WO2014205764A1 - 软性电子装置 - Google Patents

软性电子装置 Download PDF

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Publication number
WO2014205764A1
WO2014205764A1 PCT/CN2013/078326 CN2013078326W WO2014205764A1 WO 2014205764 A1 WO2014205764 A1 WO 2014205764A1 CN 2013078326 W CN2013078326 W CN 2013078326W WO 2014205764 A1 WO2014205764 A1 WO 2014205764A1
Authority
WO
WIPO (PCT)
Prior art keywords
protective film
electronic device
flexible substrate
flexible
film
Prior art date
Application number
PCT/CN2013/078326
Other languages
English (en)
French (fr)
Inventor
黄子瑜
洪仕馨
Original Assignee
友达光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 友达光电股份有限公司 filed Critical 友达光电股份有限公司
Priority to DE112013007200.9T priority Critical patent/DE112013007200T5/de
Publication of WO2014205764A1 publication Critical patent/WO2014205764A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier

Definitions

  • the present invention relates to a flexible electronic device, and more particularly to a flexible electronic device having a special structural design, which can avoid a sudden and substantial increase in the release force in a soft substrate debonding process.
  • the current soft electronic device process is to first apply a flexible substrate to a glass carrier and then perform various processes on various types of electronic components on a flexible substrate, and finally perform a release step to heat or ultraviolet light.
  • the temporary adhesive is viscous to remove the flexible substrate from the glass carrier.
  • the release force is easily changed in the release step due to the change in the thickness of the film layer, and in particular, the release force near the protective film suddenly increases sharply. Difficulties in the release, and even the destruction of electronic components affect the product yield. Therefore, how to improve the difficulty of increasing the separation step due to the large increase in the release force is still an urgent issue for the industry.
  • Invention disclosure is to first apply a flexible substrate to a glass carrier and then perform various processes on various types of electronic components on a flexible substrate, and finally perform a release step to heat or ultraviolet light.
  • the temporary adhesive is viscous to remove the flexible substrate from the glass carrier.
  • One of the objects of the present invention is to provide a flexible electronic device having a special structure of the protective film, which can reduce the damage caused by the release step to the soft electrical device.
  • the present invention discloses a flexible electronic device including a flexible substrate, an electronic component layer, and a protective film.
  • the flexible substrate has an upper surface
  • the electronic component layer is disposed on the upper surface of the flexible substrate
  • the protective film is disposed on the upper surface of the flexible substrate and covers the electronic component layer.
  • the protective film has at least one sidewall intersecting the upper surface of the flexible substrate, and the sidewall has an angle with the upper surface of the flexible substrate, the included angle being an acute angle.
  • the invention further discloses a flexible electronic device comprising a flexible substrate, an electronic component layer and a protective film, wherein the flexible substrate has an upper surface, the electronic component layer is disposed on the upper surface of the flexible substrate, and the protective film is disposed on the soft The upper surface of the substrate is covered with an electronic component layer.
  • the outer edge of the protective film has a gentle slope structure, and the thickness of the gentle slope structure gradually increases from the outer side of the protective film to the inner side of the protective film.
  • the angle between the side wall of the protective film and the flexible substrate of the flexible electronic device of the present invention is an acute angle
  • the thickness of the protective film gradually increases from the outer side to the inner side to have a gentle slope structure, so that the occurrence of the release step can be avoided.
  • the sudden increase in the release force can effectively improve the product yield.
  • FIG. 5 are schematic diagrams showing processes of a flexible electronic device according to the present invention.
  • Figure 6 is a graph showing the change of the release force of the flexible electronic device in the release step
  • Fig. 7 is a comparison diagram and a trend diagram of the angle of separation of the protective film against the maximum release force in the flexible electronic device of the present invention.
  • FIG. 1 to FIG. 5 are schematic diagrams showing the process of the flexible electronic device of the present invention.
  • the manufacturing process of the flexible electronic device of the present invention includes first attaching the flexible substrate 14 to an adhesive layer (eg, a temporary adhesive, not shown) on the surface of the carrier 12 , wherein the flexible substrate 14 is Examples of materials are polyethylene naphthalate (PEN), polyimide (PI), polyamide (PA), polyethersulfone (PES) or polyethylene terephthalate.
