WO2014201751A1 - 一种地震临震监测用探头及装置 - Google Patents

一种地震临震监测用探头及装置 Download PDF

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Publication number
WO2014201751A1
WO2014201751A1 PCT/CN2013/079810 CN2013079810W WO2014201751A1 WO 2014201751 A1 WO2014201751 A1 WO 2014201751A1 CN 2013079810 W CN2013079810 W CN 2013079810W WO 2014201751 A1 WO2014201751 A1 WO 2014201751A1
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WIPO (PCT)
Prior art keywords
sensors
signal
seismic
probe
circuit module
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PCT/CN2013/079810
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English (en)
French (fr)
Inventor
王新安
林科
张兴
雍珊珊
王腾
谢峥
郭朝阳
张国新
冯晓星
葛彬杰
周中华
安辉耀
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Peking University Shenzhen Graduate School
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Peking University Shenzhen Graduate School
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Publication of WO2014201751A1 publication Critical patent/WO2014201751A1/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/01—Measuring or predicting earthquakes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/24—Recording seismic data

Definitions

  • the present application relates to the field of seismic monitoring technology, and particularly relates to a probe for seismic earthquake monitoring and a device for monitoring earthquake seismic.
  • the local stress field distribution is an unstable state in places where stress is easily concentrated in the earth's crust, such as faults, cracks and voids.
  • the redistribution process of the stress field or the release process of the strain energy is the deformation and microscopic fracture of the rock mass.
  • the cracks are then developed into large-scale fractures (seismic) of the rock mass.
  • the part of the released energy is released in the form of sound waves.
  • the radiated sound waves are the pre-earthquake ground sounds. Therefore, the detection of geoacoustic signals in seismic fault zones has become an important method for monitoring crustal activity.
  • the technological innovations in this area will certainly have a positive effect on the exploration of earthquake inoculation process, fault activity, and prediction and prediction of large earthquakes.
  • the present application provides a probe for seismic earthquake monitoring, comprising: a sound head for directly coupling with a point to be measured to capture a ground sound signal; and for converting the ground sound signal a plurality of sets of sensors for electrical signals, each set of sensors comprising at least two independent sensors, the frequency response ranges of the plurality of sets of sensors covering different acoustic acoustic wave frequency bands; for sequentially filtering, amplifying, and modulating the electrical signals a digital conversion preprocessing circuit module; a power supply and signal cable for transmitting an output signal of the preprocessing circuit module and providing power to the preprocessing circuit module; a power supply output end and a signal input of the power supply and signal cable End, the plurality of sets of sensors and the pre-processing circuit module are packaged and fixed to an output end of the sounding head by a package structure, a power supply input end and a signal output of the power supply and signal cable The end protrudes from the package structure.
  • the probe further includes a sounding rod for transmitting the ground acoustic signal to the plurality of sets of sensors, each set of sensors comprising at least two independent piezoelectric thin film sensors, each of the piezoelectric thin film sensors Attached to the surface of the sounding rod.
  • the package structure is further used for encapsulating the sounding rod;
  • the cross section of the sounding rod is a polygon, and the number of sides of the polygon is equal to the number of all the piezoelectric film sensors.
  • the sounding rod is a solid rigid structure, and the sounding rod is provided with a connecting end at one end connected to the sounding head; the sounding head is a solid rigid structure, and the sounding head is used A connecting hole is disposed at one end connected to the sounding rod, and the connecting head is matched with the connecting hole.
  • the diameter of the input end of the sounding head is smaller than the diameter of the output end thereof; the package structure supplies the power supply output end and the signal input end of the power supply and signal cable, the plurality of sets of sensors and the pre-processing circuit module
  • the package is fixed in a cylindrical space of equal diameter to the output end of the acoustic head.
  • the plurality of sets of sensors includes at least one set of infrasound sensors, at least one set of audible wave sensors, and at least one set of ultrasonic sensors.
  • the pre-processing circuit module includes a plurality of signal processing links, the plurality of signal processing links are independent of each other, juxtaposed and identical, and are used for sequentially filtering, amplifying, and modulating the electrical signals in parallel.
  • the number of the signal processing links is the same as the number of groups of the plurality of groups of sensors, and one signal processing link is connected to a group of sensors, and each group of sensors converts the electricity converted by each of the sensors included therein The signals are added and output to a corresponding signal processing link.
  • each of the plurality of sets of sensors is a backup of other sets of sensors, and one of each set of sensors is a backup of other sensors of the set of sensors; each of the plurality of signal processing links The signal processing link is a backup of other signal processing links.
  • the present application provides an apparatus for seismic earthquake monitoring, comprising: a probe for seismic earthquake monitoring as described above, for selecting a processed signal from the pre-processing circuit module a master unit, and a wireless transmitting unit for transmitting the selected signal.
