WO2015072138A1 - 電子部品およびその製造方法 - Google Patents
電子部品およびその製造方法 Download PDFInfo
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- WO2015072138A1 WO2015072138A1 PCT/JP2014/005679 JP2014005679W WO2015072138A1 WO 2015072138 A1 WO2015072138 A1 WO 2015072138A1 JP 2014005679 W JP2014005679 W JP 2014005679W WO 2015072138 A1 WO2015072138 A1 WO 2015072138A1
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- WIPO (PCT)
- Prior art keywords
- silicone resin
- exterior
- aluminum hydroxide
- electronic component
- exterior material
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/102—Varistor boundary, e.g. surface layers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1006—Thick film varistors
Definitions
- the technology of the present disclosure relates to a technology for making flame retardant or non-flammable for an exterior material covering an element with respect to an electronic component such as a voltage nonlinear resistor.
- combustible materials such as plastics are used for the housing to reduce weight, and electronic components are required to have higher mounting density due to demands for smaller devices. Burnout of electronic components causes damage to adjacent electronic components and the entire device.
- Varistors are used as electronic components that protect electronic components and equipment from such inconveniences. Since the varistor has a voltage non-linear resistance characteristic in which the resistance rapidly decreases in response to an increase in applied voltage, it is used as a surge absorbing element.
- An example of a varistor is a sintered body obtained by mixing a small amount of bismuth oxide powder with zinc oxide powder, forming it into a disk shape using a mold, and then sintering at 1000 [° C.] or higher.
- a disk-shaped electrode smaller in diameter than the sintered body is baked on both surfaces, and an element is formed by connecting a lead wire to each outer surface of the electrode by soldering.
- the element is covered with an epoxy resin, etc. Is formed. This exterior functions to increase the mechanical strength and heat resistance of the varistor.
- Varistors are generally used to protect electronic components and equipment from external or internal surges. However, when a varistor absorbs a surge that exceeds the limit of absorbed energy, it breaks and short-circuits, and its exterior material burns. There is a fear.
- the exterior material of the varistor is generally formed of an inorganic filler component and an epoxy resin component, and the combustion of the exterior material is due to the combustion of the epoxy resin component.
- flame retardant materials are used for the exterior material.
- an epoxy resin containing bromide or antimony which is a flame retardant, is used for the flame retardant material.
- epoxy resin is flame retardant, it may burn if the varistor generates heat and continues to generate heat. Once combusted, the combustion may continue until the combustible component in the exterior material disappears.
- bromide and antimony flame retardants are added to make the exterior material incombustible.
- this flame retardant is increased, the heating flow rate (fluidity) of the resin itself is lowered, and it becomes difficult to form an exterior film.
- powder resin coating when the amount of resin is 30 wt% or less, it is difficult to form an exterior film. If the combustible component in the exterior material is reduced below the combustion limit amount, the exterior material can be made incombustible.
- Brom flame retardant has a function of suppressing the combustion of resin components by gasification.
- the gasified bromo component has a large environmental load, such as destruction of the ozone layer, and its use tends to be limited.
- a varistor using a silicone resin as a coating material excellent in flame retardancy for a protective coat is known instead of a brominated flame retardant (for example, Patent Document 1).
- a varistor in which a curing agent is added to a liquid silicone main component, and a silicone rubber obtained by adding aluminum hydroxide to the two components is used as an exterior material (for example, Patent Document 3).
- an object of the present invention is to reduce silicone resin while maintaining nonflammability and dielectric strength characteristics.
- a method for manufacturing an electronic component using an exterior material containing a silicone resin and the range is 60 wt% or more and less than 70 wt%.
- a step of dipping the element into an outer packaging material containing aluminum resin or magnesium hydroxide with a controlled addition amount and a silicone resin to which a nonpolar solvent is added, and drying the outer packaging material formed on the surface of the element And a step of evaporating the nonpolar solvent and exposing the silicone resin component to the surface of the exterior material, and a curing step of curing the exterior material.
