WO2015113215A1 - Capacitor structure and capacitor using the same - Google Patents

Capacitor structure and capacitor using the same Download PDF

Info

Publication number
WO2015113215A1
WO2015113215A1 PCT/CN2014/071685 CN2014071685W WO2015113215A1 WO 2015113215 A1 WO2015113215 A1 WO 2015113215A1 CN 2014071685 W CN2014071685 W CN 2014071685W WO 2015113215 A1 WO2015113215 A1 WO 2015113215A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal plates
port
connecting strips
capacitor
capacitor structure
Prior art date
Application number
PCT/CN2014/071685
Other languages
French (fr)
Inventor
Bo Zhou
Kun Liu
Junyou CHEN
Yang JI
Original Assignee
Telefonaktiebolaget L M Ericsson (Publ)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget L M Ericsson (Publ) filed Critical Telefonaktiebolaget L M Ericsson (Publ)
Priority to US15/115,120 priority Critical patent/US9872391B2/en
Priority to CN201480072613.4A priority patent/CN105900197B/en
Priority to EP14881052.6A priority patent/EP3100292A4/en
Priority to PCT/CN2014/071685 priority patent/WO2015113215A1/en
Publication of WO2015113215A1 publication Critical patent/WO2015113215A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics

Abstract

Embodiments of the present invention provide a capacitor structure. The capacitor structure comprises: a first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65) that are vertically disposed with their surfaces being parallel to each other; a second plurality of metal plates (P32, P34, P36; P52, P54, P56; P62, P64, P66) that are interdigitated with the first plurality of metal plates with their surfaces being parallel to the surfaces of the first plurality of metal plates; a first port (Port1) electrically connected to each of the first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65) through a first plurality of port connecting strips (S1, S3, S5) and via a first port via interconnection (V31, V51, V61); and a second port (Port2) electrically connected to each of the second plurality of metal plates (P32, P34, P36; P52, P54, P56; P62, P64, P66) through a second plurality of port connecting strips (S2, S4, S6) and via a second port via interconnection (V32, V52, V62). The first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65) is connected together at an end of each of the first plurality of metal plates opposite to the end at which the first port is connected. The second plurality of metal plates (P32, P34, P36; P52, P54, P56; P62, P64, P66) is connected together at an end of each of the second plurality of metal plates opposite to the end at which the second port is connected. A direction in which the first plurality of port connecting strips extends (S1, S3, S5) is in a certain angle with the direction in which the second plurality of port connecting strips (S2, S4, S6) extends.