  • the polyethylene terephthalate (PET) has a thickness D1 of about 10 ⁇ m to about 50 ⁇ m, but is not limited thereto.
  • the process of fabricating the electronic component is performed on the flexible substrate 14 to be soft.
  • An electronic component layer 18 is formed on the upper surface 141 of the substrate 14.
  • the flexible electronic device of the present invention may be a touch panel or an organic electroluminescent display panel. Therefore, the above electronic component process may include fabrication of a thin film type touch electrode element or fabrication of an organic electroluminescence element and a switching element.
  • the electronic component layer 18 is exemplified by an organic light emitting device array, a thin film transistor array, or a touch sensing device array.
  • the flexible electronic device of the present invention may be any other electronic device that needs to be fabricated on a flexible substrate.
  • a package process is performed on the fabricated electronic component layer 18, for example, an encapsulation film layer 16 is formed on the upper surface 141 of the flexible substrate 14, and the electronic component layer 18 is covered and covered.
  • a protective film 20 is provided, wherein the protective film 20 may be a water blocking oxygen film, an explosion-proof film, an anti-glare layer, a polarizer or any film that needs to be disposed on the surface of the electronic component layer 18.
  • the material of the protective film 20 is exemplified by a plastic material, a metal material and/or any material which can be used to provide a protective function of the electronic device, and the thickness D2 is exemplified as about 30 micrometers to about 500 micrometers, and has a uniform thickness, but not Limited.
  • the protective film 20 may be a single layer film or include a multilayer film. Then, as shown in FIG.
  • the outer edge (ie, each side) of the protective film 20 is obliquely cut so that the outer edge of the protective film 20 forms a gentle slope structure 201 having a thickness from the outer side of the protective film 20 toward the protective film 20.
  • the inner side gradually increases and the angle G between the side wall 203 of the protective film 20 and the bottom plane 204 of the protective film 205 is an acute angle, for example, about 60 degrees or less, and the range is, for example, about 30 degrees to about 60 degrees.
  • the above process is carried out, for example, by cutting the sides of the protective film 20 inwardly obliquely from the bottom at an angle of about 30 to about 60 degrees from the vertical plane up to the upper surface 205 of the protective film 20.
  • the portion of the protective film 20 that is not cut is defined as the central portion 202 of the protective film 20, surrounded by the gentle slope structure 201, and its thickness, that is, the thickness D2 of the protective film 20, is from about 30 ⁇ m to about 500 ⁇ m.
  • the protective film 20 is attached to the upper surface 141 of the flexible substrate 14, and overlaid on the electronic component layer 18 and the encapsulation film layer 16. Since the area of the protective film 20 is smaller than the area of the flexible substrate 14, the protective film 20 does not cover the side of the flexible substrate 14, and a portion of the upper surface 141 of the flexible substrate 14, such as the outer edge of the flexible substrate 14, is also exposed. . As can be seen from FIG. 4, the central portion 202 of the protective film 20 completely overlaps the electronic component layer 18. Next, as shown in Fig. 5, the release process is performed in the direction of the arrow in the figure to separate the flexible substrate 14 from the carrier 12, and the fabrication of the flexible electronic device 10 of the present invention is completed.
  • the flexible electronic device 10 of the present invention can be fixed on the surface of the carrier 12 with a large-sized flexible substrate 14 before fabrication, and a plurality of electronic component layers 18 are formed and packaged, and the protective film 20 is attached.
  • the large-sized flexible substrate 14 is cut into small dimensions and then subjected to a release process, but not limited thereto. In various embodiments, the process of cutting the large-sized flexible substrate 14 into a small size may be performed. Before or after any of the foregoing processes, for example, before the protective film 20 is attached.
  • the flexible electronic device 10 of the present invention includes a flexible substrate 14, an electronic component layer 18, and a protective film 20.
  • the flexible substrate 14 has an upper surface 141
  • the electronic component layer 18 is disposed on the upper surface 141 of the flexible substrate 14.
  • the protective film 20 is disposed on the upper surface 141 of the flexible substrate 14 and covers the electronic component layer 18.
