WO2015098934A1 - 酸化物超電導線材及び酸化物超電導線材の製造方法 - Google Patents
酸化物超電導線材及び酸化物超電導線材の製造方法 Download PDFInfo
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- WO2015098934A1 WO2015098934A1 PCT/JP2014/084089 JP2014084089W WO2015098934A1 WO 2015098934 A1 WO2015098934 A1 WO 2015098934A1 JP 2014084089 W JP2014084089 W JP 2014084089W WO 2015098934 A1 WO2015098934 A1 WO 2015098934A1
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- oxide superconducting
- protective layer
- layer
- superconducting wire
- film thickness
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- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000463 material Substances 0.000 title abstract description 26
- 239000011241 protective layer Substances 0.000 claims abstract description 169
- 239000010410 layer Substances 0.000 claims abstract description 138
- 239000001301 oxygen Substances 0.000 claims description 36
- 229910052760 oxygen Inorganic materials 0.000 claims description 36
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 35
- 238000007747 plating Methods 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 238000000137 annealing Methods 0.000 claims description 26
- 230000006641 stabilisation Effects 0.000 claims description 22
- 238000011105 stabilization Methods 0.000 claims description 22
- 239000011247 coating layer Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 15
- 238000004544 sputter deposition Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 10
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 65
- 229910000679 solder Inorganic materials 0.000 description 30
- 230000000052 comparative effect Effects 0.000 description 20
- 230000015572 biosynthetic process Effects 0.000 description 18
- 239000010949 copper Substances 0.000 description 12
- 230000002776 aggregation Effects 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 238000004220 aggregation Methods 0.000 description 10
- 230000006866 deterioration Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 239000011135 tin Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000001953 recrystallisation Methods 0.000 description 5
- 239000002887 superconductor Substances 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000007735 ion beam assisted deposition Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000000087 stabilizing effect Effects 0.000 description 4
- -1 Gd 2 Zr 2 O 7 Substances 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000004549 pulsed laser deposition Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910000856 hastalloy Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009993 protective function Effects 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- 241000954177 Bangana ariza Species 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
- H01B12/06—Films or wires on bases or cores
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/087—Oxides of copper or solid solutions thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0036—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0801—Manufacture or treatment of filaments or composite wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/20—Permanent superconducting devices
- H10N60/203—Permanent superconducting devices comprising high-Tc ceramic materials
Definitions
- the present invention relates to an oxide superconducting wire and a method for manufacturing an oxide superconducting wire.
- the RE123-based oxide superconductor is composed of a composition represented by RE 1 Ba 2 Cu 3 O 7- ⁇ (RE: rare earth elements such as Y and Gd), and has a critical temperature higher than the liquid nitrogen temperature (77 K).
- RE rare earth elements such as Y and Gd
- oxide superconductor In order to use an oxide superconductor in various superconducting devices, it is common to process the oxide superconductor into a wire and use it as an oxide superconducting wire such as a power supply conductor or a magnetic coil.
- the oxide superconducting wire is formed by forming an oxide superconducting layer made of an oxide superconducting conductor on a tape-like substrate via an intermediate layer.
- the oxide superconducting wire needs to be subjected to an oxygen annealing treatment for improving superconducting characteristics by supplying oxygen to the oxide superconducting layer after forming the protective layer.
- This oxygen annealing treatment is performed by heating the oxide superconducting wire to 300 ° C. to 500 ° C. in an oxygen atmosphere.
- Ag atoms in the protective layer may aggregate on the surface of the oxide superconducting layer to form an aggregate of a plurality of isolated and dispersed Ag particles.
- a part where the protective layer is locally thickened or a part where the protective layer is thinned occurs, and pinholes may be generated in the protective layer.
- pinholes When pinholes occur, it cannot function as a protective layer, such as allowing moisture to enter. In order to suppress pinholes, it is necessary to form a thick protective layer.
- Ag is an expensive metal, it is desirable to reduce the amount of Ag used.
- the present invention has been made in view of the above problems, and provides an oxide superconducting wire having a protective layer without a pinhole while suppressing the amount of Ag used and having an improved function of protecting the oxide superconducting layer. Objective.
- an oxide superconducting wire according to the first aspect of the present invention is formed on a tape-like base material, an intermediate layer formed on the main surface of the base material, and the intermediate layer.
- An oxide superconducting laminate having an intermediate having an oxide superconducting layer and a protective layer formed on the intermediate, and an average film thickness T ave of the protective layer is 0.1 ⁇ m or more 5 ⁇ m or less, and the ratio T ⁇ / T ave between the standard deviation T ⁇ of the film thickness of the protective layer and the average film thickness T ave is 0.4 or less.
- the protective layer may be made of Ag or an Ag alloy.
- the average film thickness T ave of the protective layer is 0.1 ⁇ m or more and 5 ⁇ m or less, and the ratio T ⁇ / T ave between the standard deviation T ⁇ of the film thickness and the average film thickness T ave is 0.4 or less,
- the formation of pinholes can be suppressed without forming the protective layer too thick. Therefore, the cost of the protective layer can be suppressed while sufficiently fulfilling the protective function.
- the oxide superconducting wire according to the above aspect can stabilize the current characteristics by adhering a metal tape to the protective layer via solder.
- a pair of oxide superconducting wires according to the above aspect can be prepared, and the protective layers can be opposed to each other and connected via solder.
- the solder adheres directly to the protective layer.
- the metal constituting the solder (Sn as an example) erodes the protective layer and Ag of the protective layer is alloyed. Ag may become brittle when alloyed. If there is a locally thin portion in the protective layer, the entire thickness of the protective layer becomes brittle in this thin portion, and the protective layer itself tends to peel off. As a result, the metal tape as described above is easily peeled off or the strength of the connection portion is reduced.
- the average film thickness T ave of the protective layer is set to 0.1 ⁇ m or more and 5 ⁇ m or less, and the ratio T ⁇ / T ave between the standard deviation T ⁇ of the film thickness and the average film thickness T ave is set. Is set to 0.4 or less. Therefore, since there is no locally thin portion in the protective layer, even if embrittlement occurs due to alloying, this embrittlement does not reach the entire thickness of the protective layer, and the strength (strength of the connection portion or the metal tape) It can suppress that peeling strength) falls.
