WO2016159595A1 - Light-emitting diode device, manufacturing method therefor, and fluorescent sheet used therein - Google Patents

Light-emitting diode device, manufacturing method therefor, and fluorescent sheet used therein Download PDF

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Publication number
WO2016159595A1
WO2016159595A1 PCT/KR2016/003087 KR2016003087W WO2016159595A1 WO 2016159595 A1 WO2016159595 A1 WO 2016159595A1 KR 2016003087 W KR2016003087 W KR 2016003087W WO 2016159595 A1 WO2016159595 A1 WO 2016159595A1
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Prior art keywords
light emitting
emitting diode
fluorescent
layer
diode chip
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PCT/KR2016/003087
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French (fr)
Korean (ko)
Inventor
김태훈
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루미마이크로 주식회사
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Publication of WO2016159595A1 publication Critical patent/WO2016159595A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Definitions

  • the present invention relates to a light emitting diode device and a method for manufacturing the same, and in particular, the fluorescent layer is not implemented through the dispensing (dispensing) process of the curable liquid fluorescent resin composition, the light emitting diode device and the film is implemented through a fluorescent sheet It relates to a manufacturing method.
  • the present invention also relates to a fluorescent sheet in the form of a film suitable for the light emitting diode device and a method of manufacturing the same.
  • a light emitting diode refers to a semiconductor device capable of realizing various colors of light through a PN junction. Recently, as blue light emitting diodes and ultraviolet light emitting diodes are manufactured using nitrides having excellent physical and chemical properties, the application range of the blue or ultraviolet light emitting diodes and fluorescent materials can be used to produce white light or other monochromatic light. .
  • white light was realized by using light emitting diodes of red (R), green (G), and blue (B) colors simultaneously so that the light from each of them was overlapped, but in this case, three light emitting diodes had to be installed.
  • white light is realized through a combination of a light emitting diode and a fluorescent material as described above, so that white light is realized through one light emitting diode.
  • a blue light emitting diode emitting a wavelength of 430 nm to 480 nm is disposed on top of a blue light emitting diode with a part of the blue light as an excitation source, and a fluorescent layer emitting yellow green or yellow light emits blue light of the light emitting diode and is generated by excitation therefrom.
  • the yellowish green or yellow light emission of the layer is allowed to overlap to obtain white light.
  • a flip chip flip chip
  • a plurality of light emitting diode chips 10 emitting blue light are installed on the first sheet 1 at appropriate intervals so that the conductive bumps 11 are attached to the first sheet 1.
  • the spacer 3 higher than the light emitting diode chip 10 is installed outside.
  • a curable liquid fluorescent resin composition 20 is applied using a dispenser so that the chip arrangement region in the spacer 3 is filled. Such a process is called a dispensing process.
  • the curable liquid fluorescent resin composition 20 uses a transparent resin in which phosphor particles emitting yellow series are dispersed, and the chip arrangement region in the space 3 is filled. Sufficient amount is applied.
  • the fluorescent layer 21 is obtained by curing the curable liquid fluorescent resin composition 20 using a suitable method such as heat or ultraviolet rays.
  • the first sheet 1 and the second sheet 2 are removed, and then cut using a dicing apparatus to obtain the light emitting diode device 30 as shown in FIG. 1F.
  • the light emitting diode chip 10 emits blue light, and the fluorescent layer 21 is excited by a part of the blue light emitted from the light emitting diode chip 10 to emit yellow light.
  • the light emitted through the fluorescent layer 21 overlaps the blue light and the yellow light and becomes white light when viewed from the outside.
  • the viscosity of the curable liquid fluorescent resin composition 20 must be lowered to some extent for the dispensing process, and thus, during storage or application of the curable liquid fluorescent resin composition 20 and subsequent curing. Partial sedimentation occurs due to the flow of the phosphor particles, and thus the phosphor particles are not uniformly distributed in the phosphor layer 21, resulting in uneven luminous luminance, high defective rate, and poor color reproducibility.
  • the dispensing process since the dispensing process must be accompanied by a leveling process to make the thickness of the curable liquid fluorescent resin composition 20 constant, the process is not only cumbersome but also difficult to make the thickness constant. There are many problems in the reliability of the process, such as poor color reproducibility.
  • the problem to be solved by the present invention by implementing a fluorescent layer of the light emitting diode device through a film-shaped fluorescent sheet can not only solve the problems of the conventional dispensing process described above, but also more preferable to implement a white light emitting diode device And to provide a manufacturing method and a fluorescent sheet suitable for the same.
  • the fluorescent sheet according to the present invention for achieving the above object is used in the light emitting diode device to be excited by the light emitted from the light emitting diode chip to emit light, a plurality of fluorescent layers for emitting light of different colors It is characterized by having.
  • a light emitting diode chip having a first surface with conductive bumps and a second surface opposite thereto;
  • a fluorescent sheet installed to be attached to the second surface
  • a side resin layer disposed to surround a side surface between the first surface and the second surface of the light emitting diode chip.
  • the fluorescent sheet preferably has an extended portion extending laterally away from the light emitting diode chip, and the side resin layer is disposed to surround the side surface of the light emitting diode chip while contacting the extension portion on the extending portion.
  • a light emitting diode chip having a first surface and a second surface opposite thereto and having a side surface between the first surface and the second surface;
  • the fluorescent sheet is preferably installed to cover the side surface adjacent to the second surface in the light emitting diode chip.
  • the fluorescent sheet may have an extended portion that extends laterally away from the light emitting diode chip, and a side resin layer may be formed to surround the side surface of the light emitting diode chip while contacting the extension portion on the extending portion.
  • a bonding electrode is formed on the second surface of the light emitting diode chip, and a wire bonding hole is formed in the fluorescent sheet to expose the bonding electrode.
  • the fluorescent sheet is preferably formed of a green fluorescent layer for emitting light of a green series and a red fluorescent layer for emitting light of a red series are sequentially disposed, wherein the green fluorescent layer is It is preferable to be provided to face the second surface of the light emitting diode chip.
  • a yellow fluorescence layer for emitting yellow light is further formed on the other side of the green fluorescence layer so as to be located opposite to the red fluorescence layer, whereby the yellow fluorescence layer, the green fluorescence layer, and the red fluorescence layer are sequentially arranged. More preferably, in this case, it is more preferable that the yellow fluorescence layer is provided to face the second surface of the light emitting diode chip.
  • the said curable liquid resin composition contains at least any one of fluorescent substance particle
  • the side resin layer preferably comprises at least one of phosphor particles and reflective particles.
  • the fluorescent layer is not implemented through the dispensing process of the curable liquid fluorescent resin composition, but is implemented through a uniform and uniform fluorescent sheet, dispersion reduction and hit ratio through color coordinate deviation (Cx, Cy) are reduced. It is possible to improve, and in particular, the fluorescent sheet has a structure in which a plurality of fluorescent layers emitting different colors are laminated, thereby obtaining more reliable white light, and reducing extraction efficiency by reducing stokes shift. This is improved.
  • 1 is a view for explaining a conventional method of manufacturing a white light emitting diode device
  • FIG. 2 is a view for explaining an example of the fluorescent sheet 110 according to the present invention.
  • FIG. 3 is a view for explaining another example of the fluorescent sheet 110 according to the present invention.
  • FIG. 4 is a view for explaining a manufacturing method of the fluorescent sheet 110 according to the present invention.
  • FIG. 5 is a view for explaining a first embodiment of a light emitting diode device and a method of manufacturing the same according to the present invention
  • FIG. 6 is a view for explaining modifications of the light emitting diode device according to the first embodiment of the present invention.
  • FIG. 7 is a view for explaining a second embodiment of the light emitting diode device and its manufacturing method according to the present invention.
  • FIG. 8 is a view for explaining a third embodiment of a light emitting diode device and a method of manufacturing the same according to the present invention.
  • first sheet 2 second sheet
  • spacer 10 light emitting diode chip
  • R red fluorescent layer
  • Y1 yellow phosphor particle
  • the fluorescent sheet 110 according to the present invention has a film shape, and includes a plurality of fluorescent layers emitting different colors.
  • the green light emitting layer G and the red light emitting layer R are sequentially arranged from the light emitting diode side.
  • the fluorescent sheet 110 according to the present invention is further formed by the yellow fluorescent layer (Y) for emitting a yellow-based light on the other side of the red fluorescent layer (R) to implement white light, From the light emitting diode side, the yellow phosphor layer Y, the green phosphor layer G, and the red phosphor layer R may be sequentially arranged (layer-by-layer).
  • Each phosphor layer (Y, G, R) is made of a resin material is a partially cured to completely cured mixture of phosphor particles. Partial cure here means that it hardens out of the liquid phase but not completely hard.
  • the resin material it is preferable to select a resin species having good adhesion, light transmittance, heat resistance, and moisture resistance.
  • a resin species having good adhesion, light transmittance, heat resistance, and moisture resistance examples thereof include an epoxy-based or a silicone-based inorganic polymer.
  • the green phosphor particles G1 emitting green light are red phosphors.
  • a red phosphor R1 that emits light of a red series will be used.
  • various phosphors such as Garnet phosphors (YAG, TAG, LuAG), silicate phosphors, nitride phosphors, sulfide phosphors, and oxide phosphors may be selected.
  • FIG. 4 is a view for explaining the manufacturing method of the fluorescent sheet 110 according to the present invention, the fluorescent sheet 110 of FIG.
  • the resin composition containing the red phosphor particles R1 is applied onto the base film 101 by spraying or printing, and the resin composition is applied to limit the flow of the red phosphor particles R1.
  • the red fluorescent layer R is formed by partial curing or complete curing.
  • the resin composition containing the green phosphor particles G1 is mixed onto the red phosphor layer G by spraying or printing, and then the flow of the green phosphor particles G1 is limited.
  • the green fluorescent layer G is formed by partially or completely curing the resin composition as much as possible.
  • a protective film 102 is formed on the green fluorescent layer G as shown in FIG. 4C.
  • the protective film 102 is formed.
  • a liquid fluorescent resin composition in which yellow phosphor particles (Y1), green phosphor particles (G1), and red phosphor particles (R1) are mixed in a combination is applied by a dispensing method.
  • yellow phosphor particles (Y1), the green phosphor particles (G1), and the red phosphor particles (R1) are not properly mixed and uniformly distributed in one phosphor layer, the entire phosphor layer is difficult. There is a problem that it is difficult to obtain uniform white light.
  • each fluorescent layer (Y, G, R) is arranged layer-by-layer as in the present invention, the problem of non-uniform mixing between the phosphor particles (Y1, G1, R1) is solved by fluorescence White light may be uniformly expressed with respect to the entire sheet 110.
  • the light extraction efficiency is improved by reducing the stoke shift, and the thickness of the fluorescent layers (Y, G, R) can be easily controlled.
  • the base film 101 is for maintaining and supporting the shape of the fluorescent sheet 110, and the protective film 102 is for protecting the fluorescent sheet 110 during the storage and transport process, as described below the fluorescent sheet 110 )
  • the protective film 102 is first removed so that the green fluorescent layer G of the fluorescent sheet 110 is bonded to the light emitting diode chip.
  • a known polymer material such as PVC, polyolefin, PET, PT, or the like may be selected.
