WO2014010219A1 - Thin-film laminate having self-assembled monolayer - Google Patents
Thin-film laminate having self-assembled monolayer Download PDFInfo
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- WO2014010219A1 WO2014010219A1 PCT/JP2013/004203 JP2013004203W WO2014010219A1 WO 2014010219 A1 WO2014010219 A1 WO 2014010219A1 JP 2013004203 W JP2013004203 W JP 2013004203W WO 2014010219 A1 WO2014010219 A1 WO 2014010219A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/42—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating of an organic material and at least one non-metal coating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
Definitions
- the present invention relates to a thin film laminate having a self-assembled film.
- Patent Document 2 a photocurable primer layer has been proposed as a primer layer of a fluorine-based monomolecular film or a thin film similar thereto.
- this primer layer it is difficult to form a dense self-assembled film or monomolecular film thereon, and it is difficult to impart sufficient hardness and solvent resistance to the substrate. It was. Further, since the primer layer is cured by irradiating ultraviolet rays or the like, it is difficult to apply it to a three-dimensional substrate.
- the present invention has been made in view of the above circumstances, is excellent in adhesiveness with a substrate, and provides a primer layer sufficient to form a self-assembled film / monomolecular film on the surface, hardness, It is an object to provide a molded article having excellent functions such as solvent resistance, lubricity, slipperiness, and low friction.
- an organic-inorganic composite film containing a thermosetting compound and a polysiloxane compound is laminated on a substrate, and the surface of the organic-inorganic composite film is further plasma-treated. Or improve the mineralization by applying UV ozone treatment, and by forming a self-assembled film on it using a silane coupling agent, etc., on the substrate, together with hardness, solvent resistance, lubricity, slipperiness, It has been found that functions such as low friction and water / oil repellency can be imparted, and the present invention has been completed.
- the first layer is a) Formula (I) R n SiX 4-n (I) (In the formula, R represents an organic group in which a carbon atom is directly bonded to Si, X represents a hydroxyl group or a hydrolyzable group. N represents 1 or 2, and when n is 2, each R is the same or different.
- each X may be the same or different when (4-n) is 2 or more.
- Laminate (4) The thin film laminate according to any one of (1) to (3), wherein the substrate is a resin, and (5) the metal-based surfactant is represented by the formula (II) R 1 m MX 1 tm (II) [Wherein, R 1 represents a hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, a halogenated hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, or a linking group.
- M represents a silicon atom, a germanium atom, a tin atom, a titanium atom, and a zirconium atom.
- m represents a positive integer from 1 to (t ⁇ 1). When m is 2 or more, R 1 s may be the same or different from each other. When (tm) is 2 or more, X 1 may be the same or different, but at least one of X 1 is a hydrolyzable group.
- the thin film laminate according to any one of (1) to (4), which is a compound represented by the formula:
- the organic-inorganic composite thin film of the first layer of the present invention is characterized in that the surface of the film is almost completely mineralized while the base side of the film is rich in organic resin due to the thermosetting compound, It has excellent adhesion to the substrate and can impart physical strength and chemical, thermal and optical stability to the substrate. Furthermore, since a dense monomolecular film made of a hydrolytic condensate of a metal surfactant can be formed on the surface of the film, according to the present invention, hardness, solvent resistance, Functions such as thermal stability, light stability, lubricity, slipperiness, low friction, water repellency and oil repellency can be imparted.
- FIG. 1 It is a figure which shows distribution of each film
- FIG. 1 It is a figure which shows distribution of each film
- FIG. 1 It is a figure which shows distribution of each film
- the thin film laminate of the present invention comprises a structure in which the following layers A), B) first layer, and C) second layer are laminated in the order of A), B), and C) on at least one surface of the substrate. It is a thin film laminate.
- the laminated body of the present invention may further include a case where one or more other layers are laminated as long as the effects of the present invention are exhibited.
- each X may be the same or different when (4-n) is 2 or more.
- Substrate The substrate used in the present invention is not particularly limited as long as the laminate of the present invention can be formed, but a resin is particularly preferable.
- a resin is particularly preferable.
- Polyimide resins such as polyethylene terephthalate, polyester resins such as polyethylene 2,6-naphthalate; Epoxy resins such as phenolic epoxy resins, alcoholic epoxy resins, glycidyl ether type epoxy resins, glycidyl amine type epoxy resins; polyethers Polyether resins such as ether ketone, polyether ketone, polyether nitrile, and polyether sulfone; Cellulosic resins such as cellulose triacetate, cellulose diacetate, and nitrocellulose; polystyrene, Shinji Polystyrene resins such as tactic polystyrene; polyolefin resins such as homopolymers or copo
- a resin a resin composition made of an acrylic compound having a radical reactive unsaturated compound, a resin composition made of a mercapto compound having an acrylic compound and a thiol group, epoxy acrylate, urethane acrylate, polyester acrylate, poly
- a photocurable resin such as a resin composition in which an oligomer such as ether acrylate is dissolved in a polyfunctional acrylate monomer, a mixture thereof, or the like can be used.
- the size and shape of the substrate are not particularly limited, and any flat plate, three-dimensional object, film, etc. can be used.
- a coated article can also be used as a substrate.
- the film-like substrate may be made of an unstretched film or may be made of a stretched film.
- the resin substrate include a single layer film and a laminated film obtained by laminating two or more layers by means such as laminating or coating.
- the film-like plastic substrate can be produced by a conventionally known general method.
- a substrate made of an unstretched film that is substantially amorphous and not oriented can be produced by melting a material resin with an extruder, extruding it with an annular die or a T die, and quenching.
- a substrate made of an unstretched film is subjected to a known method such as uniaxial stretching, tenter-type sequential biaxial stretching, tenter-type simultaneous biaxial stretching, tubular-type simultaneous biaxial stretching, or the like.
- a substrate made of a stretched film can be produced by stretching in a direction perpendicular to the flow direction of the substrate (horizontal axis).
- the draw ratio in this case can be appropriately selected according to the resin as the raw material of the substrate, but is preferably 2 to 10 times in the vertical axis direction and the horizontal axis direction.
- the thickness of the film-like resin substrate is not particularly limited, but is usually 1 to 1000 ⁇ m, preferably 3 to 500 ⁇ m.
- the organic-inorganic composite thin film that is the first layer of the present invention contains at least a condensate of an organosilicon compound and a thermosetting compound as essential components, but also contains a metal compound or the like. May be.
- the organosilicon compound of the present invention is represented by the following formula (I).
- R n SiX 4-n (I)
- R represents an organic group in which a carbon atom is directly bonded to Si
- X represents a hydroxyl group or a hydrolyzable group.
- n represents 1 or 2, and when n is 2, each R may be the same or different, and when (4-n) is 2 or more, each X may be the same or different.
- examples of the “organic group in which a carbon atom is directly bonded to Si” represented by R include a hydrocarbon group which may be substituted, a group composed of a polymer of a hydrocarbon which may be substituted, and the like. Can do.
- the hydrocarbon group in the above “optionally substituted hydrocarbon group” and “group consisting of an optionally substituted hydrocarbon polymer” is usually a hydrocarbon group having 1 to 30 carbon atoms, for example, , Alkyl group, cycloalkyl group, cycloalkylalkyl group, alkenyl group, alkynyl group, aryl group, arylalkyl group, arylalkenyl group and the like.
- a linear or branched alkyl group having 1 to 10 carbon atoms a cycloalkyl group having 3 to 8 carbon atoms, a linear or branched alkenyl group having 2 to 10 carbon atoms, and a carbon number of 3 are preferable.
- hydrocarbon group or “group consisting of a hydrocarbon polymer” may contain an oxygen atom, a nitrogen atom, or a silicon atom.
- linear or branched alkyl group having 1 to 10 carbon atoms examples include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, and n-pentyl.
- Examples of the long chain alkyl group having more than 10 carbon atoms include lauryl group, tridecyl group, myristyl group, pentadecyl group, palmityl group, heptadecyl group, stearyl group and the like.
- cycloalkyl group having 3 to 8 carbon atoms examples include cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group and the like.
- “Straight or branched alkenyl group having 2 to 10 carbon atoms” means a straight or branched alkenyl group having 2 to 10 carbon atoms having a carbon-carbon double bond at any one or more positions.
- C3-C8 cycloalkenyl group means a C3-C8 alkenyl group having a carbon-carbon double bond at any one or more positions and having a cyclic portion.
- cyclopenten-1-yl group, 2-cyclopenten-1-yl group, 1-cyclohexen-1-yl group, 2-cyclohexen-1-yl group, and 3-cyclohexen-1-yl group is a C3-C8 alkenyl group having a carbon-carbon double bond at any one or more positions and having a cyclic portion.
- cyclopenten-1-yl group 2-cyclopenten-1-yl group, 1-cyclohexen-1-yl group, 2-cyclohexen-1-yl group, and 3-cyclohexen-1-yl group.
- alkynyl group examples include alkynyl groups having 2 to 10 carbon atoms, such as ethynyl group, prop-1-yn-1-yl group, prop-2-yn-1-yl group, but-1- In-1-yl group, but-3-in-1-yl group, penta-1-in-1-yl group, penta-4-in-1-yl group, hexa-1-in-1-yl group A hexa-5-in-1-yl group, a hepta-1-in-1-yl group, an octa-1-in-1-yl group, an octa-7-in-1-yl group, and the like.
- cycloalkylalkyl group examples include a group in which a cycloalkyl group having 3 to 8 carbon atoms and an alkyl group having 1 to 8 carbon atoms are bonded, and examples thereof include a cyclopropylmethyl group, a cyclopropylpropyl group, and cyclobutylmethyl.
- aryl group examples include aryl groups having 6 to 10 carbon atoms, such as phenyl group and naphthyl group.
- arylalkyl group examples include a group in which an aryl group having 6 to 10 carbon atoms and an alkyl group having 1 to 8 carbon atoms are bonded, such as a benzyl group, a phenethyl group, a 3-phenyl-n-propyl group, Examples include 4-phenyl-n-butyl group, 5-phenyl-n-pentyl group, 8-phenyl-n-octyl group, naphthylmethyl group and the like.
- arylalkenyl group examples include a group in which an aryl group having 6 to 10 carbon atoms and an alkenyl group having 2 to 8 carbon atoms are bonded, such as a styryl group, 3-phenyl-prop-1-ene-1- Yl, 3-phenyl-prop-2-en-1-yl, 4-phenyl-but-1-en-1-yl, 4-phenyl-but-3-en-1-yl, 5- Phenyl-pent-1-en-1-yl group, 5-phenyl-pent-4-en-1-yl group, 8-phenyl-oct-1-en-1-yl group, 8-phenyl-oct-7 -En-1-yl group, naphthylethenyl group and the like.
- hydrocarbon group having an oxygen atom examples include a group having an oxirane ring (epoxy group) such as an alkoxyalkyl group, an epoxy group, an epoxyalkyl group, a glycidoxyalkyl group, an acryloxymethyl group, a methacryloxymethyl group, etc. Is mentioned.
- alkoxyalkyl group is usually a group in which an alkoxy group having 1 to 6 carbon atoms and an alkyl group having 1 to 6 carbon atoms are bonded, such as a methoxymethyl group, 2-methoxyethyl group, 3- And ethoxy-n-propyl group.
- the “epoxyalkyl group” is preferably a linear or branched epoxyalkyl group having 3 to 10 carbon atoms, such as a glycidyl group, a glycidylmethyl group, a 2-glycidylethyl group, a 3-glycidylpropyl group, a 4- An alkyl group containing a linear epoxy group such as a glycidylbutyl group, a 3,4-epoxybutyl group, a 4,5-epoxypentyl group, or a 5,6-epoxyhexyl group; ⁇ -methylglycidyl group, ⁇ -ethylglycidyl group, ⁇ -propylglycidyl group, 2-glycidylpropyl group, 2-glycidylbutyl group, 3-glycidylbutyl group, 2-methyl-3-glycidylpropyl group, 3-methyl- 2-glycidylpropyl group
- hydrocarbon group having a nitrogen atom a group having —NR ′ 2 (wherein R ′ represents a hydrogen atom, an alkyl group or an aryl group, and each R ′ may be the same as or different from each other). Or a group having —N ⁇ CR ′′ 2 (wherein R ′′ represents a hydrogen atom or an alkyl group, and each R ′′ may be the same as or different from each other).
- the aryl group include a phenyl group, a naphthyl group, an anthracen-1-yl group, and a phenanthren-1-yl group.
- the group having —NR ′ 2 includes a —CH 2 —NH 2 group, a —C 3 H 6 —NH 2 group, a —CH 2 —NH—CH 3 group, and the like.
- hydrocarbon having a silicon atom examples include groups containing a polymer such as polysiloxane, polyvinylsilane, polyacrylsilane and the like.
- Examples of the above-mentioned “optionally substituted” substituent include a halogen atom, an alkyl group, an alkenyl group, an aryl group, and a methacryloxy group.
- Examples of the alkyl group, alkenyl group, and aryl group are the same as those in R.
- a vinyl group a group having an oxirane ring, —NR ′ 2 (wherein R ′ represents a hydrogen atom, an alkyl group or an aryl group, and each R ′ may be the same as or different from each other).
- a group having —N ⁇ CR ′′ 2 (wherein R ′′ represents a hydrogen atom or an alkyl group, and each R ′′ may be the same as or different from each other) From the viewpoint of mineralization of the body surface, this is a preferred group.
- n 1 or 2
- each R may be the same or different.
- these can be used individually by 1 type or in combination of 2 or more types.
- X represents a hydroxyl group or a hydrolyzable group.
- (4-n) in formula (I) is 2 or more, each X may be the same or different.
- a hydrolyzable group is, for example, a group that can be hydrolyzed to form a silanol group or a siloxane condensate by heating at 25 ° C. to 100 ° C. in the presence of no catalyst and excess water.
- an alkoxy group, an acyloxy group, a halogen group atom, an isocyanate group, and the like can be mentioned.
- An alkoxy group having 1 to 4 carbon atoms or an acyloxy group having 1 to 6 carbon atoms Is preferred.
- Examples of the alkoxy group having 1 to 4 carbon atoms include a methyloxy group, an ethyloxy group, a propyloxy group, an isopropyloxy group, an n-butyloxy group, an isobutyloxy group, a t-butyloxy group, and the like.
- Examples of the acyloxy group (however, the carbon number does not include carbon of the carbonyl group) include an acetyloxy group and a benzoyloxy group.
- Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- Examples of the isocyanate group include an isocyanate group bonded to an alkyl group, an isocyanate group bonded to a cycloalkyl group, an isocyanate group bonded to an aryl group, an isocyanate group bonded to an alkyl group substituted with a cycloalkyl group, and an aryl group. And an isocyanate group bonded to the alkyl group.
- the raw material organosilicon compounds include methyltrichlorosilane, methyltrimethoxysilane, methyltriethoxysilane, methyltributoxysilane, ethyltrimethoxysilane, ethyltriisopropoxysilane, ethyltributoxysilane, butyltrimethylsilane.
- organosilicon compound having a group composed of a hydrocarbon polymer examples include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and cyclohexyl.
- (Meth) acrylate and other (meth) acrylic acid esters (meth) acrylic acid, itaconic acid, fumaric acid and other carboxylic acids and maleic anhydride and other acid anhydrides; glycidyl (meth) acrylate and other epoxy compounds; diethylaminoethyl Amino compounds such as (meth) acrylate and aminoethyl vinyl ether; amino compounds such as (meth) acrylamide, itaconic acid diamide, ⁇ -ethylacrylamide, crotonamide, fumaric acid diamide, maleic acid diamide, and N-butoxymethyl (meth) acrylamide Compound: A compound in which a vinyl polymer obtained by copolymerizing a vinyl compound selected from acrylonitrile, styrene, ⁇ -methylstyrene, vinyl chloride, vinyl acetate, vinyl propionate and the like is used as the R component of formula (I) can be mentioned.
- the condensate of the organosilicon compound used as the main component in the organic-inorganic composite thin film of the present invention means a product obtained by further condensing these organosilicon compounds and / or the condensate thereof.
- the blending ratio of the organosilicon compound condensate is 2 to 98% by mass, preferably 5 to 50% by mass, more preferably 5 to 30% by mass, based on the solid content of the whole organic-inorganic composite thin film.
- thermosetting compound of the present invention is not particularly limited as long as it is a compound having a functional group capable of thermosetting, and it may be a thermosetting resin or a thermosetting low molecular compound.
- thermosetting resin include phenolic novolac resins, cresol novolac resins, novolac type phenol resins such as bisphenol A novolac resins, phenol resins such as resol type phenol resins; bisphenol types such as bisphenol A epoxy resins and bisphenol F epoxy resins. Epoxy resin, novolac epoxy resin, cresol novolac epoxy resin, etc.
- novolac epoxy resin novolac epoxy resin, biphenyl type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, alkyl-modified triphenolmethane type epoxy resin, triazine nucleus-containing epoxy resin, Epoxy resins such as dicyclopentadiene-modified phenolic epoxy resins, and epoxies such as 2,2-bis (4-glycidyloxyphenyl) propane Compounds having the like.
- urea (urea) resin resin having triazine ring such as melamine resin; unsaturated polyester resin; bismaleimide resin; polyurethane resin; diallyl phthalate resin; silicone resin; resin having benzoxazine ring;
- the raw material compound of these resin is mentioned, Among these, the 1 type (s) or 2 or more types of mixture can be used.
