WO2016203100A1 - Device for sensing radiation - Google Patents
Device for sensing radiation Download PDFInfo
- Publication number
- WO2016203100A1 WO2016203100A1 PCT/FI2016/050376 FI2016050376W WO2016203100A1 WO 2016203100 A1 WO2016203100 A1 WO 2016203100A1 FI 2016050376 W FI2016050376 W FI 2016050376W WO 2016203100 A1 WO2016203100 A1 WO 2016203100A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- fhe
- array
- junction
- electrical junction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/227—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a Schottky barrier
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/122—Active materials comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/143—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies comprising quantum structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/143—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies comprising quantum structures
- H10F77/1433—Quantum dots
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/24—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only two potential barriers, e.g. bipolar phototransistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Definitions
- Examples of the present disclosure relate to an apparatus for sensing. Some examples, though without prejudice to the foregoing, relate to an apparatus for photo detection.
- Photodetectors are known. Typical photodetector devices enable incident light to be transduced to electrical charge which can then be measured. Conventional photodetector devices are not always optimal. It is useful to enable photodetector devices to operate efficiently.
- the listing or discussion of any prior-published document or any background in this specification should not necessarily be taken as an acknowledgement that the document or background is part of the state of the art or is common general knowledge.
- One or more aspects/examples of the present disclosure may or may not address one or more of the background issues.
- an apparatus comprising:
- a second layer of a two dimensional material wherein the first and second layers are configured to form an electrical junction, the electrical junction having a potential energy barrier; a third layer of a material configured to generate one or more excitons upon absorption of incident electromagnetic radiation; wherein the apparatus is configured such that said one or more excitons generated in the third layer change the potential energy barrier of the electrical junction.
- an array, module, sensor or photodetector comprising the above apparatuses, or a device comprising the same.
- Figure 1 schematically illustrates an example of an apparatus according to the present disclosure
- FIGS. 2A and 2B schematically illustrate examples of band diagrams of an apparatus according to the present disclosure with zero bias and a forward bias respectively;
- Figure 3 schematically illustrates a graph of theoretical values of diode current vs. forward bias for an apparatus according to the present disclosure
- Figure 4 schematically illustrates a graph of theoretical values of photocurrent vs. forward bias for an apparatus according to the present disclosure
- Figure 5 schematically illustrates a graph of theoretical values of responsivity vs. forward bias for an apparatus according to the present disclosure
- Figure 6 schematically illustrates an example of a further apparatus according to the present disclosure.
- Figure 7 schematically illustrates an example of an array of apparatuses according to the present disclosure.
- Figure 1 schematically illustrates a cross sectional view of an apparatus 100 comprising:
- a second layer of a two dimensional material 102 wherein the first and second layers are configured to form an electrical junction 104, the electrical junction 104 having a potential energy barrier ⁇ ;
- FIG. 1 focuses on the functional components necessary for describing the operation of the apparatus 100.
- the first layer of a semiconducting material 101 may, for example, be a layer of silicon or other semiconducting material/means.
- the second layer of a two dimensional material 102 may for example be a layer of graphene or other conductive two dimensional material, such as a two dimensional material that may be degenerately/excessively doped.
- the second layer 102 may consist of a single layer, e.g. single layer graphene (SLG), or n layers of a two dimensional material, where n is less than or equal to 5.
- the use of just a single layer or n layers of two dimensional material may reduce the density of states of the material which in turn may increase the sensitivity of the material's Fermi level to external stimuli (such as the photo induced field created in the third layer 103 as discussed below) .
- the electrical junction 104 may be one or more of: a rectifying junction, a Schottky junction, and a Schottky diode junction.
- the potential energy barrier ⁇ may be a Schottky barrier height.
- Such a junction may be formed by the provision for a first electrode 107 for the first layer 101 which is in direct and Ohmic contact therewith, and a second separate electrode 108 for the second layer 102 which is in direct and Ohmic contact therewith. A part of the second layer 102a is in direct physical contact with the first layer 101 .
- a part of the second layer 102b, which is in the vicinity of the second electrode 108, is not in direct physical contact with the first layer 101 and instead may be separated therefrom via a spacing element 109, such as a portion of an insulating material e.g. S 1O2. It is to be appreciated that the locations / relative arrangement of the first and second electrodes 107 and 108 may differ to that shown in Figure 1 (for example, the first electrode 107 could be disposed beneath the layer of a semiconducting material 101 as in Figure 6 below) .
