WO2016192939A1 - Anzeigevorrichtung mit einer mehrzahl getrennt voneinander betreibbarer bildpunkte - Google Patents
Anzeigevorrichtung mit einer mehrzahl getrennt voneinander betreibbarer bildpunkte Download PDFInfo
- Publication number
- WO2016192939A1 WO2016192939A1 PCT/EP2016/060554 EP2016060554W WO2016192939A1 WO 2016192939 A1 WO2016192939 A1 WO 2016192939A1 EP 2016060554 W EP2016060554 W EP 2016060554W WO 2016192939 A1 WO2016192939 A1 WO 2016192939A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contacts
- display device
- semiconductor layer
- contact structure
- pixel
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 111
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 4
- 230000001419 dependent effect Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 description 20
- 230000005855 radiation Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Definitions
- a display device is indicated.
- a display device is indicated.
- the display device comprises a plurality of separately operable pixels, which a
- Semiconductor layer sequence has, for example, a first one
- the display device can be, for example, a light-emitting diode, in particular a thin-film light-emitting diode, which is free of light
- the display device extends in a vertical direction between a first main plane and a second main plane, wherein the vertical direction may extend transversely or perpendicular to the first and / or second main plane.
- the main levels may be, for example, the
- Main extension levels on the top surface and the bottom surface of the display device act.
- the display device is extended in the lateral direction, that is, for example at least in places, parallel to the main planes, and has a thickness in the vertical direction that is small opposite to a maximum extent of the display device in the lateral direction.
- the semiconductor layer sequence contains
- III-V compound semiconductor materials are for ultraviolet radiation generation
- Al x In y Ga x - y P in particular for yellow to red radiation
- Al x In y Ga x - y As infrared
- spectral range are particularly suitable.
- the active layer is disposed between the first semiconductor layer and the second semiconductor layer.
- the first semiconductor layer may be a p-doped semiconductor layer and the second semiconductor layer may be an n-doped semiconductor layer.
- Pixels preferably from a common
- Pixel associated semiconductor layers ie a
- the display device has a carrier.
- the carrier may have a plurality of switches which are each assigned to the respective pixel for controlling at least one pixel.
- Carrier can mechanically stabilize the semiconductor layer sequence, for example.
- the first main plane is located, for example, on the side of the semiconductor layer sequence facing away from the carrier.
- the second main plane is exemplified on the side facing away from the semiconductor layer sequence of the carrier.
- the display device comprises a second contact structure for
- the first contact structure is arranged, for example, between the semiconductor layer sequence and the carrier.
- the first contact structure is in particular electrically conductively connected to the first semiconductor layer.
- Contact structure is the first semiconductor layer from the second main level ago electrically contacted.
- the first contact structure consists of a metallic layer or a metallic layer stack.
- the first contact structure has an optical Mirror effect.
- the first exists
- a layer thickness of the first contact structure is between 50 nm and 500 nm.
- TCO transparent conductive oxide
- this consists of a material such as ITO, SnO, ZnO, or has such.
- a layer thickness of such a layer is less than 100 nm.
- a dielectric or a dielectric layer stack may be arranged between the transparent conductive oxide layer and the metallic layer or the metallic layer stack.
- this or these consists of SiO 2 or has SiO 2.
- a layer thickness thereof is between 100 nm and 1000 nm.
- Dielectric or the dielectric layer stack may for example have recesses, in particular
- the second contact structure is also, for example, between the carrier and the semiconductor layer sequence
- the second contact structure is in particular electrically conductive with the second semiconductor layer
- the second contact structure is the second Semiconductor layer from the second main level ago electrically contacted.
- the first contact structure and / or the second contact structure or at least one sub-layer thereof are, for example, reflective, in particular with regard to the radiation generated during operation of the display device.
- the first contacts each extend laterally uninterrupted along the first
- the first contacts each define one pixel laterally.
- the first contacts may be in this context
- the first contacts are electrically connected to the respective switch.
- the first contacts contact the first
- Direction limits the lateral contour of each one of the first contacts each one pixel.
- a lateral extent of a pixel is through a lateral extent of a respective first contact
- the first contacts are assigned in each case in particular to a pixel for controlling the pixel,
- Semiconductor layer sequence and the first contact structure at least one with respect to a respective pixel laterally adjacent recess on.
