WO2016138735A1 - 一种无线充电装置 - Google Patents

一种无线充电装置 Download PDF

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Publication number
WO2016138735A1
WO2016138735A1 PCT/CN2015/085448 CN2015085448W WO2016138735A1 WO 2016138735 A1 WO2016138735 A1 WO 2016138735A1 CN 2015085448 W CN2015085448 W CN 2015085448W WO 2016138735 A1 WO2016138735 A1 WO 2016138735A1
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Prior art keywords
resistor
capacitor
module
chip
grounded
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PCT/CN2015/085448
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English (en)
French (fr)
Inventor
王江
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Huizhou TCL Mobile Communication Co Ltd
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Huizhou TCL Mobile Communication Co Ltd
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Priority to US14/912,153 priority Critical patent/US9973030B2/en
Publication of WO2016138735A1 publication Critical patent/WO2016138735A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
    • H02J7/40—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries characterised by the exchange of charge or discharge related data
    • H02J7/42—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries characterised by the exchange of charge or discharge related data with electronic devices having internal batteries, e.g. mobile phones
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/80—Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
    • H02J7/02—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries for charging batteries from AC mains by converters

Definitions

  • the present invention relates to the field of wireless charging technologies, and in particular, to a wireless charging device.
  • An X-Watch wearable product In addition to the features of most current smart watches (such as a variety of sensors, Bluetooth), the application also needs to be able to wirelessly charge.
  • wireless charging has two standards in consumer electronics, Qi magnetic induction and A4WP. (Alliance for Wireless Power) Magnetic resonance mode. Although these two standards have many advantages, they still need to be improved and improved from the current technical point of view, and are rarely used in consumer electronics.
  • the PCB area of the X-Watch wearable product is usually 30 mm ⁇ 17 Mm.
  • the wireless charging module occupies a large space of the PCB board. Therefore, the hardware circuit design of the wireless charging must be simplified and can be implemented to truly complete the wireless charging.
  • the technical problem to be solved by the present invention is to provide a wireless charging device for solving the above-mentioned defects of the prior art, which aims to solve the problem that the existing wireless charging module occupies a large space of the PCB board.
  • a wireless charging device is connected to the charging base and the battery, and comprises an oscillation module, a rectification step-down module, a power management module and a Bluetooth communication module, wherein the oscillation module, the rectification step-down module and the power management module are sequentially connected, and the Bluetooth communication module Connect the rectifier buck module, and the power management module is connected to the battery;
  • the Bluetooth communication module communicates with the charging base to obtain a charging communication protocol, and the oscillation module receives the signal sent by the charging base and oscillates to generate an alternating current, and the rectifying step-down module rectifies and steps down the alternating current to output a direct current reference voltage, and the power supply
  • the management module charges the battery by outputting a charging voltage after the reference voltage is stepped down.
  • the oscillating module includes a first antenna, a second antenna, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, and a fifth capacitor;
  • the first antenna is connected to the first capacitor
  • One end of the first capacitor is connected to one end of the fifth capacitor and the rectifying step-down module, the second capacitor is connected in parallel with the first capacitor, the second antenna is connected to one end of the third capacitor, and the other end of the third capacitor is connected The other end of the five capacitors and the rectified buck module, the fourth capacitor is connected in parallel with the third capacitor.
  • the rectifying step-down module includes a resonant chip and an inductor, and the AC+ end of the resonant chip is connected to the other end of the first capacitor and one end of the fifth capacitor, and the AC-end of the resonant chip is connected to the third The other end of the capacitor and the other end of the fifth capacitor, the SW end of the resonant chip is connected to one end of the inductor, the other end of the inductor is connected to the power management module, the TEMP end of the resonant chip is connected to the Bluetooth communication module, and the PVIN end of the resonant chip is connected to the power supply end.
  • the PGND terminal and the PGND2 terminal of the resonant chip are grounded.
  • the rectifying and step-down module further includes: a first protection circuit, a second protection circuit, and a detection circuit; the detection circuit is connected to the resonance chip, the first protection circuit, and the second protection circuit, The first protection circuit and the second protection circuit are all connected to the oscillation module;
  • the detecting circuit detects that the voltage in the resonant chip is greater than the preset voltage, and outputs a step-down signal to the first protection circuit and the second protection circuit, and the first protection circuit and the second protection circuit step down the oscillation module.
  • the first protection circuit includes a first MOS transistor and a sixth capacitor; a gate of the first MOS transistor is connected to the detection circuit, and a drain of the first MOS transistor is connected through a sixth capacitor An antenna and one end of the first capacitor, the source of the first MOS transistor is grounded.
  • the second protection circuit includes a second MOS transistor and a seventh capacitor, a gate of the second MOS transistor is connected to the detection circuit, and a drain of the second MOS transistor is connected through the seventh capacitor.
  • One end of the second antenna and the third capacitor, and the source of the second MOS transistor is grounded.
  • the detecting circuit includes a first resistor, a second resistor, an eighth capacitor, and an inverter; one end of the first resistor is connected to a gate of the first MOS transistor and a second MOS transistor The other end of the first resistor is connected to the B2 pin of the inverter, the B1 pin of the inverter is grounded, the A1 pin of the inverter is connected to the CLAMP1 end of the resonant chip and the end of the second resistor, and the A2 pin of the inverter Connect the power terminal and the other end of the second resistor.
  • the A2 pin of the inverter is also grounded through the eighth capacitor.