- this oxide superconducting wire can stabilize a current characteristic by providing a plating coating layer on the outer periphery of the oxide superconducting laminate.
- the oxide superconducting wire is immersed in a plating solution to form a plating coating layer. Since pinhole formation is suppressed in the protective layer, the plating solution does not touch the oxide superconducting layer and the oxide superconducting layer does not corrode. Therefore, it can prevent that a superconducting characteristic falls.
- the oxide superconducting wire according to the first aspect may further include a stabilization layer joined to the protective layer and formed from a metal tape.
- the oxide superconducting wire according to the first aspect may further include a stabilization layer formed on the outer periphery of the oxide superconducting laminate having the above and formed from a plating coating layer. By forming the stabilization layer, the current characteristics of the oxide superconducting wire can be stabilized. In the case where the stabilization layer is formed so as to cover the outer periphery of the oxide superconducting wire, the oxide superconducting layer is sealed from the outside, and deterioration of superconducting characteristics due to moisture intrusion can be prevented.
- the protective layer may be formed after oxygen annealing treatment of the intermediate.
- oxygen annealing treatment since the oxygen annealing treatment is performed after the protective layer is formed, Ag aggregation occurs due to the heating accompanying the oxygen annealing treatment, and locally thinned portions and pinholes are formed in the protective layer.
- the protective layer after the oxygen annealing treatment, it is possible to realize a protective layer having a uniform thickness while suppressing aggregation and recrystallization of Ag.
- the arithmetic average roughness Ra of the surface of the protective layer may be 80 nm or less.
- the method for producing an oxide superconducting wire according to the second aspect of the present invention includes a base material, an intermediate layer formed on the base material, and an oxide superconducting layer formed on the intermediate layer.
- a body is prepared, oxygen annealing treatment is performed on the intermediate, and after the oxygen annealing treatment, a protective layer is formed on the oxide superconducting layer.
- the protective layer may be formed of Ag or an Ag alloy.
- the oxygen annealing treatment is performed after the protective layer is formed, Ag aggregation occurs due to the heating accompanying the oxygen annealing treatment, and locally thinned portions and pinholes are formed in the protective layer.
- the oxide superconducting wire when forming the protective layer, may be cooled or radiated after the protective layer having an average film thickness of 5 ⁇ m or less is formed by sputtering.
- a step of forming the protective layer having an average film thickness of 5 ⁇ m or less by a sputtering method, and a step of cooling or radiating the oxide superconducting wire You may repeat.
- film formation by sputtering when sputtered particles (Ag particles) collide with the film formation body, the kinetic energy at the time of collision is converted into thermal energy, and the surface of the film formation body rises in temperature.
- the arithmetic average roughness Ra of the surface of the protective layer may be 80 nm or less.
- the average thickness T ave of the protective layer is 0.1 ⁇ m or more and 5 ⁇ m or less, and the ratio T ⁇ / T ave between the standard deviation T ⁇ of the protective layer thickness and the average film thickness T ave is set.
- it is 0.4 or less. That is, the protective layer is not formed with an extremely thick portion or an extremely thin portion. Therefore, even if the protective layer is formed thin, pinholes are hardly formed.
- the locally thin portion is not formed on the protective layer, even when solder is joined on the protective layer, the entire thickness of the protective layer can be suppressed from being alloyed and embrittled. Therefore, the peel strength of the protective layer itself is unlikely to decrease. Therefore, it is possible to provide an oxide superconducting wire that sufficiently fulfills the protective function of the oxide superconducting layer and suppresses the cost of the protective layer.
- FIG. 1 is a cross-sectional perspective view schematically showing an oxide superconducting wire according to a first embodiment of the present invention. It is a cross-sectional perspective view which shows typically the oxide superconducting wire which concerns on 2nd Embodiment of this invention. It is a cross-sectional perspective view which shows typically the oxide superconducting wire which concerns on 3rd Embodiment of this invention. It is a SEM photograph image of the cross section of the protective layer of the oxide superconducting wire of an Example. It is a SEM photograph image of the cross section of the protective layer of the oxide superconducting wire of a comparative example.
- FIG. 1 is a schematic cross-sectional view of an oxide superconducting wire 1 according to the first embodiment of the present invention.
- the oxide superconducting wire 1 of the present embodiment includes an intermediate body 6 in which an intermediate layer 4 and an oxide superconducting layer 5 are laminated on a tape-shaped substrate 3, and a main surface of the oxide superconducting layer 5 of the intermediate body 6 ( 1st surface)
- the oxide superconducting laminated body 1A which has the protective layer 2 formed on 5a is provided.
- the width direction of the wire is the X direction
- the longitudinal direction is the Y direction
- the thickness direction is the Z direction.
- the material of the base material 3 As the material of the base material 3, a nickel alloy represented by Hastelloy (registered trademark, USA), stainless steel, or an oriented Ni—W alloy in which a texture is introduced into a nickel alloy is applied.
- the thickness of the substrate 3 may be appropriately adjusted according to the purpose, and can be set in the range of 10 to 500 ⁇ m.
- the intermediate layer 4 formed on the base material 3 may have a laminated structure including a diffusion prevention layer, a bed layer, an alignment layer, and a cap layer in order from the base material side.
- the intermediate layer 4 may be configured by omitting one or both of the diffusion prevention layer and the bed layer.
- the diffusion prevention layer is made of Si 3 N 4 , Al 2 O 3 , GZO (Gd 2 Zr 2 O 7 ) or the like.
- the diffusion preventing layer is formed with a thickness of 10 to 400 nm, for example.
- the bed layer is a layer for reducing the interfacial reactivity and obtaining the orientation of the film formed on the bed layer.
- the thickness of the bed layer is, for example, 10 to 100 nm.
- the orientation layer is formed from a biaxially oriented material in order to control the crystal orientation of the cap layer on the orientation layer.
- Gd 2 Zr 2 O 7 MgO, ZrO 2 —Y 2 O 3 (YSZ), SrTiO 3 , CeO 2 , Y 2 O 3 , Al 2 O 3 , Gd 2 O 3 , Zr Examples thereof include metal oxides such as 2 O 3 , Ho 2 O 3 and Nd 2 O 3 .
- This alignment layer is preferably formed by an IBAD (Ion-Beam-Assisted Deposition) method.
