WO2016175232A1 - Film sur support pour film électroconducteur transparent et stratifié - Google Patents

Film sur support pour film électroconducteur transparent et stratifié Download PDF

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Publication number
WO2016175232A1
WO2016175232A1 PCT/JP2016/063160 JP2016063160W WO2016175232A1 WO 2016175232 A1 WO2016175232 A1 WO 2016175232A1 JP 2016063160 W JP2016063160 W JP 2016063160W WO 2016175232 A1 WO2016175232 A1 WO 2016175232A1
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Prior art keywords
transparent conductive
film
conductive film
carrier film
layer
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PCT/JP2016/063160
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English (en)
Japanese (ja)
Inventor
真理 松本
数馬 三井
天野　立巳
Original Assignee
日東電工株式会社
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Priority claimed from JP2016086010A external-priority patent/JP6835477B2/ja
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to KR1020177024521A priority Critical patent/KR102332014B1/ko
Priority to CN201680021326.XA priority patent/CN107429132B/zh
Publication of WO2016175232A1 publication Critical patent/WO2016175232A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives

Definitions

  • the present invention relates to a carrier film for a transparent conductive film having a support and an adhesive layer. Moreover, this invention relates to the laminated body which has the said carrier film for transparent conductive films, and a transparent conductive film.
  • ITO thin films In / Sn composite oxide
  • metal thin films such as silver and copper
  • silver nanowire thin films are used as materials for transparent electrodes.
  • the thickness of the thin film substrate including the nanowire thin film tends to become thinner year by year.
  • an anti-reflection (AR) layer is provided as a functional layer on the thin film substrate including the ITO thin film to improve visibility, or a hard coat (HC) layer is provided to prevent scratches.
  • a hard coat (HC) layer is provided to prevent scratches.
  • an anti-blocking (AB) layer is provided to prevent blocking, or an oligomer prevention (OB) layer is provided to prevent white turbidity during heating.
  • a surface protective film or the like is attached to an optical member such as an ITO thin film for the purpose of preventing scratches and dirt in a processing step and a conveyance step.
  • an adhesive film for surface protection used for an optical member for example, from an adhesive that uses two types of (meth) acrylic polymers having different glass transition temperatures at a specific blending ratio and adjusts the degree of crosslinking with a crosslinking agent.
  • a surface protective sheet having a pressure-sensitive adhesive layer formed on a support see Patent Document 1), an acrylic copolymer formed from a monomer component containing specific amounts of 2-ethylhexyl acrylate and hydroxyethyl methacrylate, and a specific amount of A pressure-sensitive adhesive film (see Patent Document 2) in which a pressure-sensitive adhesive layer obtained from a pressure-sensitive adhesive solution containing a polyfunctional isocyanate crosslinking agent is provided on one side of a plastic film is known.
  • a carrier film for a transparent conductive film an adhesive containing a (meth) acrylic polymer having a glass transition temperature of ⁇ 50 ° C. or lower, an isocyanate-based crosslinking agent, and a catalyst centered on iron on at least one surface of a support.
  • a carrier film for transparent conductive film having a pressure-sensitive adhesive layer formed from an adhesive composition is known (see Patent Document 3).
  • Patent Documents 1 and 2 do not fully study the use of transparent conductive films. Therefore, when the surface protection sheet of Patent Documents 1 and 2 is used as a carrier film for a transparent conductive film, the difference in adhesive strength between the low-speed peeling and the high-speed peeling is not sufficiently reduced, and the film is broken during the peeling. In some cases, the transparent conductive film, which is an adherend, cracks.
  • Patent Document 3 although the zipping at the time of peeling from the transparent conductive film can be eliminated, the difference in adhesive force between the low speed peeling and the high speed peeling is not sufficiently small, from the viewpoint of workability, There was room for further study.
  • “Zipping” that occurs when the transparent conductive film is peeled off from the carrier film is a phenomenon in which the transparent conductive film does not peel smoothly when peeled off from the carrier film, and repeats peeling or stopping while making a crisp sound. Means.
  • the carrier film has a high adhesive strength with respect to the transparent conductive film as the adherend, if the zipping occurs, the transparent conductive film may be cracked or leave traces, which is not preferable.
  • the adhesive strength when peeled at a high speed tends to be higher than the adhesive strength when peeled at a low speed.
  • the carrier film is peeled off manually, and generally, an operator often peels off at a high speed, so that the carrier film is hardly peeled off and the workability may be inferior.
  • the film may be broken or broken during peeling. In general, such manual peeling is often performed at a constant peeling speed so that peeling is initially performed at a low speed and then gradually performed at a high speed.
  • a carrier film for a transparent conductive film having a constant adhesive force at any peeling speed has been desired.
  • the present invention can suppress the occurrence of zipping, has excellent adhesion and re-peelability to a transparent conductive film, and has a small difference in adhesive force between high-speed peeling and low-speed peeling and has excellent workability. It aims at providing the carrier film for films. Furthermore, this invention aims at providing the laminated body containing the said carrier film for transparent conductive films, and a transparent conductive film.
  • the present inventors have intensively studied to achieve the above object, and as a result, have found that the above object can be achieved by using the following carrier film for transparent conductive film, and have completed the present invention.
  • the present invention is a carrier film for a transparent conductive film having an adhesive layer on at least one side of a support,
  • the adhesive strength Q when peeled at a tensile speed of 10 m / min is 0.7 N / 50 mm or less, and the absolute value of the difference between the adhesive strength P and the adhesive strength Q is 0.2 N / 50 mm. It is related with the carrier film for transparent conductive films characterized by the following.
  • the pressure-sensitive adhesive layer polymerizes a monomer component containing an alkyl (meth) acrylate, a hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C., and a hydroxyl group-containing monomer having a glass transition temperature of the homopolymer of 50 ° C. or more. It is preferable that it is formed from the adhesive composition containing the (meth) acrylic-type polymer obtained.
  • the amount of the hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C. of the homopolymer is 10 to 17% by weight based on the total amount of the monomer components,
  • the amount of the hydroxyl group-containing monomer having a glass transition temperature of 50 ° C. or higher of the homopolymer is preferably 2 to 8% by weight based on the total amount of the monomer components.
  • the monomer component preferably further contains a carboxyl group-containing monomer, and the amount of the carboxyl group-containing monomer is preferably 0.005 to 0.10% by weight based on the total amount of the monomer component.
  • the pressure-sensitive adhesive composition further contains a crosslinking agent, and the amount of the crosslinking agent exceeds 20 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer.
