WO2014169805A1 - 扬声器模组 - Google Patents

扬声器模组 Download PDF

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Publication number
WO2014169805A1
WO2014169805A1 PCT/CN2014/075376 CN2014075376W WO2014169805A1 WO 2014169805 A1 WO2014169805 A1 WO 2014169805A1 CN 2014075376 W CN2014075376 W CN 2014075376W WO 2014169805 A1 WO2014169805 A1 WO 2014169805A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
wall
speaker module
speaker
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/075376
Other languages
English (en)
French (fr)
Inventor
刘一韬
戴志干
苗青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Inc
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to KR1020157032542A priority Critical patent/KR101819733B1/ko
Priority to US14/781,101 priority patent/US9681215B2/en
Publication of WO2014169805A1 publication Critical patent/WO2014169805A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2823—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
    • H04R1/2826—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
    • H04R1/2842—Enclosures comprising vibrating or resonating arrangements of the bandpass type for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2884—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure
    • H04R1/2888—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2892—Mountings or supports for transducers
    • H04R1/2896—Mountings or supports for transducers for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer

Definitions

  • the present invention relates to the field of electroacoustics, and in particular to a speaker module. Background technique
  • the speaker module of the prior art generally includes a peripheral housing and a speaker unit housed in the peripheral housing, and a rear acoustic cavity is formed between the speaker unit and the peripheral housing; the speaker unit includes a diaphragm that vibrates to generate sound.
  • the front side space of the diaphragm communicates with the sound hole of the speaker module to radiate sound to the outside, and the space on the back side of the diaphragm communicates with the rear sound chamber. Since the sounds generated by the front side and the back side of the diaphragm are 180 degrees out of phase, The front side and the back side of the diaphragm are spaced apart, wherein the rear sound chamber is a sealed structure.
  • the low frequency effect is better when the rear cavity of the speaker module is larger.
  • the Helmholtz resonator has obvious effects, which affects the acoustic performance of the product. Therefore, it is necessary to improve the speaker module of this structure to avoid the above drawbacks. Summary of the invention
  • the present invention provides a speaker module which can attenuate the effect of the Helmholtz resonator resonator in the rear sound cavity and improve the acoustic performance of the product.
  • the present invention provides a speaker module, comprising a peripheral housing and a speaker unit housed in the peripheral housing, wherein the peripheral housing and the speaker unit enclose a rear acoustic cavity, wherein The peripheral casing in the rear acoustic cavity is provided with a retaining wall, the retaining wall dividing the rear acoustic cavity into at least two partial cavities, and a slit is formed between the retaining walls or the retaining wall, The sound of the speaker unit communicates through the slit with an adjacent cavity in the rear acoustic cavity.
  • a preferred solution is to form at least two first blocking walls arranged side by side in the peripheral housing, the slits are formed between the two first blocking walls, and the two first blocking walls and the outer peripheral shell There is a certain gap between the sidewalls of the body, and the gaps are located on opposite sides.
  • the peripheral housing includes a second blocking wall, and the second blocking wall is provided with a slit that communicates with the cavity on both sides of the second blocking wall.
  • the peripheral housing includes a separate first housing and a second housing, the second housing fixes the speaker unit, and the rear acoustic chamber is located at the speaker unit.
  • the second housing is an elongated structure, and the second housing is provided with the first blocking wall and/or the second blocking wall.
  • the width and position of the slit are adjustable.
  • the first barrier wall and the number of the slits formed by the first barrier wall are two groups; the number of the second barrier walls is two, and the second The number of slits provided on the retaining wall is at least two.
  • a preferred solution is that the heights of the sidewalls of the first barrier wall, the second barrier wall and the second housing are the same, the first barrier wall, the second barrier wall and the first housing A connection pad is disposed between the inner surfaces of the speaker unit, and the thickness of the connection pad is the same as the height of the side wall of the first casing.
  • connection pad is a gas adsorbent material structure.
  • the gas adsorbent is a carbon fiber nonwoven fabric.
  • the present invention is provided with a retaining wall for dividing the rear acoustic cavity into a plurality of cavities in the rear acoustic cavity of the speaker module, and connecting adjacent sides between the retaining walls or the retaining wall.
  • This structure can increase the acoustic resistance in the rear acoustic cavity, weaken the influence of the Helmholtz resonator resonator, and improve the acoustic performance of the product.
  • FIG. 1 is a perspective exploded structural view of a speaker module of the present invention
  • FIG. 2 is a schematic cross-sectional view of a speaker module of the present invention. detailed description
  • the speaker module includes a peripheral housing and is received in the peripheral housing.