- the amount of the aluminum hydroxide or the magnesium hydroxide added may be in the range of 60 wt% to 65 wt%.
- the average particle diameter of the aluminum hydroxide or the magnesium hydroxide may be in the range of 15 [ ⁇ m] or more and less than 50 [ ⁇ m].
- the nonpolar solvent may have a vapor pressure of 0.5 to 10 [kPa].
- the amount of the aluminum hydroxide or the magnesium hydroxide added is in the range of 60 wt% to less than 70 wt%, and the nonpolar solvent is exposed on the surface of the exterior material by drying. As a result of evaporation, the silicone resin is exposed on the surface of the exterior material and hardened.
- the average particle diameter of the aluminum hydroxide or the magnesium hydroxide may be in the range of 15 [ ⁇ m] or more and less than 50 [ ⁇ m].
- the exterior material may include aluminum hydroxide or magnesium hydroxide having a concentration gradient of 84 to 100% within a depth of 30% from the surface of the exterior material.
- Silicone resin can be reduced while maintaining the nonflammability and dielectric strength characteristics of the outer casing.
- FIG. 1 shows a cross section of the varistor.
- the varistor 2 is a voltage non-linear resistor and is an example of the electronic component of the present disclosure.
- the surface of a voltage non-linear resistance element (hereinafter simply referred to as “element”) 4 is covered with an exterior material 6.
- the element 4 is an example of a varistor element.
- a ceramic body 8 is used for the element 4.
- the ceramic body 8 is, for example, a sintered body containing zinc oxide as a main component and added with magnesium oxide, bismuth oxide, cobalt oxide and the like.
- This sintered body is, for example, a column having a diameter of about 10 [mm].
- the electrodes 10-1 and 10-2 are installed on the surface of the ceramic body 8.
- a lead wire 12-1 is connected to the electrode 10-1 by solder, and a lead wire 12-2 is connected to the electrode 10-2 by solder.
- the exterior material 6 includes an exterior resin layer 6-1 and a glass layer 6-2.
- the exterior resin layer 6-1 is an example of a first coating layer
- the glass layer 6-2 is an example of a second coating layer.
- FIG. 2A shows the manufacturing method of the varistor 2 in the order of steps.
- the manufacturing method of the varistor 2 includes an element forming step S1, a dipping step S2, a drying step S3, a curing step S4, and a coating step S5.
- the element 4 is formed.
- the ceramic body 8 of the element 4 is obtained by adding magnesium oxide, bismuth oxide, cobalt oxide, or the like to zinc oxide, which is a main component, and sintering it.
- the sintered body obtained by this sintering is, for example, a column having a diameter of about 10 [mm].
- the electrode 10-1 is printed on one surface side of the ceramic body 8 and the electrode 10-2 is printed on the other surface side and fired.
- the aforementioned lead wire 12-1 is connected to the electrode 10-1 by soldering, and the electrode 10-2 is connected to the lead wire 12-2 by soldering.
- the process proceeds to the dipping step S2.
- the exterior resin layer 6-1 of the exterior material 6 is formed on the element 4 obtained in the element formation step S1.
- the exterior resin 14 is used for the exterior resin layer 6-1.
- the exterior resin 14 has an aluminum hydroxide 18 and a solvent 20 added to the silicone resin 16.
- the range of this addition amount is more preferably 60 [wt%] or more and 65 [wt%] or less.
- a non-polar solvent type having good compatibility with the silicone resin 16 may be used.
- the silicone resin 16 is repelled, so that pinholes are generated and air bubbles remain inside the exterior resin layer 6-1 during drying. Therefore, compatibility with the silicone resin 16 is important.
- the nonpolar solvent for example, any of benzene, toluene, xylene, cyclohexane and the like may be used.
- the exterior resin 14 By adding the solvent 20, the exterior resin 14 can be reduced in viscosity, the amount of the aluminum hydroxide 18 added to the exterior resin 14 can be increased, and the formability of the exterior resin 14 can be improved.