Description

CAPACITOR STRUCTURE AND CAPACITOR USING THE SAME
TECHNICAL FIELD
[0001] Embodiments of the invention generally relate to capacitor structures, and specifically to a capacitor structure having multiple layers of vertically interdigitated metal plates and further to a wideband vertically-interditigal-capacitor (VIC) using the capacitor structure.
BACKGROUND
[0002] This section introduces aspects that may facilitate a better understanding of the disclosure. Accordingly, the statements of this section are to be read in this light and are not to be understood as admissions about what is in the prior art or what is not in the prior art.
[0003] VICs are widely used to build lumped-element based components in multilayered low-temperature co-fired ceramic (LTCC) substrates, as shown in Fig. 1. However, a VIC, as a dual port device, shows a number of additional undesired resonant frequencies that limit its operational bandwidth. Particularly, spurious spikes in |S11 |, which is defined as an input reflection coefficient of a dual port device with its output port being terminated by a matched load, and in |S21 |, which is defined as a forward transmission insertion loss of the dual port device with its output port being terminated by a matched load can be observed at several frequencies. These frequencies where the spurious spikes occur limit the bandwidth of the VIC. Moreover, an increase in the number of fingers (which will interchangeably be referred to as metal plates hereafter) may result in more undesired resonances at lower frequencies, which may further limit the bandwidth of the VIC.
[0004] For a planar interdigital capacitor, spurious spikes can be reduced by using inductive parts as recited in reference document [1], bond wires as recited in reference document [2] or a slotted ground structure with via holes as recited in reference document [3] between interval fingers of the planar interdigital capacitor. However there is not any effective approach for removing or reducing spurious spikes of a vertically-interditigal-capacitor for bandwidth enhancement.
[0005] Reference documents:
[1] L.Zhu and K. Wu, Accurate circuit model of interdigital capacitor and its application to design of new quasi-lumped miniaturized filters with suppression of harmonic resonance [J], IEEE Trans. Microw. Theory Tech., vol.48, no. 3, pp. 347-356, 2000 [2] F.P. Casares-Miranda, P. Otero, E. Marquez-Segura, and C. Camacho-Penalosa, Wire bonded interdigital capacitor, IEEE Microwave and Wireless Components Letters, vol. 15, no. 10, pp. 700-702, 2005
[3] H.L. Zhang, X.Y. Zhang and B. J. Hu, A novel interdigital capacitor with accurate model for left-handed metamaterials, Proc. IEEE Asia-Pacific Microwave Conf, Yokohama, Japan, 2010, pp. 1463-1465.
SUMMARY
[0006] Various embodiments of the invention aim at addressing at least part of the above problems and disadvantages. Other features and advantages of embodiments of the invention will also be understood from the following description of specific embodiments when read in conjunction with the accompanying drawings, which illustrate, by way of example, the principles of embodiments of the invention.
[0007] Various aspects of embodiments of the invention are set forth in the appended claims and summarized in this section. It shall be understood that the scope of the invention is limited by the appended claims.
[0008] In a first aspect of the invention, a capacitor structure is provided. The capacitor structure comprises: a first plurality of metal plates that are vertically disposed with their surfaces being parallel to each other; a second plurality of metal plates that are interdigitated with the first plurality of metal plates with their surfaces being parallel to the surfaces of the first plurality of metal plates; a first port electrically connected to each of the first plurality of metal plates through a first plurality of port connecting strips and via a first port via interconnection; and a second port electrically connected to each of the second plurality of metal plates through a second plurality of port connecting strips and via a second port via interconnection. The first plurality of metal plates is connected together at an end of each of the first plurality of metal plates opposite to the end at which the first port is connected. The second plurality of metal plates is connected together at an end of each of the second plurality of metal plates opposite to the end at which the second port is connected. A direction in which the first plurality of port connecting strips extends is in a certain angle with the direction in which the second plurality of port connecting strips extends.
[0009] With this capacitor structure, the spurious spikes in a VIC device can be reduced so that the bandwidth of the VIC device can be effectively increased, and meanwhile the capacitance and Q-factor of the VIC device have a slight increment. [0010] In some embodiments, the first plurality of metal plates is connected together through a first plate via interconnection; and the second plurality of metal plates is connected together through a second plate via interconnection.
[0011] In some embodiments, the first plate via interconnection vertically passes through clearances formed in the second plurality of metal plates without contacting the clearances and is electrically connected to each of the first plurality of metal plates; or the first plate via interconnection is electrically connected to each of the first plurality of metal plates through a first plurality of plate connecting strips.
[0012] In some embodiments, the second plate via interconnection vertically passes through clearances formed in the first plurality of metal plates without contacting the clearances and is electrically connected to each of the second plurality of metal plates; or the second plate via interconnection is electrically connected to each of the second plurality of metal plates through a second plurality of plate connecting strips.
[0013] In some embodiments, a connecting portion between each of the first plurality of metal plates with the first plate via interconnection or a corresponding one of the first plurality of plate connecting strips is located on an extension line of a corresponding one of the first plurality of port connecting strips. Preferably, the extension line extends through a center on a corresponding one of the first plurality of metal plates.
[0014] In some embodiments, a connecting portion between each of the second plurality of metal plates with the second plate via interconnection or a corresponding one of the second plurality of plate connecting strips is located on an extension line of a corresponding one of the second plurality of port connecting strips. Preferably, the extension line extends through a center on a corresponding one of the second plurality of metal plates.
