WO2016093355A1 - 電鋳部品の製造方法 - Google Patents
電鋳部品の製造方法 Download PDFInfo
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- WO2016093355A1 WO2016093355A1 PCT/JP2015/084841 JP2015084841W WO2016093355A1 WO 2016093355 A1 WO2016093355 A1 WO 2016093355A1 JP 2015084841 W JP2015084841 W JP 2015084841W WO 2016093355 A1 WO2016093355 A1 WO 2016093355A1
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- Prior art keywords
- electroformed
- manufacturing
- photoresist layer
- parts
- component
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 304
- 238000000034 method Methods 0.000 title claims description 182
- 238000005323 electroforming Methods 0.000 claims abstract description 93
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- 239000000758 substrate Substances 0.000 claims description 100
- 238000000926 separation method Methods 0.000 claims description 26
- 238000005498 polishing Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
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- 238000010030 laminating Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 58
- 229910052710 silicon Inorganic materials 0.000 description 58
- 239000010703 silicon Substances 0.000 description 58
- 239000002184 metal Substances 0.000 description 39
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- 238000010586 diagram Methods 0.000 description 14
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- DVWAOMBFCAJFPW-UHFFFAOYSA-L nickel(2+) disulfamate hydrate Chemical compound O.S(N)([O-])(=O)=O.[Ni+2].S(N)([O-])(=O)=O DVWAOMBFCAJFPW-UHFFFAOYSA-L 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/08—Perforated or foraminous objects, e.g. sieves
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
- C25D1/22—Separating compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B13/00—Gearwork
- G04B13/02—Wheels; Pinions; Spindles; Pivots
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B15/00—Escapements
- G04B15/14—Component parts or constructional details, e.g. construction of the lever or the escape wheel
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B17/00—Mechanisms for stabilising frequency
- G04B17/04—Oscillators acting by spring tension
- G04B17/06—Oscillators with hairsprings, e.g. balance
- G04B17/066—Manufacture of the spiral spring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- G—PHYSICS
- G04—HOROLOGY
- G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
- G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
- G04D3/0069—Watchmakers' or watch-repairers' machines or tools for working materials for working with non-mechanical means, e.g. chemical, electrochemical, metallising, vapourising; with electron beams, laser beams
Definitions
- the present invention relates to a method for manufacturing an electroformed part used for manufacturing a precision fine part used in precision equipment and the like.
- Electroforming (hereinafter referred to as “electroforming”), a type of electroplating technology, is a metal product that reproduces the original shape and surface irregularities by electrodepositing electrolyzed metals and ions onto the original surface. Electroformed parts) can be manufactured (replicated). In such electroforming, parts having high transferability can be manufactured by using a precisely processed electroforming mold. In recent years, it has been proposed to manufacture precision parts such as watches by using an electroforming mold manufactured by photolithography using a photosensitive material such as a silicon process by LIGA (Lithographie Galvanoforming Abforming) technology.
- LIGA Lithographie Galvanoforming Abforming
- a stepped three-dimensional structure is obtained by repeating a process of forming a metal component layer by electroforming on a resin mold formed by lithography on a conductive substrate and flattening by polishing or grinding a plurality of times.
- a technique for manufacturing a fine structure see, for example, Patent Document 2 below.
- electroformed parts such as electroformed bodies and microstructures
- electroformed parts include electroformed parts and multi-stage electroforming. Although parts can be manufactured in a series of manufacturing steps, only one type of electroformed part can be manufactured.
- the above-described conventional method for producing an electroformed component requires that each electroformed component be produced in a separate production process when producing a plurality of types of components by electroforming, resulting in poor production efficiency. was there.
- a plurality of types of electroformed parts to be manufactured are parts (stepped parts) partially provided with a stepped part, the number of steps involved in manufacturing the stepped part increases, and the number of processes is large.
- the electroformed part must be produced in a production process different from that of other types of electroformed parts, resulting in poor production efficiency.
- the present invention provides an electroformed component manufacturing method capable of accurately manufacturing a plurality of types of parts having different shapes at a time in a series of manufacturing processes in order to eliminate the above-described problems caused by the prior art. With the goal.
- the present invention is capable of accurately performing a plurality of types of parts having different shapes, at least a part of which is in close contact with or in contact with each other, in a series of manufacturing processes. It is an object of the present invention to provide a method for manufacturing an electroformed part that can be manufactured well.
- the present invention provides a series of parts that are a plurality of types of parts having different shapes and that move relatively in a state where at least some of them are in close contact with or in contact with each other. It is an object of the present invention to provide a method for manufacturing an electroformed part that can be accurately manufactured at once in the manufacturing process.
- a method for manufacturing an electroformed component according to the present invention includes patterning a first photoresist layer formed on the front surface side of a conductive layer, and Forming a first through hole penetrating the photoresist layer in the lamination direction of the conductive layer and the first photoresist layer, and electroforming using the conductive layer as one electrode, Depositing a first electroformed member on the front surface side of the conductive layer and in the first through-hole; and a step of depositing the first electroformed member and the first photoresist layer.
- first electroformed part Forming a first electroformed part by flattening the surface side, removing the first photoresist layer from the conductive layer on which the first electroformed part is formed, 1 exposed by removing the photoresist layer of 1 Forming a release film on the surface of the first electroformed component; and a second photoresist layer covering the first electroformed component from the front surface side on the front surface side of the conductive layer And patterning the second photoresist layer to penetrate the second photoresist layer along the stacking direction in a state where a part of the first electroformed component protrudes inward. And forming a second electroformed member on the front surface side of the conductive layer and in the second through hole by forming the two through holes and electroforming using the conductive layer as one electrode.
- the method for producing an electroformed component according to the present invention includes a step of chamfering a corner portion of at least a portion of the first electroformed component located in the second through hole in the above invention, The step of forming the separation film is performed after the step of chamfering.
- the method for manufacturing an electroformed component according to the present invention is characterized in that, in the above-described invention, the chamfering step chamfers the corner by electrolytic polishing or wet etching.
- the method for manufacturing an electroformed component according to the present invention is characterized in that, in the above invention, the conductive layer is formed on a surface of a substrate made of an insulating material or a semiconductive material.
- the method for manufacturing an electroformed component according to the present invention is characterized in that, in the above invention, the step of forming the release film forms a surface oxide film as the release film.
- the first electroformed part and the second electroformed part are parts that are at least partially in close contact with or in contact with each other.
- the electroformed component manufacturing method according to the present invention is the method according to the above invention, wherein the first electroformed component and the second electroformed component are relative to each other in a state where at least a part thereof is in close contact with or in contact with each other. It is a part that moves to
- the step of forming the first electroformed component mainly includes the first electroformed member and the first photoresist layer. And flattening by grinding from the surface side.
- the step of forming the second electroformed component mainly includes the second electroformed member and the second photoresist layer. And flattening by grinding from the surface side.
- an electroformed component according to the present invention a plurality of types of components having different shapes, at least a part of which is in close contact with or in contact with each other, can be accurately manufactured at a time in a series of manufacturing processes. There is an effect that can be done.
- an electroformed component according to the present invention, a series of manufacturing a plurality of types of components having different shapes and moving relatively in a state where at least some of them are in close contact with or in contact with each other. In the process, there is an effect that it can be accurately manufactured at a time.
- FIG. 1 is an explanatory view (No. 1) showing a procedure for manufacturing an electroformed part by the method for manufacturing an electroformed part according to the first embodiment of the present invention.
- FIG. 2 is an explanatory view (No. 2) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the present invention.
- FIG. 3 is an explanatory view (No. 3) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the present invention.
- FIG. 4 is an explanatory view (No. 4) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the present invention.
- FIG. 5 is an explanatory view showing an arrangement state in the electroforming tank.
- FIG. 6 is an explanatory view (No. 5) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the invention.
- FIG. 7 is an explanatory view (No. 6) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the present invention.
- FIG. 8 is an explanatory view (No. 7) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the invention.
- FIG. 9 is an explanatory view (No. 8) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the invention.
- FIG. 10 is an explanatory view (No. 5) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the invention.
- FIG. 7 is an explanatory view (No. 6) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to
- FIG. 11 is an explanatory view (No. 10) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the invention.
- FIG. 12 is an explanatory view (No. 11) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the invention.
- FIG. 13 is an explanatory view (No. 12) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the invention.
- FIG. 14 is an explanatory diagram (part 1) showing a part of a procedure for manufacturing an electroformed component by the method for manufacturing an electroformed component according to the first embodiment of the present invention.
- FIG. 15 is an explanatory diagram (No. 2) showing a part of the procedure for manufacturing the electroformed component by the method for manufacturing the electroformed component of the first embodiment according to the present invention.
- FIG. 16 is explanatory drawing (the 1) which shows a part of manufacturing procedure of the electroformed part by the manufacturing method of the electroformed part of Embodiment 2 concerning this invention.
- FIG. 17 is explanatory drawing (the 2) which shows a part of manufacturing procedure of the electroformed component by the manufacturing method of the electroformed component of Embodiment 2 concerning this invention.
- FIG. 18 is an explanatory diagram (No.
- FIG. 19 is an explanatory diagram (part 4) illustrating a part of a procedure for manufacturing an electroformed component by the method for manufacturing an electroformed component according to the second embodiment of the present invention.
- FIG. 20 is an explanatory view (No. 5) showing a part of the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the second embodiment according to the present invention.
- FIG. 21 is an explanatory view (No. 6) showing a part of the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the second embodiment according to the invention.
- FIG. 22 is an explanatory view (No.
- FIG. 23 is an explanatory diagram (No. 1) showing a procedure for manufacturing an electroformed part by the method for manufacturing an electroformed part according to the third embodiment of the present invention.
- FIG. 24 is an explanatory diagram (No. 2) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the third embodiment according to the invention.
- FIG. 25 is an explanatory view (No. 3) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the third embodiment according to the invention.
- FIG. 26 is an explanatory view (No.
- FIG. 27 is an explanatory view (No. 5) showing the procedure for manufacturing the electroformed part by the method for manufacturing an electroformed part of the third embodiment according to the invention.
- FIG. 28 is an explanatory view (No. 6) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the third embodiment according to the invention.
- FIG. 29 is an explanatory view (No. 7) showing the procedure for manufacturing the electroformed part by the method for manufacturing an electroformed part of the third embodiment according to the invention.
- FIG. 30 is an explanatory view (No.