- the at least one recess extends through the first contact structure, the first semiconductor layer and the active layer into the second semiconductor layer.
- the at least one recess extends transversely or perpendicularly from the second main plane to the first main plane.
- the at least one recess interrupts in particular the first contact structure.
- Recess extends in a lateral direction, in particular in a region of an optical separation between the individual pixels in plan view of the display device.
- the optical separation is in particular a lateral separation of the individual pixels, the
- Display device can be perceived directly and / or measured by suitable magnification and / or at least indirectly, for example in the form of an elevated
- Contact structure second contacts on. The second contacts extend from one of the first contact structure
- the second contacts contact the second one
- the second contacts can in particular be electrically in the form of each other be connected to a common electrode of the display device.
- the second contacts are in particular of the first
- the display device may have a separating structure that electrically separates the second contacts from the first contacts and / or the first semiconductor layer.
- the separating structure limits the at least one recess laterally for this purpose.
- the second contacts completely fill the at least one recess laterally delimited by the separating structure.
- the second contacts cover the separation structure and the second
- a contacting of the second semiconductor layer by means of the second contacts extends in particular in the region of the optical separation between the individual pixels in plan view of the display device.
- the optical separation between the pixels can thus in particular with the
- the separating structure consists for example of a partially or completely transparent dielectric, for example of silicon oxide and / or silicon nitride and / or aluminum oxide.
- a reflection can take place directly dependent on the angle in the form of total reflection on the dielectric, or on the background radiation behind it with respect to a beam path of the radiation generated during operation
- Metal layer of the second contact structure instead.
- the second contact structure is for this purpose advantageously formed of a highly reflective material, such as silver.
- Display device with a plurality of separately operable pixels a semiconductor layer sequence for generating electromagnetic radiation.
- Semiconductor layer sequence comprises a first semiconductor layer, an active layer and a second semiconductor layer.
- the display device further comprises a first one
- Contact structure has separately operable first contacts, each extending laterally uninterrupted along the first semiconductor layer.
- the first contacts each define a pixel laterally with their contour.
- the semiconductor layer sequence and the first contact structure have at least one recess adjoining laterally with respect to a respective pixel, which extends into the second semiconductor layer through the first contact structure, the first semiconductor layer and the active layer.
- the second contact structure has second contacts extending from one of the first contact structure
- a ratio of radiating area of the display device to non-radiating surface can thus be kept particularly high, so that a high
- interruption-free illumination of the respective pixels allows.
- it can be a
- the first and second contacts are respectively in direct contact with the first and second semiconductor layers.
- Contacts contact the respective semiconductor layers electrically, in particular directly.
- the first contacts and the first semiconductor layer adjoin each other laterally in a flat manner.
- the second contacts extend through a respective recess into the second semiconductor layer.
- at least one pixel is associated with a plurality of second contacts, which the
- the plurality of second contacts are in particular adjacent to the at least one Pixel laterally.
- Pixel occurs by energizing the
- Edge region of the pixels can be assigned to a single pixel multiple redundant second contacts.
- At least one of the second contacts is arranged laterally adjacent to a plurality of adjacent pixels and designed to contact the plurality of adjacent pixels.
- the at least one second contact is assigned in each case to the plurality of adjacent pixels.
- a plurality of pixels can thus be operated by means of a single contact.
- a space requirement for contacting the pixels can be kept so low, so that to a high ratio of radiating surface of the
- Display device is contributed to non-radiating surface.
- the pixels are arranged laterally separated in a grid.
- the pixels are arranged here, for example, in rows and transversely or perpendicularly arranged columns, the rows and columns are each separated by dividers.
- the dividers of the lateral separation also run along the Lines and transversely or vertically arranged columns.
- the lateral separation forms a grid, which
- Lattice points or nodes of the grid encloses.
- the pixels are in other words with respect to the grid in particular formed by the dividers
- Pixels are arranged optically separated in plan view of the display device. At least one of the second contacts is disposed on a node of the grid.
- a lateral separation of the pixels does not necessarily have to be along straight lines. On the contrary, the lateral separation can also result in pixels having at least partially curved or bent sides.
