WO2016009913A1 - Écran tactile capacitif - Google Patents

Écran tactile capacitif Download PDF

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Publication number
WO2016009913A1
WO2016009913A1 PCT/JP2015/069621 JP2015069621W WO2016009913A1 WO 2016009913 A1 WO2016009913 A1 WO 2016009913A1 JP 2015069621 W JP2015069621 W JP 2015069621W WO 2016009913 A1 WO2016009913 A1 WO 2016009913A1
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WO
WIPO (PCT)
Prior art keywords
touch panel
adhesive layer
capacitive touch
layer
substrate
Prior art date
Application number
PCT/JP2015/069621
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English (en)
Japanese (ja)
Inventor
真也 荻窪
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富士フイルム株式会社
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Publication of WO2016009913A1 publication Critical patent/WO2016009913A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes

Definitions

  • the present invention relates to a capacitive touch panel, and more particularly to a capacitive touch panel in which the elongation ratio of an upper adhesive layer and a lower adhesive layer is in a predetermined range.
  • Patent Document 1 The mounting rate of touch panels on various devices such as tablet PCs, car navigation systems, automatic ticket vending machines, and ATM devices is increasing, and capacitive touch panels capable of multipoint detection are particularly used (Patent Document 1). ). Normally, it is necessary to provide wiring (so-called lead-out wiring) on the peripheral part of the touch panel, and print on the peripheral part of the protective substrate so that these wirings are not visible from the protective substrate surface side constituting the touch surface. Etc. A frame-like decoration layer (decoration part) is provided.
  • an object of the present invention is to provide a capacitive touch panel that is less likely to malfunction in an input region near a decorative layer even after a long period of time has elapsed since manufacture.
  • the present inventors have found that the above problems can be solved by controlling the elongation rate of the upper adhesive layer and the lower adhesive layer contained in the capacitive touch panel. That is, it has been found that the above object can be achieved by the following configuration.
  • a capacitive touch panel comprising a display device, a lower adhesive layer, a capacitive touch panel sensor, an upper adhesive layer, and a protective substrate in this order, A decorative layer is disposed on the surface of the protective substrate on the display device side, The elongation of the upper adhesive layer is 1500% or more, A capacitive touch panel in which the lower adhesive layer has an elongation of 600% or less.
  • the capacitive touch panel according to (1) wherein the elongation rate of the upper adhesive layer is 4 times or more the elongation rate of the lower adhesive layer.
  • the capacitive touch panel sensor is a laminate having detection electrodes on both sides of the substrate, or a laminate in which substrates with detection electrodes having detection electrodes on one side are bonded together with an adhesive layer.
  • the detection electrode is selected from the group consisting of gold, silver, copper, aluminum, indium tin oxide, tin oxide, zinc oxide, cadmium oxide, gallium oxide, titanium oxide, silver palladium alloy, and silver palladium copper alloy.
  • the capacitive touch panel according to (5) which is configured by any of the above.
  • FIG. 5 is a cross-sectional view taken along a cutting line AA shown in FIG. It is an enlarged plan view of a 1st detection electrode. It is a partial cross section of other embodiment of an electrostatic capacitance type touch panel sensor. It is a partial cross section of other embodiment of an electrostatic capacitance type touch panel sensor.
  • a feature of the touch panel of the present invention is that the elongation rate of the upper adhesive layer and the lower adhesive layer is controlled. The reason why the desired effect can be obtained by such a configuration will be described in detail below.
  • a display device, a lower adhesive layer, a capacitive touch panel sensor, an upper adhesive layer, and a protective substrate are laminated in this order.
  • a frame-like decorative layer is disposed in the peripheral region of the protective substrate, and plays a role of hiding the lead-out wiring.
  • the present inventor conducted intensive studies on the problems of the prior art and found that the following two points were mainly related.
  • an upper adhesion layer is bonded so that the level
  • the upper adhesive layer may be peeled off from the protective substrate with time, and a gap may be formed between the protective substrate and the upper adhesive layer in the vicinity of the decorative layer. More specifically, as shown in FIG. 1, a gap 56 may be generated between the protective substrate 52 having the decorative layer 50 on the surface and the upper adhesive layer 54. In particular, this phenomenon is more likely to occur as the thickness of the upper adhesive layer is thinner. Since such a gap has a relative dielectric constant different from that of the upper adhesive layer, the capacitance deviates from the initially set value, leading to malfunction.
  • the step following property is further improved as compared with the conventional case, and the generation of voids is suppressed.
  • the lower adhesive layer is disposed on the display device, and a capacitive touch panel sensor is disposed thereon.
  • the lower adhesive layer may protrude from the side surface due to the weight of the capacitive touch panel sensor. More specifically, as shown in FIG. 2, protrusion occurs on the side surface 64 of the lower adhesive layer 62 sandwiched between the display device 58 and the capacitive touch panel sensor 60.
  • a relatively thick adhesive layer may be used for the lower adhesive layer from the viewpoint of noise reduction.
  • the adhesive layer tends to protrude as described above.
  • the thickness of the lower adhesive layer adjacent to the protrusion is reduced. Since the thickness of the adhesive layer is related to the capacitance, such a decrease in thickness leads to malfunction. In particular, this leads to a malfunction in the peripheral portion of the input area where the thickness of the adhesive layer is reduced.
  • the use of the lower adhesive layer having a low elongation rate suppresses the occurrence of the above-described protrusion.
  • the gap between the protective substrate and the upper adhesive layer is likely to occur in the vicinity of the decorative layer, and the decrease in thickness due to the protrusion of the lower adhesive layer described above is also caused by the peripheral portion of the lower adhesive layer, in other words, the decorative layer. It tends to occur near the layer.
  • These two points are presumed to have caused a malfunction in the input area near the decorative layer. Therefore, in the present invention, by controlling the elongation rate of the upper adhesive layer and the lower adhesive layer within a predetermined range, the occurrence of the above problem is suppressed, and as a result, the malfunction of the touch panel is suppressed.
  • FIG. 3A is a cross-sectional view of the capacitive touch panel of the present invention.
  • FIG. 3B is a top view of the capacitive touch panel of the present invention
  • FIG. 3A is a cross-sectional view taken along the cutting line XX in FIG. 3B.
  • the capacitive touch panel 10 includes a display device 12, a lower adhesive layer 14, a capacitive touch panel sensor 16, an upper adhesive layer 18, and a protective substrate 20.
  • a decorative layer 21 is arranged in a frame shape on the periphery of the protective substrate 20 on the surface of the protective substrate 20 on the display device 12 side. Incidentally, in FIG.
  • the internal region than the decorative layer 21 corresponds to the input region E I.
  • this capacitive touch panel 10 when a finger approaches or contacts the input area E I surface (touch surface) of the protective substrate 20, the capacitance between the finger and the detection electrode in the capacitive touch panel sensor 16 is increased. Change.
  • a position detection driver (not shown) always detects a change in capacitance between the finger and the detection electrode.
  • the position detection driver detects a change in capacitance that is equal to or greater than a predetermined value
  • the position detection driver detects a position where the change in capacitance is detected as an input position.
