WO2014098565A1 - Dual range pressure sensor - Google Patents
Dual range pressure sensor Download PDFInfo
- Publication number
- WO2014098565A1 WO2014098565A1 PCT/MY2013/000268 MY2013000268W WO2014098565A1 WO 2014098565 A1 WO2014098565 A1 WO 2014098565A1 MY 2013000268 W MY2013000268 W MY 2013000268W WO 2014098565 A1 WO2014098565 A1 WO 2014098565A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pressure
- diaphragm
- substrate
- pressure sensor
- pressure measurement
- Prior art date
Links
- 230000009977 dual effect Effects 0.000 title description 2
- 230000035945 sensitivity Effects 0.000 claims abstract description 17
- 238000009530 blood pressure measurement Methods 0.000 claims abstract description 16
- 239000011540 sensing material Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000009413 insulation Methods 0.000 claims abstract description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 239000002120 nanofilm Substances 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims description 2
- 239000002073 nanorod Substances 0.000 claims description 2
- 239000002070 nanowire Substances 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims 1
- 101100460147 Sarcophaga bullata NEMS gene Proteins 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000009360 aquaculture Methods 0.000 description 1
- 244000144974 aquaculture Species 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L15/00—Devices or apparatus for measuring two or more fluid pressure values simultaneously
Definitions
- the present invention relates to a pressure sensor having wide range of sensitivity.
- Figure 1 illustrates a) cross section view b) top view of the pressure sensor of the present invention.
- the present invention overcomes the aforementioned issue by introducing a pressure sensor design which is capable of sensing the change of stress level in at least two different external applied pressure range of high (>100 kPa) and low ( ⁇ 100 kPa) on the same pressure sensor with the identical mechanical deforming diaphragm structure.
- a basic configuration of the present invention is shown in Figure la, b where there exists a diaphragm structure (100c) as the mechanical deforming structure which would deform upon application on external pressure.
- the piezoresistor (lOOd) and the nanoresistive-based sensing material (lOOf) located on top of the diaphragm surface for measuring the changes in the stress level upon deformation of the diaphragm.
Abstract
The present invention relates to a pressure sensor which provides wide range of pressure measurement. The present invention comprising:a substrate (100a) having an insulation layer (100b) on top of the substrate (100a); a diaphragm structure (100c) suspended at the substrate (100a); a piezoresistor (100d) located at the edges of the diaphragm (100c) for detecting low sensitivity pressure measurement; a pressure chamber (100e) below the diaphragm structure (100c) houses reference air pressure in the form of vacuumas reference pressure for pressure measurement; characterized in that a nano-resistive-based sensing material (100f) located on top of the diaphragm (100c) surface for detecting high sensitive pressure measurement.
Description
Description
DUAL RANGE PRESSURE SENSOR
[ 1 ] FIELD OF INVENTION
[2] The present invention relates to a pressure sensor having wide range of sensitivity.
[3] BACKGROUND OF THE INVENTION
[4] MEMS/NEMS-based pressure sensor has advantages in terms of their higher sensitivity, fast response time, robustness, reliability and size. In view of that, various MEMS/NEMS-based pressure sensor has been developed and commonly deployed for applications in automotive, industrial, medical and consumer products at recent time. The most common type of MEMS/NEMS-based pressure sensor is the diaphragm-type in which the diaphragm in the form of a square or circle is suspended at it edges to form a mechanical structure which would deform upon detection or application of external pressure. The pressure sensors are generally designed to cater for a specific pressure range as the sensing depends upon the physical dimension of the mechanical deforming structure, which is the diaphragm itself, and the sensing materials as it would govern the sensing characteristics of the sensors such as sensitivity and resolution. This impedes the versatility of the sensors as it would not be able to serve wide range of applications. Under normal circumstances, multiple pressure sensors would need to be utilised together in order to sense external pressure of different range.
