は好ましくは本願明細書に組み込まれる。
熱により酸を発生させる熱酸発生剤(触媒)として、例えば、特開2010-285518号公報の[0035]~[0038]に記載の熱カチオン重合開始剤、特にオニウム塩等、特開2005-354012号公報の[0034]~[0035]に記載の触媒、特にスルホン酸類及びスルホン酸アミン塩等を好ましく使用することができ、好ましくはこれらの内容は本願明細書に組み込まれる。
また、特開2005-354012号公報の[0032]~[0033]に記載の架橋剤、特に二官能以上のエポキシ化合物、オキセタン化合物、特開2006-303465号公報の[0046]~[0062]に記載の架橋剤、特に2個以上の架橋基を有し、この架橋基の少なくとも一つがメチロール基もしくはNH基であることを特徴とする化合物、及び、特開2012-163946号公報の[0137]~[0145]に記載の、ヒドロキシメチル基又はアルコキシメチル基を分子内に2個以上有する化合物を用いるのも好ましく、これらの内容は好ましくは本願明細書に組み込まれる。
また、それぞれの金属酸化物に対応する前駆体、具体的には塩化物、臭化物等の金属ハロゲン化物や金属アルコキシド、金属水酸化物等を、アルコールや水中で塩酸、硫酸、硝酸等の酸や水酸化ナトリウム、水酸化カリウム等の塩基と反応させて加水分解することにより、形成してもよい。このような溶液系のプロセスを用いる場合、上記ウエットコーティング法を用いることができる。
本発明の有機TFT素子において、ソース電極は、配線を通じて外部から電荷が流入する電極である。また、ドレイン電極は、配線を通じて外部に電荷を送り出す電極である。
ソース電極及びドレイン電極を形成する材料は、上述したゲート電極を形成する電極材料と同じものを用いることができる。中でも、金属が好ましく、金または銀がより好ましい。また、金属と有機半導体の間に電荷注入層を設けることにより、ソースから有機半導体への電荷注入を促進し、移動度を向上させることが好ましい。
ソース電極及びドレイン電極の厚みは、特に限定されないが、それぞれ、1nm以上が好ましく、10nm以上が特に好ましい。また、500nm以下が好ましく、300nm以下が特に好ましい。
ソース電極とドレイン電極との間の間隔(ゲート長)は、適宜に決定できるが、例えば、200μm以下が好ましく、100μm以下が特に好ましい。また、ゲート幅は、適宜に決定できるが、例えば、5000μm以下が好ましく、1000μm以下が特に好ましい。
ソース電極及びドレイン電極を形成する方法は、特に限定されないが、例えば、ゲート電極とゲート絶縁膜とが形成された基板上に、電極材料を真空蒸着又はスパッタする方法、電極形成用組成物を塗布又は印刷する方法等が挙げられる。パターニングする場合、パターニングする方法は上述したゲート電極の方法と同じである。
本発明の有機TFT素子において、有機半導体層は上述した通り、原子ATを300~700ppm(好ましくは320~650ppm、より好ましくは340~630ppm)含有する。かかる有機半導体層の形成方法に特に制限はなく、例えば、有機半導体化合物と原子ATとを含有し、且つ、この有機半導体化合物の含有量と原子ATの含有量との合計に占める原子ATの含有量の割合を300~700ppm(好ましくは320~650ppm、より好ましくは340~630ppm)とした組成物を用いて形成することできる。より詳細には、有機半導体層を構成する有機半導体化合物中に、原子ATを300~700ppm(好ましくは320~650ppm、より好ましくは340~630ppm)の濃度となるように含有させて組成物を調製し、あるいは、かかる原子ATを含有させた有機半導体化合物を有機溶媒中に溶解して組成物(塗布液)を調製し、これらの組成物を有機半導体層の下層となる層(通常はゲート絶縁層)に適用(塗布)し、必要により乾燥させて形成することができる。
また、有機半導体化合物の量と原子ATの量との合計に対し、原子ATの量の割合が300~700ppm(好ましくは320~650ppm、より好ましくは340~630ppm)となるように、有機半導体化合物と原子ATとを有機溶媒中に溶解して塗布液を調製してもよい。
上記組成物(塗布液)中には、バインダー樹脂及び/又は絶縁性樹脂を含有させてもよく、本発明の効果をより高める観点からは、上記組成物(塗布液)中には有機半導体化合物以外のポリマー(バインダー樹脂、絶縁性樹脂等)を含有させないことが好ましい。
なお、本明細書において「有機半導体化合物中に、原子ATを300~700ppmの濃度となるように含有させる」、あるいは「有機半導体化合物中、原子ATの含有量が300~700ppmである」という場合、有機半導体化合物の量と、原子ATの量との合計に占める、原子ATの量の割合が300~700ppmであることを意味する。
Li供給源としては、例えば、金属リチウム、ハロゲン化リチウム、炭酸リチウム等を用いることができる。また、Na供給源としては、例えば、金属ナトリウム、ハロゲン化ナトリウム、炭酸ナトリウム等を用いることができる。また、P供給源としては、例えば、トリ(o-トリル)ホスフィン、トリフェニルホスフィン、リン酸カリウム、2-ジシクロヘキシルホスフィノ-2’、4’、6’-トリイソプロピルビフェニル(Xphos)等を用いることができる。また、K供給源としては、ハロゲン化カリウム、炭酸カリウム、硝酸カリウム等を用いることができる。また、Fe供給源としては、酸化鉄、水酸化鉄、硫酸鉄等を用いることができる。また、Pd供給源としては、トリス(ジベンジリデンアセトン)ジパラジウム、酢酸パラジウム、塩化パラジウム等を用いることができる。また、Sn供給源としては、塩化トリメチルスズ、塩化トリブチルスズ、酸化トリブチルスズ等を用いることができる。また、B供給源としては、ホウ酸トリメチル、ホウ酸トリイソプロピル、各種ボロン酸化合物等を用いることができる。また、Cl供給源としては、クロロベンゼン、クロロホルム、N-クロロスクシンイミド、塩化リチウム等の塩を用いることができる。また、Br供給源としては、臭素、N-ブロモスクシンイミド、臭化塩等を用いることができる。また、I供給源としては、ヨウ素、ヨードベンゼン、ヨウ化塩等を用いることができる。なお、上記記載は本発明の一態様を示す例示に過ぎず、本発明において原子ATの供給源は上記に限定されるものではない。
これらの中でも、炭化水素化合物、ハロゲン化炭化水素化合物、複素環化合物、ハロゲン化複素環化合物およびエーテル化合物から選ばれる1種又は2種以上が好ましい。
