WO2015139194A1 - Led支架及led发光体 - Google Patents

Led支架及led发光体 Download PDF

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Publication number
WO2015139194A1
WO2015139194A1 PCT/CN2014/073577 CN2014073577W WO2015139194A1 WO 2015139194 A1 WO2015139194 A1 WO 2015139194A1 CN 2014073577 W CN2014073577 W CN 2014073577W WO 2015139194 A1 WO2015139194 A1 WO 2015139194A1
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WIPO (PCT)
Prior art keywords
led
dam
plastic
plating layer
reflector cup
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Ceased
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PCT/CN2014/073577
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English (en)
French (fr)
Inventor
游志
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Shenzhen Refond Optoelectronics Co Ltd
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Shenzhen Refond Optoelectronics Co Ltd
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Priority to PCT/CN2014/073577 priority Critical patent/WO2015139194A1/zh
Publication of WO2015139194A1 publication Critical patent/WO2015139194A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Definitions

  • the present invention relates to the field of LED lighting technologies, and in particular, to an LED bracket and an LED illuminator.
  • LED is one of the widely used light sources.
  • the dam is usually made around the chip to facilitate the coating of fluorescent glue or encapsulant, or to block the absorption of light by the sidewall of the chip.
  • the existing dam manufacturing method is to make a dam on the substrate before packaging, and then install the chips one by one in the middle of the dam. This method is complicated, the efficiency is low, the cost is increased, and the dam is independent. On the substrate, long-term use has a hidden danger, which affects the reliability of the LED.
  • the LED holder includes a metal substrate and a plastic reflective cup disposed on the metal substrate, and a raised dam for mounting the LED chip is disposed in an area enclosed by the plastic reflective cup, the dam and the plastic
  • the reflector cup is integrally formed, and the depth of the dam is 1/3 to 3 times of the thickness of the LED chip.
  • the dam has two sets of opposite inner sides, and the angles of the opposite inner sides of each group are less than 120°.
  • Another object of the present invention is to provide an LED illuminator comprising the LED cradle, wherein the dam of the LED cradle is provided with an LED chip.
  • the LED bracket provided by the invention integrally forms the plastic reflector cup and the dam directly on the metal substrate, does not need to separately set the dam, saves the process and improves the production efficiency; and, because the dam and the plastic reflector cup are integrally formed, The metal substrate is wrapped, so that the dam is less likely to be deformed or peeled off, and the bonding force between the plastic reflector cup and the metal substrate is also enhanced, and the adhesion is improved.
  • the reliability of the LED; the depth of the dam is designed to be 1/3 to 3 times the thickness of the LED chip, and the opening angle of each of the opposite inner sides is limited to 120°, which avoids side light absorption and ensures The normal light output on the front side of the chip improves the luminous efficiency of the LED illuminator.
  • the dam can be used as a cup for coating fluorescent glue to facilitate dispensing.
  • FIG. 1 is a front elevational view of an LED bracket provided by an embodiment of the present invention.
  • Figure 2 is a cross-sectional view taken along the line A-A of the LED holder shown in Figure 1;
  • Figure 3 is a cross-sectional view taken along the line B-B of the LED holder shown in Figure 1.
  • an LED bracket provided by an embodiment of the present invention includes a metal substrate 1 and a plastic reflective cup 2 disposed on the metal substrate 1 , and a protrusion is disposed on the metal substrate 1 in a region enclosed by the plastic reflective cup 2 .
  • the dam 3, the dam 3 and the plastic reflector cup 2 are integrally formed and have the same material.
  • the size of the dam 3 is slightly larger than the size of the LED chip 4 for mounting the LED chip 4. 2 and 3, the depth of the dam 3 is 1/3 to 3 times the thickness of the LED chip 4, and more preferably 1 to 2 times.
  • the dam 3 is formed by two sets of opposite side walls, forming a square barrier structure, the inner side surface of which is a quadrangular prism shape, the bottom dimension is smaller than the size of the upper end opening, and the inner side surface is composed of two sets of opposite inner sides, that is, The first inner side surface 31 and the second inner side surface 32, and the opening angles ⁇ and ⁇ of the two first inner side surfaces 31 and the two second inner side surfaces 32 are both less than 120°.
