WO2016208430A1 - 有機elデバイス、有機el照明パネル、有機el照明装置および有機elディスプレイ - Google Patents
有機elデバイス、有機el照明パネル、有機el照明装置および有機elディスプレイ Download PDFInfo
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- WO2016208430A1 WO2016208430A1 PCT/JP2016/067420 JP2016067420W WO2016208430A1 WO 2016208430 A1 WO2016208430 A1 WO 2016208430A1 JP 2016067420 W JP2016067420 W JP 2016067420W WO 2016208430 A1 WO2016208430 A1 WO 2016208430A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/813—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/822—Cathodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80515—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- An organic EL (Organic Electro-Luminescence) device generally includes an organic EL element (an organic EL layer and a pair of electrodes), a substrate on which the organic EL element is laminated, a sealing substrate, a sealing layer, and a filler. And the substrate and the sealing substrate are stacked via the sealing layer disposed at the peripheral end portion of each opposing surface, and the space between the substrate and the sealing substrate is It is the structure filled with the filler.
- a flexible organic EL device that can be bent has been attracting attention in recent years.
- a flexible substrate flexible substrate
- the sealing substrate is used as the substrate and the sealing substrate.
- Patent Document 1 the distance in the thickness direction between the substrate and the sealing substrate approaches the curved portion and its periphery, and the inner surface of the sealing substrate contacts the organic EL layer, The organic EL layer may be damaged. When the organic EL layer is damaged, there is a problem that light is not emitted from that portion.
- the sealing layer may be peeled off from the substrate or the sealing substrate.
- an object of the present invention is to provide an organic EL device capable of preventing damage to the organic EL layer that occurs during bending.
- the support layer is a counter region that faces all or part of the non-arrangement region of the organic EL element on the mounting surface of the first substrate and all or part of the non-arrangement region on the counter surface of the second substrate. Are arranged so as to be connected to each other.
- an organic EL device capable of preventing damage to the organic EL layer that occurs during bending.
- the organic EL device the organic EL lighting panel, the organic EL lighting device, and the organic EL display of the present invention will be described in detail with reference to the drawings.
- the present invention is not limited to the following description.
- FIGS. 1 to 3 the same portions are denoted by the same reference numerals, and the description thereof may be omitted.
- the structure of each part may be simplified as appropriate, and the dimensional ratio of each part may be schematically shown, unlike the actual case.
- the support layer 15 is a laminate of two or more layers, connects the first substrate 11 and the second substrate 12 via the anode 16 on the first substrate 11, and the first substrate.
- 11 is an example of an organic EL device in which a part of the non-arrangement region of the organic EL element on the mounting surface 11 is an arrangement region of the support layer 15.
- the support layer 15 is not disposed between the end portion of the organic EL layer 13 which is a non-arrangement region of the organic EL element and the seal layer 14.
- this embodiment is merely an example of the organic EL device of the present invention.
- FIG. 1 shows an organic EL device of this embodiment.
- FIG. 1A is a plan view showing an example of the configuration of the organic EL device of the present embodiment
- FIG. 1B is a view from the II direction of the organic EL device shown in FIG. It is sectional drawing.
- the organic EL device 10 of this embodiment includes a first substrate 11, a second substrate 12, an organic EL element, and a seal layer 14.
- the organic EL element has an organic EL layer 13 and a pair of electrodes (anode 16 and cathode 17).
- One surface (the upper surface in FIG.
- the support layer 15 includes a part of the non-arrangement region of the organic EL element on the mounting surface of the first substrate 11 and a counter region facing the part of the non-arrangement region on the opposing surface of the second substrate 12.
- the organic EL device 10 having a square shape is illustrated in FIG. 1, the shape of the organic EL device of the present invention is not limited to this example.
- a polygonal shape other than a square shape such as a trapezoidal shape, a pentagonal shape, and a hexagonal shape; a circular shape; an elliptical shape; and a shape close to them (for example, a substantially square shape).
- the organic EL device 10 of the present embodiment is a bendable device, and is preferably a so-called flexible organic EL device. Therefore, each of the first substrate 11 and the second substrate 12 is preferably a flexible substrate.
