WO2016133722A1 - Interface for microphone-to-microphone communications - Google Patents

Interface for microphone-to-microphone communications Download PDF

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Publication number
WO2016133722A1
WO2016133722A1 PCT/US2016/016706 US2016016706W WO2016133722A1 WO 2016133722 A1 WO2016133722 A1 WO 2016133722A1 US 2016016706 W US2016016706 W US 2016016706W WO 2016133722 A1 WO2016133722 A1 WO 2016133722A1
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WO
WIPO (PCT)
Prior art keywords
microphone
data
transducer
pdm
combined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2016/016706
Other languages
French (fr)
Inventor
Robert POPPER
Dibyendu NANDY
Ramanujapuram RAGHUVIR
Sarmad Qutub
Oddy Khamharn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Knowles Electronics LLC
Original Assignee
Knowles Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knowles Electronics LLC filed Critical Knowles Electronics LLC
Priority to DE112016000823.6T priority Critical patent/DE112016000823T5/en
Priority to CN201680010313.2A priority patent/CN107251576B/en
Publication of WO2016133722A1 publication Critical patent/WO2016133722A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/008—MEMS characterised by an electronic circuit specially adapted for controlling or driving the same
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers
    • H04R3/005—Circuits for transducers for combining the signals of two or more microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00—Details of connection covered by H04R, not provided for in its groups
    • H04R2420/07—Applications of wireless loudspeakers or wireless microphones