  • the rectifying and step-down module further includes a temperature detecting circuit for detecting a temperature of the resonant chip and transmitting the temperature to the Bluetooth communication module, wherein the temperature detecting circuit includes a third resistor and a fourth resistor. a fifth resistor, a sixth resistor, and a ninth capacitor;
  • One end of the third resistor is connected to the TEMP pin of the resonant chip, one end of the fourth resistor and one end of the fifth resistor, one end of the ninth capacitor is connected to one end of the fourth resistor and the Bluetooth communication module, and the other end of the third resistor The other end of the fourth resistor and the other end of the ninth capacitor are grounded; the other end of the fifth resistor is connected to the VLDO end of the resonant chip, and is connected to the Bluetooth communication module through the sixth resistor.
  • the rectifying and step-down module further includes a current detecting circuit, the current detecting circuit includes a seventh resistor, and one end of the seventh resistor is connected to the VRECTS1 end and the VRECT end of the resonant chip, and the seventh resistor The other end is connected to the VRECTS2 terminal and the PVIN terminal of the resonant chip.
  • the power management module includes a charging chip, an eighth resistor, a ninth resistor, a tenth resistor, an eleventh resistor, a twelfth resistor, a thirteenth resistor, a tenth capacitor, and a tenth a capacitor;
  • the charge pin of the charging chip is connected to the battery, and is also grounded through the tenth capacitor, the TS pin of the charging chip is grounded through the eighth resistor, the PRE_TERM pin of the charging chip is grounded through the ninth resistor, and the ISET pin of the charging chip passes the tenth
  • the resistor is grounded, the VSS pin of the charging chip is grounded, the other end of the charging chip's IN pin is connected to the other end of the inductor and the eleventh resistor is also grounded through the eleventh capacitor, and the other end of the eleventh resistor is connected to the twelfth resistor.
  • One end and the main controller, the other end of the twelfth resistor is grounded through the thirteenth resistor.
  • the wireless charging device acquires a charging communication protocol by communicating with a charging base through a Bluetooth communication module, and the oscillation module receives a signal from the charging base and oscillates to generate an alternating current, and the alternating current of the step-down module is rectified. After rectifying and stepping down, the reference voltage of the direct current is output, and the power management module outputs the charging voltage to the battery after the voltage is stepped down; the wireless charging device only needs to occupy an area of not more than 8 mm ⁇ 8 mm on the PCB board, and the occupied area is small. It can be easily integrated into the current smart wearable and portable devices, that is, wireless charging can be achieved, and the charging circuit design can be simplified.
  • FIG. 1 is a structural diagram of a wireless charging device provided by the present invention.
  • FIG. 2 is a circuit diagram of an oscillation module and a rectification step-down module in the wireless charging device provided by the present invention.
  • FIG. 3 is a circuit diagram of a power management module in a wireless charging device provided by the present invention.
  • the invention provides a wireless charging device, which is suitable for an end consumer electronic device, a wearable device and an electronic product that requires daily charging of a wireless power source, such as a portable product such as a watch, a mobile phone or the like.
  • the invention is based on A4WP Wireless charging technology, model number is The MAP7101's chip design hardware circuit for wireless charging control and optimization of the chip's peripheral circuits.
  • the A4WP is a standard for wireless charging magnetic resonance. The principle of magnetic resonance is the same as that of sound.
  • the tuning forks with the same vibration frequency are arranged. If one sounds, the other will resonate. Similarly, coils of the same vibration frequency arranged in a magnetic field can also be supplied from one to the other.
  • Magnetic resonance can extend the transmission distance compared to electromagnetic induction.
  • the magnetic resonance method is different from the electromagnetic induction method, and it is not necessary to completely match the positions between the coils.
  • the magnetic resonance mode consists of an energy transmitting device and an energy receiving device. When the two devices are adjusted to the same frequency or resonate at a preset frequency (6.78 MHz), the two devices can exchange energy with each other.
  • the wireless charging device provided by the present invention is used as a receiving end for wirelessly charging a battery, and the charging base of the wireless charging system sends a signal of a preset frequency to the wireless charging device.
  • the wireless charging device includes an oscillating module 100, a rectifying and step-down module 200, a power management module 300, and a Bluetooth communication module 400.
  • the oscillating module 100, the rectifying and step-down module 200, and the power management module 300 are sequentially connected, and the Bluetooth communication module 400 is connected.
  • the rectifier step-down module 200 and the power management module 300 are connected to the battery.
  • the Bluetooth communication module 400 and the charging stand establish a communication by Bluetooth to perform a handshake, and the Bluetooth communication module 400 acquires a communication protocol (such as charging power and temperature requirement) required to control the charging process.
  • the oscillating module 100 receives the signal from the charging cradle and oscillates to generate alternating current (corresponding to the charging pedestal and the oscillating module 100 performing magnetic resonance, generating the same frequency 6.78 MHz as the signal, at which time the magnetic field is converted into an electrical signal).
  • the rectifier step-down module 200 rectifies and steps down the alternating current output from the oscillation module 100, and outputs a reference voltage of the direct current.
  • the power management module 300 steps down the reference voltage and outputs a charging voltage to charge the battery.
  • the oscillating module 100 includes a first antenna A1, a second antenna A2, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, and a fifth capacitor C5.
  • the first antenna A1 is connected to one end of the first capacitor C1, the other end of the first capacitor C1 is connected to one end of the fifth capacitor C5 and the rectifying step-down module 200, and the second capacitor C2 is connected in parallel with the first capacitor C1, the second antenna A2
  • One end of the third capacitor C3 is connected, and the other end of the third capacitor C3 is connected to the other end of the fifth capacitor C5 and the rectifying step-down module 200.
