WO2014012660A3 - Method for operating a microlithographic projection exposure apparatus - Google Patents

Method for operating a microlithographic projection exposure apparatus Download PDF

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Publication number
WO2014012660A3
WO2014012660A3 PCT/EP2013/002111 EP2013002111W WO2014012660A3 WO 2014012660 A3 WO2014012660 A3 WO 2014012660A3 EP 2013002111 W EP2013002111 W EP 2013002111W WO 2014012660 A3 WO2014012660 A3 WO 2014012660A3
Authority
WO
WIPO (PCT)
Prior art keywords
control commands
actuation unit
exposure apparatus
projection exposure
mirror substrate
Prior art date
Application number
PCT/EP2013/002111
Other languages
French (fr)
Other versions
WO2014012660A2 (en
Inventor
Boris Bittner
Norbert Wabra
Sonja Schneider
Ricarda SCHNEIDER
Hendrik Wagner
Rumen ILIEW
Original Assignee
Carl Zeiss Smt Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Smt Gmbh filed Critical Carl Zeiss Smt Gmbh
Publication of WO2014012660A2 publication Critical patent/WO2014012660A2/en
Publication of WO2014012660A3 publication Critical patent/WO2014012660A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus

Abstract

A microlithographic projection exposure apparatus (10) configured in particular for EUV light includes a projection objective (26) having an adaptive mirror (M2) comprising, for its part, a mirror substrate (44) and an actuation unit (42) for deforming the mirror substrate (44). Using imaging aberrations measured previously, a set of control commands for the actuation unit (42) is determined, and when said set of control commands is transferred to the actuation unit (42), the mirror substrate (44) is deformed such that the imaging aberrations measured previously are corrected. Said set of control commands is stored in a nonvolatile data memory (66) and transferred to the actuation unit (42). If the operation of the projection exposure apparatus is interrupted after relatively long operating durations, the correction state previously present can be rapidly reestablished by simply reloading the stored control commands, without a renewed measurement of the imaging aberrations of the projection objective (26) being required.
PCT/EP2013/002111 2012-07-20 2013-07-16 Method for operating a microlithographic projection exposure apparatus WO2014012660A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261673778P 2012-07-20 2012-07-20
US61/673,778 2012-07-20
DE201210212757 DE102012212757A1 (en) 2012-07-20 2012-07-20 METHOD FOR OPERATING A MICROLITHOGRAPHIC PROJECTION EXPOSURE PLANT
DE102012212757.7 2012-07-20

Publications (2)

Publication Number Publication Date
WO2014012660A2 WO2014012660A2 (en) 2014-01-23
WO2014012660A3 true WO2014012660A3 (en) 2014-04-17

Family

ID=49879911

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/002111 WO2014012660A2 (en) 2012-07-20 2013-07-16 Method for operating a microlithographic projection exposure apparatus

Country Status (2)

Country Link
DE (1) DE102012212757A1 (en)
WO (1) WO2014012660A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014219755A1 (en) 2013-10-30 2015-04-30 Carl Zeiss Smt Gmbh Reflective optical element
DE102015201020A1 (en) * 2015-01-22 2016-07-28 Carl Zeiss Smt Gmbh Projection exposure apparatus with manipulator and method for controlling a projection exposure apparatus
DE102016201564A1 (en) 2016-02-02 2017-08-03 Carl Zeiss Smt Gmbh Method for producing a reflective optical element and reflective optical element
DE102017205405A1 (en) 2017-03-30 2018-10-04 Carl Zeiss Smt Gmbh Mirror, in particular for a microlithographic projection exposure apparatus
CN111051990B (en) 2017-09-04 2024-01-26 Asml荷兰有限公司 Heating system for an optical component of a lithographic apparatus
DE102020201723A1 (en) 2020-02-12 2021-08-12 Carl Zeiss Smt Gmbh Projection exposure system with a thermal manipulator
DE102022114969A1 (en) 2022-06-14 2023-12-14 Carl Zeiss Smt Gmbh Method for heating an optical element and optical system
DE102022114974A1 (en) 2022-06-14 2023-12-14 Carl Zeiss Smt Gmbh Method for heating an optical element and optical system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020011573A1 (en) * 2000-07-13 2002-01-31 Van Dijsseldonk Antonius Johannes Josephus Lithographic apparatus, device manufacturing method, and device manufactured thereby
US20060008716A1 (en) * 2004-07-08 2006-01-12 Asml Netherlands B.V. Lithographic projection apparatus and a device manufacturing method using such lithographic projection apparatus
DE102010003938A1 (en) * 2009-05-04 2010-10-14 Carl Zeiss Optical arrangement i.e. projection illumination system, operating method for microlithography, involves illuminating lens with light, such that non-uniform temperature distribution is produced in lens to correct defect of system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10000191B8 (en) 2000-01-05 2005-10-06 Carl Zeiss Smt Ag Project exposure system of microlithography
US6880942B2 (en) 2002-06-20 2005-04-19 Nikon Corporation Adaptive optic with discrete actuators for continuous deformation of a deformable mirror system
US6989922B2 (en) 2002-06-21 2006-01-24 Nikon Corporation Deformable mirror actuation system
US6840638B2 (en) * 2002-07-03 2005-01-11 Nikon Corporation Deformable mirror with passive and active actuators
DE10360414A1 (en) 2003-12-19 2005-07-21 Carl Zeiss Smt Ag EUV projection lens and method for its production
US7125128B2 (en) 2004-01-26 2006-10-24 Nikon Corporation Adaptive-optics actuator arrays and methods for using such arrays
DE102008046699B4 (en) * 2008-09-10 2014-03-13 Carl Zeiss Smt Gmbh Imaging optics
CN102472974B (en) * 2009-07-17 2014-05-07 卡尔蔡司Smt有限责任公司 Microlithographic projection exposure apparatus and method of measuring a parameter related to an optical surface contained therein
DE102011084117A1 (en) 2011-10-07 2013-04-11 Carl Zeiss Smt Gmbh Reflective optical element for the EUV wavelength range, method for generating and correcting such an element, projection objective for microlithography with such an element and projection exposure apparatus for microlithography with such a projection objective

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020011573A1 (en) * 2000-07-13 2002-01-31 Van Dijsseldonk Antonius Johannes Josephus Lithographic apparatus, device manufacturing method, and device manufactured thereby
US20060008716A1 (en) * 2004-07-08 2006-01-12 Asml Netherlands B.V. Lithographic projection apparatus and a device manufacturing method using such lithographic projection apparatus
DE102010003938A1 (en) * 2009-05-04 2010-10-14 Carl Zeiss Optical arrangement i.e. projection illumination system, operating method for microlithography, involves illuminating lens with light, such that non-uniform temperature distribution is produced in lens to correct defect of system

Also Published As

Publication number Publication date
DE102012212757A1 (en) 2014-01-23
WO2014012660A2 (en) 2014-01-23

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