WO2014080567A1 - Light emitting module, lighting apparatus, and lighting equipment - Google Patents

Light emitting module, lighting apparatus, and lighting equipment Download PDF

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Publication number
WO2014080567A1
WO2014080567A1 PCT/JP2013/006180 JP2013006180W WO2014080567A1 WO 2014080567 A1 WO2014080567 A1 WO 2014080567A1 JP 2013006180 W JP2013006180 W JP 2013006180W WO 2014080567 A1 WO2014080567 A1 WO 2014080567A1
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Prior art keywords
light emitting
light
portion
emitting module
wiring
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PCT/JP2013/006180
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French (fr)
Japanese (ja)
Inventor
祐也 山本
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パナソニック株式会社
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Priority to JP2012254415A priority Critical patent/JP5914826B2/en
Priority to JP2012-254415 priority
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2014080567A1 publication Critical patent/WO2014080567A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/02Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1517Multilayer substrate
    • H01L2924/15192Resurf arrangement of the internal vias
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Abstract

This light emitting module is provided with a multilayer substrate which has: wiring sections, which are provided among a plurality of insulating layers, and each of which has a predetermined shape; through wiring, which penetrates the insulating layers, and which is electrically connected to the wiring sections; and conductor sections, each of which is electrically connected to the through wiring, and each of which is provided on the one surface side, each of said conductor sections having a predetermined shape. The light emitting module is also provided with a plurality of kinds of light emitting sections, which are provided on the one surface side, and which emit light by being supplied with power through the conductor sections. Each of the light emitting sections has at least one light emitting element, and among the plurality of kinds of light emitting sections, a first light emitting section having a largest number of the light emitting elements is electrically connected to a wiring section that is provided at a position further from the one surface than a wiring section and a conductor section, to which a second light emitting section is connected, said second light emitting section having a smaller number of the light emitting elements than the first light emitting section.

Description

Light emitting module, lighting device and lighting fixture

The present invention relates to a light emitting module, a lighting device, and a lighting fixture.

In recent years, light emitting modules capable of changing the color tone by using output ratios of a plurality of types of light emitting units having different emission colors have been used.

As this type of light emitting module, LED chips R1,..., G1,..., B1... And LED chips R1,. A light emitting unit 100 having a multilayer substrate 200 is known (for example, see Japanese Patent Publication No. 2003-168305). Hereinafter, Japanese Patent Publication No. 2003-168305 is referred to as Document 1.

The multilayer substrate 200 of the light emitting unit 100 includes a first substrate 210, a second substrate 220, and a third substrate 230 in order from the side on which the LED chips R1,..., G1,. And a fourth substrate 240.

In the light emitting unit 100, as shown in FIG. 28A, each of the red LED chips R1 to Rn has a cathode electrode and power supply terminals JR1 to JRn serving as mounting pads formed on the first substrate 210 fixed by soldering. ing. In the light emitting unit 100, the anode electrodes of the red LED chips R1 to Rn are connected to the power supply terminals DR1 to DRn serving as electrode pads formed on the first substrate 210 by bonding wires WR1 to WRn.

In the light emitting unit 100, all of the red LED chips R1 to Rn are connected in series to form a red LED chip array. The anode electrode of the red LED chip R1 at the terminal on the high potential side of the red LED chip row is connected to the electrode pad DR1 that becomes the high potential side power supply terminal. The electrode pad DR1 is connected to the red terminal (1R) formed on the first substrate 210 via the two vias 211 and 212 provided on the first substrate 210 and the circuit pattern 210R formed on the second substrate 220. 2R,..., 6R). Further, the cathode electrode of the red LED chip Rn at the lower end of the red LED chip row is connected to the mounting pad JRn serving as the low potential side power supply terminal. The mounting pad JRn is formed on the first substrate 210 through the through holes 201 and 202 provided in the first substrate 210 to the fourth substrate 240 and the circuit pattern 240C formed on the lower surface of the fourth substrate 240. It is connected to terminals (1C, 2C,..., 6C). The red LED chips R 1 to Rn between the red terminal and the common terminal are connected in series by vias 251 provided on the first substrate 210 and circuit patterns 252 provided on the second substrate 220.

In the light emitting unit 100, as shown in FIG. 28B, the green LED chips G1 to Gn are mounted on the cathode substrate of the green LED chips G1 to Gn and the first substrate 210 by the bonding wires WG1 to WG2n. Pads JG1 to JGn are connected. The light emitting unit 100 is red except that the high potential side circuit pattern 220G and the circuit pattern 253 are formed on the third substrate 230 in order to connect the anode terminal at the high potential side end of the green LED chip row and the green terminal. The configuration is the same as that of the LED chip.

Further, in the light emitting unit 100, as shown in FIG. 28C, the blue LED chips B1 to Bn are mounted on the cathode electrodes of the blue LED chips B1 to Bn and the first substrate 210 by the bonding wires WB1 to WB2n. Pads JB1 to JBn are connected. The light emitting unit 100 is red except that the high potential side circuit pattern 230B and the circuit pattern 254 are formed on the fourth substrate 240 to connect the anode electrode at the high potential side end of the blue LED chip row and the blue terminal. The configuration is the same as that of the LED chip.

The light emitting unit 100 can turn on each of the red, green, and blue LED chips for each emission color by using the multilayer substrate 200. The light emitting unit 100 can adjust the color tone of the mixed light by controlling each of the red, green, and blue LED chips R1,..., G1,.

Incidentally, in the configuration of the light emitting unit 100 that is the light emitting module of Document 1, it may be difficult to improve the light output even if the number of light emitting elements is simply increased.

Therefore, an object of the present invention is to provide a light emitting module, a lighting device, and a lighting fixture with higher light output.

The light emitting module of the present invention includes a multilayer substrate and two or more types of light emitting portions on one surface side of the multilayer substrate. The multilayer substrate has wiring portions (4a1, 4a2) having a predetermined shape provided between two or more insulating layers (1a, 1b, 1c). The multilayer substrate has through wirings (4b1, 4b2) that penetrate the insulating layers (1a, 1b, 1c) and are electrically connected to any of the wiring parts (4a1, 4a2). The multilayer substrate is electrically connected to one of the through wirings (4b1, 4b2) and has a conductor portion (4c1, 4c2, 4c3) having a predetermined shape provided on the one surface side. Each of the two or more types of light emitting parts emits light by feeding power through the pair of conductor parts (4c1, 4c2, 4c3). Each of the two or more light emitting units has at least one light emitting element. In the light emitting module, as the two or more types of light emitting units, a first light emitting unit having the largest number of the light emitting elements and a second light emitting unit having a smaller number of the light emitting elements than the first light emitting units are provided. . The first light-emitting portion includes the wiring portion (4a2, 4a2) to which the second light-emitting portion is connected and the wiring portion provided at a position farther from the one surface than the conductor portions (4c2, 4c3) ( 4a1, 4a1) are electrically connected. As a result, in the light emitting module of the present invention, the first light emitting part having the largest number of light emitting elements includes the wiring part (4a2, 4a2) having a predetermined shape to which the second light emitting part is connected and the conductor part (4c2) having a predetermined shape. , 4c3) are electrically connected to the wiring portions (4a1, 4a1) of a predetermined shape provided at a position farther from the one surface of the multilayer substrate, thereby connecting the wiring portions (4a1, 4a1) connected to the first light emitting portion. There is an effect that it is possible to suppress the light absorption in 4a1) and to further increase the light output.

In this light emitting module, the first light emitting unit preferably emits red light.

In this light emitting module, it is preferable that the second light emitting section has two or more kinds, and includes a green light emitting section that emits green light and a white light emitting section that emits white light.

In the light emitting module, the first light emitting unit includes a light emitting element that emits blue light and a phosphor that absorbs blue light emitted from the light emitting element and emits red light. Among the two or more types of the second light emitting units, the green light emitting unit includes a light emitting element that emits blue light and a phosphor that absorbs blue light emitted from the light emitting element and emits green light. . Of the two or more types of the second light emitting units, the white light emitting unit emits a light emitting element that emits blue light, a phosphor that absorbs blue light emitted from the light emitting element and emits red light, and the light emitting element. It is preferable to have a phosphor that absorbs blue light and emits green light.

In this light emitting module, the green light emitting portion and the white light emitting portion are electrically connected to the wiring portions (4a2, 4a2) provided between different layers of the two or more insulating layers (1a, 1b, 1c). It is preferable that

In this light emitting module, the green light emitting part and the white light emitting part are electrically connected to each other by the wiring parts (4a2, 4a2) provided between the same layers of the two or more insulating layers (1a, 1b, 1c). It is preferable to connect them.

In this light emitting module, the multi-layer substrate is a reflection film (1d) having a higher reflectivity than the conductor portions (4c1, 4c2, 4c3) for the light emitted from the light emitting portion, and the conductor portions (4c1, 4c2). 4c3), and the conductor portions (4c1, 4c2, 4c3) are connected to the external connection terminals (4e, 4f) connected to the outside and the connection portions (4d, 4d) connected to the light emitting portion. And has. The connection portions (4d, 4d) and the external connection terminals (4e, 4f) are preferably exposed from the reflective film (1d).

The illuminating device of the present invention includes the above-described light emitting module. Accordingly, in the lighting device of the present invention, the first light emitting unit having the largest number of light emitting elements includes the wiring portions (4a2, 4a2) having a predetermined shape to which the second light emitting portions are connected and the conductor portions (4c2) having a predetermined shape. , 4c3), it is possible to further increase the light output by electrically connecting to the wiring portions (4a1, 4a1) provided at positions farther from the one surface of the multilayer substrate. .

The lighting fixture of the present invention includes the above-described light emitting module and a fixture main body having the light emitting module. Thereby, in the lighting fixture of this invention, the 1st light emission part with the largest number of light emitting elements is the wiring part (4a2, 4a2) of a predetermined shape to which a 2nd light emission part is connected, and the conductor part (4c2) of a predetermined shape. , 4c3), it is possible to further increase the light output by electrically connecting to the wiring portions (4a1, 4a1) having a predetermined shape provided at a position farther from one surface of the multilayer substrate. effective.

Preferred embodiments of the invention are described in further detail. Other features and advantages of the present invention will be better understood with reference to the following detailed description and accompanying drawings.
FIG. 1 is a cross-sectional explanatory view showing the light emitting module of the first embodiment. FIG. 2 is an exploded explanatory view showing the light emitting module of the first embodiment. FIG. 3 is an explanatory perspective view showing the light emitting module of the first embodiment. FIG. 4 is a cross-sectional explanatory view of a light emitting module shown for comparison with the light emitting module of the first embodiment. FIG. 5 is a schematic front view showing the light emitting module of the second embodiment. FIG. 6 is a cross-sectional explanatory view showing the light emitting module of the second embodiment. FIG. 7 is a schematic front view showing the light emitting module of the third embodiment. FIG. 8 is a cross-sectional view taken along the line AB of FIG. FIG. 9 is a schematic front view showing the light emitting module of the fourth embodiment. FIG. 10 is a schematic cross-sectional view showing a main part of the light emitting module of the fourth embodiment. FIG. 11 is a schematic cross-sectional view showing another main part of the light emitting module of Embodiment 4. FIG. 12 is a side cross-sectional view illustrating the lighting apparatus according to the fifth embodiment. FIG. 13 is a cross-sectional view taken along the line AA in FIG. FIG. 14 is a schematic cross-sectional view showing a main part of the illumination device of the fifth embodiment. FIG. 15 is a perspective view illustrating the lighting apparatus according to the sixth embodiment. FIG. 16 is an exploded explanatory view showing the illumination device of the sixth embodiment. FIG. 17 is a cross-sectional explanatory diagram illustrating the illumination device of the sixth embodiment. FIG. 18 is a perspective explanatory view showing the illumination device of the seventh embodiment. FIG. 19 is an explanatory perspective view illustrating a main part of the lighting apparatus according to the seventh embodiment. FIG. 20 is a schematic cross-sectional view illustrating the lighting apparatus according to the seventh embodiment. FIG. 21 is a perspective view illustrating a main part of the lighting apparatus according to the eighth embodiment. FIG. 22 is a perspective view showing another main part of the illumination device of the eighth embodiment. FIG. 23 is a cross-sectional explanatory diagram illustrating the illumination device of the eighth embodiment. FIG. 24 is an exploded perspective view showing the lighting apparatus of the eighth embodiment. FIG. 25 is a cross-sectional explanatory diagram illustrating a lighting fixture including the lighting device according to the ninth embodiment. FIG. 26 is an explanatory perspective view illustrating the lighting apparatus of the ninth embodiment. FIG. 27 is an exploded perspective view showing the lighting apparatus of the ninth embodiment. FIG. 28 illustrates a conventional light emitting unit, FIG. 28A illustrates wiring related to a red LED chip in a multilayer substrate, FIG. 28B illustrates wiring related to a green LED chip in the multilayer substrate, and FIG. 28C illustrates wiring related to a blue light emitting LED chip in the multilayer substrate. It is explanatory drawing.

(Embodiment 1)
Hereinafter, the light emitting module 10 of the present embodiment will be described with reference to FIGS. 1 to 3. In the drawings, the same components are assigned the same numbers.

The light emitting module 10 of the present embodiment includes a multilayer substrate 1 and two or more types of light emitting units 2 as shown in FIG. In the light emitting module 10 of the present embodiment, the multilayer substrate 1 has three insulating layers, ie, a first insulating layer 1a, a second insulating layer 1b, and a third insulating layer 1c. The multilayer substrate 1 has a first wiring portion 4a1 provided between the first insulating layer 1a and the second insulating layer 1b as the wiring portion 4a having a predetermined shape provided between the insulating layers. Yes. The multilayer substrate 1 has a second wiring portion 4a2 provided between the second insulating layer 1b and the third insulating layer 1c as a wiring portion 4a having a predetermined shape provided between the insulating layers. The multilayer substrate 1 has a through wiring 4b that penetrates the insulating layer and is electrically connected to a wiring portion 4a having a predetermined shape. The multilayer substrate 1 has a first through wiring 4b1 that penetrates the second insulating layer 1b and the third insulating layer 1c as the through wiring 4b and is electrically connected to the first wiring portion 4a1. Further, the multilayer substrate 1 has a second through wiring 4b2 that penetrates the third insulating layer 1c and is electrically connected to the second wiring portion 4a2 as the through wiring 4b. The multilayer substrate 1 includes a first surface 1aa that is one surface and a second surface 1ab that is another surface opposite to the one surface. The multilayer substrate 1 has a first conductor portion 4c1 electrically connected to the first through wiring 4b1 as a conductor portion 4c having a predetermined shape provided on the first surface 1aa side of the multilayer substrate 1. The multilayer substrate 1 has a second conductor portion 4c2 electrically connected to the second through wiring 4b2 as a conductor portion 4c having a predetermined shape provided on the first surface 1aa side of the multilayer substrate 1. Furthermore, the multilayer substrate 1 is not connected to the through wiring, and has a third conductor portion 4c3 as a conductor portion 4c having a predetermined shape provided on the first surface 1aa of the multilayer substrate 1. Each of the two or more types of light emitting portions 2 of the light emitting module 10 emits light by power feeding through a pair of conductor portions 4c provided on the first surface 1aa side of the multilayer substrate 1.

