WO2014063891A1 - Led lighting module and luminaire - Google Patents

Led lighting module and luminaire Download PDF

Info

Publication number
WO2014063891A1
WO2014063891A1 PCT/EP2013/069886 EP2013069886W WO2014063891A1 WO 2014063891 A1 WO2014063891 A1 WO 2014063891A1 EP 2013069886 W EP2013069886 W EP 2013069886W WO 2014063891 A1 WO2014063891 A1 WO 2014063891A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
circuit board
lighting module
led lighting
formed
Prior art date
Application number
PCT/EP2013/069886
Other languages
French (fr)
Inventor
Jie Tan
Yuanyuan He
Yaojun Feng
Hua Wang
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201210414030.8 priority Critical
Priority to CN201210414030.8A priority patent/CN103775860A/en
Application filed by Osram Gmbh filed Critical Osram Gmbh
Publication of WO2014063891A1 publication Critical patent/WO2014063891A1/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/04Provision of filling media
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The present invention relates to an LED lighting module (200) and a luminaire. The LED lighting module comprises a circuit board (205) mounted with LED chips (207) and a housing (201), characterized in that the housing (201) comprises an annular side wall (2011) that defines openings at both ends, and the housing (201) is jointed with a surface (2051) of the circuit board (205) via one end surface (2013) of the annular side wall (2011) to define a cavity for accommodating a sealing material. According to the present invention, a structure that is simple and easy to joint and has a low cost can be provided.

Description

Description

LED Lighting Module and Luminaire Technical Field

The present invention relates to an LED lighting module and a luminaire .

Background Art

The LED luminaire, as a new light source, is widely used due to its advantages such as high efficiency, pure light color, low energy consumption, long service lifetime, reliability and durability, non-pollution and flexible control.

An LED lighting module usually demands IP (waterproof and dustproof) protection. When an IP protection is applied to the LED lighting module, a currently common method is to seal a solder pad and electronic components on a circuit board by potting a sealing material.

In reference to Fig. 1 and Fig. 2, a known LED lighting module 100 is shown. The LED lighting module 100 comprises a housing 101 and a circuit board 105. The housing 101 is formed into a cup shape opening at an upper end so as to form a cavity for accommodating a sealing material. LED chips 107 and other electronic components 109 to be sealed by the seal¬ ing material are arranged on the circuit board 105. In this known LED lighting module 100, the circuit board 105 and the housing 101 must be assembled together prior to the potting process. Such assembling is usually carried out through the following two methods: The first method is as shown in Fig. 1 and Fig. 2, that is, an adhesive 103 is coated on a whole bottom surface of the circuit board 105, and then the circuit board 105 is bonded to an inner bottom surface of the cavity of the housing 101, and further the sealing material is potted into the cavity of the housing 101 so as to realize sealing.

The second method is to form corresponding screw holes on the circuit board 105 and the housing 101, respectively, so that the circuit board 105 is fixed in the cavity of the housing 101 through screws.

The above known techniques at least have the following short¬ comings :

1. In order to form connection between the housing 101 and the circuit board 105, the housing 101 must be formed with a bottom wall, that is, the housing 101 is formed into the cup shape with the opening only at the upper end. The housing in such shape should be formed with many materials, and the cost is high;

2. As the connection is realized by placing the circuit board 105 in the cavity of the housing 101 in the known technique, the side wall of the housing 101 should be wider and higher so as to accommodate the circuit board 105 and the sealing material, so that many materials are needed and the cost is high; 3. In the known technique as shown in Fig. 1 and Fig. 2, a large-area adhesive 103 should be coated on the whole bottom surface of the circuit board 105 to realize joint with the housing 101, as a result, a large amount of adhesive is used, and the cost is high, moreover, the process of coating the adhesive and the bonding process are relatively complex; and

4. In the know technique of fixing with screws, the screw holes should be formed on the circuit board, while the cir¬ cuit board, on which circuits and electronic components are arranged, is easily damaged when the screw holes are opened; in addition, the screw holes should be opened and the screws should be installed with multiple dedicated means and a lot of manpower, and the processes are complex.

Summary of the Invention The object of the present invention lies in overcoming the defects in the prior art to provide an LED lighting module and a luminaire so as to provide a structure that is simple and easy to joint and has a low cost.

