WO2017010037A1 - 吸着機構及び吸着方法並びに製造装置及び製造方法 - Google Patents

吸着機構及び吸着方法並びに製造装置及び製造方法 Download PDF

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Publication number
WO2017010037A1
WO2017010037A1 PCT/JP2016/002854 JP2016002854W WO2017010037A1 WO 2017010037 A1 WO2017010037 A1 WO 2017010037A1 JP 2016002854 W JP2016002854 W JP 2016002854W WO 2017010037 A1 WO2017010037 A1 WO 2017010037A1
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Prior art keywords
cutting
jig
cut
sealed substrate
manufacturing
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PCT/JP2016/002854
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English (en)
French (fr)
Japanese (ja)
Inventor
勝則 傳藤
一郎 今井
幹司 石橋
Original Assignee
Ｔｏｗａ株式会社
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Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to CN201680025715.XA priority Critical patent/CN107533965B/zh
Priority to KR1020177034347A priority patent/KR102128154B1/ko
Publication of WO2017010037A1 publication Critical patent/WO2017010037A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Definitions

  • the present invention relates to an adsorption mechanism, an adsorption method, a production apparatus, and a production method that are used when a plurality of singulated products are produced by cutting an object to be cut.
  • a substrate composed of a printed circuit board, a lead frame, etc. is virtually divided into a plurality of grid-like areas, and chip-like elements (for example, semiconductor chips) are attached to the respective areas, and then the entire board is sealed with resin.
  • This is called a sealed substrate.
  • a product obtained by cutting a sealed substrate by a cutting mechanism using a rotary blade or the like and dividing it into individual regions is a product.
  • the fluid resin is cured to form a sealing resin made of a cured resin.
  • a predetermined region of a sealed substrate is cut using a cutting mechanism such as a rotary blade using a cutting device.
  • a cutting mechanism such as a rotary blade using a cutting device.
  • the sealed substrate is placed on a cutting table (cutting jig).
  • the sealed substrate is aligned (positioned). By aligning, the position of a virtual cutting line that divides a plurality of regions is set.
  • the cutting table on which the sealed substrate is placed and the cutting mechanism are relatively moved.
  • the cutting water is sprayed onto the cut portion of the sealed substrate, and the sealed substrate is cut along the cutting line set on the sealed substrate by the cutting mechanism.
  • An individualized product is manufactured by cutting the sealed substrate.
  • a cutting jig is mounted on the cutting table.
  • the cutting jig is provided with a plurality of suction passages for sucking the sealed substrate or the separated product.
  • the cutting table is provided with a space to which a plurality of suction passages are connected. Through this space, the plurality of suction passages are connected to an external suction mechanism, such as a vacuum pump. By sucking the sealed substrate or the plurality of products by the vacuum pump, the sealed substrate or the plurality of products is adsorbed to the cutting jig.
  • the sealed substrate cannot be sucked by the suction jig, there arises a problem that the sealed substrate cannot be cut. Therefore, when the sealed substrate is separated into individual pieces, it is important to reliably suck the sealed substrate having warpage to the suction jig.
  • a method for dividing a package substrate “(substantially) a method for dividing a package substrate, which includes a holding surface that holds the package substrate, and (substantially) a plurality of bellows-type suction pads that protrude from the holding surface; A mounting step of mounting the package substrate on a fixing jig formed of rubber, and (substantially) cutting the package substrate held by the fixing jig with a cutting blade. And a dividing step of dividing the package substrate into individual packages ”(see, for example, paragraph [0012] and FIGS. 5 to 8 of Patent Document 1).
  • the holding plate 50 of the fixing jig 20 has a plurality of round holes 52 having a first diameter, and a first hole formed continuously to each of the round holes 52.
  • a plurality of round holes 54 having a second diameter larger than the diameter and a large recess 56 communicating with each round hole 54 are formed.
  • a suction fitting 58 having a suction path 59 is attached, and each suction fitting 58 is attached with a bellows-type suction pad 24 made of resin.
  • the holding member 62 has a plurality of round holes 64 communicating with the respective round holes 54.
  • a concave portion is defined by the continuously formed round hole 54 and round hole 64, and the bellows type suction pad 24 is disposed in the concave portion.
  • This invention solves said subject, and aims at providing the adsorption
  • the suction mechanism Used in a process of manufacturing a plurality of products respectively corresponding to a plurality of unit regions by adsorbing a workpiece having a plurality of unit regions separated by a plurality of cutting lines and cutting the workpiece.
  • An adsorption mechanism A first table on which the object to be cut is placed; A first jig mounted on the first table; One or a plurality of first suction ports provided in the first jig, each of which sucks the workpiece by a first suction area; With Each of the plurality of second suction ports provided corresponding to each of the plurality of unit regions in the second jig used in the step of cutting the workpiece is one unit region.
  • a unit adsorption area which is an area included in the first adsorption area and adsorbs one unit region is larger than a second adsorption area which adsorbs It is characterized by that.
  • the adsorption method according to the present invention comprises: Used in a process of manufacturing a plurality of products respectively corresponding to a plurality of unit regions by adsorbing a workpiece having the plurality of unit regions separated by a plurality of cutting lines and cutting the workpiece.
  • An adsorption method Preparing a first table on which the object to be cut is placed; Preparing a first jig mounted on the first table; Preparing one or a plurality of first suction ports provided in the first jig, each of which sucks the workpiece by a first suction area; Using one or a plurality of the first suction ports, the object to be cut according to a unit suction area that is an area included in the first suction area and that sucks one unit region.
  • Adsorbing and Including Each of the plurality of second suction ports provided corresponding to each of the plurality of unit regions in the second jig used in the step of cutting the workpiece is one unit region.
  • the unit adsorption area is larger than the second adsorption area for adsorbing It is characterized by that.
  • a manufacturing apparatus includes: A cutting mechanism that cuts a workpiece having a plurality of unit regions separated by a plurality of cutting lines, and a rotary blade provided in the cutting mechanism, and a plurality of the units by cutting the workpiece.
  • a manufacturing apparatus includes: A cutting mechanism that cuts a workpiece having a plurality of unit regions separated by a plurality of cutting lines, and a rotary blade provided in the cutting mechanism, and a plurality of the units by cutting the workpiece.
  • a manufacturing apparatus used in a process of manufacturing a plurality of products corresponding to respective areas A first table on which the object to be cut is placed; A second table on which the object to be cut is placed; A moving mechanism for relatively moving the first table, the second table, and the cutting mechanism; A first jig mounted on the first table; One or a plurality of first suction ports provided in the first jig, each for sucking a workpiece by a first suction area; A second jig mounted on the second table; A plurality of second suction ports provided respectively corresponding to the plurality of unit regions in the second jig, and each sucking one unit region by a second suction area; With The unit adsorption area that is included in the first adsorption area and adsorbs each of the plurality of unit regions is larger than the second adsorption area, In the first jig, the rotary blade cuts a part of the total thickness of the object to be cut along at least one of the plurality of cutting lines.
  • a cutting groove is formed, In the first jig, a semi-finished product having a plurality of intermediate regions separated by the cutting grooves is formed, In the second jig, the semi-finished product is cut by the rotary blade along a plurality of the cutting lines, whereby a plurality of the products sucked by the plurality of second suction ports are manufactured.
  • the It is characterized by that.
  • a first cutting mechanism of the cutting mechanism A second cutting mechanism of the cutting mechanism; With In the first jig, the cutting groove is formed by a first rotary blade provided in the first cutting mechanism, In the second jig, the semi-finished product is cut by a second rotary blade provided in the second cutting mechanism. There is a mode.
  • the first jig can adsorb a first workpiece including a plurality of first unit regions each having a first dimension, and each of the first jigs has a second dimension different from the first dimension.
  • the second object to be cut including the second unit region can be adsorbed. There is a mode.
  • the cutting groove is formed along all of the cutting lines. There is a mode.
  • the object to be cut is a plate-like member in which a functional element is formed in each of the plurality of unit regions. There is a mode.
  • the object to be cut has at least a first member made of a base material and a second member formed on the base material,
  • the cutting groove is formed in at least the entire thickness of the first member, or formed in at least the entire thickness of the second member.
  • the object to be cut has at least a first member made of a base material and a second member formed on the base material,
  • the cutting groove is formed in a part of the total thickness in the first member, or formed in a part of the total thickness in the second member.
  • the first member is a substrate on which a circuit is formed
  • the second member is an insulating member; There is a mode.