[0015] In some embodiments, the certain angle is 90 degrees or 180 degrees.
[0016] In some embodiments, each of the first plurality of metal plates and the second plurality of metal plates is rectangular.
[0017] In a second aspect of the invention, a vertically-interdigital-capacitor employing the capacitor structure according to the first aspect of the invention is provided.
[0018] In some embodiments, spacing between any two adjacent metal plates of the vertically-interdigital-capacitor is filled with a dielectric material.
[0019] In some embodiments, each of the first plurality of metal plates and the second plurality of metal plates of the vertically-interdigital-capacitor is buried in respective low-temperature co-fired ceramic (LTCC) substrates, respective liquid crystal polymer (LCP) substrates, or respective printed circuit board (PCB) layers. [0020] According to particular embodiments in relation to the proposed capacitor structure and the vertically-interdigital-capacitor employing the proposed structure as described in this specification, the spurious spikes at lower frequencies can be reduced and the undesired resonances can be shifted to much higher frequencies so that the bandwidth of the vertically-interdigital-capacitor can be significantly increased. Meanwhile, the capacitance and Q-factor of the vertically-interdigital-capacitor has a slight increment.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The above and other aspects, features, and benefits of various embodiments of the invention will become more fully apparent, by way of example, from the following detailed description with reference to the accompanying drawings, in which like reference numerals or letters are used to designate like or equivalent elements. The drawings are illustrated for facilitating better understanding of the embodiments of the invention and not necessarily drawn to scale, in which:
[0022] Fig. 1 illustrates a conventional VIC structure in a prior art;
[0023] Fig. 2 illustrates an equivalent circuit and its equivalent transformational circuit of the conventional VIC as illustrated in Fig. 1;
[0024] Fig. 3 illustrates the structure of an example VIC according to a first embodiment of the present invention;
[0025] Fig. 4 illustrates an equivalent circuit and its equivalent transformational circuit of the example VIC as illustrated in Fig. 3;
[0026] Fig. 5 illustrates the structure of an example capacitor according to a second embodiment of the present invention;
[0027] Fig. 6 illustrates the structure of an example capacitor according to a third embodiment of the present invention;
[0028] Fig. 7 illustrates a plane layout of the example capacitor according to the first embodiment of the present invention, in which dimensions of metal plates, various via interconnections, clearances, and various strips are particularly defined; and
[0029] Fig. 8 illustrates an EM-simulation result for the example capacitor as illustrated in Fig. 7. DETAILED DESCRIPTION
[0030] Hereinafter, the principle and spirit of the present invention will be described with reference to the illustrative embodiments. It should be understood, all these embodiments are given merely for the skilled in the art to better understand and further practice the present invention, but not for limiting the scope of the present invention. For example, features illustrated or described as part of one embodiment may be used with another embodiment to yield still a further embodiment. In the interest of clarity, not all features of an actual implementation are described in this specification.
[0031] References in the specification to "one embodiment," "an embodiment," "an example embodiment," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
[0032] It shall be understood that, although the terms "first", "second" etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and similarly, a second element could be termed a first element, without departing from the scope of example embodiments. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed terms.
[0033] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be liming of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises", "comprising", "has", "having", "includes" and/or "including", when used herein, specify the presence of stated features, elements, and/or components etc., but do not preclude the presence or addition of one or more other features, elements, components and/ or combinations thereof.
[0034] In the following description and claims, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
[0035] Reference is first made to Fig. 1, in which the structure of a conventional VIC is illustrated. The conventional VIC is a multi-conductor on a multilayered structure, which presents pass and stop-bands and has a plurality of vertically interdigitated metal plates, which may also be referred to as "fingers". In the following, the terms "metal plate" and "finger" may be used interchangeably to refer to the same element.
[0036] The illustrated conventional VIC in Fig. 1 exemplarily comprises six layers (Layer plates Pl l, P13 and P15 are electrically connected through metal strips Sl l, SI 3, and S15 and via a first port via interconnection VI 1 to a first port (Portl l). Similarly, the even-numbered metal plates PI 2, P14 and P16 are electrically connected through metal strips SI 2, S14, and S16 and via a second port via interconnection V12 to a second port (Portl2). In the conventional VIC, all ends of the odd-numbered metal plates Pl l, P13 and P15 which are opposite to the ends where the first port Portl is connected are open (which will be referred to as open ends hereafter), and all ends of the even-numbered metal plates PI 2, P14 and PI 6 which are opposite to the ends where the second port Port2 is connected are also open.
[0037] An equivalent circuit and its equivalent transformational circuit of the conventional VIC are illustrated in Fig. 2 (a) and (b). A finger of the conventional VIC can be represented by a serial inductance (Lls L2, L3, L4, L5 or L6) and a shunt capacitance (C12, C23, C34, C45, or C56), which is drawn as two separate capacitances in the figure. Capacitive coupling effect between adjacent fingers is modeled by the capacitance ¾, where i and j are the finger numbers. It can be seen from Fig.2 (a) and (b) that the inductances and capacitances are separately distributed, which contributes to the undesired resonances that limits the bandwidth of the VIC.
