WO2015182825A1 - Bonded structure damage detection device - Google Patents

Bonded structure damage detection device Download PDF

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WO2015182825A1
WO2015182825A1 PCT/KR2014/007823 KR2014007823W WO2015182825A1 WO 2015182825 A1 WO2015182825 A1 WO 2015182825A1 KR 2014007823 W KR2014007823 W KR 2014007823W WO 2015182825 A1 WO2015182825 A1 WO 2015182825A1
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adhesive
damage detection
structures
detection device
conductive
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PCT/KR2014/007823
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French (fr)
Korean (ko)
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최진호
권진회
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경상대학교산학협력단
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20Investigating the presence of flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/24Investigating the presence of flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom

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  • the present invention relates to a non-destructive damage detection device for detecting damage to an adhesive structure, and more particularly, to bond a structure using an adhesive including a conductive material and to measure the electrical physical quantity of the adhesive structure to measure defects in the adhesive structure. It relates to an adhesive fastening damage detection device that can be.
  • Non-destructive inspection refers to a method of externally inspecting defects such as pores or cracks in a product or structure or internal coupling of a fastening part without destroying the product or structure. If there is a defect in the product or structure, it can be easily and surely checked if it is destroyed and investigated. However, such a destructive test is wasteful and is not suitable for examining all products or large and expensive structures. do.
  • Non-destructive testing is mainly used for the radiographic method using the radiation and the ultrasonic method using ultrasonic waves, all of the above test method requires expensive equipment, there is a disadvantage that the test time is long. According to the method, defects during initial bonding of the adhesive structure such as adhesive surface contamination and pores of the adhesive structure are not easily detected.
  • the present invention provides a damage detection apparatus for an adhesive structure that detects damage of an adhesive structure in which a pair of structures are adhesively bonded, wherein the damage detection device is adhesively bonded to the pair of structures and includes a conductive adhesive. ; And a measuring unit configured to measure an electrical physical quantity of the adhesive structure by connecting an anode to any one structure of the pair of structures and a cathode connected to the other structure of the pair of structures. It includes.
  • the electrical physical quantity is any one or more selected from resistance, capacitance, or inductive resistance of the pair of structures.
  • the adhesive structure may be a composite structure or an aircraft structure, and when the adhesive structure is an insulator, the damage detection apparatus may include: a conductive coating film encoded on the adhesive structure by a conductive material; It includes more.
  • the conductive coating film the first coating film for coating the outer surface of any one of the pair of structures; And a second coating film coated on an outer surface of another structure of the pair of structures; It includes, The first coating film and the second coating film is spaced apart from each other and is energized through the conductive adhesive portion.
  • Damage detection device of the adhesive structure of the present invention by the above configuration, there is an effect capable of detecting the defect of the adhesive structure difficult to measure with a conventional radiation or ultrasonic non-destructive inspection device.
  • FIG. 2 is a cross-sectional schematic view of the damage detection apparatus according to an embodiment of the present invention
  • cathode 125 main body
  • conductive coating film 151 first coating film
  • first structure 300 second structure
  • the conductive adhesive part 110 may be composed of 95 to 99.9 wt% of epoxy and 0.1 to 5 wt% of carbon nanotubes. More preferably, it may be composed of 97 to 99.5% by weight of epoxy and 0.5 to 3% by weight of carbon nanotubes.
  • the conductive adhesive 110 may be composed of 95 to 99.9 wt% of epoxy and 0.1 to 5 wt% of carbon nanofibers. More preferably, it may be composed of 97 to 99.5% by weight of epoxy and 0.5 to 3% by weight of carbon nanofibers.
  • the adhesive performance is lowered.
  • the conductivity may be lost. It is preferable to maintain such a weight ratio.
  • a metal material such as silver (Ag) as the conductive material in addition to the above-described embodiment can be expected to increase the conductivity of the adhesive portion of the adhesive structure bonded through the conductive adhesive portion 110.
