WO2014028964A1 - A method of forming a contact for a photovoltaic cell - Google Patents
A method of forming a contact for a photovoltaic cell Download PDFInfo
- Publication number
- WO2014028964A1 WO2014028964A1 PCT/AU2013/000911 AU2013000911W WO2014028964A1 WO 2014028964 A1 WO2014028964 A1 WO 2014028964A1 AU 2013000911 W AU2013000911 W AU 2013000911W WO 2014028964 A1 WO2014028964 A1 WO 2014028964A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- region
- substrate
- passivation layer
- doping
- conductive layer
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000002161 passivation Methods 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 30
- 230000015556 catabolic process Effects 0.000 claims abstract description 12
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 230000005684 electric field Effects 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 239000002019 doping agent Substances 0.000 claims description 14
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 3
- 230000001419 dependent effect Effects 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 19
- 229910052710 silicon Inorganic materials 0.000 description 19
- 239000010703 silicon Substances 0.000 description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 8
- 239000003989 dielectric material Substances 0.000 description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 238000005334 plasma enhanced chemical vapour deposition Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1868—Passivation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a method of forming a contact for a photovoltaic (PV) cell and relates in particular, not exclusively though, to a method of forming a contact on a rear surface of the PV cell.
- PV photovoltaic
- Typical PV cells of the first generation comprise large area p-n- unctions that are formed in doped silicon. Such PV cells have a passivation layer on a rear surface and electrical contacts penetrate through the passivation layer to contact selected highly doped regions of the silicon . The alignment of the contacts relative to the selected highly doped regions of the silicon and electrical properties of the contact material influence the
- a method of forming a contact for a photovoltaic (PV) cell comprising the steps of:
- the substrate having at least one first region that has a first doping property and is located at a first surface portion;
- the substrate comprises at least one second region that is adjacent the at least one first region and my at least in part surround the at least one first region.
- the at least one first region may have a doping property that is different to that of the at least one first region.
- the at least one first region and the at least one second region may have the same polarity.
- the at least one second region may have a p-n junction and the at least one first region may
- the method typically is conducted such the electrical breakdown is only induced between the at least one first region and the conductive layer and not between the at least one second region and the conductive layer.
- the method typically is conducted such that the
- passivation properties of the passivation layer material that is adjacent the formed contact are substantially unaffected.
- Embodiments of the invention have significant advantages. As the dielectric breakdown is induced only at the
- the contact is effectively self-aligned.
- the method typically is conducted such that a plurality of contacts is formed. Further, the method typically is conducted such that the contact is formed on a rear surface of the PV cell.
- the doping property is a doping
- the doping property may be a type of doping material.
- the at least one first region has a higher doping concentration than the at least one second region.
- the at least one first region may be doped with boron or any other suitable dopant material.
- the dopant concentration of the at least one first region may range from lel8/cm 3 to le21/cm 3 , such as approximately le20/cm 3 .
- the at least one second region may also be doped with boron or with any other suitable dopant material.
- the dopant concentration of the at least one second region may range from lel5/cm 3 to lel7/cm 3 , such as approximately lel6/cm 3 .
- the step of providing the substrate comprises forming the at least one first region. Forming the at least one first region may comprise thermal
- forming the at least one first region comprises laser doping. Forming the at least one first region may comprise
- the layer may include the dopant material, such as boron or any other suitable material.
- the layer may be formed by spin-on deposition.
- forming the at least one first region may comprise directing a laser beam selectively towards the at least one first surface portion such that the dopant material diffuses into the substrate and thereby forms the at least one first region.
- the method may further comprise removing the layer that functions as a dopant source when the at least one first region has been formed.
- Removing the layer may comprise rinsing, RCA cleaning and/or selective etching.
- the substrate is a p-type substrate, such as a p-type silicon wafer.
- the substrate may be selectively doped in the above- described manner and consequently the at least one first region may have a higher p-dopant concentration than some or all of the remaining regions of the substrate.
- the substrate may also be an n-type
- substrate and the at least one first region may have a concentration of an n-type dopant that is higher than that of some or all of the remaining regions of the substrate.
- the step of depositing the passivation layer onto the at least a portion of the substrate is conducted by virtue of chemical vapour deposition, such as plasma-enhanced chemical vapour deposition.