Definitions

  • This application relates to microphones and, more specifically, to communications between microphones.
  • a MEMS microphone includes a MEMS die includes a diaphragm and a back plate.
  • the MEMS die is supported by a substrate and enclosed by a housing (e.g., a cup or cover with walls).
  • a port may extend through the substrate (for a bottom port device) or through the top of the housing (for a top port device). In any case, sound energy traverses through the port, moves the diaphragm and creates a changing potential of the back plate, which creates an electrical signal.
  • Microphones are deployed in various types of devices such as personal computers or cellular phones.
  • one microphone may be used for sound pick-up in one frequency range, while another microphone may be used for sound pick-up in another frequency range.
  • the microphones are sometimes connected to a codec, which performed processing of the signals from the microphones. Because of the limitations with the interface between the microphones and the codec, the microphones were unable to communicate with each other.
  • FIG. 1 comprises a block diagram of a system including two microphones and an interface between the two microphones according to various embodiments of the present invention
  • FIG. 2 comprises a timing diagram showing the operation of the microphone-to- microphone interface shown in FIG. 1 according to various embodiments of the present invention.
  • a two microphone interface uses a pulse density modulation (PDM) bus.
  • the two microphones share the same clock.
  • the PDM output of the first microphone is transmitted and received by a second microphone on a first clock edge.
  • the second microphone decimates the signals of both microphones and converts these decimated signals into pulse code modulation (PCM) signals, where the signals are processed and converted back to PDM and then a single, combined, and processed output is sent to a codec (or some other external device) on a second clock edge of the clock.
  • PCM pulse code modulation
  • a first microphone 102 includes a first charge pump 104, a first micro electro mechanical system (MEMS) transducer 106, a first amplifier 108, and a first sigma delta converter 110.
  • MEMS micro electro mechanical system
  • a second microphone 122 includes a second charge pump 124, a second micro electro mechanical system (MEMS) transducer 126, a second amplifier 128, a second sigma delta converter 130, a decimator 132, a digital signal processor (DSP) 134, and an interpolator 136.
  • the first MEMS microphone 102 and the second MEMS microphone 122 share a clock 105.
  • the hardware clock that provides the clock signal 105 may be disposed at the codec or system on a chip (SoC) 140 in one example. Other examples are possible.
  • the first microphone 102 and the second microphone 122 in some aspects each include a housing that encloses the above-mentioned components.
  • each microphone 102, 122 includes a base, on which the components are deployed and a lid or cover that is coupled to the base and that encloses the internal components. Additionally, some of the components (e.g., sigma delta converters, decimators, and amplifiers) may be deployed on an integrated circuit that is disposed on the base.
  • the first charge pump 104 and second charge pump 124 provide voltages and/or current to the first MEMS transducer 106 and the second MEMS transducer 126.
  • the first MEMS transducer 106 and the second MEMS transducer 126 convert sound energy into an electrical signal.
  • the first MEMS transducer 106 and the second MEMS transducer 126 may include a diaphragm and a charged back plate (with the charge provided by the charge pumps 104 and 124). Sound energy moves the diaphragms to produce an electrical signal.
  • MEMS device may be used as transducers 106 and 126, it will also be appreciated that other types of devices such as piezo electrical devices or speakers (being operated as a microphone) may also be deployed.
  • the first amplifier 108 and second amplifier 128 amplify the analog signals from the first MEMS transducer 106 and the second MEMS transducer 126.
  • the first sigma delta converter 110 and the second sigma delta converter 130 convert the analog signals into pulse density modulation (PDM) signals.
  • PDM pulse density modulation
  • the decimator 132 receives signals from the first MEMS transducer 106 and the second MEMS transducer 126 (that have been converted into PDM signals). The decimator 132 converts these PDM signals into to pulse code modulation (PCM) signals for processing by the DSP 134.
  • PCM pulse code modulation
  • the DSP 134 performs various processing functions on the signals. For example, the DSP 134 may perform noise identification (e.g., identify wind or other types of noise, perform noise suppression (removal), or ultrasonic gesture or activity detection functions. Other examples of processing functions may also be performed by the DSP 134.
  • noise identification e.g., identify wind or other types of noise, perform noise suppression (removal), or ultrasonic gesture or activity detection functions.
  • Other examples of processing functions may also be performed by the DSP 134.
  • the interpolator 136 converts the PCM signal from the DSP to a PDM signal for transmission to the codec 140.
  • the codec (or system on chip (SoC)) 140 receives the combined signal.
  • the first microphone 102 couples to a codec 140 and to the second microphone
  • the codec 140 couples to an application processor 142.
  • the purpose of the codec 140 is to convert the PDM signal into PCM data and provide an amplifier for speakers in electronic devices.
  • the application processor 142 is in one aspect a system on a chip (SoC) designed to support applications running in a mobile operating system environment. In some architectures, the codec 140 is not required and the microphones 102 and 122 may be directly connected to the applications processor 142.
  • the clock 105 has rising edges 107 and falling edges 109.
  • Data 11 1, 113, 115 is obtained and transmitted from the first microphone 102 (sensed by the first MEMS transducer 106) to the second microphone 122 on the rising edges 107 of the clock 105.
  • Data 117, 119, and 121 is obtained from the second MEMS transducer 126 of the second microphone 122 on falling edges 109 of the clock 105.
  • Combined data 131, 133, and 135 is sent from the second microphone 122 to the codec 140 on falling edges 109.
  • the combined data is the processed audio stream from the first microphone 102 and the second microphone 122 combined and processed in the DSP in the second microphone.
  • combined data 133 may be the combination of data 111 (from the first microphone 102) and the data 119 (from the second transducer 126 of the second microphone 122).
  • the codec 140 receives the combined data from the two microphones
  • Microphone-to-microphone communications is supported in an efficient and seamless way.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

A microphone system includes a first transducer deployed at a first microphone; a second transducer deployed at a second microphone, the first microphone being physically distinct from the second microphone; a decimator deployed at the second microphone that receives first pulse density modulation (PDM) data from the first transducer and second PDM data from the second transducer and decimates and combines the first PDM data and the second PDM data into combined pulse code modulation (PCM) data; and an interpolator deployed at the second microphone for converting the combined PCM data to combined PDM data, and transmits the combined PDM data to an external processing device.

