WO2015043026A1 - 用于基板加工的给料系统以及基板切割机 - Google Patents

用于基板加工的给料系统以及基板切割机 Download PDF

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Publication number
WO2015043026A1
WO2015043026A1 PCT/CN2013/085629 CN2013085629W WO2015043026A1 WO 2015043026 A1 WO2015043026 A1 WO 2015043026A1 CN 2013085629 W CN2013085629 W CN 2013085629W WO 2015043026 A1 WO2015043026 A1 WO 2015043026A1
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WIPO (PCT)
Prior art keywords
substrate
vacuum suction
feeding
suction cup
screw
Prior art date
Application number
PCT/CN2013/085629
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English (en)
French (fr)
Inventor
庞春明
Original Assignee
深圳市华星光电技术有限公司
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Publication of WO2015043026A1 publication Critical patent/WO2015043026A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations

Definitions

  • the present invention relates to the field of display device manufacturing, and more particularly to a feeding system for substrate processing and a substrate cutting machine.
  • the cutting of the glass substrate is an important process of the liquid crystal panel.
  • the feeding method of the glass substrate in the cutting machine before cutting is by the material chuck 11 (Chuck)
  • the feeding position grips the residual material on the edge of the glass substrate 700 (the glass between the display screens or the edge of the display screen is called a residual material), and the entire set of material chucks 11 (Chuck) of the cutting machine is driven by the cylinder 10 or the motor to drive
  • the entire glass substrate 700 is transported to a downstream processing position, and a roller 15 is disposed at the bottom of the glass substrate 700 to smoothly feed the glass substrate to the processing position.
  • the clamping pitch of the chuck is often adjusted for the glass substrates of different thicknesses by using the above-mentioned feeding chuck 11 in the manner of clamping.
  • the process is cumbersome.
  • the material chuck 11 is also provided with a cushioning pad.
  • the wear of the gasket 13 on the surface of the material chuck 11 is also increasingly worn. This will cause an abnormality in the machine, so the frequency of the adjusting gasket 13 is increased to eliminate the abnormality, and the price of the gasket is high.
  • the total number of the gaskets 13 in one machine is large, which not only increases the workload of the work loading. It also increases production costs and also leads to a decline in production capacity.
  • the technical problem to be solved by the present invention is to provide a high efficiency, low cost feeding system for substrate processing and a substrate cutting machine.
  • a feeding system for substrate processing comprising:
  • a reclaiming device comprising a lifting device and a vacuum chuck disposed at one end of the lifting device
  • the lifting device is configured to push the vacuum chuck to a substrate at a feeding position, and the substrate is adsorbed by a vacuum chuck to be fixed on the vacuum chuck to take a material;
  • a feeding device is coupled to the reclaiming device for pushing the reclaiming device and its adsorbed substrate to a processing position.
  • the vacuum chuck comprises: a disk body and a vacuum suction device disposed on the disk body, wherein the disk body surface is provided with a plurality of air holes, and the air holes communicate with the vacuum suction device.
  • the air hole is directly arranged on the disk body, and is connected with the vacuum suction device.
  • the lifting device comprises a push cylinder, and the vacuum suction cup is disposed on a push rod of the pusher cylinder.
  • the structure of pushing the cylinder is relatively simple and the cost is low.
  • the feeding device comprises: a screw, a driving motor for driving the screw, and a guide rail; the reclaiming device is provided with a nut connected to the screw, and a slider disposed on the rail .
  • the screw nut drive method has higher accuracy, the push process is relatively stable, and the structure is relatively simple.
  • the screw is directly coupled to the drive motor.
  • a substrate cutting machine includes a feeding system, the feeding system comprising:
  • a reclaiming device comprising: a lifting device and a vacuum chuck disposed at one end of the lifting device, the lifting device for pushing the vacuum chuck to a substrate at a feeding position, and adsorbing the substrate by a vacuum chuck to fix the substrate Retrieving the vacuum chuck;
  • a feeding device is coupled to the reclaiming device for pushing the reclaiming device and its adsorbed substrate to a processing position.
  • the vacuum chuck comprises: a disk body and a vacuum suction device disposed on the disk body, wherein the disk body surface is provided with a plurality of air holes, and the air holes communicate with the vacuum suction device.
  • the air hole is directly arranged on the disk body, and is connected with the vacuum suction device.
  • the lifting device comprises a push cylinder, and the vacuum suction cup is disposed on the pusher gas On the push rod of the cylinder.
  • the structure of pushing the cylinder is relatively simple and the cost is low.
  • the feeding device comprises: a screw, a driving motor for driving the screw, and a guide rail; the reclaiming device is provided with a nut connected to the screw, and a slider disposed on the rail .
  • the screw nut drive method has higher accuracy, the push process is relatively stable, and the structure is relatively simple.
  • the screw is directly coupled to the drive motor.
