WO2015014411A1 - Agencement de support pour substrats - Google Patents

Agencement de support pour substrats Download PDF

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Publication number
WO2015014411A1
WO2015014411A1 PCT/EP2013/066294 EP2013066294W WO2015014411A1 WO 2015014411 A1 WO2015014411 A1 WO 2015014411A1 EP 2013066294 W EP2013066294 W EP 2013066294W WO 2015014411 A1 WO2015014411 A1 WO 2015014411A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
frame elements
frame
holding arrangement
aperture opening
Prior art date
Application number
PCT/EP2013/066294
Other languages
English (en)
Inventor
Andre Brüning
Reiner Hinterschuster
Hans Georg Wolf
Thomas Werner ZILBAUER
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020167005484A priority Critical patent/KR102219198B1/ko
Priority to CN201380078669.6A priority patent/CN105452523B/zh
Priority to PCT/EP2013/066294 priority patent/WO2015014411A1/fr
Priority to TW103126528A priority patent/TW201518532A/zh
Publication of WO2015014411A1 publication Critical patent/WO2015014411A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically

Definitions

  • Embodiments of the present invention relate to a holding arrangement for holding a substrate during processing, e.g., layer deposition, and to a method for holding a substrate during said processing.
  • Embodiments of the present invention particularly relate to a holding arrangement for holding a substrate during vacuum layer deposition, and to a method for holding a substrate during said vacuum layer deposition.
  • substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process etc.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • PECVD plasma enhanced chemical vapor deposition
  • the process is performed in a process apparatus or process chamber, where the substrate to be coated is located.
  • a deposition material is provided in the apparatus.
  • a plurality of materials, but also oxides, nitrides or carbides thereof, may be used for deposition on a substrate.
  • other processing steps like etching, structuring, annealing, or the like can be conducted in processing chambers.
  • Coated materials may be used in several applications and in several technical fields. For instance, an application lies in the field of microelectronics, such as generating semiconductor devices. Also, substrates for displays are often coated by a PVD process. Further applications include insulating panels, organic light emitting diode (OLED) panels, substrates with TFT, color filters or the like.
  • OLED organic light emitting diode
  • glass substrates can be supported on carriers during processing thereof.
  • a carrier drives the glass or the substrate through the processing machine.
  • the carriers typically form a frame or a plate, which supports a surface of the substrate along the periphery thereof or, in the latter case, supports the surface as such.
  • a frame shaped carrier can also mask a glass substrate, wherein the aperture in the carrier, which is surrounded by the frame, provides an aperture for coating material to be deposited on the exposed substrate portion or an aperture for other processing steps acting on the substrate portion, which is exposed by the aperture.
  • holding arrangements are provided for fixing the substrate to the frame and holding it in place during the deposition process.
  • the substrates to be coated feature already the final device size (e.g., mobile phone size) instead of coating bigger mother glasses and then cut them to the final mobile phone size.
  • the final device size e.g., mobile phone size
  • Available holding arrangements hold the substrates by applying a holding force to the extended surfaces of the substrate, i.e., also on the extended surface to be coated. For instance, a clamp contacts both extended surfaces to hold or clamp the substrate. Thus, at least some the above requirements particularly associated with the OGS approach cannot be met.
  • a holding arrangement for holding a substrate during vacuum layer deposition includes a frame having two or more frame elements, the frame elements forming an aperture opening, and elastic means configured to provide a clamping force acting against the substrate edges for clamping the substrate at said substrate edges.
  • a holding arrangement for holding a substrate during vacuum layer deposition includes a frame having two or more frame elements, the frame elements forming an aperture opening, and elastic means connecting the two or more frame elements. The two or more frame elements are moveable with respect to each other and are configured for changing a size of the aperture opening. The elastic means provide a retracting force acting on the two or more frame elements for clamping the substrate at the substrate edges.
  • an apparatus for depositing a layer on a substrate includes a chamber adapted for layer deposition therein, a holding arrangement as described above within the chamber, and a deposition source for depositing material forming the layer.
  • a method for holding a substrate during vacuum layer deposition includes providing a frame forming an aperture opening, positioning the substrate in the aperture opening, and providing a clamping force acting against the substrate edges for clamping the substrate at said substrate edges.
  • a method for holding a substrate during vacuum layer deposition includes moving two or more frame elements of a frame with respect to each other to enlarge a size of an aperture opening formed by said frame elements, positioning the substrate in the aperture opening, and releasing the two or more frame elements to clamp the substrate at the substrate edges.
  • FIG. 1 illustrates a holding arrangement according to embodiments described herein and with a substrate provided in an aperture opening of the holding arrangement; illustrates a holding arrangement according to embodiments described herein and with a substrate provided in an aperture opening of the holding arrangement being released; shows a detailed view of a holding arrangement according to embodiments described herein; illustrates another holding arrangement according to embodiments described herein and with a substrate to be positioned in an aperture opening of said holding arrangement; illustrates the holding arrangement of figure 4 according to embodiments described herein and with the substrate being accommodated in the aperture opening and being clamped; illustrates a holding arrangement according to embodiments described herein; illustrates a detailed view of the holding arrangement of figure 6 according to embodiments described herein; illustrates a schematic view of a frame protruding over the substrate surface according to embodiments described herein; shows a view of an apparatus for depositing a layer of material on a substrate utilizing a holding arrangement according to embodiments described herein; and shows a flowchart of a method for holding a substrate during vacuum layer
  • the substrate thickness can be from 0.1 to 1.8 mm and the holding arrangement, and particularly the holding devices, can be adapted for such substrate thicknesses.
  • the substrate thickness is about 0.9 mm or below, such as 0.5 mm or 0.3 mm and the holding arrangement, and particularly the holding devices, are adapted for such substrate thicknesses.
  • large area substrates or carriers supporting one or more substrates may have a size of at least 0.174 m 2 .
  • the size of the carrier can be about 1.4 m 2 to about 8 m 2 , more typically about 2 m 2 to about 9 m 2 or even up to 12 m 2 .
  • the rectangular area, in which the substrates are supported, for which the holding arrangements, apparatuses, and methods according to embodiments described herein are provided are carriers having sizes for large area substrates as described herein.
  • a large area carrier which would correspond to an area of a single large area substrate, can be GEN 5, which corresponds to about 1.4 m 2 substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m 2 substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7m 2 substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.
  • the substrate may be made from any material suitable for material deposition.
  • the substrate may be made from a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • Figure 1 illustrates a holding arrangement 10 according to embodiments described herein and with a substrate 20 provided in an aperture opening of the holding arrangement 10.
  • the holding arrangement 10 for holding a substrate 20 during vacuum layer deposition includes a carrier or frame 30 having two or more frame elements 31, 32, 33 and 34, the frame elements 31, 32, 33 and 34 forming an aperture opening, and elastic means configured to provide a clamping force acting against the substrate edges for clamping the substrate 20 at said substrate edges.
  • the frame has four frame elements 31, 32, 33 and 34.
  • the PVD process (e.g., a magnetron cathode sputtering process), which is used to coat films on the substrates, needs to be applied on the complete substrate surface from rim to rim without any disturbance or interference of the film coating from any holding arrangements holding the substrates inside the carrier, e.g. masking of the substrates.
  • the holding arrangement may not cover the substrate rim area on the substrate front (i.e., no edge exclusion).
  • the substrate front side shall be coated from rim to rim.
  • the holding arrangement may not protrude over the substrate rim height which would impede the surface coating.
  • the holding arrangement should prevent the substrate backside from any (visible) coating remnants (i.e., no backside coating), and the holding arrangement should prevent the substrate rims from any (visible) coating remnants (i.e., no rim coating).
  • substrate edge refers to the lateral surfaces of the substrate, i.e., the surfaces that extend along the thickness direction of the substrate 20.
  • the edge can be the surface of the substrate that connects a substrate frontside with a substrate backside.
  • the substrate 20 has two extended surfaces.
  • One of the extended surfaces of the substrate 20 can be the surface to be processed, e.g., coated, and may be referred to as the frontside of the substrate 20.
  • the other extended surface opposite to the extended surface to be processed may be referred to as the backside of the substrate 20.
  • both extended surfaces could be processed.
  • the substrate has four lateral surfaces.
  • elastic means as used herein may refer to singular and plural, i.e., one elastic means and a plurality of elastic means. This particularly depends on the specific embodiments, wherein in some embodiments one elastic means is provided, and in some embodiments a plurality of elastic means is provided.
  • the aperture opening is configured to accommodate or house the substrate 20.
  • the two or more frame elements 31, 32, 33 and 34 are moveable with respect to each other and are configured for changing a size of the aperture opening. This has the particular advantage that substrates 20 can easily be loaded into and unloaded from the frame 30. Further, thermal elongations of the substrate 20, the frame 30 and a carrier plate to which the frame 30 may be mounted (see, e.g., figures 4 and 5), e.g., during coating, can be compensated for.
  • the two or more frame elements 31, 32, 33 and 34 are moved so as to increase or enlarge a size of the aperture opening.
  • the two or more frame elements 31, 32, 33 and 34 are moved to decrease the size of the aperture opening again.
  • the substrate 20 is clamped within the aperture opening by providing the clamping force acting against the substrate edges for clamping the substrate 20 at said substrate edges.
  • the elastic means cause the two or more frame elements 31, 32, 33 and 34 to move back so as to decrease the size of the aperture opening. Accordingly forces act against the substrate edges, i.e. against portions of the lateral surfaces, which are essentially parallel to the extended surfaces, e.g. the front side and the backside.
  • the two or more frame elements 31, 32, 33 and 34 can be moved so as to increase a size of the aperture opening and to release the clamping force acting against the substrate edges. Then, the substrate 20 can be removed from the aperture opening.
  • the frame 30 does not cover any part at least of the extended surface to be processed. In other words, the frame 30 does not reach around the substrate perimeter toward the extended surface to be processed. This allows a processing of the complete extended surface. Further, e.g., a coating quality is not impeded or degraded by the frame 30.
  • the two or more frame elements 31, 32, 33 and 34 at least partially cover the substrate edges.
  • the two or more frame elements 31, 32, 33 and 34 fully cover the substrate edges so as to prevent any coating of the substrate edges, i.e., there is no substrate edge or rim coating, and particularly no visible substrate edge or rim coating.
  • This is particularly advantageous in LCD manufacturing, where additional process steps to remove any unwanted coating remnants on that substrate edge which would be visible on the end device (e.g. mobile phone) should be avoided. This is because in some cases, due to design considerations, the display is glued onto the mobile phone housing so that the small display rim is visible.
  • the two or more frame elements 31, 32, 33 and 34 are configured for clamping the substrate 20 against the substrate edges with a surface of the substrate 20 being aligned with a surface of said two or more frame elements 31, 32, 33, and 34. Without any frame element 31, 32, 33 and 34 protruding over the surface to be processed, i.e., without protruding over the edge or rim height, a coating quality is not impeded or degraded by the frame 30 or frame elements 31, 32, 33 and 34. According to some other embodiments, at least a portion of at least one of the frame elements 31, 32, 33 and 34 protrudes over the substrate surface. This aspect is shown in figure 8 and described later.
  • the two or more frame elements 31, 32, 33 and 34 contact the substrate edges to provide the clamping force acting against said substrate edges.
  • the two or more frame elements 31, 32, 33 and 34 contact the substrate edges so as to partially or fully cover the substrate edges, i.e. the lateral surfaces of the substrate, wherein one dimension of a lateral surface corresponds to the substrate thickness, for preventing any coating of the substrate edges, as it is described above.
  • the frame 30 has two first side sections 31 and 33, e.g. vertical sections, and two second side sections 32 and 34, e.g. horizontal sections, being configured to loop around, encapsulate or surround the substrate 20.
  • the terms horizontal and vertical sections refer to a configuration of a deposition device for vertically oriented substrates. In such a configuration, the extended surfaces of the substrate 20 are substantially parallel to the direction of the force of gravity.
  • the frame 30 is substantially rectangular in shape.
  • the elastic means are configured to provide a retracting force acting on the two or more frame elements 31, 32, 33 and 34 for providing the clamping force.
  • the elastic means could be configured to pull the two or more frame elements 31, 32, 33 and 34 towards each other. Thereby, the substrate 20 can be clamped and held within the aperture opening.
  • the two or more frame elements 31, 32, 33, and 34 are connected by the elastic means. Thereby, particularly the retracting force can be provided acting on the two or more frame elements 31, 32, 33 and 34.
  • each two of the two or more frame elements 31, 32, 33 and 34 are connected by a respective one of the elastic means.
  • more than two of the two or more frame elements 31, 32, 33 and 34 are connected by a respective one of the elastic means.
  • all of the two or more frame elements 31, 32, 33 and 34 are connected by one elastic means.
  • the elastic means 40 includes one or more springs.
  • each two of the two or more frame elements 31, 32, 33 and 34 are connected by a respective one of the elastic means having one or more springs.
  • more than two of the two or more frame elements 31, 32, 33 and 34 are connected by a respective one of the elastic means having one or more springs.
  • all of the two or more frame elements 31, 32, 33 and 34 are connected by one elastic means having one or more springs.
  • the elastic means include one or more elastic bands, e.g. rubber bands.
  • each two of the two or more frame elements 31, 32, 33 and 34 are connected by a respective one of the elastic means having one or more elastic bands.
  • more than two of the two or more frame elements 31, 32, 33 and 34 are connected by a respective one of the elastic means having one or more elastic bands.
  • all of the two or more frame elements 31, 32, 33 and 34 are connected by one elastic means having one or more elastic bands.
  • the elastic band may be configured to fully surround the frame 30 so as to connect all of the frame elements 31, 32, 33 and 34 of the frame 30.
  • the elastic band may form a closed loop.
  • any combination of different elastic means e.g., springs and elastic bands, could be used.
  • the elastic means are covered by the two or more frame elements 31, 32, 33, and 34. According to some embodiments, which could be combined with other embodiments described herein, the elastic means are incorporated in the two or more frame elements 31, 32, 33, and 34. The elastic means can be incorporated into the frame body or covered by the frame to protect them from stray coating and subsequent particle peeling.
  • the two or more frame elements 31, 32, 33, and 34 are made of or include metal or plastic.
  • the two or more frame elements 31, 32, 33, and 34 can be manufactured from any machinable material, such as metals (e.g. aluminum, stainless steel) or vacuum capable plastic (e.g. PEEK).
  • FIG. 1 illustrates a holding arrangement 10 according to embodiments described herein and with a substrate 20 provided in an aperture opening of the holding arrangement 10 being released.
  • the two or more frame elements 31, 32, 33 and 34 can be moved so as to increase a size of the aperture opening. Once the substrate 20 is positioned within said aperture opening, the two or more frame elements 31, 32, 33 and 34 are moved back so as to decrease the size of the aperture opening again. Thereby, the clamping force acting against the substrate edges for clamping the substrate 20 at said substrate edges is provided.
  • the elastic means cause the two or more frame elements 31, 32, 33 and 34 to move back so as to decrease the size of the aperture opening and to clamp the substrate 20.
  • the two or more frame elements 31, 32, 33 and 34 can be moved so as to increase a size of the aperture opening. The movement is indicated by the arrows labeled with reference numeral 39.
  • the two or more frame elements 31, 32, 33 and 34 separate from each other in regions indicated with reference numerals 35, 36, 37 and 38.
  • four frame elements and four corresponding separation regions 35, 36, 37 and 38 are shown in figure 2, the embodiments described herein are not limited thereto. Any number of frame elements and corresponding separation regions could be present, e.g., two frame elements and two separation regions.
  • the separation regions 35, 36, 37 and 38 are corner regions of the frame 30.
  • Figure 3 shows a detailed view of the holding arrangement illustrated in figure 2 according to embodiments described herein.
  • Figure 3 shows the holding arrangement in the open position, where the substrate 20 is not clamped anymore, and is particularly not clamped by the frame element 34 anymore.
  • the two or more frame elements 31, 32, 33, and 34 can be further connected by tongue and groove connections, dowels or key and/or slot joints (indicated with reference numeral 41).
  • the two or more frame elements 31, 32, 33, and 34 can be aligned against each other by means of said tongue and groove connections 41, dowels or key and/or slot joints.
  • the elastic means 40 is an elastic band, e.g. a rubber band.
  • the elastic band may be provided to only connect the two frame elements 33 and 34, or may be provided to fully surround the frame so as to connect all of the frame elements of the frame. In the latter case, the elastic band may be a closed loop.
  • a gap between the two or more frame elements 31, 32, 33 and 34 could remain.
  • the existence of the gap and the size of the gap may depend on at least one of a minimum size of the aperture opening, a size of the substrate 20, and thermal conditions. The latter case includes thermal elongations of the substrate 20, the frame 30, and a carrier plate to which the frame may be mounted (see, e.g., figures 4 and 5, the carrier plate being indicated by reference numeral 50).
  • the gaps are small enough so as to not impede the substrate coating quality.
  • Figure 4 illustrates another holding arrangement 10, according to embodiments described herein, and a substrate 20 to be positioned in an aperture opening of said holding arrangement 10.
  • the frame 30 is mounted on a mounting plate 50.
  • the mounting plate 50 can be configured to be attached e.g. to a transport device of a deposition chamber, as it is for instance shown in figure 8.
  • the mounting plate 50 may have attachment means 51, such as holes for insertion of fixing elements, e.g., screws.
  • at least one of the frame elements 31, 32 of the frame 30 is provided moveable with respect to the mounting plate 50 so as to allow a movement of said at least one of the frame elements 31, 32 to change a size of the aperture opening for loading and/or unloading the substrate 20.
  • the frame 30 shown in figure 4 has a substantially rectangular shape.
  • the elastic means are provided in corner regions of said frame 30.
  • the elastic means connect the two or more frame elements 31, 32.
  • the frame elements 31, 32 In the example of figure 4 there are two frame elements 31 and 32 provided.
  • the gap between said frame elements 31, 32 is oriented at an angle of approximately 45° with respect to an extension of the frame elements 31, 32.
  • the frame 30 shown in figure 4 may have any other configuration, e.g., of any of the other embodiments disclosed herein.
  • Figure 5 illustrates the holding arrangement of figure 4 according to embodiments described herein with the substrate being clamped.
  • the substrate 20 is positioned in the aperture opening of the frame 30 and is clamped at its substrate edges and thus, firmly held within said aperture opening.
  • the frame elements provide a pushing force against the substrate edges, i.e. against the lateral surfaces of the substrate. Thereby, particularly the front side is not covered by a clamp or another holding means and the entire front side of the substrate can be coated.
  • the entire edge i.e. all lateral surfaces of the substrate, potentially with the exception of gaps between frame elements, is covered by frame elements in order to avoid coating of the edge, i.e. the lateral surface.
  • the edge i.e. the lateral surface.
  • only portions of the edge i.e. portions of two or more of the lateral surfaces of the substrate might be contacted by frame elements and a clamping force acting against the substrate edges is provided.
  • Figure 6 illustrates a holding arrangement similar to the holding arrangement described in figures 4 and 5, and figure 7 illustrates a detailed view of the holding arrangement of figure 6.
  • Figures 6 and 7 show a case where the holding arrangement, and particularly the frame 30, is in an open condition.
  • a gap 42 between the frame elements 31 and 32 is denoted with reference numeral 42.
  • the gap 42 between the frame elements 31, 32 is oriented at an angle of approximately 45° with respect to an extension of the two or more frame elements 31, 32.
  • the frame has two frame elements 31 and 32.
  • the frame 30 shown in figures 6 and 7 may have any other configuration, e.g., of any of the other embodiments disclosed herein.
  • a gap similar to the gap 42 shown in figures 6 and 7 could remain between the frame elements 31 and 32 even when the substrate is clamped.
  • the existence of said gap in the clamped state and the size of the gap 42 may depend on at least one of a minimum size of the aperture opening, a size of the substrate, and thermal conditions. The latter case includes thermal elongations of the substrate, the frame 30, and the carrier plate 50 to which the frame 30 may be mounted.
  • the gap is small enough so as to not impede the substrate coating quality.
  • At least one of the frame elements is fixedly attached to the mounting plate 50, and at least one of the frame elements is configured to be moveable with respect to the mounting plate 50.
  • the frame element 32 is fixedly attached to the mounting plate 50, wherein the frame element 31 is configured to be moveable with respect to the mounting plate 50, as indicated with the arrow in figure 6.
  • a holding arrangement 10 can be utilized for PVD deposition processes, CVD deposition process, substrate structuring edging, heating (e.g. annealing) or any kind of substrate processing.
  • Embodiments of holding arrangements 10 as described herein and methods of utilizing such holding arrangements 10 are particularly useful for non- stationary, i.e. continuous substrate processing of the vertically oriented large area glass substrates. Non-Stationary processing typically requires that the holding arrangement also provides masking elements for the process.
  • Figure 8 illustrates a schematic view of a frame 30 protruding over the substrate surface according to embodiments described herein.
  • the frame 30 includes an inclined surface having an angle 11 with respect to the substrate surface.
  • the angle 11 is equal to or less than 45°.
  • the inclined surface is substantially aligned with the substrate edge so that no step between the substrate surface and the inclined surface of the frame 30 occurs.
  • Figure 9 shows a schematic view of a deposition chamber 600 according to embodiments.
  • the deposition chamber 600 is adapted for a deposition process, such as a PVD or CVD process.
  • a substrate 20 is shown being located within or at a holding arrangement or carrier 10 having a frame 30 according to embodiments described herein on a substrate transport device 620.
  • a deposition material source 630 is provided in processing chamber 612 facing the side of the substrate 20 to be coated. The deposition material source 630 provides deposition material to be deposited on the substrate 20.
  • the source 630 may be a target with deposition material thereon or any other arrangement allowing material to be released for deposition on substrate 20.
  • the material source 630 may be a rotatable target.
  • the material source 630 may be movable in order to position and/or replace the source.
  • the material source may be a planar target.
  • the deposition material may be chosen according to the deposition process and the later application of the coated substrate.
  • the deposition material of the source may be a material selected from the group consisting of: a metal, such as aluminum, molybdenum, titanium, copper, or the like, silicon, indium tin oxide, and other transparent conductive oxides.
  • oxide-, nitride- or carbide-layers which can include such materials, can be deposited by providing the material from the source or by reactive deposition, i.e. the material from the source reacts with elements like oxygen, nitride, or carbon from a processing gas.
  • thin film transistor materials like siliconoxides, siliconoxynitrides, siliconnitrides, aluminumoxide, aluminumoxynitrides may be used as deposition material.
  • the substrate 20 is provided within the aperture opening of the frame 30 of the holding arrangement 10.
  • Dashed lines 665 show exemplarily the path of the deposition material during operation of the chamber.
  • the holding arrangement 10 does not cover any part of the surface to be coated. This prevents the substrate rims from any coating remnants, i.e., there is no rim coating. Further, the substrate frontside can be coated from rim to rim.
  • the holding arrangement 10 according to the embodiments described herein is suitable for instance for the OGS (one glass substrate) solution.
  • Figure 10 shows a flowchart of a method 100 for holding a substrate during vacuum layer deposition according to embodiments described herein.
  • the method for holding a substrate during vacuum layer deposition includes providing 101 a frame forming an aperture opening, positioning 102 the substrate in the aperture opening, and providing 103 a clamping force acting against the substrate edges for clamping the substrate at said substrate edges.
  • the positioning 102 of the substrate in the aperture opening includes aligning a surface of the substrate with a surface of the frame. According to some embodiments, which could be combined with other embodiments described herein, positioning 102 the substrate 20 in the aperture opening comprises positioning the substrate with at least a portion of the frame 30 protruding over the surface of the substrate.
  • the method for holding a substrate during vacuum layer deposition includes moving two or more frame elements of a frame with respect to each other to enlarge a size of an aperture opening formed by said frame elements, wherein the frame elements are connected by elastic means, and the elastic means provide a retracting force acting on the two or more frame elements, positioning the substrate in the aperture opening, and releasing the two or more frame elements to clamp the substrate at the substrate edges.
  • the holding arrangement firmly holds the substrate particularly during a deposition process.
  • the holding arrangement prevents the substrate rims from any coating remnants, i.e., there is no rim coating.
  • the holding arrangement does not cover the substrate rim area on the substrate front (i.e., no edge exclusion), such that the substrate frontside can be coated from rim to rim.
  • the holding arrangement does not protrude over the substrate rim height, the surface coating is not impeded.
  • the holding arrangement might prevent the substrate backside from any (visible) coating remnants.
  • the holding arrangement according to the embodiments described herein is suitable for instance for the OGS (one glass substrate) solution.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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Abstract

Cette invention concerne un agencement de support (10) conçu pour supporter un substrat (20) au cours d'un dépôt de couche par évaporation sous vide. Ledit agencement de support (10) comprend un cadre (30) présentant deux ou plusieurs éléments de cadre (31, 32, 33, 34), lesdits éléments de cadre (31, 32, 33, 34) formant une ouverture, ainsi que des moyens élastiques (40) conçus pour appliquer une force de serrage contre des parties des bords du substrat afin de serrer le substrat (20) et lesdits bords du substrat.
PCT/EP2013/066294 2013-08-02 2013-08-02 Agencement de support pour substrats WO2015014411A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020167005484A KR102219198B1 (ko) 2013-08-02 2013-08-02 기판들을 위한 유지 배열, 및 이를 사용하는 장치 및 방법
CN201380078669.6A CN105452523B (zh) 2013-08-02 2013-08-02 用于基板的保持布置以及使用所述用于基板的保持布置的设备和方法
PCT/EP2013/066294 WO2015014411A1 (fr) 2013-08-02 2013-08-02 Agencement de support pour substrats
TW103126528A TW201518532A (zh) 2013-08-02 2014-08-04 用於基板之支承配置及應用其之設備及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/066294 WO2015014411A1 (fr) 2013-08-02 2013-08-02 Agencement de support pour substrats

Publications (1)

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WO2015014411A1 true WO2015014411A1 (fr) 2015-02-05

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PCT/EP2013/066294 WO2015014411A1 (fr) 2013-08-02 2013-08-02 Agencement de support pour substrats

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KR (1) KR102219198B1 (fr)
CN (1) CN105452523B (fr)
TW (1) TW201518532A (fr)
WO (1) WO2015014411A1 (fr)

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CN105252298A (zh) * 2015-10-30 2016-01-20 昆山洺九机电有限公司 一种板式工件定位工装
WO2017050379A1 (fr) * 2015-09-24 2017-03-30 Applied Materials, Inc. Support pour porter un substrat dans un procédé de dépôt de matériau et procédé de support de substrat
US11383465B2 (en) 2018-10-10 2022-07-12 Universidad Politécnica de Madrid Machine for adapting a fibre structure to a mould for manufacturing parts of composite material

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US20190300296A1 (en) * 2016-10-27 2019-10-03 Corning Incorporated Methods and apparatus for securing an article
US10468221B2 (en) * 2017-09-27 2019-11-05 Applied Materials, Inc. Shadow frame with sides having a varied profile for improved deposition uniformity
CN108145564A (zh) * 2017-12-27 2018-06-12 重庆精高金属结构制造有限公司 一种除尘金属打磨装置
CN117878047B (zh) * 2024-03-11 2024-06-14 四川遂芯微电子股份有限公司 用于光伏整流器基板的定位治具、夹持及转移装置

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US20070068802A1 (en) * 2005-09-24 2007-03-29 Thomas Gebele Substrate carrier
EP2009685A1 (fr) * 2006-04-19 2008-12-31 Ulvac Inc. Dispositif de transport de substrat vertical et équipement de dépôt de pellicule
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US20120199477A1 (en) * 2009-08-26 2012-08-09 Canon Anelva Corporation Film forming apparatus
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CN105252298A (zh) * 2015-10-30 2016-01-20 昆山洺九机电有限公司 一种板式工件定位工装
US11383465B2 (en) 2018-10-10 2022-07-12 Universidad Politécnica de Madrid Machine for adapting a fibre structure to a mould for manufacturing parts of composite material

Also Published As

Publication number Publication date
TW201518532A (zh) 2015-05-16
KR20160039277A (ko) 2016-04-08
CN105452523A (zh) 2016-03-30
CN105452523B (zh) 2019-07-16
KR102219198B1 (ko) 2021-02-22

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