- the passivation layer may comprise amorphous silicon or any other suitable dielectric material.
- the step of depositing the conductive layer over the passivation layer may be conducted using thermal
- the conductive layer may be deposited over the passivation layer using sputtering or any other physical or chemical deposition technique.
- the material of the conductive layer may be selected based on the doping property of the at least one first region. For example, if the at least one first region is p-doped, the material of the conductive layer may be selected from suitable acceptor materials and may, for example, be aluminium. Alternatively, if the at least one first region is n- doped, the material of the conductive layer may be
- suitable donor materials such as arsenic.
- the method may further comprise a step of removing at least a portion of the conductive layer.
- a method of forming a photovoltaic cell comprising forming a contact in accordance with the first aspect of the present invention.
- a photovoltaic cell formed by the method in accordance with the second aspect of the present invention
- Figure 1 is a flow diagram illustrating a method of forming a contact for a photovoltaic cell in accordance with an embodiment of the invention.
- FIGS 2 to 7 illustrate the formation of components of the photovoltaic cell formed in accordance with
- the contact is formed on a rear surface of the PV cell that will not receive primary illumination.
- the PV cell comprises suitably doped silicon.
- Figure 1 shows a flow diagram illustrating a method 10 of forming a contact on a rear surface of the PV cell.
- Figures 2 to 7 illustrate the formation of the PV cell and show partially fabricated components.
- a substrate 22 is provided.
- the substrate 22 is a p-type silicon wafer.
- the doping concentration of the p-type Silicon wafer is approximately lel6/cm 3 .
- the PV cell further comprises a layer (not shown) on a front surface portion of the substrate 22 which receives primary (solar) illumination when the PV cell is in use. Together with the substrate 22, this layer, which may for example be a thin n-type layer, is arranged to form a p-n junction .
- a plurality of first regions 24 is formed within the substrate 22 (only one first region is shown in Figures 2 to 7) .
- the first regions 24 are located at respective first (rear) surface portions of the substrate 22 as exemplarily shown in Figure 3.
- the first regions are in the form of islands.
- the first regions 24 have a doping concentration that differs from that of adjacent regions of the p-type silicon wafer 22.
- the first regions are heavily p-doped and have p-doping concentration that is higher than that of adjacent regions of the p-type silicon wafer 22.
- the heavily p-doped region 24 has a p-doping concentration of approximately le20/cm 3 .
- the first region may also have a doping property other that a doping concentration that is different to that of adjacent regions.
- the doping property may be
- the heavily p-doped regions 24 may be formed using any suitable method and in this example these regions are formed using laser doping.
- Forming the heavily p-doped regions 24 comprises depositing a material that functions as a dopant source onto the surface portions of the heavily p-doped regions 24.
- a spin on liquid containing boron is deposited on the rear surface portions of the p-type silicon wafer 22.
- a laser beam is then directed onto the formed film in a manner such that boron diffuses selectively into the silicon wafer 22 to form the heavily p-doped region 24.
- the film is
- Step 13 deposits a passivation layer 26 over the rear surface portions of the silicon wafer 22.
- the passivation layer 26 is an amorphous silicon layer and has a thickness in the range of 30 to 120nm, in particular in the range of 50 to 70nm, such as
- Step 14 deposits a conductive layer 28 on the amorphous silicon layer 26.
- the conductive layer 28 is an aluminium layer.
- the aluminium layer 28 is deposited by virtue of thermal evaporation.
- a person skilled in the art will appreciate that other suitable methods to deposit the conductive layer are envisaged, such as sputtering.
- the conductive layer may not necessarily be formed form a metallic material .
- Step 15 applies an electric field between the aluminium layer 28 and the silicon wafer 22.
- a voltage 30 is applied in reverse bias.
- the substrate 22 is p-type and a positive voltage 30 is applied to the aluminium layer 28 as illustrated in Figure 6.
- a negative voltage is applied to the conductive layer.
- an electric field is generated across the passivation layer 26 between the aluminium layer 28 and the p-type silicon substrate 22.
- the strength of the generated electric field is higher across the region 32 that is located directly above the heavily p-doped region 24 than across adjacent regions of passivation layer.