- the third layer of material which is configured to generate one or more excitons 105 upon absorption of one or more incident photons / electromagnetic radiation 106, may for example be one or more of: formed of a semiconducting material;
- the third layer of material 103 may be in direct contact with the second layer 102.
- the third layer may be an upper/externally facing layer of the apparatus that is exposed to incident electromagnetic radiation.
- the apparatus 100 may be configured such that one of an electron 105a or an electron hole 105b of an exciton 105 generated in the third layer 103 creates a photo induced field which acts to alter a Fermi level EFG of the two dimensional material of the second layer 102. Such an alteration of the Fermi level EFG may alter the potential energy barrier ⁇ of the electrical junction 104.
- the altering of the potential energy barrier ⁇ of the electrical junction 104 may affect a current flowing through the electrical junction between the first and second layers 101 and 102, i.e. affect a current J flowing between the first and second electrodes 107 and 108.
- the current J passing through the electrical junction 104 is modulated in dependence upon a level of the potential energy barrier ⁇ of the electrical junction 104, which itself is dependent upon the number of excitons 105 generated in the third layer 103.
- the number of excitons generated depends on the flux of electromagnetic radiation 10 ⁇ incident to the third layer 103.
- the current flowing through the electrical junction is dependent upon the flux of electromagnetic radiation incident to the third layer. Accordingly, the apparatus can be used as a photodetector.
- the first layer 101 is a layer of Silicon and the second layer 102 is single layer graphene (SLG) . These two layers are configured so as to form a Schottky diode junction 104, having a Schottky barrier height ⁇ .
- the third layer 103 is of a semiconductor material duly functionalised to generate excitons 105 upon absorption of electromagnetic radiation 106.
- a material may comprise semiconductor nanocrystals and/or Quantum Dots, such as a Colloidal Quantum Dot (CQD) film configured to generate excitons 105 upon absorption of electromagnetic radiation 106.
- CQD Colloidal Quantum Dot
- the semiconductor nanocrystals/CQD layer can be duly configured/functionalised to be responsive to particular frequency/frequencies of electromagnetic radiation.
- the third layer When illuminated, the third layer generates excitons / electron-hole pairs upon photon absorption. This occurs at a certain quantum efficiency QE, e.g. about 25% for certain PbS QD's.
- One of the electron 105a or the hole 105b of the exciton 105 may pass from the semiconductor nanocrystals/CQD layer 103 to the graphene layer 102.
- the remaining charge carrier in the semiconductor nanocrystals/CQD layer i.e.
- the other of the electron 105a or hole 105b may be temporarily "trapped" in the semiconductor nanocrystals/CQD layer due to the layer's relatively poor carrier mobility (10 ⁇ 3 to 1 cm 2 /Vs) .
- the trap lifetime (xtrap) is of the order of 20ms to 1 second.
- the exciton formation and subsequent charge separation and charge transfer at the QD-graphene interface may affect the charge density of the graphene layer 102 which may in turn affect the Fermi energy EFG of the graphene.
- Fermi energy EFG may itself affect the work function of the graphene OG which may in turn affect the Schottky barrier height ⁇ of the Schottky diode junction 104.
- Such a change in the Schottky barrier height ⁇ may affect a current flow J through the Schottky diode between the electrodes 107 and 108.
- the change in current flow J may be detected and measured and used to provide a signal indicative of an amount of light incident to the third layer, such that the apparatus 100 may be used as a sensor/photodetector.
- light 10 ⁇ incident to the third layer 103 may cause a modulation of the Schottky barrier height ⁇ of the Schottky diode junction 104 which may modulate the current flow J through the Schottky diode junction 104.
- examples of the present disclosure may provide highly sensitive sensor for detecting/measuring incident light with high levels of responsivity.
- examples may enable the use of low operational current levels, thereby reducing power consumption levels. Such reduced power consumption levels may be particularly advantageous when large numbers (> millions) of the apparatuses are configured together and scaled up to form pixels of a photodetector array.
- Figures 2A and 2B schematically illustrate examples of band diagrams for an apparatus according to the present disclosure with zero bias and a forward bias VF respectively.
- the apparatus is similar to that set out above with regards to Figure 1 , wherein the material of the first layer 101 is Silicon, the 2 dimensional material of the second layer 1 02 is graphene, the electrical junction is a Schottky diode junction, and the potential barrier is a Schottky barrier height ⁇ .
