WO2014024593A1 - Ceramic electronic component - Google Patents

Ceramic electronic component Download PDF

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Publication number
WO2014024593A1
WO2014024593A1 PCT/JP2013/067353 JP2013067353W WO2014024593A1 WO 2014024593 A1 WO2014024593 A1 WO 2014024593A1 JP 2013067353 W JP2013067353 W JP 2013067353W WO 2014024593 A1 WO2014024593 A1 WO 2014024593A1
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WO
WIPO (PCT)
Prior art keywords
insulating resin
layers
formed
electrode layer
layer
Prior art date
Application number
PCT/JP2013/067353
Other languages
French (fr)
Japanese (ja)
Inventor
大沢隆司
Original Assignee
株式会社村田製作所
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Filing date
Publication date
Priority to JP2012-176859 priority Critical
Priority to JP2012176859 priority
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2014024593A1 publication Critical patent/WO2014024593A1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

Abstract

Provided is a ceramic electronic component whereby reducing a proportion which conductive resin electrode layers occupy of external electrodes is possible, and economy is superior. A ceramic electronic component comprises a ceramic substrate (1), and external electrodes (5a, 5b) which are formed on the surface of the ceramic substrate. The external electrodes are configured to further comprise: metallic electrode layers (51a, 51b) which are formed upon the surface of the ceramic substrate and have a metal as a primary constituent thereof; insulating resin layers (52a, 52b) formed from an insulating resin, which are formed upon the metallic electrode layers such that primary portions of the metallic electrode layers, except the peripheral edge parts, are covered, and the peripheral edge parts are exposed; and conductive resin electrode layers (53a, 53b) formed from a resin including a conductive material, which are formed upon the insulating resin layers such that the insulating resin layers are covered, leading end parts reach to the peripheral edge parts of the metallic electrode layers which are not covered by the insulating resin layers, and contact is made with the metallic electrode layers.

Description

Ceramic electronic components

The present invention relates to a ceramic electronic component, and more particularly, to a ceramic electronic component including a ceramic body and external electrodes formed on the surface thereof.

A chip-type multilayer ceramic capacitor, which is one of typical ceramic electronic components, is generally a multilayer ceramic capacitor element (ceramic body) in which a plurality of internal electrodes are stacked via a ceramic layer which is a dielectric layer. The external electrodes are arranged on a pair of end faces facing each other so as to be electrically connected to the internal electrodes.

As a ceramic electronic component having such a structure, for example, a ceramic electronic component (multilayer capacitor) having a structure as shown in FIG. 2 has been proposed (see Patent Document 1).

In this ceramic electronic component (multilayer capacitor), a pair of external electrodes 130 are arranged so as to go from the first and second end faces 110c, 110d of the ceramic body 110 to the first and second side faces. Each external electrode 130 has a first metal electrode layer 132 and a conductive resin electrode layer 134.

The first metal electrode layer 132 contains a metal as a main component, the first portion 132a formed on the first and second end faces 110c and 110d, and the first and second side faces. 110a, 110b and a second portion 132b formed so as to go around.

The conductive resin electrode layer 134 contains a conductive material and covers the first and second portions 132a and 132b over the first and second portions 132a and 132b of the first metal electrode layer 132. At the same time, it is formed so as not to contact the ceramic body 110.

Furthermore, a second metal layer 136 made of, for example, a Ni plating film and a third metal electrode layer 138 made of a plating film such as Sn or Sn alloy are formed on the conductive resin electrode layer 134. .

And since the ceramic electronic component of this patent document 1 is equipped with the above structures, the conductive resin electrode layer absorbs the bending of the external electrode and suppresses or prevents the occurrence of cracks due to thermal shock. In addition, it is possible to prevent the peeling of the conductive resin electrode layer 134 and to obtain a highly reliable ceramic electronic component.

However, in the ceramic electronic component of Patent Document 1, the proportion of the conductive resin electrode layer in the external electrode is large, and the conductive resin used for forming the conductive resin electrode layer is expensive, so the material cost increases. However, there is a problem that the manufacturing cost of the ceramic electronic component as a product is increased.

JP 2008-181956 A

The present invention solves the above problems, and without sacrificing the thermal shock resistance and difficulty of peeling of the external electrode, it is possible to reduce the proportion of the conductive resin electrode layer in the external electrode, An object of the present invention is to provide an economical ceramic electronic component.