- the cap layer is formed of a material that can be formed on the surface of the above-described alignment layer so that crystal grains can self-align in the in-plane direction.
- the cap layer is formed from CeO 2, Y 2 O 3, Al 2 O 3, Gd 2 O 3, ZrO 2, YSZ, Ho 2 O 3, Nd 2 O 3, LaMnO 3 , etc..
- the film thickness of the cap layer can be formed within a range of 50 to 5000 nm.
- the material of the oxide superconducting layer 5 may be a known oxide superconducting material, specifically, REBa 2 Cu 3 Oy called RE-123 series (RE is a rare earth element such as Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu represent 1 type or 2 types).
- RE is a rare earth element such as Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu represent 1 type or 2 types.
- Examples of the oxide superconducting layer 5 include Y123 (YBa 2 Cu 3 O 7-X ) and Gd123 (GdBa 2 Cu 3 O 7-X ).
- the oxide superconducting layer 5 has a thickness of about 0.5 to 5 ⁇ m and preferably a uniform thickness.
- oxide superconducting layer 5 After the oxide superconducting layer is formed, heat treatment is performed on the oxide superconducting layer 5 at 300 to 500 ° C. for 5 to 20 hours in an oxygen atmosphere (oxygen annealing treatment).
- oxygen annealing treatment The oxide superconducting layer 5 has a crystal structure in which oxygen is insufficient after film formation. Therefore, by performing the oxygen annealing treatment, oxygen can be supplied to the oxide superconducting layer 5 to adjust the crystal structure.
- the oxide superconducting layer 5 is subjected to oxygen annealing by performing oxygen annealing on the intermediate 6.
- the protective layer 2 is a layer formed on the main surface 5a of the oxide superconducting layer 5 and formed of Ag or an Ag alloy.
- the protective layer 2 may be formed not only on the main surface 5 a but also on the side surfaces 6 a and 6 a and the back surface 6 b of the intermediate body 6.
- a part of the sputtered particles (Ag particles) wrap around the side surface 6a and the back surface 6b of the intermediate body 6, so that the thin protection is also applied to the side surface 6a and the back surface 6b of the intermediate body 6.
- Layer 2 is formed.
- the protective layer 2 formed on the side surface 6a and the back surface 6b is omitted.
- the protective layer 2 protects the oxide superconducting layer 5. Moreover, the protective layer 2 bypasses the overcurrent generated at the time of an accident. In addition, the protective layer 2 suppresses a chemical reaction that occurs between the oxide superconducting layer 5 and a layer provided on the upper surface of the oxide superconducting layer 5, and part of the elements of one layer penetrates into the other layer. Therefore, it has a function of preventing deterioration of superconducting characteristics due to the composition being broken.
- the protective layer 2 can be formed by a film formation method such as sputtering at room temperature. An example of forming the protective layer 2 by sputtering will be described below. First, a target formed of Ag or an Ag alloy and the intermediate 6 are placed in a processing vessel in which the inside is decompressed to a vacuum state and Ar gas is introduced. At this time, the oxide superconducting layer 5 is disposed toward the target. Next, plasma is generated by ionizing Ar gas by applying a voltage to the target to cause discharge. Ar ions generated in the plasma sputter the target, and sputtered Ag particles are ejected from the target. Then, the protective particles 2 are formed by depositing the sputtered particles on the oxide superconducting layer 5.
- the protective layer 2 of Ag formed by sputtering at room temperature is mainly composed of an amorphous structure (amorphous) and has a uniform film thickness.
- this protective layer 2 is heated to a recrystallization temperature of 200 ° C. or higher, aggregation due to recrystallization of Ag occurs, and when the protective layer 2 is heated to 450 ° C. or higher, this aggregation becomes more prominent.
- the film thickness of the protective layer 2 becomes non-uniform and locally thin portions and pinholes are generated. Therefore, the protective layer 2 is preferably formed after the oxygen annealing treatment in which heat of 300 ° C. or higher is applied.
- the average thickness of the protective layer 2 formed at a time is 5 ⁇ m or less.
- the film formation is divided into a plurality of times, and the film formation target is cooled (or radiated) at each film formation. That is, after forming a film with an average film thickness of 5 ⁇ m or less, the film is once cooled, and then a film with an average film thickness of 5 ⁇ m or less is formed again.
- Ag in the protective layer 2 may be recrystallized due to the temperature rise of the deposition target during film formation by sputtering. When a film having an average film thickness of 5 ⁇ m or less is formed at a time, recrystallization of Ag can be suppressed.
- the average film thickness T ave which is the average value of the film thickness T of the protective layer 2
- the ratio T ⁇ / Tave to the film thickness Tave is 0.4 or less.
- average film thickness Tave here is when the film thickness of the protective layer 2 is measured at random over the longitudinal direction (Y direction) and the width direction (X direction) of the oxide superconducting wire 1.
- the average film thickness T ave may be obtained by measuring the protective layer 2 by continuously scanning in the width direction using a measuring instrument such as a step meter. As the value of the film thickness T increases, the standard deviation value T ⁇ also increases. Therefore, the ratio of the standard deviation T sigma to the average thickness T ave, can represent whether the thickness T is extremely large portions, and the thickness T is formed is extremely small portion.
- the ratio T ⁇ / T ave between the standard deviation T ⁇ of the film thickness T and the average film thickness T ave is small, because an extremely thick portion or an extremely thin portion is not formed in the protective layer 2. It means that the thickness T is stable and smooth.
- the ratio T ⁇ / Tave to 0.4 or less, the formation of pinholes can be suppressed without forming the protective layer 2 excessively thick. Therefore, the cost can be suppressed while sufficiently fulfilling the protection function. Since this protective layer 2 is formed with a uniform film thickness without Ag aggregation, the surface is smooth and has a metallic luster when observed from above.
- the average film thickness T ave of the protective layer 2 is preferably set to 0.1 ⁇ m or more and 5 ⁇ m or less.
- the average film thickness T ave of the protective layer 2 is It is preferable to set to 1 ⁇ m or more and 5 ⁇ m or less.
- a metal (for example, Sn) constituting the solder may erode the protective layer 2 to form an alloy layer of about 1 ⁇ m. Therefore, when providing solder, it is desirable to set the average film thickness T ave of the protective layer 2 to 1 ⁇ m or more.