  • a temporary adhesive layer having a weak adhesive force exists between the base film 101 and the fluorescent sheet 110, and a release agent may be applied between the protective film 102 and the fluorescent sheet 110, but they are not necessarily required.
  • the fluorescent sheet 110 since the fluorescent sheet 110 is present in the form of a partially cured or fully cured film, the phosphor particles (G1, R1) flow in a non-uniform distribution during the storage or future use of the fluorescent sheet 110 Does not occur, and since the thickness of the fluorescent sheet 110 is already constant, a problem due to thickness unevenness does not occur.
  • FIG. 5 is a view for explaining a first embodiment of a light emitting diode device and a method of manufacturing the same according to the present invention, taking a flip chip type light emitting diode chip as an example.
  • the protective film 102 is removed from the fluorescent sheet 110 of FIG. 2 so that the green fluorescent layer G is exposed, and then the conductive bump 11 is shown in FIG. 5B.
  • the light emitting diode chip 10 is disposed on the fluorescent sheet 110 so that the second surface of the light emitting diode chip 10 having a first surface having a first surface and a second surface opposite thereto is directed toward the green fluorescent layer G. Install more than one at intervals.
  • the curable liquid resin is interposed between the light emitting diode chips 10 such that a side surface between the first and second surfaces of the light emitting diode chip 10 is surrounded by the curable liquid resin composition 120. It is applied and filled with the composition 120. Application of the curable liquid resin composition 120 is performed through a conventional dispensing process as in the prior art.
  • the curable liquid resin composition 120 is cured to form the side resin layer 121, and then, as shown in FIG. 5E, the light emitting diode chips 10 are cut off.
  • the base film 101 is removed to obtain the light emitting diode device 100 according to the present invention as shown in FIG. 3F.
  • a fluorescent sheet 110 is installed on the second surface of the light emitting diode chip 10 having a first surface having a conductive bump 11 and a second surface opposite thereto.
  • the side surface between the first surface and the second surface of the light emitting diode chip 10 has a structure surrounded by the side resin layer 121.
  • the fluorescent sheet 110 has an extension 122 extending laterally away from the light emitting diode chip 10, and the side resin layer 121 has an extension 122 on the extension 122. ) Is installed so as to surround the side of the light emitting diode chip (10).
  • the side resin layer 121 is formed by curing a liquid resin composition applied by a dispensing method, and the fluorescent sheet 110 is formed by sequentially arranging a green fluorescent layer (G) and a red fluorescent layer (R).
  • the fluorescent layer G is provided to face the second surface of the light emitting diode chip 10.
  • FIG. 6 is a diagram for describing modifications of the light emitting diode device according to the first embodiment of the present invention.
  • a fluorescent sheet 110 as shown in FIG. 3 is further formed in which a yellow fluorescence layer Y is further formed on the other side of the green fluorescence layer G so as to be opposite to the red fluorescence layer R.
  • the yellow phosphor layer Y is disposed to face the second surface of the light emitting diode chip 10, so that the yellow phosphor layer Y, the green phosphor layer G, and the red phosphor layer from the light emitting diode chip 10 side. It is preferable to arrange (R) sequentially.
  • the order of the arrangement of the fluorescent layers is important because it is desirable to improve the light extraction efficiency by reducing the stokes shift.
  • the curable liquid resin composition 120 may include phosphor particles, reflection particles may be included, and in some cases, they may be included in combination.
  • the phosphor particles Y1, G1, and R1 are present in the resin layer 121 as shown in FIG. 6B. White light will also be emitted through the resin layer 121.
  • the curable liquid resin composition 120 it is more preferable to include not only one kind of phosphor particles in the curable liquid resin composition 120 but also various kinds of phosphor particles.
  • the yellow phosphor particles (Y1), the green phosphor particles (G1), and the red phosphor particles (R1) are mixed and contained at once in combination.
  • the phosphor particles may not be uniformly mixed with each other and distributed as described above.
  • the yellow phosphor particles Y1 may be used as in the related art.
  • the green phosphor particles G1 and the red phosphor particles R1 may be mixed without the yellow phosphor particles Y1.
  • the reflective particles 130 are present in the resin layer 121 as shown in FIG. 6C, light is emitted from the fluorescent sheet 110. Being guided to the side will be emitted more intense white light through the fluorescent sheet (110). Examples of such reflective particles 130 are TiO 2 Etc. can be mentioned.
  • the amount of the curable liquid resin composition 120 is appropriately adjusted so that the curable liquid resin composition 120 covers the first surface of the light emitting diode chip 10.
  • the resin bumps 121 are formed on the first surface of the light emitting diode chip 10 while the conductive bumps 11 are exposed.
  • white light may be emitted through the first surface.
  • FIG. 7 is a view for explaining a second embodiment of a light emitting diode device and a method of manufacturing the same according to the present invention.
  • a light emitting diode chip 10 having a first surface and a second surface opposite thereto and having a side surface between the first surface and the second surface is prepared, and the first surface is After the plurality of light emitting diode chips 10 are disposed on the chip wafer film 310 so as to face the chip wafer film 310, the fluorescent sheet 110 is disposed in the upper space of the light emitting diode chip 10. .
  • the fluorescent sheet 110 may be formed of a single fluorescent layer, but preferably includes a plurality of fluorescent layers as described above. In the case of the plurality of fluorescent layers, it is preferable to sequentially arrange the yellow phosphor layer Y, the green phosphor layer G, and the red phosphor layer R from the light emitting diode chip 10 side. At this time, the yellow fluorescent layer Y can be omitted.
  • the fluorescent sheet 110 covers the second surface of the light emitting diode chip 10 and the side surface adjacent thereto by using a mold or a jig at a temperature of 100 ° C. to 200 ° C.
  • FIG. The fluorescent sheet 110 is pressed.
  • An adhesive layer may be formed on the second surface of the light emitting diode chip 110 to improve adhesion, but the illustration thereof is omitted.
  • the chip wafer film 310 is removed, and as shown in FIG. 7E, the second surface of the light emitting diode chip 10 and the like. Adjacent side portions complete the light emitting diode device 100 covered by the fluorescent sheet 110.
  • the process may be completed in FIG. 7d, but the light emitting diode chip 10 is lateral. If the wire bonding is to be performed as a lateral or vertical chip, a bonding electrode of the light emitting diode chip 10 will exist on the second surface so that an additional process is required to connect the external chip to the outside.
  • wire bonding is performed to electrically connect it to the outside.
  • a hole for wire bonding in the fluorescent sheet 110 is provided. It is preferable that (h) is formed.
  • the wire bonding hole h may exist in the fluorescent sheet 110 from the beginning in FIGS. 7A to 7D and may be formed after the step 7E.
  • the wire bonding hole h may be made using a metal or silicon molder.
  • FIG. 8 is a view for explaining a third embodiment of a light emitting diode device and a method of manufacturing the same according to the present invention.
  • a light emitting diode chip 10 having a first surface and a second surface opposite thereto and having a side surface between the first surface and the second surface is prepared, and the first surface is A plurality of light emitting diode chips 10 are disposed on the chip wafer film 310 to be spaced apart from each other so as to face the chip wafer film 310.
  • the light emitting diode chip 10 is filled with the curable liquid resin composition 120 between the light emitting diode chips 10 such that the side surface of the light emitting diode chip 10 is surrounded by the curable liquid resin composition 120.
  • the fluorescent sheet 110 may be formed of a single fluorescent layer, but preferably includes a plurality of fluorescent layers as described above. In the case of the plurality of fluorescent layers, it is preferable to sequentially arrange the yellow phosphor layer Y, the green phosphor layer G, and the red phosphor layer R from the light emitting diode chip 10 side. At this time, the yellow fluorescent layer Y can be omitted.
  • the fluorescent sheet 110 is placed on the entire surface of the resultant, and the fluorescent sheet 110 is pressed by using a mold or a jig at a temperature of 100 to 200 ° C. to fluoresce the fluorescent sheet 110. It presses on the 2nd surface of (10). In this process, the curable liquid resin composition 120 is cured to form the side resin layer 121.
  • the chip wafer film 310 is removed and the second surface of the light emitting diode chip 10 is removed as shown in FIG. 8E.
  • the light emitting diode device 100 according to the present invention which is provided on the fluorescent sheet 110 and has side surface resin layers 121 formed thereon, is obtained.
  • the fluorescent sheet 110 has an extension portion 122 extending laterally away from the light emitting diode chip 10, the side resin layer 121 is in contact with the extension portion 122 on the extension portion 122 It is installed to surround the side of the light emitting diode chip (10).
  • the side resin layer 121 may include at least one of phosphor particles and reflective particles.
  • the process of forming the wire bonding hole h in the fluorescent sheet 110 may be further performed.
  • the fluorescent layer is not implemented through the dispensing process of the curable liquid fluorescent resin composition but is implemented through a uniform and uniform fluorescent sheet, the color coordinate deviation (Cx, Cy) is reduced through Dispersion can be reduced and hit rate can be improved.
  • the fluorescent sheet 110 has a structure in which a plurality of fluorescent layers emitting different colors can be laminated, more reliable white light can be obtained, and stokes shift can be achieved. The light extraction efficiency is improved by reducing the

Abstract

A light-emitting diode device (100) according to the present invention comprises: a fluorescent sheet (110) attached and provided to a second surface of a light-emitting diode chip (10); and a side resin layer (121) provided so as to surround a side between a first surface and the second surface of the light-emitting diode chip (10). According to the present invention, instead of being implemented through a dispensing process of a curable liquid fluorescent resin composition, a fluorescent layer is implemented through a fluorescent sheet having a fixed and uniform thickness, thereby promoting accuracy rate improvement and dispersion reduction through a reduction in color coordinate deviations (Cx, Cy), and particularly, since the fluorescent sheet (110) has a structure in which a plurality of fluorescent layers for emitting different colors are stacked, a clearer white light can be obtained and light extraction efficiency is improved by a method for reducing a stokes shift.

Description

발광다이오드 장치 및 그 제조방법과 이에 사용되는 형광시트Light emitting diode device and manufacturing method thereof and fluorescent sheet used therein
본 발명은 발광다이오드 장치 및 그 제조방법에 관한 것으로서, 특히 형광층이 경화형 액상 형광 수지조성물의 디스펜싱(dispensing) 공정을 통하여 구현되는 것이 아니라 필름형태의 형광시트를 통하여 구현되는 발광다이오드 장치 및 그 제조방법에 관한 것이다. 또한 본 발명은 상기 발광다이오드 장치 및 그 제조방법에 적합한 필름형태의 형광시트에 관한 것이기도 하다. The present invention relates to a light emitting diode device and a method for manufacturing the same, and in particular, the fluorescent layer is not implemented through the dispensing (dispensing) process of the curable liquid fluorescent resin composition, the light emitting diode device and the film is implemented through a fluorescent sheet It relates to a manufacturing method. The present invention also relates to a fluorescent sheet in the form of a film suitable for the light emitting diode device and a method of manufacturing the same.
발광다이오드(Light emitting diode, LED)는 PN 접합을 통해 다양한 색의 빛을 구현할 수 있는 반도체 소자를 말한다. 최근 물리적, 화학적 특성이 우수한 질화물을 이용하여 청색 발광다이오드 및 자외선 발광다이오드가 제조됨에 따라 이러한 청색 또는 자외선 발광다이오드와 형광물질을 이용하여 백색광 또는 다른 단색광을 만들 수 있게 됨으로써 그 응용범위가 넓어지고 있다. A light emitting diode (LED) refers to a semiconductor device capable of realizing various colors of light through a PN junction. Recently, as blue light emitting diodes and ultraviolet light emitting diodes are manufactured using nitrides having excellent physical and chemical properties, the application range of the blue or ultraviolet light emitting diodes and fluorescent materials can be used to produce white light or other monochromatic light. .