In order to solve the above problems, the ceramic electronic component of the present invention is:
A ceramic electronic component comprising a ceramic body and external electrodes formed on the surface of the ceramic body,
The external electrode is
A metal electrode layer mainly composed of metal formed on the surface of the ceramic body;
An insulating resin layer made of an insulating resin, which covers the main part of the metal electrode layer and is formed on the metal electrode layer so as to expose a peripheral edge;
The insulating resin layer is coated on the insulating resin layer so that the tip portion reaches the peripheral edge of the metal electrode layer not covered with the insulating resin layer and is in contact with the metal electrode layer. And a conductive resin electrode layer made of a resin containing a conductive material.

In the ceramic electronic component of the present invention, the insulating resin layer may be formed so that a tip portion thereof does not reach the surface of the ceramic body and does not contact the surface of the ceramic body. preferable.
By providing the above configuration, it is possible to suppress peeling of the insulating resin layer and improve reliability.

Moreover, it is preferable that the surface of the said conductive resin electrode layer is coat | covered with the plating film layer.
By providing the above-described configuration, it is possible to improve characteristics such as solderability, and to make the present invention more effective.

In the ceramic electronic component of the present invention, the external electrode has a metal electrode layer formed on the surface of the ceramic body, and an insulating resin layer formed on the metal electrode layer so as to expose the peripheral edge of the metal electrode layer. And a conductive resin electrode layer that covers the insulating resin layer and has a tip (peripheral edge) that reaches the peripheral edge of the metal electrode layer not covered with the insulating resin layer and is in contact with the metal electrode layer. Therefore, it is possible to replace a part of the expensive conductive resin electrode layer with an inexpensive insulating resin layer that does not contain a conductive material while ensuring the thermal shock resistance of the external electrode and the difficulty of peeling. Thus, the ratio (volume ratio) of the conductive resin electrode layer occupying the entire external electrode can be reduced, and a ceramic electronic component having excellent economy can be obtained.

That is, according to the present invention, when the characteristics such as thermal shock resistance are ensured by the conductive resin electrode layer as in the prior art (the resin-containing layer without combining the insulating resin layer and the conductive resin electrode layer). The ratio of the conductive resin electrode layer occupying the external electrode can be reduced, and the cost of the entire product can be reduced as compared with the case where all are made conductive resin electrode layers.

In addition, according to the present invention, it is possible to reduce the manufacturing cost while maintaining the dimensions and shape of the external electrode as compared with the conventional case where the resin-containing layer is entirely made of a conductive resin electrode layer.

It is sectional drawing which shows the structure of the ceramic electronic component (multilayer ceramic capacitor) concerning one Embodiment of this invention. It is sectional drawing which shows the conventional ceramic electronic component (multilayer ceramic capacitor).

Embodiments of the present invention will be described below, and the features of the present invention will be described in more detail.

[Embodiment 1]
FIG. 1 is a cross-sectional view showing a configuration of a ceramic electronic component (a multilayer ceramic capacitor in the first embodiment) according to one embodiment (first embodiment) of the present invention. As shown in FIG. 1, in this multilayer ceramic capacitor A, a multilayer ceramic capacitor element (ceramic body) 1 in which a plurality of internal electrodes 2a and 2b are stacked is opposed to each other via a ceramic layer 3 which is a dielectric layer. The pair of end faces 4a and 4b has a structure in which a pair of external electrodes 5a and 5b are disposed so as to be electrically connected to the internal electrodes 2a and 2b.

The external electrodes 5a and 5b are
(A) Metal electrode layers (a copper electrode layer which is a thick film electrode in the first embodiment) 51a and 51b formed on the surface of the ceramic body 1 and containing metal as a main component;
(B) The main part excluding the peripheral part of the metal electrode layers 51a and 51b is covered, but the peripheral part is exposed, and is made of an insulating resin formed on the metal electrode layers 51a and 51b. Resin layers 52a and 52b;
(C) The insulating resin layers 52a and 52b are covered, and the tip portions (peripheral portions) reach the peripheral portions of the metal electrode layers 51a and 51b that are not covered by the insulating resin layers 52a and 52b. Conductive resin electrode layers 53a and 53b made of a resin containing a conductive material, formed on the insulating resin layers 52a and 52b in such a manner as to contact the layers 51a and 51b;
(D) Nickel plating film layers 54a and 54b disposed so as to cover the conductive resin electrode layers 53a and 53b, and tin plating films disposed so as to cover the nickel plating film layers 54a and 54b. And layers 55a and 55b.

