WO2016123607A3 - Contact arrangements for stackable microelectronic package structures - Google Patents

Contact arrangements for stackable microelectronic package structures Download PDF

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Publication number
WO2016123607A3
WO2016123607A3 PCT/US2016/015938 US2016015938W WO2016123607A3 WO 2016123607 A3 WO2016123607 A3 WO 2016123607A3 US 2016015938 W US2016015938 W US 2016015938W WO 2016123607 A3 WO2016123607 A3 WO 2016123607A3
Authority
WO
WIPO (PCT)
Prior art keywords
contacts
contact arrangements
ring array
array
microelectronic package
Prior art date
Application number
PCT/US2016/015938
Other languages
French (fr)
Other versions
WO2016123607A2 (en
Inventor
Zhuowen Sun
Yong Chen
Kyong-Mo Bang
Original Assignee
Invensas Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/609,896 external-priority patent/US9349707B1/en
Priority claimed from US14/609,878 external-priority patent/US9337170B1/en
Application filed by Invensas Corporation filed Critical Invensas Corporation
Publication of WO2016123607A2 publication Critical patent/WO2016123607A2/en
Publication of WO2016123607A3 publication Critical patent/WO2016123607A3/en

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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An apparatus relates generally to a microelectronic assembly. In such an apparatus, a contact arrangements are disposed on a first surface of a first substrate, including first contacts disposed as a first ring array; second contacts disposed interior to the first contacts as a second ring array; third contacts disposed interior to the second contacts as a third ring array; and fourth contacts disposed interior to the third contacts on the first surface as an innermost array. The first ring array, the second ring array, and the third ring array are concentric rings with the innermost array in a central region of the concentric rings. The first contacts and the fourth contacts are for interconnection with first microelectronic dies. The second contacts and the third contacts are for interconnection with second microelectronic dies.
PCT/US2016/015938 2015-01-30 2016-02-01 Contact arrangements for stackable microelectronic package structures WO2016123607A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14/609,896 US9349707B1 (en) 2015-01-30 2015-01-30 Contact arrangements for stackable microelectronic package structures with multiple ranks
US14/609,878 US9337170B1 (en) 2015-01-30 2015-01-30 Contact arrangements for stackable microelectronic package structures
US14/609,878 2015-01-30
US14/609,896 2015-01-30

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WO2016123607A2 WO2016123607A2 (en) 2016-08-04
WO2016123607A3 true WO2016123607A3 (en) 2016-09-22

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CN106845989A (en) * 2017-03-02 2017-06-13 上海浦江智能卡系统有限公司 Secure payment integration module and secure payment device
US10665572B2 (en) * 2018-08-15 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and manufacturing method thereof

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US20120104606A1 (en) * 2010-11-02 2012-05-03 Fujitsu Semiconductor Limited Ball grid array semiconductor device and its manufacture
US8525314B2 (en) * 2004-11-03 2013-09-03 Tessera, Inc. Stacked packaging improvements
US8680684B2 (en) * 2012-01-09 2014-03-25 Invensas Corporation Stackable microelectronic package structures

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Publication number Priority date Publication date Assignee Title
US8525314B2 (en) * 2004-11-03 2013-09-03 Tessera, Inc. Stacked packaging improvements
US20120104606A1 (en) * 2010-11-02 2012-05-03 Fujitsu Semiconductor Limited Ball grid array semiconductor device and its manufacture
US8680684B2 (en) * 2012-01-09 2014-03-25 Invensas Corporation Stackable microelectronic package structures

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