  • a manufacturing method includes: A step of relatively moving a workpiece having a plurality of unit areas divided by a plurality of cutting lines and a cutting mechanism, and a step of cutting the workpiece using a rotary blade of the cutting mechanism; A manufacturing method used in a process of manufacturing a plurality of products respectively corresponding to the plurality of unit regions by cutting the cut object.
  • the above-described adsorption method is provided.
  • a manufacturing method includes: A step of relatively moving a workpiece having a plurality of unit areas divided by a plurality of cutting lines and a cutting mechanism, and a step of cutting the workpiece using a rotary blade of the cutting mechanism; And cutting the cut object using the rotary blade, and using the cut object to manufacture a plurality of products respectively corresponding to the unit regions by cutting the object.
  • a manufacturing method comprising: Preparing a first table on which the object to be cut is placed; Preparing a second table on which the object to be cut is placed; Preparing a first jig mounted on the first table and having one or more first suction ports each having a first suction area; Preparing a second jig mounted on the second table and having a plurality of second suction ports respectively corresponding to the plurality of unit regions and having a second suction area; A step of adsorbing the object to be cut using each of one or a plurality of the first suction ports in the first jig; As the cutting step, in the first jig, a part of the total thickness of the workpiece is cut along at least one of the plurality of cutting lines using the rotary blade.
  • Forming at least one cutting groove by cutting the thickness Forming a semi-finished product having a plurality of intermediate regions separated by the cutting grooves in the first jig; Placing the semi-finished product in the second jig; Adsorbing the semi-finished product by adsorbing each of the plurality of unit regions of the semi-finished product using each of the plurality of second suction ports in the second jig; As the step of cutting, in the second jig, cutting the semi-finished product using the rotary blade along the plurality of cutting lines; Including The unit adsorption area that is included in the first adsorption area and adsorbs each of the plurality of unit regions is larger than the second adsorption area, Cutting the semi-finished product to produce a plurality of the products adsorbed by each of the plurality of second suction ports; It is characterized by that.
  • the production method includes: Preparing a first cutting mechanism having a first rotary blade as the cutting mechanism; Preparing a second cutting mechanism having a second rotary blade as the cutting mechanism; As a step of relatively moving the object to be cut and the cutting mechanism, a step of relatively moving the object to be cut and the first cutting mechanism; As a step of relatively moving the object to be cut and the cutting mechanism, a step of relatively moving the semi-finished product and the second cutting mechanism; Including In the step of forming the cutting groove, the cutting groove is formed by the first rotary blade, In the step of cutting the semi-finished product, the semi-finished product is cut by the second rotary blade. There is a mode.
  • the production method includes: In the step of adsorbing the workpiece, the first jig including the plurality of first unit regions each having a first dimension can be adsorbed using the first jig. A plurality of second unit regions each having a second dimension different from the first dimension can be adsorbed; There is a mode.
  • the production method according to the present invention includes: In the step of forming the cutting groove, the cutting groove is formed along all of the plurality of cutting lines. There is a mode.
  • the production method according to the present invention includes:
  • the object to be cut is a plate-like member in which a functional element is formed in each of the plurality of unit regions. There is a mode.
  • the production method according to the present invention includes:
  • the object to be cut has at least a first member made of a base material and a second member formed on the base material, In the step of forming the cutting groove, the cutting groove is formed in the entire thickness of the first member, or the cutting groove is formed in the total thickness of the second member. There is a mode.
  • the production method according to the present invention includes:
  • the object to be cut has at least a first member made of a base material and a second member formed on the base material,
  • the cutting groove is formed at a part of the total thickness of the first member, or at a part of the total thickness of the second member. Forming the cutting groove, There is a mode.
  • the production method according to the present invention includes: The first member is a substrate on which a circuit is formed, The second member is an insulating member; There is a mode.
  • the unit adsorption area that is included in the first adsorption area of the first adsorption port and that adsorbs one unit area is divided into one unit area. It is larger than the second suction area of the corresponding second suction port. Therefore, the unit adsorption area contained in one first adsorption port is 1 as compared with the force that one unit region is adsorbed by the second adsorption area contained in one second adsorption port. The force with which the unit areas are attracted increases.
  • a part of the total thickness of the workpiece is cut along at least one of the plurality of cutting lines of the adsorbed workpiece. .
  • at least one cutting groove is formed.
  • the object to be cut with reduced warpage is placed on the second jig.
  • the object to be cut is stably adsorbed by the plurality of second adsorption holes respectively provided in the second jig and corresponding to the plurality of unit regions.
  • a plurality of products are manufactured by cutting an object to be cut. Therefore, a plurality of products are manufactured by processing the workpiece in two stages of cutting and cutting.
  • FIG. 1A is a plan view of an object to be cut by a manufacturing apparatus according to the present invention.
  • FIG. 1B is a front view of the workpiece having warpage in FIG. 1A.
  • FIG. 2A is a plan view of a cutting jig used in the manufacturing apparatus according to Embodiment 1 of the present invention.
  • 2B is a cross-sectional view taken along line AA of FIG. 2A, virtually illustrating a state in which a workpiece having warpage is placed on a cutting jig.
  • FIG. 3A is a plan view of a cutting jig used in the manufacturing apparatus according to Embodiment 1 of the present invention.
  • FIG. 3B is a cross-sectional view taken along line BB of FIG.
  • FIG. 3A virtually illustrating a state in which a workpiece having warpage is placed on a cutting jig.
  • 4A is a plan view showing a state in which the object to be cut adsorbed by the cutting jig shown in FIGS. 2A and 2B is being cut.
  • FIG. 4B is a cross-sectional view taken along the line CC of FIG. 4A.
  • FIG. 5A is a plan view showing a state in which the object to be cut adsorbed by the cutting jig shown in FIGS. 3A and 3B is being cut.
  • 5B is a cross-sectional view taken along the line DD of FIG. 5A.
  • FIG. 6A is a plan view of a cutting jig used in a manufacturing apparatus according to a modification of the first embodiment of the present invention.
  • 6B is a cross-sectional view taken along line AA of FIG. 6A, virtually illustrating a state in which a workpiece having warpage is placed on a cutting jig.
  • FIG. 6C is a plan view showing one unit region adsorbed by the cutting jig described above.
  • FIG. 6D is a plan view showing one unit region adsorbed by the cutting jig shown in FIGS. 3A and 3B.
  • FIG. 7 is a plan view showing an outline of a manufacturing apparatus according to Embodiment 2 of the present invention.
  • FIG. 8 is a plan view showing an object to be cut and a part of a cutting jig in the manufacturing apparatus according to Embodiment 3 of the present invention.
  • a tool 15 is provided.
  • the cutting jig 9 is provided with a first suction port 12 having a first suction area.
  • One unit region 7 is adsorbed by the unit adsorption area included in the first adsorption area.
  • the cutting jig 15 is provided with a plurality of second suction ports 19A having a second suction area provided corresponding to the plurality of unit regions 7, respectively.
  • the unit adsorption area is larger than the second adsorption area.
  • the sealed substrate 1 having warpage is stably adsorbed by the first adsorbing port 12 having the first adsorbing area including the unit adsorbing area.
  • a cutting groove 24 is formed by cutting a part of the total thickness of the sealed substrate 1.
  • the warp of the sealed substrate 1 is reduced by forming the cutting groove 24.
  • the sealed substrate 1 with reduced warpage is placed on the cutting jig 15.
  • the sealed substrate 1 with reduced warpage is stably adsorbed by each second adsorbing port 19A.
  • a plurality of products 27 are manufactured by cutting the sealed substrate 1 in the cutting jig 15.
  • a sealed substrate (semi-finished product) on which cutting grooves are formed is handled as being included in the product.
  • Embodiment 1 of a cutting apparatus according to the present invention will be described with reference to FIGS. 1A to 6D. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code
  • the sealed substrate 1 is an object to be cut that is finally cut and separated into products.
  • the sealed substrate 1 is a semi-finished product when a plurality of products are manufactured.
  • the sealed substrate 1 is such that a substrate 2 made of a printed circuit board, a lead frame, etc., a chip-like component 3 mounted on each of a plurality of regions (described later) of the substrate 2, and a plurality of regions are collectively covered.
  • the chip-like component 3 is a semiconductor chip.
  • the substrate 2 corresponds to a substrate on which a circuit is formed.
  • the sealing resin 4 corresponds to an insulating member.
  • FIG. 1B shows a sealed substrate 1 having warpage.
  • the sealed substrate 1 has a plurality of first cutting lines 5 extending along the longitudinal direction and a plurality of second cutting lines 6 extending along the short direction, respectively. Is set automatically.
