WO2017075881A1 - 一种微型化的电子设备 - Google Patents

一种微型化的电子设备 Download PDF

Info

Publication number
WO2017075881A1
WO2017075881A1 PCT/CN2015/099031 CN2015099031W WO2017075881A1 WO 2017075881 A1 WO2017075881 A1 WO 2017075881A1 CN 2015099031 W CN2015099031 W CN 2015099031W WO 2017075881 A1 WO2017075881 A1 WO 2017075881A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
substrate
electrode
cover plate
contact electrode
Prior art date
Application number
PCT/CN2015/099031
Other languages
English (en)
French (fr)
Inventor
陆舟
于华章
Original Assignee
飞天诚信科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 飞天诚信科技股份有限公司 filed Critical 飞天诚信科技股份有限公司
Priority to EP15907723.9A priority Critical patent/EP3373397B1/en
Priority to US15/533,774 priority patent/US10211561B2/en
Publication of WO2017075881A1 publication Critical patent/WO2017075881A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
    • H05K5/0278—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces of USB type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement

Definitions

  • the invention relates to a miniaturized electronic device, which is an electronic device with a substrate at a plugged portion, which can be used in the field of communication, various computer or electronic instrument technologies, and more particularly to an electronic device having a USB connector.
  • an electronic device having a USB connector is usually composed of a USB connector, an electronic circuit inside the casing, and other functional areas (such as buttons) on the casing, and has a large volume, which is disadvantageous for carrying and storing the electronic device. It is unable to meet the increasing demands of people for the portability of electronic devices.
  • An object of the present invention is to provide an electronic device comprising a substrate and a cover plate, and the electronic device thus formed is a USB connector, and further includes an electronic circuit, which reduces the volume of the electronic device and achieves a portable, compact and practical effect. To enhance the user experience.
  • An electronic device provided by the present invention includes: a substrate and a cover;
  • a first electronic circuit and a first contact electrode Disposed on the substrate with a first electronic circuit and a first contact electrode, the first electronic circuit and the first contact electrode being electrically connected;
  • the cover plate is closed on the substrate, and the cover plate and the substrate have an accommodation space, and the accommodation space accommodates the first electronic circuit.
  • the substrate is a printed circuit board.
  • the first contact electrode is connected to a corresponding one of the USB interfaces.
  • the first electronic circuit and the first contact electrode are respectively located on the front and back sides of the substrate, and the cover plate is covered on a side of the substrate having the first electronic circuit.
  • the cover is covered on the substrate by fastening, bonding or snapping.
  • a second contact electrode is further disposed on the substrate, the second contact electrode and the first electronic circuit are electrically connected; the substrate includes a first area and a second area, when the electronic device is inserted into the USB In the interface, the first area is located in the USB interface, the second contact electrode is located in the second area, and the second contact electrode is a touch button.
  • the second contact electrode is located on a side of the substrate.
  • the cover plate is a printed circuit board
  • a second electronic circuit is disposed on the cover plate, and the second electronic circuit is connected to the first electronic circuit on the substrate, the second electronic A line is located in the accommodation space between the cover plate and the substrate.
  • a tampering mechanism is further disposed between the substrate and the cover plate, the tampering mechanism is connected to the substrate and the cover plate, and the tampering mechanism is located at the cover plate and the substrate In the accommodation space between.
  • the substrate has a first through hole
  • the cover plate has a second through hole
  • the second through hole penetrates the first through hole
  • a support plate is further included between the substrate and the cover plate, the support plate is connected to the substrate and the cover plate, the support plate is an annular support plate, the support plate, the substrate And the cover plate constitutes the accommodation space.
  • the support plate has a third through hole, and the third through hole penetrates the second through hole and the first through hole.
