WO2014052185A1 - Electronic device having passive cooling - Google Patents

Electronic device having passive cooling Download PDF

Info

Publication number
WO2014052185A1
WO2014052185A1 PCT/US2013/060879 US2013060879W WO2014052185A1 WO 2014052185 A1 WO2014052185 A1 WO 2014052185A1 US 2013060879 W US2013060879 W US 2013060879W WO 2014052185 A1 WO2014052185 A1 WO 2014052185A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
electronic device
bottom part
opening
output opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2013/060879
Other languages
French (fr)
Inventor
Yoshifumi Nishi
Mark Macdonald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Priority to CN201380016349.8A priority Critical patent/CN104246648B/en
Priority to DE112013001626.5T priority patent/DE112013001626T5/en
Publication of WO2014052185A1 publication Critical patent/WO2014052185A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

Definitions

  • Embodiments may relate to a passively cooled electronic device, such as a laptop computer or a notebook computer.
  • Notebook computers and laptop computers may generate heat when operating.
  • a fan may be provided within the notebook computer and/or the laptop computer in order to dissipate the generated heat.
  • FIG. 1 is a side view of a passively cooled computer according to an example arrangement
  • FIG. 2 shows a passively cooled computer according to an example arrangement
  • FIG. 3 is a cross-sectional side view of a passively cooled computer according to an example embodiment
  • FIG. 4 is a cross-sectional side view of a passively cooled computer according to an example embodiment
  • FIG. 5 is a cross-sectional side view of a passively cooled computer according to an example embodiment
  • FIG. 6 is a cross-sectional side view of a passively cooled computer according to an example embodiment
  • FIG. 7 is a cross-sectional side view of a passively cooled computer according to an example embodiment.
  • FIG. 8 is a cross-sectional side view of a passively cooled computer according to an example embodiment.
  • Arrangements and embodiments may be described with respect to a computer, such as a laptop computer or a notebook computer. However, arrangements and embodiments may be applicable to other electronic devices, such as mobile communication terminals.
  • FIG. 1 shows a passively cooled computer according to an example arrangement. Other arrangements and configurations may also be provided.
  • FIG. 1 shows a passively cooled computer 10 such as a notebook computer or a laptop computer.
  • the computer 10 may include a base 20 and a lid 40 that are coupled together by a hinge device 30.
  • FIG. 1 shows the computer 10 in an opened state (or opened position) in which the lid 40 is separated away from the base 20.
  • the computer 10 may also be provided in a closed state (or closed position) when the lid 40 is closed so as to be adjacent to the base 20.
  • the base 20 of the computer 10 may support various components such as a processor, a touch pad, a memory, a keyboard, a circuit board, a battery, etc. These components may generate heat during operation of the computer 10.
  • the lid 40 of the computer 10 may support a display 45 for a user to view during use of the computer 10.
  • the lid 40 may support other electric components.
  • the components of the lid 40 may further generate heat during operation of the computer 10.
  • the lid 40 may be exposed to a user located in front of the computer 10.
  • the base 20 may include a first side 22 (or top side) and a second side 24 (or bottom side).
  • the lid 40 may include a first side 42 and a second side 44.
  • the first side 42 of the lid 40 is separated away from the first side 22 of the base 20.
  • the keyboard on the first side 22 of the base 20 is exposed to a user and the display 45 on the first side 42 of the lid 40 is exposed to a user.
  • the first side 42 of the lid 40 is closed so as to be adjacent to the first side 22 of the base 20.
  • the keyboard on the first side 22 of the base 20 is not exposed to a user and the display 45 on the first side 42 of the lid 40 is not exposed to a user.
  • heat generated by the components of the computer 10 may create a convection plume 50, such as a natural convection plume, over the first side 22 of the base 20 and the first side 42 of the lid 40, and to an area above the lid 40.
  • the convection plume 50 is a flow of heat in a direction from the first side 22 toward the first side 42 and subsequently away from the first side 42 (of the lid 40).
  • the convection plume 50 flows in a left to right direction and then upward.
  • the convection plume 50 dissipates heat generated by the computer 10.
  • the convection plume 50 may be created without the use of a fan, even though a fan may be provided in the base 20.
  • the hinge device 30 may allow the lid 40 to rotate (or move) about a rotational axis that is parallel to a width of the lid 40 (or a width of the base 20).
  • the lid 40 may rotate about the rotational axis of the hinge device 30 between the closed state and the opened state.
  • a passive heat exchange device 70 may be provided in an area of the hinge device 30 between the base 20 and the lid 40.
  • the heat exchange device 70 may be adjacent to the hinge device 30 in an area between the base 20 and the lid 40, and the heat exchange device 70 may create an opening (or openings) in the area between the lid 40 and the base 20.
  • the heat exchange device 70 may be considered passive since it does not directly include a fan.
  • the heat exchange device 70 may be provided in an area near or at a back end of the base 20.
  • the hinge device 30 may include a first hinge device and a second hinge device spaced apart from the first hinge device.
  • the heat exchange device 70 may be provided in an area between the first hinge device and the second hinge device.
  • the opening (or openings) created by the heat exchange device 70 may induce an air flow 60 from behind the computer 10 to in front of the computer 10, and into the convection plume 50. That is, the opening(s) of the heat exchange device 70 may allow air to pass from behind the computer 10 and into the convention plume 50. Stated differently, air behind the computer 10 may be sucked into the convection plume 50 via the opening(s) in the heat exchange device 70. This may further dissipate heat from the computer 10.
  • FIG. 1 also shows components within the base 20 according to an example arrangement.
  • the shown components include a processor 34 on a circuit board, a thermal attacher 38 coupled to the processor 34 and a heat spreader 39 coupled to the thermal attacher 38.
  • the heat spreader 39 may also be considered a heat pipe.
  • the thermal attacher 38 and the heat spreader 39 may also be called a heat dissipating device to dissipate heat from the processor 34 to the heat exchange device 70.
  • the heat exchange device 70 may be physically connected to the heat spreader 39 (or to the heat dissipating device). Heat generated by the processor 34 (on the circuit board) or other components may be distributed by the thermal attacher 38 and the heat spreader 39 to the heat exchange device 70. The heat exchange device 70 may therefore receive energy or heat generated from the processor 34 and/or other components.
  • the heat exchange device 70 may include at least one heat pipe and a plurality of fins that extend perpendicularly from an axis of the at least one heat pipe.
  • the at least one heat pipe may be coupled to the heat dissipating device to receive heat from components within the base 20.
  • the openings of the heat exchange device 70 may allow the induced air flow 60 to flow when the computer 10 is provided in the opened state, such as shown in FIG. 1.
  • the induced air flow 60 that flows through the openings may help dissipate the heat or energy at the heat exchange device 70 to outside of the computer 10.
  • the dissipated heat or energy may be provided to the convection plume 50.
  • the convection plume 50 may dissipate the heat or energy away from (or above) the computer 10.
  • air from behind the computer 10 may pass through the heat exchange device 70 and into the convection plume 50.
  • the air may absorb heat provided at the heat exchange device 70, and remove some of the heat from the heat exchange device 70.
  • the convention plume 50 may detach away from the lid 40 and the heat exchange device 70 may create its own convection plume (or natural convection plume) in order to dissipate heat.
  • the heat exchange device 70 and the hinge device 30 may be provided between the base 20 and the lid 40.
  • the heat exchange device 70 may be provided adjacent to the hinge device 30 such that both the heat exchange device 70 and the hinge device 30 are provide in a same area between the base 20 and the lid 40 when the computer is in the opened state.
  • the heat exchange device 70 may be independent of the hinge device 30.
  • the hinge device 30 may allow the lid 40 to move relative to the base 20 between the closed state (of the computer 10) and the opened state (of the computer 10).
  • the heat exchange device 70 may take any of a number of specific shapes or types.
  • the heat exchange device 70 may include a number of openings and/or fins to allow the air flow 60 to flow from the rear of the computer 10 to a front of the computer 10.
  • the fins may extend perpendicularly from a heat pipe.
  • the opening(s) or fins may provide an air flow passage from the rear to the front of the lid 40 such that the air flow 60 joins the convection plume 50.
  • the heat exchange device 70 may be unique in that air flows from a rear to a front and ultimately to the convection plume 50. The air from the rear of the computer 10 may be sucked into the convection plume 50 via the openings of the heat exchange device 70, and thereby dissipate the heat from the heat exchange device 70.