- the aluminum hydroxide 18 can be uniformly dispersed, it is possible to prevent a decrease in the withstand voltage due to the uneven distribution of the aluminum hydroxide 18 in the planar direction of the exterior resin layer 6-1.
- the exterior resin layer 6-1 of the varistor 2 since the exterior resin layer 6-1 has a single layer structure, unlike the two-layer structure, even if a pinhole occurs in the exterior resin layer 6-1, it cannot be covered with the second layer. That is, the exterior resin layer 6-1 of the varistor 2 must prevent uneven distribution and pinholes of the aluminum hydroxide 18 while increasing the compounding ratio of the aluminum hydroxide 18 in order to improve flame retardancy. Therefore, a nonpolar solvent 20 having good compatibility with the aluminum hydroxide 18 is put in the silicone resin 16. In such a configuration, it is necessary to reduce both the viscosity and prevent the aluminum hydroxide 18 from being unevenly distributed without generating pinholes in the exterior resin 14, and to realize both improvement of the withstand voltage and maintenance of the formability of the outer surface. .
- the vapor pressure is high, pinholes are generated, and the surface state of the exterior resin layer 6-1 is not preferable.
- the vapor pressure is low, the surface state of the exterior resin layer 6-1 is good, but it takes time to evaporate the solvent 20 in the drying step.
- FIG. 3 shows the dipping process of the ceramic body 8 to the exterior resin 14.
- the dip treatment tank 22 is filled with the exterior resin 14 having a reduced viscosity. If the element 4 is immersed in the exterior resin 14 and pulled up, the surface of the element 4 is covered with the exterior resin 14 as shown in FIG. 3B, and the exterior resin layer 6- 1 is formed.
- the process proceeds to the drying step S3.
- this drying step S3 most of the solvent 20 is volatilized from the exterior resin 14 forming the exterior resin layer 6-1 of the element 4. In this step, the exterior resin 14 is not completely cured.
- this drying process S3 at normal temperature (20-30 [degreeC]).
- the process proceeds to the curing process S4 through the drying process S3.
- the exterior resin layer 6-1 is heat-treated and cured.
- the exterior resin layer 6-1 is formed.
- the solvent 20 remaining after the completion of the drying step S3 is evaporated by heat treatment, and the silicone resin component is exposed on the surface of the exterior resin layer 6-1. That is, by performing the heat treatment, the solvent 20 remaining in the exterior resin 14 moves to the surface of the exterior resin layer 6-1, appears on the surface, and evaporates. At this time, the silicone resin component also appears on the surface of the exterior resin layer 6-1 together with the solvent 20 that moves to the surface of the exterior resin layer 6-1.
- the silicone resin component exposed on the surface of the exterior resin layer 6-1 is cured and glossy.
- the conditions of a hardening process suitably, and what is necessary is just to set temperature as 150 [degreeC] and hardening time as 1 hour, for example.
- Such processing includes the first plan shown in FIG. 4A and the second plan shown in FIG. 4B.
- a first region 611 and a second region 612 are formed on the surface of the element 4 as shown in FIG.
- the region 611 is a thin skin layer and has a thickness of, for example, about 30% with respect to the entire resin thickness.
- the thickness of this region 611 is an example of the depth from the surface of the exterior material 6.
- the aluminum hydroxide 18 has a concentration of, for example, about 84 to 100% of the resin blending ratio.
- the aluminum hydroxide 18 has a concentration of, for example, about 100 to 109 [%] of the resin blending ratio in the depth direction of 30 [%] or more from the surface of the thin skin layer.
- the region 621 is a thin skin layer. From the surface of the thin skin layer to the depth direction of 30%, the aluminum hydroxide 18 has a concentration of, for example, about 84 to 100% of the resin blending ratio.
- the region 622 has a concentration of about 90 to 100 [%] of the resin compounding ratio from the surface of the skin layer to the depth direction 50 [%].
- the region 623 is 50% or more in the depth direction from the surface of the thin skin layer, and the aluminum hydroxide 18 has a concentration of, for example, a resin blending ratio of about 100 to 119%.
