WO2015139191A1 - 一种led封装支架及led发光体 - Google Patents

一种led封装支架及led发光体 Download PDF

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Publication number
WO2015139191A1
WO2015139191A1 PCT/CN2014/073570 CN2014073570W WO2015139191A1 WO 2015139191 A1 WO2015139191 A1 WO 2015139191A1 CN 2014073570 W CN2014073570 W CN 2014073570W WO 2015139191 A1 WO2015139191 A1 WO 2015139191A1
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Prior art keywords
cup
led
plastic
led package
plastic layer
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English (en)
French (fr)
Inventor
游志
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Shenzhen Refond Optoelectronics Co Ltd
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Shenzhen Refond Optoelectronics Co Ltd
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Priority to PCT/CN2014/073570 priority Critical patent/WO2015139191A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Definitions

  • the present invention relates to the field of LED lighting technologies, and in particular, to an LED package holder and an LED illuminator.
  • LED is one of the widely used light sources.
  • the dam is usually made around the chip to facilitate the coating of fluorescent glue or encapsulant, or to block the absorption of light by the sidewall of the chip.
  • the existing dam manufacturing method is to make a dam on the substrate before packaging, and then install the chips one by one in the middle of the dam. This method is complicated, the efficiency is low, the cost is increased, and the dam is independent. On the substrate, long-term use has a hidden danger, which affects the reliability of the LED.
  • an LED package holder comprising a metal substrate having a sink cup formed integrally therewith, the inner side of the sink cup having a plastic layer, the plastic a layer extending from the inner side facing the periphery of the sink cup to form a cup edge, the vertical distance from the upper surface of the cup edge to the bottom of the sink cup is 1/3 to 3 times the thickness of the LED chip
  • the plastic layer has two sets of opposite inner sides, each of which has an opposite inner side having an opening angle of less than 60°;
  • the LED package bracket further includes a plastic outer cover, and the plastic outer cover is on the metal base
  • the portion above the sheet forms a reflective cup; the reflective cup is formed on the periphery of the sinker cup and is integrally formed with the plastic layer.
  • Another object of the present invention is to provide an LED illuminator comprising the LED package holder, wherein the sink cup of the LED package holder is provided with an LED chip.
  • the LED package bracket provided by the invention directly forms a sink cup on the metal substrate, does not need to additionally set a dam, saves the process and improves the production efficiency; and, the depth of the plastic cup is set to the thickness of the LED chip. 1/3 ⁇ 3 times, and the angle between the two sets of opposite inner sides is limited to 60°. This combination of depth and angle can well avoid the side light absorption of the chip and ensure the normal light output on the front side, and improve the LED.
  • a plastic layer is provided on the surface of the sinking cup to facilitate the above-mentioned depth and angle setting, which can effectively avoid the side absorption of the chip; on the other hand, the reflecting cup and the plastic layer are integrally formed, further strengthening the reflecting cup and the plastic The bonding force between the layer and the metal substrate improves the reliability of the LED.
  • this design not only accurately controls the shape and size of the sinker cup, but also is a sink cup design structure that does not damage the optical structure of the reflector cup and ensures excellent optical effects.
  • FIG. 1 is a front elevational view of an LED package holder according to an embodiment of the present invention.
  • Figure 2 is a cross-sectional view taken along the line A-A of the LED package holder shown in Figure 1;
  • Figure 3 is a cross-sectional view taken along the line B-B of the LED package holder shown in Figure 1.
  • FIG. 3 shows the LED chip 4 in a cross-sectional view for convenience of description.
  • the LED package holder provided by the embodiment of the present invention comprises a metal substrate 1 having a sink cup 2 integrally formed therewith.
  • the sinking cup 2 can be formed on a metal web by chemical etching, stamping, forging, casting, machining, or the like to obtain the metal substrate 1.
  • the sinking cup 2 has two opposite inner sides, and a plastic layer 3 is attached to the inner side of the sinking cup 2.
  • the plastic layer 3 extends to the periphery of the sinking cup 2 to form a cup edge 31, that is, the cup edge 31 is formed on the metal substrate 1, and the plastic layer 3 is formed into a plastic cup, the depth of the plastic cup ( That is, the vertical distance between the upper surface of the cup edge 31 and the bottom of the sink cup 2 is 1/3 to 3 times the thickness of the LED chip 4.
  • the plastic layer 3 also has two sets of opposite inner sides, that is, The opening angles ⁇ of the first inner side surface 32 and the second inner side surface 33, the two first inner side surfaces 32 and the two second inner side surfaces 33 are each less than 60°.
  • the LED package holder further comprises a plastic outer cover 5, which is completely wrapped or partially wrapped on the metal substrate 1.