애초에는 적색(R), 녹색(G), 청색(B) 3색의 발광다이오드를 동시에 사용하여 이들 각각에서 나오는 빛이 중첩되도록 함으로써 백색광을 구현하였으나, 이 경우 발광다이오드 3개가 설치되어야 하는 문제가 있어, 최근에는 위와 같이 발광다이오드와 형광물질의 조합을 통하여 백색광이 구현되도록 함으로써 1개의 발광다이오드를 통해서 백색광이 구현되도록 하고 있다. In the beginning, white light was realized by using light emitting diodes of red (R), green (G), and blue (B) colors simultaneously so that the light from each of them was overlapped, but in this case, three light emitting diodes had to be installed. In recent years, white light is realized through a combination of a light emitting diode and a fluorescent material as described above, so that white light is realized through one light emitting diode.
예를 들어, 430nm-480nm의 파장을 발광하는 청색 발광다이오드 상부에 그 청색광의 일부를 여기원으로 하여 황록색 또는 황색을 발광하는 형광층을 배치시킴으로써, 발광다이오드의 청색 발광과 그로부터 여기되어 발생되는 형광층의 황록색 또는 황색 발광이 중첩되도록 하여 백색광을 얻는다. For example, a blue light emitting diode emitting a wavelength of 430 nm to 480 nm is disposed on top of a blue light emitting diode with a part of the blue light as an excitation source, and a fluorescent layer emitting yellow green or yellow light emits blue light of the light emitting diode and is generated by excitation therefrom. The yellowish green or yellow light emission of the layer is allowed to overlap to obtain white light.
종래의 경우, 위의 형광층을 얻기 위하여, 대한민국 등록특허 제1352967호(2014.01.22.공고) 등에 개시된 바와 같이, 경화형 액상 수지조성물에 고상의 형광체 입자가 분산되어 있는 경화형 액상 형광 수지조성물을 디스펜서(dispenser)를 통하여 도포하는 디스펜싱(dispensing) 공정이 적용되었다. In the related art, in order to obtain the above fluorescent layer, as disclosed in Korean Patent No. 1352967 (2014.01.22.), Etc., a curable liquid fluorescent resin composition in which solid phase phosphor particles are dispersed in a curable liquid resin composition is dispensed. A dispensing process applied through a dispenser was applied.
도 1은 종래의 백색 발광다이오드 장치 제조방법을 설명하기 위한 도면으로서, 플립 칩(flip chip)의 경우를 예로 든 것이다. 1 is a view for explaining a conventional method of manufacturing a white light emitting diode device, a flip chip (flip chip) is taken as an example.
먼저, 도 1a에서와 같이, 도전성 범프(11)가 제1시트(1)에 부착되도록 청색 계열의 빛을 방출하는 발광다이오드 칩(10)을 제1시트(1) 상에 적절한 간격으로 복수개 설치한 후 외곽에 발광다이오드 칩(10)보다 높은 스페이서(3)를 설치한다First, as shown in FIG. 1A, a plurality of light emitting diode chips 10 emitting blue light are installed on the first sheet 1 at appropriate intervals so that the conductive bumps 11 are attached to the first sheet 1. After that, the spacer 3 higher than the light emitting diode chip 10 is installed outside.
다음에, 도 1b에서와 같이, 스페이서(3) 내의 칩 배열영역이 채워지도록 디스펜서(dispenser)를 이용하여 경화형 액상 형광 수지조성물(20)을 도포한다. 이러한 공정을 디스펜싱(dispensing) 공정이라 하며, 이 때, 경화형 액상 형광 수지조성물(20)로는 황색계열을 방출하는 형광체 입자가 분산되어 있는 투명수지가 사용되고, 스페이스(3) 내의 칩 배열영역이 채워지도록 충분한 양이 도포된다. Next, as shown in FIG. 1B, a curable liquid fluorescent resin composition 20 is applied using a dispenser so that the chip arrangement region in the spacer 3 is filled. Such a process is called a dispensing process. At this time, the curable liquid fluorescent resin composition 20 uses a transparent resin in which phosphor particles emitting yellow series are dispersed, and the chip arrangement region in the space 3 is filled. Sufficient amount is applied.
이어서, 도 1c에서와 같이, 스페이서(3) 상에 제2시트(2)를 부착시킨 후 적절한 가압력을 작용시킴으로써, 도전성 범프(11)에 의해서 발광다이오드 칩(10)과 제1시트(1) 사이의 들떠 있는 틈으로 경화형 액상 형광 수지조성물(20)이 흘러들어가 채워지도록 함과 동시에 경화형 액상 형광 수지조성물(20)의 높이가 스페이서(3)의 높이에 준하여 평평하게 되도록 레벨링(leveling)시킨다. Subsequently, as shown in FIG. 1C, after attaching the second sheet 2 to the spacer 3, an appropriate pressing force is applied to the light emitting diode chip 10 and the first sheet 1 by the conductive bumps 11. The curable liquid fluorescent resin composition 20 flows in and fills the gaps therebetween, and at the same time, the level of the curable liquid fluorescent resin composition 20 is leveled so as to be flat with the height of the spacer 3.
다음에, 도 1d에서와 같이, 열이나 자외선 등 적절한 방법을 동원하여 경화형 액상 형광 수지조성물(20)을 경화시킴으로써 형광층(21)을 얻는다. Next, as shown in FIG. 1D, the fluorescent layer 21 is obtained by curing the curable liquid fluorescent resin composition 20 using a suitable method such as heat or ultraviolet rays.
이어서, 도 1e에서와 같이, 제1시트(1)와 제2시트(2)를 제거한 후, 다이싱 장치를 이용하여 절단함으로써 도 1f에서와 같은 발광다이오드 장치(30)를 얻는다. Subsequently, as shown in FIG. 1E, the first sheet 1 and the second sheet 2 are removed, and then cut using a dicing apparatus to obtain the light emitting diode device 30 as shown in FIG. 1F.
발광다이오드 칩(10)은 청색계열의 빛을 방출하고, 형광층(21)은 발광다이오드 칩(10)에서 방출되는 청색계열의 빛 일부에 의해서 여기되어 황색계열의 빛을 방출하기 때문에, 결과적으로 형광층(21)을 통과하여 나오는 빛은 청색계열과 황색계열의 빛이 중첩되어 전체적으로 외부에서 볼 때 백색광이 된다. The light emitting diode chip 10 emits blue light, and the fluorescent layer 21 is excited by a part of the blue light emitted from the light emitting diode chip 10 to emit yellow light. The light emitted through the fluorescent layer 21 overlaps the blue light and the yellow light and becomes white light when viewed from the outside.
상술한 종래의 백색 발광다이오드 장치는, 디스펜싱 공정을 위하여 경화형 액상 형광 수지조성물(20)의 점도가 어느 정도 낮아야 하기 때문에, 경화형 액상 형광 수지조성물(20)의 보관이나 도포 및 그 후의 경화과정에서 형광체 입자의 유동으로 인하여 부분적 침강이 발생하게 되는 바, 형광체 입자가 형광층(21) 내에 균일하게 분포되지 못하여 발광휘도가 불균일하고, 불량률이 높으며, 색 재현성이 떨어지는 단점이 있다. In the above-described conventional white light emitting diode device, the viscosity of the curable liquid fluorescent resin composition 20 must be lowered to some extent for the dispensing process, and thus, during storage or application of the curable liquid fluorescent resin composition 20 and subsequent curing. Partial sedimentation occurs due to the flow of the phosphor particles, and thus the phosphor particles are not uniformly distributed in the phosphor layer 21, resulting in uneven luminous luminance, high defective rate, and poor color reproducibility.
또한, 디스펜싱 공정에서 경화형 액상 형광 수지조성물(20)의 두께를 일정하게 하는 레벨링 과정이 수반되어야 하기 때문에 공정이 번거로울 뿐만 아니라 두께를 일정하게 하기가 어려워 위와 같이 발광휘도의 불균일하고, 불량률이 높으며, 색 재현성이 떨어지는 등 공정의 신뢰도에 문제가 많다. In addition, since the dispensing process must be accompanied by a leveling process to make the thickness of the curable liquid fluorescent resin composition 20 constant, the process is not only cumbersome but also difficult to make the thickness constant. There are many problems in the reliability of the process, such as poor color reproducibility.
뿐만 아니라, 종래에는 대한민국 공개특허 제2011-70360호(2011.06.24.공개) 등에 개시된 바와 같이, 발광다이오드에서 방출되는 청색빛과 형광물질에서 방출되는 황색빛의 중첩을 통해 백색광을 얻었는데, 이렇게 단순히 황색 형광물질을 이용하는 것만으로는 적색(R), 녹색(B), 청색(B) 빛이 중첩되었을 때에 백색광이 얻어진다는 빛의 3원색 원리를 고려해 볼 때에 백색광을 얻는 데에 부족함이 많다.In addition, conventionally, as disclosed in Korean Patent Laid-Open Publication No. 2011-70360 (published on June 24, 2011) and the like, white light was obtained through superposition of blue light emitted from a light emitting diode and yellow light emitted from a fluorescent material. Simply using a yellow fluorescent material is insufficient to obtain white light considering the three primary color principle that white light is obtained when the red (R), green (B), blue (B) light is superimposed.
<선행기술문헌><Preceding technical literature>
대한민국 등록특허 제1352967호(2014.01.22.공고) Republic of Korea Patent No. 1352967 (Jan. 22, 2014)
대한민국 공개특허 제2011-70360호(2011.06.24.공개)Republic of Korea Patent Publication No. 2011-70360 (published June 24, 2011)
따라서 본 발명이 해결하고자 하는 과제는, 필름형태의 형광시트를 통하여 발광다이오드 장치의 형광층을 구현함으로써 상술한 종래의 디스펜싱 공정에 대한 문제점을 해결할 수 있을 뿐만 아니라 백색광 구현에 더욱 바람직한 발광 다이오드 장치 및 그 제조방법과 이에 적합한 형광시트를 제공하는 데 있다. Therefore, the problem to be solved by the present invention, by implementing a fluorescent layer of the light emitting diode device through a film-shaped fluorescent sheet can not only solve the problems of the conventional dispensing process described above, but also more preferable to implement a white light emitting diode device And to provide a manufacturing method and a fluorescent sheet suitable for the same.
상기 과제를 달성하기 위한 본 발명에 따른 형광시트는, 발광다이오드 칩에서 방출되는 광에 의해 여기되어 광을 방출하도록 발광다이오드 장치에 사용되는 것으로서, 서로 다른 색의 빛을 방출하는 복수개의 형광층을 갖는 것을 특징으로 한다. The fluorescent sheet according to the present invention for achieving the above object is used in the light emitting diode device to be excited by the light emitted from the light emitting diode chip to emit light, a plurality of fluorescent layers for emitting light of different colors It is characterized by having.