Description

INTERFACE FOR MICROPHONE-TO-MICROPHONE COMMUNICATIONS
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This patent claims benefit under 35 U.S.C. §119(e) to United States Provisional
Application No. 62118252 entitled "Interface for Microphone-to-Microphone Communication" filed February 19, 2015, the content of which is incorporated herein by reference in its entirety.
TECHNICAL FIELD
[0002] This application relates to microphones and, more specifically, to communications between microphones.
BACKGROUND OF THE INVENTION
[0003] Different types of acoustic devices have been used through the years. One type of device is a microphone and one type of microphone is a microelectromechanical system (MEMS) microphone. A MEMS microphone includes a MEMS die includes a diaphragm and a back plate. The MEMS die is supported by a substrate and enclosed by a housing (e.g., a cup or cover with walls). A port may extend through the substrate (for a bottom port device) or through the top of the housing (for a top port device). In any case, sound energy traverses through the port, moves the diaphragm and creates a changing potential of the back plate, which creates an electrical signal. Microphones are deployed in various types of devices such as personal computers or cellular phones.
[0004] It is sometimes advantageous to utilize two or more microphones. For example, one microphone may be used for sound pick-up in one frequency range, while another microphone may be used for sound pick-up in another frequency range. The microphones are sometimes connected to a codec, which performed processing of the signals from the microphones. Because of the limitations with the interface between the microphones and the codec, the microphones were unable to communicate with each other.
[0005] The problems of previous approaches have resulted in some user dissatisfaction with these previous approaches.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] For a more complete understanding of the disclosure, reference should be made to the following detailed description and accompanying drawings wherein:
[0007] FIG. 1 comprises a block diagram of a system including two microphones and an interface between the two microphones according to various embodiments of the present invention;
[0008] FIG. 2 comprises a timing diagram showing the operation of the microphone-to- microphone interface shown in FIG. 1 according to various embodiments of the present invention.
[0009] Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity. It will further be appreciated that certain actions and/or steps may be described or depicted in a particular order of occurrence while those skilled in the art will understand that such specificity with respect to sequence is not actually required. It will also be understood that the terms and expressions used herein have the ordinary meaning as is accorded to such terms and expressions with respect to their corresponding respective areas of inquiry and study except where specific meanings have otherwise been set forth herein. DETAILED DESCRIPTION
[0010] The present approaches provide an interface with microphone-to-microphone communications. In some aspects, a two microphone interface uses a pulse density modulation (PDM) bus. The two microphones share the same clock. The PDM output of the first microphone is transmitted and received by a second microphone on a first clock edge. The second microphone decimates the signals of both microphones and converts these decimated signals into pulse code modulation (PCM) signals, where the signals are processed and converted back to PDM and then a single, combined, and processed output is sent to a codec (or some other external device) on a second clock edge of the clock. The codec will see only the single combined signal (although the codec may receive although not process the signal sent from the first microphone to the second microphone on the first clock edge).
[0011] Referring now to FIG. 1 and FIG. 2, one example of an interface that provides microphone-to-microphone communication is described. A first microphone 102 includes a first charge pump 104, a first micro electro mechanical system (MEMS) transducer 106, a first amplifier 108, and a first sigma delta converter 110.
[0012] A second microphone 122 includes a second charge pump 124, a second micro electro mechanical system (MEMS) transducer 126, a second amplifier 128, a second sigma delta converter 130, a decimator 132, a digital signal processor (DSP) 134, and an interpolator 136. The first MEMS microphone 102 and the second MEMS microphone 122 share a clock 105. The hardware clock that provides the clock signal 105 may be disposed at the codec or system on a chip (SoC) 140 in one example. Other examples are possible.
