WO2016206560A1 - 接触式拾音麦克风和听诊器 - Google Patents

接触式拾音麦克风和听诊器 Download PDF

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Publication number
WO2016206560A1
WO2016206560A1 PCT/CN2016/085961 CN2016085961W WO2016206560A1 WO 2016206560 A1 WO2016206560 A1 WO 2016206560A1 CN 2016085961 W CN2016085961 W CN 2016085961W WO 2016206560 A1 WO2016206560 A1 WO 2016206560A1
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WIPO (PCT)
Prior art keywords
diaphragm
piezoelectric film
hole
support member
disposed
Prior art date
Application number
PCT/CN2016/085961
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English (en)
French (fr)
Inventor
胡琨
Original Assignee
胡琨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 胡琨 filed Critical 胡琨
Publication of WO2016206560A1 publication Critical patent/WO2016206560A1/zh

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B7/00—Instruments for auscultation
    • A61B7/02—Stethoscopes
    • A61B7/04—Electric stethoscopes

Definitions

  • the present invention relates to the field of stethoscopes, and more particularly to a contact pickup microphone and a stethoscope for improving the auscultation effect.
  • the contact type pickup microphone is an electric signal generated by the vibration of the target object after contacting the target object, and then corresponding to the electric signal by a driving circuit such as an amplifying circuit, a filter circuit, a digital-to-analog conversion circuit, and a compression circuit. Processing, and finally the processed electrical signals are played and stored through devices such as audio playback and storage.
  • a driving circuit such as an amplifying circuit, a filter circuit, a digital-to-analog conversion circuit, and a compression circuit. Processing, and finally the processed electrical signals are played and stored through devices such as audio playback and storage.
  • the main object of the present invention is to provide a higher sensitivity contact pickup microphone and stethoscope.
  • the present invention first provides a contact pickup microphone including a signal processing circuit, a rigid support member, a piezoelectric film, and a diaphragm, wherein the signal processing circuit electrically connects the piezoelectric film Providing a through hole in the support member, the piezoelectric film sealingly seals the through hole, the diaphragm is covered in the through hole, and the edge of the diaphragm is tightly connected to the support member; Forming a sealed fluid-filled medium containing space between the film, the diaphragm and the support member, wherein the portion of the piezoelectric film that at least blocks the through hole is an inner wall of the receiving space, and the portion of the diaphragm that constitutes the inner wall of the receiving space is larger than The piezoelectric film blocks a portion of the through hole.
  • the diaphragm is disposed in a convex shape, and the edge of the diaphragm is tightly connected to the support.
  • edge of the diaphragm connected to the support member is pleated or corrugated; or the edge of the diaphragm is connected to the support through the flexible body.
  • the piezoelectric film and the diaphragm are respectively disposed on the same side of the through hole; or
  • the piezoelectric film is disposed at one end of the through hole, and the diaphragm is disposed at the other end of the through hole. [0010] Further, the piezoelectric film and the diaphragm are respectively disposed on the same side of the through hole, and the diaphragm is convex; or
  • the piezoelectric film is disposed at one end of the through hole, and the diaphragm is disposed at the other end of the through hole.
  • the diaphragm is convex.
  • the piezoelectric film is disposed at one end of the through hole area.
  • the support member is a PCB board, and the through hole is disposed on the PCB board;
  • the signal processing circuit is integrated at a position other than the housing space of the PCB board.
  • the upper gland is a first cylinder in which one end end is inwardly contracted, and an inner side wall of the first cylinder is provided with an internal thread;
  • the lower gland is a second cylinder, and an outer side of the second cylinder The wall is provided with an external thread, and the second cylinder extends into the first cylinder along an end of the first cylinder that is not provided to contract inwardly, and is adapted to be threadedly coupled to the first cylinder;
  • the support member is press-fixed by the constricted portion of the first cylinder and the end portion of the second cylinder projecting into the first cylinder, wherein the piezoelectric film and the diaphragm are disposed on the support member away from the second portion At one end of the cylinder, a diaphragm covers the piezoelectric film on the support.
  • a portion of the support member located in the receiving space is provided with a sound absorbing layer.
  • the signal processing circuit includes a charge amplifier.
  • the present invention also provides a stethoscope comprising a contact pickup microphone and a player, the player receiving an audio signal of the contact pickup microphone and playing;
  • the contact pickup microphone comprising a signal processing circuit and a rigid support a piezoelectric film and a diaphragm, the signal processing circuit electrically connecting the piezoelectric film;
  • the support member is provided with a through hole, the piezoelectric film seals the through hole, the diaphragm is covered in the through hole, and the edge of the diaphragm is tightly connected to the support member; Forming a sealed fluid-filled medium containing space between the piezoelectric film, the diaphragm and the support member, wherein the portion of the piezoelectric film that at least blocks the through hole is an inner wall of the receiving space, and the diaphragm portion constituting the inner wall of the receiving space A portion larger than the piezoelectric film to block the through hole.
  • the diaphragm is disposed in a convex shape, and the edge of the diaphragm is tightly connected to the support.
  • the edge of the diaphragm connected to the support member is pleated or corrugated; or the edge of the diaphragm is connected to the support through the flexible body.
  • the piezoelectric film and the diaphragm are respectively disposed on the same side of the through hole; or
  • the piezoelectric film is disposed at one end of the through hole, and the diaphragm is disposed at the other end of the through hole.
  • the piezoelectric film and the diaphragm are respectively disposed on the same side of the through hole, and the diaphragm is convex; or
  • the piezoelectric film is disposed at one end of the through hole, and the diaphragm is disposed at the other end of the through hole.
  • the diaphragm is convex.
  • the piezoelectric film is disposed at one end of the through hole area.
  • the support member is a PCB board, and the through hole is disposed on the PCB board;
  • the signal processing circuit is integrated at a position other than the accommodation space of the PCB board.
  • the upper gland is a first cylinder in which one end end is inwardly contracted, and an inner side wall of the first cylinder is provided with an internal thread;
  • the lower gland is a second cylinder, and an outer side of the second cylinder The wall is provided with an external thread, and the second cylinder extends into the first cylinder along an end of the first cylinder that is not provided to contract inwardly, and is adapted to be threadedly coupled to the first cylinder;
  • the support member is press-fixed by the contraction portion of the first cylinder and the end portion of the second cylinder projecting into the first cylinder, wherein the piezoelectric film and the diaphragm are disposed on the support member away from the second portion At one end of the cylinder, a diaphragm covers the piezoelectric film on the support.
  • a portion of the support member located in the receiving space is provided with a sound absorbing layer.
  • the signal processing circuit includes a charge amplifier.
  • the contact pickup microphone of the present invention, the diaphragm, the piezoelectric film and the support member form a sealed space filled with the fluid vibration medium, and the area of the piezoelectric film is smaller than the area of the diaphragm, when the target is collected
  • the vibration of the object is ⁇
  • the diaphragm is in contact with the target object
  • the target object will drive the diaphragm to vibrate
  • the diaphragm will act on the accommodating space, so that the piezoelectric film generates an electrical signal.
  • the vibration amplitude of the piezoelectric film is greater than the amplitude of the diaphragm, so that the electrical signal generated by the piezoelectric film is larger, so that the vibration of the target can be collected with high sensitivity and high fidelity.
  • FIG. 1 is a schematic cross-sectional view of a touch-type pickup microphone according to an embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional view of a touch-type pickup microphone according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a touch-type pickup microphone according to an embodiment of the present invention.
  • Figure 4 is a diagram A-A of Figure 3 of the present invention.
  • FIG. 5 is a schematic structural diagram of a touch-type pickup microphone according to still another embodiment of the present invention.
  • FIG. 6 is a schematic structural view of a stethoscope according to an embodiment of the present invention.
  • a touch-type pickup microphone 1 is provided in an embodiment of the present invention, including a signal processing circuit, a rigid support member 10, a piezoelectric film 20, and a diaphragm 30, and the signal processing circuit is electrically connected.
  • the piezoelectric film 20 is provided with a through hole 11 , the piezoelectric film 20 hermetically seals the through hole 11 , and the diaphragm 30 covers the through hole 11 , the diaphragm 30
  • the rim is tightly connected to the support member 10; the piezoelectric film 20, the support member 10 and the diaphragm 30 form a sealed accommodating space 40 filled with a fluid vibration medium, wherein the piezoelectric film 20 at least blocks the through hole 11.
  • the portion of the diaphragm 30 constituting the inner wall of the accommodating space 40 is larger than the portion of the piezoelectric film 20 that blocks the through hole 11, that is, the side of the diaphragm 30 opposite to the through hole 11
  • the projected area is larger than the area of the end of the through hole 11.
  • the above signal processing circuit generally includes a signal amplifying circuit, a filtering circuit, a compression circuit, an analog-to-digital conversion circuit, a radio frequency transmitting circuit, and the like for processing an electrical signal generated by the piezoelectric film 20 as needed.