[0038] According to embodiments of the present invention, a VIC structure is proposed. The VIC structure comprises: a first plurality of metal plates that are vertically disposed with their surfaces being parallel to each other; a second plurality of metal plates that are interdigitated with the first plurality of metal plates with their surfaces being parallel to the surfaces of the first plurality of metal plates; a first port electrically connected to each of the first plurality of metal plates through a first plurality of port connecting strips and via a first port via interconnection; and a second port electrically connected to each of the second plurality of metal plates through a second plurality of port connecting strips and via a second port via interconnection. In the VIC structure according to the embodiments of the present invention, the first plurality of metal plates is connected together at an end of each of the first plurality of metal plates opposite to the end at which the first port is connected; the second plurality of metal plates is connected together at an end of each of the second plurality of metal plates opposite to the end at which the second port is connected; and a direction in which the first plurality of port connecting strips extends is in a certain angle with the direction in which the second plurality of port connecting strips extends.
[0039] Hereafter, the VIC structure according to embodiments of the present invention will be described in details with reference to Figs. 3-8.
First Embodiment [0040] Now referring to Fig. 3, the structure of an example VIC according to a first embodiment of the present invention is illustrated. The VIC structure as shown in Fig. 3 comprises: a first plurality of metal plates P31, P33 and P35 in Layerl, Layer3 and Layer5, i.e odd-numbered metal plates that are vertically disposed with their surfaces being parallel to each other; a second plurality of metal plates P32, P34 and P36 in Layer2, Layer4 and Layer6, i.e. even-numbered metal plates that are interdigitated with the first plurality of metal plates with their surfaces being parallel to the surfaces of the first plurality of metal plates; a first port (which is labeled as Portl in Fig. 3) that is electrically connected to each of the first plurality of metal plates through a first plurality of port connecting strips SI, S3 and S5 and via a first port via interconnection V31; and second port (which is labeled as Port2 in Fig.3) that is electrically connected to each of the second plurality of metal plates through a second plurality of port connecting strips S2, S4 and S6 and via a second port via interconnection V32.
[0041] In this capacitor structure, the first plurality of metal plates P31, P33 and P35 is connected together at an end of each of the first plurality of metal plates that is opposite to the end at which the first port Portl is connected; and the second plurality of metal plates is connected together at an end of each of the second plurality of metal plates P32, P34 and P36 that is opposite to the end at which the second port Port2 is connected. Moreover, a direction in which the first plurality of port connecting strips extends is in a certain angle with the direction in which the second plurality of port connecting strips extends. In this embodiment, the certain angle is preferably set as 180 degrees. However, a person skilled in the art shall understand that other angle values are also possible, such as 90 degrees and the scope of the present invention is not limited to any particular value of the certain angle.
[0042] In this embodiment, numbers of the first and second plurality of metal plates are illustrated as three, respectively. However, these numbers shall be regarded as illustrative instead of limiting, which can be adjusted according to practical performance requirements. Generally, each of the first and second plurality of metal plates may be shaped as rectangles, preferably as squares as shown. However, a person skilled in the art shall understand that other shapes, such as circles, are also possible. The scope of the present invention is not limited to any particular shape of the metal plate or any particular number of the metal plates.
[0043] As compared to the capacitor structure of Fig. 1 in which all ends of the metal plates PI 1, P13 and P15 which are opposite to the ends where the first port is connected are open and all ends of the metal plates PI 2, P14 and P16 which are opposite to the ends where the second port is connected are also open, in the first embodiment of the present invention, the open ends of the first plurality of metal plates P31, P33 and P35 are electrically connected together, and the open ends of the second plurality of metal plates P32, P34 and P36 are also electrically connected together.
[0044] By electrically connecting the open ends of the corresponding metal plates, the equivalent circuit of the capacitor structure according to the embodiment of the present invention and its equivalent transformational circuit are changed into those as shown in Fig. 4. As illustrated, thanks to the electrical connection of the open ends of the metal plates in Layer 1, Layer3 and Layer5, capacitances C12, C23, C34, C45 and C56 close to Portl can be equivalently aggregated as Cpi and inductances Lls L3 and L5 can be aggregated as Lpi. Similarly, thanks to the electrical connection of the open ends of the metal plates in Layer2, Layer4 and Layer6, capacitances C12, C23, C34, C45 and C56 close to Port2 can be equivalently aggregated as Cp2 and inductances L2, L4 and L6 can be aggregated as LP2. The proposed capacitor structure according to the embodiment of the present invention combines the capacitances and inductances in parallel, respectively and accordingly the undesired resonances at lower frequencies caused by separate capacitances and inductances can be reduced. Additionally, the combination of the capacitances and inductances mainly result in shifting of the undesired resonances to higher frequencies and a slight increment of the capacitance and Q-factor of a vertically-interdigital capacitor.
[0045] In the illustrated example of this embodiment, the first plurality of metal plates may be connected together through a first plate via interconnection V33; and the second plurality of metal plates are connected together through a second plate via interconnection V34.
[0046] As illustrated in Fig. 1, the first plate via interconnection V33 may vertically pass through clearances C2 and C4 formed in the metal plates P32 and P34 without contacting the clearances and meanwhile be electrically connected to each of the first plurality of metal plates P31, P33 and P35. Similarly, the second plate via interconnection V34 may vertically pass through clearances C3 and C5 formed in the metal plates P33 and P35 without contacting the clearances and meanwhile be electrically connected to each of the second plurality of metal plates P32, P34 and P36. However, a person skilled in the art shall understand that other manners for connecting the open ends of the metal plates are also possible, as long as they can realize the expected function of the embodiments of the present invention.