  • a plurality of unit regions 7 surrounded (separated) by a plurality of first cutting lines 5 and a plurality of second cutting lines 6 are separated into individual products. become.
  • five first cutting lines 5 extending along the longitudinal direction are set on the sealed substrate 1.
  • Nine second cutting lines 6 extending along the short direction are set on the sealed substrate 1. Therefore, eight unit regions 7 are formed along the longitudinal direction and four unit regions 7 along the short direction, and a total of 32 unit regions 7 are formed in a lattice shape.
  • Each unit area 7 corresponds to a product.
  • the unit region 7 formed on the sealed substrate 1 is arbitrarily set depending on the size and number of products to be separated.
  • the shape of the unit region 7 shown in FIG. 1A is a square.
  • the shape of the unit region 7 may be a rectangle other than a square.
  • a cutting jig used in the cutting apparatus according to the present invention will be described.
  • a cutting jig 9 is mounted on the cutting table 8A.
  • the cutting jig 9 is a jig for forming a cutting groove in the sealed substrate 1.
  • the cutting jig 9 includes a metal plate 10 and a resin sheet 11 fixed on the metal plate 10.
  • the resin sheet 11 is preferably formed of, for example, a silicone resin or a fluorine resin having appropriate flexibility.
  • the resin sheet 11 of the cutting jig 9 is provided with a first suction port 12 having a size and shape that does not depend on the size and shape of the product.
  • a first adsorption area of one first adsorption port 12 is an area in which one unit region 7 is adsorbed by the first adsorption port 12 in one unit region 7 (hereinafter referred to as “unit adsorption area”). ").
  • the first adsorption area is larger than the second adsorption area of one second adsorption port (described later) that adsorbs one unit region 7.
  • the unit adsorption area is larger than the second adsorption area.
  • the first suction port 12 sucks one unit region 7 by a unit suction area with a first suction force larger than the second suction force by one second suction port. Therefore, the cutting jig 9 can adsorb and hold the sealed substrate 1 having warpage.
  • the first suction ports 12 are provided in an arbitrary size and an arbitrary number N (N ⁇ the number of all unit regions 7).
  • the first adsorption area may be an area in a range including all the unit regions 7. In this case, the number of the first suction ports 12 is one.
  • a suction path 13 that penetrates the resin sheet 11 and the metal plate 10 from the inner bottom surface of the first suction port 12 in the cutting jig 9 is provided.
  • the suction path 13 is connected to a space 14 provided in the cutting table 8A.
  • the space 14 of the cutting table 8A is connected to a suction mechanism (not shown) provided outside.
  • the sealed substrate 1 is sucked to the cutting jig 9 by the suction path 13 and the first suction port 12.
  • the size / shape of the first suction port 12 does not depend on the size / shape of the product. In other words, the size / shape of the first suction port 12 does not depend on the size / shape of one unit region 7. Therefore, the cutting table 8A and the cutting jig 9 can be made common to a plurality of types (models) of products.
  • Rotating blade cuts a part of the total thickness of the adsorbed sealed substrate 1.
  • the cutting groove (not shown) formed by this reduces the warp of the sealed substrate 1.
  • the sealed substrate 1 is adsorbed to the cutting jig 9 with the sealing resin 4 side of the sealed substrate 1 facing upward, at least the sealed thickness of the sealed substrate 1 is sealed. It is preferable to cut the entire thickness of the stop resin 4. These reduce the warpage of the sealed substrate 1.
  • the cutting groove is too deep, there may be a problem that the sealed substrate 1 is bent in the cutting groove in a process of transporting the sealed substrate 1 on which the cutting groove is formed. It is preferable that the cutting groove is as deep as possible within a range in which a problem such as bending of the sealed substrate 1 does not occur.
  • the sealed substrate 1 is cut along a part of the plurality of first cutting lines 5 and the plurality of second cutting lines 6 included in the sealed substrate 1 shown in FIG. 1A.
  • the plurality of cutting grooves formed in the sealed substrate 1 reduces the warpage of the sealed substrate 1.
  • the entire thickness of the sealed substrate 1 is not cut (cut). Thereby, it is not necessary to provide the cutting groove corresponding to the external shape (outer edge) of the product in the resin sheet 11 (see FIG. 2B). Therefore, the cutting jig 9 can be easily manufactured as compared with the cutting jig. In addition, the cost for producing the cutting jig 9 can be suppressed.
  • the cutting jig 9 does not depend on the size of the product (specifically, the size and shape of each product). Therefore, when both of the following two conditions are satisfied, the cutting jig 9 can be made common to a plurality of types of sealed substrates 1.
  • the first condition is that the size of the sealed substrate 1 is included in the range of the size of the cutting jig 9.
  • the second condition is a case where the size of the sealed substrate 1 includes a size (region) that the cutting jig 9 can adsorb.
  • a cutting jig used in the cutting apparatus according to the present invention will be described with reference to FIGS. 3A and 3B.
  • a cutting jig 15 corresponding to a specific product is attached on the cutting table 8B.
  • the cutting jig 15 is a jig for cutting the sealed substrate 1 into pieces by a cutting apparatus.
  • the cutting jig 15 includes a metal plate 16 and a resin sheet 17 fixed on the metal plate 16.
  • the resin sheet 17 is required to have appropriate flexibility in order to reduce mechanical impact.
  • the resin sheet 17 is preferably formed of, for example, a silicone resin or a fluorine resin.
  • the resin sheet 17 of the cutting jig 15 has a plurality of plate-like protrusions 18 that suck and hold the plurality of unit regions 7 in the sealed substrate 1. Is provided. Corresponding to each unit region 7 of the sealed substrate 1, a total of 32 protrusions 18 are formed, 8 along the longitudinal direction and 4 along the short direction.
  • a plurality of second suction ports 19 ⁇ / b> A are provided at the upper ends of the plurality of protrusions 18.
  • One second suction port 19A corresponds to one unit region 7 respectively.
  • a suction path 19 ⁇ / b> B that penetrates the resin sheet 17 and the metal plate 16 from the inner bottom surface of each second suction port 19 ⁇ / b> A is provided.
  • the plurality of second suction ports 19A are respectively connected to the spaces 14 provided in the cutting table 8B through the suction paths 19B.
  • the space 14 of the cutting table 8B is connected to a suction mechanism (not shown) provided outside.
  • a plurality (32) of unit regions 7 in the sealed substrate 1 are sucked to the cutting jig 15 by the corresponding second suction ports 19A.
  • the left end second suction port 19 ⁇ / b> A is formed at both ends of the sealed substrate 1.
  • the left end unit area 7 is sucked, and the right end second suction port 19A sucks the right end unit area 7.
  • the suction of the unit region 7 by the second suction port 19A sequentially spreads from both ends of the sealed substrate 1 to the inside (to the center).
  • a gap is formed between the lower surface of the sealing resin 4 and the upper surface of the resin sheet 17 in the central portion of the sealed substrate 1.
  • the suction area (second suction area) of one second suction port 19A is one. It is smaller than the plane area of the unit region 7. Due to these reasons, when using the suction ports (second suction ports) 19A corresponding to the respective unit regions 7, there is a possibility that the sealed substrate 1 having a warp cannot be sucked particularly at the central portion thereof. is there.
  • the cutting jig 15 is provided with a plurality of first cutting grooves 20 extending along the longitudinal direction of the cutting jig 15.
  • the plurality of first cutting grooves 20 correspond to the plurality of first cutting lines 5 (see FIGS. 1A and 1B) extending along the longitudinal direction in the sealed substrate 1.
  • the cutting jig 15 is provided with a plurality of second cutting grooves 21 extending along the short direction of the cutting jig 15.
  • the plurality of second cutting grooves 21 correspond to the plurality of second cutting lines 6 (see FIGS. 1A and 1B) extending along the short direction in the sealed substrate 1.
  • each of the plurality of first cutting grooves 20 and the plurality of second cutting grooves 21 (the distance from the upper surface of the protrusion 18 to the inner bottom surface of each groove) is set to about 0.5 mm to 1.0 mm. .
  • the cutting table 8B is made common to a plurality of products, and only the cutting jig 15 is replaced according to the size and number of products.
  • FIGS. 4A to 5B a process of cutting and sealing the sealed substrate 1 having warpage will be described.
  • 4A and 4B show a process of forming the cutting grooves 23 and 24 by cutting the sealed substrate 1 using the rotary blade 22 attached to a cutting mechanism (not shown).
  • the X, Y, and Z directions in the following figures represent directions based on the coordinate system in the cutting device (see FIG. 7).