  • the speaker unit 2 is illustrated.
  • the peripheral housing includes a first housing 1 and a second housing 3 to facilitate assembly of the speaker module.
  • the second housing 3 fixes the speaker unit 2, the speaker unit 2 and the second unit.
  • the position of the side of the casing 3 forms the rear acoustic cavity 4 of the speaker module, and the rear acoustic cavity 4 has a sealed structure.
  • the speaker module is a front sounding structure
  • the second housing 3 is provided with a sound hole 30 on one side of the diaphragm of the speaker unit 2, as shown in FIG. 2, and the rear sound chamber 4 is located away from the sound hole.
  • the rear acoustic cavity 4 is divided into a plurality of cavities by a plurality of retaining walls, and adjacent cavities are connected by slits.
  • the second housing 3 is provided with adjacent first blocking walls 31 arranged side by side, and the spacing between the two first blocking walls 31 is narrow to form a slit 310, and the two first blocking walls 310 and the second housing There is a certain gap between the sidewalls of the third barrier wall 310, and the gaps between the two first barrier walls 310 are in opposite positions, and the cavities on both sides of the two first barrier walls 31 are communicated through the slit 310.
  • the sound generated by the speaker unit 2 passes through the gap of the first barrier wall 31 near the side of the speaker unit 2, then passes through the slit 310, and finally passes through the gap of the first barrier 31 away from the side of the speaker unit 2 Upon arrival, the sound chamber 4 is remote from the cavity of the speaker unit 2 side.
  • the structure of the first barrier wall 31 is disposed in the rear acoustic cavity 4, and the rear acoustic cavity 4 is divided into a plurality of cavities, and the plurality of cavities communicate with each other through the slit between the first barrier walls 31 to increase the acoustic resistance. Therefore, the influence of the Helmholtz resonator caused by the excessive sound volume of the rear sound chamber 4 is prevented, and the acoustic performance of the product is improved.
  • the second housing 3 of the present embodiment has an elongated structure, and the speaker unit 2 is disposed at an intermediate position. To fit the elongated rear sound chamber 4 formed by the elongated second housing 3, the embodiment includes side by side.
  • the two sets of first barrier walls 31 and their slits 310 are provided, and a plurality of such structures are arranged to divide the elongated rear sound chamber 4 into more cavities, preventing the Helmholtz resonator resonator. Produced to improve the acoustic performance of the product.
  • the slit is not limited to such a structure disposed between adjacent barrier walls, and may be formed in other forms of structure, for example, may be provided on the barrier wall.
  • a second blocking wall 32 is defined in the rear sound chamber 4 of the speaker module, and the second soundproofing chamber is divided into a plurality of cavities. Both ends of the second blocking wall 32 can be combined with the second housing 3.
  • the side walls are connected to each other, and a slit 320 that communicates with the cavity on both sides of the second barrier wall 32 is disposed on the second barrier wall 32.
  • the slit 320 can also increase the acoustic resistance in the rear acoustic cavity 4, reduce the generation of standing waves, and improve the acoustic performance of the product.
  • the number of the second retaining walls 32 in the embodiment is also two, so as to better adjust the sound in the elongated rear acoustic chamber 4 of the embodiment to improve the acoustic performance of the product.
  • the rear acoustic cavity 4 is sealed, and adjacent cavities can only communicate through the slits. Therefore, the first barrier wall 31 and the second barrier wall 32 can abut against the inner surface of the first housing 1 facing the speaker unit 2
  • the respective cavities are separated by the retaining walls so that adjacent cavities can only be connected through the slits.
  • a retaining wall is also disposed at a position corresponding to the first retaining wall 31 and the second retaining wall 32 on the inner side of the first casing 1, and is abutted with the first retaining wall 31 and the second retaining wall 32 to form a separate cavity. .
  • the heights of the sidewalls of the first barrier wall 31, the second barrier wall 32 and the second housing 3 are the same, and the structure of the manufacturing process is easy to form, and the first housing 1 and the second housing 3 pass.
  • the ultrasonic welding is fixedly combined. Since the side wall of the first housing 1 also has a certain height, the first blocking wall 31 and the second blocking wall 32 and the first housing 1 face the inner surface of the speaker unit 2 There is a certain distance between them.
  • a connection pad 10 is disposed between the inner surface of the first casing 1 and the first barrier wall 31 and the second barrier wall 32 in order to enable communication between the respective cavities through only the slits. Preferably, the connection is provided.
  • the thickness of the gasket 10 is the same as the height of the side wall of the first casing 1, as shown in FIG. 1 and FIG. 2, wherein the joint gasket 10 may be a foam or a gas adsorbing material, such as a carbon fiber nonwoven fabric. If the gas adsorbing material is used, the equivalent volume of the rear acoustic cavity 4 is further expanded under the condition that the internal space is fully utilized, and the low-frequency sound effect of the product is improved.
  • the width, position and number of the slits are adjustable, and can be adjusted according to the specific shape of the sound cavity behind the speaker module.