  • the fourth capacitor C4 is connected in parallel with the third capacitor C3.
  • the first antenna A1 and the second antenna A2 are equivalent to an inductor for receiving a signal of the charging stand.
  • the first capacitor C1, the second capacitor C2, the third capacitor C3, the fourth capacitor C4, and the fifth capacitor C5 are all matching capacitors, and the inductor and the capacitor form an oscillating circuit to generate an alternating current to the rectifying step-down module.
  • the rectifying and step-down module includes a resonant chip U1 of the type MAP7101 and an inductor L.
  • the AC+ end of the resonant chip U1 is connected to the other end of the first capacitor C1 and one end of the fifth capacitor C5, and the AC-end of the resonant chip U1 is connected.
  • the other end of the third capacitor C3 and the other end of the fifth capacitor C5 the SW end of the resonant chip U1 is connected to one end of the inductor L, the other end of the inductor L is connected to the power management module 300, and the TEMP end of the resonant chip U1 is connected to the Bluetooth communication module 400.
  • the PVIN terminal of the resonant chip U1 is connected to the power terminal A4WP_VDD, and the PGND terminal and the PGND2 terminal of the resonant chip U1 are grounded.
  • the alternating current is input from the AC+ terminal and the AC- terminal of the resonant chip U1, rectified inside the resonant chip U1, and then DC-DC stepped down, and finally outputs a reference of 5V from the SW terminal, a maximum power of 5W, and a maximum current of 1A.
  • the voltage A4WP_VOUT is given to the power management module 300.
  • the rectifying and step-down module 200 further includes a first protection circuit 201, a second protection circuit 202, and a detection circuit 203.
  • the detecting circuit 203 is connected to the resonant chip U1, the first protection circuit 201 and the second protection circuit 202.
  • the first protection circuit 201 and the second protection circuit 202 are both connected to the oscillation module 100.
  • the detecting circuit 203 detects that the voltage in the resonant chip U1 is greater than the preset voltage, the outputting the buck signal to the first protection circuit 201 and the second protection circuit 202, the first protection circuit 201 and the second protection circuit 202 to the oscillation module 100 Perform a step-down.
  • the first protection circuit 201 includes a first MOS transistor Q1 and a sixth capacitor C6.
  • the second protection circuit 202 includes a second MOS transistor Q2 and a seventh capacitor C7.
  • the detecting circuit 203 includes a first resistor R1, a second resistor R2, an eighth capacitor C8, and an inverter U2; the model of the inverter U2 is SN74LVC1G04.
  • the gate of the first MOS transistor Q1 is connected to one end of the first resistor R1, and the drain of the first MOS transistor Q1 is connected to the first antenna A1 and one end of the first capacitor C1 through the sixth capacitor C6, the first MOS transistor Q1 The source is grounded.
  • the gate of the second MOS transistor Q2 is connected to one end of the first resistor R1, and the drain of the second MOS transistor Q2 is connected to one end of the second antenna A2 and the third capacitor C3 through the seventh capacitor C7, and the second MOS transistor Q2 The source is grounded.
  • the other end of the first resistor R1 is connected to the B2 pin of the inverter U2, the B1 pin of the inverter U2 is grounded, and the A1 pin of the inverter U2 is connected to the CLAMP1 end of the resonant chip U1 and one end of the second resistor R2.
  • the A2 pin of the U2 is connected to the other end of the power supply terminal A4WP_VDD and the second resistor R2, and the A2 pin of the inverter U2 is also grounded through the eighth capacitor C8.
  • the first MOS transistor Q1 and the second MOS transistor Q2 are NMOS transistors.
  • the A2 pin of the inverter U2 is at a high level, and the B2 pin outputs a low level, at which time the first MOS transistor Q1 and the second MOS transistor Q2 are not turned on.
  • the CLAMP1 terminal outputs a low level to pull the A2 pin of the inverter U2 low, and the B2 pin of the inverter U2 outputs a high level to control the first MOS transistor Q1 and the second.
  • the MOS transistor Q2 is turned on, and the sixth capacitor C6 and the seventh capacitor C7 are formed to the ground path, and the DC-connected alternating current is started to be discharged, so that the voltage of the resonant chip U1 is lowered.
  • the rectification and step-down module 200 further includes a temperature detecting circuit 204 for detecting the temperature of the resonant chip U1 and transmitting it to the Bluetooth communication module 400 for temperature monitoring.
  • the temperature detecting circuit 204 includes a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, and a ninth capacitor C9; one end of the third resistor R3 is connected to the TEMP pin of the resonant chip U1, and the fourth One end of the resistor R4 and one end of the fifth resistor R5, one end of the ninth capacitor C9 is connected to one end of the fourth resistor R4 and the Bluetooth communication module, the other end of the third resistor R3, the other end of the fourth resistor R4, and the ninth capacitor C9
  • the other end of the fifth resistor R5 is connected to the VLDO end of the resonant chip U1, and is connected to the Bluetooth communication module through the sixth resistor R6.
  • the rectifying and step-down module 200 further includes a current detecting circuit 205, the current detecting circuit 205 includes a seventh resistor R7, and one end of the seventh resistor R7 is connected to the VRECTS1 of the resonant chip U1. At the terminal and the VRECT terminal, the other end of the seventh resistor R7 is connected to the VRECTS2 terminal and the PVIN terminal of the resonant chip U1.
  • the resistance of the seventh resistor R7 is 51 mohm (milli ohm), and the resistance can improve the accuracy of current detection.