[5] It is evident that in most resistive-based MEMS/NEMS pressure sensor design, the pressure sensing capabilities are limited to only a single pressure range and sensitivity response to cater for a particular application hence limiting the versatility and capabilities of the sensors to be utilised for various applications at one instance. One of the example is in EP 0619477, which discloses that in a pressure sensor whose sensi- tiveelement is constituted by a deformable membrane (22) carrying a bridge of piezoresistive strain gauges suitable for measuring deformation of the membrane, a decoupling piece (34) is interposed between the membrane (22) and its support (28). The decoupling piece includes a deformable zone (38), and limited clearance (44) is left between the outer peripheral zone (36) of the decoupling piece (34) and the support (28) such that when pressure is applied during manufacture of the sensor to fix the membrane (22) to the decoupling piece (34), e.g. by gluing, the deformable zone (38) does not break.At present, the pressure sensing range for resistive-based MEMS/ NEMS pressure sensor is limited due to the following: 1. The effect of the pressure sensing is based on the piezoresistive effect which is bounded to a lower range of pressure sensing sensitivity (0.1 to 0.3mV/V/kPa). Smaller change of pressure cannot be measured. 2. The pressure sensing range is focused solely on the middle edge of the diaphragm limiting the range of pressure detection. 3. There is no on chip-referenced
pressure sensing measurement for accuracy verification and detection.
[6] SUMMARY OF THE INVENTION
[7] According to one aspect of the present invention, the present invention provides a pressure sensor (100) comprising:a substrate (100a) having an insulation layer (100b) on top of the substrate (100a); a diaphragm structure (100c) suspended at the substrate (100a); a piezoresistor (lOOd) located at the edges of the diaphragm (100c) for detecting low sensitivity pressure measurement; a pressure chamber (lOOe)below the diaphragm structure (100c) houses reference air pressure in the form of vacuumas reference pressure for pressure measurement; characterized in that a nanoresistive-based sensing material (lOOf) located on top of the diaphragm (100c) surface for detecting high sensitive pressure measurement.
[8] Above provision is advantageous as it overcomes the problems associated with
limited pressure range measurement due to the single low sensitivity sensing of the piezoresistor. This can be achieved by introducing another nanoresistive-based sensing material known to have high sensitivity towards pressure sensing. The nanoresistive- based sensing material would operate alongside CMOS-based piezoresistor on top of the diaphragm of the pressure sensor to ensure that both high and low sensitivity measurement of the pressure can be achieved. This in turn would enable a wider range of pressure sensing and allow operations of the pressure sensor in various types of applications; ranging from the less sensitivity stringent application of environmental pressure measurement to the higher pressure sensitivity medical applications for blood pressure measurement. In addition, both the pressure sensors can be operated in tandem for on chip accuracy measurement and verification for the purpose of calibration or error-detection and compensation.
[9] BRIEF DESCRIPTION OF THE DRAWINGS
[10] Figure 1 illustrates a) cross section view b) top view of the pressure sensor of the present invention.
[11] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[12] The present invention describes a pressure sensor with wide sensing range for usage in multi-applications environment requiring different specifications of pressure range such as automotive, healthcare, biomedical, aquaculture and environmental monitoring. The present invention comprising:a substrate (100a) having an insulation layer (100b) on top of the substrate (100a); a diaphragm structure (100c) suspended at the substrate (100a); a piezoresistor (lOOd) located at the edges of the diaphragm (100c) for detecting low sensitivity pressure measurement; a pressure chamber (lOOe)below the diaphragm structure (100c) houses reference air pressure in the form of vacuumas reference pressure for pressure measurement; characterized in that a nano-resistive-based sensing material (lOOf) located on top of the diaphragm (100c)
surface for detecting high sensitive pressure measurement.
[13] The present invention overcomes the aforementioned issue by introducing a pressure sensor design which is capable of sensing the change of stress level in at least two different external applied pressure range of high (>100 kPa) and low (<100 kPa) on the same pressure sensor with the identical mechanical deforming diaphragm structure. A basic configuration of the present invention is shown in Figure la, b where there exists a diaphragm structure (100c) as the mechanical deforming structure which would deform upon application on external pressure. The piezoresistor (lOOd) and the nanoresistive-based sensing material (lOOf) located on top of the diaphragm surface for measuring the changes in the stress level upon deformation of the diaphragm. The pressure chamber (lOOe) located below the diaphragm structure (100c) houses the reference air pressure in the form of vacuum. The present invention is able to measure wide pressure sensing range on a single planar diaphragm-based pressure sensor device during operation.
[14] The working principle of the proposed device is that upon application of a high
external applied pressure on top of the diaphragm, the diaphragm (100c) of the pressure sensor (100) would deform resulting in the change of stress level within the diaphragm (100c). A conducting or semi-conducting material which forms a set of piezoresistors (lOOd) sit at the edges of the diaphragm (100c) to gauge the change in the intensity of the stress level within the diaphragm (100c) at a lower sensitivity through the consequent variation in the electrical resistant of the piezoresistor (lOOd). Similarly, the nanoresistive-based material (lOOf); due to the nature of its small morphology and feature size; is highly responsive to stress variation hence providing a higher sensitivity detection of the pressure variation. The change of the resistance detected through the sensing material would be translated into an electrical output that corresponds to the measured value of the applied pressure.
