WO2016176997A1 - 一种扬声器模组 - Google Patents

一种扬声器模组 Download PDF

Info

Publication number
WO2016176997A1
WO2016176997A1 PCT/CN2015/097316 CN2015097316W WO2016176997A1 WO 2016176997 A1 WO2016176997 A1 WO 2016176997A1 CN 2015097316 W CN2015097316 W CN 2015097316W WO 2016176997 A1 WO2016176997 A1 WO 2016176997A1
Authority
WO
WIPO (PCT)
Prior art keywords
induction coil
speaker module
diaphragm
coil
voice coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/097316
Other languages
English (en)
French (fr)
Inventor
张志兵
陈钢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Inc
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US15/570,542 priority Critical patent/US10250961B2/en
Publication of WO2016176997A1 publication Critical patent/WO2016176997A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/046—Construction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2861—Enclosures comprising vibrating or resonating arrangements using a back-loaded horn
    • H04R1/2865—Enclosures comprising vibrating or resonating arrangements using a back-loaded horn for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2209/00—Details of transducers of the moving-coil, moving-strip, or moving-wire type covered by H04R9/00 but not provided for in any of its subgroups
    • H04R2209/024—Manufacturing aspects of the magnetic circuit of loudspeaker or microphone transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2209/00—Details of transducers of the moving-coil, moving-strip, or moving-wire type covered by H04R9/00 but not provided for in any of its subgroups
    • H04R2209/041—Voice coil arrangements comprising more than one voice coil unit on the same bobbin
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present invention relates to the field of sounding devices, and more particularly to a speaker module.
  • a speaker is an important acoustic component in an electronic device that is a transducer that converts an electrical signal into an acoustic signal.
  • An existing speaker module includes a housing, and a vibration system and a magnetic circuit system disposed in the housing, wherein the vibration system includes a diaphragm and a voice coil disposed on the diaphragm for driving the diaphragm to sound, the voice coil needs to pass The leads are connected to the system to achieve electrical communication.
  • the structure of the moving coil speaker is mainly transmitted by an electrical signal to the voice coil, and then the voice coil drives the diaphragm to generate an acoustic signal.
  • the voice coil In the connection of the electrical signal to the voice coil, the voice coil must lead the two leads to be connected with the FPCB, cable or shrapnel of the system.
  • This type of structure is used by various speaker manufacturers because of its simple fabrication and process maturity, but because of its structural characteristics (because the two leads that are pulled out need to vibrate with the voice coil), there are also some problems:
  • the lead wire is easily broken, causing the system end to open and causing no sound.
  • the voice coil Because of the pulling of the two leads, the voice coil will have a polarization problem when it vibrates, resulting in poor performance.
  • a speaker module includes a cavity surrounded by an outer casing, a magnetic circuit system and a vibration system are disposed in the inner cavity, and the vibration system includes a fixed inner cavity a diaphragm, a voice coil is fixed at a lower end of the diaphragm, a first induction coil is disposed at an upper end of the diaphragm, and the voice coil is electrically connected to the first induction coil through a lead thereof; A second induction coil for electrically connecting the terminal device is correspondingly provided above the induction coil.
  • a first circuit board is disposed between the first induction coil and the diaphragm; a second circuit board is disposed on the outer casing, and the second induction coil is fixed at a lower end of the second circuit board.
  • the second circuit board is fixed on an outer side of the outer casing, and the outer casing is provided with a through hole for the second induction coil to penetrate into the inner cavity thereof.
  • the first induction coil and the second induction coil are disposed opposite each other.
  • a magnetic conductive plate is respectively disposed on an end surface of the first induction coil and the second induction coil facing away from each other.
  • the diaphragm is provided with a through hole, and the lead of the voice coil is electrically connected to the first induction coil through the through hole.