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  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

一种扬声器模组，包括外围壳体和收容固定于所述外围壳体内的扬声器单体（2），所述外围壳体和扬声器单体（2）之间围成后声腔（4），其中，所述后声腔（4）内的所述外围壳体上设有挡壁，所述挡壁将所述后声腔（4）分成至少两部分腔体，所述挡壁之间或所述挡壁上形成狭缝，所述扬声器单体（2）的声音穿过所述狭缝与后声腔（4）中的相邻腔体连通。这种结构可以增大后声腔内的声阻，削弱了赫姆霍兹共鸣器的影响，提高了产品的声学性能。

Description

说 明
扬声器模組
技术领域
本发明涉及电声领域， 具体涉及一种扬声器模组。 背景技术
现有技术中的扬声器模组通常包括外围壳体和收容固定于所述外围壳体内 的扬声器单体， 扬声器单体和外围壳体之间形成后声腔； 扬声器单体包括振动 产生声音的振膜， 通常振膜前侧空间与扬声器模组的声孔连通将声音辐射到外 界， 而振膜后侧的空间与后声腔连通， 由于振膜前侧与后侧产生的声音相位相 差 180度， 因此， 振膜前侧和后侧是间隔设置的， 其中后声腔为密封的结构。
通常扬声器模组的后声腔体积较大时低频效果较好， 但是， 后腔体积较大 而且扬声器单体后腔出声孔较小时， 赫姆霍兹共鸣器效果明显， 影响产品的声 学性能。 因此， 有必要对这种结构的扬声器模组进行改进， 以避免上述缺陷。 发明内容
为了解决上述技术问题， 本发明提供一种扬声器模组， 可以削弱后声腔中 赫姆霍兹共鸣器共鸣器效果影响， 提高产品的声学性能。
为了实现上述目的， 本发明提供一种扬声器模组， 包括外围壳体和收容固 定于所述外围壳体内的扬声器单体， 所述外围壳体和扬声器单体之间围成后声 腔， 其中， 所述后声腔内的所述外围壳体上设有挡壁， 所述挡壁将所述后声腔 分成至少两部分腔体， 所述挡壁之间或所述挡壁上形成狭缝， 所述扬声器单体 的声音穿过所述狭缝与后声腔中的相邻腔体连通。
此外，优选的方案是，所述外围壳体内形成至少两个并排设置的第一挡壁， 两第一挡壁之间形成所述狭缝， 两个所述第一挡壁与所述外围壳体侧壁之间均 具有一定间隙， 所述间隙位于相反的两侧。
此外， 优选的方案是， 所述外围壳体包括第二挡壁， 所述第二挡壁上设有 连通所述第二挡壁两侧腔体的狭缝。 说 明 此外， 优选的方案是， 所述外围壳体包括独立的第一壳体和第二壳体， 所 述第二壳体固定所述扬声器单体， 所述后声腔位于所述扬声器单体的侧面； 所 述第二壳体为狭长型结构， 所述第二壳体上设有所述第一挡壁和 /或所述第二挡 壁。
此外， 优选的方案是， 所述狭缝的宽度和位置可调。
此外， 优选的方案是， 所述第一挡壁和由所述第一挡壁形成的所述狭缝的 数量为两组； 所述第二挡壁的数量为两个， 并且所述第二挡壁上设置的狭缝的 数量至少为两个。
此外， 优选的方案是， 所述第一挡壁、 第二挡壁和所述第二壳体的侧壁的 高度一致， 所述第一挡壁、 第二挡壁和所述第一壳体正对扬声器单体的内表面 之间设置有连接垫片， 所述连接垫片的厚度与所述第一壳体侧壁的高度相同。
此外， 优选的方案是， 所述连接垫片为气体吸附材料结构。
此外， 优选的方案是， 所述气体吸附材料为碳纤维无纺布。
采用上述技术方案后， 与传统结构相比， 本发明在扬声器模组的后声腔内 设置有将后声腔分隔为若干腔体的挡壁， 挡壁之间或挡壁上设有连通相邻两侧 腔体的狭缝， 这种结构可以增大后声腔内的声阻， 削弱了赫姆霍兹共鸣器共鸣 器的影响， 提高了产品的声学性能。 附图说明
通过下面结合附图对本发明进行描述， 本发明的上述特征和技术优点将会 变得更加清楚和容易理解。
图 1 是本发明扬声器模组的立体分解结构示意图；
图 2是本发明扬声器模组的剖面结构示意图。 具体实施方式
