WO2015038991A1

WO2015038991A1 - Segmented modular sensor probe measuring instruments, systems and methods of using the same

Info

Publication number: WO2015038991A1
Application number: PCT/US2014/055535
Authority: WO
Inventors: Gerald P. Roston; Michael J. Freeman
Original assignee: Optio2, Llc
Priority date: 2013-09-12
Filing date: 2014-09-12
Publication date: 2015-03-19

Abstract

The present invention discloses a system for providing a sensor probe for which the overall length, spacing between sensors, and types of sensors can be easily configured. The present invention employs the concept of modularity to enable these capabilities. The sensor probe comprises three modules: base module, one or more sensor modules, and end module. Each module comprises, at a minimum, an outer shell and an electrical network. At least one sensor module in the sensor probe includes a sensor. The sensor probes comprises a mechanical means for coupling the outer shells of adjacent modules and an electrical means for coupling the electrical networks of adjacent modules. In certain embodiments, the coupling can be coupled and uncoupled multiple times.

Description

SEGMENTED MODULAR SENSOR PROBE MEASURING INSTRUMENTS, SYSTEMS

AND METHODS OF USING THE SAME

[0001] The present invention claims priority to U.S. Provisional Pat. App. No. 61/876,963, titled "Segmented Modular Sensor Probe," filed September 12, 2013, which is incorporated by reference herein in its entirety.

TECHNICAL FIELD

[0002] The present invention relates to sensors, in particular, systems and methods for providing a probe with spatially separated sensing elements.

BACKGROUND

[0003] The practice of using a sensor to measure parameters of interest at a single point is space is well understood. The practice of employing a number of single point sensors to provide a two dimensional map, such as an isobar plot, it also well understood. What is less well understood is a means for incorporating multiple sensors into a single probe with a specified spatial separation between the sensors.

[0004] Such probes are needed, for example, to measure subsurface oxygen content, which provides an understanding of the effects of microbial activity around the probe. Currently, to obtain these data, scientists are required to fashion a customer probe. As an example, Rickelt, et al., describe a probe they developed for measuring molecular oxygen, see [Rickelt LF, Askaer L, Walpersdorf E, Elberling B, Glud RN, Kuhl M. An Optode Sensor Array for Long-Term In Situ Oxygen Measurements in Soil and Sediment. J Environ Qual. 2013 8/01 ;42(4): 1267-73]. To perform their experiments, the researchers made a custom probe by drilling holes in a long tube and placing a sensor behind each hole. While they were able to get results, this approach has two significant shortcomings:

[0005] First, the probe is only useful for the particular experiment being performed. At different experimental sites, different spacing and/or different arrays of sensors would likely be needed. Given the means of fabrication, there is no easy way to adopt this probe for use elsewhere.

[0006] Second, the probe is very costly to produce as each probe must be custom designed and custom built. Since these probes tend to be long and narrow, just the task of aligning the sensors with access ports in the exterior tube can be challenging.

[0007] What is needed is a means to provide a sensor probe for which the overall length, spacing between sensors, and types of sensors can be easily reconfigured to meet the needs of the specific experimental site and experiments to be performed.

SUMMARY OF THE INVENTION

[0008] The present invention discloses a system for providing a sensor probe for which the overall length, spacing between sensors, and types of sensors can be easily configured. The present invention employs the concept of modularity to enable these capabilities. The sensor probe can comprise three types of modules: a base module, one or more sensor modules, and an end module. Each module comprises, at a minimum, an outer shell and an electrical network. At least one sensor module in the sensor probe includes a transducer.

[0009] In certain embodiments, the sensor probe may comprise a mechanical means for coupling the outer shells of adjacent modules and an electrical means for coupling the electrical networks of adjacent modules. In certain embodiments, the coupling can be coupled and uncoupled multiple times.

[0010] In certain embodiments, each sensor module may contain a means for self-identifying its position along the chain of sensor modules which comprise the sensor probe. In an embodiment, each sensor module may contain a means for self-identifying its length.

[001 1] In certain embodiments, the base module may terminate the electrical network and can provide a means for communicating with an external computers and/or networks. In certain embodiments, the base module may comprise a computer connected to the electrical network which processes sensor information locally and then transmits it to a remote device, either by a wired or wireless connection.

[0012] The present invention further discloses the use of software, running on one or more computers, as a means for obtaining readings from the transducers. The software may run on a computer embedded within the sensor probe or a separate computer entirely; or may run on both a computer embedded within the sensor probe and a separate computer entirely.

[0013] These features of the present invention dramatically simplify the process of creating sensor probes, thereby reducing their cost and enabling various types of studies, for example, the seasonal and annual effects of microbial activity across complete ecosystems, which have heretofore been too expensive to study.

[0014] Additional features and advantages of the present invention are described in, and will be apparent from, the detailed description of the presently preferred embodiments and from the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure. Note that the dimensions are not necessarily to scale. [0016] FIG. 1 shows an overview of a sensor probe.

[0017] FIG. 2a shows a portion of a sensor module with a flush-mounted transducer.

[0018] FIG. 2b shows a portion of a sensor module with a protruding transducer.

[0019] FIG. 3a shows a protruding mechanical coupling with a separate brace.

[0020] FIG. 3b shows a protruding mechanical coupling with an integrated brace.

[0021] FIG. 4a shows a non-protruding mechanical coupling with a separate brace.

[0022] FIG. 4b shows a non-protruding mechanical coupling with an integrated brace.

[0023] FIG. 5 shows the use of a separator between modules.

[0024] FIG. 6 shows two identical segments of a sensor probe.

DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENTS

[0025] The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses. It should also be understood that throughout the reference numerals indicate like or corresponding parts and features. In respect of the methods disclosed, the order of the steps presented is exemplary in nature, and thus, is not necessary or critical, unless otherwise noted. In addition, while much of the present invention is illustrated using specific examples, the present invention is not limited to these embodiments. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entireties. In case of conflict, the present specification, including definitions, will control.

DEFINITIONS

[0026] The following definitions apply to certain terms used in the specification:

[0027] Mechanical coupling: A temporary or permanent means for mechanically adjoining adjacent modules. Temporary means are those which can be repeatedly coupled and uncoupled without diminishing the effectiveness of the coupling. Examples include screw threads and sanitary fittings. Permanent means are those which cannot be repeatedly coupled and uncoupled. Examples include welding and gluing.

[0028] Electrical coupling: A temporary or permanent means for electrically adjoining adjacent modules. Temporary means are those which can be repeatedly coupled and uncoupled without diminishing the effectiveness of the coupling. Examples include any known electrical connector. Permanent means are those which cannot be repeatedly coupled and uncoupled. Examples include soldering.

[0029] Module: one of base module, sensor modules, or end module.

[0030] Transducer: Any device for measuring a physical parameter, for example, temperature, dissolved oxygen concentration, etc.

[0031] Sensor module: A module containing zero or more sensors. Each sensor probe must include at least one sensor module with at least one sensor. A module with no sensors is used for providing additional spatial offset between sensor modules.

[0032] Sensor probe: A measuring instrument comprising a base module, one or more sensor modules, and an end module.

[0033] Now FIG. 1 shows an embodiment of a sensor probe 16. The probe comprises a base module 10, one or more sensor modules 12, and an end module 14. Each module comprises an outer shell and an electrical network. A sensor module 12 comprises zero or more transducers and at least one of the sensor modules 12 comprises at least one transducer. The profile of each of the modules can be any closed geometric figure and adjacent modules may have differing profiles. In an embodiment, all of the modules share a common circular profile. [0034] The modules may be mechanically coupled via their outer shell by mechanical coupling and electrically coupled with electrical coupling. In an embodiment, the mechanical and electrical couplings can be achieved without the need for specialized tooling or equipment.

[0035] In an embodiment, the base module 10 and/or the end module 14 may simply be endcaps. The outer envelope of the base module 10 may be different from that of other modules comprising the sensor probe 16. As shown in FIG. 1 , the outer diameter of the base module 10 is larger than the diameter for the other modules. Such a configuration may be useful, for example, when deploying the sensor probe 16 into a well as the larger diameter provides a natural stop that positions the other modules at desired depths. For those applications for which the sensor probe must be forcibly inserted into the operating environment, for example, when it must be embedded in soil, it may be desirable that the endcap 14 be designed to facilitate insertion.

[0036] Although the figures illustrate that the sensor modules are disposed serially, it should be noted that the sensor modules may be connected to the base module, or any other module, in parallel, or in a combination of serially and in parallel. For example, a first sensor module may be coupled to and extend from the base module. A second sensor module may extend from and be coupled to the first sensor module, and be disposed in series with the first sensor module. Alternatively, a third sensor module may extend and be coupled to the base module and extend from the base module, disposed in parallel with the first sensor module. Of course, any number of sensor modules may be coupled together as needed, and the present invention should not be limited as described herein.

[0037] Since most transducers must be in contact with the environment being sensed, provision must be made to provide said access. FIG. 2a shows an embodiment for providing a transducer 20 with access to the environment via a flush-mounted access port 22. Such a means of access does not impede the ability of the sensor probe to be forcibly inserted into the operating environment, for example, when it must be embedded in soil. FIG. 2b shows an embodiment for providing a transducer 20 with access to the environment via a protruding access port 24. Such a means of access may be easier to instantiate and will typically not impede the ability of the probe to be deployed within an existing orifice, such as a well or reaction vessel.

[0038] FIG. 3a shows an embodiment for mechanically coupling modules using a separate brace in a manner that extends beyond the primary envelope of the sensor probe. A module 30 is coupled to a module 32 by way of a separate protruding brace 34. An example of such a coupling is a TriClamp clamp. FIG. 3b shows an embodiment for mechanically coupling modules using an integrated brace in a manner that extends beyond the primary envelope of the sensor probe. A module 30 is coupled to a module 32 by way of an integrated protruding brace 34. An example of such a coupling is flared conduit used for electrical installations. These embodiments are typically easy to instantiate, but may impede the ability of the sensor probe to be forcibly inserted into the operating environment, for example, when it must be embedded in soil.

[0039] FIG. 4a shows an embodiment for mechanically coupling modules using a separate brace in a manner that maintains the primary envelope of the sensor probe. A module 30 is coupled to a module 32 by way of a separate internal brace 38. An example of such a coupling is the threaded rod used to connect section of certain decorative electrical fixtures together. FIG. 4b shows an embodiment for mechanically coupling modules using an integrated brace in a manner that maintains the primary envelope of the sensor probe. A module 30 is coupled to a module 32 by way of an integrated internal brace 40. An example of such a coupling is threaded standoffs used to mount certain electrical components. These embodiments typically require a modicum of effort to instantiate, but do not impede the ability of the sensor probe to be forcibly inserted into the operating environment, for example, when it must be embedded in soil.

[0040] In an embodiment, the outer shell of each module may be non-permeable, thereby preventing substances from accessing the interior of the module. In an embodiment, the mechanical coupling extends the integrity of the outer shell across adjacent modules. In a further embodiment, a sensor probe is hermetically sealed.

[0041] For certain applications, such as deployment of a sensor probe within a well, it may be desirable to segregate the transducers in each sensor module. In this manner, the environmental conditions being measured at one location do not interfere with the environmental conditions being measured at another location.

[0042] FIG.5 show one embodiment for providing said segregation. Placed between the modules 42 are spacers 44, wherein the spacers 44 are sized to fit between the envelope of the sensor and the envelope of the opening into which the sensor probe is deployed. By minimizing gaps between the spaces 44 and the sensor modules 42 and the opening into which the sensor probe is deployed, environmental crosstalk can be minimized.

[0043] For certain applications, it may be desirable deploy the probe before deploying the spacers 44. This can be accomplished by using adjustable spacers 44. In an embodiment, said adjustable spacers 44 can be inflatable rings. In an embodiment, said adjustable spacers 44 can be a mechanical collar.

[0044] Within a sensor probe, there is a need to communicate information obtained from transducers to the base module and/or external computers and/or networks. Certain transducers may also require energy to operate. Thus, the sensor probe contains one or more information and power networks. Information networks may comprise electrical, optical, and/or acoustic means of communication. Power networks may comprise electrical, pneumatic, hydraulic, and mechanical means of transmitting power.

[0045] Both the electrical and power networks may be disposed within the envelope of the sensor probe. The networks can be separate from each other, or may be combined with each other and optionally with the mechanical structure of the sensor probe. Each module within the sensor probe can have access to the electrical and power networks. Since each module can be self-contained, each module may have a means for connecting to the electrical and power networks. For example, in the case of an electrical power network, the means of connecting can be an electrical connector.

[0046] To facilitate deployment in the field, modules within a sensor probe may have certain features that enable self-identification. One such feature is a means of self-identifying its location along the sensor probe. This feature obviates the need for the experimenter to manually denote this information after sensor probe assembly. In an embodiment, this self- identification can be provided with a dedicated conductor in the electrical network and a fixed resistor. When coupled, the resistors are in series, thus by measuring the voltage at the same end of the resistor in each module, the ordering of the modules is known.

[0047] In certain embodiments, each module may contain a means of self-identifying its length. This feature obviates the need for the experimenter to manually denote this information after sensor probe assembly. In an embodiment, this self-identification can be provided with a series of jumper wires that are read by a computer. With n jumper wires, 2n lengths can be represented. [0048] Another means for providing both position and length information is to simultaneously transmit from the base an acoustic and electrical signal. Since the electrical signal will reach each of the modules instantaneously, the time difference between the arrival of the electrical and acoustic signals can be used to determine both position and length information.

[0049] In an embodiment, sensor modules with a transducer may include a computer for operating the transducer. Said computer may accept operational parameters from a computer housed within the base module or an external computer and may use these parameters to control the operation of the sensor. Said computer may report the transducer readings to a computer housed within the base module or external computer. Said computer may also report the type of the transducer housed within the module to a computer housed within the base module or external computer, thereby further automating the sensor probe self-identification capability.

[0050] FIG. 6 shows an embodiment of two identical sensor modules as part of an overall sensor probe. The embodiment shown uses industry standard TriClamp tubing as the basis for the mechanical housing. A sensor module 50 comprises a 100 mm long section of stainless steel tubing fitted with TriClamp flanges 51. Disposed within the sensor module 50 are a transducer 56 and a circuit board 57. The circuit board 57 comprises various electronic components, including a computer for processing transducer data and communicating with a computer within the base module. The circuit board 57 also comprises two electrical connectors: electrical connector 58 is used to couple the sensor module 50 to modules further from the base module, e.g., the sensor module 52; and electrical connector 60 is used to couple the sensor module 50 to modules closer to the base module. The modules are coupled using an external protruding brace, specifically a TriClamp clamp 54. [0051] A sensor probe comprising sensor modules 50 can be quickly and easily configured in the field. Field configuration may include the following steps:

[0052] Step 1 : Determine the configuration of the sensor probe. In this sense, configuration refers to the number, type, and distance between the transducers.

[0053] Step 2: Gather the sensor modules. Based on the configuration determined in Step 1 , the number and types of sensor modules are gathered.

[0054] Step 3 : Assemble the modules. Assembly entails a) connecting the modules with an electrical cable, in this case, a cable with RJ45 connectors; and b) coupling the segments together with TriClamp clamps. With this particular embodiment, assembling a sensor probe with 20 modules should only take a couple of minutes.

[0055] It should be noted that the sensors of the present invention may be coupled with one or more computers, and may be utilized in any manner including, but not limited to, the previously described detection and/or measurement of specific physical parameters. In alternate embodiments, the present invention may be utilized in control systems, such as in closed-loop control systems or other like systems as apparent to one of ordinary skill in the art.

EXAMPLES

[0056] Following are examples of how the presently disclosed technology can be employed.

[0057] Example 1 : Researchers understand that molecular oxygen is a key environmental parameter that greatly impacts soil ecology and that its concentration in soil serves as a proxy for overall biogeochemical carbon fixation and mineralization. Across the region of interest, i.e., soil depths to a few meters, oxygen concentration can change dramatically, but understanding system dynamics requires sampling dissolved oxygen simultaneously at different depths. [0058] The present invention, in combination with dissolved oxygen transducers, such as, for example, oxygen sensors made according to U.S. Pat. App. No. 13/883,759, titled "Optical Sensor and Sensing System for Oxygen Monitoring in Fluids Using Molybdenum Cluster Phosphorescence," filed November 4, 201 1 (incorporated herein by reference in its entirety) and other like transducers for measuring other physical parameters, such as, for example, temperature, addresses this need. A sensor probe comprising multiple evenly spaced modules, with each module comprising a dissolved oxygen transducer and a temperature transducer, could be constructed. Said probe may have a circular outer envelope, employ flush-mounted access ports, and non-protruding braces to facilitate insertion into the soil.

[0059] The base module may contain a wireless transmission device to allow transmitting the data from the field to a scientist's laboratory. The end module may be conical or pointed to facility emplacing the sensor into the soil.

[0060] Example 2: Aquafarmers, i.e., those who raise aquatic fauna in natural environments, need to be aware of changes to the water in which the aquatic fauna is grown and cultivated. Parameters they wish to measure may include temperature, salinity, pH, among others. Certain of these parameters are more affected by depth than others.

[0061 ] The present invention addresses the need to provide such measurements. A long probe, possibly with a number of "blank" modules, i.e., those that provide nothing other than mechanical separation and that do not include a sensor therein, may be assembled. Since cost is of primary concern to aquafarmers, the sensor probe may be sparsely populated with transducers. For example, the sensor probe may include temperature transducers at each end of the sensor probe, a salinity transducer near the middle of the sensor probe, and several pH sensors distributed at various locations throughout the sensor probe.

[0062] This sensor probe may employ protruding access ports, since their use may result in a less expensive sensor. Similarly, protruding clamps connecting separate modules together may also be employed. Since the sensor probe is likely to be in near proximity to other equipment, a hard-wired connection from the probe to this other equipment may be used to transmit information.

[0063] It should be noted that various changes and modifications to the presently preferred embodiments described herein will be apparent to those skilled in the art. Such changes and modifications may be made without departing from the spirit and scope of the present invention and without diminishing its attendant advantages. Further, references throughout the specification to "the invention" are non-limiting, and it should be noted that claim limitations presented herein are not meant to describe the invention as a whole. Moreover, the invention illustratively disclosed herein suitably may be practiced in the absence of any element which is not specifically disclosed herein.

Claims

CLAIMS We claim:

1. A sensor probe measuring instrument for measuring at least one physical parameter comprising:

a base module;

a first sensor module extending from and coupled to the base module; and

a second sensor module coupled to the first sensor module,

wherein at least one of the first sensor module and the second sensor module comprises a first sensor for detecting a first physical parameter in an environment.

2. The sensor probe measuring instrument of claim 1 wherein the first sensor module and the second sensor module each comprises an outer shell and an interior space.

3. The sensor probe measuring instrument of claim 1 wherein the first sensor module comprises the first sensor.

4. The sensor probe measuring instrument of claim 1 wherein the second sensor module comprises the first sensor.

5. The sensor probe measuring instrument of claim 4 wherein the first sensor module does not contain a sensor.

6. The sensor probe measuring instrument of claim 3 wherein the second sensor module comprises a second sensor.

7. The sensor probe measuring instrument of claim 6 wherein the first sensor measures the first physical parameter and the second sensor measures the first physical parameter.

8. The sensor probe measuring instrument of claim 6 wherein the first sensor measures the first physical parameter and the second sensor measures a second physical parameter.

9. The sensor probe measuring instrument of claim 1 wherein at least the first sensor module and the second sensor module comprises at least two sensors for measuring a plurality of physical parameters in the environment.

10. The sensor probe measuring instrument of claim 1 further comprising:

an end cap coupled to the sensor probe.

1 1. The sensor probe measuring instrument of claim 10 wherein the end cap is coupled to the second sensor.

12. The sensor probe measuring instrument of claim 1 further comprising:

a third sensor module coupled to the second sensor module, wherein at least the first sensor module, the second sensor module and the third sensor module comprises the first sensor.

13. The sensor probe measuring instrument of claim 12 wherein the third sensor module comprises the first sensor.

14. The sensor probe measuring instrument of claim 12 wherein the first sensor module comprises the first sensor and the third sensor module comprises a second sensor.

15. The sensor probe measuring instrument of claim 14 wherein the second sensor module does not contain a sensor.

16. The sensor probe measuring instrument of claim 13 wherein the first sensor module does not contain a sensor and the second sensor module does not contain a sensor.

17. The sensor probe measuring instrument of claim 12 wherein the first sensor module comprises the first sensor, the second sensor module comprises a second sensor, and the third sensor module comprises a third sensor.

18. The sensor probe measuring instrument of claim 17 wherein at least two of the first sensor, the second sensor and the third sensor measure the same physical parameter.

19. The sensor probe measuring instrument of claim 17 wherein the first sensor, the second sensor and the third sensor measure the same physical parameter.

20. The sensor probe measuring instrument of claim 17 wherein the first sensor measures a first physical parameter, the second sensor measures a second physical parameter and the third sensor measures a third physical parameter.

21. The sensor probe measuring instrument of claim 1 wherein the first sensor module and the second sensor modules are mechanically connected together.

22. The sensor probe measuring instrument of claim 1 wherein the first sensor module and the second sensor module are electrically connected together.

23. The sensor probe measuring instrument of claim 1 wherein at least one of the first and second sensor modules comprises a first access port coupled to the first sensor for measuring the first physical parameter in the environment.

24. The sensor probe measuring instrument of claim 23 wherein the access port protrudes from at least one of the first and second sensor modules.

25. The sensor probe measuring instrument of claim 1 further comprising:

a spacer extending from between the first sensor module and the second sensor module.

26. The sensor probe measuring instrument of claim 6 further comprising:

27. The sensor probe measuring instrument of claim 25 wherein the spacer is an extending flange.

28. The sensor probe measuring instrument of claim 25 wherein the size of the spacer is adjustable.

29. The sensor probe measuring instrument of claim 28 wherein the spacer is inflatable.

30. The sensor probe measuring instrument of claim 1 further comprising:

a computer within at least one of the first and second sensor modules.

31. The sensor probe measuring instrument of claim 1 further comprising:

a computer within the base module.

32. The sensor probe measuring instrument of claim 1 further comprising:

an information network within the first and second sensor modules.

33. The sensor probe measuring instrument of claim 1 further comprising:

a power network within the first and second sensor modules for powering the first sensor.

34. The sensor probe measuring instrument of claim 1 wherein the relative positions of the first and second sensor modules are detectable.

35. The sensor probe measuring instrument of claim 34 further comprising:

a first position sensor in the first sensor module; and

a second position sensor in the second sensor module,

wherein the first and second position sensors detect the relative positions of the first and second sensor modules.

36. The sensor probe measuring instrument of claim 1 wherein the distance of each of the first and second sensors from the base module is detectable.

37. The sensor probe measuring instrument of claim 36 further comprising:

a first distance sensor in the first sensor module, wherein the first distance sensor measures a distance between the first sensor module and the base module; and

a second distance sensor in the second sensor module, wherein the second distance sensor measures a distance between the second sensor module and the base module.

38. The sensor probe measuring instrument of claim 1 further comprising:

a first computer within at least one of the first and second sensor modules for operating the first sensor.

39. The sensor probe measuring instrument of claim 38 further comprising:

a second computer operationally coupled to the first computer.

40. The sensor probe measuring instrument of claim 39 wherein the second computer is contained within the base module.

41. The sensor probe measuring instrument of claim 1 further comprising:

a third sensor module extending from and coupled to the base module.

42. The sensor probe measuring instrument of claim 41 further comprising:

a second sensor within the third sensor module.

43. The sensor probe measuring instrument of claim 42 wherein the first sensor and the second sensor detect the first physical parameter.

44. The sensor probe measuring instrument of claim 42 wherein the second sensor detects a second physical parameter.

45. The sensor probe measuring instrument of claim 1 wherein the second sensor module is detachably coupled to the first sensor module.

46. The sensor probe measuring instrument of claim 1 wherein the first sensor module is detachably coupled to the base module.

47. The sensor probe measuring instrument of claim 41 wherein the third sensor module is detachably coupled to the base module.

48. A method of configuring a sensor probe measuring instrument comprising the steps of: providing a base module;

coupling a first sensor module to the base module; and

coupling a second sensor module to the first sensor module, wherein at least one of the first and second sensor modules comprises a sensor for detecting a first physical parameter in an environment.

49. The method of claim 48 wherein the first sensor module comprises the first sensor and the second sensor module comprises a second sensor.

50. The method of claim 49 wherein the second sensor detects the first physical parameter.

51. The method of claim 49 wherein the second sensor detects a second physical parameter in the environment.

52. The method of claim 49 wherein the second sensor module comprises the first sensor and the first sensor module does not contain a sensor.

53. The method of claim 48 wherein the second sensor module is detachably coupled to the first sensor module.

54. The method of claim 48 wherein the first sensor module is detachably coupled to the second sensor module.

55. The method of claim 48 further comprising the steps of:

coupling a third sensor module to the second sensor module, wherein the first sensor is contained within the first sensor module, the second sensor module or the third sensor module.

56. The method of claim 55 wherein the first sensor module comprises the first sensor and the third sensor module comprises a second sensor.

57. The method of claim 55 wherein the first sensor module comprises the first sensor, the second sensor module comprises a second sensor, and the third sensor module comprises a third sensor.

58. The method of claim 57 wherein the first sensor, the second sensor and the third sensor detect the first physical parameter.

59. The method of claim 57 wherein at least two of the first sensor, the second sensor and the third sensor detects the first physical parameter.

60. The method of claim 57 wherein the first sensor detects the first physical parameter in the environment, the second sensor detects a second physical parameter in the environment, and the third sensor detects a third physical parameter in the environment.

61. The method of claim 48 further comprising the steps of:

electrically connecting the first sensor module to the second sensor module; and

electrically connecting the first sensor module to the base module.

62. The method of claim 48 further comprising the step of:

coupling a third sensor module to the base module.

63. The method of claim 62 wherein the third sensor module comprises a second sensor.

64. The method of claim 63 wherein the second sensor detects the first physical parameter.

65. The method of claim 63 wherein the second sensor detects a second physical parameter in the environment.

66. The method of claim 48 further comprising the step of: coupling an end cap to the second sensor module.

67. The method of claim 48 further comprising the steps of:

coupling a plurality of sensor modules in series to the second sensor module to form the sensor probe measuring instrument having an end sensor module, wherein the end sensor module comprises a second sensor.

68. The method of claim 67 wherein the second sensor detects the first physical parameter in the environment.

69. The method of claim 67 wherein the second sensor detects a second physical parameter in the environment.

70. The method of claim 48 wherein the first and second sensor modules each comprise an outer shell and an interior space.

71. A sensor probe measuring instrument system for measuring at least one physical parameter comprising:

a sensor probe measuring instrument comprising a base module, a first sensor module extending from and coupled to the base module; and a second sensor module coupled to the first sensor module, wherein at least one of the first sensor module and the second sensor module comprises a first sensor for detecting a first physical parameter in an environment; and

an environment for detecting at least a first physical parameter with the sensor probe measuring instrument, wherein the sensor probe measuring instrument is disposed in the environment.

72. The sensor probe measuring instrument system of claim 71 wherein the first sensor module comprises the first sensor and the second sensor module comprises a second sensor.

73. The sensor probe measuring instrument system of claim 72 wherein the second sensor detects the first physical parameter.

74. The sensor probe measuring instrument system of claim 72 wherein the second sensor detects a second physical parameter in the environment.

75. The sensor probe measuring instrument system of claim 72 wherein the sensor probe measuring instrument comprises a spacer extending from between the first sensor module and the second sensor module.

76. The sensor probe measuring instrument system of claim 75 wherein the environment has a first location and a second location, and the first sensor module is disposed at the first location and the second sensor module is disposed at the second location.

77. The sensor probe measuring instrument system of claim 76 wherein the spacer separates the first location from the second location.

78. The sensor probe measuring instrument system of claim 76 wherein the spacer size is adjustable.

79. The sensor probe measuring instrument system of claim 78 wherein the spacer is inflatable.

80. The sensor probe measuring instrument system of claim 77 wherein the spacer decreases movement of material in the environment between the first location and the second location.