- thermosetting low molecular compound examples include 1,6-hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and triethylene glycol di (meth) acrylate.
- Bifunctional (meth) acrylate compounds such as bis (acryloyloxyethyl) ether of bisphenol A, 3-methylpentanediol di (meth) acrylate; trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) Acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol tri (meth) acrylate Reaction product with acid anhydride, reaction product of dipentaerythritol penta (meth) acrylate and acid anhydride, caprolactone modified pentaerythritol tetra (meth) acrylate, caprolactone modified dipentaerythritol penta (meth) acrylate, caprolact
- the amount of the cured product of the thermosetting compound in the organic-inorganic composite thin film of the present invention is the solid content of the whole organic-inorganic composite thin film (condensate of organosilicon compound, cured product of thermosetting compound, and blended as necessary. 2 to 98% by mass, preferably 50 to 95% by mass, more preferably 70 to 95% by mass, based on the total mass of other components to be produced.
- the blending ratio of the condensate of the organosilicon compound and the cured product of the thermosetting compound is preferably 50:50 to 5:95, more preferably 25: 75-5: 95.
- thermal polymerization initiator refers to a compound that generates radicals upon heating, and examples thereof include organic peroxides, azo compounds, and redox initiators.
- organic peroxide examples include benzoyl peroxide, cumene hydroperoxide, di-t-butyl peroxide, t-butyl hydroperoxide and dicumyl peroxide, acetyl peroxide, lauroyl peroxide, cyclohexanone peroxide, dibenzoyl Peroxides, peroxides such as tert-butylpermaleate; peroxycarbonates such as 1,6bis (t-butylperoxycarbonyloxy) hexane; peroxyketals; potassium persulfate, sodium persulfate, ammonium persulfate, etc. Examples include persulfates.
- Examples of the azo compound include 2,2′-azobispropane, 2,2′-dichloro-2,2′-azobispropane, 1,1′-azo (methylethyl) diacetate, and 2,2′-azo.
- redox initiator examples include a combination of hydrogen peroxide-iron (II) salt, organic oxide-dimethylaniline, cerium (IV) salt-alcohol, and the like.
- the blending amount of the polymerization initiator used in the present invention is preferably 0.01 to 20% by weight, more preferably 0.1 to 10% by weight, based on the solid content of the polymer.
- a curing agent or a curing accelerator can be added if necessary when using an epoxy resin or the like.
- Curing agents include amine, imidazole, amide, ester, alcohol, thiol, ether, thioether, phenol, phosphorus, urea, thiourea, acid anhydride, and Lewis acid.
- Onium salt type, active silicon compound-aluminum complex type, etc. but there is no particular limitation, and any one of those conventionally used as curing agents and curing accelerators such as conventional epoxy resins can be selected. Can be used.
- amine compounds include aliphatic amines, alicyclic and heterocyclic amines, aromatic amines, and modified amines.
- aliphatic amines ethylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenediamine, dimethylaminopropylamine, diethylaminopropylamine, trimethylhexamethylenediamine, Pentanediamine, bis (2-dimethylaminoethyl) ether, pentamethyldiethylenetriamine, alkyl-t-monoamine, 1,4-diazabicyclo (2,2,2) octane (triethylenediamine), N, N, N ′, N ′ -Tetramethylhexamethylenediamine, N, N, N ', N'-tetramethylpropylenediamine, N
- imidazole compounds include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 2-n-propylimidazole, 2-undecyl-1H-imidazole, 2-heptadecyl-1H-imidazole, 1,2- Dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-1H-imidazole, 4-methyl-2-phenyl-1H-imidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl- -Methylimidazolium trimellitate
- imidazoline compounds examples include 2-methylimidazoline and 2-phenylimidazoline.
- amide compounds include polyamides obtained by condensation of dimer acids and polyamines
- ester compounds include active carbonyl compounds such as aryl and thioaryl esters of carboxylic acids.
- phenol, alcohol-based, thiol-based, ether-based and thioether-based compounds include phenol novolak, cresol novolak, polyol, polymercaptan, polysulfide, 2- (dimethylaminomethylphenol), 2,4,6-tris ( And dimethylaminomethyl) phenol and 2,4-6-tris (dimethylaminomethyl) phenol tri-2-ethylhexyl hydrochloride.
- urea-based, thiourea-based, and Lewis acid-based curing agents include butylated urea, butylated melamine, butylated thiourea, and boron trifluoride.
- Examples of phosphorus curing agents include organic phosphine compounds, for example, alkylphosphines such as ethylphosphine and butylphosphine, first phosphines such as phenylphosphine, dialkylphosphines such as dimethylphosphine and dipropylphosphine, diphenylphosphine, and methylethylphosphine. Secondary phosphine, trimethylphosphine, triethylphosphine, and the like.
- alkylphosphines such as ethylphosphine and butylphosphine
- first phosphines such as phenylphosphine
- dialkylphosphines such as dimethylphosphine and dipropylphosphine
- diphenylphosphine diphenylphosphine
- methylethylphosphine secondary phosphine, tri
- acid anhydride curing agents examples include phthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and methylhexahydroanhydride.
- Phthalic acid Endomethylenetetrahydrophthalic anhydride, Methylendomethylenetetrahydrophthalic anhydride, Maleic anhydride, Tetramethylene maleic anhydride, Trimellitic anhydride, Chlorendic anhydride, None Pyromellitic acid, dodecenyl succinic anhydride, anhydrous benzophenone tetracarboxylic acid, ethylene glycol bis (anhydrotrimellitate), methylcyclohexene tetracarboxylic anhydride, polyazelaic acid anhydride, and the like.
- Curing agents for onium salts and active silicon compounds-aluminum complexes include aryldiazonium salts, diaryliodonium salts, triarylsulfonium salts, triphenylsilanol-aluminum complexes, triphenylmethoxysilane-aluminum complexes, silyl peroxide-aluminum complexes. And triphenylsilanol-tris (salicylaldehyde) aluminum complex.
- the content of the curing agent used in the present invention is preferably 0.01 to 20% by mass, more preferably 0.1 to 10% by mass, based on the solid content of the polymer.
- Metal compound of the present invention is contained for adjusting the refractive index, strengthening the affinity with the second layer, maintaining the shape, and adjusting the hardness. Titanium, zirconium, aluminum, tin, lead, tantalum or A metal compound containing at least one element composed of silicon is preferable, titanium, zirconium, aluminum, and tin are more preferable, and titanium is particularly preferable. These may be used alone or in combination of two or more.
- the metal compound is at least one compound selected from the group consisting of metal chelate compounds, organic acid metal salts, metal compounds having two or more hydroxyl groups or hydrolyzable groups, hydrolysates thereof, and condensates thereof. Etc.
- a metal compound can be used individually by 1 type or in combination of 2 or more types.
- it is preferably a metal chelate compound, an organic acid metal salt, a hydrolyzate and / or condensate of a metal compound having two or more hydroxyl groups or hydrolyzable groups. Or a condensate is preferable.
- the metal compound in the thin film include those existing as a raw material compound, those obtained by further condensing the compound, and those chemically bonded to the above-described organosilicon compound.
- the metal chelate compound is preferably a metal chelate compound having a hydroxyl group or a hydrolyzable group, and more preferably a metal chelate compound having two or more hydroxyl groups or hydrolyzable groups.
- having two or more hydroxyl groups or hydrolyzable groups means that the sum of hydrolyzable groups and hydroxyl groups is 2 or more.
- the metal chelate compound is preferably a ⁇ -ketocarbonyl compound, a ⁇ -ketoester compound, or an ⁇ -hydroxyester compound.
- methyl acetoacetate, n-propyl acetoacetate, isopropyl acetoacetate, acetoacetate ⁇ -ketoesters such as n-butyl, sec-butyl acetoacetate, t-butyl acetoacetate; acetylacetone, hexane-2,4-dione, heptane-2,4-dione, heptane-3,5-dione, octane ⁇ -diketones such as -2,4-dione, nonane-2,4-dione and 5-methyl-hexane-2,4-dione; compounds coordinated with hydroxycarboxylic acids such as glycolic acid and lactic acid Can be mentioned.
- the organic acid metal salt is a compound composed of a salt obtained from a metal ion and an organic acid.
- the organic acid include carboxylic acids such as acetic acid, oxalic acid, tartaric acid, and benzoic acid; sulfonic acid, sulfinic acid, thiophenol, and the like.
- Organic compounds exhibiting acidity such as phenolic compounds; enol compounds; oxime compounds; imide compounds; aromatic sulfonamides;
- the metal compound having two or more hydroxyl groups or hydrolyzable groups is other than the metal chelate compound and the organic acid metal salt, such as hydroxide, propoxide, isopropoxide, butoxide and the like. Examples thereof include metal alcoholates.
- hydrolyzable group in the metal compound, the metal chelate compound, or the organic acid metal salt examples include an alkoxy group, an acyloxy group, a halogen group, and an isocyanate group, and include an alkoxy group having 1 to 4 carbon atoms and a carbon number. 1-4 acyloxy groups are preferred.
- having two or more hydroxyl groups or hydrolyzable groups means that the sum of hydrolyzable groups and hydroxyl groups is 2 or more.
- hydrolyzate and / or condensate of a metal compound one obtained by hydrolyzing 0.5 mol or more of water with respect to 1 mol of a metal compound having two or more hydroxyl groups or hydrolyzable groups. It is more preferable that it is hydrolyzed with 0.5 to 2 mol of water.
- the hydrolyzate and / or condensate of the metal chelate compound is preferably one obtained by hydrolyzing with 5 to 100 mol of water with respect to 1 mol of the metal chelate compound. More preferably, it is hydrolyzed with water.
- the hydrolyzate and / or condensate of the organic acid metal salt is preferably hydrolyzed using 5 to 100 mol of water with respect to 1 mol of the metal organic acid salt. More preferably, it is hydrolyzed with molar water.
- the above metal compound also has a function as a silanol condensation catalyst.
- examples of the metal compound for improving the hardness include tetrafunctional silane and colloidal silica.
- examples of the tetrafunctional silane include tetraaminosilane, tetrachlorosilane, tetraacetoxysilane, tetramethoxysilane, tetraethoxysilane, tetrabutoxysilane, tetrabenzyloxysilane, tetraphenoxysilane, tetra (meth) acryloxysilane, tetrakis [2 -(Meth) acryloxyethoxy] silane, tetrakis (2-vinyloxyethoxy) silane, tetraglycidyloxysilane, tetrakis (2-vinyloxybutoxy) silane, tetrakis (3-methyl-3-oxetanemethoxy) silane be able to.
- colloidal silica examples include water-dispersed colloidal silica and organic solvent-dispersed colloidal silica such as methanol or isopropyl alcohol.
- the compounding ratio of the metal compound is 0 to 50% by mass with respect to the solid content of the whole organic-inorganic composite thin film.
- additives in order to develop various properties such as coloring prevention of the first layer, thickening, prevention of UV transmission to the base, provision of corrosion resistance, heat resistance, etc. It is also possible to disperse.
- the filler include water-insoluble pigments such as organic pigments and inorganic pigments, and particulate and fibrous or scale-like metals and alloys other than pigments, and oxides, hydroxides, carbides, nitrides thereof, and the like. Examples thereof include sulfides.
- this filler include particulate, fibrous or scale-like iron, copper, aluminum, nickel, silver, zinc, ferrite, carbon black, stainless steel, silicon dioxide, titanium oxide, aluminum oxide, chromium oxide, Manganese oxide, iron oxide, zirconium oxide, cobalt oxide, synthetic mullite, aluminum hydroxide, iron hydroxide, silicon carbide, silicon nitride, boron nitride, clay, diatomaceous earth, slaked lime, gypsum, talc, barium carbonate, calcium carbonate, carbonic acid
- dehydrating agents such as methyl orthoformate, methyl orthoacetate, tetraethoxysilane, various surfactants, silane coupling agents other than the above, titanium coupling agents, dyes, dispersants, thickeners, leveling agents, etc. These additives can also be added.
- organic / inorganic composite thin film 6-1) Preparation of organic / inorganic composite thin film forming solution
- the organic / inorganic composite thin film forming solution in the present invention may be appropriately polymerized in addition to the organic silicon compound and the thermosetting compound. It is prepared by mixing an initiator, a metal compound, a silanol condensation catalyst, water and / or a solvent. In addition, when using the metal compound which functions also as a silanol catalyst as a metal compound of this invention, it is not necessary to use a silanol catalyst.
- the metal compound when using a metal compound as a silanol catalyst, the metal compound is mixed with a solvent, a predetermined amount of water is added, (partial) hydrolysis is performed, and then an organosilicon compound is added. (Partial) Hydrolyze.
- a thermosetting compound is dissolved in a solvent, a thermal polymerization initiator or a curing agent is added as necessary, and then both solutions are mixed.
- the amount of the predetermined amount of water depends on the type of the metal compound. For example, when the metal compound is a metal compound having two or more hydroxyl groups or hydrolyzable groups, the amount of water is 0.5 with respect to 1 mol of the metal compound. It is preferable to use at least mol of water, and more preferably 0.5 to 2 mol of water. When the metal compound is a metal chelate compound or an organic acid metal salt, it is preferable to use 5 to 100 mol of water with respect to 1 mol of the metal chelate compound or organic acid metal salt, and 5 to 20 mol of water is used. It is more preferable.
- the condensate of the organosilicon compound of the present invention a product obtained by (partially) hydrolyzing an organosilicon compound using a known silanol condensation catalyst may be used.
- the composition for forming an organic-inorganic composite thin film in the present invention preferably contains water and / or a solvent in addition to the above components.
- the solvent to be used is not particularly limited.
- aromatic hydrocarbons such as benzene, toluene and xylene
- aliphatic hydrocarbons such as hexane and octane
- alicyclic hydrocarbons such as cyclohexane and cyclopentane.
- Ketones such as acetone, methyl ethyl ketone and cyclohexanone; ethers such as tetrahydrofuran and dioxane; esters such as ethyl acetate and butyl acetate; amides such as N, N-dimethylformamide and N, N-dimethylacetamide; dimethyl sulfoxide And the like; alcohols such as methanol and ethanol; and polyhydric alcohol derivatives such as ethylene glycol monomethyl ether and ethylene glycol monomethyl ether acetate. These solvents can be used alone or in combination of two or more.
- Examples of the silanol condensation catalyst include acids and bases in addition to the metal compounds.
- Examples of the acid include organic acids and mineral acids. Specific examples of the organic acid include acetic acid, formic acid, oxalic acid, carbonic acid, phthalic acid, trifluoroacetic acid, p-toluenesulfonic acid, methanesulfonic acid, and the like.
- Examples of the mineral acid include hydrochloric acid, nitric acid, boric acid, borohydrofluoric acid, and the like.
- a photoacid generator that generates an acid by light irradiation, specifically, diphenyliodonium hexafluorophosphate, triphenylphosphonium hexafluorophosphate, and the like are also included.
- the base include strong bases such as tetramethylguanidine and tetramethylguanidylpropyltrimethoxysilane; organic amines, carboxylic acid neutralized salts of organic amines, quaternary ammonium salts and the like.
- the solid content (organic silicon compound and / or condensate thereof, raw material of organic polymer compound, etc.) in the solution for forming an organic-inorganic composite thin film in the present invention is 1 to 98% by mass, 10 to 60% by mass. It is preferably 15 to 45% by mass.
- Organosilicon compound and / or its condensate, thermosetting compound, metal compound with respect to the total mass of the solid content (organosilicon compound and / or its condensate, thermosetting compound, etc.) in the organic / inorganic composite thin film forming solution The compounding amounts of the metal oxide particles, the thermal polymerization initiator and the like are the same as the content in the organic-inorganic composite film.
- the organic-inorganic composite thin film of the present invention comprises (A) a step of applying the above-mentioned organic-inorganic composite thin film-forming solution onto a substrate, drying and / or heating, (B) It can be manufactured through a step of performing plasma treatment or UV ozone treatment.
- the organic-inorganic composite thin film of the present invention is a film in which the concentration of carbon atoms at a depth of 10 nm from the surface measured by ESCA analysis is 20% or less less than the concentration of carbon atoms at a depth of 100 nm from the surface.
- the “carbon atom concentration” means the molar concentration of carbon atoms when (total metal atom + oxygen atom + carbon atom) is 100%. The same applies to the concentrations of other elements.
- the “layer in which the condensate of the organosilicon compound is concentrated” is defined by the concentration of carbon atoms by ESCA analysis, but the concentration in the concentrated layer is also high in the silicon concentration.
- the value of the film thickness used when defining the carbon content in the thin film is a value calculated when sputter etching is performed in ESCA analysis, but the actual film thickness value is not necessarily the same. It does not match. This is because the film thickness etched by sputter etching depends on the material of the film. Therefore, the actual film thickness value can be obtained by converting the etching rate for each film material.
- a SiO 2 equivalent film thickness using a thermally oxidized SiO 2 film as a standard sample was used. The standard sample is a thermally oxidized SiO 2 film formed on a silicon wafer. An etching rate was calculated by ESCA analysis of a standard sample whose thickness was previously measured by an ellipsometer while performing sputter etching.
- the organosilicon compound represented by the formula (I) contains a condensate of a compound in which R is a vinyl group in an amount of 55% by mass or more, preferably 70% by mass or more, based on the total condensate of the organosilicon compound, the surface is particularly inorganic.