  • the protective film 20 has at least one side wall 203 intersecting the upper surface 141 of the flexible substrate 14 and the side wall 203 having an angle G with the upper surface 141 of the flexible substrate 14 wherein the angle G is an acute angle, preferably less than about 60 degrees.
  • the angle G ranges from about 30 degrees to about 60 degrees, but is not limited thereto.
  • the outer edge of the protective film 20 has a gentle slope structure 201 whose thickness gradually increases from the outer side of the protective film 20 toward the inner side of the protective film.
  • FIG. 6 is a schematic diagram showing the release force change curve of the different embodiments of the flexible electronic device of the present invention and the conventional flexible electronic device.
  • FIG. 6 shows the abscissa distance and the sidewall of the flexible substrate. The distance and, in the experiment, the test was performed with the distance between the outer edge of the protective film of the flexible electronic device and the side wall of the flexible substrate (for example, the distance D3 shown in Fig. 5) was about 5.5 mm. Since the protective film of the conventional flexible electronic device does not undergo the step of cutting the side wall in advance, the angle between the protective film and the flexible substrate is 90 degrees. As shown in FIG.
  • the change in the curve of the release force is also gentler than the change in the release force of the conventional flexible electronic device.
  • the principle is that the overall thickness of the flexible electronic device is gradually increased from the outer edge of the protective film by the gentle slope structure design of the protective film, rather than increasing in vain, thereby avoiding the difficulty of releasing the shape due to a sudden large increase in thickness.
  • FIG. 7 is a comparison diagram and a trend diagram of the angle of the angle G to the maximum release force in the flexible electronic device of the present invention, wherein the solid line portion represents the maximum release force corresponding to the angle G, and the dotted line A trend line that indicates the maximum release force. It can be seen from Fig. 7 that the smaller the angle of the angle G is, the slower the slope of the gentle slope structure indicating the edge of the protective film, the lower the maximum release force in the release step, and the more effective the lift-off step can be. Process effect.