  • the electrical signal is first amplified by a signal amplifying circuit, then filtered by a filter circuit, and then converted into a digital signal by an analog-to-digital conversion circuit, and finally the digital signal is compressed by a compression circuit and a radio frequency transmitting circuit. And it is transmitted to the device such as the player 2, and in another embodiment, the device such as the player 2 is connected through the signal line, and there is no need to set the radio frequency transmitting circuit.
  • the corresponding signal processing circuit can be set according to actual usage.
  • the above rigid support member 10 means that when the diaphragm 30 vibrates, the support member 10 does not generate excessive vibration, thereby improving fidelity.
  • the piezoelectric film 20 is a piezoelectric polyvinylidene fluoride PVDF polymer film, which is a film which is deformed by an external force and generates a corresponding electrical signal.
  • the same piezoelectric film 20 has a larger deformation. The greater the electrical signal produced.
  • the piezoelectric film 20 is disposed on the support member 10 at the through hole 11 to provide space for the piezoelectric film 20 to vibrate.
  • the diaphragm 30 described above refers to a film which is capable of sensing the vibration of the object.
  • the diaphragm 30 has rigidity to prevent the compression accommodation space 40 ⁇ from being deformed by the diaphragm 30 itself and the deformation of the piezoelectric film 20 being weak.
  • the piezoelectric film 20 at least partially shields the through hole 11 from the inner wall of the accommodating space 40, and the portion of the diaphragm 20 constituting the inner wall of the accommodating space 40 is larger than the portion of the piezoelectric film 20 that blocks the through hole 11.
  • the piezoelectric film 20 blocks the through hole 11 and the diaphragm 30 is covered by the through hole 11, the portion of the piezoelectric film 20 corresponding to the through hole 11 and the portion corresponding to the diaphragm 3 and the through hole 11 There is a gap between them.
  • the diaphragm 30 will protrude through the through hole to facilitate receiving the vibration signal.
  • the diaphragm 30 is covered by the through hole 11, which means that the orthographic projection of the diaphragm 30 toward the through hole 11 covers the through hole 11, and the edge of the diaphragm 30 is connected to the support at the periphery of the end of the through hole 11.
  • the accommodation space 40 is filled with a fluid vibration medium, which may be air or other gas, or may be a liquid such as water. Different vibration media can be selected according to the specific use environment. For example, the vibration of the target in the air is mainly collected, and then the air is generally set as the vibration medium in the accommodation space 40. In other embodiments, the object in the water is collected. In the case of vibration, then the water body in the accommodation space 40 is selected as the vibration medium.
  • the contact-type pickup microphone 1 of the present embodiment when the vibration of the target object is collected, the diaphragm 30 is brought into contact with the target object, the target object will drive the diaphragm 30 to vibrate, and the diaphragm 30 applies the vibration condition to the receiving space. 40, so that the portion of the piezoelectric film 20 that blocks the through hole 11 is deformed correspondingly to generate an electrical signal.
  • the piezoelectric film 20 is planarly disposed.
  • the diaphragm 30 is disposed in a convex shape, and the edge of the diaphragm 30 is tightly connected to the support member 10, because the piezoelectric film 20 and the diaphragm 30 form a receiving space. Then, the convex apex of the diaphragm 30 is away from the piezoelectric film 20.
  • the convex shape described above may be a shape of any one of the spheres after cutting the sphere in any direction, or other irregular convex shape or the like.
  • the convex diaphragm 30 can increase the area of the diaphragm 30, and is convenient for collecting the vibration of the target.
  • the edge of the diaphragm 30 connected to the support member 10 is a pleated or corrugated shape parallel to the joint, and the edge of the pleated and corrugated diaphragm 30 connected to the support member 10 can also be used.
  • the diaphragm 30 receives the pressure disturbance ⁇ , the diaphragm 30 provides a great dynamic range and a hysteresis as low as possible; or the edge of the diaphragm 30 is connected to the support member 10 through the flexible body 31, that is, one end of the flexible body 31 is hermetically connected.
  • the support member the other end of which is tightly connected to the edge of the diaphragm 30, and the arrangement of the flexible body can also provide a great dynamic range of the diaphragm 30 and a hysteresis as low as possible.
  • the edge connected to the support member 10 is greatly deformed, thereby realizing a large-compression compression receiving space 40, making the piezoelectric film 20 more variable in shape, thereby improving the contact type of the embodiment.
  • the piezoelectric film 20 and the diaphragm 30 are respectively disposed on the same side of the through hole 11, or the piezoelectric film 20 is disposed at one end of the through hole 11, and the diaphragm 30 is disposed at The other end of the through hole.
  • the piezoelectric film 20 and the diaphragm 30 are respectively disposed on the same side of the through hole 11, and the diaphragm 30 is convex, and is shielded from the piezoelectric film 20, and is oscillated.
  • the edge of the film 30 is connected to the support member 10. Generally, there is a gap between the edge of the diaphragm 30 and the edge of the piezoelectric film 20.
  • the volume of the receiving space 40 can be increased as much as possible, and the piezoelectric film 20 is sealed in the The upper end of the through hole 11, and then the diaphragm 30 is also disposed at the end.
  • the accommodating space is pressed, and since the piezoelectric film 20 and the diaphragm 30 are disposed on the same side of the support 10, the piezoelectric film It is not easy to be detached from the support member 10 by being deformed into the recess in the through hole; in another embodiment, as shown in FIGS. 1 and 2, the piezoelectric film 20 is disposed at one end of the through hole 11, and the diaphragm 30 is disposed.
  • the diaphragm 30 is convex and is covered in the through hole 11; If the areas are not equal, the diaphragm is disposed at one end of the through hole area, and the piezoelectric film is disposed at The end of the aperture area is small, that is, when the diaphragm 30 is convex, the piezoelectric film 20 is a planar crucible, and the inner diameter of the through hole 11 can be the same at both ends; when the diaphragm 30 and the piezoelectric film 20 are both planar ⁇ , the through hole 11 is provided with a diaphragm 30-end opening area larger than the opening area of the piezoelectric film 20-end.
  • the piezoelectric film 20 And/or the diaphragm 30 may also be disposed in the middle of the through hole 11, as long as the diaphragm 30 is convenient to receive the vibration signal.
  • the support member is a sandwich structure, and the edges of the piezoelectric film 20 and the diaphragm 30 are sandwiched by the interlayer. Wait.
  • the support member 10 is a PCB board, and the through hole 11 is disposed on the PCB board, and the signal processing circuit is integrated at a position other than the receiving space 40 of the PCB board, and the PCB board is used as the PCB board.
  • the support member 10 can facilitate integration of the above signal processing circuit on the support member 10.
  • the diaphragm 30 is disposed on one side of the PCB, and the signal processing circuit is integrated on the other side. The signal processing circuit does not affect the contact of the end of the diaphragm 30 with the target.
  • the signal processing circuit is integrated at a position other than the accommodating space 40 of the support frame, and the signal processing circuit is conveniently arranged to improve the convenience and volume of the contact pickup microphone.
  • the sound absorbing layer 50 is disposed in a portion of the support member 10 in the accommodating space 40, and the sound absorbing layer 50 is disposed to prevent the reflection of sound waves in the accommodating cavity from affecting the sensing and improving the fidelity. degree.
  • the sound absorbing layer 50 described above can be laid with cotton, sponge, cloth, flexible rubber or the like.
  • the signal processing circuit includes a charge amplifier, that is, the specific electrical signal amplifying circuit is a charge amplifier.
  • the charge amplifier essentially enlarges the acquired vibration signal in the form of energy, and its amplification effect is far superior to that of the ordinary voltage amplifier: the signal function is closer to the human ear hearing experience, and the output signal conforms to the usage habit of the mechanical stethoscope; The effect is not affected by the change of the output impedance, especially the influence of the frequency change, the fidelity is greatly improved; the circuit is simple, and it is convenient to obtain a very low high-pass cutoff frequency.
  • a charge amplifier for electrical signal amplification relatively balanced signal amplification from 1 Hz to ⁇ can be easily obtained.
  • a through hole 11 is disposed in a thickness direction of a circular PCB board, and a piezoelectric film 20 is disposed at the through hole 11, and the piezoelectric film 20 is The through hole 11 is tightly sealed; then a diaphragm 30 having a spherical cross section is masked on the piezoelectric film 20, and the piezoelectric film 20, the PCB board and the diaphragm 30 are enclosed by a receiving space 40, and are accommodated in the receiving space.
  • a sound absorbing material such as a sponge is laid on the PCB board in 40; a signal processing circuit is integrated on one side of the P CB board where the diaphragm 30 is not provided, and the signal processing circuit is connected to the piezoelectric film 20.
  • the contact type pickup microphone 1 is further provided with a casing, and the casing is provided with a mouthpiece for protruding the diaphragm 30 to facilitate contact of the diaphragm 30 with the object.