  • the power management module 300 includes a charging chip U3, an eighth resistor R8, a ninth resistor R9, a tenth resistor R10, an eleventh resistor R11, a twelfth resistor R12, and a thirteenth resistor R13.
  • the tenth capacitor C10 and the eleventh capacitor C11; the OUT pin of the charging chip U3 is connected to the battery, and is also grounded through the tenth capacitor C10.
  • the TS pin of the charging chip U3 is grounded through the eighth resistor R8, and the PRE_TERM pin of the charging chip U3 passes.
  • the ninth resistor R9 is grounded, the ISET pin of the charging chip U3 is grounded through the tenth resistor R10, the VSS pin of the charging chip U3 is grounded, and the other end of the charging chip U3 is connected to the other end of the inductor L and one end of the eleventh resistor R11 is also passed.
  • the eleventh capacitor C11 is grounded, the other end of the eleventh resistor R11 is connected to one end of the twelfth resistor R12 and the main controller, and the other end of the twelfth resistor R12 is grounded through the thirteenth resistor R13.
  • the battery-based charging voltage ranges from 0.8V to 4.2V, and the 5V reference voltage A4WP_VOUT output from the resonant chip U1 needs to be step-down controlled by the charging chip U3, and finally the 4.2V charging voltage VBAT is output to charge the battery.
  • the detection signal DETECT obtained by dividing the eleventh resistor R11, the twelfth resistor R12, and the thirteenth resistor R13 is transmitted to the main controller for charging detection, that is, the terminal device is charging.
  • the voltage regulation of the tenth capacitor C10 can make the charging voltage more stable.
  • the Bluetooth communication module adopts a Bluetooth chip of the type NRF51822 and its peripheral circuit, which is a prior art and will not be described herein.
  • the wireless charging device uses the latest and smallest WLCSP (Wafer Level Chip Scale). Packaging), FAR (Full Active Rectifier), full-bridge active rectification using a MAP7101 resonant chip
  • WLCSP Wafer Level Chip Scale
  • FAR Fel Active Rectifier
  • the hardware circuit is designed to be compact, so that the MAP7101 realizes the wireless charging function; it only needs to occupy no more than 8mm ⁇ 8mm on the PCB board, occupying a small area, and can be easily integrated into the current smart wearable and portable Equipment such as mobile phones, smart watches, etc., enhance the competitiveness of the products.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)