- FIG. 31 is an explanatory view (No. 9) showing the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the third embodiment according to the invention.
- FIG. 32 is an explanatory view (No. 10) showing the procedure for manufacturing the electroformed part by the method for manufacturing an electroformed part of the third embodiment according to the invention.
- FIG. 33 is an explanatory view (No. 11) showing the procedure for manufacturing the electroformed part by the method for manufacturing an electroformed part of the third embodiment according to the invention.
- FIG. 34 is an explanatory diagram (No. 1) illustrating an example of a balance wheel and a weight attached to the balance wheel in the mechanical timepiece.
- FIG. 35 is an explanatory diagram (part 2) illustrating an example of a balance wheel and a weight attached to the balance wheel in a mechanical timepiece.
- FIG. 36 is an explanatory view (No. 1) showing a manufacturing example of a balance wheel and a weight attached to the balance wheel in a mechanical timepiece according to the method for manufacturing an electroformed component according to the present invention.
- FIG. 37 is an explanatory diagram (No. 2) showing a manufacturing example of the balance wheel and the weight attached to the balance wheel in the mechanical timepiece according to the method for manufacturing the electroformed component according to the present invention.
- FIG. 38 is an explanatory view (No. 3) showing a manufacturing example of the balance wheel and the weight attached to the balance wheel in the mechanical timepiece according to the method for manufacturing the electroformed component according to the present invention.
- FIG. 39 is a plan view showing a fitting state of the gear and the bearing.
- FIG. 40 is an explanatory view (No. 1) showing an example of manufacturing gears and bearings in a mechanical timepiece by the method for manufacturing an electroformed component according to the present invention.
- FIG. 41 is an explanatory view (No. 2) showing an example of manufacturing gears and bearings in a mechanical timepiece by the method for manufacturing an electroformed component according to the present invention.
- FIG. 42 is an explanatory view (No. 3) showing an example of manufacturing gears and bearings in a mechanical timepiece by the method for manufacturing an electroformed component according to the present invention.
- FIG. 43 is a plan view showing an escape wheel & pinion.
- FIG. 44 is a partially enlarged plan view showing a portion surrounded by an ellipse A indicated by a broken line in FIG.
- FIG. 45 is a plan view showing a part of the portion viewed from the direction of arrow B in FIG. 44 in an enlarged manner.
- FIG. 46 is an explanatory view (No. 1) showing a manufacturing example of an escape wheel and a small plate-like component in a mechanical timepiece according to the method for manufacturing an electroformed component according to the present invention.
- FIG. 47 is an explanatory view (No. 2) showing a manufacturing example of an escape wheel and a small plate-like component in a mechanical timepiece according to the method for manufacturing an electroformed component according to the present invention.
- FIG. 48 is an explanatory diagram (No.
- FIG. 49 is an explanatory view (No. 4) showing an example of manufacturing an escape wheel and a small plate-like component in a mechanical timepiece according to the method for manufacturing an electroformed component according to the present invention.
- FIG. 50 is an explanatory view (No. 5) showing a manufacturing example of an escape wheel and a small plate-like component in a mechanical timepiece according to the method for manufacturing an electroformed component according to the present invention.
- FIG. 51 is an explanatory diagram (part 1) illustrating a part of the rotor.
- FIG. 52 is an explanatory diagram (part 2) illustrating a part of the rotor.
- FIG. 53 is an explanatory diagram (part 1) illustrating a rotor shaft included in the rotor.
- FIG. 54 is an explanatory diagram (part 2) illustrating a rotor shaft included in the rotor.
- FIG. 55 is an explanatory view showing a hand and a heel incorporated in an analog timepiece.
- the LIGA method is a method of manufacturing a target part (structure) by combining X-ray lithography, electroforming, and molding, and manufacturing a part having a large aspect ratio (ratio of depth (height) to processing width). can do.
- a resist photosensitive organic material
- a mask X-ray mask
- transfer to resist it is possible to manufacture a component having a depth (height) of 100 ⁇ m or more and an arbitrary shape in the lateral direction (direction along the surface of the substrate).
- X-rays generated from a synchrotron radiation (SR) optical device having good straightness are preferably used.
- the method of manufacturing the electroformed part of the first embodiment includes, for example, electroformed parts (first electroformed part and first electroformed part) that are fitted and engaged with each other in a product that is configured by assembling the electroformed part. 2 electroformed parts).
- electroformed parts first electroformed part and first electroformed part
- such an electroformed part can be realized by, for example, a shaft and a bearing, or a gear constituting a train wheel.
- the electroformed parts (the first electroformed part and the second electroformed part) fitted to each other may be fitted so as to rotate or slide relative to each other.
- the bearing into which the shaft is fitted is the first electroformed component, and the shaft is fitted into the bearing.
- the second electroformed part can be fitted.
- each of the first electroformed component and the second electroformed component that are engaged with each other constitutes a train wheel. It can be realized by gears.
- FIGS. 1 to 4 and FIGS. 6 to 13 are explanatory views showing a procedure for producing an electroformed part by the method for producing an electroformed part of the first embodiment according to the present invention.
- FIG. 5 is an explanatory view showing an arrangement state in the electroforming tank.
- FIGS. 1 to 4 and FIGS. 6 to 13 schematically show the cross sections of the electroformed parts in each process of producing the electroformed parts by the method for producing electroformed parts of the first embodiment.
- positioning state in the electroforming tank in one process by the manufacturing method of the electroformed component of Embodiment 1 is shown typically.
- a substrate 1 is prepared as shown in FIG.
- substrate 1 can be formed using the insulating material (insulating material) which has favorable insulation, for example.
- the substrate 1 can be formed using an insulating material such as glass or plastic.
- the substrate 1 may be formed using, for example, a semiconductive semiconductor material (semiconductive material).
- the substrate 1 can be formed using a semiconductor material such as silicon (Si).
- Si silicon
- a silicon substrate formed using silicon is used as the substrate 1.
- the silicon substrate will be described with reference numeral 1.
- a conductive layer 2 is formed on the front surface side of the silicon substrate 1.
- the conductive layer 2 can be formed using a material having good conductivity. Specifically, the conductive layer 2 is formed by applying a metal material such as copper (Cu) or gold (Au) to the front surface of the silicon substrate 1 with a uniform thickness by a method such as sputtering. Can be formed. More specifically, in the conductive layer 2 (seed metal), a metal material such as copper (Cu) or gold (Au) is provided on the front surface side of the silicon substrate 1 to a thickness of about 1 ⁇ m to 2 ⁇ m. Formed by. The conductive layer 2 is also referred to as seed metal.
- the first photoresist layer 3 is formed on the front surface side of the conductive layer 2, and the first photoresist layer 3 is patterned to thereby form the first photo layer. Openings (first through holes) 3 a are formed in the resist layer 3.
- the opening 3a is formed, for example, so as to penetrate the first photoresist layer 3 in the thickness direction.
- the opening 3a is provided as an electroformed part, for example, in the case of manufacturing a shaft and a bearing, and is a size (inner diameter and depth) that allows the shaft to be inserted (fitted) to receive the shaft.
- the first electroforming layer 7 is realized by the first photoresist layer 3 and the conductive layer 2 in which the opening 3a is formed.
- first electroforming mold 7 In forming the first electroforming mold 7, specifically, first, on the front surface side of the conductive layer 2, a positive type having a thickness larger than the thickness of the first electroformed component to be manufactured. A photoresist is applied to form the first photoresist layer 3.
- the first photoresist layer 3 is applied to a uniform thickness of about several hundred ⁇ m to 500 ⁇ m, for example.
- a photomask that shields light other than the portion corresponding to the opening 3 a is set on the front surface side of the first photoresist layer 3. Then, with a photomask set, exposure is performed by irradiating ultraviolet rays, X-rays, or the like. Thereafter, the first photoresist layer 3 (silicon substrate 1) is developed using an alkaline solution or the like, and the exposed portion is removed by exposure. By such patterning, the opening 3a can be formed, and the first electroforming mold 7 can be created.
- the first electroforming mold 7 is not limited to one made using a positive type photoresist.
- the first electroforming mold 7 may be made using a negative photoresist.
- a photomask that shields light from only the portion corresponding to the opening 3a is used.
- electroforming is performed using the conductive layer 2 that realizes the first electroforming mold 7 as one electrode, and the conductive layer 2 in the opening 3 a in the first photoresist layer 3 is formed.
- the first electroformed member 4 is deposited on the front surface side.
- the electrolytic solution 16 is filled in the electroforming tank 15 shown in FIG. 5, and the first electroforming member shown in FIG.
- the mold 7 is immersed.
- the first electroforming mold 7 is immersed in a bath of the electrolytic solution 16 with the first photoresist layer 3 side facing the counter electrode 17.
- the counter electrode 17 is formed using the same metal material as the first electroformed member 4. Specifically, for example, nickel (Ni) can be used for the counter electrode 17.
- Ni nickel
- an electrolytic solution corresponding to the metal to be electroformed is used.
- the electrolytic solution 16 in the case of electroforming nickel as the first electroformed member 4 is, for example, an aqueous solution containing nickel sulfamate hydrate.
- the electroforming material used for electroforming for depositing the first electroformed member 4 is not limited to nickel, but includes copper (Cu), gold (Au), silver (Ag), iron (Fe), and these metals. All materials that can be used for electroforming, such as alloys, can be used.
- a power source is then interposed between the conductive layer 2 of the first electroforming mold 7 and the counter electrode 17 that is immersed in a bath of the electrolytic solution 16.
- a DC voltage is applied by 18.
- the DC voltage is applied so that the counter electrode 17 becomes a positive electrode (anode) and the conductive layer 2 becomes a negative electrode (cathode).
- the metal ions electrolyzed from the counter electrode 17 in the electrolytic solution 16 migrate in the direction indicated by the arrow F in FIG. 5 and the first photoresist of the first electroforming template 7 is obtained.
- Electrodeposition is performed on the front surface side of the conductive layer 2 in the opening 3 a of the layer 3.
- Electrodeposition of metal ions electrolyzed from the counter electrode 17 continues while applying a DC voltage. Thereby, the metal ions electrolyzed from the counter electrode 17 are deposited as the first electroformed member 4. Electroforming is performed until the first electroformed member 4 is formed to a thickness that protrudes somewhat from the surface of the first photoresist layer 3 and rises.