- the average film thickness T ave of the protective layer 2 should be set to 0.1 ⁇ m or more and 2.5 ⁇ m or less. Is preferred. In the pretreatment of the wire rod by the plating method, the thickness of the protective layer 2 may be reduced by about 0.1 ⁇ m. Therefore, when forming a plating coating layer, it is desirable to set the average film thickness T ave of the protective layer 2 to 0.1 ⁇ m or more. Further, the cost can be reduced by forming the protective layer 2 as thin as possible. Therefore, it is preferable to form the protective layer 2 as thin as possible according to the layer formed on the protective layer 2.
- connection between the oxide superconducting wires 1 can be realized by soldering the protective layers 2 facing each other.
- the connection to the input terminal can also be realized by soldering the terminal to the protective layer 2.
- the solder adheres directly to the protective layer 2.
- the metal constituting the solder Sn as an example
- Ag of the protective layer 2 is alloyed.
- Ag becomes brittle when alloyed with Sn. Therefore, if the protective layer 2 has a locally thin portion, the entire thickness of the thin portion may be alloyed and the strength of the connection portion may be reduced.
- the average value T ave was set to 0.1 ⁇ m or more and 5 ⁇ m or less, and the ratio T ⁇ / T ave between the standard deviation T ⁇ and the average value T ave was set to 0.4 or less. Thereby, it can suppress that the full thickness of the protective layer 2 becomes brittle, and becomes easy to peel.
- FIG. 2 is a schematic cross-sectional view of the oxide superconducting wire 11 according to the second embodiment of the present invention.
- a stabilization layer 8 is further provided around the oxide superconducting wire 1 according to the first embodiment via a solder layer 7.
- the wire in the same mode as the oxide superconducting wire 1 (see FIG. 1) according to the first embodiment is referred to as an oxide superconducting laminate 1A.
- the stabilization layer 8 is formed by covering the oxide superconducting laminate 1A with a metal tape in a substantially C shape in cross section.
- the stabilization layer 8 is joined to the solder layer 7 on the outer periphery (lateral cross section) of the oxide superconducting laminate 1A.
- An embedded portion 7b in which the molten solder layer 7 is embedded is formed in a portion not covered with the metal tape (that is, between the side end portions of the metal tape).
- Stabilizing layer 8 wraps the metal tape from the main surface side (protective layer 2 side) of oxide superconducting laminate 1A so as to form a substantially C-shaped cross section while melting solder layer 7 and bends it with a roll. It can be formed by processing. In addition, it is preferable to use the metal tape which gave the solder plating to the double side
- the material of the metal tape constituting the stabilization layer 8 is not particularly limited as long as the material has good conductivity.
- the metal tape it is preferable to use a material formed from a relatively inexpensive material such as copper, brass (Cu—Zn alloy), a copper alloy such as a Cu—Ni alloy, or stainless steel.
- the metal tape is preferably made of copper because it has high conductivity and is inexpensive.
- the stabilization layer 8 serves as a bypass for commutating overcurrent generated at the time of an accident.
- the stabilization layer 8 is used for instantaneously suppressing an overcurrent generated when quenching occurs and the state is changed to a normal conducting state.
- the material used for the stabilization layer 8 is preferably a high resistance metal such as a Ni-based alloy such as Ni—Cr.
- the thickness of the metal tape constituting the stabilization layer 8 is not particularly limited and can be adjusted as appropriate, but can be set to 9 to 60 ⁇ m. If the thickness of the metal tape is too thin, there is a risk of tearing in the processing process. If it is too thick, it becomes difficult not only to form a substantially C-shaped cross section but also to apply high stress at the time of forming. Therefore, the oxide superconducting layer 5 may be deteriorated.
- the solder used for the solder layer 7 is not particularly limited, and a conventionally known solder can be used. Among these, by using a solder having a melting point of 300 ° C. or less, it is possible to suppress deterioration of the characteristics of the oxide superconducting layer 5 due to heat of soldering.
- the oxide superconducting wire 11 according to the present embodiment has the stabilization layer 8 formed in the transverse cross section of the oxide superconducting laminate 1A, it is possible to realize a structure that does not allow moisture to enter inside.
- a stabilization layer can also be formed by spirally winding a metal tape around the outer periphery of the oxide superconducting laminate 1A.
- the stabilization layer 8 may be formed on the entire outer periphery of the oxide superconducting laminate 1A.
- the stabilization layer 8 only needs to be formed on at least the protective layer 2.
- the metal constituting the solder for example, Sn
- Ag of the protective layer 2 becomes brittle.
- the embrittlement is limited to the vicinity of the interface with the solder layer 7 in the protective layer 2, but when the protective layer 2 has a locally thin portion, the entire thickness of the protective layer 2 becomes brittle and the metal tape is easily peeled off. Become. That is, the peel strength of the stabilization layer 8 is reduced.
- the oxide superconducting wire 11 of the present embodiment forms the protective layer 2 after the oxygen annealing treatment, Ag aggregation of the protective layer 2 is suppressed. Therefore, the protective layer 2 is not locally thinned. Therefore, Ag alloying does not reach the entire thickness of the protective layer 2, and a decrease in peel strength of the stabilization layer 8 can be suppressed.
- FIG. 3 is a schematic cross-sectional view of the oxide superconducting wire 12 according to the third embodiment.
- the oxide superconducting wire 12 of this embodiment is further provided with a plating coating layer 9 (stabilization layer) by plating around the oxide superconducting wire 1 (oxide superconducting laminate 1A) of the first embodiment. .
- the plating coating layer 9 is made of a highly conductive metal material.
- the plating coating layer 9 is bypassed together with the protective layer 2 and functions as a stabilization layer.
- the plating coating layer 9 can completely block the oxide superconducting laminate 1A from the outside. Therefore, it is possible to reliably prevent moisture from entering the oxide superconducting layer 5.
- the metal used for the plating coating layer 9 include copper, nickel, gold, silver, chromium, and tin. Among these metals, one kind or a combination of two or more kinds can be used.
- the oxide superconducting wire 12 is used for a superconducting fault current limiter
- examples of the material used for the plating coating layer 9 include high resistance metals such as Ni-based alloys such as Ni—Cr.
