WO2014098225A1 - ヒータ - Google Patents
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- WO2014098225A1 WO2014098225A1 PCT/JP2013/084270 JP2013084270W WO2014098225A1 WO 2014098225 A1 WO2014098225 A1 WO 2014098225A1 JP 2013084270 W JP2013084270 W JP 2013084270W WO 2014098225 A1 WO2014098225 A1 WO 2014098225A1
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- WIPO (PCT)
- Prior art keywords
- hole conductor
- ceramic structure
- heater
- conductor
- ceramic
- Prior art date
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- 239000004020 conductor Substances 0.000 claims abstract description 111
- 239000000919 ceramic Substances 0.000 claims abstract description 99
- 238000010438 heat treatment Methods 0.000 claims description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 239000007769 metal material Substances 0.000 description 10
- 238000005219 brazing Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052750 molybdenum Inorganic materials 0.000 description 6
- 239000011733 molybdenum Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052702 rhenium Inorganic materials 0.000 description 5
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0014—Devices wherein the heating current flows through particular resistances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/027—Heaters specially adapted for glow plug igniters
Definitions
- the present invention relates to a heater used in a hair iron, a water heater, an oxygen sensor, an air-fuel ratio sensor, a glow plug, a semiconductor manufacturing apparatus, or the like.
- Examples of the heater used for the hair iron and the like include a ceramic heater disclosed in Japanese Patent Application Laid-Open No. 11-273737 (hereinafter referred to as Patent Document 1).
- the ceramic heater disclosed in Patent Document 1 includes a ceramic base, a heater part provided inside the ceramic base, a lead part provided inside the ceramic base and connected to the heater part, and a ceramic base.
- the heater according to one aspect of the present invention includes a ceramic structure, a heating resistor embedded in the ceramic structure, a conductor line embedded in the ceramic structure and connected to the heating resistor, and the ceramic structure.
- a through hole conductor having one end connected to the conductor line and the other end led to the surface of the ceramic structure, and provided on the surface of the ceramic structure so as to cover the through hole conductor,
- the heater includes an electrode pad connected to the through-hole conductor, and the through-hole conductor has a protrusion protruding outward from the surface of the ceramic structure.
- FIG. 1 is a partially broken perspective view showing a heater 10 according to an embodiment of the present invention.
- FIG. 2 is a schematic diagram showing the heater 10 according to an embodiment of the present invention.
- the heater 10 according to an embodiment of the present invention includes a ceramic structure 1, a heating resistor 2, a conductor line 3, a through-hole conductor 4, and an electrode pad 5.
- the heater 10 is used in, for example, a hair iron, a water heating heater, an oxygen sensor, an air-fuel ratio sensor, a glow plug, or a semiconductor manufacturing apparatus.
- the ceramic structure 1 is a member for holding the heating resistor 2 and the conductor line 3 inside. By providing the heating resistor 2 and the conductor line 3 inside the ceramic structure 1, the environmental resistance of the heating resistor 2 and the conductor line 3 can be improved.
- the ceramic structure 1 is a rod-shaped member.
- the ceramic structure 1 is a columnar member.
- the ceramic structure 1 is composed of a plurality of ceramic layers. Specifically, a rod-shaped ceramic body is provided at the center, and a plurality of ceramic layers are laminated so as to surround the outer peripheral surface of the ceramic body.
- the heating resistor 2 and the conductor line 3 are provided between the plurality of ceramic layers.
- the ceramic structure 1 is made of a ceramic material such as alumina, silicon nitride, aluminum nitride, or silicon carbide.
- the ceramic structure 1 has, for example, an outer diameter of 1 to 30 mm and a length in the longitudinal direction of 5 to 200 mm.
- the heating resistor 2 is a member for generating heat.
- the heating resistor 2 is provided between the ceramic layers and embedded in the ceramic structure 1.
- the heating resistor 2 is provided along the outer peripheral surface of the ceramic structure 1.
- the heating resistor 2 is formed in a wide range by having a plurality of folded portions.
- the heating resistor 2 is made of a metal material.
- the heating resistor 2 is preferably made of a metal material that can be fired simultaneously with the ceramic structure 1.