  • the measuring unit 120 may be configured as a main body 125 for measuring an electrical physical quantity between the positive electrode 121, the negative electrode 122, and the positive electrode 121 and the negative electrode 122. Therefore, the anode 121 abuts on the first structure 200 and the cathode 122 abuts on the second structure 300, and thus, the first structure is formed through the electrical physical quantities of the first structure 200 and the second structure 300. An adhesive defect between the 200 and the second structure 300 is detected.
  • the conductive adhesive part 110 which bonds the first structure 200 and the second structure 300 to each other, is made of a conductive material, so that the first structure 200 and the second structure 300 are energized, and accordingly the first structure ( Defect measurement of the adhesive joint is possible through the electrical physical quantity between the 200 and the second structure 300.
  • the electrical physical quantity may be a resistance, a capacitance, or an inductive resistance.
  • determining whether there is a defect through the electrical physical quantity of the measuring unit 120 for example, by comparing the resistance value of the normal structure and the resistance value of the sample structure, if the resistance value of the sample structure is larger than the resistance value of the normal structure, It may be determined that the adhesive surface of the structure is contaminated or that pores have occurred in the adhesive fastening portion.
  • the measuring unit 120 may be applied to the LCR meter for measuring the electrical resistance.
  • the adhesive fastening unit may be adhesively bonded to the conductive adhesive unit 110 to measure the electrical physical quantity through the measuring unit 200.
  • defect detection of the adhesive fastening portion is possible through the damage detection apparatus 100 according to the first embodiment of the present invention.
  • the damage detection apparatus 100 may further include a conductive coating film 150. That is, the outer surfaces of the adhesive structures 200 and 300 may be coated with a conductive coating film 150 made of a conductive material, and thus the adhesive structures 200 and 300 may be made of a conductive material to measure the electrical physical quantity through the measuring unit 200. Do.
  • the conductive coating film 150 is composed of a first coating film 151 coated on the outer surface of the first structure 200 and a second coating film 152 coated on the outer surface of the second structure 300, the conductive coating film 150 May include carbon nanotubes.
  • first coating film 151 and the second coating film 152 may be configured to be spaced apart from each other. That is, the first coating film 151 and the second coating film 152 may be configured to be energized through the conductive adhesive portion (110).

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
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  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

The present invention relates to a nondestructive damage detection device for detecting damage to bonded structures and, more particularly, to a bonded/fastened portion damage detection device capable of measuring defects inside bonded structures by bonding structures using an adhesive, which comprises an electrically-conductive material, and measuring electric, physical quantities of the bonded structures.

Description

접착 구조물의 손상 탐지 장치Damage detection device of adhesive structure
본 발명은 접착 구조물의 손상 탐지를 위한 비파괴 손상 탐지 장치에 관한 것으로, 더욱 상세하게는 전도성 물질을 포함하는 접착제를 이용하여 구조물을 접착하고 접착구조물의 전기적 물리량을 측정하여 접착 구조물 내부의 결함을 측정할 수 있는 접착 체결부 손상 탐지 장치에 관한 것이다.The present invention relates to a non-destructive damage detection device for detecting damage to an adhesive structure, and more particularly, to bond a structure using an adhesive including a conductive material and to measure the electrical physical quantity of the adhesive structure to measure defects in the adhesive structure. It relates to an adhesive fastening damage detection device that can be.
비파괴 검사란, 제품 또는 구조물 내부의 기공이나 균열과 같은 결함 또는 체결부의 내부 결합 등을 제품 또는 구조물을 파괴하지 않고 외부에서 검사하는 방법을 말한다. 제품 또는 구조에 결함이 있을 경우, 파괴해서 조사하면 그 유무를 쉽고 확실하게 확인할 수 있으나 이러한 파괴검사는 낭비가 많아 모든 제품이나 규모가 크고 고비용의 구조물을 조사하는 데는 적합하지 않기 때문에 비파괴 검사를 선호한다.Non-destructive inspection refers to a method of externally inspecting defects such as pores or cracks in a product or structure or internal coupling of a fastening part without destroying the product or structure. If there is a defect in the product or structure, it can be easily and surely checked if it is destroyed and investigated. However, such a destructive test is wasteful and is not suitable for examining all products or large and expensive structures. do.