  • the metal plating layer may be a laminated structure of one or more of a gold plating layer, a silver plating layer, a copper plating layer, a nickel plating layer, and a palladium plating layer for electrically connecting the LED chip 4 and the power supply line.
  • the dam 3 of the LED bracket is mainly used to prevent the side of the LED chip 4 from absorbing light.
  • the dam 3 is provided on the metal substrate 1 to effectively solve the problem.
  • the dam depth is set to 1/3 to 3 times the thickness of the LED chip 4 according to the angle at which the light is directed toward the side of the chip and the light exit angle of the front surface of the chip, and the two first inner sides 31 and the two second inner portions are simultaneously provided.
  • the opening angles of the side faces 32 are all limited to 120°, and the above-mentioned depth and angle matching can prevent the light from being irradiated to the side surface of the LED chip 4, thereby avoiding side light absorption.
  • the embodiment of the present invention directly forms the plastic reflective cup 2 and the dam 3 on the metal substrate 1 to solve the problem of light absorption on the side of the chip, and does not need to separately set the dam 3 on the metal substrate 1 to save The process is improved, and the production efficiency is improved. Moreover, since the dam 3 and the metal substrate 1 are integrally formed, the dam 3 is less likely to be deformed or peeled off, and the bonding force between the plastic reflector cup 2 and the metal substrate 1 is enhanced, and the bonding force is enhanced. Up LED reliability.
  • the dam 3 is enclosed by two sets of opposite side walls, and a pair of opposite side walls are integrally connected with the plastic reflector cup 2.
  • the plastic reflector cup 2 can be rectangular, circular, elliptical, square, or the like.
  • the plastic reflector cup 2 is rectangular, and a pair of opposite side walls of the dam 3 are adjacent to the plastic reflector cup 2, and the set of side walls are integrally connected with the plastic reflector cup 2.
  • the present invention can also adopt other connection methods, and is not necessarily limited to the above structure.
  • the material of the dam 3 and the plastic reflector cup 2 may be a thermosetting or thermoplastic high-reflection plastic material such as PPA, PCT, epoxy resin or silica gel, which has good plasticity and stability, and is good for reflection of light, reducing absorption and improving. The light output efficiency.
  • each LED chip 4 is disposed in each dam 3, and a plastic reflector cup 2 is arranged on the periphery of each dam 3, as shown in FIG. 2 and FIG. 3, and of course, it can also be enclosed in a plastic reflector cup 2.
  • a plurality of dams 3 are disposed in the area, and one LED chip 4 is installed in each dam 3.
  • each plastic reflector cup 2 is provided with three dams 3, respectively, which are provided with red, green and blue LED chips, so that each plastic reflector cup 2 and its enclosed internal structure constitute a white light unit.
  • other methods are also possible, for example, it is feasible to provide two or more dams 3 in each of the plastic reflector cups 2.
  • the fluorescent glue or the transparent encapsulant is filled in the plastic reflective cup 2, and the dam 3 can be combined. Filling up may also cover only the LED chip 4 and the dam 3. That is, when the size of the dam 3 is large, the fluorescent glue or the transparent encapsulant will fill the dam 3. When the size of the dam 3 is small, the fluorescent glue or the transparent encapsulant only covers the dam 3 or fills the dam a small amount. 3 internal, these two conditions will not affect the LED light, this embodiment will not repeat them.
  • the present invention further provides an LED illuminator comprising the above-described LED holder and an LED chip 4 disposed in the dam 3 of the LED holder.
  • the LED chips 4 may be disposed one-to-one in the dam 3, or may be disposed in the dam 3 in a one-to-one manner according to special requirements.
  • the depth and height of the dam 3 are as described above to prevent the side of the LED chip 4 from absorbing light and to ensure that the front side thereof is normally lighted.
  • the plastic reflector cup 2 is filled with a fluorescent glue or a transparent encapsulant, and the fluorescent glue or transparent encapsulant can fill the dam 3 or cover the dam 3.
  • the LED illuminator adopts the LED bracket provided by the invention, and the dam and the plastic reflector cup are integrally formed, and there is no need to separately set a dam on the metal substrate, which saves the process, improves the production efficiency, and enhances the stability of the LED. And reliability, improve product quality.

