WO2017063331A1 - 一种将fan table放在节点BMC上的整机柜风扇调速策略 - Google Patents
一种将fan table放在节点BMC上的整机柜风扇调速策略 Download PDFInfo
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- WO2017063331A1 WO2017063331A1 PCT/CN2016/076025 CN2016076025W WO2017063331A1 WO 2017063331 A1 WO2017063331 A1 WO 2017063331A1 CN 2016076025 W CN2016076025 W CN 2016076025W WO 2017063331 A1 WO2017063331 A1 WO 2017063331A1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/207—Thermal management, e.g. cabinet temperature control
Definitions
- the present invention relates to the field of heat dissipation of a server cabinet, and specifically relates to a fan speed adjustment strategy of a whole cabinet in which a fan table is placed on a node BMC.
- the whole cabinet server is more and more widely used in practical applications, especially in large data centers and cloud computing bases.
- dozens of server nodes are often integrated. High density deployment.
- the CPU of each node does not have a separate fan to dissipate heat, but the entire fan window at the rear of the cabinet dissipates heat to all nodes.
- the entire cabinet server first collects the CPU temperature and air inlet temperature of the node through the node board. After the node board transmits the data to the RMC (R ack Management Controler), the RMC obtains the fan according to the fan table placed on it. The duty value is used to control the fan.
- RMC Raster Management Controler
- the technical problem to be solved by the present invention is:
- the present invention provides a fan speed regulation strategy for a whole cabinet in which a fan table is placed on a node BMC, which can quickly obtain a fan duty after the node CPU temperature rises, and Control the fan speed to increase, so as to ensure that the entire cabinet is more efficient and efficient.
- a fan cabinet speed regulation strategy for placing a fan table on a node BMC places a fan table reflecting the fan speed adjustment policy of the entire cabinet on the BMC of each node server, which is different from the usual Put the fan table in the responsibility of the entire cabinet management unit RMC, will fan
- the table has a unique advantage on the BMC of each node server.
- the node BMC can quickly obtain the parameters such as the CPU temperature and air inlet temperature of the node, which reflect the heat dissipation of the node's motherboard, and quickly obtain the corresponding fan speed through the speed regulation strategy. Therefore, the heat dissipation of the node can be effectively controlled, and the heat dissipation of the entire cabinet can be better ensured.
- the table writes the BMC speed control strategy program code, and the node BMC obtains the corresponding duty value of the node according to the CPU temperature of the server node and the air inlet temperature, and sends it to the node middle board;
- the node middle board selects the maximum value of the fan duty of the four nodes connected to the middle board of the layer, and obtains the fan duty value of the board in the middle node;
- the RMC obtains the board fan duty value of each layer node from each node middle board, and takes the maximum duty value in the upper half cabinet and the lower half cabinet node middle board respectively, and is controlled by the fan.
- the board controls the fan speed of the fan window corresponding to the upper half and the lower half of the node to control the fan half cabinet.
- the node BMC sends the fan duty value of the node to the node middle board through the I2C bus.
- the RMC obtains a panel fan duty value of each layer node from each node middle board through an I2C bus.
- the fan duty when the node pressure increases, the CPU temperature rises or the ambient temperature rises, the fan duty can be quickly obtained, and the RMC can control the fan speed according to the obtained fan duty maximum value to ensure the heat dissipation of the whole cabinet is further improved. ⁇ Effective, and can adapt to changes in ambient temperature more quickly, improve system reliability and maintainability, and have unique advantages in the cooling of the SmartRack server.
- a fan cabinet speed regulation policy of placing a fan table on a node BMC places a fan table reflecting a fan speed regulation policy of the entire cabinet on a BMC of each node server, which is different from the usual Put the fan table in the responsibility of the entire cabinet management unit RMC, will fan
- the table writes the BMC speed control strategy program code, and the node BMC obtains the corresponding duty value of the node according to the CPU temperature of the server node and the air inlet temperature, and sends it to the node middle board;
- the node middle board selects the maximum value of the fan duty of the four nodes connected to the middle board of the layer, and obtains the fan duty value of the board in the middle node of the layer;
- the RMC obtains the board fan duty value of each layer node from each node middle board, and takes the maximum duty value in the upper half cabinet and the lower half cabinet node middle board respectively, and is controlled by the fan.
- the board controls the fan speed of the fan window corresponding to the upper half and the lower half of the node to control the fan half cabinet.
- the node BMC in this embodiment sends the fan duty value of the node to the node middle board through the I2C bus.
- the RMC described in this embodiment is obtained from each node board through the I2C bus.