[0013] The first microphone 102 and the second microphone 122 in some aspects each include a housing that encloses the above-mentioned components. In some examples, each microphone 102, 122 includes a base, on which the components are deployed and a lid or cover that is coupled to the base and that encloses the internal components. Additionally, some of the components (e.g., sigma delta converters, decimators, and amplifiers) may be deployed on an integrated circuit that is disposed on the base. [0014] The first charge pump 104 and second charge pump 124 provide voltages and/or current to the first MEMS transducer 106 and the second MEMS transducer 126. The first MEMS transducer 106 and the second MEMS transducer 126 convert sound energy into an electrical signal. In these regards, the first MEMS transducer 106 and the second MEMS transducer 126 may include a diaphragm and a charged back plate (with the charge provided by the charge pumps 104 and 124). Sound energy moves the diaphragms to produce an electrical signal. Although MEMS device may be used as transducers 106 and 126, it will also be appreciated that other types of devices such as piezo electrical devices or speakers (being operated as a microphone) may also be deployed.
[0015] The first amplifier 108 and second amplifier 128 amplify the analog signals from the first MEMS transducer 106 and the second MEMS transducer 126. The first sigma delta converter 110 and the second sigma delta converter 130 convert the analog signals into pulse density modulation (PDM) signals.
[0016] The decimator 132 receives signals from the first MEMS transducer 106 and the second MEMS transducer 126 (that have been converted into PDM signals). The decimator 132 converts these PDM signals into to pulse code modulation (PCM) signals for processing by the DSP 134.
[0017] The DSP 134 performs various processing functions on the signals. For example, the DSP 134 may perform noise identification (e.g., identify wind or other types of noise, perform noise suppression (removal), or ultrasonic gesture or activity detection functions. Other examples of processing functions may also be performed by the DSP 134.
[0018] The interpolator 136 converts the PCM signal from the DSP to a PDM signal for transmission to the codec 140. The codec (or system on chip (SoC)) 140 receives the combined signal.
[0019] The first microphone 102 couples to a codec 140 and to the second microphone
122 and to the codec 140. The codec 140 couples to an application processor 142. The purpose of the codec 140 is to convert the PDM signal into PCM data and provide an amplifier for speakers in electronic devices. The application processor 142 is in one aspect a system on a chip (SoC) designed to support applications running in a mobile operating system environment. In some architectures, the codec 140 is not required and the microphones 102 and 122 may be directly connected to the applications processor 142.
[0020] In one example of the operation of the system of FIG. 1 and now specifically referring to the time line of FIG. 2, the clock 105 has rising edges 107 and falling edges 109. Data 11 1, 113, 115 is obtained and transmitted from the first microphone 102 (sensed by the first MEMS transducer 106) to the second microphone 122 on the rising edges 107 of the clock 105.
[0021] Data 117, 119, and 121 is obtained from the second MEMS transducer 126 of the second microphone 122 on falling edges 109 of the clock 105. Combined data 131, 133, and 135 is sent from the second microphone 122 to the codec 140 on falling edges 109. The combined data is the processed audio stream from the first microphone 102 and the second microphone 122 combined and processed in the DSP in the second microphone.
[0022] It will be appreciated that there is a time lag between the reception of the data from the first microphone 102 and transmission of the combined data from the second microphone 122. For example, combined data 133 may be the combination of data 111 (from the first microphone 102) and the data 119 (from the second transducer 126 of the second microphone 122).
[0023] It will be appreciated that although in this example data is sent from the first microphone to the second microphone on a rising clock edge and sent from the second microphone to the codec on a second clock edge, that this order may be reversed. Other timing relationships may also be used.
[0024] In this way, the codec 140 receives the combined data from the two microphones
102 and 122. Microphone-to-microphone communications is supported in an efficient and seamless way.
[0025] Preferred embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention. It should be understood that the illustrated embodiments are exemplary only, and should not be taken as limiting the scope of the invention.