As described above, the insulating resin layers 52a and 52b cover the main part except the peripheral part of the metal electrode layers 51a and 51b, but the tip part (peripheral part) is the peripheral edge of the metal electrode layers 51a and 51b. It is formed only up to the region in front of the part and is not in contact with the surface of the ceramic body 1.

The conductive resin electrode layers 53a and 53b also cover the insulating resin layers 52a and 52b, and the tip portions (peripheral portions) reach the peripheral portions of the metal electrode layers 51a and 51b. Although it is electrically connected to 51 b, it does not reach the surface of the ceramic body 1, and is arranged in such a manner that it does not contact the surface of the ceramic body 1.

The dimensions of each part of the multilayer ceramic capacitor A according to the first embodiment are as follows.

<Ceramic body>
Length: 3.2mm, width: 2.5mm, height: 2.5mm

<Metal electrode layer>
(A) Thickness of the metal electrode layers 51a and 51b on the end faces 4a and 4b of the ceramic body 1: 50 μm
(B) Length (e 1 ) of the portion of the metal electrode layers 51a and 51b that wraps around from the end surface of the ceramic body 1 to the side surface: 400 μm

<Insulating resin layer>
(A) Thickness of the insulating resin layers 52a and 52b on the end faces 4a and 4b of the ceramic body 1: 80 μm
(B) Dimensions (e 2 ) of the portions of the insulating resin layers 52a and 52b that wrap around the side surfaces from the end faces 4a and 4b of the ceramic body 1: 200 μm

<Conductive resin electrode layer>
(A) Thickness of the conductive resin electrode layers 53a, 53b on the end faces 4a, 4b of the ceramic body 1: 30 μm
(B) Size (e 3 ) of the portion of the conductive resin electrode layers 53a and 53b that wraps around from the end surfaces 4a and 4b of the ceramic body 1 to the side surface: 300 μm

<Nickel plating film layer>
(A) Thickness of the nickel plating film layers 54a and 54b on the end faces 4a and 4b of the ceramic body 1: 3.5 μm
The dimensions of the portions of the nickel plating film layers 54a and 54b that wrap around from the end faces 4a and 4b of the ceramic body 1 to the side faces of the metal electrodes 51a and 51b from the end faces 4a and 4b of the ceramic body 1 to the side faces. It is the same as the dimension (e 1 ) of the wraparound part.

<Tin plating film layer>
(A) Thickness of the tin plating film layers 55a and 55b on the end faces 4a and 4b of the ceramic body 1: 3.5 μm
The dimensions of the portions of the tin plating film layers 55a and 55b that wrap around from the end faces 4a and 4b of the ceramic body 1 to the side faces of the metal electrodes 51a and 51b from the end faces 4a and 4b of the ceramic body 1 to the side faces. It is the same as the dimension (e 1 ) of the wraparound part.

Next, a method for manufacturing the above-described multilayer ceramic capacitor A will be described.
(1) In manufacturing the above-described multilayer ceramic capacitor A, first, the ceramic body 1 is prepared. There are no particular restrictions on the method of manufacturing the ceramic body 1, and for example, it can be manufactured through a process of laminating ceramic green sheets having internal electrode patterns formed on the surface by applying a conductive paste. Furthermore, the present invention is not limited to the above-described laminating method, and it can be manufactured by a method of forming a laminated body by sequentially applying ceramic slurry, conductive paste, or the like.

(2) Next, a conductive paste containing copper powder as a conductive component is applied to the surface of the ceramic body 1 and baked to form metal electrode layers (copper electrode layers) 51a and 51b mainly containing metal. To do. In the first embodiment, the metal electrode layers (copper electrode layers) 51a and 51b are so-called thick film electrodes.

(3) Then, the metal electrode layers 51a and 51b formed on the ceramic body 1 are covered with the main portion except the peripheral portion, but the peripheral portion is exposed, with the bis A epoxy resin (JER828) and The resin (bis A epoxy resin / imidazole = 100/5 phr) blended with imidazole (2E4MZ) is applied onto the copper electrode layers (metal electrode layers) 51a and 51b and cured, whereby the insulating resin layers 52a, 52b is formed. In forming the insulating resin layers 52 a and 52 b, the insulating resin layers 52 a and 52 b are formed so that their tip portions (peripheral portions) do not contact the surface of the ceramic body 1.