비파괴 검사에는 방사선을 이용한 방사선 투과법과 초음파를 이용한 초음파탐상법이 주로 이용되고 있으나, 상기 검사법 모두 고가의 장비가 요구되며, 검사시간이 길어지는 단점이 있다. 상기 방법으로는 접착 구조물의 접착표면오염 및 기공 등의 접착 구조물 초기 접합 시 결함은 검출이 용이하지 않은 단점이 있다. Non-destructive testing is mainly used for the radiographic method using the radiation and the ultrasonic method using ultrasonic waves, all of the above test method requires expensive equipment, there is a disadvantage that the test time is long. According to the method, defects during initial bonding of the adhesive structure such as adhesive surface contamination and pores of the adhesive structure are not easily detected.
따라서 복합재 구조물 또는 항공기 구조물과 같은 접착 구조물의 초기 손상 탐지 및 접착 성능을 평가할 수 있는 비파과 검사 장치의 기술 개발이 요구된다.Therefore, there is a need for the development of a non-penetrating inspection device capable of evaluating the initial damage detection and adhesion performance of adhesive structures such as composite structures or aircraft structures.
본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로서 본 발명의 목적은, 전도성 물질을 포함하는 접착제를 이용하여 접착 구조물을 형성하고, 접착 구조물의 전기적 물리량 예를 들면 저항, 전기용량, 유도 저항 등을 측정하여 접착 구조물 내부의 결함을 측정하게 되는 접착 구조물의 손상 탐지 장치를 제공함에 있다.The present invention has been made to solve the above problems, an object of the present invention is to form an adhesive structure using an adhesive comprising a conductive material, the electrical physical quantity of the adhesive structure, such as resistance, capacitance, induction resistance It is to provide a damage detection device of the adhesive structure to measure the defects in the adhesive structure by measuring the back.
본 발명은 한 쌍의 구조물이 접착 결합되는 접착 구조물의 손상을 탐지하는 접착 구조물의 손상 탐지 장치에 있어서, 상기 손상 탐지 장치는, 상기 한 쌍의 구조물을 접착 결합시키며, 전도성 물질을 포함하는 전도성 접착부; 및 상기 한 쌍의 구조물 중 어느 한 구조물에 양극이 연결되고, 상기 한 쌍의 구조물 중 다른 한 구조물에 음극이 연결되어 상기 접착 구조물의 전기적 물리량을 측정하는 측정부; 를 포함한다.The present invention provides a damage detection apparatus for an adhesive structure that detects damage of an adhesive structure in which a pair of structures are adhesively bonded, wherein the damage detection device is adhesively bonded to the pair of structures and includes a conductive adhesive. ; And a measuring unit configured to measure an electrical physical quantity of the adhesive structure by connecting an anode to any one structure of the pair of structures and a cathode connected to the other structure of the pair of structures. It includes.
이때, 상기 전도성 물질은, 탄소나노튜브 또는 탄소나노섬유이며, 상기 전도성 접합부는, 에폭시 95~99.9중량%와, 탄소나노튜브 0.1~5중량%를 포함하거나, 에폭시 95~99.9중량%와, 탄소나노섬유 0.1~5중량%를 포함한다.In this case, the conductive material is carbon nanotubes or carbon nanofibers, and the conductive bonding portion includes 95 to 99.9 wt% of epoxy and 0.1 to 5 wt% of carbon nanotube, or 95 to 99.9 wt% of epoxy and carbon Contains 0.1 to 5% by weight of nanofibers.