- one of the second contacts is arranged on each node of the grid.
- the respective second contact is thus in an optical separating web between the pixels
- Display device can be kept uninterrupted and with maximum size.
- the respective second contact can adjoin a plurality of pixels laterally, corresponding to a nodal point of the grating, for example, four pixels in a regular rectangular grid. This makes it possible to operate a particularly large number of adjacent pixels with only one respective second contact.
- a second contact is arranged between two nodes adjacent to one column and / or one row in each case.
- the respective second contact is arranged between two nodes adjacent to one column and / or one row in each case.
- one of the second contacts is arranged on every second laterally successive node of the grid.
- the display device so free of redundant second
- At least one of the second contacts associated with a pixel is attached to a lateral edge region of the display device
- the respective second concludes Contact so flush with the lateral edge of the
- Display device has a substantially flat surface
- a lateral is
- respective pixel associated second contacts The lateral extent of the second contacts can vary both in shape and in size.
- a second contact associated with a respective pixel is laterally adjacent, in particular, to the respective pixel. An operation of the respective pixel takes place by an energization via the pixel associated with the second contacts and the
- a brightness of the individual pixels is influenced by a current flow through the respective associated first and second contacts.
- the current flow through the contacts depends in particular on a cross-sectional area of the respective contacts.
- a number may be one pixel
- associated second contacts can be reduced compared to other pixels of the display device, so that by simultaneous enlargement of the pixel associated with the second contacts in comparison to the other pixels of the display device associated second contacts
- At least one of the second contacts which is associated with a pixel, which at a lateral edge region of the display device
- respective second contact is offset towards a lateral interior of the display device.
- the respective second contact is offset laterally towards the interior of the display device such that the respective second contact is flush with the edge, or at least a lateral protrusion of the respective second contact with respect to the transition region around the
- the respective second contact can in this case be arranged, for example, on the aforementioned grid with respect to one
- Node of the grid may be laterally offset.
- this contributes to a high level of process reliability in the production of the display device.
- a lateral is
- Extension of a respective second contact in the vertical direction vary.
- the respective second contact and / or the respective recess may be conical or cone-shaped.
- the lateral extent of the respective recess and / or of the respective second contact is increased towards the second main plane.
- a lateral boundary of a pixel assigned to the respective second contact is then, for example
- Pixel generated radiation is contributed.
- At least one of the second contacts encloses a pixel laterally.
- Radiation in the region of the pixel in particular with regard to a perceptible brightness of the pixel.
- the second one is
- Figure 1 shows a first embodiment of a
- Figure 2 shows a second embodiment of
- FIG. 1 A first exemplary embodiment of a display device 1 with a plurality of pixels 1a, 1b, 1c which can be operated separately from one another is shown in FIG.
- the display device 1 extends in the lateral direction, for example beyond the section shown, as indicated by the dashed lines of the pixels la, lc.
- the display device 1 comprises a
- Semiconductor layer sequence 3 which is a first semiconductor layer 31, provided for generating radiation active
- the display device 1 extends in vertical
- the first main plane 10a may in particular be a radiation exit surface of the
- the active layer 33 is between the first
- Semiconductor layer 31 is in particular p-type, and the second semiconductor layer 35 is n-type.
- first contact structure 51 Directly adjacent to the surface of the first semiconductor layer 31 extends a first contact structure 51, which enables electrical contacting of the first semiconductor layer 31.
- the first contact structure 51 is interrupted by a plurality of vertically extending through the display device 1 recesses 7a, 7b.
- the first contact structure 51 is subdivided into a plurality of first contacts 51a, 51b, 51c, which are electrically
- a lateral extent of the first contacts 51a, 51b, 51c corresponds to one
- the first contacts 51a, 51b, 51c contact the first one
- Semiconductor layer 31 electrically from the second main plane 10b of the display device 1 ago and allow a
- the first contacts 51a, 51b, 51c is assigned in each case to one of the picture elements 1a, 1b, 1c for the separate operation of the respective picture element 1a, 1b, 1c.
- the recesses 7a, 7b are arranged in a region of a respective optical separating web 7x between the pixels 1a, 1b, 1c, in particular within the separating webs 7x.