- EFG is the difference of the graphene's Fermi energy relative to the charge neutrality point, Dirac point (likewise, EFS relates to the Silicon's Fermi energy level) .
- the change in Fermi energy in the graphene, relative to the charge neutrality point, can be calculated as:
- v F is the Fermi velocity of graphene
- n is the charge density in the graphene Hence graphene's Fermi energy EFG will change as a function of a change in the graphene's charge density, n.
- n n 0 + n a
- n a is the carrier density after addition of a p- ⁇ ype dopant (i.e. due to the QD layer 103)
- n r is the residual doping of graphene before it makes contact with the semiconductor (i.e. in the region 102b)
- riinduced is the charge density induced in the graphene when contacting Silicon (i.e. in the region 102a) to form Schottky barrier
- ⁇ is the Schottky barrier height
- V is the applied voltage across the junction (i.e. between the first and second electrodes 1 07 and 1 08) .
- the Schottky barrier height ⁇ is proportional to the carrier density n a after addition of a p- ⁇ ype dopant (i.e. due to the QD layer 1 03) .
- the current density, J is exponentially proportional to the Schottky barrier height ⁇ .
- Figure 3 schematically illustrates a graph of theoretical values of diode current, i.e. J, vs. forward bias voltage applied to the apparatus.
- An illumination power of 0.1 pW incident on the sensor/detection area may be equivalent to 6 x 10 1 1 pho ⁇ ons/cm 2 /s. Assuming a quantum efficiency QE of 25%, yields 1 .5 x 10 1 1 excitons generated per cm 2 in 1 second.
- Figure 3 is a plot of the theoretical current at such an incident power level for the above described Schottky junction diode with a forward bias, V.
- Figure 4 schematically illustrates a graph of theoretical values of photocurrent vs. forward bias for the above described Schottky junction diode.
- FIG. 5 schematically illustrates a graph of theoretical values of responsivity vs. forward bias for the above described Schottky junction diode.
- Figures 3 - 5 reveal that operating the above described Schottky junction diode at a bias voltage of 0.7 V yields an operating current of 20 ⁇ , a photocurrent of 3 ⁇ for an incident optical power of 0.1 pW, and a responsivity of 3xl 0 7 A/W.
- Such responsivity is comparable to that of a hybrid QD-GFET (quantum dot graphene field effect transistor) photodetector.
- an operating current /current drain of an exemplary GFET may be ca.
- examples of the present disclosure may provide a photodetector having a low operating current, thereby enabling significant reductions in power consumption, i.e. as compared to other types of photodetectors such as GFET based photodetectors. Such power reductions may be particularly advantageous where the apparatuses are combined into large arrays comprising millions of individual apparatuses/detectors. Moreover, a low operational current can lessen issues that might otherwise be faced for high operational current with regards to interfacing electronics.
- FIG. 6 schematically illustrates an example of a further apparatus 600 according to the present disclosure.
- the apparatus 600 comprises a first layer 601 comprising a semiconductor, such as Silicon.
- a second layer of graphene 602 is provided in direct contact with the semiconductor layer and forms a Schottky junction with the semiconductor.
- a plurality of electrodes 607, 607' are provided that are in ohmic electrical contact with the first semiconductor layer 601 respectively.
- a further plurality of electrodes 608, 608' are provided that are in ohmic electrical contact with the graphene layer 602. Regions of the graphene layer 602 that are in ohmic contact with the electrodes 608, 608' are not in direct contact with the semiconductor layer 601 .
- An insulator 609 is provided between the graphene layer and the semiconductor layer in the regions in the vicinity of the electrodes 608, 608' .
- the electrodes 607, 607', 608, 608' are configured and controlled such that a potential difference V can be applied between the graphene and the Semiconductor layers 601 , 602 and such that a current flow J to/from the graphene and semiconductor layers can be measured.
- Figure 6 illustrates a partial cross-section section of the apparatus 600 which shows part of an arrangement of layers and electrodes which is repeated in the longitudinal direction.
- the central region of the figure represents a single pixel of the apparatus. It is to be appreciated that the arrangement repeats such that the left hand region of the apparatus (i.e. commencing from the gap between the first two electrodes 607' and 607) corresponds to a part of an adjacent pixel. Likewise, the right hand region of the apparatus (i.e. commencing from the gap between the second and third electrodes 607 and 607') corresponds to a part of another adjacent pixel.
- Each pixel of the apparatus may be provided with a unique electrode / electrical contact 607 for the semiconductor layer 601.
- the electrode 607 may define a pixel area of the apparatus 600.