  • the invention adopts a vacuum suction cup for adsorbing and reclaiming the feeding device of the feeding system for processing the substrate, and pushing the vacuum suction cup through the lifting device to realize the reclaiming process, since the vacuum suction cup adopts one surface of the adsorption substrate to realize the reclaiming Compared with the method of retrieving the chuck, it is not necessary to adjust the clamping pitch of the chuck for different thickness of the substrate, and the maintenance of the comparison tube reduces the working pressure of the worker. In addition, since there is no chuck, there is no pad.
  • the wear of the sheet that is to say, the vacuum chuck does not cause the grab failure due to the wear of the gasket, which improves the operating efficiency and productivity of the device, and also saves a lot of gaskets for the chuck, so Save a lot of money.
  • FIG. 1 is a schematic structural view of a conventional feeding system for substrate processing
  • FIG. 2 is a schematic view showing the structure of a chuck of a conventional feeding system for substrate processing
  • FIG. 3 is a schematic structural view of a feeding system for substrate processing according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing the structure of a vacuum chuck disk body of a feeding system for substrate processing according to an embodiment of the present invention.
  • this embodiment provides a specific embodiment of a feeding system 1 for substrate processing, comprising: a reclaiming device 100 comprising a lifting device 110 and a lifting device a vacuum suction cup 120, the lifting device 110 is configured to push the vacuum chuck toward the bottom of the substrate 700 at the feeding position, and the substrate 700 is adsorbed by the vacuum chuck 120 to be fixed to the vacuum.
  • the feeding device 1 is also provided with a feeding device 200.
  • the feeding system 1 is also provided with a feeding device 200 connected to the reclaiming device 100 for pushing the reclaiming device 100 and the substrate 700 thereon to a processing position.
  • the vacuum chuck 120 adopts one surface (ie, the bottom surface) of the adsorption substrate 700 to realize the reclaiming, the method of taking the material chuck 11 as shown in FIG. 1 or FIG. 2 does not need to be thick for the substrate 700.
  • the clamping distance of the material chuck 11 is adjusted to maintain the comparison of the single cylinder, which reduces the working pressure of the worker, and also improves the operating efficiency and productivity of the equipment. In addition, a large number of pads for the chuck are saved. The film, therefore, also saves a lot of cost.
  • the vacuum chuck 120 includes: a disk body 121 and a vacuum suction device 122 disposed at the bottom of the disk body 121.
  • the surface of the disk body 121 is provided with a plurality of air holes 123, and the air holes 123 and The vacuuming device 122 is in communication.
  • the vacuuming device 122 is provided with a vacuum pipeline in the disk body 121 to communicate with the air holes on the disk body 121.
  • the vacuum chuck may also be arranged in a matrix by a plurality of small suction cups (the size is equivalent to the air holes), but the structure is relatively complicated and the cost is relatively high.
  • the lifting device 110 includes a push cylinder 111 that is disposed on the push rod 112 of the push cylinder 111.
  • the function of the push cylinder 111 is to push the vacuum chuck 120 to the feeding position, which is a linear motion.
  • This method can be replaced by various driving mechanisms, such as a crank slider, a cam, a screw, etc., and its structure is not unique.
  • the method of using the cylinder has a relatively simple structure and a relatively low cost.
  • the feeding device 200 includes: a screw 220, a driving motor 210 for driving the screw 220, and a guide rail 230.
  • the screw 220 is directly connected to the driving motor 210.
  • the reclaiming device 100 is provided with the screw 220.
  • a nut 130, and a slider 150 disposed on the guide rail 230 guide and support the take-up device 100 through the guide rail 230.
  • the feeding process of the feeding device is also linear motion, and the above mechanism can also be replaced by other means.
  • the most direct way is to replace the cylinder, but the driving method of the screw nut is relatively stable. The degree is higher, and the structure is also relatively simple.
  • the system controls the push cylinder 111 of the lifting device 110 to push the vacuum chuck 120
  • the glass body 121 is provided with a surface of the air hole 123 attached to one surface (ie, the bottom surface) of the substrate 700.
  • the vacuum suction device 122 is already working to generate a negative pressure, and the glass substrate 700 is tightly held.
  • the lifting device 110 drives the vacuum chuck 120 to descend, and the system controls the driving motor 210 of the feeding device 200 to operate, and drives the screw 220 to rotate to drive the reclaiming device 100 along the guide rail 230 to advance the substrate 700 and
  • the reclaiming device 100 is simultaneously sent to the processing position, at which time the vacuuming device 122 stops working, and after the vacuum chuck 120 releases the glass substrate, the feeding device 200 pulls the reclaiming device 100 to the original position to perform the next reclaiming and feeding operation.
  • the embodiment can simultaneously provide a substrate cutting machine, which comprises the above feeding system 1, in this embodiment, the substrate
  • the cutting machine in addition to the glass substrate, may be used for other substrates such as plastic structures for display devices.