  • the main control unit selects the strongest signal from the pre-processing circuit module Output signal.
  • the beneficial effects of the present application are: Since the frequency response range of the sensor group covers different acoustic acoustic wave frequency bands, the probe can capture the intensity, frequency and frequency of different geoacoustic information, and is suitable for monitoring the earthquake inoculation process and the imminent earthquake prediction work; At the same time, there are at least two sensors in each group of sensors, and one of the sensors can be used as a backup for the other, thereby improving the reliability of the probe.
  • FIG. 1 is a schematic structural view of a probe for seismic earthquake monitoring according to an embodiment of the present application
  • FIG. 2 is a schematic cross-sectional view of the probe shown in FIG. 1;
  • FIG. 3 is a schematic structural view of a sound transmitting head of a probe in an embodiment of the present application.
  • FIG. 4 is a schematic structural view of a sound transmission rod of a probe in an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a sensor group of a probe connected to a pre-processing circuit module in an embodiment of the present application
  • FIG. 6 is a schematic structural diagram of a pre-processing circuit module of a probe connected to a ground base station in an embodiment of the present application.
  • the embodiment of the present application provides a probe for seismic earthquake monitoring, which comprises a sound head, a plurality of sensors, a pre-processing circuit module, a power supply and signal cable, and a package structure.
  • the sound head is used to directly couple with a point to be measured, such as a bedrock, to capture a ground sound signal.
  • Multiple sets of sensors are used to convert the ground acoustic signals captured by the acoustic head into electrical signals.
  • Each set of sensors includes at least two independent sensors whose frequency response ranges cover different acoustic acoustic wave bands.
  • the pre-processing circuit module is used for sequentially performing signal filtering, amplification, and analog-to-digital conversion on the electrical signal.
  • the power supply and signal cable have two functions of power supply and signal transmission, that is, it is used to transmit the output signal of the pre-processing circuit module, and is also used to supply power to the pre-processing circuit module.
  • the package structure is used for packaging and fixing the power supply output and the signal input end of the plurality of sensors, the pre-processing circuit module and the power supply and signal cable to the output end of the sound head, and the power supply input terminal and the signal output end of the power supply and signal cable It is exposed outside the package structure.
  • the power supply output and signal input end of the power supply and signal cable refer to the end of the power supply and signal cable connected to the pre-processing circuit module.
  • the power supply input terminal and the signal output end of the power supply and signal cable refer to the pre-processing circuit module. One end.
  • the probe for seismic earthquake monitoring of the present embodiment includes a sounding head 10, A plurality of sets of sensors 30, a pre-processing circuit module 50, a power supply and signal cable 60, and a package structure 40, wherein the plurality of sets of sensors 30 are a plurality of sets of strip-shaped piezoelectric film sensors, and the probe further comprises a transistor for facilitating the fixing of the strip-shaped piezoelectric film sensor. Sound rod 20.
  • the horn 10 is used to directly couple with the bedrock and to transmit the ground acoustic signal to the plurality of sets of sensors 30.
  • the diameter of the input end of the acoustic head can be set smaller than the diameter of the output end, wherein the input end refers to the end of the acoustic head that first contacts the bedrock, and the output end is the end opposite the input end, such as sound transmission.
  • the head may be pointed or tapered and may be shaped like a bullet.
  • the acoustic head is a solid rigid structure.
  • the acoustic head can be made of a corrosion-resistant metal material in order to be placed on the ground without damage and to better capture the acoustic signal.
  • the sounding rod 20 is used to fix the strip-shaped piezoelectric film sensor group 30, and transmits the ground sound signal from the sound transmitting head 10 to the strip-shaped piezoelectric film sensor group 30, each of which includes at least two independent Piezoelectric film sensors, each of which is attached to the surface of the sounding rod.
  • the cross section of the sounding rod is a polygon, and the number of sides of the polygon is equal to the number of all strip-shaped piezoelectric film sensors.
  • the sounding rod is a solid rigid structure
  • the sounding rod is provided with a connecting end at one end connected to the sounding head
  • the connecting end of the sounding head for connecting with the sounding rod is provided with a connecting hole
  • the connecting The head is mated with the connection hole
  • the material of the conical sounding head 10 and the sounding rod 20 are solid stainless steel, wherein the bottom surface of the conical sound head (ie, the output end) It is a circle with a radius of 5 cm and a height of 15 cm.
  • the center of the bottom surface has a threaded connection hole 101 with a diameter of 3 cm, and the sounding rod 20 is 30 cm long, and the cross section is a regular hexagon with a side length of 3 cm, which is linked with the sound head.
  • the end portion has a threaded connector 201 having a diameter of 3 cm; the tapered microphone head 10 is mechanically coupled to the sounding rod 20 by a threaded connection hole 101 and a threaded connection head 201.