[0047] Preferably, a connecting portion between each of the first plurality of metal plates P31, P33 and P35 and the first plate via interconnection V33 is on an extension line of the corresponding one of the first plurality of port connecting strips SI, S3, and S5. Further preferably, the extension line extends through the center on the corresponding one of the first plurality of metal plates. For example, in a case where each of the first plurality of metal plates is rectangular, the extension line is the central line of the corresponding rectangular metal plate which is parallel with two sides of it and thus the aforesaid connecting portion will be located in the middle of the other two sides of the metal plate.
[0048] Additionally or alternatively, a connecting portion between each of the second plurality of metal plates P32, P34 and P36 and the second plate via interconnection V34 is on an extension line of the corresponding one of the second plurality of port connecting strips S2, S4, and S6. Preferably, the extension line extends through the center on the corresponding one of the second plurality of metal plates P32, P34, and P36. For example, in a case where each of the second plurality of metal plates is rectangular, the extension line is the central line of the corresponding rectangular metal plate which is parallel with two sides of it and thus the aforesaid connecting portion will be located in the middle of the other two sides of the metal plate.
Second Embodiment
[0049] Fig. 5 illustrates the structure of an example capacitor according to a second embodiment of the present invention. The illustrated example capacitor structure is the same as the structure of the first embodiment except for the manner of connecting the open ends of the metal plates through two via interconnections. For the sake of brevity and simplicity of disclosure, descriptions for the same parts in this capacitor structure will not be repeated hereafter.
[0050] In the illustrated embodiment, the first plate via interconnection V53 may be electrically connected to each of the first plurality of metal plates P51, P53 and P55 at the end which is opposite to the end where the first port Portl is connected, respectively through a first plurality of plate connecting strips S51, S53 and S55. Similarly, the second plate via interconnection V54 may be electrically connected to each of the second plurality of metal plates P52, P54 and P56 at the end which is opposite to the end where the second port Port2 is connected, respectively through a second plurality of plate connecting strips S52, S54 and S56. As illustrated, each of the first and second plurality of plate connecting strips is in an "L" shape. However, a person skilled in the art shall understand that other shapes are also possible as along as they can achieve the expected function of the embodiments of the invention. The scope of the invention is not limited to any particular shape of the plate connecting strips.
[0051] Preferably, a connecting portion between each of the first plurality of metal plates P51, P53, and P55 and a corresponding one of the first plurality of plate connecting strips S51, S53 and S55 is located on an extension line of a corresponding one of the first plurality of port connecting strips SI, S3 and S5. Further preferably, the extension line extends through the center on the corresponding one of the first plurality of metal plates. For example, in a case where each of the first plurality of metal plates is rectangular, the extension line is the central line of the corresponding rectangular metal plate which is parallel with two sides of it and thus the aforesaid connecting portion will be located in the middle of the other two sides of the metal plate.
[0052] Additionally or alternatively, a connecting portion between each of the second plurality of metal plates P52, P54, and P56 and a corresponding one of the second plurality of plate connecting strips S52, S54 and S56 is located on an extension line of a corresponding one of the second plurality of port connecting strips S2, S4 and S6. Preferably, the extension line extends through the center on the corresponding one of the second plurality of metal plates. For example, in a case where each of the second plurality of metal plates is rectangular, the extension line is the central line of the corresponding rectangular metal plate which is parallel with two sides of it and thus the aforesaid connecting portion will be located in the middle of the other two sides of the metal plate.
[0053] In the illustrated case where all of the metal plates are configured as rectangles, each of the first plurality of plate connecting strips S51, S53 and S55 may be electrically connected in the middle of a first side of the corresponding metal plate P51, P53, or P55 and each of the second plurality of plate connecting strips S52, S54 and S56 may be electrically connected in the middle of a second side of the corresponding metal plate P52, P54, or P56, wherein the first side parallel vertical to the second side.
[0054] Although in the second embodiment, the first and second via interconnects V53 and V54 interconnect the corresponding open ends of respective metal plates in the same manner, i.e. through the plate connecting strips, it is also possible that they interconnect the open ends in different manners. For example, the first plate via interconnection V53 may interconnect the open ends of the first plurality of metal plates through the plate connecting strips as shown in Fig. 5, while the second plate via interconnection V54 may vertically pass through the clearances formed in the first plurality of metal plates without contacting the clearances and meanwhile be electrically connected to each of the second plurality of metal plates as shown in Fig. 3, or vice versa. Simply speaking, features illustrated or described as part of one embodiment of the present invention may be used with another embodiment to yield still a further embodiment, which also falls within the scope of the present invention.
[0055] According to the second embodiment, it is possible to achieve the same effect as the first embodiment. That is, the separate capacitances and inductances may be aggregated together and thus the spurious resonances at lower frequencies are reduced so that the bandwidth is increased while the capacitance is maintained. Third Embodiment