  • the contact pickup microphone 1 includes an upper gland 81, a lower gland 82, a support member 10, a signal processing circuit, a diaphragm 30, a piezoelectric film 20, and a flexible Body 31;
  • the upper gland 81 a first cylinder in which one end end is inwardly contracted, an inner side wall of the first cylinder is provided with an internal thread;
  • the lower pressing cover 82 is a second cylinder, and an outer side wall of the second cylinder is provided with an external thread, second
  • the cylinder extends into the first cylinder along an end of the first cylinder that is not provided to contract inwardly, and is adapted to be threadedly coupled to the first cylinder;
  • the support member 10 is contracted by the first cylinder and the second portion The end of the cylinder extending into the first cylinder is press-fitted, wherein the diaphragm 30 is disposed at an end of the support member 10 away from the second cylinder, and the diaphragm 30 covers the piezoelectric film 20 to
  • a through hole 11 is disposed on the support member 10, and the piezoelectric film 20 is sealed at an end of the through hole 11 away from the lower pressing cover 82.
  • the flexible body 31 is disposed on the side of the support member 10 away from the lower end cover side, and the edge of the diaphragm 30 is connected.
  • the flexible body 3 1, that is, the contraction portion of the first cylinder covers the edge of the diaphragm 30, the edge of the diaphragm 30 is connected to one end surface of the support member 10 through the flexible body 31, and the other end surface of the support member 10 and the second circle The cylinder is extruded into the end of the first cylinder.
  • the contact-type pickup microphone 1 of the present embodiment has a simple structure, the piezoelectric film 20 is disposed on the same side as the diaphragm 30, and the receiving space is pressed, and the piezoelectric film 20 is not easily deformed by being deformed into the through-hole 11 to be decoupled from the support.
  • the diaphragm 10 is convex and covers the entire support member 10, so that the volume of the accommodating space can be increased, and the ratio of the area of the diaphragm 30 to the area of the piezoelectric film 20 is increased as much as possible, and the accommodating space is squeezed and improved.
  • the electrical signal of the piezoelectric film 20 can collect the vibration of the target with high sensitivity and high fidelity; and the flexible body 31 can provide the maximum dynamic range of the diaphragm 30 and the hysteresis as low as possible;
  • the arrangement of the 81 and the lower pressing cover 82 can facilitate the fixing of the support member 10 and the installation of the diaphragm 30, etc., and has a simple structure.
  • the touch-type pickup microphone 1 of the present embodiment can sensitively collect the vibration signal of the target object, and restore the vibration signal to the sound signal with high fidelity.
  • the embodiment further provides a stethoscope including a touch-type pickup microphone 1 and a player 2, and the player 2 receives an audio signal of the contact-type pickup microphone 1 and plays the same.
  • the pickup microphone 1 includes a signal processing circuit, a rigid support member 10, a piezoelectric film 20, and a diaphragm 30.
  • the signal processing circuit is electrically connected to the piezoelectric film 20; the support member 10 is provided with a through hole 11, The piezoelectric film 20 is hermetically sealed, the diaphragm 30 is covered in the through hole 11, and the edge of the diaphragm 30 is tightly connected to the support member 10; the piezoelectric film 20, the support A accommodating space 40 filled with a fluid vibration medium is formed between the member 10 and the diaphragm 30, wherein the piezoelectric film 20 at least partially shields the through hole 11 from the inner wall of the accommodating space 40, and constitutes a vibration of the inner wall of the accommodating space 40.
  • the film 30 is partially larger than the piezoelectric film 20 to cover the through hole 1
  • the portion of 1, that is, the orthographic projection area of the diaphragm 30 with respect to the side of the through hole 11 is larger than the area of the end portion of the through hole 11.
  • the above signal processing circuit generally includes a signal amplifying circuit, a filtering circuit, a compression circuit, an analog-to-digital conversion circuit, a radio frequency transmitting circuit, and the like for processing an electrical signal generated by the piezoelectric film 20 as needed.
  • the electrical signal is first amplified by a signal amplifying circuit, then filtered by a filter circuit, and then converted into a digital signal by an analog-to-digital conversion circuit, and finally the digital signal is compressed by a compression circuit and a radio frequency transmitting circuit. And it is transmitted to the device such as the player 2, and in another embodiment, the device such as the player 2 is connected through the signal line, and there is no need to set the radio frequency transmitting circuit.
  • the corresponding signal processing circuit can be set according to actual usage.
  • the above rigid support member 10 means that when the diaphragm 30 vibrates, the support member 10 does not generate excessive vibration, thereby improving fidelity.
  • the piezoelectric film 20 is a piezoelectric polyvinylidene fluoride PVDF polymer film, and is a film which is deformed by an external force and generates a corresponding electrical signal. The same piezoelectric film 20 has a larger deformation. The greater the electrical signal produced.
  • the piezoelectric film 20 is disposed on the support member 10 at the through hole 11 to provide space for the piezoelectric film 20 to vibrate.
  • the diaphragm 30 described above refers to a film which is capable of sensing the vibration of the object.
  • the diaphragm 30 has rigidity to prevent the compression accommodation space 40 ⁇ from being deformed by the diaphragm 30 itself and the deformation of the piezoelectric film 20 being weak.
  • the piezoelectric film 20 at least partially shields the through hole 11 from the inner wall of the accommodating space 40, and the portion of the diaphragm 20 constituting the inner wall of the accommodating space 40 is larger than the portion of the piezoelectric film 20 that blocks the through hole 11.
  • the piezoelectric film 20 blocks the through hole 11 and the diaphragm 30 is covered by the through hole 11, the portion of the piezoelectric film 20 corresponding to the through hole 11 and the portion corresponding to the diaphragm 3 and the through hole 11 There is a gap between them.
  • the diaphragm 30 will protrude through the through hole to facilitate receiving the vibration signal.
  • the diaphragm 30 is covered by the through hole 11, which means that the orthographic projection of the diaphragm 30 toward the through hole 11 covers the through hole 11, and the edge of the diaphragm 30 is connected to the support at the periphery of the end of the through hole 11.
  • the accommodation space 40 is filled with a fluid vibration medium, which may be air or other gas, or may be a liquid such as water. Different vibration media can be selected according to the specific use environment. For example, the vibration of the target in the air is mainly collected, and then the air is generally set as the vibration medium in the accommodation space 40. In other embodiments, the object in the water is collected. Vibration situation, then choose to accommodate space 40 The water body is set as a vibration medium.
  • the contact-type pickup microphone 1 of the present embodiment when the vibration condition of the target object is collected, the diaphragm 30 is in contact with the target object, the target object will drive the diaphragm 30 to vibrate, and the diaphragm 30 applies the vibration condition to the receiving space. 40, so that the portion of the piezoelectric film 20 that blocks the through hole 11 is deformed correspondingly to generate an electrical signal.
  • the piezoelectric film 20 is planarly disposed.
  • the diaphragm 30 is disposed in a convex shape, and the edge of the diaphragm 30 is tightly connected to the support member 10, because the piezoelectric film 20 and the diaphragm 30 form a receiving space. Then, the convex apex of the diaphragm 30 is away from the piezoelectric film 20.
  • the convex shape described above may be a shape of any one of the spheres after cutting the sphere in any direction, or other irregular convex shape or the like.
  • the convex diaphragm 30 can increase the area of the diaphragm 30 to facilitate the collection of the vibration of the target.
  • the edge of the diaphragm 30 connected to the support member 10 is a pleated or corrugated shape parallel to the joint, and the edge of the pleated and corrugated diaphragm 30 connected to the support member 10 can also be When the diaphragm 30 receives the pressure disturbance ⁇ , the diaphragm 30 provides a great dynamic range and a hysteresis as low as possible; or the edge of the diaphragm 30 is connected to the support member 10 through the flexible body 31, that is, one end of the flexible body 31 is hermetically connected.
  • the support member the other end of which is tightly connected to the edge of the diaphragm 30, and the arrangement of the flexible body can also provide a great dynamic range of the diaphragm 30 and a hysteresis as low as possible.
  • the edge connected to the support member 10 is greatly deformed, thereby realizing a large-compression compression receiving space 40, making the piezoelectric film 20 more variable in shape, thereby improving the contact type of the embodiment.
  • the sensitivity and fidelity of the pickup microphone 1 are improved.
  • the piezoelectric film 20 and the diaphragm 30 are respectively disposed on the same side of the through hole 11, or the piezoelectric film 20 is disposed at one end of the through hole 11, and the diaphragm 30 is disposed at The other end of the through hole.
  • the piezoelectric film 20 and the diaphragm 30 are respectively disposed on the same side of the through hole 11, and the diaphragm 30 is convex, and is shielded from the piezoelectric film 20, and is oscillated.
  • the edge of the film 30 is connected to the support member 10. Generally, there is a gap between the edge of the diaphragm 30 and the edge of the piezoelectric film 20.
  • the volume of the receiving space 40 can be increased as much as possible, and the piezoelectric film 20 is sealed in the pass.