According to one aspect of the present invention, an LED lighting module is provided, comprising: a circuit board, LED chips mounted on a surface of the circuit board; and a hous¬ ing, the housing comprises an annular side wall that defines openings at both ends, and the housing is jointed with the surface of the circuit board via one end surface of the annu- lar side wall to define a cavity for accommodating a sealing material. As a result, the housing according to the present invention can be formed to be much smaller than that in the known art so as to save the material for forming the housing. In addition, the housing of the present invention can be jointed with the circuit board via one end surface of the an¬ nular side wall, so that it is unnecessary to coat a large- area adhesive on the whole bottom surface of the circuit board, saving the adhesive material and simplifying the proc¬ ess. Besides, the housing of the present invention avoids the material cost and the manpower cost needed by use of screws, as well as damage to the circuit board by opening the screw holes .

Preferably, the housing is jointed with the circuit board through a surface mount technology. Compared with the fasten- ing modes of using adhesive and screws in the known art, the surface mount technology is simple and practicable, and will not cause damage to the circuit board.

Preferably, a first solder pad is formed on the end surface of the housing, a second solder pad corresponding to the first solder pad is formed on the surface of the circuit board, and the housing and the circuit board are jointed to¬ gether via the first solder pad and the second solder pad. Via such joint formed by means of solder pads, stable connec¬ tion between the housing and the circuit board can be formed in a simple manner.

Preferably, the first solder pad is formed along the whole end surface of the housing. As a result, firm joint between the housing and the circuit board can be realized on the whole end surface, so that the finally formed LED lighting module is more reliable.

Preferably, the housing is formed through a molding process, so that the housing is formed in a simple manner.

Preferably, the housing is formed from a plastic material. The plastic material has good molding performances and has a low cost, and the whole LED lighting module can be further enabled to be manufactured in a simple and low-cost manner.

Preferably, the end surface of the housing is formed to be corresponding to edges of the whole circuit board. Accord- ingly, the annular side wall of the housing can enclose all LED chips and electronic components on the whole circuit board, thus, multiple parts to be sealed can be sealed through one-time potting. Preferably, the end surface of the housing is formed to only enclose a part of the circuit board to be sealed. Such hous¬ ing is particularly suited to the situation that there are only a small number of parts on the circuit board to be sealed, so that, on one hand, the housing can be made smaller to save the housing material, and on the other hand, the sealing material is saved as only a small amount of the seal¬ ing material needs to be potted to only enclose the parts to be sealed.

Preferably, the annular side wall of the housing is formed to have an annular cross section in a circular shape or a rectangular shape. Such annular side wall of the housing makes it more adapted to the shape of conventional circuit board, and the annular side wall in such shape has a regular shape and is easy to manufacture. According to the other aspect of the present invention, an LED luminaire is provided. The LED luminaire comprises the LED lighting module of any type according to the preceding.

Brief Description of the Drawings

The accompanying drawings constitute a part of the present Description and are used to provide further understanding of the present invention. Such accompanying drawings illustrate the embodiments of the present invention and are used to de¬ scribe the principles of the present invention together with the Description. In the accompanying drawings the same compo- nents are represented by the same reference numbers. As shown in the drawings :

Fig. 1 shows a cross section diagram of an LED lighting module according to the known art; Fig. 2 shows an exploded 3D diagram of the LED lighting module according to the known art;

Fig. 3 shows a 3D diagram of an LED lighting module according to one embodiment of the present invention;

Fig. 4 shows an exploded 3D diagram of an LED lighting module according to the embodiment of the present invention;

Fig. 5 shows a cross section diagram of an LED lighting module according to the embodiment of the present invention;

Fig. 6 is a 3D diagram of a circuit board of the LED lighting module according to the embodiment of the present invention; Fig. 7 is a 3D diagram of a housing of the LED lighting module according to the embodiment of the present invention; and

Fig. 8 is an enlarged 3D diagram of part A of the housing shown in Fig . 7.

Detailed Description of the Embodiments The present invention will be illustrated more comprehen¬ sively in reference to the figures of the exemplary embodi¬ ment of the present invention. However, the present invention may be implemented in multiple varied forms and should not be limited to constructions according to the exemplary embodi- ments illustrated herein. Of course, these exemplary embodi- ments are provided for making the present disclosure more comprehensive and complete, and can sufficiently convey the scope of the present invention to the person skilled in the art . Next, the present invention will be illustrated in detail in reference to Figs. 3-8.

As shown in Fig. 5, a cross section diagram of an LED lighting module 200 according to one embodiment of the present in¬ vention is shown. The LED lighting module 200 comprises a housing 201 and a circuit board 205. The circuit board 205 is mounted with LED chips 207 and other electronic components 209.