또한, 상기 전기적 물리량은, 상기 한 쌍의 구조물의 저항, 전기용량 또는 유도 저항 중 선택되는 어느 하나 이상이다.In addition, the electrical physical quantity is any one or more selected from resistance, capacitance, or inductive resistance of the pair of structures.
또한, 상기 접착 구조물은, 복합재 구조물 또는 항공기 구조물이며, 상기 접착 구조물이 부도체인 경우, 상기 손상 탐지 장치는, 전도성 물질로 상기 접착 구조물에 코딩되는 전도성 코팅막; 을 더 포함한다.The adhesive structure may be a composite structure or an aircraft structure, and when the adhesive structure is an insulator, the damage detection apparatus may include: a conductive coating film encoded on the adhesive structure by a conductive material; It includes more.
아울러, 상기 전도성 코팅막은, 상기 한 쌍의 구조물 중 어느 한 구조물의 외면을 코팅하는 제1 코팅막; 과, 상기 한 쌍의 구조물 중 다른 한 구조물의 외면에 코팅되는 제2 코팅막; 을 포함하며, 상기 제1 코팅막과 상기 제2 코팅막은 서로 이격 배치되되 상기 전도성 접착부를 통해 통전된다.In addition, the conductive coating film, the first coating film for coating the outer surface of any one of the pair of structures; And a second coating film coated on an outer surface of another structure of the pair of structures; It includes, The first coating film and the second coating film is spaced apart from each other and is energized through the conductive adhesive portion.
상기와 같은 구성에 의한 본 발명의 접착 구조물의 손상 탐지 장치는, 기존의 방사선 또는 초음파 비파괴 검사 장치로는 측정이 난해한 접착 구조물의 결함 검출이 가능한 효과가 있다.Damage detection device of the adhesive structure of the present invention by the above configuration, there is an effect capable of detecting the defect of the adhesive structure difficult to measure with a conventional radiation or ultrasonic non-destructive inspection device.
특히 접착 체결부를 갖는 복합재 구조물 또는 항공기 구조물의 초기 손상 탐지가 가능하고 접착표면오염 및 기공 감지와 같은 접착 성능 평가에 적용이 가능한 장점이 있다. In particular, it is possible to detect the initial damage of the composite structure or aircraft structure having an adhesive fastening, and there is an advantage that can be applied to the evaluation of adhesion performance such as adhesion surface contamination and pore detection.
도 1은 본 발명의 일실시 예에 따른 손상 탐지 장치 사시도1 is a perspective view of a damage detection apparatus according to an embodiment of the present invention
도 2는 본 발명의 일실시 예에 따른 손상 탐지 장치 단면개략도2 is a cross-sectional schematic view of the damage detection apparatus according to an embodiment of the present invention
도 3은 본 발명의 다른 실시 예에 따른 손상 탐지 장치 단면개략도3 is a schematic cross-sectional view of a damage detection apparatus according to another embodiment of the present invention.
-부호의 설명-Explanation of sign
100 : 손상 탐지 장치100: damage detection device
110 : 전도성 접착부110: conductive adhesive portion
120 : 측정기 121 : 양극120: measuring instrument 121: anode
122 : 음극 125 : 본체122: cathode 125: main body
150 : 전도성 코팅막 151 : 제1 코팅막150: conductive coating film 151: first coating film
152 : 제2 코팅막152: second coating film
200 : 제1 구조물 300 : 제2 구조물200: first structure 300: second structure
이하, 상기와 같은 본 발명의 일실시예에 대하여 도면을 참조하여 상세히 설명한다.Hereinafter, an embodiment of the present invention as described above will be described in detail with reference to the accompanying drawings.