(4) Next, bis A epoxy resin (JER828), imidazole (2E4MZ), spherical silver powder (D 50 = 1.0 μm), flat silver powder (D 50 = 3.5 μm), butyl carbite Conductive resin material blended with Thor (bis A epoxy resin / imidazole / spherical silver powder / flat silver powder / butyl carbitol = 100/5/350/350/70 phr) and covering the insulating resin layers 52a and 52b At the same time, the coating is performed so that the front end portions (peripheral portions) reach the peripheral portions of the metal electrode layers 51a and 51b that are not covered with the insulating resin layers 52a and 52b and come into contact with the metal electrode layers 51a and 51b.
Then, the applied conductive resin film is dried at 100 ° C. for 5 hours, and then heated and cured at 120 ° C. for 1 hour to form the conductive resin electrode layers 53a and 53b.

(5) Next, nickel electroplating is performed to form nickel plating film layers 54a and 54b so as to cover the conductive resin electrode layers 53a and 53b.

(6) Further, tin electroplating is performed to form tin plating film layers 55a and 55b so as to cover the nickel plating film layers 54a and 54b.
Thereby, a multilayer ceramic capacitor A having a structure as shown in FIG. 1 is obtained.

In this multilayer ceramic capacitor, an insulating resin not containing a conductive substance is used in combination with a conductive resin having a desired conductivity. Therefore, the ratio of the resin layer in the external electrode absorbs the deflection. Thus, even when the ratio is necessary to achieve sufficient thermal shock resistance, a part of the expensive conductive resin can be replaced with a low-cost insulating resin. As a result, cost reduction can be achieved without causing deterioration of characteristics such as thermal shock resistance.

Specifically, in the case of the configuration of the first embodiment, the dimensions and shape are compared with the case where the resin layers are all conductive resin electrode layers without combining the insulating resin layers and the conductive resin electrode layers. While maintaining this, the cost of the entire product can be reduced by 3.2%.

Further, since the insulating resin layer and the conductive resin electrode layer are arranged in such a manner that the peripheral tip portion thereof is not in contact with the ceramic body, the above-mentioned insulating resin layer and conductive resin electrode layer are provided. Thus, it is possible to obtain a highly reliable multilayer ceramic capacitor that can prevent such peeling.

[Embodiment 2]
In the first embodiment, a resin (bis A epoxy resin / imidazole = 100/5 phr) containing bis A epoxy resin (JER828) and imidazole (2E4MZ) was used as the insulating resin. Then, as the insulating resin, bis A epoxy resin (JER828), imidazole (2E4MZ), and spherical silica (Toa Gosei HPS-3500), bis A epoxy resin / imidazole / spherical silica = 100/5/50 phr. A monolithic ceramic capacitor was produced using the compounded in proportion.

In the second embodiment, a laminated ceramic capacitor was manufactured through the same process under the same conditions as in the first embodiment except that the insulating resin having the above-described composition was used.

In the case of the second embodiment, the same operation and effect as in the first embodiment can be obtained.

Specifically, in the case of the configuration of the second embodiment, the dimensions and shape are compared with the case where the resin layers are all conductive resin electrode layers without combining the insulating resin layers and the conductive resin electrode layers. While maintaining this, the cost of the entire product can be reduced by 3.8%.

In the first and second embodiments, the chip-type multilayer ceramic capacitor has been described as an example of the ceramic electronic component. However, the present invention is not limited to the multilayer ceramic capacitor, and for example, a ceramic body such as an LC composite component or a multilayer varistor. The present invention can be applied to various ceramic electronic components having external electrodes on the surface thereof.

In the first and second embodiments, the insulating resin layer is formed by using bis A epoxy resin / imidazole = 100/5 phr insulating resin or bis A epoxy resin / imidazole / spherical silica = 100/5/50 phr. Although the insulating resin is used, for example, other insulating resins such as other epoxy resins, phenol resins, urethane resins, polyimide resins, and silicon resins can be used.

In the first and second embodiments, the conductive resin electrode layer is formed by the conductivity of bis A epoxy resin / imidazole / spherical silver powder / flat silver powder / butyl carbitol = 100/5/350/70 phr). Resin was used, but as conductive resin for forming conductive resin electrode layer, for example, other epoxy resin, phenol resin, urethane resin, polyimide resin, silicon resin, etc., copper powder, silver coating It is also possible to use conductive resins having other compositions such as those containing conductive powders such as copper powder, tin-coated copper powder, nickel powder, silver-coated nickel powder and tin powder.

