WO2015045348A1 - Method for forming a patterned film, method for manufacturing optical component, method for manufacturing circuit board, and method for manufacturing electronic component - Google Patents
Method for forming a patterned film, method for manufacturing optical component, method for manufacturing circuit board, and method for manufacturing electronic component Download PDFInfo
- Publication number
- WO2015045348A1 WO2015045348A1 PCT/JP2014/004839 JP2014004839W WO2015045348A1 WO 2015045348 A1 WO2015045348 A1 WO 2015045348A1 JP 2014004839 W JP2014004839 W JP 2014004839W WO 2015045348 A1 WO2015045348 A1 WO 2015045348A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photo
- curable composition
- light
- mold
- alignment mark
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 104
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 230000003287 optical effect Effects 0.000 title claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 157
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 239000007789 gas Substances 0.000 claims description 81
- 230000007246 mechanism Effects 0.000 claims description 18
- 230000001678 irradiating effect Effects 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 11
- MSSNHSVIGIHOJA-UHFFFAOYSA-N pentafluoropropane Chemical compound FC(F)CC(F)(F)F MSSNHSVIGIHOJA-UHFFFAOYSA-N 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 8
- 239000010453 quartz Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000001307 helium Substances 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 238000005468 ion implantation Methods 0.000 claims description 4
- 230000000737 periodic effect Effects 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 238000000576 coating method Methods 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 13
- 239000000178 monomer Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- OHMHBGPWCHTMQE-UHFFFAOYSA-N 2,2-dichloro-1,1,1-trifluoroethane Chemical compound FC(F)(F)C(Cl)Cl OHMHBGPWCHTMQE-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- LDTMPQQAWUMPKS-OWOJBTEDSA-N (e)-1-chloro-3,3,3-trifluoroprop-1-ene Chemical compound FC(F)(F)\C=C\Cl LDTMPQQAWUMPKS-OWOJBTEDSA-N 0.000 description 1
- GCDWNCOAODIANN-UHFFFAOYSA-N 1,1,1,2,2-pentafluoro-2-methoxyethane Chemical compound COC(F)(F)C(F)(F)F GCDWNCOAODIANN-UHFFFAOYSA-N 0.000 description 1
- 229910015844 BCl3 Inorganic materials 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- RJCQBQGAPKAMLL-UHFFFAOYSA-N bromotrifluoromethane Chemical compound FC(F)(F)Br RJCQBQGAPKAMLL-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- WMIYKQLTONQJES-UHFFFAOYSA-N hexafluoroethane Chemical compound FC(F)(F)C(F)(F)F WMIYKQLTONQJES-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QYSGYZVSCZSLHT-UHFFFAOYSA-N octafluoropropane Chemical compound FC(F)(F)C(F)(F)C(F)(F)F QYSGYZVSCZSLHT-UHFFFAOYSA-N 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- FAIAAWCVCHQXDN-UHFFFAOYSA-N phosphorus trichloride Chemical compound ClP(Cl)Cl FAIAAWCVCHQXDN-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70681—Metrology strategies
- G03F7/70683—Mark designs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Definitions
- the present invention relates to a method for forming a patterned film, a method for manufacturing an optical component, a method for manufacturing a circuit board, and a method for manufacturing an electronic component.
- An imprinting method is one of the lithography techniques for manufacturing devices such as semiconductor integrated circuit elements and liquid crystal display elements. This is a method for transfer a pattern onto a work substrate, such as wafer or glass plate, by bringing a photo-curable composition on the work substrate into contact with a mold having a fine pattern, and curing the photo-curable composition in contact with the mold.
- PTL 1 discloses an imprinting method for aligning a mold and a substrate. This method uses dye-by-dye alignment in which an alignment mark formed in a shot region is irradiated with light, and the displacement between the mold and the substrate is compensated according to the properties of detected light (reflected light or diffracted light).
- a Cr film is formed on the alignment mark in order to increase the accuracy of the alignment even if the reflectance at the interface between the mold and the photo-curable composition is low.
- PTL 2 discloses an imprinting method using a condensable gas.
- PTL 2 does not describe alignment or improvement of alignment accuracy.
- a method for forming a patterned film.
- the method includes: supplying a gas between photo-curable composition R on a substrate having alignment mark B and a mold having alignment mark A; bringing the photo-curable composition R into contact with the mold, thereby turning the photo-curable composition R into photo-curable composition R' in which the gas is dissolved; detecting light coming from the alignment mark A and the alignment mark B by irradiating the mold and the substrate with light a; aligning the alignment mark A with the alignment mark B according to the detected light; curing the photo-curable composition R' into a cured film by irradiating the photo-curable composition R' with light b having a different wavelength than the light a; and separating the cured film from the mold.
- n R represents the refractive index of the photo-curable composition R at the wavelength of the light a
- n R' represents the refractive index of the photo-curable composition R' at the wavelength of the light a
- n M represents the refractive index of the mold at the wavelength of the light a.
- a method for forming a patterned film.
