WO2017123661A3 - Low stress thermoelectric module - Google Patents
Low stress thermoelectric module Download PDFInfo
- Publication number
- WO2017123661A3 WO2017123661A3 PCT/US2017/013053 US2017013053W WO2017123661A3 WO 2017123661 A3 WO2017123661 A3 WO 2017123661A3 US 2017013053 W US2017013053 W US 2017013053W WO 2017123661 A3 WO2017123661 A3 WO 2017123661A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- module
- legs
- thermoelectric
- minimize
- applicants
- Prior art date
Links
- 238000000034 method Methods 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Applicants have identified four methods to minimize the stress in the module and thereby minimize the warping the module experiences during the fabrication process. These include: breaking up the slab, thin plastic between elements, use of Bridgeman cast legs, and soldering the cold side. The primary cost driver of thermoelectric modules is the costs associated with the N and P thermoelectric material needed to make the N and P thermoelectric legs of the module. Preferred embodiments designed by applicants utilize legs that require only a small fraction of the thermoelectric material compared to typical prior art thermoelectric modules with only a slight decrease in efficiencies. These smaller legs result in projected high-volume module costs of less than $1.00 per watt.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201614998501A | 2016-01-12 | 2016-01-12 | |
| US14/998,501 | 2016-01-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2017123661A2 WO2017123661A2 (en) | 2017-07-20 |
| WO2017123661A3 true WO2017123661A3 (en) | 2017-10-19 |
Family
ID=59311393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2017/013053 WO2017123661A2 (en) | 2016-01-12 | 2017-01-11 | Low stress thermoelectric module |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2017123661A2 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5892656A (en) * | 1993-10-19 | 1999-04-06 | Bass; John C. | Thermoelectric generator |
| US5982013A (en) * | 1995-05-19 | 1999-11-09 | Seiko Instruments Inc. | Thermoelectric device |
| US6314741B1 (en) * | 1997-08-25 | 2001-11-13 | Citizen Watch Co., Ltd. | Thermoelectric device |
| US20100024437A1 (en) * | 2008-07-29 | 2010-02-04 | Norbert Elsner | High temperature compact thermoelectric module with gapless eggcrate |
| US20100243018A1 (en) * | 2009-03-27 | 2010-09-30 | California Institute Of Technology | Metallization for zintl-based thermoelectric devices |
| US20120103381A1 (en) * | 2008-12-19 | 2012-05-03 | BASF SE and Hi-Z Technology, Inc. | Segmented thermoelectric module with bonded legs |
| US20140137918A1 (en) * | 2012-11-16 | 2014-05-22 | Micropower Global Limited | Thermoelectric device and method of making same |
-
2017
- 2017-01-11 WO PCT/US2017/013053 patent/WO2017123661A2/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5892656A (en) * | 1993-10-19 | 1999-04-06 | Bass; John C. | Thermoelectric generator |
| US5982013A (en) * | 1995-05-19 | 1999-11-09 | Seiko Instruments Inc. | Thermoelectric device |
| US6314741B1 (en) * | 1997-08-25 | 2001-11-13 | Citizen Watch Co., Ltd. | Thermoelectric device |
| US20100024437A1 (en) * | 2008-07-29 | 2010-02-04 | Norbert Elsner | High temperature compact thermoelectric module with gapless eggcrate |
| US20120103381A1 (en) * | 2008-12-19 | 2012-05-03 | BASF SE and Hi-Z Technology, Inc. | Segmented thermoelectric module with bonded legs |
| US20100243018A1 (en) * | 2009-03-27 | 2010-09-30 | California Institute Of Technology | Metallization for zintl-based thermoelectric devices |
| US20140137918A1 (en) * | 2012-11-16 | 2014-05-22 | Micropower Global Limited | Thermoelectric device and method of making same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017123661A2 (en) | 2017-07-20 |
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