  • the through hole is located in the middle of the diaphragm.
  • the outer casing includes an upper casing, a middle casing, and a lower casing that are sequentially fastened together.
  • a magnetic conductive column or a magnetic conductive liquid is disposed in the through hole of the first induction coil and the second induction coil.
  • the first circuit board is an FPCB board.
  • the second induction coil is electrically connected to the terminal device, and the first induction coil is electrically connected to the voice coil.
  • the terminal device conducts a current signal of the external audio to the second induction coil, so that the second induction coil generates a magnetic field, and the generated magnetic field changes according to the change of the audio signal current; and the first induction coil senses The changing magnetic field, that is, when the magnetic flux of the closed circuit changes, generates a correspondingly varying current that conducts to the voice coil, drives the voice coil to vibrate, and ultimately achieves the sound of the speaker unit.
  • the first circuit board disposed above the diaphragm and the structure of the first induction coil and the second induction coil change the connection manner of the traditional voice coil lead, thereby saving the magnetic circuit system.
  • the voice coil lead is directly connected to the first circuit board and the first induction coil above the diaphragm, so that the voice coil lead can vibrate with the diaphragm, which makes it unnecessary to consider the lead material of the voice coil. Materials such as copper clad aluminum wire can be used, and problems such as poor polarization due to leads are also avoided.
  • the first circuit board provided at the upper end of the diaphragm and the first induction coil can collectively serve as a dome structure of the diaphragm, which improves the strength of the diaphragm at this position and changes the vibration frequency of the diaphragm.
  • the inventors of the present invention have found that in the prior art, the voice coil must lead to two leads connected to the FPCB, the cable line or the shrapnel of the system end, causing problems such as resonance and space occupation. Therefore, the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
  • FIG. 1 is an exploded view of a speaker module of the present invention.
  • FIG. 2 is a cross-sectional view of the speaker module of the present invention.
  • a speaker module provided by the present invention includes an inner cavity surrounded by an outer casing, and a speaker unit mounted in the inner cavity of the outer casing, wherein the speaker unit includes a magnetic body.
  • Road system and vibration system includes a basin frame 4, a magnet 5, a washer 6 and the like located in the inner cavity of the outer casing, wherein the magnet 5 is located in the basin frame 4, and a magnetic gap is formed between the wall and the side wall of the basin frame 4.
  • the vibration system includes a diaphragm 8 fixed in the inner cavity of the casing, and a voice coil 7 that drives the diaphragm 8 to sound.
  • the voice coil 7 is fixed to the lower end of the diaphragm 8 and suspended on the side wall of the magnet 5 and the basin frame 4.
  • the diaphragm 8 divides the inner cavity of the outer casing into a front acoustic cavity and a rear acoustic cavity, and a sound hole 16 is disposed at a position of the outer acoustic cavity on the outer casing for sound to flow out, and thereafter the acoustic cavity is a closed structure, only through damping
  • the hole is connected to the outside world.
  • the outer casing includes an upper casing 3, a middle casing 2, and a lower casing 1 which are sequentially fastened together, and the upper casing 3 is fastened to the upper end opening of the middle casing 2, and the lower casing 1 is fastened therein.
  • the lower end of the case 2 is open.
  • the sound hole 16 is disposed on the middle case 2 such that the speaker module is a side sounding structure.
  • a first circuit board 9 is attached to the diaphragm 8 at the upper end of the diaphragm 8, and the first circuit board 9 is preferably an FPCB board.
  • a first induction coil 11 is disposed at an upper end of the first circuit board 9, and the voice coil 7 is electrically connected to the first induction coil 11 through its lead. Specifically, the lead of the voice coil 7 can be connected to the first On the circuit board 9, the first inductive coil 11 is electrically connected to the lead through the first circuit board 9.