Each of the two or more types of light emitting units 2 has at least one or more light emitting elements 3. The light emitting module 10 includes, as the light emitting unit 2, a first light emitting unit 2a having the largest number of light emitting elements 3 and a second light emitting unit 2b having a smaller number of light emitting elements 3 than the first light emitting units 2a. . In the light emitting module 10 of the present embodiment, the second light emitting unit 2b includes two types of green light emitting unit 2bg and white light emitting unit 2bw which will be described later. Therefore, the light emitting unit 2 includes a total of three types including the first light emitting unit 2a serving as the red light emitting unit 2ar and the two types of second light emitting units 2b. The first light emitting part 2a is connected to the second wiring part 4a2 and the second conductor part 4c2 to which the second light emitting part 2b which is the green light emitting part 2bg is connected, and the second light emitting part 2b which is the white light emitting part 2bw. The third conductor portion 4c3 is electrically connected to the first wiring portion 4a1 provided at a position farther from the first surface 1aa of the multilayer substrate 1 than the third conductor portion 4c3.

Thereby, the light emitting module 10 of the present embodiment can further increase the light output.

More specifically, the light emitting module 10 of the present embodiment includes two or more types of light emitting units 2 on the first surface 1aa of the rectangular flat multilayer substrate 1 as shown in FIG.

In FIG. 1, the light emitting unit 2 is illustrated separately for each different type of light emitting unit 2. The first light emitting unit 2 a of the light emitting module 10 of the present embodiment includes a light emitting element 3 that emits blue light, and a sealing material 5 that covers the light emitting element 3. Although not shown, the sealing material 5 of the first light emitting unit 2a is configured by dispersing 20 wt% of (Ca, Sr) AlSiN 3 : Eu 2+ in a silicone resin as a red phosphor. In the first light emitting unit 2a, when the light emitting element 3 emits blue light, the red phosphor absorbs blue light and emits red light. The first light emitting unit 2a functions as the red light emitting unit 2ar.

In the light emitting module 10 of the present embodiment, the second light emitting unit 2b includes a green light emitting unit 2bg that emits green light and a white light emitting unit 2bw that emits white light. The green light emitting unit 2bg includes a light emitting element 3 that emits blue light and a sealing material 5 that covers the light emitting element 3. The sealing material 5 of the green light emitting part 2bg is configured by dispersing 30 wt% of Y 3 Al 5 O 12 : Ce 3+ in a silicone resin as a green phosphor. The white light emitting unit 2 bw includes a light emitting element 3 that emits blue light and a sealing material 5 that covers the light emitting element 3. The sealing material 5 of the white light emitting unit 2bw is composed of a phosphor (Ca, Sr) AlSiN 3 : Eu 2+ and a green phosphor Y 3 Al 5 O 12 : Ce 3+ as phosphors in a 9: 1 ratio. The mixture is mixed at a ratio, and the mixture is dispersed by 8 wt% in the silicone resin.

That is, the first light emitting unit 2a includes a light emitting element 3 that emits blue light and a phosphor that absorbs blue light emitted from the light emitting element 3 and emits red light. Moreover, the green light emission part 2bg among the 2nd light emission parts 2b has the light emitting element 3 which emits blue light, and the fluorescent substance which absorbs the blue light which the light emitting element 3 emits, and emits green light. . Further, among the second light emitting units 2b, the white light emitting unit 2bw emits a light emitting element 3 that emits blue light, and a phosphor that emits red light by absorbing blue light emitted from the light emitting element 3, and the light emitting element 3. A phosphor that absorbs blue light and emits green light.

As shown in FIG. 3, in the light emitting module 10 of the present embodiment, all 40 light emitting units 2 are arranged in a virtual circular range on the first surface 1aa of the multilayer substrate 1. The light emitting unit 2 includes 18 red light emitting units 2ar as the first light emitting unit 2a. The light emitting unit 2 includes ten green light emitting units 2bg as the second light emitting units 2b. Further, the light emitting unit 2 includes twelve white light emitting units 2bw as the second light emitting unit 2b. In the light emitting module 10, the light emitting unit 2 is provided on the first surface 1 aa side of the multilayer substrate 1 so that the light emission colors of the light emitted from the adjacent light emitting units 2 are different. The light emitting module 10 can enhance the color mixing property of the light emitted from the plural types of light emitting units 2 by causing the adjacent light emitting units 2 to emit different emission colors. Each light emitting unit 2 includes one light emitting element 3. Therefore, in the light emitting module 10, the total number of the light emitting elements 3 of the red light emitting unit 2ar is the largest as compared with the total number of each of the green light emitting unit 2bg and the white light emitting unit 2bw.

As shown in FIG. 1, the light emitting module 10 of this embodiment includes a multilayer substrate 1 in which a first insulating layer 1a, a second insulating layer 1b, and a third insulating layer 1c are stacked as a plurality of insulating layers. . The multilayer substrate 1 can be formed using, for example, alumina, which is a ceramic material, as the material of the first insulating layer 1a, the second insulating layer 1b, and the third insulating layer 1c. The multilayer substrate 1 includes a first alumina layer as the first insulating layer 1a, a second alumina layer as the second insulating layer 1b, and a third alumina layer as the third insulating layer 1c in this order from the side away from the light emitting element 3. . The first alumina layer can have a thickness of 0.4 mm, for example. For example, the second alumina layer can have a thickness of 0.3 mm. The third alumina layer can have a thickness of 0.3 mm, for example.

In the light emitting module 10 of the present embodiment, the wiring 4 is provided on the multilayer substrate 1 so that power can be separately supplied to two or more types of light emitting units 2. The wiring 4 includes a wiring part 4a provided between the first insulating layer 1a and the second insulating layer 1b, and a wiring part 4a provided between the second insulating layer 1b and the third insulating layer 1c. Have. The wiring 4 passes through the second insulating layer 1b and the third insulating layer 1c and is electrically connected to the wiring portion 4a. The wiring 4 is electrically connected to the through wiring 4b and is on the first surface 1aa side of the multilayer substrate 1. And a conductor portion 4c provided on the surface.

The multilayer substrate 1 includes a first wiring part 4a1 electrically connected to the red light emitting part 2ar as the first light emitting part 2a between the first insulating layer 1a and the second insulating layer 1b. The multilayer substrate 1 is formed by electrically connecting the first wiring part 4a1 for the red light emitting part 2ar and the first conductor part 4c1 for the red light emitting part 2ar by the first through wiring 4b1 for the red light emitting part 2ar. Yes. The multilayer substrate 1 includes a second wiring part 4a2 electrically connected to the green light emitting part 2bg of the second light emitting part 2b between the second insulating layer 1b and the third insulating layer 1c. In the multilayer substrate 1, the second wiring part 4a2 for the green light emitting part 2bg and the second conductor part 4c2 for the green light emitting part 2bg are electrically connected by the second through wiring 4b2 for the green light emitting part 2bg. Yes. The multilayer substrate 1 has a third conductor for the white light emitting unit 2bw electrically connected to the white light emitting unit 2bw of the second light emitting units 2b on the surface of the third insulating layer 1c that becomes the first surface 1aa of the multilayer substrate 1. Part 4c3 is provided. In the multilayer substrate 1, the second wiring part 4a2 to which the green light emitting part 2bg is connected and the third conductor part 4c3 to which the white light emitting part 2bw is connected are provided at different positions in the thickness direction of the insulating layer. The green light emitting part 2bg and the white light emitting part 2bw can be electrically connected to the wiring part 4a provided between different layers of the second insulating layer 1b and the third insulating layer 1c.

In the multilayer substrate 1, for example, a wiring member 4 a made of W as a base material and laminated with Ni and Au can be used. The multilayer substrate 1 can use, for example, a substrate in which W is a base material and Ni and Au are laminated as the through wiring 4b. The multilayer substrate 1 can use, for example, a conductor portion 4c in which W is a base material and Ni and Au are laminated. In the multilayer substrate 1, the wiring part 4a, the through wiring 4b, and the conductor part 4c may be formed of the same material or different materials. In the multilayer substrate 1, for example, the thickness of each of the wiring part 4a and the conductor part 4c electrically connected to the first light emitting part 2a can be set to 10 μm to 20 μm. In the multilayer substrate 1, for example, the film thickness of the second wiring part 4a2 and the second conductor part 4c2 electrically connected to the green light emitting part 2bg in the second light emitting part 2b can be set to 10 μm to 20 μm. In the multilayer substrate 1, for example, the film thickness of the third conductor portion 4c3 electrically connected to the white light emitting portion 2bw in the second light emitting portion 2b can be set to 10 μm to 20 μm.

The light emitting module 10 of the present embodiment uses an LED bare chip as the light emitting element 3. The light emitting module 10 constitutes a COB (Chip On Board) type LED module in which an LED bare chip is directly mounted on the first surface 1aa side of the multilayer substrate 1.

Next, it will be described that the light emitting module 10 of the present embodiment can further increase the light output by using the light emitting module 40 for comparison shown in FIG.

The light emitting module 40 shown in FIG. 4 is different in that the light emitting module 40 of the present embodiment shown in FIG. 1 is configured using a multilayer substrate 41 in which the arrangement shapes of the wiring 4 and the wiring 44 are mainly different. The light emitting module 40 for comparison includes two or more types of light emitting units 2. The light emitting module 40 is configured such that power can be separately supplied to two or more types of light emitting units 2 by wiring 44. The light emitting module 40 is configured to be capable of dimming illumination light mixed with light from the light emitting unit 2 to a desired color tone by adjusting the output ratio of two or more types of light emitting units 2 having different emission colors. . In the light emitting module 40, the light emitting units 2 having different emission colors are alternately arranged in order to improve color mixing in two or more types of light emitting units 2 having different emission colors. In the light emitting module 40, on the surface 41aa of the multilayer substrate 1, a red light emitting unit 2ar that emits red light, a green light emitting unit 2bg that emits green light, a white light emitting unit 2bw that emits white light, and a red that emits red light. The light emitting units 2ar are arranged in order (see from the lower side to the upper side in FIG. 4). The light emitting module 40 uses a multi-layer substrate 41 that is made up of multiple layers of an insulating layer 41a, an insulating layer 41b, and an insulating layer 41c. In the multilayer substrate 41, wirings 44 are provided between the insulating layer 41a and the insulating layer 41b, between the insulating layer 41b and the insulating layer 41c, and on the surface side opposite to the insulating layer 41b of the insulating layer 41c. The light emitting module 10 uses the multilayer substrate 41 to prevent the wirings 44 that supply power for different types of light emitting units 2 from crossing on the same plane to cause a short circuit.

By the way, in the multilayer substrate 41, generally, the metal material used for the wiring 44 has a low reflectance and tends to absorb light as compared with the insulating materials of the insulating layer 41a, the insulating layer 41b, and the insulating layer 41c. When the wiring 44 constituting the multilayer substrate 41 includes Au having excellent conductivity, a conductor having a predetermined shape provided on the surface 41aa of the multilayer substrate 41 as compared with the reflectance of the ceramic material as the insulating material of the multilayer substrate 41 The reflectance of the portion 44c tends to be particularly low. In the light emitting module 40, when the light from the light emitting element 3 and the phosphor constituting the light emitting unit 2 is irradiated onto the wiring 44 of the multilayer substrate 41, the light from the light emitting element 3 and the phosphor is absorbed by the wiring 44 and the light flux Tend to decrease.

Further, in the light emitting module 40, as the number of the light emitting elements 3 increases, the total area of the wirings 44 electrically connected to the light emitting elements 3 tends to increase. In the light emitting module 40, when two or more types of light emitting units 2 are alternately arranged to improve color mixing, the surface area of the wiring 44 tends to be larger due to the handling of the wiring 44. In the light emitting module 40, when the wiring 44 of the first light emitting unit 2a having a larger total number of light emitting elements 3 than the wiring 44 of the second light emitting unit 2b is provided on the surface 41aa side of the multilayer substrate 41, the light emitting element 3 or It is considered that the light tends to be absorbed easily and the tendency of the light beam to decrease is remarkable. In particular, in the light emitting module 40, as shown by the broken lines in FIG. 4, the light emitted from the light emitting element 3 toward the multilayer substrate 41 constitutes the insulating layer 41a, the insulating layer 41b, and the insulating layer 41c. There is also a possibility that the probability that light is absorbed between the particles of the ceramic material and absorbed by the wiring 44 before being emitted to the outside increases. Examples of the ceramic material particles include alumina particles. In the light emitting module 40, light from the light emitting element 3 and the phosphor is guided between the insulating layer 41a and the insulating layer 41b including the wiring portion 44a having a predetermined shape and between the insulating layer 41b and the insulating layer 41c. There is also a case. In the light emitting module 40, there is a risk that the luminous flux rapidly decreases with multiple reflection due to light guiding from the light emitting element 3 or the phosphor. Furthermore, in the light emitting module 40, when the light emitting unit 2 includes the sealing material 5 having a phosphor, light isotropically emits from the phosphor, and thus the probability of being absorbed by the wiring 44 tends to increase. It is in.

In the light emitting module 10 of this embodiment, the wiring part 4a electrically connected to the first light emitting part 2a having the largest number of light emitting elements 3 is connected to the second light emitting part 2b having the smaller number of light emitting elements 3. It is provided at a position farther from the first surface 1aa than the wiring portion 4a. In addition, the wiring portion 4a that is electrically connected to the first light emitting portion 2a having the largest number of light emitting elements 3 is smaller than the conductor portion 4c that is connected to the second light emitting portion 2b having the smaller number of light emitting elements 3. It is provided at a position away from one surface 1aa. Therefore, in the light emitting module 10 of the present embodiment, as shown by the broken line in FIG. 1, the light from the light emitting element 3 and the phosphor is suppressed from being absorbed by the wiring portion 4a, the through wiring 4b, and the conductor portion 4c. It is considered that the light output can be further increased.