  • the heat exchange device 70 may be physically connected to the base 10, and more specifically may be connected to the heat spreader 39.
  • the heat exchange device 70 may be a passive device since it does not specifically operate using a fan to dissipate heat.
  • the flow of air by the convection plume 50 may receive the induced air flow 60.
  • FIG. 2 shows a passively cooled computer according to an example arrangement. Other arrangements and configurations are also within the scope of the present invention.
  • FIG. 2 shows the computer 10 in the opened state such that the lid 40 is opened when compared to the base 20.
  • FIG. 2 shows the hinge device 30 as a first hinge component 32, a second hinge component 34 and a third hinge component 36. Each of the first, second and third components 32, 34, 36 of the hinge device 30 allow the lid 40 to move (or rotate) relative to the base 20.
  • FIG. 2 also shows the heat exchange device 70 as first openings 72 for a heat exchange component and second openings 74 for a heat exchange component.
  • the heat exchange components may be fixedly attached to the base 20 such that the heat exchange components and the openings 72, 74 do not move (or rotate) when the lid 40 is opened. In other words, the first openings 72 and the second openings 74 are stationary when the lid 40 moves.
  • the heat exchange components may include a plurality of fins, such as extending from a heat pipe, for example.
  • the fins may be made of a metallic material such as copper or aluminum, for example.
  • the fins may include fins of copper or fins of aluminum, for example.
  • the openings 72 may be provided between a rear of the heat exchange 70 and a front of the heat exchange 70.
  • the air flowing through the openings 72 may receive heat or energy from the fins, and dissipate the heat or energy to the convection plume 50 located in front of the display 45 on the lid 40.
  • the openings 72 may be provided between a rear of the heat exchange 70 and a front of the heat exchange 70.
  • the air flowing through the openings 74 may receive heat or energy from the fins, and dissipate the heat or energy to the natural convection plume 50 located in front of the display on the lid 40.
  • FIG. 3 is a cross-sectional side view of a passively cooled computer (or electronic device) according to an example arrangement.
  • FIG. 4 is a cross-sectional side view of a passively cooled computer (or electronic device) according to an example arrangement. Other arrangements and configurations may also be provided.
  • FIG. 3 shows the computer 10 having the lid 40 and the base 20 in an opened state (or opened position).
  • a hinge device may be coupled to the lid 40 and to the base 20.
  • the base 20 of the computer 10 may be provided on a support surface 5, such as a flat surface of a desk or a table.
  • the base 20 of the computer 10 may support various components such as a keyboard 25 having a plurality of keys, and/or a touch pad.
  • the base 20 of the computer 10 may also include other electronic components such as a circuit board 36 and the processor 34.
  • the base 20 of the computer 10 may include an opening 80 at a backside of the base 20.
  • the opening 80 may be provided on a rear surface of the base 20.
  • FIG. 3 also shows that the air flow 60 comes from behind the computer 10, goes through the opening 80 (of the base 20) and comes out from the base 10 and into the convection plume 50 in front of the lid 40.
  • the air flow 60 may be through vents (or the opening 80) in the base 20 to allow the air flow 60 to enhance cooling of the computer 10.
  • a thickness of the base 20 decreases, then it may be more difficult to draw air through the opening 80 due to a limited open area for venting.
  • the convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component).
  • the air 52 may be pulled out through opening 81.
  • FIG. 4 shows the computer 10 having a base 20A that is thinner than the base 20 (of FIG. 3).
  • the base 20A may include an opening 82 at a backside (or rear surface) of the base 20A.
  • the opening 82 (FIG. 4) may be smaller than the opening 80 (FIG. 3), and thus may inhibit air flow through the opening 82 as compared to the opening 80.
  • Embodiments may provide a computer (or electronic device) that includes a base having a wedged bottom portion (or wedged bottom surface).
  • the base may have a bottom portion that includes a first bottom part and a second bottom part.
  • the first bottom part may contact a support surface, such as a desk or table surface, when the computer is provided on the support surface.
  • the second bottom part may be provided at a different angle than the first bottom part, such that the second bottom part may not contact the support surface when the computer is provided on the support surface.
  • the first bottom part and the second bottom part may therefore be provided in a wedge configuration, or other configurations.
  • an input opening may be provided on the second bottom part (of the bottom portion) of the base. This may allow a better air flow into and through the base. The airflow may exit from the base at an output opening.
  • the convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component).
  • the air 52 may be pulled out through opening 81.
  • FIG. 5 is a cross-sectional side view of a passively cooled computer (or electronic device) according to an example embodiment. Other embodiments and configurations may also be provided.
  • FIG. 5 shows a computer 100 having a base 120 and the lid 40 in an opened state (or opened position).
  • a hinge device may be coupled to the lid 40 and to the base 120.
  • the base 120 of the computer 100 may be provided on the support surface 5, such as a flat surface of a desk or a table.
  • FIG. 5 shows that the base 120 includes a top portion and a bottom portion.
  • the bottom portion may include a first bottom part 123 and a second bottom part 125.
  • the first bottom part 123 may be a substantially flat surface (or define a first plane), and the second bottom part 125 may be a substantially flat surface (or define a second plane).
  • the first bottom part 123 and the second bottom part 125 may be provided in a wedge configuration, for example. In the wedge configuration, the second bottom part 125 may not be parallel to the first bottom part 123.
  • the second bottom part 125 may not be aligned with the first bottom part 123.
  • the first plane of the first bottom part 123 is not parallel (i.e., is non-planar) to the second plane of the second bottom part 125.
  • the first bottom part 123 and the second bottom part 125 may be provided in configurations other than a wedge configuration.
  • the first bottom part 123 may contact the support surface 5 and the second bottom part 125 may be raised from the surface 5, due to the wedge configuration (or shape) of the bottom of the base 120.
  • the second bottom part 125 may be raised such that is a sufficiently large gap between the second bottom part 125 and the support surface 5 for the air flow 60.
  • the gap may be 10 mm, although other dimensions for the gap may also be provided. This may allow air to be provided under the second bottom part 125.
  • the first bottom part 123 may support the computer 100 (or electronic device) on the support surface.
  • the second bottom part 125 may be raised from the support surface 5 when the first bottom part 123 supports the computer 100 (or electronic device) on the support surface 5.
  • the second bottom part 125 may include an input opening 180 that allows air to flow under the second bottom surface 125 (from the rear of the computer 10), through the input opening 180, through the base 120 and out through (or exit) an output opening 190 (of the base 120) to an area in front of the lid 40.
  • the air flow 60 may be a vertical flow (or substantially vertical flow) through the base 120 to a convection plume (or natural convection plume) over the base 120 and in front of the lid 40.
  • the output opening 190 of a top portion of the base 120 may be aligned with the input opening 180 of a bottom portion of the base 120.
  • a heat exchange device may be provided within the base 120 and within the path of the air flow 60.
  • the heat exchange device may include fins, for example.
  • the convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component).
  • the air 52 may be pulled out through opening 190.
  • FIG. 6 is a cross-sectional side view of a passively cooled computer (or electronic device) according to an example embodiment. Other embodiments and configurations may also be provided. More specifically, FIG. 6 shows the computer 100 having a base 120A and the lid 40 in an opened state (or opened position). A hinge device may be coupled to the lid 40 and to the base 120A.
  • the base 120A of the computer 100 may be provided on the support surface 5, such as a flat surface of a desk or a table.
  • FIG. 6 shows that the base 120A includes a top portion and a bottom portion.
  • the bottom portion may include the first bottom part 123 and the second bottom part 125.
  • the first bottom part 123 may be a substantially flat surface (or define a first plane), and the second bottom part 125 may be a substantially flat surface (or define a second plane).
  • the first bottom part 123 and the second bottom part 125 may be provided in a wedge configuration, for example. In the wedge configuration, the second bottom part 125 may not be parallel to the first bottom part 123.
  • the second bottom part 125 may not be aligned with the first bottom part 123.
  • the first plane of the first bottom part 123 is not parallel (i.e., is non-planar) to the second plane of the second bottom part 125.
  • the first bottom part 123 and the second bottom part 125 may be provided in configurations other than a wedge configuration.