- the thickness of the plating coating layer 9 is not particularly limited and can be adjusted as appropriate, but is preferably set to 10 to 100 ⁇ m. By setting the thickness of the plating coating layer 9 to 10 ⁇ m or more, the periphery of the oxide superconducting laminate 1A can be reliably covered. On the other hand, when the thickness of the plating coating layer 9 exceeds 100 ⁇ m, the oxide superconducting wire 12 is enlarged and the flexibility is deteriorated.
- the plating coating layer 9 may be formed on the entire outer periphery of the oxide superconducting laminate 1A. The plating coating layer 9 only needs to be formed on at least the protective layer 2.
- the plating coating layer 9 can be formed by a conventionally known plating method. That is, it is performed by immersing the oxide superconducting laminate 1A in a plating solution (in the case of electroplating, electricity is applied to the surface of the oxide superconducting laminate 1A, which is the object to be plated, in a state of being immersed in the plating solution). If a pinhole is formed on the protective layer 2, the oxide superconducting layer 5 exposed by the pinhole and the plating solution come into contact with each other, and the oxide superconducting layer 5 is corroded. This may cause deterioration of superconducting characteristics. In the oxide superconducting wire 12 according to this embodiment, Ag aggregation of the protective layer 2 is suppressed, and no pinhole is formed. Therefore, even if immersed in the plating solution, the superconducting characteristics do not deteriorate.
- Al 2 O 3 (diffusion prevention layer; film thickness 100 nm) is formed on the main surface of the base material by sputtering, and Y 2 O 3 (bed layer; film thickness 30 nm) is formed thereon by ion beam sputtering.
- MgO metal oxide layer; film thickness: 5 to 10 nm
- 500 nm thick is formed thereon by pulsed laser deposition (PLD method).
- CeO 2 cap layer
- a 2.0 ⁇ m thick GdBa 2 Cu 3 O 7- ⁇ oxide superconducting layer was formed on the CeO 2 layer by the PLD method.
- the sample A thus produced is commonly used in the following examples and comparative examples.
- Example 1 Sample A described above was oxygen annealed in an oxygen atmosphere at 500 ° C. for 10 hours, and was taken out after 26 hours of furnace cooling. Next, a protective layer made of Ag having the average film thickness shown in Table 1 shown later was formed on the oxide superconducting layer by sputtering. Thus, the oxide superconducting wire of the Example was produced.
- the oxide superconducting wire of the comparative example was produced.
- the oxide superconducting wires of the example and the comparative example differ in the order of oxygen annealing and film formation of the protective layer in the production procedure.
- the oxide superconducting wire of the example forms a protective layer after the oxygen annealing treatment. Therefore, compared with the comparative example of the conventional manufacturing method, there is a concern that the interface state between the oxide superconducting layer and the protective layer is changed and the resistance value at the interface is increased. Therefore, in the oxide superconducting wires of Examples and Comparative Examples, the interface resistance between the oxide superconducting layer and the protective layer was measured. The average value of the interface resistance measured by preparing three oxide superconducting wires of Examples and Comparative Examples is shown below.
- the average film thickness T ave and the standard deviation T ⁇ were calculated based on continuous film thickness data obtained by scanning the upper surface of the protective layer continuously over 1 mm using a step gauge. Similarly, the arithmetic average roughness Ra was calculated using a roughness meter for the upper surface of the protective layer.
- peel strength was measured by fixing the tip of a 2.7 mm diameter stud pin to the surface of a copper tape with an epoxy resin (adhesive area of the pin tip of 5.72 mm 2 ), and attaching the stud pin to the film-forming surface of the wire
- peel stress peel strength
- measurement was performed at 10 locations for each sample. The maximum and minimum values and the average value of the measured values are shown in Table 1 below.
- the protective layer of Example has a uniform thickness. 4 and 5, the thin film portion formed on the protective layer is carbon deposited when the cross section is processed by FIB (focused ion beam). Moreover, from the results shown in Table 1, the protective layer of the example has a ratio T ⁇ / Tave of the standard deviation T ⁇ and the average film thickness Tave of 0.4 or less. On the other hand, T ⁇ / T ave of the comparative example is 0.76, and it can be read from the data that a thick part and a thin part are formed in the protective layer. Moreover, the peeling strength of such an Example is high with respect to the peeling strength of a comparative example.
- the oxide superconducting wire of the comparative example has a non-uniform thickness of the protective layer, and a locally thin portion is formed. Therefore, it is considered that the entire thickness is alloyed with the solder and embrittled in that portion. . On the other hand, since the protective layer of the oxide superconducting wire of the example is formed uniformly, it is considered that the alloying does not reach the full thickness and the strength is maintained.
- the thickness distribution of the protective layer is uniform and T ⁇ is small.
- the arithmetic average roughness Ra of the protective layer surface is 80 nm or less. Therefore, in the oxide superconducting wire in which the protective layer is formed after the oxidation annealing treatment of the intermediate, the value of Ra on the surface of the protective layer formed from Ag is preferably 80 nm or less. Thus, if Ra is as small as 80 nm or less, there is no possibility that the oxide superconducting layer is exposed even when the protective layer is formed thin.
