WO2017148073A1 - 成像模组及电子装置 - Google Patents

成像模组及电子装置 Download PDF

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Publication number
WO2017148073A1
WO2017148073A1 PCT/CN2016/090054 CN2016090054W WO2017148073A1 WO 2017148073 A1 WO2017148073 A1 WO 2017148073A1 CN 2016090054 W CN2016090054 W CN 2016090054W WO 2017148073 A1 WO2017148073 A1 WO 2017148073A1
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WO
WIPO (PCT)
Prior art keywords
module
mounting portion
imaging module
circuit board
camera modules
Prior art date
Application number
PCT/CN2016/090054
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English (en)
French (fr)
Inventor
申成哲
王昕�
Original Assignee
深圳欧菲光科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201610120470.0A external-priority patent/CN107155022A/zh
Priority claimed from CN201620162848.9U external-priority patent/CN205545554U/zh
Priority claimed from CN201620163025.8U external-priority patent/CN205545564U/zh
Priority claimed from CN201610120809.7A external-priority patent/CN107155036A/zh
Priority claimed from CN201610120829.4A external-priority patent/CN107155038A/zh
Priority claimed from CN201610120830.7A external-priority patent/CN107155039A/zh
Priority claimed from CN201620162774.9U external-priority patent/CN205545553U/zh
Priority claimed from CN201610120394.3A external-priority patent/CN107155020A/zh
Priority claimed from CN201620163056.3U external-priority patent/CN205545568U/zh
Priority claimed from CN201610120806.3A external-priority patent/CN107155035A/zh
Priority claimed from CN201620163270.9U external-priority patent/CN205545579U/zh
Priority claimed from CN201620162986.7U external-priority patent/CN205545561U/zh
Priority claimed from CN201620163042.1U external-priority patent/CN205545566U/zh
Priority claimed from CN201610120908.5A external-priority patent/CN107155045A/zh
Priority claimed from CN201620163074.1U external-priority patent/CN205545572U/zh
Priority claimed from CN201610120826.0A external-priority patent/CN107155037A/zh
Priority claimed from CN201610120393.9A external-priority patent/CN107155019A/zh
Priority claimed from CN201620163068.6U external-priority patent/CN205545570U/zh
Application filed by 深圳欧菲光科技股份有限公司 filed Critical 深圳欧菲光科技股份有限公司
Publication of WO2017148073A1 publication Critical patent/WO2017148073A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to the field of camera technologies, and in particular, to an imaging module and an electronic device.
  • the dual camera module can be applied to electronic devices such as mobile phones and tablet computers. Therefore, how to reduce the cost of the dual camera module has become an urgent problem to be solved.
  • the present invention is directed to solving one of the technical problems existing in the prior art. To this end, the present invention provides an imaging module and an electronic device.
  • the imaging module of the embodiment of the invention comprises a flexible circuit board and at least two camera modules.
  • the flexible circuit board includes a module mounting portion and a connector mounting portion that connects the module mounting portion. At least two camera modules are arranged at intervals on the module mounting portion, and at least two camera modules have the same focal length.
  • the structure of at least two camera modules can be made simpler, which is advantageous for reducing the cost of the imaging module. At the same time, this can make the image processing algorithm of the imaging module simpler and further reduce the cost of the imaging module.
  • the number of camera modules is two.
  • the flexible circuit board includes a connection portion that connects the module mounting portion and the connector mounting portion.
  • each of the camera modules includes a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board, the printed circuit board being disposed in the Module mounting And electrically connected to the module mounting portion.
  • the imaging module includes an electrical connection pad disposed between the printed circuit board and the module mounting portion, and electrically connected to the printed circuit board. And the module mounting portion.
  • the camera module includes a lens module disposed on the printed circuit board and positioned above the image sensor.
  • the lens module includes a lens and a voice coil motor
  • the voice coil motor includes a housing, and the lens is disposed in the housing, and the two housings of the two camera modules are spaced apart.