- the first electroformed parts 4A and 4B are formed by flattening the front surface side of the first electroformed member 4 and the first photoresist layer 3. Specifically, for example, a part of the front surface side of the first electroformed member 4 is ground and flattened together with the first photoresist layer 3 so that the first electroformed parts 4A and 4B are obtained.
- Form. “Grinding” using a grinder (grinding stone) for grinding when flattening a part of the front surface side of the first electroformed member 4 and the front surface side of the first photoresist layer 3 And “polishing” that smoothes surface properties (surface roughness) rather than grinding using a grindstone.
- the planarization of the first electroformed member 4 and the first photoresist layer 3 is performed until the first electroformed member 4 and the first photoresist layer 3 have a predetermined thickness.
- the first photoresist layer 3 is removed from the conductive layer 2.
- the first photoresist layer 3 can be removed, for example, by immersing the silicon substrate 1 obtained by planarizing the first electroformed member 4 and the first photoresist layer 3 in a stripping solution.
- the stripping solution is a chemical solution that dissolves the first photoresist layer 3 and does not dissolve the conductive layer 2, the first electroformed member 4, and the silicon substrate 1, and various known chemical solutions can be used.
- a detachment for facilitating the detachment of the second electroformed component from the first electroformed component is performed.
- a film is formed.
- This separation film is realized by a film (resin film) formed using a resin, a film formed using an organic compound containing carbon or hydrogen, a film (nitride film) formed using nitrogen, or the like. be able to. These separation films can be formed by using a known technique.
- the separation film can be realized by an oxide film.
- the oxide film that realizes the separation film is placed in an oxidation furnace having a predetermined oxidation atmosphere after the silicon substrate 1 from which the first photoresist layer 3 has been removed is placed for a predetermined time. It can be formed by oxidation.
- the oxide film that realizes the separation film is formed by, for example, exposing the silicon substrate 1 from which the first photoresist layer 3 has been removed to the atmosphere for a certain period of time as shown in FIG. You may implement
- the second photoresist layer 5 is formed on the front surface side of the conductive layer 2, and the second photoresist layer 5 is patterned, whereby the second photoresist layer 5 is patterned. Openings (second through holes) 5 a are formed in the photoresist layer 5.
- the opening 5a is formed so as to penetrate the second photoresist layer 5 in the thickness direction.
- the opening 5a is formed so as to partially overlap the first electroformed parts 4A and 4B when the silicon substrate 1 is viewed along the thickness direction of the silicon substrate 1.
- the second electroforming mold 8 is realized by the second photoresist layer 5 in which the opening 5a is formed, the first electroformed parts 4A and 4B protruding into the opening 5a, and the conductive layer 2.
- the thickness of the second electroformed part 8 is larger than the thickness of the second electroformed part to be manufactured.
- a second photoresist layer 5 is formed by applying a photoresist. The second photoresist layer 5 is formed so as to cover the first electroformed parts 4A and 4B from the front surface side.
- a photomask that shields light other than the portion corresponding to the opening 5 a is set on the front surface side of the second photoresist layer 5. Then, with a photomask set, exposure is performed by irradiating ultraviolet rays, X-rays, or the like. Thereafter, the second photoresist layer 5 (silicon substrate 1) is developed using an alkaline solution or the like, and the exposed portion is removed by exposure. By such patterning, the opening 5a can be formed, and the second electroforming mold 8 can be created.
- the second electroforming mold 8 can be formed in the same manner as the first electroforming mold 7 described above, and is not limited to being formed using a positive type photoresist.
- the second electroforming mold 8 may be made using a negative photoresist.
- a photomask that shields light only from the portion corresponding to the opening 5a is used.
- the above-described release film may be formed on the surface where the first electroformed parts 4A and 4B are in contact with the second electroformed part.
- a release film instead of providing a release film on the entire outer surface of the first electroformed parts 4A and 4B exposed by removing the first photoresist layer 3 as shown in FIG. As shown in FIG. 8, in the state where the opening 5a is formed in the second photoresist layer 5, a release film may be formed on the surface of the first electroformed parts 4A and 4B exposed in the opening 5a. Good.
- electroforming is performed using the conductive layer 2 that realizes the second electroforming mold 8 as one electrode, and the conductive layer 2 in the opening 5 a in the second photoresist layer 5 is formed.
- a second electroformed member 6 is deposited on the front surface side and on the front surface side of the first electroformed parts 4A and 4B.
- the electrolytic solution 16 is filled in the above-described electroforming tank 15 shown in FIG. 5, and the electrolytic solution 16 is bathed in the first solution shown in FIG. 2 electroforming mold 8 is immersed.
- the second electroforming mold 8 is immersed in a bath of the electrolytic solution 16 with the second photoresist layer 5 side facing the counter electrode 17. Similar to the electroforming for depositing the first electroformed member 4, an electrolytic solution corresponding to the metal to be electroformed, that is, the material forming the second electroformed member 6 is used as the electrolytic solution 16.
- the second electroformed member 6 may be realized by the same metal as that of the first electroformed member 4, or may be realized by a metal different from that of the first electroformed member 4.
- the second electroforming member 6 is then immersed between the conductive layer 2 of the second electroforming mold 8 and the counter electrode 17 in a state immersed in a bath of the electrolytic solution 16.
- a DC voltage is applied by the power source 18 in the same manner as the electroforming for depositing one electroformed member 4.
- the counter electrode 17 becomes a positive electrode (anode)
- the conductive layer 2 becomes a negative electrode (cathode).
- Electrodeposition is performed on the front surface side of the conductive layer 2 in the opening 5 a of the layer 5.
- the electroforming for depositing the second electroformed member 6 is performed until the second electroformed member 6 is formed to a thickness that protrudes somewhat from the surface of the second photoresist layer 5.
- the second electroformed member 6 is deposited in a state where a separation film for facilitating the separation of the second electroformed component described above is interposed between the first electroformed components 4A and 4B. . That is, in the first electroformed parts 4A, 4B and the second electroformed member 6, a separation for facilitating the separation of the second electroformed part described above is provided between the surfaces facing each other. A membrane is interposed.
- the second electroformed parts 6 ⁇ / b> A and 6 ⁇ / b> B are formed by flattening the front surface side of the second electroformed member 6 and the second photoresist layer 5. Specifically, for example, a part of the front surface side of the second electroformed member 6 is ground and flattened together with the second photoresist layer 5 so that the second electroformed parts 6A and 6B are obtained. Form. The planarization is performed until the second electroformed member 6 and the second photoresist layer 5 have a predetermined thickness.
- Silicon substrate 1 and the conductive layer 2 are removed.
- Silicon substrate 1 and conductive layer 2 can be removed, for example, by grinding silicon substrate 1 and conductive layer 2 from the back side of silicon substrate 1.
- “grinding” using a grinder (grinding stone) and “polishing” for smoothing the surface properties (surface roughness) than grinding using a grindstone are performed.
- Including Thereby, the silicon substrate 1 and the conductive layer 2 are removed, and a structure constituted by the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B and the second photoresist layer 5 is formed. Things remain.
- the second photoresist layer 5 and the second electroformed parts 6A and 6B that have been flattened as shown in FIG. Then, the second photoresist layer 5 and the second electroformed parts 6A and 6B may be supported (reinforced) by attaching a reinforcing support plate or a protective seal.
- a reinforcing support plate or a protective seal attaching a reinforcing support plate or a protective seal.
- the second photoresist layer 5 is removed.
- the removal of the second photoresist layer 5 is performed, for example, by immersing the structure shown in FIG. 11 in a stripping solution and dissolving the second photoresist layer 5.
- the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B remain in close contact with each other.
- the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B are individually taken out.
- a separation film for facilitating the separation of the second electroformed parts. Since they are present, the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B are damaged only by applying a slight force when removing the second photoresist layer 5.
- the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B can be taken out individually.
- the stepped second electroformed parts 6A and 6B in which the portions overlapping the first electroformed parts 4A and 4B become stepped portions, and the flat plate-like first two electroformed parts 4A, 4B can be efficiently and accurately manufactured at a time by a series of manufacturing processes.
- the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B have surfaces that move relatively in close contact with each other as shown in FIG. A relatively moving surface can be formed with high accuracy.
- the materials of the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B it is possible to select an optimum metal according to each application.
- the silicon substrate 1 In the production of the electroformed part in the first embodiment, an example in which the silicon substrate 1 is used as the substrate has been described.
- the silicon substrate 1 can be etched by D-RIE (deep RIE) technology. For this reason, when manufacturing the electroformed part in Embodiment 1, the shape of the electroforming mold (the first electroforming mold 7 and the second electroforming mold 8) is easily processed by using the silicon substrate 1 as the substrate. be able to.
- D-RIE deep RIE
- the degree of freedom of the shape of the electroforming mold (first electroforming mold 7 and second electroforming mold 8) is increased, and the electroforming mold having the complicated shape (the first electroforming mold 7 and the second electroforming mold 8) can be obtained.
- the lower part of the first electroformed parts 4A and 4B (the first electroformed part 4A).
- the lower part of the first electroformed parts 4A, 4B can be formed in a complicated shape by performing etching according to the shape of the conductive layer 2 side in 4B.
- the first electroformed parts 4A and 4B shown in FIGS. 6 to 13 described above may be independent parts or integrated parts.
- the second electroformed parts 6A and 6B shown in FIGS. 10 to 13 described above may be independent parts or integral parts.
- the first electroformed parts 4A and 4B may be independent parts, and the second electroformed parts 6A and 6B may be integrated parts.
- the first electroformed parts 4A and 4B may be integrated parts, and the second electroformed parts 6A and 6B may be independent parts.
- FIG. 14 and 15 are explanatory views showing a part of the procedure for manufacturing the electroformed part by the method for manufacturing the electroformed part of the first embodiment according to the present invention.
- FIG. 14 shows a process corresponding to the process shown in FIG. 12 described above.
- FIG. 15 shows a process corresponding to the process shown in FIG. 13 described above.
- the first electroformed parts 4A and 4B are integral parts and the second electroformed parts 6A and 6B are integral parts
- the first electroformed parts 4 ⁇ / b> A and 4 ⁇ / b> B constitute a single first electroformed part 40.
- the second electroformed parts 6 ⁇ / b> A and 6 ⁇ / b> B constitute a single second electroformed part 60.