Hereinafter, each configuration of the light emitting module 10 of the present embodiment will be described.

The multilayer substrate 1 is mounted with a light emitting element 3 included in a plurality of types of light emitting units 2, and can supply power to the light emitting elements 3 of the light emitting unit 2 through wiring 4. The multilayer substrate 1 can be configured using two or more insulating layers. The wiring 4 has a wiring portion 4a having a predetermined shape provided between two or more insulating layers. For example, the wiring 4 can be provided with a first wiring portion 4a1 as a wiring portion 4a having a predetermined shape between the first insulating layer 1a and the second insulating layer 1b. Moreover, the wiring 4 can provide the 2nd wiring part 4a2 as the wiring part 4a of a predetermined shape between the layers of the 2nd insulating layer 1b and the 3rd insulating layer 1c. When the multilayer substrate 1 has three or more insulating layers, the wiring portion 4a having a predetermined shape is not necessarily provided between all the layers in the plurality of insulating layers. The wiring 4 has a through wiring 4b that penetrates the insulating layer and is electrically connected to the wiring portion 4a having a predetermined shape. For example, the wiring 4 penetrates the second insulating layer 1b and the third insulating layer 1c and is electrically connected to the first wiring portion 4a1 provided between the first insulating layer 1a and the second insulating layer 1b. One through wiring 4b1 can be provided. The wiring 4 is, for example, a second through wiring 4b2 that penetrates the third insulating layer 1c and is electrically connected to a second wiring portion 4a2 provided between the second insulating layer 1b and the third insulating layer 1c. Can have. The through wiring 4b only needs to be electrically connected to the wiring portion 4a, and does not necessarily have to continuously penetrate through the plurality of insulating layers. In addition, the wiring 4 is electrically connected to the through wiring 4 b and has a conductor portion 4 c having a predetermined shape provided on the first surface 1 aa side of the multilayer substrate 1.

As shown in FIGS. 1 and 2, the conductor portion 4 c includes an external connection terminal 4 e and an external connection terminal 4 f that are electrically connected to the outside, and a connection portion 4 d that is electrically connected to the light emitting element 3 of the light emitting portion 2. It has. In the wiring 4, for example, the wiring part 4a is electrically connected to the external connection terminal 4e and the external connection terminal 4f through the through wiring 4b. In the wiring 4, for example, the wiring part 4a is electrically connected to the connection part 4d through the through wiring 4b. The external connection terminal 4e and the external connection terminal 4f can be formed on the first surface 1aa of the multilayer substrate 1. The external connection terminal 4 e and the external connection terminal 4 f function as a power supply / reception unit for receiving power from an external power source and supplying power to the light emitting element 3. The external connection terminals 4e and the external connection terminals 4f are not necessarily limited to those provided on the first surface 1aa side of the multilayer substrate 1, but may be provided on the second surface 1ab side of the multilayer substrate 1. In the light emitting module 10 of the present embodiment, the light emitting element 3 emits light and emits desired light from the light emitting element 3 by supplying a direct current to the light emitting element 3 from the external connection terminal 4 e and the external connection terminal 4 f. The external connection terminal 4e is a common terminal that is commonly connected to different light emitting units 2. The external connection terminal 4f is an individual terminal provided for each of the different types of light emitting units 2. The external connection terminal 4f includes, for example, a connection terminal 4f1 for the red light emitting unit 2ar that is electrically connected to the red light emitting unit 2ar. The external connection terminal 4f includes a connection terminal 4f2 for the green light emitting unit 2bg that is electrically connected to the green light emitting unit 2bg. Furthermore, the external connection terminal 4f can be configured to include a connection terminal 4f3 for the white light emitting unit 2bw that is electrically connected to the white light emitting unit 2bw. The formation method of the wiring part 4a and the conductor part 4c is not specifically limited, A various thing can be used as a pattern formation system, such as a printing system or a plating process.

The multilayer substrate 1, a first insulating layer 1a, as the material of the second insulating layer 1b and the third insulating layer 1c, for example, can be used AlN, Al 2 O 3, BN, a ceramic material such as MgO. The multilayer substrate 1 is a mixture of Al 2 O 3 and CaO—Al 2 O 3 —SiO 2 —B 2 O 3 as materials for the first insulating layer 1a, the second insulating layer 1b, and the third insulating layer 1c. Ceramic materials can also be used. For the wiring 4, W, Ni, Pd, Al, Cu, Fe, Au, or an alloy containing these can be used as the material of the wiring 4. Further, the wiring 4 may be formed of a single layer or a plurality of layers. The multilayer substrate 1 is not limited to one using a ceramic material, and may be a resin substrate such as a glass epoxy resin or a polycarbonate resin. Further, the multilayer substrate 1 is not limited to a rigid substrate, and may be a flexible substrate. The multilayer substrate 1 may be a ceramic substrate, a heat conductive resin substrate, or a glass substrate.

The multilayer substrate 1 can be formed in an appropriate outer shape according to the use of the light emitting module 10 or the like. The multilayer substrate 1 is not limited to a rectangular flat plate, and may be a triangle, a pentagon or more polygon, a circle, or an ellipse in plan view. The multilayer substrate 1 may be formed in a long shape such as a line shape. In the case of using a ceramic material, the multilayer substrate 1 is obtained by forming a conductor to be the wiring 4 in a predetermined pattern on a green sheet to be the first insulating layer 1a, the second insulating layer 1b, or the third insulating layer 1c. Can be formed. The multilayer substrate 1 can be formed by laminating and pressing a plurality of green sheets and then firing the laminate.

The light emitting unit 2 can emit light by power feeding. The light emitting unit 2 includes at least one light emitting element 3. For example, an LED chip using a gallium nitride compound semiconductor such as InGaN capable of emitting blue light can be used for the light emitting element 3. The light emitting unit 2 is not limited to the LED chip, and for example, a solid light emitting element such as an LD (Laser diode) or an organic EL element (organic electroluminescence element) can be used. Moreover, although the light emitting element 3 can use the bare chip of an LED chip, it is not restricted only to a bare chip. The light-emitting element 3 may be a chip-type light-emitting diode in which an LED chip is mounted on a resin substrate, covered with a light-transmitting resin, and a lead terminal for power supply is provided outside.

The light emitting unit 2 may include, for example, a light emitting element 3 and a sealing material 5 containing a phosphor that emits fluorescence by absorbing light emitted from the light emitting element 3. The light emitting element 3 is not limited to one that emits visible light, and may emit ultraviolet light. In the light emitting unit 2, when the light emitting element 3 is an LED chip that emits ultraviolet light, the phosphor of the sealing material 5 absorbs the ultraviolet light from the light emitting element 3 and emits blue light, and green light. A phosphor that emits light and a phosphor that emits red light can be used. Further, the light emitting unit 2 emits red light covered with the sealing material 5 and the sealing material 5 made of a translucent material not containing the phosphor, instead of using the sealing material 5 containing the phosphor. A red LED chip, a green LED chip that emits green light, a blue LED chip that emits blue light, and the like may be used.

Further, the light emitting unit 2 may include a sealing material 5 made of a translucent material that does not contain a phosphor, and a phosphor layer that directly or indirectly covers the sealing material 5. In particular, when the light emitting unit 2 includes a phosphor layer that indirectly covers the sealing material 5, it is possible to suppress the heat generated in the LED chip from being transmitted to the phosphor layer.

Moreover, the light emission part 2 is not restricted to three types, What is necessary is just two or more types. For example, the light emitting module 10 may include a first light emitting unit 2a that emits white light and a second light emitting unit 2b that emits light of any one color of purple, blue, green, yellow, orange, or red. Good. In this case, the light emitting module 10 can emit white light in which light of a specific wavelength is emphasized.

For example, the light emitting unit 2 is formed by mounting a plurality of light emitting elements 3 on the first surface 1aa of the multilayer substrate 1 and electrically connecting the light emitting elements 3 in series using the wiring 4 of the multilayer substrate 1. be able to. The plurality of light emitting elements 3 can be electrically connected in parallel or in series and parallel using the wiring 4 of the multilayer substrate 1.

The light emitting unit 2 may be provided with a plurality of light emitting elements 3 on the first surface 1aa of the multilayer substrate 1 in accordance with the shape and size of the light emitting module 10. The light emitting unit 2 can appropriately set the number of light emitting elements 3 and the installation interval according to the size, shape, light output, and the like of the light emitting module 10.

The light emitting element 3 can be composed of an InGaN-based material when a blue LED chip is used. As the light emitting element 3, an indium gallium nitride based semiconductor light emitting element having a central wavelength of 440 nm to 470 nm can be preferably used. The light emitting element 3 can use a bare chip that emits blue light as monochromatic visible light. The light emitting element 3 can be fixed to the first surface 1aa of the multilayer substrate 1 by a die bond material (not shown).

The light emitting element 3 may be, for example, one having a sapphire substrate and a nitride semiconductor layer stacked on the sapphire substrate. The nitride semiconductor layer can be composed of a stacked film of an n-type nitride semiconductor film and a p-type nitride semiconductor film. The light emitting element 3 may be one having an n-side electrode connected to the n-type nitride semiconductor film and a p-side electrode connected to the p-type nitride semiconductor film on the same surface side. The light-emitting element 3 electrically connects the n-side electrode of each light-emitting element 3 and the connection part 4d of the conductor part 4c with a wire 7 made of Au. Similarly, the light-emitting element 3 connects the p-side electrode of each light-emitting element 3 and the connection part 4d of the conductor part 4c different from the connection part 4d connected to the n-side electrode and the wire 7 by the wire 7 made of Au. is doing. That is, the light-emitting element 3 electrically connects the n-side electrode and the p-side electrode of each light-emitting element 3 separately to the connection part 4d of the different conductor part 4c. The sealing material 5 can seal the light emitting element 3 and the wire 7 inside, and can protect the light emitting element 3 and the wire 7 from external force.

The sealing material 5 can seal the light emitting element 3. The sealing material 5 can be formed of, for example, optical nylon, transfer molded epoxy resin, cyclic olefin copolymer resin, rigid silicone resin, optical plastic, glass such as low melting glass or sol-gel glass. The sealing material 5 may be, for example, a silicone resin, an epoxy resin, a silicone / epoxy hybrid resin, a fluororesin, an acrylic resin, a urea resin, a polyimide resin, a polyamide resin, a polyphthalamide resin, or a polycarbonate. Resins, polyphenyl sulfide resins, liquid crystal polymer resins, ABS resins, and mixtures thereof can also be used.

The encapsulating material 5 contains translucent fine particles for the purpose of light scattering effect, adjustment of the refractive index of the encapsulating material 5, improvement of thermal conductivity, improvement of thixotropy of the material of the encapsulating material 5, and the like. Also good. The fine particles include, for example, SiO 2 , Al 2 O 3 , ZnO, Y 2 O 3 , TiO 2 , ZrO 2 , HfO 2 , SnO 2 , Ta 2 O 5 , Nb 2 O 5 , BaSO 4 , ZnS, V 2 O. Metal oxides such as 5 and mixtures thereof can be used. For example, fine particles having a center particle size of several tens to several hundreds of nanometers can be used.

The sealing material 5 is formed by, for example, applying the material of the uncured paste-like sealing material 5 onto the light emitting element 3 with a dispenser and then curing the material of the paste-like sealing material 5. Can do. Although the sealing material 5 can make the external shape of the sealing material 5 into a dome shape, it is not restricted only to a dome shape.

As the sealing material 5, a material containing a phosphor in the material of the sealing material 5 can be suitably used. The phosphor can function as a wavelength converter that absorbs light from the light emitting element 3 and converts it to a different wavelength. In the phosphor, the phosphor content may be appropriately set depending on the target color temperature of the light emitted from each light emitting unit 2, the light emission intensity of the light emitted from the light emitting element 3, the light emission efficiency of the phosphor, and the like. .

Depending on the excitation light from the light emitting element 3, the phosphor is BaMgAl 10 O 17 : Eu 2+ which is an aluminate phosphor and (Sr, Ba) 10 (PO 4 ) which is a halophosphate phosphor as a blue phosphor. ) 6 Cl 2 : Eu 2+ , Sr 10 (PO 4 ) 6 Cl 2 : Eu 2+ , Ba 3 MgSi 2 O 8 : Eu 2+ which is a silicate phosphor can be suitably used.

As the fluorescent substance, Sr 4 Al 14 O 25 : Eu 2+ which is an aluminate fluorescent substance and Sr 2 Si 3 O 8 · 2SrCl 2 : Eu 2+ which is a silicate fluorescent substance can be suitably used as the blue-green fluorescent substance. .

The phosphor is a green phosphor, BaMgAl 10 O 17 : Eu 2+ , Mn 2+ , (Ba, Sr, Ca) Al 2 O 4 : Eu 2+ , (Ba, Sr) 2 SiO 4 : Eu 2+ , α-sialon phosphor Sr 1.5 Al 3 Si 9 N 16 : Eu 2+ , Ca-α-SiAlON: Yb 2+ , β-sialon phosphor β-Si 3 N 4 : Eu 2+ , oxynitride Ba 3 Si 6 O 12 N 2 : Eu 2+ , an oxynitridosilicate (Ba, Sr, Ca) Si 2 O 2 N 2 : Eu 2+ , an oxonitride aluminosilicate (Ba, Sr, Ca) ) 2 Si 4 AlON 7: Ce 3+, (Ba, Sr, Ca) Al 2-x Si x O 4-x N x: Eu 2+ (0 <x <2), the nitride phosphor der Serving nitridosilicate (Ba, Sr, Ca) 2 Si 5 N 8: Ce 3+, a sulfide phosphor Thiogallate serving SrGa 2 S 4: Eu 2+, Ca 3 Sc 2 Si 3 O 12 garnet phosphor: Ce 3+ , BaY 2 SiAl 4 O 12 : Ce 3+ , Y 3 (Al, Ga) 5 O 12 : Ce 3+ , and CaSc 2 O 4 : Ce 3+ which is an oxide phosphor can be preferably used.