- the first substrate 11 preferably has a high transmittance that transmits the light emitted from the organic EL layer 13.
- the transmittance of the first substrate 11 is preferably 80% or more and more preferably 84% or more in terms of total light transmittance.
- the material for forming the first substrate 11 include polyesters such as polyethylene naphthalate and polyethylene terephthalate; acrylic resins such as polymethyl methacrylate, polyethyl methacrylate, polymethyl acrylate, and polyethyl acrylate; Von; Polycarbonate; If the first substrate 11 alone is insufficient to suppress moisture permeation, it is preferable to form a barrier film for suppressing moisture permeation on the mounting surface of the first substrate 11.
- substrate 11 is not restrict
- the thickness of the first substrate 11 is not particularly limited, but is, for example, in the range of 20 to 300 ⁇ m.
- the second substrate 12 described later may have a high transmittance that transmits light emitted from the organic EL layer 13.
- the organic EL element is a laminate in which the anode 16, the organic EL layer 13, and the cathode 17 are laminated in this order.
- the anode 16 is formed on the first substrate 11
- the lower support layer 15a is formed on the anode 16
- the same material is used on the anode 16 and the lower support layer 15a.
- the organic EL layer 13 and the first middle support layer 15b are respectively formed on the organic EL layer 13 and the first middle support layer 15b, using the same material, respectively, and the cathode 17 and the second middle support layer 15b, respectively.
- a support layer 15c is formed.
- the region where the anode 16, the organic EL layer 13 and the cathode 17 are laminated becomes the organic EL element, and the support layer 15 in which the lower support layer 15a is interposed between the anode 16 and the first middle support layer 15b.
- the arrangement region is a part of the non-arrangement region of the organic EL element.
- the anode 16 preferably has a high transmittance for transmitting the light emitted from the organic EL layer 13.
- the transmittance of the anode 16 is preferably 85% or more in terms of total light transmittance.
- Examples of the material for forming the anode 16 include indium tin oxide and indium zinc oxide.
- the anode 16 has a rectangular shape, but the organic EL device of the present embodiment is not limited to this example, and the anode 16 can apply a voltage to the organic EL layer 13. Any shape is possible.
- the anode 16 can be formed separately for each of the organic EL elements.
- the anode 16 is preferably formed as a continuous film as illustrated in FIG.
- the organic EL device 10 can be easily manufactured, and the manufacturing cost can be suppressed.
- the unevenness of the patterned end portion of the anode 16 can also avoid problems such as a short circuit occurring in the organic EL element, for example.
- the thickness of the anode 16 is not particularly limited, but is, for example, in the range of 50 to 300 nm.
- substrate 12 is a thing with the high transmittance
- the organic EL layer 13 may be a conventionally known general organic EL layer.
- a hole injection layer, a hole transport layer, a light emitting layer containing an organic EL, an electron transport layer, and an electron injection layer are sequentially formed.
- the thickness of each layer of the organic EL layer 13 is not particularly limited, but is, for example, in the range of 1 to 200 nm, and the total thickness of the organic EL layer 13 is not particularly limited. It is in the range of ⁇ 1000 nm.
- the material for forming the cathode 17 examples include aluminum and silver. Further, as the material for forming the cathode 17, for example, a material having a high transmittance similar to that exemplified as the material for forming the anode 16 may be used. For example, if all of the first substrate 11, the second substrate 12, the anode 16 and the cathode 17 are formed of a material having high transmittance, the organic EL device 10 which is entirely transparent can be manufactured.
- the thickness of the cathode 17 is not particularly limited, but is, for example, in the range of 50 to 300 nm.
- seal layer 14 examples include ultraviolet curable adhesives such as epoxy resins and acrylic resins, thermosetting adhesives, and the like.
- the seal layer 14 is formed to be slightly thicker than the sum of the thickness of the organic EL layer 13 and the thickness of the cathode 17, and the thickness is, for example, in the range of 1 to 100 ⁇ m.