  • a second induction coil 14 for electrically connecting the terminal device is correspondingly provided above the first induction coil 11. The second inductive coil 14 is electrically coupled to a control circuit board in the terminal device for controlling the sound emission of the speaker.
  • the second induction coil 14 can be fixed on the upper casing 3.
  • the second induction coil 14 is fixed to the lower end of the second circuit board 13, and the second circuit board 13 is electrically connected as a speaker module.
  • a component that can be fixed to the outer side of the upper casing 3, and the upper casing 3 is provided with a through hole for the second induction coil 14 to penetrate into the inner cavity thereof, so that the second induction coil 14 can be directly connected to the first induction coil 11 Correspondence.
  • the first inductive coil 11 and the second inductive coil 14 are correspondingly disposed, that is, the two are at least partially overlapped together. Of course, it is preferred for those skilled in the art to completely overlap, that is, the first inductive The coil 11 and the second induction coil 14 are parallel to each other and are disposed to face each other.
  • the second induction coil 14 is electrically connected to the terminal device, and the first induction coil 11 is electrically connected to the voice coil 7.
  • the terminal device will send a current signal of the external audio.
  • the number is conducted to the second induction coil 14, such that the second induction coil 14 generates a magnetic field, and the generated magnetic field changes with the change of the audio signal current; and the first induction coil 11 senses the changed magnetic field, that is, When the magnetic flux of the closed circuit changes, it generates a correspondingly varying current, and the changed current is conducted to the voice coil 7, and the voice coil 7 is driven to vibrate, thereby finally realizing the sound of the speaker unit.
  • the first circuit board disposed above the diaphragm and the structure of the first induction coil and the second induction coil change the connection manner of the traditional voice coil lead, thereby saving the magnetic circuit system.
  • the voice coil lead is directly connected to the first circuit board and the first induction coil above the diaphragm, so that the voice coil lead can vibrate with the diaphragm, which makes it unnecessary to consider the lead material of the voice coil. Materials such as copper clad aluminum wire can be used, and problems such as poor polarization due to leads are also avoided.
  • the first circuit board 9 and the first induction coil 11 provided at the upper end of the diaphragm 8 can collectively serve as the dome structure 15 of the diaphragm 8, which improves the strength of the diaphragm 8 at this position and changes the vibration.
  • the vibration frequency of the membrane 8 can be made into an assembly structure, which greatly simplifies the assembly process of the speaker module.
  • the magnetic conductive plates 10 and 12 are respectively disposed on the end faces of the first induction coil 11 and the second induction coil 14 which face away from each other.
  • the magnetic conductive plate 10 is disposed at a lower end of the first induction coil 11, that is, between the first induction coil 11 and the first circuit board 9.
  • the first induction coil 11, the magnetic conductive plate 10, and the first The circuit board 9 collectively serves as a dome structure 15 of the diaphragm 8;
  • the magnetic conductive plate 12 is disposed at the upper end of the second induction coil 14, that is, between the second induction coil 14 and the second circuit board 13.
  • a magnetic conductive column, a magnetic conductive liquid, or the like may be disposed in the through holes of the first induction coil 11 and the second induction coil 14.
  • a through hole may be provided in the diaphragm 8, and the lead of the voice coil 7 is electrically connected to the first induction coil 11 through the through hole.
  • the through hole is preferably provided in the middle of the diaphragm 8 and sealed by the first circuit board 9.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明公开了一种扬声器模组，包括由外壳围成的内腔，在内腔中设有磁路系统、振动系统，振动系统包括固定在内腔中的振膜，在振膜的下端固定有音圈，在振膜的上端设有第一感应线圈，音圈通过其引线与第一感应线圈电连接；在第一感应线圈的上方还对应地设有用于电连接终端装置的第二感应线圈。本发明的扬声器模组，工作的时候，终端装置将外部音频的电流信号导通至第二感应线圈上，使得第二感应线圈产生磁场，其产生的磁场随着音频信号电流的变化而变化；而第一感应线圈感应到该变化的磁场，也就是说，通过闭合电路的磁通量发生变化时，其会产生相应变化的电流，该变化的电流导通至音圈上，驱动音圈振动，最终实现扬声器单体的发声。