The phosphor is a silicate phosphor (Sr, Ba) 2 SiO 4 : Eu 2+ , Sr 3 SiO 5 : Eu 2+ , and a garnet phosphor (Y, Gd) 3 Al 5 O 12 : Ce as a yellow phosphor. 3+ , Y 3 Al 5 O 12 : Ce 3+ , Y 3 Al 5 O 12 : Ce 3+ , Pr 3+ , Tb 3 Al 5 O 12 : Ce 3+ , CaGa 2 S 4 as a thiogallate phosphor that is a sulfide phosphor: Eu 2+ , Ca-α-SiAlON as an α-sialon phosphor: Eu 2+ , (0.75 (Ca 0.9 Eu 0.1 ) O · 2.25AlN · 3.25Si 3 N 4 : Eu 2+ , Ca 1 .5 Al 3 Si 9 N 16 : Eu 2+ ), Ba 3 Si 6 O 12 N 2 : Eu 2+ as an oxynitride phosphor, and (Ca, Sr, Ba) AlSiN as a nitride phosphor 3 : Eu 2+ can be preferably used.

As the orange phosphor, (Sr, Ca) 2 SiO 4 : Eu 2+ which is a silicate phosphor, Gd 3 Al 5 O 12 : Ce 3+ which is a garnet phosphor, and Ca-α- which is an α-sialon phosphor. SiAlON: Eu 2+ can be preferably used.

The phosphor is a thiogallate (Sr, Ca) S: Eu 2+ , La 2 O 2 S: Eu 3+ , Sm 3+ , which is a sulfide phosphor, and Ba 3 MgSi 2 O 8 , which is a silicate phosphor, as a red phosphor. : Eu 2+ : Mn 2+ , CaAlSiN 3 as nitride phosphor: Eu 2+ , (Ca, Sr) SiN 2 : Eu 2+ , (Ca, Sr) AlSiN 3 : Eu 2+ , Sr 2 Si 5 as oxynitride phosphor -x Al x O x N 8- x: Eu 2+ (0 ≦ x ≦ 1), Sr 2 (Si, Al) 5 (N, O) 8: Eu 2+ can be preferably used.

(Embodiment 2)
The light emitting module 11 of the present embodiment shown in FIGS. 5 and 6 is mainly different in that the structure of the multilayer substrate 1 of the first embodiment shown in FIG. 1 is changed. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted suitably.

As shown in FIGS. 5 and 6, the light emitting module 11 of the present embodiment has a long shape as a whole, and is a line light source that emits light in a line shape (line shape). The multilayer substrate 1 uses a long ceramic substrate.

The light emitting module 11 of this embodiment includes a multilayer substrate 1 and two or more types of light emitting units 2. The multilayer substrate 1 of the light emitting module 11 has two or more insulating layers. In the light emitting module 11 of the present embodiment, the multilayer substrate 1 has three insulating layers of a first insulating layer 1a, a second insulating layer 1b, and a third insulating layer 1c as two or more insulating layers. The multilayer substrate 1 has a first wiring portion 4a1 provided between the first insulating layer 1a and the second insulating layer 1b as the wiring portion 4a having a predetermined shape provided between the insulating layers. Yes. The multilayer substrate 1 has a second wiring portion 4a2 provided between the second insulating layer 1b and the third insulating layer 1c as a wiring portion 4a having a predetermined shape provided between the insulating layers. . The multilayer substrate 1 has a through wiring 4b that penetrates the insulating layer and is electrically connected to a wiring portion 4a having a predetermined shape. The multilayer substrate 1 has a first through wiring 4b1 that penetrates the second insulating layer 1b and the third insulating layer 1c as the through wiring 4b and is electrically connected to the first wiring portion 4a1. Further, the multilayer substrate 1 has a second through wiring 4b2 that penetrates the third insulating layer 1c and is electrically connected to the second wiring portion 4a2 as the through wiring 4b. The multilayer substrate 1 is electrically connected to the through wiring 4b and has a conductor portion 4c having a predetermined shape provided on the first surface 1aa side. The multilayer substrate 1 has a first conductor portion 4c1 electrically connected to the first through wiring 4b1 as the conductor portion 4c. The multilayer substrate 1 has a second conductor portion 4c2 that is electrically connected to the second through wiring 4b2 as the conductor portion 4c. Each of the two or more light emitting units 2 of the light emitting module 11 emits light by power feeding through a pair of conductor portions 4c provided on the first surface 1aa side of the multilayer substrate 1.

Each light emitting section 2 has one light emitting element 3. The light emitting module 11 includes, as two or more types of light emitting units 2, a first light emitting unit 2a having the largest number of light emitting elements 3, a second light emitting unit 2b having a smaller number of light emitting elements 3 than the first light emitting units 2a, It has. In the light emitting module 11 of the present embodiment, the second light emitting unit 2b includes two types of green light emitting unit 2bg and white light emitting unit 2bw. The light emitting unit 2 includes a total of three types including a first light emitting unit 2a to be a red light emitting unit 2ar and two types of second light emitting units 2b. In the light emitting module 11, three first light emitting units 2 a are provided, and each of the first light emitting units 2 a is provided with one light emitting element 3. Of the two types of second light emitting units 2b, one green light emitting unit 2bg is provided, and one light emitting element 3 is provided in the green light emitting unit 2bg. Of the two types of second light emitting units 2b, one white light emitting unit 2bw is provided, and one light emitting element 3 is provided in the white light emitting unit 2bw. The first light emitting unit 2a is electrically connected to the first wiring unit 4a1 provided at a position farther from the first surface 1aa of the multilayer substrate 1 than the second wiring unit 4a2 to which the second light emitting unit 2b is connected. ing. The first light emitting unit 2a having the largest number of light emitting elements 3 is provided on the multilayer substrate 1 more than the second conductor unit 4c2 to which the second light emitting unit 2b having a smaller number of light emitting elements 3 than the first light emitting unit 2a is connected. It is electrically connected to a first wiring portion 4a1 provided at a position away from one surface 1aa.

In the light emitting module 11 of the present embodiment, the first light emitting unit 2a includes a light emitting element 3 that emits blue light and a phosphor that absorbs blue light emitted from the light emitting element 3 and emits red light. Moreover, the green light emission part 2bg of the 2nd light emission part 2b has the light emitting element 3 which emits blue light, and the fluorescent substance which absorbs the blue light which the light emitting element 3 emits, and emits green light. Further, the white light emitting unit 2bw of the second light emitting unit 2b includes a light emitting element 3 that emits blue light, and a phosphor that absorbs blue light emitted from the light emitting element 3 and emits yellow light.

In the light emitting module 11 of the present embodiment, the green light emitting part 2bg and the white light emitting part 2bw are electrically separated from each other by the second wiring part 4a2 provided between the same layers of the second insulating layer 1b and the third insulating layer 1c. Connected.

The light emitting module 11 of the present embodiment can improve the light output more similarly to the light emitting module 10 of the first embodiment. The light emitting module 11 can be used as a line-shaped light source.
(Embodiment 3)
The light emitting module 12 of this embodiment shown in FIG. 7 and FIG. 8 is composed of a multilayer substrate 1 having the same laminated structure as that of Embodiment 1 of FIG. 1, and in particular, is reflected on the first surface 1aa of the multilayer substrate 1. The main difference is that the film 1d is provided. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted suitably.

In the light emitting module 12 of the present embodiment, as shown in FIGS. 7 and 8, the multilayer substrate 1 has a reflective film 1d that has a higher reflectivity than the conductor 4c having a predetermined shape with respect to the light emitted from the light emitting unit 2. The conductor 4c is partially covered. The conductor portion 4 c includes an external connection terminal 4 e and an external connection terminal 4 f that are connected to the outside, and a connection portion 4 d that is connected to the light emitting unit 2. The connection portion 4d, the external connection terminal 4e, and the external connection terminal 4f are exposed from the reflective film 1d.

Most of the conductor portions 4c other than the portions exposed to the outside, such as the external connection terminals 4e, 4f, and connection portions 4d, have higher reflectivity than the conductor portions 4c with respect to light from the light emitting element 3 and the phosphor. The reflective film 1d is covered. For the reflective film 1d, for example, a ceramic material can be used as the material of the reflective film 1d. More specifically, the reflective film 1d can be made of alumina. The conductor portion 4c can also be regarded as the wiring 4 provided between the reflective film 1d, which is an insulating alumina layer, and the third insulating layer 1c. In the light emitting module 12 of the present embodiment, the portion where the conductor portion 4c is not provided on the first surface 1aa of the multilayer substrate 1 includes the same reflective film 1d as the portion where the conductor portion 4c is provided on the first surface 1aa side. In the light emitting module 12, the material of the reflective film 1d may be changed between a portion where the conductor portion 4c is on the first surface 1aa of the multilayer substrate 1 and a portion where the conductor portion 4c is not on the first surface 1aa of the multilayer substrate 1. . It is more preferable to use a portion where the conductor portion 4c is not on the first surface 1aa of the multilayer substrate 1 having a higher reflectance than the first surface 1aa of the multilayer substrate 1. The reflection film 1d is not limited to the ceramic material can be formed by using a glass material or a resin material containing a light-transmitting property of the fine particles comprising SiO 2 and metal oxides.

The light emitting element 3 is mounted on the multilayer substrate 1 side via the submount member 6. The submount member 6 is preferably used in order to efficiently dissipate the heat generated in the light emitting element 3 to the multilayer substrate 1 side. The light emitting module 12 can suitably use AlN as a material of the submount member 6 as a material having a relatively high thermal conductivity and electrical insulation. The submount member 6 has an outer shape in plan view larger than that of the light emitting element 3, and has a function as a heat spreader that diffuses heat generated from the light emitting element 3 in a range wider than the size of the light emitting element 3. . Further, the submount member 6 has a function of relieving stress generated due to a difference in coefficient of linear expansion between the multilayer substrate 1 and the light emitting element 3. Further, the submount member 6 can have a function of ensuring electrical insulation between the light emitting element 3 and the multilayer substrate 1 side. The submount member 6 is not limited to AlN, for example, and can be formed using ZnO, SiC, C, or the like.

The light emitting module 12 of the present embodiment can have a higher light output than the light emitting module 10 of the first embodiment by including the reflective film 1d.

(Embodiment 4)
The light emitting module 13 of this embodiment shown in FIG. 9 is mainly different from the light emitting module 12 of Embodiment 3 in that the light emitting unit 2 having a plurality of light emitting elements 3 is used. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 3, and description is abbreviate | omitted suitably.

As shown in FIG. 9, the light emitting module 13 of the present embodiment includes a multilayer substrate 1 having a circular plan view and a plurality of long light emitting units 2 arranged in parallel on the first surface 1aa of the multilayer substrate 1. With. Here, eleven light emitting units 2 are provided. Each light emitting section 2 is a seal that collectively seals a plurality of light emitting elements 3 mounted in a row and a plurality of light emitting elements 3 mounted in each row along the long light emitting section 2. Material 5 is provided. The multilayer substrate 1 is preferably provided with a through hole 1h in the vicinity of the external connection terminal 4e and the external connection terminal 4f of the multilayer substrate 1 for inserting, for example, a lead wire derived from a power supply unit (not shown).

The light-emitting element 3 is a semiconductor light-emitting element and uses a bare chip that emits monochromatic visible light. The light emitting element 3 uses a blue LED chip. In the light emitting module 13 of the present embodiment, a plurality of light emitting elements 3 are mounted on the first surface 1aa of the multilayer substrate 1. Here, 85 light emitting elements 3 are provided. Moreover, the light emitting module 13 comprises one light emitting part 2 from three to eleven light emitting elements 3 mounted in a line on the first surface 1aa of the multilayer substrate 1, and the adjacent light emitting parts 2 are different. It is arranged side by side so that it becomes a kind.

Specifically, the light-emitting module 13 has a white light-emitting portion 2 bw in which eleven light-emitting elements 3 are arranged in a row so as to pass through the center of the multilayer substrate 1 and covered with the sealing material 5. The light emitting module 13 has a row of ten light emitting elements 3 in parallel with the white light emitting unit 2bw on both sides in the direction orthogonal to the longitudinal direction of the white light emitting unit 2bw with respect to the white light emitting unit 2bw on the center side of the multilayer substrate 1. A red light emitting portion 2ar is provided. The light emitting module 13 includes nine light emitting elements 3 in parallel to the red light emitting parts 2ar on the side opposite to the center side of the multilayer substrate 1 with respect to each of the red light emitting parts 2ar composed of the ten light emitting elements 3. The green light emission part 2bg which becomes is provided. Further, the light emitting module 13 includes eight light emitting elements 3 in parallel to the green light emitting part 2bg on the side opposite to the center side of the multilayer substrate 1 for each of the green light emitting parts 2bg composed of the nine light emitting elements 3. An array of red light emitting portions 2ar is provided. The light emitting module 13 has seven light emitting elements 3 arranged in parallel to the red light emitting part 2ar on the side opposite to the center side of the multilayer substrate 1 for each of the red light emitting parts 2ar composed of eight light emitting elements 3. A white light emitting unit 2bw is provided. The light emitting module 13 is a red light composed of three light emitting elements 3 on the first surface 1aa of the multilayer substrate 1 at a position closest to the peripheral portion of the multilayer substrate 1 in a direction orthogonal to the column direction of the white light emitting portions 2bw. A light emitting unit 2ar is provided. The two or more types of light emitting units 2 are arranged in 11 rows on the first surface 1aa of the multilayer substrate 1, but may be two rows or may be arranged in two or more rows. I do not care. In any case, the light emitting module 13 of the present embodiment is configured such that the total number of the light emitting elements 3 of the red light emitting unit 2ar is relatively large among the light emitting units 2.

As shown in FIG. 10, the light emitting module 13 includes a metal wire 7, a conductor portion 4 c, a through wiring 4 b, and a wiring portion 4 a, and a plurality of light emitting elements 3 of the light emitting portion 2 are electrically connected in series. Connected. For the wire 7, for example, Au or Al can be used as the metal material of the wire 7.

The light emitting module 13 of this embodiment is provided with each wire 7 along the row direction of the light emitting units 2 as shown in FIG. In the light emitting module 13, the sealing material 5 may expand and contract in the column direction of the light emitting units 2 due to a temperature change caused by turning on or off the light emitting element 3. The light emitting module 13 of the present embodiment emits light to the wires 7 as compared with the force applied in the direction along the column direction of the light emitting units 2 even when the sealing material 5 expands and contracts in the column direction of the light emitting units 2. The force applied in the direction orthogonal to the portion 2 is small. In FIG. 10, the row direction of the light emitting units 2 is indicated by white arrows. In FIG. 10, the force applied in the direction along the column direction of the light emitting units 2 is illustrated by a thick black arrow. Therefore, the light emitting module 13 can suppress the twisting or disconnection of the wire 7 accompanying the expansion / contraction of the sealing material 5.