  • the cross-linking agent is preferably an aliphatic polyisocyanate-based cross-linking agent, and the aliphatic polyisocyanate-based cross-linking agent more preferably contains hexamethylene diisocyanate.
  • a carrier film for a transparent conductive film having an adhesive layer on at least one side of a support is obtained by polymerizing a monomer component containing a hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C. of the homopolymer and a hydroxyl group-containing monomer having a glass transition temperature of the homopolymer of 50 ° C. or more.
  • the carrier film for transparent conductive films characterized by being formed from the adhesive composition containing a base polymer may be sufficient.
  • the present invention is a laminate having a transparent conductive film laminated on the transparent conductive film carrier film and the transparent conductive film carrier film,
  • the present invention relates to a laminate, wherein the adhesive surface of the adhesive layer of the carrier film for transparent conductive film is bonded to at least one surface of the transparent conductive film.
  • the transparent conductive film has a transparent conductive layer and a transparent substrate
  • the adhesive surface of the adhesive layer of the said carrier film for transparent conductive films is affixed on the surface on the opposite side to the surface which contacts the said transparent conductive layer of the said transparent base material is mentioned.
  • the transparent conductive film has a transparent conductive layer and a transparent substrate, and further has a functional layer on the surface of the transparent substrate opposite to the surface in contact with the transparent conductive layer. And The thing by which the adhesive surface of the adhesive layer of the said carrier film for transparent conductive films is affixed on the surface on the opposite side to the surface which contacts the said transparent base material of the said functional layer is mentioned.
  • the carrier film for transparent conductive film of the present invention can suppress the occurrence of zipping, has excellent adhesion and re-peelability to the transparent conductive film, and has a small difference in adhesive force between high-speed peeling and low-speed peeling. Excellent. Furthermore, this invention can provide the laminated body containing the said carrier film for transparent conductive films, and a transparent conductive film.
  • the transparent conductive film as an adherend is not wrinkled or scratched, and the shape of the transparent conductive film is maintained. Can do.
  • the carrier film 3 for transparent conductive film of the present invention has a pressure-sensitive adhesive layer 1 on at least one surface of a support 2, and the surface of the pressure-sensitive adhesive layer 1 that contacts the support 2. It has an adhesive surface A on the opposite side.
  • the adhesive surface A is formed on the surface of the transparent substrate 5 (transparent substrate) constituting the transparent conductive film. 5 where the transparent conductive layer 4 does not exist), and when the transparent conductive film as the adherend is the transparent conductive film 8 with a functional layer as shown in FIG. It is a surface that contacts the functional layer 7.
  • the laminated body 9 of this invention mentioned later contains the carrier film 3 for transparent conductive films, and the transparent conductive film 6 (or transparent conductive film 8 with a functional layer) as shown in FIG.
  • the carrier film for transparent conductive film of the present invention is heated at 140 ° C. for 90 minutes in a state where the pressure-sensitive adhesive layer of the carrier film is bonded to an adherend, and then the carrier film is pulled from the adherend at a tensile rate of 0.
  • the adhesive strength P when peeled at 3 m / min and the adhesive strength Q when peeled at a tensile speed of 10 m / min are both 0.7 N / 50 mm or less, and the adhesive strength P and the adhesive strength Q
  • the absolute value of the difference is 0.2 N / 50 mm or less.
  • the adhesive strength P is 0.7 N / 50 mm or less, preferably 0.6 N / 50 mm or less, and more preferably 0.5 N / 50 mm or less.
  • the lower limit value of the adhesive strength P is not particularly limited, but is preferably 0.1 N / 50 mm or more from the viewpoint of the adhesive strength with respect to the transparent conductive film as the adherend.
  • the adhesive force when peeled at a tensile speed of 0.3 m / min is in the above range, so that zipping does not occur even when the carrier film for transparent conductive film is peeled off from the transparent conductive film at a low speed, This is preferable because of excellent balance between adhesion and removability.
  • the adhesive strength Q is 0.7 N / 50 mm or less, preferably 0.6 N / 50 mm or less, and more preferably 0.5 N / 50 mm or less.
  • the lower limit value of the adhesive strength Q is not particularly limited, but is preferably 0.1 N / 50 mm or more from the viewpoint of the adhesive strength with respect to the transparent conductive film as the adherend.
  • the absolute value of the difference between the adhesive strength P and the adhesive strength Q is 0.2 N / 50 mm or less, preferably 0.15 N / 50 mm or less, more preferably 0.1 N / 50 mm or less, 0 .05 N / 50 mm or less is particularly preferable.
  • the lower limit of the absolute value of the difference between the adhesive force P and the adhesive force Q is not particularly limited, and the smaller the smaller the better, the more ideally there is no difference (0 N / 50 mm). . If the absolute value of the difference between the adhesive strength P and the adhesive strength Q exceeds 0.2 N / 50 mm, the film may be broken during the peeling or transparent when the carrier film for transparent conductive film is peeled off from the transparent conductive film.
  • a crack may enter the conductive layer.
  • the absolute value of the difference between the adhesive force P and the adhesive force Q is within the above range, so that the peeling is performed like a manual peeling operation (usually peeling at low speed at the beginning and gradually approaching high speed peeling). Even in the case where the speed is not constant, the film is not broken during the peeling or the transparent conductive layer is cracked, and therefore, the releasability of the carrier film for transparent conductive film is excellent, which is preferable.
  • the “adhered body” at the time of measuring the adhesive force is a transparent conductive film, and when the transparent conductive film does not have a functional layer, the adherend surface is a transparent substrate constituting the transparent conductive film. When the transparent conductive film has a functional layer, the adherend surface is the surface of the functional layer.
  • the carrier film for transparent conductive film of the present invention is not particularly limited as long as it has an adhesive layer on at least one surface of the support and has the above-mentioned adhesive force, and the adhesive composition is not particularly limited. The composition will be described.
  • the pressure-sensitive adhesive layer in the present invention is not particularly limited, and may be acrylic, synthetic rubber-based, rubber-based, silicone-based, etc. From the viewpoint of properties and the like, an acrylic pressure-sensitive adhesive having a (meth) acrylic polymer as a base polymer is preferable.
  • the (meth) acrylic polymer used as the base polymer of the acrylic pressure-sensitive adhesive is obtained by polymerizing a monomer component containing an alkyl (meth) acrylate, and the glass transition temperature of the alkyl (meth) acrylate and homopolymer is 50.
  • alkyl (meth) acrylate for example, those having an alkyl group having 2 to 14 carbon atoms can be used.