  • the imaging module includes a connector assembly including a substrate and a connector disposed on the substrate, the substrate being disposed on the connector mounting portion and The connector mounting portion is electrically connected.
  • the imaging module includes a gel that bonds the two camera modules.
  • the camera module includes a connection side opposite to another camera module, and the two camera modules are fixedly connected by soldering the connection side.
  • the imaging module includes a frame, and the two camera modules are disposed in the frame and are fixedly coupled to the frame.
  • An electronic device includes the above-described imaging module.
  • the image processing algorithm of the electronic device can be made simpler, and the cost of the electronic device can be reduced.
  • FIG. 1 is a schematic structural view of an imaging module according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the imaging module of FIG. 2 taken along the line III-III.
  • FIG. 4 is an enlarged schematic view of an IV portion of the imaging module of FIG. 3.
  • FIG. 5 is an exploded perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 6 is another exploded schematic view of an imaging module according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural view of a flexible circuit board of an imaging module according to an embodiment of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • FIG. 1 is a schematic structural view of an imaging module according to an embodiment of the present invention. Figure 1 does not show the frame of the imaging module.
  • an imaging module 100 includes a flexible circuit board 10 and at least two camera modules 20 .
  • the flexible circuit board 10 includes a module mounting portion 11 and a connector mounting portion 12. At least two camera modules 20 are spaced apart from each other on the module mounting portion 11, and at least two camera modules 20 have the same focal length.
  • the structure of the at least two camera modules 20 can be made simpler, which is advantageous for reducing the cost of the imaging module 100. At the same time, this can also make the image processing algorithm of the imaging module 100 simpler, and can further reduce the cost of the imaging module 100.
  • the number of the camera modules 20 is two. In other embodiments, the number of the camera modules may be three or more, and three or more camera modules are disposed on the flexible circuit board at intervals.
  • the focal length of each of the two camera modules 20 can be a fixed focal length, and the structure of each camera module 20 can be the same as that of the other camera module 20, thereby achieving two The focal lengths of the camera modules 20 are all the same.
  • the focal length of one of the two camera modules 20 may be a fixed focal length, and the focal length of the other camera module 20 is a zoom distance, which can be adjusted by the zoom module.
  • the focal length is the same as the focal length of the camera module 20 with a fixed focal length.
  • the two camera modules 20 can simultaneously zoom the camera module 20, so that the focal lengths of the two camera modules 20 can be conveniently adjusted to be the same.
  • the two camera modules 20 are respectively fixed to the module mounting portion 11, and then one of the camera modules 20 can be clamped by a robot, and then the other is adjusted by the robot.
  • the position of the camera module 20 is such that the optical axes of the two camera modules 20 are parallel, and the two camera modules 20 face the same side.
  • the flexible circuit board 10 includes a connection portion 13 that connects the module mounting portion 11 and the connector mounting portion 12 .
  • the connecting portion 13 can realize communication between the module mounting portion 11 and the connector mounting portion 12, so that the camera module disposed on the module mounting portion 11 transmits the collected image information to the electronic device.
  • each camera module 20 includes a printed circuit board 21 (PCB) and an image sensor 22 .
  • the printed circuit board 21 is disposed on the module mounting portion 11 and is electrically connected to the module mounting portion 11.
  • the image sensor 22 is disposed on the printed circuit board 21 and electrically connected to the printed circuit board 21.
  • the image sensor 22 can acquire an image of the object and transmit the image to the external device through the printed circuit board 21 and the flexible circuit board 10. It should be noted that the sensing faces of the two image sensors 22 are parallel or coplanar and face the same side.
  • the image sensor 22 may be, for example, a Complementary Metal Oxide Semiconductor (CMOS) image sensor or a Charge-coupled Device (CCD) image sensor.
  • CMOS Complementary Metal Oxide Semiconductor
  • CCD Charge-coupled Device
  • the imaging module 100 includes an electrical connection pad 211, and the electrical connection pad 211 is disposed on the printed circuit.
  • the printed circuit board 21 and the module mounting portion 11 are electrically connected between the circuit board 21 and the module mounting portion 11.