  • the plurality of sets of sensors are a plurality of sets of piezoelectric thin film sensors for converting the received ground acoustic signals into electrical signals.
  • PVDF polyvinylidene fluoride
  • the electric film is packaged in a metal strip package, 20cm long and 2cm wide. It is glued to the six sides of the sound rod. Its sensitivity should be better than -180dB-Vxl0 4 /Pa, and the frequency response range is greater than 10" 3 Hz to less than 10 5 Hz, operating temperature range greater than -50 ° C to less than 100 ° C.
  • the pre-processing circuit module 50 is configured to perform signal filtering and amplification on the transmitted electrical signal, and convert the analog quantity into a digital quantity and output.
  • the pre-processing circuit module includes a plurality of juxtapositions Signal processing link, each signal processing link is independent and identical to each other, the number of signal processing links is the same as the number of groups of multiple sets of sensors, and one signal processing link is connected to a group of sensors, since each group of sensors includes At least two sensors, such that the sum of the signals output by each of the sensors in each set of sensors is the output of the set of sensors, which is delivered to a corresponding signal processing link in the pre-processing circuit module.
  • the filtering and amplifier bandwidth used for each signal processing link is DC-lMHz, ie 0 ⁇ 1 ⁇
  • the analog-to-digital converter uses a ⁇ analog-to-digital converter.
  • the plurality of sets of sensor groups 30 include six strip-shaped piezoelectric film sensors 3011, 3012, 3021, 3022, 3031, 3032, which are composed of two pairs.
  • the three pairs of strip-shaped piezoelectric film sensor pairs that is, the sensor 3011 and the sensor 3012 form a pair 301, the sensor 3021 and the sensor 3022 form a pair 302, the sensor 3031 and the sensor 3032 form a pair 303, each pair of strip-shaped piezoelectric film sensor pairs
  • the electrical signals of each of the strip-shaped piezoelectric film sensors are summed and outputted to corresponding signal processing links in the pre-processing circuit module, and the pre-processing circuit module 50 includes three signal processing links 501, 502, 503, each
  • the strip links include filtering and amplifiers 5011, 5012, 5013 and analog to digital converters 5021, 5022, 5023 that are connected in sequence.
  • the three links output the processed signals in parallel.
  • each group of sensors and the other group of sensors are backed up with each other, and one of each group of sensors and the other sensors of the group of sensors are also backed up each other.
  • each signal processing link in the preprocessing circuit module is The other signal processing links are backups of each other. Still taking the foregoing specific implementation as an example, in the three sets of strip-shaped piezoelectric film sensors, each pair of strip-shaped piezoelectric film sensors are mutually backed up by two pairs, each of each pair of strip-shaped piezoelectric film sensors The piezoelectric film sensors are mutually backed up, and each of the three signal processing links is backed up by two other.
  • the pre-processing circuit module can be installed in the metal shielding box, and the input/output interface is reserved by the SMA (SubMini a ture Ver s i on A, 3 ⁇ 4 A) connector.
  • SMA SubMini a ture Ver s i on A, 3 ⁇ 4 A
  • the package structure 40 is used for encapsulating and fixing the power supply output end and the signal input end of the sounding rod 20, the plurality of sets of sensors 30, the pre-processing circuit module 50, the power supply and signal cable 60, and fixing the signal to the output end of the sound head, and supplying power and signals
  • the power supply input and signal output of the cable 60 are exposed outside of the package structure 40, as shown in FIG.
  • the package structure 40 encloses and fixes the power supply output end and the signal input end of the sounding rod 20, the plurality of sets of sensors 30, the pre-processing circuit module 50, the power supply and signal cable 60, and the cone-shaped head 1 Within the cylindrical space of diameter.
  • the package structure 40 should allow the entire probe, of course, in addition to the acoustic head, to be resistant to corrosion, water and friction. Still taking the specific implementation as described above as an example, the steps of assembling and using the probe are as follows: Step 1: attach the strip-shaped piezoelectric film sensor group 30 to the side of the sounding rod 20; Step 2, the sound rod 20 and the cone The voice head 10 is connected;
  • Step 3 connecting the strip-shaped piezoelectric film sensor group 30, the power supply and signal cable 60 and the pre-processing circuit 50 by coaxial lines;
  • Step 4 Put the connected probe into the mold, and expose only the power supply input terminal and the signal output end of the cone-shaped head 1 and the power supply and signal cable 6.
  • the glue used should be corrosion-resistant, waterproof, and hard. And anti-friction.
  • the assembled probe is installed in a bedrock 150 to 200 meters underground and potted with non-expanded cement, where the cone-shaped head must be directly coupled to the bedrock.