  • the upper end of the hole 11, and then the diaphragm 30 is also It is disposed at the end, and the accommodating space is squeezed by using ⁇ . Since the piezoelectric film 20 and the diaphragm 30 are disposed on the same side of the support member 10, the piezoelectric film is not easily deformed by being deformed into the through hole.
  • the piezoelectric film 20 is disposed at one end of the through hole 11, and the diaphragm 30 is disposed at the other end of the through hole 11.
  • the diaphragm 30 When the end faces of the through holes 11 are equal in area, the diaphragm 30 is convex and is covered in the through hole 11; when the end faces of the through holes are not equal in area, the diaphragm is disposed on The piezoelectric film is disposed at one end of the through hole having a large area, that is, when the diaphragm 30 is convex, and the piezoelectric film 20 is a flat type, the inner diameter of the through hole 11 can be the same at both ends; When the diaphragm 30 and the piezoelectric film 20 are both planar, the through-hole 11 is provided with a diaphragm 30-end opening area larger than the opening area of the piezoelectric film 20-end.
  • the piezoelectric film 20 and/or the diaphragm 30 may also be disposed in the middle of the through hole 11, as long as the diaphragm 30 is convenient to receive the vibration signal, for example, the support member is a sandwich structure, and the piezoelectric film 20 The edge of the diaphragm 30 is sandwiched by a sandwich or the like.
  • the support member 10 is a PCB board, and the through hole 11 is disposed on the PCB board, and the signal processing circuit is integrated at a position other than the receiving space 40 of the PCB board, and the PCB board is used as the PCB board.
  • the support member 10 can facilitate integration of the above signal processing circuit on the support member 10.
  • the diaphragm 30 is disposed on one side of the PCB, and the signal processing circuit is integrated on the other side. The signal processing circuit does not affect the contact of the end of the diaphragm 30 with the target.
  • the signal processing circuit is integrated at a position other than the accommodating space 40 of the support frame, and the signal processing circuit is conveniently arranged to improve the convenience and volume of the contact pickup microphone.
  • the sound absorbing layer 50 is disposed in a portion of the support member 10 in the accommodating space 40, and the sound absorbing layer 50 is disposed to prevent the reflection of sound waves in the accommodating cavity from affecting the sensing and improving the fidelity. degree.
  • the sound absorbing layer 50 described above can be laid with cotton, sponge, cloth, flexible rubber or the like.
  • the signal processing circuit includes a charge amplifier, that is, the specific electrical signal amplifying circuit is a charge amplifier.
  • the charge amplifier essentially enlarges the acquired vibration signal in the form of energy, and its amplification effect is far superior to that of the ordinary voltage amplifier: the signal function is closer to the human ear hearing experience, and the output signal conforms to the usage habit of the mechanical stethoscope; The effect is not affected by the change of the output impedance, especially the influence of the frequency change, the fidelity is greatly improved; the circuit is simple, and it is convenient to obtain a very low high-pass cutoff frequency.
  • a charge amplifier for electrical signal amplification relatively equalized signal amplification from 1 Hz to ⁇ can be obtained relatively easily.
  • a through hole 11 is disposed in a thickness direction of a circular PCB board, and a piezoelectric film 20 is disposed at the through hole 11, and the piezoelectric film 20 is The through hole 11 is tightly sealed; then a diaphragm 30 having a spherical cross section is masked on the piezoelectric film 20, and the piezoelectric film 20, the PCB board and the diaphragm 30 are enclosed by a receiving space 40, and are accommodated in the receiving space.
  • a sound absorbing material such as a sponge is laid on the PCB board in 40; a signal processing circuit is integrated on one side of the P CB board where the diaphragm 30 is not provided, and the signal processing circuit is connected to the piezoelectric film 20.