  • the portion above the metal substrate 1 forms a reflective cup 51, and the reflective cup 51 surrounds the sinking bowl.
  • the outer periphery of the cup 2, and the plastic layer 3 provided on the surface of the cupping cup 2 is integrally formed with the reflecting cup 51, that is, the entire plastic outer sealing member 5 is integrally formed with the plastic layer 3 on the surface of the cupping cup 2.
  • the metal plating layer may be a laminated structure of one or more of a gold plating layer, a silver plating layer, a copper plating layer, a nickel plating layer, and a palladium plating layer. It is used to realize the electrical connection between the LED chip 4 and the power supply line.
  • the LED package bracket integrally forms the sink cup 2 directly on the metal substrate 1, and does not need to additionally set a dam, which saves the process and improves the production efficiency; and, the depth of the plastic cup is set to the thickness of the LED chip 4. 1/3 to 3 times, and the angle between the two sets of opposite inner sides is limited to 60°. This combination of depth and angle can well block the light incident on the side of the LED chip 4 without hindering.
  • the front side of the chip emits light, which avoids the side light absorption of the chip and ensures the normal light output on the front side, thereby improving the luminous efficiency of the LED; in addition, because the sinking cup 2 directly made on the metal substrate 1 has a dip angle of the side, it is difficult to control.
  • the inclination angle is large, and the upper edge of the cup has a large radius of curvature, which is not conducive to shielding the light that is directed toward the side of the chip. Therefore, the plastic layer 3 is disposed on the surface of the cup cup 2 to facilitate the setting of the depth and the angle.
  • the side of the chip can be effectively prevented from absorbing light; on the other hand, the reflective cup 51 and the plastic layer 3 are integrally formed, which further strengthens the bonding force of the reflective cup 51, the plastic layer 3 and the metal substrate 1, and improves the reliability of the LED.
  • the metal substrate 1 may be rectangular, circular or square, etc., which is wrapped inside the plastic outer cover 5.
  • the shape of the reflective cup 51 may also be rectangular, circular or square. It preferably conforms to the shape of the metal substrate 1.
  • FIG. 1 is an alternative implementation. In the area enclosed by the reflective cup 51, the first inner side 32 of the plastic layer 3 is closer to the long side of the reflective cup 51, and the first inner side 32 is connected to the cup edge 31. Connected to the reflector cup 51 as a unit, the cup edge 31 connected to the second inner side surface 33 is isolated from the reflector cup 51.
  • the opening angle of each of the opposite inner sides of the plastic layer 3 is below 60°, and the opening angle ⁇ of the inner side of the sinking cup 2 of the metal substrate 1 can be 120° or less, so the plastic
  • the thickness of the layer 3 is inconsistent in the depth direction of the cup, and has the characteristics of being thin and thick.
  • the material of the plastic outer seal 5 and the plastic layer 3 can be selected from thermosetting or thermoplastic high-reflection plastic materials such as PPA, PCT, epoxy resin, and silica gel, which has good plasticity and stability, and is favorable for light reflection. Reduce absorption and improve light extraction efficiency.
  • a cup cup 2 can be provided in a region enclosed by a plastic reflecting cup 51.
  • a plurality of sinking cups 2 can also be provided.
  • each reflecting cup 51 is provided.
  • other methods are also possible, for example, it is feasible that each of the reflecting cups 51 corresponds to two or more sinking cups 2 and the like.
  • the fluorescent glue or the transparent encapsulant is filled in the reflective cup 51, and the sinking cup 2 can be filled together, or only Covered by the LED chip 4 and the sinker cup 2. That is, when the size of the cup surrounded by the plastic layer 3 is large, the fluorescent glue or the transparent encapsulant will fill the sink cup 2, and when the size of the cup surrounded by the plastic layer 3 is small, the fluorescent glue or the transparent encapsulant only Covering the cup or a small amount of filling the inside of the cup, neither of which will affect the LED light, which will not be described in this embodiment.
  • the present invention further provides an LED illuminator comprising the above-described LED holder and an LED chip 4 disposed in the sinker cup 2 of the LED holder.
  • the LED chips 4 may be disposed one-to-one in the sinking cup 2, or may be disposed in the sinking cup 2 in a one-to-one manner according to special requirements.
  • the reflective cup 51 is filled with a fluorescent glue or a transparent encapsulant which can fill the sink cup 2 or cover the cup outside the sink cup 2.
  • the LED illuminator adopts the LED package bracket provided by the invention, and the sink cup and the reflector cup are integrally formed, and there is no need to separately set a dam on the metal substrate, thereby saving the process, improving the production efficiency, and enhancing the LED. Stability and reliability improve product quality.
  • the plastic layer and the plastic outer seal are integrally formed, the bonding force between the plastic layer, the reflective cup and the metal substrate is enhanced, and the reliability of the LED is improved.