[0056] Fig. 6 illustrates the structure of an example capacitor according to a third embodiment of the present invention. The illustrated example capacitor structure is the same as the structure of the second embodiment except that locations of the first port, the second port and the first and second plate via interconnections relative to the metal plates are changed. For the sake of brevity and simplicity of disclosure, descriptions for the same parts in this capacitor structure will not be repeated herein.
[0057] In the third embodiment, the certain angle between the first direction in which the first plurality of port connecting strip SI, S3, and S5 extends and the second direction in which the second plurality of port connecting strip S2, S4 and S6 extends may be set as 90 degrees. Similarly to the second embodiment, the open ends of the first plurality of metal plates P61, P63, and P65 are electrically connected together through the first plurality of plate connecting strips S61, S63 and S65 and via the first plate via interconnection V63, for example and the open ends of the second plurality of metal plates P62, P64, and P66 are electrically connected together through the first plurality of plate connecting strips S61, S63 and S65 and via the first plate via interconnection V64, for example. A person skilled in the art shall understand that the open ends of the first and/ or second plurality of metal plates may also be electrically connected together in the manner as illustrated in Fig. 3.
[0058] In the illustrated case where all of the metal plates are configured as rectangles, each of the first plurality of plate connecting strips S61, S63 and S65 is electrically connected in the middle of a first side of the corresponding metal plate P61, P63, or P65 and each of the second plurality of plate connecting strips S62, S64 and S66 is electrically connected in the middle of a second side of the corresponding metal plate P62, P64, or P66, wherein the first side is vertical to the second side.
[0059] Fig. 6(b) illustrates another example capacitor structure according to the third embodiment of the present invention, in which the locations of the first port Portl and the second port Port2 as well as the first and second plate via interconnections P63 and P64 are rotated 180 degrees relative to the capacitor structure as illustrated in Fig. 6(a).
[0060] According to the third embodiment, it is possible to achieve the same effect as the first and second embodiments. That is, the separate capacitances and inductances may be aggregated together and thus the spurious resonances at lower frequencies can be reduced so that the bandwidth can be increased while the capacitance is maintained.
[0061] In the above embodiments or some other embodiments, the first and second metal plates may generally be made of gold, silver and copper etc.. Thicknesses of the first and second plurality metal plates and spacing between any two adjacent metal plates are usually configured to be equal. Preferably, sizes of all metal plates are set equal and their centers are vertically aligned. Preferably, the thickness of each of the first and second metal plates and the spacing may be configured as 0.1mm. Further preferably, the width of each of the port connecting strips S1-S6 and the first and second plurality of plate connecting strips may be not more than 1/4 waveguide wavelength.
[0062] The capacitor structure according to embodiments of the present invention as shown in Figs. 3, 5 and 6 can be formed in multiple layers of substrates, which can be semiconductor substrates in which a semiconductor device, such as a VIC device can be formed. In a vertically- interdigital-capacitor employing the capacitor structure according to the first, second or third embodiment of the present invention, spacing between a pair of adjacent metal plates may be filled with a dielectric material, such as ceramic, crystal and Teflon and the like. Each of the first plurality of metal plates and the second plurality of metal plates may be buried in respective semiconductor substrates, such as low-temperature co-fired ceramic (LTCC) substrates, liquid crystal polymer (LCP) substrates, or printed circuit board (PCB) layers. The LTCC can be Ferro-A6, dupond 951, or dupond943 etc..
[0063] In the following, a specific example VIC employing the capacitor structure according to the first embodiment will be described. A person skilled in the art shall understand that the specific example is given just for illustrating the technical effects of the embodiments of the present invention rather than limiting the present invention in any particular form.
[0064] In this example, the VIC is buried in a six-layer LTCC substrate, which is made of Ferro-A6 material with a dielectric constant of 5.9 and loss tangent of 0.002. Each LTCC layer has a thickness of 0.096 mm. Fig. 7 shows a plane layout of the VIC, in which dimensions of the metal plates, various via interconnections, clearances, and various strips are particularly defined. AXIEM, which is a full-wave electromagnetic (EM) solver based on the spectral domain method of moments is selected for EM-optimization and verification. After the optimization, the final optimal dimension parameters are wo=0.2 mm, wi=0.6, w2=0.5, wc=1.8 mm, ri=0.2 mm, r2=0.3 mm, r3=0.2 mm and r4=0.4 mm.
[0065] Fig. 8 shows the simulation result for the VIC with the above optimal dimension parameters, from which it can be seen that as compared to a conventional VIC made in the same shape and of the same materials and with the same values for parameters w0, w2j ΓΙ, Γ2> andwc, the spurious spike at frequency fi in |S11 | and |S21 | shifts from 3.4 GHz to 9.8 GHz. That is, the bandwidth of the proposed VIC according to the embodiment of the present invention is improved from 3.4GHz to 9.8, which means 188% improvement of the bandwidth. [0066] It will be obvious to a person skilled in the art that, as the technology advances, the inventive concept can be implemented in various ways. The invention and its embodiments are not limited to the examples described above but may vary within the scope of the claims.
[0067] While this specification contains many specific implementation details, these should not be construed as limitations on the scope of any implementation or of what may be claimed, but rather as descriptions of features that may be specific to particular embodiments of particular implementations. Certain features that are described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub-combination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a sub-combination or variation of a sub-combination.
[0068] While the invention has been described in terms of several embodiments, those skilled in the art will recognize that the invention is not limited to the embodiments described, and can be practiced with modification and alteration within the disclosure and scope of the appended claims. The description is thus to be regarded as illustrative instead of limiting.