- the method includes: the photo-curable composition applying step of supplying and applying a photo-curable composition onto a substrate having alignment mark B from a photo-curable composition application mechanism; the stage moving step of moving a substrate stage on which the substrate is disposed from the photo-curable composition application mechanism so that the substrate is placed under a mold having alignment mark A with an accuracy from several micrometers to several hundreds of nanometers; the high-solubility low-refractive-index gas supply step of supplying a gas containing a high-solubility low-refractive-index gas between the substrate and the mold; the contacting step of bringing the photo-curable composition into contact with the mold; the alignment step of operating the substrate stage so that the alignment mark A is aligned with the alignment mark B at position Y; the irradiation step of irradiating the photo-curable composition with light; and the demolding step of separating the photo-curable composition from the
- the present invention allows the alignment marks of a mold and a substrate to be accurately detected, and accordingly provides a method for forming a patterned film with a high throughput, reducing the time for controlling the relative displacement between the mold and the substrate. Furthermore, the present invention provides a method for manufacturing an optical component, a method for manufacturing a circuit board, and a method for manufacturing an electronic component.
- Fig. 1 is a flow diagram of a method for forming a patterned film according to an embodiment of the present invention.
- Fig. 2 is a schematic view of an imprinting apparatus used in a method for forming a patterned film of an embodiment of the present invention.
- Fig. 3A is a schematic sectional view illustrating a process of a method for forming a patterned film according to an embodiment of the present invention.
- Fig. 3B is a schematic sectional view illustrating the process of the method for forming a patterned film according to the embodiment of the present invention.
- Fig. 3C is a schematic sectional view illustrating the process of the method for forming a patterned film according to the embodiment of the present invention.
- Fig. 3A is a schematic sectional view illustrating a process of a method for forming a patterned film according to an embodiment of the present invention.
- Fig. 3B is a schematic sectional view illustrating the process of the method for forming a patterned film according
- FIG. 3D is a schematic sectional view illustrating the process of the method for forming a patterned film according to the embodiment of the present invention.
- Fig. 3E is a schematic sectional view illustrating the process of the method for forming a patterned film according to the embodiment of the present invention.
- Fig. 3F is a schematic sectional view illustrating the process of the method for forming a patterned film according to the embodiment of the present invention.
- Fig. 4A is a sectional view illustrating a method for manufacturing an optical component, a circuit board or an electronic component according to an embodiment of the present invention.
- Fig. 4B is a sectional view illustrating the method for manufacturing an optical component, a circuit board or an electronic component according to the embodiment of the present invention.
- a method for forming a patterned film according to an embodiment of the present invention includes: supplying a gas between photo-curable composition R on a substrate having alignment mark B and a mold having alignment mark A, thereby preparing photo-curable composition R' in which the gas is dissolved; bringing the photo-curable composition R' into contact with the mold; irradiating the mold and the substrate with light a and detecting light coming from the alignment mark A and the alignment mark B; aligning the alignment mark A with the alignment mark B on the basis of the detected light; curing the photo-curable composition R' into a cured film by irradiating the photo-curable composition R' with light b having a different wavelength than the light a; and separating the cured film from the mold.
- n R represents the refractive index of the photo-curable composition R at the wavelength of the light a
- n R' represents the refractive index of the photo-curable composition R' at the wavelength of the light a
- n M represents the refractive index of the mold at the wavelength of the light a.
- Fig. 2 is a schematic view of an apparatus used in the method of the present embodiment.
- the main surface, or patterned surface, of a mold 11 is disposed parallel to the Z axis, and the other two axes perpendicular to the Z axis are the X and Y directions.
- the Z axis typically extends in the vertical direction.
- a coating film 10 is formed by applying photo-curable composition R onto a substrate 9, as shown in Fig. 2 (Step 1 in Fig. 1).
- a substrate stage 6 supporting the substrate 9 is moved to a position under an application mechanism 5 from which the photo-curable composition R is applied, and then the application mechanism 5 applies the photo-curable composition R to the surface of the substrate 9.
- the application of the photo-curable composition R may be performed by, for example, an ink jet method, dip coating, air knife coating, curtain coating, a wire barcode method, gravure coating, extrusion coating, spin coating, or a slit scan method.
- the application mechanism 5 may be selected from the apparatuses capable of these coating methods.
- the photo-curable composition mentioned herein refers to a composition that can be cured by polymerization reaction caused by being irradiated with light.
- the substrate 9 may be, for example, a silicon wafer or a glass plate.
- the photo-curable composition R contains a (meth)acrylate monomer that will be turned into an acrylic resin by photopolymerization, and a photopolymerization initiator.
- the photo-curable composition R used in the present embodiment is a radically polymerizable composition containing mainly a (meth)acrylic monomer that will be turned into an acrylic resin by photopolymerization, and a photopolymerization initiator.
- the photo-curable composition R may be a cationically polymerizable composition mainly containing an epoxy monomer, an oxetane monomer, a vinyl ether monomer, or the like. "Mainly containing" mentioned herein implies that the material accounts for 90% or more of the total amount of all the constituents. (2. First Alignment Step)
- the substrate 9 having the coating film 10 containing the photo-curable composition R on the surface thereof is moved by the substrate state 6 so that alignment marks A, denoted by 14, of the mold 11 coincide with alignment marks B, denoted by 15, of the substrate 9 when viewed from above while the alignment marks A and the alignment marks B are observed through an alignment camera 3, as shown in Fig. 3A (Step 2 in Fig. 1).
- the alignment marks A and the corresponding alignment marks B have a concavo-convex structure.
- the concavo-convex structure has a periodicity.
- the alignment between the alignment marks A of the mold 11 and the alignment marks B of the substrate 9 is not necessarily so accurate as the order of nanometers, but is in the range of 1 micrometer to 900 micrometers.
- the substrate stage 6 desirably has a suction or sticky surface so as to facilitate the transfer of the substrate 9 without the movement of the substrate on the substrate stage 6. If the substrate stage 6 has such a suction or sticky surface, the entirety of the substrate stage 6 may be made of a sucking material of a sticky material, or the substrate stage may have a sucking or sticky layer on the surface thereof.