  • the electronic device has a width of 11.95 mm to 12.05 mm, and the thickness of the electronic device is 2.4mm to 2.5mm.
  • the electronic device has a width of 12 mm and the electronic device has a thickness of 2.45 mm.
  • the first contact electrode comprises four non-connected electrodes, which are respectively a first electrode, a second electrode, a third electrode and a fourth electrode.
  • each of the first contact electrodes has a width of 0.95 mm to 1.05 mm; a distance between the first electrode and the second electrode is 2.45 mm to 2.55 mm; the second electrode and the second electrode The distance between the third electrodes is 1.95 mm to 2.05 mm; the distance between the third electrode and the fourth electrode is 2.45 mm to 2.55mm.
  • the invention has the following advantages:
  • the invention provides an electronic device comprising a substrate and a cover plate, and the electronic circuit is accommodated through the receiving space between the cover plate and the substrate, and the electronic device thus formed is a USB connector, which reduces the volume of the electronic device and reaches Portable, compact, and practical effects enhance the user experience.
  • FIG. 1 and FIG. 2 are schematic diagrams of an electronic device according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of an electronic device according to an embodiment of the present invention.
  • FIG. 4 to FIG. 6 are schematic diagrams showing a substrate 101 of an electronic device according to an embodiment of the present invention.
  • FIG. 7 and FIG. 8 are schematic diagrams of a cover plate 102 of an electronic device according to an embodiment of the present invention.
  • FIG. 9 to FIG. 12 are schematic diagrams showing a second contact electrode 101-3 of an electronic device according to an embodiment of the present invention.
  • FIG. 13 is a schematic diagram of a cover 102 of an electronic device according to an embodiment of the present invention.
  • FIG. 14 is a cross-sectional view of an electronic device according to an embodiment of the present invention.
  • FIG. 16 are schematic diagrams of still another electronic device according to an embodiment of the present invention.
  • FIG. 17 is a schematic diagram of still another electronic device according to an embodiment of the present invention.
  • FIG. 18 and FIG. 19 are schematic diagrams of another electronic device according to an embodiment of the present invention.
  • An embodiment of the present invention provides an electronic device, as shown in FIG. 1 to FIG. 3, comprising: a substrate 101 and a cover plate 102;
  • a first electronic circuit 101-1 and a first contact electrode 101-2 are disposed on the substrate 101, and the first electronic circuit 101-1 and the first contact electrode 101-2 are electrically connected;
  • the substrate 101 is a PCB (Printed Circuit) Board, printed circuit board); when the electronic device is inserted into the USB interface, the first contact electrode 101-2 is connected to the corresponding electrode of the USB interface;
  • PCB Print Circuit
  • the first contact electrode 101-2 includes four non-connected electrodes, which are respectively a first electrode, a second electrode, a third electrode, and a fourth electrode, and each electrode has a width of 0.95 mm to 1.05 mm;
  • the distance between one electrode and the second electrode (the distance between the center line of the first electrode in the direction of insertion of the USB interface and the center line of the second electrode in the direction of insertion of the USB interface) is 2.45 mm to 2.55 mm;
  • the second electrode The distance from the third electrode (the distance between the center line of the second electrode in the direction in which the USB interface is inserted and the center line of the third electrode in the direction in which the USB interface is inserted) is 1.95 mm to 2.05 mm;
  • the third electrode and the third electrode The spacing between the four electrodes (the distance between the center line of the third electrode in the direction in which the USB interface is inserted and the center line of the fourth electrode in the direction in which the USB interface is inserted) is 2.45 mm to 2.55 mm; the first electrode
  • the cover plate 102 is covered on the substrate 101, and the receiving space 103 is received between the cover plate 102 and the substrate 101.
  • the receiving space 103 can accommodate the first electronic circuit 101-1 on the substrate 101, as shown in FIG. 3;
