WO2017113184A1 - Circuit board and electronic device having same - Google Patents

Circuit board and electronic device having same Download PDF

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Publication number
WO2017113184A1
WO2017113184A1 PCT/CN2015/099853 CN2015099853W WO2017113184A1 WO 2017113184 A1 WO2017113184 A1 WO 2017113184A1 CN 2015099853 W CN2015099853 W CN 2015099853W WO 2017113184 A1 WO2017113184 A1 WO 2017113184A1
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WO
WIPO (PCT)
Prior art keywords
antenna
sensor
substrate
circuit board
interface
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Application number
PCT/CN2015/099853
Other languages
French (fr)
Chinese (zh)
Inventor
王典
胡孟
冯建刚
刘元财
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN201580066951.1A priority Critical patent/CN107210523B/en
Priority to PCT/CN2015/099853 priority patent/WO2017113184A1/en
Publication of WO2017113184A1 publication Critical patent/WO2017113184A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Definitions

  • the present invention relates to a circuit board and an electronic device having the same.
  • the antenna and the sensor are usually designed separately and placed in different positions, which will occupy a large amount of equipment space and reduce the equipment.
  • the degree of integration In addition, the limited space limits the number of antennas and sensors.
  • a circuit board includes: a substrate, an antenna, and a sensor, wherein the sensor and the antenna are disposed on the substrate, and the substrate is further provided with an anti-interference component for reducing the antenna and the sensor Interference.
  • the senor is disposed on another side different from the side of the antenna, and the position of the sensor on the substrate is defined in a predetermined area where the interference to the antenna is less than a preset value.
  • the circuit board further includes an antenna interface connected to the antenna, and a sensor interface electrically connected to the sensor, the antenna interface being electrically connected to the antenna through a coaxial line or a microstrip line And the sensor is electrically connected to the sensor interface through a circuit disposed on the substrate.
  • the substrate is a multi-layer structure, at least two of the antenna, the antenna interface, and the sensor interface are disposed on the same layer of the substrate or on different layers.
  • the senor and the antenna are respectively disposed on different layers of the substrate.
  • the circuit board includes an antenna interface, a sensor interface, and a connecting wire
  • the substrate includes a first layer substrate, a second layer substrate, the antenna including a first portion and a second portion, the first portion And the second portion is respectively disposed on the front and back sides of the first layer substrate, and the sensor interface, the antenna interface, the first portion of the antenna, and the sensor are all disposed on the same side of the first layer substrate On the side, the position of the sensor on the substrate is defined in a predetermined area where the interference to the antenna is less than a preset value; the connecting wire is disposed on a bottom side of the second layer substrate.
  • the second portion of the antenna is comprised of a metal sheet, the second portion is coupled to the first portion of the antenna, and the second portion of the antenna is configured to reduce the first portion and the connecting conductor Mutual coupling between.
  • the second portion of the antenna is coupled to the first portion of the antenna by a metal via.
  • the sensor is electrically connected to the sensor interface through the connecting wires, and the metal vias on the first layer substrate and the second layer substrate.
  • the antenna interface is soldered to the first portion of the antenna.
  • the anti-interference element is at least one of a decoupling capacitor, a magnetic bead, and a common mode inductor.
  • the interference preventing component is disposed around the sensor.
  • the antenna is a dipole antenna and the sensor is a compass component.
  • the antenna is disposed on the substrate remote from the sensor.
  • the circuit board is applied to a robot, an unmanned aerial vehicle, an unmanned boat, or an unmanned vehicle.
  • An electronic device includes a circuit board including: a substrate, an antenna, and a sensor, wherein the sensor and the antenna are disposed on the substrate, and the substrate is further provided with an anti-interference component for reducing Interference between the antenna and the sensor.
  • the senor is disposed on another side different from the side of the antenna, and the position of the sensor on the substrate is defined in a predetermined area where the interference to the antenna is less than a preset value.
  • the circuit board further includes an antenna interface connected to the antenna, and a sensor interface electrically connected to the sensor, the antenna interface being electrically connected to the antenna through a coaxial line or a microstrip line And the sensor is electrically connected to the sensor interface through a circuit disposed on the substrate.
  • the substrate is a multi-layer structure, and at least two of the antenna, the antenna interface, and the sensor interface are disposed on the same layer of the substrate or on different layers.
  • the senor and the antenna are respectively disposed on different layers of the substrate.
  • the circuit board includes an antenna interface, a sensor interface, and a connecting wire
  • the substrate includes a first layer substrate, a second layer substrate, the antenna including a first portion and a second portion, the first portion And the second portion is respectively disposed on the front and back sides of the first layer substrate, and the sensor interface, the antenna interface, the first portion of the antenna, and the sensor are all disposed on the same side of the first layer substrate On the side, the position of the sensor on the substrate is defined in a predetermined area where the interference to the antenna is less than a preset value; the connecting wire is disposed on a bottom side of the second layer substrate.
  • the second portion of the antenna is comprised of a metal sheet, the second portion is coupled to the first portion of the antenna, and the second portion of the antenna is configured to reduce the first portion and the connecting conductor Mutual coupling between.
  • the second portion of the antenna is coupled to the first portion of the antenna by a metal via.
  • the sensor is electrically connected to the sensor interface through the connecting wires, and the metal vias on the first layer substrate and the second layer substrate.
  • the antenna interface is soldered to the first portion of the antenna.
  • the anti-interference element is at least one of a decoupling capacitor, a magnetic bead, and a common mode inductor.
  • the interference preventing component is disposed around the sensor.
  • the antenna is a dipole antenna and the sensor is a compass component.
  • the antenna is disposed on the substrate remote from the sensor.
  • the electronic device is a robot, an unmanned aerial vehicle, an unmanned vehicle, or an unmanned boat.
  • the circuit board of the present invention integrates the antenna and the sensor in a highly integrated manner, thereby greatly improving the space utilization rate, facilitating the compact structure and the appearance design; and, by adopting a collaborative design, The sensors and antennas are enabled to not interfere with each other and maintain good performance, respectively.
  • FIG. 1 is a schematic structural view of a circuit board according to a first preferred embodiment of the present invention.
  • FIG. 2 is an exploded view of a circuit board in accordance with a first preferred embodiment of the present invention.
  • FIG 3 is a top plan view of a circuit board in accordance with a first preferred embodiment of the present invention.
  • Figure 4 is a bottom plan view of a circuit board in accordance with a first preferred embodiment of the present invention.
  • Figure 5 is an exploded view of a circuit board in accordance with a second preferred embodiment of the present invention.
  • FIG. 1 is a schematic structural view of a circuit board 100 according to a first preferred embodiment of the present invention.
  • FIG. 2 is an exploded view of a circuit board 100 according to a first preferred embodiment of the present invention
  • FIG. 3 and FIG. 4 are the first embodiment of the present invention.
  • the circuit board 100 is an antenna transmitting device, including, but not limited to, a substrate 11, an antenna 12, a sensor 13, an antenna interface 14, and a sensor interface 15.