Claims

WHAT IS CLAIMED IS:
1. A capacitor structure, comprising:
a first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65) that are vertically disposed with their surfaces being parallel to each other;
a second plurality of metal plates (P32, P34, P36; P52, P54, P56; P62, P64, P66) that are interdigitated with the first plurality of metal plates with their surfaces being parallel to the surfaces of the first plurality of metal plates;
a first port (Portl) electrically connected to each of the first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65) through a first plurality of port connecting strips (SI, S3 , S5) and via a first port via interconnection (V31 , V51 , V61 ); and
a second port (Port2) electrically connected to each of the second plurality of metal plates (P32, P34, P36; P52, P54, P56; P62, P64, P66) through a second plurality of port connecting strips (S2, S4, S6) and via a second port via interconnection (V32, V52, V62);
wherein the first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65) is connected together at an end of each of the first plurality of metal plates opposite to the end at which the first port is connected;
the second plurality of metal plates (P32, P34, P36; P52, P54, P56; P62, P64, P66) is connected together at an end of each of the second plurality of metal plates opposite to the end at which the second port is connected; and
a direction in which the first plurality of port connecting strips extends (SI, S3, S5) is in a certain angle with the direction in which the second plurality of port connecting strips (S2, S4, S6) extends.
2. The capacitor structure according to Claim 1, wherein
the first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65) are connected together through a first plate via interconnection (V33, V53, V63); and
the second plurality of metal plates are connected together through a second plate via interconnection (V34, V54, V64).
3. The capacitor structure according to Claim 2, wherein
the first plate via interconnection (V33) vertically passes through clearances (C2, C4) formed in the second plurality of metal plates without contacting the clearances and is electrically connected to each of the first plurality of metal plates (P31, P33, P35), or
the first plate via interconnection (V53, V63) is electrically connected to each of the first plurality of metal plates (P51, P53, P55; P61, P63, P65) through a first plurality of plate connecting strips (S51, S53, S55; S61, S63, S65).
4. The capacitor structure according to Claim 3, wherein the second plate via interconnection (V34) vertically passes through clearances (C3, C5) formed in the first plurality of metal plates without contacting the clearances and is electrically connected to each of the second plurality of metal plates (P52, P54, P56; P62, P64, P66), or the second plate via interconnection (V54, V64) is electrically connected to each of the second plurality of metal plates (P52, P54, P56; P62, P64, P66) through a second plurality of plate connecting strips (S52, S54, S56; S62, S64, S66).
5. The capacitor structure according to Claim 4, wherein
a connecting portion between each of the first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65) with the first plate via interconnection (V33) or a corresponding one of the first plurality of plate connecting strips (S51, S53, S55; S61, S63, S65) is on an extension line of a corresponding one of the first plurality of port connecting strips (SI, S3, S5).
6. The capacitor structure according to Claim 5, wherein
the extension line extends through a center on a corresponding one of the first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65).
7. The capacitor structure according to Claim 4 or 5, wherein
a connecting portion between each of the second plurality of metal plates (P32, P34, P36; P52, P54, P56; P62, P64, P66) with the second plate via interconnection (V34) or a corresponding one of the second plurality of plate connecting strips (S52, S54, S56; S62, S64, S66) is on an extension line of a corresponding one of the second plurality of port connecting strips (S2, S4, S6).
8. The capacitor structure according to Claim 7, wherein
the extension line extends through a center on a corresponding one of the second plurality of metal plates (P32, P34, P36; P52, P54, P56; P62, P64, P66).
9. The capacitor structure according to any of Claims 1-8, wherein
the certain angle is 90 degrees or 180 degrees.
10. The capacitor structure according to any of Claims 1-9, wherein each of the first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65) and the second plurality of metal plates (P32, P34, P36; P52, P54, P56; P62, P64, P66) is rectangular.
11. A capacitor employing the capacitor structure according to any of Claims 1-10.
12. The capacitor according to Claim 11, wherein spacing between any two adjacent metal plates is filled with a dielectric material.
13. The capacitor according to any of Claims 1-10, wherein each of the first plurality of metal plates (P31, P33, P35; P51, P53, P55; P61, P63, P65) and the second plurality of metal plates (P32, P34, P36; P52, P54, P56; P62, P64, P66) is buried in respective low-temperature co-fired ceramic (LTCC) substrates, respective liquid crystal polymer (LCP) substrates, or respective printed circuit board (PCB) layers.
PCT/CN2014/071685 2014-01-28 2014-01-28 Capacitor structure and capacitor using the same WO2015113215A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US15/115,120 US9872391B2 (en) 2014-01-28 2014-01-28 Capacitor structure and capacitor using the same
CN201480072613.4A CN105900197B (en) 2014-01-28 2014-01-28 Capacitor arrangement and the capacitor for using the capacitor arrangement
EP14881052.6A EP3100292A4 (en) 2014-01-28 2014-01-28 Capacitor structure and capacitor using the same
PCT/CN2014/071685 WO2015113215A1 (en) 2014-01-28 2014-01-28 Capacitor structure and capacitor using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/071685 WO2015113215A1 (en) 2014-01-28 2014-01-28 Capacitor structure and capacitor using the same

Publications (1)

Publication Number Publication Date
WO2015113215A1 true WO2015113215A1 (en) 2015-08-06

Family

ID=53756110

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/071685 WO2015113215A1 (en) 2014-01-28 2014-01-28 Capacitor structure and capacitor using the same

Country Status (4)