  • the first bottom part 123 may contact the support surface 5 and the second bottom part 125 may be raised from the support surface 5, due to the wedge configuration (or shape) of the bottom of the base 120A.
  • the second bottom part 125 may be raised (from the support surface) such that there is a sufficiently large gap between the second bottom part 125 and the support surface 5 for the air flow 60. This may allow air to be provided under the second bottom part 125.
  • the first bottom part 123 may support the computer 100 (or electronic device) on the support surface.
  • the second bottom part 125 may be raised from the support surface 5 when the first bottom part 123 supports the computer 100 (or electronic device) on the support surface 5.
  • the second bottom part 125 may include an input opening 182 that allows air to flow under the second bottom surface 125 (from the rear of the computer 10), through the input opening 182, along an inside portion 130 of the base 120A, and out through (or exit) an output opening 192 (of the base 120A) to an area over the base 120A.
  • the air flow 60 may be into the input opening 182, then in a longitudinal direction along the inside portion 130 of the base 120A, and then out of the base 120A through the output opening 192 to a convection plume (or natural convection plume) over the base 120A and in front of the lid 40.
  • the inside portion 130 of the base 120A may be over the processor 34 and the circuit board 36, for example.
  • the air flow 60 may help dissipate heat from the processor 34, the circuit board 36 and/or other components.
  • the output opening 192 (of the base 120A) may be provided at an edge of the keyboard 25 on the base 120A.
  • the output opening 192 may be provided at one or a plurality of edge areas of the keyboard 25.
  • FIG. 6 specifically shows the output opening 192 at a top edge of the keyboard 25.
  • the output opening 192 may be an opening along an entire top edge of the keyboard 25, or the output opening 192 may be an opening (or openings) along only part of the top edge of the keyboard 25.
  • the output opening 192 may also (or alternatively) be provided along a first side edge of the keyboard 25, a second side edge of the keyboard 25, and/or a bottom edge of the keyboard 25.
  • the output opening may also (or alternatively) be provided along any edge of a touch pad on the base 120A.
  • the output opening (or openings) may be provided at other areas of a top surface of the base 120A.
  • the air flow 60 that enters into the base 120A through the input opening 182 may pass through the inside portion 130 of the base 120A and may exit from the base 120A through any of the above described output openings, including the output opening 192 shown in FIG. 6.
  • a heat exchange device may be provided within the base 120 A and within the path of the air flow 60.
  • the heat exchange device may include fins, for example.
  • FIG. 7 is a cross-sectional side view of a passively cooled computer (or electronic device) according to an example embodiment. Other embodiments and configurations may also be provided.
  • FIG. 7 shows the computer 100 having a base 120B and the lid 40 in an opened state (or opened position).
  • a hinge device may be coupled to the lid 40 and to the base 120B.
  • the base 120B of the computer 100 may be provided on the support surface 5, such as a flat surface of a desk or a table.
  • FIG. 7 shows that the base 120B includes a top portion and a bottom portion.
  • the bottom portion may include the first bottom part 123 and the second bottom part 125.
  • the first bottom part 123 may be a substantially flat surface (or define a first plane), and the second bottom part 125 may be a substantially flat surface (or define a second plane).
  • the first bottom part 123 and the second bottom part 125 may be provided in a wedge configuration, for example. In the wedge configuration, the second bottom part 125 may not be parallel to the first bottom part 123.
  • the second bottom part 125 may not be aligned with the first bottom part 123.
  • the first plane of the first bottom part 123 is not parallel (i.e., is non-planar) to the second plane of the second bottom part 125.
  • the first bottom part 123 and the second bottom part 125 may be provided in configurations other than a wedge configuration.
  • the first bottom part 123 may contact the support surface 5 and the second bottom part 125 may be raised from the support surface 5, due to the wedge configuration (or shape) of the bottom of the base 120B.
  • the second bottom part 125 may be raised such that there is a sufficient gap between the second bottom part 125 and the support surface 5 for the air flow 60.
  • a gap may be less than 10 mm under an input opening 184 to the support surface 5. This may allow air to be provided under the second bottom part 125.
  • the first bottom part 123 may support the computer 100 (or electronic device) on the support surface.
  • the second bottom part 125 may be raised from the support surface 5 when the first bottom part 123 supports the computer 100 (or electronic device) on the support surface 5.
  • the second bottom part 125 may include the input opening 184 that allows air to flow under the second bottom surface 125 (from the rear of the computer 10), through the input opening 184 and out of the base 120B through an output opening 194 to an area over the base
  • the air flow 60 may be into the input opening 184, then vertically (or substantially vertically) out through the output opening 194 of the base 120B to a convection plume (or natural convection plume) over the base 120B and in front of the lid 40.
  • the output opening 194 (of the base 120B) may be provided at an edge of the keyboard 25 on the base 120B.
  • the output opening 194 may be provided at one or a plurality of edge areas of the keyboard 25.
  • FIG. 7 specifically shows the output opening 194 at a top edge of the keyboard 25.
  • the output opening 194 may be an opening along an entire top edge of the keyboard 25, or the output opening 194 may be an opening (or openings) along only part of the top edge of the keyboard 25.
  • the output opening 194 may also (or alternatively) be provided along a first side edge of the keyboard 25, a second side edge of the keyboard 25, and/or a bottom edge of the keyboard 25.
  • the output opening may also (or alternatively) be provided along any edge of a touch pad on the base 120B.
  • the output opening (or openings) may be provided at other areas on a top surface of the base 120B.
  • the air flow 60 that enters into the base 120B through the input opening 184 may exit from the base 120B through any of the above described output openings, including the output opening 194 shown in FIG. 7.
  • the output opening 194 of a top portion of the base 120B may be aligned with the input opening 184 of a bottom portion of the base 120B.
  • a heat exchange device may be provided within the base 120B and within the flow of the air flow 60.
  • the heat exchange device may include fins, for example.
  • the convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component).
  • the air 52 may be pulled out through opening 194.
  • Embodiments have been described with respect to a bottom portion (of a base) that includes a first bottom part and a second bottom part arranged in a wedge configuration. However, embodiments are not limited to this configuration.
  • Embodiments may include a bottom portion (of a base) that includes a first bottom part, a second bottom part and a third bottom part.
  • FIG. 8 shows a base 120 having a bottom portion that includes the first bottom part 123, the second bottom part 125 and a third bottom part 127.
  • the first bottom part 123 may contact the support surface 5 to provide stability to the computer 100.
  • the second bottom part 125 may extend from the first bottom part 123 at a first particular angle.
  • the third bottom part 127 may extend from the second bottom part 125 at a second particular angle.
  • the bottom portion may include three (or more) separate surfaces.
  • An input opening 185 may be provided on the third bottom part 127 at an area near a rear side 122 of the base 120C.
  • the third bottom part 127 may include the input opening 185 that allows air to flow into the input opening 185 (from the rear of the computer) and out the output opening 192 (of the base) to an area above the base 120C.
  • the third bottom part 127 may be a surface of the bottom portion (of the base) closest to the rear side 122 of the computer 100.
  • the input opening may be a single opening or may be a plurality of openings, such as being on the left and the right of the second bottom part and/or the third bottom part.
  • the input and output openings may be vents or have vent surfaces within the input and output opening(s).
  • Embodiments may include a base that has a bottom portion with two separate surfaces, where a first surface may be substantially parallel to a support surface and the a second surface may be slanted up from the first surface so that air flow may enter thru an opening(s) provided on the second surface.
  • Embodiments may include a base that has a bottom portion with at least three separate surfaces, where a first surface may be substantially parallel to a support surface, a second surface may be slanted up from the first surface, and a third surface may be slanted up from the second surface.
  • An opening (or vent) may be provided on the third surface so that air flow may enter thru the opening on the bottom of the electronic device.
  • An output opening of a top portion of the base may be aligned with an input opening on a bottom portion of the base such that air may flow from over a processor to dissipate heat out from the output opening.
  • any reference in this specification to "one embodiment,” “an embodiment,” “example embodiment,” etc. means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention.
  • the appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