  • the contact type pickup microphone 1 is further provided with a casing, and the casing is provided with a mouthpiece for protruding the diaphragm 30 to facilitate contact of the diaphragm 30 with the object.
  • the touch-type pickup microphone 1 includes an upper gland 81, a lower gland 82, a support member 10, a signal processing circuit, a diaphragm 30, a piezoelectric film 20, and a flexible
  • the upper gland 81 is a first cylinder in which one end end is inwardly contracted, the inner side wall of the first cylinder is internally threaded
  • the lower gland 82 is a second cylinder, the second cylinder
  • the outer side wall is provided with an external thread
  • the second cylinder extends into the first cylinder along one end of the first cylinder which is not provided to contract inwardly, and is adapted to be screwed to the first cylinder
  • the support member 10 is a constricted portion of a cylinder and an end portion of the second cylinder projecting into the first cylinder are press-fixed, wherein the diaphragm 30 is disposed at an end of the support member 10 away from the second cylinder, and the diaphragm 30 is covered by the diaphragm
  • a through hole 11 is disposed on the support member 10, and the piezoelectric film 20 is sealed at an end of the through hole 11 away from the lower pressing cover 82.
  • the flexible body 31 is disposed on the side of the support member 10 away from the lower end cover side, and the edge of the diaphragm 30 is connected.
  • the flexible body 3 1, that is, the contraction portion of the first cylinder covers the edge of the diaphragm 30, the edge of the diaphragm 30 is connected to one end surface of the support member 10 through the flexible body 31, and the other end surface of the support member 10 and the second circle The cylinder is extruded into the end of the first cylinder.
  • the contact-type pickup microphone 1 of the present embodiment has a simple structure, the piezoelectric film 20 is disposed on the same side as the diaphragm 30, and the receiving space is pressed, and the piezoelectric film 20 is not easily deformed by being deformed into the through-hole 11 to be decoupled from the support.
  • the diaphragm 10 is convex and covers the entire support member 10, so that the volume of the accommodating space can be increased, and the ratio of the area of the diaphragm 30 to the area of the piezoelectric film 20 is increased as much as possible, and the accommodating space is squeezed and improved.
  • the electrical signal of the piezoelectric film 20 can collect the vibration of the target with high sensitivity and high fidelity; and the flexible body 31 can provide the maximum dynamic range of the diaphragm 30 and the hysteresis as low as possible;
  • the arrangement of the 81 and the lower pressing cover 82 can facilitate the fixing of the support member 10 and the installation of the diaphragm 30, etc., and has a simple structure.
  • the stethoscope of the embodiment can be sensitively collected by providing the contact pickup microphone of the above embodiment.
  • the vibration signal of the target, and the vibration signal is reduced to a sound signal with high fidelity.

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Abstract

本发明揭示了一种接触式拾音麦克风和听诊器，其中听诊器包括接触式拾音麦克风和播放器，播放器接收接触式拾音麦克风的音频信号并播放，所述接触式拾音麦克风包括信号处理电路、刚性的支撑件、压电薄膜和振膜，所述信号处理电路电连接所述压电薄膜；所述支撑件上设置通孔，所述压电薄膜将所述通孔密闭遮封，所述振膜遮罩于所述通孔，振膜的边沿密闭的连接于支撑件上；压电薄膜、振膜和支撑件之间形成密闭的充满流体震动介质的容纳空间，其中，所述压电薄膜至少遮封通孔的部分为容纳空间的内壁，组成所述容纳空间内壁的振膜部分大于所述压电薄膜遮封通孔的部分。本发明的接触式拾音麦克风和听诊器，可以灵敏地、高保真地采集目标物的震动信号。

Description

说明书 发明名称:接触式拾音麦克风和听诊器 技术领域
[0001] 本发明涉及到听诊器领域， 特别是涉及到一种提高听诊效果的接触式拾音麦克 风和听诊器。
背景技术
[0002] 接触式拾音麦克风是一种通过接触目标物后， 将目标物的震动产生电信号， 然 后通过放大电路、 滤波电路、 数模转换电路、 压缩电路等驱动电路对电信号进 行相应的处理， 最后再将处理后的电信号通过音频播放和存储等设备进行播放 和存储等。
[0003] 现有的接触式拾音麦克风， 采集目标物震动的灵敏度低， 当被测物的震动较弱 吋， 存在漏采集或采集到的震动信号失真的情况。
技术问题
[0004] 本发明的主要目的是为了提供一种更高灵敏度的接触式拾音麦克风和听诊器。
技术解决方案
[0005] 为了实现上述发明目的， 本发明首先提供一种接触式拾音麦克风， 包括信号处 理电路、 刚性的支撑件、 压电薄膜和振膜， 所述信号处理电路电连接所述压电 薄膜； 所述支撑件上设置通孔， 所述压电薄膜将所述通孔密闭遮封， 所述振膜 遮罩于所述通孔， 振膜的边沿密闭的连接于支撑件上； 压电薄膜、 振膜和支撑 件之间形成密闭的充满流体震动介质的容纳空间， 其中， 压电薄膜至少遮封通 孔的部分为容纳空间的内壁， 组成所述容纳空间内壁的振膜部分大于所述压电 薄膜遮封通孔的部分。
[0006] 进一步地， 所述振膜设置为凸面形， 振膜的边沿密闭的连接于支撑件上。
[0007] 进一步地， 所述振膜与支撑件连接的边沿为褶皱状或波纹状； 或者， 所述振膜 的边沿通过柔性体连接所述支撑件。
[0008] 进一步地， 所述压电薄膜与振膜分别设置所述通孔的同一侧； 或者，
[0009] 所述压电薄膜设置于所述通孔的一端， 振膜设置于所述通孔的另一端。 [0010] 进一步地， 所述压电薄膜与振膜分别设置所述通孔的同一侧吋， 所述振膜为凸 面形； 或者，
