WO2016177286A1 - 一种压膜装置及压膜方法 - Google Patents

一种压膜装置及压膜方法 Download PDF

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Publication number
WO2016177286A1
WO2016177286A1 PCT/CN2016/079832 CN2016079832W WO2016177286A1 WO 2016177286 A1 WO2016177286 A1 WO 2016177286A1 CN 2016079832 W CN2016079832 W CN 2016079832W WO 2016177286 A1 WO2016177286 A1 WO 2016177286A1
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Prior art keywords
substrate
roller
layer
film
electrode
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PCT/CN2016/079832
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English (en)
French (fr)
Inventor
井杨坤
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京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/511,119 priority Critical patent/US10486404B2/en
Publication of WO2016177286A1 publication Critical patent/WO2016177286A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0064—Smoothing, polishing, making a glossy surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the present disclosure relates to a substrate manufacturing apparatus, and more particularly to a film forming apparatus and a film pressing method.
  • AMOLED Active-matrix organic light emitting diode, active matrix organic light emitting diode or active matrix organic light emitting diode
  • the substrate of the AMOLED display panel is formed by adhering an AMOLED film layer to the substrate to be coated through an AMOLED film laminator.
  • the AMOLED laminating machine mainly comprises: a loading platform for carrying and conveying the substrate to be coated; a pressure roller disposed above the stage; a rubberizing roller for coating the bonding layer on the substrate; and, for using the AMOLED
  • the film layer covers the film portion on the surface of the substrate coated with the adhesive layer.
  • the adhesive layer on the rubberizing roller is transferred onto the substrate to be bonded, and the AMOLED film layer is coated on the substrate coated with the bonding layer, and covered with the coating portion.
  • the AMOLED film layer can be attached to the substrate.
  • the surface flatness of each surface of the surface of the substrate to be coated is not uniform, and thus, after the AMOLED film layer is coated on the substrate coated with the adhesive layer, the roller is pressed by the pressure roller.
  • the uneven pressure between the pressure roller and the surface of the substrate causes problems such as film bubbles and affects the quality of the film.
  • the purpose of the present disclosure is to provide a film forming device and a film pressing method, which can reduce the presence of a film. Bubbles and other phenomena improve the quality of the film.
  • a filming device for attaching a film layer to a substrate comprising:
  • a coating portion for coating a film layer on a surface of the substrate
  • a first roller for rolling on a substrate coated with a film to perform a flattening defoaming process
  • a deformation layer disposed on the first roller, the deformation layer being deformable to change a roll mesh pattern on an outer circumferential surface of the first roller to cause a rolling point of the first roller
  • the pattern matches the surface of the substrate; and an alignment structure for aligning the substrate and the first roller.
  • the lamination device further includes: an acquisition mechanism for acquiring flatness information of a surface of the substrate, and controlling deformation of the deformation layer according to the flatness information.
  • the obtaining mechanism includes:
  • a second roller for rolling on the surface of the substrate before the substrate is uncoated
  • a pressure sensing film for sensing a pressure between the second roller and a surface of the substrate when the second roller is rolled on a surface of the substrate, and generating a corresponding sensing signal, the pressure sensing film setting On the outer circumferential surface of the second roller;
  • a first control module for generating the flatness information according to the sensing signal.
  • the pressure sensing film comprises:
  • a second electrode opposite to the first electrode and overlapping at a plurality of predetermined regions
  • a plurality of capacitance sensors respectively disposed at respective predetermined regions between the first electrode and the second electrode, the capacitance sensors being used when the second roller and the surface of the substrate are rolled Converting a pressure between the second roller and the surface of the substrate at a corresponding predetermined area into a change value of the capacitance value, and generating a corresponding sensing signal;
  • the first control module is configured to generate the flatness information according to the sensing signal and position information of a predetermined area where each capacitive sensor is located.
  • the first electrode includes a plurality of first electrode strips circumferentially spaced along the second roller;
  • the second electrode includes a plurality of second electrode strips perpendicularly intersecting the plurality of first electrode strips; a plurality of regions where the first electrode strip and the second electrode strip intersect form the plurality of predetermined regions.
  • the deformation layer includes: a piezoelectric deformation layer for deforming under an applied voltage; and an electrode structure for applying a voltage signal to the piezoelectric deformation layer;
  • the acquiring mechanism includes: sending, according to the flatness information, a first voltage signal to the electrode structure to deform the piezoelectric deformation layer such that a roller on an outer surface of the first roller A second control module that matches the surface of the substrate to the surface of the substrate.
  • the piezoelectric deformation layer comprises a piezoelectric ceramic deformation layer.
  • the acquiring mechanism includes: sending, according to flatness information of a surface of the substrate, a second voltage signal to the electrode structure to deform the piezoelectric deformation layer, so that the first roller The roll-pressed dot pattern on the outer surface of the wheel is restored to the third control module in the initial state.
  • the filming device further includes a cleaning portion for receiving the flatness information of the surface of the substrate acquired by the acquiring mechanism, and cleaning the surface of the substrate when the flatness information is preset information.
  • the lamination device further includes: a gluing structure for applying a bonding layer on the surface of the substrate before the surface coating layer of the substrate.
  • a film pressing method for attaching a film layer to a substrate the method adopting a film pressing device as described above, the method comprising:
  • the first roller is controlled to roll on the surface of the substrate coated with the film layer to perform a flattening and defoaming treatment.
  • the deformation of the deformation layer is controlled to change the roll mesh pattern on the outer circumferential surface of the first roller, so that the roll mesh pattern of the outer surface of the first roller matches the surface of the substrate, and specifically includes:
  • the acquisition mechanism controls the flatness information of the surface of the substrate, and controls the deformation of the deformation layer according to the flatness information.
  • control acquiring mechanism acquires the flatness information of the surface of the substrate, and specifically includes:
  • the flatness information is generated according to the sensing signal by the first control module.
  • the deformation of the deformation layer is controlled according to the flatness information, and specifically includes:
  • the piezoelectric deformation layer is deformed according to the first voltage signal such that the roll press dot pattern on the outer surface of the first roller matches the surface of the substrate.
  • the third control module is controlled to send a second voltage signal to the electrode structure according to the flatness information of the surface of the substrate, so that the piezoelectric deformation layer is deformed, so that the outer surface of the first roller The upper roller dot pattern is restored to the initial state.
  • the method further includes:
  • a bonding layer is applied on the surface of the substrate before the substrate coating layer.
  • the deformable deformation layer is provided on the first roller, the deformation of the deformation layer can be performed, so that the roll mesh pattern on the outer surface of the first roller can be
  • the surfaces of the substrates are matched so that when the surface of the substrate coated with the film layer is subjected to roll flattening and defoaming through the first roller, the force on each surface of the substrate surface is uniform, thereby reducing the presence of the film bubbles and improving the quality of the film.
  • FIG. 1 is a schematic structural view of a lamination device according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural view of a pressure sensing film in a lamination device according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of a lamination device according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural view of a deformation layer of a lamination device according to an embodiment of the present disclosure.