  • main monomer component of the alkyl (meth) acrylate an alkyl group having 4 to 14 carbon atoms can be used. Certain alkyl (meth) acrylates are preferred, alkyl (meth) acrylates having 6 to 14 carbon atoms are more preferred, and alkyl (meth) acrylates having 6 to 9 carbon atoms are particularly preferred.
  • the main monomer is 50% by weight or more, more preferably 60% by weight or more, and still more preferably 80% by weight or more based on the total amount of “alkyl (meth) acrylate” contained in the monomer component. Particularly preferably 100% by weight.
  • alkyl (meth) acrylate having an alkyl group having 2 to 14 carbon atoms examples include ethyl (meth) acrylate, n-butyl (meth) acrylate (BA), t-butyl (meth) acrylate, isobutyl (meth) ) Acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate (2EHA), n-octyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, n -Decyl (meth) acrylate, isodecyl (meth) acrylate, n-dodecyl (meth) acrylate, n-tridecyl (meth) acrylate, n-tetradecyl (meth)
  • Te n-butyl (meth) acrylate (BA) and 2-ethylhexyl (meth) acrylate (2EHA) are preferable, and 2-ethylhexyl (meth) acrylate (2EHA) is particularly preferable.
  • the alkyl (meth) acrylate having an alkyl group having 6 to 14 carbon atoms is preferably used, and the alkyl having an alkyl group having 6 to 14 carbon atoms (
  • the (meth) acrylate is preferably 50% by weight or more, more preferably 60% by weight or more, still more preferably 80% by weight or more, and particularly preferably 90% by weight or more based on the total amount of the alkyl (meth) acrylate.
  • the content of the alkyl (meth) acrylate is preferably 65% by weight in the monomer component, more preferably 75% by weight or more, and further preferably 80% by weight or more.
  • the homopolymer has a glass transition temperature of less than 50 ° C. and has an unsaturated double bond such as a (meth) acryloyl group or a vinyl group. And those having a functional group and having a hydroxyl group.
  • 2-hydroxyethyl acrylate (homopolymer Tg: ⁇ 15 ° C.), 2-hydroxypropyl methacrylate (homopolymer Tg: 26 ° C.), 2-hydroxypropyl acrylate (homopolymer Tg: ⁇ 7 ° C.) ), 4-hydroxybutyl acrylate (homopolymer Tg: ⁇ 32 ° C.), etc., hydroxyalkyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl acrylate (homopolymer Tg: 17 ° C.), 1,4-cyclohexane (Meth) acrylate having a cyclic structure such as dimethanol monoacrylate (homopolymer Tg: 18 ° C.), polyethylene glycol monoacrylate (number of moles of ethylene glycol: 10, homopolymer Tg: ⁇ 64 ° C.), polypropylene glycol mono Accel Relay (Meth) acrylates having an alkylene oxide structure such as propylene
  • the glass transition temperature of the homopolymer of the hydroxyl group-containing monomer may be less than 50 ° C., for example, preferably 30 ° C. or less, more preferably ⁇ 40 to 30 ° C., and ⁇ 40 to 0 More preferably, the temperature is C.
  • the content of the hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C. of the homopolymer is preferably 10 to 17% by weight, more preferably 10 to 15% by weight, based on the total amount of the monomer components. More preferably, it is ⁇ 14% by weight.
  • the content ratio of the hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C. of the homopolymer is less than 10% by weight, the number of reaction points is small, so that the crosslinking density is lowered and the adhesive strength tends to be increased. In that case, since the removability with respect to a transparent conductive film will fall, it is unpreferable.
  • hydroxyl group-containing monomer having a glass transition temperature of 50 ° C. or higher of the homopolymer a polymer having an unsaturated double bond such as a (meth) acryloyl group or a vinyl group having a glass transition temperature of the homopolymer of 50 ° C. or higher. And those having a functional group and having a hydroxyl group.
  • 2-hydroxyethyl methacrylate (homopolymer Tg: 55 ° C.), N-methylolacrylamide (homopolymer Tg: 110 ° C.), N- (2-hydroxyethyl) acrylamide (homopolymer Tg: 98) ° C) and the like, and these can be used alone or in combination of two or more.
  • 2-hydroxyethyl methacrylate (homopolymer Tg: 55 ° C.) is preferable from the viewpoint that zipping can be suppressed.
  • the glass transition temperature of the homopolymer of the hydroxyl group-containing monomer may be 50 ° C. or more, but is preferably 50 to 150 ° C., more preferably 50 to 100 ° C., and more preferably 50 to 90 ° C. More preferably.
  • the content of the hydroxyl group-containing monomer having a glass transition temperature of 50 ° C. or higher in the homopolymer is preferably 2 to 8% by weight, more preferably 3 to 6% by weight, based on the total amount of the monomer components.
  • the content ratio of the hydroxyl group-containing monomer having a glass transition temperature of 50 ° C. or higher of the homopolymer is less than 2% by weight, the adhesive force at high-speed peeling tends to be difficult to decrease. There is a tendency that the adhesive strength of the resin tends to decrease too much, which is not preferable.
  • the monomer component may contain other polymerizable monomer other than the alkyl (meth) acrylate and the hydroxyl group-containing monomer.
  • the polymerizable monomer for adjusting the glass transition point and peelability of a (meth) acrylic-type polymer etc. can be used in the range which does not impair the effect of this invention.
  • Other polymerizable monomers may be used alone or in combination, but the blending amount of the other polymerizable monomer is preferably 10% by weight or less, preferably 5% by weight or less based on the total amount of the monomer components. Is more preferable.
  • Examples of the polymerizable monomer include carboxyl group-containing monomers.
  • the carboxyl group-containing monomer can be used from the viewpoint that the crosslinking reaction can be carried out more efficiently and the adhesive force at high speed peeling can be lowered.
  • Examples of the carboxyl group-containing monomer include those having a polymerizable functional group having an unsaturated double bond such as a (meth) acryloyl group or a vinyl group, and containing a carboxyl group. (Meth) acrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid and the like.
  • acrylic acid is preferred from the viewpoints of polymerizability, cohesiveness, cost, and versatility.
  • the content of the carboxyl group-containing monomer is preferably 0.005 to 0.10% by weight, more preferably 0.005 to 0.05% by weight, based on the total amount of the monomer components. It is preferable that the content of the carboxyl group-containing monomer is in the above-mentioned range since there is an effect of reducing the adhesive strength at high speed peeling.