- the width of the heating resistor 2 is, for example, 0.1 to 5 mm, and the thickness is 0.01 to 1 mm.
- the heat generated by the heating resistor 2 is conducted inside the ceramic structure 1 and is emitted from the surface of the ceramic structure 1 to the outside.
- the conductor line 3 is a member for electrically connecting the heating resistor 2 and a power source (not shown) outside the ceramic structure 1 together with the through-hole conductor 4 and the electrode pad 5.
- the conductor line 3 is embedded in the ceramic structure 1.
- the conductor line 3 is provided between the same ceramic layers as between the ceramic layers provided with the heating resistor 2.
- One end of the conductor line 3 is electrically connected to the end of the heating resistor 2.
- the other end of the conductor line 3 is connected to the through-hole conductor 4 in order to connect to an external power source.
- the conductor line 3 is preferably made of a metal material that can be fired simultaneously with the ceramic structure 1.
- tungsten, molybdenum, rhenium, or the like can be used as a metal material that can be fired simultaneously with the ceramic structure 1.
- the width of the conductor line 3 is, for example, 0.1 to 2 mm, and the thickness is, for example, 1 to 100 ⁇ m.
- the through-hole conductor 4 is a member for electrically connecting the conductor line 3 and the electrode pad 5.
- the through-hole conductor 4 is provided in the ceramic structure 1. One end of the through-hole conductor 4 is connected to the conductor line 3, and the other end is led to the surface of the ceramic structure 1. As shown in FIG. 3, the other end of the through-hole conductor 4 is electrically connected to the electrode pad 5 by being covered with the electrode pad 5.
- FIG. 3 is a partially enlarged view of the vicinity of the through-hole conductor 4.
- the through-hole conductor 4 is preferably made of a metal material that can be fired simultaneously with the ceramic structure 1. As a metal material that can be fired simultaneously with the ceramic structure 1, for example, tungsten, molybdenum, rhenium, or the like can be used.
- the through-hole conductor 4 has a protruding portion 41 at the other end.
- the protruding portion 41 protrudes outward from the surface of the ceramic structure 1. Specifically, it protrudes from the surface of the ceramic structure 1 in a dome shape. Thereby, the area which the through-hole conductor 4 and the electrode pad 5 contact can be increased. As a result, heat can be easily released from the through-hole conductor 4 to the outside. Therefore, even if the heat generated in the heating resistor 2 is transmitted to the through-hole conductor 4 via the conductor line 3, it is possible to reduce the heat from being transmitted to the through-hole conductor 4.
- the thermal stress generated between the through-hole conductor 4 and the ceramic structure 1 can be reduced.
- the risk of cracks occurring in the through-hole conductor 4 or the ceramic structure 1 can be reduced, so that the long-term reliability of the heater 10 can be improved.
- the through-hole conductor 4 is cylindrical.
- the outer diameter can be set to 0.1 to 1 mm.
- the total length including the protrusion 41 when the outer diameter is 0.1 mm can be set to about 0.1 to 1 mm, for example.
- the length of the protruding portion (protruding portion 41) of the through-hole conductor 4 can be set to about 0.003 mm to 0.1 mm, for example.
- the length of the protrusion 41 When the length of the protrusion 41 is longer than 0.003 mm, the contact area between the through-hole conductor 4 and the electrode pad 5 can be increased. Therefore, heat can be easily released from the through-hole conductor 4 to the outside. In addition, by making the length of the protruding portion 41 shorter than 0.1 mm, it is possible to reduce the possibility that the protruding portion is destroyed when an external force is applied to the protruding portion.
- the surface of the protrusion 41 is a curved surface in which the central portion of the protrusion 41 protrudes outward. Since the surface of the protrusion 41 is curved, the generation of noise in the protrusion 41 can be reduced. Specifically, when the surface of the protruding portion 41 has a sharply protruding portion, the energy of the current flowing between the through-hole conductor 4 and the electrode pad 5 is the protruding portion of the protruding portion 41. A spark or the like may occur due to concentration at the tip. As a result, noise may occur in the protruding portion 41. Generation
- production of noise can be reduced by making the surface of the protrusion part 41 into a curved surface shape. By reducing the generation of noise, it is possible to reduce the adverse effects of noise on the electronic components provided around the heater 10.