  • the present invention provides a film pressing device which can reduce the phenomenon of bubbles in the film and improve the quality of the film.
  • the present disclosure provides a film pressing device for attaching a film layer to a substrate, the film forming device comprising:
  • stage 200 for carrying and transporting the substrate 100
  • a deformation layer 401 disposed on the first roller 400, the deformation layer 401 being deformable to change a roll mesh pattern on an outer circumferential surface of the first roller 400, so that the first roller
  • the roll-press dot pattern of 400 matches the surface of the substrate 100; and an alignment structure 800 (shown in FIG. 3) for aligning the substrate 100 with the first roller 400.
  • the deformation of the deformation layer 401 can be performed to make the roller press point on the outer surface of the first roller 400.
  • the pattern is matched with the surface of the substrate 100, so that when the first roller 400 is subjected to the roll flattening defoaming process on the surface of the substrate 100 coated with the film layer, the substrate 100 can be aligned with the first roller 400.
  • the roll pressing dot pattern on the first roller 400 is matched with the surface of the substrate 100, so that the force on each surface of the substrate 100 is uniform, the presence of the film bubbles is reduced, and the film quality is improved.
  • the roll mesh pattern of the first roller 400 is matched with the surface of the substrate 100, and may include: when a certain area on the surface of the substrate 100 has a convex structure, the deformation layer 401 and the The position corresponding to the region is deformed such that the roll-pressed dot pattern of the first roller 400 produces a concave deformation at a position corresponding to the convex structure of the region; conversely, when a certain region on the surface of the substrate 100 has a depression In the structure, the deformed layer 401 is deformed at a position corresponding to the region such that the roll-pressed dot pattern of the first roller 400 generates a convex deformation at a position corresponding to the recessed structure of the region.
  • the first roller is made by the deformation layer 401.
  • the roll press dot pattern of 400 matches the surface of the substrate 100, and can be achieved in the following manner.
  • the deformation layer 401 is disposed on the outer circumferential surface of the first roller 400, and the deformation layer 401 can directly contact the substrate 100 coated with the film layer, that is, the deformation pattern of the deformation layer 401 is
  • the roll-pressed dot pattern of the first roller 400 causes the deformation layer 401 to be deformed to match the surface of the substrate 100, so that the roll-press dot pattern of the first roller 400 matches the surface of the substrate 100;
  • the deformation layer 401 may be further covered with a functional structure layer, and the functional structure layer may include a protective layer for protecting the deformation layer 401, and the protective layer is a flexible material.
  • the shape can be changed according to the deformation of the deformation layer 401, that is, the deformation pattern formed by the deformation of the protection layer along with the deformation layer 401 is the roll-press dot pattern of the first roller 400, optionally
  • the protective layer may be a nano rubber adsorption film. If the deformation layer 401 is deformed, the protective layer is deformed accordingly, so that the roll mesh pattern of the first roller 400 matches the surface of the substrate 100. .
  • the deformation layer 401 may be deformed by applying an external force such that the roll mesh pattern of the first roller 400 matches the surface of the substrate 100.
  • the deformation layer 401 may be a deformable deformation layer or a plastic deformation layer capable of deforming under an external force and maintaining the deformation after the external force is removed, for the first roller 400 to be on the substrate.
  • a normal deformation or plastic deformation occurs under the pressure between the first roller 400 and the substrate 100.
  • the first roller 400 can be rolled once on the surface of the substrate 100 before the coating layer of the substrate 100, and the deformation layer 401 on the first roller 400 can be in the first roller.
  • a deformation matching the surface of the substrate 100 occurs under the pressure between the substrate 400 and the substrate 100, and the deformation is maintained after the completion of one rolling, so that after the substrate 100 is coated with the film layer,
  • the first roller 400 is double-rolled to perform the flattening and defoaming process, since the roll-pressed dot pattern of the first roller 400 maintains a shape matching the surface of the substrate 100, the force of each region of the substrate 100 is uniform. , thereby reducing the occurrence of film bubbles.
  • the deformation layer 401 can also be deformed by applying a signal.
  • the following embodiments describe the present disclosure in detail by deforming the deformation layer 401 by applying a signal.
  • the film forming device further includes: flattening the surface of the substrate 100 for obtaining Degree information, and controlling the acquisition mechanism of the deformation layer 401 to be deformed according to the flatness information.
  • the flatness information of the surface of the substrate 100 is obtained by providing an acquisition mechanism, and the deformation of the deformation layer 401 is controlled according to the flatness information, so that the pattern matching accuracy of the surface of the pressure equalizing roller can be further improved.
  • the acquiring mechanism includes:
  • a second roller 500 for rolling on the surface of the substrate 100 before the substrate 100 is uncoated
  • a pressure sensing film 600 for sensing a pressure between the second roller 500 and a surface of the substrate 100 when the second roller 500 is rolled on the surface of the substrate 100, and generating a corresponding sensing signal.
  • the pressure sensing film 600 is disposed on an outer circumferential surface of the second roller 500;
  • a first control module 810 (shown in FIG. 3) for generating the flatness information according to the sensing signal.
  • the first control module Before the substrate 100 is uncoated, a roll is performed on the surface of the substrate 100 by the second roller 500, and the pressure sensing film 600 senses between the second roller 500 and the surface of the substrate 100. And generating a sensing signal, the first control module generates the flatness information according to the sensing signal, and the deformation layer 401 deforms according to the flatness information, so that the roll mesh pattern of the first roller 400 and The surface of the substrate 100 is matched, and the first roller 400 is secondarily rolled on the substrate 100 coated with the film layer to perform a flattening and defoaming process, because the roll press dot pattern of the first roller 400 is maintained and the substrate
  • the surface matching shape of 100 makes the force of each region of the substrate 100 uniform, thereby reducing the occurrence of film bubbles.
  • the pressure sensing film 600 includes:
  • a first electrode 601 disposed on an outer circumferential surface of the second roller 500;
  • a second electrode 602 opposite to the first electrode 601 and overlapping in a plurality of predetermined regions;
  • An intermediate dielectric layer disposed between the first electrode 601 and the second electrode 602;
  • a plurality of capacitance sensors 603 respectively disposed at predetermined regions between the first electrode 601 and the second electrode 602, the capacitance sensors 603 being used in the second roller 500 and the substrate 100 When the surface is rolled, the pressure between the second roller 500 and the surface of the substrate 100 at the corresponding predetermined area is converted into a change value of the capacitance value, and the corresponding sensing signal is generated;
  • the first control module is configured to generate the flatness information according to the sensing signal and position information of a predetermined area where each capacitive sensor 603 is located.
  • the pressure sensing film 600 acquires the surface flatness information of the substrate 100 by: if the surface flatness of each region in the substrate 100 is not uniform, the second roller 500 is performed on the surface of the substrate 100.