  • Examples of the other polymerizable monomers include components for improving cohesion and heat resistance such as sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, cyano group-containing monomers, vinyl ester monomers, aromatic vinyl monomers, and acid anhydrides.
  • a monomer component having a functional group that functions as a crosslinking point such as a group-containing monomer, an amide group-containing monomer, an amino group-containing monomer, an epoxy group-containing monomer, N-acryloylmorpholine, or a vinyl ether monomer, can be used as appropriate.
  • These monomer components may be used alone or in admixture of two or more.
  • Examples of the acid anhydride group-containing monomer include maleic anhydride and itaconic anhydride.
  • sulfonic acid group-containing monomer examples include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth) ) Acrylyloxynaphthalene sulfonic acid and the like.
  • Examples of the phosphoric acid group-containing monomer include 2-hydroxyethylacryloyl phosphate, 2- (phosphonooxy) ethyl methacrylate, 3-chloro-2- (phosphonooxy) propyl methacrylate, and the like.
  • Examples of the cyano group-containing monomer include acrylonitrile.
  • vinyl ester monomer examples include vinyl acetate, vinyl propionate, vinyl laurate, and the like.
  • aromatic vinyl monomer examples include styrene, chlorostyrene, chloromethylstyrene, ⁇ -methylstyrene, and the like.
  • amide group-containing monomer examples include acrylamide and diethyl acrylamide.
  • amino group-containing monomer examples include N, N-dimethylaminoethyl (meth) acrylate, N, N-dimethylaminopropyl (meth) acrylate, and the like.
  • epoxy group-containing monomer examples include glycidyl (meth) acrylate and allyl glycidyl ether.
  • vinyl ether monomer examples include methyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, and the like.
  • the (meth) acrylic polymer used in the present invention is obtained by polymerizing the monomer components, and the polymerization method is not particularly limited, and is solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization. Polymerization can be performed by a known method such as turbid polymerization, and solution polymerization is more preferable from the viewpoint of workability and the like.
  • the obtained polymer may be any of homopolymer, random copolymer, block copolymer and the like.
  • the (meth) acrylic polymer used in the present invention preferably has a weight average molecular weight of 300,000 to 5,000,000, more preferably 400,000 to 2,000,000, particularly preferably 500,000 to 1,000,000.
  • the weight average molecular weight is less than 300,000, the adhesive strength at the time of peeling increases due to the improvement of wettability to the transparent conductive film that is the adherend (with functional layer). This may cause damage to the adherend, and the adhesive force tends to be generated due to the reduced cohesive force of the pressure-sensitive adhesive layer.
  • a weight average molecular weight means what was obtained by measuring by GPC (gel permeation chromatography).
  • the glass transition temperature (Tg) of the (meth) acrylic polymer is preferably 0 ° C. or lower (usually ⁇ 100 ° C. or higher, and preferably ⁇ 70 ° C. or higher) for easy balance of adhesive performance. -10 ° C or lower is more preferable, -20 ° C or lower is further preferable, and -30 ° C or lower is particularly preferable.
  • the glass transition temperature is higher than 0 ° C., the polymer is difficult to flow, and the transparent conductive film as the adherend is not sufficiently wetted with the transparent base material, and the gap between the adherend and the adhesive layer of the carrier film Tend to cause blisters to occur.
  • the glass transition temperature (Tg) of a (meth) acrylic-type polymer can be adjusted in the said range by changing the monomer component and composition ratio to be used suitably.
  • a crosslinking agent to the pressure-sensitive adhesive composition used in the present invention.
  • a crosslinking agent an isocyanate compound, an epoxy compound, a melamine resin, an aziridine derivative, a metal chelate compound, or the like is used.
  • an isocyanate compound is particularly preferably used mainly from the viewpoint of obtaining an appropriate cohesive force. These compounds may be used alone or in combination of two or more.
  • Examples of the isocyanate compound include compounds having at least two isocyanate groups.
  • aliphatic polyisocyanates, alicyclic polyisocyanates, aromatic polyisocyanates and the like are generally used.
  • aliphatic polyisocyanates can be preferably used from the viewpoint of zipping suppression and adhesive strength, but alicyclic polyisocyanates and aromatic polyisocyanates are not used from the viewpoint of zipping suppression and adhesive strength. preferable.
  • aliphatic polyisocyanate examples include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene diisocyanate, 2,4,4-trimethyl.
  • trimethylene diisocyanate tetramethylene diisocyanate
  • hexamethylene diisocyanate pentamethylene diisocyanate
  • 1,2-propylene diisocyanate 1,3-butylene diisocyanate
  • dodecamethylene diisocyanate 2,4,4-trimethyl.
  • Hexamethylene diisocyanate and the like can be mentioned, and among these, aliphatic polyisocyanates containing hexamethylene diisocyanate are preferable from the viewpoints of suppression of zipping and adhesive strength.
  • isocyanate crosslinking agents examples include trade names “Coronate HL” and “Coronate HX” (manufactured by Nippon Polyurethane Industry Co., Ltd.); trade names “Takenate D-160N” and “Takenate D-165N”. "Takenate D-170HN”, “Takenate D-178N” (above, manufactured by Mitsui Chemicals, Inc.) and the like. These compounds may be used alone or in combination of two or more.
  • the amount of the isocyanate-based crosslinking agent is preferably more than 20 parts by weight, more preferably more than 20 parts by weight and not more than 30 parts by weight based on 100 parts by weight of the (meth) acrylic polymer.
  • the amount is more preferably 21 to 25 parts by weight, and particularly preferably 22 to 24 parts by weight.
  • an appropriate adhesive strength can be expressed by high-speed peeling and low-speed peeling, and the difference in adhesive strength between high-speed peeling and low-speed peeling can be reduced.
  • the isocyanate crosslinking agent is added in an amount of 0.89 to 1.22 in terms of an OH / NCO equivalent ratio with respect to the hydroxyl group of the (meth) acrylic polymer. It is more preferable to add in an amount of .95 to 1.14.
  • isocyanate-based crosslinking agents may be used alone or in combination of two or more, and a bifunctional isocyanate compound and a trifunctional or higher isocyanate compound may be used in combination.
  • Examples of the epoxy compound include N, N, N ′, N′-tetraglycidyl-m-xylenediamine (trade name: TETRAD-X, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane (trade name: TETRAD-C, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and the like. These compounds may be used alone or in combination of two or more.
  • Examples of the melamine resin include hexamethylol melamine.