[0011] 所述压电薄膜设置于所述通孔的一端， 振膜设置于所述通孔的另一端吋， 当所 述通孔的两端端面面积相等， 则所述振膜为凸面形； 当所述通孔的两端端面面 积不相等， 则所述振膜设置于通孔面积大的一端， 压电薄膜设置于通孔面积小 的一端。
[0012] 进一步地， 所述支撑件为 PCB板， 所述 PCB板上设置所述通孔；
[0013] 所述信号处理电路集成于所述 PCB板的容纳空间以外的位置上。
[0014] 进一步地， 还包括上压盖和下压盖，
[0015] 所述上压盖为其中一端端部向内收缩的第一圆筒， 第一圆筒的内侧壁设置内螺 纹； 所述下压盖为第二圆筒， 第二圆筒的外侧壁设置外螺纹， 第二圆筒沿第一 圆筒未设置向内收缩的一端伸入第一圆筒， 且适配地与第一圆筒螺纹连接；
[0016] 所述支撑件被第一圆筒的收缩部分和第二圆筒伸入第一圆筒的端部挤压固定， 其中， 所述压电薄膜和振膜设置于支撑件远离第二圆筒的一端， 振膜遮罩压电 薄膜于支撑件。
[0017] 进一步地， 所述支撑件位于所述容纳空间内的部分设置吸音层。
[0018] 进一步地， 所述信号处理动电路中包括电荷放大器。
[0019] 本发明还提供一种听诊器， 包括接触式拾音麦克风和播放器， 播放器接收接触 式拾音麦克风的音频信号并播放； 所述接触式拾音麦克风包括信号处理电路、 刚性的支撑件、 压电薄膜和振膜， 所述信号处理电路电连接所述压电薄膜；
[0020] 所述支撑件上设置通孔， 所述压电薄膜将所述通孔密闭遮封， 所述振膜遮罩于 所述通孔， 振膜的边沿密闭的连接于支撑件上； 压电薄膜、 振膜和支撑件之间 形成密闭的充满流体震动介质的容纳空间， 其中， 压电薄膜至少遮封通孔的部 分为容纳空间的内壁， 组成所述容纳空间内壁的振膜部分大于所述压电薄膜遮 封通孔的部分。
[0021] 进一步地， 所述振膜设置为凸面形， 振膜的边沿密闭的连接于支撑件上。
[0022] 进一步地， 所述振膜与支撑件连接的边沿为褶皱状或波纹状； 或者， 所述振膜 的边沿通过柔性体连接所述支撑件。 [0023] 进一步地， 所述压电薄膜与振膜分别设置所述通孔的同一侧； 或者，
[0024] 所述压电薄膜设置于所述通孔的一端， 振膜设置于所述通孔的另一端。
[0025] 进一步地， 所述压电薄膜与振膜分别设置所述通孔的同一侧吋， 所述振膜为凸 面形； 或者，
[0026] 所述压电薄膜设置于所述通孔的一端， 振膜设置于所述通孔的另一端吋， 当所 述通孔的两端端面面积相等， 则所述振膜为凸面形； 当所述通孔的两端端面面 积不相等， 则所述振膜设置于通孔面积大的一端， 压电薄膜设置于通孔面积小 的一端。
[0027] 进一步地， 所述支撑件为 PCB板， 所述 PCB板上设置所述通孔；
[0028] 所述信号处理电路集成于所述 PCB板的容纳空间以外的位置上。
[0029] 进一步地， 还包括上压盖和下压盖，
[0030] 所述上压盖为其中一端端部向内收缩的第一圆筒， 第一圆筒的内侧壁设置内螺 纹； 所述下压盖为第二圆筒， 第二圆筒的外侧壁设置外螺纹， 第二圆筒沿第一 圆筒未设置向内收缩的一端伸入第一圆筒， 且适配地与第一圆筒螺纹连接；
[0031] 所述支撑件被第一圆筒的收缩部分和第二圆筒伸入第一圆筒的端部挤压固定， 其中， 所述压电薄膜和振膜设置于支撑件远离第二圆筒的一端， 振膜遮罩压电 薄膜于支撑件。
[0032] 进一步地， 所述支撑件位于所述容纳空间内的部分设置吸音层。
[0033] 进一步地， 所述信号处理动电路中包括电荷放大器。
问题的解决方案
发明的有益效果
有益效果
[0034] 本发明的接触式拾音麦克风， 将振膜、 压电薄膜和支撑件形成密闭的充满流体 震动介质的容纳空间， 并且压电薄膜的面积小于所述振膜的面积， 当采集目标 物的震动情况吋， 将振膜接触目标物， 目标物会带动振膜震动， 振膜将震动情 况作用于容纳空间， 从而使压电薄膜产生电信号， 由于振膜的面积大于压电薄 膜， 所以压电薄膜的震动幅度会大于振膜的幅度， 使压电薄膜产生的电信号会 更大， 从而可以高灵敏度地、 高保真地的采集目标物的震动情况。 对附图的简要说明
附图说明
[0035] 图 1为本发明一实施例的接触式拾音麦克风的截面示意图；
[0036] 图 2为本发明另一实施例的接触式拾音麦克风的截面示意图；
[0037] 图 3为本发明一具体实施例的接触式拾音麦克风的结构示意图；
[0038] 图 4为本发明图 3的 A-A图；
[0039] 图 5为本发明又一具体实施例的接触式拾音麦克风的结构示意图；
[0040] 图 6为本发明一实施例的听诊器的结构示意图。
[0041] 本发明目的的实现、 功能特点及优点将结合实施例， 参照附图做进一步说明。
实施该发明的最佳实施例
本发明的最佳实施方式
[0042] 应当理解， 此处所描述的具体实施例仅仅用以解释本发明， 并不用于限定本发 明。
[0043] 参照图 1， 本发明实施例中提出一种接触式拾音麦克风 1， 包括信号处理电路、 刚性的支撑件 10、 压电薄膜 20和振膜 30， 所述信号处理电路电连接所述压电薄 膜 20; 所述支撑件 10上设置通孔 11， 所述压电薄膜 20将所述通孔 11密闭遮封， 所述振膜 30遮罩于所述通孔 11， 振膜 30的边沿密闭的连接于支撑件 10上； 压电 薄膜 20、 支撑件 10与振膜 30之间形成密闭的充满流体震动介质的容纳空间 40， 其中， 压电薄膜 20至少遮封通孔 11的部分为容纳空间 40的内壁， 组成所述容纳 空间 40内壁的振膜 30部分大于所述压电薄膜 20遮封通孔 11的部分， 也就是说， 振膜 30相对通孔 11一侧的正投影面积大于通孔 11的端部的面积。
[0044] 上述信号处理电路一般包括信号放大电路、 滤波电路、 压缩电路、 模数转换电 路、 射频发射电路等， 用于根据需要对压电薄膜 20产生的电信号进行处理。 比 如， 首先将电信号通过信号放大电路进行放大处理， 然后通过滤波电路杂波过 滤， 在后分别通过模数转换电路将模拟信号转换为数字信号， 最后通过压缩电 路和射频发射电路将数字信号压缩并发射给播放器 2等设备， 而在另一实施例中 ， 通过信号线连接播放器 2等设备， 则无需设置射频发射电路。 在其它实施例中 ， 可以根据实际的使用情况设置对应的信号处理电路。 [0045] 上述刚性的支撑件 10是指当振膜 30震动吋， 而支撑件 10不会产生过大震动， 从 而提高保真度。
[0046] 上述压电薄膜 20即是压电聚偏氟乙烯 PVDF高分子膜， 是至一种受到外力干扰 而变形后， 会产生相应电信号的薄膜， 同一个压电薄膜 20具有形变越大， 产生 的电信号越大的特点。 上述支撑件 10上设置通孔 11处设置压电薄膜 20， 为压电 薄膜 20震动提供空间。
[0047] 上述振膜 30是指一层能够感受目标物震动情况的膜。 本实施例中， 振膜 30具有 刚性， 以防止压缩容纳空间 40吋， 振膜 30自身发生形变而压电薄膜 20的形变微 弱的情况发生。
[0048] 上述压电薄膜 20至少遮封通孔 11的部分为容纳空间 40的内壁， 组成所述容纳空 间 40内壁的振膜 20部分大于所述压电薄膜 20遮封通孔 11的部分， 是指压电薄膜 2 0遮封通孔 11和振膜 30遮罩于所述通孔 11后， 压电薄膜 20与通孔 11对应的部分会 与振膜 3与通孔 11对应的部分之间有间隙， 为了实际应用， 振膜 30会突出通孔设 置， 方便接收震动信号。 本实施例中， 振膜 30遮罩于所述通孔 11， 是指振膜 30 朝向通孔 11方向的正投影覆盖通孔 11， 振膜 30的边沿连接于通孔 11一端部周边 的支撑件上。 上述容纳空间 40内充满流体震动介质， 可以为空气或其它气体， 也可以是水等液体。 可以根据具体的使用环境选择不同的震动介质， 比如， 主 要采集空气中的目标物的震动情况， 那么一般会在容纳空间 40内设置空气为震 动介质， 在其它实施例中， 采集水中目标物的震动情况， 那么选择容纳空间 40 中设置水体为震动介质等。
[0049] 本实施例的接触式拾音麦克风 1， 当采集目标物的震动情况吋， 将振膜 30接触 目标物， 目标物会带动振膜 30震动， 振膜 30将震动情况作用于容纳空间 40， 从 而使压电薄膜 20遮封通孔 11部分发生相应的形变而产生电信号， 由于容纳空间 4 0内壁的振膜 30部分的面积大于压电薄膜 20遮封通孔 11部分的面积， 所以压电薄 膜 20的震动幅度会大于振膜 30的幅度， 使压电薄膜 20产生的电信号会更大， 从 而可以高灵敏度的采集目标物的震动情况， 更加真实的还原目标物的震动情况 。 本实施例中， 为了减小压电薄膜 20对应通孔的面积， 压电薄膜 20为平面设置 [0050] 参照图 2， 本实施例中， 上述振膜 30设置为凸面形， 振膜 30的边沿密闭的连接 于支撑件 10上， 因为压电薄膜 20与振膜 30之间形成容纳空间， 那么振膜 30的凸 面顶点会远离压电薄膜 20。 上述的凸面形可以是一种将圆球沿任意方向切幵后 的任意一半球体的形状， 或者其他不规则的凸面形等。 凸面形的振膜 30， 可以 增加振膜 30的面积， 方便采集目标物的震动情况。
[0051] 本实施例中， 上述振膜 30与支撑件 10连接的边沿为与连接处平行的褶皱状或波 纹状， 褶皱状和波纹状的振膜 30与支撑件 10连接的边沿， 同样可以在振膜 30收 到压力干扰吋， 提供振膜 30极大的动态范围和尽量低的迟滞； 或者振膜 30的边 沿通过柔性体 31连接所述支撑件 10， 即柔性体 31的一端密闭连接支撑件， 另一 端密闭连接振膜 30的边沿， 柔性体的设置， 同样可以提供振膜 30极大的动态范 围和尽量低的迟滞。 当振膜 30受到挤压吋， 与支撑件 10连接的边沿会大幅度的 形变， 从而实现大效率的压缩容纳空间 40， 使压电薄膜 20的形变量更大， 从而 提高实施例的接触式拾音麦克风 1的灵敏度和保真度。