  • the substrate 101 is disposed with a first electronic circuit 101-1 on one side and a first contact electrode 101-2, that is, a first electronic circuit 101-1 and a first contact electrode. 101-2 are respectively located on the front and back sides of the substrate 101, and the cover plate 102 is covered on the side of the substrate 101 having the first electronic circuit 101-1, and the cover plate 102 is as shown in FIG. 7 and FIG.
  • the cover plate 102 is covered on the substrate 101, and the cover manner includes, but is not limited to, fastening, bonding or snapping;
  • a second contact electrode 101-3 is further disposed on the substrate 101, and the second contact electrode 101-3 is electrically connected to the first electronic circuit 101-1; the substrate 101 includes the first region.
  • the second area when the electronic device is inserted into the USB interface, the first area is located in the USB interface, the second contact electrode 101-3 is located in the second area of the electronic device, and the second contact electrode 101-3 can be used as a touch button.
  • the second contact electrode 101-3 is exposed outside the USB interface;
  • the second contact electrode 101-3 is located on the side of the substrate 101; the first region may include the first electronic circuit 101-1 and the first contact electrode 101-2;
  • the cover 102 is a PCB (Printed Circuit) Board, printed circuit board), one side of the cover plate 102 is arranged with a second electronic circuit 102-1, and the first electronic circuit 102-1 and the first electronic circuit on the substrate 101 101-1 is connected, and the second electronic circuit 102-1 is located in the accommodating space 103 between the cover plate 102 and the substrate 101, as shown in FIG. 13 and FIG. 14;
  • PCB Print Circuit
  • a tamper-proof mechanism 104 may be disposed between the substrate 101 and the cover plate 102.
  • the tamper-proof mechanism 104 is connected to the substrate 101 and the cover plate 102, and the tamper-proof mechanism 104 is located between the cover plate 102 and the substrate 101. 103, as shown in FIG. 14;
  • a support plate 105 may be further included between the substrate 101 and the cover plate 102.
  • the support plate 105 is connected to the substrate 101 and the cover plate 102.
  • the support plate 105 is an annular support plate, and the support plate 105, the substrate 101 and the cover plate 102 are connected.
  • the composition accommodating space 103 is as shown in FIGS. 15 to 16;
  • the substrate 101 has a first through hole 106; the first through hole 106 can be used for a lanyard;
  • the first through hole 106 is located at an edge of the substrate 101;
  • the cover plate 102 has a second through hole 107, and the second through hole 107 penetrates through the first through hole 106; the second through hole 107 and the first through hole 106 can be used for a lanyard;
  • the support plate 105 has a third through hole 108, and the third through hole 108 penetrates with the second through hole 107 or the first through hole 106; the third through hole 108, the second through hole 107, and the first through hole 106 can be used for lanyards;
  • the shapes of the substrate 101, the cap plate 102, the first contact electrode 101-2 and the second contact electrode 101-3 on the substrate 101 are not limited to the shapes given in the drawings, and may be other shapes as shown in the figure. 17 to Figure 19;
  • the width B of the electronic device composed of the substrate 101 and the cover plate 102 is 11.95 mm to 12.05 mm, and the thickness H of the electronic device composed of the substrate 101 and the cover plate 102 is 2.4 mm to 2.5 mm;
  • the width B of the electronic device composed of the substrate 101 and the cover 102 is 12 mm
  • the thickness H of the electronic device composed of the substrate 101 and the cover 102 is 2.45 mm.
  • An electronic device provided by the present invention includes a substrate 101 and a cover 102.
  • the electronic device thus formed is a USB connector, and further includes an electronic circuit, which reduces the volume of the electronic device.
  • the substrate 101 is further disposed.
  • the second contact electrode 101-3 can be used as a touch button.
  • the cover plate 102 can also be a PCB and a second electronic circuit 102-1 can be disposed thereon to increase the function of the electronic device.
  • the cover plate 102 can also be provided with a tamper mechanism 104.
  • the electronic device may further include a through hole 106 on the substrate 101 and/or the cover plate 102; the through hole 106 may be used for the lanyard to make the electronic device easy to carry.
  • the electronic device provided by the present invention can achieve a portable, compact, and practical effect, and enhance the user experience.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)