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Abstract
Description
本願は、2013年12月25日に日本に出願された特願2013-267921号に基づき優先権を主張し、その内容をここに援用する。
したがって、上記の酸化物超電導線材において、水分の影響や外部からの負荷に対し酸化物超電導層を保護する目的で、表面を覆う保護層を形成する技術が開示されている(例えば特許文献1)。保護層としては、酸化物超電導層と反応性が低いAg又はAg合金を用いることが知られている。
ピンホールが発生すると、水分の浸入を許すなど保護層としての機能を果たすことができない。ピンホールを抑制するためには、保護層を厚く形成する必要があるが、Agは高価な金属であるため、Agの使用量は少なくすることが望ましい。
上記第一態様において、前記保護層がAg又はAg合金から形成されていてもよい。
保護層の平均膜厚Taveを0.1μm以上、5μm以下とし、膜厚の標準偏差Tσと前記平均膜厚Taveの比Tσ/Taveを、0.4以下とすることにより、保護層を過剰に厚く形成することなくピンホールの形成を抑制できる。したがって保護機能を十分に果たしつつ保護層のコストを抑えることができる。
上記態様に係る酸化物超電導線材は、保護層上に、半田を介して金属テープを密着させ電流特性を安定化することができる。その他に、上記態様に係る酸化物超電導線材を一対用意し、保護層同士を対向させて、半田を介して接続することができる。これらの場合においては、保護層に直接半田が密着する。保護層に半田が密着すると、半田を構成する金属(一例としてSn)が保護層に侵食し保護層のAgが合金化する。Agは合金化することで脆化することがある。保護層に局所的に薄い部分があると、この薄い部分において保護層の全厚が脆化し、保護層自身が剥離しやすくなる。これによって、上記のような金属テープが剥離しやすくなったり、接続部分の強度が低下したりする。
本発明の上記態様によれば、保護層の平均膜厚Taveを0.1μm以上、5μm以下に設定し、膜厚の標準偏差Tσと平均膜厚Taveとの比Tσ/Taveを、0.4以下に設定する。そのため、保護層に局所的に薄い部分がないため、合金化による脆化が生じても、この脆化が保護層の全厚に達することがなく、強度(接続部の強度、又は金属テープの剥離強度)が低下することを抑制できる。
加えて、この酸化物超電導線材は、酸化物超電導積層体の外周にメッキ被覆層を設けて、電流特性を安定化することができる。この場合においては、酸化物超電導線材をメッキ液に浸してメッキ被覆層を形成する。保護層はピンホール形成が抑制されているため、メッキ液が酸化物超電導層に触れて酸化物超電導層が腐食することがない。したがって、超電導特性が低下することを防ぐことができる。
また、上記第一態様に係る酸化物超電導線材は、前記を有する酸化物超電導積層体の外周に形成され、メッキ被覆層から形成される安定化層をさらに有していてもよい。
安定化層を形成することで、酸化物超電導線材の電流特性を安定化できる。酸化物超電導線材の外周を覆うように、安定化層を形成する場合においては、酸化物超電導層が外部から封止され、水分の浸入による超電導特性の劣化を防ぐことができる。
上記第一態様において、前記保護層は、前記中間体を酸素アニール処理した後に形成されてもよい。
従来、酸素アニール処理は保護層を形成した後に行われていたため、酸素アニール処理に伴う加熱によってAgの凝集が起こり、保護層に局所的に薄くなる部分やピンホールが形成されていた。しかしながら、酸素アニール処理を行った後に保護層を形成することで、Agの凝集や再結晶化が抑制され均一な膜厚の保護層を実現できる。
上記第一態様において、前記保護層の表面の算術平均粗さRaが80nm以下であってもよい。
上記第二態様において、前記保護層がAg又はAg合金から形成されていてもよい。
従来、酸素アニール処理は保護層を形成した後に行われていたため、酸素アニール処理に伴う加熱によってAgの凝集が起こり、保護層に局所的に薄くなる部分やピンホールが形成されていた。しかしながら、酸素アニール処理を行った後に保護層を形成することで、Agの凝集や再結晶化が抑制され均一な膜厚の保護層を実現できる。
また、上記第二態様において、前記保護層を成膜する際、スパッタ法によって平均膜厚5μm以下の前記保護層を成膜する工程と、前記酸化物超電導線材を冷却又は放熱する工程と、を繰り返し行ってもよい。
スパッタ法による成膜において、スパッタ粒子(Ag粒子)が被成膜体に衝突すると衝突時の運動エネルギーが熱エネルギーに変換され、被成膜体の表面が温度上昇する。被成膜体である酸化物超電導層が温度上昇すると、酸化物超電導層中の酸素が抜け出し超電導特性の劣化が起こる虞がある。一回の成膜工程で成膜される保護層の厚さを5μm以下とすることで、酸化物超電導層から酸素が抜け出すことを抑制し、超電導特性の劣化を防ぐことができる。
上記第二態様において、前記保護層の表面の算術平均粗さRaが80nm以下であってもよい。
即ち保護層には、極端に厚い部分、極端に薄い部分が形成されていない。したがって、保護層を薄く形成したとしてもピンホールが形成されにくい。また、局所的に薄い部分が保護層に形成されていないことで、保護層上に半田を接合しても、保護層の全厚が合金化し脆化することを抑制できる。したがって、保護層自身の剥離強度が低下しにくい。
したがって酸化物超電導層の保護機能を十分に果たしつつ保護層のコストを抑えた酸化物超電導線材を提供できる。
図1に本発明の第1実施形態に係る酸化物超電導線材1の横断面の模式図を示す。本実施形態の酸化物超電導線材1は、テープ状の基材3に中間層4と酸化物超電導層5とが積層された中間体6と、中間体6の酸化物超電導層5の主面(第1の面)5a上に形成される保護層2とを有する酸化物超電導積層体1Aを備えている。
なお、本明細書中の各図において、線材の幅方向をX方向、長手方向をY方向、厚さ方向をZ方向とする。
拡散防止層は、Si3N4、Al2O3、GZO(Gd2Zr2O7)等から構成される。拡散防止層は、例えば厚さ10~400nmに形成される。ベッド層は、界面反応性を低減し、ベッド層上に形成される膜の配向性を得るための層であり、Y2O3や、Er2O3、CeO2、Dy2O3、Er2O3、Eu2O3、Ho2O3、La2O3等から形成される。ベッド層の厚さは例えば10~100nmである。配向層は、配向層上のキャップ層の結晶配向性を制御するために2軸配向する物質から形成される。配向層の材質としては、Gd2Zr2O7や、MgO、ZrO2-Y2O3(YSZ)、SrTiO3、CeO2、Y2O3、Al2O3、Gd2O3、Zr2O3、Ho2O3、Nd2O3等の金属酸化物を例示することができる。