Description

一种扬声器模组 技术领域
本发明涉及发声装置领域，更具体地，本发明涉及一种扬声器模组。
背景技术
扬声器是电子设备中的重要声学部件，其为一种把电信号转变为声信号的换能器件。现有的扬声器模组，包括外壳，以及设置在外壳内的振动系统、磁路系统，其中振动系统包括振膜以及设置在振膜上用于驱动振膜发声的音圈，该音圈需要通过引线与系统连接，实现电路的连通。现有技术中，动圈式扬声器的结构主要由电信号传输到音圈上，然后由音圈驱动振膜产生声音信号。在电信号连接音圈这个环节，音圈必须引出两根引线同系统端的FPCB、cable线或弹片等连接。这种结构因为制作简单，工艺成熟被各扬声器生产商所采用，但是因为其结构的特点(因为被引出的两根引线需要随音圈振动)，也存在一些问题：
1.在结构上必须要做避让，这样会牺牲磁路系统的尺寸。
2.引线容易断裂，造成系统端开路导致无音。
3.因为两根引线的拉扯，音圈振动时会产生偏振问题，导致性能不良。
发明内容
本发明的一个目的是提供一种扬声器模组的新技术方案。
根据本发明的第一方面，提供了一种扬声器模组，包括由外壳围成的内腔，在所述内腔中设有磁路系统、振动系统，所述振动系统包括固定在内腔中的振膜，在所述振膜的下端固定有音圈，在所述振膜的上端设有第一感应线圈，所述音圈通过其引线与第一感应线圈电连接；在所述第一感应线圈的上方还对应地设有用于电连接终端装置的第二感应线圈。
优选地，所述第一感应线圈与所述振膜之间设置有第一线路板；所述外壳上设置有第二电路板，所述第二感应线圈固定在第二电路板的下端。
优选地，所述第二电路板固定在外壳的外侧，所述外壳上设置有供第二感应线圈穿入其内腔的通孔。
优选地，所述第一感应线圈和第二感应线圈正对设置。
优选地，所述第一感应线圈、第二感应线圈相互背离的端面的上分别设置有导磁板。
优选地，所述振膜上设有通孔，所述音圈的引线穿过该通孔与第一感应线圈电连接。
优选地，所述通孔位于振膜的中部。
优选地，所述外壳包括依次扣合在一起的上壳、中壳、下壳。
优选地，所述第一感应线圈、第二感应线圈的通孔内设置有导磁柱或导磁液。
优选地，所述第一电路板为FPCB板。
本发明的扬声器模组，第二感应线圈与终端装置电连接，而第一感应线圈与音圈电连接。工作的时候，终端装置将外部音频的电流信号导通至第二感应线圈上，使得第二感应线圈产生磁场，其产生的磁场随着音频信号电流的变化而变化；而第一感应线圈感应到该变化的磁场，也就是说，通过闭合电路的磁通量发生变化时，其会产生相应变化的电流，该变化的电流导通至音圈上，驱动音圈振动，最终实现扬声器单体的发声。
本发明的扬声器模组中，通过设置在振膜上方的第一电路板，以及第一感应线圈、第二感应线圈的结构，改变了传统音圈引线的连接方式，为磁路系统节约了较大的空间，也就是说，可以允许磁路系统做的更大，以提高灵敏度和频响曲线。采用本发明的结构，音圈引线直接与振膜上方的第一电路板、第一感应线圈电连接，使音圈引线可随着振膜一共振动，这就使得不用再考虑音圈的引线材质，可以使用铜包铝线等材料，同时也避免因为引线导致的偏振不良等问题。另外，在本发明中，设置在振膜上端的第一电路板、第一感应线圈可共同作为振膜的球顶结构，提高了振膜该位置的强度，改变了振膜的振动频率。
本发明的发明人发现，在现有技术中，音圈必须引出两根引线同系统端的FPCB、cable线或弹片等连接，造成了共振、占用空间等问题。因此，本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是本发明扬声器模组的爆炸图。