また、上記塗布液中の上記有機溶媒の含有量は50~99.8質量%が好ましく、70~99.7質量%がより好ましく、80~99.5質量%がより好ましく、90~99.5質量%がさらに好ましく、95~99.5質量%が特に好ましい。
上記塗布液中、有機溶媒と原子ATとを除いた残部に占める有機半導体化合物の割合は50質量%以上が好ましく、70質量%以上がより好ましく、80質量%以上がさらに好ましく、90質量%以上が特に好ましく、また95質量%以上であってもよく、97質量%以上であってもよい。
上記有機半導体層中には、有機半導体化合物ではないポリマー(バインダー樹脂、絶縁性樹脂等)が含まれないことが好ましい。
有機半導体層の層厚は、適用される有機TFT素子に応じて適宜に調整されるものであり、一義的に決定することができないが、例えば、10~500nmが好ましく、20~200nmがより好ましい。
本発明の有機半導体層には、有機TFT素子の有機半導体層の形成に用いることができる有機半導体化合物を特に制限なく用いることができる。上記有機半導体化合物は低分子化合物であっても高分子化合物であってもよい。
上記有機半導体化合物が低分子化合物である場合、縮合多環芳香族化合物を好適に用いることができる。かかる、縮合多環芳香族化合物として、例えば、特許第5480510号公報の段落[0055]~[0077]に記載された化合物を用いることができる。
また、本発明の効果をより高める観点から、上記有機半導体化合物として下記式(1)で表される構造単位を有するポリマーを用いることがより好ましい。
以下、単環構造の芳香族複素環を「単環式芳香族複素環」とも称す。また、縮合多環構造の芳香族複素環を「縮合多環芳香族複素環」とも称す。
置換基DS1として採り得るアルキル基は、直鎖でも分岐を有してもよく、環状であってもよい。このアルキル基の炭素数は1~30が好ましく、1~20がより好ましい。このアルキル基は、アルキル基の炭素鎖中に-O-、-S-及び-NRD3-から選ばれる基が組み込まれていてもよく、アルキル基の結合部位側の末端に-O-、-S-及び-NRD3-が組み込まれていてもよい。RD3は後述するR1Sと同義であり、好ましい形態も同じである。
置換基DS1として採り得るアルケニル基又はアルキニル基は、直鎖でも分岐を有してもよい。このアルケニル基及びアルキニル基の炭素数は2~30が好ましく、2~20がより好ましい。
置換基DS1として採り得る芳香族炭化水素基の炭素数は6~30が好ましい。
置換基DS1として採り得る芳香族複素環基は単環式芳香族複素環基であることが好ましく、5~7員環の単環式芳香族複素環基であることがより好ましい。この芳香族複素環基は環構成ヘテロ原子としてO、N、S及びSeから選ばれるヘテロ原子を有することが好ましい。
置換基DS1として採り得るハロゲン原子はF、Cl、Br又はIであり、FまたはClがより好ましく、Fが特に好ましい。
置換基DS1として採り得る式(1-1)で表される基は下記構造の基である。
本発明において、アルキレン基が炭素鎖中に-O-を含むとは、アルキレン基の炭素-炭素結合の途中に-O-が導入されている態様、アルキレン基の一端又は両端に-O-が導入されている態様、並びに、アルキレン基の炭素-炭素結合の途中及びアルキレン基の一端又は両端に-O-が導入されている態様を意味する。アルキレン基に-S-又は-NR1S-を含む場合も同様の意味である。また、アルキレン基が-O-、-S-及び-NR1S-を含む場合、これらの数の合計は少なくとも1つであり、その上限は、特に限定されないが、例えば、5個である。
Laとして採りうるアルキレン基は、直鎖、分岐鎖及び環状のいずれであってもよいが、直鎖又は分岐鎖のアルキレン基であることが好ましい。このアルキレン基の炭素数は、キャリア移動度の観点から、1~20であることが好ましく、1~15であることがより好ましく、1~10であることが更に好ましい。
Laとして採りうるアルキレン基が分岐鎖である場合には、分岐部分の炭素数については、Laを示すアルキレン基の炭素数に含むものとする。ただし、Laが-NR1S-を含み、かつ、このR1Sが炭素原子を含む場合には、R1Sの炭素数は、Laとして採りうるアルキレン基の炭素数に含めないものとする。
Arとして採りうる芳香族複素環基は、単環の基であっても、2環以上の縮環の基であってもよく、キャリア移動度の観点から単環であることが好ましい。単環の基である場合、その環員数は5~7員が好ましい。また、芳香族複素環基に含まれる環構成ヘテロ原子としては、窒素原子、酸素原子、硫黄原子又はセレン原子であることが好ましく、硫黄原子であることがより好ましい。
Arとして採りうる炭素数6~18の芳香族炭化水素基としては、特に限定されないが、例えば、ベンゼン環基、ナフタレン環基、又は、3環以上の環が縮合した芳香族炭化水素(例えばフルオレン環)から2以上の水素原子を取り除いた基が挙げられる。これらの中でも、キャリア移動度がより優れたものになるという観点から、ベンゼン環基、又は、ナフタレン環基であることが好ましく、ベンゼン環基であることが好ましい。
本発明において、アルキル基が炭素鎖中に-O-を含むとは、アルキル基の炭素-炭素結合の途中に-O-が導入されている態様、アルキル基の結合部位側の末端に-O-が導入されている態様、並びに、アルキル基の炭素-炭素結合の途中及びアルキル基の結合部位側の末端に-O-が導入されている態様を意味する。アルキル基に-S-又は-NR2S-を含む場合も同様の意味である。また、アルキル基が-O-、-S-及び-NR2S-を含む場合、これらの数は少なくとも1つであり、その上限は、特に限定されないが、例えば、5個である。
Lbとして採りうるアルキル基は、直鎖、分岐鎖及び環状のいずれであってもよいが、キャリア移動度の観点から、直鎖又は分岐鎖のアルキル基であることが好ましく、分岐鎖のアルキル基がより好ましい。また、このアルキル基は、置換基としてハロゲン原子(好ましくは、フッ素原子、塩素原子、臭素原子又はヨウ素原子、より好ましくはフッ素原子)を有するハロゲン化アルキル基であってもよい。
Lbとして採りうるアルキル基の炭素数は、1~100であり、9~100であることが好ましい。
また、式(1-1)で表される基がLbを複数個有する場合、キャリア移動度の観点から少なくとも1つのLbが、炭素数9~100の上記アルキル基であることが好ましく、20~100の上記アルキル基であることがより好ましく、20~40の上記アルキル基であることが更に好ましい。