  • the capacitive touch panel 10 can detect the input position.
  • each member of the capacitive touch panel 10 will be described in detail. First, the aspect of the upper adhesive layer 18 and the lower adhesive layer 14 which are the characteristics of this invention is explained in full detail, and another member is explained in full detail after that.
  • the upper adhesive layer 18 is a layer for ensuring adhesion between a capacitive touch panel sensor 16 described later and a protective substrate 20 described later.
  • the elongation percentage of the upper adhesive layer 18 is 1500% or more, and is 1600 in that malfunction in the input region near the decorative layer is further suppressed (hereinafter, also simply referred to as “the effect of the present invention is more excellent”).
  • % Or more preferably 1700% or more, more preferably 1800% or more.
  • the upper limit is not particularly limited, but is preferably 3000% or less and more preferably 2500% or less from the viewpoint of handleability.
  • the measuring method of the elongation percentage of the upper adhesive layer 18 is as follows. In measuring the elongation rate of the upper adhesive layer 18, first, a sample of the upper adhesive layer cut to a predetermined size (0.4 mm thickness, 20 mm width, 70 mm length) was prepared, and a tensile tester (Autograph, Shimadzu) The sample is sandwiched 10 mm above and below in the longitudinal direction of the sample and pulled under the conditions of an atmospheric temperature of 25 ° C. and a pulling speed of 300 mm / min.
  • Elongation (%) (L ⁇ L 0 ) / L 0 ⁇ 100 Is calculated.
  • L 0 is the length of the sample before the tensile test
  • L is the length of the sample at the time of fracture.
  • the tensile as the length L 0 of the specimen before the test, 50 mm excluding the grip portion (10 mm ⁇ 2) in a tensile testing machine from the sample total length (70 mm) corresponds.
  • the sample having the above thickness may be directly manufactured, or a plurality of samples having a thickness less than the above may be stacked to prepare the sample having the above thickness.
  • the thickness of the upper adhesive layer 18 is not particularly limited, but is preferably 5 to 350 ⁇ m, more preferably 30 to 250 ⁇ m, and even more preferably 30 to 150 ⁇ m. Within the above range, desired visible light transmittance can be obtained, and handling is easy.
  • the upper adhesive layer 18 is preferably optically transparent. That is, a transparent adhesive layer is preferable. Optically transparent means that the total light transmittance is 85% or more, preferably 90% or more, and more preferably 100%.
  • the material constituting the upper adhesive layer 18 is not particularly limited as long as the elongation rate is satisfied.
  • an acrylic adhesive, a rubber adhesive, a silicone adhesive, and the like can be given.
  • the acrylic pressure-sensitive adhesive is a pressure-sensitive adhesive containing a polymer of monomer components ((meth) acrylic polymer) containing an acrylate monomer and / or a methacrylate monomer.
  • the said polymer is contained as a base polymer in the said acrylic adhesive, the other components (The tackifier mentioned later, a rubber component, etc.) may be contained.
  • the (meth) acrylic polymer is a concept including both an acrylic polymer and a methacrylic polymer.
  • the monomer component used in producing the (meth) acrylic polymer contained in the acrylic pressure-sensitive adhesive includes other types of monomers (for example, acrylamide monomer) other than the acrylate monomer and the methacrylate monomer. , Vinyl monomers, etc.).
  • Examples of the monomer ((meth) acrylate monomer) used for producing the (meth) acrylic polymer include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, and isobutyl (meth) acrylate.
  • the upper adhesive layer 18 includes an embodiment in which an acrylic adhesive is included.
  • an acrylic adhesive is included.
  • it is derived from a (meth) acrylate monomer having a hydrocarbon group having at least 4 carbon atoms (the number of carbon atoms).
  • a (meth) acrylic polymer having a repeating unit is preferably included in the upper adhesive layer 18.
  • the (meth) acrylate monomer is a concept including both an acrylate monomer and a methacrylate monomer.
  • Examples of the (meth) acrylate monomer having the carbon number include 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, n-dodecyl (meth) acrylate, n-tridecyl (meth) acrylate, n-tetradecyl (meth) acrylate, n-hexadecyl (meth) acrylate, stearyl (meth) Examples include acrylate, isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate, and dicyclopentanyl (meth) acrylate.
  • Examples of the (meth) acrylate monomer having a hydrocarbon group having the above carbon number include, for example, a (meth) acrylate monomer having a chain aliphatic hydrocarbon group having the above carbon number, and a cyclic aliphatic hydrocarbon group having the above carbon number.
  • (Meth) acrylate monomers having the number of carbon atoms in the hydrocarbon group is preferably 6 or more, more preferably 6 to 20, and still more preferably 8 to 16.
  • the chain aliphatic hydrocarbon group may be either linear or branched.
  • One preferred embodiment of the (meth) acrylic polymer is a repeating unit derived from a (meth) acrylate monomer having a chain aliphatic hydrocarbon group having the above carbon number, and a cyclic aliphatic hydrocarbon group having the above carbon number.
  • the (meth) acrylic polymer which has a repeating unit derived from the (meth) acrylate monomer which has is mentioned.
  • the (meth) acrylic polymer includes monomers other than those described above within a range not impairing the effects of the present invention (for example, carboxylic acid group-containing (meth) acrylate (for example, acrylic acid), hydroxyl group-containing (meth) acrylate (for example, , 2-hydroxyethyl acrylate))-derived repeating units may be included. Furthermore, the (meth) acrylic polymer may have a crosslinked structure.
  • the method for forming the crosslinked structure is not particularly limited, and a method using a bifunctional (meth) acrylate monomer or a crosslinking agent that introduces a reactive group (for example, a hydroxyl group) into a (meth) acrylic polymer and reacts with the reactive group.
  • the method of making it react with is mentioned.
  • Specific examples of the latter method include a repeating unit derived from a (meth) acrylate monomer having a group having at least one active hydrogen selected from the group consisting of a hydroxyl group, a primary amino group, and a secondary amino group (meta )
  • the content of the (meth) acrylic polymer in the upper adhesive layer 18 is not particularly limited, but is preferably 10 to 95% by mass with respect to the total mass of the upper adhesive layer in terms of more excellent effects of the present invention. More preferably, it is more preferably 15 to 40% by weight.
  • the upper adhesive layer 18 may further contain a tackifier.
  • a tackifier those known in the field of patch or patch preparation may be appropriately selected and used.
  • petroleum resin for example, aromatic petroleum resin, aliphatic petroleum resin, aliphatic / aromatic hybrid petroleum resin, resin by C9 fraction
  • terpene resin for example, ⁇ -pinene resin, ⁇ -pinene, etc.
  • Resin resin obtained by copolymerizing any mixture of ⁇ -pinene / ⁇ -pinene / dipentene, terpene phenol copolymer, hydrogenated terpene phenol resin, aromatic modified hydrogenated terpene, abietic acid ester resin
  • rosin Resin for example, partially hydrogenated gum rosin resin, erythritol modified wood rosin resin, tall oil rosin resin, wood rosin resin, gum rosin, rosin modified maleic acid resin, polymerized rosin, rosin phenol, rosin ester
  • the tackifier can be used singly or in combination of two or more, and when used in combination of two or more, for example, different types of resins may be combined, and the softening point of the same type of resin Different resins may be combined.
