WO2014020862A1 - グラビアオフセット印刷用凹版および印刷配線基材 - Google Patents

グラビアオフセット印刷用凹版および印刷配線基材 Download PDF

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Publication number
WO2014020862A1
WO2014020862A1 PCT/JP2013/004483 JP2013004483W WO2014020862A1 WO 2014020862 A1 WO2014020862 A1 WO 2014020862A1 JP 2013004483 W JP2013004483 W JP 2013004483W WO 2014020862 A1 WO2014020862 A1 WO 2014020862A1
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WO
WIPO (PCT)
Prior art keywords
pattern
printing
intaglio
gravure offset
offset printing
Prior art date
Application number
PCT/JP2013/004483
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English (en)
French (fr)
Japanese (ja)
Inventor
健太郎 窪田
Original Assignee
凸版印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 凸版印刷株式会社 filed Critical 凸版印刷株式会社
Priority to JP2014527971A priority Critical patent/JP6217639B2/ja
Priority to CN201380035908.XA priority patent/CN104411502B/zh
Publication of WO2014020862A1 publication Critical patent/WO2014020862A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/04—Printing plates or foils; Materials therefor metallic
    • B41N1/06—Printing plates or foils; Materials therefor metallic for relief printing or intaglio printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/12—Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Definitions

  • the present invention relates to an intaglio used for gravure offset printing, and a printed wiring substrate provided with a wiring pattern formed by gravure offset printing using the intaglio.
  • Gravure offset printing is a method for stably printing excellent images with high resolution and high dimensional accuracy over a wide area using various high-viscosity coating materials such as various inks, resins, and conductive pastes on the surface of printing objects. It is a technique to do.
  • Fig. 1 shows a general gravure offset printing process.
  • Gravure offset printing is a process of filling the ink 102 with a doctor, squeegee or scraper 103 into the pattern portion 104 of the gravure offset printing intaglio 101 made of glass, resin, metal, etc. (step 1), and the pattern portion.
  • a gravure offset printing intaglio 101 filled with ink 102 in 104 is rotated while contacting a transfer body 111 having a transfer layer 112 formed of a resin such as silicone on the surface, and an ink film is formed on the transfer layer 112.
  • a step of transferring 113 (step 2), and a step of pressure-bonding the transfer body 111 to the printing body 121 and transferring the print pattern 122 of the ink film 113 remaining on the transfer layer 112 to the printing body 121 (step 3).
  • a transfer printing method In this gravure offset printing, coating materials having high viscosity such as various inks, resins, and conductive pastes can be printed on the surface of a printing medium in a wide range with high resolution and high dimensional accuracy.
  • the ink filled in the desired pattern portion provided in the intaglio is reliably transferred onto the transfer layer having ink releasability. Is required.
  • the ink is filled in the desired pattern part with a doctor, squeegee or scraper in advance, and the ink surface filled in the pattern part is smoothed, and the ink peelability It is necessary for the ink surface to be in uniform contact with the transfer body when it is pressure-bonded to the transfer body having the transfer layer.
  • Patent Document 1 specifically describes means for smoothing the ink surface filled in the pattern portion of the intaglio, bringing the ink surface into contact with the transfer body evenly, and reliably transferring the ink surface onto the transfer layer.
  • the pattern to be printed exists continuously substantially perpendicular to the printing progress direction
  • the transfer body is rotated while contacting the intaglio
  • the distortion of the transfer layer generated inside the continuous pattern portion of the intaglio The problem is that the shape of the ink film transferred to the transfer layer changes continuously because the behavior is different within each continuous pattern part of the intaglio that exists continuously perpendicular to the direction of movement of the transfer body. Occurs. This problem becomes more prominent as high-definition fine line patterns are formed in gravure offset printing.
  • an object of the present invention is to prevent a change in the shape of a continuous pattern in the printing direction, particularly a continuous fine line pattern, and to stably supply a printed wiring substrate having a high-definition wiring pattern.