  • the pressure between the pressure sensing film 600 and the substrate 100 is also non-uniform, so that the distance between the first electrode 601 and the second electrode 602 of each predetermined region is inconsistent, so that the capacitance at each predetermined region
  • the capacitance values of the sensors 603 are changed, and finally the magnitudes of the piezoelectric induced currents output from the respective capacitive sensors 603 are unequal, that is, the capacitive sensors 603 at the predetermined regions have the pressure sensing film 600 and the substrate 100 at
  • the pressure generated during the contact is converted into a change in the capacitance value and outputted as a piezoelectric induced current; and the first control module is based on the magnitude of the piezoelectric induced current output by each capacitive sensor 603 in the pressure sensing film 600 and the respective capacit
  • the pressure sensing film 600 of the above structure has good dynamic and static sensing performance, so that whether the pressure sensing film 600 and the substrate 100 are in instantaneous contact or continuously pressed, good tactile information can be obtained, thereby ensuring the obtained information.
  • the surface flatness information of the substrate 100 is highly accurate.
  • the first electrode 601 includes a plurality of first electrode strips circumferentially spaced along the second roller 500; the second The electrode 602 includes a plurality of second electrode strips perpendicularly intersecting the plurality of first electrode strips; wherein the plurality of regions where the first electrode strip and the second electrode strip intersect form the plurality of predetermined regions.
  • the plurality of electrode strips of the first electrode 601 and the plurality of electrode strips of the second electrode 602 in the pressure sensing film 600 are arranged orthogonally, which can facilitate obtaining the position information of each capacitive sensor 603, and improve the obtained substrate.
  • the accuracy of the surface flatness information of 100 is not limited thereto.
  • the acquiring mechanism may also adopt other manners to obtain surface flatness information of the substrate 100, for example, by providing a flexible thin layer sensing sensor on the second roller 500,
  • the surface flatness information of the substrate 100 is obtained by a pressure-sensing rubber or an electro-rheological fluid sensing sensor, and is not limited herein.
  • the pressure sensing film 600 may also be wrapped with a protective layer for protecting the pressure sensing film 600.
  • the protective layer may employ a nano rubber adsorption film.
  • the second roller 500 may be the same roller as the first roller 400, that is, the first roller 400 may be used for The surface of the substrate 100 is rolled once to obtain the surface flatness of the substrate 100, and can also be used for secondary rolling on the surface of the substrate 100 for the flattening and defoaming treatment. It will of course be understood that the second roller 500 may also be a different roller than the first roller 400.
  • the pressure sensing film 600 may be wrapped around the deformation layer 401 at the pressure.
  • the protective film 600 may be further wrapped with a protective layer, and the first electrode 601 and the second electrode 602 of the pressure sensing film 600 shall be made of a flexible conductive material, which may be deformed according to the deformation of the deformed layer 401.
  • the first electrode 601 and the second electrode 602 may be made of a carbon nanotube conductive material.
  • the deformation layer 401 includes: a piezoelectric deformation layer 820 for deforming under an applied voltage; and An electrode structure 840 that applies a voltage signal to the deformation layer.
  • the acquiring mechanism includes: transmitting, according to the flatness information, a first voltage signal to the electrode structure to deform the piezoelectric deformation layer 401 such that an outer surface of the first roller 400 is on an outer surface
  • the roll control dot pattern is matched to the surface of the substrate 100 by a second control module 850 (shown in Figures 3-4).
  • the second control module determines the voltage value required for the deformation of the piezoelectric deformation layer according to the surface flatness information of each region of the substrate 100, and applies the determined voltage value to the electrode structure that controls the deformation of the piezoelectric deformation layer.
  • the piezoelectric deformation layer is deformed to match the surface of the substrate 100.
  • the deformation layer 401 may also be implemented in other manners, and the specific structure of the deformation layer 401 is not limited herein.
  • the piezoelectric deformation layer may adopt a piezoelectric ceramic deformation layer.
  • the material of the piezoelectric ceramic deformation layer refers to a polycrystal obtained by irregularly collecting fine crystal grains obtained by mixing raw materials of necessary components, and then obtained by a process such as granulation, molding, high-temperature sintering, etc., such as barium titanate. And a compound such as lead zirconate titanate.
  • the acquiring mechanism may further include: Flatness information of the surface, sending a second voltage signal to the electrode structure to deform the piezoelectric deformation layer, so that the roll mesh pattern on the outer surface of the first roller 400 is restored to an initial state
  • the third control module 860 (shown in Figure 3-4).
  • the third control module can be used to control the deformation of the piezoelectric deformation layer 401 according to the surface flatness information of the substrate 100, so that the roll mesh pattern of the first roller 400 is restored to the initial state. It is used when the other substrate 100 is pasted for the next time.
  • the third control module controls the piezoelectric variable layer to generate or eliminate a roll mesh pattern corresponding to each surface of the substrate 100 according to the surface flatness information of the substrate 100, mainly by piezoelectric
  • the variable layer sets different parameters, which can be achieved by creating different roll-press dot patterns.
  • the film forming device can be applied to various types of substrates 100.
  • different types of roll-pressed dot patterns can be realized by directly setting different parameters to the piezoelectric variable layer.
  • a film version can only be used for filming one type of substrate 100. When it is required to apply film to different types of substrate 100, it is not necessary to replace the film version on the first roller 400 (ie, the pressure roller). (ie, the piezoelectric variable layer), thereby saving the time required to replace the film version; and, also, avoiding problems such as scratching of the film plate due to replacement of the film version.
  • the lamination device may further include flatness information for receiving a surface of the substrate 100 acquired by the acquisition mechanism, and when the flatness information is preset information A cleaning portion 870 (shown in FIG. 3) for cleaning the surface of the substrate 100.
  • a cleaning portion 870 shown in FIG. 3 for cleaning the surface of the substrate 100.
  • the cleaning portion may be a vacuum suction tube.
  • the vacuum suction tube is opened to be adsorbed on the substrate 100. Foreign matter such as debris and small particles are removed in time.
  • the lamination device further includes: a gluing structure for applying a bonding layer on the surface of the substrate 100 before the surface coating layer of the substrate 100.
  • the glue coating structure may include a dispenser 701, a squeegee roller 702, a third roller 703, and the like, wherein the dispenser 701 drops a bonding layer on the surface of the third roller 703, and then utilizes The scraping roller 702 (or the scraper) uniformly coats the adhesive layer dropped on the surface of the third roller 703, and the third roller 703 is rolled on the surface of the substrate 100 to coat the adhesive layer on the surface thereof. The cloth is placed on the surface of the substrate 100.
  • the specific structure of the rubberized structure is not limited herein.
  • the dispenser 701 and the blade scraping roller 702 may be separated from the third roller 703 before the surface of the substrate 100 is coated with a bonding layer, and the bonding of the surface of the substrate 100 is required.
  • the dispenser 701 and the scraper roller 702 are brought close to the third roller 703 to uniformly apply the adhesive layer on the third roller 703, and the third roller 703 is utilized.