Further reference is made to Fig. 4, Fig. 6 and Fig. 7. The circuit board 205 is substantially formed into a quadrate shape, and the housing 201 comprises an annular side wall

2011. As viewed from the figures, upper and lower ends of the annular side wall 2011 are openings. In addition, the housing 201 is jointed with a surface 2051 of the circuit board 205 (i.e. a surface 2051 of the circuit board 205 mounted with the LED chips) via one end surface 2013 of the annular side wall 2011. After the housing 201 is jointed with the circuit board 205, a shape with one opening at the upper end as shown in Figs. 3 and 5 is formed, that is, the housing 201 and the circuit board 205 together enclose and form a cavity so that a sealing material can be potted into the cavity via the up¬ per opening of the cavity.

It should be noted that the annular side wall 2011 according to the present application means a hollow cylindrical body, while the shape of the annular side wall 2011 is not specifi- cally limited. For instance, the annular side wall 2011, as shown in Fig. 3, can be annular in a quadrate shape corre¬ sponding to the quadrate shape of the circuit board 205, and the annular side wall 2011 of the housing 201 also can be an¬ nular in other shapes, such as circular ring or polygonal an- nular shape. Selection of the shape of the annular side wall 2011 can be dependent upon the shape of the circuit board 205 to be jointed with according to requirement, or the selection of the shape of the annular side wall 2011 can be determined by the shape of the part it needs to enclose on the circuit board 205. Therefore, the shape of the annular side wall 2011 of the present application should not be limited to the shape shown .

Upon comparison of Fig. 5 of the embodiment of the present invention with Fig. 1 in the known art, the structure of the present invention at least can be found to have the following advantages :

The housing 101 in the prior art as shown in Fig. 1 presents a substantially cup shape with a bottom wall, and the purpose of forming such cup shape is, on one hand, placing the cir- cuit board 105 on the bottom wall thereof, and on the other hand, forming a cavity opening at one end to accommodate a sealing material. Thus, a material for forming the bottom wall is indispensable for manufacturing the housing 101 as shown in Fig. 1. But in the structure of the present inven- tion as shown in Fig. 5, a shape opening at both ends is formed, that is, the housing does not have the bottom wall as in Fig. 1, as a result, the material for forming the bottom wall is saved during the manufacture process, and the manu¬ facture of the housing can be simpler; Besides, the housing 101 in the known art as shown in Fig. 1 should accommodate the circuit board 105 therein, and then, a „

height of the housing 101 should be a sum of a height of the circuit board 105 and a height of the sealing material, more¬ over, a width of the housing 101 should be a sum of a width of the circuit board 105 and a thickness of the side wall of the housing 101. But in the structure of the present inven¬ tion as shown in Fig. 5, the housing 201 is jointed to an up¬ per surface of the circuit board 205 so that a height thereof is only formed to be equal to that of the sealing material, and a width of the housing also can be formed to be smaller than or equal to that of the circuit board 205. That is to say, the housing according to the embodiment of the present invention can be formed shorter and narrower than that in the know art as shown in Fig. 1, as a result, the material for forming the housing can be saved;

Furthermore, in the structure of the know art, as shown in Fig. 1 and Fig. 2, the whole bottom surface of the circuit board 105 should be coated with the adhesive 103 to realize joint with the housing 101, which obviously demands a large amount of adhesive. But in the structure according to the em¬ bodiment of the present invention as shown in Fig. 3, the housing 201 thereof is formed with the annular side wall 2011, and then, a joint portion 203 can be formed only along a small-area end portion of the annular side wall 2011, and thus, it is not necessary to coat a large-area adhesive on the whole bottom surface of the circuit board, saving the ma¬ terial for joint between the housing 201 and the circuit board 205 and simplifying the process;

Moreover, compared with the second know art of fixing with screws in the preceding, in the structure according to the embodiment of the present invention, the housing 201 of the present invention can be jointed with the surface of the cir¬ cuit board, which avoids damage to the circuit board due to opening of the screw holes and the complex processes of open¬ ing the screw holes and installing the screws, and saves the material cost and the manpower cost needed for installing the screws . Furthermore, according to the embodiment of the present in¬ vention, the housing 201 preferably can be jointed with the circuit board 205 through a surface mount technology. For in¬ stance, the joint can be realized with the following struc¬ ture: as shown in Fig. 6 and Fig. 7, a firs solder pad 2015 is formed on the end surface 2013 of the housing 201, a sec¬ ond solder pad 2053 corresponding to the first solder pad 2015 is formed on the surface 2051 of the circuit board 205, and the housing 201 and the circuit board 205 are jointed to¬ gether via the first solder pad 2015 and the second solder pad 2053 so that the joint portion 203 (see Fig. 3) is formed between the housing 201 and the circuit board 205. As shown in Fig. 6 and Fig. 7, the first solder pad 2015 can be formed along the whole end surface 2013 of the housing 201. Prefera¬ bly, as shown in Fig. 8, a shape of the first solder pad 2015 can be configured to substantially conform to a shape of the end surface 2013 of the annular side wall 2011 of the hous¬ ing. As a result, the housing can be well jointed with the circuit board 205 on the whole end surface such that the sealing effect of the finally formed LED lighting module can be further guaranteed.