Lbとして採りうるアルキル基が分岐鎖である場合には、分岐部分の炭素数については、Lbとして採りうるアルキル基の炭素数に含むものとする。ただし、Lbが-NR2S-を含み、かつ、このR2Sが炭素原子を含む場合には、R2Sの炭素数は、Lbとして採りうるアルキル基の炭素数に含めないものとする。
式(1-1)において、*は結合部位を示す。
Dが縮合多環芳香族炭化水素環を有する基である場合、D中の縮合多環芳香族炭化水素環の数は1~6が好ましく、1~4がより好ましく、1又は2がさらに好ましく、1が特に好ましい。
Dは、さらに好ましくは上記縮合多環芳香族炭化水素環からなる基(すなわち縮合多環芳香族炭化水素基)である。
上記芳香族炭化水素基はさらに置換基を有した形態でもよく、かかる置換基(以下、「置換基DS2」という。)として例えば、アルキル基、ハロゲン原子、及び上記式(1-1)で表される基が挙げられる。置換基DS2として採り得るアルキル基、ハロゲン原子、及び上記式(1-1)で表される基の好ましい形態は、それぞれ、上記置換基DS1として採り得るアルキル基、ハロゲン原子、及び上記式(1-1)で表される基の好ましい態様と同じである。
RD1は有機基を示す。RD1は好ましくはアルキル基(このアルキル基は炭素鎖中に-O-、-S-、及び-NRD3-(RD3は上記R1Sと同義であり、好ましい形態も同じである)のうち少なくとも1つを含んでいてもよい。このアルキル基の炭素数は1~30が好ましく、1~20がより好ましい。)、アルキニル基(炭素数2~30が好ましい。)、アルケニル基(炭素数2~30が好ましい。)、芳香族炭化水素基(炭素数6~30が好ましい。)、芳香族複素環基(5~7員環が好ましい。環構成ヘテロ原子としては、O、N、S又はSeが好ましい。)、ハロゲン原子(F、Cl、Br又はIであり、F又はClがより好ましく、Fが特に好ましい。)、又は、上記式(1-1)で表される基であり、アルキル基、ハロゲン原子、または上記式(1-1)で表される基であることがより好ましく、上記式(1-1)で表される基であることが更に好ましい。
なお、上記式(D-1)において、括弧内の構造単位及び上記Mは、結合軸において回転可能に結合している。
Mとして採り得る芳香族炭化水素基としては、炭素数6~20の芳香族炭化水素基が好ましい。かかる芳香族炭化水素基を構成する芳香族炭化水素環としては、ベンゼン環、ビフェニレン環、フルオレン環、ナフタレン環、その他の3環若しくは4環が縮合した芳香族炭化水素環がより好ましく、フルオレン環、ナフタレン環、アントラセン環、フェナントレン環、クリセン環、若しくはピレン環が更に好ましい。
Mとして採り得る芳香族複素環基又は芳香族炭化水素基は、置換基を有した形態でもよく、かかる置換基としては、アルキル基(このアルキル基は炭素鎖中に-O-、-S-及び-NRD3-(RD3は上記R1Sと同義であり、好ましい形態も同じである)のうち少なくとも1つを含んでいてもよい。)、ハロゲン原子(F、Cl、Br又はIであり、FまたはClがさらに好ましく、Fが特に好ましい。)、上記式(1-1)で表される基が挙げられる。
Mとして採り得るアルケニレン基としては、炭素数2~10のアルケニレン基が好ましく、炭素数2~4のアルケニレン基がより好ましく、エテニレン基がさらに好ましい。
Mとして採り得るアルキニレン基としては、炭素数2~10のアルキニレン基が好ましく、炭素数2~4のアルキニレン基がより好ましく、エチニレン基がさらに好ましい。
ただし、p+qが0の場合には、Mは、環構成原子としてN、O、S及びSeから選ばれるヘテロ原子を少なくとも1つ有する単環式又は多環式の芳香族複素環を有するか、又は、縮合多環芳香族炭化水素環を有することが好ましい。
式(A-1)~(A-9)中、XAは酸素原子、硫黄原子、セレン原子又はNRXを示し、硫黄原子又はNRXが好ましい。
RXは、アルキル基、又は、上記式(1-1)で表される基を示す。RXとして採りうる上記アルキル基は、後述するRA1として採りうるアルキル基と同義であり、好ましい範囲も同じである。
RA2は、水素原子、ハロゲン原子、アルキル基(このアルキル基は炭素鎖中に-O-、-S-、および、-NRA3-のうち少なくとも1つを含んでいてもよい。)、又は、単結合を示す。RA2が単結合であるとは、すなわちRA2が他の構造との結合部位となっていることを意味する。
RA2は、水素原子又は単結合が好ましい。
RA2がハロゲン原子である場合、フッ素原子、塩素原子、臭素原子又はヨウ素原子であり、フッ素原子が好ましい。RA2が上記アルキル基である場合、炭素数2~35のアルキル基が好ましく、炭素数8~25のアルキル基がより好ましい。また、上記アルキル基は直鎖でも分岐鎖でもよい。RA3は、水素原子又は置換基を示す。RA3として採りうる置換基としては、特に限定されず、上記R1S及びR2Sにおける置換基と同義であり、好ましい範囲も同じである。
具体的には、上記式(A-3)及び(A-7)においては、ZAを含む環構造において、1つのZAがCRA2であり、かつそのRA2が単結合となる。この単結合を有するCRA2(炭素原子)が各式において*で示す結合部位となる。また、式(A-8)においては、8個のうち2つのZAがCRA2であり、かつそれらのRA2が単結合となる。これらの単結合を有するCRA2(炭素原子)が式(A-8)において*で示す結合部位となる。
RA1は、アルキル基(このアルキル基は炭素鎖中に-O-、-S-、および、-NRA3-のうち少なくとも1つを含んでいてもよい。)、上記式(1-1)で表される基、又は、単結合を示す。RA1としては、アルキル基又は上記式(1-1)で表される基が好ましい。
RA1として採りうるアルキル基は直鎖でも分岐鎖でもよい。このアルキル基の炭素数は、2~35であることが好ましく、8~25であることがより好ましい。
WAにおけるRA2及びRA3は、それぞれ、ZAにおけるRA2及びRA3と同義であり、好ましいものも同じである。
態様1:WAがCRA2であり、かつそのRA2が単結合である。
態様2:WAがNRA1であり、かつそのRA1が単結合である。
態様3:WAがC(RA2)2であり、かつそのRA2のうち一方が単結合であり、他方が水素原子、ハロゲン原子又は上記アルキル基である。
上記各態様において、上記単結合を有するCRA2(炭素原子)、NRA1(窒素原子)又はC(RA2)2(炭素原子)が式(A-4)における結合部位(式中、*で示す)となる。