- the heavily p- doped region 24 forms a depletion region that is narrow enough for tunnelling to occur. Consequently, the
- the passivation layer 26 is sufficiently thin such that the relatively large applied field results in a breakdown of dielectric
- the dielectric breakdown is a "hard" breakdown such that the amorphous silicon layer 26 locally loses its insulating properties.
- the permanent change in local electrical properties of the regions 32 results in the formation of an electrical contact.
- the hard dielectric breakdown is limited to the local regions 32 directly at the heavily p-doped regions 24. Regions of the passivation layer 26 that are adjacent to region 32 are not significantly affected by the applied voltage 30 and as a consequence these regions maintain the passivation properties of amorphous silicon.
- the bias voltage required to induce the hard breakdown of the dielectric material 26 generally depends on material properties of the heavily p-doped regions 24 and the dielectric material 26.
- the bias voltage typically is in the range of 5 to 30V, such as approximately 10V.
- the bias voltage increases with the resistivity of the dielectric material 26.
- the bias voltage is
- the bias voltage required to induce the hard breakdown of a 64nm thick amorphous silicon layer is in the range 2 to 5V; a lOnm thick aluminium oxide layer is in the range of 5 to 10V; an 80nm thick silicon rich silicon nitride layer is in the range 13 to 18V and a 200nm silicon nitride layer is in the range of 23 to 28V.
- a self-aligned electrical contact is formed without the requirement of patterning or masking the amorphous silicon layer 26.
- the aluminium layer 28 forms a portion of the rear contact of the PV cell as shown in Figure 7.
- the method 10 may further comprise a step of removing the aluminium layer 28.
- Advantageous embodiments of the method 10 can be used to form contacts to the base of a PV device through an emitter of a PV device.
- the steps of method 10 are carried out on a semiconductor substrate, for example a silicon wafer, which comprises a p-n junction.
- the semiconductor substrate may be a p-type silicon wafer 11 (base) and an n-type region (emitter) may be formed on a surface of the p-type silicon wafer 11 by diffusion of n-type atoms, for example phosphorous atoms.
- the remaining steps of method 10 are performed on the n- type surface of the silicon wafer 11.
- advantages of contacting the base of the PV device through the emitter of the PV device by using the method 10 include floating junction passivation, implementation of inter-digitated rear contact designs, and minimisation of shunts .
- the substrate 22 may be an n type wafer and the at least one first region may be a heavily n-doped region.
- the variations of the described method may be used to form selective contacts at a front surface of a PV cell.
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2013305471A AU2013305471C1 (en) | 2012-08-22 | 2013-08-16 | A method of forming a contact for a photovoltaic cell |
SG11201500617SA SG11201500617SA (en) | 2012-08-22 | 2013-08-16 | A method of forming a contact for a photovoltaic cell |
EP13831468.7A EP2888766A4 (en) | 2012-08-22 | 2013-08-16 | A method of forming a contact for a photovoltaic cell |
US14/423,379 US10361321B2 (en) | 2012-08-22 | 2013-08-16 | Method of forming a contact for a photovoltaic cell |
CN201380043233.3A CN104603955B (en) | 2012-08-22 | 2013-08-16 | Method of forming contact for photovoltaic cell |
KR1020157006328A KR102081393B1 (en) | 2012-08-22 | 2013-08-16 | A method of forming a contact for a photovoltaic cell |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2012903616 | 2012-08-22 | ||
AU2012903616A AU2012903616A0 (en) | 2012-08-22 | A method of forming a contact for a photovoltaic cell |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014028964A1 true WO2014028964A1 (en) | 2014-02-27 |
Family
ID=50149273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/AU2013/000911 WO2014028964A1 (en) | 2012-08-22 | 2013-08-16 | A method of forming a contact for a photovoltaic cell |
Country Status (7)
Country | Link |