Claims

WHAT IS CLAIMED IS:
1. A microphone system comprising: a first transducer deployed at a first microphone; a second transducer deployed at a second microphone, the first microphone being physically distinct from the second microphone; a decimator deployed at the second microphone that receives first pulse density modulation (PDM) data from the first transducer and second PDM data from the second transducer and decimates and combines the first PDM data and the second PDM data into combined pulse code modulation (PCM) data; an interpolator deployed at the second microphone, the interpolator being configured to convert the combined PCM data to combined PDM data, and transmit the combined PDM data to an external processing device.
2. The microphone system of claim 1, wherein the first transducer and the second transducer are micro electro mechanical system (MEMS) transducers.
3. The microphone system of claim 2, wherein the first microphone includes a first charge pump and the second microphone includes a second charge pump.
4. The microphone system of claim 1 wherein the first microphone includes a first sigma delta converter and the second microphone includes a second sigma delta converter.
5. The microphone system of claim 1, wherein the first microphone and the second MEMS microphone share a clock.
6. The microphone system of claim 5, wherein the clock is supplied by an external processing device.
7. The microphone system of claim 1, wherein the external processing device is a codec or system on a chip (SoC).
8. The microphone system of claim 1, wherein the decimated PCM data is sent to the external processing device.
9. A microphone comprising: a housing that encloses: a transducer; a decimator that is configured to receive first pulse density modulation (PDM) data from the transducer and second PDM data from another transducer external to the housing, such that the decimator decimates and combines the first PDM data and the second PDM data into combined pulse code modulation (PCM) data; an interpolator deployed that is configured to convert the combined PCM data to combined PDM data, and transmit the combined PDM data to an external processing device.
10. The microphone of claim 9, wherein the transducer is a micro electro mechanical system (MEMS) transducer.
11. The microphone of claim 9, wherein the microphone includes a charge pump.
12. The microphone of claim 9 wherein the microphone includes a sigma delta converter.
13. The microphone of claim 9, wherein the external processing device is a codec or system on a chip (SoC).
14. The microphone of claim 9, wherein the decimated PCM data is sent to the external processing device.
15. A method of operating a microphone system, the system including a first transducer deployed at a first microphone and a second transducer deployed at a second microphone, the first microphone being physically distinct from the second microphone, the method comprising: receiving first pulse density modulation (PDM) data from the first transducer and second PDM data from the second transducer; at a decimator deployed at the second microphone, decimating and combining the first PDM data and the second PDM data into combined pulse code modulation (PCM) data; at an interpolator deployed at the second microphone, converting the combined PCM data to combined PDM data; transmitting the combined PDM data to an external processing device.
16. The method of claim 15, wherein the first transducer and the second transducer are micro electro mechanical system (MEMS) transducers.
17. The method of claim 15, wherein the first microphone includes a first charge pump and the second microphone includes a second charge pump.
18. The method of claim 15, comprising sharing a clock between the first microphone and the second MEMS microphone.
19. The method of claim 18, wherein the clock is disposed at the external processing device.
20. The method of claim 15, wherein the external processing device is a codec or system on a chip (SoC).
21. The method of claim 15, wherein the decimated PCM data is sent to the external processing device.
PCT/US2016/016706 2015-02-19 2016-02-05 Interface for microphone-to-microphone communications Ceased WO2016133722A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112016000823.6T DE112016000823T5 (en) 2015-02-19 2016-02-05 Interface for microphone-to-microphone communication
CN201680010313.2A CN107251576B (en) 2015-02-19 2016-02-05 Microphone and method implemented in microphone

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562118252P 2015-02-19 2015-02-19
US62/118,252 2015-02-19

Publications (1)

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WO2016133722A1 true WO2016133722A1 (en) 2016-08-25