- the mold 11 is made of a material that can transmit light from a light source 2, such as quartz, silicon, a polymer, or a combination of these materials.
- a light source 2 such as quartz, silicon, a polymer, or a combination of these materials.
- quartz has a low thermal expansion coefficient, the alignment accuracy is not easily reduced even by heat of exposure light.
- the mold 11 is held by a mold holding mechanism 8, and desirably has a cavity (air chamber) 7 with a smaller thickness than the other portion at the middle thereof in the surface opposite the surface that will come into contact with the photo-curable composition R.
- the cavity 7 helps reduce the time taken to introduce the photo-curable composition R or reduce the force required to remove the mold 11 (demolding force).
- the substrate 9 having the coating film 10 containing the photo-curable composition R on the surface thereof is moved to the position corresponding to the mold 11 (under the mold 11) from the position corresponding to the application mechanism 5 (under the application mechanism 5) before the step of (2).
- the alignment marks A of the mold 11 denoted by 14 and the alignment marks B of the substrate 9 denoted by 15 are aligned with each other using the alignment camera3
- the alignment of the alignment marks A and B may be performed by any means other than using an alignment camera in another embodiment.
- the alignment marks A and B have a periodic concavo-convex structure in the method of the present embodiment, the structure of the alignment marks A and B is not limited to periodic concavo-convex structures.
- a gas 16 is introduced over the substrate 9 from the gas supply mechanism 4 to form an atmosphere of the gas around the coating film 10 on the substrate 9.
- the refractive index of the gas 16 in the form of liquid is lower than the refractive index n R of the photo-curable composition R applied in the step of (1), and the gas 16 is supplied under a lower pressure than the vapor pressure thereof or at a higher temperature than the boiling point thereof (Step 3 in Fig. 1, shown in Fig. 3B).
- the gas 16 which, in a liquid form, has a lower refractive index than the photo-curable composition R, dissolves 1 percent by volume or more in the photo-curable composition R.
- Examples of such a gas include chlorofluorocarbon (CFC), fluorocarbon (FC), hydrochlorofluorocarbon (HCFC), hydrofluorocarbon (HFC), and hydrofluoroether (HFE).
- CFC chlorofluorocarbon
- FC fluorocarbon
- HCFC hydrochlorofluorocarbon
- HFC hydrofluorocarbon
- HFE hydrofluoroether
- HFC-245fa and HFE-245mc have solubilities as high as about 40 percent by volume in the photo-curable composition R mainly containing an acrylic monomer, and the liquids thereof have lower refractive indices than the acrylic monomer used as the main constituent of the photo-curable composition R.
- the refractive index of the acrylic monomer can be considered to be substantially the same as the refractive index of the photo-curable composition R because the acrylic monomer is the main constituent of the photo-curable composition R.
- HFC-245fa and HFE-245mc are also advantageous in view of incombustibility, low toxicity and low reactivity (hence, being safe).
- the gas 16 may be composed of a single gas, or may contain a plurality of gases. Hence, the above-cited gases may be used singly or in combination.
- the gas 16 may be a mixture of any of the cited gases and air, nitrogen, carbon dioxide, helium, argon, or the like. If a mixture of an above-cited gas is used, helium gas is suitable as the gas to be mixed. This is because helium is stable and easy to introduce for imprinting. (4. Contacting Step)
- the mold 11 is brought into contact with the coating film 10 of the photo-curable composition R (Step 4 in Fig. 1).
- the photo-curable composition R in the coating film 10 fills the space between the substrate 9 and the mold 11 and the recesses in the mold 11 and dissolves therein the gas 16 present there, thereby forming a coating film 17 of photo-curable composition R'.
- the light 19 and light 20 may be reflected light or diffracted light (or reflected light and diffracted light), and the position gap between the light 19 and the light 20 is a gap on the X-Y plane.
- Alignment mark A and alignment mark B are the same as those used in the step of (2).
- the coating film 17 of the photo-curable composition R' between the mold 11 and the substrate 9 has a refractive index (effective refractive index) n R' at the wavelength of light a calculated from the following the Maxwell-Garnett formula (5):
- V p represents the solubility of a gas in the photo-curable composition R
- n g represents the refractive index of the gas in a liquid form at the wavelength of light a
- n R represents the refractive index of the photo-curable composition R at the wavelength of light a.
- the refractive index of the coating film is reduced by n R - n R' at the wavelength of light a.
- n R represents the refractive index of the photo-curable composition R at the wavelength of light a
- n R' represents the refractive index of the photo-curable composition R' at the wavelength of light a
- n M represents the refractive index of the mold at the wavelength of light a
- the reflectance or diffraction efficiency of light from the interface between the alignment mark A of the mold 11 and the photo-curable composition R' is increased in comparison with that of light from the interface between the alignment mark A and the photo-curable composition R, and consequently, alignment accuracy is increased.
- n M of the mold 11 is higher than the refractive index n R of the photo-curable composition R, and accordingly, Inequality (2) holds true:
- n R represents the refractive index of the photo-curable composition R at the wavelength of light a
- n R' represents the refractive index of the photo-curable composition R' at the wavelength of light a
- n M represents the refractive index of the mold at the wavelength of light a.
- n R represents the refractive index of the photo-curable composition R at the wavelength of light a
- n R' represents the refractive index of the photo-curable composition R' at the wavelength of light a.