- the support layer 15 has a cylindrical shape.
- the organic EL device 10 of the present embodiment is not limited to this example, and the support layer 15 may be, for example, a prismatic shape such as a hexagonal column.
- the support layer 15 can be formed in a lattice shape so as to divide the organic EL element and surround each element. For example, as illustrated in FIG. It is preferable to pattern the layer 15 into dots. Thereby, for example, the contact area between the first substrate 11 and the second substrate 12 can be reduced and the flexibility of the organic EL device 10 can be increased as compared with the case where the support layer 15 is formed in a lattice shape. As described above, the light emitting region can be widened.
- the density of the support layer 15 in the region surrounded by the seal layer 14 is preferably in the range of 10 to 10,000 pieces / cm 2 . If the density is within the above range, the opposing surface of the second substrate 12 can be more suitably prevented from coming into contact with the organic EL layer 13 when the organic EL device 10 is curved, and as a result, the organic EL layer 13 can be more damaged. It can be suitably prevented.
- the density is more preferably in the range of 100 to 400 / cm 2 .
- the light emitting region in the region surrounded by the sealing layer 14 on the mounting surface of the first substrate 11 is preferably 80% or more, and more preferably 90% or more.
- region is an arrangement
- the lower support layer 15a is preferably an insulating layer, and examples of the material for forming the lower support layer 15a include resins, inorganic compounds, and the like, which are the same as those exemplified as the material for forming the first substrate 11 and the second substrate 12. It may be a material.
- the thickness of the lower support layer 15a is not particularly limited, but an average range of 0.2 ⁇ m to 100 ⁇ m is preferable, and an average range of 1 ⁇ m to 30 ⁇ m is more preferable.
- the configuration of the first middle support layer 15b is the same as that of the organic EL layer 13 as described above.
- the formation material and thickness of the second middle support layer 15c are the same as those of the cathode 17 as described above.
- the upper support layer 15d is preferably formed of the same material as that for forming the seal layer 14.
- the thickness of the upper support layer 15d is determined from the thickness of the seal layer 14 to the lower support layer 15a, the first middle support layer 15b, and the second middle support layer 15c.
- the thickness may be a value obtained by subtracting the thickness, or may be the same thickness as the seal layer 14 or other thickness, and is not particularly limited.
- a filler is filled in the space between the first substrate 11 and the second substrate 12 and surrounded by the seal layer 14 (the white portion in FIG. 1B). It may be.
- the filler include an inert gas.
- the filler is obtained by kneading a water capturing agent such as calcium oxide in silicone, it is more preferable that the opposing surface of the second substrate 12 contacts the organic EL layer 13 when the organic EL device 10 is curved. As a result, damage to the organic EL layer 13 can be more suitably prevented.
- the organic EL device 10 of the present embodiment will be described with an example. However, this manufacturing method is merely an example, and the organic EL device 10 of the present embodiment may be manufactured by any method.
- the anode 16 is formed on the mounting surface of the first substrate 11.
- the anode 16 can be formed, for example, by depositing the above-described forming material of the anode 16 through a shadow mask by a conventionally known method such as a sputtering method or a chemical vapor deposition (CVD) method.
- the anode 16 can also be formed by uniformly forming the material for forming the anode 16 on the mounting surface of the first substrate 11 and patterning it into a desired shape by photolithography.
- a lower support layer 15 a is formed on the anode 16.
- the lower support layer 15a can be formed in the same manner as the method for forming the anode 16, using, for example, the material for forming the lower support layer 15a described above.
- the lower support layer 15a can also be formed by dispensing the material for forming the lower support layer 15a, such as dispensing application, ink jet application, screen flexo gravure, or the like.
- the lower support layer 15a can be formed, for example, by forming a photoresist on the anode 16 and patterning the photoresist film by photolithography.
- a photoresist either a negative type or a positive type may be used.
- a negative type such as an acrylic resin, a novolac, or a polyimide may be used.
- photolithography it is possible to form a fine pattern of a unit of 10 ⁇ m, and it is preferable to use a transparent acrylic resin as the photoresist because the light emission from the organic EL layer 13 is not blocked. .