- the second electroformed component 60 can be realized by a member having a substantially cylindrical shape, for example. As shown in FIGS. 14 and 15, the second electroformed component 60 includes a cylindrical portion 60a. In the cylindrical portion 60a, a flange portion 60b is provided at an end portion on the front surface side.
- a central hole 60c penetrating the cylindrical portion 60a in the axial direction is formed on the inner periphery of the cylindrical portion 60a.
- the inner diameter of the center hole 60c is the same size in the cylindrical portion 60a and the flange portion 60b. That is, the inner diameter of the flange portion 60b is equal to the inner diameter of the cylindrical portion 60a, and the outer diameter of the flange portion 60b is larger than the outer diameter of the cylindrical portion 60a.
- the second electroformed component 60 can be realized by a stepped component such as a bearing provided with a step at the boundary between the cylindrical portion 60a and the flange portion 60b.
- the first electroformed component 40 can be realized by an annular and flat member having a circular opening 40a at the center. More specifically, the first electroformed component 40 can be realized by, for example, a ring or a gear. In the first electroformed component 40, the inner diameter of the opening 40a is the same (or slightly larger) than the outer diameter of the cylindrical portion 60a.
- the inner peripheral surface of the first electroformed component 40 and the outer peripheral surface of the second electroformed component 60 are mutually connected by fitting the cylindrical portion 60a of the second electroformed component 60 into the opening 40a.
- the first electroformed component 40 and the second electroformed component 60 can be relatively moved in a state of being in close contact (or contact).
- the first electroformed part 40 and the second electroformed part 60 may be a large gear and a small gear (cana) that are fitted to each other at the shaft portion.
- the 1st electroformed component 40 and the 2nd electroformed component 60 may be components fitted so that relative rotation is possible.
- the first electroformed component 40 and the second electroformed component 60 may be components having surfaces that move relatively in close contact with or in contact with each other, and are limited to annular, cylindrical, or columnar components. is not.
- the parts that are brought into close contact with each other are fitted.
- the two types of electroformed parts can be manufactured with high accuracy in a series of manufacturing steps. That is, since the second electroformed component 60 is formed using the opening 40a in the first electroformed component 40 as a mold, the formed first electroformed component 40 and the second electroformed component 60 are combined. It can be fitted with high accuracy without causing displacement or play.
- At least one of the components to be fitted to each other is like a boundary portion between the cylindrical portion 60a and the flange portion 60b in the second electroformed component 60.
- these two types of electroformed components can be manufactured with high accuracy in a series of manufacturing processes.
- the parts are fitted with high accuracy without causing a gap or backlash between the parts in the fitted state. Can be combined.
- chamfering can be realized, for example, by performing electrolytic polishing on the first electroformed parts 4A and 4B.
- electrolytic polishing first, as shown in FIG. 6 described above, the silicon substrate 1 (see FIG. 6 described above) in which the first electroformed member 4 and the first photoresist layer 3 are planarized is illustrated. 5 is immersed in the electrolytic solution 16 filled in the electroforming tank 15 shown in FIG. At this time, the silicon substrate 1 is immersed in a bath of the electrolytic solution 16 with the first electroformed parts 4A and 4B side (the front surface side of the silicon substrate 1) facing the counter electrode 17.
- a direct current voltage is applied by the power source 18 between the conductive layer 2 of the silicon substrate 1 immersed in the bath of the electrolytic solution 16 and the counter electrode 17.
- the DC voltage is applied so that the counter electrode 17 becomes a negative electrode (cathode) and the conductive layer 2 and the first electroformed parts 4A and 4B become positive electrodes (anode). That is, the DC voltage can be applied by applying a voltage having a polarity opposite to that in the case of performing the above-described electroforming.
- the DC voltage is applied in a state where the conductive layer 2 and the first electroformed parts 4A and 4B are the anode and the counter electrode 17 is the cathode.
- a current flows in the electrolyte solution 16 in the direction opposite to that in the electroforming described above, and the first electroformed parts 4A and 4B are electrolyzed.
- Metal ions generated by electrolysis of the first electroformed parts 4A and 4B migrate in the direction opposite to the direction indicated by the arrow F in FIG.
- Electrolytic polishing (application of a DC voltage) is predetermined according to the shape of the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B, the size of the first electroformed parts 4A and 4B, and the like. Let's do time.
- the first electroformed parts 4A and 4B after the electropolishing are performed only at the corners for a predetermined time during the electropolishing.
- Chamfering is performed for a short time so that the shape is substantially the same as the shape of the first electroformed parts 4A and 4B before electropolishing.
- the chamfered portion 4a is not limited to one formed by electrolytic polishing.
- the chamfered portion 4a may be formed by wet etching instead of electrolytic polishing.
- the wet etching is performed by using the silicon substrate 1 on which the first electroformed member 4 and the first photoresist layer 3 are flattened, and the first electroformed parts 4A and 4B (first electroformed member 4). This is performed by immersing in an etching solution to be dissolved for a predetermined time.
- the corner portions of the first electroformed parts 4A and 4B are preferentially dissolved as in the case of electrolytic polishing. Thereby, the corners of the first electroformed parts 4A and 4B are chamfered, and the chamfered parts 4a are formed in the first electroformed parts 4A and 4B.
- the wet etching is performed for a predetermined time according to the shape of the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B, the size of the first electroformed parts 4A and 4B, and the like.
- the predetermined time for performing wet etching is the first electroformed part 4A after the wet etching is performed.
- 4B is performed for a short time so that only the corners are chamfered and the shape is substantially the same as the shape of the first electroformed parts 4A, 4B before wet etching is performed.
- a separation film is formed on the surface of the first electroformed parts 4A and 4B exposed to the outside.
- the second photoresist layer 5 is formed on the front surface side of the conductive layer 2, and the second photoresist layer 5 is patterned, whereby the second photo layer 5 is patterned.
- Openings (second through holes) 5 a are formed in the resist layer 5.
- the opening 5a is formed so as to penetrate the second photoresist layer 5 in the thickness direction as in the first embodiment.
- the opening 5a partially overlaps the first electroformed parts 4A and 4B when the silicon substrate 1 is viewed along the thickness direction of the silicon substrate 1. To be formed.
- the above-described embodiment is performed until the second electroformed member 6 is formed to a thickness that protrudes somewhat from the surface of the second photoresist layer 5.
- electroforming is performed using the conductive layer 2 as one electrode.
- the second electroformed member 6 has an R shape that is curved so as to cover the chamfered portion 4a at a portion facing the chamfered portion 4a in the first electroformed parts 4A and 4B. Since the chamfered portions 4a are formed at the corners of the first electroformed parts 4A and 4B, the corners on the inner side of the second electroformed member 6 formed by electroforming over the chamfered portions are chamfered. The portion 4a is transferred to a corresponding concave curved surface (or inclined surface).
- the release film described above is, for example, a release film on the entire outer surfaces of the first electroformed parts 4A and 4B exposed by removing the first photoresist layer 3 as shown in FIG. In the state where the opening 5a is formed in the second photoresist layer 5, as shown in FIG. 17, the surface of the first electroformed parts 4A and 4B exposed in the opening 5a is detached.
- a special film may be formed.
- chamfered portions 4a are formed at the corners of the first electroformed parts 4A and 4B.
- the corner 6b facing the chamfered portion 4a in the second electroformed components 6A and 6B is also a concave curved surface corresponding to the chamfered portion 4a of the first electroformed components 4A and 4B. (Or sloped).
- the stress in the chamfered portion 4a of the first electroformed parts 4A and 4B and the corner portion 6b of the second electroformed parts 6A and 6B can be dispersed. And thereby, the intensity
- the second electroformed components 6A and 6B positioned at least in the opening 5a Chamfer the corners of the overlapping parts. Thereby, the edge in the part which 1st electroformed components 4A and 4B (1st electroformed component 40) and 2nd electroformed components 6A and 6B (2nd electroformed component 60) contact mutually is eliminated. Can do.
- the parts to be fitted to each other is a stepped part having a stepped portion such as a boundary portion between the cylindrical part 60a and the flange part 60b in the second electroformed part 60.
- the stress due to contact can be prevented from being concentrated locally, and the stress can be dispersed.
- strength of 1st electroformed components 4A and 4B and 2nd electroformed components 6A and 6B is raised, and durability Can be improved.
- the corners of the electroformed part can be chamfered (R-attached).
- the aesthetics of an electroformed part can be improved and the aesthetics can be improved.
- an electroformed part produced by the method for producing an electroformed part according to Embodiment 2 as a watch part that allows the movement to be visually recognized, the aesthetics of the watch are improved and the aesthetic appearance is improved. Can do.
- a stepped cylindrical or columnar part having a stepped portion overlapping therewith can be manufactured in a series of manufacturing steps.
- the corner 4a of the closely contacting portion is chamfered. Since there is no edge, stress due to contact is not concentrated locally, the strength of each electroformed part can be increased, and durability can be improved.
- FIG. 23 to FIG. 33 are explanatory views showing a procedure for manufacturing an electroformed part by the method for manufacturing an electroformed part according to the third embodiment of the present invention.
- a substrate 10 is prepared.
- the substrate 10 can be formed using, for example, a conductive material (conductive material) having good conductivity.
- the substrate 10 can be formed using a conductive material such as a metal (including an alloy) such as copper, brass, and stainless steel.
- the substrate 10 formed using a conductive material by using the substrate 10 formed using a conductive material, the surface of the substrate (silicon substrate) 1 in the first embodiment or the second embodiment described above is used.
- the step of forming the conductive layer 2 becomes unnecessary.
- a metal substrate formed using a conductive material is used as the substrate 10.
- the description will be made by attaching the reference numeral 10 to the metal substrate.
- the same processes as those shown in FIGS. 3, 4 and 6 to 13 in the first embodiment are performed. That is, first, the first photoresist layer 3 is formed on the front surface side of the metal substrate 10, and the first photoresist layer 3 is patterned, so that the first photo layer is formed as shown in FIG. Openings (first through holes) 3 a are formed in the resist layer 3.
- the first electroforming mold 7 ′ is realized by the first photoresist layer 3 formed on the front surface side of the metal substrate 10 and having the opening 3 a and the metal substrate 10.
- electroforming is performed in the same manner as in the first embodiment using the metal substrate 10 realizing the first electroforming mold 7 'as one electrode, and the surface of the metal substrate 10 is supported.