  • the substrate 11 is a carrier of the antenna 12, the sensor 13, the antenna interface 14, and the sensor interface 15.
  • the substrate 11 may be a single layer substrate or a multilayer substrate.
  • the circuit board 100 is integrated as a circuit board provided with the above devices.
  • the circuit board 100 may be a flexible circuit board.
  • the circuit board may also be a non-flexible circuit board, such as a PCB board.
  • the antenna 12 can be an antenna device of various types and configurations.
  • the antenna 12 is a dipole antenna (symmetric vibrator).
  • the dipole antenna is used for transmitting and receiving a signal of a fixed frequency, and is composed of two conductors each having a length of a quarter wavelength of an antenna operating frequency. Therefore, the total length of the dipole antenna is approximately the antenna operation.
  • Half wavelength of the frequency. Therefore, dipole antennas are often referred to as half-wave oscillators.
  • the operating frequency of the dipole antenna is located in the frequency band of the 2.4 GHz band.
  • the specific structure of the dipole antenna is a common structure well known to those skilled in the art and will not be described in detail herein. It can be understood that the operating frequency of the antenna 12 can also be located in other frequency bands.
  • the sensor 13 is a component that can sense the measured information and convert the sensed information into an electrical signal or other desired form of information output according to a certain rule.
  • the sensor 13 is described by taking a compass component as an example.
  • the sensor 13 can also be any suitable sensor for positioning, navigation, vision, weather, and the like.
  • the structure of the compass component is also a common circuit structure well known to those skilled in the art and will not be described in detail herein.
  • the antenna interface 14 is electrically connected to the antenna 12 by any suitable electrical connection manner such as a coaxial line or a microstrip line.
  • the antenna interface 14 may be an IPEX terminal. In other preferred embodiments, the antenna interface 14 can also be other types of terminals.
  • the sensor 13 is electrically connected to the sensor interface 15 through a circuit (not shown) disposed on the substrate 11 to form a complete sensor.
  • the antenna 12, the antenna interface 14, and the sensor interface 15 are disposed on the same side of the substrate 11.
  • at least two of the antenna 12, the antenna interface 14, and the sensor interface 15 may be disposed on the same side of the substrate, or at least two of them may be respectively disposed on the substrate.
  • the antenna 12, the antenna interface 14, and the sensor interface 15 are disposed on a top layer of the substrate 11.
  • the sensor 13 is disposed on the other side of the substrate 11.
  • the sensor 13 is disposed on the bottom layer of the substrate 11.
  • the sensor 13 may also be disposed on another layer different from the layer where the antenna 12 is located, and connected to the sensor through a wire or the like.
  • the position of the sensor 13 on the substrate 11 is limited within a predetermined area to reduce interference with the antenna 12.
  • the predetermined area may be determined according to the interference of the sensor 13 to the antenna 12 being less than a predetermined value. That is, the interference of the sensor 13 to the antenna 12 is small in the predetermined area. In other preferred embodiments, the predetermined area is differently set according to the structure of the antenna 12 and the structure of the sensor 13.
  • the design of the antenna 12 is relatively uncertain, and the antenna 12 is affected. Radiation efficiency. Therefore, the area occupied by the antenna 12 avoids designing other circuits as much as possible, thereby reducing the influence of other circuits on the performance of the antenna 12.
  • the relative position between the sensor 13 and the antenna 12 is not limited to the vertical relationship as shown in FIG. 2, and may be a left-right relationship, an overlapping relationship, or the like.
  • the circuit board 200 of the second preferred embodiment also includes the antenna 22, the sensor 23, the antenna interface 24, and the sensor interface 25 as compared to the first preferred embodiment.
  • the types and functions of the same or similar elements in the present embodiment as those in the above-described first embodiment will not be described herein.
  • the circuit board 200 includes a first layer substrate 26, a second layer substrate 27, and connection wires 28.
  • the antenna 22 is also described by taking a dipole antenna as an example.
  • the antenna 22 is divided into a first portion 221 and a second portion 222.
  • the first portion 221 and the second portion 222 are respectively disposed on the front and back sides of the first layer substrate 26.
  • the second portion 222 can be a T-shaped metal sheet that can be mechanically and electrically connected to the first portion 221 through the metal vias 29.
  • the first portion 221 can also be electrically linked to its second portion 222 in other manners.
  • the antenna interface 24 is directly connected to a portion of the antenna 22 by soldering, for example, to the first portion 221.
  • the sensor interface 25, the antenna interface 24, the first portion 221, and the sensor 23 are all disposed on the same side of the first layer substrate 26, as shown in FIG. On the upper side of a layer of substrate 26.
  • the second portion 222 is disposed on a lower side of the first layer substrate 26.
  • the sensor 23 may be disposed at an end of the first layer substrate 26 remote from the antenna 22.
  • the connecting wire 28 is disposed on the bottom layer of the second layer substrate 27. By disposing the connecting wire 28 on the bottom layer of the second layer substrate 27, the interference caused by the connecting wire 28 to the antenna 22 after being energized can be further reduced.
  • the first portion 221 is primarily used as a radiator and the second portion 222 is used to match the impedance of the antenna interface 24.
  • the current of the first portion 221 is greater than the current of the second portion 222, and the metal of the second portion 222 can effectively separate the first portion 221 from the connecting wire 28 disposed on the bottom layer, such that The current induced by the first portion 221 on the connecting wire 28 can be reduced, and the mutual coupling can be reduced, thereby further reducing the influence of the connecting wire 28 on the overall performance of the antenna 22.
  • the sensor 23 is electrically connected to the sensor interface 25 through the connecting wire 28, the first layer substrate 26 and the metal via 29 on the second layer substrate 27.
  • the metal via 29 for connecting the first layer substrate 26 and the second layer substrate 27 and the metal via 29 for connecting the first portion 221 and the second portion 222 may be the same via hole or It is a different via, which can be set according to actual needs.
  • the circuit board in order to reduce the interference of the radio signal on the sensor at the antenna radiation, the circuit board is designed to evaluate the respective response frequencies of the antenna and the sensor.
  • the design of the sensor peripheral circuit is performed in accordance with the mutual response.
  • the circuit board is provided with an anti-interference element 30 for reducing interference between the antenna and the sensor.
  • an anti-interference component 30 may be disposed around the sensor, and the anti-interference component 30 may be at least one of a decoupling capacitor, a magnetic bead, and a common mode inductor, thereby reducing the antenna. Interference with the sensor.
  • the interference preventing component 30 can also be disposed in the sensor (eg, a power source (not shown) of the sensor.
  • the circuit layout of the sensor And the traces can also be properly laid out to reduce radiation coupling.
  • the circuit board can be applied to mobile electronic devices such as robots, unmanned aerial vehicles, unmanned vehicles, unmanned vehicles (not shown), and the circuit board can also be applied to smart devices (figure Any suitable electronic device, such as not shown).

