WO2017096811A1 - 一种可进行功能扩展的pcb装置，模块板及方法 - Google Patents

一种可进行功能扩展的pcb装置，模块板及方法 Download PDF

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Publication number
WO2017096811A1
WO2017096811A1 PCT/CN2016/088580 CN2016088580W WO2017096811A1 WO 2017096811 A1 WO2017096811 A1 WO 2017096811A1 CN 2016088580 W CN2016088580 W CN 2016088580W WO 2017096811 A1 WO2017096811 A1 WO 2017096811A1
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Prior art keywords
module board
substrate
module
pcie interface
connector
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Ceased
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PCT/CN2016/088580
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English (en)
French (fr)
Inventor
侯晓明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Le Holdings Beijing Co Ltd
Leshi Zhixin Electronic Technology Tianjin Co Ltd
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Le Holdings Beijing Co Ltd
Leshi Zhixin Electronic Technology Tianjin Co Ltd
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Priority to US15/250,521 priority Critical patent/US20170168977A1/en
Publication of WO2017096811A1 publication Critical patent/WO2017096811A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/409—Mechanical coupling
    • G06F13/4095—Mechanical coupling in incremental bus architectures, e.g. bus stacks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

Definitions

  • the present application relates to the technical field of PCB design, and in particular, to a PCB device, a module board and a method capable of function expansion.
  • PCB Printed Circuit Board
  • Chinese name for printed circuit board, also known as printed circuit board, is an important electronic component, is the support of electronic components, is the carrier of electrical connection of electronic components.
  • the development and design of the product is usually realized through PCB design.
  • the inventors have found that at least the following problems exist in the prior art: the design and replacement of smart electrical equipment is now faster, even if the same platform is different in order to distinguish the high, medium and low third gears of the product.
  • the drawback of the motherboard is that the development of the design requires maintenance of multiple PCB designs. Once the product needs to be upgraded or changed, it can only be redesigned by changing the PCB.
  • the embodiments of the present application provide a PCB device, a module board, and a method for function expansion, which expand the function of the PCB design, reduce the workload of design and development, and the risk of purchasing materials, and design development. More flexible.
  • the embodiment itself provides a PCB device capable of function expansion, including a substrate for PCB design, and further includes:
  • the module board is connected to the substrate through the connector, and the module board and the substrate are signal-transmitted.
  • the connector includes a latest bus (PCIE) interface, and the module board and the substrate transmit signals through a private protocol through the PCIE interface.
  • PCIE latest bus
  • the PCIE interface transmits a data type signal by using a proprietary protocol. And control class signals.
  • the module board further includes: a screw positioning hole for fixing the module board to the substrate.
  • the two screw positioning holes are two, and the two screw positioning holes are located at two opposite corners of one side of the module board opposite to the PCIE interface.
  • a module board for function expansion is also provided, the module board is integrated with a performance improvement module, and the module board is connected to a substrate for PCB design through a connector, and the module board and the substrate pass through the connector Signal transmission.
  • the connector includes a PCIE interface, and the module board and the substrate transmit signals by using a proprietary protocol through the PCIE interface.
  • the PCIE interface transmits a data type signal and a control type signal using a proprietary protocol.
  • the module board further includes: a screw positioning hole for fixing the module board to the substrate.
  • the two screw positioning holes are two, and the two screw positioning holes are located at two opposite corners of one side of the module board opposite to the PCIE interface.
  • At least one module board of the integrated performance enhancement module is connected to the substrate through a connector, and the module board and the substrate are signaled through the connector.
  • the module board and the substrate are transmitted by using a proprietary protocol through a PCIE interface.
  • the PCIE interface transmits a data type signal and a control type signal using a proprietary protocol.
  • the module board of the present application integrates a performance improvement module, and the module board is connected to a substrate for PCB design through a connector, and the module board and the substrate are transmitted by the connector. Therefore, when the product needs to be upgraded or changed, the application can be extended by integrating the module board of the performance improvement module, without changing the PCB design of the substrate, reducing the workload of design development and the risk of purchasing the material, and design development. More flexible.