- a base substrate 610 is provided on which the various layers are themselves provided. It is to be appreciated that additional circuitry may be provided (e.g. a backplane not shown) for selecting/addressing particular electrodes to enable the selective addressing of a particular pixel and a readout of current therefrom.
- a third layer 603 of appropriately-functionalised semiconductor nanocrystals is provided that overlays and is in direct contact with the graphene layer 602. The semiconductor nanocrystals are configured so as to absorb incoming light and generate excitons. Depending on the band alignment between the semiconductor nanocrystals 603 and the graphene 602, either a hole or an electron from an exciton is passed to the graphene.
- the remaining charge in the semiconductor nanocrystals layer 603 acts, in effect, to electrostatically gate the graphene layer by altering the Fermi energy EFG of the graphene and consequently the Schottky barrier height ⁇ and also thereby altering a current J between the graphene and the semiconductor layers 602, 601 .
- the apparatuses 100 and 600 of the present disclosure can be driven by an alternating current (AC) in which case the apparatuses would provide a rectified output voltage proportional to the illumination level (and the number of excitons created in the third layer 103, 603) .
- AC alternating current
- the apparatuses can be wirelessly powered for example by inductive coupling if the apparatuses were coupled to an inductor loop or other kind of antenna.
- the apparatuses or an array of apparatuses can be embodied in a medical imaging device.
- an array of apparatuses can be integrated with an X-ray scintillator to form part of an X-ray imaging device.
- the above described apparatuses 100 and 600 may be provided in a module.
- module refers to a unit or apparatus that excludes certain parts/components that would be added by an end manufacturer or a user.
- FIG. 7 schematically illustrates an example of an array 800 of a plurality of apparatuses 600. Each apparatus 600 may form a pixel of the array.
- the Figure illustrates the array from a plan view perspective and moreover relates to a plan view cut through view of the apparatus 600 of Figure 6 along the line A - A.
- the (second) electrode/electrical contact for the (second) graphene layer for each pixel 600 may be shared and common with one another across the array. I.e. each of the electrodes for the graphene layer, 608, 608', 808, 808' are all in contact with one another, for instance the column graphene electrodes 608 and 608' interconnect with and are in contact with the row graphene electrodes 808 and 808' .
- a unique (first) electrode 607 for the (first) silicon layer (not shown) is provided for each pixel 600 of the array.
- the electrode 607 (not shown) is configured to define the pixel area and is arranged beneath the central region of each pixel and extends across the area of the central region (i.e. in this case a square shaped electrode for the silicon layer is provided for each pixel) thereby defining effective pixel area, i.e. the photo responsive/detecting area which may correspond to the area of third layer of semiconductor nanocrystals disposed above the first electrode.
- Such an arrangement may increase the fill factor of the pixel i.e. reduce the coverage area of the electrodes (and the "shadowing effect" they have reducing the pixel's effective photosensitive area surface). This may increase the surface area of the (third) layer of semiconductor nanocrystals available to receive incident light and thus increase the active photosensitive area surface area of each pixel and the array.
- the array 800 may further include means configured to selectively address one or more of the pixels and read an output therefrom, e.g. an active matrix backplane / addressing and readout circuitry (not shown).
- an active matrix backplane / addressing and readout circuitry (not shown).
- the components may be embodied as or otherwise controlled by a corresponding controller or circuitry such as one or more processing elements or processors of the apparatus.
- each of the components described above may be one or more of any device, means or circuitry embodied in hardware, software or a combination of hardware and software that is configured to perform the corresponding functions of the respective components as described above.
- a backplane may be provided with circuitry configured to: selectively address particular electrodes, apply a voltage to particular electrodes, and to read out/measure a current from particular electrodes.
- the device may be a hand held portable electronic device, such as a mobile telephone, wearable computing device or personal digital assistant, that may additionally provide one or more audio/text/video communication functions (e.g. tele-communication, video-communication, and/or text transmission (Short Message Service (SMS)/ Multimedia Message Service (MMS)/emailing) functions), interactive/non-interactive viewing functions (e.g. web-browsing, navigation, TV/program viewing functions), music recording/playing functions (e.g. Moving Picture Experts Group-1 Audio Layer 3 (MP3) or other format and/or (frequency modulation/amplitude modulation) radio broadcast recording/playing), downloading/sending of data functions, image capture function (e.g. using a (e.g. in-built) digital camera), and gaming functions.