- the first electroformed member 4 is deposited on the surface side and in the opening 3 a in the first photoresist layer 3.
- the first electroformed member 4 and the first photoresist layer 3 are flattened on the front surface side, thereby making the first.
- the electroformed parts 4A and 4B are formed.
- the first photoresist layer 3 is removed from the metal substrate 10.
- the first photoresist layer 3 is obtained by immersing a metal substrate 10 obtained by planarizing the first electroformed member 4 and the first photoresist layer 3 in a stripping solution. Can be removed. Then, a separation film is formed on the surfaces of the first electroformed parts 4A and 4B that are exposed to the outside.
- the second photoresist layer 5 is formed on the front surface side of the metal substrate 10, and the second photoresist layer 5 is patterned, whereby the second photo layer 5 is patterned as shown in FIG. Openings (second through holes) 5 a are formed in the resist layer 5.
- a second electroforming mold 8 ′ is realized by the second photoresist layer 5 formed on the front surface side of the metal substrate 10 and having the opening 5 a and the metal substrate 10.
- electroforming is performed in the same manner as in the first embodiment using the metal substrate 10 realizing the second electroforming mold 8 ′ as one electrode, and the second photoresist layer 5 is formed.
- the second electroformed member 6 is deposited on the front surface side of the conductive layer 2 in the opening 5a and on the front surface side of the first electroformed parts 4A and 4B.
- a part of the front surface side of the second electroformed member 6 is ground and flattened together with the second photoresist layer 5, so that the second electroformed component 6A, 6B is formed.
- the metal substrate 10 is, for example, a surface of the metal substrate 10 opposite to the surface (front surface) on which the first electroformed components 4A and 4B and the second electroformed components 6A and 6B are formed (front surface).
- the metal substrate 10 can be removed by grinding from the back surface side.
- the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B are individually taken out. Since a separation film is formed between the first electroformed parts 4A and 4B and the second electroformed parts 6A and 6B, the first electroformed parts 4A and 4B and the second electroformed parts 4A and 4B are formed. The electroformed parts 6A and 6B can be detached and taken out without being damaged.
- an electroformed component of the third embodiment like the first electroformed component 40 and the second electroformed component 60, as in the first embodiment described above, Two types of electroformed parts having portions that are brought into close contact with each other can be manufactured with high accuracy in a series of manufacturing steps. That is, since the second electroformed component 60 is formed using the opening 40a in the first electroformed component 40 as a mold, the formed first electroformed component 40 and the second electroformed component 60 are combined. It can be fitted with high accuracy without causing displacement or play.
- At least one of the components fitted to each other is the cylindrical portion 60a in the second electroformed component 60.
- these two types of electroformed parts can be manufactured with high accuracy in a series of manufacturing processes.
- the parts can be accurately fitted without causing a gap or backlash between the parts in the fitted state. Can be made.
- the conductive layer 2 is provided on the front surface side of the substrate (silicon substrate) 1 as compared with the first and second embodiments described above. Since the forming process is unnecessary, the number of processes for manufacturing the electroformed part can be reduced, and the time required for manufacturing the electroformed part can be shortened.
- the metal substrate 10 has higher durability than the substrate 1 made of an insulating material or a semiconductive material such as the silicon substrate 1, it is possible to improve the handleability in manufacturing the electroformed part and improve the manufacturing efficiency. Can do. That is, by using the metal substrate 10, the first electroformed parts 4A and 4B (first electroformed part 40) and the second electroformed parts 6A and 6B (second second) are not damaged during the production. Since the electroformed component 60) can be reliably supported, it is possible to improve the production efficiency of the electroformed component and reduce the burden on the worker involved in the production.
- the first electroformed parts 4A and 4B are exposed in the process shown in FIG. 27 as in the second embodiment.
- the second electroformed parts 4A, 4B of the first electroformed parts 4A, 4B are located at least in the opening 5a. You may chamfer the corner
- a speed governor also called a balance
- the balance wheel reciprocally rotates at a constant cycle by the force of the hairspring.
- the balance of the balance is made by swinging the ankle by reciprocating rotation of the balance wheel and feeding the escape wheel one tooth at a time (that is, rotating at a constant speed).
- Uncles and escape cars are also called escapements.
- the reciprocating motion of the balance wheel changes the advance or delay of the time reported by the mechanical watch, the so-called rate.
- the balance wheel has a prescribed weight and moment of inertia in order to perform a predetermined reciprocating motion.
- adjustment is often performed by using an adjustment mechanism called a slow and quick hand attached to the balance spring or by providing a weight around the balance wheel. .
- FIG. 34 and FIG. 35 are explanatory views showing an example of a balance wheel and a weight attached to the balance wheel in the mechanical timepiece.
- FIG. 34 shows a plan view of the weight and the balance wheel on which the weight is mounted.
- FIG. 35 shows an exploded perspective view in which the mounting portion of the balance wheel and the weight is enlarged.
- the balance wheel 20 is provided with four small disk-shaped weights 25 at equal angular intervals.
- Each weight mounting portion on the upper surface side of the balance wheel 20 is formed with a notch 20a slightly longer than the outer diameter of the weight 25 and having a depth equivalent to the thickness of the weight 25, as shown in an enlarged view in FIG. ing.
- a column (support shaft) 20b is integrally formed at the center of the lower step surface of each notch 20a.
- Each weight 25 is provided with a center hole 25b and a notch 25a on the outer peripheral surface.
- Each weight 25 is attached to each notch 20a of the balance wheel 20 with the center hole 25b fitted to the support 20b.
- Such a balance wheel 20 and four weights 25 can be manufactured at a time in a series of manufacturing steps by using the same manufacturing method as in the first and third embodiments.
- first when the balance wheel 20 and the four weights 25 are viewed from the direction shown in FIG. A silicon substrate 1 having a size that can be accommodated is prepared.
- first when the balance wheel 20 and the four weights 25 are viewed from the direction shown in FIG. A metal substrate 10 having a size that can be accommodated is prepared.
- 36 to 38 are explanatory views showing a manufacturing example of a balance wheel and a weight attached to the balance wheel in a mechanical timepiece according to the method for manufacturing an electroformed part according to the present invention.
- 36 to 38 show a part of the manufacturing procedure of the balance wheel 20 and the weight 25 by the same manufacturing method as in the first embodiment.
- 36 corresponds to the step of FIG. 10 in the manufacturing procedure of the first embodiment.
- FIG. 37 corresponds to the step of FIG. 11 in the manufacturing procedure of the first embodiment.
- FIG. 38 corresponds to the step of FIG. 13 in the manufacturing procedure of the first embodiment.
- 36 to 38 show a portion corresponding to a cross section of the balance wheel 20 and the weight 25 cut along the line XX in FIG. 36 to 38, the same parts as those in the first to third embodiments are denoted by the same reference numerals, and the description thereof is omitted.
- the small disc-shaped weight 25 having the center hole 25b is used as the first electroformed part, and the balance wheel 20 is used as the second electroformed part.
- the conductive layer 2 is formed on the front surface side of the silicon substrate 1 in the same manner as the steps shown in FIGS. 1 to 4, 6 and 7 described above, and the front surface of the conductive layer 2 is formed.
- a weight 25 is formed on the side.
- a separation film that facilitates separation of the balance wheel 20 is formed on the exposed surface of the weight 25.
- a second photoresist layer 5 is formed on the front surface side of the conductive layer 2 and a part of the front surface side of the weight 25 in the same manner as in the step shown in FIG.
- an opening 5 a corresponding to the planar shape of the balance wheel 20, part of which overlaps with the weight 25, is formed.
- the second electroforming is performed on the front surface side of the conductive layer 2 and the front surface side of the weight 25 in the opening 5a in the second photoresist layer 5 in the same manner as the process shown in FIG.
- the member 6 is deposited.
- the balance wheel 20 is formed by flattening the front surface side of the second electroformed member 6 and the second photoresist layer 5 by grinding.
- the positional relationship between the balance wheel 20 and the weight 25 in FIG. 36 is opposite to the positional relationship between the balance wheel 20 and the weight 25 in FIG. 36 shows a state in which the support 20b of the balance wheel 20 enters the center hole 25b of the weight 25 and the notch 20a overlaps the weight 25.
- the silicon substrate 1 and the conductive layer 2 are removed from the weight 25 and the balance wheel 20 by grinding the silicon substrate 1 and the conductive layer 2 from the back side of the silicon substrate 1. After that, when the photoresist layer 5 is removed, the balance wheel 20 and the weight 25 are easily detached without being damaged as shown in FIG. It can be taken out.
- the weight 25 that is a flat plate-like component and the balance wheel 20 that is a stepped component having a notch 20a are once formed in a series of steps.
- FIG. 39 is a plan view showing a fitting state of the gear and the bearing.
- the gear 30 includes an annular portion 30b having an annular shape, and a plurality of teeth 30a projecting radially from the annular portion 30b on the outer peripheral portion of the annular portion 30b.
- the plurality of teeth 30a protrude radially at a constant pitch on the outer periphery of the annular portion 30b.
- a circular opening (see reference numeral 30c in FIGS. 40 to 42) into which the bearing 35 is fitted is provided inside the annular portion 30b.
- the bearing 35 is fitted into the gear 30 in a relatively rotatable state.
- the bearing 35 is formed with four retaining holes 35a at equal angular intervals from the center.
- the bearing 35 is fixed to a support plate or the like by screws or pins inserted into the respective retaining holes 35a.
- the gear 30 and the bearing 35 can be manufactured at a time in a series of manufacturing steps by using the same manufacturing method as that of the second embodiment.
- the gear 30 and the bearing 35 are manufactured using the same manufacturing method as in the second embodiment, first, the silicon having a size that can be accommodated when the gear 30 and the bearing 35 are viewed from the direction indicated by the arrows in FIG. A substrate 1 is prepared.
- the gear 30 and the bearing 35 can be manufactured at a time in a series of manufacturing steps even when the manufacturing method similar to that of the first embodiment and the third embodiment described above is used.
- 40 to 42 are explanatory views showing examples of manufacturing the gear 30 and the bearing 35 in the mechanical timepiece by the method for manufacturing an electroformed part according to the present invention.
- 40 to 42 show a part of the manufacturing procedure of the gear 30 and the bearing 35 by the same manufacturing method as in the second embodiment.
- FIG. 40 corresponds to the step of FIG. 19 in the manufacturing procedure of the second embodiment.