图2是本发明扬声器模组的剖面图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
参考图1、图2，本发明提供的一种扬声器模组，包括由外壳围成的内腔，以及安装在外壳内腔中的扬声器单体，其中，该扬声器单体包括磁 路系统和振动系统。磁路系统包括位于外壳内腔中的盆架4、磁铁5、华司6等部件，其中磁铁5位于盆架4中，且其与盆架4的侧壁之间形成有磁间隙。振动系统包括固定在外壳内腔中的振膜8，以及驱动振膜8发声的音圈7，所述音圈7固定在振膜8的下端，并且悬置在磁铁5与盆架4侧壁之间的磁间隙中；振膜8将外壳的内腔分为前声腔和后声腔，外壳上位于前声腔的位置设置有声孔16，以便声音的流出，其后声腔为封闭结构，仅通过阻尼孔与外界连通。当音圈7通电后，音圈7会在磁路系统的作用下振动，与此同时，音圈7驱动振膜8一同振动，实现了振膜8的发声。
在本发明一个具体的实施方式中，外壳包括依次扣合在一起的上壳3、中壳2、下壳1，上壳3扣合在中壳2的上端开口，下壳1扣合在中壳2的下端开口。其中，声孔16设置在中壳2上，使得该扬声器模组为侧发声结构。
本发明的扬声器模组，在所述振膜8的上端设有与振膜8贴合在一起的第一电路板9，该第一电路板9优选采用FPCB板。在所述第一电路板9的上端设置有第一感应线圈11，所述音圈7通过其引线与第一感应线圈11电连接在一起，具体地，音圈7的引线可连接在第一电路板9上，第一感应线圈11通过第一电路板9与引线电连接在一起。在所述第一感应线圈11的上方还对应地设有用于电连接终端装置的第二感应线圈14。该第二感应线圈14与终端装置中用于控制扬声器发声的控制电路板电连接在一起。其中，该第二感应线圈14可以固定在上壳3上，优选的是，所述第二感应线圈14固定在第二电路板13的下端，该第二电路板13作为扬声器模组对外电连接的部件，其可以固定在上壳3的外侧，所述上壳3上设置有供第二感应线圈14穿入其内腔的通孔，使得第二感应线圈14可以和第一感应线圈11直接对应起来。其中，第一感应线圈11和第二感应线圈14对应设置，也就是说，二者至少部分重叠在一起，当然，对于本领域的技术人员来说，优选完全重叠，也就是说，第一感应线圈11与第二感应线圈14相互平行，正对设置在一起。
本发明的扬声器模组，第二感应线圈14与终端装置电连接，而第一感应线圈11与音圈7电连接。工作的时候，终端装置将外部音频的电流信 号导通至第二感应线圈14上，使得第二感应线圈14产生磁场，其产生的磁场随着音频信号电流的变化而变化；而第一感应线圈11感应到该变化的磁场，也就是说，通过闭合电路的磁通量发生变化时，其会产生相应变化的电流，该变化的电流导通至音圈7上，驱动音圈7振动，最终实现扬声器单体的发声。
本发明的扬声器模组中，通过设置在振膜上方的第一电路板，以及第一感应线圈、第二感应线圈的结构，改变了传统音圈引线的连接方式，为磁路系统节约了较大的空间，也就是说，可以允许磁路系统做的更大，以提高灵敏度和频响曲线。采用本发明的结构，音圈引线直接与振膜上方的第一电路板、第一感应线圈电连接，使音圈引线可随着振膜一共振动，这就使得不用再考虑音圈的引线材质，可以使用铜包铝线等材料，同时也避免因为引线导致的偏振不良等问题。另外，在本发明中，设置在振膜8上端的第一电路板9、第一感应线圈11可共同作为振膜8的球顶结构15，提高了振膜8该位置的强度，改变了振膜8的振动频率。而且，振膜8、音圈7、第一电路板9、第一感应线圈11可以做成组件结构，大大简化了扬声器模组的组装工艺。