  • the piezoelectric film sensor used in the embodiment is used as a ground acoustic wave detecting element. Since the piezoelectric film has high sensitivity and a large dynamic range, the frequency response range covers infrasound waves, audible waves, and ultrasonic waves. , so that the probe can completely capture the intensity, frequency and frequency of the ground acoustic information, and is suitable for monitoring the large earthquake incubation process and imminent earthquake prediction work;
  • the probe of the present embodiment backs up the captured geoacoustic signals from the sensor, the processing of the pre-processing circuit and the output thereof, thereby improving the reliability of the probe and making the probe suitable for 150 meters underground.
  • the ground acoustic signal is monitored stably for a long time at 200 meters.
  • This embodiment provides a probe for seismic earthquake monitoring, similar to Embodiment 1, which includes a sound head, a plurality of sets of sensors, a pre-processing circuit module, a power supply and signal cable, and a package structure.
  • Description of the microphone head, pre-processing circuit module, power supply and signal cable, and package structure Reference can be made to Example 1.
  • the plurality of sets of sensors are at least one set of infrasound sensors, at least one set of audible wave sensors, and at least one set of ultrasonic sensors. Therefore, the embodiment does not require a sound rod, but may The infrasonic wave sensor, the audible wave sensor and the ultrasonic sensor are directly fixed to the output end of the acoustic head.
  • the probe of this embodiment also has the advantages of the probe of the embodiment 1, and will not be described again.
  • the present embodiment provides a seismic earthquake monitoring device, which includes the probe for seismic seismic monitoring provided by the foregoing embodiments, and further includes a main control unit and a wireless transmitting unit.
  • the master unit is used to determine and select the optimal signal in the plurality of signal processing links, such as the signal with the best signal strength, and the selected signal is transmitted by the wireless transmitting unit, for example, to the ground sound monitoring center.
  • the main control unit adopts the SoC chip of the MCU+DSP