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  • Led Device Packages (AREA)

Abstract

一种LED封装支架，包括具有下沉碗杯（2）的金属基片（1），下沉碗杯（2）内侧面附有塑胶层（3），塑胶层（3）向下沉碗杯（2）的周边延伸形成杯沿（31），杯沿（31）的上表面至碗杯底部的垂直距离为芯片（4）厚度的1/3～3倍；塑胶层（3）的每组相对内侧面的张角小于60°；还包括塑胶外封件（5），于金属基片（1）之上形成反射杯（51），反射杯（51）与塑胶层（3）一体成型。直接在金属基片（1）上一体成型下沉碗杯（2），节省了工序，提高了生产效率；将塑胶碗杯（2）的深度设为芯片（4）厚度的1/3～3倍，将内侧面张角限定为60°，可避免芯片（4）侧面吸光并保证正面正常出光，提高了LED的发光效率；在碗杯（2）表面设置塑胶层（3），方便了深度及角度的设置；反射杯（51）与塑胶层（3）一体成型，提高了LED的可靠性。

Description

一种LED封装支架及LED发光体 技术领域
本发明涉及LED照明技术领域，尤其涉及一种LED封装支架及LED发光体。
 背景技术
LED是目前应用较为广泛的光源之一，在LED的制作过程中，通常在芯片四周制作围坝，以便于涂覆荧光胶或封装胶，或是阻挡芯片侧壁对光的吸收。现有的围坝制作方法是在封装前于基板上制作围坝，然后将芯片一一安装在围坝中间，这种方式工序复杂，效率较低，也增加了成本，并且由于围坝是独立于基板上，长久使用有变形隐患，影响LED的可靠性。
 技术问题
本发明的目的在于提供一种新型的LED封装支架，旨在简化工序，提高生产效率，并提高其可靠性。
 技术解决方案
本发明是这样实现的，一种LED封装支架，包括金属基片，所述金属基片具有与其一体成型的下沉碗杯，所述下沉碗杯的内侧面附有塑胶层，所述塑胶层自所述内侧面向所述下沉碗杯的周边延伸形成杯沿，所述杯沿的上表面至所述下沉碗杯的底部的垂直距离为LED芯片的厚度的1/3~3倍；所述塑胶层具有两组相对的内侧面，每组相对的内侧面的张角均小于60°；所述LED封装支架还包括塑胶外封件，所述塑胶外封件于所述金属基片之上的部分形成反射杯；所述反射杯形成于所述下沉碗杯的外围，且与所述塑胶层一体成型。
本发明的另一目的在于提供一种LED发光体，包括所述的LED封装支架，所述LED封装支架的所述下沉碗杯内设有LED芯片。
 有益效果
本发明提供的LED封装支架直接在金属基片上一体成型下沉碗杯，不需要另外设置围坝，节省了工序，提高了生产效率；并且，将塑胶碗杯的深度设置为LED芯片的厚度的1/3~3倍，且将两组相对的内侧面的张角限定为60°之内，这种深度和角度的配合可以很好的避免芯片侧面吸光并保证正面的正常出光，提高了LED的发光效率；另外，在下沉碗杯表面设置塑胶层，方便了上述深度及角度的设置，可以有效避免芯片侧面吸光；另一方面，反射杯与塑胶层一体成型，进一步加强了反射杯、塑胶层与金属基片的结合力，提高了LED的可靠性。另外，此种设计不仅能精确控制下沉杯的形状尺寸，并且由于是沉杯设计结构，不会破坏反射杯的光学结构，保证优良的光学效果。
 附图说明
图1是本发明实施例提供的LED封装支架的正视图；
图2是图1所示 LED封装支架的A-A向剖视图；
图3是图1所示 LED封装支架的B-B向剖视图。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