- the organic / inorganic composite thin film of the present invention can be easily produced.
- a coating method of the organic / inorganic composite thin film forming solution a known coating method can be used. For example, dipping method, spray method, bar coating method, roll coating method, spin coating method, curtain coating method, gravure printing method. , Silk screen method, ink jet method and the like.
- the film thickness to be formed is not particularly limited and is, for example, about 0.1 to 200 ⁇ m.
- the drying / heating treatment of the film formed by applying the organic / inorganic composite thin film forming solution is preferably performed, for example, at 40 to 200 ° C. for about 0.5 to 120 minutes, and at 60 to 160 ° C. for 1 to 1 minute. More preferably, it is performed for about 60 minutes, more preferably for about 1 to 60 minutes at 60 to 120 ° C.
- the pencil hardness specified in the JIS K 5600-5-4 pencil method is about 1H to 4H, and 2H to 4H in terms of adhesion to the substrate and hardness. It is preferable that
- the plasma treatment is a corona discharge treatment in a nitrogen gas atmosphere or a glow plasma treatment in a rare gas atmosphere such as helium or argon. More specifically, a method of generating plasma by applying a high voltage at a high frequency between parallel plate electrodes in which at least one of the electrode pairs is coated with a dielectric, and holding a base material layer between the electrodes, Or the method of moving this base material layer between these electrodes is mentioned.
- Plasma processing includes atmospheric pressure plasma processing and vacuum plasma processing, but since the density of active species is higher in atmospheric pressure plasma processing than in vacuum plasma processing, electrode surfaces can be processed at high speed and high efficiency. In addition, since there is no need to use a vacuum during processing, there is an advantage that processing can be performed with a small number of steps.
- Atmospheric pressure plasma treatment is performed using an atmospheric pressure plasma generator (for example, atmospheric pressure plasma apparatus S-5000 manufactured by Sakai Semiconductor Co., Ltd., atmospheric pressure plasma surface treatment apparatus RD series manufactured by Sekisui Chemical Co., Ltd.). It can be carried out.
- an atmospheric pressure plasma generator for example, atmospheric pressure plasma apparatus S-5000 manufactured by Sakai Semiconductor Co., Ltd., atmospheric pressure plasma surface treatment apparatus RD series manufactured by Sekisui Chemical Co., Ltd.
- UV ozone treatment means that the thin film is irradiated with UV (ultraviolet rays), oxygen in the air is changed to ozone, and the thin film is modified by the ozone and ultraviolet rays.
- the UV light source is not particularly limited as long as oxygen can be changed to ozone by UV irradiation.
- Examples of the UV light source include a low-pressure mercury lamp. Low pressure mercury lamps generate UV light at 185 nm and 254 nm, and the 185 nm line can convert oxygen to ozone.
- the illuminance upon irradiation varies depending on the light source used, but generally several tens to several hundreds mW / cm 2 are used. Moreover, illumination intensity can be changed by condensing or diffusing.
- the irradiation time varies depending on the illuminance of the lamp and the type of the untreated layer, but is usually 1 minute to 24 hours.
- the treatment temperature is usually 10 to 200 ° C.
- the irradiation amount of UV i.e., ultraviolet amount
- the irradiation amount of UV is usually 1000 mJ / cm 2 or more, preferably 1000 ⁇ 100000mJ / cm 2, more preferably 1000 ⁇ 30
- the carbon atom content in the film surface portion is compared with the carbon atom content in the inside of the film (near the joint with the base material) through the heating step (A). Therefore, a concentrated layer of silane compounds is formed on the film surface. Therefore, even if the plasma treatment and UV ozone treatment in the step (B) are performed, only the silane compound on the film surface reacts and the organic polymer compound in the film is hardly affected.
- plasma treatment and UV ozone treatment alkaline aqueous solution treatment, hydrogen peroxide solution treatment, and sodium metasilicate aqueous solution treatment may be performed.
- Second layer A layer containing a self-assembled film that is a hydrolyzed condensate of a metal surfactant.
- a layer containing a film is provided on the outside of the organic-inorganic composite thin film.
- the self-assembled film is preferably a monomolecular film.
- the self-assembled film means a film formed with an ordered structure without external forcing.
- the molecule forming the self-assembled film is obtained from the metal surfactant used for preparing the solution for forming the self-assembled film.
- the molecules of the metal-based surfactant are not solvated by the solvent alone in the self-assembled film forming solution, but some of them gather together to form an aggregate.
- the form of the aggregate is a form in which molecules are assembled by hydrophobic forces or hydrophilic parts by intermolecular force, coordination bond, hydrogen bond, etc .; the molecules forming the membrane are bonded by covalent bonds Aggregated form; Form in which other medium such as water forms micelles or the like as a nucleus or mediation; or form in which these are combined;
- the layer containing the hydrolytic condensate of the metal surfactant is, for example, “at least as described in WO03 / 076064, WO2004 / 091810, WO2006 / 009292, WO2009 / 104424, WO2008 / 059840, etc.
- Produced by bringing the organic-inorganic composite thin film into contact with an organic solvent solution containing “a metal-based surfactant having one or more hydrolyzable groups”, “a compound capable of interacting with the metal-based surfactant” and water. can do.
- An organic solvent solution containing “a metal surfactant having at least one hydrolyzable group”, “a compound capable of interacting with the metal surfactant” and water is commercially available, for example, Japan SAMLAY (registered trademark) manufactured by Soda Co., Ltd. can be used.
- Examples of the “metal surfactant having at least one hydrolyzable group” include formula (II) R 1 m MX 1 tm (II) [Wherein, R 1 represents a hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, a halogenated hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, or a linking group. Represents a hydrocarbon group having 1 to 30 carbon atoms or a halogenated hydrocarbon group having 1 to 30 carbon atoms including a linking group, and M represents a silicon atom, a germanium atom, a tin atom, a titanium atom, and a zirconium atom.
- Represents at least one metal atom selected from the group consisting of X 1 represents a hydroxyl group or a hydrolyzable group, and t represents the valence of M.
- m represents a positive integer from 1 to (t ⁇ 1).
- R 1 s may be the same or different from each other.
- X 1 may be the same or different, but at least one of X 1 is a hydrolyzable group.
- the metal-type surfactant shown by these is preferable.
- the hydrocarbon group of the hydrocarbon group having 1 to 30 carbon atoms which may have a substituent is a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, Isobutyl group, sec-butyl group, t-butyl group, n-pentyl group, isopentyl group, neopentyl group, t-pentyl group, n-hexyl group, isohexyl group, n-heptyl group, n-octyl group, alkyl groups such as n-decyl group and n-octadecyl group; alkenyl groups such as vinyl group, propenyl group, butenyl group, pentenyl group, n-decynyl group and n-octadecynyl group; phenyl group, 1-n
- Examples of the halogenated hydrocarbon group of the halogenated hydrocarbon group having 1 to 30 carbon atoms which may have a substituent include a halogenated alkyl group having 1 to 30 carbon atoms and a halogenated alkenyl group having 1 to 30 carbon atoms. And a halogenated aryl group having 1 to 30 carbon atoms.
- a group in which two or more hydrogen atoms in an alkyl group having 1 to 30 carbon atoms are substituted with a halogen atom is preferable, and two or more hydrogen atoms in an alkyl group having 1 to 30 carbon atoms are fluorine atoms.
- a fluorinated alkyl group substituted with is more preferable.
- the branched portion is preferably a short chain having 1 to 4 carbon atoms, preferably 1 to 2 carbon atoms.
- hydrocarbon group of the hydrocarbon group containing a linking group and the halogenated hydrocarbon group of a halogenated hydrocarbon group containing a linking group include the hydrocarbon groups that may have the above-mentioned substituents.
- the thing similar to what was mentioned as a halogenated hydrocarbon group of the halogenated hydrocarbon group which may have a hydrogen group and a substituent is mentioned.
- the linking group is preferably present between carbon-carbon bonds of a hydrocarbon group or a halogenated hydrocarbon group, or between carbon of the hydrocarbon group and a metal atom M described later.
- linking group examples include —O—, —S—, —SO 2 —, —CO—, —C ( ⁇ O) O— or —C ( ⁇ O) NR 51 —
- R 51 represents A hydrogen atom; an alkyl group such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group; Among these, from the viewpoint of water repellency and durability, an alkyl group having 1 to 30 carbon atoms, a fluorinated alkyl group having 1 to 30 carbon atoms, or a fluorinated alkyl group containing a linking group is preferable.
- X 1 represents a hydroxyl group or a hydrolyzable group.
- the hydrolyzable group is not particularly limited as long as it is a group that reacts with water and decomposes.
- an optionally substituted alkoxy group having 1 to 6 carbon atoms an optionally substituted acyloxy group; a halogen atom such as a fluorine atom, chlorine atom, bromine atom or iodine atom; an isocyanate group Cyano group; amino group; or amide group.
- alkoxy group having 1 to 6 carbon atoms examples include methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, sec-butoxy group, t-butoxy group, n-pentyloxy group, and n-to A xyloxy group etc. are mentioned.
- the acyloxy group examples include an acetoxy group, a propionyloxy group, an n-propylcarbonyloxy group, an isopropylcarbonyloxy group, and an n-butylcarbonyloxy group.
- substituents include a carboxyl group, an amide group, an imide group, an ester group, and a hydroxyl group.
- a hydroxyl group, an alkoxy group having 1 to 4 carbon atoms, an acyloxy group, a halogen atom, or an isocyanate group is preferable, and an alkoxy group or acyloxy group having 1 to 4 carbon atoms is more preferable.
- M represents one kind of atom selected from the group consisting of a silicon atom, a germanium atom, a tin atom, a titanium atom, and a zirconium atom.
- a silicon atom is preferable from the viewpoint of availability of raw materials and reactivity.
- Examples of the metal surfactant represented by the above formula (II) include the following silane coupling agents.
- M is Si and R 1 is a hydrocarbon group, but the present invention is not limited thereto.
- Examples of the “compound capable of interacting with a metal-based surfactant” include metal oxides; metal hydroxides; metal alkoxides; metal alkoxides partial hydrolysis products; metal alkoxides hydrolysis products; A coordinated metal compound; at least one selected from other silanol condensation catalysts is used.
- metal oxides include methanol silica sol, IPA-ST, IPA-ST-UP, IPA-ST-ZL, NPC-ST-30, DMAC-ST, MEK-ST, MIBK-ST, and XBA-ST.
- PMA-ST all of which represent the trade names of organosilica sol manufactured by Nissan Chemical Industries, Ltd.
- any metal hydroxide may be used as long as it is a metal hydroxide.
- a manufacturing method of a metal hydroxide the method of hydrolyzing the below-mentioned metal alkoxide, the method of making a metal salt react with a metal hydroxide, etc. are mentioned.
- what is marketed as a metal hydroxide can also be refine
- metal alkoxides examples include silicon alkoxides such as Si (OCH 3 ) 4 , Si (OC 2 H 5 ) 4 , Si (OC 3 H 7 -i) 4 , Si (OC 4 H 9 -t) 4 ; Ti ( Titanium alkoxides such as OCH 3 ) 4 , Ti (OC 2 H 5 ) 4 , Ti (OC 3 H 7 -i) 4 , Ti (OC 4 H 9 ) 4 ; Ti [OSi (CH 3 ) 3 ] 4 , Ti Tetrakistrialkylsiloxytitanium such as [OSi (C 2 H 5 ) 3 ] 4 ; Zr (OCH 3 ) 4 , Zr (OC 2 H 5 ) 4 , Zr (OC 3 H 7 ) 4 , Zr (OC 4 H 9 ) 4 zirconium such alkoxide; Al (OCH 3) 4, Al (OC 2 H 5) 4, Al (OC 3 H 7 -i) 4, Al (OC 4 H 9) 3
- indium alkoxides Sn Tin alkoxides such as (OCH 3 ) 4 , Sn (OC 2 H 5 ) 4 , Sn (OC 3 H 7 -i) 4 , Sn (OC 4 H 9 ) 4 ; Ta (OCH 3 ) 5 , Ta (OC 2 Tantalum alkoxides such as H 5 ) 5 , Ta (OC 3 H 7 -i) 5 , Ta (OC 4 H 9 ) 5 ; W (OCH 3 ) 6 , W (OC 2 H 5 ) 6 , W (OC 3 H 7- i) tungsten alkoxides such as 6 and W (OC 4 H 9 ) 6 ; zinc alkoxides such as Zn (OC 2 H 5 ) 2 ; lead alkoxides such as Pb (OC 4 H 9 ) 4 ; These metal alkoxides can be used alone or in combination of two or more.
- the metal alkoxide partial hydrolysis product is obtained before the metal alkoxide is completely hydrolyzed, and examples thereof include a metal oxide sol precursor or an oligomer present in the state of oligomer. Can do.
- the metal alkoxide partial hydrolysis product is stably dispersed without aggregation in an organic solvent in the absence of at least one selected from the group consisting of acids, bases and dispersion stabilizers.
- Preferred examples include dispersoids having the above properties.
- the dispersoid refers to fine particles dispersed in the dispersion system, and specific examples include colloidal particles.
- the state of stable dispersion without agglomeration means that in the absence of acid, base and / or dispersion stabilizer in the organic solvent, the dispersoid of the hydrolysis product coagulates and becomes heterogeneous.
- separated is said, Preferably the transparent and homogeneous state is said.
- Transparent means a state in which the transmittance in visible light is high. Specifically, the concentration of the dispersoid is 0.5% by weight in terms of oxide, the optical path length of the quartz cell is 1 cm, and the control sample is organic. This is a state in which the transmittance is preferably 80 to 100%, expressed as a spectral transmittance measured under the condition of using a solvent and a light wavelength of 550 nm.
- the particle size of the dispersoid of the hydrolysis product is not particularly limited, but is preferably in the range of 1 to 100 nm and more preferably in the range of 1 to 50 nm in order to obtain a high visible light transmittance. More preferably, it is in the range of 1 to 10 nm.
- an organic solvent is used in the absence of an acid, a base, and / or a dispersion stabilizer in an amount of 0.5 to 2.0 with respect to the metal alkoxide exemplified above.
- a preferred example is a method of hydrolyzing in an organic solvent reflux temperature range from ⁇ 100 ° C. using less than double moles of water.
- the metal alkoxide hydrolysis product used in the present invention is a product obtained by hydrolysis with water equal to or more than twice the metal alkoxides. Even if the hydrolysis product is obtained by hydrolyzing a metal alkoxide with water at least twice as much as the metal alkoxide, the metal alkoxide is less than twice the equivalent of the metal alkoxide.
- the partial hydrolysis product of the metal alkoxides was obtained by partial hydrolysis with water, and the partial hydrolysis product was further mixed with a predetermined amount of water (the amount of water used in the previous partial hydrolysis and In a total amount of 2 times the equivalent of metal alkoxides).
- the chelated or coordinated metal compound can be prepared by adding a chelating agent or a coordination compound capable of forming a complex with the metal of the metal compound to a solution of the metal compound.
- a chelating agent or coordination compound a metal hydroxide, metal alkoxide, or metal alkoxide is chelated or coordinated to the metal of the hydrolysis product obtained by treating with water to form a complex. If it can do, it will not specifically limit.
- Chelating agents or coordination compounds include saturated aliphatic carboxylic acids such as acetic acid, propionic acid, butyric acid, valeric acid, lauric acid, myristic acid, palmitic acid, stearic acid; oxalic acid, malonic acid, succinic acid, glutaric acid Saturated aliphatic dicarboxylic acids such as adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid; unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, array acid, maleic acid; benzoic acid, toluic acid, Aromatic carboxylic acids such as phthalic acid; halogenocarboxylic acids such as chloroacetic acid and trifluoroacetic acid; ⁇ -diketones such as acetylacetone, benzoylacetone and hexafluoroacetylacetone; ⁇ -ketoesters such as methyl acetoacetate and
- silanol condensation catalysts examples include carboxylic acid metal salts, carboxylic acid ester metal salts, carboxylic acid metal salt polymers, carboxylic acid metal salt chelates, titanic acid esters and titanic acid ester chelates, and acid catalysts.
- the acid catalyst examples include mineral acids such as hydrochloric acid, nitric acid, boric acid, and borofluoric acid, and organic acids such as acetic acid, formic acid, oxalic acid, carbonic acid, trifluoroacetic acid, p-toluenesulfonic acid, and methanesulfonic acid.
- photoacid generators that generate an acid upon irradiation with light, specifically, diphenyliodonium hexafluorophosphate, triphenylphosphonium hexafluorophosphate, and the like can be exemplified.
- the content of water in an organic solvent solution containing a metal surfactant having at least one hydrolyzable group, a compound capable of interacting with the metal surfactant, and water is preferably 10 ppm to 2000 ppm.
- the above organic solvent solution is prepared by dipping, spin coating, spraying, roller coating, It can be carried out by contacting the organic-inorganic composite thin film on the organic-inorganic composite thin film by a method such as the Mayer bar method, screen printing, brush coating method, etc., preferably by a dip method.
- Example 1 1-1. Preparation of polysiloxane solution [A-1] To 15.0 g of diisopropoxybisacetylacetonate titanium, 28.93 g of vinyltrimethoxysilane which is an organosilicon compound and 3-methacryloxypropyltrimethoxysilane 20. 78 g was added and stirred for about 1 minute. Next, 36.71 g of MEK was added so that the solid content in [A-1] was 30 wt%, and then 1.5 times mol of pure component (Ti + Si) mol in [A-1] was added. 8.38 g of water was added.