  • FIG. 1 is a schematic structural view of a PCB device capable of function expansion according to the present application.
  • FIG. 2 is a schematic structural diagram of a module board capable of performing function expansion according to the present application
  • FIG. 3 is a flow chart of a method for functionally expanding a PCB device according to the present application.
  • FIG. 4 is a schematic structural diagram of a specific application of a PCB device capable of function expansion according to the present application
  • FIG. 5 is a schematic diagram of signal definition for a specific application of a PCB device capable of function expansion.
  • the module board of the present application integrates a performance improvement module, and the module board is connected to a substrate for PCB design through a connector, and the module board and the substrate are transmitted by the connector. Therefore, when the product needs to be upgraded or changed, the application can be extended by integrating the module board of the performance improvement module, without changing the PCB design of the substrate, reducing the workload of design development and the risk of purchasing the material, and design development. More flexible.
  • a specific embodiment of the present application provides a PCB device capable of function expansion, including a substrate 11 for performing PCB design, and further includes:
  • At least one module board 12 the performance board is integrated on the module board 12.
  • the connector board 13 is connected to the substrate 11 through the connector 13, and the module board 12 and the substrate 11 are signal-transmitted.
  • the modular board of the module expands the function, eliminating the need to change the PCB design of the substrate, reducing the workload of design development and the risk of purchasing the material, making the design development more flexible.
  • the PCIE interface is a high-speed serial point-to-point dual-channel high-bandwidth transmission interface.
  • the connected devices allocate exclusive channel bandwidth and do not share bus bandwidth. They mainly support active power management, error reporting, end-to-end reliability transmission, hot swap and service. Quality (Quality of Service, QOS) and other functions.
  • the connector 13 of the present application includes a PCIE interface, and the module board 12 and the substrate 11 are connected through the PCIE interface.
  • the PCIE interface is generally used to transmit a PCIE signal.
  • the present application defines a data type signal and a control type signal transmitted between the PCIE interfaces by using a proprietary protocol, thereby implementing a relationship between the module board 12 and the substrate 11. Signal transmission.
  • the proprietary protocol is defined by one of ordinary skill in the art based on the performance enhancement module integrated by the module board 12.
  • the module board 12 further includes a screw positioning hole 121 for fixing the module board 12 to the substrate 11.
  • the two screw positioning holes 121 are located on the module board 12 opposite to the PCIE interface. The two sides of the opposite corners.
  • another embodiment of the present application provides a module board 21 for performing function expansion, the module board 21 is integrated with a performance improvement module, and the module board 21 is connected to the substrate 23 for PCB design through the connector 22.
  • the module board 21 and the substrate 23 are signal-transmitted through the connector 22.
  • the application can be extended by integrating the module board of the performance improvement module, without changing the PCB design of the substrate, reducing the workload of design development and the risk of purchasing the material, and design development. More flexible.
  • the PCIE interface is a high-speed serial point-to-point dual-channel high-bandwidth transmission interface.
  • the connected devices allocate exclusive channel bandwidth and do not share bus bandwidth. They mainly support active power management, error reporting, end-to-end reliability transmission, hot swap and service. Quality (QOS) and other functions.
  • QOS Quality (QOS) and other functions.
  • the connector 22 of the present application includes a PCIE interface, and the module board 21 and the substrate 23 are connected through the PCIE interface.
  • the PCIE interface is generally used to transmit a PCIE signal.
  • the data type signal and the control type signal transmitted between the module board 21 and the substrate 23 are defined by a proprietary protocol, thereby implementing the module board 21 and the Signal transmission between the substrates 23 is described.
  • the proprietary protocol is defined by one of ordinary skill in the art in accordance with the performance enhancement module integrated by the module board 21.
  • the module board 21 further includes a screw positioning hole 211 for fixing the module board 21 to the substrate 23.