Abstract

一种用于基板加工的给料系统以及基板切割机：包括：取料装置，其包括升降装置以及设置在所述升降装置一端真空吸盘，所述升降装置将所述真空吸盘推向进料位置的基板，通过真空吸盘吸附所述基板使其固定在所述真空吸盘上进行取料；还包括送料装置，其与所述取料装置连接，用以将所述取料装置及其吸附的基板推送至加工位置。

Description

用于 加工的给料系统以 切割机
【技术领域】
本发明涉及显示装置制造领域， 更具体的说， 涉及一种用于基板加工的给 料系统以及基板切割机。
【背景技术】
玻璃基板的切割是液晶面板的重要制程， 目前， 玻璃基板的切割过程中， 如图 1 所示， 切割机内的玻璃基板在切割前的给材方式是通过给材夹头 11 ( Chuck )在进料位置夹取玻璃基板 700边沿的残材（显示屏之间或者显示屏边 沿的玻璃称为残材），由气缸 10或者马达带动切割机的整组给材夹头 11( Chuck ) 从而带动整片玻璃基板 700传向往下游加工位置， 玻璃基板 700底部设置有辊 子 15使玻璃基板平稳送到加工位置。
由于目前玻璃基板的厚度不唯一， 使用上述的给材夹头 11以夹取方式给材 的话要针对不同厚度的玻璃基板经常常调整夹头的夹紧间距， 过程比较繁瑣。 如图 2所示， 给材夹头 11上同时还设置有緩沖垫片， 随着机台使用时间越来越 长， 给材夹头 11表面起緩沖作用的垫片 13磨损也会日益严重， 这样会导致机 台出现异常， 因而增加调整垫片 13的频率以消除异常， 且垫片价格较高， 一台 机台总共垫片 13的数量较多， 不仅增加人员工作更换 ( loading )工作量， 也增 加了生产成本同时亦导致产能下降。
【发明内容】
本发明所要解决的技术问题是提供一种效率高， 成本低的用于基板加工的 给料系统以及基板切割机。
本发明的目的是通过以下技术方案来实现的： 一种用于基板加工的给料系 统， 包括：
取料装置， 其包括升降装置以及设置在所述升降装置一端的真空吸盘， 所 述升降装置用于将所述真空吸盘推向进料位置的基板， 通过真空吸盘吸附所述 基板使其固定在所述真空吸盘上进行取料；
送料装置， 其与所述取料装置连接， 用于将所述取料装置及其吸附的基板 推送至加工位置。
优选的， 所述真空吸盘包括： 一盘体以及设置在盘体的吸真空装置， 所述 盘体表面设置有多个气孔， 所述气孔与所述吸真空装置连通。 直接在盘体上设 置气孔， 并与吸真空装置连通， 其结构较为筒单， 不需要设置多个吸真空头， 成本较低。
优选的， 所述升降装置包括一推料气缸， 所述真空吸盘设置在所述推料气 缸的推杆上。 推料气缸推送的方式结构较为筒单， 成本低。
优选的， 所述送料装置包括： 螺杆、 用于驱动所述螺杆的驱动马达以及一 导轨； 所述取料装置设置有与所述螺杆连接的螺母， 以及一设置在所述导轨上 的滑块。 螺杆螺母驱动的方式精确度较高， 推送过程比较平稳， 结构也较为筒 单。
优选的， 所述螺杆与所述驱动马达直联。
一种基板切割机， 包括给料系统， 所述给料系统包括：
取料装置， 其包括升降装置以及设置在所述升降装置一端的真空吸盘， 所 述升降装置用于将所述真空吸盘推向进料位置的基板， 通过真空吸盘吸附所述 基板使其固定在所述真空吸盘上进行取料；
送料装置， 其与所述取料装置连接， 用于将所述取料装置及其吸附的基板 推送至加工位置。
优选的， 所述真空吸盘包括： 一盘体以及设置在盘体的吸真空装置， 所述 盘体表面设置有多个气孔， 所述气孔与所述吸真空装置连通。 直接在盘体上设 置气孔， 并与吸真空装置连通， 其结构较为筒单， 不需要设置多个吸真空头， 成本较低。
优选的， 所述升降装置包括一推料气缸， 所述真空吸盘设置在所述推料气 缸的推杆上。 推料气缸推送的方式结构较为筒单， 成本低。
优选的， 所述送料装置包括： 螺杆、 用于驱动所述螺杆的驱动马达以及一 导轨； 所述取料装置设置有与所述螺杆连接的螺母， 以及一设置在所述导轨上 的滑块。 螺杆螺母驱动的方式精确度较高， 推送过程比较平稳， 结构也较为筒 单。
优选的， 所述螺杆与所述驱动马达直联。
本发明将基板加工用的给料系统的取料装置采用了真空吸盘进行吸附取 料， 并通过升降装置推送真空吸盘实现取料过程， 由于真空吸盘采用的是吸附 基板的一个面来实现取料， 相对于夹头取料的方式， 不需要针对基板厚度不一 而调整夹头的夹紧间距， 维护比较筒单， 减少了工作人员的工作压力， 另外， 由于没有夹头， 从而也没有垫片的磨耗， 也就是说， 真空吸盘不会因为垫片的 磨耗导致抓取失败， 这样就提高了设备的运行效率以及产能， 另外， 还节约了 大量用于夹头上的垫片， 因此也节约了大量的成本。