  • the flexible electronic device of the present invention can be designed such that the gentle slope structure of the protective film is as smooth as possible, even if the angle between the sidewall of the protective film and the upper surface of the flexible substrate is G. The smaller the better, the lower the release force caused by the release step and the more gentle the change in the release force.
  • the protective film of the flexible electronic device of the present invention has a gentle slope structure in which the thickness of the edge portion gradually increases from the outer side to the inner side, and the side wall and the flexible substrate have an angle of less than 90 degrees, thereby avoiding the release.
  • the sudden and large increase in the release force in the step will only produce a small maximum release force, so the difficulty of the release step can be reduced, and the electronic components of the conventional soft electronic device in the release process can be improved. Damage problem, effectively improve product yield.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本发明公开一种软性电子装置，其包括软性基板、一电子元件层以及保护膜，其中电子元件层设置于软性基板的上表面，保护膜设置于软性基板的上表面且覆盖电子元件层。保护膜具有至少一侧壁与软性基板的上表面相交，且侧壁与软性基板上表面的夹角为锐角。

Description

技术领域
本发明涉及一种软性电子装 尤指一种具有特殊结构设计的软性电子装 置， 可以避免在软性基板离型 （debonding) 歩骤中离型力突然大幅增加。
现行软性电子装置的工艺为先将软性基板以暂粘胶贴于玻璃载板上 然后 在软性基板上进行各类电子元件的必需工艺， 最后再进行离型步骤， 以热或紫 外光将暂粘胶减粘以将软性基板从玻璃载板上取下。 然而， 由于电子装置上可 能有多层膜层和元件，在离型歩骤中容易因为膜层厚度变化而使离型力发生改 变， 特别是在保护膜附近的离型力会突然大幅增加， 造成离型困难， 甚至造成 电子元件的毁坏而影响产品成品率。 因此， 如何改善因离型力大幅增加而增加 离型步骤困难度的问题， 仍为业界亟需研究的课题。 发明公开
本发明的目的之一在于提供一种软性电子装置， 其保护膜具有特殊结构， 能够降低离型步骤对软性电装置所造成的伤害。
本发明公开一种软性电子装置， 其包括软性基板、 电子元件层以及保护 膜。 软性基板具有上表面， 电子元件层设置于软性基板的上表面， 保护膜设置 于软性基板的上表面且覆盖电子元件层。保护膜具有至少一侧壁与软性基板的 上表面相交， 且侧壁与软性基板上表面具有一夹角， 该夹角为锐角。
本发明又公开一种软性电子装置， 其包括软性基板、 电子元件层以及保护 膜， 其中软性基板具有上表面， 电子元件层设置于软性基板的上表面， 而保护 膜设置于软性基板的上表面上且覆盖电子元件层。 保护膜的外缘具有缓坡结 构， 且缓坡结构的厚度由保护膜的外侧向保护膜的内侧渐渐增加。
由于本发明软性电子装置的保护膜侧壁与软性基板的夹角为锐角，保护膜 在边缘部分的厚度从外侧往内侧渐渐增加而具有缓坡结构， 因此可以避免在进 行离型步骤时发生离型力忽然大幅增加的情况， 能有效改善产品成品率。 附图简要说明
图 1至图 5为本发明软性电子装置的工艺示意图；
图 6为软性电子装置在离型歩骤的离型力变化曲线图；
图 7为本发明软性电子装置中保护膜夹角角度对最大离型力的比较图及 趋势图。 其中 附图标记
12
14
141 上表面
16
18 电子元件层
20 保护膜
201 缓坡结构
202 中央部分
203 侧壁
204 底平面
205 上表面
Dl、 D2 厚度
D3 距离
G 夹角