상기 과제를 달성하기 위한 본 발명이 일예에 따른 발광다이오드 장치는, Light emitting diode device according to an embodiment of the present invention for achieving the above object,
도전성 범프가 있는 제1면과 그 반대편의 제2면을 갖는 발광다이오드 칩;A light emitting diode chip having a first surface with conductive bumps and a second surface opposite thereto;
상기 제2면에 부착되도록 설치되는 형광시트; 및A fluorescent sheet installed to be attached to the second surface; And
상기 발광다이오드 칩의 제1면과 제2면 사이의 측면을 둘러싸도록 설치되는 측면수지층;을 포함하여 이루어지는 것을 특징으로 한다. And a side resin layer disposed to surround a side surface between the first surface and the second surface of the light emitting diode chip.
상기 형광시트는 상기 발광다이오드 칩에서 벗어나도록 옆으로 연장된 연장부를 가지고, 상기 측면수지층은 상기 연장부 상에서 상기 연장부에 접하면서 상기 발광다이오드 칩의 측면을 둘러싸도록 설치되는 것이 바람직하다. The fluorescent sheet preferably has an extended portion extending laterally away from the light emitting diode chip, and the side resin layer is disposed to surround the side surface of the light emitting diode chip while contacting the extension portion on the extending portion.
상기 과제를 달성하기 위한 본 발명에 따른 발광다이오드 장치 제조방법은, Method of manufacturing a light emitting diode device according to the present invention for achieving the above object,
도전성 범프가 있는 제1면과 그 반대편의 제2면을 갖는 발광다이오드 칩의 상기 제2면이 형광시트를 향하도록 상기 형광시트 상에 상기 발광다이오드 칩을 소정간격으로 복수개 설치하는 단계;Providing a plurality of the light emitting diode chips on the fluorescent sheet at predetermined intervals such that the second surface of the light emitting diode chip having a first surface with a conductive bump and a second surface opposite thereto faces the fluorescent sheet;
상기 발광다이오드 칩의 제1면과 제2면 사이의 측면이 경화형 액상 수지조성물에 의해 둘러싸이도록 상기 발광다이오드 칩 사이에 상기 경화형 액상 수지조성물을 도포하는 단계;Applying the curable liquid resin composition between the light emitting diode chips such that a side surface between the first and second surfaces of the light emitting diode chip is surrounded by the curable liquid resin composition;
상기 경화형 액상 수지조성물을 경화시켜 측면수지층을 형성하는 단계; 및Curing the curable liquid resin composition to form a side resin layer; And
상기 발광다이오드 칩 사이를 절단하여 상기 발광다이오드 칩의 제2면에는 상기 형광시트가 설치되고 상기 발광다이오드 칩의 측 부위에는 상기 측면수지층이 설치되는 발광다이오드 장치를 얻는 단계; 를 포함하는 것을 특징으로 한다. Cutting the light emitting diode chip to obtain a light emitting diode device in which the fluorescent sheet is installed on a second surface of the light emitting diode chip and the side resin layer is provided on a side portion of the light emitting diode chip; Characterized in that it comprises a.
상기 과제를 달성하기 위한 본 발명의 다른 예에 따른 발광다이오드 장치는, Light emitting diode device according to another embodiment of the present invention for achieving the above object,
제1면과 그 반대편의 제2면을 가지고 상기 제1면과 제2면 사이에서 측면을 가지는 발광다이오드 칩; 및A light emitting diode chip having a first surface and a second surface opposite thereto and having a side surface between the first surface and the second surface; And
상기 발광다이오드 칩의 제2면을 덮도록 설치되는 형광시트; 를 포함하여 이루어지는 것을 특징으로 한다. A fluorescent sheet disposed to cover the second surface of the light emitting diode chip; Characterized in that comprises a.
이 경우, 상기 형광시트는 상기 발광다이오드 칩에서 상기 제2면에 인접하는 상기 측면까지 덮도록 설치되는 것이 바람직하다. 또는 상기 형광시트는 상기 발광다이오드 칩에서 벗어나도록 옆으로 연장된 연장부를 가지고, 상기 연장부 상에서 상기 연장부에 접하면서 상기 발광다이오드 칩의 측면을 둘러싸도록 측면수지층이 형성되는 것이 바람직하다. 상기 발광다이오드 칩의 제2면에 본딩전극이 형성되고 상기 본딩전극이 노출되도록 상기 형광시트에 와이어 본딩용 홀이 형성되는 것이 바람직하다. In this case, the fluorescent sheet is preferably installed to cover the side surface adjacent to the second surface in the light emitting diode chip. Alternatively, the fluorescent sheet may have an extended portion that extends laterally away from the light emitting diode chip, and a side resin layer may be formed to surround the side surface of the light emitting diode chip while contacting the extension portion on the extending portion. A bonding electrode is formed on the second surface of the light emitting diode chip, and a wire bonding hole is formed in the fluorescent sheet to expose the bonding electrode.
위의 본 발명에 있어서, 상기 형광시트는 녹색계열의 빛을 방출하는 녹색형광층과 적색계열의 빛을 방출하는 적색형광층이 순차적으로 배치되어 이루어지는 것이 바람직하며, 이 때 상기 녹색형광층이 상기 발광다이오드 칩의 제2면을 향하도록 설치되는 것이 바람직하다.In the above present invention, the fluorescent sheet is preferably formed of a green fluorescent layer for emitting light of a green series and a red fluorescent layer for emitting light of a red series are sequentially disposed, wherein the green fluorescent layer is It is preferable to be provided to face the second surface of the light emitting diode chip.
상기 적색형광층의 반대편에 위치하도록 상기 녹색형광층의 다른 편에 황색계열의 빛을 방출하는 황색형광층이 더 형성됨으로써, 황색형광층, 녹색형광층, 및 적색형광층이 순차적으로 배치되어 이루어지는 것이 더욱 바람직하며, 이 때, 상기 황색형광층이 상기 발광다이오드 칩의 제2면을 향하도록 설치되는 것이 더욱 바람직하다.A yellow fluorescence layer for emitting yellow light is further formed on the other side of the green fluorescence layer so as to be located opposite to the red fluorescence layer, whereby the yellow fluorescence layer, the green fluorescence layer, and the red fluorescence layer are sequentially arranged. More preferably, in this case, it is more preferable that the yellow fluorescence layer is provided to face the second surface of the light emitting diode chip.
상기 경화형 액상 수지조성물이 형광체 입자 및 반사성 입자 중 적어도 어느 하나를 포함하여 이루어지는 것이 바람직하다. It is preferable that the said curable liquid resin composition contains at least any one of fluorescent substance particle | grains and reflective particle | grains.
상기 측면수지층은 형광체 입자 및 반사성 입자 중 적어도 어느 하나를 포함하여 이루어지는 것이 바람직하다. The side resin layer preferably comprises at least one of phosphor particles and reflective particles.
본 발명에 의하면, 형광층이 경화형 액상 형광 수지조성물의 디스펜싱 공정을 통하여 구현되는 것이 아니라 두께가 일정하면서도 균일한 형광시트를 통해 구현되기 때문에 색좌표 편차(Cx, Cy) 감소를 통한 분산 감소 및 적중률 향상을 도모할 수 있고, 특히, 형광시트가 서로 다른 색을 방출하는 복수개의 형광층이 적층된 구조를 가짐으로써 더 확실한 백색광을 얻을 수 있으며, 스토크 쉬프트(stokes shift)를 줄이는 방식으로 광추출 효율이 향상된다. According to the present invention, since the fluorescent layer is not implemented through the dispensing process of the curable liquid fluorescent resin composition, but is implemented through a uniform and uniform fluorescent sheet, dispersion reduction and hit ratio through color coordinate deviation (Cx, Cy) are reduced. It is possible to improve, and in particular, the fluorescent sheet has a structure in which a plurality of fluorescent layers emitting different colors are laminated, thereby obtaining more reliable white light, and reducing extraction efficiency by reducing stokes shift. This is improved.
도 1은 종래의 백색 발광다이오드 장치 제조방법을 설명하기 위한 도면;1 is a view for explaining a conventional method of manufacturing a white light emitting diode device;
도 2는 본 발명에 따른 형광시트(110)의 일예를 설명하기 위한 도면; 2 is a view for explaining an example of the fluorescent sheet 110 according to the present invention;
도 3은 본 발명에 따른 형광시트(110)의 다른 예를 설명하기 위한 도면;3 is a view for explaining another example of the fluorescent sheet 110 according to the present invention;
도 4는 본 발명에 따른 형광시트(110)의 제조방법을 설명하기 위한 도면;4 is a view for explaining a manufacturing method of the fluorescent sheet 110 according to the present invention;
도 5는 본 발명에 따른 발광다이오드 장치 및 그 제조방법의 제1실시예를 설명하기 위한 도면;5 is a view for explaining a first embodiment of a light emitting diode device and a method of manufacturing the same according to the present invention;
도 6은 본 발명의 제1실시예에 따른 발광다이오드 장치의 변형 예들을 설명하기 위한 도면;6 is a view for explaining modifications of the light emitting diode device according to the first embodiment of the present invention;
도 7은 본 발명에 따른 발광다이오드 장치 및 그 제조방법의 제2실시예를 설명하기 위한 도면;7 is a view for explaining a second embodiment of the light emitting diode device and its manufacturing method according to the present invention;
도 8은 본 발명에 따른 발광다이오드 장치 및 그 제조방법의 제3실시예를 설명하기 위한 도면이다. 8 is a view for explaining a third embodiment of a light emitting diode device and a method of manufacturing the same according to the present invention.
<부호의 설명><Description of the code>
1: 제1시트 2: 제2시트1: first sheet 2: second sheet
3: 스페이서 10: 발광다이오드 칩3: spacer 10: light emitting diode chip
11: 도전성 범프 20, 120: 경화형 액상 형광 수지조성물11: conductive bumps 20 and 120: curable liquid fluorescent resin composition
21: 형광층 30, 100: 발광다이오드 장치21: fluorescent layer 30, 100: light emitting diode device
101: 베이스필름 102: 보호필름101: base film 102: protective film
110: 형광시트 121: 측면수지층110: fluorescent sheet 121: side resin layer
130: 반사성 입자 310: 칩 웨이퍼 필름130: reflective particle 310: chip wafer film
Y: 황색형광층 G: 녹색형광층Y: yellow fluorescent layer G: green fluorescent layer
R: 적색형광층 Y1: 황색형광체 입자R: red fluorescent layer Y1: yellow phosphor particle
G1: 녹색형광체 입자 R1: 적색형광체 입자G1: Green phosphor particle R1: Red phosphor particle
h: 와이어 본딩용 홀h: hole for wire bonding
이하에서, 본 발명의 바람직한 실시예를 첨부한 도면들을 참조하여 상세히 설명한다. 아래의 실시예는 본 발명의 내용을 이해하기 위해 제시된 것일 뿐이며 당 분야에서 통상의 지식을 가진 자라면 본 발명의 기술적 사상 내에서 많은 변형이 가능할 것이다. 따라서 본 발명의 권리범위가 이러한 실시예에 한정되는 것으로 해석돼서는 안 된다. Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail. The following examples are only presented to understand the content of the present invention, and those skilled in the art will be capable of many modifications within the technical spirit of the present invention. Therefore, the scope of the present invention should not be construed as limited to these embodiments.
