WO2017089119A1 - Dispositif de filtration de la tension d'alimentation d'un bloc électrique, en particulier dans un composant de véhicule automobile - Google Patents

Dispositif de filtration de la tension d'alimentation d'un bloc électrique, en particulier dans un composant de véhicule automobile Download PDF

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Publication number
WO2017089119A1
WO2017089119A1 PCT/EP2016/076969 EP2016076969W WO2017089119A1 WO 2017089119 A1 WO2017089119 A1 WO 2017089119A1 EP 2016076969 W EP2016076969 W EP 2016076969W WO 2017089119 A1 WO2017089119 A1 WO 2017089119A1
Authority
WO
WIPO (PCT)
Prior art keywords
smd
circuit board
printed circuit
suppression
interference suppression
Prior art date
Application number
PCT/EP2016/076969
Other languages
German (de)
English (en)
Inventor
Ralph Trapp
Original Assignee
Behr-Hella Thermocontrol Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Behr-Hella Thermocontrol Gmbh filed Critical Behr-Hella Thermocontrol Gmbh
Publication of WO2017089119A1 publication Critical patent/WO2017089119A1/fr

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233Filters, inductors or a magnetic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/1003Non-printed inductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10545Related components mounted on both sides of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045Protection against vibrations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a device for filtering the supply voltage of an electrical assembly, in particular an assembly in a vehicle component.
  • the invention relates to a device for suppressing the noise in EMI (Electromagnetic Interference) filters for filtering the supply voltage of electrical / electronic assemblies superimposed noise AC voltages.
  • EMI Electromagnetic Interference
  • the invention relates to the use of vibrating during operation SMD Entstörbauteilettin for the greatest possible suppression of vibration noise in the operation of a device for filtering conducted interference signals of the supply voltage of an electrical device.
  • EMI filters with which the supply lines are connected in the input area of a module.
  • EMI filters are usually a network of impedances that are interconnected in a specific way. Usual is z. B. a so-called ⁇ -structure with an inductance in the longitudinal branch and two capacitances at the input and the output of the ⁇ -structure as shown in Fig. 1.
  • the desired filter behavior can also be realized by other circuit groups (T-circuit or combinations with semiconductor components). Due to their properties (in particular price, impedance, etc.), ceramic capacitors in the input area are often used as the capacitances of such filter circuits.
  • the design is usually suitable for surface mounting (SMT Surface Mounting Technology).
  • SMT Surface Mounting Technology A disadvantage of this component technology is that the corresponding SMD components (Surface Mounted Device) can be set into mechanical oscillations with alternating components in the supply voltage. The reason for this is the inverse piezoelectric effect, which alternately leads to a contraction and an elongation of the component.
  • DE-T-699 37 677 and DE-A-100 19 461 show two suppression components on opposite sides of a circuit board. This procedure is carried out in the prior art but not with the aim of noise reduction. It is not mentioned in both documents that the suppression components vibrate during operation.
  • the object of the invention is to provide a device for filtering conducted interference signals of the supply voltage of an electrical device, in particular a vehicle component, wherein in the device noise developments are largely suppressed.
  • the invention provides the use of vibrating during operation SMD suppression device elements for the greatest possible suppression of vibration noise in the operation of a device for filtering conducted interference signals of the supply
  • the one SMD suppression component element is disposed on the one main side of the printed circuit board and the other SMD suppression component element on the other main side of the printed circuit board, facing each other and aligned with each other when viewing the printed circuit board towards one of the two main sides.
  • the SMD component elements can serve to realize various electrical parameters of the device according to the invention.
  • SMD capacitors and in particular SMD ceramic capacitors are installed.
  • the invention is not limited to SMD components.
  • the invention can in principle also be used with the use of wired components, especially if the wired components come in touching contact with the printed circuit board. This may be the case due to the demands on, for example, low heights of printed circuit boards.
  • FIG. 1 shows the circuit concept for a conventional, on the input side of an electronic or electrical assembly to be used EMI filter with ⁇ -structure
  • FIG. 2 shows a circuit realization of the replacement of an interference suppression capacitor by two suppression capacitors connected in parallel, each with half the capacity of the suppression capacitor to be replaced,
  • Fig. 3 shows the vibration behavior of a printed circuit board at one side on this attached, alternately contractions and expansions exporting SMD ceramic capacitor, and
  • Fig. 4 is a schematic representation of the inventive approach of the arrangement of two SMD component elements opposite to the two main side surfaces of a printed circuit board.
  • FIG. 1 shows a known circuit of an EMI filter 10 in ⁇ -structure.
  • the EMI filter 10 has a longitudinal inductance L and two (transverse) capacitors CA and CB.
  • the EMI filter has an SMD suppression component 14 in the form of a ceramic capacitor C.
  • SMD components lie flat on a printed circuit board, which is disadvantageous in so far as the introduction of vibrations of an SMD component is favored in the printed circuit board.
  • the function of the SMD suppression component 14 is now realized by two SMD suppression component elements 16, 18, which are likewise designed as capacitors. These two (equivalent) capacitors C1, C2 are connected in parallel, ie each have a capacity which is 50% of the capacity of the SMD suppression component 14.
  • the invention can also be described alternatively by one of the following feature groups, wherein the feature groups can be combined with each other and individual features of a feature group with one or more features of one or more other feature groups and / or one or more of the embodiments described above can be combined.
  • At least one electrical or electronic SMD suppression component 14 which has an interference suppression function and / or which contributes to a suppression function
  • a printed circuit board 22 having two main sides 20, 24 on which the SMD suppression component 14 can be positioned as part of an electrical circuit
  • suppression function to be implemented by the SMD suppression component 14 is replaced by two SMD suppression component elements 16, 18 which are electrically connected to one another, and
  • the one SMD suppression element element 16, 18 is arranged on the one main side 20, 24 of the printed circuit board 22 and the other SMD suppression element element 16, 18 is arranged on the other main side 20, 24 of the printed circuit board 22, facing each other and when viewing the printed circuit board 22 in the direction of one of the two main sides 20,24 aligned.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Filters And Equalizers (AREA)