  • the sealed substrate 1 having a warp is reliably adsorbed using the cutting jig 9 shown in FIG. 4B.
  • FIGS. 3A to 4B it is explained that the sealed substrate 1 having a warp (see FIG. 3B) is reliably adsorbed using the cutting jig 9 shown in FIG. 4B.
  • FIG. 4A and 4B show an adsorption mechanism used for reliably adsorbing the sealed substrate 1 having warpage in the cutting apparatus according to the present invention.
  • the sealed substrate 1 is placed on the resin sheet 11 included in the cutting jig 9 attached to the cutting table 8A.
  • the cutting jig 9 is provided with two first suction ports 12.
  • One first suction port 12 corresponds to four rows of unit regions 7 shown in FIG. 4B.
  • a first adsorption area of one first adsorption port 12 is a unit adsorption area that is an area in which one unit region 7 is adsorbed by the first adsorption port 12 in one unit region 7. Including.
  • the unit adsorption area is larger than the second adsorption area for one unit region 7 by one second adsorption port 19A shown in FIG. 3B. This is obvious when FIG. 4B and FIG. 3B are compared. Accordingly, the first suction port 12 sucks one unit region 7 in the unit suction area with a first suction force larger than the second suction force by the second suction port 19A.
  • warpage of the sealed substrate 1 corresponding to each of the unit regions 7 positioned in the inner three rows in the left half of the sealed substrate 1 is sequentially corrected from the outside (from the left side). This effect is increased by adsorbing almost the entire surface of each of the unit regions 7 located in the inner three rows in the left half of the sealed substrate 1 by the first suction port 12 on the left side.
  • warpage of the sealed substrate 1 corresponding to each unit region 7 located in each of the three inner rows in the right half of the sealed substrate 1 is sequentially corrected from the outside (from the right side).
  • the sealed substrate 1 is first placed on the cutting jig 9 attached to the cutting table 8A.
  • a plurality of first cutting lines extending along the longitudinal direction of the sealed substrate 1 with the substrate 2 side of the sealed substrate 1 facing upward, instead of the state shown in FIGS. 4A and 4B
  • the sealed substrate 1 is arranged so that 5 (see FIG. 4A) is along the Y direction.
  • the sealed substrate 1 shown in FIG. 4A is rotated +90 degrees to place the sealed substrate 1 on the cutting jig 9.
  • the sealed substrate 1 adsorbed on the cutting jig 9 and the rotary blade 22 are aligned. Specifically, the rotary blade 22 is aligned with an alignment mark (not shown) formed in advance on the substrate 2. In this step, since the entire thickness of the sealed substrate 1 is not cut (cut), it is not necessary to form a cutting groove in the cutting jig 9 (resin sheet 11). Therefore, when the sealed substrate 1 is placed on the cutting jig 9, it is not necessary to align the cutting jig 9 and the sealed substrate 1.
  • a control unit (not shown) included in the cutting device includes a plurality of first cutting lines 5 extending along the longitudinal direction of the sealed substrate 1 and a plurality of extending along the short direction based on the captured image.
  • a second cutting line 6 is set.
  • the rotary blade 22 attached to a cutting mechanism (not shown) is rotated at a high speed of about 30,000 to 40,000 rpm.
  • the rotary blade 22 attached to the cutting mechanism is lowered.
  • the lower end of the rotary blade 22 is lowered to a predetermined depth position in the sealing resin 4 included in the sealed substrate 1.
  • the cutting table 8A and the rotary blade 22 are relatively moved in the X direction. Accordingly, in the sealed substrate 1 arranged by being rotated 90 degrees instead of the state shown in FIG. 4A, the rotary blade 22 is aligned with the position of the specific first cutting line 5 extending along the longitudinal direction. .
  • the sealed substrate 1 placed on the cutting table 8A (cutting jig 9) is moved in the Y direction using a moving mechanism (not shown).
  • 4A instead of the state shown in FIG. 4A, in the sealed substrate 1 arranged by being rotated 90 degrees, the thickness of a part of the total thickness along the first cutting line 5 extending along the longitudinal direction. Is cut by the rotary blade 22. For example, a predetermined thickness portion of the total thickness of the substrate 2 and the total thickness of the sealing resin 4 is cut.
  • the cutting groove 23 is formed along the first cutting line 5 extending along the longitudinal direction of the sealed substrate 1. In order to reduce warpage of the sealed substrate 1, it is preferable to form the cutting groove 23 by lowering the rotary blade 22 to an appropriate depth position in the sealed substrate 1.
  • the sealed substrate 1 is cut along a predetermined number of cutting lines 5 among the plurality of first cutting lines 5 extending along the longitudinal direction of the sealed substrate 1.
  • two cutting lines 5 out of five cutting lines 5 extending along the longitudinal direction.
  • Cutting grooves 23b and 23d extending along the line are formed.
  • the sealed substrate 1 is rotated by -90 degrees.
  • the sealed substrate 1 is arranged so that the second cutting line 6 extending along the short direction of the sealed substrate 1 is along the Y direction.
  • the rotary blade 22 attached to a cutting mechanism (not shown) is rotated at a high speed by about 30,000 to 40,000 rpm.
  • the rotary blade 22 attached to the cutting mechanism is lowered.
  • the lower end of the rotary blade 22 is lowered to a predetermined depth position of the sealing resin 4 included in the sealed substrate 1.
  • the cutting table 8A and the rotary blade 22 are relatively moved in the X direction. Thereby, the rotary blade 22 is aligned with the position of the specific second cutting line 6 extending along the short direction of the sealed substrate 1.
  • the sealed substrate 1 placed on the cutting table 8A (cutting jig 9) is moved in the Y direction using a moving mechanism (not shown).
  • a moving mechanism not shown
  • the rotary blade 22 rotating at high speed, along the second cutting line 6 extending along the short direction of the sealed substrate 1, for example, the total thickness of the substrate 2 and the total thickness of the sealing resin 4.
  • a predetermined thickness portion is cut.
  • the cutting groove 24 is formed along the second cutting line 6 extending along the short direction of the sealed substrate 1.
  • the sealed substrate 1 is cut along a predetermined number of cutting lines 6 among the plurality of second cutting lines 6 extending along the short direction of the sealed substrate 1.
  • the cutting grooves 24c, 24e, and 24g are formed on the sealed substrate 1.
  • Cutting grooves 23 and 24 are formed in the sealed substrate 1. As a result, firstly, it is considered that at least a part of the shrinkage stress when the sealing resin 4 is cured is released. Therefore, since the warpage of the sealed substrate 1 is reduced, the sealed substrate 1 is reliably attracted to the cutting jig 9. Second, since the rigidity of the sealed substrate 1 is reduced, the sealed substrate 1 is surely adsorbed to the cutting jig 9. Due to at least one of the reduction in warpage or the reduction in rigidity in the sealed substrate 1, the sealed substrate 1 is reliably adsorbed to the cutting jig 9.
  • the number and position of the cutting grooves 23 and 24 formed in the sealed substrate 1 are appropriately selected according to the mode and degree of warpage.
  • one cutting groove 24 along the short direction may be formed at the center. In this case, it may not be necessary to form the cutting groove 23 along the longitudinal direction. Depending on the mode and degree of warpage, it may be sufficient that at least one of the cutting grooves 23 and 24 is formed.
  • the sealed substrate 1 is virtually divided into 12 intermediate regions by the plurality of cutting grooves 23 and 24 formed in the sealed substrate 1.
  • the intermediate areas (total of 8) in the uppermost and lowermost stages shown in FIG. 4A each have two unit areas 7.
  • the middle region (four in total) in the middle stage has four unit regions 7 each.
  • the sealed substrate 1 in which the plurality of cutting grooves 23 and 24 are formed is a semi-finished product in the process of manufacturing a plurality of products.
  • FIGS. 5A and 5B a sealed substrate in which cutting grooves 23 and 24 (see FIG. 4A) are formed on the cutting jig 15 attached to the cutting table 8B. 1 is placed.
  • the first cutting line 5 and the first line extending along the longitudinal direction of the sealed substrate 1
  • the sealed substrate 1 is arranged so that the cutting groove 23 (see FIG. 4A) is along the Y direction.
  • the sealed substrate 1 shown in FIG. 5A is rotated +90 degrees to place the sealed substrate 1 on the cutting jig 15.
  • the sealed substrate 1 and the cutting jig 15 are aligned.
  • the first cutting line 5 and the first cutting groove 23 overlap the first cutting groove 20 (see FIG. 3A)
  • the second cutting line 6 and the second cutting groove 24 are the second. This is performed so as to overlap the cutting groove 21 (see FIG. 3A).