[형광시트][Fluorescent Sheet]
도 2는 본 발명에 따른 형광시트(110)의 일예를 설명하기 위한 도면이다. 도 2에 도시된 바와 같이, 본 발명에 따른 형광시트(110)는 필름형태를 하며, 서로 다른 색을 방출하는 복수개의 형광층을 포함하여 이루어지는 것을 특징으로 한다. 2 is a view for explaining an example of the fluorescent sheet 110 according to the present invention. As shown in FIG. 2, the fluorescent sheet 110 according to the present invention has a film shape, and includes a plurality of fluorescent layers emitting different colors.
특히, 청색 발광다이오드를 사용하여 백색광을 얻는 경우를 상정하여 볼 때, 발광다이오드 쪽에서부터 녹색형광층(G)과 적색형광층(R)이 순차적으로 배열되어 이루어지는 것이 바람직하다. In particular, assuming that white light is obtained using a blue light emitting diode, it is preferable that the green light emitting layer G and the red light emitting layer R are sequentially arranged from the light emitting diode side.
도 3은 본 발명에 따른 형광시트(110)의 다른 예를 설명하기 위한 도면이다. 도 3에 도시된 바와 같이, 본 발명에 따른 형광시트(110)는 백색광 구현을 위하여 적색형광층(R)의 다른 편에 황색계열의 빛을 방출하는 황색형광층(Y)이 더 형성됨으로써, 발광다이오드 쪽에서부터 황색형광층(Y), 녹색형광층(G), 및 적색형광층(R)이 순차적으로 배열(layer-by-layer)되어 이루어질 수 있다. 3 is a view for explaining another example of the fluorescent sheet 110 according to the present invention. As shown in Figure 3, the fluorescent sheet 110 according to the present invention is further formed by the yellow fluorescent layer (Y) for emitting a yellow-based light on the other side of the red fluorescent layer (R) to implement white light, From the light emitting diode side, the yellow phosphor layer Y, the green phosphor layer G, and the red phosphor layer R may be sequentially arranged (layer-by-layer).
각 형광층(Y, G, R)은 형광체입자가 혼합되어 부분 경화 내지 완전 경화된 수지물질로 이루어진다. 여기서 부분 경화라고 하는 것은 액상에서 벗어나도록 경화되기는 하지만 완전히 딱딱하게 경화되는 것은 아니라는 의미이다. Each phosphor layer (Y, G, R) is made of a resin material is a partially cured to completely cured mixture of phosphor particles. Partial cure here means that it hardens out of the liquid phase but not completely hard.
수지물질로는 접착성, 광투과성, 내열성, 내습성이 좋은 수지종이 선택되는 것이 바람직한데, 예컨대 에폭시 계열이나 무기계 고분자인 실리콘 계열 등이 이에 해당한다. As the resin material, it is preferable to select a resin species having good adhesion, light transmittance, heat resistance, and moisture resistance. Examples thereof include an epoxy-based or a silicone-based inorganic polymer.
황색형광층(Y)의 경우는 황색계열의 빛을 방출하는 황색형광체 입자(Y1)가, 녹색형광층(G)의 경우는 녹색계열의 빛을 방출하는 녹색형광체 입자(G1)가, 적색형광층(R)의 경우는 적색계열의 빛을 방출하는 적색형광체(R1)가 사용될 것이다. 해당 형광층에 맞게 빛을 방출하는 것이라면, 형광체 입자로서 Garnet계 형광체(YAG, TAG, LuAG), 실리케이트계 형광체, 질화물계 형광체, 황화물계 형광체, 산화물계 형광체 등 다양한 것이 선택될 수 있다. In the case of the yellow phosphor layer Y, the yellow phosphor particles Y1 emitting yellow light, and in the case of the green phosphor layer G, the green phosphor particles G1 emitting green light are red phosphors. In the case of the layer R, a red phosphor R1 that emits light of a red series will be used. As long as it emits light in accordance with the phosphor layer, various phosphors such as Garnet phosphors (YAG, TAG, LuAG), silicate phosphors, nitride phosphors, sulfide phosphors, and oxide phosphors may be selected.
도 4는 본 발명에 따른 형광시트(110)의 제조방법을 설명하기 위한 도면으로서, 도 2의 형광시트(110)를 예로 든 것이다. 4 is a view for explaining the manufacturing method of the fluorescent sheet 110 according to the present invention, the fluorescent sheet 110 of FIG.
먼저 도 4a에 도시된 바와 같이, 적색형광체 입자(R1)가 혼합되어 있는 수지조성물을 베이스필름(101) 상에 스프레이나 프린팅 방식으로 도포하고 적색형광체 입자(R1)의 유동이 제한되도록 수지조성물을 부분 경화 또는 완전 경화시킴으로써 적색형광층(R)을 형성시킨다. First, as shown in FIG. 4A, the resin composition containing the red phosphor particles R1 is applied onto the base film 101 by spraying or printing, and the resin composition is applied to limit the flow of the red phosphor particles R1. The red fluorescent layer R is formed by partial curing or complete curing.
다음에, 도 4b에 도시된 바와 같이, 녹색형광체 입자(G1)가 혼합되어 있는 수지조성물을 적색형광층(G) 상에 스프레이나 프린팅 방식으로 도포한 후 녹색형광체 입자(G1)의 유동이 제한되도록 수지조성물을 부분 경화 또는 완전 경화시킴으로써 녹색형광층(G)을 형성시킨다. 이어서, 도 4c에 도시된 바와 같이 녹색형광층(G) 상에 보호필름(102)을 형성한다. 도 3의 형광시트(110)의 경우에는 녹색형광층(G) 위에 황색형광층(Y)을 더 설치한 후 보호필름(102)이 형성된다. Next, as shown in FIG. 4B, the resin composition containing the green phosphor particles G1 is mixed onto the red phosphor layer G by spraying or printing, and then the flow of the green phosphor particles G1 is limited. The green fluorescent layer G is formed by partially or completely curing the resin composition as much as possible. Subsequently, a protective film 102 is formed on the green fluorescent layer G as shown in FIG. 4C. In the case of the fluorescent sheet 110 of FIG. 3, after the yellow phosphor layer Y is further installed on the green phosphor layer G, the protective film 102 is formed.
종래의 디스펜싱 방식을 따를 경우, 백색광을 얻기 위해서는 황색형광체 입자(Y1), 녹색형광체 입자(G1), 적색형광체 입자(R1)가 한꺼번에 조합으로 혼합되어 있는 액상 형광 수지조성물을 디스펜싱 방식으로 도포하게 될 것인데, 이 경우 하나의 형광층 내에서 황색형광체 입자(Y1), 녹색형광체 입자(G1), 및 적색형광체 입자(R1)가 제대로 혼합되어 균일하게 분포되게 하기가 어렵기 때문에 형광층 전체로 볼 때 균일한 백색광을 얻기가 어려운 문제가 있다. According to the conventional dispensing method, in order to obtain white light, a liquid fluorescent resin composition in which yellow phosphor particles (Y1), green phosphor particles (G1), and red phosphor particles (R1) are mixed in a combination is applied by a dispensing method. In this case, since the yellow phosphor particles (Y1), the green phosphor particles (G1), and the red phosphor particles (R1) are not properly mixed and uniformly distributed in one phosphor layer, the entire phosphor layer is difficult. There is a problem that it is difficult to obtain uniform white light.
그러나 본 발명에서와 같이 각 형광층(Y, G, R)이 층별로 배치(layer-by-layer)되도록 하면, 이러한 형광체 입자(Y1, G1, R1) 상호간의 불균일한 혼합 문제가 해결되어 형광시트(110) 전체에 대해서 백색광이 균일하게 발현될 수 있다. 또한 스토크 쉬프트(stokes shift)를 줄이는 방식으로 광추출 효율이 향상되고, 형광층(Y, G, R)의 두께 제어도 용이하다는 장점도 있다. However, if each fluorescent layer (Y, G, R) is arranged layer-by-layer as in the present invention, the problem of non-uniform mixing between the phosphor particles (Y1, G1, R1) is solved by fluorescence White light may be uniformly expressed with respect to the entire sheet 110. In addition, the light extraction efficiency is improved by reducing the stoke shift, and the thickness of the fluorescent layers (Y, G, R) can be easily controlled.
베이스필름(101)은 형광시트(110)의 형태 유지 및 지지를 위한 것이고, 보호필름(102)은 보관 및 운반과정에서 형광시트(110)를 보호하기 위한 것으로서, 후술하는 바와 같이 형광시트(110)를 발광다이오드 장치에 설치하는 과정에서는 보호필름(102)을 먼저 제거하여 형광시트(110)의 녹색형광층(G)이 발광다이오드 칩에 접착되도록 할 것이기에 위와 같은 순서로 형성하는 것이 바람직하다. The base film 101 is for maintaining and supporting the shape of the fluorescent sheet 110, and the protective film 102 is for protecting the fluorescent sheet 110 during the storage and transport process, as described below the fluorescent sheet 110 ) In the process of installing the light emitting diode device, the protective film 102 is first removed so that the green fluorescent layer G of the fluorescent sheet 110 is bonded to the light emitting diode chip.
베이스필름(101)과 보호필름(102)의 재질로는 PVC, 폴리올레핀(polyolefin), PET, PT 등 공지의 고분자 재질이 선택될 수 있다. 베이스필름(101)과 형광시트(110) 사이에는 점착력이 약한 임시적 점착층이 존재하고, 보호필름(102)과 형광시트(110) 사이에는 이형제가 도포될 수 있으나, 이들은 반드시 있어야 하는 것은 아니다. As a material of the base film 101 and the protective film 102, a known polymer material such as PVC, polyolefin, PET, PT, or the like may be selected. A temporary adhesive layer having a weak adhesive force exists between the base film 101 and the fluorescent sheet 110, and a release agent may be applied between the protective film 102 and the fluorescent sheet 110, but they are not necessarily required.
본 발명의 경우, 형광시트(110)가 부분 경화 또는 완전 경화된 필름 형태로 존재하기 때문에 형광시트(110)의 보관이나 추후 사용과정에서 형광체 입자(G1, R1)가 유동되어 불균일하게 분포되는 문제가 발생하지 않고, 또한 이미 형광시트(110)의 두께가 일정하기 때문에 두께 불균일에 의한 문제가 발생하지 않는다. In the case of the present invention, since the fluorescent sheet 110 is present in the form of a partially cured or fully cured film, the phosphor particles (G1, R1) flow in a non-uniform distribution during the storage or future use of the fluorescent sheet 110 Does not occur, and since the thickness of the fluorescent sheet 110 is already constant, a problem due to thickness unevenness does not occur.
[발광다이오드 장치 및 그 제조방법] [Light Emitting Diode Device and Manufacturing Method Thereof]
[제1실시예][First Embodiment]
도 5는 본 발명에 따른 발광다이오드 장치 및 그 제조방법의 제1실시예를 설명하기 위한 도면으로서, 플립 칩(flip chip)형 발광 다이오드 칩의 경우를 예로 든 것이다. FIG. 5 is a view for explaining a first embodiment of a light emitting diode device and a method of manufacturing the same according to the present invention, taking a flip chip type light emitting diode chip as an example.