Abstract

一种无线充电装置，包括振荡模块（100）、整流降压模块（200）、电源管理模块（300）和蓝牙通讯模块（400）；蓝牙通讯模块与充电座通信获取充电的通讯协议，振荡模块接收充电座发出的信号并进行振荡产生交流电，整流降压模块对交流电进行整流、降压后输出直流的基准电压，电源管理模块对基准电压降压后输出充电电压对电池充电。该无线充电装置占用面积小，可以很方便地整合到智能穿戴和便携设备中。

Description

一种无线充电装置 技术领域
本发明涉及无线充电技术领域，尤其涉及的是一种无线充电装置。
 背景技术
一款X-Watch 穿戴产品, 其应用除了具有目前大多数智能手表所有的功能（如各种各样的传感器、蓝牙功能）之外，还需要能进行无线充电。目前，无线充电在消费类电子中有两种标准，Qi磁感应方式和A4WP （Alliance for Wireless Power）磁共振方式。虽然这两种标准有许多优点，但是就目前技术角度而言其还有待改进提高，而且很少应用在消费类电子产品中。
另外，X-Watch 穿戴产品的 PCB板面积通常为30 mm×17 mm。在需要设置多种功能的基础上，无线充电部分如何设置才能合理使用有限的PCB板的空间是非常大的挑战。基于目前A4WP磁共振技术还未成熟，且无线充电模块占用PCB板的空间较大，因此，无线充电的硬件线路设计必须做到精简并可实行，才能真正完成无线充电。
因此，现有技术还有待于改进和发展。
 技术问题
本发明要解决的技术问题在于，针对现有技术的上述缺陷，提供一种无线充电装置，旨在解决现有无线充电模块占用PCB板的空间较大的问题。
 技术解决方案
本发明解决技术问题所采用的技术方案如下：
一种无线充电装置，与充电座和电池连接，其包括振荡模块、整流降压模块、电源管理模块和蓝牙通讯模块，所述振荡模块、整流降压模块、电源管理模块依次连接，蓝牙通讯模块连接整流降压模块，电源管理模块连接电池；
所述蓝牙通讯模块与充电座通信获取充电的通讯协议，振荡模块接收充电座发出的信号并进行振荡产生交流电，整流降压模块对所述交流电进行整流、降压后输出直流的基准电压，电源管理模块对基准电压降压后输出充电电压对电池充电。
所述的无线充电装置中，所述振荡模块包括第一天线、第二天线、第一电容、第二电容、第三电容、第四电容和第五电容；所述第一天线连接第一电容的一端，第一电容的另一端连接第五电容的一端和整流降压模块，第二电容与第一电容并联，所述第二天线连接第三电容的一端，第三电容的另一端连接第五电容的另一端和整流降压模块，第四电容与第三电容并联。
所述的无线充电装置中，所述整流降压模块包括谐振芯片和电感，所述谐振芯片的AC+端连接第一电容的另一端和第五电容的一端，谐振芯片的AC-端连接第三电容的另一端和第五电容的另一端，谐振芯片的SW端连接电感的一端，电感的另一端连接电源管理模块，谐振芯片的TEMP端连接蓝牙通讯模块，谐振芯片的PVIN端连接电源端，谐振芯片的PGND端、PGND2端接地。
所述的无线充电装置中，所述整流降压模块还包括：第一保护电路、第二保护电路和检测电路；所述检测电路连接谐振芯片、第一保护电路和第二保护电路，所述第一保护电路、第二保护电路均连接振荡模块；
所述检测电路检测谐振芯片内的电压大于预设电压时，输出降压信号给第一保护电路和第二保护电路，第一保护电路、第二保护电路对振荡模块进行降压。
所述的无线充电装置中，所述第一保护电路包括第一MOS管和第六电容；所述第一MOS管的栅极连接检测电路，第一MOS管的漏极通过第六电容连接第一天线和第一电容的一端，第一MOS管的源极接地。
所述的无线充电装置中，所述第二保护电路包括第二MOS管和第七电容，所述第二MOS管的栅极连接检测电路，第二MOS管的漏极通过第七电容连接第二天线和第三电容的一端，第二MOS管的源极接地。
所述的无线充电装置中，所述检测电路包括第一电阻、第二电阻、第八电容和反向器；所述第一电阻的一端连接第一MOS管的栅极和第二MOS管的栅极，第一电阻的另一端连接反向器的B2脚，反向器的B1脚接地，反向器的A1脚连接谐振芯片的CLAMP1端和第二电阻的一端，反向器的A2脚连接电源端和第二电阻的另一端，反向器的A2脚也通过第八电容接地。
所述的无线充电装置中，所述整流降压模块还包括用于检测谐振芯片的温度并传输给蓝牙通讯模块进行温度监控的温度检测电路，所述温度检测电路包括第三电阻、第四电阻、第五电阻、第六电阻和第九电容；
所述第三电阻的一端连接谐振芯片的TEMP脚、第四电阻的一端和第五电阻的一端，第九电容的一端连接第四电阻的一端和蓝牙通讯模块，第三电阻的另一端、第四电阻的另一端、第九电容的另一端均接地；所述第五电阻的另一端连接谐振芯片的VLDO端、并通过第六电阻连接蓝牙通讯模块。
所述的无线充电装置中，所述整流降压模块还包括电流检测电路，所述电流检测电路包括第七电阻，所述第七电阻的一端连接谐振芯片的VRECTS1端和VRECT端，第七电阻的另一端连接谐振芯片的VRECTS2端和PVIN端。
所述的无线充电装置中，所述电源管理模块包括充电芯片、第八电阻、第九电阻、第十电阻、第十一电阻、第十二电阻、第十三电阻、第十电容和第十一电容；所述充电芯片的OUT脚连接电池、也通过第十电容接地，充电芯片的TS脚通过第八电阻接地，充电芯片的PRE_TERM脚通过第九电阻接地，充电芯片的ISET脚通过第十电阻接地，充电芯片的VSS脚接地，充电芯片的IN脚连接电感的另一端和第十一电阻的一端、也通过第十一电容接地，所述第十一电阻的另一端连接第十二电阻的一端和主控器，第十二电阻的另一端通过第十三电阻接地。
 有益效果