- 41 corresponds to the step of FIG. 20 in the manufacturing procedure of the second embodiment.
- 42 corresponds to the step of FIG. 22 in the manufacturing procedure of the second embodiment.
- 40 to 42 show a portion corresponding to a cross section of the gear 30 and the bearing 35 cut along the line YY in FIG.
- the same parts as those in the first to third embodiments are denoted by the same reference numerals, and the description thereof is omitted.
- the gear 30 is a first electroformed part and the bearing 35 is a second electroformed part.
- a conductive layer 2 is formed on the front surface side of the silicon substrate 1, and the conductive layer 2 is formed on the front surface side.
- a gear 30 is formed.
- chamfering (R-attachment) of at least a portion of the gear 30 that contacts the bearing 35 is performed to form a chamfered portion 30 d.
- the chamfered portion 30d is formed at the upper end edge (front surface side edge) of the circular opening 30c of the gear 30 and the upper end edge (front surface side edge) of the tip of the tooth 30a.
- a separation film that facilitates separation of the bearing 35 is formed on the exposed surface of the gear 30.
- a second photoresist layer 5 is formed on the front surface side of the conductive layer 2 and a part of the front surface side of the gear 30, and the second By patterning the photoresist layer 5, an opening 5 a corresponding to the planar shape of the bearing 35 partially overlapping with the gear 30 is formed. Then, the second electroforming is performed on the front surface side of the conductive layer 2 and the front surface side of the gear 30 in the opening 5a in the second photoresist layer 5 in the same manner as the process shown in FIG. The member 6 is deposited.
- a bearing 35 is formed by flattening the front surface side of the second electroformed member 6 and the second photoresist layer 5.
- the bearing 35 has a small-diameter portion 35 b fitted into the circular opening 30 c of the gear 30, and the large-diameter portion 35 c overlaps the gear 30.
- the chamfered shape (R shape) of the chamfered portion 30d is transferred.
- the corner portion 35d is formed in a similar concave curved surface or slope shape.
- the silicon substrate 1 and the conductive layer 2 are removed from the gear 30 and the bearing 35 by grinding the silicon substrate 1 and the conductive layer 2 from the back side of the silicon substrate 1. Thereafter, when the photoresist layer 5 is removed, the gear 30 and the bearing 35 are easily detached without being damaged and taken out individually by a separation film that facilitates the separation of the bearing 35, as shown in FIG. Can do.
- a series of the gear 30 that is a flat plate component and the bearing 35 that is a stepped component including the small diameter portion 35b and the large diameter portion 35c are provided. It can be accurately manufactured at a time in the process. Furthermore, according to the method for manufacturing an electroformed component according to the present invention, by providing the gear 30 with the chamfered portion 30d, a surface on which the gear 30 and the bearing 35 come into contact with each other and relatively rotate can be accurately formed. it can.
- the stress caused by the contact between the gear 30 and the bearing 35 is not concentrated locally, Since the stress can be dispersed, the strength of the gear 30 and the bearing 35 can be increased and the durability can be improved.
- the metal substrate 10 described in the third embodiment may be used instead of the silicon substrate 1 and the conductive layer 2 as described above. Also by this, similarly to the gear 30 and the bearing 35 described above, the gear 30 and the bearing 35 can be accurately manufactured at a time through a series of steps, and durability can be improved.
- FIG. 43 is a plan view showing an escape wheel & pinion.
- the escape wheel & pinion 50 has an annular shape.
- a plurality of tooth portions 51 are provided on the outer periphery of the escape wheel & pinion 50 at a constant pitch.
- Each tooth portion 51 is provided to be inclined at a certain angle with respect to the ring-shaped radial direction (radial direction) formed by the escape wheel & pinion 50.
- the escape wheel 50 is intermittently rotated at a constant speed in a mechanical timepiece by being fed one tooth at a time by an ankle that is swung by the reciprocating rotation of the balance wheel.
- the ankle is provided with an ankle claw stone that engages with the tooth portion 51 of the escape wheel & pinion 50 in order to rotate the escape wheel & pinion 50.
- the escape wheel & pinion 50 is provided at the end of the train wheel from the barrel wheel rotated by the mainspring.
- FIG. 44 is a plan view showing a part of the portion surrounded by an ellipse A indicated by a broken line in FIG. 43 in an enlarged manner.
- FIG. 45 is a plan view showing a part of the portion viewed from the direction of arrow B in FIG. 44 in an enlarged manner.
- the distal end portion of the tooth portion 51 is formed in a step shape by reducing the thickness on the distal end side.
- a thin-walled portion 51 a having a small thickness is provided at the most distal end of the tooth portion 51.
- One side surface of the thin-walled portion 51a has a leaving corner 51c with the tip slightly protruding sideways (outward), and the tip (corner portion) of the other side surface has a locking corner 51d.
- the leaving corner 51c of the toothed portion 51 of the escape wheel & pinion 50 hits the leaving corner of the hook that is held at one end of the ankle, and the locking corner 51d of the tooth 51 is held at the other end of the ankle. Hit the rocking corner.
- the corner portion 51e of the step portion formed by providing the thin portion 51a and having an L shape by switching the thickness is formed in a concave curved surface (R shape).
- the stress in the corner part 51e is more than in the case where the corner of the stepped part is not a concave curved surface (R shape) but a right angle (90 °). It can be dispersed to increase the strength.
- 46 to 50 are explanatory views showing an example of manufacturing an escape wheel 50 and a small plate-like component in a mechanical timepiece by the method for manufacturing an electroformed component according to the present invention. 46 to 50 show a part of the manufacturing procedure of the escape wheel 50 and the flat plate-like small part 45 manufactured in a series of manufacturing steps for manufacturing the escape wheel 50.
- FIG. 46A corresponds to the step of FIG. 17 in the manufacturing procedure of the second embodiment.
- 47 corresponds to the step of FIG. 18 in the manufacturing procedure of the second embodiment.
- FIG. 48A corresponds to the step of FIG. 19 in the manufacturing procedure of the second embodiment.
- FIG. 49 corresponds to the step of FIG. 20 in the manufacturing procedure of the second embodiment.
- FIG. 50A corresponds to the step of FIG. 22 in the manufacturing procedure of the second embodiment.
- FIGS. 46 to 50 the same parts as those in the first to third embodiments are denoted by the same reference numerals, and description thereof is omitted.
- the flat small component 45 is the first electroformed component
- the escape wheel 50 is the second electroformed component. Electroformed parts. Specifically, when manufacturing the escape wheel & pinion 50 and the flat small component 45 by the method for manufacturing an electroformed component according to the present invention, first, the same steps as those shown in FIGS. 1 to 4 and 6 described above are performed. Then, by flattening the front surface side of the first electroformed member 4 and the first photoresist layer 3, a flat small component 45 is formed.
- the flat small part 45 functions as a nesting.
- chamfering (R attachment) of the corners of the flat small component 45 is performed. This chamfering is performed on at least the corner of the flat small component 45 located in the opening 5a.
- a film for detachment that facilitates detachment of the escape wheel & pinion 50 is formed on the surface of the flat small component 45 that is exposed to the outside.
- the second photoresist layer 5 is formed on the front surface side of the conductive layer 2, and the second photoresist layer 5 is patterned, whereby the second photoresist layer 5 is patterned. Openings (second through holes) 5 a are formed in the photoresist layer 5. Then, as shown in FIG. 47, until the second electroformed part 55 is deposited to a thickness that protrudes somewhat from the surface of the second photoresist layer 5 and rises, Similarly, electroforming using the conductive layer 2 as one electrode is performed.
- the escape wheel 50 is formed by flattening the front surface side of the second electroformed member 55 and the second photoresist layer 5 by grinding.
- the thin portion 51 a of the tooth portion 51 in the escape wheel & pinion 50 is in close contact with and overlaps with the small component 45.
- the corner portion 51e forming the step portion in the tooth portion 51 is in contact with the chamfered portion 45a of the flat small component 45, and the chamfered shape (R shape) of the chamfered portion 45a is transferred to the corner portion 51e. Formed in a concave curved surface.
- the silicon substrate 1 and the conductive layer 2 are ground from the escape wheel 50 and the small plate-like component 45 by grinding the silicon substrate 1 and the conductive layer 2 from the back side of the silicon substrate 1. Remove. Thereafter, when the photoresist layer 5 is removed, the escape wheel 50 and the small plate-shaped component 45 are easily detached without being damaged by the release film that facilitates the removal of the escape wheel 50 as shown in FIG. Can be taken out individually.
- the escape wheel 50 that is a stepped component and the small component 45 that is a flat plate component are accurately manufactured at a time in a series of steps. be able to. Even in the case where the metal substrate 10 described in the third embodiment is used instead of the silicon substrate 1 and the conductive layer 2, the escape wheel 50 and the plate-like small component 45 are formed in a series of steps as described above. Can be manufactured accurately at a time.
- the chamfered portion (R shape) of the chamfered portion 45a provided on the flat plate-shaped small component 45 is transferred to the corner portion 51e, thereby being a stepped component.
- the car 50 is manufactured.
- the stress caused by the contact of the ankle claw stone with the escape wheel 50 can be prevented from being concentrated locally and the stress can be dispersed, so that the strength of the thin portion 51a is increased and the durability is improved. Can do. And thereby, durability of the escape wheel & pinion 50 can be improved.
- the second electroformed member 6 deposited on the flat small component 45 is ground together with the second photoresist layer 5 to thereby form the tooth portion 51.
- the thin part 51a can be formed in the front-end
- the flat plate-shaped small part 45 manufactured in a series of manufacturing steps for manufacturing the escape wheel & pinion 50 can be changed to an arbitrary planar shape.
- the flat small component 45 is, for example, a scale piece that is attached or fitted to the dial of a watch, the weight 25 that is attached to the balance wheel 20 described above, or the like.
- Various parts can be used.
- FIG. 51 and 52 are explanatory views showing a part of the rotor.
- FIG. 52 shows a cross section of a part of the rotor shown in FIG. 51 cut along a plane passing through the line AA.
- 53 and 54 are explanatory views showing a rotor shaft included in the rotor.
- FIG. 54 shows a cross section of the rotor shaft shown in FIG. 53 cut along a plane passing through the line BB.
- the rotor shaft 52b provided in the rotor is supported at one end side by a rotor bearing 52a and is rotatably provided around the axis.