  • one aspect of the present invention is a gravure offset printing intaglio having a pattern part for forming a wiring pattern, wherein a part of the pattern part is in a printing direction.
  • a plurality of fine line-shaped pattern portions extending in a substantially vertical direction and continuously arranged in the printing direction; (a) a dummy pattern portion is provided at the upper end in the printing direction of the plurality of fine line-shaped pattern portions; (B) Of the plurality of fine line-shaped pattern portions, the line width of the pattern portion located at the start end in the printing direction satisfies any one of the narrower than the line width of the pattern portion located at the end in the printing direction. It is characterized by.
  • the line width of the plurality of fine line-shaped pattern portions is 10 ⁇ m or more and 5 mm or less, and the distance between the lines is 10 ⁇ m or more and 100 ⁇ m or less.
  • another aspect of the present invention is a printed wiring substrate including a wiring pattern formed by gravure offset printing, wherein a part of the wiring pattern extends in a direction substantially perpendicular to the printing direction and extends in the printing direction.
  • a plurality of fine line-shaped wiring patterns arranged side by side; (a) having a dummy pattern at the upper end in the printing direction of the plurality of fine line-shaped wiring patterns; and (b) a plurality of fine line-shaped wiring patterns.
  • the line width of the plurality of thin line-shaped wiring patterns is 10 ⁇ m or more and 5 mm or less, and the distance between the lines is 10 ⁇ m or more and 100 ⁇ m or less.
  • the intaglio for gravure offset printing of the present invention By using the intaglio for gravure offset printing of the present invention, it becomes possible to perform printing with high reproducibility without a change in shape on a thin line-like wiring pattern continuous in the printing direction.
  • the effect of the gravure offset printing intaglio according to the present invention becomes more prominent as the wiring pattern becomes thinner, it is suitable for forming a fine wiring pattern.
  • FIG. 1 is a process diagram of gravure offset printing according to the present invention.
  • FIG. 2 is a top view of an intaglio for gravure offset printing having a pattern portion having a conventional shape.
  • FIG. 3 is a top view showing an embodiment of an intaglio for gravure offset printing according to the present invention.
  • FIG. 4 is a top view showing an embodiment of the gravure offset printing intaglio according to the present invention.
  • FIG. 5 is a top view showing the gravure offset printing intaglio according to Example 1.
  • FIG. 6 is a top view showing an intaglio for gravure offset printing according to Example 2.
  • FIG. 1 is a process diagram of gravure offset printing according to the present invention.
  • FIG. 2 is a top view of an intaglio for gravure offset printing having a pattern portion having a conventional shape.
  • FIG. 3 is a top view showing an embodiment of an intaglio for gravure offset printing according to the present invention.
  • FIG. 4
  • FIG. 1 is a process chart of the general gravure offset printing described above.
  • the ink 102 is put on the gravure offset printing intaglio 101, and the gravure is rolled while the ink 102 is rolled in the direction of the arrow in the figure by a doctor, a squeegee or a scraper 103.
  • the ink 102 is filled into the pattern portion 104 of the intaglio 101 for gravure offset printing.
  • the pattern portion 104 of the intaglio 101 for gravure offset printing is formed by a groove having a width of about 10 ⁇ m to 5 mm and a depth of about 5 ⁇ m to 20 ⁇ m.
  • the distance between the grooves is about 10 ⁇ m to 100 ⁇ m, preferably 20 to 50 ⁇ m.
  • the present invention is particularly effective for an intaglio for gravure offset printing having a groove having a width of about 10 ⁇ m to 100 ⁇ m, and having a distance between the grooves of about 10 ⁇ m to 100 ⁇ m, and further 20 ⁇ m to 50 ⁇ m.
  • the gravure offset printing intaglio 101 has a smooth surface. Thereby, it is possible to print without causing ink leakage to the surface of the intaglio. Further, chipping of a doctor or the like can be suppressed.