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  • Led Device Packages (AREA)

Abstract

一种LED支架，包括金属基板（1）以及设于金属基板（1）上的塑胶反射杯（2），于塑胶反射杯（2）围合的区域设有用于安装LED芯片（4）的凸起的围坝（3），围坝（3）与塑胶发射杯（2）一体成型，围坝（3）的深度为LED芯片（4）的厚度的1/3-3倍，围坝（3）的每组相对的内侧面的张角均小于120°。

Description

LED支架及LED发光体 技术领域
本发明涉及LED照明技术领域，尤其涉及一种LED支架及LED发光体。
 背景技术
LED是目前应用较为广泛的光源之一，在LED的制作过程中，通常在芯片四周制作围坝，以便于涂覆荧光胶或封装胶，或是阻挡芯片侧壁对光的吸收。现有的围坝制作方法是在封装前于基板上制作围坝，然后将芯片一一安装在围坝中间，这种方式工序复杂，效率较低，也增加了成本，并且由于围坝是独立于基板上，长久使用有变形隐患，影响LED的可靠性。
 技术问题
本发明的目的在于提供一种新型的LED支架，旨在简化工序，提高生产效率，并提高其可靠性。
 技术解决方案
本发明是这样实现的， LED支架，包括金属基板以及设于所述金属基板上的塑胶反射杯，于所述塑胶反射杯围合的区域设有用于安装LED芯片的凸起的围坝，所述围坝与所述塑胶反射杯一体成型，所述围坝的深度为LED芯片的厚度的1/3~3倍，所述围坝具有两组相对的内侧面，每组相对的内侧面的张角均小于120°。
本发明的另一目的在于提供一种LED发光体，包括所述的LED支架，所述LED支架的所述围坝内设有LED芯片。
 有益效果
本发明提供的LED支架直接在金属基板上一体成型塑胶反射杯和围坝，不需要单独设置围坝，节约了工序，提高了生产效率；并且，由于围坝与塑胶反射杯一体成型，且可以将金属基板包裹，使得围坝不易出现变形、剥离等可能性，也加强了塑胶反射杯与金属基板的结合力，提高了 LED的可靠性；将围坝的深度设计为LED芯片的厚度的1/3~3倍，同时将每组相对的内侧面的张角限定在120°以内，既避免了侧面吸光，又保证了芯片正面的正常出光，提高了LED发光体的发光效率，另外，围坝可以作为涂覆荧光胶的碗杯，便于点胶。
 附图说明
图1是本发明实施例提供的LED支架的正视图；
图2是图1所示 LED支架的A-A向剖视图；
图3是图1所示 LED支架的B-B向剖视图。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
请参阅图1，本发明实施例提供的LED支架包括金属基板1以及设于金属基板1上的塑胶反射杯2，在塑胶反射杯2围合的区域内设有凸起于金属基板1之上的围坝3，围坝3与塑胶反射杯2一体成型，材质相同。围坝3的尺寸略大于LED芯片4的尺寸，用于安装LED芯片4。进一步参阅图2、3，围坝3的深度为LED芯片4的厚度的1/3~3倍，进一步优选为1~2倍。围坝3由两组相对的侧壁围合而成，形成方形的壁垒结构，其内侧面为四棱台形，底部尺寸小于上端开口的尺寸，其内侧面由两组相对的内侧面构成，即第一内侧面31和第二内侧面32，且两个第一内侧面31和两个第二内侧面32的张角α和β均小于120°。另外，金属镀层可以为金镀层、银镀层、铜镀层、镍镀层及钯镀层中的一种或者几种的层叠结构，用于实现LED芯片4与供电线路的电性连接。