  • the first cutting line 5 and the first cutting groove 23 (see FIG. 4A) extending along the longitudinal direction in the sealed substrate 1 are cut grooves 20 (see FIG. 4A) extending along the longitudinal direction in the cutting jig 15. 3A)).
  • the rigidity of the sealed substrate 1 is reduced by forming the first cutting groove 23 and the second cutting groove 24. Therefore, the plurality of second suction ports 19 ⁇ / b> A formed in the cutting jig 15 corresponding to the plurality of unit regions 7 of the sealed substrate 1 can stably suck each unit region 7.
  • a control unit (not shown) included in the cutting device has a plurality of first cutting lines 5 (see FIG. 4A) and a plurality of first cutting lines extending along the longitudinal direction of the sealed substrate 1 based on the captured image.
  • One cutting groove 23, and a plurality of second cutting lines 6 and a plurality of second cutting grooves 24 extending along the short direction are set again.
  • the rotary blade 22 attached to a cutting mechanism (not shown) is rotated at a high speed of about 30,000 to 40,000 rpm.
  • the rotary blade 22 attached to the cutting mechanism is lowered.
  • the lower end of the rotary blade 22 is lowered to a predetermined position slightly below the lower surface of the sealing resin 4 of the sealed substrate 1.
  • the cutting table 8B and the rotary blade 22 are relatively moved in the X direction.
  • the rotary blade 22 is aligned with the position 23 (see FIG. 4A).
  • the seal rotated by +90 degrees from that state and placed on the cutting table 8B (cutting jig 15)
  • the finished substrate 1 is moved in the Y direction.
  • the substrate 2 and the sealing resin 4 are collectively cut using the rotary blade 22 along a first cutting line 5 (see FIG. 4A) extending along the longitudinal direction.
  • the first cut trace 25 (25a) shown in FIG. 5A is formed.
  • the remaining portion (the remaining thickness portion) where the sealing resin 4 is formed is All are cut using the rotary blade 22.
  • the first cut mark 25 (25b) shown in FIG. 5A is formed.
  • the first cut marks 25 (25a, 25b) are indicated by thick solid lines in FIG. 5A.
  • the end material portions 1a and 1b portions indicated by two-dot chain lines on the upper side and the lower side in FIG. 5A formed along the longitudinal direction of the sealed substrate 1 are removed.
  • the sealed substrate 1 is rotated by -90 degrees. As a result, as shown in FIG. 5A, the sealed substrate 1 is such that the second cutting line 6 and the second cutting groove 24 extending along the short direction of the sealed substrate 1 are along the Y direction. 1 is placed.
  • the rotary blade 22 attached to a cutting mechanism (not shown) It is rotated at a high speed of about 30,000 to 40,000 rpm.
  • the rotary blade 22 attached to the cutting mechanism is lowered.
  • the lower end of the rotary blade 22 is lowered to a predetermined position slightly below the lower surface of the sealing resin 4 of the sealed substrate 1.
  • the cutting table 8B and the rotary blade 22 are relatively moved in the X direction. Thereby, the rotary blade 22 is aligned with the position of the specific second cutting line 6 or the specific second cutting groove 24 extending along the short direction of the sealed substrate 1.
  • the sealed substrate 1 placed on the cutting table 8B (cutting jig 15) is moved in the Y direction by using a moving mechanism (not shown).
  • the substrate 2 and the sealing resin 4 included in the sealed substrate 1 are collectively used using the rotary blade 22. Disconnect.
  • the second cut trace 26 (26a) is formed.
  • a rotary blade 22 is used to remove the remaining portion (remaining thickness portion) where the sealing resin 4 is formed along the second cutting groove 24 extending along the short direction of the sealed substrate 1. Disconnect everything.
  • the second cut trace 26 (26b) is formed.
  • the second cut marks 26 (26a, 26b) are indicated by thick solid lines in FIG. 5A.
  • FIG. 5A shows a state where only the end material portion 1c (the portion indicated by a two-dot chain line in the drawing) is removed.
  • the sealed substrate 1 is surrounded by a first cut trace 25 formed along the longitudinal direction and a second cut trace 26 formed along the short direction.
  • the unit area 7 corresponds to the product 27 that has been separated.
  • the sealed substrate 1 whose warpage or rigidity has been reduced by forming the first cutting groove 23 and the second cutting groove 24 in the sealed substrate 1 is reliably attracted to the cutting jig 15.
  • each product 27 corresponding to each unit region 7 is stably adsorbed by each second adsorbing port 19A. Therefore, in a state where the sealed substrate 1 is singulated, each product 27 is stably adsorbed to the cutting jig 15 by the second suction ports 19A formed in the cutting jig 15. .
  • a cutting jig 9 for forming a cutting groove in the sealed substrate 1 and a piece for cutting the sealed substrate 1 into pieces.
  • a cutting jig 15 is provided.
  • the second suction port 19A of the cutting jig 15 has a second suction area corresponding to each of the plurality of unit regions 7 of the sealed substrate 1.
  • the first suction port 12 of the cutting jig 9 has a first suction area larger than the second suction area.
  • the unit adsorption area that is included in the first adsorption area and that adsorbs the plurality of unit regions 7 is larger than the second adsorption area. Therefore, the sealed substrate 1 having warpage is adsorbed to the cutting jig 9 by the first adsorption port 12 including a unit adsorption area larger than the second adsorption area.
  • the sealed substrate 1 having warpage is adsorbed by the cutting jig 9
  • a part of the total thickness of the sealed substrate 1 is cut.
  • the warpage of the sealed substrate 1 is reduced, and the rigidity of the sealed substrate 1 is reduced.
  • the sealed substrate 1 with reduced warpage or the sealed substrate 1 with reduced rigidity is placed on the cutting jig 15.
  • the cutting jig 15 is provided with a plurality of second suction ports 19A respectively corresponding to the plurality of unit regions 7 of the sealed substrate 1.
  • the A plurality of products 27 are manufactured by cutting the sealed substrate 1 in the cutting jig 15. Therefore, the sealed substrate 1 having warpage can be cut in two stages.
  • the first suction port 12 having a size and shape that does not depend on the size and shape of the product is provided in the cutting jig 9. Since cutting (cutting) the entire thickness of the sealed substrate 1 is not performed, it is not necessary to provide the cutting jig 9 with a cutting groove corresponding to the size of the product. Therefore, the cutting jig 9 can be easily manufactured as compared with a normal cutting jig, and the cost for manufacturing the cutting jig 9 can be suppressed. In addition, the cutting jig 9 does not depend on the size and shape of the product. Therefore, if the size of the sealed substrate 1 is within the range of the size of the cutting jig 9, the cutting table 8A and the cutting jig 9 are common to a plurality of types (models) of products. Can be
  • the two cutting grooves 23b and 23d extending along the longitudinal direction and the three cutting grooves 24c, 24e and 24g extending along the short direction are provided.
  • the warpage of the sealed substrate 1 was reduced.
  • the cutting groove 23 extended along all the cutting lines 5 extended along the longitudinal direction of the sealed substrate 1 may be formed.
  • the number of cutting grooves formed on the sealed substrate 1 is the size of the sealed substrate 1, the thickness of the sealed substrate 1, the thickness of the substrate 2, the thickness of the sealing resin 4, and the product 27 (FIG. 5A and FIG. 5B) and the like.
  • a cutting groove was formed by cutting a predetermined thickness portion of the total thickness of the substrate 2 and the total thickness of the sealing resin 4 included in the sealed substrate 1.
  • the present invention is not limited to this, and only a predetermined thickness portion of the total thickness of the substrate 2 included in the sealed substrate 1 may be cut to form a cutting groove. This method is effective, for example, when the total thickness of the sealing resin 4 is smaller than the total thickness of the substrate 2.
  • a resin sheet 11 having a first suction port 12 below the cutting line 6 at the center of the sealed substrate 1 may be used.
  • the sealed substrate 1 can be cut along one cutting line 6 in the central portion.
  • two semi-finished products are produced from the sealed substrate 1.
  • Two semi-finished products with reduced warpage are adsorbed on the cutting jig 15 shown in FIG. 5B.
  • each semi-finished product adsorbed on the cutting jig 15 is cut.
  • cutting grooves 23 and 24 are formed in the sealed substrate 1 at cutting lines 5 and 6 of the sealed substrate 1. Also good.
  • a unit adsorption area which is an area where one unit region 7 is adsorbed by one first adsorption port 12, and one first adsorption area.