- the lower support layer 15a When the lower support layer 15a is formed by printing, it may be repeated a plurality of times so that the lower support layer 15a has a desired thickness.
- the lower support layer 15a formed by printing has a larger cross-sectional area in the surface direction of the mounting surface of the first substrate 11 than in the case of photolithography, but the thickness can be easily increased.
- the range of selection is widened, the forming process and the forming apparatus are simple, the forming efficiency is high, and it can be formed inexpensively.
- the organic EL layer 13 and the first middle support layer 15b are simultaneously formed on the anode 16 and the lower support layer 15a by using the same forming material.
- the patterning thereof can be eliminated or simplified, so that the organic EL device 10 can be made easier, for example. Can be manufactured.
- the organic EL layer 13 and the first middle support layer 15b are formed by a conventionally known method such as a vacuum deposition method using resistance heating, an MBE (molecular beam epitaxy) method, or a laser ablation method using a conventionally known forming material.
- the organic EL layer 13 and the first middle support layer 15b can be formed through a shadow mask.
- the organic EL layer 13 is formed on the anode 16 and the lower support layer 15a by printing the polymer material in a liquid state by inkjet or the like. It is also possible to form the first middle support layer 15b, and the photosensitive coating solution is spin-coated or slit-coated, and the organic EL layer 13 and the first support layer 15a are formed on the anode 16 and the lower support layer 15a by photolithography. It is also possible to form the first middle support layer 15b.
- the cathode 17 and the second middle support layer 15c are simultaneously formed on the organic EL layer 13 and the first middle support layer 15b by using the same forming material.
- the cathode 17 and the second middle support layer 15c can be formed by a conventionally known method such as a vacuum evaporation method or a sputtering method, using the above-described material for forming the cathode 17.
- the seal layer 14 and the upper support layer 15d are simultaneously formed on the anode 16 and the second middle support layer 15d, respectively, using the same forming material.
- the second substrate 12 is bonded or fused to the upper surface of the layer 15d. In this way, the organic EL device 10 of the present embodiment can be obtained.
- the support layer 15 includes a part of the non-arrangement region of the organic EL element on the mounting surface of the first substrate 11 and the non-arrangement region on the opposing surface of the second substrate 12.
- the columnar support layer 15 is patterned in a dot shape in plan view, the bending stress at the time of bending of the organic EL device 10 is dispersed, and the first substrate 11 or the second substrate. 12 can be prevented from peeling off the seal layer 14, the lower support layer 15a, and the upper support layer 15d.
- the organic EL device 10 of the present embodiment can be used for a wide range of applications such as an organic EL lighting panel, an organic EL lighting device, and an organic EL display, as will be described later.
- the support layer 15 is a single layer body, connects the first substrate 11 and the second substrate 12 via the anode 16 on the first substrate 11, and mounts the first substrate 11.
- a part of the non-arrangement region of the organic EL element on the surface is an example of the organic EL device in which the organic EL layer 13 is not disposed.
- FIG. 2 is a cross-sectional view showing an example of the configuration of the organic EL device of the present embodiment.
- the organic EL device 20 of this embodiment is the same as the organic EL device 10 of Embodiment 1 except that the support layer 15 is a single layer body.
- Examples of the material for forming the support layer 15 include those exemplified as the material for forming the lower support layer 15a in Embodiment 1 and those exemplified as the material for forming the seal layer 14.
- the thickness of the support layer 15 may be the same as the thickness of the seal layer 14, or may be any other thickness, and is not particularly limited.
- the organic EL device 20 of the present embodiment will be described with an example. However, this manufacturing method is merely an example, and the organic EL device 20 of the present embodiment may be manufactured by any method.
- the anode 16 is formed on the mounting surface of the first substrate 11.
- the anode 16 can be formed separately for each organic EL element.
- the anode 16 is preferably formed as a continuous film as illustrated in FIG.
- the unevenness of the patterned end portion of the anode 16 can also avoid problems such as a short circuit occurring in the organic EL element, for example. The same applies to the third embodiment.