ELECTRONIC DEVICE HAVING PASSIVE COOLING
BACKGROUND
1. Field
Embodiments may relate to a passively cooled electronic device, such as a laptop computer or a notebook computer.
2. Background
Notebook computers and laptop computers may generate heat when operating. A fan may be provided within the notebook computer and/or the laptop computer in order to dissipate the generated heat.
BRIEF DESCRIPTION OF THE DRAWINGS
Arrangements and embodiments may be described in detail with reference to the following drawings in which like reference numerals refer to like elements and wherein:
FIG. 1 is a side view of a passively cooled computer according to an example arrangement;
FIG. 2 shows a passively cooled computer according to an example arrangement;
FIG. 3 is a cross-sectional side view of a passively cooled computer according to an example embodiment;
FIG. 4 is a cross-sectional side view of a passively cooled computer according to an example embodiment;
FIG. 5 is a cross-sectional side view of a passively cooled computer according to an example embodiment;
FIG. 6 is a cross-sectional side view of a passively cooled computer according to an example embodiment;
FIG. 7 is a cross-sectional side view of a passively cooled computer according to an example embodiment; and
FIG. 8 is a cross-sectional side view of a passively cooled computer according to an example embodiment.
DETAILED DESCRIPTION
Arrangements and embodiments may be described with respect to a computer, such as a laptop computer or a notebook computer. However, arrangements and embodiments may be applicable to other electronic devices, such as mobile communication terminals.
FIG. 1 shows a passively cooled computer according to an example arrangement. Other arrangements and configurations may also be provided.
FIG. 1 shows a passively cooled computer 10 such as a notebook computer or a laptop computer. The computer 10 may include a base 20 and a lid 40 that are coupled together by a hinge device 30. FIG. 1 shows the computer 10 in an opened state (or opened position) in which the lid 40 is separated away from the base 20. The computer 10 may also be provided in a closed state (or closed position) when the lid 40 is closed so as to be adjacent to the base 20.
The base 20 of the computer 10 may support various components such as a processor, a touch pad, a memory, a keyboard, a circuit board, a battery, etc. These components may generate heat during operation of the computer 10.
The lid 40 of the computer 10 may support a display 45 for a user to view during use of the computer 10. The lid 40 may support other electric components. The components of the lid 40 may further generate heat during operation of the computer 10.
When the computer 10 is in an opened state, the keyboard on the base 20 and the display
45 on the lid 40 may be exposed to a user located in front of the computer 10.
The base 20 may include a first side 22 (or top side) and a second side 24 (or bottom side). The lid 40 may include a first side 42 and a second side 44. When the computer 10 is in the opened state (such as shown in FIG. 1), the first side 42 of the lid 40 is separated away from the first side 22 of the base 20. In other words, the keyboard on the first side 22 of the base 20 is exposed to a user and the display 45 on the first side 42 of the lid 40 is exposed to a user. When the computer 10 is in the closed state, the first side 42 of the lid 40 is closed so as to be adjacent to the first side 22 of the base 20. In other words, the keyboard on the first side 22 of the base 20 is not exposed to a user and the display 45 on the first side 42 of the lid 40 is not exposed to a user.
During operation of the computer 10 while the computer 10 is in an opened state, heat generated by the components of the computer 10 may create a convection plume 50, such as a natural convection plume, over the first side 22 of the base 20 and the first side 42 of the lid 40, and to an area above the lid 40. The convection plume 50 is a flow of heat in a direction from the first side 22 toward the first side 42 and subsequently away from the first side 42 (of the lid 40). In FIG. 1, the convection plume 50 flows in a left to right direction and then upward. The convection plume 50 dissipates heat generated by the computer 10. The convection plume 50 may be created without the use of a fan, even though a fan may be provided in the base 20.
The hinge device 30 may allow the lid 40 to rotate (or move) about a rotational axis that is parallel to a width of the lid 40 (or a width of the base 20). The lid 40 may rotate about the rotational axis of the hinge device 30 between the closed state and the opened state.
In at least one arrangement, a passive heat exchange device 70 may be provided in an area of the hinge device 30 between the base 20 and the lid 40. The heat exchange device 70 may be adjacent to the hinge device 30 in an area between the base 20 and the lid 40, and the heat exchange device 70 may create an opening (or openings) in the area between the lid 40 and the base 20. The heat exchange device 70 may be considered passive since it does not directly include a fan.
The heat exchange device 70 may be provided in an area near or at a back end of the base 20. The hinge device 30 may include a first hinge device and a second hinge device spaced apart from the first hinge device. The heat exchange device 70 may be provided in an area between the first hinge device and the second hinge device.
The opening (or openings) created by the heat exchange device 70 may induce an air flow 60 from behind the computer 10 to in front of the computer 10, and into the convection plume 50. That is, the opening(s) of the heat exchange device 70 may allow air to pass from behind the computer 10 and into the convention plume 50. Stated differently, air behind the computer 10 may be sucked into the convection plume 50 via the opening(s) in the heat exchange device 70. This may further dissipate heat from the computer 10.
FIG. 1 also shows components within the base 20 according to an example arrangement. The shown components include a processor 34 on a circuit board, a thermal attacher 38 coupled to the processor 34 and a heat spreader 39 coupled to the thermal attacher 38. The heat spreader 39 may also be considered a heat pipe. The thermal attacher 38 and the heat spreader 39 may also be called a heat dissipating device to dissipate heat from the processor 34 to the heat exchange device 70.
The heat exchange device 70 may be physically connected to the heat spreader 39 (or to the heat dissipating device). Heat generated by the processor 34 (on the circuit board) or other components may be distributed by the thermal attacher 38 and the heat spreader 39 to the heat exchange device 70. The heat exchange device 70 may therefore receive energy or heat generated from the processor 34 and/or other components.
The heat exchange device 70 may include at least one heat pipe and a plurality of fins that extend perpendicularly from an axis of the at least one heat pipe. The at least one heat pipe may be coupled to the heat dissipating device to receive heat from components within the base 20.
The openings of the heat exchange device 70 may allow the induced air flow 60 to flow when the computer 10 is provided in the opened state, such as shown in FIG. 1. The induced air flow 60 that flows through the openings may help dissipate the heat or energy at the heat exchange device 70 to outside of the computer 10. The dissipated heat or energy may be provided to the convection plume 50. The convection plume 50 may dissipate the heat or energy away from (or above) the computer 10.
As shown by the induced air flow 60, air from behind the computer 10 may pass through the heat exchange device 70 and into the convection plume 50. The air may absorb heat provided at the heat exchange device 70, and remove some of the heat from the heat exchange device 70.
When the opening angle of the lid 40 is large, the convention plume 50 may detach away from the lid 40 and the heat exchange device 70 may create its own convection plume (or natural convection plume) in order to dissipate heat.
The heat exchange device 70 and the hinge device 30 may be provided between the base 20 and the lid 40. The heat exchange device 70 may be provided adjacent to the hinge device 30 such that both the heat exchange device 70 and the hinge device 30 are provide in a same area between the base 20 and the lid 40 when the computer is in the opened state. The heat exchange device 70 may be independent of the hinge device 30.
The hinge device 30 may allow the lid 40 to move relative to the base 20 between the closed state (of the computer 10) and the opened state (of the computer 10).
The heat exchange device 70 may take any of a number of specific shapes or types. For example, the heat exchange device 70 may include a number of openings and/or fins to allow the air flow 60 to flow from the rear of the computer 10 to a front of the computer 10. The fins may extend perpendicularly from a heat pipe. The opening(s) or fins may provide an air flow passage from the rear to the front of the lid 40 such that the air flow 60 joins the convection plume 50. The heat exchange device 70 may be unique in that air flows from a rear to a front and ultimately to the convection plume 50. The air from the rear of the computer 10 may be sucked into the convection plume 50 via the openings of the heat exchange device 70, and thereby dissipate the heat from the heat exchange device 70.
The heat exchange device 70 may be physically connected to the base 10, and more specifically may be connected to the heat spreader 39. The heat exchange device 70 may be a passive device since it does not specifically operate using a fan to dissipate heat. The flow of air by the convection plume 50 may receive the induced air flow 60.
FIG. 2 shows a passively cooled computer according to an example arrangement. Other arrangements and configurations are also within the scope of the present invention.