  • the electrical connection pad 211 can electrically connect and communicate between the flexible circuit board 10 and the camera module 20 .
  • the electrical connection pads 211 are all made of a conductive paste.
  • the shape and size of the printed circuit board 21 are slightly smaller than the shape and size of the corresponding module mounting portion 11.
  • the volume of the electronic device can be further reduced.
  • each printed circuit board 21 and the corresponding module mounting portion 11 have a flat shape.
  • the shape of each printed circuit board and the corresponding module mounting portion may be specifically set according to actual needs.
  • the camera module 20 includes a lens module 23 disposed on the printed circuit board 21 and located above the image sensor 22 .
  • the lens module 23 can obtain an image of better quality by the image sensor 22, thereby improving the shooting quality of the imaging module 100.
  • the lens module 23 includes a lens 231 and a voice coil motor 232.
  • the voice coil motor 232 includes a housing 2321.
  • the lens 231 is disposed in the housing 2321.
  • the two housings 2321 of the two camera modules 20 are spaced apart from each other. .
  • the voice coil motor 232 can drive the lens 231 to move along the optical axis of the lens 231 to adjust the distance between the lens 231 and the image sensor 22, thereby achieving autofocus of the imaging module 100, so that the imaging module 100 can obtain a better quality image.
  • the voice coil motor 232 can realize the movement of the driving lens 231, the focal lengths of the two camera modules 20 can be the same.
  • a filter 24 is disposed between the lens 231 and the image sensor 22.
  • the filter 24 can filter the light of a predetermined frequency such that the image sensor 22 forms a better image based on the filtered light.
  • the filter 24 is an infrared cut filter.
  • the infrared cut filter 24 can filter infrared rays to avoid image distortion of the image sensor 22.
  • the lens module 23 further includes a base 233.
  • the base 233 defines a recess 2331.
  • the bottom surface of the recess 2331 defines a through hole 2332.
  • the filter 24 is disposed in the recess 2331 and supported on the bottom surface of the recess 2331, and the light filtered by the filter 24 can pass through the through hole 2332 to reach the image sensor 22.
  • the light passes through the lens 231 and the filter 24 in turn and reaches the image sensor 22, so that the image sensor 22 can collect the external image.
  • the base 233 is provided with a connecting groove 2333, and the connecting groove 2333 communicates with the groove 2331.
  • the imaging module 100 includes a connector assembly 30 including a substrate 31 and a connector 32 disposed on the substrate 31.
  • the substrate 31 is disposed on the connector mounting portion 12 and electrically connected to the connector mounting portion 12.
  • the connector 32 can quickly mount the imaging module 100 to the electronic device.
  • the substrate 31 corresponds to the shape and size of the connector mounting portion 12. This makes the structure of the connector 32 and the flexible circuit board 10 more compact.
  • the imaging module 100 includes a colloid 40, and the colloid 40 bonds the two camera modules 20.
  • the colloid 40 is inserted between the two camera modules.
  • the colloid 40 ensures that the two camera modules 20 are relatively fixed.
  • the colloid 40 can increase the connection strength of the two camera modules 20, and can reduce the probability of the optical axis offset of the two camera modules 20.
  • the colloid 40 is located at a lower portion of the gap between the two camera modules 20 .
  • the colloid can fill the gap between the two camera modules.
  • the colloid 40 may be, for example, a colloidal colloid such as UV glue (Ultraviolet Glue).
  • the camera module includes a connection side opposite to another camera module, and the two camera modules are fixedly connected by a solder connection side.
  • the two camera modules can be firmly fixed together by welding.
  • the connection side of each camera module can be fixedly connected to another camera module by laser spot welding or solder paste or tin wire bonding.
  • the imaging module 100 includes a frame 50 , and the two camera modules 20 are disposed in the frame 50 and fixedly connected to the frame 50 .
  • the frame 50 and the two camera modules 20 can be fixedly connected by welding or colloid.