- the material for forming the support layer 15 is used so that the thickness is the same as that of the seal layer 14 to be formed later.
- the support layer 15 is formed.
- the organic EL layer 13 is formed on the anode 16 except for the portion where the support layer 15 is formed.
- the cathode 17 is formed only on the organic EL layer 13.
- the seal layer 14 is formed on the anode 16, and the second substrate 12 is bonded or fused to the upper surfaces of the seal layer 14 and the support layer 15. In this way, the organic EL device 20 of this embodiment can be obtained.
- the organic EL device 20 of the present embodiment can achieve the same effects as the organic EL device 10 of the first embodiment, and the organic EL device 20 of the present embodiment is the same as the organic EL device 10 of the first embodiment. Available for use.
- FIG. 3 is a cross-sectional view showing an example of the configuration of the organic EL device of the present embodiment. As shown in FIG.
- the organic EL device 30 of the present embodiment has a point that the insulating layer 18 is formed at the position of the lower support layer 15 a, the point that the organic EL layer 13 is formed as a continuous film, and the cathode 17.
- the region in which the anode 16, the organic EL layer 13 and the cathode 17 are stacked serves as the organic EL element, and the anode 16, the insulating layer 18, the organic EL layer 13 and the cathode 17 are stacked. The region is a part of the non-arranged region of the organic EL element.
- the insulating layer 18 is patterned into a mountain shape with a smooth slope.
- the cross-sectional area of the crests of the insulating layer 18 per piece preferably corresponds to an area of a circle having an average diameter of 5 ⁇ m or more and 300 ⁇ m or less, more preferably The average diameter corresponds to the area of a circle of 8 ⁇ m or more and 100 ⁇ m or less.
- Sectional area of the foot of the mountain part of the aforementioned insulating layer 18 is preferably in the range of 15 ⁇ 80000 ⁇ m 2, more preferably in the range of 50 ⁇ 8000 ⁇ m 2.
- the thickness (height) of the insulating layer 18 is not particularly limited, but an average range of 0.2 ⁇ m to 100 ⁇ m is preferable, and an average range of 1 ⁇ m to 30 ⁇ m is more preferable.
- a material for forming the insulating layer 18 for example, a material similar to that exemplified as the material for forming the lower support layer 15 a in the first embodiment, a photoresist material that can be finely patterned in units of 10 ⁇ m (for example, an acrylic resin, Novolak, polyimide, etc.).
- the material for forming the support layer 15 examples include those exemplified as the material for forming the upper support layer 15d in the first embodiment.
- the thickness of the support layer 15 may be a value obtained by subtracting the thickness of the insulating layer 18, the organic EL layer 13, and the cathode 17 from the thickness of the seal layer 14.
- the thickness may be the same as 14 or any other thickness, and is not particularly limited.
- the organic EL device 30 of the present embodiment will be described with an example. However, this manufacturing method is only an example, and the organic EL device 30 of the present embodiment may be manufactured by any method.
- the anode 16 is formed on the mounting surface of the first substrate 11.
- the insulating layer 18 is formed on the anode 16 by using the material for forming the insulating layer 18 described above by the same method as the formation of the lower support layer 15a in the first embodiment. At this time, if the forming temperature is adjusted so that the viscosity of the forming material of the insulating layer 18 becomes a desired value, the insulating layer 18 can be easily formed into a mountain shape with a smooth inclination.
- the organic EL layer 13 is formed on the anode 16 and the insulating layer 18 in the same manner as in the first embodiment except that it is formed as a continuous film.
- a continuous film of the cathode 17 is formed on the organic EL layer 13 by the same method as in the first embodiment.
- the seal layer 14 and the support layer 15 are simultaneously formed on the anode 16 and the cathode 17 using the same forming material, and the second substrate 12 is bonded to the upper surfaces of the seal layer 14 and the support layer 15. Or fuse.
- the organic EL device 30 of this embodiment can be obtained.