  • the content of the tackifier in the upper adhesive layer 18 is not particularly limited, but is preferably 10 to 60% by mass, and preferably 20 to 50% by mass with respect to the total mass of the upper adhesive layer in terms of more excellent effects of the present invention. Is more preferable.
  • the upper adhesive layer 18 may further contain a rubber component (softening agent).
  • the rubber component include polyolefin or modified polyolefin.
  • the rubber component include natural rubber, polyisobutylene, polybutadiene, polyisoprene, polybutene, hydrogenated polyisoprene, hydrogenated polybutadiene, styrene butadiene copolymer, or a combination of any combination selected from these groups. Examples include polymers and polymer mixtures.
  • the content of the rubber component in the upper adhesive layer 18 is not particularly limited, but is preferably 1 to 50% by mass, and preferably 5 to 50% by mass, based on the total mass of the upper adhesive layer, in that the effect of the present invention is more excellent. More preferred.
  • One preferred embodiment of the upper pressure-sensitive adhesive layer 18 includes a pressure-sensitive adhesive layer obtained by subjecting a pressure-sensitive adhesive composition containing a (meth) acrylate monomer having a hydrocarbon group having at least 4 carbon atoms to a curing treatment.
  • a pressure-sensitive adhesive composition containing a (meth) acrylate monomer having a hydrocarbon group having at least 4 carbon atoms to a curing treatment.
  • the definition of the (meth) acrylate monomer is as described above.
  • the said tackifier is contained in the said adhesive composition.
  • the rubber composition is contained in the pressure-sensitive adhesive composition.
  • the rubber component which has a polymeric group may be contained.
  • the pressure-sensitive adhesive composition may contain a rubber component having a polymerizable group and a rubber component having no polymerizable group.
  • the polymerizable group include known radical polymerizable groups (such as vinyl group and (meth) acryloyl group) and known cationic polymerizable groups (such as epoxy group).
  • the content of the tackifier in the pressure-sensitive adhesive composition is not particularly limited, but is preferably 80 to 320 parts by weight, more preferably 120 to 270 parts by weight with respect to 100 parts by weight of the (meth) acrylate monomer.
  • the content of the rubber component in the pressure-sensitive adhesive composition is not particularly limited, but is preferably 5 to 320 parts by mass, more preferably 5 to 280 parts by mass with respect to 100 parts by mass of the (meth) acrylate monomer.
  • the pressure-sensitive adhesive composition may contain additives other than the above components (for example, a polymerization initiator, a thermosetting agent, an antioxidant, transparent particles, a plasticizer, a chain transfer agent, etc.).
  • a polymerization initiator for example, a photopolymerization initiator such as (1-hydroxy) cyclohexyl phenyl ketone or acylphosphine oxide, or a thermal polymerization initiator such as azobisalkylnitrile or perbutyl can be used.
  • the thermosetting agent for example, polyisocyanate or epoxy or oxetane thermosetting agent is selected.
  • antioxidants examples include known hindered phenols (pentaerythritol tetrakis [3- (3,3-di-tert-butyl-4-hydroxyphenyl) propionate], 2,4-bis (octylthiomethyl) ortho Cresol) and hindered amines can be used.
  • transparent particles optically minute particles (such as nano silica) that cannot be visually recognized can be appropriately used unless they are contrary to the present invention.
  • chain transfer agent for example, 1-dodecanethiol, trimethylolpropane tristhiopropionate, pentaerythritol tetrakisthiopropionate and the like are used.
  • the procedure in particular for manufacturing the upper adhesion layer 18 from the said adhesive composition is not restrict
  • a well-known method is employable.
  • the pressure-sensitive adhesive composition is applied on a predetermined substrate (for example, on a peelable substrate), dried as necessary, and subjected to the curing treatment described above.
  • the coating method include known methods.
  • known coating apparatuses such as an applicator, a gravure coat, a curtain coat, a comma coater, a slot die coater, and a lip coater are used.
  • the curing treatment applied to the pressure-sensitive adhesive composition include photocuring treatment and thermosetting treatment.
  • the adhesive layer is preferably formed by curing a photocurable adhesive or a thermosetting adhesive.
  • the pressure-sensitive adhesive composition (curable composition) used for curing is not only a monomer mixture, but also a polymer obtained by polymerizing monomers in advance and a monomer or a polymer having curing reactivity, depending on the characteristics of the curing reaction. You may use the adhesive composition which blended.
  • the photocuring treatment may consist of a plurality of curing steps, and the light wavelength to be used may be appropriately selected from a plurality.
  • the thermosetting treatment may be composed of a plurality of curing steps, and the method for applying heat may be selected from appropriate methods such as an oven, a reflow furnace, and an IR heater.
  • the adhesive layer is relatively less likely to be deformed with time, which is preferable in terms of production suitability.
  • the lower adhesive layer 14 is a layer for ensuring adhesion between the display device 12 described later and a capacitive touch panel sensor 16 described later.
  • the elongation percentage of the lower adhesive layer 14 is 600% or less, and is preferably 550% or less, more preferably 500% or less, from the viewpoint that the effect of the present invention is more excellent.
  • the lower limit is not particularly limited, but is preferably 50% or more and more preferably 100% or more in terms of adhesiveness.
  • the measuring method of the elongation rate of the lower adhesion layer 14 is the same as the measuring method of the elongation rate of the upper adhesion layer 18 mentioned above.
  • the thickness of the lower adhesive layer 14 is not particularly limited, but is preferably 5 to 350 ⁇ m, more preferably 30 to 300 ⁇ m, and even more preferably 30 to 250 ⁇ m. Within the above range, desired visible light transmittance can be obtained, and handling is easy. Note that the relationship between the thickness of the lower adhesive layer 14 and the thickness of the upper adhesive layer 18 is not particularly limited, but the thickness of the lower adhesive layer 14 is the thickness of the upper adhesive layer 18 in terms of the balance between the strength and thinning of the touch panel. The above embodiment is preferable.
  • the lower adhesive layer 14 is preferably optically transparent. That is, a transparent adhesive layer is preferable. Optically transparent means that the total light transmittance is 85% or more, preferably 90% or more, and more preferably 100%.
  • the material constituting the lower adhesive layer 14 is not particularly limited, and examples thereof include the material constituting the upper adhesive layer 18 described above.
  • the display device 12 is a device having a display surface for displaying an image, and each member (for example, the lower adhesive layer 14 is disposed on the display screen side).
  • the kind in particular of the display apparatus 12 is not restrict
  • CTR cathode ray tube
  • LCD liquid crystal display
  • OLED organic light emitting diode
  • VFD vacuum fluorescent display
  • PDP plasma display panel
  • SED surface field display
  • FED field emission display
  • E-Paper electronic paper
  • the protective substrate 20 is a substrate disposed on the upper adhesive layer 18 and serves to protect the capacitive touch panel sensor 16 and the display device 12 to be described later from the external environment, and its main surface constitutes a touch surface. To do.