  • the frame 50 can further fix the positions of the two camera modules 20, reduce the impact force of the camera module 20 during the falling or oscillating process, increase the stability of the structure of the imaging module 100, and improve the imaging.
  • the quality of the module 100 can further fix the positions of the two camera modules 20, reduce the impact force of the camera module 20 during the falling or oscillating process, increase the stability of the structure of the imaging module 100, and improve the imaging. The quality of the module 100.
  • the frame 50 is provided with a fixing hole 50a, and a gap is formed between the hole wall of the fixing hole 50a and the two camera modules 20. Solder or colloid is filled in the gap between the wall of the fixing hole 50a and the two camera modules 20, and the two camera modules 20 are fixedly connected to the frame 50.
  • the imaging module 100 further includes a reinforcing plate 60, and the module mounting portion 11 is fixed on the reinforcing plate 60.
  • the reinforcing plate 60 can further fix the position of the camera module 20, improve the anti-collision capability of the imaging module 100, and thereby improve the shooting quality.
  • the imaging module 100 further includes an electromagnetic wave interference preventing member 70, and the reinforcing plate 60 is disposed on the electromagnetic wave preventing component 70.
  • the anti-electromagnetic interference component 70 can prevent the imaging module 100 from being interfered by electromagnetic waves, and ensure that the imaging module 100 obtains a better quality image.
  • the electromagnetic wave preventing member 70 can be made of, for example, a metal material.
  • the electronic device of the embodiment of the present invention includes the imaging module 100 described above.
  • the image processing algorithm of the electronic device can be made simpler, and the cost of the electronic device can be reduced.

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  • Signal Processing (AREA)