- the board fan duty value in each layer node is obtained from each node board through the I2C bus.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Control Of Temperature (AREA)
Abstract
一种将fan table放在节点BMC上的整机柜风扇调速策略,所述策略把反映整机柜风扇调速策略的fan table放在每个节点服务器的BMC上,节点BMC能够快速获取到节点主板散热情况的参数,通过调速策略快速得到对应的风扇转速。该策略在节点压力增大CPU温度升高或周围环境温度上升时,能够快速得到风扇duty,RMC根据得到的风扇duty最大值能及时控制风扇转速上升,保证整机柜散热更加及时有效,并且能更快的适应周围环境温度的变化,提高了系统的可靠性和可维护性,在SmartRack整机柜服务器散热中有独特的优势。
Description
说明书 发明名称:一种将 fan table放在节点 BMC上的整机柜风扇调速策略 技术领域
[0001] 本发明涉及服务器机柜散热技术领域, 具体涉及一种将 fan table放在节点 BMC 上的整机柜风扇调速策略。
背景技术
[0002] 随着计算机技术的发展, 整机柜服务器在实际应用中尤其是在大型数据中心、 云计算基地等场合应用越来越广泛, 在整机柜中往往集成几十个服务器节点, 实现高密度部署。 在整机柜上, 每个节点的 CPU没有独立的风扇来散热, 而是通 过机柜后部的风扇窗整体给所有节点散热。 一般整机柜服务器会首先通过节点 中板采集节点的 CPU温度, 进风口温度等数据, 节点中板将数据传递给 RMC (R ack Management Controler) 后, RMC根据放在其上的 fan table得到风扇 duty值去 控制风扇。 但此种方式一个明显缺点就是从节点 CPU温度、 进风口温度变化到 R MC根据这种变化得到新的风扇 duty值的吋间较长, 在服务器节点压力较大 CPU 温度较高吋, 不能及吋有效地对节点散热, 这种做法无疑加大了散热风险, 严 重吋会导致 CPU降频。 因此, 如何能实现一种能及吋有效给服务器节点散热的方 式, 成为设计和幵发人员亟需解决的问题。
技术问题
[0003] 本发明要解决的技术问题是: 本发明提供一种将 fan table放在节点 BMC上的整 机柜风扇调速策略, 能够在节点 CPU温度升高吋, 快速得到风扇 duty, 及吋控制 风扇转速上升, 以此来保证整机柜散热更加及吋有效。
问题的解决方案
技术解决方案
[0004] 本发明所采用的技术方案为:
[0005] 一种将 fan table放在节点 BMC上的整机柜风扇调速策略, 所述策略把反映整机 柜风扇调速策略的 fan table放在每个节点服务器的 BMC上, 不同于通常将 fan table放在负责整机柜管理单元 RMC上的做法, 将 fan
table放在每个节点服务器的 BMC上有其独特的优势, 节点 BMC能够快速获取到 节点的 CPU温度、 进风口温度等反映节点主板散热情况的参数, 通过调速策略快 速得到对应的风扇转速, 从而对节点散热能进行及吋有效的控制, 更好的保证 整机柜散热。
所述策略具体内容为:
[0007] 1) 做散热测试, 得到不同 CPU温度和不同环境温度下的 fan table风扇调控策略 表;
[0008] 2) 根据 fan
table编写 BMC调速策略程序代码, 节点 BMC根据自身服务器节点 CPU温度和进 风口温度得到本节点对应风扇 duty值, 并发送给节点中板;
[0009] 3) 编写节点中板风扇控制程序, 节点中板选取本层中板所连接四个节点的风 扇 duty中的最大值, 得到本层节点中板的风扇 duty值;
[0010] 4) 编写 RMC风扇控制程序, RMC从每个节点中板获取每层节点中板风扇 duty 值, 在上半柜和下半柜节点中板中分别取最大 duty值, 并通过风扇控制板分别控 制上半柜节点和下半柜节点对应风扇窗的风扇转速, 实现风扇半柜控制。
[0011] 所述节点 BMC将本节点风扇 duty值通过 I2C总线发送给节点中板。
[0012] 所述 RMC通过 I2C总线从每个节点中板获取每层节点中板风扇 duty值。
发明的有益效果
有益效果
[0013] 本发明的有益效果为:
[0014] 本发明在节点压力增大 CPU温度升高或周围环境温度上升吋, 能够快速得到风 扇 duty, RMC根据得到的风扇 duty最大值能及吋控制风扇转速上升, 保证整机柜 散热更加及吋有效, 并且能更快的适应周围环境温度的变化, 提高了系统的可 靠性和可维护性, 在 SmartRack整机柜服务器散热中有独特的优势。
对附图的简要说明
附图说明
[0015] 图 1为本发明所述策略流程图。