相较于现有技术，本发明提供的无线充电装置，通过蓝牙通讯模块与充电座通信获取充电的通讯协议，振荡模块接收充电座发出的信号并进行振荡产生交流电，整流降压模块所述交流电进行整流、降压后输出直流的基准电压，电源管理模块对基准电压降压后输出充电电压对电池充电；该无线充电装置仅需占用PCB板上不大于8mm×8mm的面积，占用面积很小，可以很方便地整合到目前的智能穿戴和便携设备中，即能实现无线充电，又能达到充电电路设计精简化的目的。
 附图说明
图1是本发明提供的无线充电装置的结构图。
图2是本发明提供的无线充电装置中振荡模块与整流降压模块的电路图。
图3是本发明提供的无线充电装置中电源管理模块的电路图。
 本发明的最佳实施方式
本发明提供一种无线充电装置，适用于终端消费电子、穿戴设备及日常所需要无线电源充电的电子产品，如应用在穿戴手表、手机等便携产品上。本发明基于A4WP 无线充电技术，采用型号为 MAP7101的芯片设计硬件电路来进行无线充电控制，并对芯片外围电路进行优化。所述A4WP是无线充电磁共振的标准。磁共振原理与声音的共振原理相同，排列好振动频率相同的音叉，一个发声的话，其它的也会共振发声。同样，排列在磁场中的相同振动频率的线圈，也可从一个向另一个供电。相比电磁感应方式，利用磁共振可延长传输距离。磁共振方式不同于电磁感应方式，无需使线圈间的位置完全吻合。磁共振方式由能量发送装置和能量接收装置组成，当两个装置调整到相同频率，或者说在一个预设频率（为6.78MHz）上共振，两个装置之间就可以交换彼此的能量。
为使本发明的目的、技术方案及优点更加清楚、明确，以下参照附图并举实施例对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
请参阅图1，本发明提供的无线充电装置作为接收端用于对电池进行无线充电，无线充电系统的充电座发出预设频率的信号给无线充电装置。所述无线充电装置包括振荡模块100、整流降压模块200、电源管理模块300和蓝牙通讯模块400，所述振荡模块100、整流降压模块200、电源管理模块300依次连接，蓝牙通讯模块400连接整流降压模块200，电源管理模块300连接电池。
所述蓝牙通讯模块400与充电座采用蓝牙方式建立通信进行握手，蓝牙通讯模块400获取其需要的通讯协议（如充电功率，温度要求）来整个控制充电过程。所述振荡模块100接收充电座发出的信号并进行振荡产生交流电（相当于充电座与振荡模块100进行磁共振，产生与该信号相同的频率6.78MHz，此时磁场转变成电信号）。整流降压模块200对振荡模块100输出的交流电进行整流、降压后输出直流的基准电压。电源管理模块300对基准电压降压后输出充电电压对电池充电。
请一并参阅图2，所述振荡模块100包括第一天线A1、第二天线A2、第一电容C1、第二电容C2、第三电容C3、第四电容C4和第五电容C5；所述第一天线A1连接第一电容C1的一端，第一电容C1的另一端连接第五电容C5的一端和整流降压模块200，第二电容C2与第一电容C1并联，所述第二天线A2连接第三电容C3的一端，第三电容C3的另一端连接第五电容C5的另一端和整流降压模块200，第四电容C4与第三电容C3并联。
所述第一天线A1、第二天线A2相当于电感，用于接收充电座的信号。第一电容C1、第二电容C2、第三电容C3、第四电容C4和第五电容C5均为匹配电容，电感与电容构成振荡电路从而产生交流电给整流降压模块。
所述整流降压模块包括型号为MAP7101的谐振芯片U1和电感L，所述谐振芯片U1的AC+端连接第一电容C1的另一端和第五电容C5的一端，谐振芯片U1的AC-端连接第三电容C3的另一端和第五电容C5的另一端，谐振芯片U1的SW端连接电感L的一端，电感L的另一端连接电源管理模块300，谐振芯片U1的TEMP端连接蓝牙通讯模块400，谐振芯片U1的PVIN端连接电源端A4WP_VDD，谐振芯片U1的PGND端、PGND2端接地。
所述交流电从谐振芯片U1的AC+端、AC-端输入，在谐振芯片U1内部进行整流、再进行DC-DC降压，最后从SW端输出5V、最大功率为5W、最大电流为1A的基准电压A4WP_VOUT给电源管理模块300。
在具体实施时，为了避免高压烧坏谐振芯片U1，所述整流降压模块200还包括第一保护电路201、第二保护电路202和检测电路203。所述检测电路203连接谐振芯片U1、第一保护电路201和第二保护电路202，所述第一保护电路201、第二保护电路202均连接振荡模块100。所述检测电路203检测谐振芯片U1内的电压大于预设电压时，输出降压信号给第一保护电路201和第二保护电路202，第一保护电路201、第二保护电路202对振荡模块100进行降压。
所述第一保护电路201包括第一MOS管Q1和第六电容C6。第二保护电路202包括第二MOS管Q2和第七电容C7。所述检测电路203包括第一电阻R1、第二电阻R2、第八电容C8和反向器U2；所述反向器U2的型号为SN74LVC1G04。
所述第一MOS管Q1的栅极连接第一电阻R1的一端，第一MOS管Q1的漏极通过第六电容C6连接第一天线A1和第一电容C1的一端，第一MOS管Q1的源极接地。
所述第二MOS管Q2的栅极连接第一电阻R1的一端，第二MOS管Q2的漏极通过第七电容C7连接第二天线A2和第三电容C3的一端，第二MOS管Q2的源极接地。
所述第一电阻R1的另一端连接反向器U2的B2脚，反向器U2的B1脚接地，反向器U2的A1脚连接谐振芯片U1的CLAMP1端和第二电阻R2的一端，反向器U2的A2脚连接电源端A4WP_VDD和第二电阻R2的另一端，反向器U2的A2脚也通过第八电容C8接地。
第一MOS管Q1和第二MOS管Q2为NMOS管。谐振芯片U1正常工作时，反向器U2的A2脚为高电平，其B2脚输出低电平，此时第一MOS管Q1和第二MOS管Q2不导通。当谐振芯片U1内电压大于预设电压时，其CLAMP1端输出低电平将反向器U2的A2脚拉低，反向器U2的B2脚输出高电平控制第一MOS管Q1和第二MOS管Q2导通，第六电容C6与第七电容C7形成到地通路，开始隔直流通交流从而放电，使谐振芯片U1的电压降低。