- the support layer 15 is patterned into a columnar dot shape in plan view, for example, the first substrate 11 and the second substrate 12 can be compared with the support layer 15 formed in a lattice shape.
- the contact area can be reduced, the flexibility of the organic EL device 30 can be increased, and the light emitting region can be increased.
- the organic EL device 30 of the present embodiment can also obtain the same effects as the organic EL device 10 of the first embodiment, and the organic EL device 30 of the present embodiment is the same as the organic EL device 10 of the first embodiment. Available for use. Moreover, since the organic EL layer 13 is a continuous film, the organic EL device 30 of this embodiment can eliminate or simplify the patterning, and is easy to manufacture.
- the organic EL panel of the present invention is characterized by including the organic EL devices of the first to third embodiments, and other configurations and conditions are not limited at all. For example, the same as a conventionally known organic EL lighting panel Good.
- the organic EL lighting device of the present invention is characterized by including the organic EL device of Embodiments 1 to 3 or the organic EL lighting panel of Embodiment 4, and other configurations and conditions are not limited at all. It may be the same as that of the organic EL lighting device.
- the organic EL display of the present invention will be described.
- the organic EL display of the present invention is characterized by including the organic EL device of Embodiments 1 to 3 or the organic EL lighting panel of Embodiment 4, and other configurations and conditions are not limited at all. What is necessary is just to be the same as that of an organic EL display.
- an organic EL device capable of preventing damage to the organic EL layer that occurs during bending.
- the organic EL device of the present invention can be used in a wide range of applications such as an organic EL lighting panel, an organic EL lighting device, and an organic EL display.
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Abstract
Description
第1基板と、第2基板と、1以上の有機EL素子と、シール層とを有し、
前記有機EL素子は、有機EL層と一対の電極とを有し、
前記第1基板の一方の表面は、前記1以上の有機EL素子が配置された実装表面であり、
前記第1基板および前記第2基板は、前記シール層を介して、前記第1基板の実装表面と前記第2基板の一方の表面とが対向するように積層され、