- the through-hole conductor 4 has a curved surface in which the connection surface with the conductor line 3 at one end protrudes downward (on the conductor line 3 side). Since the connection surface with the conductor line 3 is a curved surface, generation of noise on the connection surface can be reduced. Specifically, when the surface of the connection surface has a sharp protruding portion, the energy of the current flowing between the through-hole conductor 4 and the conductor line 3 is at the tip of the protruding portion of the connection surface. There is a case where sparks and the like occur due to concentration. As a result, noise may occur. Generation of noise can be reduced by making the connection surface curved. By reducing the generation of noise, it is possible to reduce the adverse effects of noise on the electronic components provided around the heater 10.
- the electrode pad 5 is a member for electrically connecting the through-hole conductor 4 and an external power source.
- the electrode pad 5 is provided on the surface of the ceramic structure 1.
- the electrode pad 5 tightly covers the protruding portion 41 of the through-hole conductor 4. Thereby, the electrode pad 5 is electrically connected to the through-hole conductor 4.
- a rod-shaped lead terminal 7 is joined to the electrode pad 5 so as to be drawn out to the side opposite to the side where the heating resistor 2 is provided.
- the lead terminal 7 is made of, for example, a metal material excellent in electrical conduction such as nickel.
- a brazing material 8 is used for joining the electrode pad 5 and the lead terminal 7. As the brazing material 8, for example, silver brazing is used.
- the brazing material 8 is provided from the region where the lead terminal 7 is provided in the electrode pad 5 to the region covering the through-hole conductor 4.
- the possibility that the through-hole conductor 4 is distorted is reduced by reducing the thermal stress generated between the through-hole conductor 4 and the ceramic structure 1. Therefore, the possibility of peeling between the electrode pad 5 and the through-hole conductor 4 is reduced. For this reason, peeling between the electrode pad 5 and the through-hole conductor 4 is caused and the electrode pad 5 is deformed, so that the possibility that stress is generated between the electrode pad 5 and the brazing material 8 is reduced. As a result, the risk of cracks in the brazing material 8 is reduced. Therefore, the possibility that the lead terminal 7 is peeled off is also reduced. As a result, the long-term reliability of the heater 10 can be improved.
- the plating layer 6 is provided on the upper surface of the electrode pad 5.
- a nickel plating layer can be used as the plating layer 6. By providing the nickel plating layer, the bondability between the electrode pad 5 and the lead terminal 7 can be improved.
- the protrusion 41 of the through-hole conductor 4 enters the electrode pad 5. Specifically, a part of the electrode pad 5 is recessed, and the protrusion 41 of the through-hole conductor 4 is located in this recess. When the protruding portion 41 enters the electrode pad 5, the electrode pad 5 is not easily displaced in the direction along the surface of the ceramic structure 1. As a result, it is possible to further reduce the possibility that the electrode pad 5 is peeled off.
- the electrode pad 5 is preferably made of a metal material that can be fired simultaneously with the ceramic structure 1.
- a metal material that can be fired simultaneously with the ceramic structure for example, tungsten, molybdenum, rhenium, or the like can be used.
- the width of the electrode pad 5 can be set to 0.5 to 15 mm. When the width is about 0.5 mm, the length can be set to 0.5 mm, for example. When the width is about 15 mm, the width can be set to about 20 mm.
- the present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention.
- the outer periphery of the protrusion 41 of the through-hole conductor 4 may expand as it protrudes.
- the electrode pad 5 enters the lower side of the projecting portion 41, the expanded portion of the projecting portion 41 is sandwiched between the electrode pads 5 from the vertical direction. As a result, the electrode pad 5 can be firmly fixed by the through-hole conductor 4.
- the protruding portion 41 may have a plurality of protruding portions protruding outward at a portion in contact with the electrode pad 5. Since the protruding portion 41 has a plurality of convex portions, a portion where current is concentrated can be divided into a plurality of portions. As a result, local concentration of current can be reduced. As a result, local heat generation in the through-hole conductor 4 can be reduced. As a result, the long-term reliability of the heater 10 can be improved.