- n R represents the refractive index of the photo-curable composition R at the wavelength of light a
- n M represents the refractive index of the mold at the wavelength of light a
- the substrate stage 6 is moved to adjust the position of the substrate 9 so that the position gap between the light 19 from the alignment mark A of the mold 11 and the light 20 from the alignment mark B of the substrate 9 is reduced.
- the mold may be moved to adjust the position gap between light 19 and light 20.
- the wavelength of light a is preferably 500 nm or more. This is because photo-curable compositions used for imprinting are generally cured at wavelengths of 400 nm or less.
- the refractive index n R' of the photo-curable composition R' in a case will be calculated below by way of example.
- light a has a wavelength of 632.8 nm
- the photo-curable composition R mainly contains an acrylic monomer
- HFC-245fa is used as the gas
- a quartz mold is used as the mold.
- the refractive index n g of liquid HFC-245fa for light with a wavelength of 632.8 nm is 1.26, and about 40 percent by volume of HFC-245fa can dissolve in the photo-curable composition R.
- the solubility V p of the gas in the photo-curable composition R is 0.4
- the refractive index n R of the photo-curable composition R is 1.45 at a wavelength of 632.8 nm.
- the refractive index n M of the quartz mold is 1.46 at a wavelength of 632.8 nm.
- the refractive index n R' of the photo-curable composition R' in which the gas is dissolved comes to 1.38.
- n M - n R 0.01
- n M - n R' 0.08
- the reflectance R M-R that is, the effective reflectance at the interface between the alignment mark A of the mold and the photo-curable composition R, is obtained using the refractive index n M of the mold and the refractive index n R of the photo-curable composition R, as shown in the following Equation (6):
- the refractive index n M of the mold is 1.46 for light with a wavelength of 632.8 nm
- the refractive index n R of the photo-curable composition R is 1.45 for light with a wavelength of 632.8 nm; hence the reflectance R M-R is 0.118 x 10 -4 .
- the reflectance R M-R' at the interface between the alignment mark A of the mold and the photo-curable composition R' in which the gas is dissolved is obtained using the refractive index n M of the mold and the refractive index n R' of the photo-curable composition R', as shown in the following Equation (7):
- the refractive index n M of the mold is 1.46 for light with a wavelength of 632.8 nm
- the refractive index n R' of the photo-curable composition R' is 1.38 for light with a wavelength of 632.8 nm; hence the reflectance R M-R' is 7.93 x 10 -4 .
- the reflectance at the interface between the alignment mark A of the mold and the photo-curable composition R' is increased to about 67 times the reflectance at the interface between the alignment mark A and the photo-curable composition R.
- the photo-curable composition R' is irradiated with light b, denoted by 21, from the light source 2 to cure the photo-curable composition R' into a cured composition 12 (Step 6 in Fig. 1, shown in Fig. 3D).
- light b has a different wavelength from light a used in the step of (5). This is because light a needs to have a wavelength at which the photo-curable composition R' is difficult to cure, whereas light b needs to have a wavelength at which the photo-curable composition R' is cured.
- light b may be, but is not limited to, ultraviolet light.
- the cured composition 12 is separated from the mold 11 to yield a patterned film 13.
- the cured composition 12 is separated from the mold 11 to yield a pattern of the cured composition or cured film 12, as shown in Fig. 3F.
- This resulting pattern is the counter pattern to the fine pattern of the mold 11, formed on the mold 11 in the step of (6) (irradiation step).
- How to separate the cured composition or cured film 12 from the mold 11, including the conditions for demolding, is not particularly limited as long as a part of the cured film 12 is not physically damaged.
- the mold 11 may be moved so as to go away from the substrate 9 fixed, or the substrate 9 may be moved so as to go away from the mold 11 fixed.
- the mold and the substrate may be drawn in the opposite directions so as to separate from each other.
- a cured film having a desired pattern formed based on the relief pattern of the mold 11 in a desired position can be formed.
- the resulting cured film may be used as, for example, an optical member such as a Fresnel lens or a diffraction grating, or a member in the optical member.
- the optical member includes at least the substrate 11 and the patterned film 13 on the substrate 11.
- the series of the steps (1) to (7), or a repeating unit (shot) may be repeated several times for the same substrate.
- a cured film can be formed which has a desired pattern formed based on the relief pattern of the mold 11 in a plurality of desired positions.
- the thickness of the photo-curable composition R remaining on the substrate 9 described in the step of (8) is desirably as small as possible.
- the method for forming a patterned film may include: the photo-curable composition applying step of supplying and applying a photo-curable composition onto a substrate having alignment mark B from a photo-curable composition application mechanism; the stage moving step of moving a substrate stage on which the substrate is disposed from the photo-curable composition application mechanism so that the substrate is placed under a mold having alignment mark A with an accuracy from 1 micrometer to 900 micrometers; the high-solubility low-refractive-index gas supply step of supplying a gas containing a high-solubility low-refractive-index gas between the substrate and the mold; the contacting step of bringing the photo-curable composition into contact with the mold; the alignment step of operating the substrate stage so that the alignment mark A is aligned with the alignment mark B at position Y; the irradiation step of irradiating the photo-curable composition with light; and the demolding step of separating the photo-curable composition from the mold after the ir
- the high-solubility low-refractive-index gas has a solubility of 10 percent by volume or more in the photo-curable composition, and the gas in a liquid form has a lower refractive index than the photo-curable composition.
- the mold may be a nanoimprinting mold having a nanometer-relief pattern at the surface thereof.