  • the protective substrate is preferably a transparent substrate, and a plastic plate (plastic film), a glass plate, or the like is used. It is desirable that the thickness of the substrate is appropriately selected according to each application.
  • polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, and EVA; vinyl resins
  • PC polycarbonate
  • PC polyamide
  • polyimide acrylic resin
  • TAC triacetyl cellulose
  • COP cycloolefin resin
  • the decorative layer 21 is a layer disposed on the surface of the protective substrate 20 on the display device 12 side, and can hide a lead-out wiring in a capacitive touch panel sensor, which will be described later, and is a layer for improving design. As a role. It is preferable that the decoration layer 21 is usually disposed in an outer area E O located outside an input area E I of a capacitive touch panel sensor described later. In FIG. 3, the decorative layer 21 is arranged in a frame shape (frame shape), but is not limited to this mode and can be appropriately changed.
  • the decorating layer 21 for example, a layer colored black or white is used.
  • the material in particular of the decoration layer 21 is not restrict
  • the colored resin composition containing binder resin and a coloring agent is mentioned.
  • a metal layer can also be used for a decoration layer.
  • the method for forming the decorative layer 21 is not particularly limited as long as it can be formed on the protective substrate 20.
  • printing methods such as gravure printing and screen printing, ink jet methods, photolithography methods and the like can be mentioned.
  • a vacuum evaporation method, sputtering method, etc. are mentioned, for example.
  • the thickness of the decoration layer is appropriately selected according to the purpose, but is often 5 to 50 ⁇ m, and is preferably 5 to 30 ⁇ m from the viewpoint of thinning the touch panel.
  • the capacitive touch panel sensor 16 is disposed on the display device 12 (operator side), and utilizes a change in capacitance that occurs when an external conductor such as a human finger comes into contact (approaching). This is a sensor that detects the position of an external conductor such as a finger.
  • the configuration of the capacitive touch panel sensor 16 is not particularly limited.
  • the capacitive touch panel sensor 16 includes detection electrodes (in particular, detection electrodes extending in the X direction and detection electrodes extending in the Y direction), and static detection of the detection electrodes in contact with or close to the finger.
  • the coordinates of the finger are specified by detecting the change in capacitance.
  • FIG. 4 shows a plan view of the capacitive touch panel sensor 160.
  • FIG. 5 is a cross-sectional view taken along the cutting line AA in FIG.
  • the capacitive touch panel sensor 160 includes a substrate 22, a first detection electrode 24 disposed on one main surface (on the surface) of the substrate 22, a first lead-out wiring 26, and the other main surface of the substrate 22.
  • a second detection electrode 28, a second lead wiring 30, and a flexible printed wiring board (hereinafter also referred to as FPC) 32 are provided on the upper side (on the back surface).
  • the region where the first detection electrode 24 and the second detection electrode 28 are provided constitutes an input region E I (an input region (sensing unit) capable of detecting contact of an object) that can be input by an operator, and input.
  • a first lead wiring 26, a second lead wiring 30 and a flexible printed wiring board 32 are arranged in the outer region E O located outside the region E I. Below, the said structure is explained in full detail.
  • the substrate 22 plays a role of supporting the first detection electrode 24 and the second detection electrode 28 in the input region E I and plays a role of supporting the first lead wiring 26 and the second lead wiring 30 in the outer region E O. It is a member.
  • the substrate 22 preferably transmits light appropriately. Specifically, the total light transmittance of the substrate 22 is preferably 85 to 100%.
  • the substrate 22 preferably has an insulating property (is an insulating substrate). That is, the substrate 22 is a layer for ensuring insulation between the first detection electrode 24 and the second detection electrode 28.
  • the substrate 22 is preferably a transparent substrate (particularly a transparent insulating substrate).
  • a transparent substrate particularly a transparent insulating substrate.
  • Specific examples thereof include an insulating resin substrate, a ceramic substrate, and a glass substrate.
  • an insulating resin substrate is preferable because of its excellent toughness.
  • the material constituting the insulating resin substrate is polyethylene terephthalate, polyethersulfone, polyacrylic resin, polyurethane resin, polyester, polycarbonate, polysulfone, polyamide, polyarylate, polyolefin, cellulose resin, poly Examples include vinyl chloride and cycloolefin resins.
  • polyethylene terephthalate, cycloolefin resin, polycarbonate, and triacetyl cellulose resin are preferable because of excellent transparency.
  • the substrate 22 is a single layer, but may be a multilayer of two or more layers.
  • the thickness of the substrate 22 (when the substrate 22 is a multilayer of two or more layers, the total thickness thereof) is not particularly limited, but is preferably 5 to 350 ⁇ m, more preferably 30 to 150 ⁇ m. Within the above range, desired visible light transmittance can be obtained, and handling is easy.
  • substrate 22 is substantially rectangular shape, However, It is not restricted to this. For example, it may be circular or polygonal.
  • the first detection electrode 24 and the second detection electrode 28 are sensing electrodes that sense a change in capacitance, and constitute a sensing unit (sensing unit). That is, when the fingertip is brought into contact with the touch panel, the mutual capacitance between the first detection electrode 24 and the second detection electrode 28 changes, and the position of the fingertip is calculated by the IC circuit based on the change amount.
  • the first detection electrode 24 has a role of detecting an input position in the X direction of an operator's finger approaching the input area E I and has a function of generating a capacitance between the first detection electrode 24 and the finger. ing.
  • the first detection electrodes 24 are electrodes that extend in a first direction (X direction) and are arranged at a predetermined interval in a second direction (Y direction) orthogonal to the first direction. Includes patterns.
  • the second detection electrode 28 has a role of detecting an input position in the Y direction of an operator's finger approaching the input area E I and has a function of generating a capacitance between the second detection electrode 28 and the finger. ing.
  • the second detection electrodes 28 are electrodes that extend in the second direction (Y direction) and are arranged at a predetermined interval in the first direction (X direction), and include a predetermined pattern as will be described later. In FIG. 4, five first detection electrodes 24 and five second detection electrodes 28 are provided, but the number is not particularly limited and may be plural.
  • the first detection electrode 24 and the second detection electrode 28 are composed of conductive thin wires.
  • FIG. 6 shows an enlarged plan view of a part of the first detection electrode 24.
  • the first detection electrode 24 is composed of conductive thin wires 34, and includes a plurality of gratings 36 formed of intersecting conductive thin wires 34.
  • the second detection electrode 28 similarly to the first detection electrode 24, also includes a plurality of lattices 36 formed by intersecting conductive thin wires 34.
  • Examples of the material of the conductive thin wire 34 include metals and alloys such as gold (Au), silver (Ag), copper (Cu), aluminum (Al), and palladium (Pd) (for example, silver palladium alloy, silver palladium copper). Alloys), indium tin oxide (ITO), tin oxide, zinc oxide, cadmium oxide, gallium oxide, titanium oxide, and other metal oxides. Among these, silver is preferable because the conductivity of the conductive thin wire 34 is excellent.
  • the conductive fine wire 34 preferably contains a binder from the viewpoint of adhesion between the conductive fine wire 34 and the substrate 22.