  • the two screw positioning holes 211 are two, and the two screw positioning holes 211 are located on the module board 12 and the PCIE interface 221 Opposite sides of the two opposite corners.
  • FIG. 3 another embodiment of the present application provides a method for expanding a function of a PCB device, including:
  • the module board of the at least one integrated performance improvement module is connected to the substrate through a connector, so that the module board and the substrate are transmitted by the connector.
  • the application can be extended by integrating the module board of the performance improvement module, without changing the PCB design of the substrate, reducing the workload of design development and the risk of purchasing the material, and design development. More flexible.
  • the PCIE interface is a high-speed serial point-to-point dual-channel high-bandwidth transmission interface.
  • the connected devices allocate exclusive channel bandwidth and do not share bus bandwidth. They mainly support active power management, error reporting, end-to-end reliability transmission, hot swap and service. Quality (QOS) and other functions.
  • QOS Quality (QOS) and other functions.
  • the module board and the substrate of the present application are connected through the PCIE interface.
  • the PCIE interface is generally used to transmit a PCIE signal.
  • the present application defines a data type signal and a control type signal transmitted between the module board and the substrate through a proprietary protocol, thereby implementing the module board and the substrate. Signal transmission between.
  • the proprietary protocol is defined by one of ordinary skill in the art based on the performance enhancement module integrated by the module board.
  • the FRC enhancement module 411 (frame rate compensation chip) is integrated on the module board 41, and the FRC enhancement module 411 is configured as an enhancement of the video display.
  • the module board 41 is connected to the original substrate 42 through the PCIE interface 43, which defines a proprietary protocol, as shown in FIG. Thereby, the transmission of the LVDS, VB1 video signal and the control type signal between the module board 41 and the original substrate 42 is realized.