- the method of an embodiment of the invention can be used as a method for forming a relief pattern by photo-nanoimprinting.
- the method for forming a relief pattern includes: the step of disposing a photo-curable composition containing a gas between a substrate having alignment mark B and a mold provided with a relief at the surface thereof and having alignment mark A; the step of estimating the relative positional relationship between the alignment mark A of the mold and the alignment mark B of the substrate by irradiating the alignment marks A and B with light incapable of curing the photo-curable composition; and the step of aligning the alignment mark A with the alignment mark B by moving the substrate relative to the mold in a direction parallel to the surface of the substrate.
- n R represents the refractive index of the photo-curable composition not containing the gas at the wavelength of the light incapable of curing the photo-curable composition
- n R' represents the refractive index of the photo-curable composition containing the gas at the wavelength of the light incapable of curing the photo-curable composition
- n M represents the refractive index of the mold at the wavelength of the light incapable of curing the photo-curable composition.
- Part of the cured film, having a specific pattern, obtained through the step of (7) or the demolding step can remain in a region other than the region in which the pattern should be formed (hereinafter such a portion of the film may be referred to as a residual film).
- the portion (residual film) of the cured film having the resulting pattern in the region 111 where the film is not required is removed to yield a cured pattern 110 having a desired relief pattern (formed based on the relief pattern of the mold 11).
- the residual film can be removed by, for example, etching the recessed portions (residual films) of the patterned film 13 to expose the surface of the substrate in the recesses of the patterned film 13, as shown in Fig. 4A.
- any technique may be applied without particular limitation, and a known technique, such as dry etching, may be performed.
- a known technique such as dry etching
- a known dry etching apparatus can be used.
- the source gas used for this dry etching can be selected, according to the elemental composition of the cured film to be etched.
- the source gas examples include halogen-containing gases, such as CF 4 , C 2 F 6 , C 3 F 8 , CCl 2 F 2 , CCl 4 , CBrF 3 , BCl 3 , PCl 3 , SF 6 , and Cl 2 ; oxygen-containing gases, such as O 2 , CO, and CO 2 ; inert gases, such as He, N 2 , and Ar; and other gases such as H 2 and NH 3 .
- halogen-containing gases such as CF 4 , C 2 F 6 , C 3 F 8 , CCl 2 F 2 , CCl 4 , CBrF 3 , BCl 3 , PCl 3 , SF 6 , and Cl 2
- oxygen-containing gases such as O 2 , CO, and CO 2
- inert gases such as He, N 2 , and Ar
- other gases such as H 2 and NH 3 .
- a mixed gas of these gases may be used.
- a cured pattern having a desired relief pattern (formed based on the relief pattern of the mold 11) in a desired position can be formed, and an article having the cured pattern can be produced.
- a substrate working step (Step of (9) is performed as described below.
- the resulting cured pattern 110 may be used as an optical member such as a diffraction grating or a polarizer, or a member in the optical member to produce an optical component.
- the optical component includes at least the substrate 102 and the cured pattern 110 on the substrate 102.
- the cured pattern 110 having a relief pattern obtained by the method for forming a patterned film of an embodiment of the present invention may be used as an interlayer insulating film of a semiconductor device, such as LSI, system LSI, DRAM, SDRAM, RDRAM, or D-RDRAM, or as a resist film used in a semiconductor manufacturing process.
- a semiconductor device such as LSI, system LSI, DRAM, SDRAM, RDRAM, or D-RDRAM, or as a resist film used in a semiconductor manufacturing process.
- the cured pattern 110 is used as a resist film for producing an electronic component
- the portions (regions denoted by 111 in Fig. 4A) of the substrate exposed by the step of (8), etching step, are subjected to etching or ion implantation.
- the cured pattern 110 functions as an etching mask.
- a circuit structure 112 (Fig. 4B) is formed on the substrate 102 according to the profile of the cured pattern 110).
- a circuit board used in a semiconductor device or the like is produced. By connecting the resulting circuit board to a control mechanism for the circuit board, an electronic component is produced for a display, a camera, a medical instrument, or any other apparatus.
- the cured pattern 110 may be used as a resist film for etching or ion implantation in a process for manufacturing an optical component.
- the cured pattern 110 may finally be removed from the substrate, but may be left as a member of a device.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
supplying a gas between photo-curable composition R on a substrate having alignment mark B and a mold having alignment mark A; bringing the photo-curable composition R into contact with the mold, thereby turning the photo-curable composition R into photo-curable composition R' in which the gas is dissolved; detecting light coming from the alignment mark A and the alignment mark B by irradiating the mold and the substrate with light a; aligning the alignment mark A with the alignment mark B according to the detected light; curing the photo-curable composition R' into a cured film by irradiating the photo-curable composition R' with light b having a different wavelength than the light a; and separating the cured film from the mold. The gas satisfies the following Inequality (1):
(1. Photo-curable Composition Applying Step)
(2. First Alignment Step)
(3. Gas Supply Step)
(4. Contacting Step)
(5. Second Alignment Step)
nM - nR' = 0.08
(6. Irradiation Step)
(7. Demolding Step)
the photo-curable composition applying step of supplying and applying a photo-curable composition onto a substrate having alignment mark B from a photo-curable composition application mechanism; the stage moving step of moving a substrate stage on which the substrate is disposed from the photo-curable composition application mechanism so that the substrate is placed under a mold having alignment mark A with an accuracy from 1 micrometer to 900 micrometers; the high-solubility low-refractive-index gas supply step of supplying a gas containing a high-solubility low-refractive-index gas between the substrate and the mold; the contacting step of bringing the photo-curable composition into contact with the mold;
the alignment step of operating the substrate stage so that the alignment mark A is aligned with the alignment mark B at position Y; the irradiation step of irradiating the photo-curable composition with light; and the demolding step of separating the photo-curable composition from the mold after the irradiation step. The high-solubility low-refractive-index gas has a solubility of 10 percent by volume or more in the photo-curable composition, and the gas in a liquid form has a lower refractive index than the photo-curable composition. The mold may be a nanoimprinting mold having a nanometer-relief pattern at the surface thereof.