  • the surface of the substrate 100 is rolled to apply a bonding layer on the surface of the substrate 100.
  • the third roller 703 may be the same roller as the first roller 400, that is, the first roller 400 may be used in The surface layer of the substrate 100 is coated with a bonding layer on the substrate 100 before, and may be used to perform a roll flattening and defoaming process on the surface of the substrate 100 after the surface of the substrate 100 is coated with a film layer.
  • the third roller 703 may also be a different roller than the first roller 400.
  • the second roller 500 is used to perform the first rolling on the surface of the substrate 100 to acquire the surface flatness information of the substrate 100 through the pressure sensing film 600 and acquired according to the pressure sensing film 600.
  • the flatness information is controlled to deform the piezoelectric deformation layer 401 on the first roller 400 such that the roll mesh pattern of the first roller 400 matches the surface of the substrate 100;
  • the dispenser 701 and the scraper are brought close to the third roller 703 to uniformly apply a bonding layer on the third roller 703 through the third roller 703.
  • the dispenser 701 and the scraper are brought close to the third roller 703 to uniformly apply a bonding layer on the third roller 703 through the third roller 703.
  • the AMOLED film layer is coated on the substrate 100 coated with the adhesive layer by the coating portion 300;
  • the substrate 100 coated with the film layer is aligned with the first roller 400 such that the roll mesh pattern of the first roller 400 corresponds to the surface of the substrate 100, and the first roller is 400 is subjected to a third rolling on the substrate 100 to perform a flattening defoaming process.
  • the roller can be passed through the alignment structure in the three rolling process.
  • the wheel and the substrate 100 are aligned.
  • the present disclosure also provides a lamination method for laminating a film using the laminating device as described above for attaching a film layer to the substrate 100; the method comprising:
  • Step S01 the deformation layer 401 is deformed to change the roll mesh pattern on the outer circumferential surface of the first roller 400, so that the roll mesh pattern of the outer surface of the first roller 400 matches the surface of the substrate 100;
  • Step S02 coating a film on the surface of the substrate 100
  • Step S03 aligning the substrate 100 with the first roller 400
  • Step S04 controlling the first roller 400 to roll on the surface of the substrate 100 coated with the film layer to perform a flattening and defoaming process.
  • step S01 specifically includes:
  • the acquisition mechanism acquires the flatness information of the surface of the substrate 100, and controls the deformation of the deformation layer 401 according to the flatness information.
  • the obtaining mechanism obtains the flatness information of the surface of the substrate 100, and specifically includes:
  • the flatness information is generated according to the sensing signal by the first control module.
  • the deformation of the deformation layer 401 is controlled according to the flatness information, and specifically includes:
  • the piezoelectric deformation layer is deformed according to the first voltage signal such that the roll press dot pattern on the outer surface of the first roller 400 matches the surface of the substrate 100.
  • the third control module is controlled to send a second voltage signal to the electrode structure according to the flatness information of the surface of the substrate 100, so as to deform the piezoelectric deformation layer.
  • the roll press dot pattern on the outer surface of the first roller 400 is returned to the initial state.
  • the method further includes: coating a bonding layer on the surface of the substrate 100 before the substrate 100 is coated.

Abstract

一种压膜装置及压膜方法，用于将膜层贴在基板上。压膜装置包括：用于承载及传送基板（100）的载台（200）；用于将膜层覆在基板（100）的表面上的覆膜部（300）；用于在覆有膜层的基板（100）上滚压以进行铺平除泡处理的第一辊轮（400）；设置于第一辊轮（400）上的形变层（401），形变层（401）能够发生形变，以改变第一辊轮（400）的外周面上的辊压网点图案，使第一辊轮（400）的辊压网点图案与基板（100）的表面相匹配；用于对基板（100）和第一辊轮（400）进行对位的对位结构（800）。

Description

一种压膜装置及压膜方法
相关申请的交叉引用
本申请主张在2015年5月6日在中国提交的中国专利申请号No.201510227561.X的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及一种基板制造装置，尤其涉及一种压膜装置及压膜方法。
背景技术
AMOLED(Active-matrix organic light emitting diode，有源矩阵有机发光二极体或主动矩阵有机发光二极体)具有宽视角，高分辨率，高亮度，响应速度快，低能耗，自发光，超薄等特点，被誉为第三代显示技术革命。
通常，AMOLED显示面板的基板是将AMOLED膜层通过AMOLED压膜机黏贴在待贴膜基板上形成的。AMOLED压膜机主要包括：用于承载及传送待贴膜基板的载台；设置于载台上方的匀压辊轮；用于向基板上涂布黏结层的涂胶辊；以及，用于将AMOLED膜层覆在涂布有黏结层的基板的表面上的覆膜部。其中，待贴膜基板经涂胶辊滚压之后，涂胶辊上的黏结层转印至待贴合基板上，覆膜部将AMOLED膜层覆压于涂布有黏结层的基板上，覆有AMOLED膜层的基板再经匀压辊轮滚压进行铺平除泡之后，便可将AMOLED膜层贴在基板上。
AMOLED压膜机存在以下技术问题：
待贴膜基板的表面各区域的表面平整度是不均一的，如此，会导致将AMOLED膜层覆压于涂布有黏结层的基板上之后，在经匀压辊轮滚压时，会由于匀压辊轮与基板的表面之间的压力不匀一而导致存在贴膜气泡等问题，影响贴膜质量。
发明内容
本公开的目的就在于提供一种压膜装置及压膜方法，能够减少贴膜存在 气泡等现象，提高贴膜质量。
本公开所提供的技术方案如下：
一种压膜装置，用于将膜层贴在基板上；所述压膜装置包括：
用于承载及传送基板的载台；
用于将膜层覆在基板的表面上的覆膜部；
用于在覆有膜层的基板上滚压以进行铺平除泡处理的第一辊轮；
设置于所述第一辊轮上的形变层，所述形变层能够发生形变，以改变所述第一辊轮的外周面上的辊压网点图案，使所述第一辊轮的辊压网点图案与基板的表面相匹配；以及用于对基板和所述第一辊轮进行对位的对位结构。
进一步的，所述压膜装置还包括：用于获取基板的表面的平整度信息，并根据所述平整度信息控制所述形变层发生形变的获取机构。
进一步的，所述获取机构包括：
用于在基板未覆膜层之前，在基板的表面上进行滚压的第二辊轮；
用于在所述第二辊轮在基板的表面滚压时，感知所述第二辊轮与基板的表面之间的压力，并生成相应的感应信号的压力感知膜，所述压力感知膜设置在所述第二辊轮的外周面上；
以及，用于根据所述感应信号生成所述平整度信息的第一控制模块。
进一步的，所述压力感知膜包括：
设置于所述第二辊轮的外周面上的第一电极；
与所述第一电极相对、并在多个预定区域交叠的第二电极；
以及分别设置于所述第一电极和所述第二电极之间的各预定区域处的多个电容传感器，所述电容传感器用于在所述第二辊轮与基板的表面进行滚压时，将相应的预定区域处所述第二辊轮与基板的表面之间的压力转换为电容值的变化值，并生成相应的所述感应信号；
其中，所述第一控制模块用于根据所述感应信号以及各电容传感器所处的预定区域的位置信息，生成所述平整度信息。
进一步的，所述第一电极包括沿第二辊轮周向间隔分布的多个第一电极条；所述第二电极包括与多个第一电极条垂直相交的多个第二电极条；其中，所述第一电极条和所述第二电极条相交的多个区域形成所述多个预定区域。
进一步的，所述形变层包括：用于在外加电压作用下发生形变的压电形变层；以及用于向所述压电形变层施加电压信号的电极结构；
所述获取机构包括：用于根据所述平整度信息，向所述电极结构发送第一电压信号，以使所述压电形变层发生形变，使得所述第一辊轮的外表面上的辊压网点图案与基板的表面相匹配的第二控制模块。
进一步的，所述压电形变层包括压电陶瓷形变层。
进一步的，所述获取机构包括：用于根据所述基板的表面的平整度信息，向所述电极结构发送第二电压信号，以使所述压电形变层发生形变，使得所述第一辊轮的外表面上的辊压网点图案恢复至初始状态的第三控制模块。
进一步的，所述压膜装置还包括用于接收所述获取机构获取的基板的表面的平整度信息，并在所述平整度信息为预设信息时，对基板的表面进行清洁的清洁部。
进一步的，所述压膜装置还包括：用于在基板的表面覆膜层之前，在基板的表面涂布黏结层的涂胶结构。
一种压膜方法，用于将膜层贴在基板上；所述方法采用如上所述的压膜装置，所述方法包括：
控制形变层发生形变，以改变第一辊轮的外周面上的辊压网点图案，使第一辊轮的外表面的辊压网点图案与基板的表面相匹配；
在基板的表面上覆膜层；
将基板与第一辊轮进行对位；
控制第一辊轮在覆有膜层的基板的表面滚压进行铺平除泡处理。
进一步的，所述方法中，
控制形变层发生形变，以改变第一辊轮的外周面上的辊压网点图案，使第一辊轮的外表面的辊压网点图案与基板的表面相匹配，具体包括：
控制获取机构获取基板的表面的平整度信息，并根据平整度信息，控制形变层发生形变。
进一步的，所述方法中，控制获取机构获取基板的表面的平整度信息，具体包括：
在基板未覆膜层之前，控制第二辊轮在基板的表面上进行滚压；
在第二辊轮与基板的表面滚压时，通过压力感知膜感知第二辊轮与基板的表面之间的压力并生成感应信号；
通过第一控制模块根据感应信号生成所述平整度信息。
进一步的，根据所述平整度信息，控制形变层发生形变，具体包括：
控制第二控制模块根据所述平整度信息，向电极结构发送第一电压信号；
电极结构向压电形变层施加所述第一电压信号；
压电形变层根据所述第一电压信号发生形变，使得第一辊轮的外表面上的辊压网点图案与基板的表面相匹配。
进一步的，所述方法中，