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Abstract

A circuit board (100) and an electronic device having same. The circuit board (100) comprises: a substrate (11), an antenna (12), and a sensor (13); the sensor (13) and the antenna (12) are both disposed on the substrate (11); the substrate (11) is further provided with an anti-interference element used for reducing the interference between the antenna (12) and the sensor (13).

Description

电路板及具有该电路板的电子装置Circuit board and electronic device having the same 技术领域Technical field
本发明涉及一种电路板及具有该电路板的电子装置。The present invention relates to a circuit board and an electronic device having the same.
背景技术Background technique
随着智能设备、机器人的普及和推广,定位、导航、视觉、天气等各类传感器在这些设备上都得到了广泛的应用,并且成为这些设备不可缺少的组件。但是由于很多传感器对环境有特殊的要求,如果需要达到一定的测量精度,其工作环境一般要求比较苛刻,所以这些传感器一般会被放置在元件较为稀疏较少或者干扰较低的结构和位置处。例如,指南针传感器对磁场环境有严格要求,并且需要避开金属物件。天线也是智能设备、无线通讯中必不可少的元件,在很多智能设备以及机器人设计中,为了达到足够高的辐射效率和性能,天线所处的位置也需要远离金属以及放置在元件较为稀疏的位置处。With the popularization and promotion of smart devices and robots, various sensors such as positioning, navigation, vision, and weather have been widely used in these devices and become an indispensable component of these devices. However, since many sensors have special requirements on the environment, if a certain measurement accuracy is required, the working environment is generally demanding, so these sensors are generally placed at structures and locations where the components are less sparse or have less interference. For example, compass sensors have strict requirements for magnetic field environments and need to avoid metal objects. The antenna is also an indispensable component in smart devices and wireless communication. In many smart devices and robot designs, in order to achieve high enough radiation efficiency and performance, the position of the antenna needs to be away from the metal and placed in a relatively sparsely placed position. At the office.
在传统的设计中,为了减少天线与传感器之间的干扰,保证各自的性能,通常都是将天线与传感器分开设计,并放置在不同的位置,这样就会占据大量的设备空间,降低了设备的集成度。此外,有限的空间限制了天线和传感器的数量。In the traditional design, in order to reduce the interference between the antenna and the sensor and ensure the respective performance, the antenna and the sensor are usually designed separately and placed in different positions, which will occupy a large amount of equipment space and reduce the equipment. The degree of integration. In addition, the limited space limits the number of antennas and sensors.
发明内容Summary of the invention
鉴于以上内容,有必要提供一种同时集成天线和传感器且保持天线和传感器良好性能的电路板。In view of the above, it is necessary to provide a circuit board that integrates both the antenna and the sensor while maintaining the good performance of the antenna and the sensor.
还有必要提供一种具有该电路板的电子装置。It is also necessary to provide an electronic device having the circuit board.
一种电路板,包括:基板、天线及传感器,所述传感器和所述天线均设置于所述基板上,所述基板上还设置有防干扰元件,用于降低所述天线与所述传感器之间的干扰。A circuit board includes: a substrate, an antenna, and a sensor, wherein the sensor and the antenna are disposed on the substrate, and the substrate is further provided with an anti-interference component for reducing the antenna and the sensor Interference.
在一些实施例中,所述传感器设置于与所述天线所在侧面不同的另一侧面上,所述传感器在所述基板上的位置限定在对所述天线的干扰小于预设值的预定区域内。In some embodiments, the sensor is disposed on another side different from the side of the antenna, and the position of the sensor on the substrate is defined in a predetermined area where the interference to the antenna is less than a preset value. .
在一些实施例中,所述电路板还包括与天线连接的天线接口,以及与所述传感器电性连接的传感器接口,所述天线接口通过同轴线或微带线与所述天线电性连接,以及所述传感器通过设置在所述基板上的电路与所述传感器接口电性连接。In some embodiments, the circuit board further includes an antenna interface connected to the antenna, and a sensor interface electrically connected to the sensor, the antenna interface being electrically connected to the antenna through a coaxial line or a microstrip line And the sensor is electrically connected to the sensor interface through a circuit disposed on the substrate.
在一些实施例中,所述基板为多层结构,所述天线、天线接口以及所述传感器接口中至少二者设置于所述基板的同一层上或者不同层上。In some embodiments, the substrate is a multi-layer structure, at least two of the antenna, the antenna interface, and the sensor interface are disposed on the same layer of the substrate or on different layers.
在一些实施例中,所述传感器与所述天线分别设置于所述基板的不同层上。In some embodiments, the sensor and the antenna are respectively disposed on different layers of the substrate.
在一些实施例中,所述电路板包括天线接口、传感器接口及连接导线,以及所述基板包括第一层基板、第二层基板,所述天线包括第一部分和第二部分,所述第一部分及第二部分分别设置在所述第一层基板的正反侧面上,所述传感器接口、所述天线接口、所述天线的第一部分以及所述传感器均设置在所述第一层基板的同一侧面上,所述传感器在所述基板上的位置限定在对所述天线的干扰小于预设值的预定区域内;所述连接导线设置在所述第二层基板的底侧。In some embodiments, the circuit board includes an antenna interface, a sensor interface, and a connecting wire, and the substrate includes a first layer substrate, a second layer substrate, the antenna including a first portion and a second portion, the first portion And the second portion is respectively disposed on the front and back sides of the first layer substrate, and the sensor interface, the antenna interface, the first portion of the antenna, and the sensor are all disposed on the same side of the first layer substrate On the side, the position of the sensor on the substrate is defined in a predetermined area where the interference to the antenna is less than a preset value; the connecting wire is disposed on a bottom side of the second layer substrate.
在一些实施例中,所述天线的第二部分由金属片构成,该第二部分与所述天线的第一部分连接,所述天线的第二部分用以降低所述第一部分与所述连接导线之间的互耦。In some embodiments, the second portion of the antenna is comprised of a metal sheet, the second portion is coupled to the first portion of the antenna, and the second portion of the antenna is configured to reduce the first portion and the connecting conductor Mutual coupling between.
在一些实施例中,所述天线的第二部分通过金属过孔与所述天线的第一部分连接。In some embodiments, the second portion of the antenna is coupled to the first portion of the antenna by a metal via.
在一些实施例中,所述传感器通过所述连接导线、和所述第一层基板及所述第二层基板上的金属过孔与所述传感器接口电性连接。In some embodiments, the sensor is electrically connected to the sensor interface through the connecting wires, and the metal vias on the first layer substrate and the second layer substrate.
在一些实施例中,所述天线接口通过焊接的方式连接于所述天线的第一部分。In some embodiments, the antenna interface is soldered to the first portion of the antenna.
在一些实施例中,所述防干扰元件为退耦电容、磁珠及共模电感中的至少一种。In some embodiments, the anti-interference element is at least one of a decoupling capacitor, a magnetic bead, and a common mode inductor.
在一些实施例中,所述防干扰元件设置于所述传感器的周围。In some embodiments, the interference preventing component is disposed around the sensor.