  • the binder is preferably a water-soluble polymer because the adhesion between the conductive thin wire 34 and the substrate 22 is more excellent.
  • binders include gelatin, carrageenan, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch and other polysaccharides, cellulose and its derivatives, polyethylene oxide, polysaccharides, polyvinylamine, chitosan, polylysine, and polyacryl. Examples include acid, polyalginic acid, polyhyaluronic acid, carboxycellulose, gum arabic, and sodium alginate.
  • gelatin is preferable because the adhesion between the conductive thin wire 34 and the substrate 22 is more excellent.
  • acid-processed gelatin may be used as gelatin, and gelatin hydrolyzate, gelatin enzyme decomposition product, and other gelatins modified with amino groups and carboxyl groups (phthalated gelatin, acetylated gelatin) Can be used.
  • the volume ratio of the metal to the binder (metal volume / binder volume) in the conductive thin wire 34 is preferably 1.0 or more, and more preferably 1.5 or more.
  • the upper limit is not particularly limited, but is preferably 6.0 or less, more preferably 4.0 or less, and even more preferably 2.5 or less from the viewpoint of productivity.
  • the volume ratio of the metal and the binder can be calculated from the density of the metal and the binder contained in the conductive thin wire 34. For example, when the metal is silver, the density of silver is 10.5 g / cm 3 , and when the binder is gelatin, the density of gelatin is 1.34 g / cm 3 .
  • the line width of the conductive thin wire 34 is not particularly limited, it is preferably 30 ⁇ m or less, more preferably 15 ⁇ m or less, further preferably 10 ⁇ m or less, and particularly preferably 9 ⁇ m or less, from the viewpoint that a low-resistance electrode can be formed relatively easily. 7 ⁇ m or less is most preferable, 0.5 ⁇ m or more is preferable, and 1 ⁇ m or more is more preferable.
  • the thickness of the conductive thin wire 34 is not particularly limited, but can be selected from 0.00001 to 0.2 mm from the viewpoint of conductivity and visibility, but is preferably 30 ⁇ m or less, more preferably 20 ⁇ m or less, and 0.01 Is more preferably from 9 to 9 ⁇ m, most preferably from 0.05 to 5 ⁇ m.
  • the lattice 36 includes an opening region surrounded by the thin conductive wires 34.
  • the length W of one side of the grating 36 is preferably 800 ⁇ m or less, more preferably 600 ⁇ m or less, further preferably 400 ⁇ m or less, preferably 5 ⁇ m or more, more preferably 30 ⁇ m or more, and further preferably 80 ⁇ m or more.
  • the aperture ratio is preferably 85% or more from the viewpoint of visible light transmittance, more preferably 90% or more, and further preferably 95% or more. preferable.
  • the aperture ratio corresponds to the ratio of the transmissive portion excluding the conductive thin wires 34 in the first detection electrode 24 or the second detection electrode 28 in the predetermined region.
  • the lattice 36 has a substantially rhombus shape.
  • other polygonal shapes for example, a triangle, a quadrangle, a hexagon, and a random polygon
  • the shape of one side may be a curved shape or a circular arc shape in addition to a linear shape.
  • the arc shape for example, the two opposing sides may have an outwardly convex arc shape, and the other two opposing sides may have an inwardly convex arc shape.
  • the shape of each side may be a wavy shape in which an outwardly convex arc and an inwardly convex arc are continuous. Of course, the shape of each side may be a sine curve.
  • the conductive thin wire 34 is formed as a mesh pattern, but is not limited to this mode, and may be a stripe pattern.
  • the first detection electrode 24 and the second detection electrode 28 are configured by the mesh structure of the conductive thin wires 34.
  • the present invention is not limited to this mode.
  • the first detection electrode 24 and the second detection electrode 28 2 The entire detection electrode 28 may be formed of a metal oxide thin film (transparent metal oxide thin film) such as ITO or ZnO.
  • the conductive thin wires 34 of the first detection electrode 24 and the second detection electrode 28 are formed of metal oxide particles, metal paste such as silver paste and copper paste, and metal nanowire particles such as silver nanowire and copper nanowire. Also good. Among these, silver nanowires are preferable because they are excellent in conductivity and transparency.
  • the patterning of the electrode can be selected depending on the material of the electrode, and a photolithography method, a resist mask screen printing-etching method, an ink jet method, a printing method, or the like may be used.
  • the first lead wiring 26 and the second lead wiring 30 are members that play a role in applying a voltage to the first detection electrode 24 and the second detection electrode 28, respectively.
  • the first lead wiring 26 is disposed on the substrate 22 in the outer region E O , one end of which is electrically connected to the corresponding first detection electrode 24, and the other end is electrically connected to the flexible printed wiring board 32.
  • the second lead wiring 30 is disposed on the substrate 22 in the outer region E O , one end of which is electrically connected to the corresponding second detection electrode 28, and the other end is electrically connected to the flexible printed wiring board 32.
  • the In FIG. 4, five first extraction wirings 26 and five second extraction wirings 30 are illustrated, but the number is not particularly limited, and a plurality of the first extraction wirings are usually arranged according to the number of detection electrodes.
  • Examples of the material constituting the first lead wiring 26 and the second lead wiring 30 include metals such as gold (Au), silver (Ag), and copper (Cu), tin oxide, zinc oxide, cadmium oxide, and gallium oxide. And metal oxides such as titanium oxide. Among these, silver is preferable because of its excellent conductivity. In addition, it is preferable that the binder is contained in the 1st extraction wiring 26 and the 2nd extraction wiring 30 from the point which adhesiveness with the board
  • the flexible printed wiring board 32 is a board in which a plurality of wirings and terminals are provided on a substrate, and is connected to each other end of the first lead wiring 26 and each other end of the second lead wiring 30 to electrostatically It plays a role of connecting the capacitive touch panel sensor 160 and an external device (for example, a display device).
  • an appropriate sensing environment can be obtained even when the size of the input region (sensing unit) capable of detecting contact of an object of the capacitive touch panel sensor is 5 inches or more, and more preferably, the size is 8 inches. As described above, if it is more preferably 10 inches or more, a high effect can be exhibited in suppressing malfunction.
  • the shape of the input area indicated by the size is a rectangular shape.
  • the manufacturing method of the capacitive touch panel sensor 160 is not particularly limited, and a known method can be adopted. For example, there is a method in which a photoresist film on the metal foil formed on both main surfaces of the substrate 22 is exposed and developed to form a resist pattern, and the metal foil exposed from the resist pattern is etched. Further, there is a method in which a paste containing metal fine particles or metal nanowires is printed on both main surfaces of the substrate 22 and metal plating is performed on the paste. Moreover, the method of printing and forming on the board
  • a method using silver halide can be mentioned. More specifically, the step (1) of forming a silver halide emulsion layer (hereinafter also referred to simply as a photosensitive layer) containing silver halide and a binder on both surfaces of the substrate 22, respectively, exposing the photosensitive layer. Then, the method which has the process (2) which carries out image development processing is mentioned. Below, each process is demonstrated.
  • a silver halide emulsion layer hereinafter also referred to simply as a photosensitive layer
  • Step (1) is a step of forming a photosensitive layer containing silver halide and a binder on both surfaces of the substrate 22.