  • the wireless transmitting unit adopts the GPRS module or the TD-SCDMA module.
  • the main control unit and the wireless transmitting unit can be used as the ground base station, and the probe transmits the signal to the ground base station through the power supply and the signal cable.
  • the ground base station 70 includes the main control unit 701 and the wireless transmitting unit. 702.
  • the plurality of signal processing links in the pre-processing circuit module of the probe output signals in parallel and are transmitted to the main control unit via the power supply and the signal cable.
  • the pre-processing circuit module and the ground base station use the RS-485 standard for communication; of course, in other embodiments, the RS-422 standard can also be used for communication.
  • the present application provides a low-cost, high-reliability, large-scale dense layout for the existing large-scale earthquake monitoring field, which can monitor the sound information of underground ground sounds for a long time.
  • the monitoring data can be used for the process of large earthquakes. Scientific research, as well as forecasting.

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Abstract

一种地震临震监测用探头，包括：用于与待测点直接耦合的传声头（10）；用于将地声信号转换为电信号的多组传感器（30）；用于对电信号依次进行信号滤波、放大以及模数转换的预处理电路模块（50）；用于传输预处理电路模块（50）的输出信号、并为预处理电路模块（50）提供电源的供电及信号电缆（60）；供电及信号电缆（60）的供电输出端和信号输入端、多组传感器（30）和预处理电路模块（50）通过封装结构（40）封装并固定于传声头（10）的输出端。由于传感器组的频率响应范围覆盖不同地声声波频段，使得探头可以捕获不同的地声信息的强度、频度和频率，适用于监测地震孕育过程与临震预测工作；同时，可将每组传感器组中的一个传感器作为另一个传感器的备份，从而可提高探头的可靠性。还提供了一种地震临震监测用装置。

Description

一种地震临震监测用探头及装置 技术领域
本申请涉及地震监测技术领域， 具体涉及一种地震临震监测用探头 和一种地震临震监测用装置。
背景技术
地球经过不断的运动和变化，使地壳某些脆弱地带逐渐积累了能量， 一旦积累的能量巨大， 将造成岩石突然发生破裂， 或者引发原有断层的 错动， 这就是地震。 我国是全球大陆地震灾害最严重的国家之一， 在约 占全球陆地面积 1 / 14的国土上，每年发生地震的次数却占全球陆地地震 次数的 1 / 3以上。加强地震灾害的对策研究，提高地震监测预测的技术水 平， 减轻地震灾害， 与国家的发展社会的稳定和人民生命财产的安全都 有着直接关系和重大意义。
出现大地震前， 在地壳中应力容易集中的地方， 如断层、 裂缝和空 洞等， 其局部的应力场分布为一种不稳定态。 当这种非稳态的应力场持 续积累能量时， 在一个临界点就会发生应力场的再分布， 这种应力场的 再分布过程或应变能的释放过程是以岩体的形变、 微观破裂、 裂缝产生 进而发展为岩体大规模断裂（发震） 为表现形式。 而其中释放出的能量 一部分以声波的形式释放出来， 在岩体大规模断裂（发震）之前的微观 破裂、 裂缝产生过程中， 辐射的声波即为震前地声。 因此检测地震断裂 带的地声信号己成为监测地壳活动的一种重要方法， 这方面的技术革新 必将对探讨地震孕育过程、 断层活动性、 大地震临震预测预报等方面有 着积极作用。
发明内容
根据本申请的第一个方面， 本申请提供一种地震临震监测用探头， 包括： 用于与待测点直接耦合以捕获地声信号的传声头； 用于将所述地 声信号转换为电信号的多组传感器， 每组传感器包括至少两个独立的传 感器， 所述多组传感器的频率响应范围覆盖不同地声声波频段； 用于对 所述电信号依次进行信号滤波、 放大以及模数转换的预处理电路模块； 用于传输所述预处理电路模块的输出信号、 并为所述预处理电路模块提 供电源的供电及信号电缆； 所述供电及信号电缆的供电输出端和信号输 入端、 所述多组传感器和所述预处理电路模块通过封装结构封装并固定 于所述传声头的输出端， 所述供电及信号电缆的供电输入端和信号输出 端伸出所述封装结构。