在基板进行铺平除泡处理之后，控制第三控制模块根据基板的表面的平整度信息，向电极结构发送第二电压信号，以使压电形变层发生形变，使得第一辊轮的外表面上的辊压网点图案恢复至初始状态。
进一步的，所述方法还包括：
在基板覆膜层之前，在基板的表面涂布黏结层。
本公开的有益效果如下：
本公开所提供的压膜装置及压膜方法中，由于在第一辊轮上设置有可变形的形变层，通过形变层发生形变，可以使第一辊轮外表面上的辊压网点图案与基板的表面相匹配，从而使得在通过第一辊轮在覆有膜层的基板表面进行滚压铺平除泡时，基板表面各区域的受力均一，从而减少贴膜气泡存在，提高贴膜质量。
附图说明
图1表示本公开实施例所提供的压膜装置的结构示意图；
图2表示本公开实施例所提供的压膜装置中压力感知膜的结构示意图；
图3为本公开实施例所提供的压膜装置的具体结构示意图；
图4为本公开实施例所提供的压膜装置的形变层的结构示意图。
具体实施方式
以下结合附图对本公开的原理和特征进行描述，所举实例只用于解释本 公开，并非用于限定本公开的范围。
针对由于待贴膜基板的表面各区域的表面平整度不均一，导致在经匀压辊轮进行滚压铺平除泡处理时，会由于匀压辊轮与基板的表面之间的压力不匀一而导致存在贴膜气泡等问题，本公开提供了一种压膜装置可以减少贴膜存在气泡等现象，提高贴膜质量。
如图1所示，本公开所提供了一种压膜装置，用于将膜层贴在基板上，该压膜装置包括：
用于承载及传送基板100的载台200；
用于将膜层覆在基板100的表面上的覆膜部300；
用于在覆有膜层的基板100上滚压以进行铺平除泡处理的第一辊轮400；
设置于所述第一辊轮400上的形变层401，所述形变层401能够发生形变，以改变所述第一辊轮400的外周面上的辊压网点图案，使所述第一辊轮400的辊压网点图案与基板100的表面相匹配；以及用于对基板100和所述第一辊轮400进行对位的对位结构800(如图3中所示)。
本公开所提供的压膜装置中，由于在第一辊轮400上设置有可变形的形变层401，可以通过该形变层401发生形变，来使第一辊轮400外表面上的辊压网点图案与基板100的表面相匹配，从而，通过第一辊轮400在覆有膜层的基板100表面进行滚压铺平除泡处理时，可以将基板100与第一辊轮400进行对位之后，使第一辊轮400上的辊压网点图案与基板100的表面相对应，从而使基板100表面各区域的受力均一，减少了贴膜气泡存在，提高了贴膜质量。
需要说明的是，上述所述第一辊轮400的辊压网点图案与基板100的表面相匹配，可以包括：当基板100表面上某一区域具有凸起结构时，所述形变层401与该区域所对应的位置发生形变，使得所述第一辊轮400的辊压网点图案在该区域的凸起结构相对应的位置处产生凹陷的形变；反之，当基板100表面上某一区域具有凹陷结构时，所述形变层401与该区域所对应的位置发生形变，使得所述第一辊轮400的辊压网点图案在该区域的凹陷结构相对应的位置处产生凸起的形变。
还需要说明的是，在本公开中，通过所述形变层401来使所述第一辊轮 400的辊压网点图案与基板100的表面相匹配，可以通过以下方式实现。
在所述第一辊轮400的外周面设置所述形变层401，而所述形变层401可以直接与覆有膜层的基板100进行接触，即，所述形变层401的形变图案即为所述第一辊轮400的辊压网点图案，则所述形变层401发生与基板100的表面匹配的形变，即可使得所述第一辊轮400的辊压网点图案与基板100的表面匹配；或者，也可以是，在所述形变层401外还包覆有功能结构层，该功能结构层可以包括用于对所述形变层401起保护作用的保护层，且所述保护层为柔性材料，能够随所述形变层401的形变而改变形状，即，所述保护层随所述形变层401形变而形成的形变图案即为所述第一辊轮400的辊压网点图案，可选的，该保护层可以为纳米橡胶吸附膜，若所述形变层401发生形变，则所述保护层随之发生形变，而使得所述第一辊轮400的辊压网点图案与基板100的表面匹配。
在本公开所提供的一种实施例中，所述形变层401可以是通过施加外力的方式来发生形变，而使得第一辊轮400的辊压网点图案与基板100的表面相匹配。其中，所述形变层401可以为能够在外力作用下发生形变，并在撤去所述外力之后仍保持该形变的范性形变层或塑性形变层，用于在所述第一辊轮400在基板100的表面滚压时，在所述第一辊轮400与基板100之间的压力作用下发生范性形变或塑性形变。
采用上述方案，可以在基板100覆膜层之前，通过所述第一辊轮400在基板100的表面进行一次滚压，所述第一辊轮400上的形变层401即可在第一辊轮400与基板100之间的压力作用下而发生与基板100的表面相匹配的变形，并在一次滚压完成后仍保持该形变，这样，在基板100上覆有膜层之后，再经所述第一辊轮400二次滚压进行铺平除泡处理时，由于所述第一辊轮400的辊压网点图案保持与基板100的表面匹配的形状，而使得基板100各区域的受力均一，从而减少贴膜气泡发生。
在本公开的另一种实施例中，所述形变层401也可以通过外加信号的方式来发生形变。以下实施例就以所述形变层401通过外加信号的方式发生形变来对本公开进行详细说明。
在本实施例中，所述压膜装置还包括：用于获取基板100的表面的平整 度信息，并根据所述平整度信息控制所述形变层401发生形变的获取机构。上述方案中，通过设置一获取机构来获取基板100的表面的平整度信息，并根据该平整度信息来控制形变层401的形变，这样，可以进一步地提高匀压辊表面的图案匹配准确度。
在本公开的可选实施例中，如图1所示，所述获取机构包括：
用于在基板100未覆膜层之前，在基板100的表面上进行滚压的第二辊轮500；
用于在所述第二辊轮500在基板100的表面滚压时，感知所述第二辊轮500与基板100的表面之间的压力，并生成相应的感应信号的压力感知膜600，所述压力感知膜600设置在所述第二辊轮500的外周面上；
以及，用于根据所述感应信号生成所述平整度信息的第一控制模块810(如图3所示)。
采用上述方案，在基板100未覆膜层之前，通过所述第二辊轮500在基板100的表面上进行一次滚压，压力感知膜600感知到第二辊轮500与基板100的表面之间的压力并生成感应信号，第一控制模块根据感应信号生成所述平整度信息，所述形变层401根据该平整度信息来发生形变，而使得所述第一辊轮400的辊压网点图案与基板100的表面匹配，所述第一辊轮400再在覆有膜层的基板100上二次滚压进行铺平除泡处理，由于所述第一辊轮400的辊压网点图案保持与基板100的表面匹配的形状，而使得基板100各区域的受力均一，从而减少贴膜气泡发生。
进一步可选的，如图2所示，所述压力感知膜600包括：
设置于所述第二辊轮500的外周面上的第一电极601；
与所述第一电极601相对、并在多个预定区域交叠的第二电极602；
设置于第一电极601和第二电极602之间的中间介质层；
以及，分别设置于所述第一电极601和所述第二电极602之间的各预定区域处的多个电容传感器603，所述电容传感器603用于在所述第二辊轮500与基板100的表面进行滚压时，将相应的预定区域处所述第二辊轮500与基板100的表面之间的压力转换为电容值的变化值，并生成相应的所述感应信号；
其中，所述第一控制模块用于根据所述感应信号以及各电容传感器603所处的预定区域的位置信息，生成所述平整度信息。
上述方案中，压力感知膜600获取基板100的表面平整度信息通过以下方式实现：如果基板100中各区域的表面平整度是不均一的，在所述第二辊轮500在基板100的表面进行滚压时，压力感知膜600与基板100之间的压力也是不均一的，从而导致各预定区域的第一电极601和第二电极602之间的距离是不一致的，使各预定区域处的电容传感器603的电容值发生变化，最终导致从各电容传感器603中输出的压电感应电流的大小是不相等的，也就是说，各预定区域处的电容传感器603将压力感知膜600与基板100在接触时产生的压力转换为电容值的变化，并以压电感应电流的方式输出；而第一控制模块根据压力感知膜600中各电容传感器603输出的压电感应电流大小以及各电容传感器603在压力感知膜600中的位置，确定基板100中各区域的表面平整度信息。