  • the method for forming the photosensitive layer is not particularly limited, but from the viewpoint of productivity, the photosensitive layer forming composition containing silver halide and a binder is brought into contact with the substrate 22, and the photosensitive layer is formed on both surfaces of the substrate 22.
  • the method of forming is preferred. Below, after explaining in full detail the aspect of the composition for photosensitive layer formation used with the said method, the procedure of a process is explained in full detail.
  • the photosensitive layer forming composition contains a silver halide and a binder.
  • the halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof.
  • As the silver halide for example, silver halides mainly composed of silver chloride, silver bromide and silver iodide are preferably used, and silver halides mainly composed of silver bromide and silver chloride are preferably used.
  • the kind of binder used is as above-mentioned.
  • the binder may be contained in the composition for photosensitive layer formation in the form of latex.
  • the volume ratio of the silver halide and the binder contained in the composition for forming the photosensitive layer is not particularly limited, and is appropriately adjusted so as to be within a preferable volume ratio range of the metal and the binder in the conductive thin wire 34 described above. Is done.
  • the composition for forming a photosensitive layer contains a solvent, if necessary.
  • the solvent used include water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethyl sulfoxide, esters such as ethyl acetate, ethers, and the like. Etc.), ionic liquids, or mixed solvents thereof.
  • the content of the solvent used is not particularly limited, but is preferably 30 to 90% by mass and more preferably 50 to 80% by mass with respect to the total mass of silver halide and binder.
  • the method for bringing the composition for forming a photosensitive layer and the substrate 22 into contact with each other is not particularly limited, and a known method can be adopted.
  • substrate 22 in the composition for photosensitive layer formation, etc. are mentioned.
  • the content of the binder in the formed photosensitive layer is not particularly limited but is preferably 0.3 ⁇ 5.0g / m 2, more preferably 0.5 ⁇ 2.0g / m 2.
  • the content of the silver halide in the photosensitive layer is not particularly limited, but is preferably 1.0 to 20.0 g / m 2 in terms of silver from the viewpoint that the conductive properties of the conductive fine wire 34 are more excellent. 0 to 15.0 g / m 2 is more preferable.
  • the protective layer By providing the protective layer, scratches can be prevented and mechanical properties can be improved.
  • Step (2) Exposure and development step
  • the photosensitive layer obtained in the above step (1) is subjected to pattern exposure and then developed to thereby perform the first detection electrode 24 and the first lead wiring 26, and the second detection electrode 28 and the second detection electrode 28.
  • This is a step of forming two lead-out wirings 30.
  • the pattern exposure process will be described in detail below, and then the development process will be described in detail.
  • the silver halide in the photosensitive layer in the exposed region forms a latent image.
  • a detection electrode and a lead-out wiring are formed by a development process described later.
  • the silver halide dissolves and flows out of the photosensitive layer during the fixing process described later, and a transparent film is obtained.
  • the light source used in the exposure is not particularly limited, and examples thereof include light such as visible light and ultraviolet light, and radiation such as X-rays.
  • the method for performing pattern exposure is not particularly limited. For example, surface exposure using a photomask may be performed, or scanning exposure using a laser beam may be performed.
  • the shape of the pattern is not particularly limited, and is appropriately adjusted according to the pattern of the conductive fine wire to be formed.
  • the development processing method is not particularly limited, and a known method can be employed.
  • a usual development processing technique used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.
  • the type of the developer used in the development process is not particularly limited.
  • PQ developer, MQ developer, MAA developer and the like can be used.
  • Commercially available products include, for example, CN-16, CR-56, CP45X, FD-3, Papitol, C-41, E-6, RA-4, D-19, D-72 prescribed by KODAK.
  • a developer contained in a kit thereof can be used.
  • a lith developer can also be used.
  • the development process can include a fixing process performed for the purpose of removing and stabilizing the silver salt in the unexposed part.
  • a technique of fixing process used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.
  • the fixing temperature in the fixing step is preferably 20 to 50 ° C., more preferably 25 to 45 ° C.
  • the fixing time is preferably 5 seconds to 1 minute, more preferably 7 to 50 seconds.
  • the mass of the metallic silver contained in the exposed area (detection electrode and lead-out wiring) after the development treatment is preferably a content of 50% by mass or more with respect to the mass of silver contained in the exposed area before the exposure. 80% by mass or more is more preferable. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.
  • the following undercoat layer forming step, antihalation layer forming step, or heat treatment may be performed as necessary.
  • Undercoat layer forming process For the reason of excellent adhesion between the substrate 22 and the silver halide emulsion layer, it is preferable to perform a step of forming an undercoat layer containing the binder on both sides of the substrate 22 before the step (1).
  • the binder used is as described above.
  • the thickness of the undercoat layer is not particularly limited, but is preferably from 0.01 to 0.5 ⁇ m, more preferably from 0.01 to 0.1 ⁇ m, from the viewpoint that the adhesiveness and the rate of change in mutual capacitance can be further suppressed.
  • Anti-halation layer formation process From the viewpoint of thinning the conductive thin wire 34, it is preferable to carry out a step of forming antihalation layers on both surfaces of the substrate 22 before the step (1).
  • Step (3) is performed as necessary, and is a step of performing heat treatment after the development processing. By performing this step, fusion occurs between the binders, and the hardness of the detection electrode and the lead-out wiring is further increased.
  • the binder when polymer particles are dispersed as a binder in the composition for forming a photosensitive layer (when the binder is polymer particles in latex), by performing this step, fusion occurs between the polymer particles, A detection electrode and a lead wiring having a desired hardness are formed.
  • the conditions for the heat treatment are appropriately selected depending on the binder to be used, but it is preferably 40 ° C. or higher from the viewpoint of the film forming temperature of the polymer particles, more preferably 50 ° C.
  • the heating time is not particularly limited, but is preferably 1 to 5 minutes, more preferably 1 to 3 minutes from the viewpoint of suppressing curling of the substrate and the like and productivity.
  • this heat treatment can be combined with a drying step usually performed after exposure and development processing, it is not necessary to increase a new step for film formation of polymer particles, and productivity, cost, etc. Excellent from a viewpoint.
  • the light transmissive part containing a binder is formed between detection electrodes (between the conductive thin wires 34) and between extraction wiring.
  • the transmittance in the light transmitting portion is preferably 90% or more, more preferably 95% or more, still more preferably 97% or more, 98% The above is particularly preferable, and 99% or more is most preferable.
  • the light transmissive portion may contain materials other than the binder, and examples thereof include a silver difficult solvent.
  • the capacitive touch panel sensor is not limited to the aspect of FIG. 4 described above, and may be another aspect.
  • the capacitive touch panel sensor 260 is electrically connected to the first substrate 38, the second detection electrode 28 disposed on the first substrate 38, and one end of the second detection electrode 28. Electrically connected to the second lead-out wiring (not shown) disposed on the first substrate 38, the adhesive layer 40, the first detection electrode 24, and one end of the first detection electrode 24.