The housing 201 can be formed through a molding process.

Preferably, the housing 201 can be made from a plastic mate¬ rial or other easily molded materials.

As shown in Figs. 3-5, the annular side wall 2011 of the housing 201 is formed to be corresponding to edges of the whole circuit board 205. Such housing 201 encloses in the cavity all the LED chips 207 and the electronic components 209 on the whole circuit board, so that all components formed on the circuit board 205 can be sealed when the sealing mate¬ rial is potted into the cavity, which can complete the seal- ing in a highly efficient manner.

Nevertheless, the annular side wall 2011 of the housing 201 is not limited to such structure. For example, the annular side wall 2011 of the housing 201 also can be formed to only enclose a part of the circuit board 205 to be sealed. For in- stance, modification is made to the housing as shown in Figs. 3-5 such that it only encloses the LED chips 207. Obviously, the modified housings are much smaller than the housing 201 enclosing the housing 201 of the whole circuit board 205 as shown in Figs. 3-5, so that the material needed for manufac- turing the housing can be saved. In addition, in this situation, as only the LED chips 207 are needed to be sealed, the amount of the sealing material to be potted is also appar¬ ently smaller than that demanded by the structure as shown in Figs. 3-5. That is to say, to form such housings that only enclose the part on the circuit board 205 to be sealed can greatly save the material needed for manufacturing the hous¬ ing as well as the amount of the sealing material.

The above is only preferred embodiments of the present inven¬ tion but not to limit the present invention. For the person skilled in the art, the present invention may have various alterations and changes. Any alterations, equivalent substi¬ tutions, improvements, within the spirit and principle of the present invention, should be covered in the protection scope of the present invention. List of reference signs

100 LED lighting module in known art

101 housing

103 adhesive

105 circuit board

107 LED chip

109 electronic component

200 LED lighting module according to the present invention

201 housing

203 joint portion

205 circuit board

207 LED chip

209 electronic component

2011 annular side wall

2013 end surface of housing

2015 first solder pad

2051 surface of circuit board

2053 second solder pad

Claims

Patent claims
An LED lighting module (200), comprising: a circuit board (205), LED chips (207) mounted on one surface (2051) of the circuit board (205); and a housing (201), characterized in that the housing (201) comprises an an¬ nular side wall (2011) that defines openings at both ends, and the housing (201) is jointed with the surface (2051) of the circuit board (205) via one end surface (2013) of the annular side wall (2011) to define a cav¬ ity for accommodating a sealing material.
The LED lighting module (200) according to Claim 1, characterized in that the housing (201) is jointed with the circuit board (205) through a surface mount technol¬ ogy.
The LED lighting module (200) according to Claim 2, characterized in that a first solder pad (2015) is formed on the end surface (2013) of the housing (201), a second solder pad (2053) corresponding to the first sol¬ der pad (2015) is formed on the surface (2051) of the circuit board (205), and the housing (201) and the cir¬ cuit board (205) are jointed together via the first sol¬ der pad (2015) and the second solder pad (2053) .
The LED lighting module (200) according to Claim 3, characterized in that the first solder pad (2015) is formed along the whole end surface (2013) of the housing (201) .
5. The LED lighting module (200) according to any of Claims 1-4, characterized in that the housing (201) is formed through a molding process.
6. The LED lighting module (200) according to any of Claims 1-4, characterized in that the housing (201) is formed from a plastic material.
7. The LED lighting module (200) according to any of Claims 1-4, characterized in that the end surface (2013) of the housing (201) is formed to be corresponding to edges of the whole circuit board (205) .
8. The LED lighting module (200) according to any of Claims 1-4, characterized in that the end surface (2013) of the housing (201) is formed to only enclose a part of the circuit board (205) to be sealed.
9. The LED lighting module (200) according to any of Claims 1-4, characterized in that the annular side wall (2011) of the housing (201) is formed to have an annular cross section in a circular shape or a rectangular shape.
10. An LED luminaire, characterized in that the LED lumi- naire comprises the LED lighting module (200) according to any of Claims 1-9.
PCT/EP2013/069886 2012-10-25 2013-09-24 Led lighting module and luminaire WO2014063891A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201210414030.8 2012-10-25
CN201210414030.8A CN103775860A (en) 2012-10-25 2012-10-25 LED light emitting module and lamp