上述结构的压力感知膜600具有良好的动态和静态传感性能，因此，无论压力感知膜600与基板100是瞬间接触还是持续受力挤压，都可以获得良好的触觉信息，从而保证获取到的基板100的表面平整度信息准确度较高。
在本公开的可选实施例中，如图2所示，进一步可选的，所述第一电极601包括沿第二辊轮500周向间隔分布的多个第一电极条；所述第二电极602包括与多个第一电极条垂直相交的多个第二电极条；其中，所述第一电极条和所述第二电极条相交的多个区域形成所述多个预定区域。
采用上述方案，压力感知膜600中第一电极601的多个电极条和第二电极602的多个电极条呈正交设置，可以有利于获取各电容传感器603的位置信息，而提高获取的基板100的表面平整度信息的精确度。当然可以理解的是，在其他实施例中，所述第一电极601和所述第二电极602的设置方式并不仅局限于此。
需要说明的是，在本公开的其他实施例中，所述获取机构也可以采用其他方式来获取基板100的表面平整度信息，例如：通过在第二辊轮500上设置柔性薄层感知传感器、压力感应橡胶或者电流变流体感知传感器等方式来获取基板100的表面平整度信息，在此不做限定。
此外，还需要说明的是，在本公开所提供的可选实施例中，所述压力感知膜600外还可以包裹一保护层，用于对所述压力感知膜600起保护作用。该保护层可采用纳米橡胶吸附膜。
此外，还需要说明的是，上述方案中，所述第二辊轮500可以是与所述第一辊轮400为同一辊轮，也就是说，所述第一辊轮400既可以用于在基板100的表面一次滚压以获取基板100的表面平整度，还可以用于在基板100的表面进行二次滚压进行铺平除泡处理。当然可以理解的是，所述第二辊轮500也可以与第一辊轮400分别为不同的辊轮。
此外，还需说明的是，当所述第二辊轮500和所述第一辊轮400采用同一辊轮时，所述压力感知膜600可以包裹于所述形变层401外，在所述压力感知膜600外可以再包裹一保护层，且所述压力感知膜600的第一电极601和第二电极602应采用柔性导电材料，可随所述形变层401的形变而发生变形，可选的，第一电极601和第二电极602可以采用碳纳米管导电材料制成。
此外，在本实施例中，进一步可选的，如图4所示，所述形变层401包括：用于在外加电压作用下发生形变的压电形变层820；以及用于向所述压电形变层施加电压信号的电极结构840。所述获取机构包括：用于根据所述平整度信息，向所述电极结构发送第一电压信号，以使所述压电形变层401发生形变，使得所述第一辊轮400的外表面上的辊压网点图案与基板100的表面相匹配的第二控制模块850(如图3-4所示)。
采用上述方案，第二控制模块根据基板100各区域的表面平整度信息，确定压电形变层所需形变的电压值，并向控制压电形变层发生形变的电极结构施加确定出的电压值，使得压电形变层发生形变，而与基板100的表面匹配。需要说明的是，在本公开的其他实施例中，所述形变层401也可以采用其他方式实现，在此并不对所述形变层401的具体结构进行局限。
此外，在本实施例中，进一步可选的，所述压电形变层可以采用压电陶瓷形变层。压电陶瓷形变层的材料是指用必要成份的原料进行混合后，然后通过造粒、成型、高温烧结等工艺而获得的由微细晶粒无规则集合而成的多晶体，如钛酸钡系、锆钛酸铅二元系等化合物。
此外，在本实施例中，所述获取机构还可以包括：用于根据所述基板100 的表面的平整度信息，向所述电极结构发送第二电压信号，以使所述压电形变层发生形变，使得所述第一辊轮400的外表面上的辊压网点图案恢复至初始状态的第三控制模块860(如图3-4所示)。采用上述方案，可以采用第三控制模块根据基板100的表面平整度信息来控制压电形变层401发生变形，而使得第一辊轮400的辊压网点图案恢复至初始状态。以便下次对其他基板100进行贴膜时使用。具体地，在上述方案中，第三控制模块根据基板100的表面平整度信息，控制压电可变层产生或消除与基板100的表面各区域对应的辊压网点图案，主要是通过对压电可变层设定不同的参数，可以使其产生不同的辊压网点图案的方式来实现的。这样，可以使该压膜装置适用于多种型号的基板100，针对不同型号的基板100，直接通过对压电可变层设定不同的参数就可以实现产生不同类型的辊压网点图案，与相关技术中一张贴膜版只能对一种型号的基板100贴膜相比，当需要对不同型号的基板100进行贴膜时，不需要更换第一辊轮400(即匀压辊)上的贴膜版(即压电可变层)，从而可以节约更换贴膜版所需要的时间；并且，还可以避免由于更换贴膜版可能导致的对贴膜版的划伤等问题。
此外，在本公开的可选实施例中，所述压膜装置还可以包括用于接收所述获取机构获取的基板100的表面的平整度信息，并在所述平整度信息为预设信息时，对基板100的表面进行清洁的清洁部870(如图3所示)。采用上述方案，可以通过压力感知膜600获取基板100中各区域的表面平整度信息之后，并且在基板100的表面覆膜层之前，当根据基板100的表面平整度信息得知，基板100上有碎屑、小颗粒等异物时，可以采用清洁部在基板100覆膜层之前对其进行清理，从而可以避免由于该基板100上的异物导致刮伤第一辊轮400表面或刮伤该基板100自身。
其中，上述方案中，该清洁部可以为真空吸管，当根据基板100的表面平整度信息得知，基板100上有碎屑、小颗粒等异物时，打开真空吸管，使吸附于该基板100上的碎屑、小颗粒等异物及时被清除。
此外，在本公开所提供的实施例中，所述压膜装置还包括：用于在基板100的表面覆膜层之前，在基板100的表面涂布黏结层的涂胶结构。
采用上述方案，对于一些膜层(例如AMOLED膜层)，其本身没有粘性， 需要首先在基板100的表面涂布黏结层，然后在基板100的表面覆膜层，再利用第一辊轮400滚压进行铺平除泡处理。
其中，所述涂胶结构可以包括点胶机701、刮胶辊轮702和第三辊轮703等，其中所述点胶机701在第三辊轮703的表面上滴加黏结层，然后利用刮胶辊轮702(或刮刀)将滴加在第三辊轮703表面的黏结层涂布均匀，所述第三辊轮703在基板100的表面进行滚压，以将其表面的黏结层涂布在基板100的表面。当然，在此对于涂胶结构的具体结构不做限定。
在上述方案中，在基板100的表面涂布黏结层之前，可以将点胶机701和刮刀刮胶辊轮702(或刮刀)与第三辊轮703分离，在需要在基板100表面涂布黏结层时，将点胶机701和刮胶辊轮702(或刮刀)靠近第三辊轮703，以在所述第三辊轮703上均匀涂布黏结层，进而利用所述第三辊轮703在基板100的表面滚压，而将黏结层涂布于基板100的表面上。
需要说明的是，上述方案中，可选的，所述第三辊轮703可以是与所述第一辊轮400为同一辊轮，也就是说，所述第一辊轮400可以用于在基板100的表面覆膜层之前在基板100上涂布黏结层，还可以用于在基板100的表面覆有膜层之后在基板100的表面进行滚压铺平除泡处理。当然，所述第三辊轮703也可以与第一辊轮400分别为不同的辊轮。
以下说明本实施例中所提供的压膜装置在基板100上贴AMOLED膜层的贴膜过程：
如图1所示，首先，利用所述第二辊轮500在基板100的表面进行第一次滚压，以通过压力感知膜600获取基板100的表面平整度信息，并根据压力感知膜600获取的平整度信息，控制所述第一辊轮400上的压电形变层401发生形变，以使所述第一辊轮400的辊压网点图案与基板100的表面匹配；
然后，将点胶机701和刮刀(或刮胶辊轮702)靠近所述第三辊轮703，以在所述第三辊轮703上均匀涂布黏结层，通过所述第三辊轮703在基板100的表面进行第二次滚压，使得所述第三辊轮703上的黏结层涂布于基板100的表面；