进一步地， 所述探头还包括用于将所述地声信号传递到所述多组传 感器的传声杆， 每组传感器包括至少两个独立的压电薄膜传感器， 每个 所述压电薄膜传感器贴于所述传声杆的表面。
优选地， 所述封装结构还用于封装所述传声杆； 所述传声杆的横截 面为多边形， 所述多边形的边的条数等于所有所述压电薄膜传感器的个 数。
优选地， 所述传声杆为实心刚性结构， 所述传声杆用于与所述传声 头连接的一端设有连接头； 所述传声头为实心刚性结构， 所述传声头用 于与所述传声杆连接的一端设有连接孔， 所述连接头与所述连接孔匹配 连接。
优选地， 所述传声头的输入端的直径小于其输出端的直径； 所述封 装结构将所述供电及信号电缆的供电输出端和信号输入端、 所述多组传 感器和所述预处理电路模块封装固定于与所述传声头的输出端等直径的 柱形空间内。
进一步地， 所述多组传感器包括至少一组次声波传感器、 至少一组 可听波传感器和至少一组超声波传感器。
进一步地， 所述预处理电路模块包括多条信号处理链路， 所述多条 信号处理链路彼此独立、 并列且相同， 用于并行地将所述电信号依次进 行信号滤波、 放大以及模数转换后输出； 所述信号处理链路的条数与所 述多组传感器的组数相同， 且一条信号处理链路对应连接一组传感器， 每组传感器将其包含的每个传感器所转换的电信号相加后输出到对应的 一条信号处理链路。
进一步地， 所述多组传感器中的每一组传感器为其它组传感器的备 份， 每组传感器中的一个传感器为该组传感器中其它传感器的备份； 所 述多条信号处理链路中的每一条信号处理链路为其它条信号处理链路的 备份。
根据本申请的第二个方面， 本申请提供一种地震临震监测用装置， 包括： 如上所述的地震临震监测用探头、 用于从所述预处理电路模块中 选取处理后的信号的主控单元， 和用于传输选取出的信号的无线发射单 元。
进一步地， 所述主控单元从所述预处理电路模块中选取出信号最强 的输出信号。
本申请的有益效果是： 由于传感器组的频率响应范围覆盖不同地声 声波频段， 使得探头可以捕获不同的地声信息的强度、 频度和频率， 适 用于监测地震孕育过程与临震预测工作； 同时每组传感器组中有至少两 个传感器， 可以将其中一个传感器作为另一个的备份， 从而可提高探头 的可靠性。
附图说明
图 1是本申请一种实施例的地震临震监测用探头的结构示意图； 图 2是图 1所示探头的一个剖面的示意图；
图 3是本申请一种实施例中探头的传声头的结构示意图；
图 4是本申请一种实施例中探头的传声杆的结构示意图；
图 5是本申请一种实施例中探头的传感器组与预处理电路模块相连 接的示意图；
图 6是本申请一种实施例中探头的预处理电路模块连接地面基站的 结构示意图。
具体实施方式
本申请实施例提供了一种地震临震监测用探头， 其包括传声头、 多 组传感器、 预处理电路模块、 供电及信号电缆、 以及封装结构。 传声头 用于与待测点例如基岩等直接进行耦合以捕获地声信号。 多组传感器用 于将传声头捕获的地声信号转换为电信号， 每组传感器包括至少两个独 立的传感器， 这多组传感器的频率响应范围覆盖不同地声声波频段。 预 处理电路模块用于对电信号依次进行信号滤波、放大及模数转换等处理。 供电及信号电缆具有供电和信号传输两功能， 即其用于传输预处理电路 模块的输出信号， 还用于为预处理电路模块提供电源。 封装结构用于将 多组传感器、 预处理电路模块和供电及信号电缆的供电输出端和信号输 入端封装并固定于传声头的输出端， 而供电及信号电缆的供电输入端和 信号输出端露在封装结构外。 这里供电及信号电缆的供电输出端和信号 输入端是指该供电及信号电缆连接预处理电路模块的一端， 显然， 供电 及信号电缆的供电输入端和信号输出端是指背离预处理电路模块的一 端。
下面通过具体实施方式结合附图对本发明作进一步详细说明。
实施例 1 :
如图 1和图 2所示，本实施例的地震临震监测用探头包括传声头 10、 多组传感器 30、 预处理电路模块 50、 供电及信号电缆 60以及封装结构 40,其中多组传感器 30为多组带状压电薄膜传感器， 为便于固定带状压 电薄膜传感器， 探头还包括传声杆 20。
传声头 10 用于与基岩直接耦合， 并将地声信号传递至多组传感器 30。 一种实现中， 可设置传声头的输入端的直径小于其输出端的直径， 其中输入端是指传声头首先与基岩相接触的一端， 输出端是与输入端相 对的一端， 例如传声头可以是尖形或锥形， 可以是类似子弹头形状。 又 一种实现中， 传声头为实心刚性结构。 具体实现时， 为能够放置于地底 而不受损且可更好地捕获地声信号， 传声头可以为耐腐蚀的金属材料制 成。
传声杆 20用于固定带状压电薄膜传感器组 30, 并将地声信号由传 声头 10传递到带状压电薄膜传感器组 30, 每组带状压电薄膜传感器包 括至少两个独立的压电薄膜传感器， 每个压电薄膜传感器贴于传声杆的 表面。 一种实现中， 传声杆的横截面为多边形， 多边形的边的条数等于 所有带状压电薄膜传感器的个数。 又一种实现中， 传声杆为实心刚性结 构， 传声杆用于与传声头连接的一端设有连接头， 而传声头用于与传声 杆连接的一端设有连接孔， 连接头与连接孔匹配连接。
例如， 如图 3和图 4所示， 在一种具体实现中， 锥形传声头 10和传 声杆 20所用材质均为实心不锈钢，其中，锥形传声头的底面（即输出端） 为半径 5 cm、高 15 cm的圆，该底面的圆心处有直径 3cm的螺纹连接孔 101, 而传声杆 20长 30cm, 横截面为边长 3cm的正六边形， 其与传声头链接 的端部有直径 3cm的螺纹连接头 201; 锥形传声头 10与传声杆 20由螺 纹连接孔 101和螺纹连接头 201机械连接。