Publications (1)

Publication Number Publication Date
WO2014063891A1 true WO2014063891A1 (en) 2014-05-01

Family

ID=49230803

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/069886 WO2014063891A1 (en) 2012-10-25 2013-09-24 Led lighting module and luminaire

Country Status (2)

Country Link
CN (1) CN103775860A (en)
WO (1) WO2014063891A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037221A1 (en) * 2005-09-27 2007-04-05 Sony Chemical & Information Device Corporation Functional element package and process for producing the same
US20070253209A1 (en) * 2006-04-27 2007-11-01 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
US20080054288A1 (en) * 2006-07-05 2008-03-06 Tir Technology Lp Lighting Device Package
US7446347B2 (en) * 2000-08-23 2008-11-04 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof, module and device comprising a module of this type
JP2009231525A (en) * 2008-03-24 2009-10-08 Koizumi Lighting Technology Corp Light-emitting module, and illuminator
US20100044726A1 (en) * 2008-08-22 2010-02-25 Qing Li Method for Packaging White-Light LED and LED Device Produced Thereby
US20100164346A1 (en) * 2008-12-31 2010-07-01 Intematix Corporation Light emitting device with phosphor wavelength conversion
US20110001152A1 (en) * 2009-07-06 2011-01-06 Paragon Semiconductor Lighting Technology Co., Ltd Led package structure for forming a stuffed convex lens to adjust light-projecting angle and method for manufacturing the same
US20120243232A1 (en) * 2009-12-04 2012-09-27 Osram Ag Lighting module

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7446347B2 (en) * 2000-08-23 2008-11-04 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof, module and device comprising a module of this type
WO2007037221A1 (en) * 2005-09-27 2007-04-05 Sony Chemical & Information Device Corporation Functional element package and process for producing the same
US20070253209A1 (en) * 2006-04-27 2007-11-01 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
US20080054288A1 (en) * 2006-07-05 2008-03-06 Tir Technology Lp Lighting Device Package
JP2009231525A (en) * 2008-03-24 2009-10-08 Koizumi Lighting Technology Corp Light-emitting module, and illuminator
US20100044726A1 (en) * 2008-08-22 2010-02-25 Qing Li Method for Packaging White-Light LED and LED Device Produced Thereby
US20100164346A1 (en) * 2008-12-31 2010-07-01 Intematix Corporation Light emitting device with phosphor wavelength conversion
US20110001152A1 (en) * 2009-07-06 2011-01-06 Paragon Semiconductor Lighting Technology Co., Ltd Led package structure for forming a stuffed convex lens to adjust light-projecting angle and method for manufacturing the same
US20120243232A1 (en) * 2009-12-04 2012-09-27 Osram Ag Lighting module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Also Published As

Publication number Publication date
CN103775860A (en) 2014-05-07

Similar Documents

Publication Publication Date Title
US20060215422A1 (en) LED light bulb
US20070034886A1 (en) PLCC package with integrated lens and method for making the package
JP5984845B2 (en) Lighting device
WO2007004572A1 (en) Light emitting device
US9086217B2 (en) Lighting apparatus
JP2007073825A (en) Semiconductor light emitting device
EP2455991A4 (en) Led chip assembly, led package, and manufacturing method of led package
JP2009054894A (en) Light-emitting device
US8405118B2 (en) Multichip package structure using a constant voltage power supply
US7883261B2 (en) Water-resistant and replaceable LED lamps
WO2008109813A3 (en) Sealed light emitting diode assemblies and methods of making same
US20040099875A1 (en) Structure of surface mount device light emitting diode
KR101173656B1 (en) Case for led lighting and led lighting apparatus using the same
EP2657968A1 (en) Package structure of high-power led light source module
US8678617B2 (en) Illuminating device and method for manufacturing the same
TW200601528A (en) Surface mounted electronic component and manufacturing method therefor
US20120098458A1 (en) Multichip package structure for directly electrically connecting to an ac power source
US7736920B1 (en) Led package structure with standby bonding pads for increasing wire-bonding yield and method for manufacturing the same
US20130328088A1 (en) LED Module and Lighting Apparatus
JP2009080966A (en) Illumination device
JP2012523678A (en) Power LED heat dissipation substrate, method for manufacturing power LED product, and product by the method
US7794118B2 (en) Light emitting diode assembly
JP2007096079A (en) Semiconductor light emitting device
EP2244313A1 (en) Light emitting diode with high power
US8338851B2 (en) Multi-layer LED array engine

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13766121

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase in:

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13766121

Country of ref document: EP

Kind code of ref document: A1