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  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

一种成像模组及电子装置。成像模组包括柔性电路板及至少两个摄像模组。柔性电路板包括模组安装部及连接模组安装部的连接器安装部。至少两个摄像模组间隔设置在模组安装部上，至少两个摄像模组的焦距均相同。

Description

成像模组及电子装置
优先权信息
本申请请求2016年03月03日向中国国家知识产权局提交的、专利申请号为201610120470.0、201620163068.6、201610120809.7、201620162986.7、201610120830.7、201620163056.3、201610120394.3、201620163270.9、201610120829.4、201620163042.1、201610120908.5、201620163025.8、201610120806.3、201620163074.1、201610120393.9、201620162848.9、201610120826.0及201620162774.9的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本发明涉及摄像技术领域，尤其涉及一种成像模组及一种电子装置。
背景技术
随着人们对拍摄图像的质量要求提高，双摄像头拍照技术应运而生。为了保证拍照质量，双摄像头模组的两个摄像模组的光轴平行设置且两个摄像模组朝同一侧拍摄。
双摄像头模组可应用在例如手机、平板电脑等电子装置上，因此，如何降低双摄像头模组的成本成为亟待解决的问题。
发明内容
本发明旨在解决现有技术中存在的技术问题之一。为此，本发明提供一种成像模组及一种电子装置。
本发明实施方式的成像模组包括柔性电路板及至少两个摄像模组。柔性电路板包括模组安装部及连接模组安装部的连接器安装部。至少两个摄像模组间隔设置在模组安装部上，至少两个摄像模组的焦距均相同。
上述成像模组中，由于至少两个摄像模组的焦距均相同，因此可使至少两个摄像模组的结构更加简单，有利于降低成像模组的成本。同时，这还可使成像模组的图像处理算法更简单，能够进一步降低成像模组的成本。
在某些实施方式中，所述摄像模组的数量为两个。
在某些实施方式中，所述柔性电路板包括连接部，所述连接部连接所述模组安装部及所述连接器安装部。
在某些实施方式中，每个所述摄像模组包括印刷电路板及设置在所述印刷电路板上且与所述印刷电路板电性连接的图像传感器，所述印刷电路板设置在所述模组安装部上 且与所述模组安装部电性连接。
在某些实施方式中，所述成像模组包括电性连接垫，所述电性连接垫设置在所述印刷电路板与所述模组安装部之间，并电性连接所述印刷电路板与所述模组安装部。
在某些实施方式中，所述摄像模组包括设置在所述印刷电路板上并位于所述图像传感器上方的镜头模组。
所述镜头模组包括镜头及音圈马达，所述音圈马达包括壳体，所述镜头设置在所述壳体内，两个所述摄像模组的两个所述壳体间隔设置。
在某些实施方式中，所述成像模组包括连接器组件，所述连接器组件包括基板及设置在所述基板上的连接器，所述基板设置在所述连接器安装部上并与所述连接器安装部电性连接。
在某些实施方式中，所述成像模组包括胶体，所述胶体粘接两个所述摄像模组。
在某些实施方式中，所述摄像模组包括与另一个所述摄像模组相对的连接侧，两个所述摄像模组通过焊接所述连接侧固定连接。
在某些实施方式中，所述成像模组包括框体，两个所述摄像模组设置在所述框体中且与所述框体固定连接。
本发明实施方式的电子装置包括上述的成像模组。
上述电子装置中，由于至少两个摄像模组的焦距均相同，因此可使电子装置的图像处理算法更简单，能够降低电子装置的成本。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本发明实施方式的成像模组的结构示意图。
图2是本发明实施方式的成像模组的立体示意图。
图3是图2中的成像模组沿III-III向的剖面示意图。
图4是图3中的成像模组的IV部分的放大示意图。
图5是本发明实施方式的成像模组的分解示意图。
图6是本发明实施方式的成像模组的另一个分解示意图。
图7是本发明实施方式的成像模组的柔性电路板的结构示意图。
具体实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
图1是本发明实施方式的成像模组的结构示意图。图1未示出成像模组的框体。
请参图1，本发明实施方式的成像模组100包括柔性电路板10及至少两个摄像模组20。柔性电路板10包括模组安装部11及连接器安装部12。至少两个摄像模组20间隔设置在模组安装部11上，至少两个摄像模组20的焦距均相同。
本发明实施方式的成像模组100中，由于至少两个摄像模组20的焦距均相同，因此可使至少两个摄像模组20的结构更加简单，有利于降低成像模组100的成本。同时，这还可使成像模组100的图像处理算法更简单，能够进一步降低成像模组100的成本。