FIG. 2 shows the computer 10 in the opened state such that the lid 40 is opened when compared to the base 20. FIG. 2 shows the hinge device 30 as a first hinge component 32, a second hinge component 34 and a third hinge component 36. Each of the first, second and third components 32, 34, 36 of the hinge device 30 allow the lid 40 to move (or rotate) relative to the base 20.
FIG. 2 also shows the heat exchange device 70 as first openings 72 for a heat exchange component and second openings 74 for a heat exchange component. The heat exchange components may be fixedly attached to the base 20 such that the heat exchange components and the openings 72, 74 do not move (or rotate) when the lid 40 is opened. In other words, the first openings 72 and the second openings 74 are stationary when the lid 40 moves.
The heat exchange components may include a plurality of fins, such as extending from a heat pipe, for example. The fins may be made of a metallic material such as copper or aluminum, for example. The fins may include fins of copper or fins of aluminum, for example.
The openings 72 may be provided between a rear of the heat exchange 70 and a front of the heat exchange 70. The air flowing through the openings 72 may receive heat or energy from the fins, and dissipate the heat or energy to the convection plume 50 located in front of the display 45 on the lid 40.
The openings 72 may be provided between a rear of the heat exchange 70 and a front of the heat exchange 70. The air flowing through the openings 74 may receive heat or energy from the fins, and dissipate the heat or energy to the natural convection plume 50 located in front of the display on the lid 40.
FIG. 3 is a cross-sectional side view of a passively cooled computer (or electronic device) according to an example arrangement. FIG. 4 is a cross-sectional side view of a passively cooled computer (or electronic device) according to an example arrangement. Other arrangements and configurations may also be provided.
More specifically, FIG. 3 shows the computer 10 having the lid 40 and the base 20 in an opened state (or opened position). A hinge device may be coupled to the lid 40 and to the base 20.
The base 20 of the computer 10 may be provided on a support surface 5, such as a flat surface of a desk or a table.
The base 20 of the computer 10 may support various components such as a keyboard 25 having a plurality of keys, and/or a touch pad. The base 20 of the computer 10 may also include other electronic components such as a circuit board 36 and the processor 34.
The base 20 of the computer 10 may include an opening 80 at a backside of the base 20. The opening 80 may be provided on a rear surface of the base 20. FIG. 3 also shows that the air flow 60 comes from behind the computer 10, goes through the opening 80 (of the base 20) and comes out from the base 10 and into the convection plume 50 in front of the lid 40. The air flow 60 may be through vents (or the opening 80) in the base 20 to allow the air flow 60 to enhance cooling of the computer 10. However, as a thickness of the base 20 decreases, then it may be more difficult to draw air through the opening 80 due to a limited open area for venting.
The convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component). The air 52 may be pulled out through opening 81.
FIG. 4 shows the computer 10 having a base 20A that is thinner than the base 20 (of FIG. 3). The base 20A may include an opening 82 at a backside (or rear surface) of the base 20A. The opening 82 (FIG. 4) may be smaller than the opening 80 (FIG. 3), and thus may inhibit air flow through the opening 82 as compared to the opening 80.
Embodiments may provide a computer (or electronic device) that includes a base having a wedged bottom portion (or wedged bottom surface). The base may have a bottom portion that includes a first bottom part and a second bottom part. The first bottom part may contact a support surface, such as a desk or table surface, when the computer is provided on the support surface. The second bottom part may be provided at a different angle than the first bottom part, such that the second bottom part may not contact the support surface when the computer is provided on the support surface. The first bottom part and the second bottom part may therefore be provided in a wedge configuration, or other configurations. In view of the wedge configuration, or other configurations, an input opening may be provided on the second bottom part (of the bottom portion) of the base. This may allow a better air flow into and through the base. The airflow may exit from the base at an output opening.
The convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component). The air 52 may be pulled out through opening 81.
FIG. 5 is a cross-sectional side view of a passively cooled computer (or electronic device) according to an example embodiment. Other embodiments and configurations may also be provided.
More specifically, FIG. 5 shows a computer 100 having a base 120 and the lid 40 in an opened state (or opened position). A hinge device may be coupled to the lid 40 and to the base 120.
The base 120 of the computer 100 may be provided on the support surface 5, such as a flat surface of a desk or a table.
FIG. 5 shows that the base 120 includes a top portion and a bottom portion. The bottom portion may include a first bottom part 123 and a second bottom part 125. The first bottom part 123 may be a substantially flat surface (or define a first plane), and the second bottom part 125 may be a substantially flat surface (or define a second plane). The first bottom part 123 and the second bottom part 125 may be provided in a wedge configuration, for example. In the wedge configuration, the second bottom part 125 may not be parallel to the first bottom part 123. The second bottom part 125 may not be aligned with the first bottom part 123. The first plane of the first bottom part 123 is not parallel (i.e., is non-planar) to the second plane of the second bottom part 125. The first bottom part 123 and the second bottom part 125 may be provided in configurations other than a wedge configuration.
For example, when the computer 100 (or electronic device) is provided on the support surface 5, the first bottom part 123 may contact the support surface 5 and the second bottom part 125 may be raised from the surface 5, due to the wedge configuration (or shape) of the bottom of the base 120. As one example, the second bottom part 125 may be raised such that is a sufficiently large gap between the second bottom part 125 and the support surface 5 for the air flow 60. As one example, the gap may be 10 mm, although other dimensions for the gap may also be provided. This may allow air to be provided under the second bottom part 125.
The first bottom part 123 may support the computer 100 (or electronic device) on the support surface. The second bottom part 125 may be raised from the support surface 5 when the first bottom part 123 supports the computer 100 (or electronic device) on the support surface 5.
The second bottom part 125 may include an input opening 180 that allows air to flow under the second bottom surface 125 (from the rear of the computer 10), through the input opening 180, through the base 120 and out through (or exit) an output opening 190 (of the base 120) to an area in front of the lid 40. The air flow 60 may be a vertical flow (or substantially vertical flow) through the base 120 to a convection plume (or natural convection plume) over the base 120 and in front of the lid 40.
The output opening 190 of a top portion of the base 120 may be aligned with the input opening 180 of a bottom portion of the base 120.
A heat exchange device may be provided within the base 120 and within the path of the air flow 60. The heat exchange device may include fins, for example.
The convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component). The air 52 may be pulled out through opening 190.
FIG. 6 is a cross-sectional side view of a passively cooled computer (or electronic device) according to an example embodiment. Other embodiments and configurations may also be provided. More specifically, FIG. 6 shows the computer 100 having a base 120A and the lid 40 in an opened state (or opened position). A hinge device may be coupled to the lid 40 and to the base 120A.
The base 120A of the computer 100 may be provided on the support surface 5, such as a flat surface of a desk or a table.
FIG. 6 shows that the base 120A includes a top portion and a bottom portion. The bottom portion may include the first bottom part 123 and the second bottom part 125. The first bottom part 123 may be a substantially flat surface (or define a first plane), and the second bottom part 125 may be a substantially flat surface (or define a second plane). The first bottom part 123 and the second bottom part 125 may be provided in a wedge configuration, for example. In the wedge configuration, the second bottom part 125 may not be parallel to the first bottom part 123. The second bottom part 125 may not be aligned with the first bottom part 123. The first plane of the first bottom part 123 is not parallel (i.e., is non-planar) to the second plane of the second bottom part 125. The first bottom part 123 and the second bottom part 125 may be provided in configurations other than a wedge configuration.
For example, when the computer 100 (or electronic device) is provided on the support surface 5, the first bottom part 123 may contact the support surface 5 and the second bottom part 125 may be raised from the support surface 5, due to the wedge configuration (or shape) of the bottom of the base 120A. As stated above, the second bottom part 125 may be raised (from the support surface) such that there is a sufficiently large gap between the second bottom part 125 and the support surface 5 for the air flow 60. This may allow air to be provided under the second bottom part 125.