- a plurality of convex portions are provided along the outer periphery of the through-hole conductor 4.
- the location where an electric current concentrates can be spread over a wide range.
- the heat generated in the convex portion can be dispersed over a wide range.
- the height of the convex portion is 0.001 to 0.07 mm.
- variety of a convex part in case height is 0.07 mm can be set to about 0.5 mm, for example.
- the outer peripheral side and the center part of the surface of the protrusion 41 are recessed.
- region located between an outer peripheral side and center part among the surfaces of the protrusion part 41 is a frame shape.
- the through-hole conductor 4 has a protruding portion 41 and a part of the surface of the through-hole conductor 4 is recessed inward from the surface of the ceramic structure 1. May be. Thereby, the area which the through-hole conductor 4 and the electrode pad 5 contact can be enlarged more. As a result, heat can be more easily released from the through-hole conductor 4 to the outside.
- sintering aids such as silicon dioxide, calcium oxide, magnesium oxide and zirconia are added to ceramic components such as alumina ceramics, silicon nitride ceramics, aluminum nitride ceramics, or silicon carbide ceramics.
- a ceramic slurry is obtained by adding an agent. This ceramic slurry is formed into a sheet to produce a ceramic green sheet. Or the said component is mixed and a plate-shaped or rod-shaped molded object is produced by press molding or extrusion molding.
- a through-hole conductor 4 is provided in order to transmit electric power from the outside to the heating resistor 2 through the lead terminal 7, the brazing material 8, and nickel plating.
- the through-hole conductor 4 is produced by making a hole in a ceramic green sheet and press-fitting a conductive paste therein. At this time, it is important to provide the conductive paste so that the end portion of the conductive paste is located outside the surface of the green sheet. This portion becomes the protruding portion 41 of the through-hole conductor 4 after firing.
- the conductive paste that forms the heating resistor 2 and the conductor line 3 is formed on one main surface of the ceramic green sheet or the molded body that forms the ceramic structure 1 using a method such as screen printing. Further, a conductive paste printing ink to be used as the electrode pad 5 is formed on the back surface by using a method such as screen printing.
- a material for the heating resistor 2, the conductor line 3, and the electrode pad 5 a material mainly composed of a refractory metal such as tungsten, molybdenum or rhenium which can be manufactured by simultaneous firing with the ceramic structure 1 is used.
- the conductive paste to be the through-hole conductor 4 can be prepared by appropriately mixing and kneading ceramic raw materials, a binder, an organic solvent and the like with these high melting point metals.
- the length of the conductive paste pattern that forms the heating resistor 2 the distance and interval of the folded pattern, and the line width of the pattern can be changed to Set the resistance to the desired value.
- the ceramic green sheet or molded body made of the same material is further laminated and adhered to the ceramic green sheet or molded body on which this pattern is formed using a laminating liquid, so that the heating resistor 2 and the conductor line 3 are formed inside.
- a rod-shaped or plate-shaped molded body that becomes the ceramic structure 1 having the above is obtained.
- the obtained molded body is fired at about 1500 ° C. to 1600 ° C. Furthermore, a nickel plating layer 6 is provided on the electrode pad 5 on the main surface of the ceramic structure 1 by electrolytic plating. Then, silver solder is used as the brazing material 8 to join the electrode pad 5 and the lead terminal 7 made of Ni. As described above, the heater 10 can be manufactured.
- the heater 10 of the example of the present invention was manufactured as follows.
- a ceramic green sheet having alumina as a main component and prepared so that silicon dioxide, calcium oxide, magnesium oxide and zirconia were within 10% by mass in total was produced.
- a conductive paste A portion to be the through-hole conductor 4 was produced by making a hole in the ceramic green sheet and filling the inside with a conductive paste. At this time, the conductive paste was provided so that the end of the conductive paste was positioned about 0.05 mm outward from the surface of the green sheet.
- a method for positioning the end portion of the conductive paste outside the surface of the green sheet in this way for example, a method of filling the hole with the conductive paste while applying pressure using a jig can be mentioned. .