在一些实施例中,所述天线为偶极子天线,以及所述传感器为指南针元器件。In some embodiments, the antenna is a dipole antenna and the sensor is a compass component.
在一些实施例中,所述天线远离所述传感器设置于所述基板上。In some embodiments, the antenna is disposed on the substrate remote from the sensor.
在一些实施例中,所述电路板应用于机器人、无人飞行器、无人船、或无人车。In some embodiments, the circuit board is applied to a robot, an unmanned aerial vehicle, an unmanned boat, or an unmanned vehicle.
一种电子装置,包括一电路板,该电路板包括:基板、天线及传感器,所述传感器和所述天线均设置于所述基板上,所述基板上还设置有防干扰元件,用于降低所述天线与所述传感器之间的干扰。An electronic device includes a circuit board including: a substrate, an antenna, and a sensor, wherein the sensor and the antenna are disposed on the substrate, and the substrate is further provided with an anti-interference component for reducing Interference between the antenna and the sensor.
在一些实施例中,所述传感器设置于与所述天线所在侧面不同的另一侧面上,所述传感器在所述基板上的位置限定在对所述天线的干扰小于预设值的预定区域内。In some embodiments, the sensor is disposed on another side different from the side of the antenna, and the position of the sensor on the substrate is defined in a predetermined area where the interference to the antenna is less than a preset value. .
在一些实施例中,所述电路板还包括与天线连接的天线接口,以及与所述传感器电性连接的传感器接口,所述天线接口通过同轴线或微带线与所述天线电性连接,以及所述传感器通过设置在所述基板上的电路与所述传感器接口电性连接。In some embodiments, the circuit board further includes an antenna interface connected to the antenna, and a sensor interface electrically connected to the sensor, the antenna interface being electrically connected to the antenna through a coaxial line or a microstrip line And the sensor is electrically connected to the sensor interface through a circuit disposed on the substrate.
在一些实施例中,所述基板为多层结构,所述天线、天线接口以及所述传感器接口中至少二者设置于所述基板的同一层上或者不同的层上。In some embodiments, the substrate is a multi-layer structure, and at least two of the antenna, the antenna interface, and the sensor interface are disposed on the same layer of the substrate or on different layers.
在一些实施例中,所述传感器与所述天线分别设置于所述基板的不同层上。In some embodiments, the sensor and the antenna are respectively disposed on different layers of the substrate.
在一些实施例中,所述电路板包括天线接口、传感器接口及连接导线,以及所述基板包括第一层基板、第二层基板,所述天线包括第一部分和第二部分,所述第一部分及第二部分分别设置在所述第一层基板的正反侧面上,所述传感器接口、所述天线接口、所述天线的第一部分以及所述传感器均设置在所述第一层基板的同一侧面上,所述传感器在所述基板上的位置限定在对所述天线的干扰小于预设值的预定区域内;所述连接导线设置在所述第二层基板的底侧。In some embodiments, the circuit board includes an antenna interface, a sensor interface, and a connecting wire, and the substrate includes a first layer substrate, a second layer substrate, the antenna including a first portion and a second portion, the first portion And the second portion is respectively disposed on the front and back sides of the first layer substrate, and the sensor interface, the antenna interface, the first portion of the antenna, and the sensor are all disposed on the same side of the first layer substrate On the side, the position of the sensor on the substrate is defined in a predetermined area where the interference to the antenna is less than a preset value; the connecting wire is disposed on a bottom side of the second layer substrate.
在一些实施例中,所述天线的第二部分由金属片构成,该第二部分与所述天线的第一部分连接,所述天线的第二部分用以降低所述第一部分与所述连接导线之间的互耦。In some embodiments, the second portion of the antenna is comprised of a metal sheet, the second portion is coupled to the first portion of the antenna, and the second portion of the antenna is configured to reduce the first portion and the connecting conductor Mutual coupling between.
在一些实施例中,所述天线的第二部分通过金属过孔与所述天线的第一部分连接。In some embodiments, the second portion of the antenna is coupled to the first portion of the antenna by a metal via.
在一些实施例中,所述传感器通过所述连接导线、和所述第一层基板及所述第二层基板上的金属过孔与所述传感器接口电性连接。In some embodiments, the sensor is electrically connected to the sensor interface through the connecting wires, and the metal vias on the first layer substrate and the second layer substrate.
在一些实施例中,所述天线接口通过焊接的方式连接于所述天线的第一部分。In some embodiments, the antenna interface is soldered to the first portion of the antenna.
在一些实施例中,所述防干扰元件为退耦电容、磁珠及共模电感中的至少一种。In some embodiments, the anti-interference element is at least one of a decoupling capacitor, a magnetic bead, and a common mode inductor.
在一些实施例中,所述防干扰元件设置于所述传感器周围。In some embodiments, the interference preventing component is disposed around the sensor.
在一些实施例中,所述天线为偶极子天线,以及所述传感器为指南针元器件。In some embodiments, the antenna is a dipole antenna and the sensor is a compass component.
在一些实施例中,所述天线远离所述传感器设置于所述基板上。In some embodiments, the antenna is disposed on the substrate remote from the sensor.
在一些实施例中,所述电子装置为机器人、无人飞行器、无人车或无人船。In some embodiments, the electronic device is a robot, an unmanned aerial vehicle, an unmanned vehicle, or an unmanned boat.
与现有技术相比较,本发明所述的电路板上将天线与传感器高度集成地一体化设计,大大提高了空间的使用率,有利于结构的紧凑和外观设计;此外,通过采用协同设计,使得所述传感器和天线能够不相互干扰且分别都能保持良好的性能。Compared with the prior art, the circuit board of the present invention integrates the antenna and the sensor in a highly integrated manner, thereby greatly improving the space utilization rate, facilitating the compact structure and the appearance design; and, by adopting a collaborative design, The sensors and antennas are enabled to not interfere with each other and maintain good performance, respectively.
附图说明DRAWINGS
图1为本发明第一较佳实施例的电路板的结构示意图。1 is a schematic structural view of a circuit board according to a first preferred embodiment of the present invention.
图2为本发明第一较佳实施例的电路板的分解图。2 is an exploded view of a circuit board in accordance with a first preferred embodiment of the present invention.
图3为本发明第一较佳实施例的电路板的俯视图。3 is a top plan view of a circuit board in accordance with a first preferred embodiment of the present invention.
图4为本发明第一较佳实施例的电路板的仰视图。Figure 4 is a bottom plan view of a circuit board in accordance with a first preferred embodiment of the present invention.
图5为本发明第二较佳实施例的电路板的分解图。Figure 5 is an exploded view of a circuit board in accordance with a second preferred embodiment of the present invention.