  • the module board 41 is reliably fixed to the substrate 42 through the PCIE interface 43 and the two screw positioning holes 412.
  • the output interface of the FRC enhancement module 411 is a standard 51pin VB1 interface, which is set to connect to an external display.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

提供一种可进行功能扩展的PCB装置，模块板及方法，该PCB装置包括进行PCB设计的基板（11），还包括：至少一模块板（12），模块板（12）上集成性能提升模块；连接器（13），该模块板（12）通过该连接器（13）连接该基板（11），令该模块板（12）和该基板（11）进行信号传输。由此对PCB设计进行功能扩展，减少了设计开发的工作量和采购呆料的风险，令设计开发更加灵活。

Description

一种可进行功能扩展的PCB装置，模块板及方法
本申请要求于2015年12月9日提交中国专利局、申请号为2015109193381，发明名称为“一种可进行功能扩展的PCB装置，模块板及方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及PCB设计技术领域，尤其涉及一种可进行功能扩展的PCB装置，模块板及方法。
背景技术
PCB(Printed Circuit Board)，中文名称为印制电路板，又称印刷线路板，是重要的电子部件，是电子元器件的支撑体，是电子元器件电气连接的载体。在产品的开发过程中，通常通过PCB设计来实现产品的开发设计。
在实现本申请过程中，发明人发现现有技术中至少存在如下问题：现在智能电器设备的设计更新换代较快，即使同一平台为了区分产品高、中、低三挡，通常也会做成不同方案的主板，这样带来的弊端是开发设计需要维护多个PCB设计。一旦产品需要进行升级或者变更，只能通过更改PCB的方式重新进行设计。
因此，如何对PCB设计进行功能扩展，成为现有技术中亟需解决的技术问题。
发明内容
有鉴于此，本申请实施例提供一种可进行功能扩展的PCB装置，模块板及方法，其对PCB设计进行功能扩展，减少了设计开发的工作量和采购呆料的风险，，令设计开发更加灵活。
本身请实施例提供一种可进行功能扩展的PCB装置，包括进行PCB设计的基板，还包括：
至少一模块板，所述模块板上集成性能提升模块；
连接器，所述模块板通过所述连接器连接所述基板，令所述模块板和所述基板进行信号传输。
在本申请一具体实施例中，所述连接器包括最新总线(PCIE)接口，所述模块板和所述基板通过所述PCIE接口使用私有协议进行信号传输。
在本申请一具体实施例中，所述PCIE接口使用私有协议传输数据类信号 和控制类信号。
在本申请一具体实施例中，所述模块板还包括：将所述模块板固定至所述基板上的螺丝定位孔。
在本申请一具体实施例中，所述螺丝定位孔为两个，且所述两个螺丝定位孔位于所述模块板上与所述PCIE接口相对的一边的两个相对的角上。
本身请还提供一种进行功能扩展的模块板，所述模块板集成性能提升模块，且所述模块板通过连接器连接进行PCB设计的基板，所述模块板和所述基板通过所述连接器进行信号传输。
在本申请一具体实施例中，所述连接器包括PCIE接口，所述模块板和所述基板通过所述PCIE接口使用私有协议进行信号传输。
在本申请一具体实施例中，所述PCIE接口使用私有协议传输数据类信号和控制类信号。
在本申请一具体实施例中，所述模块板还包括：将所述模块板固定至所述基板的螺丝定位孔。
在本申请一具体实施例中，所述螺丝定位孔为两个，且所述两个螺丝定位孔位于所述模块板上与所述PCIE接口相对的一边的两个相对的角上。
本身请还提供一种对PCB装置进行功能扩展的方法，包括：
至少一集成性能提升模块的模块板通过连接器连接基板，令所述模块板和所述基板通过所述连接器进行信号传输。
在本申请一具体实施例中，所述模块板和所述基板通过PCIE接口使用私有协议进行信号传输。
在本申请一具体实施例中，所述PCIE接口使用私有协议传输数据类信号和控制类信号。