- Dip coating is formed on the silicon wafer and iron material so that the thickness is 0.6 ⁇ m or more, and is heated at 130 to 150 ° C. for 5 to 10 minutes with a hot air circulating dryer to form a coating film. .
- SAM self-assembled monolayer
- YD-128 (Nippon Steel Chemical Co., Ltd., BPA type epoxy resin) is diluted with methyl ethyl ketone (MEK) so that the solid content is 30 wt%, and 4 wt% of 2-ethyl is added to the solid content of YD-128.
- MEK methyl ethyl ketone
- a Dip coat film was formed on the iron material so that the thickness became 0.6 ⁇ m or more, and heated at 130 to 150 ° C. for 5 to 10 minutes with a hot air circulation dryer, A coating film was formed.
- the obtained coating film is subjected to UV ozone cleaning for 10 minutes using a UV ozone cleaning device (manufactured by Iwasaki Electric Co., Ltd.) and then placed in a SAM forming solution (SAMLAY (registered trademark) Nippon Soda Co., Ltd.) for 10 minutes. Soaked. After pulling up from the SAM liquid, it was washed with NS Clean 100, drained by air blow, and heated at 60 ° C. for 10 minutes in a hot air circulating dryer.
- SAMLAY registered trademark
- Example 1 and Comparative Examples 1 and 2 were evaluated.
- the measurement method is as follows. The results are shown in Table 1. However, Example 1 used what was laminated
- Liquid repellency static contact angle measurement: After 2 ⁇ l of water or 7 ⁇ l of tetradecane (hereinafter abbreviated as “TD”) is dropped from the microsyringe onto the surface of each sample, the contact angle is measured using Drop Master 700 (manufactured by Kyowa Interface Science Co., Ltd.) 60 seconds later. did. 2) Falling angle: At the room temperature, the tilt angle of the deposition substrate was changed, and the drop start angle of the droplet was measured. Water was used as the liquid, and the applied amount was 30 ⁇ l.
- Hysteresis expansion contraction method: The dynamic contact angle of the thin film was measured using Drop Master 700 (manufactured by Kyowa Interface Science Co., Ltd.) using butyl carbitol acetate as droplets. The measurement of the dynamic contact angle is a method performed based on the difference ⁇ between the advancing angle ⁇ a and the receding angle ⁇ r of the droplet, and is described in detail in Japanese Patent Application Laid-Open No. 2007-322181.
- Coating film storage stability test i) Using a saturated aqueous solution of Na 2 SO 4 , a high humidity condition was maintained in a desiccator, and the sample of Example 1 was stored for about 1 month to check the state of the coating film. No abnormality was observed visually.
- SAM formation was performed using a sample after 1 month of storage, and the influence on the SAM formation speed and liquid repellency was investigated. The results are shown in Table 3 below. From the results, it was found that even a coating film after 1 month of storage had liquid repellency (after SAM formation) almost the same as the state of the coating film before storage, so that there was storage stability during coating.
- Example 2 2-1. Preparation of polysiloxane solution [B-1] In a 140 mL mayonnaise bottle, 17.00 g of methyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd. KBM-13) was charged. 3.02 g of diisopropoxybisacetylacetonate titanium (Nippon Soda Co., Ltd., T-50, TiO 2 equivalent solid content: 16.5 wt%) so as to be 5 mol% in terms of TiO 2 with respect to methyltrimethoxysilane Added. 19.91 g of MIBK was charged and stirred for 15 minutes (stirring speed: 100 rpm).
- a bar coat film was formed on the thin film-formed stainless steel plate so as to have a thickness of 5 ⁇ m (Dip film formation is also possible), and the film was heated at 150 ° C. for 30 minutes with a hot air circulation dryer. About the obtained coating film, distribution of each film
- SAM self-assembled monolayer
- the obtained coating film is subjected to UV ozone cleaning for 10 minutes using a UV ozone cleaning device (manufactured by Iwasaki Electric Co., Ltd.) and then placed in a SAM forming solution (SAMLAY (registered trademark) Nippon Soda Co., Ltd.) for 10 minutes. Soaked. After lifting from the SAM forming solution, it was washed with NS Clean 100, drained by air blow, and heated at 60 ° C. for 10 minutes with a hot air circulation dryer.
- SAMLAY registered trademark
- a bar coat film was formed on the thin film-formed stainless steel plate so as to have a thickness of 5 ⁇ m (Dip film formation was also possible), and the film was heated at 150 ° C. for 30 minutes with a hot air circulating dryer. About the obtained coating film, distribution of each film
- SAM self-assembled monolayer
- Example 3 and Comparative Example 4 were evaluated.
- the measurement method is as follows. The results are shown in Table 5.
- TD tetradecane
- Thin film formation Dip coating is formed on an acrylic substrate and a polycarbonate substrate to a thickness of 0.6 ⁇ m or more, and heated at 60 to 100 ° C. for 5 to 20 minutes with a hot-air circulating drier. did.
- SAM self-assembled monolayer
- Example 6 The solution [D-2] for forming an organic-inorganic composite thin film produced in Example 4 was formed into a Dip coat film on a polycarbonate resin substrate so as to be 0.6 ⁇ m or more, and was heated to 60 to 100 ° C. with a hot air circulation dryer. For 5 to 20 minutes to form a coating film.
- Example 4 and Comparative Examples 5 to 8 were evaluated.
- the measurement method is as follows. The results are shown in Table 6. However, Example 4-1 was laminated on an acrylic resin substrate, and Example 4-2 was laminated on a polycarbonate resin substrate. Comparative Example 7 is an untreated acrylic resin substrate, and Comparative Example 8 is an untreated polycarbonate resin substrate.
Abstract
Description
そこで、特許文献2では、フッ素系の単分子膜乃至それに近い薄膜のプライマー層として、光硬化性のプライマー層が提案されている。しかし、このプライマー層では、その上に緻密な自己組織化膜、単分子膜を形成することは困難であり、また、基板に対して十分な硬度や耐溶剤性を付与することは困難であった。また、紫外線などを照射してプライマー層を硬化させるため立体形状の基体への適用が困難であった。 Conventionally, a method of forming a self-assembled film on the surface of a base material has been studied as a method for making the surface of metal, ceramic, glass, plastic, fiber, paper, wood, etc. water and oil repellent (patents). Reference 1). Since these films react with hydroxyl groups, imino groups, or carboxyl groups on the substrate surface and are chemically bonded to the substrate surface via —SiO— or —SiN <bond, When using a base material having a functional group, it was easy to form a self-assembled film on the base material. However, it has been difficult to form a self-assembled film on a substrate such as a resin or a metal that is difficult to oxidize.
Therefore, in Patent Document 2, a photocurable primer layer has been proposed as a primer layer of a fluorine-based monomolecular film or a thin film similar thereto. However, with this primer layer, it is difficult to form a dense self-assembled film or monomolecular film thereon, and it is difficult to impart sufficient hardness and solvent resistance to the substrate. It was. Further, since the primer layer is cured by irradiating ultraviolet rays or the like, it is difficult to apply it to a three-dimensional substrate.
(1)基体上に、第1層、第2層の順に形成された薄膜積層体において、
第1層が、
a)式(I)
RnSiX4-n (I)
(式中、RはSiに炭素原子が直接結合した有機基を表し、Xは水酸基又は加水分解性基を表す。nは1又は2を表し、nが2のとき各Rは同一でも異なっていてもよく、(4-n)が2以上のとき各Xは同一でも異なっていてもよい。)で表される有機ケイ素化合物の縮合物、
b)熱硬化性化合物の硬化物を含有する有機無機複合薄膜であって、
第2層が、金属界面活性剤の加水分解縮合物である自己組織化膜を含有する層であることを特徴とする薄膜積層体、
(2)第1層中のa)とb)との重量比が50:50~5:95、好ましくは25:75~5:95であることを特徴とする(1)に記載の薄膜積層体、
(3)式(I)中のRがビニル基である化合物の縮合物を有機ケイ素化合物の縮合物全体の55質量%以上含有することを特徴とする(1)又は(2)に記載の薄膜積層体、
(4)基体が樹脂であることを特徴とする(1)~(3)のいずれかに記載の薄膜積層体、及び
(5)金属系界面活性剤が、式(II)
R1 mMX1 t-m (II)
〔式中、R1は、置換基を有していてもよい炭素数1~30の炭化水素基、置換基を有していてもよい炭素数1~30のハロゲン化炭化水素基、連結基を含む炭素数1~30の炭化水素基、又は連結基を含む炭素数1~30のハロゲン化炭化水素基を表し、Mは、ケイ素原子、ゲルマニウム原子、スズ原子、チタン原子、及びジルコニウム原子からなる群から選ばれる少なくとも1種の金属原子を表し、X1は、水酸基又は加水分解性基を表し、tはMの原子価を表す。mは、1から(t-1)のいずれかの正整数を表し、mが2以上の場合、R1は、互いに同一でも相異なっていてもよい。(t-m)が2以上の場合、X1は同一であっても、相異なっていてもよいが、X1のうち、少なくとも一個は加水分解性基である。〕で示される化合物である(1)~(4)のいずれかに記載の薄膜積層体に関する。 That is, the present invention
(1) In the thin film laminate formed in the order of the first layer and the second layer on the substrate,
The first layer is
a) Formula (I)
R n SiX 4-n (I)
(In the formula, R represents an organic group in which a carbon atom is directly bonded to Si, X represents a hydroxyl group or a hydrolyzable group. N represents 1 or 2, and when n is 2, each R is the same or different. And each X may be the same or different when (4-n) is 2 or more.)
b) An organic-inorganic composite thin film containing a cured product of a thermosetting compound,
A thin film laminate, wherein the second layer is a layer containing a self-assembled film that is a hydrolysis condensate of a metal surfactant;
(2) The thin film stack according to (1), wherein the weight ratio of a) to b) in the first layer is 50:50 to 5:95, preferably 25:75 to 5:95 body,
(3) The thin film as described in (1) or (2), wherein the condensate of the compound in which R in the formula (I) is a vinyl group is contained in an amount of 55% by mass or more of the total condensate of the organosilicon compound. Laminate,
(4) The thin film laminate according to any one of (1) to (3), wherein the substrate is a resin, and (5) the metal-based surfactant is represented by the formula (II)
R 1 m MX 1 tm (II)
[Wherein, R 1 represents a hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, a halogenated hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, or a linking group. Represents a hydrocarbon group having 1 to 30 carbon atoms or a halogenated hydrocarbon group having 1 to 30 carbon atoms including a linking group, and M represents a silicon atom, a germanium atom, a tin atom, a titanium atom, and a zirconium atom. Represents at least one metal atom selected from the group consisting of X 1 represents a hydroxyl group or a hydrolyzable group, and t represents the valence of M. m represents a positive integer from 1 to (t−1). When m is 2 or more, R 1 s may be the same or different from each other. When (tm) is 2 or more, X 1 may be the same or different, but at least one of X 1 is a hydrolyzable group. The thin film laminate according to any one of (1) to (4), which is a compound represented by the formula:
A)基体
B)第1層
a)式(I)
RnSiX4-n (I)
(式中、RはSiに炭素原子が直接結合した有機基を表し、Xは水酸基又は加水分解性基を表す。nは1又は2を表し、nが2のとき各Rは同一でも異なっていてもよく、(4-n)が2以上のとき各Xは同一でも異なっていてもよい。)で表される有機ケイ素化合物の縮合物、
b)熱硬化性化合物の硬化物
を含有する有機無機複合薄膜、
C)第2層
金属界面活性剤の加水分解縮合物である自己組織化膜を含有する層
以下に、詳細に説明する。 The thin film laminate of the present invention comprises a structure in which the following layers A), B) first layer, and C) second layer are laminated in the order of A), B), and C) on at least one surface of the substrate. It is a thin film laminate. The laminated body of the present invention may further include a case where one or more other layers are laminated as long as the effects of the present invention are exhibited.
A) Substrate B) First layer a) Formula (I)
R n SiX 4-n (I)
(In the formula, R represents an organic group in which a carbon atom is directly bonded to Si, X represents a hydroxyl group or a hydrolyzable group. N represents 1 or 2, and when n is 2, each R is the same or different. And each X may be the same or different when (4-n) is 2 or more.)
b) an organic-inorganic composite thin film containing a cured product of a thermosetting compound,
C) Layer containing a self-assembled film which is a hydrolyzed condensate of the second layer metal surfactant.
本発明において使用される基体は、本発明の積層体を形成することができる限り制限はないが、樹脂が特に好ましく、例えば、ポリアミドイミド、ポリエーテルイミド、ポリイミド、ポリアミノビスマレインイミド等のポリイミド系樹脂;ポリエチレンテレフタレート、ポリエチレン2,6-ナフタレート等のポリエステル系樹脂;フェノール系エポキシ樹脂、アルコール系エポキシ樹脂、グリシジルエーテル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂等のエポキシ系樹脂;ポリエーテルエーテルケトン、ポリエーテルケトン、ポリエーテルニトリル、ポリエーテルスルホン等のポリエーテル系樹脂;セルローストリアセテート、セルロースジアセテート、ニトロセルロース等のセルロース系樹脂;ポリスチレン、シンジオタクチックポリスチレン等のポリスチレン系樹脂;エチレン、プロピレン、ブテン等のオレフィンの単独重合体又は共重合体等のポリオレフィン系樹脂;ノルボルネン系樹脂等のシクロオレフィン系樹脂;ナイロン6、ナイロン12、共重合ナイロン等のポリアミド系樹脂;エチレン-ポリビニルアルコール共重合体等のポリビニルアルコール系樹脂;エチレン-四フッ化エチレン共重合体、ポリ三フッ化塩化エチレン、四フッ化エチレン-パーフルオロアルキルビニルエーテル共重合体、ポリフッ化ビニル、パーフルオロエチレン-パーフルオロプロピレン-パーフルオロビニルエーテル共重合体等のフッ素系樹脂;ポリカーボネート、ポリビニルブチラート樹脂、ポリアリレート樹脂等が挙げられる。 (1) Substrate The substrate used in the present invention is not particularly limited as long as the laminate of the present invention can be formed, but a resin is particularly preferable. For example, polyamideimide, polyetherimide, polyimide, polyaminobismaleimide Polyimide resins such as polyethylene terephthalate, polyester resins such as polyethylene 2,6-naphthalate; Epoxy resins such as phenolic epoxy resins, alcoholic epoxy resins, glycidyl ether type epoxy resins, glycidyl amine type epoxy resins; polyethers Polyether resins such as ether ketone, polyether ketone, polyether nitrile, and polyether sulfone; Cellulosic resins such as cellulose triacetate, cellulose diacetate, and nitrocellulose; polystyrene, Shinji Polystyrene resins such as tactic polystyrene; polyolefin resins such as homopolymers or copolymers of olefins such as ethylene, propylene and butene; cycloolefin resins such as norbornene resins; nylon 6, nylon 12, copolymer nylon Polyamide resins such as ethylene-polyvinyl alcohol copolymers; ethylene-tetrafluoroethylene copolymers, polytetrafluoroethylene ethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymers, Fluorine resins such as polyvinyl fluoride and perfluoroethylene-perfluoropropylene-perfluorovinyl ether copolymer; polycarbonate, polyvinyl butyrate resin, polyarylate resin and the like.
また、樹脂基体としては、単層フィルムや二層以上をラミネート、コーティング等の手段によって積層させた積層フィルム等が挙げられる。 The film-like substrate may be made of an unstretched film or may be made of a stretched film.
Examples of the resin substrate include a single layer film and a laminated film obtained by laminating two or more layers by means such as laminating or coating.
フィルム状の樹脂基体の厚みは、特に制限されるものではないが、通常1~1000μm、好ましくは3~500μmである。 The film-like plastic substrate can be produced by a conventionally known general method. For example, a substrate made of an unstretched film that is substantially amorphous and not oriented can be produced by melting a material resin with an extruder, extruding it with an annular die or a T die, and quenching. In addition, a substrate made of an unstretched film is subjected to a known method such as uniaxial stretching, tenter-type sequential biaxial stretching, tenter-type simultaneous biaxial stretching, tubular-type simultaneous biaxial stretching, or the like. A substrate made of a stretched film can be produced by stretching in a direction perpendicular to the flow direction of the substrate (horizontal axis). The draw ratio in this case can be appropriately selected according to the resin as the raw material of the substrate, but is preferably 2 to 10 times in the vertical axis direction and the horizontal axis direction.
The thickness of the film-like resin substrate is not particularly limited, but is usually 1 to 1000 μm, preferably 3 to 500 μm.
本発明の第1層である有機無機複合薄膜は、少なくとも有機ケイ素化合物の縮合物、及び熱硬化性化合物を必須成分として含有するが、その他、金属化合物等を含有していてもよい。 (2) First layer The organic-inorganic composite thin film that is the first layer of the present invention contains at least a condensate of an organosilicon compound and a thermosetting compound as essential components, but also contains a metal compound or the like. May be.