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US (1) US9866938B2 (en)
CN (1) CN107251576B (en)
DE (1) DE112016000823T5 (en)
TW (1) TW201633729A (en)
WO (1) WO2016133722A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10200794B2 (en) * 2014-12-31 2019-02-05 Invensense, Inc. Ultrasonic operation of a digital microphone
US10250980B2 (en) * 2016-10-19 2019-04-02 Fortemedia, Inc. Digital microphone and control method therefor
CN110024281B (en) 2016-10-28 2024-05-07 三星电子株式会社 Transducer assembly and method
JP7410935B2 (en) 2018-05-24 2024-01-10 ザ リサーチ ファウンデーション フォー ザ ステイト ユニバーシティー オブ ニューヨーク capacitive sensor
CN112806026B (en) * 2018-10-09 2022-05-31 美商楼氏电子有限公司 Integrated circuit, microphone assembly, multi-microphone system, method of processing audio stream
US11265666B2 (en) 2019-04-12 2022-03-01 Knowles Electronics, Llc Microphone device with communication interface
US12391546B1 (en) 2021-01-07 2025-08-19 Skyworks Global Pte. Ltd. Method of making acoustic devices with directional reinforcement
US12328559B2 (en) 2021-06-17 2025-06-10 Skyworks Solutions, Inc. Acoustic devices with improved sensitivity
US12568337B2 (en) 2021-06-17 2026-03-03 Skyworks Solutions, Inc. Acoustic devices with residual stress compensation
US12335687B2 (en) 2021-09-20 2025-06-17 Skyworks Solutions, Inc. Piezoelectric MEMS microphone with cantilevered separation
US20230130082A1 (en) 2021-10-21 2023-04-27 Skyworks Solutions, Inc. Method of making a piezoelectric sensor with increased sensitivity and devices having the same
US20230136347A1 (en) 2021-11-01 2023-05-04 Skyworks Solutions, Inc. Method of modifying a resonant frequency in cantilever sensors
US12218693B2 (en) * 2022-07-26 2025-02-04 Syntiant Low power digital PDM microphone interfacing for always-on applications

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007226040A (en) * 2006-02-24 2007-09-06 Aiphone Co Ltd Interphone device
US7619551B1 (en) * 2008-07-29 2009-11-17 Fortemedia, Inc. Audio codec, digital device and voice processing method
US20100086146A1 (en) * 2008-10-02 2010-04-08 Fortemedia, Inc. Silicon-based microphone package
US20110007907A1 (en) * 2009-07-10 2011-01-13 Qualcomm Incorporated Systems, methods, apparatus, and computer-readable media for adaptive active noise cancellation
US20130208915A1 (en) * 2012-02-10 2013-08-15 Infineon Technologies Ag System and method for a pcm interface for a capacitive signal source