下面结合附图和具体实施例对本发明做进一步详细的描述。 如图 1和图 2所示， 扬声器模组包括外围壳体和收容于所述外围壳体内的 说 明 扬声器单体 2，外围壳体包括第一壳体 1和第二壳体 3以便于扬声器模组的组装， 本实施例第二壳体 3固定扬声器单体 2， 扬声器单体 2与第二壳体 3侧面的位置 形成扬声器模组的后声腔 4， 后声腔 4为密封的结构。 本实施例扬声器模组为正 面出声的结构， 第二壳体 3正对扬声器单体 2振膜的一侧设有出声孔 30，如图 2 所示， 后声腔 4位于远离出声孔 30的一侧。 本实施例中， 后声腔 4被若干挡壁 分割为多个腔体， 相邻的腔体之间通过狭缝连接。
其中， 第二壳体 3上设有并排设置的相邻的第一挡壁 31 , 两第一挡壁 31之 间的间距很窄形成狭缝 310， 两第一挡壁 310与第二壳体 3的侧壁之间具有一定 间隙， 且两第一挡壁 310的间隙位于相反的位置， 两第一挡壁 31 两侧的腔体通 过狭缝 310连通。扬声器单体 2产生的声音穿过靠近扬声器单体 2一侧的第一挡 壁 31 的间隙， 然后穿过狭缝 310， 最后穿过远离扬声器单体 2—侧的第一挡壁 31 的间隙到达后声腔 4远离扬声器单体 2—侧的腔体内。 这种在后声腔 4内设 置第一挡壁 31 的结构， 将后声腔 4分隔为多个腔体， 多个腔体之间通过第一挡 壁 31之间的狭缝连通以增大声阻， 从而避免了由于后声腔 4体积过大单体出声 孔过小造成的赫姆霍兹共鸣器的影响， 提高了产品的声学性能。 此外， 本实施 例第二壳体 3为狭长型结构， 扬声器单体 2设置于中间的位置， 为了配合这种 狭长型第二壳体 3形成的狭长型的后声腔 4， 本实施例包括并排设置的两组第一 挡壁 31及其狭缝 310， 设置多组这样的结构可以将这种狭长型的后声腔 4分隔 成更多的腔体， 防止了赫姆霍兹共鸣器共鸣器的产生，提高了产品的声学性能。
此外， 狭缝不限于这种设置于相邻挡壁之间的结构， 也可以以其他形式的 结构出现， 例如， 可以设置于挡壁上。 如图 1和图 2所示， 扬声器模组后声腔 4 内还设置有将后声腔分隔为若干腔体的第二挡壁 32, 第二挡壁 32的两端均可与 第二壳体 3的侧壁相接，在第二挡壁 32上设有连通第二挡壁 32两侧腔体的狭缝 320。 狭缝 320同样可以增大后声腔 4内的声阻， 減少驻波的产生， 提高产品的 声学性能。 此外， 本实施例第二挡壁 32的数量也为两个， 以更好的调整本实施 例这种狭长型后声腔 4内的声音， 提高产品的声学性能。
需要说明的是后声腔 4是密封的， 相邻的腔体之间仅可通过狭缝连通。 因 此，第一挡壁 31和第二挡壁 32可以抵接于第一壳体 1正对扬声器单体 2的内表 说 明 面， 通过挡壁将各个腔体分开， 使相邻的腔体仅能通过狭缝连接。 或者， 在第 一壳体 1 内侧与第一挡壁 31和第二挡壁 32对应的位置也设置挡壁，并与第一挡 壁 31和第二挡壁 32对接， 以形成分开的腔体。 本实施例中， 第一挡壁 31、 第 二挡壁 32和第二壳体 3侧壁的高度一致， 这种结构制作工艺筒单易于成型， 第 一壳体 1 与第二壳体 3通过超声波焊接的方式固定结合，由于第一壳体 1 的侧壁 也具有一定的高度， 因此， 第一挡壁 31、 第二挡壁 32与第一壳体 1正对扬声器 单体 2的内表面之间具有一定的距离。 为了使各个腔体之间能够仅通过狭缝连 通， 本实施例在第一壳体 1 内表面与第一挡壁 31、 第二挡壁 32之间设置有连接 垫片 10， 优选的， 连接垫片 10的厚度与第一壳体 1侧壁的高度一致， 如图 1和 图 2所示， 其中， 连接垫片 10可以为泡棉， 也可以为气体吸附材料， 如碳纤维 无纺布等， 若采用气体吸附材料则在充分利用内部空间的情况下进一步拓展了 后声腔 4的等效体积， 提高了产品的低频声效。
此外， 狭缝的宽度、 位置和数量等均可调， 可以根据扬声器模组后声腔的 具体形状进行调整。 在本发明的上述教导下， 本领域技术人员可以在上述实施例的基础上进行 其他的改进和变形， 而这些改进和变形， 都落在本发明的保护范围内， 本领域 技术人员应该明白， 上述的具体描述只是更好的解释本发明的目的， 本发明的 保护范围由权利要求及其等同物限定。