请一同参阅图1~3，图3在剖视图中示出了LED芯片4以便于描述，本发明实施例提供的LED封装支架包括金属基片1，其具有与其一体成型的下沉碗杯2，具体可以通过化学蚀刻、冲压、锻压、铸造、机械加工等方法在一金属料片上制作下沉碗杯2以获得该金属基片1。该下沉碗杯2具有两组相对的内侧面，在下沉碗杯2的内侧面上附有塑胶层3， 该塑胶层3延伸至下沉碗杯2的周边，形成杯沿31，即该杯沿31形成于金属基片1之上，塑胶层3围合成一塑胶碗杯，该塑胶碗杯的深度（即杯沿31的上表面与下沉碗杯2的底部之间的垂直距离）为LED芯片4的厚度的1/3~3倍，另外，塑胶层3也具有两组相对的内侧面，即第一内侧面32和第二内侧面33，两个第一内侧面32和两个第二内侧面33的张角β均小于60°。进一步地，该LED封装支架还包括一塑胶外封件5，对金属基片1全部包裹或部分包裹，在金属基片1之上的部分形成反射杯51，该反射杯51包围于下沉碗杯2的外围，并且下沉碗杯2表面设置的塑胶层3是与该反射杯51一体成型的，即整个塑胶外封件5连同下沉碗杯2表面的塑胶层3一体成型。另外，金属镀层可以为金镀层、银镀层、铜镀层、镍镀层及钯镀层中的一种或者几种的层叠结构。用于实现LED芯片4与供电线路的电性连接。
该LED封装支架直接在金属基片1上一体成型下沉碗杯2，不需要另外设置围坝，节省了工序，提高了生产效率；并且，将塑胶碗杯的深度设置为LED芯片4的厚度的1/3~3倍，且将两组相对的内侧面的张角限定为60°之内，这种深度和角度的配合可以很好的遮挡射向LED芯片4侧面的光并且不会妨碍芯片正面出光，避免了芯片侧面吸光并保证了正面的正常出光，提高了LED的发光效率；另外，因为在金属基片1上直接制作的下沉碗杯2，其侧面的倾角较难控制，一般倾角较大，且碗杯的上边缘具有较大的曲率半径，这些都不利于遮挡射向芯片侧面的光线，因此在下沉碗杯2表面设置塑胶层3方便了上述深度及角度的设置，可以有效避免芯片侧面吸光；另一方面，反射杯51与塑胶层3一体成型，进一步加强了反射杯51、塑胶层3与金属基片1的结合力，提高了LED的可靠性。
进一步参考图1和图3，金属基片1可以为矩形、圆形或是方形等，其被包裹于塑胶外封件5内部，反射杯51的形状也可以是矩形、圆形或是方形等，优选与金属基片1的形状一致。图1是一种可选的实现方式，在反射杯51围合的区域内，塑胶层3的第一内侧面32与反射杯51的长边较为接近，第一内侧面32连接的杯沿31与反射杯51连接为一体，第二内侧面33连接的杯沿31与反射杯51相隔离。
进一步参考图2，塑胶层3的每组相对内侧面的张角均在60°之下，金属基片1的下沉碗杯2的内侧面的张角α可以做到120°以下，因此塑胶层3的厚度在碗杯深度方向是不一致的，具有下薄上厚的特点。
在本实施例中，塑胶外封件5和塑胶层3的材质可以选择PPA、PCT、环氧树脂、硅胶等热固性或热塑性的高反射塑胶材料，可塑性及稳定性好，并且利于光的反射，减少吸收，提高了出光效率。
在本实施例中，在一个塑胶反射杯51围合的区域可以设有一个下沉碗杯2，如图1，也可以设置多个下沉碗杯2，例如，每个反射杯51内设有三个下沉碗杯2，分别设置红、绿、蓝光芯片，这样，每个反射杯51以及其围合的内部结构构成一个白光单元。不仅如此，还可以采用其他方式，例如每个反射杯51对应两个或更多个下沉碗杯2等均是可行的。
进一步地，在LED的制造过程中，在安装好芯片之后，需进行点胶过程，将荧光胶或透明封装胶填充反射杯51内，可以将下沉碗杯2一并填满，也可以只覆盖于LED芯片4和下沉碗杯2之外。即：当塑胶层3围合的碗杯尺寸较大时，荧光胶或透明封装胶会填充下沉碗杯2，当塑胶层3围合的碗杯尺寸较小时，荧光胶或透明封装胶只覆盖于碗杯之上或者少量填充碗杯内部，这两种情况都不会影响LED出光，本实施例不再赘述。
本发明进一步提供一种LED发光体，包括上述的LED支架，以及设置于LED支架的下沉碗杯2内的LED芯片4。该LED芯片4可以一对一的设置于下沉碗杯2内，也可以按照特殊要求多对一的设置于下沉碗杯2内。
进一步地，在反射杯51内填充有荧光胶或透明封装胶，该荧光胶或透明封装胶可以充满下沉碗杯2或覆盖于下沉碗杯2之外。
该LED发光体采用了本发明提供的LED封装支架，其下沉碗杯与反射杯一体成型，不需要在金属基片上另设围坝，节省了工序，提高了生产效率，并增强了LED的稳定性和可靠性，提高了产品质量。另外，由于塑胶层和塑胶外封件一体成型，加强了塑胶层、反射杯与金属基片的结合力，提高了LED的可靠性。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (9)