该LED支架的围坝3主要用于防止LED芯片4侧面吸光，对于侧面不发光的LED芯片，本身发出的光和其他芯片发出的光照射到其侧面会被大量吸收，造成光损失，本实施例在金属基板1上设置围坝3可有效解决该问题。根据光线射向芯片侧面的角度以及芯片正面的出光角度，将围坝深度设定为LED芯片4的厚度的1/3~3倍，同时将两个第一内侧面31和两个第二内侧面32的张角均限定在120°以内，上述深度及角度配合，可以使光线无法照射到LED芯片4的侧面，避免侧面吸光。
本发明实施例与现有技术相比，直接在金属基板1上一体成型塑胶反射杯2和围坝3，以解决芯片侧面吸光的问题，不需要在金属基板1上另设围坝3，节约了工序，提高了生产效率；并且，由于围坝3与金属基板1一体成型，使得围坝3不易出现变形、剥离等可能性，也加强了塑胶反射杯2与金属基板1的结合力，提高了 LED的可靠性。
在本实施例中，围坝3由两组相对的侧壁围合而成，其中一组相对的侧壁与塑胶反射杯2连接为一体。塑胶反射杯2可以为矩形、圆形、椭圆形、方形等。如图1，作为一种可选的方式，塑胶反射杯2为矩形，围坝3的一组相对的侧壁靠近塑胶反射杯2，该组侧壁与塑胶反射杯2连接为一体。当然，本实用新型还可以采用其他连接方式，不必局限于上述结构。
进一步地，围坝3与塑胶反射杯2的材质可以是PPA、PCT、环氧树脂、硅胶等热固性或热塑性的高反射塑胶材料，可塑性及稳定性好，并且利于光的反射，减少吸收，提高了出光效率。
在本实施例中，每个围坝3内设置一个LED芯片4，每个围坝3外围设有一个塑胶反射杯2，如图2、3，当然，还可以在一个塑胶反射杯2围合的区域内设置多个围坝3，每个围坝3内安装一个LED芯片4。例如，每个塑胶反射杯2内设有三个围坝3，分别设置红、绿、蓝光LED芯片，这样，每个塑胶反射杯2以及其围合的内部结构构成一个白光单元。不仅如此，还可以采用其他方式，例如在每个塑胶反射杯2中设置两个或更多个围坝3等均是可行的。
进一步地，在LED的制造过程中，在设置好塑胶反射杯2并安装好芯片之后，需进行点胶过程，将荧光胶或透明封装胶填充塑胶反射杯2内，可以将围坝3一并填满，也可以只覆盖于LED芯片4和围坝3之外。即：当围坝3尺寸较大时，荧光胶或透明封装胶会填充围坝3，当围坝3尺寸较小时，荧光胶或透明封装胶只覆盖于围坝3之上或者少量填充围坝3内部，这两种情况都不会影响LED出光，本实施例不再赘述。
本发明进一步提供一种LED发光体，包括上述的LED支架，以及设置于LED支架的围坝3内的LED芯片4。该LED芯片4可以一对一的设置于围坝3内，也可以按照特殊要求多对一的设置于围坝3内。围坝3的深度和高度如上所述，以避免LED芯片4侧面吸光并保证其正面正常出光。
进一步地，在塑胶反射杯2内填充有荧光胶或透明封装胶，该荧光胶或透明封装胶可以充满围坝3或覆盖于围坝3之外。
该LED发光体采用了本发明提供的LED支架，其围坝与塑胶反射杯一体成型，不需要在金属基板上另设围坝，节省了工序，提高了生产效率，并增强了LED的稳定性和可靠性，提高了产品质量。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (9)