本発明の有機ケイ素化合物は、以下の式(I)で表される。
RnSiX4-n (I)
式中、RはSiに炭素原子が直接結合する有機基を表し、Xは水酸基又は加水分解性基を表す。nは1又は2を表し、nが2のとき各Rは同一でも異なっていてもよく、(4-n)が2以上のとき各Xは同一でも異なっていてもよい。 1) Condensate of organosilicon compound The organosilicon compound of the present invention is represented by the following formula (I).
R n SiX 4-n (I)
In the formula, R represents an organic group in which a carbon atom is directly bonded to Si, and X represents a hydroxyl group or a hydrolyzable group. n represents 1 or 2, and when n is 2, each R may be the same or different, and when (4-n) is 2 or more, each X may be the same or different.
上記「置換されていてもよい炭化水素基」及び「置換されていてもよい炭化水素のポリマーからなる基」の炭化水素基としては、通常、炭素数1~30の炭化水素基であり、例えば、アルキル基、シクロアルキル基、シクロアルキルアルキル基、アルケニル基、アルキニル基、アリール基、アリールアルキル基、アリールアルケニル基等が挙げられる。これらのうち、好ましくは、炭素数1~10の直鎖又は分岐鎖のアルキル基、炭素数3~8のシクロアルキル基、炭素数2~10の直鎖又は分岐鎖のアルケニル基、炭素数3~8のシクロアルケニル基である。 Here, examples of the “organic group in which a carbon atom is directly bonded to Si” represented by R include a hydrocarbon group which may be substituted, a group composed of a polymer of a hydrocarbon which may be substituted, and the like. Can do.
The hydrocarbon group in the above “optionally substituted hydrocarbon group” and “group consisting of an optionally substituted hydrocarbon polymer” is usually a hydrocarbon group having 1 to 30 carbon atoms, for example, , Alkyl group, cycloalkyl group, cycloalkylalkyl group, alkenyl group, alkynyl group, aryl group, arylalkyl group, arylalkenyl group and the like. Of these, a linear or branched alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 8 carbon atoms, a linear or branched alkenyl group having 2 to 10 carbon atoms, and a carbon number of 3 are preferable. A cycloalkenyl group of ˜8.
「シクロアルキルアルキル基」としては、炭素数3~8のシクロアルキル基と炭素数1~8のアルキル基の結合した基が挙げられ、例えば、シクロプロピルメチル基、シクロプロピルプロピル基、シクロブチルメチル基、シクロペンチルメチル基、シクロペンチルエチル基、シクロへキシルエチル基、シクロヘプチルメチル基等が挙げられる。 Examples of the “alkynyl group” include alkynyl groups having 2 to 10 carbon atoms, such as ethynyl group, prop-1-yn-1-yl group, prop-2-yn-1-yl group, but-1- In-1-yl group, but-3-in-1-yl group, penta-1-in-1-yl group, penta-4-in-1-yl group, hexa-1-in-1-yl group A hexa-5-in-1-yl group, a hepta-1-in-1-yl group, an octa-1-in-1-yl group, an octa-7-in-1-yl group, and the like.
Examples of the “cycloalkylalkyl group” include a group in which a cycloalkyl group having 3 to 8 carbon atoms and an alkyl group having 1 to 8 carbon atoms are bonded, and examples thereof include a cyclopropylmethyl group, a cyclopropylpropyl group, and cyclobutylmethyl. Group, cyclopentylmethyl group, cyclopentylethyl group, cyclohexylethyl group, cycloheptylmethyl group and the like.
「アリールアルキル基」としては、炭素数6~10のアリール基と炭素数1~8のアルキル基が結合した基が挙げられ、例えば、ベンジル基、フェネチル基、3-フェニル-n-プロピル基、4-フェニル-n-ブチル基、5-フェニル-n-ペンチル基、8-フェニル-n-オクチル基、ナフチルメチル基等が挙げられる。
「アリールアルケニル基」としては、炭素数6~10のアリール基と炭素数2~8のアルケニル基が結合した基が挙げられ、例えば、スチリル基、3-フェニル-プロパ-1-エン-1-イル基、3-フェニル-プロパ-2-エン-1-イル基、4-フェニル-ブタ-1-エン-1-イル基、4-フェニル-ブタ-3-エン-1-イル基、5-フェニル-ペンタ-1-エン-1-イル基、5-フェニル-ペンタ-4-エン-1-イル基、8-フェニル-オクタ-1-エン-1-イル基、8-フェニル-オクタ-7-エン-1-イル基、ナフチルエテニル基等が挙げられる。 Examples of the “aryl group” include aryl groups having 6 to 10 carbon atoms, such as phenyl group and naphthyl group.
Examples of the “arylalkyl group” include a group in which an aryl group having 6 to 10 carbon atoms and an alkyl group having 1 to 8 carbon atoms are bonded, such as a benzyl group, a phenethyl group, a 3-phenyl-n-propyl group, Examples include 4-phenyl-n-butyl group, 5-phenyl-n-pentyl group, 8-phenyl-n-octyl group, naphthylmethyl group and the like.
Examples of the “arylalkenyl group” include a group in which an aryl group having 6 to 10 carbon atoms and an alkenyl group having 2 to 8 carbon atoms are bonded, such as a styryl group, 3-phenyl-prop-1-ene-1- Yl, 3-phenyl-prop-2-en-1-yl, 4-phenyl-but-1-en-1-yl, 4-phenyl-but-3-en-1-yl, 5- Phenyl-pent-1-en-1-yl group, 5-phenyl-pent-4-en-1-yl group, 8-phenyl-oct-1-en-1-yl group, 8-phenyl-oct-7 -En-1-yl group, naphthylethenyl group and the like.
ここで、「エポキシアルキル基」としては炭素数3~10の直鎖又は分岐鎖のエポキシアルキル基が好ましく、例えばグリシジル基、グリシジルメチル基、2-グリシジルエチル基、3-グリシジルプロピル基、4-グリシジルブチル基、3,4-エポキシブチル基、4,5-エポキシペンチル基、5,6-エポキシヘキシル基等の直鎖状のエポキシ基を含むアルキル基;
β-メチルグリシジル基、β-エチルグリシジル基、β-プロピルグリシジル基、2-グリシジルプロピル基、2-グリシジルブチル基、3-グリシジルブチル基、2-メチル-3-グリシジルプロピル基、3-メチル-2-グリシジルプロピル基、3-メチル-3,4-エポキシブチル基、3-エチル-3,4-エポキシブチル基、4-メチル-4,5-エポキシペンチル基、5-メチル-5,6-エポキシヘキシル基等の枝分かれ状のエポキシ基を含むアルキル基等が挙げられる。
「グリシドキシアルキル基」としては、グリシドキシメチル基、グリシドキシプロピル基等が挙げられる。 Here, the “alkoxyalkyl group” is usually a group in which an alkoxy group having 1 to 6 carbon atoms and an alkyl group having 1 to 6 carbon atoms are bonded, such as a methoxymethyl group, 2-methoxyethyl group, 3- And ethoxy-n-propyl group.
Here, the “epoxyalkyl group” is preferably a linear or branched epoxyalkyl group having 3 to 10 carbon atoms, such as a glycidyl group, a glycidylmethyl group, a 2-glycidylethyl group, a 3-glycidylpropyl group, a 4- An alkyl group containing a linear epoxy group such as a glycidylbutyl group, a 3,4-epoxybutyl group, a 4,5-epoxypentyl group, or a 5,6-epoxyhexyl group;
β-methylglycidyl group, β-ethylglycidyl group, β-propylglycidyl group, 2-glycidylpropyl group, 2-glycidylbutyl group, 3-glycidylbutyl group, 2-methyl-3-glycidylpropyl group, 3-methyl- 2-glycidylpropyl group, 3-methyl-3,4-epoxybutyl group, 3-ethyl-3,4-epoxybutyl group, 4-methyl-4,5-epoxypentyl group, 5-methyl-5,6- Examples thereof include an alkyl group containing a branched epoxy group such as an epoxy hexyl group.
Examples of the “glycidoxyalkyl group” include glycidoxymethyl group and glycidoxypropyl group.
なお、本発明の有機無機複合薄膜における主成分となる有機ケイ素化合物の縮合物は、これらの有機ケイ素化合物及び/又はその縮合物がさらに縮合したものを意味する。
有機ケイ素化合物の縮合物の配合割合は、有機無機複合薄膜全体の固形分に対して2~98質量%、好ましくは5~50質量%、更に好ましくは5~30質量%である。 Examples of the organosilicon compound having a group composed of a hydrocarbon polymer include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and cyclohexyl. (Meth) acrylate and other (meth) acrylic acid esters; (meth) acrylic acid, itaconic acid, fumaric acid and other carboxylic acids and maleic anhydride and other acid anhydrides; glycidyl (meth) acrylate and other epoxy compounds; diethylaminoethyl Amino compounds such as (meth) acrylate and aminoethyl vinyl ether; amino compounds such as (meth) acrylamide, itaconic acid diamide, α-ethylacrylamide, crotonamide, fumaric acid diamide, maleic acid diamide, and N-butoxymethyl (meth) acrylamide Compound: A compound in which a vinyl polymer obtained by copolymerizing a vinyl compound selected from acrylonitrile, styrene, α-methylstyrene, vinyl chloride, vinyl acetate, vinyl propionate and the like is used as the R component of formula (I) can be mentioned. .
In addition, the condensate of the organosilicon compound used as the main component in the organic-inorganic composite thin film of the present invention means a product obtained by further condensing these organosilicon compounds and / or the condensate thereof.
The blending ratio of the organosilicon compound condensate is 2 to 98% by mass, preferably 5 to 50% by mass, more preferably 5 to 30% by mass, based on the solid content of the whole organic-inorganic composite thin film.
本発明の熱硬化性化合物は、熱硬化させることが可能な官能基を有する化合物であれば特に限定されず、熱硬化性樹脂でも熱硬化性低分子化合物でもよい。
熱硬化性樹脂としては、例えば、フェノールノボラック樹脂、クレゾールノボラック樹脂、ビスフェノールAノボラック樹脂等のノボラック型フェノール樹脂、レゾール型フェノール樹脂等のフェノール樹脂;ビスフェノールAエポキシ樹脂、ビスフェノールFエポキシ樹脂等のビスフェノール型エポキシ樹脂、ノボラックエポキシ樹脂、クレゾールノボラックエポキシ樹脂等のノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、スチルベン型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、アルキル変性トリフェノールメタン型エポキシ樹脂、トリアジン核含有エポキシ樹脂、ジシクロペンタジエン変性フェノール型エポキシ樹脂等のエポキシ樹脂や、2,2-ビス(4-グリシジルオキシフェニル)プロパンなどのエポキシ基を有する化合物が挙げられる。また、ユリア(尿素)樹脂;メラミン樹脂等のトリアジン環を有する樹脂;不飽和ポリエステル樹脂;ビスマレイミド樹脂;ポリウレタン樹脂;ジアリルフタレート樹脂;シリコーン樹脂;ベンゾオキサジン環を有する樹脂;シアネートエステル樹脂等やそれらの樹脂の原料化合物が挙げられ、これらのうちの1種または2種以上の混合物を用いることができる。 2) Cured product of thermosetting compound The thermosetting compound of the present invention is not particularly limited as long as it is a compound having a functional group capable of thermosetting, and it may be a thermosetting resin or a thermosetting low molecular compound. Good.
Examples of the thermosetting resin include phenolic novolac resins, cresol novolac resins, novolac type phenol resins such as bisphenol A novolac resins, phenol resins such as resol type phenol resins; bisphenol types such as bisphenol A epoxy resins and bisphenol F epoxy resins. Epoxy resin, novolac epoxy resin, cresol novolac epoxy resin, etc. novolac epoxy resin, biphenyl type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, alkyl-modified triphenolmethane type epoxy resin, triazine nucleus-containing epoxy resin, Epoxy resins such as dicyclopentadiene-modified phenolic epoxy resins, and epoxies such as 2,2-bis (4-glycidyloxyphenyl) propane Compounds having the like. In addition, urea (urea) resin; resin having triazine ring such as melamine resin; unsaturated polyester resin; bismaleimide resin; polyurethane resin; diallyl phthalate resin; silicone resin; resin having benzoxazine ring; The raw material compound of these resin is mentioned, Among these, the 1 type (s) or 2 or more types of mixture can be used.
また、本発明の有機無機複合薄膜中、前記有機ケイ素化合物の縮合物と熱硬化性化合物の硬化物の配合比は、好ましくは、質量比で50:50~5:95、より好ましくは25:75~5:95である。 The amount of the cured product of the thermosetting compound in the organic-inorganic composite thin film of the present invention is the solid content of the whole organic-inorganic composite thin film (condensate of organosilicon compound, cured product of thermosetting compound, and blended as necessary. 2 to 98% by mass, preferably 50 to 95% by mass, more preferably 70 to 95% by mass, based on the total mass of other components to be produced.
In the organic-inorganic composite thin film of the present invention, the blending ratio of the condensate of the organosilicon compound and the cured product of the thermosetting compound is preferably 50:50 to 5:95, more preferably 25: 75-5: 95.
本発明においては、必要ならば、熱重合開始剤を添加することができる。
熱重合開始剤は、加熱によりラジカルを発生する化合物のことを指し、例えば、有機過酸化物、アゾ化合物及びレドックス開始剤等が挙げられる。
上記有機過酸化物としては、ベンゾイルパーオキサイド、クメンヒドロパーオキサイド、ジ-t-ブチルパーオキサイド、t-ブチルハイドロパーオキサイド及びジクミルパーオキサイド、アセチルパーオキサイド、ラウロイルパーオキサイド、シクロヘキサノンペルオキシド、ジベンゾイルペルオキシド、tert-ブチルペルマレエートのようなペルオキシド;1,6ビス(t-ブチルパーオキシカルボニロキシ)ヘキサン等のパーオキシカーボネート;パーオキシケタール;過硫酸カリウム、過硫酸ナトリウム、過硫酸アンモニウム等の過硫酸塩等が挙げられる。 3) Thermal polymerization initiator or curing agent In the present invention, if necessary, a thermal polymerization initiator can be added.
The thermal polymerization initiator refers to a compound that generates radicals upon heating, and examples thereof include organic peroxides, azo compounds, and redox initiators.
Examples of the organic peroxide include benzoyl peroxide, cumene hydroperoxide, di-t-butyl peroxide, t-butyl hydroperoxide and dicumyl peroxide, acetyl peroxide, lauroyl peroxide, cyclohexanone peroxide, dibenzoyl Peroxides, peroxides such as tert-butylpermaleate; peroxycarbonates such as 1,6bis (t-butylperoxycarbonyloxy) hexane; peroxyketals; potassium persulfate, sodium persulfate, ammonium persulfate, etc. Examples include persulfates.
硬化剤としては、アミン系、イミダゾール系、アミド系、エステル系、アルコール系、チオール系、エーテル系、チオエーテル系、フェノール系、リン系、尿素系、チオ尿素系、酸無水物系、ルイス酸系、オニウム塩系、活性珪素化合物-アルミニウム錯体系等が上げられるが、特に制限はなく、従来のエポキシ樹脂等の硬化剤、硬化促進剤として慣用とされているもの中から任意のものを選択して用いることができる。 In the present invention, a curing agent or a curing accelerator can be added if necessary when using an epoxy resin or the like.
Curing agents include amine, imidazole, amide, ester, alcohol, thiol, ether, thioether, phenol, phosphorus, urea, thiourea, acid anhydride, and Lewis acid. Onium salt type, active silicon compound-aluminum complex type, etc., but there is no particular limitation, and any one of those conventionally used as curing agents and curing accelerators such as conventional epoxy resins can be selected. Can be used.
また、尿素系、チオ尿素系、並びにルイス酸系の硬化剤として、例えばブチル化尿素、ブチル化メラミン、ブチル化チオ尿素、三フッ化ホウ素などが挙げられる。 Examples of the amide compounds include polyamides obtained by condensation of dimer acids and polyamines, and examples of the ester compounds include active carbonyl compounds such as aryl and thioaryl esters of carboxylic acids. Further, phenol, alcohol-based, thiol-based, ether-based and thioether-based compounds include phenol novolak, cresol novolak, polyol, polymercaptan, polysulfide, 2- (dimethylaminomethylphenol), 2,4,6-tris ( And dimethylaminomethyl) phenol and 2,4-6-tris (dimethylaminomethyl) phenol tri-2-ethylhexyl hydrochloride.
Examples of urea-based, thiourea-based, and Lewis acid-based curing agents include butylated urea, butylated melamine, butylated thiourea, and boron trifluoride.
本発明において用いられる硬化剤の配合量は、重合体の固形分に対して、0.01~20質量%配合することが好ましく、0.1~10質量%が、さらに好ましい。 Curing agents for onium salts and active silicon compounds-aluminum complexes include aryldiazonium salts, diaryliodonium salts, triarylsulfonium salts, triphenylsilanol-aluminum complexes, triphenylmethoxysilane-aluminum complexes, silyl peroxide-aluminum complexes. And triphenylsilanol-tris (salicylaldehyde) aluminum complex.
The content of the curing agent used in the present invention is preferably 0.01 to 20% by mass, more preferably 0.1 to 10% by mass, based on the solid content of the polymer.