主要元件符号说明Main component symbol description
电路板 100,200Circuit board 100,200
基板 11 Substrate 11
天线 12,22 Antenna 12, 22
传感器 13,23 Sensor 13,23
天线接口 14,24 Antenna interface 14,24
传感器接口 15,25 Sensor interface 15,25
第一层基板 26 First layer substrate 26
第二层基板 27 Second substrate 27
连接导线 28Connecting wire 28
金属过孔 29 Metal vias 29
防干扰元件 30 Anti-interference component 30
第一部分 221Part 1 221
第二部分 222Part II 222
如下具体实施方式将结合上述附图进一步说明本发明。The invention will be further illustrated by the following detailed description in conjunction with the accompanying drawings.
具体实施方式detailed description
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
下面结合附图,对本发明的一些实施方式作详细说明。在不冲突的情况下,下述的实施例及实施例中的特征可以相互组合。Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The features of the embodiments and examples described below can be combined with each other without conflict.
请参阅图1,是本发明第一较佳实施例的电路板100的结构示意图,图2是本发明第一较佳实施例电路板100的分解图,图3与图4是本发明第一较佳实施例电路板100的俯视图和仰视图。在本实施方式中,所述电路板100为天线发射装置,包括,但不限于,基板11、天线12、传感器13、天线接口14、及传感器接口15。在第一较佳实施例中,所述基板11为天线12、传感器13、天线接口14、传感器接口15的载体,所述基板11可为单层基板或多层基板。在本较佳实施例中,所述电路板100作为集成上述器件所设置集成的电路板,例如,所述电路板100可以是柔性电路板。在其他较佳实施例中,所述电路板也可以是非柔性电路板,如PCB板。1 is a schematic structural view of a circuit board 100 according to a first preferred embodiment of the present invention. FIG. 2 is an exploded view of a circuit board 100 according to a first preferred embodiment of the present invention, and FIG. 3 and FIG. 4 are the first embodiment of the present invention. A top view and a bottom view of the circuit board 100 of the preferred embodiment. In the present embodiment, the circuit board 100 is an antenna transmitting device, including, but not limited to, a substrate 11, an antenna 12, a sensor 13, an antenna interface 14, and a sensor interface 15. In the first preferred embodiment, the substrate 11 is a carrier of the antenna 12, the sensor 13, the antenna interface 14, and the sensor interface 15. The substrate 11 may be a single layer substrate or a multilayer substrate. In the preferred embodiment, the circuit board 100 is integrated as a circuit board provided with the above devices. For example, the circuit board 100 may be a flexible circuit board. In other preferred embodiments, the circuit board may also be a non-flexible circuit board, such as a PCB board.
在一实施例中,所述天线12可以是各种类型和结构的天线装置。在本较佳实施例中,所述天线12为偶极子天线(对称振子)。所述偶极子天线用来发射和接收固定频率的信号,由两根导体组成,每根的长度为天线工作频率的四分之一波长,因此,偶极子天线的总长度约为天线工作频率的半波长。因此偶极子天线通常被称为半波振子。偶极子天线的工作频率位于2.4GHz频段的射频,偶极子天线的具体结构为本技术领域人员所熟知常见结构,在此不做具体描述。可以理解的是,所述天线12的工作频率也可位于其他的频段。In an embodiment, the antenna 12 can be an antenna device of various types and configurations. In the preferred embodiment, the antenna 12 is a dipole antenna (symmetric vibrator). The dipole antenna is used for transmitting and receiving a signal of a fixed frequency, and is composed of two conductors each having a length of a quarter wavelength of an antenna operating frequency. Therefore, the total length of the dipole antenna is approximately the antenna operation. Half wavelength of the frequency. Therefore, dipole antennas are often referred to as half-wave oscillators. The operating frequency of the dipole antenna is located in the frequency band of the 2.4 GHz band. The specific structure of the dipole antenna is a common structure well known to those skilled in the art and will not be described in detail herein. It can be understood that the operating frequency of the antenna 12 can also be located in other frequency bands.
所述传感器13是能够感受到被测量的信息,并将所感受的信息按一定规律变换成为电信号或其他所需形式的信息输出的元器件。在本实施例中,所述传感器13以指南针元器件为例进行说明。在其他较佳实施例中,所述传感器13也可以是定位、导航、视觉、天气等各类任意适用的传感器。指南针元器件的结构也是本技术领域人员所熟知的常见电路结构,在此不做具体描述。The sensor 13 is a component that can sense the measured information and convert the sensed information into an electrical signal or other desired form of information output according to a certain rule. In the embodiment, the sensor 13 is described by taking a compass component as an example. In other preferred embodiments, the sensor 13 can also be any suitable sensor for positioning, navigation, vision, weather, and the like. The structure of the compass component is also a common circuit structure well known to those skilled in the art and will not be described in detail herein.
所述天线接口14通过同轴线或微带线等多种任意适用的电性连接方式与所述天线12电性连接。在一实施方式中,所述天线接口14可以是IPEX端子。在其他较佳实施例中,所述天线接口14也可以是其他种类的端子。The antenna interface 14 is electrically connected to the antenna 12 by any suitable electrical connection manner such as a coaxial line or a microstrip line. In an embodiment, the antenna interface 14 may be an IPEX terminal. In other preferred embodiments, the antenna interface 14 can also be other types of terminals.
所述传感器13通过设置在所述基板11上的电路(图中未示出)与所述传感器接口15电性连接,以构成一个完整的传感器。The sensor 13 is electrically connected to the sensor interface 15 through a circuit (not shown) disposed on the substrate 11 to form a complete sensor.
在第一较佳实施例中,参见图1所示,所述天线12、天线接口14以及所述传感器接口15设置于所述基板11同一侧面上。在其他较佳实施例中,所述天线12、天线接口14以及所述传感器接口15中可以是至少两者设置在所述基板的同一侧面上,也可以是至少二者分别设置于所述基板11的不同侧面上。参见图3所示,所述天线12、天线接口14以及所述传感器接口15设置于所述基板11的顶层。所述传感器13设置于所述基板11的另一侧面上,例如,参见图4所示,所述传感器13设置于所述基板11的底层。在另一实施例中,当所述基板11为多层结构时,所述传感器13也可以设置于与所述天线12所在层不同的其它层上,并通过导线等连接方式连接到所述传感器接口15处。In the first preferred embodiment, as shown in FIG. 1, the antenna 12, the antenna interface 14, and the sensor interface 15 are disposed on the same side of the substrate 11. In other preferred embodiments, at least two of the antenna 12, the antenna interface 14, and the sensor interface 15 may be disposed on the same side of the substrate, or at least two of them may be respectively disposed on the substrate. On the different sides of the 11th. Referring to FIG. 3, the antenna 12, the antenna interface 14, and the sensor interface 15 are disposed on a top layer of the substrate 11. The sensor 13 is disposed on the other side of the substrate 11. For example, as shown in FIG. 4, the sensor 13 is disposed on the bottom layer of the substrate 11. In another embodiment, when the substrate 11 has a multi-layer structure, the sensor 13 may also be disposed on another layer different from the layer where the antenna 12 is located, and connected to the sensor through a wire or the like. At interface 15.