도 1에는 본 발명의 일실시 예에 따른 접착 구조물의 손상 탐지 장치(100, 이하 손상 탐지 장치)의 사시도가 도시되어 있다. 도시된 바와 같이 손상 탐지 장치(100)는 전도성 접착부(110) 및 측정부(120)를 포함하여 구성된다. 따라서 손상 탐지 장치(100)는 전도성 접착부(110)를 이용해 한 쌍의 구조물을 접착 결합시킨 접착 구조물에 한하여 손상 탐지가 가능하다.1 is a perspective view of a damage detection device 100 (hereinafter, damage detection device) of an adhesive structure according to an embodiment of the present invention. As shown, the damage detection device 100 includes a conductive adhesive 110 and a measurement unit 120. Therefore, the damage detection apparatus 100 may detect damage only in an adhesive structure in which a pair of structures are adhesively bonded using the conductive adhesive unit 110.
전도성 접착부(110)는 제1 구조물(200)과 제2 구조물(300)을 접착 결합시키기 위한 구성으로, 통상의 접착 물질, 일예로 에폭시(epoxy)와 전도성 물질, 일예로 탄소나노튜브(Carbon nano-tube), 탄소나노섬유(Carbon nano-fiber) 또는 금속물질(metal)을 포함하여 구성된다. 따라서 전도성 접착부(110)는 구조물의 접착을 위한 접착물질에 전도성 물질을 혼합하여 구성될 수 있다.The conductive adhesive 110 is a component for adhesively bonding the first structure 200 and the second structure 300, a common adhesive material, for example epoxy and a conductive material, for example carbon nanotubes (Carbon nano) -tube), carbon nanofibers, or metals. Therefore, the conductive adhesive 110 may be configured by mixing a conductive material with the adhesive material for the adhesion of the structure.
보다 상세하게 전도성 접착부(110)는 에폭시 95~99.9중량%와, 탄소나노튜브 0.1~5중량%로 구성될 수 있다. 보다 바람직하게는 에폭시 97~99.5중량%와, 탄소나노튜브 0.5~3중량%로 구성될 수 있다.In more detail, the conductive adhesive part 110 may be composed of 95 to 99.9 wt% of epoxy and 0.1 to 5 wt% of carbon nanotubes. More preferably, it may be composed of 97 to 99.5% by weight of epoxy and 0.5 to 3% by weight of carbon nanotubes.
전도성 접착부(110)의 전도성을 높이기 위해 탄소나노튜브를 5중량% 이상으로 구성할 경우 접착 성능이 떨어지며, 탄소나노튜브를 0.1중량% 이하로 구성할 경우 전도성을 상실할 수 있기 때문에 상기와 같은 중량비를 유지하는 것이 바람직하다. 전도성 재질로 탄소나노튜브를 적용할 경우 전도성 접착부(110)를 통해 접착된 접착 구조물의 접착부 강도 및 피로 강도가 증가되는 추가 효과도 기대할 수 있다.In order to increase the conductivity of the conductive bonding portion 110, when the carbon nanotubes are composed of 5% by weight or more, the adhesive performance decreases, and when the carbon nanotubes are composed of 0.1% by weight or less, the conductivity may be lost. It is desirable to maintain. When carbon nanotubes are used as the conductive material, an additional effect of increasing the adhesive strength and the fatigue strength of the adhesive structure bonded through the conductive adhesive 110 may also be expected.
다른 실시 예로 전도성 접착부(110)는 에폭시 95~99.9중량%와, 탄소나노섬유 0.1~5중량%로 구성될 수 있다. 보다 바람직하게는 에폭시 97~99.5중량%와, 탄소나노섬유 0.5~3중량%로 구성될 수 있다.In another embodiment, the conductive adhesive 110 may be composed of 95 to 99.9 wt% of epoxy and 0.1 to 5 wt% of carbon nanofibers. More preferably, it may be composed of 97 to 99.5% by weight of epoxy and 0.5 to 3% by weight of carbon nanofibers.
본실시 예 역시 전도성 접착부(110)의 전도성을 높이기 위해 탄소나노섬유를 5중량% 이상으로 구성할 경우 접착 성능이 떨어지며, 탄소나노섬유를 0.1중량% 이하로 구성할 경우 전도성을 상실할 수 있기 때문에 상기와 같은 중량비를 유지하는 것이 바람직하다.  In this embodiment, too, when the carbon nanofibers are composed of 5 wt% or more in order to increase the conductivity of the conductive adhesive part 110, the adhesive performance is lowered. When the carbon nanofibers are composed of 0.1 wt% or less, the conductivity may be lost. It is preferable to maintain such a weight ratio.