Abstract

一种微型化的电子设备，包括：基板（101）和盖板（102）；基板（101）上布置有第一电子线路（101-1）和第一接触电极（101-2），第一电子线路（101-1）和第一接触电极（101-2）电气连接；盖板（102）盖合在基板（101）上，盖板（102）和基板（101）之间具有容纳空间（103），容纳空间容纳第一电子线路（101-1）。当电子设备插入USB接口时，第一接触电极（101-2）与USB接口中对应的电极相连。电子设备的宽度为11.95mm至12.05mm，电子设备的厚度为2.4mm至2.5mm。该电子设备，是基板位于插接部位的电子设备，包括基板和盖板，由此组成的电子设备本身即是USB接头，还包括电子线路，减小了电子设备的体积，达到便携、小巧、实用的效果，增强用户体验。

Description

一种微型化的电子设备 技术领域
本发明涉及一种微型化的电子设备，是基板位于插接部位的电子设备，可用于通信、各种计算机或电子仪器技术领域，尤其涉及一种具有USB接头的电子设备。
背景技术
现有技术中，具有USB接头的电子设备通常由USB接头、壳体内部的电子线路以及壳体上的其他功能区域（例如按键）叠加组成，体积较大，不利于电子设备的携带及存放，无法满足人们对电子设备便携性越来越高的要求。
发明内容
本发明的目的是提供一种电子设备，包括基板和盖板，由此组成的电子设备本身即是USB接头，还包括电子线路，减小了电子设备的体积，达到便携、小巧、实用的效果，增强用户体验。
本发明提供的一种电子设备，包括：基板和盖板；
所述基板上布置有第一电子线路和第一接触电极，所述第一电子线路和所述第一接触电极电气连接；
所述盖板盖合在所述基板上，所述盖板和所述基板之间具有容纳空间，所述容纳空间容纳所述第一电子线路。
优选地，所述基板为印制电路板。
优选地，当所述电子设备插入USB接口时，所述第一接触电极与所述USB接口中对应的电极相连。
优选地，所述第一电子线路和所述第一接触电极分别位于所述基板的正反两面上，所述盖板盖合在所述基板的具有所述第一电子线路的一面上。
优选地，所述盖板盖合在所述基板上的盖合方式为：扣合、粘合或卡合。
优选地，所述基板上还布置有第二接触电极，所述第二接触电极和所述第一电子线路电气连接；所述基板包括第一区域和第二区域，当所述电子设备插入USB接口时，所述第一区域位于所述USB接口中，所述第二接触电极位于所述第二区域，所述第二接触电极为触摸按键。
优选地，所述第二接触电极位于所述基板的侧面。
优选地，所述盖板为印制电路板，所述盖板上布置有第二电子线路，所述第二电子线路与所述基板上的所述第一电子线路相连，所述第二电子线路位于所述盖板和所述基板之间的所述容纳空间中。
优选地，所述基板和所述盖板之间还布置防拆机构，所述防拆机构与所述基板和所述盖板连接，所述防拆机构位于所述盖板和所述基板之间的所述容纳空间中。
优选地，所述基板具有第一通孔，所述盖板具有第二通孔，所述第二通孔与所述第一通孔贯通。
优选地，所述基板和所述盖板之间还包括支撑板，所述支撑板与所述基板和所述盖板相连，所述支撑板为环形支撑板，所述支撑板、所述基板和所述盖板组成所述容纳空间。
优选地，所述支撑板具有第三通孔，所述第三通孔与所述第二通孔和所述第一通孔贯通。
优选地，所述电子设备的宽度为11.95mm至12.05mm，所述电子设备的厚度为 2.4mm至2.5mm。
优选地，所述电子设备的宽度为12mm，所述电子设备的厚度为2.45mm。
优选地，所述第一接触电极包括四块不相连接的电极，依次分别为第一电极、第二电极、第三电极和第四电极。
优选地,所述第一接触电极中的各个电极的宽度为0.95mm至1.05mm;所述第一电极与所述第二电极之间间距为2.45mm至2.55mm;所述第二电极与所述第三电极之间间距为1.95mm至2.05mm；所述第三电极与所述第四电极之间间距为2.45mm至 2.55mm。
本发明与现有技术相比，具有以下优点：
本发明提供的一种电子设备，包括基板和盖板，通过盖板和基板之间的容纳空间容纳电子线路，由此组成的电子设备本身即是USB接头，减小了电子设备的体积，达到便携、小巧、实用的效果，增强用户体验。
附图说明
图1和图2为本发明实施例提供的一种电子设备的示意图；
图3为本发明实施例提供的一种电子设备的剖视图；
图4至图6为本发明实施例提供的一种电子设备的基板101的示意图；
图7和图8为本发明实施例提供的一种电子设备的盖板102的示意图；
图9至图12为本发明实施例提供的一种电子设备的第二接触电极101-3的示意图；
图13为本发明实施例提供的一种电子设备的盖板102的示意图；
图14为本发明实施例提供的一种电子设备的剖视图；
图15和图16为本发明实施例提供的又一种电子设备的示意图；
图17为本发明实施例提供的再一种电子设备的示意图；
图18和图19为本发明实施例提供的另一种电子设备的示意图。
具体实施方式
下面将结合附图，对本发明进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域的技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的实施例提供了一种电子设备，如图1至图3所示，包括：基板101和盖板102；