  • the relationship with the second adsorption area which is the area where one unit region 7 is adsorbed by the two adsorption ports 19A, will be described.
  • the length is represented by an anonymous number (a dimensionless number).
  • the unit adsorption area is larger than the second adsorption area.
  • the first adsorption port 12 adsorbs one unit region 7 with a slightly larger adsorption force than the second adsorption port 19A. Stay as you can.
  • one first suction port 12 in the present modification corresponds to each of the unit regions 7 corresponding to the four unit regions 7 arranged along the vertical direction in FIG. 6A. Cover parts other than both ends.
  • One first suction port 12 is arranged to extend to the outside of the upper and lower unit regions 7 shown in FIG. 6A.
  • a square unit region 7 in which the length L1 of one side of the unit region 7 is 10 will be described as an example of the unit region 7 included in the sealed substrate 1.
  • FIG. 6D shows, as a plan view, the unit region 7 adsorbed by the second adsorption port 19A in the step of cutting the sealed substrate 1 shown in FIGS. 5A and 5B.
  • FIG. 6D an aspect in which one unit region 7 is adsorbed by a unit adsorption area larger than the second adsorption area S2 in the process of forming the cutting groove will be examined.
  • a cutting groove (see the cutting groove 21 in FIG. 5B) is unnecessary. Based on this, the cutting groove is eliminated from the state of FIG. 6D and the suction port is expanded.
  • the unit adsorption area included in the first adsorption area is compared with the second adsorption area S2.
  • the unit adsorption area S1 is 64/49 times ( ⁇ 1.31) times the second adsorption area S2.
  • the first suction force by the first suction port 12 targeting one unit region 7 is the second suction force by the second suction port 19A targeting one unit region 7. It becomes about 1.3 times the force.
  • the unit adsorption area S1 is preferably 1.3 times or more of the second adsorption area S2.
  • FIG. 6C shows, as a plan view, another aspect of the unit region 7 that is sucked by the first suction port 12 in the step of forming the cutting groove.
  • Another unit adsorption area S1 in another aspect of the unit region 7 is 70/49 times ( ⁇ 1.43) times the first adsorption area S1.
  • the first suction force by the first suction port 12 targeting one unit region 7 is the second suction force by the second suction port 19A targeting one unit region 7. It becomes about 1.4 times the force.
  • the unit adsorption area S1 is more preferably 1.4 times or more of the second adsorption area S2.
  • the sealed substrate 1 generally has both end portions projecting toward the sealing resin 4 due to shrinkage stress when the sealing resin 4 is cured. Deform. In other words, the deformation at both ends of the sealed substrate 1 is the largest.
  • the unit adsorption area S1 which is the area where one unit region 7 is adsorbed by one first adsorption port 12, is the area where one unit region 7 is adsorbed by one second adsorption port 19A. It is preferable that it is 1.3 times or more than the second adsorption area S2. More preferably, the first adsorption area S1 is 1.4 times or more than the second adsorption area S2.
  • first suction ports 12 instead of the two (two rows) suction ports (first suction ports) 12 shown in FIGS. 2B and 4B, four ( (Four rows) of first suction ports 12 are provided.
  • Adsorption paths 13 and on-off valves respectively connected to the four first adsorption ports 12 are provided. In this case, four piping systems are provided.
  • the sealed substrate 1 when the sealed substrate 1 is placed on the cutting jig 9 with the substrate 2 side up, the bottom surface of the sealing resin 4 at the center of the sealed substrate 1 And a gap is formed between the upper surface of the resin sheet 11.
  • the sealed substrate 1 is mounted using the first suction ports 12 (one at the right end and one at the left) corresponding to both ends of the sealed substrate 1.
  • the sealed first substrate 1 is sucked using the remaining first suction ports 12 (two in the center). Thereby, the sealed substrate 1 having warpage can be sucked and held.
  • the sealed substrate 1 When the sealed substrate 1 is adsorbed to the cutting jig 9 with the substrate 2 side of the sealed substrate 1 facing up, the total thickness of the substrate 2 and the sealing resin of the sealed substrate 1 It is preferable to cut a part of the thickness part 4 (see FIG. 4B). This further reduces the warpage of the sealed substrate 1 and further reduces the rigidity of the sealed substrate 1.
  • the sealed substrate 1 When the sealed substrate 1 is arranged on the cutting jig 9 with the sealing resin 4 side up, the lower surface of the substrate 2 and the upper surface of the resin sheet 11 are formed at both ends of the sealed substrate 1. A gap is generated between them. In this case, first, the sealed substrate 1 is sucked by using the first suction ports 12 (two in the central portion) located corresponding to the central portion of the sealed substrate 1. Next, the sealed substrate 1 is sucked using the first suction ports 12 (one at the right end and one at the left end) at the remaining both ends.
  • the total thickness of the sealing resin 4 of the sealed substrate 1 It is preferable to cut a part of the thickness of the substrate 2. This further reduces the warpage of the sealed substrate 1 and further reduces the rigidity of the sealed substrate 1.
  • FIGS. 6A and 6B As a second modification, for example, instead of the two (two rows) first suction ports 12 shown in FIGS. 2B and 4B, eight (eight rows) shown in FIGS. 6A and 6B.
  • the first suction port 12 is provided.
  • the first intermediate portion located at the second and third positions from both ends is used.
  • the sealed substrate 1 is sucked using the suction ports 12 (four in total).
  • the sealed substrate 1 is sucked using the remaining first suction ports 12 (two at the center and two at both ends). Thereby, the sealed substrate 1 having warpage can be sucked and held.
  • the object to be cut is a rectangle other than a square (particularly, when the object to be cut is a rectangle having a large aspect ratio like the object to be cut (sealed substrate 1) shown in FIG. 1A). It is effective for.
  • one elongated first suction port 12 shown in FIG. 6A is provided corresponding to a plurality (four in FIG. 1A) of row-shaped unit regions 7 along the short direction. Eight elongated first suction ports 12 are provided so as to be aligned along the longitudinal direction. Eight rows of first suction ports 12 are respectively connected to different piping systems (eight).
  • Another mode of the eight rows of first suction ports 12 is a mode in which two to three first suction ports 12 arranged along the short side direction are arranged in eight rows along the longitudinal direction.
  • the area of the sealed substrate 1 to which the one first suction port 12 sucks is larger than the area of one unit region 7.
  • suction ports 12 are provided corresponding to each of a plurality (four in FIG. 1A) of row-like unit regions 7 along the short direction.
  • the four first suction ports 12 arranged in one row are provided in eight rows so as to be arranged along the longitudinal direction.
  • the eight rows of the first suction ports 12 are respectively connected to different piping systems (eight).
  • a plurality of first suction ports 12 are sequentially used with a time difference depending on the deformation (including warpage and undulation) of the workpiece. By this, the to-be-cut object which has curvature can be adsorbed reliably.
  • first suction ports 12 Eight rows of first suction ports 12 are sequentially used from the center toward both ends. Eight rows of first suction ports 12 are sequentially used from both ends toward the center. The eight rows of the first suction ports 12 are sequentially used from the intermediate portion located between the central portion and both end portions toward the central portion, and then sequentially used from the intermediate portion toward both end portions. Eight rows of first suction ports 12 are sequentially used from the intermediate portion toward both ends, and then sequentially used from the intermediate portion toward the central portion. Eight rows of first suction ports 12 are sequentially used from one short side toward the other short side.
  • a cut sheet 9 such as a sealed substrate 1 attached to the pressure-sensitive adhesive tape is attached to the resin sheet 11 (See FIG. 4B).
  • the resin sheet 11 having the first suction port 12 shown in FIG. 4B sucks the adhesive tape to which the object to be cut is attached.
  • the adhesive tape to which the to-be-cut object which has curvature is affixed is reliably adsorbed by the resin sheet 11 of the jig 9 for cutting.
  • the cutting grooves 23 and 24 are formed in the workpiece adsorbed on the resin sheet 11 using the cutting blade 22.
  • the cutting blade 22 is lowered until the lower end of the cutting blade 22 reaches a predetermined position in the thickness of the adhesive tape. Thereafter, the cutting blade 22 and the cutting jig 9 are relatively moved to cut the object to be cut.
  • the cutting jig 9 shown in FIG. 4 functions as a cutting jig.
  • Each cut product 27 (see FIG. 5A and FIG. 5B) is adsorbed, separated from the adhesive tape, and transferred to a tray for storage.
  • an ultraviolet curable adhesive is used as the adhesive that the adhesive tape has.