In the first and second embodiments, the case where the plating film layer is a nickel plating film layer and a tin plating film layer has been described as an example. However, a plating film made of other types of materials may be used.
In some cases, it is possible to adopt a configuration in which no plating film layer is provided.

The present invention is not limited to Embodiments 1 and 2 in other points, and various applications and modifications can be added within the scope of the invention.

1 Ceramic body (multilayer ceramic capacitor element)
2a, 2b Internal electrode 3 Ceramic layer 4a, 4b A pair of opposite end faces 5a, 5b of the ceramic body 5a, 5b External electrode 51a, 51b Metal electrode layer (copper electrode layer)
52a, 52b Insulating resin layer 53a, 53b Conductive resin electrode layer 54a, 54b Nickel plating film layer 55a, 55b Tin plating film layer e 1 Length of the portion of the metal electrode layer that extends from the end surface to the side surface of the ceramic body e 2 Length of the portion of the insulating resin layer that extends from the end surface of the ceramic body to the side surface e 3 Length of the portion of the conductive resin electrode layer that extends from the end surface of the ceramic body to the side surface A Multilayer ceramic capacitor ( Ceramic electronic components)

Claims (3)

  1. A ceramic electronic component comprising a ceramic body and external electrodes formed on the surface of the ceramic body,
    The external electrode is
    A metal electrode layer mainly composed of metal formed on the surface of the ceramic body;
    An insulating resin layer made of an insulating resin, which covers the main part of the metal electrode layer and is formed on the metal electrode layer so as to expose a peripheral edge;
    The insulating resin layer is coated on the insulating resin layer so that the tip portion reaches the peripheral edge of the metal electrode layer not covered with the insulating resin layer and is in contact with the metal electrode layer. A ceramic electronic component comprising: a conductive resin electrode layer made of a resin containing a conductive material.
  2. 2. The ceramic electronic according to claim 1, wherein the insulating resin layer is formed so that a tip portion thereof does not reach a surface of the ceramic body and does not contact a surface of the ceramic body. 3. parts.
  3. 3. The ceramic electronic component according to claim 1, wherein a surface of the conductive resin electrode layer is covered with a plating film layer.
PCT/JP2013/067353 2012-08-09 2013-06-25 Ceramic electronic component WO2014024593A1 (en)

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JP2012-176859 2012-08-09
JP2012176859 2012-08-09

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015090977A (en) * 2013-11-05 2015-05-11 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic capacitor
JP2016134616A (en) * 2015-01-20 2016-07-25 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic electronic component, manufacturing method therefor, and circuit board mounting electronic component

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019220602A (en) * 2018-06-21 2019-12-26 株式会社村田製作所 Electronic component and method of manufacturing electronic component
KR102101933B1 (en) * 2018-09-06 2020-04-20 삼성전기주식회사 Multi-layered ceramic electronic componentthe

Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH0684687A (en) * 1992-08-31 1994-03-25 Toshiba Corp Ceramic chip component and mounting structure therefor
JPH10135073A (en) * 1996-10-30 1998-05-22 Matsushita Electric Ind Co Ltd Composite ceramic electronic part and its manufacture
JP2011137128A (en) * 2009-12-04 2011-07-14 Murata Mfg Co Ltd Conductive resin composition and chip-type electronic component
JP2011171650A (en) * 2010-02-22 2011-09-01 Kyocera Corp Circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684687A (en) * 1992-08-31 1994-03-25 Toshiba Corp Ceramic chip component and mounting structure therefor
JPH10135073A (en) * 1996-10-30 1998-05-22 Matsushita Electric Ind Co Ltd Composite ceramic electronic part and its manufacture
JP2011137128A (en) * 2009-12-04 2011-07-14 Murata Mfg Co Ltd Conductive resin composition and chip-type electronic component
JP2011171650A (en) * 2010-02-22 2011-09-01 Kyocera Corp Circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015090977A (en) * 2013-11-05 2015-05-11 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic capacitor
KR20150051667A (en) * 2013-11-05 2015-05-13 삼성전기주식회사 Multi-Layered Ceramic Capacitor
KR101983154B1 (en) 2013-11-05 2019-05-28 삼성전기주식회사 Multi-Layered Ceramic Capacitor
JP2016134616A (en) * 2015-01-20 2016-07-25 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic electronic component, manufacturing method therefor, and circuit board mounting electronic component

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JPWO2014024593A1 (en) 2016-07-25

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