  • an aziridine derivative for example, a trade name HDU (manufactured by Mutual Yakuko Co., Ltd.), a brand name TAZM (manufactured by Mutual Yakuko Co., Ltd.), a brand name TAZO (manufactured by Mutual Yakuko Co., Ltd.), etc. Is mentioned. These compounds may be used alone or in combination of two or more.
  • metal chelate compound examples include aluminum, titanium, nickel, zirconium and the like as the metal component, and acetylene, methyl acetoacetate, ethyl acetoacetate, ethyl lactate, acetylacetone and the like as the chelate component. These compounds may be used alone or in combination.
  • the amount used is not particularly limited as long as the effects of the present invention are not impaired, but the total amount of the isocyanate crosslinking agent is 100 parts by weight of the (meth) acrylic polymer. It is preferable to use in an amount exceeding 20 parts by weight and the ratio of the isocyanate-based crosslinking agent in the total amount of the crosslinking agent is in the range of 50% by weight or more, further 70% by weight or more, and further 90% by weight or more.
  • the pressure-sensitive adhesive composition of the present invention may contain a polyfunctional monomer having two or more radiation-reactive unsaturated bonds in addition to the (meth) acrylic polymer.
  • the polyfunctional monomer can be used as a monomer component when preparing the (meth) acrylic polymer.
  • the (meth) acrylic polymer is crosslinked by irradiating radiation or the like.
  • a polyfunctional monomer having two or more radiation-reactive unsaturated bonds in one molecule for example, it can be crosslinked (cured) by irradiation with radiation such as a vinyl group, an acryloyl group, a methacryloyl group, or a vinylbenzyl group.
  • a polyfunctional monomer having two or more kinds of radiation reactivity of one kind or two kinds or more can be mentioned.
  • the polyfunctional monomer generally, those having 10 or less radiation-reactive unsaturated bonds are preferably used. These compounds may be used alone or in combination of two or more.
  • polyfunctional monomer examples include, for example, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and 1,6 hexane.
  • examples include diol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, divinylbenzene, and N, N′-methylenebisacrylamide.
  • the blending amount of the polyfunctional monomer is preferably 30 parts by weight or less with respect to 100 parts by weight (solid content) of the (meth) acrylic polymer.
  • Examples of the radiation include ultraviolet rays, laser rays, ⁇ rays, ⁇ rays, ⁇ rays, X rays, electron rays, and the like, and ultraviolet rays are preferably used from the viewpoints of controllability, good handleability, and cost. More preferably, ultraviolet rays having a wavelength of 200 to 400 nm are used. Ultraviolet rays can be irradiated using an appropriate light source such as a high-pressure mercury lamp, a microwave excitation lamp, or a chemical lamp. In addition, when using an ultraviolet-ray as a radiation, a photoinitiator is mix
  • the photopolymerization initiator may be any substance that generates radicals or cations by irradiating ultraviolet rays having an appropriate wavelength that can trigger the polymerization reaction according to the type of the radiation-reactive component.
  • radical photopolymerization initiators for example, benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, methyl o-benzoylbenzoate-p-benzoin ethyl ether, benzoin isopropyl ether, ⁇ -methylbenzoin, benzyl dimethyl ketal, trichloro Acetophenones such as acetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methylpropiophenone, 2-hydroxy-4'-isopropyl-2-methylpropiophenone, etc.
  • benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, methyl o-benzoylbenzoate-p-benzoin ethyl ether, benzoin isopropyl ether, ⁇ -methylbenzoin, benzyl dimethyl
  • Propiophenones benzophenone, methylbenzophenone, p-chlorobenzophenone, benzophenones such as p-dimethylaminobenzophenone, 2-chlorothioxanthone, 2-ethyl Thioxanthones such as oxanthone and 2-isopropylthioxanthone, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, (2,4,6-trimethylbenzoyl)- Examples include acylphosphine oxides such as (ethoxy) -phenylphosphine oxide, benzyl, dibenzosuberone, ⁇ -acyloxime ester, and the like. These compounds may be used alone or in combination of two or more.
  • Examples of the cationic photopolymerization initiator include onium salts such as aromatic diazonium salts, aromatic iodonium salts, aromatic sulfonium salts, organometallic complexes such as iron-allene complexes, titanocene complexes, and arylsilanol-aluminum complexes, nitro Examples thereof include benzyl ester, sulfonic acid derivative, phosphoric acid ester, phosphoric acid ester, phenol sulfonic acid ester, diazonaphthoquinone, and N-hydroxyimide sulfonate. These compounds may be used alone or in combination of two or more.
  • the photopolymerization initiator is usually added in an amount of 0.1 to 10 parts by weight and preferably 0.2 to 7 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer.
  • a photoinitiated polymerization aid such as amines in combination.
  • the photoinitiator aid include 2-dimethylaminoethyl benzoate, dimethylaminoacetophenone, p-dimethylaminobenzoic acid ethyl ester, p-dimethylaminobenzoic acid isoamyl ester, and the like. These compounds may be used alone or in combination of two or more.
  • the polymerization initiation assistant is preferably added in an amount of 0.05 to 10 parts by weight, more preferably 0.1 to 7 parts by weight, based on 100 parts by weight of the (meth) acrylic polymer.
  • a catalyst can be added to the pressure-sensitive adhesive composition used in the present invention.
  • the type of the catalyst is not particularly limited, and a catalyst known in this field such as a tin catalyst can be used, but it is preferable to use a tin catalyst. Moreover, in this invention, it is preferable not to contain the catalyst which uses iron as an active center.
  • tin catalyst examples include dioctyltin dilaurate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin dioctate, dibutyltin diolate, diphenyltin diacetate, dibutyltin oxide, dibutyltin dimethoxide, dibutylbis (triethoxysiloxy) tin, dibutyltin benzyl Malate, dioctyltin diacetate, etc. can be mentioned, These can be used individually or in mixture of 2 or more types. Among these, dioctyltin dilaurate is preferable.
  • the amount of the catalyst added is not particularly limited, but for example, it is preferably about 0.001 to 0.5 parts by weight with respect to 100 parts by weight of the acrylic polymer.
  • the pressure-sensitive adhesive composition used in the present invention may contain other known additives, such as powders such as colorants and pigments, surfactants, plasticizers, and tackifiers.
  • powders such as colorants and pigments, surfactants, plasticizers, and tackifiers.
  • powders such as colorants and pigments, surfactants, plasticizers, and tackifiers.