- audio/text/video communication functions e.g. tele-communication, video-communication, and/or text transmission (Short Message Service (S)/ Multimedia Message Service (MMS)/emailing) functions
- the apparatus may be provided in an electronic device, for example, a mobile terminal, according to an exemplary embodiment of the present disclosure. It should be understood, however, that a mobile terminal is merely illustrative of an electronic device that would benefit from examples of implementations of the present disclosure and, therefore, should not be taken to limit the scope of the present disclosure to the same. While certain in certain implementation examples the apparatus may be provided in a mobile terminal, other types of electronic devices, such as, but not limited to, hand portable electronic devices, wearable computing devices, personal digital assistants (PDAs), pagers, mobile computers, desktop computers, televisions, gaming devices, laptop computers, tablets, cameras, video recorders, GPS devices and other types of electronic systems, may readily employ examples of the present disclosure. Furthermore, devices may readily employ examples of the present disclosure regardless of their intent to provide mobility.
- PDAs personal digital assistants
- references to "a/an/the” [feature, element, component, means ...] are to be interpreted as “at least one” [feature, element, component, means ...] unless explicitly stated otherwise.
Landscapes
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/735,280 US20180175217A1 (en) | 2015-06-15 | 2016-05-30 | Device for Sensing Radiation |
| KR1020187000872A KR102056016B1 (en) | 2015-06-15 | 2016-05-30 | Radiation sensing device |
| PH12017502239A PH12017502239A1 (en) | 2015-06-15 | 2017-12-07 | Device for sensing radiation |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15172216.2 | 2015-06-15 | ||
| EP15172216.2A EP3107127B1 (en) | 2015-06-15 | 2015-06-15 | Device for sensing radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2016203100A1 true WO2016203100A1 (en) | 2016-12-22 |
Family
ID=53434249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/FI2016/050376 Ceased WO2016203100A1 (en) | 2015-06-15 | 2016-05-30 | Device for sensing radiation |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20180175217A1 (en) |
| EP (1) | EP3107127B1 (en) |
| KR (1) | KR102056016B1 (en) |
| PH (1) | PH12017502239A1 (en) |
| WO (1) | WO2016203100A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102651544B1 (en) * | 2016-11-21 | 2024-03-28 | 삼성전자주식회사 | Broadband and multi-purpose optical device and methods of manufacturing and operating the same |
| KR101984398B1 (en) * | 2017-10-13 | 2019-05-30 | 건국대학교 산학협력단 | Phothdetector based on barristor and image sencor including the same |
| GB2570487A (en) * | 2018-01-26 | 2019-07-31 | Emberion Oy | Voltage-mode photosensitive device |
| JP7550854B2 (en) * | 2020-06-15 | 2024-09-13 | 三菱電機株式会社 | Electromagnetic wave detectors and electromagnetic wave detector arrays |
| KR102438043B1 (en) * | 2020-10-13 | 2022-08-31 | 한국원자력연구원 | Radiation detector and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538489A (en) * | 2014-12-09 | 2015-04-22 | 中国科学院上海技术物理研究所 | Method for increasing the switch ratio of graphene and nanowire heterojunction detector |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8872159B2 (en) * | 2011-09-29 | 2014-10-28 | The United States Of America, As Represented By The Secretary Of The Navy | Graphene on semiconductor detector |
| US8878157B2 (en) * | 2011-10-20 | 2014-11-04 | University Of Kansas | Semiconductor-graphene hybrids formed using solution growth |
| US9202945B2 (en) * | 2011-12-23 | 2015-12-01 | Nokia Technologies Oy | Graphene-based MIM diode and associated methods |
| KR101952363B1 (en) * | 2012-04-03 | 2019-05-22 | 삼성전자주식회사 | Graphene semiconductor device and manufacturing method thereof, and organic light emitting display and memory including graphene semiconductor device |
| US20150243826A1 (en) * | 2012-08-28 | 2015-08-27 | Northeastern University | Tunable heterojunction for multifunctional electronics and photovoltaics |
| US9685559B2 (en) * | 2012-12-21 | 2017-06-20 | The Regents Of The University Of California | Vertically stacked heterostructures including graphene |
| EP2768039B1 (en) * | 2013-02-15 | 2021-01-13 | Samsung Electronics Co., Ltd. | Graphene device and electronic apparatus |