本实施方式中，摄像模组20的数量为两个，在其他实施方式中，摄像模组的数量可为三个以上，三个以上摄像模组间隔设置在柔性电路板上。
为了方便说明，下文以摄像模组的数量为两个的实施方式作进一步说明，但不能理解为对发明的限制。
在一例子中，两个摄像模组20中，每个摄像模组20的焦距可以为定焦距，并且每个摄像模组20的结构可以与另一个摄像模组20的结构相同，从而实现两个摄像模组20的焦距均相同。
在另一个例子中，两个摄像模组20中的其中一个摄像模组20的焦距可以为定焦距，另一个摄像模组20的焦距为变焦距，可通过调节变焦距的摄像模组20的焦距以与定焦距的摄像模组20的焦距均相同。
可以理解，在又一个例子中，两个摄像模组20可以同时变焦距的摄像模组20，这样能够方便地将两个摄像模组20的焦距调至相同。
在一个例子中，在组装成像模组100的时候，先将两个摄像模组20分别固定至模组安装部11，然后可用机械手夹持固定其中一个摄像模组20，之后通过机械手调整另一个摄像模组20的位置以使两个摄像模组20的光轴平行，并且两个摄像模组20朝向同一侧。
请结合图7，本实施方式中，柔性电路板10包括连接部13，连接部13连接模组安装部11及连接器安装部12。
如此，连接部13可以实现模组安装部11与连接器安装部12之间的通信，以使设置在模组安装部11上的摄像模组将采集到的图像信息传至电子装置。
请参阅图2-图4，本实施方式中，每个摄像模组20包印刷电路板21(Printed Circuit Board，PCB)及图像传感器22。印刷电路板21设置在模组安装部11上且与模组安装部11电性连接。图像传感器22设置在印刷电路板21上且与印刷电路板21电性连接。
如此，图像传感器22可获取物体的图像，并将图像通过印刷电路板21及柔性电路板10传至外部装置。需要说明的是，两个图像传感器22的感测面相平行或共面并且朝向同一侧。
图像传感器22例如可以采用互补金属氧化物半导体(Complementary Metal Oxide Semiconductor，CMOS)影像感测器或者电荷耦合元件(Charge-coupled Device，CCD)影像感测器。
本实施方式中，成像模组100包括电性连接垫211，电性连接垫211设置在印刷电 路板21与模组安装部11之间，并电性连接印刷电路板21与模组安装部11。
电性连接垫211可实现柔性电路板10与摄像模组20之间电性连接并通信。例如，电性连接垫211均采用导电胶。
本实施方式中，印刷电路板21的形状及尺寸略小于与对应的模组安装部11的形状及尺寸。
这样可使成像模组100的结构更加紧凑，有利于减小成像模组100的体积。成像模组100应用于电子装置时，可进一步减小电子装置的体积。
本实施方式中，作为一个示例，每个印刷电路板21及与对应的模组安装部11的形状呈平板状。而在其他实施方式中，每个印刷电路板及与对应的模组安装部的形状可根据实际需求而具体设置。
请结合图5及图6，本实施方式中，摄像模组20包括设置在印刷电路板21上并位于图像传感器22上方的镜头模组23。
如此，镜头模组23可使图像传感器22获得品质较佳的图像，从而可提高成像模组100的拍摄品质。
本实施方式中，镜头模组23包括镜头231及音圈马达232，音圈马达232包括壳体2321，镜头231设置在壳体2321内，两个摄像模组20的两个壳体2321间隔设置。
音圈马达232可以驱动镜头231沿镜头231的光轴方向移动以调整镜头231与图像传感器22之间的距离，进而实现成像模组100的自动对焦，使成像模组100获取品质较佳的图像。另外，音圈马达232可实现驱动镜头231移动后，可实现两个摄像模组20的焦距均相同。
进一步地，镜头231与图像传感器22之间设置有滤光片24。滤光片24可以过滤预设频率的光线，使得图像传感器22根据过滤后的光线形成较佳的图像。
较佳地，滤光片24为红外截止滤光片。如此，红外截止滤光片24可以过滤红外线，避免图像传感器22的图像失真。
具体地，镜头模组23还包括基座233，基座233开设有凹槽2331，凹槽2331的底面开设有通孔2332。滤光片24设置在凹槽2331内且支撑在凹槽2331的底面上，经过滤光片24过滤的光线可以通过通孔2332到达图像传感器22。光线依次经过镜头231及滤光片24后到达图像传感器22，图像传感器22从而可采集到外界图像。
为了方便拿取滤光片24，基座233上开设有连接槽2333，连接槽2333连通凹槽2331。
本实施方式中，成像模组100包括连接器组件30，连接器组件30包括基板31及设置在基板31上的连接器32。基板31设置在连接器安装部12上并与连接器安装部12电性连接。
如此，连接器32可将成像模组100快速地安装到电子设备上。
较佳地，基板31与连接器安装部12的形状及尺寸相对应。这样可使连接器32与柔性电路板10的结构更加紧凑。