请参考图 1至图 5， 图 1至图 5为本发明软性电子装置的工艺示意图。 如 图 1所示，本发明软性电子装置的制作流程包括先将软性基板 14以粘着层（例 如暂粘胶， 未绘示）贴附于载板 12的表面， 其中软性基板 14的材料举例为聚 萘酸乙酯 （polyethylene naphthalate, PEN)、 聚酰亚胺 （polyimide, PI)、 聚酰 胺 （polyamide, PA)、 聚苯醚砜 （polyethersulfone, PES ) 或聚对苯二甲酸乙 二酯 （polyethylene terephthalate, PET) , 其厚度 D1举例为约 10微米至约 50 微米， 但不以此为限。 然后， 在软性基板 14进行制作电子元件的工艺以在软 性基板 14的上表面 141上形成电子元件层 18。 举例而言， 本发明软性电子装 置可以为触控面板或有机电激发光显示面板 因此上述电子元件工艺可能包括 薄膜型触控电极元件的制作或是有机电激发光元件和开关元件的制作， 电子元 件层 18举例为有机发光元件阵列、 薄膜晶体管阵列或触控感应元件阵列， 但 不以此为限， 本发明软性电子装置也可以为其他需要制作在软性基板上的任何 电子装置。 之后， 对制作好的电子元件层 18进行封装工艺， 例如在软性基板 14的上表面 141上形成封装膜层 16， 覆盖并包覆电子元件层 18。
接着， 请参考图 2， 提供保护膜 20， 其中保护膜 20可以为阻水氧膜、 防 爆膜、 抗眩膜（anti-glare layer )、 偏光片或任何需要设置在电子元件层 18表面 的膜层， 保护膜 20的材料举例包括塑胶材料、 金属材料及 /或任何可用来提供 电子装置保护功能的材料， 其厚度 D2举例为约 30微米至约 500微米， 具有 均匀的厚度， 但不以此为限。 此外， 保护膜 20可以为单层膜或包括多层膜。 然后， 如图 3， 对保护膜 20的外缘 （即各侧边） 进行斜角切割， 以使保护膜 20的外缘形成缓坡结构 201， 其厚度由保护膜 20的外侧向保护膜 20的内侧渐 渐增加且保护膜 20的侧壁 203与保护膜 205的底平面 204的夹角 G为锐角， 例如小于等于约 60度， 其范围举例为约 30度至约 60度。 上述工艺的进行方 式例如对保护膜 20的各侧边由底部沿着与垂直面夹角约 30度至约 60度的角 度向内斜向切割直到保护膜 20的上表面 205。 在此工艺后， 保护膜 20没有被 切割的部分定义为保护膜 20的中央部分 202， 被缓坡结构 201所围绕， 其厚 度即保护膜 20的厚度 D2, 为约 30微米至约 500微米。
接着， 请参考图 4， 将保护膜 20贴于软性基板 14的上表面 141， 覆盖在 电子元件层 18与封装膜层 16上。 由于保护膜 20的面积小于软性基板 14的面 积， 因此保护膜 20未覆盖软性基板 14的侧边， 也会暴露出软性基板 14的部 分上表面 141， 例如软性基板 14的外缘。 由图 4可知， 保护膜 20的中央部分 202完全重叠覆盖电子元件层 18。 接着， 如图 5所示， 沿着图中箭头方向进行 离型歩骤， 使软性基板 14与载板 12分离， 便完成本发明软性电子装置 10的 制作。 需注意的是， 本发明软性电子装置 10在制作时， 可以先以大尺寸的软 性基板 14固定于载板 12表面， 制作多个电子元件层 18并进行封装、 贴上保 护膜 20后， 才将大尺寸软性基板 14切割成小尺寸后再进行离型歩骤， 但不以 此为限， 在不同实施例中， 将大尺寸软性基板 14切割成小尺寸的工艺可以在 前述任何工艺之前或之后， 例如在贴上保护膜 20之前。
因此， 如图 4与图 5所示， 本发明软性电子装置 10包括软性基板 14、 电 子元件层 18以及保护膜 20。 其中， 软性基板 14具有上表面 141， 而电子元件 层 18设置在软性基板 14的上表面 141， 保护膜 20则设置于软性基板 14的上 表面 141上且覆盖电子元件层 18。 保护膜 20具有至少一侧壁 203， 与软性基 板 14的上表面 141相交且侧壁 203与软性基板 14的上表面 141具有夹角 G 其中夹角 G为锐角， 较佳小于约 60度， 例如夹角 G的范围为约 30度至约 60 度， 但不以此为限。 此外， 保护膜 20的外缘具有缓坡结构 201， 其厚度由保 护膜 20的外侧向保护膜的内侧渐渐增加。
请参考图 6， 图 6为本发明软性电子装置的不同实施例与传统软性电子装 置的离型歩骤的离型力变化曲线示意图， 图 6横坐标距离表示与软性基板侧壁 的距离， 并且， 在实验中， 以软性电子装置的保护膜的外缘与软性基板侧壁的 距离 （例如图 5所示的距离 D3 ) 为约 5.5毫米来进行测试。 由于传统软性电 子装置的保护膜并没有经过预先切割侧壁的歩骤， 因此其保护膜与软性基板的 夹角为 90度。 如图 6所示， 在传统软性电子装置的离型歩骤中， 当使软性基 板自其边缘开始而从载板上剥离至距离软性基板侧壁约 5.5毫米处时， 由于遭 遇到软性基板表面上保护膜的侧鹿所以软性电子装置的整体厚度突然大幅增 力口， 导致离型力会突然大幅增加至约 130克。 另一方面， 由于本发明软性电子 装置的保护膜具有缓坡结构， 因此其侧壁与软性基板具有夹角 G， 当夹角 G 为 60度时， 在离型歩骤中的最大离型力为约 80克 ， 而当夹角 G为 50度时， 最大离型力更降低至约 50克。 并且， 在本发明软性电子装置中， 当夹角 G为 60度与 50度时， 离型力的曲线变化也较传统软性电子装置的离型力的变化更 为平缓。其原理是通过保护膜的缓坡结构设计而使软性电子装置的整体厚度从 保护膜外缘开始缓慢增加， 而非徒然增加， 以此避免因厚度突然大幅增大而导 致离型困难。