前記シール層は、前記第1基板の実装表面における前記第2基板との対向領域の端部全域と、前記第2基板の対向表面における前記第1基板との対向領域の端部全域とにおいて、前記第1基板と前記第2基板との隙間をシールし、
さらに、1以上の支持層を有し、
前記支持層は、前記第1基板の実装表面における前記有機EL素子の非配置領域の全部または一部と、前記第2基板の対向表面における前記非配置領域の全部または一部に対向する対向領域とを、連結するように配置されていることを特徴とする。
本実施形態は、支持層15が、2層以上の積層体であり、第1基板11上の陽極16を介して、第1基板11と第2基板12とを連結し、且つ、第1基板11の実装表面における有機EL素子の非配置領域の一部が、支持層15の配置領域である有機ELデバイスの一例である。本例においては、有機EL素子の非配置領域である有機EL層13端部とシール層14との間に、支持層15が配置されていない。ただし、本実施形態は、本発明の有機ELデバイスの一例に過ぎず、本発明の有機ELデバイスにおいて、有機EL層端部とシール層との間の領域に、さらに、支持層があってもよい。図1に、本実施形態の有機ELデバイスを示す。図1(A)は、本実施形態の有機ELデバイスの構成の一例を示す平面図であり、図1(B)は、図1(A)に示す有機ELデバイスのI-I方向から見た断面図である。図1(A)および(B)に示すように、本実施形態の有機ELデバイス10は、第1基板11と、第2基板12と、有機EL素子と、シール層14とを有する。前記有機EL素子は、有機EL層13と一対の電極(陽極16および陰極17)とを有する。第1基板11の一方の表面(図1(B)においては、上面)は、前記有機EL素子が配置された実装表面である。第1基板11および第2基板12は、シール層14を介して、第1基板11の実装表面と第2基板12の一方の表面(図1(B)においては、下面)とが対向するように積層されている。シール層14は、第1基板11の実装表面における第2基板12との対向領域の端部全域と、第2基板12の対向表面における第1基板11との対向領域の端部全域とにおいて、第1基板11と第2基板12との隙間をシールしている。本実施形態の有機ELデバイス10は、さらに、1以上の支持層15(図1においては、45個)を有する。支持層15は、図1(B)に示すように、下部支持層15a、第1の中部支持層15b、第2の中部支持層15cおよび上部支持層15dの積層体である。下部支持層15aの一方の面(図1(B)においては、下面)は、陽極16と接しており、下部支持層15aの他方の面(図1(B)においては、上面)は、第1の中部支持層15bの一方の面(図1(B)においては、下面)と接している。第1の中部支持層15bの他方の面(図1(B)においては、上面)は、第2の中部支持層15cの一方の面(図1(B)においては、下面)と接している。第2の中部支持層15cの他方の面(図1(B)においては、上面)は、上部支持層15dの一方の面(図1(B)において、下面)と接しており、上部支持層15dの他方の面(図1(B)においては、上面)は、第2基板12の対向表面と接している。これにより、支持層15は、第1基板11の実装表面における前記有機EL素子の非配置領域の一部と、第2基板12の対向表面における前記非配置領域の一部に対向する対向領域とを、連結している。図1には、正方形状である有機ELデバイス10を例示したが、本発明の有機ELデバイスの形状はこの例に限定されず、例えば正方形状以外の平行四辺形状(長方形状、菱形状を含む。)、台形状、五角形状、六角形状等の正方形状以外の多角形状;円状;楕円状;およびそれらに近い形状(例えば、略正方形状等)等であってもよい。
本実施形態は、支持層15が、単層体であり、第1基板11上の陽極16を介して、第1基板11と第2基板12とを連結し、且つ、第1基板11の実装表面における有機EL素子の非配置領域の一部が、有機EL層13が配置されていない領域である有機ELデバイスの一例である。図2は、本実施形態の有機ELデバイスの構成の一例を示す断面図である。図2に示すように、本実施形態の有機ELデバイス20は、支持層15が、単層体である点以外、実施形態1の有機ELデバイス10と同様である。
本実施形態は、第1基板11の実装表面における有機EL素子の非配置領域の一部が、一対の電極(陽極16および陰極17)と有機EL層13とを有し、且つ、前記一対の電極(陽極16および陰極17)間に絶縁層18を有する有機ELデバイスの一例である。図3は、本実施形態の有機ELデバイスの構成の一例を示す断面図である。図3に示すように、本実施形態の有機ELデバイス30は、下部支持層15aの位置に絶縁層18が形成されている点、有機EL層13が連続膜として形成されている点、陰極17が有機EL層13上に連続膜として形成されている点、および、上部支持層15dの位置に支持層15が形成されている点以外、実施形態1の有機ELデバイス10と同様である。本実施形態の有機ELデバイス30では、陽極16、有機EL層13および陰極17が積層された領域が前記有機EL素子となり、陽極16、絶縁層18、有機EL層13および陰極17が積層された領域が前記有機EL素子の非配置領域の一部となっている。
本実施形態では、本発明の有機EL照明パネルについて説明する。本発明の有機ELパネルは、実施形態1~3の有機ELデバイスを含むことを特徴とし、その他の構成および条件は、何ら制限されず、例えば、従来公知の有機EL照明パネルと同様とすればよい。