然后，利用覆膜部300将AMOLED膜层覆在涂布有黏结层的基板100上；
最后，将覆有膜层的基板100与所述第一辊轮400进行对位，使得所述第一辊轮400的辊压网点图案与基板100的表面对应之后，将所述第一辊轮400在基板100上进行第三次滚压，以进行铺平除泡处理。
需要说明的是，上述贴膜过程中，当所述第一辊轮400、第二辊轮500和第三辊轮703采用同一辊轮时，可通过对位结构在三次滚压过程中来对辊轮和基板100来进行对位。
此外，本公开还提供了一种采用如上所述的压膜装置进行压膜的压膜方法，用于将膜层贴在基板100上；所述方法包括：
步骤S01、控制形变层401发生形变，以改变第一辊轮400的外周面上的辊压网点图案，使第一辊轮400的外表面的辊压网点图案与基板100的表面相匹配；
步骤S02、在基板100的表面上覆膜层；
步骤S03、将基板100与第一辊轮400进行对位；
步骤S04、控制第一辊轮400在覆有膜层的基板100的表面滚压进行铺平除泡处理。
其中所述方法中，步骤S01具体包括：
控制获取机构获取基板100的表面的平整度信息，并根据平整度信息，控制形变层401发生形变。
其中所述方法中，控制获取机构获取基板100的表面的平整度信息，具体包括：
在基板100未覆膜层之前，控制第二辊轮500在基板100的表面上进行滚压；
在第二辊轮500与基板100的表面滚压时，通过压力感知膜600感知第二辊轮500与基板100的表面之间的压力并生成感应信号；
通过第一控制模块根据感应信号生成所述平整度信息。
其中所述方法中，根据所述平整度信息，控制形变层401发生形变，具体包括：
控制第二控制模块根据所述平整度信息，向电极结构发送第一电压信号；
电极结构向压电形变层施加所述第一电压信号；
压电形变层根据所述第一电压信号发生形变，使得第一辊轮400的外表面上的辊压网点图案与基板100的表面相匹配。
其中所述方法中，在基板100进行铺平除泡处理之后，控制第三控制模块根据基板100的表面的平整度信息，向电极结构发送第二电压信号，以使压电形变层发生形变，使得第一辊轮400的外表面上的辊压网点图案恢复至初始状态。
其中所述方法中，所述方法还包括：在基板100覆膜层之前，在基板100的表面涂布黏结层。
以上所述是本公开的可选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (16)

  1. 一种压膜装置，用于将膜层贴在基板上；所述压膜装置包括：
    用于承载及传送基板的载台；
    用于将膜层覆在基板的表面上的覆膜部；
    用于在覆有膜层的基板上滚压以进行铺平除泡处理的第一辊轮；
    其中，所述压膜装置还包括：
    设置于所述第一辊轮上的形变层，所述形变层能够发生形变，以改变所述第一辊轮的外周面上的辊压网点图案，使所述第一辊轮的辊压网点图案与基板的表面相匹配；以及用于对基板和所述第一辊轮进行对位的对位结构。
  2. 根据权利要求1所述的压膜装置，其中，
    所述压膜装置还包括：用于获取基板的表面的平整度信息，并根据所述平整度信息控制所述形变层发生形变的获取机构。
  3. 根据权利要求2所述的压膜装置，其中，
    所述获取机构包括：
    用于在基板未覆膜层之前，在基板的表面上进行滚压的第二辊轮；
    用于在所述第二辊轮在基板的表面滚压时，感知所述第二辊轮与基板的表面之间的压力，并生成相应的感应信号的压力感知膜，所述压力感知膜设置在所述第二辊轮的外周面上；
    以及，用于根据所述感应信号生成所述平整度信息的第一控制模块。
  4. 根据权利要求3所述的压膜装置，其中，
    所述压力感知膜包括：
    设置于所述第二辊轮的外周面上的第一电极；
    与所述第一电极相对、并在多个预定区域交叠的第二电极；
    以及分别设置于所述第一电极和所述第二电极之间的各预定区域处的多个电容传感器，所述电容传感器用于在所述第二辊轮与基板的表面进行滚压时，将相应的预定区域处所述第二辊轮与基板的表面之间的压力转换为电容值的变化值，并生成相应的所述感应信号；
    其中，所述第一控制模块用于根据所述感应信号以及各电容传感器所处 的预定区域的位置信息，生成所述平整度信息。
  5. 根据权利要求4所述的压膜装置，其中，
    所述第一电极包括沿第二辊轮周向间隔分布的多个第一电极条；所述第二电极包括与多个第一电极条垂直相交的多个第二电极条；其中，所述第一电极条和所述第二电极条相交的多个区域形成所述多个预定区域。
  6. 根据权利要求2所述的压膜装置，其中，
    所述形变层包括：用于在外加电压作用下发生形变的压电形变层；以及用于向所述压电形变层施加电压信号的电极结构；
    所述获取机构包括：用于根据所述平整度信息，向所述电极结构发送第一电压信号，以使所述压电形变层发生形变，使得所述第一辊轮的外表面上的辊压网点图案与基板的表面相匹配的第二控制模块。
  7. 根据权利要求6所述的压膜装置，其中，
    所述压电形变层包括压电陶瓷形变层。
  8. 根据权利要求6所述的压膜装置，其中，
    所述获取机构包括：用于根据所述基板的表面的平整度信息，向所述电极结构发送第二电压信号，以使所述压电形变层发生形变，使得所述第一辊轮的外表面上的辊压网点图案恢复至初始状态的第三控制模块。
  9. 根据权利要求2所述的压膜装置，其中，
    所述压膜装置还包括用于接收所述获取机构获取的基板的表面的平整度信息，并在所述平整度信息为预设信息时，对基板的表面进行清洁的清洁部。
  10. 根据权利要求1所述的压膜装置，其中，
    所述压膜装置还包括：用于在基板的表面覆膜层之前，在基板的表面涂布黏结层的涂胶结构。
  11. 一种压膜方法，采用如权利要求1至10任一项所述的压膜装置将膜层贴在基板上；所述方法包括：
    控制形变层发生形变，以改变第一辊轮的外周面上的辊压网点图案，使第一辊轮的外表面的辊压网点图案与基板的表面相匹配；
    在基板的表面上覆膜层；
    将基板与第一辊轮进行对位；
    控制第一辊轮在覆有膜层的基板的表面滚压进行铺平除泡处理。
  12. 根据权利要求11所述的方法，其中，控制形变层发生形变，以改变第一辊轮的外周面上的辊压网点图案，使第一辊轮的外表面的辊压网点图案与基板的表面相匹配，具体包括：
    控制获取机构获取基板的表面的平整度信息，并根据平整度信息控制形变层发生形变。
  13. 根据权利要求12所述的方法，其中，控制获取机构获取基板的表面的平整度信息，具体包括：
    在基板未覆膜层之前，控制第二辊轮在基板的表面上进行滚压；
    在第二辊轮与基板的表面滚压时，通过压力感知膜感知第二辊轮与基板的表面之间的压力并生成感应信号；
    通过第一控制模块根据感应信号生成所述平整度信息。
  14. 根据权利要求12所述的方法，其中，根据所述平整度信息，控制形变层发生形变，具体包括：
    控制第二控制模块根据所述平整度信息，向电极结构发送第一电压信号；
    电极结构向压电形变层施加所述第一电压信号；
    压电形变层根据所述第一电压信号发生形变，使得第一辊轮的外表面上的辊压网点图案与基板的表面相匹配。
  15. 根据权利要求12所述的方法，其中，
    在基板进行铺平除泡处理之后，所述方法还包括：控制第三控制模块根据基板的表面的平整度信息，向电极结构发送第二电压信号，以使压电形变层发生形变，使得第一辊轮的外表面上的辊压网点图案恢复至初始状态。
  16. 根据权利要求11所述的方法，还包括：
    在基板覆膜层之前，在基板的表面涂布黏结层。
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