Further, the light emitting module 13 of the present embodiment uses the light emitting element 3 whose outer shape is a rectangular parallelepiped. Each light emitting element 3 is arranged such that the longitudinal direction in plan view coincides with the column direction of the light emitting elements 3. Thereby, since the width | variety of the row direction of each light emitting element 3 becomes narrow, the light emitting module 13 can narrow the width W1 (refer FIG. 11) of the transversal direction of the sealing material 5 in planar view. If the light emitting module 13 is the multilayer substrate 1 having the same size, the gap between the adjacent light emitting portions 2 can be widened by narrowing the width W1 of the sealing material 5. Therefore, the light emitting module 13 can reduce the amount of heat transmitted from the counterpart sealing material 5 through the multilayer substrate 1 between the adjacent light emitting units 2, and can further increase the heat dissipation of the light emitting unit 2. It becomes possible.

The light emitting module 13 is formed with the sealing material 5 in a long shape, and seals an element array composed of a plurality of light emitting elements 3. The sealing material 5 is provided for each element array, and collectively seals the plurality of light emitting elements 3 constituting the element array. Thereby, the light emitting module 13 has a plurality of sealing materials 5 arranged in parallel in a direction orthogonal to the column direction of the element rows. The light emitting unit 2 has a shorter length in the longitudinal direction as it is closer to the outer periphery of the multilayer substrate 1 in the direction in which the sealing materials 5 are arranged.

In the light emitting module 13, in each light emitting section 2, it is more preferable that the central axis along the longitudinal direction of the sealing material 5 coincides with the arrangement axis in the element row of the light emitting elements 3. When the light-emitting module 13 includes a phosphor in the sealing material 5, the optical axis length difference of light from the light-emitting element 3 is made by matching the central axis of the sealing material 5 with the array axis of the light-emitting element 3. It is possible to suppress the occurrence of color unevenness due to the above.

In the light emitting module 13 of the present embodiment, as shown in FIGS. 9 and 10, the end portion 5 a in the longitudinal direction of the sealing material 5 has a substantially quadrangular shape. Moreover, as shown in FIG. 11, the light emitting module 13 of this embodiment is making the side surface of the cross-sectional shape along the transversal direction of the sealing material 5 into the substantially semi-elliptical shape which has R shape. When forming the sealing material 5 so that the light emitting module 13 has an R shape in the cross section in the longitudinal direction and the short side direction, for example, using a dispenser method in which the material of the sealing material 5 is applied by a dispenser (not shown). What is necessary is just to form.

Although not shown, the light emitting module 13 is applied with a resin paste as a material of the sealing material 5 along the element rows of the plurality of light emitting elements 3 using a dispenser, and then cured. Thus, the sealing material 5 can be formed. The light emitting module 13 can adjust the shape of the sealing material 5 by adjusting the viscosity of the resin paste. The light emitting module 13 may contain a filler in the resin paste in order to adjust the viscosity of the resin paste. The light emitting module 13 can use, for example, an inorganic pigment of SiO 2 as a filler.

Note that the light emitting module 13 of the present embodiment includes the first light emitting module 2 of the multilayer substrate 1 so that the light emitting section 2 disposed on the center side among the plurality of light emitting sections 2 does not overlap the light emitting section 2 disposed on the end side. A step may be provided on the surface 1aa. In the light emitting module 13, the step of the multilayer substrate 1 can be increased as the distance from the center of the multilayer substrate 1 to the outer peripheral portion of the multilayer substrate 1 is increased. Thereby, the light emitting module 13 can further suppress the light emitted from the light emitting unit 2 from being absorbed by the wiring 4 of the multilayer substrate 1.

(Embodiment 5)
The illuminating device 20 of this embodiment shown in FIG. 12 includes the light emitting module 14 having the same laminated structure as that of the fourth embodiment shown in FIG. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 4, and description is abbreviate | omitted suitably.

The lighting device 20 of this embodiment constitutes an LED bulb that is a bulb-type lamp.

As shown in FIG. 12, the lighting device 20 of the present embodiment includes a light emitting module 14, a mounting member 21 on which the light emitting module 14 is mounted, and a case 22 having the mounting member 21. The lighting device 20 includes a globe 23 that covers the light emitting module 14 and a lighting circuit unit 24 that can light each light emitting unit 2 of the light emitting module 14 separately. The lighting device 20 includes a circuit holder 25 that houses the lighting circuit unit 24 and is disposed in the case 22, and a base 26 that is provided on one end side of the cylindrical case 22. The lighting device 20 of the present embodiment is the same as the light emitting module 13 of the fourth embodiment shown in FIG. 9 except that the outer shape of the multilayer substrate 1 is a rectangular flat plate and the lengths of the light emitting units 2 are substantially the same. The light emitting module 14 having the configuration is provided.

As shown in FIGS. 13 and 14, the light emitting module 14 is provided with two or more types of light emitting units 2 on the multilayer substrate 1. The light emitting unit 2 includes a multilayer substrate 1, a plurality of light emitting elements 3 mounted on the first surface 1aa of the multilayer substrate 1, and a sealing material 5 that covers the light emitting elements 3. Although the light emitting module 14 is illustrated in a simplified manner in FIG. 14, the first insulating layer 1 a, the second insulating layer 1 b, and the third insulating layer are used as the multilayer substrate 1 having two or more insulating layers as in FIG. 10. 1c. The multilayer substrate 1 includes a wiring 4.

Each light emitting unit 2 covers a plurality of light emitting elements 3 with one sealing material 5 although not shown in FIG. For example, as shown in FIG. 14, one sealing material 5 can seal six light emitting elements 3. Nine light emitting units 2 are provided in a direction orthogonal to the longitudinal direction of the light emitting unit 2. The light emitting module 14 changes the kind of the light emitting part 2 for each adjacent light emitting part 2, and the number of the light emitting elements 3 of the red light emitting part 2ar is the number of the light emitting elements 3 of the green light emitting part 2bg and the white light emitting part 2bw. More than that.

The mounting member 21 mounts and fixes the light emitting module 14 and closes the other end side of the cylindrical case 22. As shown in FIGS. 12 and 13, the mounting member 21 has, for example, a disk shape, is fitted into the other end of the case 22, and is a surface located on the outer side of the case 22 (upper side of the paper in FIG. 12). The light emitting module 14 is fixed to the side. In the illumination device 20, the case 22 has a cylindrical shape, and the mounting member 21 has a disk shape.

The lighting device 20 includes a recess 21 a for mounting the light emitting module 14 on the surface side of the mounting member 21. The illuminating device 20 fixes the light emitting module 14 to the mounting member 21 in a state where the bottom surface of the recess 21 a and the multilayer substrate 1 of the light emitting module 14 are in surface contact. The light emitting module 14 can be fixed to the mounting member 21 by, for example, a method of directly fixing with the fixing screw or a method of applying a pressing force with a leaf spring. The lighting device 20 can position the light emitting module 14 relatively easily and accurately by the recess 21 a of the mounting member 21.

The mounting member 21 includes a plurality of through holes 21 b that penetrate in the thickness direction of the mounting member 21. Here, four through holes 21b are provided. In the illuminating device 20, the lead wire as the power supply line 25 c from the lighting circuit unit 24 is electrically connected to the external connection terminal 4 e and the external connection terminal 4 f of the multilayer substrate 1 through the through hole 21 b of the mounting member 21. Yes. The mounting member 21 includes a small-diameter portion 21c having a small outer diameter and a large-diameter portion 21d having an outer diameter larger than that of the small-diameter portion 21c. In the mounting member 21, the outer peripheral surface 21d1 of the large-diameter portion 21d abuts on the inner peripheral surface 22aa of the case 22, and an adhesive or the like is used between the inner peripheral surface 22aa of the case 22 and the small-diameter portion 21c. The end 23a on the opening side of the globe 23 is fixed.

The case 22 has a cylindrical outer shape, and the outer diameter is gradually reduced from the other end side to the one end side of the case 22. The case 22 has a mounting member 21 fixed at the other end and a base 26 provided at one end. The case 22 accommodates the circuit holder 25 therein and holds the lighting circuit portion 24 in the circuit holder 25. The case 22 has a cylindrical wall portion 22a and a bottom wall portion 22b provided at one end of the cylindrical wall portion 22a. Case 22 is provided with through-hole 22ba in the center part of bottom wall part 22b. The cylindrical wall portion 22a includes a straight portion 22a1 having a substantially constant inner diameter along the central axis of the cylindrical wall portion 22a and a tapered portion 22a2 having a gradually decreasing inner diameter.

In the lighting device 20, for example, the mounting member 21 can be attached to the case 22 by press-fitting the mounting member 21 from the other end of the case 22. The illuminating device 20 can position the mounting member 21 at the time of press-fitting by a stopper portion 22a3 formed on the inner surface of the case 22. There are a plurality of stopper portions 22 a 3, which are formed at equal intervals in the circumferential direction of the case 22. For example, three stopper portions 22a3 can be provided. The lighting device 20 has a positional relationship between the mounting member 21 and the case 22 such that the surface of the mounting member 21 on which the light emitting module 14 is fixed is present on the inner side of the end surface of the case 22 on the mounting member 21 side. Is stipulated.

The circuit holder 25 is for storing the lighting circuit unit 24 therein, and includes a holder body 25a and a lid body 25b. As for the circuit holder 25, the cover body 25b has closed the storage port of the holder main body 25a. The holder main body 25a includes a protruding cylindrical portion 25a1 that protrudes from the inside of the case 22 to the outside through the through hole 22ba of the bottom wall portion 22b of the case 22, and a bottom portion 25a2 that contacts the inner surface of the bottom wall portion 22b of the case 22. have. The holder main body 25a has a large-diameter cylindrical portion 25a3 extending from the outer peripheral edge of the bottom portion 25a2 to the side opposite to the protruding direction of the protruding cylindrical portion 25a1. The holder body 25a closes the opening of the large-diameter cylindrical portion 25a3 with a lid body 25b. The protruding cylindrical portion 25a1 is a screw portion 25a1a in which the outer peripheral surface of the protruding cylindrical portion 25a1 is screwed to the base portion 26a of the base 26.

The lid body 25b has a lid part 25b1 and a cylinder part 25b2. The lid body 25b has a bottomed cylindrical shape. For example, the cylindrical portion 25b2 can be fitted onto the large-diameter cylindrical portion 25a3 of the holder main body 25a. In the illumination device 20, the inner diameter of the cylindrical portion 25b2 of the lid body 25b is slightly larger than the outer diameter of the large diameter cylindrical portion 25a3 of the holder main body 25a. In the illumination device 20, the inner peripheral surface of the cylindrical portion 25b2 of the lid 25b and the outer peripheral surface of the large-diameter cylindrical portion 25a3 of the holder main body 25a are in contact with each other in a state where the lid 25b and the holder main body 25a are assembled. For example, the lighting device 20 can fix the lid 25b and the holder body 25a with an adhesive. The illuminating device 20 may be fixed so that the lid body 25b and the holder main body 25a are engaged with each other by an engaging means in which the engaging portion and the engaged portion are combined. Moreover, the illuminating device 20 may fix the cover body 25b and the holder main body 25a with a screw. The illuminating device 20 may fix the lid body 25b and the holder body 25a by fitting by making the inner diameter of the cylinder portion 25b2 of the lid body 25b smaller than the outer diameter of the large-diameter cylinder portion 25a3 of the holder body 25a. .

The circuit board 27 has an electronic component 28 mounted thereon. Although not shown, the circuit board 27 can be held on the circuit holder 25 side by a clamp mechanism, for example. The circuit holder 25 can be attached to the case 22 by sandwiching the bottom wall portion 22b of the case 22 between the bottom portion 25a2 and the base 26 of the holder body 25a. The illuminating device 20 has a gap between the outer surface of a portion excluding the bottom portion 25 a 2 of the circuit holder 25 and the protruding cylindrical portion 25 a 1 and the inner surface of the case 22. In addition, the illumination device 20 has a gap between the outer surface of the portion excluding the bottom portion 25 a 2 of the circuit holder 25 and the protruding cylindrical portion 25 a 1 and the back surface of the mounting member 21. The lighting device 20 has an air layer in the gap.

The lighting circuit unit 24 can illuminate two or more light emitting units 2 of the light emitting module 14 separately using AC power supplied from an external AC power source through a base 26. An example of the external AC power supply is a commercial AC power supply. The lighting circuit unit 24 includes a plurality of electronic components 28 mounted on the circuit board 27. In the lighting device 20, the lighting circuit unit 24 converts AC power from a commercial AC power source into power suitable for lighting the light emitting element 3 in the light emitting unit 2 and supplies the power to the light emitting element 3 side of the light emitting unit 2. The lighting circuit unit 24 includes, for example, a filter circuit unit that removes noise mixed in AC power from a commercial AC power source, a power supply circuit unit that supplies power suitable for lighting the light emitting element 3, and light emission. It can be set as the structure provided with the output control part which controls lighting of the element 3. FIG. The filter circuit unit can be configured using an AC line filter or the like that blocks noise. The power supply circuit unit can convert the AC power from the filter circuit unit into predetermined DC power and output it. Although not shown, the power supply circuit unit is rectified by, for example, a rectifier circuit such as a diode bridge circuit that rectifies AC power into DC power, a power factor correction circuit that improves the power factor of AC power, and a rectifier circuit. The voltage conversion circuit that converts the voltage of the direct current power into a voltage suitable for the light emitting element 3 can be used. The lighting circuit unit 24 may appropriately include a dimmer circuit, a booster circuit, and the like.

Note that the lighting device 20 does not necessarily include the lighting circuit unit 24. For example, when direct-current power is directly supplied from a battery or the like, the lighting device 20 may not include the lighting circuit unit 24.

The circuit board 27 has an electronic component 28 mounted on one main surface side of the circuit board 27, and is held by the circuit holder 25 in a state where the electronic component 28 is located on the protruding cylindrical portion 25a1 side of the holder body 25a. Yes. The circuit board 27 is provided with a power supply line 25 c electrically connected to the light emitting module 14 on the other main surface side of the circuit board 27. The globe 23 has a dome-like outer shape, for example. The globe 23 is provided in the case 22 so as to cover the light emitting module 14. In the lighting device 20, an end portion 23 a on the opening side of the globe 23 is inserted between the inner periphery of the case 22 and the small diameter portion 21 c of the mounting member 21. The lighting device 20 attaches the globe 23 to the case 22 in a state where the end surface of the end portion 23a of the globe 23 is in contact with the large diameter portion 21d by an adhesive (not shown) disposed between the case 22 and the small diameter portion 21c. Adhered to the side. The base 26 is attached to a socket of a lighting fixture (not shown) and receives power from the socket. The base 26 includes, for example, a base part 26 a and a flange part 26 b that extends outward in the radial direction from the opening-side end of the base part 26 a. The base part 26a has a shell part 26a1 of a screw part and an eyelet part 26a2 of a tip part. In the lighting device 20, the shell portion 26 a 1 is screwed with the screw portion 25 a 1 a of the circuit holder 25.