  • the surface of the intaglio 101 for gravure offset printing is the surface in contact with the doctor, squeegee or scraper 103 in the intaglio 101 for gravure offset printing, or the inner surface of the pattern portion 104 (groove) of the intaglio 101 for gravure offset printing. I mean. Note that the surface of the gravure offset printing intaglio 101 can be smoothed by rough surface polishing, mirror polishing, or ultra-precision polishing (lapping or polishing).
  • Examples of the method for forming the pattern portion 104 of the intaglio 101 for gravure offset printing include an etching method, an electroforming method, and a sand blast method. From the viewpoint of workability by these forming methods, the gravure offset printing intaglio 101 is preferably made of glass or a metal such as copper or nickel. Further, it is desirable to form a rubbing resistant film of chromium or carbon on the surface.
  • the doctor, squeegee or scraper 103 needs to be filled with the ink 102 in the pattern portion 104 of the gravure offset printing intaglio 101 and scrape the ink 102 on the gravure offset printing intaglio 101 to some extent. Flexibility is required. Therefore, the doctor, squeegee or scraper 103 is preferably made of a metal such as stainless steel, a resin such as urethane, or a ceramic.
  • the transfer body 111 having the transfer layer 112 is rotated and moved on the intaglio plate 101 for gravure offset printing in which the pattern portion 104 is filled with the ink 102, and gravure offset printing is performed.
  • the ink 102 in the pattern portion 104 of the intaglio 101 is transferred to the transfer layer 112, and an ink film 113 is formed on the transfer layer 112.
  • a material for forming the transfer layer 112 a known material can be used, and among these, silicone rubber is desirable.
  • the surface of the transfer layer 112 and the surface of the ink 102 filled in the pattern portion 104 of the gravure offset printing intaglio 101 are in the contact surface. It is necessary to touch evenly.
  • the transfer layer of the transfer body largely falls into the pattern portion located at the start end in the printing direction. The transfer layer of the transfer body cannot sufficiently contact the ink inside the pattern portion in the pattern portion to be contacted next, and there is a problem that the ink cannot be sufficiently transferred.
  • a gravure offset printing intaglio having a pattern portion (pattern portion having the same shape) having a conventional shape shown in FIG.
  • a gravure offset printing intaglio 210 including a plurality of thin line-like pattern portions 211 extending in a direction perpendicular to the Y direction (X direction) and continuously arranged is used to form a pattern.
  • the transfer member is rotated and moved in the Y direction after the ink is filled in the portion 211, the transfer layer of the transfer member falls into the concave portion 212 at the start end of the pattern portion 211, and is arranged in parallel in the Y direction with respect to the concave portion 212.
  • a phenomenon occurs in which the ink film transferred from the recessed portions 213 and other recessed portions gradually becomes thinner in the Y direction.
  • the shape of the wiring pattern in the printing direction changes, and the designed wiring pattern is reproduced. Can not do it.
  • the difference in shape between the recess 212 and the recess 212 adjacent to the recess 212 in the Y direction becomes significant.
  • the pattern portion of the gravure offset printing intaglio is, for example, a dummy pattern portion on the upper end of the concave portion 312 at the start end in the Y direction in the pattern portion 311 as in the gravure offset printing intaglio 310 shown in FIG. 313 is arranged.
  • the transfer body is rotated and moved in the Y direction using the gravure offset printing intaglio plate 310 provided with the dummy pattern portion 313, the transfer layer of the transfer body is intentionally dropped into the dummy pattern portion 313, so that the subsequent pattern Contact with the portion 311 can be stabilized.
  • the printing direction refers to the moving direction of the transfer body when the ink film transferred to the transfer layer surface of the transfer body is transferred to the printing medium.
  • This printing direction is the same as the moving direction of the transfer body when the ink filled in the pattern portion of the gravure offset printing intaglio is transferred to the transfer layer surface of the transfer body.