In this instance, the method for forming a relief pattern includes: the step of disposing a photo-curable composition containing a gas between a substrate having alignment mark B and a mold provided with a relief at the surface thereof and having alignment mark A; the step of estimating the relative positional relationship between the alignment mark A of the mold and the alignment mark B of the substrate by irradiating the alignment marks A and B with light incapable of curing the photo-curable composition; and the step of aligning the alignment mark A with the alignment mark B by moving the substrate relative to the mold in a direction parallel to the surface of the substrate. The gas, the photo-curable composition and the mold satisfy the following Inequality (1):
(8. Residual film Removing Step)
(9. Substrate Working Step)
2: light source
3: alignment camera
4: gas supply mechanism
5: application mechanism
6: substrate stage
7: cavity
8: mold holding mechanism
9: substrate
10: coating film
11: mold
12: cured composition
13: patterned film
14: alignment mark A of a mold
15: alignment mark B of a substrate
16: gas
17: coating film
18: light a
19: light
20: light
21: light b
22: evaporated gas
102: substrate
110: cured pattern
111: region of a cured patterned film to be removed
112: circuit structure formed based on the profile of a cured pattern
Claims (19)
- A method for forming a patterned film, the method comprising:
supplying a gas between photo-curable composition R on a substrate having alignment mark B and a mold having alignment mark A;
bringing the photo-curable composition R into contact with the mold, thereby turning the photo-curable composition R into photo-curable composition R' in which the gas is dissolved;
detecting light from the alignment mark A and the alignment mark B by irradiating the mold and the substrate with light a;
aligning the alignment mark A with the alignment mark B according to the detected light;
curing the photo-curable composition R' into a cured film by irradiating the photo-curable composition R' with light b having a different wavelength than the light a; and
separating the cured film from the mold,
wherein the gas satisfies the following Inequality (1):
- The method according to Claim 1, wherein the gas satisfies the following Inequality (2):
- The method according to Claim 1 or 2, wherein the gas satisfies the following Inequality (3):
- The method according to any one of Claims 1 to 3, wherein the photo-curable composition R and the mold satisfy the following Inequality (4):
- The method according to any one of Claims 1 to 4, wherein the photo-curable composition R mainly contains a (meth)acrylate.
- The method according to any one of Claims 1 to 5, wherein the gas contains 1,1,1,3,3-pentafluoropropane.
- The method according to Claim 6, wherein the gas is a mixture of 1,1,1,3,3-pentafluoropropane and helium.
- The method according to any one of Claims 1 to 5, wherein the gas is 1,1,1,3,3-pentafluoropropane.
- The method according to any one of Claims 1 to 8, wherein the surface of the mold coming into contact with the photo-curable composition R is made of quartz.
- The method according to any one of Claims 1 to 8, wherein the entirety of the mold is made of quartz.
- The method according to any one of Claims 1 to 10, wherein the alignment mark A and the alignment mark B have a periodic concavo-convex structure.
- The method according to any one of Claims 1 to 11, wherein light from the alignment mark A and the alignment mark B is reflected light or diffracted light.
- A method for manufacturing an optical component, the method comprising forming a patterned film by the method as set forth in any one of Claims 1 to 12.
- A method for manufacturing an optical component, the method comprising:
forming a patterned film by the method as set forth in any one of Claims 1 to 12; and
working the substrate by etching or ion implantation using the patterned film as a mask. - A method for manufacturing a circuit board, the method comprising:
forming a patterned film by the method as set forth in any one of Claims 1 to 12;
working the substrate by etching or ion implantation using the patterned film as a mask; and
preparing an electronic component. - A method for manufacturing an electronic component, the method comprising:
manufacturing a circuit board by the method as set forth in Claim 15; and
connecting the circuit board to a control mechanism configured to control the circuit board. - A method for forming a patterned film, the method comprising:
the photo-curable composition applying step of supplying and applying a photo-curable composition onto a substrate having alignment mark B from a photo-curable composition application mechanism;
the stage moving step of moving a substrate stage on which the substrate is disposed from the photo-curable composition application mechanism so that the substrate is placed under a mold having alignment mark A with the alignment mark A aligned with the alignment marks B with an accuracy of 1 micrometer to 900 micrometers;
the high-solubility low-refractive-index gas supply step of supplying a gas containing a high-solubility low-refractive-index gas between the substrate and the mold;
the contacting step of bringing the photo-curable composition into contact with the mold;
the alignment step of operating the substrate stage so that the alignment mark A is aligned with the alignment mark B at position Y;
the irradiation step of irradiating the photo-curable composition with light; and
the demolding step of separating the photo-curable composition from the mold after the irradiation step,
wherein the high-solubility low-refractive-index gas has a solubility of 10 percent by volume or more in the photo-curable composition, and the gas in a liquid form has a lower refractive index than the photo-curable composition. - The method according to any one of Claim 1 to 17, wherein the mold is a nanoimprinting mold having a nanometer-relief pattern at the surface thereof.