Country Link
US (1) US9872391B2 (en)
EP (1) EP3100292A4 (en)
CN (1) CN105900197B (en)
WO (1) WO2015113215A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102324695B1 (en) * 2015-02-17 2021-11-10 삼성전자주식회사 Printed circuit board
CN106960996A (en) * 2017-03-09 2017-07-18 南京邮电大学 A kind of LTCC bandpass filters with spurious reduction type vertical inter-digital electric capacity
CN106960995A (en) * 2017-03-09 2017-07-18 南京邮电大学 It is a kind of that there is wide upper stopband and the double mode LTCC bandpass filters of nonopiate feedback
US11489038B2 (en) * 2017-08-29 2022-11-01 Micron Technology, Inc. Capacitors having vertical contacts extending through conductive tiers
WO2019125385A1 (en) * 2017-12-18 2019-06-27 Intel IP Corporation Compound capacitor structures
CN108492984A (en) * 2018-03-19 2018-09-04 南京邮电大学 A kind of new structural spurious reduction type vertical inter-digital capacitance
CN108428980A (en) * 2018-03-26 2018-08-21 南京邮电大学 A kind of new structural broadband vertical interdigital capacitor
US11901315B2 (en) * 2021-03-04 2024-02-13 Innolux Corporation Package device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070290929A1 (en) * 2006-03-08 2007-12-20 Junichi Noro Antenna module and antenna device
US20080239619A1 (en) * 2007-03-29 2008-10-02 Okamoto Kiyomi Capacitor structure
CN101640519A (en) * 2009-09-02 2010-02-03 南京理工大学 High stop-band inhibiting multi-zero 2.4 GHz mini filter
US20110292565A1 (en) * 2009-04-28 2011-12-01 United Microelectronics Corp. Capacitor structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4912324B2 (en) * 2005-12-26 2012-04-11 三洋電機株式会社 Electrical circuit device
JP4773252B2 (en) 2006-04-11 2011-09-14 太陽誘電株式会社 Multilayer capacitor
US8594604B2 (en) * 2009-12-18 2013-11-26 Nxp, B.V. Fringe capacitor circuit
WO2014209302A1 (en) * 2013-06-26 2014-12-31 Intel Corporation Metal-insulator-metal on-die capacitor with partial vias

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070290929A1 (en) * 2006-03-08 2007-12-20 Junichi Noro Antenna module and antenna device
US20080239619A1 (en) * 2007-03-29 2008-10-02 Okamoto Kiyomi Capacitor structure
US20110292565A1 (en) * 2009-04-28 2011-12-01 United Microelectronics Corp. Capacitor structure
CN101640519A (en) * 2009-09-02 2010-02-03 南京理工大学 High stop-band inhibiting multi-zero 2.4 GHz mini filter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3100292A4 *

Also Published As

Publication number Publication date
US9872391B2 (en) 2018-01-16
CN105900197B (en) 2019-09-13
EP3100292A1 (en) 2016-12-07
CN105900197A (en) 2016-08-24
EP3100292A4 (en) 2017-10-11
US20160381797A1 (en) 2016-12-29

Similar Documents

Publication Publication Date Title
WO2015113215A1 (en) Capacitor structure and capacitor using the same
US7479857B2 (en) Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias
JP4992345B2 (en) Transmission line type resonator, and high frequency filter, high frequency module and wireless device using the same
US7342471B2 (en) Systems and methods for blocking microwave propagation in parallel plate structures
KR101192231B1 (en) Filter design methods and filters based on metamaterial structures
TWI407461B (en) Common-mode noise filtering circuit, common-mode noise filtering element and common-mode noise filtering structure
US8334734B2 (en) Printed multilayer filter methods and designs using extended CRLH (E-CRLH)
US11095010B2 (en) Bandpass filter with induced transmission zeros
US20220077553A1 (en) Miniature filter design for antenna systems
CN206340652U (en) Radio frequency vertical transition structure comprising ceramic micro-strip
US10003115B2 (en) Terminator and termination method
JP5578440B2 (en) Differential transmission line
CN101783431A (en) Complementary metal coupling line
Studniberg et al. A quad-band bandpass filter using negative-refractive-index transmission-line (NRI-TL) metamaterials
Durán-Sindreu et al. Novel fully-planar extended-composite right/left handed transmission line based on substrate integrated waveguide for multi-band applications
CN113823885A (en) Filter
TWM599507U (en) Broadband common mode filter suppression device using tandem annular ground plane structure
Parvez et al. A novel quasi-lumped UWB high pass filter with multiple transmission zeros
JP2006311492A (en) Filter and filtering apparatus
WO2008108003A1 (en) Compact filtering structure
KR20150112891A (en) Filtering circuit with slot line resonators
TWM492538U (en) Directional coupler suitable for different frequency band
Liu et al. Miniaturized Quarter-Wavelength Resonator for Common-Mode Filter Based on Pattern Ground Structure
Parvez et al. Chebyshev quarter wavelength wideband bandstop filter based on dumbbell annular ring resonator
Enriquez LTCC High K miniature filters in L and S bands

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14881052

Country of ref document: EP

Kind code of ref document: A1

REEP Request for entry into the european phase

Ref document number: 2014881052

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2014881052

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 15115120

Country of ref document: US