The first bottom part 123 may support the computer 100 (or electronic device) on the support surface. The second bottom part 125 may be raised from the support surface 5 when the first bottom part 123 supports the computer 100 (or electronic device) on the support surface 5.
The second bottom part 125 may include an input opening 182 that allows air to flow under the second bottom surface 125 (from the rear of the computer 10), through the input opening 182, along an inside portion 130 of the base 120A, and out through (or exit) an output opening 192 (of the base 120A) to an area over the base 120A. The air flow 60 may be into the input opening 182, then in a longitudinal direction along the inside portion 130 of the base 120A, and then out of the base 120A through the output opening 192 to a convection plume (or natural convection plume) over the base 120A and in front of the lid 40.
The inside portion 130 of the base 120A may be over the processor 34 and the circuit board 36, for example. The air flow 60 may help dissipate heat from the processor 34, the circuit board 36 and/or other components.
The output opening 192 (of the base 120A) may be provided at an edge of the keyboard 25 on the base 120A. For example, the output opening 192 may be provided at one or a plurality of edge areas of the keyboard 25. FIG. 6 specifically shows the output opening 192 at a top edge of the keyboard 25. The output opening 192 may be an opening along an entire top edge of the keyboard 25, or the output opening 192 may be an opening (or openings) along only part of the top edge of the keyboard 25.
The output opening 192 (or openings) may also (or alternatively) be provided along a first side edge of the keyboard 25, a second side edge of the keyboard 25, and/or a bottom edge of the keyboard 25.
The output opening (or openings) may also (or alternatively) be provided along any edge of a touch pad on the base 120A. The output opening (or openings) may be provided at other areas of a top surface of the base 120A.
The air flow 60 that enters into the base 120A through the input opening 182 may pass through the inside portion 130 of the base 120A and may exit from the base 120A through any of the above described output openings, including the output opening 192 shown in FIG. 6.
A heat exchange device may be provided within the base 120 A and within the path of the air flow 60. The heat exchange device may include fins, for example.
FIG. 7 is a cross-sectional side view of a passively cooled computer (or electronic device) according to an example embodiment. Other embodiments and configurations may also be provided.
More specifically, FIG. 7 shows the computer 100 having a base 120B and the lid 40 in an opened state (or opened position). A hinge device may be coupled to the lid 40 and to the base 120B.
The base 120B of the computer 100 may be provided on the support surface 5, such as a flat surface of a desk or a table.
FIG. 7 shows that the base 120B includes a top portion and a bottom portion. The bottom portion may include the first bottom part 123 and the second bottom part 125. The first bottom part 123 may be a substantially flat surface (or define a first plane), and the second bottom part 125 may be a substantially flat surface (or define a second plane). The first bottom part 123 and the second bottom part 125 may be provided in a wedge configuration, for example. In the wedge configuration, the second bottom part 125 may not be parallel to the first bottom part 123. The second bottom part 125 may not be aligned with the first bottom part 123. The first plane of the first bottom part 123 is not parallel (i.e., is non-planar) to the second plane of the second bottom part 125. The first bottom part 123 and the second bottom part 125 may be provided in configurations other than a wedge configuration.
For example, when the computer 100 (or electronic device) is provided on the support surface 5, the first bottom part 123 may contact the support surface 5 and the second bottom part 125 may be raised from the support surface 5, due to the wedge configuration (or shape) of the bottom of the base 120B. The second bottom part 125 may be raised such that there is a sufficient gap between the second bottom part 125 and the support surface 5 for the air flow 60.
In this embodiment, a gap may be less than 10 mm under an input opening 184 to the support surface 5. This may allow air to be provided under the second bottom part 125.
The first bottom part 123 may support the computer 100 (or electronic device) on the support surface. The second bottom part 125 may be raised from the support surface 5 when the first bottom part 123 supports the computer 100 (or electronic device) on the support surface 5.
The second bottom part 125 may include the input opening 184 that allows air to flow under the second bottom surface 125 (from the rear of the computer 10), through the input opening 184 and out of the base 120B through an output opening 194 to an area over the base
120B. The air flow 60 may be into the input opening 184, then vertically (or substantially vertically) out through the output opening 194 of the base 120B to a convection plume (or natural convection plume) over the base 120B and in front of the lid 40.
The output opening 194 (of the base 120B) may be provided at an edge of the keyboard 25 on the base 120B. For example, the output opening 194 may be provided at one or a plurality of edge areas of the keyboard 25. FIG. 7 specifically shows the output opening 194 at a top edge of the keyboard 25. The output opening 194 may be an opening along an entire top edge of the keyboard 25, or the output opening 194 may be an opening (or openings) along only part of the top edge of the keyboard 25.
The output opening 194 (or openings) may also (or alternatively) be provided along a first side edge of the keyboard 25, a second side edge of the keyboard 25, and/or a bottom edge of the keyboard 25.
The output opening (or openings) may also (or alternatively) be provided along any edge of a touch pad on the base 120B. The output opening (or openings) may be provided at other areas on a top surface of the base 120B.
The air flow 60 that enters into the base 120B through the input opening 184 may exit from the base 120B through any of the above described output openings, including the output opening 194 shown in FIG. 7.
The output opening 194 of a top portion of the base 120B may be aligned with the input opening 184 of a bottom portion of the base 120B.
A heat exchange device may be provided within the base 120B and within the flow of the air flow 60. The heat exchange device may include fins, for example.
The convection plume 50 may pull or suck air 52 from an area at the processor 34 (or other component). The air 52 may be pulled out through opening 194.
Embodiments have been described with respect to a bottom portion (of a base) that includes a first bottom part and a second bottom part arranged in a wedge configuration. However, embodiments are not limited to this configuration.
Embodiments may include a bottom portion (of a base) that includes a first bottom part, a second bottom part and a third bottom part. As one example, FIG. 8 shows a base 120 having a bottom portion that includes the first bottom part 123, the second bottom part 125 and a third bottom part 127. The first bottom part 123 may contact the support surface 5 to provide stability to the computer 100. The second bottom part 125 may extend from the first bottom part 123 at a first particular angle. Additionally, the third bottom part 127 may extend from the second bottom part 125 at a second particular angle. In this configuration, the bottom portion may include three (or more) separate surfaces. An input opening 185 may be provided on the third bottom part 127 at an area near a rear side 122 of the base 120C.
The third bottom part 127 may include the input opening 185 that allows air to flow into the input opening 185 (from the rear of the computer) and out the output opening 192 (of the base) to an area above the base 120C. The third bottom part 127 may be a surface of the bottom portion (of the base) closest to the rear side 122 of the computer 100.
In each of the above described embodiments, the input opening may be a single opening or may be a plurality of openings, such as being on the left and the right of the second bottom part and/or the third bottom part. The input and output openings may be vents or have vent surfaces within the input and output opening(s).
Embodiments may include a base that has a bottom portion with two separate surfaces, where a first surface may be substantially parallel to a support surface and the a second surface may be slanted up from the first surface so that air flow may enter thru an opening(s) provided on the second surface.
Embodiments may include a base that has a bottom portion with at least three separate surfaces, where a first surface may be substantially parallel to a support surface, a second surface may be slanted up from the first surface, and a third surface may be slanted up from the second surface. An opening (or vent) may be provided on the third surface so that air flow may enter thru the opening on the bottom of the electronic device. An output opening of a top portion of the base may be aligned with an input opening on a bottom portion of the base such that air may flow from over a processor to dissipate heat out from the output opening.
Any reference in this specification to "one embodiment," "an embodiment," "example embodiment," etc., means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with any embodiment, it is submitted that it is within the purview of one skilled in the art to affect such feature, structure, or characteristic in connection with other ones of the embodiments.
Although embodiments have been described with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More particularly, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure, the drawings and the appended claims. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art.