  • the adhesive tape is irradiated with ultraviolet rays to reduce the adhesive strength of the adhesive. Therefore, the product 27 can be adsorbed and easily separated from the adhesive tape.
  • a conveying jig handles the sealed substrate 1 as follows. First, the transfer jig places the sealed substrate 1 on the upper surface of the resin sheet 11 shown in FIG. 4B while adsorbing the substrate 2 of the sealed substrate 1 shown in FIG. 3B. . Next, the transfer jig slightly moves in the ⁇ Z direction shown in FIG. 4B to press the sealed substrate 1 against the upper surface of the resin sheet 11. As a result, the warpage (see FIG. 3B) of the sealed substrate 1 is corrected. Next, the sealed substrate 1 is sucked onto the upper surface of the resin sheet 11 using the first suction port 12 shown in FIG. 4B.
  • the transfer jig releases the suction to the sealed substrate 1.
  • the conveying jig moves in the X direction or the Y direction shown in FIG. 4B and moves away from above the cutting jig 9.
  • the cutting device 28 is a device that divides an object to be cut into a plurality of products.
  • the cutting device 28 includes a substrate supply module A, a substrate cutting module B, and an inspection module C as components.
  • Each component (each module A to C) is detachable and replaceable with respect to other components.
  • the substrate supply module A is provided with a substrate supply mechanism 29.
  • the sealed substrate 1 corresponding to the object to be cut is carried out from the substrate supply mechanism 29 and transferred to the substrate cutting module B by a transfer mechanism (not shown).
  • the cutting device 28 shown in FIG. 7 is a twin-cut table type cutting device. Therefore, the substrate cutting module B is provided with one cutting table 8A and one cutting table 8B. A cutting jig 9 (see FIGS. 2A and 2B) is attached to the cutting table 8A. A cutting jig 15 (see FIGS. 3A and 3B) is attached to the cutting table 8B.
  • the cutting table 8A can be moved in the Y direction in the figure by the moving mechanism 30A, and can be rotated in the ⁇ direction by the rotating mechanism 31A.
  • the cutting table 8B can be moved in the Y direction in the figure by the moving mechanism 30B, and can be rotated in the ⁇ direction by the rotating mechanism 31B.
  • the substrate cutting module B is provided with an alignment camera (not shown). The alignment camera can move independently in the X direction.
  • the substrate cutting module B is provided with two spindles 32A and 32B as a cutting mechanism.
  • the cutting device 28 is a twin spindle cutting device provided with two spindles 32A and 32B.
  • the spindles 32A and 32B are independently movable in the X direction and the Z direction.
  • the spindles 32A and 32B are provided with cutting water nozzles (not shown) for injecting cutting water to suppress frictional heat generated by the rotary blades 22A and 22B rotating at high speed.
  • the rotary blade 22A cuts the sealed substrate 1 by rotating in a plane including the Y direction and the Z direction.
  • the rotary blade 22B cuts the sealed substrate 1 by rotating in a plane including the Y direction and the Z direction.
  • the inspection module 33 is provided with an inspection table 33.
  • An assembly of a plurality of products 27 obtained by cutting the sealed substrate 1 into pieces, that is, the cut substrate 34 is placed on the inspection table 33.
  • the plurality of products 27 are inspected by an inspection camera (not shown) and sorted into non-defective products and defective products. Non-defective products are stored in the tray 35.
  • control unit CTL that performs all operations and controls such as the operation of the cutting device 28, the transport of the sealed substrate 1, the cutting and cutting of the sealed substrate 1, and the inspection of the product 27 is performed on the substrate. It was provided in the supply module A. Not limited to this, the control unit CTL may be provided in another module.
  • the sealed substrate 1 is placed on and adsorbed to a cutting jig 9 attached to the cutting table 8A.
  • a cutting groove is formed in the sealed substrate 1 adsorbed by the cutting jig 9 by the rotary blade 22A attached to the spindle 32A. For example, a part of the total thickness is cut along a part of the plurality of cutting lines set in the sealed substrate 1. By forming the cutting groove in the sealed substrate 1, warpage of the sealed substrate 1 is reduced.
  • the sealed substrate 1 with reduced warpage is placed on the cutting jig 15. Since the warpage of the sealed substrate 1 is reduced, each unit region 7 corresponding to the product 27 is stably sucked by the respective second suction ports 19A formed in the cutting jig 15 (FIG. 3A and FIG. 3B).
  • the sealed substrate 1 adsorbed by the cutting jig 15 is cut by the rotary blade 22B attached to the spindle 32B.
  • the entire thickness of the sealed substrate 1 is cut along the cutting line set in the sealed substrate 1, and all the sealed substrate 1 is cut along the cutting grooves formed in the sealed substrate 1. A portion of the thickness corresponding to the remaining thickness is cut. As a result, the sealed substrate 1 is separated into pieces and the product 27 is manufactured (see FIGS. 5A and 5B).
  • twin-cut table type cutting device 28 having a twin spindle configuration has been described.
  • present invention is not limited to this, and the present invention can also be applied to a twin-cut table type cutting apparatus having a single spindle configuration.
  • the cutting jig 9 is attached to the cutting table 8A, and the cutting jig 15 is attached to the cutting table 8B.
  • the present invention is not limited to this, and the present invention can also be applied to the case where two single-cut table type cutting devices are used.
  • the cutting jig 9 is attached to one of the cutting devices, and the one cutting device is positioned as a dedicated device for reducing warpage of the sealed substrate 1.
  • the cutting jig 15 is attached to the other cutting device, and the other cutting device is positioned as a dedicated device for cutting the sealed substrate 1 into pieces.
  • the object to be cut in the present embodiment has a substantially circular planar shape.
  • the object to be cut is, for example, a sealed wafer 36 made of a resin-sealed semiconductor wafer.
  • the sealed wafer 36 includes a plurality of (52 in FIG. 8) unit regions 7, a notch NT, and a sealing resin (not shown).
  • An electronic circuit is built in each unit area 7.
  • the sealed wafer 36 is placed on the resin sheet 11 of the cutting jig 9 (see FIGS. 2A and 2B) with the semiconductor wafer main body W facing up.
  • the object to be cut may be a circular sealed substrate in which a semiconductor chip is attached to each unit region 7 of the printed circuit board having a circular planar shape.
  • the resin sheet 11 has a second suction port 37 having a second suction area corresponding to one unit region 7 (the second suction port 37 shown in FIGS. 3A, 3B, and 5B). Corresponding to the suction port 19A).
  • the second suction ports 37 are provided in a number equal to N (for example, 52 in the case of FIG. 8) which is the number of all the unit regions 7.
  • N for example, 52 in the case of FIG. 8
  • only one of the second suction ports 37 of the resin sheet 11 located at the lower right is shown by a thin broken line between the second suction ports 37.
  • the group of (52) second suction ports 37 are connected to a suction mechanism (not shown) via each suction path 38 and the on-off valve.
  • Each second suction port 37 and each suction path 38 provided in the resin sheet 11 have the same structure as each second suction port 19A and each suction path 19B provided in the resin sheet 17 shown in FIG. 5B. Have.
  • the 52 second suction ports 37 respectively corresponding to the 52 unit regions 7 are divided into three groups shown in FIG.
  • the three groups are a central group SA1, an intermediate group SA2 located outside the center group SA1, and an outer edge group SA3 located outside.
  • Each of the three groups corresponds to one first suction port (see the first suction port 12 shown in FIGS. 2A and 2B).
  • the center group SA1 has four second suction ports 37. Therefore, the suction port (first suction port) included in the central group SA1 is an aggregate of four second suction ports 37.
  • the adsorption area (first adsorption area) of the aggregate is the sum of the adsorption areas of one second adsorption port 37 (in this case, the adsorption area of one second adsorption port 37). 4 times).
  • the suction port (first suction port) included in the intermediate group SA2 is an aggregate of 32 second suction ports 37.
  • the adsorption area (first adsorption area) of the aggregate is 32 times the adsorption area of one second adsorption port 37.
  • the suction port (first suction port) included in the outer edge group SA3 is an aggregate of 16 second suction ports 37.
  • the adsorption area (first adsorption area) of the aggregate is 16 times the adsorption area of one second adsorption port 37.
  • all of the plurality of second suction ports 37 of the center group SA1 are communicated with each other.
  • the plurality of second suction ports 37 included in the group SA2 are all communicated, and the plurality of second suction ports 37 included in the outer edge group SA3 are all communicated.
  • Each second suction port 37 included in the center group SA1 and a suction mechanism (not shown) provided outside are connected to each other through each suction path 38 and a first on-off valve (not shown).