本発明の金属化合物は、屈折率調整、第2層との親和性強化、形状維持、硬度調整のために含有させるものであり、チタン、ジルコニウム、アルミニウム、スズ、鉛、タンタル又はケイ素からなる元素の少なくとも1種を含む金属化合物が好ましく、さらに、チタン、ジルコニウム、アルミニウム、スズが好ましく、特にチタンが好ましい。これらは1種単独で用いてもよいし、2種以上用いることもできる。
金属化合物としては、金属キレート化合物、有機酸金属塩、2以上の水酸基若しくは加水分解性基を有する金属化合物、それらの加水分解物、及びそれらの縮合物からなる群より選ばれる少なくとも1種の化合物等が挙げられる。金属化合物は1種単独、又は、2種以上の組合せで使用することができる。特に、金属キレート化合物、有機酸金属塩、2以上の水酸基若しくは加水分解性基を有する金属化合物の加水分解物及び/又は縮合物であることが好ましく、特に、金属キレート化合物の加水分解物及び/又は縮合物が好ましい。
薄膜中の金属化合物としては、原料である化合物のまま存在するものや、前記化合物がさらに縮合されたもののほか、上述した有機ケイ素化合物等と化学結合したものも包含する。 4) Metal compound The metal compound of the present invention is contained for adjusting the refractive index, strengthening the affinity with the second layer, maintaining the shape, and adjusting the hardness. Titanium, zirconium, aluminum, tin, lead, tantalum or A metal compound containing at least one element composed of silicon is preferable, titanium, zirconium, aluminum, and tin are more preferable, and titanium is particularly preferable. These may be used alone or in combination of two or more.
The metal compound is at least one compound selected from the group consisting of metal chelate compounds, organic acid metal salts, metal compounds having two or more hydroxyl groups or hydrolyzable groups, hydrolysates thereof, and condensates thereof. Etc. A metal compound can be used individually by 1 type or in combination of 2 or more types. In particular, it is preferably a metal chelate compound, an organic acid metal salt, a hydrolyzate and / or condensate of a metal compound having two or more hydroxyl groups or hydrolyzable groups. Or a condensate is preferable.
Examples of the metal compound in the thin film include those existing as a raw material compound, those obtained by further condensing the compound, and those chemically bonded to the above-described organosilicon compound.
尚、以上の金属化合物はシラノール縮合触媒としての機能も有する。 In addition, the hydrolyzate and / or condensate of the organic acid metal salt is preferably hydrolyzed using 5 to 100 mol of water with respect to 1 mol of the metal organic acid salt. More preferably, it is hydrolyzed with molar water.
The above metal compound also has a function as a silanol condensation catalyst.
4官能シランとしては、例えば、テトラアミノシラン、テトラクロロシラン、テトラアセトキシシラン、テトラメトキシシラン、テトラエトキシシラン、テトラブトキシシラン、テトラベンジロキシシラン、テトラフェノキシシラン、テトラ(メタ)アクリロキシシラン、テトラキス[2-(メタ)アクリロキシエトキシ]シラン、テトラキス(2-ビニロキシエトキシ)シラン、テトラグリシジロキシシラン、テトラキス(2-ビニロキシブトキシ)シラン、テトラキス(3-メチル-3-オキセタンメトキシ)シランを挙げることができる。また、コロイド状シリカとしては、水分散コロイド状シリカ、メタノールもしくはイソプロピルアルコールなどの有機溶媒分散コロイド状シリカを挙げることができる。
金属化合物の配合割合は、有機無機複合薄膜全体の固形分に対して、0~50質量%である。 Furthermore, examples of the metal compound for improving the hardness include tetrafunctional silane and colloidal silica.
Examples of the tetrafunctional silane include tetraaminosilane, tetrachlorosilane, tetraacetoxysilane, tetramethoxysilane, tetraethoxysilane, tetrabutoxysilane, tetrabenzyloxysilane, tetraphenoxysilane, tetra (meth) acryloxysilane, tetrakis [2 -(Meth) acryloxyethoxy] silane, tetrakis (2-vinyloxyethoxy) silane, tetraglycidyloxysilane, tetrakis (2-vinyloxybutoxy) silane, tetrakis (3-methyl-3-oxetanemethoxy) silane be able to. Examples of the colloidal silica include water-dispersed colloidal silica and organic solvent-dispersed colloidal silica such as methanol or isopropyl alcohol.
The compounding ratio of the metal compound is 0 to 50% by mass with respect to the solid content of the whole organic-inorganic composite thin film.
また、第1層の着色防止、厚膜化、下地への紫外線透過防止、防蝕性の付与、耐熱性などの諸特性を発現させるために、別途、充填材を添加・分散させることも可能である。この充填材としては、例えば有機顔料、無機顔料などの非水溶性の顔料または顔料以外の粒子状、繊維状もしくは鱗片状の金属および合金ならびにこれらの酸化物、水酸化物、炭化物、窒化物、硫化物などが挙げられる。この充填材の具体例としては、粒子状、繊維状もしくは鱗片状の鉄、銅、アルミニウム、ニッケル、銀、亜鉛、フェライト、カーボンブラック、ステンレス鋼、二酸化ケイ素、酸化チタン、酸化アルミニウム、酸化クロム、酸化マンガン、酸化鉄、酸化ジルコニウム、酸化コバルト、合成ムライト、水酸化アルミニウム、水酸化鉄、炭化ケイ素、窒化ケイ素、窒化ホウ素、クレー、ケイソウ土、消石灰、石膏、タルク、炭酸バリウム、炭酸カルシウム、炭酸マグネシウム、硫酸バリウム、ベントナイト、雲母、亜鉛緑、クロム緑、コバルト緑、ビリジアン、ギネー緑、コバルトクロム緑、シェーレ緑、緑土、マンガン緑、ピグメントグリーン、群青、紺青、岩群青、コバルト青、セルリアンブルー、ホウ酸銅、モリブデン青、硫化銅、コバルト紫、マルス紫、マンガン紫、ピグメントバイオレット、亜酸化鉛、鉛酸カルシウム、ジンクエロー、硫化鉛、クロム黄、黄土、カドミウム黄、ストロンチウム黄、チタン黄、リサージ、ピグメントエロー、亜酸化銅、カドミウム赤、セレン赤、クロムバーミリオン、ベンガラ、亜鉛白、アンチモン白、塩基性硫酸鉛、チタン白、リトポン、ケイ酸鉛、酸化ジルコン、タングステン白、鉛亜鉛華、バンチソン白、フタル酸鉛、マンガン白、硫酸鉛、黒鉛、ボーンブラック、ダイヤモンドブラック、サーマトミック黒、植物性黒、チタン酸カリウムウィスカー、二硫化モリブデンなどを挙げることができる。 5) Other additives In addition, in order to develop various properties such as coloring prevention of the first layer, thickening, prevention of UV transmission to the base, provision of corrosion resistance, heat resistance, etc. It is also possible to disperse. Examples of the filler include water-insoluble pigments such as organic pigments and inorganic pigments, and particulate and fibrous or scale-like metals and alloys other than pigments, and oxides, hydroxides, carbides, nitrides thereof, and the like. Examples thereof include sulfides. Specific examples of this filler include particulate, fibrous or scale-like iron, copper, aluminum, nickel, silver, zinc, ferrite, carbon black, stainless steel, silicon dioxide, titanium oxide, aluminum oxide, chromium oxide, Manganese oxide, iron oxide, zirconium oxide, cobalt oxide, synthetic mullite, aluminum hydroxide, iron hydroxide, silicon carbide, silicon nitride, boron nitride, clay, diatomaceous earth, slaked lime, gypsum, talc, barium carbonate, calcium carbonate, carbonic acid Magnesium, Barium sulfate, Bentonite, Mica, Zinc green, Chrome green, Cobalt green, Viridian, Guinea green, Cobalt chromium green, Shale green, Green earth, Manganese green, Pigment green, Ultramarine, Bituminous, Rock ultramarine, Cobalt blue, Cerulean Blue, copper borate, molybdenum blue, copper sulfide, koval Purple, Mars Purple, Manganese Purple, Pigment Violet, Lead Oxide, Calcium Leadate, Zinc Yellow, Lead Sulfide, Chrome Yellow, Ocher, Cadmium Yellow, Strontium Yellow, Titanium Yellow, Resurge, Pigment Yellow, Cuprous Oxide, Cadmium Red, Selenium red, chrome vermilion, bengara, zinc white, antimony white, basic lead sulfate, titanium white, lithopone, lead silicate, zircon oxide, tungsten white, lead zinc white, bunchison white, lead phthalate, manganese white, sulfuric acid Examples thereof include lead, graphite, bone black, diamond black, thermostatic black, vegetable black, potassium titanate whisker, and molybdenum disulfide.
6-1)有機無機複合薄膜形成用溶液の調製
本発明における有機無機複合薄膜の形成用溶液は、有機ケイ素化合物、熱硬化性化合物のほか、適宜、熱重合開始剤、金属化合物、シラノール縮合触媒、水及び/又は溶媒等を混合して調製される。
なお、本発明の金属化合物としてシラノール触媒としても機能する金属化合物を使用する場合は、シラノール触媒を使用する必要はない。 6) Manufacturing method of organic / inorganic composite thin film 6-1) Preparation of organic / inorganic composite thin film forming solution The organic / inorganic composite thin film forming solution in the present invention may be appropriately polymerized in addition to the organic silicon compound and the thermosetting compound. It is prepared by mixing an initiator, a metal compound, a silanol condensation catalyst, water and / or a solvent.
In addition, when using the metal compound which functions also as a silanol catalyst as a metal compound of this invention, it is not necessary to use a silanol catalyst.
用いる溶媒としては、特に制限されるものではなく、例えば、ベンゼン、トルエン、キシレン等の芳香族炭化水素類;ヘキサン、オクタン等の脂肪族炭化水素類;シクロヘキサン、シクロペンタン等の脂環族炭化水素類;アセトン、メチルエチルケトン、シクロヘキサノン等のケトン類;テトラヒドロフラン、ジオキサン等のエーテル類;酢酸エチル、酢酸ブチル等のエステル類;N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド等のアミド類;ジメチルスルホキシド等のスルホキシド類;メタノール、エタノール等のアルコール類;エチレングリコールモノメチルエーテル、エチレングリコールモノメチルエーテルアセテート等の多価アルコール誘導体類等が挙げられる。これらの溶媒は1種単独で、あるいは2種以上を組み合わせて用いることができる。 The composition for forming an organic-inorganic composite thin film in the present invention preferably contains water and / or a solvent in addition to the above components.
The solvent to be used is not particularly limited. For example, aromatic hydrocarbons such as benzene, toluene and xylene; aliphatic hydrocarbons such as hexane and octane; alicyclic hydrocarbons such as cyclohexane and cyclopentane. Ketones such as acetone, methyl ethyl ketone and cyclohexanone; ethers such as tetrahydrofuran and dioxane; esters such as ethyl acetate and butyl acetate; amides such as N, N-dimethylformamide and N, N-dimethylacetamide; dimethyl sulfoxide And the like; alcohols such as methanol and ethanol; and polyhydric alcohol derivatives such as ethylene glycol monomethyl ether and ethylene glycol monomethyl ether acetate. These solvents can be used alone or in combination of two or more.
酸としては、有機酸、鉱酸が挙げられ、具体的には例えば、有機酸としては酢酸、ギ酸、シュウ酸、炭酸、フタル酸、トリフルオロ酢酸、p-トルエンスルホン酸、メタンスルホン酸等、鉱酸としては、塩酸、硝酸、ホウ酸、ホウフッ化水素酸等が挙げられる。
ここで、光照射によって酸を発生する光酸発生剤、具体的には、ジフェニルヨードニウムヘキサフルオロホスフェート、トリフェニルホスホニウムヘキサフルオロホスフェート等も包含される。
塩基としては、テトラメチルグアニジン、テトラメチルグアニジルプロピルトリメトキシシラン等の強塩基類;有機アミン類、有機アミンのカルボン酸中和塩、4級アンモニウム塩等が挙げられる。 Examples of the silanol condensation catalyst include acids and bases in addition to the metal compounds.
Examples of the acid include organic acids and mineral acids. Specific examples of the organic acid include acetic acid, formic acid, oxalic acid, carbonic acid, phthalic acid, trifluoroacetic acid, p-toluenesulfonic acid, methanesulfonic acid, and the like. Examples of the mineral acid include hydrochloric acid, nitric acid, boric acid, borohydrofluoric acid, and the like.
Here, a photoacid generator that generates an acid by light irradiation, specifically, diphenyliodonium hexafluorophosphate, triphenylphosphonium hexafluorophosphate, and the like are also included.
Examples of the base include strong bases such as tetramethylguanidine and tetramethylguanidylpropyltrimethoxysilane; organic amines, carboxylic acid neutralized salts of organic amines, quaternary ammonium salts and the like.
有機無機複合薄膜形成用溶液中の固形分(有機ケイ素化合物および/又はその縮合物、熱硬化性化合物等)の全質量に対する、有機ケイ素化合物及び/又はその縮合物、熱硬化性化合物、金属化合物、金属酸化物粒子、熱重合開始剤等の配合量は、上記有機無機複合膜中の含有量と同様である。 The solid content (organic silicon compound and / or condensate thereof, raw material of organic polymer compound, etc.) in the solution for forming an organic-inorganic composite thin film in the present invention is 1 to 98% by mass, 10 to 60% by mass. It is preferably 15 to 45% by mass.
Organosilicon compound and / or its condensate, thermosetting compound, metal compound with respect to the total mass of the solid content (organosilicon compound and / or its condensate, thermosetting compound, etc.) in the organic / inorganic composite thin film forming solution The compounding amounts of the metal oxide particles, the thermal polymerization initiator and the like are the same as the content in the organic-inorganic composite film.
本発明の有機無機複合薄膜は、(A)上述した有機無機複合薄膜形成用溶液を基体上に塗布し、乾燥及び/又は加熱する工程、(B)プラズマ処理もしくはUVオゾン処理を施す工程を経ることにより製造できる。 6-2) Method for producing organic-inorganic composite thin film The organic-inorganic composite thin film of the present invention comprises (A) a step of applying the above-mentioned organic-inorganic composite thin film-forming solution onto a substrate, drying and / or heating, (B) It can be manufactured through a step of performing plasma treatment or UV ozone treatment.
ここで、「炭素原子の濃度」とは、(全金属原子+酸素原子+炭素原子)を100%としたときの炭素原子のモル濃度を意味する。他の元素の濃度も同様である。
また、「有機ケイ素化合物の縮合物が濃縮した層」をESCA分析による炭素原子の濃度で規定しているが、濃縮した層では、ケイ素濃度においても濃度が高くなっている。 The organic-inorganic composite thin film of the present invention is a film in which the concentration of carbon atoms at a depth of 10 nm from the surface measured by ESCA analysis is 20% or less less than the concentration of carbon atoms at a depth of 100 nm from the surface. preferable.
Here, the “carbon atom concentration” means the molar concentration of carbon atoms when (total metal atom + oxygen atom + carbon atom) is 100%. The same applies to the concentrations of other elements.
In addition, the “layer in which the condensate of the organosilicon compound is concentrated” is defined by the concentration of carbon atoms by ESCA analysis, but the concentration in the concentrated layer is also high in the silicon concentration.
なお、本明細書において、薄膜中の炭素含有量を規定する時に用いている膜厚の値は、ESCA分析においてスパッタエッチングした時に算出される値であるが、現実の膜厚の値とは必ずしも一致しない。その理由は、スパッタエッチングによりエッチングされる膜厚は、膜の材質に依存するためである。そのため、現実の膜厚値は、各膜材料に対するエッチング速度を換算することで得られる。
本明細書中のESCA分析では、熱酸化SiO2膜を標準試料としたSiO2換算膜厚を用いた。標準試料はシリコンウェハー上に形成された熱酸化SiO2膜である。エリプソメーターによりあらかじめ膜厚を測定してある標準試料を、スパッタエッチングしながらESCA分析することで、エッチング速度を算出した。 In the present invention, the lower the carbon concentration, the higher the silicon concentration.
Note that in this specification, the value of the film thickness used when defining the carbon content in the thin film is a value calculated when sputter etching is performed in ESCA analysis, but the actual film thickness value is not necessarily the same. It does not match. This is because the film thickness etched by sputter etching depends on the material of the film. Therefore, the actual film thickness value can be obtained by converting the etching rate for each film material.
In the ESCA analysis in this specification, a SiO 2 equivalent film thickness using a thermally oxidized SiO 2 film as a standard sample was used. The standard sample is a thermally oxidized SiO 2 film formed on a silicon wafer. An etching rate was calculated by ESCA analysis of a standard sample whose thickness was previously measured by an ellipsometer while performing sputter etching.
より具体的には、電極対の少なくとも一方を誘電体で被覆した平行平板電極間に、高周波数の高電圧を印加することでプラズマを発生させ、該電極間に基材層を保持する方法、あるいは該電極間で該基材層を移動させる方法が挙げられる。プラズマ処理には、大気圧プラズマ処理と真空プラズマ処理があるが、大気圧プラズマ処理では真空プラズマ処理に比して活性種の密度が高いために、高速、高効率で電極表面の処理ができ、また処理時に真空にする必要がないために、少ない工程数で処理ができるといった利点がある。 In the present invention, the plasma treatment is a corona discharge treatment in a nitrogen gas atmosphere or a glow plasma treatment in a rare gas atmosphere such as helium or argon.