この配向層はIBAD(Ion-Beam-Assisted Deposition)法で形成することが好ましい。
キャップ層は、上述の配向層の表面に成膜されて結晶粒が面内方向に自己配向し得る材料から形成される。具体的には、キャップ層は、CeO2、Y2O3、Al2O3、Gd2O3、ZrO2、YSZ、Ho2O3、Nd2O3、LaMnO3等から形成される。キャップ層の膜厚は50~5000nmの範囲内に形成できる。
まず、Ag又はAg合金から形成されるターゲットと中間体6とを、内部を真空状態に減圧しArガスを導入した処理容器内に配置する。このとき、酸化物超電導層5をターゲットに向けて配置する。次に前記ターゲットに電圧を印加し放電させることでArガスをイオン化してプラズマを生成する。プラズマ中に生成されたArのイオンが、前記ターゲットをスパッタしてターゲットからAgのスパッタ粒子がはじき出される。そして、当該スパッタ粒子が酸化物超電導層5上に堆積することで、保護層2が成膜される。
被成膜体の温度上昇は、一回に成膜する保護層2の膜厚(成膜レート)と相関関係を有している。酸化物超電導層5の超電導特性の劣化を抑制するためには、一回に成膜する保護層2の平均膜厚を5μm以下とすることが好ましい。平均膜厚が5μmを超える保護層2を形成する場合は、成膜を複数回に分け、各成膜の度に被成膜体を冷却(又は放熱)する。即ち、平均膜厚5μm以下の成膜を行った後に、一旦冷却し、その後、再度平均膜厚5μm以下の成膜を行う。
また、スパッタ法による成膜における被成膜体の温度上昇により、保護層2のAgが再結晶化することがある。一回に平均膜厚5μm以下の成膜を行う場合にはAgの再結晶化を抑制できる。
膜厚Tの値が大きくなると、その標準偏差の値Tσも大きくなる。そこで、平均膜厚Taveに対する標準偏差Tσの比により、膜厚Tが極端に大きい部分、及び膜厚Tが極端に小さい部分が形成されているかどうかを表現できる。
膜厚Tの標準偏差Tσと平均膜厚Taveとの比Tσ/Taveが小さいことは、保護層2に、極端に厚い部分、又は極端に薄い部分が形成されておらず、膜厚Tが安定し平滑であることを意味する。
本実施形態において、比Tσ/Taveを、0.4以下とすることによって、保護層2を過剰に厚く形成することなくピンホールの形成を抑制できる。したがって保護機能を十分に果たしつつコストを抑えることができる。
この保護層2は、Agの凝集がなく、均一な膜厚に形成されているため、表面が平滑であり上面から観察すると金属光沢を有する。
保護層2の上に半田を介して線材同士を接続する場合、又は半田層を介して金属テープなどから形成される安定化層を形成する場合には、保護層2の平均膜厚Taveは、1μm以上5μm以下に設定することが好ましい。保護層2上に半田を設けると、半田を構成する金属(例えばSn)が保護層2に侵食し1μm程度の合金層を形成することがある。したがって、半田を設ける場合には、保護層2の平均膜厚Taveを1μm以上に設定することが望ましい。
保護層2を形成した酸化物超電導線材1の外周にメッキ法によるメッキ被覆層を形成する場合には、保護層2の平均膜厚Taveは、0.1μm以上2.5μm以下に設定することが好ましい。メッキ法による線材の前処理において、保護層2の膜厚が0.1μm程度減少することがある。したがって、メッキ被覆層を形成する場合には、保護層2の平均膜厚Taveを0.1μm以上に設定することが望ましい。
また、保護層2をできるだけ薄く形成することでコスト低減を図ることができる。したがって、保護層2の上に形成される層に応じて、できるだけ薄く保護層2を形成することが好ましい。
図2に本発明の第2実施形態に係る酸化物超電導線材11の横断面の模式図を示す。
本実施形態に係る酸化物超電導線材11は、第1実施形態に係る酸化物超電導線材1の周囲にさらに半田層7を介して安定化層8が設けられている。
以下、第2、第3実施形態の説明では、第1実施形態に係る酸化物超電導線材1(図1参照)と同態様の線材を酸化物超電導積層体1Aと呼ぶ。
このように加工することで、溶融した半田(金属テープに予め施された半田メッキ)が、金属テープの側端部同士の隙間に集中し、埋込部7bが形成される。
この酸化物超電導線材11において安定化層8は、事故時に発生する過電流を転流するバイパスとなる。
また、酸化物超電導線材11を超電導限流器に使用する場合において安定化層8は、クエンチが起こり常電導状態に転移した時に発生する過電流を瞬時に抑制するために用いられる。この場合、安定化層8に用いられる材料は、例えば、Ni-Cr等のNi系合金等の高抵抗金属を用いる事が好ましい。
図3に第3実施形態に係る酸化物超電導線材12の横断面の模式図を示す。
本実施形態の酸化物超電導線材12は、第1実施形態の酸化物超電導線材1(酸化物超電導積層体1A)の周囲にさらにメッキ法によるメッキ被覆層9(安定化層)が設けられている。
また、メッキ被覆層9により、酸化物超電導積層体1Aを外部から完全に遮断することが可能となる。したがって、酸化物超電導層5に水分が浸入することを確実に防ぐことができる。
メッキ被覆層9に使用する金属としては、銅や、ニッケル、金、銀、クロム、錫などを挙げることができ、これ等の金属のうち一種又は二種以上を組み合わせて用いる事ができる。また、酸化物超電導線材12を超電導限流器に使用する場合に、メッキ被覆層9に用いられる材料は、例えば、Ni-Cr等のNi系合金等の高抵抗金属が挙げられる。
保護層2上にピンホールが形成されていると、ピンホールにより露出した酸化物超電導層5とメッキ液が接触して、酸化物超電導層5が腐食する。これにより、超電導特性の劣化を引き起こす虞がある。
本実施形態に係る酸化物超電導線材12は、保護層2のAg凝集が抑制されておりピンホールが形成されることがない。したがって、メッキ液に浸しても、超電導特性が低下することがない。
<試料の作製>
まず、ハステロイC-276(米国ヘインズ社商品名)から形成される幅10mm、厚さ0.1mm、長さ1000mmのテープ状の基材の表面を平均粒径3μmのアルミナを使用し研磨した。次に、前記基材の表面をアセトンにより脱脂、洗浄した。
この基材の主面上にスパッタ法によりAl2O3(拡散防止層;膜厚100nm)を成膜し、その上に、イオンビームスパッタ法によりY2O3(ベッド層;膜厚30nm)を成膜した。