在本实施例中， 多组传感器为多组压电薄膜传感器， 用于将接收的 地声信号转换为电信号。 仍以前述所举具体实现为例， 此时为三组压电 薄膜传感器， 每组两个传感器， 即有六个独立的压电薄膜传感器， 举例 中其可为聚偏氟乙烯 （PVDF)压电薄膜， 封装形式为金属带状封装， 长 20cm, 宽 2cm, 用胶粘于传声杆的六个侧面， 其灵敏度应优于 -180dB-Vxl04/Pa, 频率响应范围为大于 10"3Hz至小于 105Hz, 工作温度 范围大于 -50°C至小于 100°C。
预处理电路模块 50用于对传送来的电信号进行信号滤波、放大， 并 将模拟量转化为数字量后输出。 具体地， 预处理电路模块包括多条并列 的信号处理链路， 每条信号处理链路彼此独立且相同， 信号处理链路的 条数与多组传感器的组数相同， 且一条信号处理链路对应连接一组传感 器， 由于每组传感器包括至少两个传感器， 因此， 每组传感器中每个传 感器输出的信号加和后的结果为该组传感器的输出， 将该输出输送至预 处理电路模块中相应的信号处理链路。 一种实现中， 每条信号处理链路 所用的滤波及放大器的带宽为 DC-lMHz, 即 0Ηζ~1ΜΗζ ,模数转换器采 用 ΣΔ模数转换器。
仍以前述所举具体实现为例， 如图 5 所示， 此时多组传感器组 30 包括六条带状压电薄膜传感器 3011、 3012、 3021、 3022、 3031、 3032 , 以两条为一对组成三对带状压电薄膜传感器对，即传感器 3011和传感器 3012组成一对 301、 传感器 3021和传感器 3022组成一对 302、 传感器 3031和传感器 3032组成一对 303 ,每对带状压电薄膜传感器对将其中每 个带状压电薄膜传感器的电信号加和后输出至预处理电路模块中相应的 信号处理链路中，而预处理电路模块 50包括三条信号处理链路 501、 502、 503 , 每条链路包括依次相连的滤波及放大器 5011、 5012、 5013和模数 转换器 5021、 5022、 5023。 三条链路并行地输出处理后的信号。
实施例中， 每组传感器与其它组传感器互为备份， 且每组传感器中 的一个传感器与该组传感器中的其它传感器也互为备份， 此外， 预处理 电路模块中每条信号处理链路与其它条信号处理链路互为备份。 仍以前 述所举具体实现为例， 在三组带状压电薄膜传感器中， 每对带状压电薄 膜传感器相互为另两对的备份， 每对带状压电薄膜传感器中的每个带状 压电薄膜传感器相互为另一个的备份， 而三条信号处理链路中的每条信 号处理链路相互为另两条的备份。
具体实施时，预处理电路模块可装于金属屏蔽盒内，其输入 /输出接 口以 SMA ( SubMini a ture Ver s i on A , ¾ A )接头留出。
封装结构 40用于将传声杆 20、多组传感器 30、预处理电路模块 50、 供电及信号电缆 60 的供电输出端和信号输入端封装并固定于传声头的 输出端，而供电及信号电缆 60的供电输入端和信号输出端露在封装结构 40外， 如图 1所示。 一种实现中， 封装结构 40将传声杆 20、 多组传感 器 30、 预处理电路模块 50、 供电及信号电缆 60的供电输出端和信号输 入端封装并固定于与锥形传声头 1 等直径的柱形空间内。 封装结构 40 应使得整个探头， 当然， 除了传声头外， 能够耐腐蚀、 防水和抗摩擦。 仍以前述所举具体实现为例， 探头的组装与使用步骤如下： 步骤 1 , 将带状压电薄膜传感器组 30贴于传声杆 20的侧面； 步骤 2 , 将传声杆 20与锥形传声头 10连接；
步骤 3 ,将带状压电薄膜传感器组 30、供电及信号电缆 60与预处理 电路 50分别用同轴线相连接；
步骤 4 , 将连接完成的探头放入模具， 仅露出锥形传声头 1及供电 及信号电缆 6的供电输入端和信号输出端， 灌胶封装， 所用胶质应耐腐 蚀、 防水、 硬度大且抗摩擦。
最后， 将组装好的探头安装于地下 150米至 200米处基岩中， 由非 膨胀水泥灌封， 其中锥形传声头必须与基岩直接耦合。
可见， 本实施例的探头具有如下优点：
( 1 )由于地声信息包含地震孕育过程中或临震前地下基岩断面及其 周围小破碎及微断裂所产生的高频超声波， 也包括临震前基岩宏观破裂 及地壳蠕变过程中所产生的低频可听波和次声波， 因此， 本实施例使用 的压电薄膜传感器作为地声声波检测元件， 由于压电薄膜灵敏度高、 动 态范围大， 频率响应范围覆盖次声波、 可听波、 超声波， 使得探头可以 完整的捕获地声信息的强度、 频度和频率， 并适于监测大地震孕育过程 与临震预测工作；
( 2 )震前地声监测工作的一个难点在于不易选取适合的深水井作为 地声观测井， 而本实施例的探头易于制造， 耐腐蚀、 防水、 抗摩擦， 其 安装方式与现有钻探技术相兼容， 安装成本低， 适于大规模地、 密集地 布设地声监测点；
( 3 )震前地声监测工作的另一个难点在于难以长期连续监测，其要 求仪器或设备有非常好的可靠性， 然而， 由于地下环境复杂， 因此对传 感器、 处理电路、 传输过程的可靠性有着苛刻的要求， 对此， 本实施例 的探头从传感器、 预处理电路的处理及其输出三个层次对捕获的地声信 号备份， 提高了探头的可靠性， 使探头适于在地下 150米至 200米处长 时间地、 稳定地对地声信号进行监测。
实施例 2 :