아울러 상술된 실시 예 외에 전도성 재질로 은(Ag)과 같은 금속재질을 적용할 경우 전도성 접착부(110)를 통해 접착된 접착 구조물의 접착부 전도성이 증가되는 효과를 기대할 수 있다.In addition, when applying a metal material such as silver (Ag) as the conductive material in addition to the above-described embodiment can be expected to increase the conductivity of the adhesive portion of the adhesive structure bonded through the conductive adhesive portion 110.
측정부(120)는 양극(121), 음극(122) 및 양극(121)과 음극(122) 사이의 전기적 물리량 측정을 위한 본체(125)로 구성될 수 있다. 따라서 양극(121)은 제1 구조물(200)에 맞닿고 음극(122)은 제2 구조물(300)에 맞닿아 제1 구조물(200)과 제2 구조물(300)의 전기적 물리량을 통해 제1 구조물(200)과 제2 구조물(300)의 접착부 결함을 탐지하게 된다.The measuring unit 120 may be configured as a main body 125 for measuring an electrical physical quantity between the positive electrode 121, the negative electrode 122, and the positive electrode 121 and the negative electrode 122. Therefore, the anode 121 abuts on the first structure 200 and the cathode 122 abuts on the second structure 300, and thus, the first structure is formed through the electrical physical quantities of the first structure 200 and the second structure 300. An adhesive defect between the 200 and the second structure 300 is detected.
즉 제1 구조물(200)과 제2 구조물(300)을 접착 결합시킨 전도성 접착부(110)가 전도성 재질로 이루어져 제1 구조물(200)과 제2 구조물(300)이 통전되고, 이에따라 제1 구조물(200)과 제2 구조물(300) 사이의 전기적 물리량을 통해 접착 결합부의 결함 측정이 가능하다.That is, the conductive adhesive part 110, which bonds the first structure 200 and the second structure 300 to each other, is made of a conductive material, so that the first structure 200 and the second structure 300 are energized, and accordingly the first structure ( Defect measurement of the adhesive joint is possible through the electrical physical quantity between the 200 and the second structure 300.
상기 전기적 물리량은 저항, 전기용량(capacitance) 또는 유도 저항(reactance) 일 수 있다.The electrical physical quantity may be a resistance, a capacitance, or an inductive resistance.
측정부(120)의 전기적 물리량을 통해 결함 여부를 판단함에 있어서 일예로정상적인 구조물의 저항 수치와, 샘플 구조물의 저항 수치를 비교하여, 정상 구조물의 저항수치보다 샘플 구조물의 저항 수치가 크다면, 접착 구조물의 접착 표면이 오염되었거나, 접착 체결부에 기공이 발생한 것으로 판단할 수 있다.In determining whether there is a defect through the electrical physical quantity of the measuring unit 120, for example, by comparing the resistance value of the normal structure and the resistance value of the sample structure, if the resistance value of the sample structure is larger than the resistance value of the normal structure, It may be determined that the adhesive surface of the structure is contaminated or that pores have occurred in the adhesive fastening portion.
측정부(120)는 전기 저항 측정을 위한 LCR메타 등이 적용될 수 있다. The measuring unit 120 may be applied to the LCR meter for measuring the electrical resistance.
도 2에는 본 발명의 제1 실시 예에 따른 손상 탐지 장치(100)의 단면개략도가 도시되어 있다. 도시된 바와 같이 접착 구조물(200, 300)이 전도성 재질로 이루어진 경우 접착 체결부를 전도성 접착부(110)로 접착 결합하여 측정부(200)를 통해 전기적 물리량을 측정하는 것이 가능하다.2 is a schematic cross-sectional view of the damage detection apparatus 100 according to the first embodiment of the present invention. As illustrated, when the adhesive structures 200 and 300 are made of a conductive material, the adhesive fastening unit may be adhesively bonded to the conductive adhesive unit 110 to measure the electrical physical quantity through the measuring unit 200.