---|---|
US (1) | US10361321B2 (en) |
EP (1) | EP2888766A4 (en) |
KR (1) | KR102081393B1 (en) |
CN (1) | CN104603955B (en) |
AU (1) | AU2013305471C1 (en) |
SG (2) | SG10201701426TA (en) |
WO (1) | WO2014028964A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109983584A (en) * | 2016-11-25 | 2019-07-05 | 荷兰应用自然科学研究组织 Tno | Photovoltaic cell with passivation contact |
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US5538564A (en) * | 1994-03-18 | 1996-07-23 | Regents Of The University Of California | Three dimensional amorphous silicon/microcrystalline silicon solar cells |
US20040025932A1 (en) * | 2002-08-12 | 2004-02-12 | John Husher | Variegated, high efficiency solar cell and method for making same |
US20110086468A1 (en) * | 2009-10-08 | 2011-04-14 | Yacine Felk | Assembly of semiconductor chips/wafers |
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US6972464B2 (en) * | 2002-10-08 | 2005-12-06 | Great Wall Semiconductor Corporation | Power MOSFET |
US20050172996A1 (en) * | 2004-02-05 | 2005-08-11 | Advent Solar, Inc. | Contact fabrication of emitter wrap-through back contact silicon solar cells |
JP2008028249A (en) * | 2006-07-24 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Semiconductor device, and method for manufacturing semiconductor device |
US7811900B2 (en) * | 2006-09-08 | 2010-10-12 | Silicon Genesis Corporation | Method and structure for fabricating solar cells using a thick layer transfer process |
JP5019397B2 (en) * | 2006-12-01 | 2012-09-05 | シャープ株式会社 | Solar cell and method for manufacturing the same |
JP4847889B2 (en) * | 2007-02-13 | 2011-12-28 | 株式会社日立国際電気 | Software defined radio |
ITMI20071389A1 (en) * | 2007-07-12 | 2009-01-13 | System Plast Spa | SYSTEM OF MINI CONVEYORS |
US20090022706A1 (en) * | 2007-07-20 | 2009-01-22 | Auspex Pharmaceuticals, Inc. | Substituted cyclohexenes |
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CN101855730A (en) * | 2007-11-09 | 2010-10-06 | 夏普株式会社 | Solar battery module and method for manufacturing solar battery module |
JP5286046B2 (en) * | 2007-11-30 | 2013-09-11 | 株式会社半導体エネルギー研究所 | Method for manufacturing photoelectric conversion device |
US20090227061A1 (en) * | 2008-03-05 | 2009-09-10 | Nicholas Bateman | Establishing a high phosphorus concentration in solar cells |
DE102010025968B4 (en) * | 2010-07-02 | 2016-06-02 | Schott Ag | Generation of microholes |
-
2013
- 2013-08-16 EP EP13831468.7A patent/EP2888766A4/en not_active Withdrawn
- 2013-08-16 AU AU2013305471A patent/AU2013305471C1/en not_active Ceased
- 2013-08-16 KR KR1020157006328A patent/KR102081393B1/en active IP Right Grant
- 2013-08-16 WO PCT/AU2013/000911 patent/WO2014028964A1/en active Application Filing
- 2013-08-16 SG SG10201701426TA patent/SG10201701426TA/en unknown
- 2013-08-16 CN CN201380043233.3A patent/CN104603955B/en active Active
- 2013-08-16 SG SG11201500617SA patent/SG11201500617SA/en unknown
- 2013-08-16 US US14/423,379 patent/US10361321B2/en active Active
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US5538564A (en) * | 1994-03-18 | 1996-07-23 | Regents Of The University Of California | Three dimensional amorphous silicon/microcrystalline silicon solar cells |
US20040025932A1 (en) * | 2002-08-12 | 2004-02-12 | John Husher | Variegated, high efficiency solar cell and method for making same |
US20110086468A1 (en) * | 2009-10-08 | 2011-04-14 | Yacine Felk | Assembly of semiconductor chips/wafers |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN109983584A (en) * | 2016-11-25 | 2019-07-05 | 荷兰应用自然科学研究组织 Tno | Photovoltaic cell with passivation contact |
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KR102081393B1 (en) | 2020-02-25 |
US20150303324A1 (en) | 2015-10-22 |
EP2888766A4 (en) | 2016-04-06 |
US10361321B2 (en) | 2019-07-23 |
CN104603955B (en) | 2017-04-19 |
CN104603955A (en) | 2015-05-06 |
SG10201701426TA (en) | 2017-03-30 |
AU2013305471A1 (en) | 2015-02-19 |
AU2013305471C1 (en) | 2018-08-23 |
SG11201500617SA (en) | 2015-03-30 |
EP2888766A1 (en) | 2015-07-01 |
KR20150046107A (en) | 2015-04-29 |
AU2013305471B2 (en) | 2018-05-17 |
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