为了提高第一感应线圈11、第二感应线圈14之间的磁通量利用率，所述第一感应线圈11、第二感应线圈14相互背离的端面上分别设置有导磁板10、12。导磁板10设置在第一感应线圈11的下端，也就是说，设置在第一感应线圈11和第一电路板9之间，此时，第一感应线圈11、导磁板10、第一电路板9共同作为振膜8的球顶结构15；导磁板12设置在第二感应线圈14的上端，也就是说，设置在第二感应线圈14和第二电路板13之间。通过导磁板10、12，不但可以提高磁通量的利用率，而且还可以避免两个感应线圈对其它器件的影响。为了进一步提高磁通量的利用率，在所述第一感应线圈11、第二感应线圈14的通孔内还可以设置导磁柱或导磁液等。
本发明中，可以在振膜8上设置通孔，所述音圈7的引线穿过该通孔与第一感应线圈11电连接。该通孔优选设置在振膜8的中部，并被第一电路板9密封起来。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组，其特征在于：包括由外壳围成的内腔，在所述内腔中设有磁路系统、振动系统，所述振动系统包括固定在内腔中的振膜(8)，在所述振膜(8)的下端固定有音圈(7)，在所述振膜(8)的上端设有第一感应线圈(11)，所述音圈(7)通过其引线与第一感应线圈(11)电连接；在所述第一感应线圈(11)的上方还对应地设有用于电连接终端装置的第二感应线圈(14)。
  2. 根据权利要求1所述的扬声器模组，其特征在于：所述第一感应线圈(11)与所述振膜(8)之间设置有第一线路板(9)；所述外壳上设置有第二电路板(13)，所述第二感应线圈(14)固定在第二电路板(13)的下端。
  3. 根据权利要求2所述的扬声器模组，其特征在于：所述第二电路板(13)固定在外壳的外侧，所述外壳上设置有供第二感应线圈(14)穿入其内腔的通孔。
  4. 根据权利要求1所述的扬声器模组，其特征在于：所述第一感应线圈(11)和第二感应线圈(14)正对设置。
  5. 根据权利要求1所述的扬声器模组，其特征在于：所述第一感应线圈(11)、第二感应线圈(14)相互背离的端面的上分别设置有导磁板(10、12)。
  6. 根据权利要求1所述的扬声器模组，其特征在于：所述振膜(8)上设有通孔，所述音圈(7)的引线穿过该通孔与第一感应线圈(11)电连接。
  7. 根据权利要求6所述的扬声器模组，其特征在于：所述通孔位于振膜(8)的中部。
  8. 根据权利要求1所述的扬声器模组，其特征在于：所述外壳包括依次扣合在一起的上壳(3)、中壳(2)、下壳(1)。
  9. 根据权利要求1所述的扬声器模组，其特征在于：所述第一感应线圈(11)、第二感应线圈(14)的通孔内设置有导磁柱或导磁液。
  10. 根据权利要求2所述的扬声器模组，其特征在于：所述第一电路板(9)为FPCB板。
PCT/CN2015/097316 2015-05-04 2015-12-14 一种扬声器模组 Ceased WO2016176997A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/570,542 US10250961B2 (en) 2015-05-04 2015-12-14 Speaker module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510221328.0A CN104796828B (zh) 2015-05-04 2015-05-04 一种扬声器模组
CN201510221328.0 2015-05-04