  • the starting end in the printing direction of the pattern portion of the gravure offset printing intaglio plate means the position of the concave portion arranged on the most upstream side in the moving direction of the transfer body. In other words, it refers to the position of the concave portion of the gravure offset printing intaglio that first comes into contact with the transfer body. Specifically, it refers to a position where the recess 212 in FIG.
  • the end in the printing direction of the pattern portion of the gravure offset printing intaglio plate means the position of the concave portion arranged on the most downstream side in the moving direction of the transfer body. In other words, it refers to the position of the recess of the gravure offset printing intaglio that comes into contact with the transfer body last.
  • the upper end in the printing direction of the pattern portion of the gravure offset printing intaglio plate refers to the position in the direction opposite to the printing direction of the concave portion arranged on the most upstream side in the moving direction of the transfer body. Specifically, FIG. This is the position of the dummy pattern portion 313 adjacent in the direction opposite to the printing direction of the recess 312.
  • the dummy pattern part may or may not be arranged as a part of the pattern part for forming the wiring pattern. That is, the pattern formed by the dummy pattern portion may or may not be conductive. Therefore, the shape of the dummy pattern portion may be a disconnected shape.
  • a part of the pattern portion of the gravure offset printing intaglio is a plurality of fine line-shaped pattern portions extending in a direction substantially perpendicular to the printing direction and continuously arranged in the printing direction.
  • the effect becomes noticeable.
  • the thin line pattern part extends in a direction substantially perpendicular to the printing direction, the pattern part becomes substantially parallel to the width direction of the transfer body, so that the transfer layer of the transfer body drops into the pattern part. It is easily affected by the distortion behavior of the transfer layer of the transfer body generated inside the pattern portion.
  • the direction substantially perpendicular to the printing direction means that the pattern portion strictly extends with respect to the printing direction as long as the pattern portion extends in a direction that is affected by the distortion behavior of the transfer layer of the transfer body generated inside the pattern portion. This means that it does not have to be in the vertical direction.
  • the pattern portion extends in a direction perpendicular to the printing direction or extends in a direction substantially perpendicular (specifically, a direction inclined by about 60 to 120 degrees with respect to the printing direction), the present invention. Can be suitably applied.
  • the area (length) of the pattern portion that is affected by the transfer layer of the transfer body increases, so that the transfer that occurs inside the pattern portion It is susceptible to strain behavior of the body transfer layer.
  • the line width of the pattern portion 411 of the intaglio 410 for gravure offset printing is set in the printing direction (here, as shown in FIG. 4).
  • a method of changing from the start end to the end in the (Y direction) is effective. For example, among the pattern portions 411 in FIG.
  • the line width of a plurality of concave portions 412 including a concave portion at the start end in the printing direction and a concave portion located in the vicinity thereof is set to an average line width of the entire pattern portion 411 (a desired wiring pattern
  • the line width of the plurality of concave portions 413 including the concave portion at the end in the printing direction and the concave portion located in the vicinity of the pattern portion 411 is made 10% thinner than the designed line width for forming the line width). , 10% thicker than the average line width. Thereby, it is possible to suppress the line width variation of the entire ink film transferred from the pattern portion 411.
  • the pattern portion 411 of the gravure offset printing intaglio 410 shown in FIG. 4 adjusts the line widths of the pattern portions near the start end in the printing direction and near the end (three recesses near the start end and near the end, respectively). It is sufficient that at least the line width of the pattern portion located at the start end in the printing direction is narrower than the line width of the pattern portion located at the end in the printing direction. Thereby, it is possible to suppress the influence on the line width of the print pattern due to the drop of the transfer layer of the transfer body onto the pattern portion located at the start end in the printing direction.
  • the pattern portion is gradually changed from the start end to the end.
  • the line width of the part may be made narrower than the average line width only at the starting end.
  • the transfer body 111 is rolled on the substrate 121 to transfer the ink film 113, thereby forming the print pattern 122 and obtaining the printed wiring substrate.