- the first contacts 51a, 51b, 51c associated with a respective pixel 1a, 1b, 1c are thus planar
- the recesses 7a, 7b extend further in the vertical direction from the first contact structure 51 through the first semiconductor layer 31 and the active layer 33. As shown in FIG. 1, the recesses 7a, 7b can further extend into the second semiconductor layer 35.
- the recesses 7a, 7b are laterally separated by an electrically insulating separation structure 53
- the separating structure 53 also extends in the lateral direction on a side facing the second main plane 10b along the first contact structure 51.
- a second contact structure 55 likewise extends in the lateral direction on a side facing the second main plane 10b along the separating structure 53.
- the second contact structure 55 is, for example, by means of the
- Separation structure 53 is electrically separated from the first contact structure 51.
- the second contact structure 55 forms second contacts 55a, 55b, which extend into the recesses 7a, 7b towards the second semiconductor layer 35.
- the second contacts 55a, 55b contact the second one
- Semiconductor layer 35 electrically from the second main plane 10b of the display device 1 ago and allow a
- the second contacts 55a, 55b may in particular be connected to one another electrically.
- one of the second contacts 55a, 55b can in each case be associated with one of the picture elements 1a, 1b, 1c for operating the respective picture element 1a, 1b, 1c. Furthermore, in each case one of the second contacts 55a, 55b may in each case also be associated with more than one of the pixels 1a, 1b, 1c for operating the respective pixels 1a, 1b, 1c. Furthermore, in each case more than one of the second contacts 55a, 55b may each be associated with one and / or in each case more than one of the pixels 1a, 1b, 1c in order to operate the respective one
- lateral sectional view of a separation of the second contact structure 55 by the separation structure 53 takes place in the paper plane, for example.
- FIG. 1 A second embodiment of the display device 1 according to the first embodiment is shown in FIG.
- the display device 1 additionally comprises a carrier 9.
- Carrier 9 may, for example, a mechanical
- the carrier 9 comprises a further one for this purpose
- Separation structure 91 which electrically separates the first contact structure 51 and second contact structure 55 from each other.
- the carrier further comprises separately operable switches 93a, 93b, 93c, each electrically connected to one of the first contacts 51a, 51b, 51c.
- a third to tenth embodiment of the display device 1 are shown in a schematic plan view. For simplified representation, several vertical sectional planes are shown in the paper plane. In particular, an arrangement of the first contact structure 51 and second contact structure 55 is shown, wherein a number, shape, size and position of the first contacts 51a, 51b, 51c and the second contacts 55a, 55b in the following
- the pixels 1a, 1b, 1c are arranged in a lattice-like manner separated from one another.
- the pixels la, lb, lc correspond in their lateral extent substantially to the first contacts 51a, 51b, 51c.
- the grid 100 is For example, a uniform grid, in particular a uniformly rectangular grid.
- the grid comprises nodes 100x, in each of which a column and a row of the grid 100 intersect.
- Lines and columns of the grid in particular form the optical separating webs 7x between the individual pixels 1a, 1b, 1c.
- one of the second contacts 55a, 55b is arranged on the nodes 10000.
- each pixel la, lb, lc is assigned four adjoining second contacts 55a, 55b, which provide redundant energization of the second semiconductor layer 35 (see FIG. 1) in the region of the respective pixel la, lb, lc enable.
- the current flow is uniform with respect to the respective pixel la, lb, lc from all four sides, so that a uniform luminance distribution of the pixels la, lb, lc is made possible.
- one of the second contacts 55a, 55b is also assigned to four adjacent pixels 1a, 1b, 1c, so that no redundant current is present despite redundant current supply of the second semiconductor layer 35 in the region of the respective pixels 1a, 1b, 1c
- the first contacts 51a, 51b, 51c are, for example
- the first contacts 51a, 51b, 51c can then also be referred to as a "contact mirror” or “mirror surface”. be designated.
- the first contacts 51a, 51b, 51c are rectangular by way of example
- the second contacts 55a, 55b are for example in
- pixels 1a, 1b, 1c are likewise arranged in the form of lattices separated from one another. A lateral extent of the
- Recesses 7a, 7b are dimensioned so large in the region of the first contacts 51a, 51b, 51c, that a lateral
- the reduced lateral extent of the first contacts 55a, 55b is advantageously small in comparison to a contacting of the second semiconductor layer 35 arranged centrally with respect to the respective pixels 1a, 1b, 1c.