Publications (1)

Publication Number Publication Date
WO2016176997A1 true WO2016176997A1 (zh) 2016-11-10

Family

ID=53561271

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/097316 Ceased WO2016176997A1 (zh) 2015-05-04 2015-12-14 一种扬声器模组

Country Status (3)

Country Link
US (1) US10250961B2 (zh)
CN (1) CN104796828B (zh)
WO (1) WO2016176997A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111800714A (zh) * 2019-07-23 2020-10-20 深圳市豪恩声学股份有限公司 扬声器及电子设备
CN113810832A (zh) * 2021-09-17 2021-12-17 厦门圣德斯贵电子科技有限公司 微型扬声器
US11785393B2 (en) 2019-09-24 2023-10-10 Samsung Electronics Co., Ltd. Electronic device including speaker module
US12010500B2 (en) 2019-07-08 2024-06-11 Goertek Inc. Magnetic potential transducer and electronic apparatus using same

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104796828B (zh) 2015-05-04 2018-05-01 歌尔股份有限公司 一种扬声器模组
CN105845381A (zh) * 2016-05-09 2016-08-10 安徽恒源煤电股份有限公司 变压器结构
CN106255013B (zh) * 2016-08-18 2022-04-05 歌尔股份有限公司 一种音圈结构
CN108322874B (zh) * 2018-03-19 2019-09-17 歌尔股份有限公司 一种扬声器及电子设备
CN108882129B (zh) * 2018-09-21 2021-04-02 歌尔股份有限公司 电路板、扬声器、电子设备及偏振补偿方法
CN109246514B (zh) * 2018-09-30 2020-05-08 歌尔科技有限公司 一种无线喇叭和耳机
CN110856087B (zh) * 2019-11-25 2021-07-13 歌尔股份有限公司 扬声器和电子设备
CN110933574B (zh) * 2019-11-30 2021-06-15 捷开通讯(深圳)有限公司 一种扬声器
CN111246348B (zh) * 2020-01-20 2025-05-13 维仕科技有限公司 一种扬声器
CN111417057B (zh) * 2020-03-30 2022-03-15 歌尔股份有限公司 微型扬声器模组、微型扬声器模组阵列和视听设备
CN112218217B (zh) * 2020-11-17 2021-09-07 无锡杰夫电声股份有限公司 一种具有缓冲结构稳定性强的音圈
CN115002626B (zh) * 2021-09-23 2026-01-13 北京荣耀终端有限公司 扬声器模组的内核、扬声器模组和电子设备
CN113873407B (zh) * 2021-10-26 2025-06-27 维沃移动通信有限公司 扬声器控制方法、扬声器模组和电子设备
CN116033318B (zh) * 2021-10-27 2023-12-08 华为终端有限公司 扬声器及电子设备
CN114051198B (zh) * 2021-12-10 2024-11-05 东莞市真思电子有限公司 一种扬声器发声装置
CN116320925A (zh) * 2023-03-08 2023-06-23 维沃移动通信有限公司 电子设备
CN118540641B (zh) * 2024-07-24 2024-11-05 瑞声光电科技(常州)有限公司 电子设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001197579A (ja) * 2000-01-17 2001-07-19 Kenwood Corp イルミネーション付きスピーカー
CN201585122U (zh) * 2009-11-09 2010-09-15 瑞声声学科技(常州)有限公司 一种扬声器系统
CN102065359A (zh) * 2010-05-25 2011-05-18 瑞声声学科技(深圳)有限公司 电磁扬声器
WO2014198958A2 (en) * 2013-06-14 2014-12-18 Jaguar Land Rover Limited Speaker device
CN204442659U (zh) * 2015-03-31 2015-07-01 歌尔声学股份有限公司 一种扬声器模组
CN104768109A (zh) * 2015-03-31 2015-07-08 歌尔声学股份有限公司 一种扬声器模组
CN104796828A (zh) * 2015-05-04 2015-07-22 歌尔声学股份有限公司 一种扬声器模组
CN204559870U (zh) * 2015-05-04 2015-08-12 歌尔声学股份有限公司 一种扬声器模组

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2808578C3 (de) * 1977-03-01 1983-12-29 Seas Fabrikker A/S, 1500 Moss Elektrodynamischer Lautsprecher
GB8321810D0 (en) * 1983-08-12 1983-09-14 Linn Prod Ltd Loudspeaker with notional feedback
CN1177652C (zh) * 1998-06-29 2004-12-01 松下电器产业株式会社 电-机/声转换器及采用该转换器的电-机/声转换装置
JP2002112388A (ja) * 2000-09-25 2002-04-12 Akg Acoustics Gmbh 小型音響変換器
GB0500616D0 (en) * 2005-01-13 2005-02-23 Univ Dundee Hearing implant
EP1845750B1 (en) * 2005-03-14 2018-06-13 Panasonic Intellectual Property Management Co., Ltd. Speaker
CN201403186Y (zh) * 2009-03-13 2010-02-10 瑞声声学科技(常州)有限公司 受话器
CN103885321A (zh) * 2012-12-21 2014-06-25 鸿富锦精密工业（深圳）有限公司 具有麦克风的手表
CN203618121U (zh) * 2013-12-11 2014-05-28 歌尔声学股份有限公司 扬声器模组