More specifically, a method of generating plasma by applying a high voltage at a high frequency between parallel plate electrodes in which at least one of the electrode pairs is coated with a dielectric, and holding a base material layer between the electrodes, Or the method of moving this base material layer between these electrodes is mentioned. Plasma processing includes atmospheric pressure plasma processing and vacuum plasma processing, but since the density of active species is higher in atmospheric pressure plasma processing than in vacuum plasma processing, electrode surfaces can be processed at high speed and high efficiency. In addition, since there is no need to use a vacuum during processing, there is an advantage that processing can be performed with a small number of steps.
そのため、上記(B)工程におけるプラズマ処理及びUVオゾン処理を施しても、膜表面のシラン化合物のみが反応し、膜内部の有機高分子化合物はほぼ影響を受けない。
プラズマ処理及びUVオゾン処理に代えて、アルカリ水溶液処理、過酸化水素水処理、メタケイ酸ナトリウム水溶液処理を施してもよい。 In the organic-inorganic composite thin film according to the present invention, the carbon atom content in the film surface portion is compared with the carbon atom content in the inside of the film (near the joint with the base material) through the heating step (A). Therefore, a concentrated layer of silane compounds is formed on the film surface.
Therefore, even if the plasma treatment and UV ozone treatment in the step (B) are performed, only the silane compound on the film surface reacts and the organic polymer compound in the film is hardly affected.
Instead of plasma treatment and UV ozone treatment, alkaline aqueous solution treatment, hydrogen peroxide solution treatment, and sodium metasilicate aqueous solution treatment may be performed.
金属界面活性剤の加水分解縮合物である自己組織化膜を含有する層
また、本発明においては、上記有機無機複合薄膜の外側に、さらに金属界面活性剤の加水分解縮合物である自己組織化膜を含有する層を設ける。自己組織化膜としては、好ましくは単分子膜である。
ここで自己組織化膜とは、外部からの強制力なしに秩序だった構造を形成してなる膜を意味する。自己組織化膜を形成する分子は、自己組織化膜形成用溶液の調製に用いた金属系界面活性剤から得られたものである。金属系界面活性剤の分子は、自己組織化膜形成用溶液中で、溶媒により溶媒和されて単独に存在するのではなく、幾つかが集まって集合体を形成している。 (3) Second layer
A layer containing a self-assembled film that is a hydrolyzed condensate of a metal surfactant Further, in the present invention, on the outside of the organic-inorganic composite thin film, a self-assembled that is a hydrolyzed condensate of a metal surfactant. A layer containing a film is provided. The self-assembled film is preferably a monomolecular film.
Here, the self-assembled film means a film formed with an ordered structure without external forcing. The molecule forming the self-assembled film is obtained from the metal surfactant used for preparing the solution for forming the self-assembled film. The molecules of the metal-based surfactant are not solvated by the solvent alone in the self-assembled film forming solution, but some of them gather together to form an aggregate.
金属界面活性剤の加水分解縮合物を含有する層は、たとえば、例えば、WO03/076064、WO2004/091810、WO2006/009292、WO2009/104424、WO2008/059840パンフレット等に記載されているように、「少なくとも1以上の加水分解性基を有する金属系界面活性剤」、「該金属系界面活性剤と相互作用し得る化合物」及び水を含む有機溶媒溶液に、前記有機無機複合薄膜を接触させることにより作製することができる。また、「少なくとも1以上の加水分解性基を有する金属系界面活性剤」、「該金属系界面活性剤と相互作用し得る化合物」及び水を含む有機溶媒溶液は、市販のもの、例えば、日本曹達(株)製SAMLAY(登録商標)を使用することができる。 Below, the preparation methods of the layer containing the hydrolysis-condensation product of a metal surfactant are demonstrated.
The layer containing the hydrolytic condensate of the metal surfactant is, for example, “at least as described in WO03 / 076064, WO2004 / 091810, WO2006 / 009292, WO2009 / 104424, WO2008 / 059840, etc. Produced by bringing the organic-inorganic composite thin film into contact with an organic solvent solution containing “a metal-based surfactant having one or more hydrolyzable groups”, “a compound capable of interacting with the metal-based surfactant” and water. can do. An organic solvent solution containing “a metal surfactant having at least one hydrolyzable group”, “a compound capable of interacting with the metal surfactant” and water is commercially available, for example, Japan SAMLAY (registered trademark) manufactured by Soda Co., Ltd. can be used.
R1 mMX1 t-m (II)
〔式中、R1は、置換基を有していてもよい炭素数1~30の炭化水素基、置換基を有していてもよい炭素数1~30のハロゲン化炭化水素基、連結基を含む炭素数1~30の炭化水素基、又は連結基を含む炭素数1~30のハロゲン化炭化水素基を表し、Mは、ケイ素原子、ゲルマニウム原子、スズ原子、チタン原子、及びジルコニウム原子からなる群から選ばれる少なくとも1種の金属原子を表し、X1は、水酸基又は加水分解性基を表し、tはMの原子価を表す。mは、1から(t-1)のいずれかの正整数を表し、mが2以上の場合、R1は、互いに同一でも相異なっていてもよい。(t-m)が2以上の場合、X1は同一であっても、相異なっていてもよいが、X1のうち、少なくとも一個は加水分解性基である。〕で示される金属系界面活性剤が好ましい。
式(II)中、置換基を有していてもよい炭素数1~30の炭化水素基の炭化水素基としては、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基、イソブチル基、sec-ブチル基、t-ブチル基、n-ペンチル基、イソペンチル基、ネオペンチル基、t-ペンチル基、n-へキシル基、イソへキシル基、n-ヘプチル基、n-オクチル基、n-デシル基、n-オクタデシル基等のアルキル基;ビニル基、プロペニル基、ブテニル基、ペンテニル基、n-デシニル基、n-オクタデシニル基等のアルケニル基;フェニル基、1-ナフチル基、2-ナフチル基等のアリール基等が挙げられる。 Examples of the “metal surfactant having at least one hydrolyzable group” include formula (II)
R 1 m MX 1 tm (II)
[Wherein, R 1 represents a hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, a halogenated hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, or a linking group. Represents a hydrocarbon group having 1 to 30 carbon atoms or a halogenated hydrocarbon group having 1 to 30 carbon atoms including a linking group, and M represents a silicon atom, a germanium atom, a tin atom, a titanium atom, and a zirconium atom. Represents at least one metal atom selected from the group consisting of X 1 represents a hydroxyl group or a hydrolyzable group, and t represents the valence of M. m represents a positive integer from 1 to (t−1). When m is 2 or more, R 1 s may be the same or different from each other. When (tm) is 2 or more, X 1 may be the same or different, but at least one of X 1 is a hydrolyzable group. ] The metal-type surfactant shown by these is preferable.
In the formula (II), the hydrocarbon group of the hydrocarbon group having 1 to 30 carbon atoms which may have a substituent is a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, Isobutyl group, sec-butyl group, t-butyl group, n-pentyl group, isopentyl group, neopentyl group, t-pentyl group, n-hexyl group, isohexyl group, n-heptyl group, n-octyl group, alkyl groups such as n-decyl group and n-octadecyl group; alkenyl groups such as vinyl group, propenyl group, butenyl group, pentenyl group, n-decynyl group and n-octadecynyl group; phenyl group, 1-naphthyl group, 2- An aryl group such as a naphthyl group is exemplified.
前記連結基は、炭化水素基若しくはハロゲン化炭化水素基の炭素-炭素結合間、又は炭化水素基の炭素と後述する金属原子Mとの間に存在するのが好ましい。
連結基の具体例としては、-O-、-S-、-SO2-、-CO-、-C(=O)O-又は-C(=O)NR51-(式中、R51は、水素原子;メチル基、エチル基、n-プロピル基、イソプロピル基等のアルキル基;を表す。)等が挙げられる。
これらの中でも、撥水性、耐久性の観点から、炭素数1~30のアルキル基、炭素数1~30のフッ素化アルキル基、又は連結基を含むフッ素化アルキル基であるのがそれぞれ好ましい。 Specific examples of the hydrocarbon group of the hydrocarbon group containing a linking group and the halogenated hydrocarbon group of a halogenated hydrocarbon group containing a linking group include the hydrocarbon groups that may have the above-mentioned substituents. The thing similar to what was mentioned as a halogenated hydrocarbon group of the halogenated hydrocarbon group which may have a hydrogen group and a substituent is mentioned.
The linking group is preferably present between carbon-carbon bonds of a hydrocarbon group or a halogenated hydrocarbon group, or between carbon of the hydrocarbon group and a metal atom M described later.
Specific examples of the linking group include —O—, —S—, —SO 2 —, —CO—, —C (═O) O— or —C (═O) NR 51 — (wherein R 51 represents A hydrogen atom; an alkyl group such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group;
Among these, from the viewpoint of water repellency and durability, an alkyl group having 1 to 30 carbon atoms, a fluorinated alkyl group having 1 to 30 carbon atoms, or a fluorinated alkyl group containing a linking group is preferable.
炭素数1~6のアルコキシ基としては、メトキシ基、エトキシ基、n-プロポキシ基、イソプロポキシ基、n-ブトキシ基、sec-ブトキシ基、t-ブトキシ基、n-ペンチルオキシ基、n-へキシルオキシ基等が挙げられる。アシルオキシ基としては、アセトキシ基、プロピオニルオキシ基、n-プロピルカルボニルオキシ基、イソプロピルカルボニルオキシ基、n-ブチルカルボニルオキシ基等が挙げられる。これらの置換基としては、カルボキシル基、アミド基、イミド基、エステル基、水酸基等が挙げられる。これらの中でも、水酸基、炭素数1~4のアルコキシ基、アシルオキシ基、ハロゲン原子、又はイソシアネート基が好ましく、炭素数1~4のアルコキシ基又はアシルオキシ基がより好ましい。 X 1 represents a hydroxyl group or a hydrolyzable group. The hydrolyzable group is not particularly limited as long as it is a group that reacts with water and decomposes. For example, an optionally substituted alkoxy group having 1 to 6 carbon atoms; an optionally substituted acyloxy group; a halogen atom such as a fluorine atom, chlorine atom, bromine atom or iodine atom; an isocyanate group Cyano group; amino group; or amide group.
Examples of the alkoxy group having 1 to 6 carbon atoms include methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, sec-butoxy group, t-butoxy group, n-pentyloxy group, and n-to A xyloxy group etc. are mentioned. Examples of the acyloxy group include an acetoxy group, a propionyloxy group, an n-propylcarbonyloxy group, an isopropylcarbonyloxy group, and an n-butylcarbonyloxy group. Examples of these substituents include a carboxyl group, an amide group, an imide group, an ester group, and a hydroxyl group. Among these, a hydroxyl group, an alkoxy group having 1 to 4 carbon atoms, an acyloxy group, a halogen atom, or an isocyanate group is preferable, and an alkoxy group or acyloxy group having 1 to 4 carbon atoms is more preferable.
また、これらの化合物は1種単独で、あるいは2種以上を組み合わせて用いることができる。 CH 3 CH 2 O (CH 2 ) 15 Si (OH) 3 , CH 3 (CH 2 ) 2 Si (CH 3 ) 2 (CH 2 ) 15 Si (OH) 3 , CH 3 (CH 2 ) 6 Si (CH 3) 2 (CH 2) 9 Si (OH) 3, CH 3 COO (CH 2) 15 Si (OH) 3, CH 3 CH 2 O (CH 2) 15 Si (OH) 3, CH 3 (CH 2) 2 Si (CH 3 ) 2 (CH 2 ) 15 Si (OH) 3 , CH 3 (CH 2 ) 6 Si (CH 3 ) 2 (CH 2 ) 9 Si (OH) 3 , CH 3 COO (CH 2 ) 15 Si (OH) 3 , CH 3 (CH 2 ) 9 Si (NCO) 3 , CH 3 (CH 2 ) 10 Si (NCO) 3 , CH 3 (CH 2 ) 11 Si (NCO) 3 and the like.
Moreover, these compounds can be used individually by 1 type or in combination of 2 or more types.
金属アルコキシド類部分加水分解生成物としては、具体的には、有機溶媒中、酸、塩基及び分散安定化剤からなる群から選ばれる少なくとも1種の非存在下、凝集せずに安定に分散している性質を有する分散質を好ましく例示することができる。この場合、分散質とは、分散系中に分散している微細粒子のことをいい、具体的には、コロイド粒子等を例示することができる。ここで凝集せずに安定に分散している状態とは、有機溶媒中、酸、塩基及び/又は分散安定化剤の非存在下、加水分解生成物の分散質が、凝結して不均質に分離していない状態をいい、好ましくは透明で均質な状態をいう。また透明とは、可視光における透過率が高い状態をいい、具体的には、分散質の濃度を酸化物換算で0.5重量%とし、石英セルの光路長を1cmとし、対照試料を有機溶媒とし、光の波長を550nmとする条件で測定した分光透過率で表して、好ましくは80~100%の透過率を表す状態をいう。加水分解生成物の分散質の粒子径は特に限定されないが、可視光における高い透過率を得るためには、1~100nmの範囲であることが好ましく、1~50nmの範囲であることがより好ましく、1~10nmの範囲であることがさらに好ましい。
金属アルコキシド類の部分加水分解生成物の製造方法としては、有機溶媒中、酸、塩基、及び/又は分散安定化剤の非存在下、上記例示した金属アルコキシド類に対し0.5~2.0倍モル未満の水を用い、-100℃から有機溶媒還流温度範囲で加水分解する方法を好ましく例示することができる。 The metal alkoxide partial hydrolysis product is obtained before the metal alkoxide is completely hydrolyzed, and examples thereof include a metal oxide sol precursor or an oligomer present in the state of oligomer. Can do.
Specifically, the metal alkoxide partial hydrolysis product is stably dispersed without aggregation in an organic solvent in the absence of at least one selected from the group consisting of acids, bases and dispersion stabilizers. Preferred examples include dispersoids having the above properties. In this case, the dispersoid refers to fine particles dispersed in the dispersion system, and specific examples include colloidal particles. Here, the state of stable dispersion without agglomeration means that in the absence of acid, base and / or dispersion stabilizer in the organic solvent, the dispersoid of the hydrolysis product coagulates and becomes heterogeneous. The state which is not isolate | separated is said, Preferably the transparent and homogeneous state is said. Transparent means a state in which the transmittance in visible light is high. Specifically, the concentration of the dispersoid is 0.5% by weight in terms of oxide, the optical path length of the quartz cell is 1 cm, and the control sample is organic. This is a state in which the transmittance is preferably 80 to 100%, expressed as a spectral transmittance measured under the condition of using a solvent and a light wavelength of 550 nm. The particle size of the dispersoid of the hydrolysis product is not particularly limited, but is preferably in the range of 1 to 100 nm and more preferably in the range of 1 to 50 nm in order to obtain a high visible light transmittance. More preferably, it is in the range of 1 to 10 nm.
As a method for producing a partial hydrolysis product of a metal alkoxide, an organic solvent is used in the absence of an acid, a base, and / or a dispersion stabilizer in an amount of 0.5 to 2.0 with respect to the metal alkoxide exemplified above. A preferred example is a method of hydrolyzing in an organic solvent reflux temperature range from −100 ° C. using less than double moles of water.
キレート化剤又は配位化合物としては、酢酸、プロピオン酸、酪酸、吉草酸、ラウリン酸、ミリスチン酸、パルミチン酸、ステアリン酸等の飽和脂肪族カルボン酸類;シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸等の飽和脂肪族ジカルボン酸類;アクリル酸、メタクリル酸、クロトン酸、アレイン酸、マレイン酸等の不飽和カルボン酸類;安息香酸、トルイル酸、フタル酸等の芳香族カルボン酸類;クロロ酢酸、トリフルオロ酢酸等のハロゲノカルボン酸類;アセチルアセトン、ベンゾイルアセトン、ヘキサフルオロアセチルアセトン等のβ-ジケトン類;アセト酢酸メチル、アセト酢酸エチル等のβ-ケトエステル類;テトラヒドロフラン、フラン、フランカルボン酸、チオフェン、チオフェンカルボン酸、ピリジン、ニコチン酸、イソニコチン酸等の複素環化合物類;等が挙げられる。これらは1種単独で、あるいは2種以上を組み合わせて用いることができる。 The chelated or coordinated metal compound can be prepared by adding a chelating agent or a coordination compound capable of forming a complex with the metal of the metal compound to a solution of the metal compound. As a chelating agent or coordination compound, a metal hydroxide, metal alkoxide, or metal alkoxide is chelated or coordinated to the metal of the hydrolysis product obtained by treating with water to form a complex. If it can do, it will not specifically limit.
Chelating agents or coordination compounds include saturated aliphatic carboxylic acids such as acetic acid, propionic acid, butyric acid, valeric acid, lauric acid, myristic acid, palmitic acid, stearic acid; oxalic acid, malonic acid, succinic acid, glutaric acid Saturated aliphatic dicarboxylic acids such as adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid; unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, array acid, maleic acid; benzoic acid, toluic acid, Aromatic carboxylic acids such as phthalic acid; halogenocarboxylic acids such as chloroacetic acid and trifluoroacetic acid; β-diketones such as acetylacetone, benzoylacetone and hexafluoroacetylacetone; β-ketoesters such as methyl acetoacetate and ethyl acetoacetate; Tetrahydrofuran, furan, furancarboxylic acid, thi And heterocyclic compounds such as offene, thiophenecarboxylic acid, pyridine, nicotinic acid, and isonicotinic acid. These can be used alone or in combination of two or more.