따라서 대표적인 접착 구조물인 복합재 구조물이나, 항공기 구조물의 경우 본 발명의 제1 실시 예에 따른 손상 탐지 장치(100)를 통해 접착 체결부의 결함 탐지가 가능하다. Therefore, in the case of a composite structure, or an aircraft structure, which is a representative adhesive structure, defect detection of the adhesive fastening portion is possible through the damage detection apparatus 100 according to the first embodiment of the present invention.
도 3에는 본 발명의 제2 실시 예에 따른 손상 탐지 장치(100)의 단면개략도가 도시되어 있다. 도시된 바와 같이 접착 구조물(200, 300)이 통전되지 않는 부도체인 경우 손상 탐지 장치(100)는 전도성 코팅막(150)을 더 포함하여 구성될 수 있다. 즉 접착 구조물(200, 300)의 외면을 전도성 물질로 이루어진 전도성 코팅막(150)으로 코팅하여 접착 구조물(200, 300)을 통전 재질로 구성하여 측정부(200)를 통해 전기적 물리량을 측정하는 것이 가능하다.3 is a schematic cross-sectional view of the damage detection apparatus 100 according to the second embodiment of the present invention. As shown in the drawing, when the adhesive structures 200 and 300 are insulators that are not energized, the damage detection apparatus 100 may further include a conductive coating film 150. That is, the outer surfaces of the adhesive structures 200 and 300 may be coated with a conductive coating film 150 made of a conductive material, and thus the adhesive structures 200 and 300 may be made of a conductive material to measure the electrical physical quantity through the measuring unit 200. Do.
전도성 코팅막(150)은 제1 구조물(200)의 외면에 코팅되는 제1 코팅막(151)과 제2 구조물(300)의 외면에 코팅되는 제2 코팅막(152)으로 구성되며, 전도성 코팅막(150)은 탄소나노튜브를 포함할 수 있다. The conductive coating film 150 is composed of a first coating film 151 coated on the outer surface of the first structure 200 and a second coating film 152 coated on the outer surface of the second structure 300, the conductive coating film 150 May include carbon nanotubes.
이때 제1 코팅막(151)과 제2 코팅막(152)은 서로 이격되도록 구성될 수 있다. 즉 제1 코팅막(151)과 제2 코팅막(152)은 전도성 접착부(110)를 통해 통전되도록 구성될 수 있다. In this case, the first coating film 151 and the second coating film 152 may be configured to be spaced apart from each other. That is, the first coating film 151 and the second coating film 152 may be configured to be energized through the conductive adhesive portion (110).
본 발명의 상기한 실시 예에 한정하여 기술적 사상을 해석해서는 안된다. 적용범위가 다양함은 물론이고, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당업자의 수준에서 다양한 변형 실시가 가능하다. 따라서 이러한 개량 및 변경은 당업자에게 자명한 것인 한 본 발명의 보호범위에 속하게 된다.The technical spirit should not be interpreted as being limited to the above embodiments of the present invention. Various modifications may be made at the level of those skilled in the art without departing from the spirit of the invention as claimed in the claims. Therefore, such improvements and modifications fall within the protection scope of the present invention as long as it will be apparent to those skilled in the art.