- the first contacts 51a, 51b, 51c can be in this case
- the fifth embodiment differs from the previous embodiments three and four by a number of the second contacts 55a, 55b.
- each pixel la, lb, lc are only two second
- Associated contacts 55a, 55b Deviating from this may distinguish a number of the second contacts 55a, 55b associated with each pixel 1a, 1b, 1c.
- only one second contact 55a, 55b could be assigned to each pixel 1a, 1b, 1c.
- a second contact 55a, 55b could be arranged only on a node of every second row and every second column.
- the recesses 7a, 7b form, for example, a common recess which extends continuously into the
- Semiconductor layer sequence 3 extends. By way of example, this recess is etched into the semiconductor layer sequence 3.
- the second contacts 55a, 55b form in this recess, for example, a continuous second contact structure 55 which laterally surrounds the respective pixels 1a, 1b, 1c.
- a lateral edge region 10c of the display device 1 is shown. Unlike the previous ones
- Embodiments three to six are associated with pixels 1a, 1b, 1c adjoining the lateral edge region 10c, only two of the second contacts 55a, 55b, or associated with only one of the second contacts 55a, 55b in a lateral corner of the display device 1a. Due to a mechanical sensitivity of the second
- the second contacts 55a, 55b are parallel to the lateral edge portion 10c
- the second contacts 55a, 55b may also have a contiguous frame
- Form display device 1 This allows a
- Edge region 10c as well as a uniform energization and homogeneous brightness of the pixels la, lb, lc in
- the ninth embodiment in contrast to the previous embodiments, seven and eight in the lateral edge portion 10 c of the display device 1 are the second contacts 55 a, 55 b toward an interior of the display device 1
- Display device 1 arranged laterally offset.
- Embodiment a shape and size of the lateral
- Contacts 55a, 55b are in particular towards the edge region 10c enlarged in comparison to the second contacts 55a, 55b in the lateral interior of the display device 1.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Led Devices (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020177033965A KR102531660B1 (ko) | 2015-05-29 | 2016-05-11 | 서로 개별적으로 동작될 수 있는 복수의 픽셀을 갖는 디스플레이 디바이스 |
CN201680027611.2A CN107636832A (zh) | 2015-05-29 | 2016-05-11 | 具有多个可彼此分开运行的像素的显示设备 |
JP2017559097A JP6688320B2 (ja) | 2015-05-29 | 2016-05-11 | 表示デバイス |
US15/578,239 US10361249B2 (en) | 2015-05-29 | 2016-05-11 | Display device having a plurality of pixels that can be operated separately from one another |
KR1020237015584A KR20230070068A (ko) | 2015-05-29 | 2016-05-11 | 서로 개별적으로 동작될 수 있는 복수의 픽셀을 갖는 디스플레이 디바이스 |
DE112016002412.6T DE112016002412B4 (de) | 2015-05-29 | 2016-05-11 | Anzeigevorrichtungen mit einer Mehrzahl getrennt voneinander betreibbarer Bildpunkte |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015108532.1A DE102015108532A1 (de) | 2015-05-29 | 2015-05-29 | Anzeigevorrichtung mit einer Mehrzahl getrennt voneinander betreibbarer Bildpunkte |
DE102015108532.1 | 2015-05-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016192939A1 true WO2016192939A1 (de) | 2016-12-08 |
Family
ID=55963372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2016/060554 WO2016192939A1 (de) | 2015-05-29 | 2016-05-11 | Anzeigevorrichtung mit einer mehrzahl getrennt voneinander betreibbarer bildpunkte |
Country Status (7)
Country | Link |
---|---|
US (1) | US10361249B2 (de) |