먼저, 도 5a에 도시된 바와 같이, 도 2의 형광시트(110)에서 녹색형광층(G)이 노출되도록 보호필름(102)을 제거한 후, 도 5b에 도시된 바와 같이, 도전성 범프(11)가 있는 제1면과 그 반대편의 제2면을 갖는 발광다이오드 칩(10)의 상기 제2면이 녹색형광층(G)을 향하도록 형광시트(110) 상에 발광다이오드 칩(10)을 소정간격으로 복수개 설치한다. First, as shown in FIG. 5A, the protective film 102 is removed from the fluorescent sheet 110 of FIG. 2 so that the green fluorescent layer G is exposed, and then the conductive bump 11 is shown in FIG. 5B. The light emitting diode chip 10 is disposed on the fluorescent sheet 110 so that the second surface of the light emitting diode chip 10 having a first surface having a first surface and a second surface opposite thereto is directed toward the green fluorescent layer G. Install more than one at intervals.
다음에, 도 5c에 도시된 바와 같이, 발광다이오드 칩(10)의 제1면과 제2면 사이의 측면이 경화형 액상 수지조성물(120)에 둘러싸이도록 발광다이오드 칩(10) 사이를 경화형 액상 수지조성물(120)로 도포하여 채운다. 경화형 액상 수지조성물(120)의 도포는 종래와 같이 통상적인 디스펜싱 공정을 통하여 이루어진다. Next, as shown in FIG. 5C, the curable liquid resin is interposed between the light emitting diode chips 10 such that a side surface between the first and second surfaces of the light emitting diode chip 10 is surrounded by the curable liquid resin composition 120. It is applied and filled with the composition 120. Application of the curable liquid resin composition 120 is performed through a conventional dispensing process as in the prior art.
이어서, 도 5d에 도시된 바와 같이, 경화형 액상 수지조성물(120)을 경화시켜 측면수지층(121)을 형성한 후, 도 5e에 도시된 바와 같이, 발광다이오드 칩(10) 사이를 절단하고, 베이스필름(101)을 제거하여, 도 3f에서와 같이 본 발명에 따른 발광다이오드 장치(100)를 얻는다. Subsequently, as shown in FIG. 5D, the curable liquid resin composition 120 is cured to form the side resin layer 121, and then, as shown in FIG. 5E, the light emitting diode chips 10 are cut off. The base film 101 is removed to obtain the light emitting diode device 100 according to the present invention as shown in FIG. 3F.
따라서 본 발명에 따른 발광다이오드 장치(100)는 도전성 범프(11)가 있는 제1면과 그 반대편의 제2면을 갖는 발광다이오드 칩(10)의 상기 제2면에 형광시트(110)가 설치되고, 발광다이오드 칩(10)의 제1면과 제2면 사이의 측면은 측면수지층(121)에 의해 둘러싸인 구조를 갖는다. Accordingly, in the light emitting diode device 100 according to the present invention, a fluorescent sheet 110 is installed on the second surface of the light emitting diode chip 10 having a first surface having a conductive bump 11 and a second surface opposite thereto. The side surface between the first surface and the second surface of the light emitting diode chip 10 has a structure surrounded by the side resin layer 121.
구체적으로 볼 때, 형광시트(110)는 발광다이오드 칩(10)에서 벗어나도록 옆으로 연장된 연장부(122)를 가지며, 측면수지층(121)은 이러한 연장부(122) 상에서 연장부(122)에 접하면서 발광다이오드 칩(10)의 측면을 둘러싸도록 설치된다. Specifically, the fluorescent sheet 110 has an extension 122 extending laterally away from the light emitting diode chip 10, and the side resin layer 121 has an extension 122 on the extension 122. ) Is installed so as to surround the side of the light emitting diode chip (10).
측면수지층(121)은 디스펜싱 방식으로 도포된 액상 수지조성물이 경화되어 이루어진 것이며, 형광시트(110)은 녹색형광층(G)과 적색형광층(R)이 순차적으로 배열되어 이루어지되, 녹색형광층(G)이 발광다이오드 칩(10)의 제2면을 향하도록 설치된다. The side resin layer 121 is formed by curing a liquid resin composition applied by a dispensing method, and the fluorescent sheet 110 is formed by sequentially arranging a green fluorescent layer (G) and a red fluorescent layer (R). The fluorescent layer G is provided to face the second surface of the light emitting diode chip 10.
도 6은 본 발명의 제1실시예에 따른 발광다이오드 장치의 변형 예들을 설명하기 위한 도면이다. 6 is a diagram for describing modifications of the light emitting diode device according to the first embodiment of the present invention.
도 6a에 도시된 바와 같이, 적색형광층(R)의 반대편에 위치하도록 녹색형광층(G)의 다른 편에 황색형광층(Y)이 더 형성된 도 3과 같은 형광시트(110)를 사용하는 경우에는 황색형광층(Y)이 발광다이오드 칩(10)의 제2면을 향하도록 설치됨으로써, 발광다이오드 칩(10) 쪽에서부터 황색형광층(Y), 녹색형광층(G), 적색형광층(R)이 순차적으로 배열되도록 하는 것이 바람직하다. As shown in FIG. 6A, a fluorescent sheet 110 as shown in FIG. 3 is further formed in which a yellow fluorescence layer Y is further formed on the other side of the green fluorescence layer G so as to be opposite to the red fluorescence layer R. In this case, the yellow phosphor layer Y is disposed to face the second surface of the light emitting diode chip 10, so that the yellow phosphor layer Y, the green phosphor layer G, and the red phosphor layer from the light emitting diode chip 10 side. It is preferable to arrange (R) sequentially.
이렇게 형광층의 배열순서가 중요한 이유는 스토크 쉬프트(stokes shift)를 줄이는 방식으로 광추출 효율을 향상시키는 데 바람직하기 때문이다. The order of the arrangement of the fluorescent layers is important because it is desirable to improve the light extraction efficiency by reducing the stokes shift.
경화형 액상 수지조성물(120)에는 형광체 입자가 포함될 수도 있고, 반사성 입자가 포함될 수도 있으며, 경우에 따라서는 이들이 조합으로 포함될 수도 있다.The curable liquid resin composition 120 may include phosphor particles, reflection particles may be included, and in some cases, they may be included in combination.
형광체 입자(Y1, G1, R1)가 포함되어 있는 경화형 액상 수지조성물(120)을 사용하는 경우에는, 도 6b에서와 같이 수지층(121)에 형광체 입자(Y1, G1, R1)가 존재하게 되므로 수지층(121)을 통해서도 백색광이 방출될 것이다. In the case of using the curable liquid resin composition 120 containing the phosphor particles Y1, G1, and R1, the phosphor particles Y1, G1, and R1 are present in the resin layer 121 as shown in FIG. 6B. White light will also be emitted through the resin layer 121.
백색광이 제대로 구현되도록 하기 위해서는 경화형 액상 수지조성물(120)에 한 종류의 형광체 입자만 포함시키는 것이 아니라 여러 종류의 형광체 입자를 포함시키는 것이 더욱 바람직하다. In order to properly implement the white light, it is more preferable to include not only one kind of phosphor particles in the curable liquid resin composition 120 but also various kinds of phosphor particles.
예컨대, 황색형광체 입자(Y1), 녹색형광체 입자(G1), 적색형광체 입자(R1)가 한꺼번에 조합으로 혼합되어 포함되도록 하는 것이 더욱 바람직하다는 것이다. 그러나 이 경우 경화형 액상 수지조성물(120)이 디스펜싱 공정을 통하여 도포되기 때문에 앞서 언급한 바와 같이 형광체 입자가 서로 균일하게 혼합되어 분포되지 않을 수는 있다. 물론 종래와 같이 황색형광체 입자(Y1)만 사용될 수도 있다. 황색형광체 입자(Y1) 없이 녹색형광체 입자(G1)와 적색형광체 입자(R1)가 혼합되어도 좋다. For example, it is more preferable that the yellow phosphor particles (Y1), the green phosphor particles (G1), and the red phosphor particles (R1) are mixed and contained at once in combination. In this case, however, since the curable liquid resin composition 120 is applied through a dispensing process, the phosphor particles may not be uniformly mixed with each other and distributed as described above. Of course, only the yellow phosphor particles Y1 may be used as in the related art. The green phosphor particles G1 and the red phosphor particles R1 may be mixed without the yellow phosphor particles Y1.
반사성 입자(130)가 포함되어 있는 경화형 액상 수지조성물(120)을 사용하는 경우에는, 도 6c에서와 같이 수지층(121)에 반사성 입자(130)가 존재하게 되므로, 빛이 형광시트(110)가 있는 쪽으로 가이드 되어 형광시트(110)을 통하여 더욱 강한 백색광이 방출될 것이다. 이러한 반사성 입자(130)의 예로는 TiO2 등을 들 수 있다. In the case of using the curable liquid resin composition 120 including the reflective particles 130, since the reflective particles 130 are present in the resin layer 121 as shown in FIG. 6C, light is emitted from the fluorescent sheet 110. Being guided to the side will be emitted more intense white light through the fluorescent sheet (110). Examples of such reflective particles 130 are TiO 2 Etc. can be mentioned.
도 5c에서와 같이 경화형 액상 수지조성물(120)을 도포하는 과정에서 경화형 액상 수지조성물(120)의 양을 적절히 조절하여 경화형 액상 수지조성물(120)이 발광다이오드 칩(10)의 제1면을 덮도록 하면, 도 6d에서와 같이 도전성 범프(11)는 노출되는 상태로 발광다이오드 칩(10)의 제1면에도 수지층(121)이 형성된다. 이 때 앞서 설명한 바와 같이 경화형 액상 수지조성물(120)에 형광체 입자가 포함되어 있는 경우라면 제1면을 통하여도 백색광이 방출될 것이다. In the process of applying the curable liquid resin composition 120 as shown in FIG. 5C, the amount of the curable liquid resin composition 120 is appropriately adjusted so that the curable liquid resin composition 120 covers the first surface of the light emitting diode chip 10. As shown in FIG. 6D, the resin bumps 121 are formed on the first surface of the light emitting diode chip 10 while the conductive bumps 11 are exposed. At this time, if the phosphor particles are included in the curable liquid resin composition 120 as described above, white light may be emitted through the first surface.
위의 여러가지 실시예는 독립적인 것이 아니라 상호 보완적으로 채택될 수 있는 것이다. The various embodiments above are not independent but can be complementarily employed.
[제2실시예]Second Embodiment
도 7은 본 발명에 따른 발광다이오드 장치 및 그 제조방법의 제2실시예를 설명하기 위한 도면이다. 7 is a view for explaining a second embodiment of a light emitting diode device and a method of manufacturing the same according to the present invention.
먼저, 도 7a에 도시된 바와 같이, 제1면과 그 반대편의 제2면을 가지고 상기 제1면과 제2면 사이에서 측면을 가지는 발광다이오드 칩(10)을 준비하고, 상기 제1면이 칩 웨이퍼 필름(310)을 향하도록 발광다이오드 칩(10)을 칩 웨이퍼 필름 상(310)에 서로 이격되게 복수개 설치한 후, 발광다이오드 칩(10)의 상부 공간에 형광시트(110)를 배치시킨다. First, as shown in FIG. 7A, a light emitting diode chip 10 having a first surface and a second surface opposite thereto and having a side surface between the first surface and the second surface is prepared, and the first surface is After the plurality of light emitting diode chips 10 are disposed on the chip wafer film 310 so as to face the chip wafer film 310, the fluorescent sheet 110 is disposed in the upper space of the light emitting diode chip 10. .