本发明的实施方式
[0016] 下面根据说明书附图, 结合具体实施方式对本发明进一步说明:
[0017] 实施例 1 :
[0018] 一种将 fan table放在节点 BMC上的整机柜风扇调速策略, 所述策略把反映整机 柜风扇调速策略的 fan table放在每个节点服务器的 BMC上, 不同于通常将 fan table放在负责整机柜管理单元 RMC上的做法, 将 fan
table放在每个节点服务器的 BMC上有其独特的优势, 节点 BMC能够快速获取到 节点的 CPU温度、 进风口温度等反映节点主板散热情况的参数, 通过调速策略快 速得到对应的风扇转速, 从而对节点散热能进行及吋有效的控制, 更好的保证 整机柜散热。
[0019] 实施例 2:
[0020] 如图 1所示, 在实施例 1的基础上, 本实施例所述策略具体内容为:
[0021] 1) 做散热测试, 得到不同 CPU温度和不同环境温度下的 fan table风扇调控策略 表;
[0022] 2) 根据 fan
table编写 BMC调速策略程序代码, 节点 BMC根据自身服务器节点 CPU温度和进 风口温度得到本节点对应风扇 duty值, 并发送给节点中板;
[0023] 3) 编写节点中板风扇控制程序, 节点中板选取本层中板所连接四个节点的风 扇 duty中的最大值, 得到本层节点中板的风扇 duty值;
[0024] 4) 编写 RMC风扇控制程序, RMC从每个节点中板获取每层节点中板风扇 duty 值, 在上半柜和下半柜节点中板中分别取最大 duty值, 并通过风扇控制板分别控 制上半柜节点和下半柜节点对应风扇窗的风扇转速, 实现风扇半柜控制。
[0025] 实施例 3:
[0026] 在实施例 2的基础上, 本实施例所述节点 BMC将本节点风扇 duty值通过 I2C总线 发送给节点中板。
[0027] 实施例 4:
[0028] 在实施例 2或 3的基础上, 本实施例所述 RMC通过 I2C总线从每个节点中板获取
每层节点中板风扇 duty值。
以上实施方式仅用于说明本发明, 而并非对本发明的限制, 有关技术领域的普 通技术人员, 在不脱离本发明的精神和范围的情况下, 还可以做出各种变化和 变型, 因此所有等同的技术方案也属于本发明的范畴, 本发明的专利保护范围 应由权利要求限定。
Claims
[权利要求 1] 一种将 fan table放在节点 BMC上的整机柜风扇调速策略, 其特征在于 : 所述策略把反映整机柜风扇调速策略的 fan table放在每个节点服务 器的 BMC上, 节点 BMC能够快速获取到节点主板散热情况的参数, 通过调速策略快速得到对应的风扇转速。
[权利要求 2] 根据权利要求 1所述的一种将 fan table放在节点 BMC上的整机柜风扇 调速策略, 其特征在于, 所述策略具体内容为:
1) 做散热测试, 得到不同 CPU温度和不同环境温度下的 fan table;
2) 根据 fan table编写 BMC调速策略程序代码, 节点 BMC根据自身服 务器节点 CPU温度和进风口温度得到本节点对应风扇 duty值, 并发送 给节点中板;
3) 编写节点中板风扇控制程序, 节点中板选取本层中板所连接四个 节点的风扇 duty中的最大值, 得到本层节点中板的风扇 duty值;
4) 编写 RMC风扇控制程序, RMC从每个节点中板获取每层节点中板 风扇 duty值, 在上半柜和下半柜节点中板中分别取最大 duty值, 并通 过风扇控制板分别控制上半柜节点和下半柜节点对应风扇窗的风扇转 速, 实现风扇半柜控制。
[权利要求 3] 根据权利要求 2所述的一种将 fan table放在节点 BMC上的整机柜风扇 调速策略, 其特征在于: 所述节点 BMC将本节点风扇 duty值通过 I2C 总线发送给节点中板。
[权利要求 4] 根据权利要求 2或 3任一所述的一种将 fan table放在节点 BMC上的整机 柜风扇调速策略, 其特征在于: 所述 RMC通过 I2C总线从每个节点中 板获取每层节点中板风扇 duty值。
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CN105909545A (zh) * | 2016-04-12 | 2016-08-31 | 浪潮电子信息产业股份有限公司 | 一种基于CPU Margin温度的整机柜风扇调速方法 |
CN107203251A (zh) * | 2017-05-26 | 2017-09-26 | 郑州云海信息技术有限公司 | 一种整机柜服务器散热方法 |
CN107015618A (zh) * | 2017-05-26 | 2017-08-04 | 郑州云海信息技术有限公司 | 一种整机柜服务器散热系统及散热方法 |
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