本实施例中，所述整流降压模块200还包括温度检测电路204，用于检测谐振芯片U1的温度并传输给蓝牙通讯模块400进行温度监控。所述温度检测电路204包括第三电阻R3、第四电阻R4、第五电阻R5、第六电阻R6和第九电容C9；所述第三电阻R3的一端连接谐振芯片U1的TEMP脚、第四电阻R4的一端和第五电阻R5的一端，第九电容C9的一端连接第四电阻R4的一端和蓝牙通讯模块，第三电阻R3的另一端、第四电阻R4的另一端、第九电容C9的另一端均接地；所述第五电阻R5的另一端连接谐振芯片U1的VLDO端、并通过第六电阻R6连接蓝牙通讯模块。
为了避免大电流烧坏谐振芯片U1，所述整流降压模块200还包括电流检测电路205，所述电流检测电路205包括第七电阻R7，所述第七电阻R7的一端连接谐振芯片U1的VRECTS1端和VRECT端，第七电阻R7的另一端连接谐振芯片U1的VRECTS2端和PVIN端。较佳地，所述第七电阻R7的阻值为51mohm（毫欧姆），该阻值能提高电流检测的准确度。
请同时参阅图3，所述电源管理模块300包括充电芯片U3、第八电阻R8、第九电阻R9、第十电阻R10、第十一电阻R11、第十二电阻R12、第十三电阻R13、第十电容C10和第十一电容C11；所述充电芯片U3的OUT脚连接电池、也通过第十电容C10接地，充电芯片U3的TS脚通过第八电阻R8接地，充电芯片U3的PRE_TERM脚通过第九电阻R9接地，充电芯片U3的ISET脚通过第十电阻R10接地，充电芯片U3的VSS脚接地，充电芯片U3的IN脚连接电感L的另一端和第十一电阻R11的一端、也通过第十一电容C11接地，所述第十一电阻R11的另一端连接第十二电阻R12的一端和主控器，第十二电阻R12的另一端通过第十三电阻R13接地。
基于电池的充电电压范围为0.8V~4.2V，谐振芯片U1输出的5V的基准电压A4WP_VOUT需要通过充电芯片U3降压控制，最终输出4.2V的充电电压VBAT对电池充电。在充电前，通过第十一电阻R11、第十二电阻R12、第十三电阻R13分压获得的检测信号DETECT传输给主控器，以进行充电检测，即表明该终端设备正在充电。通过第十电容C10的稳压滤波可使充电电压更加稳定。
所述蓝牙通讯模块采用型号为NRF51822的蓝牙芯片及其外围电路，其为现有技术，此处不作赘述。
综上所述，本发明提供的无线充电装置使用最新、小的WLCSP（Wafer Level Chip Scale Packaging）封装，采用型号为MAP7101 的谐振芯片实现了FAR（Full Active Rectifier，全桥主动式整流 ）的整流技术，对硬件电路进行精简设计，使MAP7101实现了无线充电功能；仅需占用PCB板上不大于8mm×8mm的面积，占用面积很小，可以很容易整合到目前的智能穿戴和便携设备中，如手机，智能手表等，提高了产品的竞争力。
应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。

Claims (20)

  1. 一种无线充电装置，与充电座和电池连接，其中，包括振荡模块、整流降压模块、电源管理模块和蓝牙通讯模块，所述振荡模块、所述整流降压模块、所述电源管理模块依次连接，所述蓝牙通讯模块连接所述整流降压模块，所述电源管理模块连接电池；
    所述蓝牙通讯模块与充电座采用蓝牙方式建立通信连接，以获取充电的通讯协议，所述振荡模块接收所述充电座发出的信号并进行磁共振产生交流电，所述整流降压模块对所述交流电进行整流、降压后输出直流的基准电压，所述电源管理模块对所述基准电压降压后输出充电电压对电池充电。
  2. 根据权利要求1所述的无线充电装置，其中，所述振荡模块包括第一天线、第二天线、第一电容、第二电容、第三电容、第四电容和第五电容；所述第一天线连接第一电容的一端，第一电容的另一端连接第五电容的一端和整流降压模块，第二电容与第一电容并联，所述第二天线连接第三电容的一端，第三电容的另一端连接第五电容的另一端和整流降压模块，第四电容与第三电容并联。
  3. 根据权利要求2所述的无线充电装置，其中，所述整流降压模块包括谐振芯片和电感，所述谐振芯片的AC+端连接第一电容的另一端和第五电容的一端，谐振芯片的AC-端连接第三电容的另一端和第五电容的另一端，谐振芯片的SW端连接电感的一端，电感的另一端连接电源管理模块，谐振芯片的TEMP端连接蓝牙通讯模块，谐振芯片的PVIN端连接电源端，谐振芯片的PGND端、PGND2端接地。
  4. 根据权利要求3所述的无线充电装置，其中，所述整流降压模块还包括：第一保护电路、第二保护电路和检测电路；所述检测电路连接谐振芯片、第一保护电路和第二保护电路，所述第一保护电路、第二保护电路均连接振荡模块；
    所述检测电路检测谐振芯片内的电压大于预设电压时，输出降压信号给第一保护电路和第二保护电路，第一保护电路、第二保护电路对振荡模块进行降压。
  5. 根据权利要求4所述的无线充电装置，其中，所述第一保护电路包括第一MOS管和第六电容；所述第一MOS管的栅极连接检测电路，第一MOS管的漏极通过第六电容连接第一天线和第一电容的一端，第一MOS管的源极接地。
  6. 根据权利要求5所述的无线充电装置，其中，所述第二保护电路包括第二MOS管和第七电容，所述第二MOS管的栅极连接检测电路，第二MOS管的漏极通过第七电容连接第二天线和第三电容的一端，第二MOS管的源极接地。
  7. 根据权利要求6所述的无线充电装置，其中，所述检测电路包括第一电阻、第二电阻、第八电容和反向器；所述第一电阻的一端连接第一MOS管的栅极和第二MOS管的栅极，第一电阻的另一端连接反向器的B2脚，反向器的B1脚接地，反向器的A1脚连接谐振芯片的CLAMP1端和第二电阻的一端，反向器的A2脚连接电源端和第二电阻的另一端，反向器的A2脚也通过第八电容接地。