형광시트(110)는 단일의 형광층으로 이루어질 수도 있지만, 앞서 설명한 바와 같이 복수개의 형광층을 포함하여 이루어지는 것이 바람직하다. 복수개의 형광층으로 이루어지는 경우에는 발광다이오드 칩(10) 쪽에서부터 황색형광층(Y), 녹색형광층(G), 적색형광층(R)이 순차적으로 배치되도록 하는 것이 바람직하다. 이 때, 황색형광층(Y)은 생략이 가능하다. The fluorescent sheet 110 may be formed of a single fluorescent layer, but preferably includes a plurality of fluorescent layers as described above. In the case of the plurality of fluorescent layers, it is preferable to sequentially arrange the yellow phosphor layer Y, the green phosphor layer G, and the red phosphor layer R from the light emitting diode chip 10 side. At this time, the yellow fluorescent layer Y can be omitted.
다음에, 도 7b 및 도 7c에서와 같이, 100~200℃의 온도에서 금형이나 지그 등을 이용하여 형광시트(110)가 발광다이오드 칩(10)의 제2면과 이에 인접한 측면 부위를 덮도록 형광시트(110)를 눌러 압착시킨다. 접착이 잘되게 하기 위하여 발광다이오드 칩(110)의 제2면에 접착층이 형성될 수 있으나 이에 대한 도시는 생략하였다. Next, as shown in FIGS. 7B and 7C, the fluorescent sheet 110 covers the second surface of the light emitting diode chip 10 and the side surface adjacent thereto by using a mold or a jig at a temperature of 100 ° C. to 200 ° C. FIG. The fluorescent sheet 110 is pressed. An adhesive layer may be formed on the second surface of the light emitting diode chip 110 to improve adhesion, but the illustration thereof is omitted.
이어서, 도 7d에 도시된 바와 같이, 발광다이오드 칩(10) 사이를 절단한 후, 칩 웨이퍼 필름(310)을 제거하여, 도 7e에서와 같이, 발광다이오드 칩(10)의 제2면과 이에 인접한 측면 부위가 형광시트(110)에 의해 덮인 발광다이오드 장치(100)를 완성한다. Subsequently, as shown in FIG. 7D, after cutting between the light emitting diode chips 10, the chip wafer film 310 is removed, and as shown in FIG. 7E, the second surface of the light emitting diode chip 10 and the like. Adjacent side portions complete the light emitting diode device 100 covered by the fluorescent sheet 110.
발광다이오드 칩(10)이 플립 칩 형태일 경우에 발광다이오드 칩(10)의 제1면에 도전성 범프가 존재할 것이므로, 도 7d에서 공정을 마무리하여도 무방하겠지만, 발광다이오드 칩(10)이 레터럴(lateral)이나 버티칼(vertical) 칩으로서 와이어 본딩을 해야 하는 것이라면, 상기 제2면에 발광다이오드 칩(10)의 본딩전극이 존재할 것이므로 이를 외부와 접속시킬 수 있도록 추가적인 공정이 더 요구된다,Since the conductive bumps will be present on the first surface of the light emitting diode chip 10 when the light emitting diode chip 10 is a flip chip type, the process may be completed in FIG. 7d, but the light emitting diode chip 10 is lateral. If the wire bonding is to be performed as a lateral or vertical chip, a bonding electrode of the light emitting diode chip 10 will exist on the second surface so that an additional process is required to connect the external chip to the outside.
예컨대, 제2면상에 발광다이오드 칩(10)의 본딩전극이 있는 경우에는 이를 외부와 전기적으로 접속시키기 위하여 와이어 본딩을 하게 되는데, 이 경우 도 7f에서와 같이 형광시트(110)에 와이어 본딩용 홀(h)이 형성되는 것이 바람직하다. 이러한 와이어 본딩용 홀(h)은 도 7a 내지 도 7d 과정에서 애초부터 형광시트(110)에 존재할 수도 있고, 도 7e 단계 이후에 형성될 수 있다. 와이어 본딩용 홀(h)은 금속 또는 실리콘 재질의 몰더(molder)를 이용하여 만들 수 있다.For example, when there is a bonding electrode of the light emitting diode chip 10 on the second surface, wire bonding is performed to electrically connect it to the outside. In this case, as shown in FIG. 7F, a hole for wire bonding in the fluorescent sheet 110 is provided. It is preferable that (h) is formed. The wire bonding hole h may exist in the fluorescent sheet 110 from the beginning in FIGS. 7A to 7D and may be formed after the step 7E. The wire bonding hole h may be made using a metal or silicon molder.
[제3실시예]Third Embodiment
도 8은 본 발명에 따른 발광다이오드 장치 및 그 제조방법의 제3실시예를 설명하기 위한 도면이다. 8 is a view for explaining a third embodiment of a light emitting diode device and a method of manufacturing the same according to the present invention.
먼저, 도 8a에 도시된 바와 같이, 제1면과 그 반대편의 제2면을 가지고 상기 제1면과 제2면 사이에서 측면을 가지는 발광다이오드 칩(10)을 준비하고, 상기 제1면이 칩 웨이퍼 필름(310)을 향하도록 발광다이오드 칩(10)을 칩 웨이퍼 필름 상(310)에 서로 이격되게 복수개 설치한다. First, as shown in FIG. 8A, a light emitting diode chip 10 having a first surface and a second surface opposite thereto and having a side surface between the first surface and the second surface is prepared, and the first surface is A plurality of light emitting diode chips 10 are disposed on the chip wafer film 310 to be spaced apart from each other so as to face the chip wafer film 310.
다음에, 도 8b에 도시된 바와 같이 발광다이오드 칩(10)의 측면이 경화형 액상 수지조성물(120)에 의해 둘러싸이도록 발광다이오드 칩(10) 사이를 경화형 액상 수지조성물(120)로 도포하여 채운다. Next, as shown in FIG. 8B, the light emitting diode chip 10 is filled with the curable liquid resin composition 120 between the light emitting diode chips 10 such that the side surface of the light emitting diode chip 10 is surrounded by the curable liquid resin composition 120.
형광시트(110)는 단일의 형광층으로 이루어질 수도 있지만, 앞서 설명한 바와 같이 복수개의 형광층을 포함하여 이루어지는 것이 바람직하다. 복수개의 형광층으로 이루어지는 경우에는 발광다이오드 칩(10) 쪽에서부터 황색형광층(Y), 녹색형광층(G), 적색형광층(R)이 순차적으로 배치되도록 하는 것이 바람직하다. 이 때, 황색형광층(Y)은 생략이 가능하다. The fluorescent sheet 110 may be formed of a single fluorescent layer, but preferably includes a plurality of fluorescent layers as described above. In the case of the plurality of fluorescent layers, it is preferable to sequentially arrange the yellow phosphor layer Y, the green phosphor layer G, and the red phosphor layer R from the light emitting diode chip 10 side. At this time, the yellow fluorescent layer Y can be omitted.
이어서, 도 8c에서와 같이, 형광시트(110)를 상기 결과물 전면에 얹고 100~200℃의 온도에서 금형이나 지그 등을 이용하여 형광시트(110)를 가압하여 형광시트(110)를 발광다이오드 칩(10)의 제2면에 압착시킨다. 이 과정에서 경화형 액상 수지조성물(120)이 경화되어 측면수지층(121)이 형성된다. Subsequently, as shown in FIG. 8C, the fluorescent sheet 110 is placed on the entire surface of the resultant, and the fluorescent sheet 110 is pressed by using a mold or a jig at a temperature of 100 to 200 ° C. to fluoresce the fluorescent sheet 110. It presses on the 2nd surface of (10). In this process, the curable liquid resin composition 120 is cured to form the side resin layer 121.
다음에, 도 8d에 도시된 바와 같이, 발광다이오드 칩(10) 사이를 절단한 후, 칩 웨이퍼 필름(310)을 제거하여, 도 8e에서와 같이, 발광다이오드 칩(10)의 제2면에 형광시트(110)에 설치되고, 측면에는 측면수지층(121)이 형성된 본 발명에 따른 발광다이오드 장치(100)가 얻어진다. 이 때 형광시트(110)는 발광다이오드 칩(10)에서 벗어나도록 옆으로 연장된 연장부(122)를 가지고, 측면수지층(121)은 연장부(122) 상에서 연장부(122)에 접하면서 발광다이오드 칩(10)의 측면을 둘러싸도록 설치된다. 측면수지층(121)에는 앞서 언급한 바와 같이 형광체 입자 및 반사성 입자 중 적어도 어느 하나가 포함되는 것이 바람직하다. Next, as shown in FIG. 8D, after cutting between the light emitting diode chips 10, the chip wafer film 310 is removed and the second surface of the light emitting diode chip 10 is removed as shown in FIG. 8E. The light emitting diode device 100 according to the present invention, which is provided on the fluorescent sheet 110 and has side surface resin layers 121 formed thereon, is obtained. At this time, the fluorescent sheet 110 has an extension portion 122 extending laterally away from the light emitting diode chip 10, the side resin layer 121 is in contact with the extension portion 122 on the extension portion 122 It is installed to surround the side of the light emitting diode chip (10). As described above, the side resin layer 121 may include at least one of phosphor particles and reflective particles.
제2실시예의 경우와 마찬가지 이유로 도 8f에서와 같이 형광시트(110)에 와이어 본딩용 홀(h)을 형성시키는 공정이 추가로 더 진행될 수 있다. For the same reason as in the second embodiment, as shown in FIG. 8F, the process of forming the wire bonding hole h in the fluorescent sheet 110 may be further performed.
상술한 바와 같이 본 발명에 의하면, 형광층이 경화형 액상 형광 수지조성물의 디스펜싱 공정을 통하여 구현되는 것이 아니라 두께가 일정하면서도 균일한 형광시트를 통해 구현되기 때문에 색좌표 편차(Cx, Cy) 감소를 통한 분산 감소 및 적중률 향상을 도모할 수 있고, 특히, 형광시트(110)가 서로 다른 색을 방출하는 복수개의 형광층이 적층된 구조를 가짐으로써 더 확실한 백색광을 얻을 수 있으며, 스토크 쉬프트(stokes shift)를 줄이는 방식으로 광추출 효율이 향상된다. As described above, according to the present invention, since the fluorescent layer is not implemented through the dispensing process of the curable liquid fluorescent resin composition but is implemented through a uniform and uniform fluorescent sheet, the color coordinate deviation (Cx, Cy) is reduced through Dispersion can be reduced and hit rate can be improved. Particularly, since the fluorescent sheet 110 has a structure in which a plurality of fluorescent layers emitting different colors can be laminated, more reliable white light can be obtained, and stokes shift can be achieved. The light extraction efficiency is improved by reducing the

Claims (19)

  1. 발광다이오드 칩에서 방출되는 광에 의해 여기되어 광을 방출하도록 발광다이오드 장치에 사용되는 형광시트로서, A fluorescent sheet used in a light emitting diode device to be excited by light emitted from a light emitting diode chip to emit light,
    서로 다른 색의 빛을 방출하는 복수개의 형광층을 갖는 것을 특징으로 하는 형광시트. A fluorescent sheet comprising a plurality of fluorescent layers for emitting light of different colors.