- concentration has shown the density
- This concentration range is an average value of the region, and it is considered that there is a concentration portion that is locally lower than the lower limit value. Therefore, in this process, the area range may be reduced by 16% by the average minimum value of the areas 611 and 621, and the area 612 and 622 may be increased by 9% by the average maximum value.
- the concentration of aluminum hydroxide 18 is a value measured by energy dispersive X-ray analysis (EDX: Energy Dispersive X-ray spectrometry).
- the process proceeds to the coating step S5.
- glass coating is performed on the surface of the exterior resin layer 6-1.
- the element 4 covered with the exterior resin layer 6-1 is immersed in silica sol as an example to perform glass coating.
- This glass coat is subjected to heat treatment and cured to form a glass layer 6-2. Thereby, the varistor 2 shown in FIG. 1 is obtained.
- silicone resin 16 is the main ingredient and aluminum hydroxide 18 is added in an amount of less than 70 [wt%], more preferably 60 to 65 [wt%], silicone resin 16 can be reduced by that amount. Thereby, costs, such as material cost, can be reduced.
- the silicone resin 16 can be exposed on the surface of the exterior resin layer 6-1 as the solvent 20 evaporates in the soot curing step, the surface of the varistor 2 can be glossed.
- the surface of the outer resin layer 6-1 becomes glossy, and the visibility when the varistor rating is printed on the surface of the outer resin layer 6-1 is improved.
- the non-flammability was determined to be less than 1 [second] as a criterion for determining non-flammability due to overvoltage breakdown.
- the aluminum hydroxide 18 is added to the silicone resin 16 as the main agent in a range of less than 70 [wt%], nonflammability of less than 1.0 [second] in flame time is recognized, and aluminum hydroxide If the range of the added amount of 18 is 60 [wt%] or more and 65 [wt%] or less, nonflammability is more preferably obtained. Therefore, the nonflammability of the varistor 2 can be increased while reducing the silicone resin 16.
- the dielectric breakdown of the mixing ratio [wt%] was measured using the particle size [ ⁇ m] of the aluminum hydroxide 18 as a parameter.
- 6A shows the measured value
- FIG. 6B shows a graph.
- a withstand voltage [kV / mm] of 10 [kV / mm] or more is determined to have an withstand voltage effect.
- the average particle size is not less than 15 [ ⁇ m], 30 [ ⁇ m], and 50 [ ⁇ m], and if the blending ratio is 65 wt% or less, the average particle size is 10 [kV / mm] or more. An insulation withstand voltage effect is obtained.
- the aluminum hydroxide 18 is added to the silicone resin 16 as the main agent in a range of less than 70 [wt%], preferably 60 [wt%] to 65 [wt%], 10 [kV / mm
- the average particle size is most preferably 30 ⁇ m.
- FIG. 7 shows the evaluation result.
- the gloss of the surface of the exterior resin layer 6-1 does not directly affect the function of the varistor 2, but it is preferable that the surface of the exterior resin layer 6-1 is glossy in order to impair the appearance.
- a varistor rating or the like may be laser-printed on the surface of the exterior resin layer 6-1. At this time, when printing is performed on the surface of the glossy exterior resin layer 6-1 with a laser, the visibility is improved as compared with the uneven state of the surface state.
- the formation of the glossy layer reduces the roughness of the surface state due to the high blending of the aluminum hydroxide 18, and has an effect of preventing the appearance by the appearance and scratches caused by rubbing between products in the packaged state.
- the coating step S5 is performed after the curing step S4, and the glass coating is performed on the surface of the exterior resin layer 6-1 to form the glass layer 6-2. May not be provided.
- the case where the exterior resin 14 forming the exterior resin layer 6-1 is added with the aluminum hydroxide 18 and the solvent 20 to the silicone resin 16 is not limited to this.
- magnesium hydroxide may be added to the silicone resin 16 as a flame retardant together with the solvent 20.
- the range of this addition amount is more preferably set to 60 [wt%] or more and 65 [wt%] or less.