Claims

WHAT IS CLAIMED IS:
1. An electronic device comprising:
a lid having a display; and
a base having a top portion and a bottom portion, the bottom portion including a first bottom part and a second bottom part, the first bottom part to define a first plane, and the second bottom part to define a second plane, the second plane being non-planar with the first plane, and
the second bottom part including an input opening to receive an air flow from outside the electronic device,
the top portion of the base including an output opening, and
the input opening and the output opening to allow air to flow from under the electronic device, through the base and to outside the base.
2. The electronic device of claim 1, wherein the first bottom part and the second bottom part have a wedge configuration.
3. The electronic device of claim 1, wherein the output opening is provided at an edge of a keyboard provided on the base.
4. The electronic device of claim 1, wherein the output opening is provided at an edge of a touch pad provided on the base.
5. The electronic device of claim 1, wherein the output opening of the top portion is aligned with the input opening of the bottom portion.
6. The electronic device of claim 1, wherein the output opening of the top portion is aligned with the input opening of the bottom portion such that air to flow over a processor and out from the output opening.
7. The electronic device of claim 1, wherein the base includes a processor, and the air that flows through the base to dissipate heat from the processor.
8. The electronic device of claim 1, wherein the base includes a heat exchange device.
9. The electronic device of claim 1, wherein the lid has a first side and a second side, the first side of the lid to be adjacent to the top portion of the base when the electronic device is in a closed state, and the first side of the lid to be separated from the top portion of the base when the electronic device is in an opened state.
10. The electronic device of claim 9, further comprising a hinge device to allow the lid to move relative to the base between the closed state and the opened state.
11. The electronic device of claim 1, wherein a convection plume over the base to pull air away from a processor and out the output opening of the base and into the convection plume.
12. An electronic device comprising:
a lid to support a display; and
a base to support a processor and a keyboard, the base including a top portion and a bottom portion, the bottom portion including a first bottom part and a second bottom part, the first bottom part to support the electronic device on a support surface, and the second bottom part to be raised from the support surface when the first bottom part supports the electronic device on the support surface, and
the second bottom part including an input opening,
the top portion of the base including an output opening, and
air to flow from behind the electronic device into the input opening, through the base and to exit the base through the output opening.
13. The electronic device of claim 12, wherein the first bottom part and the second bottom part have a wedge configuration.
14. The electronic device of claim 12, wherein the output opening is provided at an edge of the keyboard.
15. The electronic device of claim 12, wherein the output opening is provided at an edge of a touch pad provided on the base.
16. The electronic device of claim 12, wherein the output opening of the top portion is aligned with the input opening of the bottom portion.
17. The electronic device of claim 12, wherein the output opening of the top portion is aligned with the input opening of the bottom portion such that air to flow over the processor and out from the output opening.
18. The electronic device of claim 12, wherein the input opening and the output opening to allow air to pass from under the electronic device to a front of the electronic device, and the air to remove a portion of the heat received from the processor.
19. The electronic device of claim 12, wherein the base includes a heat exchange device.
20. The electronic device of claim 12, wherein a convection plume over the base to pull air away from the processor and out the output opening of the base and into the convection plume.
21. An electronic device comprising:
a lid having a display; and
a base having a keyboard and an output opening on a first portion, and the base having a second portion that includes a first part to support the base on a support surface and a second part having an input opening to receive an air flow from outside the electronic device, and
the input opening and the output opening to allow air to flow from under the second part of the electronic device, through the base and to exit from the output opening of the base.
22. The electronic device of claim 21, wherein the input opening is provided at a bottom portion of the base.
23. The electronic device of claim 21, wherein the input opening is provided at a back part of the second portion of the base.
24. The electronic device of claim 21, wherein the first part and the second part have a wedge configuration.
25. The electronic device of claim 21, wherein the output opening is provided at an edge of the keyboard provided at the base.
26. The electronic device of claim 21, wherein the output opening is provided at an edge of a touch pad provided on the base.
27. The electronic device of claim 21, wherein the output opening of the top portion is aligned with the input opening of the bottom portion such that air to flow over a processor and out from the output opening.
28. The electronic device of claim 21, wherein a convection plume over the base to pull air away from a processor and out from the output opening of the base and into the convection plume.
PCT/US2013/060879 2012-09-28 2013-09-20 Electronic device having passive cooling Ceased WO2014052185A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380016349.8A CN104246648B (en) 2012-09-28 2013-09-20 Electronic equipment with passive type cooling
DE112013001626.5T DE112013001626T5 (en) 2012-09-28 2013-09-20 Electronic device with passive cooling

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/630,894 US8982555B2 (en) 2012-09-28 2012-09-28 Electronic device having passive cooling
US13/630,894 2012-09-28

Publications (1)

Publication Number Publication Date
WO2014052185A1 true WO2014052185A1 (en) 2014-04-03

Family

ID=50384972

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/060879 Ceased WO2014052185A1 (en) 2012-09-28 2013-09-20 Electronic device having passive cooling

Country Status (5)

Country Link
US (1) US8982555B2 (en)
CN (1) CN104246648B (en)
DE (1) DE112013001626T5 (en)
TW (1) TWI571196B (en)
WO (1) WO2014052185A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8982555B2 (en) 2012-09-28 2015-03-17 Intel Corporation Electronic device having passive cooling
US9134757B2 (en) 2012-09-28 2015-09-15 Intel Corporation Electronic device having passive cooling
US9268377B2 (en) 2011-12-28 2016-02-23 Intel Corporation Electronic device having a passive heat exchange device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204258880U (en) * 2014-11-24 2015-04-08 翁金柱 Full encirclement protective sleeve
KR102395490B1 (en) * 2015-07-31 2022-05-09 엘지전자 주식회사 Display apparatus
US10275000B2 (en) * 2016-09-06 2019-04-30 Google Llc Thermally conductive cables
US10768676B2 (en) * 2017-09-07 2020-09-08 Intel Corporation Docking systems and methods for electronic devices
US11073879B2 (en) * 2019-03-31 2021-07-27 Lenovo (Beijing) Co., Ltd. Electronic device
TWM614137U (en) * 2021-04-09 2021-07-01 華碩電腦股份有限公司 Electronic device
EP4404030A4 (en) * 2021-12-28 2025-01-15 Samsung Electronics Co., Ltd. HINGE STRUCTURE HAVING AIR VENT, AND ELECTRONIC DEVICE COMPRISING SAME

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020012228A1 (en) * 1998-12-04 2002-01-31 Sony Corporation. Cooling device, cooling method, and electronic apparatus
US20060243878A1 (en) * 2005-04-27 2006-11-02 Saad David J Ventilation support for laptop computers
US20090268392A1 (en) * 2008-04-23 2009-10-29 Foxconn Technology Co., Ltd. Notebook computer having heat pipe
US20110075352A1 (en) * 2008-06-12 2011-03-31 Trentent Tye Electronic Device With Deployable Air Flow Enhancing Support
US20120130545A1 (en) * 2010-11-19 2012-05-24 International Business Machines Corporation Dynamic cooling system for electronic device