请参阅图 7， 图 7为本发明软性电子装置中夹角 G的角度对最大离型力的 比较图及趋势图， 其中实线部分表示夹角 G所对应的最大离型力， 而虚线表 示最大离型力的趋势线。 由图 7可知， 当夹角 G的角度越小时， 表示保护膜 边缘的缓坡结构坡度越缓， 那么在离型歩骤中的最大离型力会越低， 可以更有 效地提高离型歩骤的工艺效果。 此外， 由趋势线得知， 如果保护膜侧壁与软性 基板上表面的夹角 G能降至 30度， 那么离型力甚至可以小于 20克， 使离型 力对装置的伤害降到更低。 因此， 在保护膜侧壁切割工艺可以支持的条件下， 本发明软性电子装置可以设计使保护膜的缓坡结构越平缓越好，亦即使保护膜 侧壁与软性基板上表面的夹角 G越小越好， 以降低离型歩骤所导致的最大离 型力， 并使离型力的变化更趋平缓。
综上所 由于本发明软性电子装置的保护膜在边缘部分的厚度从外侧往 内侧渐渐增加而具有缓坡结构， 其侧壁与软性基板具有小于 90度的夹角， 因 此可以避免在离型歩骤中发生离型力突然大幅增加的情况 也仅会产生较小的 最大离型力， 因此可以降低离型歩骤的困难度， 改善传统软性电子装置在离型 歩骤中发生电子元件损坏的问题， 有效提升产品成品率。

Claims

权利要求书
I. 一种软性电子装置， 其特征在于， 包括：
一软性基板， 其具有一上表面；
一电子元件层设置于该软性基板的该上表面； 以及
一保护膜， 设置于该软性基板的该上表面上且覆盖该电子元件层， 该保 护膜具有至少一侧壁与该上表面相交， 该侧壁与该上表面具有一夹角， 且该夹 角为锐角。
2. 根据权利要求 1所述的软性电子装置 其特征在于， 其中该夹角小于 等于约 60度。
3. 根据权利要求 2所述的软性电子装置 其特征在于， 其中该夹角的范 围为约 30度至约 60度。
4. 根据权利要求 1所述的软性电子装置 其特征在于， 其中该保护膜的 面积小于该软性基板的面积， 且该保护膜未 I 盖该软性基板的侧边。
5. 根据权利要求 1所述的软性电子装置 其特征在于， 其中该保护膜包 括阻水氧膜、 防爆膜、 抗眩膜或偏光片。
6. 根据权利要求 1所述的软性电子装置 其特征在于， 其中该保护膜的 材料包括塑胶或金属材料。
7. 根据权利要求 1所述的软性电子装置 其特征在于， 其中该保护膜包 括单层膜或多层膜。
8. 根据权利要求 1所述的软性电子装置 其特征在于， 其中该软性基板 的材料包括聚萘酸乙酯、聚酰亚胺、聚酰胺、聚苯醚砜或聚对苯二甲酸乙二酯。
9. 根据权利要求 1所述的软性电子装置， 其特征在于， 其中该软性基板 的厚度为约 10微米至约 50微米。
10. 根据权利要求 1所述的软性电子装置， 其特征在于， 其中该电子元件 层包括有机发光元件、 薄膜晶体管或触控感应元件。
II. 一种软性电子装置， 其特征在于， 包括：
一软性基板， 其具有一上表面；
一电子元件层设置于该软性基板的该上表面； 以及 一保护膜， 设置于该软性基板的该上表面上且覆盖该电子元件层， 该保护 膜的外缘具有一缓坡结构， 且该缓坡结构的厚度由该保护膜的外侧向该保护膜 的内侧渐渐增加。
12. 根据权利要求 11所述的软性电子装置， 其特征在于， 其中该保护膜 还包括一中央部分被该缓坡结构所围绕 该保护膜的该中央部分完全重叠于该 电子元件层， 且该中央部分的厚度为约 30微米至约 500微米。
PCT/CN2013/078326 2013-06-26 2013-06-28 软性电子装置 WO2014205764A1 (zh)

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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150029429A (ko) * 2013-09-10 2015-03-18 삼성디스플레이 주식회사 표시 패널 및 그의 제조 방법
CN103682177B (zh) * 2013-12-16 2015-03-25 深圳市华星光电技术有限公司 柔性oled面板的制作方法
US20160181574A1 (en) * 2014-01-03 2016-06-23 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for manufacturing flexible oled (organic light emitting diode) panel
CN104166475A (zh) * 2014-06-27 2014-11-26 京东方科技集团股份有限公司 一种柔性触摸基板及触摸显示器件
CN105718091A (zh) * 2014-08-17 2016-06-29 宸鸿科技(厦门)有限公司 具有柔性触控感测器的触控面板及其制作方法
TWI589194B (zh) * 2014-12-26 2017-06-21 財團法人工業技術研究院 軟性電子裝置
US9743513B2 (en) 2014-12-26 2017-08-22 Industrial Technology Research Institute Flexible electronic device
KR102622227B1 (ko) 2015-10-30 2024-01-08 코닝 인코포레이티드 제2 기판에 결합된 제1 기판을 가공하는 방법
US10418237B2 (en) * 2016-11-23 2019-09-17 United States Of America As Represented By The Secretary Of The Air Force Amorphous boron nitride dielectric
US10384434B2 (en) 2017-08-31 2019-08-20 Industrial Technology Research Institute Separating device and separating method