- the rotor bearing 52a is fixed to a ground plate 53 that holds the coil.
- the rotor shaft 52b is provided to be rotatable relative to the rotor bearing 52a.
- a rotor kana 54 is provided on the other end side of the rotor shaft 52b.
- the rotor shaft 52 b includes a rotor magnet 58 provided between the main plate 53 and the rotor kana 54.
- the rotor magnet 58 is held by a rotor magnet holding member 57.
- the rotor magnet holding member 57 is fitted into the rotor shaft 52b in a state where the rotor magnet 58 is held.
- a chamfered portion 56 is formed at the end on the rotor shaft 52b side.
- the chamfered portion 56 has a chamfered shape (R shape) in which the axis side of the rotor shaft 52b protrudes toward the rotor shaft 52b rather than the outer peripheral side.
- a concave portion (reference numeral is omitted) corresponding to the chamfered shape (R shape) of the chamfered portion 56 is provided at the end on the rotor bearing 52a side.
- the rotor bearing 52a and the rotor shaft 52b are in contact with each other by bringing the chamfered portion 56 into contact with the recessed portion.
- Such a rotor bearing 52a and a rotor shaft 52b can be manufactured at a time in a series of manufacturing steps by using, for example, the same manufacturing method as that of the second embodiment described above.
- the rotor bearing 52a and the rotor shaft 52b using the same manufacturing method as in the second embodiment, the rotor bearing 52a is the first electroformed component and the rotor shaft 52b is the second electroformed component.
- the same processes as those shown in FIGS. 1 to 4, 6, and 7 described above are performed.
- the conductive layer 2 is formed on the front surface side of the silicon substrate 1, and the rotor bearing 52 a is formed on the front surface side of the conductive layer 2.
- at least a portion (tip portion) of the rotor bearing 52a that contacts the rotor shaft 52b is chamfered (R-attached) to form a chamfered portion.
- a separation film that facilitates separation of the rotor shaft 52b is formed on the exposed surface of the rotor bearing 52a.
- the second photoresist layer 5 is formed on the front surface side of the conductive layer 2 and a part of the front surface side of the rotor bearing 52a.
- an opening 5a corresponding to the planar shape of the rotor shaft 52b overlapping the rotor bearing 52a is formed.
- the second electroforming is performed on the front surface side of the conductive layer 2 and the front surface side of the gear 30 in the opening 5a in the second photoresist layer 5 in the same manner as the process shown in FIG.
- the member 6 is deposited.
- the opening 5a (second electroforming mold 8) for forming the rotor shaft 52b can be formed of a photoresist.
- the second photoresist layer 5 is formed a plurality of times, and the patterning shape of each second photoresist layer 5 is adjusted to form the rotor shaft 52b having a stepped portion such as the rotor kana 54 with the photoresist. be able to.
- At least a portion (tip portion) that comes into contact with the rotor shaft 52b is a chamfered portion by chamfering (R-attachment), and therefore, at the end of the rotor shaft 52b on the rotor bearing 52a side, The chamfered portion is transferred to form a concave curved surface (or a beveled shape).
- the second electroformed member 6 is molded by grinding a predetermined amount of the front surface side of the second electroformed member 6 and the second photoresist layer 5 to form the rotor shaft 52b. Thereafter, the second photoresist layer 5 is removed to form the rotor bearing 52a and the rotor shaft 52b.
- the rotor bearing 52a fixed to the base plate and the rotor shaft 52b rotatable relative to the rotor bearing 52a are subjected to a series of steps. Can be manufactured accurately at a time.
- stress is locally concentrated at the contact portion between the rotor bearing 52a and the rotor shaft 52b by providing a chamfered portion at the tip of the rotor bearing 52a.
- friction between the rotor bearing 52a and the rotor shaft 52b can be reduced. Thereby, the power consumption of the motor can be reduced.
- the entire rotor shaft and the rotor bearing may be manufactured by the method for manufacturing the electroformed component according to the present invention. Only the joint (contact portion: see reference numeral 540 in FIG. 54) may be manufactured by the method for manufacturing an electroformed component according to the present invention.
- the portion of the rotor bearing 52a that contacts the rotor shaft 52b and its peripheral portion” and “the portion of the rotor shaft 52b that contacts the rotor bearing 52a and its peripheral portion” are only used by the LIGA method.
- the rotor bearing 52a and the rotor shaft 52b are formed by joining a separately manufactured portion (shaft) to the portion manufactured using the above.
- a part having a long axis shape such as the rotor bearing 52a and the rotor shaft 52b is manufactured using the LIGA method
- a portion in contact with the other of the rotor bearing 52a and the rotor shaft 52b and the vicinity thereof Only the portion may be manufactured using the LIGA method.
- the first electroformed member 4 with respect to the area of the conductive layer 2 serving as an electrode in electroforming.
- the dimension in the thickness direction in which the second electroformed member 6 is deposited is large, and it takes a long time to deposit the first electroformed member 4 and the second electroformed member 6 by the desired thickness.
- the parts to be manufactured are limited to the parts that are in contact with each other, and manufactured by using the LIGA method, so that at least part of the parts that are in close contact with or in contact with each other are in close contact or contact with each other.
- the contacting portion can be accurately manufactured at a time by a series of manufacturing processes. Thereby, when it is assembled as a product, it can be brought into close contact or contact with high accuracy without causing displacement or backlash between components.
- a gear (not shown) has a substantially disc shape and a gear portion provided with teeth projecting radially on the outer peripheral portion, and a gear shaft provided at the rotation center of the gear portion. Composed.
- a bearing (not shown) rotatably holds both ends of the gear shaft in the gear. The gear rotates relative to the bearing at a position defined by the bearing.
- the gear (gear shaft) is the first electroformed part and the bearing is the second electroformed part.
- the first electroforming is performed in the same manner as in the steps shown in FIGS. 1 to 4 and 6 described above.
- a gear (gear shaft) that is a part is formed.
- chamfering (R attachment) is performed at the end of the gear shaft to form a chamfered portion.
- a film for detachment that facilitates detachment of the bearing is formed on the surface of the chamfered shape (R shape) of the chamfered portion at the end of the gear shaft. Then, after depositing the second electroformed member 6 constituting the bearing so as to cover the chamfered shape (R shape) of the end portion of the gear shaft in the same manner as the steps shown in FIGS. By grinding the second electroformed member 6, a bearing as a second electroformed component is formed. Thereafter, in the same manner as in the steps shown in FIGS. 21 and 22, the gear and the bearing are detached, and each of them is taken out individually.
- the gear and the bearing can be accurately manufactured at a time in a series of steps.
- a gear shaft can be hold
- stress is locally concentrated at the contact portion between the gear shaft and the bearing by forming a chamfered portion at the end of the gear shaft in the gear. And the friction between the gear shaft and the bearing can be reduced. Thereby, the power consumption of the motor can be reduced.
- FIG. 55 is an explanatory view showing a hand and a heel incorporated in an analog timepiece.
- the analog timepiece is provided with hands (indicating hands) 6a that indicate the time by pointing to the dial numbers and memory, such as hour hand, minute hand, and second hand.
- Some of the needles 6a are provided with a cylindrical collar 6b for the purpose of stably fixing the needle 6a to a gear shaft or the like.
- the flange 6b has a cylindrical shape in which the length direction of the needle 6a and the direction orthogonal to the rotation surface on which the needle rotates are the axial direction.
- the needle 6a and the collar 6b are integrally formed.
- the second electroformed parts are realized by the needles 6a and the scissors 6b.
- the needle 6a and the flange 6b by the method for manufacturing an electroformed component according to the present invention, first, in the same manner as the respective steps shown in FIGS. 1 to 4 and 6 to 8 described above, The first electroformed parts 4A and 4B are formed, and the second electroforming mold 8 is formed.
- a release film is provided on the outer surface of the first electroformed parts 4A and 4B, and thereafter, the same processes as those described in the first and second embodiments are performed. Specifically, as shown in FIG. 9, the conductive layer 2 is formed until the second electroformed member 6 is formed to a thickness that protrudes somewhat from the surface of the second photoresist layer 5. Electroforming as one electrode is performed. Next, as shown in FIG. 10, after the second electroformed member 6 and the second photoresist layer 5 are flattened, the silicon substrate 1 and the conductive layer 2 are removed as shown in FIG. Do it. Then, after removing the second photoresist layer 5 as shown in FIG. 12, as shown in FIG. 13, the first electroformed parts 4A and 4B and the needles 6a as the second electroformed parts and Take out the basket 6b individually.
- the needle 6a and the flange 6b can be accurately manufactured at a time in a series of steps.
- chamfering may be performed at the boundary between the needle 6a and the scissors 6b to form a chamfered portion.
- the corners of the first electroformed parts 4A and 4B are chamfered (R-attached), and the first electroformed parts 4A and 4B are chamfered.
- Part 4a is formed.
- the chamfered portion 4a is performed on the corner portion of the portion that becomes the boundary between the needle 6a and the flange 6b.
- the second electroformed member 6 is deposited.
- the second electroformed member 6 has an R shape that is curved so as to cover the chamfered portion 4a at a portion facing the chamfered portion 4a in the first electroformed parts 4A and 4B.
- the inner corners of the second electroformed member 6 formed by electroforming over the chamfered portions 4a formed on the first electroformed parts 4A and 4B are the boundaries between the needle 6a and the flange 6b. It corresponds to the part.
- the chamfered portion 4a is transferred to the boundary portion between the needle 6a and the collar 6b to form a corresponding concave curved surface.
- timepiece parts such as mechanical timepieces and quartz type electronic timepieces by the method for manufacturing electroformed parts according to the embodiments of the present invention
- the method for manufacturing an electroformed part according to the embodiment of the present invention is not limited to the manufacture of a watch part.
- the method for manufacturing an electroformed component according to the embodiment of the present invention can be applied to the manufacture of parts for cameras, measuring instruments, and other various precision devices in addition to timepiece parts.
- the method for producing an electroformed part according to the present invention is useful for a method for producing an electroformed part that is incorporated into a watch or the like and is formed by electroforming. Suitable for the manufacturing method.