  • leveling agent such as antioxidant, corrosion inhibitor, light stabilizer, UV absorber, polymerization inhibitor, silane coupling agent, inorganic or organic filler, metal powder, particulate
  • blend suitably according to the use which uses a foil-like thing.
  • the solid content of the pressure-sensitive adhesive composition is not particularly limited, and is preferably 20% by weight or more, and more preferably 30% by weight or more.
  • the pressure-sensitive adhesive layer used in the present invention is formed from the pressure-sensitive adhesive composition as described above.
  • the carrier film for transparent conductive films (with a functional layer) of this invention forms such an adhesive layer on a support body (a base material, a base material layer).
  • the crosslinking of the (meth) acrylic polymer is generally performed after the application of the pressure-sensitive adhesive composition, but the pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition after crosslinking may be transferred to a support or the like. Is possible.
  • a method for forming the pressure-sensitive adhesive layer on the support is not particularly limited.
  • the pressure-sensitive adhesive composition is applied to the support (for example, as a solid content). 20% by weight or more, and more preferably 30% by weight or more), and the pressure-sensitive adhesive layer is formed on the support by drying and removing the polymerization solvent and the like. Thereafter, curing may be performed for the purpose of adjusting the component transfer of the pressure-sensitive adhesive layer, adjusting the crosslinking reaction, and the like.
  • the pressure-sensitive adhesive composition when the pressure-sensitive adhesive composition is applied on a support to produce a carrier film for a transparent conductive film, the pressure-sensitive adhesive composition is a kind other than the polymerization solvent so that it can be uniformly applied on the support.
  • the above solvent may be newly added.
  • a known method used for manufacturing a pressure-sensitive adhesive tape or the like is used as a method for applying the pressure-sensitive adhesive composition. Specifically, for example, roll coating, gravure coating, reverse coating, roll brushing, spray coating, air knife coating and the like can be mentioned.
  • the drying conditions for drying the pressure-sensitive adhesive composition applied to the support can be appropriately determined depending on the composition, concentration, type of solvent in the composition, etc., and are not particularly limited. However, it can be dried at 80 to 200 ° C. for about 10 seconds to 30 minutes.
  • the pressure-sensitive adhesive layer is applied by light irradiation after coating on one side or both sides of the support (base material, base material layer).
  • the pressure-sensitive adhesive layer is obtained by photopolymerization by irradiating an ultraviolet ray having an illuminance of 1 to 200 mW / cm 2 at a wavelength of 300 to 400 nm with a light amount of about 400 to 4000 mJ / cm 2 .
  • the thickness of the pressure-sensitive adhesive layer of the carrier film for transparent conductive film of the present invention is preferably 5 to 50 ⁇ m, more preferably 10 to 30 ⁇ m. Within the above range, the balance between adhesion and removability is excellent and a preferred embodiment is obtained.
  • the pressure-sensitive adhesive layer is formed on at least one surface of a support (base material layer) used in the present invention by coating or the like to form a film, sheet, tape or the like.
  • the support (base material) (2 in FIG. 1) constituting the carrier film for transparent conductive film of the present invention is not particularly limited.
  • a paper-based support such as paper; Non-woven fabrics, nets and other fiber-based supports (the raw materials are not particularly limited, for example, Manila hemp, rayon, polyester, pulp fibers, etc. can be selected as appropriate); metal-based supports such as metal foils and metal plates Body; Plastic support such as plastic film or sheet; Rubber support such as rubber sheet; Foam such as foam sheet or laminate thereof (for example, lamination of plastic support and other support)
  • a suitable thin leaf body such as a body or a laminate of plastic films (or sheets) can be used.
  • ⁇ -olefin such as polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) is used as a monomer component.
  • Olefin resins Polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT); polycarbonate resins; polyvinyl chloride (PVC); vinyl acetate resins; polyphenylene sulfide (PPS) Amide resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); polyimide resins; polyolefin resins having a cyclic or norbornene structure; polyether ether ketone (PEEK) It is. These materials can be used alone or in combination of two or more. Among these, the polyester-based resin has toughness, workability, transparency, and the like, and therefore, by using it as a carrier film for a transparent conductive film, workability and testability are improved. This is a more preferable embodiment.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PBT polybutylene terephthalate
  • PVC
  • the polyester resin is not particularly limited as long as it can be formed into a sheet shape or a film shape, and examples thereof include polyester films such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate. . These polyester resins may be used alone (homopolymer), or two or more kinds may be mixed and polymerized (copolymers, etc.).
  • PET polyethylene terephthalate
  • polyethylene terephthalate since it is used as a carrier film for a transparent conductive film, polyethylene terephthalate is preferably used as a support. By using polyethylene terephthalate, it becomes a carrier film for a transparent conductive film excellent in toughness, workability, and transparency, and workability is improved, which is a preferred embodiment.
  • the thickness of the support is generally 25 to 300 ⁇ m, preferably 75 to 200 ⁇ m, more preferably 80 to 140 ⁇ m, and particularly preferably 90 to 130 ⁇ m.
  • the transparent conductive film carrier film is attached to a transparent conductive film (with a functional layer) and used to maintain the shape of the transparent conductive film that is flexible and flexible. This is useful because it can prevent the occurrence of defects such as wrinkles and scratches in the processing step and the conveying step.
  • the support may include a silicone-based, fluorine-based, long-chain alkyl-based or fatty acid amide-based release agent, release with a silica powder, antifouling treatment, acid treatment, alkali treatment, primer, if necessary.
  • Anti-adhesive treatment such as treatment, corona treatment, plasma treatment, ultraviolet treatment, coating type, kneading type, vapor deposition type, etc. can also be performed.
  • the surface of the support may be subjected to corona treatment or the like. Moreover, you may perform a back surface process to a support body.
  • the carrier film for a transparent conductive film (with a functional layer) of the present invention is a silicone-based, fluorine-based, long-chain alkyl-based, or fatty acid amide-based release agent on the pressure-sensitive adhesive surface for the purpose of protecting the pressure-sensitive adhesive surface as necessary. It is possible to bond a separator treated with an agent.
  • the substrate constituting the separator there are paper and plastic film, but a plastic film is preferably used from the viewpoint of excellent surface smoothness.
  • the film is not particularly limited as long as it can protect the pressure-sensitive adhesive layer, and for example, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, a vinyl chloride copolymer.
  • a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, a vinyl chloride copolymer examples thereof include a coalesced film, a polyethylene terephthalate film, a polybutylene terephthalate film, a polyurethane film, and an ethylene-vinyl acetate copolymer film.