WO2019049235A1 (ja) * 2017-09-06 2019-03-14 シャープ株式会社 表示デバイスの製造方法及び表示デバイスの製造装置
CN107589873A (zh) * 2017-10-11 2018-01-16 业成科技（成都）有限公司 触控显示装置的制造方法
TWI736695B (zh) * 2017-10-24 2021-08-21 啟耀光電股份有限公司 電子裝置與其製造方法
CN110021234B (zh) * 2018-01-08 2022-03-08 上海和辉光电股份有限公司 一种阵列基板及其制作方法、柔性显示面板
CN111341715B (zh) * 2018-12-19 2022-11-08 瀚宇彩晶股份有限公司 电子装置及其制作方法
CN110636158A (zh) * 2019-09-12 2019-12-31 华为技术有限公司 一种中框、后盖及其制备方法和电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050133249A1 (en) * 2003-12-19 2005-06-23 Mitsui Mining & Smelting Co., Ltd. Printed wiring board and semiconductor device
CN1913752A (zh) * 2005-08-12 2007-02-14 日本梅克特隆株式会社 混合多层电路基板的制造方法
CN101616542A (zh) * 2008-06-26 2009-12-30 华通电脑股份有限公司 具有可剥保护层的软硬复合电路板及其制造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5796586A (en) 1996-08-26 1998-08-18 National Semiconductor, Inc. Substrate board having an anti-adhesive solder mask
JP3759841B2 (ja) * 1998-08-31 2006-03-29 富士通株式会社 薄膜積層型光学部品及び要素部品の被覆構造
JP2001350047A (ja) * 2000-06-07 2001-12-21 Nippon Telegr & Teleph Corp <Ntt> 光導波路基板およびその作製方法
KR100768182B1 (ko) * 2001-10-26 2007-10-17 삼성에스디아이 주식회사 유기 전자 발광 소자와 그 제조방법
JP4864649B2 (ja) 2005-11-11 2012-02-01 株式会社半導体エネルギー研究所 機能性を有する層、及びそれを有する可撓性基板の形成方法、並びに半導体装置の作製方法
KR100879207B1 (ko) * 2005-12-30 2009-01-16 주식회사 엘지화학 플렉시블 디스플레이장치 및 이의 제조방법
US8115326B2 (en) * 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier
JP5227531B2 (ja) 2007-03-30 2013-07-03 日本発條株式会社 ディスク装置用サスペンション
JP3141815U (ja) * 2008-01-18 2008-05-22 株式会社パワーサポート 粘着セパレータ付き保護フィルム
US20110291544A1 (en) 2010-05-31 2011-12-01 Industrial Technology Research Institute Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof
KR101267529B1 (ko) 2010-10-30 2013-05-24 엘지디스플레이 주식회사 플렉서블한 유기전계 발광소자 제조 방법
JP5735989B2 (ja) 2011-07-08 2015-06-17 三井化学株式会社 ポリイミド樹脂組成物およびそれを含む積層体
JP2013089710A (ja) * 2011-10-17 2013-05-13 Fujikura Ltd フレキシブルプリント基板及びその製造方法
US20140061610A1 (en) * 2012-08-31 2014-03-06 Hyo-Young MUN Organic light emitting device and manufacturing method thereof
TWI532163B (zh) * 2014-01-10 2016-05-01 友達光電股份有限公司 可撓式顯示面板及可撓式顯示面板之製作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050133249A1 (en) * 2003-12-19 2005-06-23 Mitsui Mining & Smelting Co., Ltd. Printed wiring board and semiconductor device
CN1913752A (zh) * 2005-08-12 2007-02-14 日本梅克特隆株式会社 混合多层电路基板的制造方法
CN101616542A (zh) * 2008-06-26 2009-12-30 华通电脑股份有限公司 具有可剥保护层的软硬复合电路板及其制造方法

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