- A method for forming a relief pattern by photo-nanoimprinting, the method comprising:
disposing a photo-curable composition containing a gas between a substrate having alignment mark B and a mold provided with a relief at the surface thereof and having alignment mark A;
estimating the relative positional relationship between the alignment mark A and the alignment mark B by irradiating the alignment mark A and the alignment mark B with light incapable of curing the photo-curable composition; and
aligning the alignment mark A with the alignment mark B by moving the substrate relative to the mold in a direction parallel to the surface of the substrate,
wherein the gas, the photo-curable composition and the mold satisfy the following Inequality (1):
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201480053312.7A CN105580109B (en) | 2013-09-25 | 2014-09-22 | The forming method of patterned film, the manufacture method of optical module, the manufacture method of the manufacture method of circuit board and electronic building brick |
KR1020167010639A KR101788493B1 (en) | 2013-09-25 | 2014-09-22 | Method for forming a patterned film, method for manufacturing optical component, method for manufacturing circuit board, and method for manufacturing electronic component |
US15/024,797 US20160219717A1 (en) | 2013-09-25 | 2014-09-22 | Method for forming a patterned film, method for manufacturing optical component, method for manufacturing circuit board, and method for manufacturing electronic component |
EP14847055.2A EP3061121B1 (en) | 2013-09-25 | 2014-09-22 | Method for forming a patterned film, method for manufacturing an optical component, method for manufacturing an integrated circuit element, method for manufacturing an electronic component, and method for forming a relief pattern |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013198446A JP6230353B2 (en) | 2013-09-25 | 2013-09-25 | Manufacturing method of film having pattern shape, manufacturing method of optical component, manufacturing method of circuit board, manufacturing method of electronic device |
JP2013-198446 | 2013-09-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015045348A1 true WO2015045348A1 (en) | 2015-04-02 |
Family
ID=52742520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/004839 WO2015045348A1 (en) | 2013-09-25 | 2014-09-22 | Method for forming a patterned film, method for manufacturing optical component, method for manufacturing circuit board, and method for manufacturing electronic component |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160219717A1 (en) |
EP (1) | EP3061121B1 (en) |
JP (1) | JP6230353B2 (en) |
KR (1) | KR101788493B1 (en) |
CN (1) | CN105580109B (en) |
TW (1) | TWI539232B (en) |
WO (1) | WO2015045348A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107430988A (en) * | 2015-04-14 | 2017-12-01 | 佳能株式会社 | Imprinting apparatus, method for stamping and the method for manufacturing article |
CN108885976A (en) * | 2016-03-31 | 2018-11-23 | 佳能株式会社 | Pattern forming method, production method, the production method of optical component, the production method of circuit board, the production method of the production method of electronic component and imprint mold for processing substrate |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL268871B2 (en) * | 2017-03-16 | 2024-05-01 | Molecular Imprints Inc | Optical polymer films and methods for casting the same |
EP3697588B1 (en) | 2017-10-17 | 2024-04-03 | Magic Leap, Inc. | A system for molding a photocurable material into a planar object |
TWI728489B (en) * | 2019-10-04 | 2021-05-21 | 永嘉光電股份有限公司 | Imprint method using a soluble mold and its related imprint system |
TWI758185B (en) * | 2021-05-12 | 2022-03-11 | 永嘉光電股份有限公司 | Imprint method for improving demolding stability and the related imprint system |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS561B2 (en) | 1977-02-24 | 1981-01-06 | ||
WO2002010721A2 (en) | 2000-08-01 | 2002-02-07 | Board Of Regents, The University Of Texas System | Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography |
US7136150B2 (en) | 2003-09-25 | 2006-11-14 | Molecular Imprints, Inc. | Imprint lithography template having opaque alignment marks |
EP1731963A2 (en) | 2005-06-08 | 2006-12-13 | Canon Kabushiki Kaisha | Mold, pattern forming method, and pattern forming apparatus |
US20080131791A1 (en) * | 2006-12-01 | 2008-06-05 | Samsung Electronics Co., Ltd. | Soft template with alignment mark |
US20110018168A1 (en) * | 2009-07-27 | 2011-01-27 | Asml Netherlands B.V. | Imprint lithography template |
US20110095455A1 (en) * | 2009-10-28 | 2011-04-28 | Asml Netherlands B.V. | Imprint lithography |
US20110236579A1 (en) * | 2010-03-24 | 2011-09-29 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
JP2013033907A (en) * | 2011-06-30 | 2013-02-14 | Toshiba Corp | Substrate for template and manufacturing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006516065A (en) * | 2002-08-01 | 2006-06-15 | モレキュラー・インプリンツ・インコーポレーテッド | Scatter measurement alignment for imprint lithography |
JP3700001B2 (en) * | 2002-09-10 | 2005-09-28 | 独立行政法人産業技術総合研究所 | Imprint method and apparatus |
JP5679850B2 (en) * | 2011-02-07 | 2015-03-04 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
JP2013070033A (en) * | 2011-09-05 | 2013-04-18 | Canon Inc | Imprint device, imprint method and manufacturing method of article |
-
2013
- 2013-09-25 JP JP2013198446A patent/JP6230353B2/en active Active
-
2014
- 2014-09-22 US US15/024,797 patent/US20160219717A1/en not_active Abandoned
- 2014-09-22 WO PCT/JP2014/004839 patent/WO2015045348A1/en active Application Filing
- 2014-09-22 EP EP14847055.2A patent/EP3061121B1/en active Active