JP (1) | JP6688320B2 (de) |
KR (2) | KR20230070068A (de) |
CN (1) | CN107636832A (de) |
DE (2) | DE102015108532A1 (de) |
TW (1) | TWI590435B (de) |
WO (1) | WO2016192939A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018099794A1 (de) * | 2016-11-29 | 2018-06-07 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung mit einer mehrzahl getrennt voneinander betreibbarer bildpunkte |
CN110121781A (zh) * | 2017-11-08 | 2019-08-13 | 首尔伟傲世有限公司 | 包括多个像素的显示用发光二极管单元及具有该显示用发光二极管单元的显示装置 |
US10388694B2 (en) | 2016-01-11 | 2019-08-20 | Osram Opto Semiconductors Gmbh | Optoelectronic component, lighting apparatus and car headlight |
JP2019204823A (ja) * | 2018-05-21 | 2019-11-28 | シャープ株式会社 | マイクロ発光素子、画像表示素子およびその形成方法 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015108545A1 (de) * | 2015-05-29 | 2016-12-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
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US10892297B2 (en) | 2017-11-27 | 2021-01-12 | Seoul Viosys Co., Ltd. | Light emitting diode (LED) stack for a display |
US10892296B2 (en) * | 2017-11-27 | 2021-01-12 | Seoul Viosys Co., Ltd. | Light emitting device having commonly connected LED sub-units |
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DE102018106970A1 (de) | 2018-03-23 | 2019-09-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
CN110676280A (zh) * | 2018-05-30 | 2020-01-10 | 鸿富锦精密工业(深圳)有限公司 | 显示面板及显示面板制作方法 |
DE102019107030A1 (de) * | 2019-03-19 | 2020-09-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische halbleitervorrichtung mit einer vielzahl von bildelementen und trennelementen und verfahren zur herstellung der optoelektronischen halbleitervorrichtung |
KR102469704B1 (ko) * | 2020-04-23 | 2022-11-22 | 주식회사 썬다이오드코리아 | 경사진 측면을 가지는 마이크로 디스플레이의 화소 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010014032A1 (en) * | 2008-07-07 | 2010-02-04 | Glo Ab | A nanostructured LED |
US20140014894A1 (en) * | 2012-07-06 | 2014-01-16 | Invensas Corporation | High performance light emitting diode with vias |
DE102012112302A1 (de) * | 2012-12-14 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008034560B4 (de) | 2008-07-24 | 2022-10-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips |
US8441007B2 (en) * | 2008-12-25 | 2013-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
TWI429107B (zh) * | 2009-05-14 | 2014-03-01 | Toyoda Gosei Kk | 半導體發光元件、其製造方法、燈、照明裝置、電子機器及機械裝置 |
DE102009023849B4 (de) * | 2009-06-04 | 2022-10-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und optoelektronischer Halbleiterchip |
KR100986570B1 (ko) * | 2009-08-31 | 2010-10-07 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
DE102011056888A1 (de) | 2011-12-22 | 2013-06-27 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
JP2014045175A (ja) * | 2012-08-02 | 2014-03-13 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
DE102012110775A1 (de) * | 2012-11-09 | 2014-05-15 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102013102667A1 (de) | 2013-03-15 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung |
JP2015012048A (ja) * | 2013-06-27 | 2015-01-19 | 三菱電機株式会社 | アクティブマトリクス基板およびその製造方法 |
JP2015156431A (ja) * | 2014-02-20 | 2015-08-27 | スタンレー電気株式会社 | 半導体発光素子及び半導体発光装置 |
-
2015
- 2015-05-29 DE DE102015108532.1A patent/DE102015108532A1/de not_active Withdrawn
-
2016
- 2016-05-11 JP JP2017559097A patent/JP6688320B2/ja active Active
- 2016-05-11 CN CN201680027611.2A patent/CN107636832A/zh active Pending
- 2016-05-11 US US15/578,239 patent/US10361249B2/en active Active