[15] Further explaining, at high change of stress level due to the high applied external pressure (>100kPa), there won't be meaningful electrical output from the nanoresistive- basedsensing material(lOOf) as it would exceed the measurable range due to its high sensitivity. Hence, only the electrical output from the piezoresistor (lOOd) would be captured. Likewise, upon application of a low external applied pressure on top of the diaphragm (100c), only the nanoresistive-basedsensing material(lOOf) would be able to measure the low change in the stress level of the diaphragm structure (100c). This enables the present invention to cater for applications of pressure sensing in wide range of pressure environment.
[16] The nanoresistive-based sensing material (lOOf) can be made of, but not limited to materials such as carbon nanotubes, or nanowires, or nanorods, or nanoparticles or nanofilm, or the like resistors.
Although the invention has been described with reference to particular embodiment, it is to be understood that the embodiment is merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiment that other arrangements may be devised without departing from the scope of the present invention as defined by the appended claims.
Claims
[Claim 1] A pressure sensor (100) comprising:
a substrate (100a) having an insulation layer (100b) on top of the substrate (100a);
a diaphragm structure (100c) suspended at the substrate (100a);
apiezoresistor (lOOd) located at the edges of the diaphragm (100c) for detecting low sensitivity pressure measurement;
a pressure chamber (lOOe)below the diaphragm structure (100c) houses reference air pressure in the form of vacuumas reference pressure for pressure measurement;
characterized in that
a nano-resistive-based sensing material (lOOf) located on top of the diaphragm (100c) surface for detecting high sensitive pressure measurement.
[Claim 2] A pressure sensor as claimed in Claim 1, wherein the nano- resistive-based sensing material (lOOf) further comprising: carbon nanotubes, or nanowires, or nanorods, or nanoparticles, or nanofilm, or the like resistors.
[Claim 3] A pressure sensing system with wide sensing range, the resultant
change of displacement and stress on the diaphragm structure (100c) during application of
externalpressure on top of a diaphragm structure (100c) contributes to the
correspondingchange in the resistance,comprising:
apiezoresistor (lOOd) configured to detect measurable resistance change resulted frombig change in stress level due to the applied pressure of more than 100 kPa;
anano-resistive-based sensing material (lOOf) configured to detect measurable
resistancechange resulted fromsmall change in stress level due to the applied pressure
ofless than 100 kPa; and
apressure chamber (lOOe)configured to house reference air pressure in the form of vacuumas reference pressure for pressure measurement.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2012005559 | 2012-12-21 | ||
MYPI2012005559 | 2012-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014098565A1 true WO2014098565A1 (en) | 2014-06-26 |
Family
ID=50137975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/MY2013/000268 WO2014098565A1 (en) | 2012-12-21 | 2013-12-20 | Dual range pressure sensor |
Country Status (1)
Country | Link |
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WO (1) | WO2014098565A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1384612A2 (en) * | 2002-07-19 | 2004-01-28 | Matsushita Electric Works, Ltd. | Mechanical deformation amount sensor |
WO2007010570A1 (en) * | 2005-07-22 | 2007-01-25 | Stmicroelectronics S.R.L. | Integrated pressure sensor with double measuring scale and a high full-scale value |
-
2013
- 2013-12-20 WO PCT/MY2013/000268 patent/WO2014098565A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1384612A2 (en) * | 2002-07-19 | 2004-01-28 | Matsushita Electric Works, Ltd. | Mechanical deformation amount sensor |
WO2007010570A1 (en) * | 2005-07-22 | 2007-01-25 | Stmicroelectronics S.R.L. | Integrated pressure sensor with double measuring scale and a high full-scale value |
Non-Patent Citations (1)
Title |
---|
CARMEN K M FUNG ET AL: "Fabrication of CNT-based MEMS piezoresistive pressure sensors using DEP nanoassembly", 2005 5TH IEEE CONFERENCE ON NANOTECHNOLOGY, IEEE OPERATIONS CENTER, US, 11 July 2005 (2005-07-11), pages 353 - 356, XP010832093, ISBN: 978-0-7803-9199-4, DOI: 10.1109/NANO.2005.1500728 * |
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