Abstract

L'invention concerne un dispositif de filtration de la tension d'alimentation d'un bloc électrique, en particulier dans un composant de véhicule automobile, lequel dispositif est muni d'au moins un composant électrique ou électronique de déparasitage monté en surface (14), ayant une fonction de déparasitage et/ou contribuant à une fonction de déparasitage, et d'une carte de circuits imprimés (22) qui comporte deux côtés principaux (20, 24) et sur laquelle le composant de déparasitage monté en surface (14) peut être positionnée en tant que partie d'un circuit électrique. La fonction de déparasitage que doit réaliser le composant de déparasitage monté en surface (14) est remplacée par deux éléments (16, 18) du composant de déparasitage monté en surface (lesquels ont sensiblement une configuration identique) qui sont reliés électriquement entre eux. L'un des éléments (16, 18) est disposé sur l'un des côtés principaux (20, 24) de la carte de circuits imprimés (22) et l'autre élément (16, 18) est disposé sur l'autre côté principal (20, 24) de la carte de circuits imprimés (22), à savoir à l'opposé l'un de l'autre et en alignement l'un avec l'autre lorsque l'on regarde la carte de circuits imprimés (22) en direction de l'un des deux côtés principaux (20, 24).
PCT/EP2016/076969 2015-11-23 2016-11-08 Dispositif de filtration de la tension d'alimentation d'un bloc électrique, en particulier dans un composant de véhicule automobile WO2017089119A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015223029 2015-11-23
DE102015223029.5 2015-11-23

Publications (1)

Publication Number Publication Date
WO2017089119A1 true WO2017089119A1 (fr) 2017-06-01

Family

ID=57394533

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/076969 WO2017089119A1 (fr) 2015-11-23 2016-11-08 Dispositif de filtration de la tension d'alimentation d'un bloc électrique, en particulier dans un composant de véhicule automobile

Country Status (1)

Country Link
WO (1) WO2017089119A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10019461A1 (de) 1999-04-27 2000-11-02 Fuji Electric Co Ltd Entstörfilter
US6304425B1 (en) * 1998-12-09 2001-10-16 Taiyo Yuden Co., Ltd. Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof
DE69937677T2 (de) 1998-04-07 2008-11-20 X2Y Attenuators, L.L.C. Bauelementeträger
WO2014035929A1 (fr) * 2012-08-30 2014-03-06 Allison Transmission, Inc. Procédé et système pour la réduction de bruit sonore et/ou électrique provenant de condensateurs excités électriquement ou mécaniquement

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69937677T2 (de) 1998-04-07 2008-11-20 X2Y Attenuators, L.L.C. Bauelementeträger
US6304425B1 (en) * 1998-12-09 2001-10-16 Taiyo Yuden Co., Ltd. Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof
DE10019461A1 (de) 1999-04-27 2000-11-02 Fuji Electric Co Ltd Entstörfilter
WO2014035929A1 (fr) * 2012-08-30 2014-03-06 Allison Transmission, Inc. Procédé et système pour la réduction de bruit sonore et/ou électrique provenant de condensateurs excités électriquement ou mécaniquement

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