  8. 根据权利要求7所述的无线充电装置，其中，所述整流降压模块还包括用于检测谐振芯片的温度并传输给蓝牙通讯模块进行温度监控的温度检测电路，所述温度检测电路包括第三电阻、第四电阻、第五电阻、第六电阻和第九电容；
    所述第三电阻的一端连接谐振芯片的TEMP脚、第四电阻的一端和第五电阻的一端，第九电容的一端连接第四电阻的一端和蓝牙通讯模块，第三电阻的另一端、第四电阻的另一端、第九电容的另一端均接地；所述第五电阻的另一端连接谐振芯片的VLDO端、并通过第六电阻连接蓝牙通讯模块。
  9. 根据权利要求8所述的无线充电装置，其中，所述整流降压模块还包括电流检测电路，所述电流检测电路包括第七电阻，所述第七电阻的一端连接谐振芯片的VRECTS1端和VRECT端，第七电阻的另一端连接谐振芯片的VRECTS2端和PVIN端。
  10. 根据权利要求9所述的无线充电装置，其中，所述电源管理模块包括充电芯片、第八电阻、第九电阻、第十电阻、第十一电阻、第十二电阻、第十三电阻、第十电容和第十一电容；所述充电芯片的OUT脚连接电池、也通过第十电容接地，充电芯片的TS脚通过第八电阻接地，充电芯片的PRE_TERM脚通过第九电阻接地，充电芯片的ISET脚通过第十电阻接地，充电芯片的VSS脚接地，充电芯片的IN脚连接电感的另一端和第十一电阻的一端、也通过第十一电容接地，所述第十一电阻的另一端连接第十二电阻的一端和主控器，第十二电阻的另一端通过第十三电阻接地。
  11. 一种无线充电装置，与充电座和电池连接，其中，包括振荡模块、整流降压模块、电源管理模块和蓝牙通讯模块，所述振荡模块、所述整流降压模块、所述电源管理模块依次连接，所述蓝牙通讯模块连接所述整流降压模块，所述电源管理模块连接电池；
    所述蓝牙通讯模块与充电座通信获取充电的通讯协议，所述振荡模块接收充电座发出的信号并进行振荡产生交流电，所述整流降压模块对所述交流电进行整流、降压后输出直流的基准电压，所述电源管理模块对所述基准电压降压后输出充电电压对电池充电。
  12. 根据权利要求11所述的无线充电装置，其中，所述振荡模块包括第一天线、第二天线、第一电容、第二电容、第三电容、第四电容和第五电容；所述第一天线连接第一电容的一端，第一电容的另一端连接第五电容的一端和整流降压模块，第二电容与第一电容并联，所述第二天线连接第三电容的一端，第三电容的另一端连接第五电容的另一端和整流降压模块，第四电容与第三电容并联。
  13. 根据权利要求12所述的无线充电装置，其中，所述整流降压模块包括谐振芯片和电感，所述谐振芯片的AC+端连接第一电容的另一端和第五电容的一端，谐振芯片的AC-端连接第三电容的另一端和第五电容的另一端，谐振芯片的SW端连接电感的一端，电感的另一端连接电源管理模块，谐振芯片的TEMP端连接蓝牙通讯模块，谐振芯片的PVIN端连接电源端，谐振芯片的PGND端、PGND2端接地。
  14. 根据权利要求13所述的无线充电装置，其中，所述整流降压模块还包括：第一保护电路、第二保护电路和检测电路；所述检测电路连接谐振芯片、第一保护电路和第二保护电路，所述第一保护电路、第二保护电路均连接振荡模块；
    所述检测电路检测谐振芯片内的电压大于预设电压时，输出降压信号给第一保护电路和第二保护电路，第一保护电路、第二保护电路对振荡模块进行降压。
  15. 根据权利要求14所述的无线充电装置，其中，所述第一保护电路包括第一MOS管和第六电容；所述第一MOS管的栅极连接检测电路，第一MOS管的漏极通过第六电容连接第一天线和第一电容的一端，第一MOS管的源极接地。
  16. 根据权利要求15所述的无线充电装置，其中，所述第二保护电路包括第二MOS管和第七电容，所述第二MOS管的栅极连接检测电路，第二MOS管的漏极通过第七电容连接第二天线和第三电容的一端，第二MOS管的源极接地。
  17. 根据权利要求16所述的无线充电装置，其中，所述检测电路包括第一电阻、第二电阻、第八电容和反向器；所述第一电阻的一端连接第一MOS管的栅极和第二MOS管的栅极，第一电阻的另一端连接反向器的B2脚，反向器的B1脚接地，反向器的A1脚连接谐振芯片的CLAMP1端和第二电阻的一端，反向器的A2脚连接电源端和第二电阻的另一端，反向器的A2脚也通过第八电容接地。
  18. 根据权利要求17所述的无线充电装置，其中，所述整流降压模块还包括用于检测谐振芯片的温度并传输给蓝牙通讯模块进行温度监控的温度检测电路，所述温度检测电路包括第三电阻、第四电阻、第五电阻、第六电阻和第九电容；
    所述第三电阻的一端连接谐振芯片的TEMP脚、第四电阻的一端和第五电阻的一端，第九电容的一端连接第四电阻的一端和蓝牙通讯模块，第三电阻的另一端、第四电阻的另一端、第九电容的另一端均接地；所述第五电阻的另一端连接谐振芯片的VLDO端、并通过第六电阻连接蓝牙通讯模块。
  19. 根据权利要求18所述的无线充电装置，其中，所述整流降压模块还包括电流检测电路，所述电流检测电路包括第七电阻，所述第七电阻的一端连接谐振芯片的VRECTS1端和VRECT端，第七电阻的另一端连接谐振芯片的VRECTS2端和PVIN端。
  20. 根据权利要求19所述的无线充电装置，其中，所述电源管理模块包括充电芯片、第八电阻、第九电阻、第十电阻、第十一电阻、第十二电阻、第十三电阻、第十电容和第十一电容；所述充电芯片的OUT脚连接电池、也通过第十电容接地，充电芯片的TS脚通过第八电阻接地，充电芯片的PRE_TERM脚通过第九电阻接地，充电芯片的ISET脚通过第十电阻接地，充电芯片的VSS脚接地，充电芯片的IN脚连接电感的另一端和第十一电阻的一端、也通过第十一电容接地，所述第十一电阻的另一端连接第十二电阻的一端和主控器，第十二电阻的另一端通过第十三电阻接地。
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