[0052] 本实施例中， 上述压电薄膜 20与振膜 30分别设置所述通孔 11的同一侧， 或者， 上述压电薄膜 20设置于所述通孔 11的一端， 振膜 30设置于所述通孔的另一端。 在一具体实施例中， 如图 4所示， 上述压电薄膜 20与振膜 30分别设置所述通孔 11 的同一侧吋， 振膜 30为凸面形， 遮罩于压电薄膜 20， 振膜 30的边沿连接于支撑 件 10， 通常振膜 30的边沿与压电薄膜 20的边沿之间有间隙， 可以尽可能大的增 加容纳空间 40的体积， 将压电薄膜 20遮封于所述通孔 11的上端， 然后将振膜 30 也设置于该端， 在使用吋， 容纳空间受到挤压吋， 由于压电薄膜 20与振膜 30设 置于支撑件 10的同一侧， 所以压电薄膜不容易因向通孔内凹陷形变而脱离支撑 件 10; 在另一实施例中， 如图 1和图 2所示， 上述压电薄膜 20设置于所述通孔 11 的一端， 振膜 30设置于所述通孔 11的另一端吋， 当所述通孔 11的两端端面面积 相等， 则所述振膜 30为凸面形， 遮罩于通孔 11 ; 当所述通孔的两端端面面积不 相等， 则所述振膜设置于通孔面积大的一端， 压电薄膜设置于通孔面积小的一 端， 也就是说， 当振膜 30为凸面形， 压电薄膜 20为平面型吋， 通孔 11的内径可 以两端相同； 当振膜 30和压电薄膜 20均为平面型吋， 通孔 11设置振膜 30—端的 幵口面积大于设置压电薄膜 20—端的幵口面积。 在其它实施例中， 压电薄膜 20 和 /或振膜 30也可以设置于通孔 11的中部， 只要振膜 30方便接收震动信号即可， 比如， 支撑件为一夹层结构， 压电薄膜 20和振膜 30的边沿被夹层夹持等。
[0053] 本实施例中， 上述支撑件 10为 PCB板， 所述 PCB板上设置所述通孔 11， 信号处 理电路集成于所述 PCB板的容纳空间 40以外的位置上， 使用 PCB板作为支撑件 10 ， 可以方便将上述信号处理电路集成于支撑件 10上。 在一具体实施例中， PCB板 的一面设置振膜 30， 另一面集成上述信号处理电路， 信号处理电路不会影响设 置振膜 30的一端与目标物接触。 本实施例中， 上述信号处理电路集成于所述支 撑架的容纳空间 40以外的位置上， 方便设置信号处理电路， 提高接触式拾音麦 克风 1的使用便利性和体积。
[0054] 本实施例中， 上述支撑件 10位于所述容纳空间 40内的部分设置吸音层 50， 吸音 层 50的设置， 可以避免声波在容纳空腔内反射对传感产生影响， 提高保真度。 上述的吸音层 50可以棉花、 海绵、 布、 柔性橡胶等铺设而成。
[0055] 本实施例中， 上述信号处理电路中包括电荷放大器， 即具体的电信号放大电路 为电荷放大器。 电荷放大器本质上是将获取的震动信号以能量的形式进进行放 大， 其放大效果远远优于普通的电压放大器： 信号作用更接近人耳听觉感受， 输出信号符合机械听诊器等的使用习惯； 信号作用不受输出阻抗改变的影响， 尤其不受频率改变带来的影响， 保真度大大提高； 电路简洁， 方便获得很低的 高通截止频率。 本实施例中， 利用电荷放大器进行电信号放大， 可以较轻松地 获得从 1Hz到 ΙΟΚΗζ的比较均衡的信号放大。
[0056] 参照图 3和图 4， 在一具体实施例中， 一圆形的 PCB板的中间沿厚度方向上设置 通孔 11， 在通孔 11处设置压电薄膜 20， 压电薄膜 20将通孔 11紧密的封住； 然后 将一截面球形的振膜 30遮罩于压电薄膜 20， 使压电薄膜 20、 PCB板和振膜 30之间 围成一容纳空间 40， 并且在容纳空间 40内的 PCB板上铺设海绵等吸音材料； 在 P CB板未设置振膜 30的一面集成信号处理电路， 信号处理电路与压电薄膜 20连接 。 本实施中， 接触式拾音麦克风 1还会设置壳体， 壳体上设置突出振膜 30的幵口 ， 方便振膜 30与目标物接触。
[0057] 参照图 5， 在又一具体实施例中， 接触式拾音麦克风 1包括上压盖 81、 下压盖 82 、 支撑件 10、 信号处理电路、 振膜 30、 压电薄膜 20和柔性体 31 ; 所述上压盖 81 为其中一端端部向内收缩的第一圆筒， 第一圆筒的内侧壁设置内螺纹； 所述下 压盖 82为第二圆筒， 第二圆筒的外侧壁设置外螺纹， 第二圆筒沿第一圆筒未设 置向内收缩的一端伸入第一圆筒， 且适配地与第一圆筒螺纹连接； 所述支撑件 1 0被第一圆筒的收缩部分和第二圆筒伸入第一圆筒的端部挤压固定， 其中， 所述 振膜 30设置于支撑件 10远离第二圆筒的一端， 振膜 30遮罩压电薄膜 20于支撑件 1 0。 支撑件 10上设置一通孔 11， 在通孔 11远离下压盖 82的一端遮封压电薄膜 20， 在支撑件 10远离下端盖一侧的边沿设置柔性体 31， 振膜 30的边沿连接与柔性体 3 1， 即第一圆筒的收缩部分压盖振膜 30的边沿， 振膜 30的边沿通过柔性体 31连接 与支撑件 10的一端面， 支撑件 10的另一端面与第二圆筒伸入第一圆筒的端部挤 压， 当下压盖 82和上压盖 81相对螺纹连接吋， 将振膜 30、 柔性体 31和支撑件 10 压固于上压盖 81和县压盖之间。 本实施例的接触式拾音麦克风 1， 结构简单， 压 电薄膜 20与振膜 30同侧设置， 容纳空间受到挤压吋， 压电薄膜 20不容易因向通 孔 11内凹陷形变而脱离支撑件 10; 振膜 30为凸面且遮盖整个支撑件 10， 可以增 大容纳空间的体积， 尽量的增大振膜 30的面积与压电薄膜 20的面积之比， 容纳 空间受到挤压吋， 提高压电薄膜 20的电信号， 可以高灵敏度地、 高保真地的采 集目标物的震动情况； 而柔性体 31的设置， 可以提供振膜 30极大的动态范围和 尽量低的迟滞； 上压盖 81和下压盖 82的设置可以方便固定支撑件 10和安装振膜 3 0等， 结构简单。
[0058] 本实施例的接触式拾音麦克风 1， 可以灵敏的采集目标物的震动信号， 而且高 保真地将震动信号还原成声音信号。
[0059] 参照图 6和图 1， 本实施例还提供一种听诊器， 包括接触式拾音麦克风 1和播放 器 2， 播放器 2接收接触式拾音麦克风 1的音频信号并播放， 所述接触式拾音麦克 风 1包括信号处理电路、 刚性的支撑件 10、 压电薄膜 20和振膜 30， 所述信号处理 电路电连接所述压电薄膜 20; 所述支撑件 10上设置通孔 11， 所述压电薄膜 20将 所述通孔 11密闭遮封， 所述振膜 30遮罩于所述通孔 11， 振膜 30的边沿密闭的连 接于支撑件 10上； 压电薄膜 20、 支撑件 10与振膜 30之间形成密闭的充满流体震 动介质的容纳空间 40， 其中， 压电薄膜 20至少遮封通孔 11的部分为容纳空间 40 的内壁， 组成所述容纳空间 40内壁的振膜 30部分大于所述压电薄膜 20遮封通孔 1 1的部分， 也就是说， 振膜 30相对通孔 11一侧的正投影面积大于通孔 11的端部的 面积。
[0060] 上述信号处理电路一般包括信号放大电路、 滤波电路、 压缩电路、 模数转换电 路、 射频发射电路等， 用于根据需要对压电薄膜 20产生的电信号进行处理。 比 如， 首先将电信号通过信号放大电路进行放大处理， 然后通过滤波电路杂波过 滤， 在后分别通过模数转换电路将模拟信号转换为数字信号， 最后通过压缩电 路和射频发射电路将数字信号压缩并发射给播放器 2等设备， 而在另一实施例中 ， 通过信号线连接播放器 2等设备， 则无需设置射频发射电路。 在其它实施例中 ， 可以根据实际的使用情况设置对应的信号处理电路。
[0061] 上述刚性的支撑件 10是指当振膜 30震动吋， 而支撑件 10不会产生过大震动， 从 而提高保真度。
[0062] 上述压电薄膜 20即是压电聚偏氟乙烯 PVDF高分子膜， 是至一种受到外力干扰 而变形后， 会产生相应电信号的薄膜， 同一个压电薄膜 20具有形变越大， 产生 的电信号越大的特点。 上述支撑件 10上设置通孔 11处设置压电薄膜 20， 为压电 薄膜 20震动提供空间。
[0063] 上述振膜 30是指一层能够感受目标物震动情况的膜。 本实施例中， 振膜 30具有 刚性， 以防止压缩容纳空间 40吋， 振膜 30自身发生形变而压电薄膜 20的形变微 弱的情况发生。
[0064] 上述压电薄膜 20至少遮封通孔 11的部分为容纳空间 40的内壁， 组成所述容纳空 间 40内壁的振膜 20部分大于所述压电薄膜 20遮封通孔 11的部分， 是指压电薄膜 2 0遮封通孔 11和振膜 30遮罩于所述通孔 11后， 压电薄膜 20与通孔 11对应的部分会 与振膜 3与通孔 11对应的部分之间有间隙， 为了实际应用， 振膜 30会突出通孔设 置， 方便接收震动信号。 本实施例中， 振膜 30遮罩于所述通孔 11， 是指振膜 30 朝向通孔 11方向的正投影覆盖通孔 11， 振膜 30的边沿连接于通孔 11一端部周边 的支撑件上。 上述容纳空间 40内充满流体震动介质， 可以为空气或其它气体， 也可以是水等液体。 可以根据具体的使用环境选择不同的震动介质， 比如， 主 要采集空气中的目标物的震动情况， 那么一般会在容纳空间 40内设置空气为震 动介质， 在其它实施例中， 采集水中目标物的震动情况， 那么选择容纳空间 40 中设置水体为震动介质等。
[0065] 本实施例的接触式拾音麦克风 1， 当采集目标物的震动情况吋， 将振膜 30接触 目标物， 目标物会带动振膜 30震动， 振膜 30将震动情况作用于容纳空间 40， 从 而使压电薄膜 20遮封通孔 11部分发生相应的形变而产生电信号， 由于容纳空间 4 0内壁的振膜 30部分的面积大于压电薄膜 20遮封通孔 11部分的面积， 所以压电薄 膜 20的震动幅度会大于振膜 30的幅度， 使压电薄膜 20产生的电信号会更大， 从 而可以高灵敏度的采集目标物的震动情况， 更加真实的还原目标物的震动情况 。 本实施例中， 为了减小压电薄膜 20对应通孔的面积， 压电薄膜 20为平面设置
[0066] 参照图 2， 本实施例中， 上述振膜 30设置为凸面形， 振膜 30的边沿密闭的连接 于支撑件 10上， 因为压电薄膜 20与振膜 30之间形成容纳空间， 那么振膜 30的凸 面顶点会远离压电薄膜 20。 上述的凸面形可以是一种将圆球沿任意方向切幵后 的任意一半球体的形状， 或者其他不规则的凸面形等。 凸面形的振膜 30， 可以 增加振膜 30的面积， 方便采集目标物的震动情况。