【附图说明】
图 1是现有用于基板加工的给料系统结构示意图，
图 2是现有用于基板加工的给料系统的夹头结构示意图，
图 3是本发明实施例用于基板加工的给料系统结构示意图，
图 4是本发明实施例用于基板加工的给料系统的真空吸盘盘体结构示意图。
【具体实施方式】
下面结合附图和较佳的实施例对本发明作进一步说明。
如图 3所示，本实施例提供了用于基板加工的给料系统 1的一个具体实施例， 其包括： 取料装置 100, 该取料装置 100包括升降装置 110以及设置在所述升降 装置 110—端真空吸盘 120,所述升降装置 110用于将所述真空吸盘推向进料位 置的基板 700底部， 通过真空吸盘 120吸附所述基板 700使其固定在所述真空 吸盘 700上进行取料； 该给料系统 1同时还设置有一送料装置 200, 其与所述取 料装置 100连接， 用以将所述取料装置 100及其上的基板 700推送至加工位置。 由于真空吸盘 120采用的是吸附基板 700的一个面 （即底面）来实现取料， 相 对于如图 1或图 2所示采用给材夹头 11取料的方式， 不需要针对基板 700厚度 不一而调整给材夹头 11的夹紧间距， 维护比较筒单， 减少了工作人员的工作压 力， 同时也提高了设备的运行效率以及产能， 另外， 还节约了大量用于夹头上 的垫片， 因此也节约了大量的成本。
如图 3所示， 真空吸盘 120包括： 一盘体 121以及设置在盘体 121底部的吸 真空装置 122,结合图 4所示，盘体 121表面设置有多个气孔 123,所述气孔 123 与所述吸真空装置 122连通， 具体的， 该吸真空装置 122在盘体 121 中铺设有 真空管路与所述的盘体 121 上的气孔连通。 真空吸盘也可以是通过多个小的吸 盘（大小与所述气孔相当）按矩阵方式排列组成， 但其结构较为复杂， 造价相 对较高。
升降装置 110包括一推料气缸 111 , 所述真空吸盘 120设置在所述推料气缸 111的推杆 112上。 当然， 推料气缸 111的作用是推送真空吸盘 120到达进料位 置， 是直线的运动， 该种方式可以由多种驱动机构替代， 如曲柄滑块、 凸轮、 丝杆等方式， 其结构不是唯一但采用气缸的方式， 其结构较为筒单， 成本也相 对较低。
送料装置 200包括： 螺杆 220、 用于驱动所述螺杆 220的驱动马达 210以及 一导轨 230, 螺杆 220与驱动马达 210直联即可； 所述取料装置 100设置有与所 述螺杆 220连接的螺母 130, 以及一设置在所述导轨 230上的滑块 150, 通过导 轨 230进行导向和支撑所述取料装置 100。 同样的， 本实施例中， 送料装置送料 过程也是直线运动， 上述的机构也可以由其它方式代替， 如最直接的方式是可 以采用气缸代替， 但是， 螺杆螺母驱动的方式， 其运动过程相对平稳度较高， 并且结构也比较筒单。
当切割机工作时， 系统控制升降装置 110的推料气缸 111将真空吸盘 120推 送至进料位置， 盘体 121设置有所述气孔 123的表面贴附于基板 700的一个面 (即底面）， 此时吸真空装置 122已经在工作， 产生负压， 将玻璃基板 700紧紧 的吸附在盘体 121的表面之后升降装置 110驱动真空吸盘 120下降， 系统控制 送料装置 200的驱动马达 210工作， 带动丝杆 220转动进而带动取料装置 100 沿导轨 230前行， 将基板 700以及取料装置 100同时送至加工位置， 此时吸真 空装置 122停止工作， 真空吸盘 120放开玻璃基板后送料装置 200将取料装置 100拉会原位， 进行下一次取料和送料的动作。
以上是本实施例所述的基板切割的给料系统 1 , 基于上述的给料系统,， 本实 施例同时可以提供一种基板切割机， 其包括上述给料系统 1 , 本实施例中， 基板 切割机， 除了玻璃基板以为， 对于采用其它的一些用于显示装置的基板如塑料 结构也可以。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明， 不能 认定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的普通技 术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干筒单推演或替换， 都应当视为属于本发明的保护范围。