其中,所述传感器13在所述基板11上的位置被限制在预定区域内,以降低对天线12的干扰。该预定区域可以根据所述传感器13对天线12的干扰小于一预设值来进行确定。即,在该预定区域内,所述传感器13对天线12的干扰较小。在其他较佳实施例中,该预定区域根据所述天线12的结构及所述传感器13结构的不同而进行不同设置。Wherein, the position of the sensor 13 on the substrate 11 is limited within a predetermined area to reduce interference with the antenna 12. The predetermined area may be determined according to the interference of the sensor 13 to the antenna 12 being less than a predetermined value. That is, the interference of the sensor 13 to the antenna 12 is small in the predetermined area. In other preferred embodiments, the predetermined area is differently set according to the structure of the antenna 12 and the structure of the sensor 13.
在本较佳实施例中,如果所述天线12的周围存在其他金属物体及/或不同特性和尺寸的器件时,会对天线12的设计带来比较大的不确定性,同时影响天线12的辐射效率。因此天线12所占用的区域尽量避免设计其他电路,从而降低其他电路对天线12性能的影响。In the preferred embodiment, if other metal objects and/or devices of different characteristics and sizes are present around the antenna 12, the design of the antenna 12 is relatively uncertain, and the antenna 12 is affected. Radiation efficiency. Therefore, the area occupied by the antenna 12 avoids designing other circuits as much as possible, thereby reducing the influence of other circuits on the performance of the antenna 12.
应说明的是,所述传感器13和所述天线12之间的相对位置并不局限于如图2所示上下关系,也可以是左右关系,重叠关系等。It should be noted that the relative position between the sensor 13 and the antenna 12 is not limited to the vertical relationship as shown in FIG. 2, and may be a left-right relationship, an overlapping relationship, or the like.
参见图5所示,为本发明第二较佳实施例的电路板200的分解图。与第一较佳实施例相比,所述第二较佳实施中的所述电路板200同样包括所述天线22、所述传感器23、所述天线接口24及所述传感器接口25。本实施例中与上述第一实施例中相同或相似的元件的类型和功能在此就不赘述了。所述电路板200包括第一层基板26、第二层基板27、以及连接导线28。Referring to Figure 5, there is shown an exploded view of a circuit board 200 in accordance with a second preferred embodiment of the present invention. The circuit board 200 of the second preferred embodiment also includes the antenna 22, the sensor 23, the antenna interface 24, and the sensor interface 25 as compared to the first preferred embodiment. The types and functions of the same or similar elements in the present embodiment as those in the above-described first embodiment will not be described herein. The circuit board 200 includes a first layer substrate 26, a second layer substrate 27, and connection wires 28.
在所述第二较佳实施例中,所述天线22同样以偶极子天线为例进行说明。在本较佳实施例中,所述天线22分为第一部分221和第二部分222,所述第一部分221与所述第二部分222分别设置在所述第一层基板26的正反侧面上。在一实施方式中,所述第二部分222可以是T型金属片,其可以通过金属过孔29机械连接和电连接所述第一部分221。在其他较佳实施例中,所述第一部分221也可以采用其他方式与其第二部分222实现电链接。In the second preferred embodiment, the antenna 22 is also described by taking a dipole antenna as an example. In the preferred embodiment, the antenna 22 is divided into a first portion 221 and a second portion 222. The first portion 221 and the second portion 222 are respectively disposed on the front and back sides of the first layer substrate 26. . In an embodiment, the second portion 222 can be a T-shaped metal sheet that can be mechanically and electrically connected to the first portion 221 through the metal vias 29. In other preferred embodiments, the first portion 221 can also be electrically linked to its second portion 222 in other manners.
所述天线接口24通过焊接的方式直接连接于所述天线22的一部分上,例如连接于所述第一部分221上。所述传感器接口25、所述天线接口24、所述第一部分221,以及所述传感器23均设置在所述第一层基板26的同一侧面上,参见图5所示,均设置于所述第一层基板26的上侧面上。所述第二部分222设置于所述第一层基板26的下侧面上。为了降低所述传感器23对所述天线22的影响,所述传感器23可以设置在远离所述天线22的所述第一层基板26的端部。所述连接导线28设置在所述第二层基板27的底层。通过将所述连接导线28设置在所述第二层基板27的底层,可以进一步地降低所述连接导线28在通电后对所述天线22造成的干扰。The antenna interface 24 is directly connected to a portion of the antenna 22 by soldering, for example, to the first portion 221. The sensor interface 25, the antenna interface 24, the first portion 221, and the sensor 23 are all disposed on the same side of the first layer substrate 26, as shown in FIG. On the upper side of a layer of substrate 26. The second portion 222 is disposed on a lower side of the first layer substrate 26. In order to reduce the influence of the sensor 23 on the antenna 22, the sensor 23 may be disposed at an end of the first layer substrate 26 remote from the antenna 22. The connecting wire 28 is disposed on the bottom layer of the second layer substrate 27. By disposing the connecting wire 28 on the bottom layer of the second layer substrate 27, the interference caused by the connecting wire 28 to the antenna 22 after being energized can be further reduced.
在本较佳实施例中,所述第一部分221主要用于作为辐射体,而所述第二部分222用于与所述天线接口24的阻抗匹配使用。所述第一部分221的电流大于所述第二部分222的电流,所述第二部分222的金属能够有效的将所述第一部分221和设置于底层的所述连接导线28分隔开来,这样能够降低所述第一部分221在所述连接导线28上感应出的电流,降低互耦,从而进一步降低了所述连接导线28对所述天线22整体性能的影响。In the preferred embodiment, the first portion 221 is primarily used as a radiator and the second portion 222 is used to match the impedance of the antenna interface 24. The current of the first portion 221 is greater than the current of the second portion 222, and the metal of the second portion 222 can effectively separate the first portion 221 from the connecting wire 28 disposed on the bottom layer, such that The current induced by the first portion 221 on the connecting wire 28 can be reduced, and the mutual coupling can be reduced, thereby further reducing the influence of the connecting wire 28 on the overall performance of the antenna 22.
所述传感器23通过所述连接导线28、所述第一层基板26及所述第二层基板27上的金属过孔29与所述传感器接口25电性连接。应说明的是,用于连接第一层基板26和第二层基板27的金属过孔29与用于连接第一部分221和第二部分222的金属过孔29可以是同一个过孔,也可以是不同的过孔,这可以根据实际需求进行相应的设置。The sensor 23 is electrically connected to the sensor interface 25 through the connecting wire 28, the first layer substrate 26 and the metal via 29 on the second layer substrate 27. It should be noted that the metal via 29 for connecting the first layer substrate 26 and the second layer substrate 27 and the metal via 29 for connecting the first portion 221 and the second portion 222 may be the same via hole or It is a different via, which can be set according to actual needs.