In the light emitting module 14 of the lighting device 20 of the present embodiment, the first light emitting unit 2a having the largest number of light emitting elements 3 is formed on the multilayer substrate 1 more than the wiring unit 4a and the conductor unit 4c to which the second light emitting unit 2b is connected. It is electrically connected to the wiring portion 4a provided at a position away from the first surface 1aa. Thereby, the illumination device 20 of the present embodiment can further increase the light output. The lighting device 20 according to the present embodiment includes not only the light emitting module 14 but also the light emitting module 10, the light emitting module 11, the light emitting module 12, and the light emitting module 13 described in the first to fourth embodiments. But you can.

(Embodiment 6)
The illumination device 20a of the present embodiment shown in FIG. 15 is mainly different from the fifth embodiment of FIG. 12 in the structure of the illumination device 20a including the light emitting module 15. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 5, and description is abbreviate | omitted suitably.

The illumination device 20a of the present embodiment constitutes an LED bulb that is a bulb-type lamp, as shown in FIGS. The illuminating device 20a of the present embodiment is an LED bulb that replaces an incandescent bulb, and includes a translucent globe 23, a light emitting module 15 that can emit light, a base 26 that receives power from the outside, and light emission. And a stem 29 for supporting the module 15. Furthermore, the lighting device 20a of the present embodiment is housed in a container constituted by a power supply line 25c that feeds power to the light emitting module 15, a support member 22c, and a resin case 22, and the lighting circuit unit 24 that lights the light emitting module 15. And has. In the illumination device 20a of the present embodiment, an envelope is configured by the globe 23, the case 22, and the base 26.

Hereinafter, each component of the illuminating device 20a of this embodiment is demonstrated in detail.

The globe 23 is a light-transmitting member that houses the light-emitting module 15 and transmits light from the light-emitting module 15 to the outside of the lamp. The globe 23 is composed of a silica glass hollow member that is transparent to visible light. Therefore, the lighting device 20 a can visually recognize the light emitting module 15 housed in the globe 23 from the outside of the globe 23. The lighting device 20a hermetically seals the inside of the globe 23, and for example, nitrogen gas, argon gas, dry air, or the like can be sealed as a sealing gas.

As shown in FIGS. 16 and 17, the globe 23 has an outer shape in which one end side of the globe 23 is closed in a spherical shape and the other end side has an opening 23aa. The outer shape of the globe 23 is such that the outer shape narrows while a part of the hollow sphere extends away from the center of the sphere, and the globe 23 has an opening 23aa at a position away from the center of the sphere. Is forming. The globe 23 has an outer shape similar to that of a general incandescent bulb.

In addition, the globe 23 is not limited to silica glass but may be composed of a resin material such as an acrylic resin. The globe 23 is not necessarily transparent to visible light. For example, the globe 23 may be a translucent material coated with silica and provided with a milky white diffusion film.

The light emitting module 15 is housed in the globe 23. The light emitting module 15 is suitably arranged at a spherical center position formed by the globe 23. In the light emitting module 15, the multilayer substrate 1 on which the LED chip as the light emitting element 3 is mounted is made of a translucent ceramic material. The lighting device 20a arranges the light emitting module 15 at the center of the spherical shape of the globe 23, and obtains a light distribution characteristic approximate to that of a general incandescent bulb using a conventional filament coil when the lighting device 20a is turned on. It is configured to be possible.

Further, in the lighting device 20a, the light emitting module 15 is arranged so as to be positioned in the air in the globe 23 by the four power supply lines 25c. In other words, the light emitting module 15 is disposed within the large diameter portion of the globe 23. The lighting device 20a supplies power to the light emitting module 15 from the power supply line 25c. The illuminating device 20a is capable of emitting two or more types of light emitting units 2 in the light emitting module 15 separately by supplying power from the four power supply lines 25c. The light emitting module 15 includes a multilayer substrate 1, a plurality of light emitting elements 3 mounted on the first surface 1 aa side of the multilayer substrate 1, and a sealing material 5. The light emitting module 15 is arranged with the first surface 1aa of the multilayer substrate 1 on which the plurality of light emitting elements 3 are mounted facing the top of the globe 23.

The multilayer substrate 1 is the multilayer substrate 1 on which the light emitting element 3 is mounted, and is made of a ceramic material having a light-transmitting property with respect to visible light. The multilayer substrate 1 uses, for example, a rectangular flat plate-shaped alumina substrate. In addition, in the illuminating device 20a of this embodiment, it is preferable that the multilayer substrate 1 is a member with a high visible light transmittance. As a result, the light emitting module 15 allows light from each light emitting unit 2 to pass through the inside of the multilayer substrate 1 and emit light from a portion where the light emitting unit 2 is not provided. Therefore, even when the light emitting module 15 is provided only on the first surface 1aa side of the multilayer substrate 1, light is emitted from the second surface 1ab of the multilayer substrate 1 and approximates an incandescent bulb. Light distribution characteristics can be obtained. The multilayer substrate 1 does not necessarily have translucency. Further, the light emitting unit 2 may be provided not only on the first surface 1aa of the multilayer substrate 1 but also on the second surface 1ab side of the multilayer substrate 1.

Since the illuminating device 20a of this embodiment uses the multilayer substrate 1 having translucency, the light emitted from each light emitting unit 2 passes through the inside of the multilayer substrate 1, and the light emitting unit 2 of the multilayer substrate 1 The light is also emitted from the second surface 1ab that is not provided.

The base 26 is a power receiving unit that receives power for lighting the light emitting units 2 of the light emitting module 15 and receives AC power. The lighting device 20a inputs the power received by the base 26 to the lighting circuit unit 24 via the lead wire 24a. The base 26 has a Japanese industrial standard E shape, and has a metallic bottomed cylindrical shape. The lighting device 20a is attached to a Japanese Industrial Standard E26 base socket connected to a commercial AC power source.

The base 26 does not necessarily have to be an E26 type base, and may be a Japanese Industrial Standard E17 type. Further, the base 26 does not necessarily need to be a screw-type base, and may have different shapes such as a plug-in type.

The stem 29 is provided so as to extend from the vicinity of the opening 23aa of the globe 23 into the globe 23. The stem 29 has a rod shape, and is configured so that one end is connected to the light emitting module 15 and the other end is connected to the support member 22c. The stem 29 is preferably made of a material having a thermal conductivity larger than that of the multilayer substrate 1 of the light emitting module 15. The stem 29 can be composed of, for example, a metal material or an inorganic material such as ceramic. As the metal material of the stem 29, for example, Al can be used. The stem 29 can conduct heat from the light emitting module 15 to the base 26 side.

The stem 29 includes a first stem portion 29a connected to the light emitting module 15, a second stem portion 29c connected to the support member 22c, and an intermediate stem portion 29b between the first stem portion 29a and the second stem portion 29c. It has. The stem 29 integrally forms a first stem portion 29a, a second stem portion 29c, and an intermediate stem portion 29b. The stem 29 is configured to have substantially the same shape as the stem used for the incandescent bulb. The first stem portion 29 a has a cylindrical shape and has a mounting member 21 on which the light emitting module 15 is mounted. The mounting member 21 has a disk shape, and the diameter of the mounting member 21 is larger than the diameter of the main body portion of the first stem portion 29a.

The second stem portion 29c has a cylindrical shape and is fixed to the support member 22c. The stem 29 is supported and fixed to the support member 22c. In the second stem portion 29c, the diameter of the second stem portion 29c is larger than the diameter of the first stem portion 29a. The intermediate stem portion 29b has a truncated cone shape in which the diameter on the first stem portion 29a side is smaller than the diameter on the second stem portion 29c side. The intermediate stem portion 29b includes two through holes for inserting the power supply line 25c. The power supply line 25c is inserted through the through hole of the intermediate stem portion 29b, and is electrically connected to the lighting circuit portion 24 through the intermediate stem portion 29b and the second stem portion 29c. Further, the power supply line 25c is configured to contact the intermediate stem portion 29b and the second stem portion 29c. The illuminating device 20a can conduct the heat of the power supply line 25c to the stem 29.

Further, the intermediate stem portion 29b has an inclined surface constituted by a truncated cone-shaped side surface. In the intermediate stem portion 29b, the inclined surface reflects light from the light emitting module 15 toward the base 26 side. The illuminating device 20a can reflect the light transmitted through the multilayer substrate 1 and emitted from the second surface 1ab side of the multilayer substrate 1 by the inclined surface of the intermediate stem portion 29b. The illuminating device 20a can adjust the light distribution of the reflected light reflected by the inclined surface by appropriately changing the inclination angle of the inclined surface of the intermediate stem portion 29b. In addition, the illuminating device 20a may paint the inclined surface of the intermediate stem part 29b in white. Moreover, the illuminating device 20a is not restricted to what is white-coated on the inclined surface of the intermediate stem part 29b, You may provide the reflective surface mirror-finished by the surface grinding | polishing process etc. The illuminating device 20a may function as a reflecting surface that performs desired light distribution control in the same manner as the stem 29 by providing an inclination on the surface of the support member 22c on the stem 29 side or performing a surface polishing finish. Good.

The illuminating device 20a of this embodiment fixes the multilayer substrate 1 and the mounting member 21 of the first stem portion 29a with an adhesive (not shown) applied to the second surface 1ab of the multilayer substrate 1. Yes. As the adhesive, for example, an adhesive made of a silicone resin can be used. The lighting device 20a preferably uses an adhesive having a high thermal conductivity so that the adhesive efficiently conducts heat of the light emitting module 15 to the stem 29. For example, the lighting device 20a can increase the thermal conductivity of the adhesive by using an adhesive in which metal fine particles are dispersed in a silicone resin. The lighting device 20a does not necessarily need to adhere the multilayer substrate 1 and the mounting member 21 of the first stem portion 29a with an adhesive. For the lighting device 20a, for example, an adhesive sheet in which an adhesive is applied to both sides can be used. The illuminating device 20a may be configured such that an adhesive sheet is disposed between the mounting member 21 of the first stem portion 29a and the second surface 1ab of the multilayer substrate 1. For the lighting device 20a, an adhesive sheet in which a thermally conductive filler such as alumina, silica or titanium oxide is filled in an epoxy resin and formed into a semi-cured sheet can be suitably used.

The support member 22 c is a member that is connected to the opening end 23 c of the opening 23 aa of the globe 23 and supports the stem 29. The support member 22c is configured to close the opening 23aa of the globe 23. The support member 22c is fitted and fixed to the case 22. The support member 22c can be made of, for example, a metal material or an inorganic material such as ceramic. The support member 22 c is made of the same material as the stem 29.

The support member 22c is formed of a circular plate-like member, and includes a first support portion 22c1 and a second support portion 22c2. In the support member 22c, the diameter of the second support portion 22c2 is larger than the diameter of the first support portion 22c1. As illustrated in FIG. 17, the lighting device 20a includes a step portion 22c3 between the peripheral edge portion of the first support portion 22c1 and the peripheral edge portion of the second support portion 22c2. In addition, the illuminating device 20a of this embodiment forms the 1st support part 22c1 and the 2nd support part 22c2 integrally. The first support portion 22 c 1 fixes the second stem portion 29 c of the stem 29. Further, the inner surface of the case 22 is in contact with the side surface of the second support portion 22c2 in the second support portion 22c2. The step portion 22c3 comes into contact with the opening end 23c of the opening 23aa of the globe 23. The lighting device 20a closes the opening 23aa of the globe 23 by the second support portion 22c2. In the illumination device 20a, the support member 22c, the case 22, and the opening end 23c of the opening 23aa of the globe 23 are fixed to each other at the step portion 22c3 by an adhesive 23b. The adhesive 23b is provided so as to fill the stepped portion 22c3. In the lighting device 20a, for example, a silicone resin can be used as the adhesive 23b for fixing the globe 23 and the like. In order to increase the thermal conductivity of the adhesive 23b, for example, metal fine particles may be dispersed in a silicone resin.

The case 22 is an insulating case that electrically insulates the stem 29 and the base 26 and accommodates the lighting circuit portion 24. The case 22 includes a cylindrical first case portion 22d and a cylindrical second case portion 22e. In the first case portion 22d, the inner diameter of the first case portion 22d is slightly larger than the outer diameter of the second support portion 22c2 of the support member 22c. The first case portion 22d fits and fixes the support member 22c. The second case portion 22 e is configured so that the outer peripheral surface of the second case portion 22 e is in contact with the inner peripheral surface of the base 26. The second case portion 22e includes a screw portion 25a1a in which the outer peripheral surface of the second case portion 22e is screwed with the base 26. The second case portion 22e is in contact with the base 26 by the screw portion 25a1a of the second case portion 22e.

The case 22 is formed by integrally injection-molding the first case portion 22d and the second case portion 22e. The case 22 can be formed of, for example, polybutylene terephthalate (PBT) containing glass fiber.

The power supply line 25 c can hold the light emitting module 15 at a certain position in the globe 23 and supply power supplied from the base 26 to the light emitting unit 2. As shown in FIG. 16, the power supply line 25c has one end of each power supply line 25c electrically connected to the external connection terminal 4e or the external connection terminal 4f of the light emitting module 15 by solder or the like. Further, the power supply line 25 c is electrically connected to the lighting circuit unit 24 at the other end of each power supply line 25 c. For example, the power supply line 25c can be made of a metal wire containing Cu having a high thermal conductivity.

The lighting circuit unit 24 is a circuit for lighting the light emitting element 3 of each light emitting unit 2 and is suitably stored in the case 22. The lighting circuit unit 24 includes a plurality of electronic components 28 and a circuit board 27 on which the electronic components 28 are mounted. The lighting circuit unit 24 converts the AC power received from the base 26 into DC power, and supplies the DC power to the light emitting element 3 of the light emitting unit 2 through the feeder line 25c.