- 2016-05-11 DE DE112016002412.6T patent/DE112016002412B4/de active Active
- 2016-05-11 KR KR1020237015584A patent/KR20230070068A/ko not_active Application Discontinuation
- 2016-05-11 WO PCT/EP2016/060554 patent/WO2016192939A1/de active Application Filing
- 2016-05-11 KR KR1020177033965A patent/KR102531660B1/ko active IP Right Grant
- 2016-05-24 TW TW105116093A patent/TWI590435B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010014032A1 (en) * | 2008-07-07 | 2010-02-04 | Glo Ab | A nanostructured LED |
US20140014894A1 (en) * | 2012-07-06 | 2014-01-16 | Invensas Corporation | High performance light emitting diode with vias |
DE102012112302A1 (de) * | 2012-12-14 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
Non-Patent Citations (2)
Title |
---|
HERRNSDORF JOHANNES ET AL: "Active-Matrix GaN Micro Light-Emitting Diode Display With Unprecedented Brightness", IEEE TRANSACTIONS ON ELECTRON DEVICES, IEEE SERVICE CENTER, PISACATAWAY, NJ, US, vol. 62, no. 6, 10 April 2015 (2015-04-10) - 1 June 2015 (2015-06-01), pages 1918 - 1925, XP011581749, ISSN: 0018-9383, [retrieved on 20150518], DOI: 10.1109/TED.2015.2416915 * |
ZHAO JUN LIU ET AL: "Investigation of Forward Voltage Uniformity in Monolithic Light-Emitting Diode Arrays", IEEE PHOTONICS TECHNOLOGY LETTERS, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 25, no. 13, 1 July 2013 (2013-07-01), pages 1290 - 1293, XP011515647, ISSN: 1041-1135, DOI: 10.1109/LPT.2013.2263223 * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10388694B2 (en) | 2016-01-11 | 2019-08-20 | Osram Opto Semiconductors Gmbh | Optoelectronic component, lighting apparatus and car headlight |
WO2018099794A1 (de) * | 2016-11-29 | 2018-06-07 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung mit einer mehrzahl getrennt voneinander betreibbarer bildpunkte |
US11121124B2 (en) | 2016-11-29 | 2021-09-14 | Osram Oled Gmbh | Display device with a plurality of separately operable pixels formed in a grid |
CN110121781A (zh) * | 2017-11-08 | 2019-08-13 | 首尔伟傲世有限公司 | 包括多个像素的显示用发光二极管单元及具有该显示用发光二极管单元的显示装置 |
JP2021511528A (ja) * | 2017-11-08 | 2021-05-06 | ソウル バイオシス カンパニー リミテッドSeoul Viosys Co.,Ltd. | 複数のピクセルを含むディスプレイ用発光ダイオードユニット及びそれを有する表示装置 |
JP7222993B2 (ja) | 2017-11-08 | 2023-02-24 | ソウル バイオシス カンパニー リミテッド | 複数のピクセルを含むディスプレイ用発光ダイオードユニット及びそれを有する表示装置 |
US11764253B2 (en) | 2017-11-08 | 2023-09-19 | Seoul Viosys Co., Ltd. | Light-emitting diode unit for display comprising plurality of pixels and display device having same |
CN110121781B (zh) * | 2017-11-08 | 2024-02-23 | 首尔伟傲世有限公司 | 包括多个像素的显示用发光二极管单元及具有该显示用发光二极管单元的显示装置 |
US12009385B2 (en) | 2017-11-08 | 2024-06-11 | Seoul Viosys Co., Ltd. | Light-emitting diode unit for display comprising plurality of pixels and display device having same |
JP2019204823A (ja) * | 2018-05-21 | 2019-11-28 | シャープ株式会社 | マイクロ発光素子、画像表示素子およびその形成方法 |
JP7105612B2 (ja) | 2018-05-21 | 2022-07-25 | シャープ株式会社 | 画像表示素子およびその形成方法 |
Also Published As
Publication number | Publication date |
---|---|
DE102015108532A1 (de) | 2016-12-01 |
KR102531660B1 (ko) | 2023-05-12 |
CN107636832A (zh) | 2018-01-26 |
DE112016002412A5 (de) | 2018-03-08 |
DE112016002412B4 (de) | 2021-09-09 |
TWI590435B (zh) | 2017-07-01 |
JP6688320B2 (ja) | 2020-04-28 |
JP2018520504A (ja) | 2018-07-26 |
KR20230070068A (ko) | 2023-05-19 |
US20180166499A1 (en) | 2018-06-14 |
US10361249B2 (en) | 2019-07-23 |
TW201703246A (zh) | 2017-01-16 |
KR20180013904A (ko) | 2018-02-07 |
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