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001197579A (ja) * 2000-01-17 2001-07-19 Kenwood Corp イルミネーション付きスピーカー
CN201585122U (zh) * 2009-11-09 2010-09-15 瑞声声学科技(常州)有限公司 一种扬声器系统
CN102065359A (zh) * 2010-05-25 2011-05-18 瑞声声学科技(深圳)有限公司 电磁扬声器
WO2014198958A2 (en) * 2013-06-14 2014-12-18 Jaguar Land Rover Limited Speaker device
CN204442659U (zh) * 2015-03-31 2015-07-01 歌尔声学股份有限公司 一种扬声器模组
CN104768109A (zh) * 2015-03-31 2015-07-08 歌尔声学股份有限公司 一种扬声器模组
CN104796828A (zh) * 2015-05-04 2015-07-22 歌尔声学股份有限公司 一种扬声器模组
CN204559870U (zh) * 2015-05-04 2015-08-12 歌尔声学股份有限公司 一种扬声器模组

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12010500B2 (en) 2019-07-08 2024-06-11 Goertek Inc. Magnetic potential transducer and electronic apparatus using same
CN111800714A (zh) * 2019-07-23 2020-10-20 深圳市豪恩声学股份有限公司 扬声器及电子设备
CN111800714B (zh) * 2019-07-23 2022-03-25 深圳市豪恩声学股份有限公司 扬声器及电子设备
US11785393B2 (en) 2019-09-24 2023-10-10 Samsung Electronics Co., Ltd. Electronic device including speaker module
CN113810832A (zh) * 2021-09-17 2021-12-17 厦门圣德斯贵电子科技有限公司 微型扬声器

Also Published As

Publication number Publication date
US20180152773A1 (en) 2018-05-31
CN104796828A (zh) 2015-07-22
CN104796828B (zh) 2018-05-01
US10250961B2 (en) 2019-04-02

Similar Documents

Publication Publication Date Title
WO2016176997A1 (zh) 一种扬声器模组
CN203708475U (zh) 多功能电声器件
CN106303858B (zh) 一种扬声器及终端设备
CN205622865U (zh) 扬声器单体以及扬声器模组
KR101965083B1 (ko) 스피커 모듈
US10277985B2 (en) Speaker module
CN105657614A (zh) 动圈式扬声器单体
WO2018170945A1 (zh) 动磁式扬声器
WO2021093677A1 (zh) 一种发声装置
CN105392092A (zh) 振动发声装置
US9820067B2 (en) Micro speaker with capacitors formed by conductive segmented cover and segmented diaphram
US9820069B2 (en) Micro speaker with capacitors formed by conductive segmented cover and diaphragm
WO2021098563A1 (zh) 扬声器模组及便携式电子设备
CN103096224A (zh) 动磁式扬声器
CN204465860U (zh) 体积小的磁力驱动组件及应用该磁力驱动组件的动铁单元
CN203691624U (zh) 扬声器
US9866982B2 (en) Micro speaker with capacitors formed by conductive diaphragm and segmented pole plate
CN205510389U (zh) 扬声器
CN204539453U (zh) 发声装置
CN206226706U (zh) 一种发声装置
CN204616080U (zh) 扬声器装置
CN204559870U (zh) 一种扬声器模组
US20170013378A1 (en) Micro Speaker
KR20110002043U (ko) 홀더 일체형 스피커
CN115412811B (zh) 一种发声装置及电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15891240

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 15570542

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 14.03.2018)

122 Ep: pct application non-entry in european phase

Ref document number: 15891240

Country of ref document: EP

Kind code of ref document: A1