Claims

1. 一种扬声器模组， 包括外围壳体和收容固定于所述外围壳体内的扬声器 单体， 所述外围壳体和扬声器单体之间围成后声腔， 其特征在于， 所述后声腔 内的所述外围壳体上设有挡壁， 所述挡壁将所述后声腔分成至少两部分腔体， 所述挡壁之间或所述挡壁上形成狭缝， 所述扬声器单体的声音穿过所述狭缝与 后声腔中的相邻腔体连通。
2. 根据权利要求 1所述的扬声器模组， 其特征在于， 所述外围壳体内形成 至少两个并排设置的第一挡壁， 两第一挡壁之间形成所述狭缝， 两个所述第一 挡壁与所述外围壳体侧壁之间均具有一定间隙， 所述间隙位于相反的两侧。
3. 根据权利要求 1所述的扬声器模组， 其特征在于， 所述外围壳体包括第 二挡壁， 所述第二挡壁上设有连通所述第二挡壁两侧腔体的狭缝。
4. 根据权利要求 1至 3任一权利要求所述的扬声器模组， 其特征在于， 所 述外围壳体包括独立的第一壳体和第二壳体， 所述第二壳体固定所述扬声器单 体， 所述后声腔位于所述扬声器单体的侧面； 所述第二壳体为狭长型结构， 所 述第二壳体上设有所述第一挡壁和 /或所述第二挡壁。
5. 根据权利要求 4所述的扬声器模组， 其特征在于， 所述狭缝的宽度和位 置可调。
6. 根据权利要求 4所述的扬声器模组， 其特征在于， 所述第一挡壁和由所 述第一挡壁形成的所述狭缝的数量为两组； 所述第二挡壁的数量为两个， 并且 所述第二挡壁上设置的狭缝的数量至少为两个。
7. 根据权利要求 6所述的扬声器模组， 其特征在于， 所述第一挡壁、 第二 挡壁和所述第二壳体的侧壁的高度一致， 所述第一挡壁、 第二挡壁和所述第一 壳体正对扬声器单体的内表面之间设置有连接垫片， 所述连接垫片的厚度与所 述第一壳体侧壁的高度相同。
8. 根据权利要求 7所述的扬声器模组， 其特征在于， 所述连接垫片为气体 吸附材料结构。
9. 根据权利要求 8所述的扬声器模组， 其特征在于， 所述气体吸附材料为 碳纤维无纺布。
PCT/CN2014/075376 2013-04-16 2014-04-15 扬声器模组 Ceased WO2014169805A1 (zh)

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