- Magnesium hydroxide has a density of 2.36 [g / cm 3 ], which is substantially equivalent to the density of aluminum hydroxide 2.42 [g / cm 3 ]. Therefore, the amount of magnesium hydroxide added may be set to a condition equivalent to that in the case of adding the above-described aluminum hydroxide 18 based on, for example, the weight ratio with respect to the silicone resin 16.
- the average particle diameter of magnesium hydroxide may be set in a range of, for example, 15 [ ⁇ m] or more and less than 50 [ ⁇ m].
- the same addition conditions and exterior resin as when adding the aluminum hydroxide 18 shown in the above embodiment are used.
- the formation conditions of the layer 6-1 may be set, and the processing procedure may be performed similarly.
- the exterior resin 14 to which magnesium hydroxide is added can set the dehydration start temperature higher than the case where the aluminum hydroxide 18 is added. That is, the exterior resin 14 has a dehydration start temperature of about 200 [° C.] when aluminum hydroxide is added, and a dehydration start temperature of about 300 [° C.] when magnesium hydroxide is added.
- the varistor 2 When the varistor 2 generates local heat as the surge is applied, the exterior material 6 changes from “dehydration” ⁇ “vaporization” ⁇ “swelling” ⁇ “resin peeling” ⁇ “spark” ⁇ “failure mode”.
- the varistor 2 can function even under a high heat generation temperature because the dehydration start temperature of the exterior resin 14 is high, and can be used for an electronic device in which a larger surge voltage may be applied. It becomes.
- silicone resin 16 is the main component and magnesium hydroxide is added in an amount of less than 70 wt%, more preferably 60 to 65 wt%, the silicone resin 16 can be reduced by that amount. Thereby, costs, such as material cost, can be reduced.
- the solvent 20 can be added to the outer casing resin 14 to suppress the increase in viscosity due to magnesium hydroxide. That is, by reducing the viscosity of the exterior resin 14 by adding the solvent 20, a large amount of magnesium hydroxide can be blended, and the moldability of the exterior resin layer 6-1 by the exterior resin 14 can be improved.
- the technology of the present disclosure adds aluminum hydroxide or magnesium hydroxide to the silicone resin contained in the exterior material of the varistor, and reduces the amount used while maintaining the nonflammable characteristics of the silicone resin according to the amount added. It is highly useful because it can reduce manufacturing costs.
- Varistor 4 Voltage Nonlinear Resistance Element 6 Exterior Material 6-1 Exterior Resin Layer 6-2 Glass Layer 8 Ceramic Element 10-1, 10-2 Electrode 12-1, 12-2 Lead Wire 14 Exterior Resin 16 Silicone Resin 18 Aluminum hydroxide 20 Solvent 22 Dip treatment tank 611, 621 First region 612, 622 Second region 623 Third region
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Abstract