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Abstract
Description
実施の形態1においては、この発明にかかる実施の形態1の電鋳部品の製造方法として、LIGA(Lithographie,Galvanoformung,Abformung)法を応用した電鋳部品の製造方法について説明する。LIGA法は、X線リソグラフィと電鋳とモールディングを組み合わせて目的の部品(構造物)を製造する方法であって、アスペクト比(加工幅に対する深さ(高さ)の比)の大きな部品を製造することができる。
まず、この発明にかかる実施の形態1の電鋳部品の製造方法について説明する。図1~図4および図6~図13は、この発明にかかる実施の形態1の電鋳部品の製造方法による、電鋳部品の製造手順を示す説明図である。図5は、電鋳槽内の配置状態を示す説明図である。図1~図4および図6~図13においては、実施の形態1の電鋳部品の製造方法による電鋳部品の各製造工程における、電鋳部品の断面を模式的に示している。図5においては、実施の形態1の電鋳部品の製造方法による一工程における、電鋳槽内の配置状態を模式的に示している。
つぎに、上述した実施の形態1の電鋳部品の製造方法によって製造する、第1の電鋳部品および第2の電鋳部品の一例について説明する。図14および図15は、この発明にかかる実施の形態1の電鋳部品の製造方法による、電鋳部品の製造手順の一部を示す説明図である。
つぎに、この発明にかかる実施の形態2の電鋳部品の製造方法について説明する。実施の形態2においては、上述した実施の形態1と同一部分は同一符号で示し、説明を省略する。図16~図22は、この発明にかかる実施の形態2の電鋳部品の製造方法による、電鋳部品の製造手順の一部を示す説明図である。実施の形態2の電鋳部品の製造方法による電鋳部品の製造手順は、上述した図1~図4および図6に示した各工程と同じ工程をおこない、以降、図16~図22に示す各工程をおこなう。
実施の形態2の電鋳部品の製造方法による電鋳部品の製造に際しては、まず、上述した図1~図4および図6に示した各工程と同様にして、第1の電鋳部材4および第1のフォトレジスト層3のおもて面側を平坦化することにより第1の電鋳部品4A,4Bを形成する。つぎに、図16に示すように、第1の電鋳部品4A,4Bの角部の面取り(R付け)をおこなう。この面取りは、第1の電鋳部品4A,4Bにおける少なくとも開口5a内に位置する部分の角部に対しておこなう。
つぎに、この発明にかかる実施の形態3の電鋳部品の製造方法について説明する。実施の形態3においては、上述した実施の形態1や実施の形態2と同一部分は同一符号で示し、説明を省略する。図23~図33は、この発明にかかる実施の形態3の電鋳部品の製造方法による、電鋳部品の製造手順を示す説明図である。
実施の形態3の電鋳部品の製造方法による電鋳部品の製造に際しては、まず、図23に示すように、基板10を用意する。基板10は、たとえば、良好な導電性を有する導電材料(導電材)を用いて形成することができる。具体的には、基板10は、たとえば、銅、黄銅、ステンレス鋼等の金属(合金を含む)などの導電材料を用いて形成することができる。
つぎに、上述した実施の形態1~3の電鋳部品の製造方法によって製造する第1の電鋳部品4A,4Bおよび第2の電鋳部品6A,6Bの、具体的部品の製造例について説明する。
まず、機械式時計に組み込まれるてん輪および錘の製造例について説明する。機械式時計においては、てん輪とひげぜんまいを組み合わせて調速機(てんぷとも呼ぶ)が構成され、ひげぜんまいの力によっててん輪が一定周期で往復回動する。てんぷは、てん輪の往復回動によってアンクルを揺動させ、ガンギ車を1歯ずつ送って(つまり、一定速度で回転して)、時を刻んでいる。アンクルとガンギ車は、脱進機とも呼ばれている。
つぎに、機械式時計に組み込まれる歯車および軸受けの製造例について説明する。機械式時計には多数の歯車が使用されている。歯車は、軸受けによって、当該軸受けに対して相対的に回転可能に支持されている。図39は、歯車と軸受けの嵌合状態を示す平面図である。
つぎに、機械式時計に組み込まれるガンギ車および平板状の小部品の製造例について説明する。機械式時計は、ガンギ車を備えている。図43は、ガンギ車を示す平面図である。図43に示すように、ガンギ車50は、環形状をなしている。ガンギ車50の外周には、複数の歯部51が、一定のピッチで設けられている。各歯部51は、ガンギ車50がなす環形状の放射方向(半径方向)に対して、一定の角度で傾斜して設けられている。
つぎに、クオーツ式時計などに組み込まれるロータ軸の製造例について説明する。図51および図52は、ロータの一部を示す説明図である。図52は、図51に示したロータの一部を、A-A線を通る平面に沿って切断した断面を示している。図53および図54は、ロータが備えるロータ軸を示す説明図である。図54は、図53に示したロータ軸を、B-B線を通る平面に沿って切断した断面を示している。
つぎに、機械式時計やクオーツ式時計などに組み込まれる歯車および軸受けの製造例について説明する。一般的に、歯車(図示を省略する)は、略円盤形状であって外周部に放射状に突出する歯を備えた歯車部と、当該歯車部の回転中心に設けられる歯車軸と、を備えて構成される。軸受け(図示を省略する)は、歯車における歯車軸の両端を回転可能に保持する。歯車は、軸受けによって定められる位置において、当該軸受けに対して相対的に回転する。
つぎに、アナログ時計に組み込まれる針および袴の製造例について説明する。図55は、アナログ時計に組み込まれる針および袴を示す説明図である。図55に示すように、アナログ時計は、たとえば、時針、分針、秒針などのように、文字盤の数字やメモリを指し示すことにより時刻をあらわす針(指示針)6aを備えている。この針6aには、当該針6aを安定して歯車の軸などに固定することを目的として、筒形状の袴6bが設けられているものがある。袴6bは、針6aの長さ方向および当該針が回転する回転面に対して直交する方向を軸心方向とする筒形状をなす。針6aおよび袴6bは、一体に形成されている。
2 導電層
3 第1のフォトレジスト層
3a 第1のフォトレジスト層の開口
4 第1の電鋳部材
4a 面取り部
4A,4B,40 第1の電鋳部品
5 第2のフォトレジスト層
5a 第2のフォトレジスト層の開口
6,55 第2の電鋳部材
6A,6B、60 第2の電鋳部品
7,7’ 第1の電鋳型
8,8’ 第2の電鋳型
10 金属基板
15 電鋳槽
16 電解液
17 対向電極
18 電源
20 てん輪(第2の電鋳部品)
20a 切り欠き部
20b 支柱(支持軸)
25 錘(第1の電鋳部品)
25b 中心孔
25a 切り欠き部
30 歯車(第1の電鋳部品)
30a 歯
30b 環状部
30c 円形開口
30d 面取り部
35 軸受け(第2の電鋳部品)
35a 止め穴
35b 小径部
35c 大径部
35d コーナ部
45 平板状の小部品(第1の電鋳部品)
45a 面取り部
50 ガンギ車(第2の電鋳部品)
51 歯部
51a 薄肉部
51c リービングコーナ
51d ロッキングコーナ
51e コーナ部
6a 針
6b 袴
Claims (9)
- 導電層のおもて面側に形成した第1のフォトレジスト層をパターニングして、当該第1のフォトレジスト層を、前記導電層と前記第1のフォトレジスト層との積層方向に沿って貫通する第1の貫通孔を形成する工程と、
前記導電層を一方の電極とする電鋳によって、前記導電層のおもて面側であって前記第1の貫通孔内に第1の電鋳部材を堆積させる工程と、
前記第1の電鋳部材および前記第1のフォトレジスト層のおもて面側を平坦化することにより第1の電鋳部品を形成する工程と、
前記第1の電鋳部品を形成した前記導電層から前記第1のフォトレジスト層を除去する工程と、
前記第1のフォトレジスト層を除去することにより露出された前記第1の電鋳部品の表面に離脱用の膜を形成する工程と、
前記導電層のおもて面側に、前記第1の電鋳部品をおもて面側から覆う第2のフォトレジスト層を形成し、当該第2のフォトレジスト層をパターニングして、前記第1の電鋳部品の一部が内側に突出する状態で当該第2のフォトレジスト層を前記積層方向に沿って貫通する第2の貫通孔を形成する工程と、
前記導電層を一方の電極とする電鋳によって、前記導電層のおもて面側であって前記第2の貫通孔内に第2の電鋳部材を堆積させる工程と、
前記第2の電鋳部材および前記第2のフォトレジスト層のおもて面側を平坦化することにより第2の電鋳部品を形成する工程と、
前記第1の電鋳部品、前記第2の電鋳部品および前記第2のフォトレジスト層から、前記導電層を除去する工程と、
前記導電層を除去した前記第1の電鋳部品および前記第2の電鋳部品から、前記第2のフォトレジスト層を除去する工程と、
を含んだことを特徴とする電鋳部品の製造方法。 - 前記第1の電鋳部品における少なくとも前記第2の貫通孔内に位置する部分の角部の面取りをおこなう工程を含み、
前記離脱用の膜を形成する工程は、前記面取りをおこなう工程の後におこなうことを特徴とする請求項1に記載の電鋳部品の製造方法。 - 前記面取りをおこなう工程は、電解研磨またはウエットエッチングによって前記角部の面取りをおこなうことを特徴とする請求項2に記載の電鋳部品の製造方法。
- 前記導電層は、絶縁材または半導電材からなる基板の表面に形成されていることを特徴とする請求項1~3のいずれか一つに記載の電鋳部品の製造方法。
- 前記離脱用の膜を形成する工程は、表面酸化膜を前記離脱用の膜として形成することを特徴とする請求項1に記載の電鋳部品の製造方法。
- 前記第1の電鋳部品および前記第2の電鋳部品は、少なくとも一部が互いに密接または当接する部品であることを特徴とする請求項1に記載の電鋳部品の製造方法。
- 前記第1の電鋳部品および前記第2の電鋳部品は、少なくとも一部が互いに密接または当接した状態で相対的に移動する部品であることを特徴とする請求項6に記載の電鋳部品の製造方法。
- 前記第1の電鋳部品を形成する工程は、前記第1の電鋳部材および前記第1のフォトレジスト層をおもて面側から研削することにより平坦化することを特徴とする請求項1~7のいずれか一つに記載の電鋳部品の製造方法。
- 前記第2の電鋳部品を形成する工程は、前記第2の電鋳部材および前記第2のフォトレジスト層をおもて面側から研削することにより平坦化することを特徴とする請求項1~8のいずれか一つに記載の電鋳部品の製造方法。
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