The lighting circuit unit 24 is electrically connected to the base 26. In the lighting circuit unit 24, one of the input terminals of the lighting circuit unit 24 is electrically connected to the shell portion 26 a 1 on the side surface of the base 26. Further, the lighting circuit portion 24 is electrically connected to the eyelet portion 26 a 2 at the bottom of the base 26 at the other input terminal of the lighting circuit portion 24.

In the light emitting module 15 of the lighting device 20a of this embodiment, the first light emitting unit 2a having the largest number of light emitting elements 3 is formed on the multilayer substrate 1 more than the wiring unit 4a and the conductor unit 4c to which the second light emitting unit 2b is connected. It is electrically connected to the wiring portion 4a provided at a position away from the first surface 1aa. Thereby, the illuminating device 20a of this embodiment can make a light output higher. Moreover, the illuminating device 20a can obtain the light distribution characteristic approximate to an incandescent lamp. In addition, the illuminating device 20a of this embodiment is not only provided with the light emitting module 15, but also the light emitting module 10, the light emitting module 11, the light emitting module 12, the light emitting module 13, and the light emitting module 14 described in the first to fifth embodiments. May be provided.

(Embodiment 7)
The lighting device 20b of this embodiment shown in FIG. 18 includes a plurality of light emitting modules 16 having the same configuration as the light emitting module 11 of Embodiment 2 of FIG. 5 to form a straight tube LED lamp. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 2, and description is abbreviate | omitted suitably.

The illumination device 20b of the present embodiment is a straight tube LED lamp whose outer shape is substantially the same as that of a straight tube fluorescent lamp using an electrode coil, as shown in FIGS. The lighting device 20b of this embodiment includes a light emitting module 16. In FIG. 18, a part of the housing 20a1 is cut away to show the inside of the lighting device 20b.

The lighting device 20b of the present embodiment includes a housing 20a1, a pair of bases 26d, a pair of base pins 26c protruding from the bases 26d, and a plurality of elongated light emitting modules 16. The housing 20a1 is a hollow envelope for housing the LED module. In the lighting device 20b of the present embodiment, the outer shape of the housing 20a1 is a long cylindrical shape. The housing 20a1 includes a translucent cover 23d and a base 22f. The casing 20a1 has openings at both ends of the cylinder that are formed by combining the cover 23d and the base 22f. The cover 23d can be made of a light-transmitting plastic, for example. Note that the cover 23d is not limited to plastic made of the material of the cover 23d, and acrylic resin, polycarbonate resin, glass, or the like may be used.

The cover 23d has the same outer shape of the cover 23d from one end to the other end in the longitudinal direction of the cover 23d. The base 22f has the same outer shape of the base 22f from one end to the other end in the longitudinal direction of the base 22f. The cover 23d is configured to cover a plurality of long light emitting modules 16. As shown in FIGS. 19 and 20, the cover 23 d has a substantially arc shape in cross section. The cover 23d preferably includes a light diffusion portion on the outer surface or the inner surface of the cover 23d.

The illuminating device 20b can diffuse the light emitted from each light emitting unit 2 of the light emitting module 16 by the light diffusing unit of the cover 23d. The illuminating device 20b can form a light-diffusion part by apply | coating a silica, calcium carbonate, etc. to the inner surface of the cover 23d, for example. Moreover, the illuminating device 20b can also form a light-diffusion part by using resin materials, such as a polycarbonate which disperse | distributed the diffusion material to the material of the cover 23d. Furthermore, the illuminating device 20b may form a light diffusing part by forming grooves or the like on the inner surface, outer surface, or both surfaces of the cover 23d to provide unevenness.

The base 22f has a mounting member 21 on which the light emitting module 16 is mounted. The mounting member 21 extends along the longitudinal direction of the housing 20a1. In the illumination device 20b of the present embodiment, a plurality of light emitting modules 16 are linearly mounted on the mounting member 21 of the base 22f along the longitudinal direction of the housing 20a1. The illuminating device 20b fixes the plurality of light emitting modules 16 to the mounting member 21 with an adhesive (not shown). The illumination device 20b is not limited to the one that fixes each light emitting module 16 with an adhesive, and may be one that is fixed to the mounting member 21 with a screw member or the like.

The lighting device 20b of the present embodiment uses the same configuration as the light emitting module 11 of the second embodiment shown in FIG. The light emitting module 16 includes the multilayer substrate 1 and the light emitting unit 2. The multilayer substrate 1 has a long shape extending in the longitudinal direction of the housing 20a1. In the light emitting module 16, the light emitting unit 2 is provided up to both end edges in the longitudinal direction of the multilayer substrate 1 on the first surface 1aa of the multilayer substrate 1.

The lighting device 20b has a plurality of light emitting modules 16 arranged in a housing 20a1. In the lighting device 20b, the multilayer substrate 1 of the light emitting module 16 is disposed in the housing 20a1. The lighting device 20 b electrically connects the external connection terminal 4 e of one light emitting module 16 and the external connection terminal 4 f of the other light emitting module 16 among the adjacent light emitting modules 16. In addition, the lighting device 20 b electrically connects the external connection terminal 4 f of one light emitting module 16 and the external connection terminal 4 e of the other light emitting module 16 among the adjacent light emitting modules 16. The illumination device 20b is electrically connected in series for each of the two or more light emitting units 2 in the plurality of light emitting modules 16. In addition, the illuminating device 20b can electrically connect the adjacent light emitting module 16 with conductive members, such as a lead wire which consists of conducting wires with an insulating film, for example. Further, the lighting device 20 b may be electrically connected in parallel for each of the two or more types of light emitting units 2 in the plurality of light emitting modules 16.

The lighting device 20b of the present embodiment includes a pair of caps 26d at both ends of the housing 20a1. The base 26d has a bottomed cylindrical shape that closes the opening of the housing 20a1. The base 26d projects a pair of base pins 26c. The base pin 26c can be made of a conductive metal. The lighting device 20b is appropriately provided with a lighting circuit unit (not shown) inside or outside the housing 20a1. In the illuminating device 20b, the lighting circuit unit is capable of emitting two or more types of light emitting units 2 separately by receiving power from one of the pair of caps 26d. In addition, in the illuminating device 20b, the lighting circuit unit may receive two or more types of light emitting units 2 to emit light separately from each other by receiving power from both of the pair of caps 26d. When the lighting device 20b supplies power to the light emitting module 16 by using one of the caps 26d, the other cap 26d of the pair of caps 26d can function as an earth terminal. .

The base 22f of the housing 20a1 can be made of Al, for example. As shown in FIG. 20, the base 22f suitably includes two engaging portions 22f1 at positions symmetrical with respect to the central axis along the longitudinal direction of the housing 20a1. The engagement portion 22f1 can be configured by a portion where each of two end portions in the short direction of the base 22f is bent inward of the housing 20a1. The engaging portion 22f1 can have a C-shape, for example, as the shape of the engaging portion 22f1. The cover 23d can be configured to include a bent portion 23d1 in which an end portion of the cover 23d is bent into a substantially arc shape. The bent portion 23d1 is a portion where an end portion in the short direction of the cover 23d is bent toward the inside of the cover 23d.

The lighting device 20b is configured such that the bent portion 23d1 of the cover 23d and the engaging portion 22f1 of the base 22f are engaged with each other. The housing 20a1 The housing 20a1 can be configured such that the cover 23d and the base 22f are integrated by engaging the bent portion 23d1 of the cover 23d and the engaging portion 22f1 of the base 22f. The illuminating device 20b suitably includes a guide portion 23d2 in the cover 23d. The guide portion 23d2 can guide the bent portion 23d1 when the bent portion 23d1 of the cover 23d is inserted into the engaging portion 22f1 of the base 22f. Specifically, the illumination device 20b includes guide portions 23d2 in the vicinity of each end portion in the short direction of the cover 23d. The guide portion 23d2 is configured to extend along the longitudinal direction of the housing 20a1 and the housing 20a1. The guide portion 23d2 is configured to cover the engaging portion 22f1 in the longitudinal direction of the cover 23d.

In the light emitting module 16 of the lighting device 20b of this embodiment, the first light emitting unit 2a having the largest number of light emitting elements 3 is formed on the multilayer substrate 1 more than the wiring unit 4a and the conductor unit 4c to which the second light emitting unit 2b is connected. It is electrically connected to the wiring portion 4a provided at a position away from the first surface 1aa. Thereby, the illuminating device 20b of this embodiment can make a light output higher. Moreover, the illuminating device 20b can be used for the same illumination use as the existing straight tube fluorescent lamp. In addition, the illuminating device 20b of this embodiment is not only provided with the light emitting module 16, but also the light emitting module 10, the light emitting module 11, the light emitting module 12, the light emitting module 13, and the light emitting module 14 described in the first to sixth embodiments. Or a light emitting module 15.

(Embodiment 8)
The illuminating device 20c of this embodiment shown in FIG. 21 is provided with the light emitting module 10 of Embodiment 1 shown in FIG.

Referring to FIGS. 21 to 24, the illuminating device 20c of the present embodiment constitutes an LED lamp having a disc shape as a whole and having a GH76p-type base in Japanese Industrial Standards. The lighting device 20 c includes a light emitting module 10, a mounting member 21 on which the light emitting module 10 is mounted, and a case 22 that stores the mounting member 21. The lighting device 20c has a configuration in which the opening of the lighting device 20c is closed with a cover 23d, but the cover 23d is a light-transmitting member so that the inside of the case 22 can be seen through.

The illumination device 20c includes five through holes 26h1a to 26h1e in the case 22, as shown in FIG. In the illumination device 20c, a connection pin 26pa for electrical connection to the outside is inserted into the through hole 26h1a. In the lighting device 20c, a connection pin 26pb for electrical connection to the outside is inserted into the through hole 26h1b. In the lighting device 20c, the connection pin 26pa is inserted into the through hole 26h1a, and the connection pin 26pb is inserted into the through hole 26h1b. Similarly, in the lighting device 20c, connection pins (not shown) are inserted into the through holes 26h1c to 26h1e, respectively. The connection pin 26pa and the connection pin 26pb are power supply pins. The illuminating device 20c has a configuration in which a connection pin inserted into the through hole 26h1c and a connection pin inserted into the through hole 26h1d can be used as dimming pins. Moreover, the illuminating device 20c uses the connection pin inserted in the through-hole 26h1e as a grounding pin. The lighting device 20c may be configured not to include the through hole 26h1c and the through hole 26h1d when the light control of the light emitting module 10 is not performed.

The illumination device 20c includes a heat conductive sheet 21e between the light emitting module 10 and the mounting member 21, as shown in FIG. The heat conductive sheet 21 e can thermally connect the multilayer substrate 1 and the mounting member 21. The heat conductive sheet 21e functions as a heat-conductive sheet that efficiently transfers heat from the multilayer substrate 1 of the light emitting module 10 to the mounting member 21 to dissipate heat. For example, a silicone rubber sheet or an acrylic sheet can be used as the heat conductive sheet 21e. Moreover, the illuminating device 20c is suitably equipped with the heat conductive sheet 21h arrange | positioned between the mounting member 21 and the external installation surface. The heat conductive sheet 21h functions as a heat conductive sheet that releases heat from the light emitting module 10 transmitted through the mounting member 21 to the external installation surface side. For example, a silicone rubber sheet or an acrylic sheet can be used as the heat conductive sheet 21h.

The lighting device 20c includes a fixing screw 22g for fixing the mounting member 21 and the case 22 as shown in FIG. The illuminating device 20 c includes a reflecting mirror 22 h that is housed in the case 22 and reflects light from the light emitting module 10. The illuminating device 20c includes a circuit board 27 that is housed in the case 22 and disposed on the periphery of the reflecting mirror 22h. The lighting device 20 c includes a translucent cover 23 d that closes the opening of the case 22.

The mounting member 21 functions as a member that is fixed to the external installation surface side. More specifically, the illuminating device 20c can be attached to the external installation surface side, for example, by forming a GH76p-type base on the placement member 21. The mounting member 21 is a pedestal to which the multilayer substrate 1 of the light emitting module 10 is attached, and is disposed on the side opposite to the light emitting side of the light emitting module 10. The mounting member 21 can be made of a material having high thermal conductivity such as Al, for example.

The case 22 is a cylindrical casing that has an opening on the light emitting side and surrounds the light emitting module 10. The illuminating device 20c fixes the case 22 to the mounting member 21 with fixing screws 22g. The illumination device 20 c has a cover 23 d attached to the case 22. In the lighting device 20 c, the heat conductive sheet 21 e, the light emitting module 10, the circuit board 27, and the reflecting mirror 22 h are disposed inside the case 22. The case 22 can be formed of a resin housing made of a synthetic resin having insulating properties such as PBT (polybutylene terephthalate).

In the lighting device 20c, the power connection pin 26pa and the connection pin 26pb receive AC power, and the received AC power is input to the circuit board 27 via a lead wire (not shown). The circuit board 27 mounts an electronic component (not shown) and constitutes a lighting circuit unit for lighting two or more light emitting units 2 of the light emitting module 10 separately. The circuit board 27 has an annular shape in which a circular opening is formed, and is configured to be disposed on the outer periphery of the reflecting mirror 22h. In the lighting device 20c, a circuit board 27 on which electronic components are mounted is disposed in the space inside the case 22 and on the outer periphery of the reflecting mirror 22h.

The reflecting mirror 22h is arranged so that the light from each light emitting unit 2 in the light emitting module 10 can be efficiently emitted to the outside. The reflecting mirror 22h is an optical member made of a material having a high reflectance with respect to light emitted from the light emitting unit 2. The reflecting mirror 22h is disposed inside the case 22 and has a cylindrical shape formed so that its diameter gradually increases toward the cover 23d. For the reflecting mirror 22h, polycarbonate can be preferably used as the material of the reflecting mirror 22h. The reflecting mirror 22h can also coat the inner surface of the reflecting mirror 22h with a reflecting film in order to improve the reflectance with respect to the light from the light emitting module 10.

The cover 23d is preferably provided to protect the light emitting module 10 and the like disposed inside the case 22. The cover 23d can have a flat plate shape attached to the case 22. The cover 23d may be appropriately fixed to the case 22 with an adhesive, a plurality of rivets, screws, or the like so as to close the opening formed on the light emitting side of the case 22. The cover 23d can be made of a synthetic resin material such as a polycarbonate resin so that the light from the light emitting portion 2 can be efficiently transmitted.