  • the support for the separator may be subjected to anti-static treatment such as alkali treatment, primer treatment, corona treatment, plasma treatment, ultraviolet treatment, coating type, kneading type, vapor deposition type, etc., if necessary. It can also be processed. In particular, when an antistatic treatment is performed, it is preferable to provide an antistatic treatment layer between the support and the release agent.
  • anti-static treatment such as alkali treatment, primer treatment, corona treatment, plasma treatment, ultraviolet treatment, coating type, kneading type, vapor deposition type, etc.
  • Transparent conductive film 6 can mention the film which has the transparent conductive layer 4 and the transparent base material 5, as shown in FIG.
  • the transparent substrate 5 examples include a resin film and a substrate made of glass or the like (for example, a sheet-like, film-like, or plate-like substrate (member)). In particular, a resin film can be mentioned. .
  • the thickness of the transparent substrate 5 is not particularly limited, but is preferably about 10 to 200 ⁇ m, more preferably about 15 to 150 ⁇ m.
  • the material of the resin film is not particularly limited, and various plastic materials having transparency can be mentioned.
  • the materials include polyester resins such as polyethylene terephthalate and polyethylene naphthalate, acetate resins, polyethersulfone resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth) acrylic resins.
  • polyester resins, polyimide resins and polyethersulfone resins are particularly preferable.
  • the transparent base material 5 is subjected to an etching process such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical conversion, oxidation, or undercoating treatment on the surface in advance, and the transparent conductive layer 4 provided thereon. You may make it improve the adhesiveness with respect to the said transparent base materials 5, such as. Further, before the transparent conductive layer 4 is provided, dust may be removed and cleaned by solvent cleaning, ultrasonic cleaning, or the like, if necessary.
  • an etching process such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical conversion, oxidation, or undercoating treatment on the surface in advance, and the transparent conductive layer 4 provided thereon. You may make it improve the adhesiveness with respect to the said transparent base materials 5, such as. Further, before the transparent conductive layer 4 is provided, dust may be removed and cleaned by solvent cleaning, ultrasonic cleaning, or the like, if necessary.
  • the constituent material of the transparent conductive layer 4 is not particularly limited, and is selected from the group consisting of indium, tin, zinc, gallium, antimony, titanium, silicon, zirconium, magnesium, aluminum, gold, silver, copper, palladium, tungsten.
  • a metal oxide of at least one metal is used.
  • the metal oxide may further contain a metal atom shown in the above group, if necessary.
  • indium oxide (ITO) containing tin oxide, tin oxide containing antimony, or the like is preferably used, and ITO is particularly preferably used.
  • ITO preferably contains 80 to 99% by weight of indium oxide and 1 to 20% by weight of tin oxide.
  • the thickness of the transparent conductive layer 4 is not particularly limited, but is preferably 10 to 300 nm, and more preferably 15 to 100 nm.
  • the method for forming the transparent conductive layer 4 is not particularly limited, and a conventionally known method can be employed. Specifically, for example, a vacuum deposition method, a sputtering method, and an ion plating method can be exemplified. In addition, an appropriate method can be adopted depending on the required film thickness.
  • an undercoat layer, an oligomer prevention layer, etc. can be provided between the transparent conductive layer 4 and the transparent base material 5 as necessary.
  • the transparent conductive film 6 having the transparent conductive layer 4 can be used as a substrate for optical devices (optical member).
  • the substrate for an optical device is not particularly limited as long as it is a substrate having optical characteristics.
  • a display device liquid crystal display device, organic EL (electroluminescence) display device, PDP (plasma display panel), electronic Paper, etc.
  • base materials members constituting devices such as input devices (touch panels, etc.) or base materials (members) used in these devices.
  • These substrate materials for optical devices have become stiff due to the recent trend of thinning, and have been prone to bend and deform in shape during processing and transporting processes.
  • a shape can be hold
  • a functional layer 7 can be provided on the surface of the transparent conductive film 6 where the transparent conductive layer 5 is not provided.
  • Examples of the functional layer include an antiglare treatment (AG) layer, an antireflection (AR) layer, a hard coat (HC), and an antiblocking (AB) layer for the purpose of improving visibility.
  • AG antiglare treatment
  • AR antireflection
  • HC hard coat
  • AB antiblocking
  • the constituent material of the antiglare treatment layer is not particularly limited, and for example, an ionizing radiation curable resin, a thermosetting resin, a thermoplastic resin, or the like can be used.
  • the thickness of the antiglare treatment layer is preferably from 0.1 to 30 ⁇ m.
  • titanium oxide, zirconium oxide, silicon oxide, magnesium fluoride, or the like is used.
  • the antireflection layer can be provided with a plurality of layers.
  • the material for forming the hard coat (HC) layer for example, a cured film made of a curable resin such as a melamine resin, a urethane resin, an alkyd resin, an acrylic resin, or a silicone resin is preferably used.
  • the thickness of the hard coat layer is preferably from 0.1 to 30 ⁇ m. The thickness is preferably 0.1 ⁇ m or more for imparting hardness.
  • the antiglare treatment layer, the antireflection layer, and the antiblocking layer can be provided on the hard coat layer. Further, a hard coat layer having an antiglare function, an antireflection function, an antiblocking function, and an oligomer prevention function can be used.
  • a curable resin layer containing fine particles, a curable resin composition using a coating composition containing two or more components that are phase-separated, or a combination thereof are used.
  • those having irregularities formed on the surface are preferably used.
  • the component of the curable resin layer include a thermosetting resin, an ultraviolet curable resin, and an electron beam curable resin.
  • a coating composition containing 2 or more types of components which phase-separate the composition as described in the international publication 2005/073763 pamphlet can be used suitably, for example.
  • the thickness of the anti-blocking layer is preferably 0.1 to 30 ⁇ m.
  • the thickness of the transparent conductive film with a functional layer is preferably 210 ⁇ m or less, and more preferably 150 ⁇ m or less.
  • this invention is the laminated body 9 which has the transparent conductive film 6 laminated
  • the carrier film for transparent conductive film 3 is a carrier film for transparent conductive film described in the present specification,
  • the transparent conductive film 6 has a transparent conductive layer 4 and a transparent substrate 5,
  • the adhesive surface of the adhesive layer 1 of the carrier film 3 for transparent conductive film is bonded to the surface of the transparent substrate 5 opposite to the surface that contacts the transparent conductive layer 4.
  • the laminated body 9 for example, FIG. 2).