本実施形態では、本発明の有機EL照明装置について説明する。本発明の有機EL照明装置は、実施形態1~3の有機ELデバイスまたは実施形態4の有機EL照明パネルを含むことを特徴とし、その他の構成および条件は、何ら制限されず、例えば、従来公知の有機EL照明装置と同様とすればよい。
本実施形態では、本発明の有機ELディスプレイについて説明する。本発明の有機ELディスプレイは、実施形態1~3の有機ELデバイスまたは実施形態4の有機EL照明パネルを含むことを特徴とし、その他の構成および条件は、何ら制限されず、例えば、従来公知の有機ELディスプレイと同様とすればよい。
11 第1基板
12 第2基板
13 有機EL層
14 シール層
15 支持層
16 陽極
17 陰極
18 絶縁層
Claims (17)
- 第1基板と、第2基板と、1以上の有機EL素子と、シール層とを有し、
前記有機EL素子は、有機EL層と一対の電極とを有し、
前記第1基板の一方の表面は、前記1以上の有機EL素子が配置された実装表面であり、
前記第1基板および前記第2基板は、前記シール層を介して、前記第1基板の実装表面と前記第2基板の一方の表面とが対向するように積層され、
前記シール層は、前記第1基板の実装表面における前記第2基板との対向領域の端部全域と、前記第2基板の対向表面における前記第1基板との対向領域の端部全域とにおいて、前記第1基板と前記第2基板との隙間をシールし、
さらに、1以上の支持層を有し、
前記支持層は、前記第1基板の実装表面における前記有機EL素子の非配置領域の全部または一部と、前記第2基板の対向表面における前記非配置領域の全部または一部に対向する対向領域とを、連結するように配置されていることを特徴とする有機ELデバイス。 - 前記支持層が、2層以上の積層体である、請求項1記載の有機ELデバイス。
- 前記支持層が、前記積層体であり、前記積層体を構成する少なくとも1層が、前記シール層と同じ組成の層である、請求項2記載の有機ELデバイス。
- 前記支持層が、単層体である、請求項1記載の有機ELデバイス。
- 前記支持層が、絶縁層である、請求項1から4のいずれか一項に記載の有機ELデバイス。
- 前記第1基板の実装表面の面方向において、前記支持層1つあたりの断面積が、15~80000μm2の範囲である、請求項1から5のいずれか一項に記載の有機ELデバイス。
- 前記第1基板の実装表面の面方向において、前記シール層で囲まれる領域における前記支持層の密度が、10~10000個/cm2の範囲である、請求項1から6のいずれか一項に記載の有機ELデバイス。
- 前記第1基板の実装表面の面方向において、前記シール層で囲まれる領域における発光領域が、80%以上である、請求項1から7のいずれか一項に記載の有機ELデバイス。
- 前記第1基板と前記第2基板とが対向する対向方向において、前記有機EL素子は、前記一対の電極のうち一方の電極層と、前記有機EL層と、前記一対の電極のうち他方の電極層とが、この順序で積層された積層体である、請求項1から8のいずれか一項に記載の有機ELデバイス。
- 前記有機EL素子は、前記第1基板側の電極層が、陽極であり、前記第2基板側の電極層が、陰極である、請求項9記載の有機ELデバイス。
- 前記第1基板の実装表面における前記非配置領域の全部または一部は、前記支持層の配置領域である、請求項1から10のいずれか一項に記載の有機ELデバイス。
- 前記第1基板の実装表面における前記非配置領域の全部または一部は、前記一対の電極と前記有機EL層とを有し、且つ、前記一対の電極間に絶縁層を有する領域である、請求項1から10のいずれか一項に記載の有機ELデバイス。
- 前記第1基板および前記第2基板が、可撓性基板である、請求項1から12のいずれか一項に記載の有機ELデバイス。
- 前記第1基板と前記第2基板との間であり且つ前記シール層で囲まれる空間に、充填剤が充填されている、請求項1から13のいずれか一項に記載の有機ELデバイス。
- 請求項1から14のいずれか一項に記載の有機ELデバイスを含むことを特徴とする有機EL照明パネル。
- 請求項1から14のいずれか一項に記載の有機ELデバイスまたは請求項15記載の有機EL照明パネルを含むことを特徴とする有機EL照明装置。
- 請求項1から14のいずれか一項に記載の有機ELデバイスまたは請求項15記載の有機EL照明パネルを含むことを特徴とする有機ELディスプレイ。
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2016
- 2016-06-10 WO PCT/JP2016/067420 patent/WO2016208430A1/ja active Application Filing
- 2016-06-10 JP JP2017525209A patent/JP6802156B2/ja active Active
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JPWO2016208430A1 (ja) | 2018-04-26 |
US10249842B2 (en) | 2019-04-02 |
US20180183000A1 (en) | 2018-06-28 |
JP6802156B2 (ja) | 2020-12-16 |
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