  1. 一种LED封装支架，其特征在于，包括金属基片，所述金属基片具有与其一体成型的下沉碗杯，所述下沉碗杯的内侧面附有塑胶层，所述塑胶层自所述内侧面向所述下沉碗杯的周边延伸形成杯沿，所述杯沿的上表面至所述下沉碗杯的底部的垂直距离为LED芯片的厚度的1/3~3倍；所述塑胶层具有两组相对的内侧面，每组相对的内侧面的张角均小于60°；所述LED封装支架还包括塑胶外封件，所述塑胶外封件于所述金属基片之上的部分形成反射杯；所述反射杯形成于所述下沉碗杯的外围，且与所述塑胶层一体成型。
  2. 如权利要求1所述的LED封装支架，其特征在于，所述塑胶层的一组相对的杯沿与反射杯连接为一体。
  3. 如权利要求1所述的LED封装支架，其特征在于，所述金属基片被所述塑胶外封件包裹。
  4. 如权利要求1所述的LED封装支架，其特征在于，所述金属基片为矩形，圆形或是方形。
  5. 如权利要求1~4任一项所述的LED封装支架，其特征在于，所述下沉碗杯的每组相对的内侧面的张角均小于120°。
  6. 如权利要求1所述的LED封装支架，其特征在于，所述塑胶外封件和塑胶层的材质为热固性或热塑性高反射塑胶材料。
  7. 如权利要求1所述的LED封装支架，其特征在于，所述金属基片的表面设有金属镀层，所述金属镀层为金镀层、银镀层、铜镀层、镍镀层及钯镀层中的一种或者几种的层叠结构。
  8. 一种LED发光体，其特征在于，包括权利要求1至7任一项所述的LED封装支架，所述LED封装支架的所述下沉碗杯内设有LED芯片。
  9. 如权利要求8所述的LED发光体，其特征在于，于所述LED封装支架的反射杯内填充有荧光胶或透明封装胶。
PCT/CN2014/073570 2014-03-18 2014-03-18 一种led封装支架及led发光体 Ceased WO2015139191A1 (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203351665U (zh) * 2013-01-28 2013-12-18 博罗承创精密工业有限公司 一种带有凹杯的led支架及其端子料带
CN103872219A (zh) * 2014-03-18 2014-06-18 深圳市瑞丰光电子股份有限公司 一种led封装支架及led发光体
CN203787455U (zh) * 2014-03-18 2014-08-20 深圳市瑞丰光电子股份有限公司 一种led封装支架及led发光体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203351665U (zh) * 2013-01-28 2013-12-18 博罗承创精密工业有限公司 一种带有凹杯的led支架及其端子料带
CN103872219A (zh) * 2014-03-18 2014-06-18 深圳市瑞丰光电子股份有限公司 一种led封装支架及led发光体
CN203787455U (zh) * 2014-03-18 2014-08-20 深圳市瑞丰光电子股份有限公司 一种led封装支架及led发光体

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