  1. LED支架，其特征在于，包括金属基板以及设于所述金属基板上的塑胶反射杯，于所述塑胶反射杯围合的区域设有用于安装LED芯片的凸起的围坝，所述围坝与所述塑胶反射杯一体成型，所述围坝的深度为LED芯片的厚度的1/3~3倍，所述围坝具有两组相对的内侧面，每组相对的内侧面的张角均小于120°。
  2. 如权利要求1所述的LED支架，其特征在于，所述围坝由两组相对的侧壁围合而成，其中一组相对的侧壁与所述塑胶反射杯连接为一体。
  3. 如权利要求1或2所述的LED支架，其特征在于，所述塑胶反射杯的杯底为矩形、圆形或方形。
  4. 如权利要求1或2所述的LED支架，其特征在于，所述塑胶反射杯和围坝的材质为热固性或热塑性高反射塑胶材料。
  5. 如权利要求1所述的LED支架，其特征在于，所述金属基板的表面设有金属镀层，所述金属镀层为金镀层、银镀层、铜镀层、镍镀层及钯镀层中的一种或者几种的层叠结构。
  6. 一种LED发光体，其特征在于，包括权利要求1至5任一项所述的LED支架，所述LED支架的所述围坝内设有LED芯片。
  7. 如权利要求6所述的LED发光体，其特征在于，于所述塑胶反射杯内填充有荧光胶或透明封装胶。
  8. 如权利要求7所述的LED发光体，其特征在于，所述围坝内部充满所述荧光胶或透明封装胶。
  9. 如权利要求7所述的LED发光体，其特征在于，所述荧光胶或透明封装胶覆盖于所述围坝之外。
PCT/CN2014/073577 2014-03-18 2014-03-18 Led支架及led发光体 Ceased WO2015139194A1 (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114864427A (zh) * 2022-04-29 2022-08-05 深圳市同一方光电技术有限公司 光源自动补胶减胶设备
CN115343888A (zh) * 2022-07-29 2022-11-15 深圳市德仓科技有限公司 一种驱动电路板、灯板及制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940704B2 (en) * 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
CN101859866A (zh) * 2010-04-09 2010-10-13 江苏伯乐达光电科技有限公司 用于制造led的支架、大功率白光led封装方法
CN202352723U (zh) * 2011-11-11 2012-07-25 佛山市国星光电股份有限公司 具有均匀荧光粉涂布结构的led器件
CN202423375U (zh) * 2011-12-05 2012-09-05 深圳市瑞丰光电子股份有限公司 发光二极管封装结构
CN202561533U (zh) * 2012-05-30 2012-11-28 深圳市红绿蓝光电科技有限公司 一种大功率led灯及包括该led灯的照明装置
CN103872218A (zh) * 2014-03-18 2014-06-18 深圳市瑞丰光电子股份有限公司 Led支架及led发光体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940704B2 (en) * 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
CN101859866A (zh) * 2010-04-09 2010-10-13 江苏伯乐达光电科技有限公司 用于制造led的支架、大功率白光led封装方法
CN202352723U (zh) * 2011-11-11 2012-07-25 佛山市国星光电股份有限公司 具有均匀荧光粉涂布结构的led器件
CN202423375U (zh) * 2011-12-05 2012-09-05 深圳市瑞丰光电子股份有限公司 发光二极管封装结构
CN202561533U (zh) * 2012-05-30 2012-11-28 深圳市红绿蓝光电科技有限公司 一种大功率led灯及包括该led灯的照明装置
CN103872218A (zh) * 2014-03-18 2014-06-18 深圳市瑞丰光电子股份有限公司 Led支架及led发光体

Cited By (2)

* Cited by examiner, † Cited by third party
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CN114864427A (zh) * 2022-04-29 2022-08-05 深圳市同一方光电技术有限公司 光源自动补胶减胶设备
CN115343888A (zh) * 2022-07-29 2022-11-15 深圳市德仓科技有限公司 一种驱动电路板、灯板及制备方法

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