本实施方式中，成像模组100包括胶体40，胶体40粘接两个摄像模组20。
在将两个摄像模组20的光轴调至相互平行后，在两个摄像模组间点入胶体40。胶体40可保证两个摄像模组20相对固定。胶体40可增加两个摄像模组20的连接强度，可降低两个摄像模组20的光轴偏移的概率。
需要说明的是，本实施方式中，如图3中的方位所示，胶体40位于两个摄像模组20之间的间隙的下部。而在其他实施方式中，胶体可填满两个摄像模组之间的间隙。
胶体40例如可为UV胶(Ultraviolet Glue)等具有黏性的胶体。
在一些实施方式中，摄像模组包括与另一个摄像模组相对的连接侧，两个摄像模组通过焊接连接侧固定连接。
如此，两个摄像模组通过焊接可将牢固地固定在一起。例如，每个摄像模组的连接侧可通过激光点焊或锡膏或锡线焊接而与另一个摄像模组固定连接。
本实施方式中，成像模组100包括框体50，两个摄像模组20设置在框体50中并与框体50固定连接。例如，框体50与两个摄像模组20可通过焊接或者胶体固定连接。
如此，框体50可进一步固定两个摄像模组20的位置，减小了摄像模组20在跌落或震荡的过程中所受的冲击力，增加成像模组100结构的稳定性，提高了成像模组100的品质。
具体地，框体50开设有固定孔50a，固定孔50a的孔壁与两个摄像模组20之间形成有间隙。焊料或胶体填充在固定孔50a的孔壁与两个摄像模组20形成的间隙中，并将两个摄像模组20与框体50固定连接。
进一步地，成像模组100还包括加强板60，模组安装部11固定在加强板60上。
如此，加强板60可进一步固定摄像模组20的位置，提高成像模组100的抗冲撞的能力，进而提高拍摄品质。
本实施方式中，成像模组100还包括防电磁波干扰件70，加强板60设置在防电磁波干扰件70上。防电磁波干扰件70可防止成像模组100受到电磁波的干扰，保证成像模组100获取品质较佳的图像。防电磁波干扰件70例如可采用金属材料制成。
本发明实施方式的电子装置包括上述的成像模组100。
上述电子装置中，由于至少两个摄像模组20的焦距均相同，因此可使电子装置的图像处理算法更简单，能够降低电子装置的成本。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明 书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施方式，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。

Claims (11)

  1. 一种成像模组，其特征在于，包括：
    柔性电路板，所述柔性电路板包括模组安装部及连接所述模组安装部的连接器安装部；及
    至少两个摄像模组，所述至少两个摄像模组间隔设置在所述模组安装部上，所述至少两个摄像模组的焦距均相同。
  2. 如权利要求1所述的成像模组，其特征在于，所述摄像模组的数量为两个。
  3. 如权利要求2所述的成像模组，其特征在于，所述柔性电路板包括连接部，所述连接部连接所述模组安装部及所述连接器安装部。
  4. 如权利要求2所述的成像模组，其特征在于，每个所述摄像模组包括印刷电路板及设置在所述印刷电路板上且与所述印刷电路板电性连接的图像传感器，所述印刷电路板设置在所述模组安装部上且与所述模组安装部电性连接。
  5. 如权利要求4所述的成像模组，其特征在于，所述成像模组包括电性连接垫，所述电性连接垫设置在所述印刷电路板与所述模组安装部之间，并电性连接所述印刷电路板与所述模组安装部。
  6. 如权利要求4所述的成像模组，其特征在于，所述摄像模组包括设置在所述印刷电路板上并位于所述图像传感器上方的镜头模组；
    所述镜头模组包括镜头及音圈马达，所述音圈马达包括壳体，所述镜头设置在所述壳体内，两个所述摄像模组的两个所述壳体间隔设置。
  7. 如权利要求2所述的成像模组，其特征在于，所述成像模组包括连接器组件，所述连接器组件包括基板及设置在所述基板上的连接器，所述基板设置在所述连接器安装部上并与所述连接器安装部电性连接。
  8. 如权利要求2所述的成像模组，其特征在于，所述成像模组包括胶体，所述胶体粘接两个所述摄像模组。
  9. 如权利要求2所述的成像模组，其特征在于，所述摄像模组包括与另一个所述摄像模组相对的连接侧，两个所述摄像模组通过焊接所述连接侧固定连接。
  10. 如权利要求2所述的成像模组，其特征在于，所述成像模组包括框体，两个所述摄像模组设置在所述框体中且与所述框体固定连接。
  11. 一种电子装置，其特征在于，包括如权利要求1-10任一项所述的成像模组。
PCT/CN2016/090054 2016-03-03 2016-07-14 成像模组及电子装置 WO2017148073A1 (zh)

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