XA、YA及びZAは、それぞれ、上記式(A-1)~(A-9)において説明したXA、YA及びZAと同義である。
Xd、Zd、M、p及びqは、それぞれ、上記式(D-1)において説明したXd、Zd、M、p及びqと同義である。
Xd、M、p及びqは、それぞれ、上記式(D-1)において説明したXd、M、p及びqと同義である。
下記例示化合物中のm:nは、繰り返し単位のモル比を表す。
重合度nは、後述する重量平均分子量と、各繰り返し単位の質量とから概算できる。
上記式(1)で表される構造単位を有する有機半導体ポリマー中、上記式(1)で表される構造単位の含有量は、60質量%以上であることが好ましく、80質量%以上であることがより好ましく、90質量%以上であることが更に好ましい。上記式(1)で表される構造単位を有する有機半導体ポリマーは上記式(1)で表される構造単位からなるポリマーであることが好ましい。
本発明において、重量平均分子量及び数平均分子量は、ゲル浸透クロマトグラフィ法(GPC(Gel Permeation Chromatography))法にて測定され、標準ポリスチレンで換算して求められる。具体的には、例えば、GPCは、HLC-8121GPC(東ソー社製)を用い、カラムとして、TSKgel GMHHR-H(20) HT(東ソー社製、7.8mmID×30cm)を2本用い、溶離液として1,2,4-トリクロロベンゼンを用いる。また、条件としては、試料濃度を0.02質量%、流速を1.0mL/min、サンプル注入量を300μL、測定温度を160℃とし、IR(infrared)検出器を用いて行う。また、検量線は、東ソー社製の「標準試料TSK standard,polystyrene」:「F-128」、「F-80」、「F-40」、「F-20」、「F-10」、「F-4」、「F-2」、「F-1」、「A-5000」、「A-2500」、「A-1000」、「A-500」の12サンプルを用いて、作製する。
本発明の有機TFT素子は、耐久性の観点から、最外層に封止層を備えるのが好ましい。封止層には、有機TFT素子に通常用いられる封止剤(封止層形成用組成物)を用いることができる。
封止層の膜厚は、特に限定されないが、0.2~10μmであることが好ましい。
図2は、本発明の半導体素子の一例であるボトムゲート-トップコンタクト型の有機TFT素子200を表す断面模式図である。
有機TFT素子200は、図2に示されるように、基板10と、ゲート電極20と、ゲート絶縁層(膜)30と、有機半導体層(膜)50と、ソース電極40及びドレイン電極42と、封止層60とを、この順で、有する。
有機TFT素子200は、層構成(積層態様)が異なること以外は、有機TFT素子100と同じである。したがって、基板、ゲート電極、ゲート絶縁層、ソース電極、ドレイン電極、有機半導体層及び封止層については、上述の、ボトムゲート-ボトムコンタクト型有機TFT素子におけるものと同じであるので、その説明を省略する。
有機半導体化合物(ポリマー又は低分子化合物)中の原子ATの含有量は下記方法により決定した。
テフロン(登録商標)容器中に有機半導体化合物と硝酸を加え、マイクロウェーブオーブンで加熱することにより灰化し、その後硝酸に溶解し、この溶解液をサンプルとして、ICP-MS HP7700(アジレント社製)を用いて原子ATを定量した。
下記の有機半導体化合物(下記構成単位からなるポリマー1~13及び低分子化合物14及び15)を合成した。
下記スキームに従い、ポリマー1を合成した。下記スキーム中、DMFはN,N-ジメチルホルムアミド、NBSはN-ブロモスクシンイミド、dbaはジベンジリデンアセトンを示す。
3、6-ジ(2-チエニル)-2、5-ジヒドロピロロ[3、4-c]ピロール-1、4-ジオン(4.0g、13.3mmol)、炭酸カリウム(5.5g、39.9mmol)、脱水N、N-ジメチルホルムアミド(200mL)を混合し、窒素雰囲気下、120℃で1時間撹拌した。反応液中に2-エチルヘキシルブロミド(7.7g、39.9mmol)を加え、さらに4時間撹拌した。反応液を室温まで冷却した後、セライトとシリカゲルで不溶物をろ別し、ろ液を減圧濃縮した。粗生成物をシリカゲルクロマトグラフィーで精製し、中間体1(5.6g、10.7mmol)を得た。
中間体1(5.6g、10.7mmol)、クロロホルム(200mL)を混合し、窒素雰囲気下、0℃に冷却した。反応液にN-ブロモスクシンイミド(4.2g、23.5mmol)を少量ずつ添加し、12時間加熱還流した。反応液を室温まで冷却し、飽和亜硫酸水素ナトリウム水溶液を加え、反応をクエンチさせた。クロロホルムで抽出し、減圧濃縮した後、粗生成物をシリカゲルクロマトグラフィー精製し、中間体2(6.2g、9.1mmol)を得た。
中間体2(200mg、293μmol)、3,3’-ジドデシル-5,5’-ビス(トリメチルスタンニル)-2,2’-ビチオフェン(242mg、293μmol)、トリ(o-トリル)ホスフィン(7.1mg、23μmol)、トリス(ジベンジリデンアセトン)ジパラジウム(5.4mg、6μmol)、脱水クロロベンゼン(30mL)を混合し、窒素雰囲気下、130℃で24時間撹拌した。反応液を室温まで冷却した後、メタノール(240mL)/濃塩酸(10mL)混合液に注ぎ、2時間撹拌した。析出物をろ過、メタノール洗浄した後、メタノール、アセトン、酢酸エチルで順次ソックスレー抽出し、可溶性の不純物を取り除いた。続いて、クロロホルムでソックスレー抽出し、得られた溶液を減圧濃縮した後、メタノールを添加し、析出した固形分をろ過、メタノール洗浄し80℃で12時間真空乾燥することでポリマー1を253mg得た(収率82%)。
ポリスチレン換算の数平均分子量は2.4×104であり、重量平均分子量は6.8×104であった。ポリマー1中の原子AT含有量は1090ppmであった。
このポリマーを特開2014-189721号公報の段落[0238]に記載の方法に準じて精製した。この精製後の有機半導体ポリマー1中、原子ATの含有量は10ppmであった。
上記合成例1において使用するモノマーを変更し、上記合成例1に準じて、有機半導体ポリマー2~13を合成および精製した。得られた有機半導体ポリマー2~13は、ポリマー6を除きいずれも原子ATの含有量が10~50ppmの範囲内にあった。
低分子の有機半導体化合物14は2,7-Dioctyl[1]benzothieno[3,2-b][1]benzothiophene(Aldrich社製、製品番号747092)を購入し、さらに分取GPCで精製したものを用いた。上記精製後の有機半導体化合物14中、原子ATの含有量は20ppmであった。