Description
4 電圧非直線性抵抗素子
6 外装材
6-1 外装樹脂層
6-2 ガラス層
8 セラミック素体
10-1、10-2 電極
12-1、12-2 リード線
14 外装樹脂
16 シリコーン樹脂
18 水酸化アルミニウム
20 溶剤
22 ディップ処理槽
611、621 第1領域
612、622 第2領域
623 第3領域
Claims (7)
- シリコーン樹脂を含む外装材を用いた電子部品の製造方法であって、
60〔重量%〕以上70〔重量%〕未満の範囲に添加量を制御した水酸化アルミニウムもしくは水酸化マグネシウム、および無極性溶媒が添加されたシリコーン樹脂を含む外装材に素子をディップする工程と、
前記素子の表面に形成された前記外装材を乾燥させて、前記無極性溶媒を蒸発させ、かつ、シリコーン樹脂成分を前記外装材の表面に表出させる工程と、
前記外装材を硬化させる硬化工程と
を含むことを特徴とする電子部品の製造方法。 - 前記水酸化アルミニウムもしくは前記水酸化マグネシウムの添加量が60〔重量%〕以上65〔重量%〕以下の範囲であることを特徴とする請求項1に記載の電子部品の製造方法。
- 前記水酸化アルミニウムもしくは前記水酸化マグネシウムの平均粒径が15〔μm〕以上50〔μm〕未満の範囲であることを特徴とする請求項1または2に記載の電子部品の製造方法。
- 前記無極性溶媒は、蒸気圧が0.5~10〔kPa〕であることを特徴とする請求項1から3のいずれかに記載の電子部品の製造方法。
- シリコーン樹脂を含む外装材を用いた電子部品であって、
前記シリコーン樹脂に無極性溶媒と、水酸化アルミニウムもしくは水酸化マグネシウムとが添加され、該水酸化アルミニウムもしくは該水酸化マグネシウムの添加量が60〔重量%〕以上70〔重量%〕未満の範囲であり、前記無極性溶媒が乾燥により前記外装材の表面に表出して蒸発し、前記シリコーン樹脂が前記外装材の表面に表出して硬化していることを特徴とする電子部品。 - 前記水酸化アルミニウムもしくは前記水酸化マグネシウムの平均粒径が15〔μm〕以上50〔μm〕未満の範囲であることを特徴とする請求項5に記載の電子部品。
- 前記外装材は、該外装材表面から深さ方向の30〔%〕以内で、84ないし100〔%〕の濃度勾配を持つ水酸化アルミニウムもしくは水酸化マグネシウムを含むことを特徴とする請求項5または6に記載の電子部品。
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JP2015547640A JP6561839B2 (ja) | 2013-11-13 | 2014-11-12 | 電子部品およびその製造方法 |
CN201480060992.5A CN105706189B (zh) | 2013-11-13 | 2014-11-12 | 电子部件及其制造方法 |
EP14862954.6A EP3070720B1 (en) | 2013-11-13 | 2014-11-12 | Electronic component and production method therefor |
KR1020167012114A KR102181912B1 (ko) | 2013-11-13 | 2014-11-12 | 전자 부품 및 그의 제조 방법 |
US15/150,903 US9892830B2 (en) | 2013-11-13 | 2016-05-10 | Electronic component and production method therefor |
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EP (1) | EP3070720B1 (ja) |
JP (1) | JP6561839B2 (ja) |
KR (1) | KR102181912B1 (ja) |
CN (1) | CN105706189B (ja) |
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WO (1) | WO2015072138A1 (ja) |
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CN112614639A (zh) * | 2020-12-01 | 2021-04-06 | 辰硕电子(九江)有限公司 | 一种mov芯片用带有防爆泄压的大模块mov安装组件 |
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JP6822766B2 (ja) * | 2015-01-22 | 2021-01-27 | 旭化成株式会社 | ポリアミド樹脂組成物を含む成形体 |
KR102486920B1 (ko) * | 2016-11-03 | 2023-01-10 | 주식회사 아모텍 | 오픈모드 보호소자의 제조 방법 |
KR102507857B1 (ko) * | 2016-11-04 | 2023-03-08 | 주식회사 아모텍 | 오픈모드 보호소자 및 이를 구비한 전자장치 |
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CN112614639B (zh) * | 2020-12-01 | 2022-04-26 | 辰硕电子(九江)有限公司 | 一种mov芯片用带有防爆泄压的大模块mov安装组件 |
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JP6561839B2 (ja) | 2019-08-21 |
KR20160083004A (ko) | 2016-07-11 |
US20160254081A1 (en) | 2016-09-01 |
EP3070720B1 (en) | 2019-06-12 |
JPWO2015072138A1 (ja) | 2017-03-16 |
CN105706189A (zh) | 2016-06-22 |
TWI646560B (zh) | 2019-01-01 |
CN105706189B (zh) | 2019-05-03 |
TW201530572A (zh) | 2015-08-01 |
EP3070720A1 (en) | 2016-09-21 |
EP3070720A4 (en) | 2017-11-29 |
US9892830B2 (en) | 2018-02-13 |
KR102181912B1 (ko) | 2020-11-23 |
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