  2. 제1항에 있어서, 녹색계열의 빛을 방출하는 녹색형광층과 적색계열의 빛을 방출하는 적색형광층이 순차적으로 배치되어 이루어지는 것을 특징으로 하는 형광시트. The fluorescent sheet of claim 1, wherein a green fluorescent layer emitting green light and a red fluorescent layer emitting red light are sequentially disposed.
  3. 제2항에 있어서, 상기 적색형광층의 반대편에 위치하도록 상기 녹색형광층의 다른 편에 황색계열의 빛을 방출하는 황색형광층이 더 형성됨으로써, 황색형광층, 녹색형광층, 및 적색형광층이 순차적으로 배치되어 이루어지는 것을 특징으로 하는 형광시트.The yellow fluorescent layer, the green fluorescent layer, and the red fluorescent layer of claim 2, wherein a yellow fluorescent layer for emitting yellow light is formed on the other side of the green fluorescent layer so as to be opposite to the red fluorescent layer. Fluorescent sheet characterized in that arranged sequentially.
  4. 도전성 범프가 있는 제1면과 그 반대편의 제2면을 갖는 발광다이오드 칩;A light emitting diode chip having a first surface with conductive bumps and a second surface opposite thereto;
    상기 제2면에 부착되도록 설치되는 형광시트; 및A fluorescent sheet installed to be attached to the second surface; And
    상기 발광다이오드 칩의 제1면과 제2면 사이의 측면을 둘러싸도록 설치되는 측면수지층;을 포함하여 이루어지는 것을 특징으로 하는 발광다이오드 장치. And a side resin layer disposed to surround a side surface between the first and second surfaces of the light emitting diode chip.
  5. 제4항에 있어서, 상기 형광시트는 상기 발광다이오드 칩에서 벗어나도록 옆으로 연장된 연장부를 가지고, 상기 측면수지층은 상기 연장부 상에서 상기 연장부에 접하면서 상기 발광다이오드 칩의 측면을 둘러싸도록 설치되는 것을 특징으로 하는 발광다이오드 장치. The light emitting device of claim 4, wherein the fluorescent sheet has an extended portion extending laterally away from the light emitting diode chip, and the side resin layer is disposed to surround the side surface of the light emitting diode chip while contacting the extension portion on the extending portion. Light emitting diode device, characterized in that.
  6. 제4항에 있어서, 상기 형광시트가 녹색형광층과 적색형광층이 순차적으로 배열되어 이루어지고, 상기 녹색형광층이 상기 발광다이오드 칩의 제2면을 향하도록 설치되는 것을 특징으로 하는 발광다이오드 장치. The light emitting diode device of claim 4, wherein the fluorescent sheet is formed by sequentially arranging a green fluorescent layer and a red fluorescent layer, and the green fluorescent layer is disposed to face the second surface of the LED chip. .
  7. 제6항에 있어서, 상기 적색형광층의 반대편에 위치하도록 상기 녹색형광층의 다른 편에 형성되어 황색형광층이 더 형성되고, 상기 형광시트는 상기 황색형광층이 상기 발광다이오드 칩의 제2면을 향하도록 설치되는 것을 특징으로 하는 발광다이오드 장치. The light emitting diode of claim 6, wherein the yellow phosphor layer is formed on the other side of the green phosphor layer so as to be opposite to the red phosphor layer, and the yellow phosphor layer is formed on the second surface of the light emitting diode chip. Light emitting diode device, characterized in that installed so as to face.
  8. 제4항에서 있어서, 상기 측면수지층이 형광체 입자 및 반사성 입자 중 적어도 어느 하나를 포함하여 이루어지는 것을 특징으로 하는 발광다이오드 장치. The light emitting diode device according to claim 4, wherein the side resin layer comprises at least one of phosphor particles and reflective particles.
  9. 도전성 범프가 있는 제1면과 그 반대편의 제2면을 갖는 발광다이오드 칩의 상기 제2면이 형광시트를 향하도록 상기 형광시트 상에 상기 발광다이오드 칩을 소정간격으로 복수개 설치하는 단계;Providing a plurality of the light emitting diode chips on the fluorescent sheet at predetermined intervals such that the second surface of the light emitting diode chip having a first surface with a conductive bump and a second surface opposite thereto faces the fluorescent sheet;
    상기 발광다이오드 칩의 제1면과 제2면 사이의 측면이 경화형 액상 수지조성물에 의해 둘러싸이도록 상기 발광다이오드 칩 사이에 상기 경화형 액상 수지조성물을 도포하는 단계;Applying the curable liquid resin composition between the light emitting diode chips such that a side surface between the first and second surfaces of the light emitting diode chip is surrounded by the curable liquid resin composition;
    상기 경화형 액상 수지조성물을 경화시켜 측면수지층을 형성하는 단계; 및Curing the curable liquid resin composition to form a side resin layer; And
    상기 발광다이오드 칩 사이를 절단하여 상기 발광다이오드 칩의 제2면에는 상기 형광시트가 설치되고 상기 발광다이오드 칩의 측 부위에는 상기 측면수지층이 설치되는 발광다이오드 장치를 얻는 단계; 를 포함하는 것을 특징으로 하는 발광다이오드 장치 제조방법. Cutting the light emitting diode chip to obtain a light emitting diode device in which the fluorescent sheet is installed on a second surface of the light emitting diode chip and the side resin layer is provided on a side portion of the light emitting diode chip; Light emitting diode device manufacturing method comprising a.
  10. 제9항에 있어서, 상기 형광시트가 녹색형광층과 적색형광층이 순차적으로 배열되어 이루어지고, 상기 녹색형광층이 상기 발광다이오드 칩의 제2면을 향하도록 설치되는 것을 특징으로 하는 발광다이오드 장치 제조방법. The light emitting diode device of claim 9, wherein the fluorescent sheet is formed by sequentially arranging a green fluorescent layer and a red fluorescent layer, and wherein the green fluorescent layer is disposed to face the second surface of the LED chip. Manufacturing method.
  11. 제10항에 있어서, 상기 적색형광층의 반대편에 위치하도록 상기 녹색형광층의 다른 편에 황색형광층이 더 형성되고, 상기 형광시트는 상기 황색형광층이 상기 발광다이오드 칩의 제2면을 향하도록 설치되는 것을 특징으로 하는 발광다이오드 장치 제조방법. The light emitting device of claim 10, wherein a yellow fluorescent layer is further formed on the other side of the green fluorescent layer so as to be opposite to the red fluorescent layer, and the fluorescent sheet has the yellow fluorescent layer facing the second surface of the light emitting diode chip. Light emitting diode device manufacturing method characterized in that it is installed to.
  12. 제9항에 있어서, 상기 경화형 액상 수지조성물이 형광체 입자 및 반사성 입자 중 적어도 어느 하나를 포함하여 이루어지는 것을 특징으로 하는 발광다이오드 장치 제조방법. 10. The method of claim 9, wherein the curable liquid resin composition comprises at least one of phosphor particles and reflective particles.
  13. 제1면과 그 반대편의 제2면을 가지고 상기 제1면과 제2면 사이에서 측면을 가지는 발광다이오드 칩; 및A light emitting diode chip having a first surface and a second surface opposite thereto and having a side surface between the first surface and the second surface; And
    상기 발광다이오드 칩의 제2면을 덮도록 설치되는 형광시트; 를 포함하여 이루어지는 것을 특징으로 하는 발광다이오드 장치. A fluorescent sheet disposed to cover the second surface of the light emitting diode chip; Light emitting diode device comprising a.
  14. 제13항에 있어서, 상기 형광시트가 상기 발광다이오드 칩에서 상기 제2면에 인접하는 상기 측면까지 덮도록 설치되는 것을 특징으로 하는 발광다이오드 장치. The light emitting diode device of claim 13, wherein the fluorescent sheet is provided to cover the side surface of the light emitting diode chip adjacent to the second surface.
  15. 제13항에 있어서, 상기 형광시트는 상기 발광다이오드 칩에서 벗어나도록 옆으로 연장된 연장부를 가지고, 상기 연장부 상에서 상기 연장부에 접하면서 상기 발광다이오드 칩의 측면을 둘러싸도록 측면수지층이 형성되는 것을 특징으로 하는 발광다이오드 장치. 15. The method of claim 13, wherein the fluorescent sheet has an extension extending laterally away from the light emitting diode chip, the side resin layer is formed to surround the side of the light emitting diode chip in contact with the extension on the extension portion Light emitting diode device, characterized in that.
  16. 제13항에 있어서, 상기 형광시트가 녹색형광층과 적색형광층이 순차적으로 배열되어 이루어지고, 상기 녹색형광층이 상기 발광다이오드 칩의 제2면을 향하도록 설치되는 것을 특징으로 하는 발광다이오드 장치. The light emitting diode device of claim 13, wherein the fluorescent sheet is formed by sequentially arranging a green fluorescent layer and a red fluorescent layer, and wherein the green fluorescent layer is disposed to face the second surface of the LED chip. .
  17. 제16항에 있어서, 상기 적색형광층의 반대편에 위치하도록 상기 녹색형광층의 다른 편에 황색형광층이 더 형성되고, 상기 형광시트는 상기 황색형광층이 상기 발광다이오드 칩의 제2면을 향하도록 설치되는 것을 특징으로 하는 발광다이오드 장치. 17. The light emitting device of claim 16, wherein a yellow fluorescent layer is further formed on the other side of the green fluorescent layer so as to be opposite to the red fluorescent layer, and the fluorescent sheet has the yellow fluorescent layer facing the second surface of the light emitting diode chip. Light emitting diode device characterized in that it is installed to.
  18. 제15항에 있어서, 상기 측면수지층이 형광체 입자 및 반사성 입자 중 적어도 어느 하나를 포함하여 이루어지는 것을 특징으로 하는 발광다이오드 장치. The light emitting diode device of claim 15, wherein the side resin layer comprises at least one of phosphor particles and reflective particles.
  19. 제13항에 있어서, 상기 발광다이오드 칩의 제2면에 본딩전극이 형성되고 상기 본딩전극이 노출되도록 상기 형광시트에 와이어 본딩용 홀이 형성되는 것을 특징으로 발광다이오드 장치. The light emitting diode device of claim 13, wherein a bonding electrode is formed on a second surface of the light emitting diode chip, and a hole for wire bonding is formed in the fluorescent sheet to expose the bonding electrode.
PCT/KR2016/003087 2015-03-30 2016-03-25 Light-emitting diode device, manufacturing method therefor, and fluorescent sheet used therein WO2016159595A1 (en)

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KR20120014853A (en) * 2010-08-10 2012-02-20 엘지이노텍 주식회사 Light emitting device
KR20120061376A (en) * 2010-12-03 2012-06-13 삼성엘이디 주식회사 Method of applying phosphor on semiconductor light emitting device
JP2014110333A (en) * 2012-12-03 2014-06-12 Citizen Holdings Co Ltd Led device and manufacturing method thereof
JP2014112669A (en) * 2012-11-12 2014-06-19 Citizen Holdings Co Ltd Semiconductor light-emitting device and manufacturing method of the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010130000A (en) * 2008-11-27 2010-06-10 Lighthouse Technology Co Ltd Optical film
KR20120014853A (en) * 2010-08-10 2012-02-20 엘지이노텍 주식회사 Light emitting device
KR20120061376A (en) * 2010-12-03 2012-06-13 삼성엘이디 주식회사 Method of applying phosphor on semiconductor light emitting device
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