  • the capacitive touch panel sensor 260 has the same configuration as that of the capacitive touch panel sensor 160 except for the first substrate 38, the second substrate 42, and the adhesive layer 40. Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
  • the definitions of the first substrate 38 and the second substrate 42 are the same as the definition of the substrate 22 described above.
  • the adhesive layer 40 is a layer for bringing the first detection electrode 24 and the second detection electrode 28 into close contact, and is preferably optically transparent (preferably a transparent adhesive layer). As a material constituting the adhesive layer 40, a known material is used. A plurality of first detection electrodes 24 and second detection electrodes 28 in FIG. 7 are used as shown in FIG.
  • the capacitive touch panel sensor 260 shown in FIG. 7 prepares two substrates with electrodes having a substrate, and detection electrodes and lead wires arranged on the substrate surface, so that the electrodes face each other. This corresponds to a capacitive touch panel sensor obtained by bonding through an adhesive layer.
  • the capacitive touch panel sensor 360 is electrically connected to the first substrate 38, the second detection electrode 28 disposed on the first substrate 38, and one end of the second detection electrode 28.
  • a second lead-out wiring (not shown) disposed on the substrate, an adhesive layer 40, a second substrate 42, a first detection electrode 24 disposed on the second substrate 42, and one end of the first detection electrode 24.
  • a first lead-out wiring (not shown) and a flexible printed wiring board (not shown) which are electrically connected and are arranged on the second substrate 42 are provided.
  • the capacitive touch panel sensor 360 shown in FIG. 8 has the same layers as the capacitive touch panel sensor 260 shown in FIG. 7 except that the order of the layers is different.
  • a plurality of first detection electrodes 24 and a plurality of second detection electrodes 28 in FIG. 8 are used as shown in FIG. 4, and both are arranged so as to be orthogonal to each other as shown in FIG.
  • the capacitive touch panel sensor 360 shown in FIG. 8 is provided with two substrates with electrodes each having a substrate and detection electrodes and lead wires arranged on the substrate surface. This corresponds to a capacitive touch panel sensor obtained by bonding through an adhesive layer such that the substrate and the electrode of the other electrode-attached substrate face each other.
  • the manufacturing method of the capacitive touch panel 10 described above is not particularly limited, and a known method can be adopted.
  • a method of forming the upper adhesive layer 18 on the capacitive touch panel sensor 16 for example, an adhesive layer sheet (so-called transparent adhesive film (OCA)) is formed on the capacitive touch panel sensor 16.
  • a liquid pressure sensitive adhesive composition for example, UV curable adhesive or transparent pressure sensitive adhesive (OCR) is applied on the capacitive touch panel sensor 16 A method of applying a curing treatment according to the method is given.
  • the type of the pressure-sensitive adhesive layer sheet and the pressure-sensitive adhesive composition to be used is not particularly limited as long as the formed upper pressure-sensitive adhesive layer 18 satisfies the above characteristics.
  • the protective substrate 20 having the decorative layer 21 disposed on the surface is bonded onto the upper adhesive layer 18 disposed on the capacitive touch panel sensor 16.
  • a method for bonding a known method can be adopted.
  • the method for forming the upper adhesive layer 18 can be used.
  • the display device 12 is bonded onto the lower adhesive layer 14 to manufacture a desired touch panel.
  • a laminate A including a capacitive touch panel sensor 16, a lower adhesive layer 14, and a display device 12 is prepared first, and a protective substrate 20 and an upper adhesive layer 18 on which a decorative layer 21 is separately arranged.
  • a desired touch panel can be manufactured by preparing a laminate B including the above and bonding the laminate A and the laminate B together. Moreover, the pressure deaeration process and the bonding in a vacuum environment can also be performed suitably.
  • the size of the touch panel is not particularly limited, but due to the demand for a larger screen, the diagonal size of the display screen of the display device (synonymous with the input area (sensing unit) that can detect the contact of an object of the capacitive touch panel sensor) Is preferably 5 inches or more, more preferably 10 inches or more. With the touch panel of the present invention, malfunctions are unlikely to occur even in the above sizes. Normally, the size in the diagonal direction of the input area in which the touch of the object of the capacitive touch panel sensor can be detected is changed in accordance with the size of the diagonal line of the display image. The input area indicated by the size is rectangular.
  • the obtained pressure-sensitive adhesive 1 was applied on the surface-treated surface of a 75 ⁇ m-thick release film (heavy release film) so that the thickness of the formed pressure-sensitive adhesive layer was 200 ⁇ m, and the resulting coating film had a thickness of 50 ⁇ m.
  • the surface-treated surface of the release film (light release film) was bonded.
  • the coating film sandwiched between release films is irradiated with UV light so that the irradiation energy is 1 J / cm 2 , and the adhesive is sandwiched between two release films.
  • An adhesive film 1 having a layer was obtained.
  • the pressure-sensitive adhesive composition was prepared by mixing uniformly.
  • a coating layer was formed by coating so as to have a thickness of 75 ⁇ m.
  • a 38 ⁇ m thick polyester film (trade name: Diafoil MRE, manufactured by Mitsubishi Resin Co., Ltd.), one side of which is peeled off with silicone, is placed so that the peeling side of the film is on the coating layer side. And coated. Thereby, the coating layer was shielded from oxygen.
  • the film having the coating layer thus obtained was irradiated with ultraviolet light having an illuminance of 5 mW / cm 2 (measured with Topcon UVR-T1 having a maximum sensitivity of about 350 nm) using a chemical light lamp (manufactured by Toshiba Corporation). Irradiating for 360 seconds to cure the coating layer, an adhesive film 2 having an adhesive layer sandwiched between two release films was produced.
  • the polyester film coated on both sides of the adhesive layer functions as a release liner.
  • Synthesis Example 3 an adhesive film 3 was produced according to the same procedure except that the isobutylene rubber was changed to 14 parts by mass.
  • V-65 was added so as to be 0.4% by mass with respect to the monomer component, and then purged with nitrogen for 10 minutes. Then, when it was made to react for 24 hours in a 50 degreeC thermostat, the transparent viscous solution (polymerization solution) was obtained. Next, this polymerization solution was applied on a release film having a thickness of 50 ⁇ m (a heavy release surface of a therapeutic MIB (T) manufactured by Toray Film Processing Co., Ltd.) with a gap of a knife coater adjusted to 600 ⁇ m, and an oven at 100 ° C. Dry for 8 minutes. The thickness of the pressure-sensitive adhesive layer after drying was 200 ⁇ m.
  • T therapeutic MIB
  • a 38 ⁇ m-thick release film (Purex (registered trademark) A-31 manufactured by Teijin DuPont) was laminated on the adhesive layer, and an adhesive film 4 provided with an adhesive layer sandwiched between two release films.
  • the gap of the knife coater was adjusted to 225 ⁇ m and applied, and an adhesive film 4 having a thickness of 75 ⁇ m after drying was separately prepared.
  • the emulsion after washing with water and desalting was adjusted to pH 6.4 and pAg 7.5, and gelatin 3.9 g, sodium benzenethiosulfonate 10 mg, sodium benzenethiosulfinate 3 mg, sodium thiosulfate 15 mg and chloroauric acid 10 mg were added.