  • the present invention is a laminate having a transparent conductive film carrier film 3 and a transparent conductive film 6 laminated on the transparent conductive film carrier film 3,
  • the carrier film for transparent conductive film 3 is a carrier film for transparent conductive film described in the present specification
  • the transparent conductive film 3 has a transparent conductive layer 4 and a transparent substrate 5, and further has a functional layer 7 on the surface of the transparent substrate opposite to the surface in contact with the transparent conductive layer,
  • a laminate in which the adhesive surface of the adhesive layer 1 of the carrier film 3 for transparent conductive film is bonded to the surface of the functional layer 7 opposite to the surface in contact with the transparent substrate 5.
  • Examples of the carrier film for transparent conductive film used in the laminate of the present invention and the transparent conductive film (with a functional layer) include those described above.
  • Production Examples 2 to 12 In Production Example 1, as shown in Table 1, the acrylic polymers (A2) to (A) were prepared in the same manner as in Production Example 1 except that the type of monomer used for the preparation of the acrylic polymer and the use ratio thereof were changed. Solutions of (A8) and (A11) to (A14) were prepared.
  • Tg glass transition temperature
  • Example 1 Adjustment of adhesive solution
  • the acrylic polymer (A1) solution (about 35% by weight) obtained in Production Example 1 was diluted to 29% by weight with ethyl acetate, and hexamethylene was added to 100 parts by weight (solid content) of the acrylic polymer in this solution.
  • the acrylic pressure-sensitive adhesive composition (1) is applied to one side of a polyethylene terephthalate (PET) substrate (thickness 125 ⁇ m, support) and heated at 150 ° C. for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 20 ⁇ m. Formed.
  • PET polyethylene terephthalate
  • the surface of the pressure-sensitive adhesive layer was bonded with a silicone-treated surface of a PET release liner (thickness 25 ⁇ m) that had been subjected to silicone treatment on one side, and stored at 50 ° C. for 1 day to obtain a carrier film for transparent conductive film. Produced. In use, the release liner was removed before use.
  • Comparative Examples 1 to 6 As shown in Table 2, the type of acrylic polymer, the cross-linking agent constituting the pressure-sensitive adhesive composition, or the blending amount thereof was changed. Further, in Comparative Examples 3 and 4, an iron catalyst (acetylacetone first) was used instead of the tin catalyst. A carrier film for a transparent conductive film was produced in the same manner as in Example 1 except that diiron) was used.
  • a transparent conductive film (trade name: V150-OFJ, PET film having a width of 50 mm and a length of 100 mm, fixed to a SUS plate (SUS430BA), has a transparent conductive layer on one side and an anti-surface on the other side.
  • Nitto Denko film having a blocking layer formed from a coating composition composed of amorphous silica, acrylic monomer, photoinitiator and additives containing less than 5% by weight of 0.8 ⁇ m acrylic particles
  • the pressure-sensitive adhesive layer of the carrier film for transparent conductive film was bonded to the surface of the anti-blocking layer (manufactured by Co., Ltd.) (pressure bonding with a bonding machine: 0.25 MPa, pressure bonding speed 2.0 m / min). Next, after heating at 140 ° C.
  • a transparent conductive film (trade name: V150-OFJ, PET film having a width of 50 mm and a length of 100 mm, fixed to a SUS plate (SUS430BA), has a transparent conductive layer on one side and an anti-surface on the other side.
  • Nitto Denko film having a blocking layer formed from a coating composition composed of amorphous silica, acrylic monomer, photoinitiator and additives containing less than 5% by weight of 0.8 ⁇ m acrylic particles
  • the pressure-sensitive adhesive layer of the carrier film for transparent conductive film was bonded to the surface of the anti-blocking layer (manufactured by Co., Ltd.) (pressure bonding with a bonding machine: 0.25 MPa, pressure bonding speed 2.0 m / min). Next, after heating at 140 ° C.
  • the carrier film for transparent conductive film was peeled 80 mm from the transparent conductive film under the conditions, and the peel force (N / 50 mm) at this time was measured. Using the measurement data for the latter half 60 mm of the peeling force, the presence or absence of zipping was evaluated by the following formula.
  • A1 to A14 are (meth) acrylic polymers produced in Production Examples 1 to 12, respectively.
  • C / HX is an isocyanate crosslinking agent (isocyanurate of hexamethylene diisocyanate, trade name: Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.)
  • C / L is an isocyanate crosslinking agent (trimethylolpropane / tolylene diisocyanate trimer adduct, trade name: Coronate L, manufactured by Nippon Polyurethane Industry Co., Ltd.)
  • the tin catalyst is dioctyltin dilaurate,
  • the iron catalyst refers to ferric acetylacetone.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

L'invention concerne un film sur support pour films électroconducteurs transparents qui ne peut entraîner de glissement, remarquable en en termes d'adhérence forte à des films électro-conducteurs transparents et de capacité de décollement, et présentant une faible différence de force adhésive entre un décollement à grande vitesse et un décollement à faible vitesse pour atteindre une excellente efficacité de fonctionnement. L'invention concerne également un stratifié comprenant le film sur support pour films électroconducteurs transparents et un film électroconducteur transparent. Le film sur support pour films électroconducteurs transparents comprend un support et une couche adhésive sensible à la pression formée sur au moins une surface du support. Le film sur support est caractérisé en ce que lorsqu'il est dans un état tel que sa couche adhésive sensible à la pression a été appliquée sur une partie à coller, il est chauffé à 140 °C pendant 90 minutes, puis décollé de la partie à coller à une vitesse de traction de 0,3 m/min et à une vitesse de traction de 10 m/min pour fournir respectivement une force adhésive P et une force adhésive Q, la force adhésive P et la force adhésive Q étant chacune égales à 0,7 N/50 mm ou moins, et la valeur absolue de la différence entre la force adhésive P et la force adhésive Q étant égale à 0,2 N/50 mm ou moins.
PCT/JP2016/063160 2015-04-30 2016-04-27 Film sur support pour film électroconducteur transparent et stratifié WO2016175232A1 (fr)

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JP2015048394A (ja) * 2013-08-30 2015-03-16 日東電工株式会社 透明導電性フィルム用キャリアフィルム及び積層体

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JP2012021164A (ja) * 2011-09-15 2012-02-02 Hitachi Chem Co Ltd 粘着フィルム
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JP2015048394A (ja) * 2013-08-30 2015-03-16 日東電工株式会社 透明導電性フィルム用キャリアフィルム及び積層体
JP2015004072A (ja) * 2014-09-25 2015-01-08 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物およびこれを用いた光学部材

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