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2069356C (en) * 1991-07-17 1997-05-06 Gary Wayne Elko Adjustable filter for differential microphones
US6070140A (en) 1995-06-05 2000-05-30 Tran; Bao Q. Speech recognizer
US5822598A (en) 1996-07-12 1998-10-13 Ast Research, Inc. Audio activity detection circuit to increase battery life in portable computers
EP0867856B1 (en) 1997-03-25 2005-10-26 Koninklijke Philips Electronics N.V. Method and apparatus for vocal activity detection
US6249757B1 (en) 1999-02-16 2001-06-19 3Com Corporation System for detecting voice activity
US6397186B1 (en) 1999-12-22 2002-05-28 Ambush Interactive, Inc. Hands-free, voice-operated remote control transmitter
DE10160830A1 (en) 2001-12-11 2003-06-26 Infineon Technologies Ag Micromechanical sensors and methods for producing the same
US6756700B2 (en) 2002-03-13 2004-06-29 Kye Systems Corp. Sound-activated wake-up device for electronic input devices having a sleep-mode
GB2405949A (en) 2003-09-12 2005-03-16 Canon Kk Voice activated device with periodicity determination
US7418392B1 (en) 2003-09-25 2008-08-26 Sensory, Inc. System and method for controlling the operation of a device by voice commands
DE102004011149B3 (en) 2004-03-08 2005-11-10 Infineon Technologies Ag Microphone and method of making a microphone
US20060074658A1 (en) 2004-10-01 2006-04-06 Siemens Information And Communication Mobile, Llc Systems and methods for hands-free voice-activated devices
US7268006B2 (en) 2004-12-30 2007-09-11 E.I. Du Pont De Nemours And Company Electronic device including a guest material within a layer and a process for forming the same
US7795695B2 (en) 2005-01-27 2010-09-14 Analog Devices, Inc. Integrated microphone
DE102005008511B4 (en) 2005-02-24 2019-09-12 Tdk Corporation MEMS microphone
US7825484B2 (en) 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
SG130158A1 (en) 2005-08-20 2007-03-20 Bse Co Ltd Silicon based condenser microphone and packaging method for the same
DE102005053767B4 (en) 2005-11-10 2014-10-30 Epcos Ag MEMS microphone, method of manufacture and method of installation
DE102005053765B4 (en) 2005-11-10 2016-04-14 Epcos Ag MEMS package and method of manufacture
GB0605576D0 (en) 2006-03-20 2006-04-26 Oligon Ltd MEMS device
KR100722686B1 (en) 2006-05-09 2007-05-30 주식회사 비에스이 Silicon condenser microphone with additional back chamber and acoustic holes formed in the substrate
US7957972B2 (en) 2006-09-05 2011-06-07 Fortemedia, Inc. Voice recognition system and method thereof
US20080175425A1 (en) 2006-11-30 2008-07-24 Analog Devices, Inc. Microphone System with Silicon Microphone Secured to Package Lid
TWI327357B (en) 2007-01-10 2010-07-11 Advanced Semiconductor Eng Mems microphone package and method thereof
US7991168B2 (en) * 2007-05-15 2011-08-02 Fortemedia, Inc. Serially connected microphones
TWI323242B (en) 2007-05-15 2010-04-11 Ind Tech Res Inst Package and packageing assembly of microelectromechanical system microphone
TWM341025U (en) 2008-01-10 2008-09-21 Lingsen Precision Ind Ltd Micro electro-mechanical microphone package structure
US8244528B2 (en) 2008-04-25 2012-08-14 Nokia Corporation Method and apparatus for voice activity determination
US8193596B2 (en) 2008-09-03 2012-06-05 Solid State System Co., Ltd. Micro-electro-mechanical systems (MEMS) package
US8351634B2 (en) 2008-11-26 2013-01-08 Analog Devices, Inc. Side-ported MEMS microphone assembly
JP5267573B2 (en) * 2009-01-08 2013-08-21 富士通株式会社 Voice control device and voice output device
US20100177913A1 (en) * 2009-01-12 2010-07-15 Fortemedia, Inc. Microphone preamplifier circuit and voice sensing devices
US8472648B2 (en) 2009-01-20 2013-06-25 General Mems Corporation Miniature MEMS condenser microphone package and fabrication method thereof
US8325951B2 (en) 2009-01-20 2012-12-04 General Mems Corporation Miniature MEMS condenser microphone packages and fabrication method thereof
CN201438743U (en) 2009-05-15 2010-04-14 瑞声声学科技(常州)有限公司 microphone