应说明的是,在上述第一实施例与第二实施例中,为了降低天线辐射处的射信号对传感器的干扰,所述电路板在设计时评估了天线与所述传感器各自的响应频率,以根据相互之间的响应来进行传感器外围电路的设计。在一实施方式中,所述电路板上设置有防干扰元件30,用于降低所述天线与所述传感器之间的干扰。在一实施例中,所述传感器的周围可以设置有防干扰元件30,所述防干扰元件30可以是退耦电容、磁珠及共模电感中的至少一种,以此来降低所述天线对传感器的干扰。在其他较佳实施例中,所述防干扰元件30也可以设置于所述传感器中(例如传感器的电源(未示出)处。当然,在其他较佳实施例中,所述传感器的电路布局和走线也可以适当的布局来降低辐射耦合。It should be noted that, in the foregoing first embodiment and the second embodiment, in order to reduce the interference of the radio signal on the sensor at the antenna radiation, the circuit board is designed to evaluate the respective response frequencies of the antenna and the sensor. The design of the sensor peripheral circuit is performed in accordance with the mutual response. In an embodiment, the circuit board is provided with an anti-interference element 30 for reducing interference between the antenna and the sensor. In an embodiment, an anti-interference component 30 may be disposed around the sensor, and the anti-interference component 30 may be at least one of a decoupling capacitor, a magnetic bead, and a common mode inductor, thereby reducing the antenna. Interference with the sensor. In other preferred embodiments, the interference preventing component 30 can also be disposed in the sensor (eg, a power source (not shown) of the sensor. Of course, in other preferred embodiments, the circuit layout of the sensor And the traces can also be properly laid out to reduce radiation coupling.
在一实施方式中,上述电路板可以应用于机器人、无人飞行器、无人车、无人船(图示未示出)等可移动电子装置,所述电路板也可以应用于智能设备(图示未示出)等任意适用的电子装置。In an embodiment, the circuit board can be applied to mobile electronic devices such as robots, unmanned aerial vehicles, unmanned vehicles, unmanned vehicles (not shown), and the circuit board can also be applied to smart devices (figure Any suitable electronic device, such as not shown).
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。The above is only the embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformation of the present invention and the contents of the drawings may be directly or indirectly applied to other related technologies. The fields are all included in the scope of patent protection of the present invention.
本专利文件披露的内容包含受版权保护的材料。该版权为版权所有人所有。版权所有人不反对任何人复制专利与商标局的官方记录和档案中所存在的该专利文件或者该专利披露。The disclosure of this patent document contains material that is subject to copyright protection. This copyright is the property of the copyright holder. The copyright owner has no objection to the reproduction of the patent document or the patent disclosure in the official records and files of the Patent and Trademark Office.

Claims (30)

  1. 一种电路板,其特征在于,该电路板包括:基板、天线及传感器,所述传感器和所述天线均设置于所述基板上,所述基板上还设置有防干扰元件,用于降低所述天线与所述传感器之间的干扰。A circuit board, comprising: a substrate, an antenna, and a sensor, wherein the sensor and the antenna are disposed on the substrate, and the substrate is further provided with an anti-interference component for reducing the Interference between the antenna and the sensor.
  2. 如权利要求1所述的电路板,其特征在于,所述传感器设置于与所述天线所在侧面不同的另一侧面上,所述传感器在所述基板上的位置限定在对所述天线的干扰小于预设值的预定区域内。The circuit board according to claim 1, wherein said sensor is disposed on a different side from a side on which said antenna is located, and a position of said sensor on said substrate is limited to interference with said antenna Within a predetermined area that is less than the preset value.
  3. 如权利要求1所述的电路板,其特征在于,所述电路板还包括与天线连接的天线接口,以及与所述传感器电性连接的传感器接口,所述天线接口通过同轴线或微带线与所述天线电性连接,以及所述传感器通过设置在所述基板上的电路与所述传感器接口电性连接。The circuit board according to claim 1, wherein said circuit board further comprises an antenna interface connected to the antenna, and a sensor interface electrically connected to said sensor, said antenna interface passing through a coaxial line or a microstrip A wire is electrically connected to the antenna, and the sensor is electrically connected to the sensor interface through a circuit disposed on the substrate.
  4. 如权利要求3所述的电路板,其特征在于,所述基板为多层结构,所述天线、天线接口以及所述传感器接口中至少二者设置于所述基板的同一层上或者不同层上。The circuit board according to claim 3, wherein the substrate is a multi-layer structure, and at least two of the antenna, the antenna interface, and the sensor interface are disposed on the same layer or on different layers of the substrate. .
  5. 如权利要求4所述的电路板,其特征在于,所述传感器与所述天线分别设置于所述基板的不同层上。The circuit board according to claim 4, wherein said sensor and said antenna are respectively disposed on different layers of said substrate.
  6. 如权利要求1所述的电路板,其特征在于,所述电路板包括天线接口、传感器接口及连接导线,以及所述基板包括第一层基板、第二层基板,所述天线包括第一部分和第二部分,所述第一部分及第二部分分别设置在所述第一层基板的正反侧面上,所述传感器接口、所述天线接口、所述天线的第一部分以及所述传感器均设置在所述第一层基板的同一侧面上,所述传感器在所述基板上的位置限定在对所述天线的干扰小于预设值的预定区域内;所述连接导线设置在所述第二层基板的底侧。The circuit board according to claim 1, wherein said circuit board comprises an antenna interface, a sensor interface, and a connecting wire, and said substrate comprises a first layer substrate, a second layer substrate, said antenna comprising a first portion and In a second part, the first portion and the second portion are respectively disposed on the front and back sides of the first layer substrate, and the sensor interface, the antenna interface, the first portion of the antenna, and the sensor are all disposed at The same side of the first layer substrate, the position of the sensor on the substrate is defined in a predetermined area where the interference to the antenna is less than a preset value; the connecting wire is disposed on the second layer substrate The bottom side.
  7. 如权利要求6所述的电路板,其特征在于,所述天线的第二部分由金属片构成,该第二部分与所述天线的第一部分连接,所述天线的第二部分用以降低所述第一部分与所述连接导线之间的互耦。The circuit board according to claim 6, wherein the second portion of the antenna is formed of a metal piece, the second portion is connected to the first portion of the antenna, and the second portion of the antenna is used to lower the The mutual coupling between the first portion and the connecting wire.
  8. 如权利要求7所述的电路板,其特征在于,所述天线的第二部分通过金属过孔与所述天线的第一部分连接。The circuit board of claim 7 wherein the second portion of the antenna is coupled to the first portion of the antenna by a metal via.
  9. 如权利要求6所述的电路板,其特征在于,所述传感器通过所述连接导线、和所述第一层基板及所述第二层基板上的金属过孔与所述传感器接口电性连接。The circuit board according to claim 6, wherein the sensor is electrically connected to the sensor interface through the connecting wire and the metal via on the first layer substrate and the second layer substrate .
  10. 如权利要求6所述的电路板,其特征在于,所述天线接口通过焊接的方式连接于所述天线的第一部分。The circuit board of claim 6 wherein said antenna interface is soldered to said first portion of said antenna.