本实施例提供一种地震临震监测用探头， 与实施例 1类似， 其包括 传声头、 多组传感器、 预处理电路模块、 供电及信号电缆以及封装结构。 其中， 传声头、 预处理电路模块、 供电及信号电缆以及封装结构的描述 可参考实施例 1。 本实施例的不同之处在于， 此时多组传感器为至少一 组次声波传感器、 至少一组可听波传感器和至少一组超声波传感器， 因 此， 本实施例不需要传声杆， 而是可以将次声波传感器、 可听波传感器 和超声波传感器直接固定于传声头的输出端。
类似地， 本实施例的探头也具有实施例 1的探头所具有的优点， 在 此不作重述。
实施例 3 :
本实施例提供了一种地震临震监测用装置， 该装置包括前述实施例 提供的地震临震监测用探头， 还包括主控单元和无线发射单元。 主控单 元用于判决并选取多条信号处理链路中的最优信号， 例如信号强度最好 的信号， 并由无线发射单元将选取出的信号传输出去， 例如传输到地声 监控中心。 一种实现中主控单元采用 MCU+DSP的 SoC芯片， 无线发射单 元采用 GPRS模块或 TD- SCDMA模块。
一种具体实施时， 可将主控单元和无线发射单元作为地面基站， 探 头通过供电及信号电缆将信号传输到地面基站， 如图 6所示， 地面基站 70包括主控单元 701和无线发射单元 702 , 此时， 探头的预处理电路模 块中的多条信号处理链路并行输出信号并经供电及信号电缆传输到主控 单元。 为了具有更好的抗干扰性和更远的传输距离， 预处理电路模块和 地面基站之间采用 RS-485 标准进行通信； 当然， 其他实施例中也可以 采用 RS-422标准进行通信。
综上， 本申请为现有大地震监测领域提供一种低成本、 高可靠性、 可大规模密集布局， 可长时间监测地下地声变化信息的监测系统， 监测 数据可用于大地震孕育过程的科学研究， 以及预测预报。
以上所述仅为本申请的较佳实施例， 只是用于帮助理解本申请并不 用以限制本申请。 对于本领域的一般技术人员， 依据本申请的思想， 可 以对上述具体实施方式进行变化。

Claims

权 利 要 求
1. 一种地震临震监测用探头， 其特征在于， 包括：
用于与待测点直接耦合以捕获地声信号的传声头；
用于将所述地声信号转换为电信号的多组传感器， 每组传感器包括 至少两个独立的传感器， 所述多组传感器的频率响应范围覆盖不同地声 声波频段；
用于对所述电信号依次进行信号滤波、 放大以及模数转换的预处理 电路模块；
用于传输所述预处理电路模块的输出信号、 并为所述预处理电路模 块提供电源的供电及信号电缆；
所述供电及信号电缆的供电输出端和信号输入端、 所述多组传感器 和所述预处理电路模块通过封装结构封装并固定于所述传声头的输出 端，所述供电及信号电缆的供电输入端和信号输出端伸出所述封装结构。
2. 如权利要求 1所述的地震临震监测用探头，其特征在于，还包括 用于将所述地声信号传递到所述多组传感器的传声杆， 每组传感器包括 至少两个独立的压电薄膜传感器， 每个所述压电薄膜传感器贴于所述传 声杆的表面。
3. 如权利要求 2所述的地震临震监测用探头，其特征在于，所述封 装结构还用于封装所述传声杆； 所述传声杆的横截面为多边形， 所述多 边形的边的条数等于所有所述压电薄膜传感器的个数。
4. 如权利要求 1 所述的地震临震监测用探头， 其特征在于， 所述 传声杆为实心刚性结构， 所述传声杆用于与所述传声头连接的一端设有 连接头； 所述传声头为实心刚性结构， 所述传声头用于与所述传声杆连 接的一端设有连接孔， 所述连接头与所述连接孔匹配连接。
5. 如权利要求 1 所述的地震临震监测用探头， 其特征在于， 所述 传声头的输入端的直径小于其输出端的直径； 所述封装结构将所述供电 及信号电缆的供电输出端和信号输入端、 所述多组传感器和所述预处理 电路模块封装固定于与所述传声头的输出端等直径的柱形空间内。
6. 如权利要求 1 所述的地震临震监测用探头， 其特征在于， 所述 多组传感器包括至少一组次声波传感器、 至少一组可听波传感器和至少 一组超声波传感器。
7. 如权利要求 1-6 任一项所述的地震临震监测用探头， 其特征在 于， 所述预处理电路模块包括多条信号处理链路， 所述多条信号处理链 路彼此独立、并列且相同，用于并行地将所述电信号依次进行信号滤波、 放大以及模数转换后输出； 所述信号处理链路的条数与所述多组传感器 的组数相同， 且一条信号处理链路对应连接一组传感器， 每组传感器将 其包含的每个传感器所转换的电信号相加后输出到对应的一条信号处理 链路。
8. 如权利要求 7所述的地震临震监测用探头， 其特征在于， 所述多组传感器中的每一组传感器为其它组传感器的备份， 每组传 感器中的一个传感器为该组传感器中其它传感器的备份；
所述多条信号处理链路中的每一条信号处理链路为其它条信号处理 链路的备份。
9. 一种地震临震监测用装置， 其特征在于， 包括： 如权利要求 1 -8 任一项所述的地震临震监测用探头、 用于从所述预处理电路模块中选取 处理后的信号的主控单元， 和用于传输选取出的信号的无线发射单元。
1 0. 如权利要求 9所述的地震临震监测用装置， 其特征在于， 所述 主控单元从所述预处理电路模块中选取出信号最强的输出信号。
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CN114137603A (zh) * 2021-10-14 2022-03-04 珠海市泰德企业有限公司 一种井下地震观测交叉冗余电路
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