低分子の有機半導体化合物15は6,13-Bis(triisopropylsilylethynyl)pentacene(Aldrich社製、製品番号716006)を購入し、これを昇華精製したものを用いた。上記精製後の有機半導体化合物15は、原子ATの含有量が20ppmであった。
上記各合成例で得られた有機半導体化合物について、クロロベンゼン中への溶解度(60℃で12時間加熱した後、室温(20℃)まで冷却した場合における溶解度、単位:mg/100g、以下同様。)を測定した(この溶解度を「溶解度X」という)。
また、クロロベンゼン中において、上記各合成例で得られた有機半導体化合物の含有量と、原子ATの含有量との合計に占める、原子ATの含有量の割合が下記表1の各有機半導体形成用組成物1~21に示す割合(ppm)となるように、クロロベンゼン中に有機半導体化合物と原子ATを加え、原子ATをかかる割合で共存させた場合における、有機半導体化合物のクロロベンゼン中への溶解度を測定した(この溶解度を「溶解度Y」という)。
溶解度向上率(%)を下記式により算出し、下記評価基準に基づき評価した。
溶解度向上率(%)=100×(溶解度Y/溶解度X)
<溶解度向上率評価基準>
A:溶解度向上率が120%以上
B;溶解度向上率が110%以上120%未満
C:溶解度向上率が101%以上110%未満
D:溶解度向上率が100%以下
結果を下記表1の有機半導体膜形成用組成物1~21のカラムに示す。
Na供給源:炭酸ナトリウム
P供給源:トリフェニルホスフィン
Fe供給源:酸化鉄
Pd供給源:トリス(ジベンジリデンアセトン)ジパラジウム
Sn供給源:塩化トリブチルスズ
B供給源:ホウ酸トリイソプロピル
Br供給源:臭素
I供給源:ヨウ素
図1に示す構造のボトムゲート-ボトムコンタクト型の有機薄膜トランジスタを作製した。
ガラス基板(イーグルXG:コーニング社製)上に、ゲート電極となるAlを蒸着した(厚み:50nm)。その上にゲート絶縁膜形成用組成物(ポリビニルフェノール/メラミン=1質量部/1質量部(w/w)のPGMEA(プロピレングリコールモノメチルエーテルアセテート)溶液(固形分濃度:2質量%))をスピンコートし、150℃で60分間ベークして膜厚400nmのゲート絶縁膜を形成した。その上に銀インク(銀ナノコロイドH-1、三菱マテリアル(株)製)をインクジェット装置DMP-2831(富士フイルムダイマティクス社製)を用いてソース電極及びドレイン電極状(チャネル長40μm、チャネル幅100μm)に描画した。その後オーブンにて180℃、30分ベークを行い、焼結して、ソース電極及びドレイン電極を形成することでTFT特性評価用素子基板を得た。
窒素グローブボックス中で、TFT特性評価用素子基板の上に、上記の加熱後に室温(20℃以上)まで冷却した下記表1に示す有機半導体膜形成用組成物1~21をスピンコート(200rpm、30秒間)した。その後、ホットプレート上で150℃、1時間乾燥することで有機半導体層を形成し、下記表1に示す実施例1~15及び比較例1~6のボトムゲート-ボトムコンタクト型の有機TFT素子を、それぞれ10個ずつ得た。下記表1中、実施例1、比較例1、実施例2、比較例2、比較例3、実施例3、実施例4、比較例4、実施例5、比較例5、実施例6、比較例6、実施例7~15の有機TFT素子は、それぞれ順に、有機半導体膜形成用組成物1~21を用いて作製した有機TFT素子に対応する。
作製した各有機TFT素子について、半導体特性評価装置B2900A(アジレントテクノロジーズ社製)を用い、大気下でキャリア移動度を測定した。
<キャリア移動度>
各有機TFT素子のソース電極-ドレイン電極間に-80Vの電圧を印加し、ゲート電圧を+80V~-80Vの範囲で変化させ、ドレイン電流Idを表わす下記式を用いてキャリア移動度μを算出した。
Id=(w/2L)μCi(Vg-Vth)2
式中、Lはゲート長、wはゲート幅、Ciは絶縁層の単位面積当たりの容量、Vgはゲート電圧、Vthは閾値電圧を表す。
上記製造例で作製した各実施例及び各比較例における各10素子のキャリア移動度に基づき、下記式により変異係数(変動係数)を算出し、この変異係数をキャリア移動度のばらつきの指標とした。この値が小さいほど素子間の移動度ばらつきが小さく、製造安定性に優れる。
変異係数(%)=100×[10個の素子のキャリア移動度の標準偏差]/[10個の素子のキャリア移動度の平均値]
キャリア移動度のばらつきの評価基準を以下に示す。実用上、A又はBであることが好ましく、Aであることがより好ましい。
-キャリア移動度のばらつき評価基準-
A:変異係数が15%未満
B:変異係数が15%以上30%未満
C:変異係数が30%以上50%未満
D:変異係数が50%以上
また、有機半導体層中の原子ATの含有量を本発明で規定するよりも高めた場合には、この半導体層の形成に用いる有機半導体膜形成用組成物において、有機半導体化合物の溶媒に対する溶解性は向上する。しかし、得られる有機TFT素子のキャリア移動度のばらつきは大きかった(比較例3)。これは、有機半導体層中に過剰に存在する原子ATにより過大なリーク電流等を生じたことが一因と考えられる。
また、用いる有機半導体化合物が式(5)で表される構造単位を有するポリマーである場合に、キャリア移動度のばらつきがより効果的に抑えられ、製造安定性により優れることもわかった。
20 ゲート電極
30 ゲート絶縁層(膜)
40 ソース電極
42 ドレイン電極
50 有機半導体層(膜)
60 封止層
100、200 有機薄膜トランジスタ素子
Claims (11)
- 有機半導体化合物を含有してなる有機半導体層を有する有機薄膜トランジスタ素子であって、前記有機半導体層中、Li、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる1種又は2種以上の原子の含有量が300~700ppmである、有機薄膜トランジスタ素子。
- 前記有機半導体化合物が下記式(1)で表される構造単位を有する有機半導体ポリマーである、請求項1に記載の有機薄膜トランジスタ素子。
XAは酸素原子、硫黄原子、セレン原子又はNRXを示す。RXはアルキル基又は下記式(1-1)で表される基を示す。
YAは酸素原子又は硫黄原子を示す。
ZAはCRA2又は窒素原子を示す。