- 2014-09-22 KR KR1020167010639A patent/KR101788493B1/en not_active Application Discontinuation
- 2014-09-22 CN CN201480053312.7A patent/CN105580109B/en active Active
- 2014-09-23 TW TW103132793A patent/TWI539232B/en active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS561B2 (en) | 1977-02-24 | 1981-01-06 | ||
WO2002010721A2 (en) | 2000-08-01 | 2002-02-07 | Board Of Regents, The University Of Texas System | Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography |
US7136150B2 (en) | 2003-09-25 | 2006-11-14 | Molecular Imprints, Inc. | Imprint lithography template having opaque alignment marks |
EP1731963A2 (en) | 2005-06-08 | 2006-12-13 | Canon Kabushiki Kaisha | Mold, pattern forming method, and pattern forming apparatus |
US20080131791A1 (en) * | 2006-12-01 | 2008-06-05 | Samsung Electronics Co., Ltd. | Soft template with alignment mark |
US20110018168A1 (en) * | 2009-07-27 | 2011-01-27 | Asml Netherlands B.V. | Imprint lithography template |
US20110095455A1 (en) * | 2009-10-28 | 2011-04-28 | Asml Netherlands B.V. | Imprint lithography |
US20110236579A1 (en) * | 2010-03-24 | 2011-09-29 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
JP2013033907A (en) * | 2011-06-30 | 2013-02-14 | Toshiba Corp | Substrate for template and manufacturing method thereof |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107430988A (en) * | 2015-04-14 | 2017-12-01 | 佳能株式会社 | Imprinting apparatus, method for stamping and the method for manufacturing article |
CN107430988B (en) * | 2015-04-14 | 2020-07-10 | 佳能株式会社 | Imprint apparatus, imprint method, and method of manufacturing article |
US10751930B2 (en) | 2015-04-14 | 2020-08-25 | Canon Kabushiki Kaisha | Imprint apparatus, imprint method, and method of manufacturing article |
CN108885976A (en) * | 2016-03-31 | 2018-11-23 | 佳能株式会社 | Pattern forming method, production method, the production method of optical component, the production method of circuit board, the production method of the production method of electronic component and imprint mold for processing substrate |
CN108885976B (en) * | 2016-03-31 | 2023-05-02 | 佳能株式会社 | Pattern forming method, production method of processed substrate, production method of optical component, production method of circuit board, production method of electronic component, and production method of imprint mold |
Also Published As
Publication number | Publication date |
---|---|
EP3061121A1 (en) | 2016-08-31 |
JP6230353B2 (en) | 2017-11-15 |
CN105580109A (en) | 2016-05-11 |
EP3061121B1 (en) | 2019-08-28 |
CN105580109B (en) | 2017-09-15 |
KR101788493B1 (en) | 2017-10-19 |
TW201512769A (en) | 2015-04-01 |
KR20160063359A (en) | 2016-06-03 |
EP3061121A4 (en) | 2017-06-28 |
TWI539232B (en) | 2016-06-21 |
US20160219717A1 (en) | 2016-07-28 |
JP2015065308A (en) | 2015-04-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3061121B1 (en) | Method for forming a patterned film, method for manufacturing an optical component, method for manufacturing an integrated circuit element, method for manufacturing an electronic component, and method for forming a relief pattern | |
KR101667132B1 (en) | Method for manufacturing photo cured material | |
TWI596430B (en) | Curable composition for photoimprint and method of producing film, optical component, circuit board, or electronic component using the composition | |
TWI526293B (en) | Method of producing film, method of producing optical component, method of producing circuit board, method of producing electronic component, and photocurable composition | |
JP6494185B2 (en) | Imprint method and apparatus | |
KR102011558B1 (en) | Imprint apparatus, imprint method, and method of manufacturing article | |
JP2018195811A (en) | Method of determining drop recipe, imprint apparatus, and article manufacturing method | |
JP5932500B2 (en) | Imprint method, imprint apparatus, and article manufacturing method using the same | |
JP7025132B2 (en) | Manufacturing method of imprint device and goods | |
JP2020177978A (en) | Imprinting device and article manufacturing method | |
JP2019145786A (en) | Imprint apparatus, planarization layer forming apparatus, forming apparatus, control method, and article manufacturing method | |
JP6420571B2 (en) | Imprint apparatus, imprint method, and article manufacturing method | |
JP2020096077A (en) | Imprint method, imprint device and article manufacturing method | |
JP6304921B2 (en) | Imprint method, imprint apparatus, and article manufacturing method using the same | |
US20170140922A1 (en) | Generating method, imprinting method, imprint apparatus, program, and method of manufacturing article | |
JP2019054211A (en) | Imprint apparatus and article manufacturing method | |
JP2023089742A (en) | Motion control unit, lithography device, flattening device, processing unit, and article manufacturing method | |
KR20240002183A (en) | Imprint system, substrate, imprint method, replica mold manufacturing method, and article manufacturing method | |
JP6250022B2 (en) | Imprint apparatus, article manufacturing method, and imprint method | |
JP2021193714A (en) | Molding device and article manufacturing method | |
JP2019201078A (en) | Imprint device, imprint method, and article manufacturing method | |
JP2018019041A (en) | Liquid filling method, imprinting method, and article manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201480053312.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14847055 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15024797 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2014847055 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2014847055 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20167010639 Country of ref document: KR Kind code of ref document: A |