Claims (8)

  1. 한 쌍의 구조물이 접착 결합되는 접착 구조물의 손상을 탐지하는 접착 구조물의 손상 탐지 장치에 있어서,In the damage detection device of the adhesive structure for detecting the damage of the adhesive structure to which the pair of structures are adhesively bonded,
    상기 손상 탐지 장치는,The damage detection device,
    상기 한 쌍의 구조물을 접착 결합시키며, 전도성 물질을 포함하는 전도성 접착부; 및A conductive adhesive portion that bonds the pair of structures together and includes a conductive material; And
    상기 한 쌍의 구조물 중 어느 한 구조물에 양극이 연결되고, 상기 한 쌍의 구조물 중 다른 한 구조물에 음극이 연결되어 상기 접착 구조물의 전기적 물리량을 측정하는 측정부;A measuring unit configured to measure an electrical physical quantity of the adhesive structure by connecting an anode to any one structure of the pair of structures and a cathode connected to the other structure of the pair of structures;
    를 포함하는, 접착 구조물의 손상 탐지 장치.Including, damage detection device of the adhesive structure.
  2. 제 1항에 있어서,The method of claim 1,
    상기 전도성 물질은, 탄소나노튜브 또는 탄소나노섬유인 것을 특징으로 하는, 접착 구조물의 손상 탐지 장치.The conductive material is carbon nanotubes or carbon nanofibers, characterized in that the damage detection device of the adhesive structure.
  3. 제 2항에 있어서,The method of claim 2,
    상기 전도성 접합부는, The conductive junction,
    에폭시 95~99.9중량%와, 탄소나노튜브 0.1~5중량%를 포함하는, 접착 구조물의 손상 탐지 장치.The damage detection apparatus of the adhesive structure containing 95 to 99.9 weight% of epoxy, and 0.1 to 5 weight% of carbon nanotubes.
  4. 제 2항에 있어서,The method of claim 2,
    상기 전도성 접합부는, The conductive junction,
    에폭시 95~99.9중량%와, 탄소나노섬유 0.1~5중량%를 포함하는, 접착 구조물의 손상 탐지 장치.The damage detection apparatus of the adhesive structure containing 95 to 99.9 weight% of epoxy and 0.1 to 5 weight% of carbon nanofibers.
  5. 제 1항에 있어서,The method of claim 1,
    상기 전기적 물리량은, The electrical physical quantity is,
    상기 한 쌍의 구조물의 저항, 전기용량 또는 유도 저항 중 선택되는 어느 하나 이상인, 접착 구조물의 손상 탐지 장치.The damage detection device of the adhesive structure, any one or more selected from the resistance, capacitance or inductive resistance of the pair of structures.
  6. 제 1항에 있어서,The method of claim 1,
    상기 접착 구조물은,The adhesive structure,
    복합재 구조물 또는 항공기 구조물인, 접착 구조물의 손상 탐지 장치.Damage detection device for adhesive structures, which are composite structures or aircraft structures.
  7. 제 1항에 있어서,The method of claim 1,
    상기 접착 구조물이 부도체인 경우,If the adhesive structure is an insulator,
    상기 손상 탐지 장치는,The damage detection device,
    전도성 물질로 상기 접착 구조물에 코딩되는 전도성 코팅막; A conductive coating film encoded on the adhesive structure with a conductive material;
    을 더 포함하는, 접착 구조물의 손상 탐지 장치.Further comprising a damage detection device of the adhesive structure.
  8. 제 7항에 있어서,The method of claim 7, wherein
    상기 전도성 코팅막은, The conductive coating film,
    상기 한 쌍의 구조물 중 어느 한 구조물의 외면을 코팅하는 제1 코팅막; 과, 상기 한 쌍의 구조물 중 다른 한 구조물의 외면에 코팅되는 제2 코팅막; 을 포함하며,A first coating film coating an outer surface of any one of the pair of structures; And a second coating film coated on an outer surface of another structure of the pair of structures; Including;
    상기 제1 코팅막과 상기 제2 코팅막은 서로 이격 배치되되 상기 전도성 접착부를 통해 통전되는, 접착 구조물의 손상 탐지 장치.The first coating layer and the second coating layer is spaced apart from each other and is energized through the conductive adhesive, damage detection device of the adhesive structure.
PCT/KR2014/007823 2014-05-28 2014-08-22 Bonded structure damage detection device WO2015182825A1 (en)

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