基板101上布置有第一电子线路101-1和第一接触电极101-2,第一电子线路101-1和第一接触电极101-2电气连接；
优选地，基板101为PCB（Printed Circuit Board，印制电路板）；当电子设备插入USB接口时，第一接触电极101-2与该USB接口中对应的电极相连；
优选地，第一接触电极101-2包括四块不相连接的电极，依次分别为第一电极、第二电极、第三电极和第四电极，各个电极的宽度为0.95mm至1.05mm；第一电极与第二电极之间间距（第一电极的沿插入USB接口的方向的中线与第二电极的沿插入USB接口的方向的中线之间的距离）为2.45mm至2.55mm；第二电极与第三电极之间间距（第二电极的沿插入USB接口的方向的中线与第三电极的沿插入USB接口的方向的中线之间的距离）为1.95mm至2.05mm；第三电极与第四电极之间间距（第三电极的沿插入USB接口的方向的中线与第四电极的沿插入USB接口的方向的中线之间的距离）为2.45mm至2.55mm；第一电极和第四电极的长度为7.10mm至7.72mm，第二电极和第三电极的长度为6.10mm至6.72mm；
盖板102盖合在基板101上，盖板102和基板101之间具有容纳空间103，容纳空间103能够容纳基板101上的第一电子线路101-1，如图3所示；
优选地，如图4至图6所示，基板101一面布置有第一电子线路101-1，另一面布置有第一接触电极101-2，即第一电子线路101-1和第一接触电极101-2分别位于基板101的正反两面上，盖板102盖合在基板101的具有第一电子线路101-1的一面上，盖板102如图7和图8所示；
本实施例中，盖板102盖合在基板101上，其盖合方式包括但不限于扣合、粘合或卡合；
优选地,如图9至图12所示，基板101上还布置有第二接触电极101-3，第二接触电极101-3和第一电子线路101-1电气连接；基板101包括第一区域和第二区域，当电子设备插入USB接口时，第一区域位于该USB接口中，第二接触电极101-3位于电子设备的第二区域，第二接触电极101-3可作为触摸按键，当电子设备插入USB接口时，第二接触电极101-3暴露在USB接口之外；
例如，第二接触电极101-3位于基板101的侧面；第一区域可以包括第一电子线路101-1和第一接触电极101-2；
优选地，盖板102为PCB（Printed Circuit Board，印制电路板），盖板102的一面布置有第二电子线路102-1，第二电子线路102-1与基板101上的第一电子线路 101-1相连，第二电子线路102-1位于盖板102和基板101之间的容纳空间103中，如图13和图14所示；
除此之外，基板101和盖板102之间还可以布置防拆机构104，防拆机构104与基板101和盖板102连接，防拆机构104位于盖板102和基板101之间的容纳空间103中，如图14所示；
除此之外,基板101和盖板102之间还可以包括支撑板105,支撑板105与基板101和盖板102连接，支撑板105为环形支撑板，支撑板105、基板101和盖板102组成容纳空间103如图15至图16所示；
除此之外，基板101基板具有第一通孔106；第一通孔106可以用于挂绳；
优选地，第一通孔106位于基板101的边缘；
除此之外，盖板102具有第二通孔107，第二通孔107与第一通孔106贯通；第二通孔107和第一通孔106可以用于挂绳；
除此之外，支撑板105具有第三通孔108，第三通孔108与第二通孔107或第一通孔106贯通；第三通孔108、第二通孔107和第一通孔106可以用于挂绳；
除此之外，基板101、盖板102、基板101上的第一接触电极101-2和第二接触电极101-3的形状不限于附图给出的形状，也可以为其他形状，如图17至图19所示；
本实施例中,基板101和盖板102组成的电子设备的宽度B为11.95mm至12.05mm，基板101和盖板102组成的电子设备的厚度H为2.4mm至2.5mm；
例如，基板101和盖板102组成的电子设备的宽度B为12mm，基板101和盖板102组成的电子设备的厚度H为2.45mm。
本发明提供的一种电子设备，包括基板101和盖板102，由此组成的电子设备本身即是USB接头，还包括电子线路,减小了电子设备的体积；进一步地，基板101上还布置有第二接触电极101-3可作为触摸按键，盖板102也可以为PCB并在其上布置第二电子线路102-1，增加电子设备的功能；盖板102上还可以布置防拆机构104，增加电子设备的安全性；电子设备还可以包括通孔106，通孔106位于基板101和/或盖板102上；通孔106可以用于挂绳，使电子设备易于携带。由此，本发明提供的一种电子设备能够达到便携、小巧、实用的效果，增强用户体验。
以上所述，仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，本领域的技术人员在本发明公开的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应该以权利要求的保护范围为准。