[0067] 本实施例中， 上述振膜 30与支撑件 10连接的边沿为与连接处平行的褶皱状或波 纹状， 褶皱状和波纹状的振膜 30与支撑件 10连接的边沿， 同样可以在振膜 30收 到压力干扰吋， 提供振膜 30极大的动态范围和尽量低的迟滞； 或者振膜 30的边 沿通过柔性体 31连接所述支撑件 10， 即柔性体 31的一端密闭连接支撑件， 另一 端密闭连接振膜 30的边沿， 柔性体的设置， 同样可以提供振膜 30极大的动态范 围和尽量低的迟滞。 当振膜 30受到挤压吋， 与支撑件 10连接的边沿会大幅度的 形变， 从而实现大效率的压缩容纳空间 40， 使压电薄膜 20的形变量更大， 从而 提高实施例的接触式拾音麦克风 1的灵敏度和保真度提高。
[0068] 本实施例中， 上述压电薄膜 20与振膜 30分别设置所述通孔 11的同一侧， 或者， 上述压电薄膜 20设置于所述通孔 11的一端， 振膜 30设置于所述通孔的另一端。 在一具体实施例中， 如图 4所示， 上述压电薄膜 20与振膜 30分别设置所述通孔 11 的同一侧吋， 振膜 30为凸面形， 遮罩于压电薄膜 20， 振膜 30的边沿连接于支撑 件 10， 通常振膜 30的边沿与压电薄膜 20的边沿之间有间隙， 可以尽可能大的增 加容纳空间 40的体积， 压电薄膜 20遮封于所述通孔 11的上端， 然后将振膜 30也 设置于该端， 在使用吋， 容纳空间受到挤压吋， 由于压电薄膜 20与振膜 30设置 于支撑件 10的同一侧， 所以压电薄膜不容易因向通孔内凹陷形变而脱离支撑件 1 0； 在另一实施例中， 如图 1和图 2所示， 上述压电薄膜 20设置于所述通孔 11的一 端， 振膜 30设置于所述通孔 11的另一端吋， 当所述通孔 11的两端端面面积相等 ， 则所述振膜 30为凸面形， 遮罩于通孔 11 ; 当所述通孔的两端端面面积不相等 ， 则所述振膜设置于通孔面积大的一端， 压电薄膜设置于通孔面积小的一端， 也就是说， 当振膜 30为凸面形， 压电薄膜 20为平面型吋， 通孔 11的内径可以两 端相同； 当振膜 30和压电薄膜 20均为平面型吋， 通孔 11设置振膜 30—端的幵口 面积大于设置压电薄膜 20—端的幵口面积。 在其它实施例中， 压电薄膜 20和 /或 振膜 30也可以设置于通孔 11的中部， 只要振膜 30方便接收震动信号即可， 比如 ， 支撑件为一夹层结构， 压电薄膜 20和振膜 30的边沿被夹层夹持等。
[0069] 本实施例中， 上述支撑件 10为 PCB板， 所述 PCB板上设置所述通孔 11， 信号处 理电路集成于所述 PCB板的容纳空间 40以外的位置上， 使用 PCB板作为支撑件 10 ， 可以方便将上述信号处理电路集成于支撑件 10上。 在一具体实施例中， PCB板 的一面设置振膜 30， 另一面集成上述信号处理电路， 信号处理电路不会影响设 置振膜 30的一端与目标物接触。 本实施例中， 上述信号处理电路集成于所述支 撑架的容纳空间 40以外的位置上， 方便设置信号处理电路， 提高接触式拾音麦 克风 1的使用便利性和体积。
[0070] 本实施例中， 上述支撑件 10位于所述容纳空间 40内的部分设置吸音层 50， 吸音 层 50的设置， 可以避免声波在容纳空腔内反射对传感产生影响， 提高保真度。 上述的吸音层 50可以棉花、 海绵、 布、 柔性橡胶等铺设而成。
[0071] 本实施例中， 上述信号处理电路中包括电荷放大器， 即具体的电信号放大电路 为电荷放大器。 电荷放大器本质上是将获取的震动信号以能量的形式进进行放 大， 其放大效果远远优于普通的电压放大器： 信号作用更接近人耳听觉感受， 输出信号符合机械听诊器等的使用习惯； 信号作用不受输出阻抗改变的影响， 尤其不受频率改变带来的影响， 保真度大大提高； 电路简洁， 方便获得很低的 高通截止频率。 本实施例中， 利用电荷放大器进行电信号放大， 可以较轻松地 获得从 1Hz到 ΙΟΚΗζ的比较均衡的信号放大。 [0072] 参照图 3和图 4， 在一具体实施例中， 一圆形的 PCB板的中间沿厚度方向上设置 通孔 11， 在通孔 11处设置压电薄膜 20， 压电薄膜 20将通孔 11紧密的封住； 然后 将一截面球形的振膜 30遮罩于压电薄膜 20， 使压电薄膜 20、 PCB板和振膜 30之间 围成一容纳空间 40， 并且在容纳空间 40内的 PCB板上铺设海绵等吸音材料； 在 P CB板未设置振膜 30的一面集成信号处理电路， 信号处理电路与压电薄膜 20连接 。 本实施中， 接触式拾音麦克风 1还会设置壳体， 壳体上设置突出振膜 30的幵口 ， 方便振膜 30与目标物接触。
[0073] 参照图 5， 在又一具体实施例中， 接触式拾音麦克风 1包括上压盖 81、 下压盖 82 、 支撑件 10、 信号处理电路、 振膜 30、 压电薄膜 20和柔性体 31 ; 所述上压盖 81 为其中一端端部向内收缩的第一圆筒， 第一圆筒的内侧壁设置内螺纹； 所述下 压盖 82为第二圆筒， 第二圆筒的外侧壁设置外螺纹， 第二圆筒沿第一圆筒未设 置向内收缩的一端伸入第一圆筒， 且适配地与第一圆筒螺纹连接； 所述支撑件 1 0被第一圆筒的收缩部分和第二圆筒伸入第一圆筒的端部挤压固定， 其中， 所述 振膜 30设置于支撑件 10远离第二圆筒的一端， 振膜 30遮罩压电薄膜 20于支撑件 1 0。 支撑件 10上设置一通孔 11， 在通孔 11远离下压盖 82的一端遮封压电薄膜 20， 在支撑件 10远离下端盖一侧的边沿设置柔性体 31， 振膜 30的边沿连接与柔性体 3 1， 即第一圆筒的收缩部分压盖振膜 30的边沿， 振膜 30的边沿通过柔性体 31连接 与支撑件 10的一端面， 支撑件 10的另一端面与第二圆筒伸入第一圆筒的端部挤 压， 当下压盖 82和上压盖 81相对螺纹连接吋， 将振膜 30、 柔性体 31和支撑件 10 压固于上压盖 81和县压盖之间。 本实施例的接触式拾音麦克风 1， 结构简单， 压 电薄膜 20与振膜 30同侧设置， 容纳空间受到挤压吋， 压电薄膜 20不容易因向通 孔 11内凹陷形变而脱离支撑件 10; 振膜 30为凸面且遮盖整个支撑件 10， 可以增 大容纳空间的体积， 尽量的增大振膜 30的面积与压电薄膜 20的面积之比， 容纳 空间受到挤压吋， 提高压电薄膜 20的电信号， 可以高灵敏度地、 高保真地的采 集目标物的震动情况； 而柔性体 31的设置， 可以提供振膜 30极大的动态范围和 尽量低的迟滞； 上压盖 81和下压盖 82的设置可以方便固定支撑件 10和安装振膜 3 0等， 结构简单。
[0074] 本实施例的听诊器因为设置上述实施例的接触式拾音麦克风， 可以灵敏的采集 目标物的震动信号， 而且高保真地将震动信号还原成声音信号。
以上所述仅为本发明的优选实施例， 并非因此限制本发明的专利范围， 凡是利 用本发明说明书及附图内容所作的等效结构或等效流程变换， 或直接或间接运 用在其他相关的技术领域， 均同理包括在本发明的专利保护范围内。

Claims

权利要求书
一种接触式拾音麦克风， 其特征在于， 包括信号处理电路、 刚性的支 撑件、 压电薄膜和振膜， 所述信号处理电路电连接所述压电薄膜； 所述支撑件上设置通孔， 所述压电薄膜将所述通孔密闭遮封， 所述振 膜遮罩于所述通孔， 振膜的边沿密闭的连接于支撑件上； 压电薄膜、 振膜和支撑件之间形成密闭的充满流体震动介质的容纳空间， 其中， 压电薄膜至少遮封通孔的部分为容纳空间的内壁， 组成所述容纳空间 内壁的振膜部分大于所述压电薄膜遮封通孔的部分。
根据权利要求 1所述的接触式拾音麦克风， 其特征在于， 所述振膜设 置为凸面形， 振膜的边沿密闭的连接于支撑件上。
根据权利要求 2所述的接触式拾音麦克风， 其特征在于， 所述振膜与 支撑件连接的边沿为褶皱状或波纹状； 或者， 所述振膜的边沿通过柔 性体连接所述支撑件。
根据权利要求 1所述的接触式拾音麦克风， 其特征在于， 所述压电薄 膜与振膜分别设置所述通孔的同一侧； 或者， 所述压电薄膜设置于所述通孔的一端， 振膜设置于所述通孔的另一端
[权利要求 5] 根据权利要求 4所述的接触式拾音麦克风， 其特征在于， 所述压电薄 膜与振膜分别设置所述通孔的同一侧吋， 所述振膜为凸面形； 或者， 所述压电薄膜设置于所述通孔的一端， 振膜设置于所述通孔的另一端 吋， 当所述通孔的两端端面面积相等， 则所述振膜为凸面形； 当所述 通孔的两端端面面积不相等， 则所述振膜设置于通孔面积大的一端， 压电薄膜设置于通孔面积小的一端。
[权利要求 6] 根据权利要求 1所述的接触式拾音麦克风， 其特征在于， 所述支撑件 为 PCB板， 所述 PCB板上设置所述通孔；
所述信号处理电路集成于所述 PCB板的容纳空间以外的位置上。
[权利要求 7] 根据权利要求 1-6中任一项所述的接触式拾音麦克风， 其特征在于， 还包括上压盖和下压盖， 所述上压盖为其中一端端部向内收缩的第一圆筒， 第一圆筒的内侧壁 设置内螺纹； 所述下压盖为第二圆筒， 第二圆筒的外侧壁设置外螺纹 ， 第二圆筒沿第一圆筒未设置向内收缩的一端伸入第一圆筒， 且适配 地与第一圆筒螺纹连接；
所述支撑件被第一圆筒的收缩部分和第二圆筒伸入第一圆筒的端部挤 压固定， 其中， 所述压电薄膜和振膜设置于支撑件远离第二圆筒的一 端， 振膜遮罩压电薄膜于支撑件。
[权利要求 8] 根据权利要求 1-6中任一项所述的接触式拾音麦克风， 其特征在于， 所述支撑件位于所述容纳空间内的部分设置吸音层。
[权利要求 9] 根据权利要求 1-6中任一项所述的接触式拾音麦克风， 其特征在于， 所述信号处理动电路中包括电荷放大器。
[权利要求 10] —种听诊器， 包括接触式拾音麦克风和播放器， 播放器接收接触式拾 音麦克风的音频信号并播放， 其特征在于， 所述接触式拾音麦克风包 括信号处理电路、 刚性的支撑件、 压电薄膜和振膜， 所述信号处理电 路电连接所述压电薄膜；
所述支撑件上设置通孔， 所述压电薄膜将所述通孔密闭遮封， 所述振 膜遮罩于所述通孔， 振膜的边沿密闭的连接于支撑件上； 压电薄膜、 振膜和支撑件之间形成密闭的充满流体震动介质的容纳空间， 其中， 所述压电薄膜至少遮封通孔的部分为容纳空间的内壁， 组成所述容纳 空间内壁的振膜部分大于所述压电薄膜遮封通孔的部分。
[权利要求 11] 根据权利要求 10所述的听诊器， 其特征在于， 所述接触式拾音麦克风 如权利要求 2-9中任一项所述的接触式拾音麦克风。
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