WO2014126785A3 - Water soluble film and uv-curable film hybrid mask for wafer dicing using laser scribing and plasma etch - Google Patents

Water soluble film and uv-curable film hybrid mask for wafer dicing using laser scribing and plasma etch Download PDF

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Publication number
WO2014126785A3
WO2014126785A3 PCT/US2014/015171 US2014015171W WO2014126785A3 WO 2014126785 A3 WO2014126785 A3 WO 2014126785A3 US 2014015171 W US2014015171 W US 2014015171W WO 2014126785 A3 WO2014126785 A3 WO 2014126785A3
Authority
WO
WIPO (PCT)
Prior art keywords
hybrid mask
laser scribing
plasma etch
water soluble
curable
Prior art date
Application number
PCT/US2014/015171
Other languages
French (fr)
Other versions
WO2014126785A2 (en
Inventor
Wei-Sheng Lei
Mohammad K. CHOWDHURY
Todd Egan
Brad Eaton
Madhava Rao Yalamanchili
Ajay Kumar
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Publication of WO2014126785A2 publication Critical patent/WO2014126785A2/en
Publication of WO2014126785A3 publication Critical patent/WO2014126785A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

Methods of using a hybrid mask composed of a water soluble film layer and a UV-curable film layer for wafer dicing using laser scribing and plasma etch described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits includes forming a hybrid mask above the semiconductor wafer, the hybrid mask composed of a water-soluble layer formed on the integrated circuits and a UV-curable layer formed on the water-soluble layer. The hybrid mask is patterned with a laser scribing process to provide a patterned hybrid mask with gaps to expose regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is etched through the gaps in the patterned hybrid mask to singulate the integrated circuits.
PCT/US2014/015171 2013-02-13 2014-02-06 Water soluble film and uv-curable film hybrid mask for wafer dicing using laser scribing and plasma etch WO2014126785A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361764156P 2013-02-13 2013-02-13
US61/764,156 2013-02-13

Publications (2)

Publication Number Publication Date
WO2014126785A2 WO2014126785A2 (en) 2014-08-21
WO2014126785A3 true WO2014126785A3 (en) 2015-01-08

Family

ID=51354655

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2014/015171 WO2014126785A2 (en) 2013-02-13 2014-02-06 Water soluble film and uv-curable film hybrid mask for wafer dicing using laser scribing and plasma etch

Country Status (2)

Country Link
TW (1) TW201436019A (en)
WO (1) WO2014126785A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027675A (en) * 2005-06-17 2007-02-01 Seiko Epson Corp Semiconductor device, manufacturing method therefor, circuit substrate and electronic device
US20110018127A1 (en) * 2008-03-31 2011-01-27 Byoungchul Lee Multilayer UV-Curable Adhesive Film
US20110220268A1 (en) * 2008-11-25 2011-09-15 Nitto Denko Corporation Surface protection tape for dicing and method for peeling and removing surface protection tape for dicing
US20120322237A1 (en) * 2011-06-15 2012-12-20 Wei-Sheng Lei Laser and plasma etch wafer dicing using physically-removable mask
US20120322241A1 (en) * 2011-06-15 2012-12-20 Applied Materials, Inc. Multi-layer mask for substrate dicing by laser and plasma etch

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027675A (en) * 2005-06-17 2007-02-01 Seiko Epson Corp Semiconductor device, manufacturing method therefor, circuit substrate and electronic device
US20110018127A1 (en) * 2008-03-31 2011-01-27 Byoungchul Lee Multilayer UV-Curable Adhesive Film
US20110220268A1 (en) * 2008-11-25 2011-09-15 Nitto Denko Corporation Surface protection tape for dicing and method for peeling and removing surface protection tape for dicing
US20120322237A1 (en) * 2011-06-15 2012-12-20 Wei-Sheng Lei Laser and plasma etch wafer dicing using physically-removable mask
US20120322241A1 (en) * 2011-06-15 2012-12-20 Applied Materials, Inc. Multi-layer mask for substrate dicing by laser and plasma etch

Also Published As

Publication number Publication date
WO2014126785A2 (en) 2014-08-21
TW201436019A (en) 2014-09-16

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