Claims (18)

  1. 一种微型化的电子设备，其特征在于，包括：基板和盖板；
    所述基板上布置有第一电子线路和第一接触电极，所述第一电子线路和所述第一接触电极电气连接；
    所述盖板盖合在所述基板上，所述盖板和所述基板之间具有容纳空间，所述容纳空间容纳所述第一电子线路。
  2. 根据权利要求1所述的电子设备，其特征在于，所述基板为印制电路板。
  3. 根据权利要求1所述的电子设备，其特征在于，当所述电子设备插入USB接口时，所述第一接触电极与所述USB接口中对应的电极相连。
  4. 根据权利要求1所述的电子设备，其特征在于，所述第一电子线路和所述第一接触电极分别位于所述基板的正反两面上，所述盖板盖合在所述基板的具有所述第一电子线路的一面上。
  5. 根据权利要求1所述的电子设备，其特征在于，所述盖板盖合在所述基板上的盖合方式为：扣合、粘合或卡合。
  6. 根据权利要求1所述的电子设备,其特征在于,所述基板上还布置有第二接触电极，所述第二接触电极和所述第一电子线路电气连接；所述基板包括第一区域和第二区域，当所述电子设备插入USB接口时，所述第一区域位于所述USB接口中，所述第二接触电极位于所述第二区域。
  7. 根据权利要求6所述的电子设备，其特征在于，所述第二接触电极为触摸按键。
  8. 根据权利要求6所述的电子设备，其特征在于，所述第二接触电极位于所述基板的侧面。
  9. 根据权利要求1所述的电子设备，其特征在于，所述盖板上布置有第二电子线路，所述第二电子线路与所述第一电子线路相连，所述第二电子线路位于所述盖板和所述基板之间的所述容纳空间中。
  10. 根据权利要求1所述的电子设备，其特征在于，所述基板和所述盖板之间还布置防拆机构，所述防拆机构与所述基板和所述盖板连接，所述防拆机构位于所述盖板和所述基板之间的所述容纳空间中。
  11. 根据权利要求1所述的电子设备，其特征在于，所述基板具有第一通孔。
  12. 根据权利要求10所述的电子设备，其特征在于，所述盖板具有第二通孔，所述第二通孔与所述第一通孔贯通。
  13. 根据权利要求1所述的电子设备，其特征在于，所述基板和所述盖板之间还包括支撑板，所述支撑板与所述基板和所述盖板相连，所述支撑板为环形支撑板，所述支撑板、所述基板和所述盖板组成所述容纳空间。
  14. 根据权利要求13所述的电子设备，其特征在于，所述支撑板具有第三通孔，所述第三通孔与所述第二通孔或所述第一通孔贯通。
  15. 根据权利要求1所述的电子设备,其特征在于，所述电子设备的宽度为11.95mm至12.05mm，所述电子设备的厚度为2.4mm至2.5mm。
  16. 根据权利要求15所述的电子设备，其特征在于，所述电子设备的宽度为12mm，所述电子设备的厚度为2.45mm。
  17. 根据权利要求1所述的电子设备，其特征在于，所述第一接触电极包括四块不相连接的电极，依次分别为第一电极、第二电极、第三电极和第四电极。
  18. 根据权利要求17所述的电子设备，其特征在于，所述第一接触电极中的各个电极的宽度为0.95mm至1.05mm；所述第一电极与所述第二电极之间间距为2.45mm至2.55mm；所述第二电极与所述第三电极之间间距为1.95mm至2.05mm；所述第三电极与所述第四电极之间间距为2.45mm至2.55mm。
PCT/CN2015/099031 2015-11-02 2015-12-25 一种微型化的电子设备 WO2017075881A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP15907723.9A EP3373397B1 (en) 2015-11-02 2015-12-25 Miniature electronic device
US15/533,774 US10211561B2 (en) 2015-11-02 2015-12-25 Miniature electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201520862328.4 2015-11-02
CN201520862328.4U CN205264910U (zh) 2015-11-02 2015-11-02 一种电子设备

Publications (1)

Publication Number Publication Date
WO2017075881A1 true WO2017075881A1 (zh) 2017-05-11

Family

ID=56006417

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/099031 WO2017075881A1 (zh) 2015-11-02 2015-12-25 一种微型化的电子设备

Country Status (4)