  • the printed wiring board of the present invention is produced by gravure offset printing using the above-described intaglio for gravure offset printing of the present invention.
  • the ink filled in the pattern portion of the intaglio for gravure offset printing of the present invention is transferred onto the transfer layer of the transfer body.
  • the formed ink film is transferred onto the base material to form a print pattern on the base material.
  • the printed pattern formed on the substrate is a plurality of fine line-shaped wiring patterns that partially extend in a direction substantially perpendicular to the printing direction and are continuously arranged in the printing direction. Then, a dummy pattern is formed at the upper end in the printing direction of the plurality of thin line-shaped wiring patterns.
  • the printed wiring base material of the present invention has a dummy pattern, it has a high-definition wiring pattern with little change in the shape of the wiring pattern.
  • a plurality of fine wiring patterns are formed in which the line width of the pattern located at the start end in the printing direction is narrower than the line width of the pattern located at the end in the printing direction. Is done.
  • the printed wiring board of the present invention has a high-definition wiring pattern with little change in the shape of the wiring pattern because the line width of the pattern is different between the starting end and the terminal end in the printing direction.
  • the shape of the wiring pattern corresponds to the shape of the pattern portion of the intaglio for gravure offset printing
  • the line width of the wiring pattern is about 10 ⁇ m to 5 mm
  • the distance between the lines is about 10 ⁇ m to 100 ⁇ m, preferably Is 20 ⁇ m to 50 ⁇ m.
  • the present invention is particularly effective for a thin line-like wiring pattern having a line width of about 10 ⁇ m to 100 ⁇ m, a distance between the lines of about 10 ⁇ m to 100 ⁇ m, and further 20 ⁇ m to 50 ⁇ m.
  • FIG. 5 shows an outline of an intaglio for gravure offset printing according to the first embodiment.
  • the gravure offset printing intaglio 510 has a pattern portion 511 formed by etching using glass having a length of 120 mm, a width of 120 mm, and a height of 3 mm.
  • the width of the pattern portion 511 is 30 ⁇ m and has a shape in which 15 fine lines are continuous.
  • the depth of the pattern portion 511 is 10 ⁇ m.
  • a dummy pattern portion 512 is formed at the upper end in the printing direction (Y direction).
  • the gravure offset printing intaglio 610 is the same as the gravure offset printing intaglio 510 according to the first embodiment shown in FIG. 5, using a glass having a length of 120 mm, a width of 120 mm, and a height of 3 mm. 611 is formed. Three recesses 612 are 27 ⁇ m wide on the start side in the printing direction (Y direction) of the pattern portion 611, and three recesses 613 are 33 ⁇ m wide on the end side.
  • the intaglio for gravure offset printing according to the comparative example has the same material and size as those of the first and second embodiments, but the dummy pattern portion and the pattern portion that is changed from the start end to the end in the printing direction are arranged. However, the pattern part which consists of a thin line with the thickness of 30 micrometers uniformly is formed by the etching.
  • gravure offset printing was performed in order to form a conductive silver-based wiring pattern on a polyethylene terephthalate substrate.
  • the polyethylene terephthalate substrate used had a thickness of 188 ⁇ m, a length of 120 mm, and a width of 120 mm.
  • the viscosity measured using a rheology measuring device was 9.5 Pa.s at an angular velocity of 10 rad / sec.
  • the ink which is s was used.
  • As the ink-peelable transfer member a material having a rubber hardness (JIS A) of 45 ° and a rubber thickness of 0.6 mm mainly composed of silicone rubber manufactured by Kinyo Co., Ltd. was used.
  • the doctor used a regular type of doctor blade manufactured by MDC.
  • the gravure offset printing device used was a commonly used printing device.
  • the printing conditions were such that the doctor speed was 50 mm / sec, the transfer body speed was 50 mm / sec, the contact width between the transfer body and the gravure offset printing intaglio, and the contact width between the transfer body and the polyethylene terephthalate substrate was uniformly 10 mm.