由以上技术方案可见，本申请模块板集成性能提升模块，且所述模块板通过连接器连接进行PCB设计的基板，所述模块板和所述基板通过所述连接器进行信号传输。因此，本申请在产品需要进行升级或者变更时，可以通过集成性能提升模块的模块板进行功能扩展，无需更改基板的PCB设计，减少了设计开发的工作量和采购呆料的风险，令设计开发更加灵活。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实 施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请中记载的一些实施例，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。
图1是本申请一种可进行功能扩展的PCB装置的结构示意图；
图2是本申请一种可进行功能扩展的模块板的结构示意图；
图3是本申请一种对PCB装置进行功能扩展的方法的流程图；
图4是本申请一种可进行功能扩展的PCB装置的具体应用的结构示意图；
图5是本申请一种可进行功能扩展的PCB装置的具体应用的信号定义原理图。
具体实施方式
本申请模块板集成性能提升模块，且所述模块板通过连接器连接进行PCB设计的基板，所述模块板和所述基板通过所述连接器进行信号传输。因此，本申请在产品需要进行升级或者变更时，可以通过集成性能提升模块的模块板进行功能扩展，无需更改基板的PCB设计，减少了设计开发的工作量和采购呆料的风险，令设计开发更加灵活。
当然，实施本申请的任一技术方案必不一定需要同时达到以上的所有优点。
为了使本领域的人员更好地理解本申请中的技术方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员所获得的所有其他实施例，都应当属于本申请保护的范围。
下面结合本申请附图具体地说明本申请具体实现。
参见图1，本申请一具体实施例提供一种可进行功能扩展的PCB装置，包括进行PCB设计的基板11，还包括：
至少一模块板12，所述模块板12上集成性能提升模块。
连接器13，所述模块板12通过所述连接器13连接所述基板11，令所述模块板12和所述基板11进行信号传输。
因此，本申请在产品需要进行升级或者变更时，可以通过集成性能提升 模块的模块板进行功能扩展，无需更改基板的PCB设计，减少了设计开发的工作量和采购呆料的风险，令设计开发更加灵活。
PCIE接口属于高速串行点对点双通道高带宽传输接口，所连接的设备分配独享通道带宽，不共享总线带宽，主要支持主动电源管理，错误报告，端对端的可靠性传输，热插拔以及服务质量(Quality of Service，QOS)等功能。
由于PCIE接口具有上述优点，本申请所述连接器13包括PCIE接口，所述模块板12和所述基板11通过所述PCIE接口连接。
而PCIE接口通常用来传输PCIE信号，本申请通过私有协议对所述PCIE接口之间传输的数据类信号和控制类信号进行了定义，从而实现所述模块板12和所述基板11之间的信号传输。
所述私有协议由本领域普通技术人员根据所述模块板12所集成的性能提升模块来进行定义。
这样，当产品需要进行升级或者变更时，无需变更基板，仅通过更换集成不同性能提升模块的模块板来实现产品的高、中、低的配置，减少了设计开发的工作量和采购呆料的风险，令设计开发更加灵活简便。
在本申请一具体实现中，所述模块板12还包括将所述模块板12固定至所述基板11上的螺丝定位孔121。
为了保证所述模块板12固定在所述基板11上的可靠性，所述螺丝定位孔121为两个，且所述两个螺丝定位孔121位于所述模块板12上与所述PCIE接口相对的一边的两个相对的角上。
参见图2，本申请另一具体实施例提供一种进行功能扩展的模块板21，所述模块板21集成性能提升模块，且所述模块板21通过连接器22连接进行PCB设计的基板23，所述模块板21和所述基板23通过所述连接器22进行信号传输。
因此，本申请在产品需要进行升级或者变更时，可以通过集成性能提升模块的模块板进行功能扩展，无需更改基板的PCB设计，减少了设计开发的工作量和采购呆料的风险，令设计开发更加灵活。
PCIE接口属于高速串行点对点双通道高带宽传输接口，所连接的设备分配独享通道带宽，不共享总线带宽，主要支持主动电源管理，错误报告，端对端的可靠性传输，热插拔以及服务质量(QOS)等功能。
由于PCIE接口具有上述优点，本申请所述连接器22包括PCIE接口，所述模块板21和所述基板23通过所述PCIE接口连接。
而PCIE接口通常用来传输PCIE信号，本申请通过私有协议对所述模块板21和所述基板23之间传输的数据类信号和控制类信号进行了定义，从而实现所述模块板21和所述基板23之间的信号传输。
所述私有协议由本领域普通技术人员根据所述模块板21所集成的性能提升模块来进行定义。
这样，当产品需要进行升级或者变更时，无需变更基板，仅通过更换集成不同性能提升模块的模块板来实现产品的高、中、低的配置，减少了设计开发的工作量和采购呆料的风险，令设计开发更加灵活简便。
在本申请一具体实现中，所述模块板21还包括将所述模块板21固定至所述基板23上的螺丝定位孔211。
为了保证所述模块板21固定在所述基板23上的可靠性，所述螺丝定位孔211为两个，且所述两个螺丝定位孔211位于所述模块板12上与所述PCIE接口221相对的一边的两个相对的角上。
参见图3，本申请另一具体实施例提供一种对PCB装置进行功能扩展的方法，包括：