JP4505035B1 (en) * 2009-06-02 2010-07-14 パナソニック株式会社 Stereo microphone device
CN101651917A (en) 2009-06-19 2010-02-17 瑞声声学科技(深圳)有限公司 Capacitance microphone
CN101651913A (en) 2009-06-19 2010-02-17 瑞声声学科技(深圳)有限公司 microphone
CN101959106A (en) 2009-07-16 2011-01-26 鸿富锦精密工业（深圳）有限公司 Packaging structure of microphone of micro electromechanical system and packaging method thereof
US8275148B2 (en) 2009-07-28 2012-09-25 Fortemedia, Inc. Audio processing apparatus and method
CN101765047A (en) 2009-09-28 2010-06-30 瑞声声学科技(深圳)有限公司 Capacitance microphone and manufacturing method thereof
CN102741918B (en) 2010-12-24 2014-11-19 华为技术有限公司 Method and apparatus for voice activity detection
US8670554B2 (en) * 2011-04-20 2014-03-11 Aurenta Inc. Method for encoding multiple microphone signals into a source-separable audio signal for network transmission and an apparatus for directed source separation
US20130058495A1 (en) * 2011-09-01 2013-03-07 Claus Erdmann Furst System and A Method For Streaming PDM Data From Or To At Least One Audio Component
US8996381B2 (en) 2011-09-27 2015-03-31 Sensory, Incorporated Background speech recognition assistant
EP2592751B1 (en) * 2011-11-14 2017-05-31 Dialog Semiconductor GmbH A sigma-delta modulator for increased volume resolution in audio output stages
US8666751B2 (en) 2011-11-17 2014-03-04 Microsoft Corporation Audio pattern matching for device activation
US9838810B2 (en) 2012-02-27 2017-12-05 Qualcomm Technologies International, Ltd. Low power audio detection
TWI474317B (en) 2012-07-06 2015-02-21 Realtek Semiconductor Corp Signal processing apparatus and signal processing method
US8937515B2 (en) * 2012-11-15 2015-01-20 Dsp Group Ltd. Device and method for direct mixing of pulse density modulation (PDM) signals
US9704486B2 (en) 2012-12-11 2017-07-11 Amazon Technologies, Inc. Speech recognition power management
US10395651B2 (en) 2013-02-28 2019-08-27 Sony Corporation Device and method for activating with voice input
US9349386B2 (en) 2013-03-07 2016-05-24 Analog Device Global System and method for processor wake-up based on sensor data
US11393461B2 (en) 2013-03-12 2022-07-19 Cerence Operating Company Methods and apparatus for detecting a voice command
US9112984B2 (en) 2013-03-12 2015-08-18 Nuance Communications, Inc. Methods and apparatus for detecting a voice command
US9361885B2 (en) 2013-03-12 2016-06-07 Nuance Communications, Inc. Methods and apparatus for detecting a voice command
US9703350B2 (en) 2013-03-15 2017-07-11 Maxim Integrated Products, Inc. Always-on low-power keyword spotting
US9043211B2 (en) 2013-05-09 2015-05-26 Dsp Group Ltd. Low power activation of a voice activated device
US20140343949A1 (en) 2013-05-17 2014-11-20 Fortemedia, Inc. Smart microphone device
US9245527B2 (en) 2013-10-11 2016-01-26 Apple Inc. Speech recognition wake-up of a handheld portable electronic device
US20150112690A1 (en) 2013-10-22 2015-04-23 Nvidia Corporation Low power always-on voice trigger architecture
US10079019B2 (en) 2013-11-12 2018-09-18 Apple Inc. Always-on audio control for mobile device
US9380384B2 (en) * 2013-11-26 2016-06-28 Qualcomm Incorporated Systems and methods for providing a wideband frequency response
CN104320738A (en) * 2014-09-29 2015-01-28 宇龙计算机通信科技(深圳)有限公司 Digital microphone circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007226040A (en) * 2006-02-24 2007-09-06 Aiphone Co Ltd Interphone device
US7619551B1 (en) * 2008-07-29 2009-11-17 Fortemedia, Inc. Audio codec, digital device and voice processing method
US20100086146A1 (en) * 2008-10-02 2010-04-08 Fortemedia, Inc. Silicon-based microphone package
US20110007907A1 (en) * 2009-07-10 2011-01-13 Qualcomm Incorporated Systems, methods, apparatus, and computer-readable media for adaptive active noise cancellation
US20130208915A1 (en) * 2012-02-10 2013-08-15 Infineon Technologies Ag System and method for a pcm interface for a capacitive signal source

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