| WO2014149004A1 (en) * | 2013-03-22 | 2014-09-25 | Nanyang Technological University | Method of manufacturing a monolayer graphene photodetector and monolayer graphene photodetector |
| KR102237826B1 (en) * | 2014-07-18 | 2021-04-08 | 삼성전자주식회사 | Graphene device, methods of manufacturing and operating the same, and electronic apparatus including graphene device |
| KR102395776B1 (en) * | 2015-05-18 | 2022-05-09 | 삼성전자주식회사 | Semiconductor device including two-dimensional material and method of manufacturing the same |
-
2015
- 2015-06-15 EP EP15172216.2A patent/EP3107127B1/en active Active
-
2016
- 2016-05-30 KR KR1020187000872A patent/KR102056016B1/en active Active
- 2016-05-30 WO PCT/FI2016/050376 patent/WO2016203100A1/en not_active Ceased
- 2016-05-30 US US15/735,280 patent/US20180175217A1/en not_active Abandoned
-
2017
- 2017-12-07 PH PH12017502239A patent/PH12017502239A1/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538489A (en) * | 2014-12-09 | 2015-04-22 | 中国科学院上海技术物理研究所 | Method for increasing the switch ratio of graphene and nanowire heterojunction detector |
Non-Patent Citations (2)
| Title |
|---|
| ALEXANDER V KLEKACHEV ET AL: "Graphene Transistors and Photodetectors", INTERFACE, vol. 22, no. 1, 1 January 2013 (2013-01-01), US, pages 63 - 68, XP055237499, ISSN: 1064-8208 * |
| RIAZIMEHR SARAH ET AL: "Spectral sensitivity of a graphene/silicon pn-junction photodetector", EUROSOI-ULIS 2015: 2015 JOINT INTERNATIONAL EUROSOI WORKSHOP AND INTERNATIONAL CONFERENCE ON ULTIMATE INTEGRATION ON SILICON, IEEE, 26 January 2015 (2015-01-26), pages 77 - 80, XP032748024, DOI: 10.1109/ULIS.2015.7063777 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3107127B1 (en) | 2022-03-30 |
| US20180175217A1 (en) | 2018-06-21 |
| PH12017502239A1 (en) | 2018-06-11 |
| KR102056016B1 (en) | 2019-12-13 |
| KR20180018688A (en) | 2018-02-21 |
| EP3107127A1 (en) | 2016-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12165049B2 (en) | Imaging device, imaging module, electronic device, and imaging system | |
| JP6879919B2 (en) | Manufacturing method of solid-state image sensor, electronic device, and solid-state image sensor | |
| WO2016203100A1 (en) | Device for sensing radiation | |
| KR101565750B1 (en) | High sensitivity image sensor | |
| US8803100B2 (en) | Radiation image pickup apparatus and radiation image pickup/display system | |
| US9520437B2 (en) | Flexible APS X-ray imager with MOTFT pixel readout and a pin diode sensing element | |
| WO2001061729A1 (en) | Fully depleted back illuminated ccd | |
| EP3252831A1 (en) | A quantum dot photodetector apparatus and associated methods | |
| JP2007173832A (en) | Photodiode, organic light emitting display, and electronic device | |
| JP2015133408A (en) | Radiation detector | |
| US20230238405A1 (en) | Semiconductor device and electronic device | |
| EP3174108A1 (en) | A quantum dot photodetector apparatus and associated methods | |
| US20210280622A1 (en) | Solid-state imaging apparatus and electronic apparatus | |
| TWI603463B (en) | Light sensor and light sensing module | |
| CN114363542B (en) | Photosensitive circuit structure and optical devices | |
| CN103247640B (en) | active matrix image sensing panel and device | |
| US20170221939A1 (en) | Functional element and electronic apparatus | |
| JP2012114166A (en) | Detection device and radiation detection system | |
| US8415634B2 (en) | Apparatus and method for detecting radiation | |
| CN108933149B (en) | Imaging sensor pixels and systems | |
| US11158658B2 (en) | Radiation detector | |
| US20140198900A1 (en) | High resolution x-ray imaging with thin, flexible digital sensors | |
| TW202306134A (en) | Image detector | |
| US20220278164A1 (en) | Semiconductor device | |
| JP2013545965A (en) | Radiation detector and radiation detection method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16731186 Country of ref document: EP Kind code of ref document: A1 |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 12017502239 Country of ref document: PH |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 15735280 Country of ref document: US |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| ENP | Entry into the national phase |
Ref document number: 20187000872 Country of ref document: KR Kind code of ref document: A |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 16731186 Country of ref document: EP Kind code of ref document: A1 |