  • the printed wiring substrates of Example 1, Example 2, and Comparative Example were produced by the following steps. First, the conductive silver paste was filled with a doctor into the pattern portion of the prepared gravure offset printing intaglio. Next, on the gravure offset printing plate filled with ink, the transfer body is rotated and moved in the printing direction (Y direction) of the gravure offset printing intaglio to form a conductive silver-based film on the silicone rubber. Formed. Finally, the transfer body on which the conductive silver-based film is formed is rotated and moved in the printing direction of the polyethylene terephthalate substrate, and the conductive silver paste film is transferred onto the polyethylene terephthalate substrate to form a wiring pattern. did.
  • the line width of the wiring pattern of each printed wiring base material was measured with a microscope, and the average value of the entire wiring pattern was calculated to be the average line width. . At this time, 100 measurements were performed.
  • the line width of the wiring pattern was the thickest at the starting end in the printing direction and gradually decreased from there.
  • the wiring patterns of Example 1 and Example 2 do not completely eliminate the variation in line width, but as shown in the results, they are smaller than the variation in line width of the wiring pattern of the comparative example, and the shape is more stable. I was doing.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2013/004483 2012-08-01 2013-07-23 グラビアオフセット印刷用凹版および印刷配線基材 WO2014020862A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014527971A JP6217639B2 (ja) 2012-08-01 2013-07-23 グラビアオフセット印刷用凹版および印刷配線基材
CN201380035908.XA CN104411502B (zh) 2012-08-01 2013-07-23 凹版胶印印刷用凹版和印刷线路板

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JP2012-170909 2012-08-01
JP2012170909 2012-08-01

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CN (1) CN104411502B (zh)
TW (1) TWI574853B (zh)
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JP2018063578A (ja) * 2016-10-13 2018-04-19 日本航空電子工業株式会社 印刷配線の製造方法
JP2018144496A (ja) * 2018-04-23 2018-09-20 日本航空電子工業株式会社 印刷配線の製造方法

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CN102099728A (zh) * 2008-07-15 2011-06-15 株式会社Ip舍路信 裸眼立体画面显示系统、裸眼立体画面显示装置、游戏机、视差屏障薄片
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Publication number Priority date Publication date Assignee Title
JPH0361902A (ja) * 1989-07-31 1991-03-18 Toppan Printing Co Ltd カラーフィルターの製造方法
JPH0516322A (ja) * 1991-07-11 1993-01-26 Toppan Printing Co Ltd 凹版の製造方法
JPH09141829A (ja) * 1995-11-27 1997-06-03 Matsushita Electric Ind Co Ltd 電子部品の製造装置
JP2001353973A (ja) * 2000-06-16 2001-12-25 Canon Inc 印刷用凹版とそれを用いたオフセット印刷方法
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JP2018063578A (ja) * 2016-10-13 2018-04-19 日本航空電子工業株式会社 印刷配線の製造方法
WO2018070171A1 (ja) * 2016-10-13 2018-04-19 日本航空電子工業株式会社 印刷配線
KR20190033626A (ko) * 2016-10-13 2019-03-29 니혼 고꾸 덴시 고교 가부시끼가이샤 인쇄 배선
US10754485B2 (en) 2016-10-13 2020-08-25 Japan Aviation Electronics Industry, Limited Printed wiring
KR102189438B1 (ko) * 2016-10-13 2020-12-11 니혼 고꾸 덴시 고교 가부시끼가이샤 인쇄 배선
US11209945B2 (en) 2016-10-13 2021-12-28 Japan Aviation Electronics Industry, Limited Printed wiring
US12014012B2 (en) 2016-10-13 2024-06-18 Japan Aviation Electronics Industry, Limited Printed wiring
JP2018144496A (ja) * 2018-04-23 2018-09-20 日本航空電子工業株式会社 印刷配線の製造方法

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CN104411502A (zh) 2015-03-11
TW201406563A (zh) 2014-02-16

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