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5621613A (en) * 1995-05-16 1997-04-15 Intel Corporation Apparatus for dissipating heat in a hinged computing device
US5732765A (en) * 1995-12-22 1998-03-31 Hughes Electronics Adjustable heat rejection system
US5910883A (en) * 1997-08-06 1999-06-08 International Business Machines Corporation Hinge incorporating a helically coiled heat pipe for a laptop computer
US5880929A (en) 1997-12-01 1999-03-09 Intel Corporation Heat exchanger system for cooling a hinged computing device
US6118655A (en) * 1997-12-08 2000-09-12 Compaq Computer Corporation Cooling fan with heat pipe-defined fan housing portion
US5882929A (en) * 1998-04-07 1999-03-16 Tissue Engineering, Inc. Methods and apparatus for the conditioning of cartilage replacement tissue
US6044899A (en) * 1998-04-27 2000-04-04 Hewlett-Packard Company Low EMI emissions heat sink device
US6250378B1 (en) * 1998-05-29 2001-06-26 Mitsubishi Denki Kabushiki Kaisha Information processing apparatus and its heat spreading method
US6125035A (en) * 1998-10-13 2000-09-26 Dell Usa, L.P. Heat sink assembly with rotating heat pipe
JP2000148304A (en) 1998-11-04 2000-05-26 Nec Niigata Ltd System for cooling note personal computer
US6253836B1 (en) * 1999-05-24 2001-07-03 Compaq Computer Corporation Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus
TW458501U (en) * 1999-09-07 2001-10-01 Foxconn Prec Components Co Ltd Pivotable heat conduction structure
US6411505B1 (en) * 1999-11-12 2002-06-25 Apple Computer, Inc. Computer housing for a portable computer
US6341062B1 (en) * 2000-03-06 2002-01-22 International Business Machines Corp. Thermal transfer hinge for hinged mobile computing device and method of heat transfer
JP3601778B2 (en) * 2000-06-30 2004-12-15 株式会社東芝 Electronics
KR20020032737A (en) 2000-10-27 2002-05-04 박영조 A heat exchange structure of protection against heat for notebook computer
JP2004086736A (en) * 2002-08-28 2004-03-18 Toshiba Corp Electronics
US6958910B2 (en) 2003-11-18 2005-10-25 Kabushiki Kaisha Toshiba Cooling apparatus for electronic apparatus
JP4504760B2 (en) 2004-08-09 2010-07-14 富士通株式会社 Electronics
US20060082966A1 (en) * 2004-10-15 2006-04-20 Lev Jeffrey A External cooling module
US7388745B2 (en) * 2004-12-02 2008-06-17 Hewlett-Packard Development Company, L.P. Portable computer power system
US7116552B2 (en) 2005-01-31 2006-10-03 Chaun-Choung Technology Corp. Heat-dissipation apparatus of portable computer
US7505255B2 (en) * 2006-03-29 2009-03-17 Aten International Co. Ltd. KVM module with torsion-varying hinge
US7542290B2 (en) * 2006-09-26 2009-06-02 Hewlett-Packard Development Company, L.P. Computer device cooling system
JP4745206B2 (en) * 2006-11-30 2011-08-10 株式会社東芝 Electronics
WO2009043240A1 (en) * 2007-09-29 2009-04-09 Biao Qin Flat heat pipe radiator and application thereof
US7859840B2 (en) * 2008-01-11 2010-12-28 Su-Ben Chang Portable heat dissipation device with cross flow fan
JP4724197B2 (en) * 2008-03-27 2011-07-13 富士通株式会社 Electronics
JP2010067192A (en) * 2008-09-12 2010-03-25 Fujitsu Ltd Electronic apparatus
US7800903B2 (en) * 2008-09-30 2010-09-21 Cooler Master Co., Ltd. Heat-dissipating structure applied to at least one portable electronic device
US20100134976A1 (en) * 2008-12-03 2010-06-03 Cheng-Ping Kuo Heat dissipating pad structure for notebook computer
WO2010068211A1 (en) 2008-12-11 2010-06-17 Hewlett-Packard Development Company, L.P. Laptop computer user thermal isolation apparatus
TWI385505B (en) * 2008-12-25 2013-02-11 Asustek Comp Inc Portable electronic device
CN101763141A (en) * 2008-12-25 2010-06-30 华硕电脑股份有限公司 Portable electronic device
TWI355883B (en) * 2009-02-20 2012-01-01 Asustek Comp Inc Portable electronic device
JP2010224587A (en) * 2009-03-19 2010-10-07 Toshiba Corp Electronics
TWI360739B (en) * 2009-05-25 2012-03-21 Wistron Corp Pressure sensing device for electronic device and
WO2011024319A1 (en) * 2009-08-31 2011-03-03 富士通株式会社 Electronic apparatus
TWI391813B (en) * 2009-12-08 2013-04-01 Wistron Corp Heat-dissipating hole mechanism capable of adjusting airflow rate and portable computer device thereof
US8472171B2 (en) * 2009-12-22 2013-06-25 Intel Corporation Method and system for cooling a computer device
JP4823374B1 (en) * 2010-05-11 2011-11-24 株式会社東芝 Electronics
JP4892078B2 (en) * 2010-05-11 2012-03-07 株式会社東芝 Electronics
WO2011146064A1 (en) * 2010-05-20 2011-11-24 Hewlett-Packard Development Company, L.P. Flow diversion apparatuses and methods
US8189331B2 (en) * 2010-05-25 2012-05-29 Hewlett-Packard Development Company, L.P. Thermal management systems and methods
JP4982590B2 (en) * 2010-06-18 2012-07-25 株式会社東芝 Display device and electronic device
TW201230939A (en) * 2010-11-08 2012-07-16 Compal Electronics Inc Electronic apparatus
TW201223418A (en) * 2010-11-19 2012-06-01 Inventec Corp An electronic apparatus with heat improvement
US8355248B2 (en) * 2010-12-16 2013-01-15 Intel Corporation Apparatus and system for improved thermal radiation for a mobile computing device and case
JP2012198673A (en) * 2011-03-18 2012-10-18 Toshiba Corp Electronic equipment
US8724314B2 (en) * 2011-06-24 2014-05-13 Motorola Mobility Llc Apparatus for supplemental cooling of a docked mobile computing device
US20130003284A1 (en) * 2011-06-28 2013-01-03 Kevin Massaro Elevating display lid
TWI469716B (en) * 2011-07-26 2015-01-11 Compal Electronics Inc Electronic device
US20130063889A1 (en) * 2011-09-12 2013-03-14 Clinton Yee System and Method for Cooling Notebook Computer Surface
US9268377B2 (en) 2011-12-28 2016-02-23 Intel Corporation Electronic device having a passive heat exchange device
US8662465B2 (en) * 2012-01-06 2014-03-04 Cheng Yu Huang Tiltable notebook-computer cooling pad with tablet-computer bracket
KR20130099688A (en) * 2012-02-29 2013-09-06 주식회사 팬택 Mobile communication device and heat exhausting method therein
JP5306511B1 (en) * 2012-04-27 2013-10-02 株式会社東芝 Electronics
US8982555B2 (en) 2012-09-28 2015-03-17 Intel Corporation Electronic device having passive cooling
US9134757B2 (en) * 2012-09-28 2015-09-15 Intel Corporation Electronic device having passive cooling

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020012228A1 (en) * 1998-12-04 2002-01-31 Sony Corporation. Cooling device, cooling method, and electronic apparatus
US20060243878A1 (en) * 2005-04-27 2006-11-02 Saad David J Ventilation support for laptop computers
US20090268392A1 (en) * 2008-04-23 2009-10-29 Foxconn Technology Co., Ltd. Notebook computer having heat pipe
US20110075352A1 (en) * 2008-06-12 2011-03-31 Trentent Tye Electronic Device With Deployable Air Flow Enhancing Support
US20120130545A1 (en) * 2010-11-19 2012-05-24 International Business Machines Corporation Dynamic cooling system for electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9268377B2 (en) 2011-12-28 2016-02-23 Intel Corporation Electronic device having a passive heat exchange device
US8982555B2 (en) 2012-09-28 2015-03-17 Intel Corporation Electronic device having passive cooling
US9134757B2 (en) 2012-09-28 2015-09-15 Intel Corporation Electronic device having passive cooling

Also Published As

Publication number Publication date
CN104246648B (en) 2018-05-22
DE112013001626T5 (en) 2015-01-15
TWI571196B (en) 2017-02-11
US8982555B2 (en) 2015-03-17
US20140092542A1 (en) 2014-04-03
TW201419995A (en) 2014-05-16
CN104246648A (en) 2014-12-24

Similar Documents

Publication Publication Date Title
US8982555B2 (en) Electronic device having passive cooling
US9134757B2 (en) Electronic device having passive cooling
US9268377B2 (en) Electronic device having a passive heat exchange device
US10747277B2 (en) Laptop computer with integral cooling
JP4892078B2 (en) Electronics
US9277672B2 (en) Television, radiating member, and electronic apparatus
US20130083483A1 (en) Heat dissipation device and electronic device using same
US20120327589A1 (en) Computer system with airflow guiding duct
JP2012003130A (en) Display device and electronic apparatus
TWI544319B (en) Airflow guiding mechanism and related heat dissipating module and electronic device having the airflow guiding mechanism
US10555441B2 (en) Winds shroud and server using the same
US20190302872A1 (en) Electronic device having an active edge
JP2014127680A (en) Electronic apparatus, electronic apparatus system, method of cooling electronic apparatus and method of cooling electronic apparatus system
US20090201639A1 (en) Chassis of portable electronic apparatus
US20100214738A1 (en) Portable electronic device and dissipating structure thereof
US20160224077A1 (en) Enclosure of electronic device
CN104105379A (en) Heat radiation assembly and display card module
US20110235273A1 (en) Case and electronic device having the same
JP5066294B2 (en) Electronics
JP2013140501A (en) Information processing device
JP5717676B2 (en) Heat dissipation structure of electronic equipment
JP6669975B2 (en) Information processing device
JP4922473B2 (en) Electronics
TW201620366A (en) Heat dissipation structure of handheld device
TW201343062A (en) Electronic device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13842573

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 112013001626

Country of ref document: DE

Ref document number: 1120130016265

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13842573

Country of ref document: EP

Kind code of ref document: A1