WAはC(RA2)2、NRA1、窒素原子、CRA2、酸素原子、硫黄原子又はセレン原子を示す。RA1は、アルキル基、下記式(1-1)で表される基又は単結合を示す。RA2は水素原子、ハロゲン原子、アルキル基又は単結合を示す。
*は上記式(1)のA中に組み込まれるための結合部位を示す。
式(1-1)中、
Laは炭素数1~20のアルキレン基を示す。
Arは芳香族複素環基又は炭素数6~18の芳香族炭化水素基を示す。
Lbは炭素数1~100のアルキル基を示す。
lは1~5の整数である。
*は結合部位を示す。 - 前記有機半導体層中、Na、P、Fe、Pd、Sn、B、Br及びIからなる群から選ばれる1種又は2種以上の原子の含有量が300~700ppmである、請求項1~5のいずれか1項に記載の有機薄膜トランジスタ素子。
- 有機半導体化合物と、Li、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる1種又は2種以上の原子とを含有し、
前記有機半導体化合物の含有量と、前記のLi、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる1種又は2種以上の原子の含有量との合計に占める、前記のLi、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる1種又は2種以上の原子の含有量の割合が300~700ppmである、有機半導体膜形成用組成物。 - 前記有機半導体化合物が下記式(1)で表される構造単位を有する有機半導体ポリマーである、請求項7に記載の有機半導体膜形成用組成物。
XAは酸素原子、硫黄原子、セレン原子又はNRXを示す。RXはアルキル基又は下記式(1-1)で表される基を示す。
YAは酸素原子又は硫黄原子を示す。
ZAはCRA2又は窒素原子を示す。
WAはC(RA2)2、NRA1、窒素原子、CRA2、酸素原子、硫黄原子又はセレン原子を示す。RA1は、アルキル基、下記式(1-1)で表される基又は単結合を示す。RA2は水素原子、ハロゲン原子、アルキル基又は単結合を示す。
*は上記式(1)のA中に組み込まれるための結合部位を示す。
式(1-1)中、
Laは炭素数1~20のアルキレン基を示す。
Arは芳香族複素環基又は炭素数6~18の芳香族炭化水素基を示す。
Lbは炭素数1~100のアルキル基を示す。
lは1~5の整数である。
*は結合部位を示す。 - 溶媒を含有する、請求項7又は8に記載の有機半導体膜形成用組成物。
- 請求項7~9のいずれか1項に記載の有機半導体膜形成用組成物を用いて成膜することを含む、有機半導体膜の製造方法。
- 有機半導体化合物と、Li、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる少なくとも1種の原子とを含有し、膜中の、Li、Na、P、K、Fe、Pd、Sn、B、Cl、Br及びIからなる群から選ばれる少なくとも1種の原子の含有量が300~700ppmである、有機半導体膜。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17779044.1A EP3442043A4 (en) | 2016-04-07 | 2017-03-30 | ORGANIC THIN FILM TRANSISTOR ELEMENT, COMPOSITION FOR ORGANIC SEMICONDUCTOR FILM FORMATION, PROCESS FOR PRODUCING ORGANIC SEMICONDUCTOR FILM, AND ORGANIC SEMICONDUCTOR FILM |
JP2018510570A JP6666996B2 (ja) | 2016-04-07 | 2017-03-30 | 有機薄膜トランジスタ素子、有機半導体膜形成用組成物、有機半導体膜の製造方法及び有機半導体膜 |
US16/152,191 US20190036029A1 (en) | 2016-04-07 | 2018-10-04 | Organic thin film transistor element, organic semiconductor film-forming composition, method of forming organic semiconductor film, and organic semiconductor film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016077035 | 2016-04-07 | ||
JP2016-077035 | 2016-04-07 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/152,191 Continuation US20190036029A1 (en) | 2016-04-07 | 2018-10-04 | Organic thin film transistor element, organic semiconductor film-forming composition, method of forming organic semiconductor film, and organic semiconductor film |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017175665A1 true WO2017175665A1 (ja) | 2017-10-12 |
Family
ID=60001248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/013390 WO2017175665A1 (ja) | 2016-04-07 | 2017-03-30 | 有機薄膜トランジスタ素子、有機半導体膜形成用組成物、有機半導体膜の製造方法及び有機半導体膜 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20190036029A1 (ja) |
EP (1) | EP3442043A4 (ja) |
JP (1) | JP6666996B2 (ja) |
WO (1) | WO2017175665A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019146368A1 (ja) * | 2018-01-23 | 2019-08-01 | 富士フイルム株式会社 | 有機半導体素子、有機半導体組成物、有機半導体膜、有機半導体膜の製造方法、及び、これらに用いるポリマー |