S1、至少一集成性能提升模块的模块板通过连接器连接基板，令所述模块板和所述基板通过所述连接器进行信号传输。
因此，本申请在产品需要进行升级或者变更时，可以通过集成性能提升模块的模块板进行功能扩展，无需更改基板的PCB设计，减少了设计开发的工作量和采购呆料的风险，令设计开发更加灵活。
PCIE接口属于高速串行点对点双通道高带宽传输接口，所连接的设备分配独享通道带宽，不共享总线带宽，主要支持主动电源管理，错误报告，端对端的可靠性传输，热插拔以及服务质量(QOS)等功能。
由于PCIE接口具有上述优点，本申请所述模块板和所述基板通过所述PCIE接口连接。
而PCIE接口通常用来传输PCIE信号，本申请通过私有协议对所述模块板和所述基板之间传输的数据类信号和控制类信号进行了定义，从而实现所述模块板和所述基板之间的信号传输。
所述私有协议由本领域普通技术人员根据所述模块板所集成的性能提升模块来进行定义。
这样，当产品需要进行升级或者变更时，无需变更基板，仅通过更换集成不同性能提升模块的模块板来实现产品的高、中、低的配置，减少了设计开发的工作量和采购呆料的风险，令设计开发更加灵活简便。
下面通过一具体应用场景来说明本申请实现。
在多数运动画面上，由于显示帧率的丢失，造成画面卡顿或者拖尾等问题。通常通过增加FRC增强模块(帧率补偿芯片)，增强显示效果，使画面更加流畅，提升产品性能。
当智能电视产品需要进行上述产品性能升级时，参看图4，模块板41上集成FRC增强模块411(帧率补偿芯片)，FRC增强模块411配置为视频显示的增强。
模块板41通过PCIE接口43与原有的基板42连接，所述PCIE接口43定义了私有协议，如图5所示。从而，实现模块板41和原有的基板42之间LVDS、VB1视频信号及控制类信号的传输。
所述模块板41通过PCIE接口43和两个螺丝定位孔412可靠的固定在所述基板42上。所述FRC增强模块411输出接口处是标准的51pin VB1接口，设置为连接外部显示屏。
这样，当智能电视产品需要增强显示效果，使画面更加流畅，提升产品性能时，无需变更基板，仅通过更换集成FRC增强模块的模块板来实现产品的升级。从而，无需重新进行基板的PCB设计开发，令设计开发更加灵活简便。
尽管已描述了本申请的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本申请范围的所有变更和修改。显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (13)

  1. 一种可进行功能扩展的PCB装置，包括进行PCB设计的基板，其特征在于，还包括：
    至少一模块板，所述模块板上集成性能提升模块；
    连接器，所述模块板通过所述连接器连接所述基板，令所述模块板和所述基板进行信号传输。
  2. 根据权利要求1所述的装置，其特征在于，所述连接器包括PCIE接口，所述模块板和所述基板通过所述PCIE接口使用私有协议进行信号传输。
  3. 根据权利要求2所述的装置，其特征在于，所述PCIE接口使用私有协议传输数据类信号和控制类信号。
  4. 根据权利要求1所述的装置，其特征在于，所述模块板还包括：将所述模块板固定至所述基板上的螺丝定位孔。
  5. 根据权利要求4所述的装置，其特征在于，所述螺丝定位孔为两个，且所述两个螺丝定位孔位于所述模块板上与所述PCIE接口相对的一边的两个相对的角上。
  6. 一种进行功能扩展的模块板，其特征在于，所述模块板集成性能提升模块，且所述模块板通过连接器连接进行PCB设计的基板，所述模块板和所述基板通过所述连接器进行信号传输。
  7. 根据权利要求6所述的模块板，其特征在于，所述连接器包括PCIE接口，所述模块板和所述基板通过所述PCIE接口使用私有协议进行信号传输。
  8. 根据权利要求7所述的模块板，其特征在于，所述PCIE接口使用私有协议传输数据类信号和控制类信号。
  9. 根据权利要求6所述的模块板，其特征在于，所述模块板还包括：将所述模块板固定至所述基板的螺丝定位孔。
  10. 根据权利要求9所述的模块板，其特征在于，所述螺丝定位孔为两个，且所述两个螺丝定位孔位于所述模块板上与所述PCIE接口相对的一边的两个相对的角上。
  11. 一种对PCB装置进行功能扩展的方法，其特征在于，包括：
    至少一集成性能提升模块的模块板通过连接器连接基板，令所述模块板 和所述基板通过所述连接器进行信号传输。
  12. 根据权利要求11所述的方法，其特征在于，所述模块板和所述基板通过PCIE接口使用私有协议进行信号传输。
  13. 根据权利要求12所述的方法，其特征在于，所述PCIE接口使用私有协议传输数据类信号和控制类信号。
PCT/CN2016/088580 2015-12-09 2016-07-05 一种可进行功能扩展的pcb装置，模块板及方法 Ceased WO2017096811A1 (zh)

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