Country Link
US (1) US10211561B2 (zh)
EP (1) EP3373397B1 (zh)
CN (1) CN205264910U (zh)
WO (1) WO2017075881A1 (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030087554A1 (en) * 2001-11-06 2003-05-08 Huang Yea Yen USB electric fragrant emitting joint
CN201207197Y (zh) * 2008-04-29 2009-03-11 诠欣股份有限公司 读卡器
CN201349066Y (zh) * 2008-12-31 2009-11-18 东莞骅国电子有限公司 改良通用序列汇流排连接座结构
CN203433826U (zh) * 2013-09-05 2014-02-12 黄桂馥 一种u盘

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848045B2 (en) * 1999-01-15 2005-01-25 Rainbow Technologies, Inc. Integrated USB connector for personal token
US7740493B2 (en) * 2004-02-26 2010-06-22 Supertalent Electronics, Inc. Universal serial bus (USB) flash drive housing a slim USB device and having swivel cap functionalities allowing for two locking positions
US6744634B2 (en) * 2001-11-23 2004-06-01 Power Quotient International Co., Ltd. Low height USB interface connecting device and a memory storage apparatus thereof
US6994568B2 (en) * 2004-03-04 2006-02-07 C-One Technology Corporation Portable storage device
TWM349111U (en) * 2008-07-18 2009-01-11 Vencer Co Ltd Improved structure for Bluetooth USB adaptor
TW201202996A (en) * 2010-07-12 2012-01-16 Walton Advanced Eng Inc Encryption flash disk
TWI503754B (zh) * 2012-07-31 2015-10-11 Walton Advanced Eng Inc A composite card structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030087554A1 (en) * 2001-11-06 2003-05-08 Huang Yea Yen USB electric fragrant emitting joint
CN201207197Y (zh) * 2008-04-29 2009-03-11 诠欣股份有限公司 读卡器
CN201349066Y (zh) * 2008-12-31 2009-11-18 东莞骅国电子有限公司 改良通用序列汇流排连接座结构
CN203433826U (zh) * 2013-09-05 2014-02-12 黄桂馥 一种u盘

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3373397A4 *

Also Published As

Publication number Publication date
CN205264910U (zh) 2016-05-25
US20180226741A1 (en) 2018-08-09
US10211561B2 (en) 2019-02-19
EP3373397A4 (en) 2019-06-12
EP3373397B1 (en) 2020-11-04
EP3373397A1 (en) 2018-09-12

Similar Documents

Publication Publication Date Title
WO2020032438A1 (en) Electronic device including shielding member connected to conductive plate covering opening of shield can
WO2021153929A1 (en) Electronic device including air vent
WO2015034270A1 (ko) 키 버튼을 포함하는 전자 장치
WO2020171452A1 (en) Stack structure of printed circuit boards using interposer and electronic device including the same
WO2020235787A1 (en) Electrical connecting device and electronic device including the same
WO2015178614A1 (ko) 초 슬림 터치 키보드 및 이를 포함하는 초 슬림 스마트 커버 장치
WO2011143979A1 (zh) 一种可双面插接的usb插座与插头
WO2020091280A1 (ko) 전기적 연결 장치 및 그것을 포함하는 전자 장치
EP3055854A1 (en) Electronic device with curved display module
WO2019112252A1 (en) Electronic device with waterproof structure
WO2021085914A1 (en) Electronic device including slot antenna module
WO2021162251A1 (en) Electronic device including printed circuit board having shielding structure
WO2022173129A1 (ko) 방열 구조를 포함하는 전자 장치
WO2013165179A1 (en) Mounting structure for circuit boards in electronic device
WO2013122368A1 (ko) 위치 정보 입력이 가능한 키보드 및 이를 포함하는 키보드 시스템
WO2020085706A1 (ko) 연결 부재로 연결된 복수의 회로 기판 사이에 상 변환 물질이 충진된 전자 장치
WO2015099502A1 (en) Protective cover and electronic device having it
WO2020145648A1 (en) Display assembly and electronic device including the same
WO2022177203A1 (ko) 베이퍼 챔버를 포함하는 전자 장치
WO2017135781A1 (ko) 클립형 컨택터 및 이를 포함하는 보호장치
WO2017075881A1 (zh) 一种微型化的电子设备
WO2019107744A1 (ko) 휴대용 단말기 홀더
WO2022164129A1 (ko) 방수 구조를 포함하는 전자 장치
WO2020262849A1 (ko) 방열 구조를 포함하는 전자장치
WO2014027760A1 (ko) 이동 단말기

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 15533774

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15907723

Country of ref document: EP

Kind code of ref document: A1

REEP Request for entry into the european phase

Ref document number: 2015907723

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE