WO2015005851A1 - Fingerprint sensing device with protective coating - Google Patents
Fingerprint sensing device with protective coating Download PDFInfo
- Publication number
- WO2015005851A1 WO2015005851A1 PCT/SE2014/050830 SE2014050830W WO2015005851A1 WO 2015005851 A1 WO2015005851 A1 WO 2015005851A1 SE 2014050830 W SE2014050830 W SE 2014050830W WO 2015005851 A1 WO2015005851 A1 WO 2015005851A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- recesses
- sensing device
- layer
- sensing
- dielectric layer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/08—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3178—Coating or filling in grooves made in the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the recesses of the first layer are formed in the first layer without penetrating through the first layer, meaning that they do not reach through to the sensing element covered by the first layer.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Human Computer Interaction (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/894,162 US9449214B2 (en) | 2013-07-11 | 2014-07-01 | Fingerprint sensing device with protective coating |
JP2016525326A JP6403767B2 (en) | 2013-07-11 | 2014-07-01 | Fingerprint sensing system with protective coating |
EP14822466.0A EP3019998B1 (en) | 2013-07-11 | 2014-07-01 | Fingerprint sensing device with protective coating |
CN201480036705.7A CN105359164B (en) | 2013-07-11 | 2014-07-01 | Finger sensor apparatus with protective coating |
KR1020157033798A KR101698144B1 (en) | 2013-07-11 | 2014-07-01 | Fingerprint sensing device with protective coating |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13176103.3 | 2013-07-11 | ||
EP13176103 | 2013-07-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015005851A1 true WO2015005851A1 (en) | 2015-01-15 |
Family
ID=48793916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SE2014/050830 WO2015005851A1 (en) | 2013-07-11 | 2014-07-01 | Fingerprint sensing device with protective coating |
Country Status (6)
Country | Link |
---|---|
US (1) | US9449214B2 (en) |
EP (1) | EP3019998B1 (en) |
JP (1) | JP6403767B2 (en) |
KR (1) | KR101698144B1 (en) |
CN (1) | CN105359164B (en) |
WO (1) | WO2015005851A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016200314A1 (en) * | 2015-06-08 | 2016-12-15 | Fingerprint Cards Ab | Fingerprint sensing device with heterogeneous coating structure comprising an adhesive |
WO2017007392A1 (en) * | 2015-06-08 | 2017-01-12 | Fingerprint Cards Ab | Fingerprint sensing device with hetereogeneous coating structure comprising a mold |
US11295189B2 (en) | 2018-06-07 | 2022-04-05 | Fingerprint Cards Anacatum Ip Ab | Smartcard comprising a fingerprint sensor and method for manufacturing the smartcard |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8485442B2 (en) | 2009-07-02 | 2013-07-16 | Biometric Payment Solutions | Electronic transaction verification system with biometric authentication |
US10282583B2 (en) * | 2015-12-22 | 2019-05-07 | Gemalto Sa | Fingerprint imaging systems comprising self-wetting adhesive, films and methods |
US10387707B2 (en) | 2016-06-24 | 2019-08-20 | Idex Asa | Reinforcement panel for fingerprint sensor cover |
CN106250849B (en) * | 2016-08-01 | 2019-06-04 | 京东方科技集团股份有限公司 | Fingerprint identification device and preparation method thereof, display equipment |
JP7084702B2 (en) | 2016-09-02 | 2022-06-15 | アイデックス バイオメトリクス エーエスエー | How to manufacture a cover member suitable for a fingerprint sensor |
EP3370187A4 (en) * | 2017-01-19 | 2018-10-31 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint recognition device |
EP3432195A4 (en) * | 2017-02-10 | 2019-06-12 | Shenzhen Goodix Technology Co., Ltd. | Biosensor |
SE1750770A1 (en) * | 2017-06-16 | 2018-12-17 | Fingerprint Cards Ab | Fingerprint sensor module and method for manufacturing a fingerprint sensor module |
US11157717B2 (en) * | 2018-07-10 | 2021-10-26 | Next Biometrics Group Asa | Thermally conductive and protective coating for electronic device |
KR102582647B1 (en) * | 2018-10-10 | 2023-09-25 | 삼성디스플레이 주식회사 | Cover window and display device including the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002071307A (en) * | 2000-09-01 | 2002-03-08 | Sony Corp | Semiconductor device and its manufacturing method |
EP1316912A2 (en) * | 2001-11-30 | 2003-06-04 | STMicroelectronics, Inc. | Protection of exposed semiconductor chip using thin polymer coatings |
US20070222010A1 (en) * | 2006-03-24 | 2007-09-27 | Lightuning Tech. Inc. | Semiconductor integrated circuit chip with a nano-structure-surface passivation film and method of fabricating the same |
US20120170819A1 (en) * | 2011-01-05 | 2012-07-05 | Asd, Incorporated | Fingerprint Image Sensor without Residual Image |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6067368A (en) * | 1996-01-26 | 2000-05-23 | Authentec, Inc. | Fingerprint sensor having filtering and power conserving features and related methods |
US6088471A (en) * | 1997-05-16 | 2000-07-11 | Authentec, Inc. | Fingerprint sensor including an anisotropic dielectric coating and associated methods |
US6411726B1 (en) * | 1998-10-08 | 2002-06-25 | Durel Corporation | Fingerprint detector using an EL lamp |
US6440814B1 (en) * | 1998-12-30 | 2002-08-27 | Stmicroelectronics, Inc. | Electrostatic discharge protection for sensors |
US6310371B1 (en) * | 1999-10-08 | 2001-10-30 | United Microelectronics Corp. | Fingerprint sensor chip |
KR100371375B1 (en) * | 2001-03-12 | 2003-02-07 | 엘지산전 주식회사 | Shunt trip device |
US6515488B1 (en) * | 2001-05-07 | 2003-02-04 | Stmicroelectronics, Inc. | Fingerprint detector with scratch resistant surface and embedded ESD protection grid |
JP3806044B2 (en) * | 2002-02-08 | 2006-08-09 | 日本電信電話株式会社 | Surface shape recognition sensor and manufacturing method thereof |
DE10325863A1 (en) * | 2003-06-06 | 2005-01-05 | Infineon Technologies Ag | A method of manufacturing an integrated fingerprint sensor and sensor circuitry and injection assembly |
JP2005055327A (en) * | 2003-08-05 | 2005-03-03 | Sony Corp | Fingerprint collation device |
US7071708B2 (en) * | 2004-04-16 | 2006-07-04 | Lightuning Tech. Inc. | Chip-type sensor against ESD and stress damages and contamination interference |
CN101047153A (en) * | 2006-03-29 | 2007-10-03 | 祥群科技股份有限公司 | Semiconductor integrated circuit chip and its forming method |
US7858532B2 (en) * | 2007-08-06 | 2010-12-28 | United Microelectronics Corp. | Dielectric layer structure and manufacturing method thereof |
CN101656299B (en) * | 2008-08-22 | 2012-01-18 | 埃比克瑞亚有限公司 | Touch luminous element, manufacturing method thereof and fingerprint identification device |
KR20120138886A (en) * | 2011-06-16 | 2012-12-27 | 솔렌시스 주식회사 | Touch sensor |
-
2014
- 2014-07-01 US US14/894,162 patent/US9449214B2/en active Active
- 2014-07-01 JP JP2016525326A patent/JP6403767B2/en active Active
- 2014-07-01 WO PCT/SE2014/050830 patent/WO2015005851A1/en active Application Filing
- 2014-07-01 EP EP14822466.0A patent/EP3019998B1/en active Active
- 2014-07-01 KR KR1020157033798A patent/KR101698144B1/en active IP Right Grant
- 2014-07-01 CN CN201480036705.7A patent/CN105359164B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002071307A (en) * | 2000-09-01 | 2002-03-08 | Sony Corp | Semiconductor device and its manufacturing method |
EP1316912A2 (en) * | 2001-11-30 | 2003-06-04 | STMicroelectronics, Inc. | Protection of exposed semiconductor chip using thin polymer coatings |
US20070222010A1 (en) * | 2006-03-24 | 2007-09-27 | Lightuning Tech. Inc. | Semiconductor integrated circuit chip with a nano-structure-surface passivation film and method of fabricating the same |
US20120170819A1 (en) * | 2011-01-05 | 2012-07-05 | Asd, Incorporated | Fingerprint Image Sensor without Residual Image |
Non-Patent Citations (2)
Title |
---|
DATABASE WPI Week 200234, Derwent World Patents Index; AN 2002-300548, XP055255530 * |
See also references of EP3019998A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016200314A1 (en) * | 2015-06-08 | 2016-12-15 | Fingerprint Cards Ab | Fingerprint sensing device with heterogeneous coating structure comprising an adhesive |
WO2017007392A1 (en) * | 2015-06-08 | 2017-01-12 | Fingerprint Cards Ab | Fingerprint sensing device with hetereogeneous coating structure comprising a mold |
EP3304418A4 (en) * | 2015-06-08 | 2019-01-23 | Fingerprint Cards AB | Fingerprint sensing device with heterogeneous coating structure comprising an adhesive |
US11295189B2 (en) | 2018-06-07 | 2022-04-05 | Fingerprint Cards Anacatum Ip Ab | Smartcard comprising a fingerprint sensor and method for manufacturing the smartcard |
Also Published As
Publication number | Publication date |
---|---|
JP2016530913A (en) | 2016-10-06 |
CN105359164A (en) | 2016-02-24 |
US20160125220A1 (en) | 2016-05-05 |
US9449214B2 (en) | 2016-09-20 |
EP3019998A4 (en) | 2017-04-05 |
EP3019998B1 (en) | 2020-08-12 |
EP3019998A1 (en) | 2016-05-18 |
KR20160029738A (en) | 2016-03-15 |
CN105359164B (en) | 2017-04-05 |
JP6403767B2 (en) | 2018-10-10 |
KR101698144B1 (en) | 2017-01-19 |
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