- a conductive paste mainly composed of molybdenum and tungsten to be the heating resistor 2, the conductor line 3, and the electrode pad 5 was printed on each pattern by a screen printing method.
- a ceramic green sheet on which these are printed and a rod-shaped molded body produced by extrusion molding from the same material as this ceramic green sheet are coated with a laminated liquid in which ceramics of the same composition are dispersed and stacked to form a rod A laminate was obtained.
- the rod-like laminate thus obtained was fired in a reducing atmosphere (nitrogen atmosphere) at 1500 to 1600 ° C.
- a nickel plating layer having a thickness of 2 to 4 ⁇ m was provided on the electrode pad 5 on the main surface of the ceramic structure 1 by electrolytic plating. Thereafter, the lead terminal 7 was joined to the electrode pad 5. Silver solder was used for joining. Thus, the heater 10 of the sample 1 was produced.
- Sample 2 was produced in which a hole was formed in the ceramic structure and the conductive paste was positioned only inside the hole when the inside was filled with the conductive paste. Other conditions are the same as those of Sample 1.
- the temperature in the vicinity of the through-hole conductor 4 when the surface temperature of the heater reached 1200 ° C. was measured. Specifically, the temperature was measured by attaching a thermocouple having a diameter of 0.1 mm to a region of the electrode pad 5 located immediately above the through-hole conductor 4. As a result, the measurement result of the heater 10 of the sample 1 was 238 ° C., whereas the measurement result of the heater of the sample 2 was 270 ° C.
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- Ceramic Products (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
Abstract
Description
セラミック構造体1は、発熱抵抗体2および導体線路3を内部に保持するための部材である。セラミック構造体1の内部に発熱抵抗体2および導体線路3が設けられることによって、発熱抵抗体2および導体線路3の耐環境性を向上できる。セラミック構造体1は、棒状の部材である。セラミック構造体1は、円柱状の部材である。セラミック構造体1は、複数のセラミック層から成る。具体的には、中央に棒状のセラミック体が設けられており、このセラミック体の外周面を取り巻くように複数のセラミック層が積層されている。発熱抵抗体2および導体線路3は、これらの複数のセラミック層の間に設けられている。セラミック構造体1は、アルミナ、窒化珪素、窒化アルミニウムまたは炭化珪素等のセラミック材料から成る。セラミック構造体1は、例えば、外径が1~30mmであり、長手方向の長さが5~200mmである。
発熱抵抗体2は、熱を発するための部材である。発熱抵抗体2は、複数のセラミック層の間に設けられて、セラミック構造体1に埋設されている。発熱抵抗体2は、セラミック構造体1の外周面に沿って、設けられている。発熱抵抗体2は、複数の折り返し部を有することによって広範囲に形成されている。発熱抵抗体2は、金属材料から成る。発熱抵抗体2は、セラミック構造体1と同時に焼成することが可能な金属材料から成ることが好ましい。セラミック構造体1と同時に焼成することが可能な金属材料としては、例えば、タングステン、モリブデンまたはレニウム等を用いることができる。発熱抵抗体2の幅は例えば0.1~5mmであり、厚みは0.01~1mmである。発熱抵抗体2で発せられた熱は、セラミック構造体1の内部を伝導し、セラミック構造体1の表面から外部に発せられる。