JPWO2021070646A1 (ja) * | 2019-10-10 | 2021-04-15 | ||
JP7527585B2 (ja) | 2020-07-31 | 2024-08-05 | 国立大学法人 東京大学 | 共役高分子の製造方法、共役高分子、該共役高分子を含有する有機半導体デバイス用膜形成用インク、および有機半導体デバイス |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102372207B1 (ko) * | 2017-07-27 | 2022-03-07 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법 |
CN110183452B (zh) * | 2019-05-16 | 2021-06-01 | 中山大学 | 一种全氟丁基取代化合物及其制备方法和应用 |
EP4080524A4 (en) * | 2019-12-27 | 2024-01-17 | Murata Manufacturing Co., Ltd. | FILM CAPACITOR AND FILM FOR FILM CAPACITORS |
CN115109234B (zh) * | 2022-05-24 | 2024-03-22 | 武汉工程大学 | 一种联噻吩与噻吩基异靛青交替共轭聚合物、其制备方法和应用 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007287961A (ja) * | 2006-04-18 | 2007-11-01 | Konica Minolta Holdings Inc | 有機薄膜トランジスタ及びその製造方法 |
JP2012506928A (ja) * | 2008-10-31 | 2012-03-22 | ビーエーエスエフ ソシエタス・ヨーロピア | 有機電界効果トランジスタに使用するためのジケトピロロピロールポリマー |
JP2012167242A (ja) * | 2011-01-28 | 2012-09-06 | Mitsubishi Chemicals Corp | 新規コポリマー、有機半導体材料、及びこれを用いた有機電子デバイス、光電変換素子並びに太陽電池モジュール |
JP2012224618A (ja) * | 2011-04-08 | 2012-11-15 | Fujifilm Corp | 有機材料の精製方法、有機エレクトロニクス用材料、光電変換素子、光センサ、撮像素子、及び有機電界発光素子 |
JP2012229394A (ja) * | 2010-10-13 | 2012-11-22 | Sumitomo Chemical Co Ltd | 高分子化合物及びそれを用いた有機光電変換素子 |
WO2015076171A1 (ja) * | 2013-11-21 | 2015-05-28 | 株式会社ダイセル | 有機トランジスタ製造用溶剤 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120222743A1 (en) * | 2009-10-30 | 2012-09-06 | Takehito Kato | Organic photovoltaic cell and manufacturing method of the same |
EP2669966A4 (en) * | 2011-01-28 | 2014-11-12 | Mitsubishi Chem Corp | PHOTOELECTRIC CONVERSION ELEMENT, SOLAR CELL AND SOLAR CELL MODULE |
US9399698B2 (en) * | 2014-01-31 | 2016-07-26 | Xerox Corporation | Processes for purifying diketopyrrolopyrrole copolymers |
JP6302995B2 (ja) * | 2014-03-03 | 2018-03-28 | 富士フイルム株式会社 | 有機トランジスタ |
-
2017
- 2017-03-30 WO PCT/JP2017/013390 patent/WO2017175665A1/ja active Application Filing
- 2017-03-30 EP EP17779044.1A patent/EP3442043A4/en not_active Withdrawn
- 2017-03-30 JP JP2018510570A patent/JP6666996B2/ja active Active
-
2018
- 2018-10-04 US US16/152,191 patent/US20190036029A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007287961A (ja) * | 2006-04-18 | 2007-11-01 | Konica Minolta Holdings Inc | 有機薄膜トランジスタ及びその製造方法 |
JP2012506928A (ja) * | 2008-10-31 | 2012-03-22 | ビーエーエスエフ ソシエタス・ヨーロピア | 有機電界効果トランジスタに使用するためのジケトピロロピロールポリマー |
JP2012229394A (ja) * | 2010-10-13 | 2012-11-22 | Sumitomo Chemical Co Ltd | 高分子化合物及びそれを用いた有機光電変換素子 |
JP2012167242A (ja) * | 2011-01-28 | 2012-09-06 | Mitsubishi Chemicals Corp | 新規コポリマー、有機半導体材料、及びこれを用いた有機電子デバイス、光電変換素子並びに太陽電池モジュール |
JP2012224618A (ja) * | 2011-04-08 | 2012-11-15 | Fujifilm Corp | 有機材料の精製方法、有機エレクトロニクス用材料、光電変換素子、光センサ、撮像素子、及び有機電界発光素子 |