  • Chemical sensitization to obtain optimum sensitivity at 0 ° C. 100 mg of 1,3,3a, 7-tetraazaindene as stabilizer and 100 mg of proxel (trade name, manufactured by ICI Co., Ltd.) as preservative It was.
  • the finally obtained emulsion contains 0.08 mol% of silver iodide, and the ratio of silver chlorobromide is 70 mol% of silver chloride and 30 mol% of silver bromide. It was a silver iodochlorobromide cubic grain emulsion having a coefficient of 9%.
  • Photosensitive layer forming step After subjecting a polyethylene terephthalate (PET) film having a thickness of 100 ⁇ m to corona discharge treatment, a gelatin layer having a thickness of 0.1 ⁇ m as an undercoat layer on both sides of the PET film, and an optical density of about 1.0 on the undercoat layer. And an antihalation layer containing a dye which is decolorized by alkali in the developer. On the antihalation layer, the composition for forming a photosensitive layer was applied, a gelatin layer having a thickness of 0.15 ⁇ m was further provided, and a PET film having a photosensitive layer formed on both sides was obtained. The obtained film is referred to as film A.
  • the formed photosensitive layer had a silver amount of 6.0 g / m 2 and a gelatin amount of 1.0 g / m 2 .
  • Exposure development process As shown in FIG. 4, a high voltage is applied through a photomask in which detection electrodes (first detection electrodes and second detection electrodes) and lead wires (first lead wires and second lead wires) are arranged on both surfaces of the film A. Exposure was performed using parallel light using a mercury lamp as a light source. After the exposure, development was performed with the following developer, and further development processing was performed using a fixing solution (trade name: N3X-R for CN16X, manufactured by Fuji Film Co., Ltd.). Furthermore, by rinsing with pure water and drying, a capacitive touch panel sensor provided with detection electrodes and lead wires made of Ag fine wires on both sides was obtained.
  • the detection electrode is composed of conductive thin wires that intersect in a mesh shape. Further, as described above, the first detection electrode is an electrode extending in the X direction, and the second detection electrode is an electrode extending in the Y direction, and each 4.5-5.0 mm pitch is arranged on the film.
  • a touch panel including a liquid crystal display device, a lower adhesive layer, a capacitive touch panel sensor, an upper adhesive layer, and a glass substrate was manufactured.
  • the types of pressure-sensitive adhesive films used in the production of the lower pressure-sensitive adhesive layer and the upper pressure-sensitive adhesive layer and the size of the display screen are summarized in Table 1 below.
  • As a manufacturing method of the touch panel first, when the upper adhesive layer is bonded onto the capacitive touch panel sensor, one of the adhesive films cut out to a predetermined size is peeled off, and the adhesive layer is removed from the capacitive touch panel. Affixed to the sensor and pressed using a 2 kg heavy roller.
  • the other release film is peeled off, and a glass protective substrate of the same size is formed on the upper adhesive layer using a commercially available bonding apparatus (manufactured by FUK). Bonding was performed at a total thickness, an indentation pressure of 100 kPa, and a bonding speed of 30 mm / sec. As shown in FIG. 3B, a decorative layer (thickness: 40 ⁇ m) is disposed in the peripheral area on the surface of the glass protective substrate, and the decorative layer and the upper adhesive layer are in contact with each other. As shown in FIG. Bonding of the capacitive touch panel sensor and the liquid crystal display device (display screen: diagonal size is 10 inches) was performed by the same method using the above-described commercially available bonding device.
  • the adhesive layer After bonding the adhesive layer, each time an autoclave treatment at 60 ° C., 5 atm, 20 minutes was performed to defoam, and a touch panel was produced.
  • the capacitive touch panel sensor used above includes FPC.
  • the adhesive film 4 when the adhesive layer is used for producing the lower adhesive layer, the adhesive layer having a thickness of 200 ⁇ m is used, and when used for producing the upper adhesive layer, the adhesive layer has a thickness of 75 ⁇ m. I used one.
  • the elongation was measured. Specifically, the pressure-sensitive adhesive film produced in Synthesis Example 1 is cut into a predetermined size, and then the release film is peeled off and a plurality of pressure-sensitive adhesive layers are laminated to have a predetermined size (0.4 mm thickness, 20 mm width). , 70 mm long). Next, using a tensile tester (Autograph, Shimadzu Corp.), the sample was sandwiched 10 mm above and below in the longitudinal direction, pulled under conditions of an ambient temperature of 25 ° C.
  • a tensile tester Autograph, Shimadzu Corp.
  • Capacitive Touch Panel 12 Capacitive Touch Panel 12, 58 Display Device 14, 62 Lower Adhesive Layer 16, 60, 260, 360 Capacitive Touch Panel Sensor 18, 54 Upper Adhesive Layer 20, 52 Protective Substrate 21, 50 Decorative Layer 22 Substrate 24 First detection electrode 26 First extraction wiring 28 Second detection electrode 30 Second extraction wiring 32 Flexible printed wiring board 34 Conductive thin wire 36 Grid 38 First substrate 40 Adhesive layer 42 Second substrate 56 Air gap 64 Side surface

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Abstract

La présente invention concerne un écran tactile capacitif qui n'est pas facilement défaillant dans la région d'entrée à proximité d'une couche décorative, même après qu'une longue durée s'est écoulée depuis la fabrication. L'écran tactile capacitif comporte, disposés dans l'ordre suivant, un dispositif d'affichage, une couche adhésive inférieure, un capteur d'écran tactile capacitif, une couche adhésive supérieure et un substrat protecteur. La couche décorative est disposée au niveau de la surface côté dispositif d'affichage du substrat protecteur, le taux d'allongement de la couche adhésive supérieure est d'au moins 1 500 %, et le taux d'allongement de la couche adhésive inférieure n'est pas supérieur à 600 %.
PCT/JP2015/069621 2014-07-16 2015-07-08 Écran tactile capacitif WO2016009913A1 (fr)

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WO2020079883A1 (fr) * 2018-10-16 2020-04-23 日東電工株式会社 Élément optique et dispositif d'affichage d'image

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WO2010027041A1 (fr) * 2008-09-05 2010-03-11 協立化学産業株式会社 Composition de résine photodurcissable pour la stratification d'un matériau optiquement fonctionnel
JP2013256552A (ja) * 2012-06-11 2013-12-26 Soken Chem & Eng Co Ltd 光重合性粘着剤、粘着シートおよびタッチパネル用積層体

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WO2010027041A1 (fr) * 2008-09-05 2010-03-11 協立化学産業株式会社 Composition de résine photodurcissable pour la stratification d'un matériau optiquement fonctionnel
JP2013256552A (ja) * 2012-06-11 2013-12-26 Soken Chem & Eng Co Ltd 光重合性粘着剤、粘着シートおよびタッチパネル用積層体

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Publication number Priority date Publication date Assignee Title
WO2020079883A1 (fr) * 2018-10-16 2020-04-23 日東電工株式会社 Élément optique et dispositif d'affichage d'image
JP2020064160A (ja) * 2018-10-16 2020-04-23 日東電工株式会社 光学部材および画像表示装置

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