導体線路3は、スルーホール導体4および電極パッド5等と共に、発熱抵抗体2とセラミック構造体1の外部の電源(図示せず)とを電気的に接続するための部材である。導体線路3は、セラミック構造体1に埋設されている。導体線路3は、発熱抵抗体2が設けられたセラミック層の間と同じセラミック層の間に設けられている。導体線路3は、一端が発熱抵抗体2の端部に電気的に接続されている。一方、導体線路3の他端は、外部の電源に接続するために、スルーホール導体4に接続されている。導体線路3は、セラミック構造体1と同時に焼成することが可能な金属材料から成ることが好ましい。セラミック構造体1と同時に焼成することが可能な金属材料としては、例えば、タングステン、モリブデンまたはレニウム等を用いることができる。導体線路3の幅は、例えば0.1~2mmであり、厚みは、例えば1~100μmである。
スルーホール導体4は、導体線路3と電極パッド5とを電気的に接続するための部材である。スルーホール導体4は、セラミック構造体1に設けられている。スルーホール導体4は、一端が導体線路3に接続されており、他端がセラミック構造体1の表面に導出されている。また、図3に示すように、スルーホール導体4の他端は、電極パッド5に覆われていることによって、電極パッド5に電気的に接続されている。なお、図3はスルーホール導体4付近の部分拡大図である。スルーホール導体4は、セラミック構造体1と同時に焼成することが可能な金属材料から成ることが好ましい。セラミック構造体1と同時に焼成することが可能な金属材料としては、例えば、タングステン、モリブデンまたはレニウム等を用いることができる。
電極パッド5は、スルーホール導体4と外部の電源とを電気的に接続するための部材である。電極パッド5は、セラミック構造体1の表面に設けられている。電極パッド5はスルーホール導体4の突出部41を密着して覆っている。これにより、電極パッド5がスルーホール導体4に電気的に接続されている。電極パッド5には、棒状のリード端子7が、発熱抵抗体2が設けられている側とは逆側に引き出されるように接合されている。リード端子7は、例えば、ニッケル等の電気伝導に優れる金属材料から成る。電極パッド5とリード端子7との接合には、例えば、ろう材8が用いられる。ろう材8としては、例えば、銀ろう等が用いられる。ろう材8は、電極パッド5のうちリード端子7が設けられている領域からスルーホール導体4を覆う領域にまで設けられている。本実施形態のヒータ10においては、スルーホール導体4とセラミック構造体1との間に生じる熱応力が低減されていることによって、スルーホール導体4が歪むおそれが低減されている。そのため、電極パッド5とスルーホール導体4との間に剥がれが生じるおそれが低減されている。このため、電極パッド5とスルーホール導体4との間に剥がれが生じて電極パッド5が変形することにより、電極パッド5とろう材8との間に応力が生じるおそれが低減されている。その結果、ろう材8にクラックが入るおそれが低減されている。そのため、リード端子7に剥がれが生じるおそれも低減されている。これらの結果、ヒータ10の長期信頼性を向上させることができる。
次に、本実施の形態のヒータ10の製造方法について説明する。
2:発熱抵抗体
3:導体線路
4:スルーホール導体
41:突出部
5:電極パッド
6:めっき層
7:リード端子
8:ろう材
10:ヒータ
Claims (7)
- セラミック構造体と、該セラミック構造体に埋設された発熱抵抗体と、前記セラミック構造体に埋設されて前記発熱抵抗体に接続された導体線路と、前記セラミック構造体に設けられ、一端が前記導体線路に接続され、他端が前記セラミック構造体の表面に導出されたスルーホール導体と、該スルーホール導体を覆うように前記セラミック構造体の表面に設けられ、前記スルーホール導体に接続された電極パッドとを備えたヒータであって、
前記スルーホール導体は、前記セラミック構造体の表面よりも外方に突出した突出部を有しているヒータ。 - 前記突出部の表面が曲面状である請求項1に記載のヒータ。
- 前記スルーホール導体の前記一端が、前記導体線路に入り込んでいる請求項1または請求項2に記載のヒータ。
- 前記スルーホール導体の前記一端の前記導体線路との接続面が曲面状である請求項3に記載のヒータ。
- 前記突出部は複数の凸部を有している請求項1乃至請求項4のいずれかに記載のヒータ。
- 前記スルーホール導体は円柱状である請求項1乃至請求項5のいずれかに記載のヒータ。
- 前記スルーホール導体の前記突出部の外周が突出するにしたがって広がっている請求項1乃至請求項6のいずれかに記載のヒータ。
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JPWO2019188380A1 (ja) * | 2018-03-30 | 2021-04-01 | 株式会社カネカ | ポリアミド酸およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法 |
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CN207869432U (zh) * | 2018-03-07 | 2018-09-14 | 东莞市国研电热材料有限公司 | 一种多温区陶瓷发热体 |
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