WO2015076171A1 (ja) * | 2013-11-21 | 2015-05-28 | 株式会社ダイセル | 有機トランジスタ製造用溶剤 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019146368A1 (ja) * | 2018-01-23 | 2019-08-01 | 富士フイルム株式会社 | 有機半導体素子、有機半導体組成物、有機半導体膜、有機半導体膜の製造方法、及び、これらに用いるポリマー |
JPWO2019146368A1 (ja) * | 2018-01-23 | 2020-11-26 | 富士フイルム株式会社 | 有機半導体素子、有機半導体組成物、有機半導体膜、有機半導体膜の製造方法、及び、これらに用いるポリマー |
EP3745484A4 (en) * | 2018-01-23 | 2021-03-10 | FUJIFILM Corporation | ORGANIC SEMICONDUCTOR ELEMENT, ORGANIC SEMICONDUCTOR COMPOSITION, ORGANIC SEMICONDUCTOR FILM, METHOD FOR PRODUCING AN ORGANIC SEMICONDUCTOR FILM, AND POLYMER USED THEREFORE |
US11011706B2 (en) | 2018-01-23 | 2021-05-18 | Fujifilm Corporation | Organic semiconductor element, organic semiconductor composition, organic semiconductor film, method of manufacturing organic semiconductor film, and polymer using the same |
JPWO2021070646A1 (ja) * | 2019-10-10 | 2021-04-15 | ||
WO2021070646A1 (ja) * | 2019-10-10 | 2021-04-15 | 富士フイルム株式会社 | 有機薄膜トランジスタ、ポリマー、組成物、有機半導体膜、化合物 |
JP7266697B2 (ja) | 2019-10-10 | 2023-04-28 | 富士フイルム株式会社 | 有機薄膜トランジスタ、ポリマー、組成物、有機半導体膜、化合物 |
JP7527585B2 (ja) | 2020-07-31 | 2024-08-05 | 国立大学法人 東京大学 | 共役高分子の製造方法、共役高分子、該共役高分子を含有する有機半導体デバイス用膜形成用インク、および有機半導体デバイス |
Also Published As
Publication number | Publication date |
---|---|
EP3442043A1 (en) | 2019-02-13 |
JPWO2017175665A1 (ja) | 2019-02-21 |
EP3442043A4 (en) | 2019-04-03 |
US20190036029A1 (en) | 2019-01-31 |
JP6666996B2 (ja) | 2020-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6666996B2 (ja) | 有機薄膜トランジスタ素子、有機半導体膜形成用組成物、有機半導体膜の製造方法及び有機半導体膜 | |
TWI688586B (zh) | 有機半導體元件及其製造方法、化合物、有機半導體組合物和有機半導體膜及其製造方法 | |
JP6689393B2 (ja) | 有機半導体膜形成用組成物、有機半導体膜及びその製造方法、並びに、有機半導体素子 | |
JP6706316B2 (ja) | 有機半導体素子、重合体、有機半導体組成物及び有機半導体膜 | |
JP6651606B2 (ja) | 有機半導体組成物、有機薄膜トランジスタの製造方法、及び有機薄膜トランジスタ | |
JP6463475B2 (ja) | 有機半導体素子、化合物、有機半導体組成物、および、有機半導体膜の製造方法 | |
JP6754126B2 (ja) | 有機半導体素子、有機半導体組成物、有機半導体膜の製造方法、有機半導体膜、並びに、これらに用いる化合物及びポリマー | |
JP6751364B2 (ja) | 有機半導体素子、有機半導体組成物、有機半導体膜の製造方法、有機半導体膜、及びこれらに用いるポリマー | |
JP6709275B2 (ja) | 有機半導体膜、有機半導体素子、重合体及び有機半導体組成物 | |
JP6442057B2 (ja) | 有機半導体素子、化合物、有機半導体組成物、並びに、有機半導体膜及びその製造方法 | |
WO2018181056A1 (ja) | 有機半導体素子、有機半導体組成物、有機半導体膜の製造方法、有機半導体膜、並びに、これらに用いる化合物及びポリマー | |
JP6573983B2 (ja) | 有機半導体膜形成用組成物、化合物、有機半導体膜、有機半導体素子 | |
JP6574052B2 (ja) | 有機半導体素子、重合体、有機半導体組成物及び有機半導体膜 | |
TW201841924A (zh) | 有機半導體元件、有機半導體組成物、有機半導體膜的製造方法、有機半導體膜、以及用於其的化合物及聚合物 | |
WO2016076197A1 (ja) | 有機半導体素子及び化合物 | |
JP2017157637A (ja) | 有機半導体素子、並びに、これに用いる有機半導体膜、化合物及び有機半導体組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2018510570 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2017779044 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2017779044 Country of ref document: EP Effective date: 20181107 |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17779044 Country of ref document: EP Kind code of ref document: A1 |