In the light emitting module 10 of the lighting device 20c of this embodiment, the first light emitting unit 2a having the largest number of light emitting elements 3 is formed on the multilayer substrate 1 more than the wiring unit 4a and the conductor unit 4c to which the second light emitting unit 2b is connected. It is electrically connected to the wiring portion 4a provided at a position away from the first surface 1aa. Thereby, the illuminating device 20c of this embodiment can make a light output higher. Moreover, the illuminating device 20c of this embodiment can implement | achieve the disk-shaped illuminating device 20c which can be attached or detached to the lighting fixture which is not shown in figure with a nozzle | cap | die. In addition, the illuminating device 20c of this embodiment is not only provided with the light emitting module 10, but also the light emitting module 11, the light emitting module 12, the light emitting module 13, the light emitting module 14, and the light emitting module 15 described in the second to seventh embodiments. Or a light emitting module 16.

(Embodiment 9)
A lighting device 20d according to the present embodiment illustrated in FIG. 25 includes the light emitting module 10 according to the first embodiment illustrated in FIG. A lighting fixture 30 including the lighting device 20d of the present embodiment includes a light emitting module 10 and a fixture main body 33 having the light emitting module 10.

The lighting fixture 30 provided with the lighting device 20d of the present embodiment constitutes a downlight that is attached so as to be embedded in the ceiling material 90, as shown in FIG. The lighting fixture 30 is housed inside the fixture main body 33, the lighting circuit unit 34 housed inside the fixture main body 33, and inside the fixture main body 33, and emits illumination light to the outside of the fixture main body 33. The illumination device 20d shown in FIG.

The lighting circuit unit 34 can be configured by a circuit including an AC / DC converter, for example. The lighting circuit unit 34 converts an alternating current from an external alternating current power source into a direct current, and can supply power to each of the two or more types of light emitting units 2 of the light emitting module 10. An example of the external AC power supply is a commercial AC power supply. In addition, the lighting fixture 30 may be equipped with the light control unit 35 which adjusts the illumination light from the illuminating device 20d outside.

In the lighting fixture 30, the fixture body 33 includes a bottomed cylindrical lamp housing portion 33a that houses the lighting device 20d, and a bottomed cylindrical circuit that is provided on the opposite side of the lamp housing portion 33a and houses the lighting circuit unit 34. The housing portion 33b is integrally provided. The fixture body 33 includes an annular outer flange portion 33c extending outward from the opening of the lamp housing portion 33a. The instrument body 33 can be made of, for example, a metal material. The lamp housing portion 33a of the fixture body 33 is configured such that the lighting device 20d is directly attached to the inner bottom surface of the lamp housing portion 33a and cannot be removed. The bottomed cylindrical circuit housing portion 33b uses a common plate material on the inner bottom surface of the bottomed cylindrical lamp housing portion 33a, and houses the lighting circuit unit 34 on the inner bottom surface of the circuit housing portion 33b.

In the lighting fixture 30, the lamp housing portion 33 a and the circuit housing portion 33 b of the fixture body 33 are embedded in an embedded hole 90 c penetrating the ceiling material 90, and the outer flange portion 33 c is surrounded by the embedded hole 90 c in the ceiling material 90. It is attached to the ceiling material 90 in a state of being in contact with the portion.

The lighting circuit unit 34 incorporates a circuit for lighting the light emitting module 10 housed in the lighting device 20d. The lighting circuit unit 34 includes a power supply line 34a that is electrically connected to the lighting device 20d. The power supply line 34a includes a connector 34b that is detachably connected to a connector 26e2 provided on the lead wire 26e1 of the lighting device 20d at the tip of the power supply line 34a.

The lighting fixture 30 includes a lighting device 20d. As shown in FIGS. 26 and 27, the lighting device 20d is configured by incorporating the light emitting module 10 shown in FIG. 3 into the lighting device 20d. The illumination device 20d is a unit that does not include a power supply circuit that supplies power to the light emitting module 10. The lighting device 20d includes a base 22f on which the light emitting module 10 is mounted, a holder 22j that fixes the light emitting module 10 to the base 22f side, and a decorative cover 22m that covers the holder 22j. The lighting device 20 d includes a cover 23 d that transmits light from the light emitting module 10, a cover pressing member 22 n that presses the cover 23 d toward the base 22 f, and a wiring member 26 e that supplies power to the light emitting module 10.

The base 22f is a disk-shaped body made of aluminum die casting, and has a mounting member 21 at the center. The base 22 f places the light emitting module 10 on the placement member 21. The base 22f is provided with screw holes 22f2 on both sides of the mounting member 21 for screwing an assembly screw 22k for fixing the holder 22j. The base 22f has an insertion hole 22f3 through which a mounting screw (not shown) is inserted along the peripheral portion of the base 22f in order to attach the base 22f to the lighting fixture 30 side. The base 22f is provided with a boss hole 22f4 into which the boss 22n1 of the cover pressing member 22n is inserted, and a notch 22f5 through which the lead wire 26e1 is led out of the lighting device 20d along the peripheral portion of the base 22f. .

The holder 22j has a bottomed cylindrical shape, and includes a disc-shaped presser plate portion 22j1 and a cylindrical peripheral wall portion 22j2 extending from the periphery of the presser plate portion 22j1 to the base 22f side. The holder 22j is a pressing plate portion 22j1 of the holder 22j and presses and fixes the light emitting module 10 to the mounting member 21 side of the base 22f. The pressing plate portion 22j1 includes a window hole 22j3 that allows light from the light emitting module 10 to pass through a central portion of the pressing plate portion 22j1. The pressing plate portion 22j1 communicates with the window hole 22j3 and includes an opening portion 22j4. The opening 22j4 of the pressing plate portion 22j1 suppresses interference between the lead wire 26e1 connected to the light emitting module 10 and the pressing plate portion 22j1. The holder 22j is provided with an insertion hole 22j5 through which the assembly screw 22k is inserted so as to penetrate at a position corresponding to the screw hole 22f2 of the base 22f in the peripheral portion of the pressing plate portion 22j1.

When attaching the holder 22j to the base 22f, the lighting device 20d has the light emitting module 10 with the holder 22j and the base 22f in a state in which two or more types of light emitting portions 2 of the light emitting module 10 are exposed from the window hole 22j3 of the holder 22j. Pinch. The illuminating device 20d attaches the holder 22j to the base 22f by passing the assembly screw 22k through the screw insertion hole 22j5 and screwing it into the screw hole 22f2 of the base 22f via the pressing plate portion 22j1 of the holder 22j.

The decorative cover 22m has an annular shape and is disposed between the holder 22j and the cover 23d. The decorative cover 22m can be formed of a white opaque resin or the like that is a non-translucent material. The decorative cover 22m covers and hides the lead wire 26e1, the assembly screw 22k, and the like that come out of the opening 22j4 from the outside of the lighting device 20d. The decorative cover 22m includes a window hole 22m1 that emits light from the light emitting module 10 at the center of the decorative cover 22m.

The cover 23d has a dome shape and includes a main body 23d3 having a lens function and an outer flange 23d4 provided to extend outward from the peripheral edge of the main body 23d3. The cover 23d has an outer flange 23d4 fixed to the base 22f. The cover 23d is made of a translucent material such as silicone resin, acrylic resin, or glass. In the illumination device 20d, the light from the light emitting module 10 passes through the cover 23d and is extracted to the outside.

The cover pressing member 60 presses the cover 23d toward the base 22f, and has a circular plate shape so as not to block light emitted from the main body 23d3 of the cover 23d. The cover 23d is fixed with the outer flange portion 23d4 sandwiched between the cover pressing member 22n and the base 22f. The cover pressing member 22n can be formed using a non-translucent material such as a metal such as Al or a white opaque resin.

The cover pressing member 22n is provided with a cylindrical boss portion 22n1 that protrudes toward the base 22f. The cover 23d includes a semicircular cutout portion 23d5 at the position of the outer flange portion 23d4 of the cover 23d corresponding to the boss portion 22n1 of the cover pressing member 22n. The base 22f is provided with a boss hole 22f4 through which the boss 22n1 passes at the peripheral edge of the base 22f corresponding to the boss 22n1 of the cover pressing member 22n.

When the cover pressing member 22n is fixed to the base 22f, the lighting device 20d passes the boss portion 22n1 of the cover pressing member 22n through the boss hole 22f4 of the base 22f. The lighting device 20d plastically deforms the distal end portion of the boss portion 22n1 that has passed through the base 22f into a shape that does not come out of the boss hole 22f4. The lighting device 20d fixes the cover pressing member 22n and the base 22f by plastically deforming the distal end portion of the boss portion 22n1.

The lighting device 20d includes a semicircular cutout 22n2 at the peripheral edge of the cover pressing member 22n corresponding to the insertion hole 22f3 of the base 22f. In the illumination device 20d, the notch 22n2 prevents the mounting screw passed through the insertion hole 22f3 of the base 22f from hitting the cover pressing member 22n. Similarly, the illuminating device 20d includes a semicircular cutout portion 23d6 at the peripheral edge portion of the outer flange portion 23d4 of the cover 23d corresponding to the insertion hole 22f3 of the base 22f. In the illumination device 20d, the notch 23d6 prevents the mounting screw inserted into the insertion hole 22f3 of the base 22f from hitting the cover 23d.

The wiring member 26e has a set of lead wires 26e1 electrically connected to the light emitting module 10. The lead wire 26e1 goes out of the lighting device 20d through the notch 22f5 of the base 22f, and a connector 26e2 is attached to the end of the lead wire 26e1. In the light emitting module 10, the external connection terminal 4e and the external connection terminal 4f of the light emitting module 10 and the lead wire 26e1 are electrically connected to each other by soldering or the like.

In the light emitting module 10 of the lighting fixture 30 and the lighting device 20d of the present embodiment, the first light emitting unit 2a having the largest number of light emitting elements 3 is more than the wiring unit 4a and the conductor unit 4c to which the second light emitting unit 2b is connected. The multilayer substrate 1 is electrically connected to a wiring portion 4a provided at a position away from the first surface 1aa. Thereby, the lighting fixture 30 and the lighting device 20d of the present embodiment can further increase the light output. Note that the lighting fixture 30 and the lighting device 20d of the present embodiment are not only provided with the light emitting module 10, but also the light emitting module 11, the light emitting module 12, the light emitting module 13, and the light emitting module 14 described in the second to seventh embodiments. The light emitting module 15 and the light emitting module 16 may be provided.

The lighting device 20d of the present embodiment can realize a smaller lighting device 20d without incorporating a lighting circuit unit. The light emitting module 10 is not limited to being incorporated in the lighting fixture 30 as the lighting device 20d, and may be incorporated in the fixture main body 33 as it is.

Further, the lighting fixture 30 is not limited to a downlight, but may be a ceiling light or a base light. The lighting fixture 30 may include, for example, a lighting device having the same structure as the lighting device 20, the lighting device 20a, the lighting device 20b, and the lighting device 20c described in the fifth to eighth embodiments.

As mentioned above, although the structure of this invention was demonstrated based on the above-mentioned embodiment, this invention is not restricted only to the example of the above-mentioned embodiment. The present invention may be, for example, another configuration obtained by appropriately combining the partial configurations of the above-described embodiments. Moreover, in this invention, the material, the numerical value, etc. which were described in the said embodiment only illustrated what is preferable, and is not limited to this. Therefore, the present invention is not limited to the specific examples described in the above embodiments. Furthermore, the present invention can be modified as appropriate to the configuration of the present embodiment without departing from the scope of the technical idea of the present invention. The present invention can be widely used in general lighting applications.

While several preferred embodiments of the present invention have been described above, various modifications and variations can be made by those skilled in the art without departing from the true spirit and scope of the present invention, that is, the claims.

Claims (9)

  1. A wiring portion having a predetermined shape provided between layers of a plurality of insulating layers, a through-wiring that penetrates the insulating layer and is electrically connected to the wiring portion, and one surface side that is electrically connected to the through-wiring A light emitting module comprising: a multilayer substrate having a conductor portion of a predetermined shape provided on the substrate; and a plurality of types of light emitting portions that are provided on the one surface side of the multilayer substrate and emit light by power feeding through the conductor portion. There,
    The light emitting unit includes at least one light emitting element, and the first light emitting unit having the largest number of the light emitting elements among the plurality of types of the light emitting units is more than the first light emitting unit. It is electrically connected to the wiring part provided at a position farther from the one surface than the wiring part and the conductor part to which the second light emitting part with a small number of light emitting elements is connected. Light emitting module.
  2. The light emitting module according to claim 1, wherein the first light emitting unit emits red light.
  3. 3. The light emitting module according to claim 1, wherein the second light emitting unit includes a green light emitting unit that emits green light and a white light emitting unit that emits white light.
  4. The first light emitting unit includes a light emitting element that emits blue light and a phosphor that absorbs blue light emitted from the light emitting element and emits red light, and the green light emitting unit of the second light emitting units. Has a light emitting element that emits blue light and a phosphor that absorbs blue light emitted from the light emitting element and emits green light, and among the second light emitting parts, the white light emitting part is blue light. And a phosphor that absorbs blue light emitted from the light emitting element and emits red light, and a phosphor that absorbs blue light emitted from the light emitting element and emits green light. The light emitting module according to claim 3.
  5. The light emitting module according to claim 3 or 4, wherein the green light emitting part and the white light emitting part are electrically connected to the wiring part provided between different layers of the insulating layer.
  6. The said green light emission part and the said white light emission part are electrically connected separately by the said wiring part provided in the same interlayer of the said insulating layer, The Claim 3 or Claim 4 characterized by the above-mentioned. Light emitting module.
  7. The multilayer substrate covers a part of the conductor part with a reflective film having a higher reflectance than the conductor part with respect to light emitted from the light emitting part, and the conductor part is connected to the outside. 7. The device according to claim 1, further comprising a connection terminal and a connection portion connected to the light emitting portion, wherein the connection portion and the external connection terminal are exposed from the reflective film. The light emitting module according to 1.
  8. An illuminating device comprising the light emitting module according to any one of claims 1 to 7.
  9. A lighting fixture comprising: the light emitting module according to any one of claims 1 to 7; and a fixture main body having the light emitting module.
PCT/JP2013/006180 2012-11-20 2013-10-18 Light emitting module, lighting apparatus, and lighting equipment WO2014080567A1 (en)

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JP2017063073A (en) * 2015-09-24 2017-03-30 東芝ライテック株式会社 Light emitting device and luminaire
JP2017063072A (en) * 2015-09-24 2017-03-30 東芝ライテック株式会社 Light emitting device and luminaire
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JP2014103261A (en) 2014-06-05
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