  • the second suction port 37 of the intermediate group SA2 and the suction mechanism are connected to each other through each suction path 38 and a second on-off valve (not shown).
  • the second suction port 37 of the outer edge group SA3 and the suction mechanism are connected to each other through each suction path 38 and a third on-off valve (not shown).
  • One suction mechanism used in common for each group is provided.
  • the second suction ports 37 included in the central group SA1, the second suction ports 37 included in the intermediate group SA2, and the second suction ports 37 included in the outer edge group SA3 are simultaneously used. Then, the sealed wafer 36 is adsorbed. In addition, also in this embodiment, it is possible to adopt a modification in which the sealed wafer 36 is sucked by using a plurality of second suction ports 37 sequentially with a time difference.
  • the sealed wafers are sequentially arranged in the order of the outer edge group SA3, the intermediate group SA2, and the center group SA1. It is preferable to adsorb 36. Depending on the warpage of the sealed wafer 36, the sealed wafer 36 may be adsorbed in the order of the intermediate group SA2, the central group SA1, and the outer edge group SA3. The intermediate group SA2, the outer edge group SA3, and the central group SA1. The order may be acceptable.
  • the sealed wafer 36 When a gap is generated between the lower surface of the semiconductor wafer and the upper surface of the resin sheet at the outer edge of the sealed wafer 36, the sealed wafer 36 is moved in the order of the center group SA1, the intermediate group SA2, and the outer edge group SA3. Adsorption is preferred. Depending on the warpage of the sealed wafer 36, the sealed wafer 36 may be adsorbed in the order of the intermediate group SA2, the central group SA1, and the outer edge group SA3. The intermediate group SA2, the outer edge group SA3, and the central group SA1. The order may be acceptable.
  • one suction port 37 corresponding to one unit region 7 is provided in the resin sheet 11.
  • a plurality (three in FIG. 8) of groups each including a plurality of second suction ports 37 are provided for the entire region of the sealed wafer 36.
  • Three piping systems corresponding to each of the three groups are provided.
  • the sealed wafers 36 are sucked by using a plurality of groups sequentially in accordance with the manner in which the sealed wafers 36 warp. Thereby, first, the sealed wafer 36 can be appropriately adsorbed according to the mode in which the sealed wafer 36 warps. Secondly, when an adhesive tape is used, the resin sheet 11 can be shared between the cutting jig and the cutting jig.
  • the plurality of second suction ports 37 may be divided into more groups.
  • the intermediate group SA2 shown in FIG. 8 may be divided into eight square groups each having four second suction ports 37.
  • the outer edge group SA3 shown in FIG. 8 may be divided into four groups in rows each having four second suction ports 37.
  • the object to be cut is adsorbed as follows according to the distance from the upper surface of the resin sheet 11 to the lower surface of the object to be cut (hereinafter referred to as “separation distance”).
  • separation distance the distance from the upper surface of the resin sheet 11 to the lower surface of the object to be cut.
  • a plurality of second suction ports 37 positioned around the mouth 37 are used to suck the object to be cut.
  • the object to be cut is adsorbed, the object to be cut is adsorbed using a plurality of second suction ports 37 positioned around the plurality of second suction ports 37 already used.
  • one suction port group composed of a plurality of second suction ports 37 is sequentially arranged in a substantially concentric shape (or a frame shape having the same center).
  • the object to be cut is adsorbed by sequentially using a plurality of adsorbing port groups with a time difference.
  • the object to be cut can be adsorbed by using a plurality of suction port groups sequentially with a time difference according to the deformation of the object to be cut (including warping, waviness, and deflection).
  • the plurality of suction port groups described above are Use as follows.
  • a plurality of suction port groups may be used sequentially from the center toward both ends (the left end and the right end in FIG. 1A).
  • a plurality of suction port groups may be used sequentially from both ends toward the center.
  • the plurality of suction port groups may be sequentially used from the intermediate portion located between the central portion and both end portions toward the central portion, and then sequentially used from the intermediate portion toward both end portions.
  • a plurality of suction port groups may be used sequentially from the intermediate part toward both ends, and then used sequentially from the intermediate part toward the central part.
  • a plurality of suction port groups may be used sequentially from one end (left end or right end in FIG. 1A) to the other end (right end or left end) of the workpiece shown in FIG. 1A.
  • the plurality of suction port groups thus used are used as follows.
  • a plurality of suction port groups may be used sequentially from the central portion toward the peripheral portion.
  • a plurality of suction port groups may be used sequentially from the peripheral part toward the central part.
  • the plurality of suction port groups may be used sequentially from the intermediate portion located between the central portion and the peripheral portion toward the central portion, and then sequentially used from the intermediate portion toward the peripheral portion.
  • the plurality of suction port groups may be used sequentially from the intermediate portion toward the peripheral portion and then sequentially from the intermediate portion toward the central portion.
  • a plurality of suction port groups may be used sequentially from one end to the other end of the workpiece shown in FIG.
  • a plurality of single suction ports corresponding to one suction port group may be provided.
  • One suction port and one suction port corresponding to the four unit regions 7 are sequentially provided.
  • a mode in which a plurality of suction port groups are sequentially used with a time difference may be prepared for a plurality of types.
  • a plurality of types of software that realize the plurality of types of aspects are stored in the control unit CTL shown in FIG.
  • the control unit CTL selects optimum software from a plurality of types of software and causes the optimum software to be executed. Until the workpiece is adsorbed, the control unit CTL may sequentially execute a plurality of types of software.
  • the cutting device shown in FIG. 7 may be provided with a measuring mechanism that measures the deformation of the workpiece.
  • the control unit CTL selects the optimum software from a plurality of types of software and executes the optimum software according to the deformation mode (specification of uneven portions, deformation dimensions, etc.) measured by the measurement mechanism. You may let them.
  • the present invention is not limited to this, and the present invention can also be applied to a case of cutting an object other than a rectangle (including a square) and having an irregular planar shape other than a circle.
  • the sealed substrate 1 in which the sealing resin 4 was formed on the substrate 2 was cut as an object to be cut was shown.
  • a lead frame, a glass epoxy laminated board, a printed wiring board, a ceramic substrate, a metal base substrate, a film base substrate, etc. are used as a substrate in an object to be cut, and a sealing resin is formed thereon.
  • the present invention can also be applied to a finished substrate.
  • Functional elements include sensors, filters, actuators, oscillators, etc. in addition to semiconductor elements such as ICs (Integrated Circuits), transistors, and diodes.
  • a plurality of functional elements may be mounted on one unit region 7.
  • a semiconductor wafer of a silicon semiconductor or a compound semiconductor cuts an object to be cut having a substantially circular shape such as a wafer level package encapsulated with an encapsulating resin.
  • the present invention can be applied.
  • the sealing resin corresponds to the insulating member.
  • the present invention can be applied to the case of cutting an object made of a semiconductor wafer.
  • the passivation film for protecting the circuit formed on the semiconductor wafer corresponds to the insulating member.
  • the semiconductor wafer corresponds to a substrate on which a circuit is formed.
  • the chip-shaped component 3 mounted on each unit region 7 in the substrate 2 may be not only one chip-shaped component 3 that is an active element but also a plurality of chip-shaped components (including passive components).
  • the chip-like component 3 is an example, and a mechanical component such as a connector, an oscillator, a sensor, a filter, or the like may be mounted on each unit region 7.
  • the present invention can be applied to the case where it is desired to suppress the warpage of the plate member in the process of separating the resin molded product that is the plate member.
  • the present invention can be applied to the case where optical components such as a lens, a microlens array, an optical module, and a light guide plate are manufactured by separating a resin molded product that is a plate-like member.
  • a lens, a microlens array, an optical module, a light guide plate, and the like correspond to the functional elements.
  • the present invention can be applied in the case of manufacturing a general molded product such as a connector by dividing a resin molded product into individual pieces. In this case, the molded product corresponds to the functional element. The contents described so far can be applied to various cases including these cases.
  • the present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. It is.

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  • Condensed Matter Physics & Semiconductors (AREA)
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PCT/JP2016/002854 2015-07-10 2016-06-13 吸着機構及び吸着方法並びに製造装置及び製造方法 WO2017010037A1 (ja)

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KR102279726B1 (ko) * 2019-09-26 2021-07-20 한국광기술원 웨이퍼 렌즈 어레이를 절단하기 위한 다이싱 블레이드 및 이를 이용한 웨이퍼 렌즈 어레이 다이싱 장치 및 방법
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