Claims

权利要求
1、 一种用于基板加工的给料系统， 包括：
取料装置， 其包括升降装置以及设置在所述升降装置一端的真空吸盘， 所 述升降装置用于将所述真空吸盘推向进料位置的基板， 通过真空吸盘吸附所述 基板使其固定在所述真空吸盘上进行取料；
送料装置， 其与所述取料装置连接， 用于将所述取料装置及其吸附的基板 推送至加工位置。
2、 如权利要求 1所述的用于基板加工的给料系统， 其中， 所述真空吸盘包 括： 一盘体以及设置在盘体的吸真空装置， 所述盘体表面设置有多个气孔， 所 述气孔与所述吸真空装置连通。
3、 如权利要求 1所述的用于基板加工的给料系统， 其中， 所述升降装置包 括一推料气缸， 所述真空吸盘设置在所述推料气缸的推杆上。
4、 如权利要求 1所述的用于基板加工的给料系统， 其中， 所述送料装置包 括： 螺杆、 用于驱动所述螺杆的驱动马达以及一导轨； 所述取料装置设置有与 所述螺杆连接的螺母， 以及一设置在所述导轨上的滑块。
5、 如权利要求 4所述的用于基板加工的给料系统， 其中， 所述螺杆与所述 驱动马达直联。
6、 一种基板切割机， 包括给料系统， 所述给料系统包括：
取料装置， 其包括升降装置以及设置在所述升降装置一端的真空吸盘， 所 述升降装置用于将所述真空吸盘推向进料位置的基板， 通过真空吸盘吸附所述 基板使其固定在所述真空吸盘上进行取料；
送料装置， 其与所述取料装置连接， 用于将所述取料装置及其吸附的基板 推送至加工位置。
7、 如权利要求 6所述的基板切割机， 其中， 所述真空吸盘包括： 一盘体以 及设置在盘体的吸真空装置， 所述盘体表面设置有多个气孔， 所述气孔与所述 吸真空装置连通。
8、如权利要求 6所述的基板切割机， 其中， 所述升降装置包括一推料气缸， 所述真空吸盘设置在所述推料气缸的推杆上。
9、 如权利要求 6所述的用于基板切割机， 其中， 所述送料装置包括： 螺杆、 用于驱动所述螺杆的驱动马达以及一导轨； 所述取料装置设置有与所述螺杆连 接的螺母， 以及一设置在所述导轨上的滑块。
10、 如权利要求 9所述的用于基板切割机， 其中， 所述螺杆与所述驱动马 达直联。
PCT/CN2013/085629 2013-09-25 2013-10-22 用于基板加工的给料系统以及基板切割机 WO2015043026A1 (zh)

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