次いで、このベッド層上に、イオンビームアシスト蒸着法(IBAD法)によりMgO(金属酸化物層;膜厚5~10nm)を形成し、その上にパルスレーザー蒸着法(PLD法)により500nm厚のCeO2(キャップ層)を成膜した。次いでCeO2層上にPLD法により2.0μm厚のGdBa2Cu3O7-δ(酸化物超電導層)を形成した。
このように作製した試料Aを以下の実施例及び比較例で共通して使用する。
上述した試料Aを500℃で10時間、酸素雰囲気中において酸素アニールし、26時間の炉冷却後に取り出した。
次にこの試料に対し、スパッタ法により酸化物超電導層上に後段に示す表1の平均膜厚を有し、Agから形成される保護層を形成した。
このように、実施例の酸化物超電導線材を作製した。
上述した試料Aに対し、スパッタ法により酸化物超電導層上にAgから形成される保護層を形成した。
次にこの試料を500℃で10時間、酸素雰囲気中において酸素アニールし、26時間の炉冷却後に取り出した。
このように、比較例の酸化物超電導線材を作製した。
実施例と比較例との酸化物超電導線材は、その作製手順において、酸素アニールと保護層の成膜との順序が異なる。
(臨界電流特性)
実施例及び比較例の酸化物超電導線材をそれぞれ3本用意し、これらの臨界電流値(Ic)を測定した。それぞれ3本の酸化物超電導線材のIcの平均値は以下のようになった。
実施例:545A
比較例:539A
実施例の酸化物超電導線材は、酸素アニール処理の後に保護層を形成している。したがって、従来製法の比較例と比べて、酸化物超電導層と保護層の界面状態が変わり、界面における抵抗値が上昇していることが懸念される。そこで、実施例及び比較例の酸化物超電導線材において、酸化物超電導層と保護層との界面抵抗を測定した。
実施例及び比較例の酸化物超電導線材をそれぞれ3本用意し測定した界面抵抗の平均値を以下に示す。
実施例:4.2×10-8Ω・cm2
比較例:3.9×10-8Ω・cm2
実施例及び比較例の酸化物超電導線材を切断し、断面の保護層を走査型電子顕微鏡(SEM)により観察した。
図4に、実施例の酸化物超電導線材に形成された保護層の断面のSEM写真像を示す。図5に、比較例の酸化物超電導線材に形成された保護層の断面のSEM写真像を示す。また、表1に実施例及び比較例の保護層の平均膜厚Tave、標準偏差Tσ、及び算術平均粗さRaの測定結果を示す。平均膜厚Taveと標準偏差Tσは、段差計を用いて、保護層の上面を1mmに亘り連続的にスキャンすることによって求めた連続的な膜厚のデータを基にして算出した。同様に、算術平均粗さRaは、保護層の上面について、粗さ計を用いて算出した。
次に、実施例及び比較例の酸化物超電導線材の保護層に、幅10mm、厚さ0.1mm、長さ1000mmの銅テープを半田付けし、この銅テープと酸化物超電導線材との剥離強度を測定した。
測定は、スタッドプル剥離試験により銅テープ(金属テープ)が剥離する強度を測定した。剥離強度の測定は、銅テープの表面に直径2.7mmのスタッドピンの先端部をエポキシ樹脂で接着固定(ピン先端部の接着面積5.72mm2)し、このスタッドピンを線材の成膜面に対して垂直方向に引っ張り、応力が低下した瞬間の引張荷重を剥離応力(剥離強度)として行った。
スタッドプル剥離試験は、各サンプルについて10カ所の測定を行った。測定値の最大値と最小値、並びに平均値を以下の表1に示す。
また、表1に示す結果から、実施例の保護層は、標準偏差Tσと平均膜厚Taveの比Tσ/Taveが0.4以下となっている。これに対し、比較例のTσ/Taveは、0.76となっており、データからも厚い部分と薄い部分とが保護層に形成されていると読み取れる。
また、このような実施例の剥離強度は、比較例の剥離強度に対し高くなっている。比較例の酸化物超電導線材は、保護層の膜厚が不均一であり、局所的に薄い部分が形成されているため、その部分において、全厚が半田と合金化して脆化したためと考えられる。これに対し、実施例の酸化物超電導線材の保護層は、膜厚が均一に形成されているため、合金化が全厚に及ばず、強度が維持されていると考えられる。
Claims (11)
- テープ状の基材と、前記基材の主面上に形成された中間層と、前記中間層上に形成された酸化物超電導層と、を有する中間体と、前記中間体上に形成された保護層と、を有する酸化物超電導積層体を備え、
前記保護層の平均膜厚Taveが、0.1μm以上、5μm以下であり、
前記保護層の膜厚の標準偏差Tσと前記平均膜厚Taveとの比Tσ/Taveが、0.4以下である酸化物超電導線材。 - 前記保護層がAg又はAg合金から形成される請求項1に記載の酸化物超電導線材。
- 前記保護層に接合され、金属テープから形成される安定化層をさらに有する請求項1に記載の酸化物超電導線材。
- 前記酸化物超電導積層体の外周に形成され、メッキ被覆層から形成される安定化層をさらに有する請求項1に記載の酸化物超電導線材。
- 前記保護層は、前記中間体を酸素アニール処理した後に形成される請求項1に記載の酸化物超電導線材。
- 前記保護層の表面の算術平均粗さRaが80nm以下である請求項1に記載の酸化物超電導線材。
- 基材と、前記基材上に形成された中間層と、前記中間層上に形成された酸化物超電導層と、を有する中間体を用意し、
前記中間体に酸素アニール処理を行い、
前記酸素アニール処理を行った後に、前記酸化物超電導層上に保護層を成膜する酸化物超電導線材の製造方法。 - 前記保護層がAg又はAg合金から形成される請求項7に記載の酸化物超電導線材の製造方法。
- 前記保護層を成膜する際、スパッタ法によって平均膜厚5μm以下の前記保護層を成膜した後で、前記酸化物超電導線材を冷却又は放熱する請求項7に記載の酸化物超電導線材の製造方法。
- 前記保護層を成膜する際、スパッタ法によって平均膜厚5μm以下の前記保護層を成膜する工程と、前記酸化物超電導線材を冷却又は放熱する工程と、を繰り返し行う請求項7に記載の酸化物超電導線材の製造方法。
- 前記保護層の表面の算術平均粗さRaが80nm以下である請求項7に記載の酸化物超電導線材の製造方法。
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EP3089172A1 (en) | 2016-11-02 |
EP3089172B1 (en) | 2019-05-01 |
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