  11. 如权利要求1所述的电路板,其特征在于,所述防干扰元件为退耦电容、磁珠及共模电感中的至少一种。The circuit board according to claim 1, wherein the interference preventing component is at least one of a decoupling capacitor, a magnetic bead, and a common mode inductor.
  12. 如权利要求10所述的电路板,其特征在于,所述防干扰元件设置于所述传感器的周围。The circuit board according to claim 10, wherein said interference preventing member is disposed around said sensor.
  13. 如权利要求1所述的电路板,其特征在于,所述天线为偶极子天线,以及所述传感器为指南针元器件。The circuit board of claim 1 wherein said antenna is a dipole antenna and said sensor is a compass component.
  14. 如权利要求1所述的电路板,其特征在于,所述天线远离所述传感器设置于所述基板上。The circuit board according to claim 1, wherein said antenna is disposed on said substrate away from said sensor.
  15. 如权利要求1所述的电路板,其特征在于,所述电路板应用于机器人、无人飞行器、无人船、或无人车。The circuit board of claim 1 wherein said circuit board is applied to a robot, an unmanned aerial vehicle, an unmanned vehicle, or an unmanned vehicle.
  16. 一种电子装置,其特征在于,该电子装置包括一电路板,该电路板包括:基板、天线及传感器,所述传感器和所述天线均设置于所述基板上,所述基板上还设置有防干扰元件,用于降低所述天线与所述传感器之间的干扰。An electronic device, comprising: a circuit board, the circuit board comprising: a substrate, an antenna and a sensor, wherein the sensor and the antenna are both disposed on the substrate, and the substrate is further provided with An interference preventing component for reducing interference between the antenna and the sensor.
  17. 如权利要求16所述的电子装置,其特征在于,所述传感器设置于与所述天线所在侧面不同的另一侧面上,所述传感器在所述基板上的位置限定在对所述天线的干扰小于预设值的预定区域内。The electronic device according to claim 16, wherein said sensor is disposed on another side different from a side on which said antenna is located, and a position of said sensor on said substrate is limited to interference with said antenna Within a predetermined area that is less than the preset value.
  18. 如权利要求16所述的电子装置,其特征在于,所述电路板还包括与天线连接的天线接口,以及与所述传感器电性连接的传感器接口,所述天线接口通过同轴线或微带线与所述天线电性连接,以及所述传感器通过设置在所述基板上的电路与所述传感器接口电性连接。The electronic device according to claim 16, wherein the circuit board further comprises an antenna interface connected to the antenna, and a sensor interface electrically connected to the sensor, the antenna interface passing through a coaxial line or a microstrip A wire is electrically connected to the antenna, and the sensor is electrically connected to the sensor interface through a circuit disposed on the substrate.
  19. 如权利要求18所述的电子装置,其特征在于,所述基板为多层结构,所述天线、天线接口以及所述传感器接口中至少二者设置于所述基板的同一层上或者不同的层上。The electronic device according to claim 18, wherein the substrate is a multi-layer structure, at least two of the antenna, the antenna interface and the sensor interface are disposed on the same layer of the substrate or different layers on.
  20. 如权利要求19所述的电子装置,其特征在于,所述传感器与所述天线分别设置于所述基板的不同层上。The electronic device according to claim 19, wherein said sensor and said antenna are respectively disposed on different layers of said substrate.
  21. 如权利要求16所述的电子装置,其特征在于,所述电路板包括天线接口、传感器接口及连接导线,以及所述基板包括第一层基板、第二层基板,所述天线包括第一部分和第二部分,所述第一部分及第二部分分别设置在所述第一层基板的正反侧面上,所述传感器接口、所述天线接口、所述天线的第一部分以及所述传感器均设置在所述第一层基板的同一侧面上,所述传感器在所述基板上的位置限定在对所述天线的干扰小于预设值的预定区域内;所述连接导线设置在所述第二层基板的底侧。The electronic device according to claim 16, wherein the circuit board comprises an antenna interface, a sensor interface, and a connecting wire, and the substrate comprises a first layer substrate and a second layer substrate, the antenna comprising a first portion and In a second part, the first portion and the second portion are respectively disposed on the front and back sides of the first layer substrate, and the sensor interface, the antenna interface, the first portion of the antenna, and the sensor are all disposed at The same side of the first layer substrate, the position of the sensor on the substrate is defined in a predetermined area where the interference to the antenna is less than a preset value; the connecting wire is disposed on the second layer substrate The bottom side.
  22. 如权利要求21所述的电子装置,其特征在于,所述天线的第二部分由金属片构成,该第二部分与所述天线的第一部分连接,所述天线的第二部分用以降低所述第一部分与所述连接导线之间的互耦。The electronic device according to claim 21, wherein the second portion of the antenna is formed of a metal piece, the second portion is connected to the first portion of the antenna, and the second portion of the antenna is used to lower the The mutual coupling between the first portion and the connecting wire.
  23. 如权利要求22所述的电子装置,其特征在于,所述天线的第二部分通过金属过孔与所述天线的第一部分连接。The electronic device of claim 22 wherein the second portion of the antenna is coupled to the first portion of the antenna via a metal via.
  24. 如权利要求21所述的电子装置,其特征在于,所述传感器通过所述连接导线、和所述第一层基板及所述第二层基板上的金属过孔与所述传感器接口电性连接。The electronic device according to claim 21, wherein the sensor is electrically connected to the sensor interface through the connecting wire and the metal via on the first layer substrate and the second layer substrate .
  25. 如权利要求21所述的电子装置,其特征在于,所述天线接口通过焊接的方式连接于所述天线的第一部分。The electronic device of claim 21 wherein said antenna interface is soldered to said first portion of said antenna.
  26. 如权利要求16所述的电子装置,其特征在于,所述防干扰元件为退耦电容、磁珠及共模电感中的至少一种。The electronic device according to claim 16, wherein the interference preventing component is at least one of a decoupling capacitor, a magnetic bead, and a common mode inductor.
  27. 如权利要求25所述的电子装置,其特征在于,所述防干扰元件设置于所述传感器周围。The electronic device according to claim 25, wherein said interference preventing member is disposed around said sensor.
  28. 如权利要求16所述的电子装置,其特征在于,所述天线为偶极子天线,以及所述传感器为指南针元器件。The electronic device of claim 16 wherein said antenna is a dipole antenna and said sensor is a compass component.
  29. 如权利要求16所述的电子装置,其特征在于,所述天线远离所述传感器设置于所述基板上。The electronic device according to claim 16, wherein said antenna is disposed on said substrate away from said sensor.
  30. 如权利要求16所述的电子装置,其特征在于,所述电子装置为机器人、无人飞行器、无人车或无人船。The electronic device of claim 16 wherein said electronic device is a robot, an unmanned aerial vehicle, an unmanned vehicle or an unmanned vehicle.
PCT/CN2015/099853 2015-12-30 2015-12-30 Circuit board and electronic device having same WO2017113184A1 (en)

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