具体的には、酢酸第一スズ、ジブチルスズジラウレート、ジブチルスズジオクテート、ジブチルスズジアセテート、ジオクチルスズジラウレート、ジオクチルスズジオクテート、ジオクチルスズジアセテート、ジオクタン酸第一スズ、ナフテン酸鉛、ナフテン酸コバルト、2-エチルヘキセン酸鉄、ジオクチルスズビスオクチリチオグリコール酸エステル塩、ジオクチルスズマレイン酸エステル塩、ジブチルスズマレイン酸塩ポリマー、ジメチルスズメルカプトプロピオン酸塩ポリマー、ジブチルスズビスアセチルアセテート、ジオクチルスズビスアセチルラウレート、チタンテトラエトキサイド、チタンテトラブトキサイド、チタンテトライソプロポキサイド、チタンビス(アセチルアセトニル)ジプロポキサイド等を例示することができる。 Examples of other silanol condensation catalysts include carboxylic acid metal salts, carboxylic acid ester metal salts, carboxylic acid metal salt polymers, carboxylic acid metal salt chelates, titanic acid esters and titanic acid ester chelates, and acid catalysts.
Specifically, stannous acetate, dibutyltin dilaurate, dibutyltin dioctate, dibutyltin diacetate, dioctyltin dilaurate, dioctyltin dioctate, dioctyltin diacetate, stannous dioctanoate, lead naphthenate, cobalt naphthenate , Iron 2-ethylhexenoate, dioctyltin bisoctylthioglycolate, dioctyltin maleate, dibutyltin maleate polymer, dimethyltin mercaptopropionate polymer, dibutyltin bisacetylacetate, dioctyltin bisacetyllaurate , Titanium tetraethoxide, titanium tetrabutoxide, titanium tetraisopropoxide, titanium bis (acetylacetonyl) dipropoxide, etc. .
[実施例1]
1-1.ポリシロキサン溶液[A-1]の調製
ジイソプロポキシビスアセチルアセトナートチタン15.0gに、有機ケイ素化合物であるビニルトリメトキシシラン28.93gと3-メタクリロキシプロピルトリメトキシシラン20.78gを加えて、約1分程度撹拌した。次に、[A-1]中の固形分量が30wt%になる様にMEKを36.71g加えた後、[A-1]中の成分(Ti+Si)molに対して1.5倍molの純水8.38gを添加した。この溶液を室温下で2時間撹拌し加水分解を行った。反応終了後、反応液の液温が室温程度になるまで放置し、固形分量が30wt%のポリシロキサン溶液[A-1]109.80gを得た。
※ビニルトリメトキシシラン(信越化学工業株式会社製 KBM-1003)
※3-メタクリロキシプロピルトリメトキシシラン(信越化学工業株式会社製KBM-503)
※ジイソプロポキシビスアセチルアセトナートチタン(日本曹達株式会社T-50、TiO2換算固形分量:16.5wt%)
※メチルエチルケトン(MEK)和光純薬工業(株) Examples of the present invention are shown below, but the technical scope of the present invention is not limited thereto.
[Example 1]
1-1. Preparation of polysiloxane solution [A-1] To 15.0 g of diisopropoxybisacetylacetonate titanium, 28.93 g of vinyltrimethoxysilane which is an organosilicon compound and 3-
* Vinyltrimethoxysilane (KBM-1003, Shin-Etsu Chemical Co., Ltd.)
* 3-Methacryloxypropyltrimethoxysilane (Shin-Etsu Chemical KBM-503)
* Diisopropoxybisacetylacetonate titanium (Nippon Soda Co., Ltd. T-50, TiO 2 equivalent solid content: 16.5 wt%)
* Methyl ethyl ketone (MEK) Wako Pure Chemical Industries, Ltd.
YD-128:ポリシロキサン溶液[A-1]=80wt%:20wt%(固形分比)となる様に、YD-128を15.50gとポリシロキサン溶液[A-1]12.92gをそれぞれ計量した。次に、有機無機複合薄膜形成用溶液[A-2]中の固形分濃度が、40wt%になる様にMEKを20.96g加えて混合した。この混合液にYD-128の固形分量に対して4wt%の2-エチル-4-メチルイミダゾール0.62gを添加し、室温下で1時間程度撹拌を行った。固形分濃度40wt%の有機無機複合薄膜形成用溶液[A-2]50.0gを得た。
※YD-128(新日鐵化学、BPA型エポキシ樹脂)
※2-エチル-4-メチルイミダゾール(四国化成工業(株))
※溶媒:メチルエチルケトン(MEK)、メチルイソブチルケトン(MIBK)、トルエン等(いずれも和光純薬工業(株)) 1-2. Preparation of organic / inorganic composite thin film forming solution [A-2]
YD-128: Weigh 15.50 g of YD-128 and 12.92 g of polysiloxane solution [A-1] so that the polysiloxane solution [A-1] = 80 wt%: 20 wt% (solid content ratio). did. Next, 20.96 g of MEK was added and mixed so that the solid content concentration in the organic-inorganic composite thin film forming solution [A-2] was 40 wt%. To this mixed solution, 0.62 g of 4-ethyl-4-methylimidazole of 4 wt% based on the solid content of YD-128 was added and stirred at room temperature for about 1 hour. 50.0 g of an organic-inorganic composite thin film forming solution [A-2] having a solid content concentration of 40 wt% was obtained.
* YD-128 (Nippon Steel Chemical, BPA type epoxy resin)
* 2-Ethyl-4-methylimidazole (Shikoku Chemicals Co., Ltd.)
* Solvent: Methyl ethyl ketone (MEK), Methyl isobutyl ketone (MIBK), Toluene, etc. (all Wako Pure Chemical Industries, Ltd.)
シリコンウェハ及び鉄材上に0.6μm以上となる様にDipコート成膜し、温風循環型乾燥機にて130~150℃で5~10分間加熱し、コーティング膜とした。 1-3. Dip coating is formed on the silicon wafer and iron material so that the thickness is 0.6 μm or more, and is heated at 130 to 150 ° C. for 5 to 10 minutes with a hot air circulating dryer to form a coating film. .
上記1-3で得られたコーティング膜に、UVオゾン洗浄装置(岩崎電機(株)製)を用いてUVオゾン洗浄を10分間行い、SAM形成溶液中に10分間浸漬させた。SAM形成溶液より引き上げ後、NSクリーン100で掛け洗いし、エアーブローによる液切りを行い、温風循環型乾燥機にて60℃で10分間加熱した。
※SAM形成溶液:SAMLAY(登録商標) 日本曹達(株) オクタデシルトリメトキシシラン含有 1-4. Formation of self-assembled monolayer (SAM) The coating film obtained in 1-3 above is subjected to UV ozone cleaning for 10 minutes using a UV ozone cleaning device (Iwasaki Electric Co., Ltd.), It was immersed in the SAM forming solution for 10 minutes. After lifting from the SAM forming solution, it was washed with
* SAM formation solution: SAMLAY (registered trademark) Nippon Soda Co., Ltd. Octadecyltrimethoxysilane
シリコンウェハ及び鉄材にUVオゾン洗浄装置(岩崎電機(株)製)を用いてUVオゾン洗浄を10分間行い、SAM形成溶液中に10分間浸漬させた。SAM形成溶液より引き上げ後、NSクリーン100で掛け洗いし、エアーブローによる液切りを行い、温風循環型乾燥機にて60℃で10分間加熱した。 [Comparative Example 1]
The silicon wafer and the iron material were subjected to UV ozone cleaning for 10 minutes using a UV ozone cleaning device (manufactured by Iwasaki Electric Co., Ltd.) and immersed in the SAM forming solution for 10 minutes. After lifting from the SAM forming solution, it was washed with
固形分が30wt%となるように、YD-128(新日鐵化学、BPA型エポキシ樹脂)をメチルエチルケトン(MEK)で希釈し、そこにYD-128の固形分量に対して4wt%の2-エチル-4-メチルイミダゾールを添加した溶液を用いて、鉄材上に0.6μm以上となる様にDipコート成膜し、温風循環型乾燥機にて130~150℃で5~10分間加熱し、コーティング膜を形成した。
得られたコーティング膜に、UVオゾン洗浄装置(岩崎電機(株)製)を用いてUVオゾン洗浄を10分間行い、SAM形成溶液(SAMLAY(登録商標) 日本曹達(株)製)中に10分間浸漬させた。SAM液より引き上げ後、NSクリーン100で掛け洗いし、エアーブローによる液切りを行い、温風循環型乾燥機にて60℃で10分間加熱した。 [Comparative Example 2]
YD-128 (Nippon Steel Chemical Co., Ltd., BPA type epoxy resin) is diluted with methyl ethyl ketone (MEK) so that the solid content is 30 wt%, and 4 wt% of 2-ethyl is added to the solid content of YD-128. Using a solution to which -4-methylimidazole was added, a Dip coat film was formed on the iron material so that the thickness became 0.6 μm or more, and heated at 130 to 150 ° C. for 5 to 10 minutes with a hot air circulation dryer, A coating film was formed.
The obtained coating film is subjected to UV ozone cleaning for 10 minutes using a UV ozone cleaning device (manufactured by Iwasaki Electric Co., Ltd.) and then placed in a SAM forming solution (SAMLAY (registered trademark) Nippon Soda Co., Ltd.) for 10 minutes. Soaked. After pulling up from the SAM liquid, it was washed with
実施例1及び比較例1,2について評価を行った。測定方法は以下のとおりである。結果を表1に示す。ただし、実施例1は鉄材上に積層したものを用いた。 [Evaluation test]
Example 1 and Comparative Examples 1 and 2 were evaluated. The measurement method is as follows. The results are shown in Table 1. However, Example 1 used what was laminated | stacked on the iron material.
各試料の表面にマイクロシリンジから水2μl、又は、テトラデカン(以下、「TD」と略す。)7μlを滴下した後、60秒後に、Drop Master700(協和界面科学社製)を用いて接触角を測定した。
2)転落角:
室温にて、成膜基板の傾斜角度を変えて、液滴の転落開始角度を測定した。液体としては水を用い、付与量は30μlとした。
3)ヒステリシス(拡張収縮法):
Drop Master700(協和界面科学社製)により、液滴としてブチルカルビトールアセテートを用いて、薄膜の動的接触角を測定して行った。動的接触角の測定は、液滴の前進角θaと後退角θrの差Δに基づいて行う方法であり、特開2007-322181号に詳細に記載されている。
4)平均動摩擦力
測定機器:TRIBOGEAR HHS2000 荷重変動型摩擦磨耗試験システム(HEIDON)
移動距離:15mm、移動速度:3.0mm/秒
圧子:SUS球(5mmφ)、垂直荷重:50g
測定回数:1基板につき5回
動摩擦力(Fk):掃引開始後、摩擦力が安定した時点から測定終了までの間の摩擦力の平均を算出
5)防錆試験
湿度90%以上の室温環境下で、2週間、1ヶ月間の保存試験を行った。実施例1及び、比較例2のサンプルに錆の発生は見られなかったことから、エポキシ樹脂としての防食機能が保持されていることが分かった。
6)耐溶剤試験
各塗膜にBCAを滴下して数秒後、NSクリーン100で洗い流した。SAM化がなされていない比較例2は、塗膜に溶解痕が見られた。これに対し実施例1には溶解痕は見られず、改良の優位性があることが分かった。
7)結晶性評価
(In-plane測定(ラフネスの大きい基材でのデータ))
[A-1]を用いて、エポキシ樹脂上に形成したSAMの緻密性を、X線回折測定により確認した。エポキシ上SAMの結晶性シグナルは、平滑なシリコンウェハ上に形成させたSAM[比較例1]と同じ位置に強度が現れ、エポキシ樹脂上に形成されたSAMが緻密に形成されていることが分かった。 1) Liquid repellency (static contact angle measurement):
After 2 μl of water or 7 μl of tetradecane (hereinafter abbreviated as “TD”) is dropped from the microsyringe onto the surface of each sample, the contact angle is measured using Drop Master 700 (manufactured by Kyowa Interface Science Co., Ltd.) 60 seconds later. did.
2) Falling angle:
At the room temperature, the tilt angle of the deposition substrate was changed, and the drop start angle of the droplet was measured. Water was used as the liquid, and the applied amount was 30 μl.
3) Hysteresis (expansion contraction method):
The dynamic contact angle of the thin film was measured using Drop Master 700 (manufactured by Kyowa Interface Science Co., Ltd.) using butyl carbitol acetate as droplets. The measurement of the dynamic contact angle is a method performed based on the difference Δ between the advancing angle θa and the receding angle θr of the droplet, and is described in detail in Japanese Patent Application Laid-Open No. 2007-322181.
4) Average dynamic friction force
Measuring equipment: TRIBOGEAR HHS2000 Load Fluctuation Friction Wear Test System (HEIDON)
Moving distance: 15 mm, moving speed: 3.0 mm / second Indenter: SUS ball (5 mmφ), vertical load: 50 g
Number of measurements: 5 rotational friction force per substrate (F k ): After the start of sweep, calculate the average friction force from the time when the friction force is stabilized until the end of measurement 5) Rust prevention test Room temperature environment with humidity of 90% or more A storage test was conducted for 2 weeks and 1 month. Since generation | occurrence | production of rust was not seen in the sample of Example 1 and the comparative example 2, it turned out that the anti-corrosion function as an epoxy resin is hold | maintained.
6) Solvent resistance test BCA was dropped onto each coating film, and after a few seconds, it was washed away with
7) Evaluation of crystallinity (In-plane measurement (data on a substrate with large roughness))
Using [A-1], the denseness of the SAM formed on the epoxy resin was confirmed by X-ray diffraction measurement. The crystallinity signal of the SAM on the epoxy shows strength at the same position as the SAM [Comparative Example 1] formed on the smooth silicon wafer, indicating that the SAM formed on the epoxy resin is densely formed. It was.
超微小硬さ試験システム ピコデンター(Fischer)を用い、最大荷重0.5mN、クリープ速度20sで測定した。結果を表2に示す。SAM形成後で約1.8倍程度の硬度上昇が見られた。 8) Hardness test Ultra-micro hardness test system Using a picodenter (Fischer), the maximum load was 0.5 mN, and the creep speed was 20 s. The results are shown in Table 2. A hardness increase of about 1.8 times was observed after SAM formation.
i)Na2SO4飽和水溶液を用いて、デシケーター内で高湿度下状態を保ち、実施例1のサンプルを約1ヶ月間保存し塗膜の状態を確認した。目視では異常は認められなかった。
ii)保存1ヶ月後のサンプルを用いてSAM形成を行い、SAM形成速度や撥液性への影響を調査した。結果を以下の表3に示す。結果から、保存1ヶ月後の塗膜でも保存前の塗膜状態とほぼ同様の撥液性(SAM化後)が得られたことから、塗膜時の保存安定性があることが分かった。 9) Coating film storage stability test i) Using a saturated aqueous solution of Na 2 SO 4 , a high humidity condition was maintained in a desiccator, and the sample of Example 1 was stored for about 1 month to check the state of the coating film. No abnormality was observed visually.
ii) SAM formation was performed using a sample after 1 month of storage, and the influence on the SAM formation speed and liquid repellency was investigated. The results are shown in Table 3 below. From the results, it was found that even a coating film after 1 month of storage had liquid repellency (after SAM formation) almost the same as the state of the coating film before storage, so that there was storage stability during coating.
2-1.ポリシロキサン溶液の調製[B-1]
140mLマヨネーズ瓶にメチルトリメトキシシラン(信越化学工業株式会社KBM-13)を17.00g仕込んだ。メチルトリメトキシシランに対してTiO2換算で5mol%となるようにジイソプロポキシビスアセチルアセトナートチタン(日本曹達株式会社、T-50、TiO2換算固形分量:16.5wt%)を3.02g添加した。MIBK19.91gを仕込み、15分間攪拌(攪拌速度100r.p.m.)。メチルトリメトキシシランに対して2倍molとなるように蒸留水4.50g仕込み、加水分解反応を行った(2時間、攪拌速度100r.p.m.)。この時液温は40℃まで上昇。反応終了後、反応液の液温が25℃になるまで30分間放置し、ポリシロキサン溶液[B-1]を得た。 [Example 2]
2-1. Preparation of polysiloxane solution [B-1]
In a 140 mL mayonnaise bottle, 17.00 g of methyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd. KBM-13) was charged. 3.02 g of diisopropoxybisacetylacetonate titanium (Nippon Soda Co., Ltd., T-50, TiO 2 equivalent solid content: 16.5 wt%) so as to be 5 mol% in terms of TiO 2 with respect to methyltrimethoxysilane Added. 19.91 g of MIBK was charged and stirred for 15 minutes (stirring speed: 100 rpm). Distilled water (4.50 g) was added so as to be 2 mol per mol of methyltrimethoxysilane, and a hydrolysis reaction was carried out (2 hours, stirring speed: 100 rpm). At this time, the liquid temperature rose to 40 ° C. After completion of the reaction, the reaction solution was left for 30 minutes until the temperature of the reaction solution reached 25 ° C. to obtain a polysiloxane solution [B-1].
バイロン600(東洋紡績株式会社、非晶性ポリエステル樹脂、SP値約10)/ポリシロキサン溶液[B-1]=90wt%/10wt%となるように、バイロン600を17.37gとポリシロキサン溶液[B-1]9.65gを混合した。この混合液にMIBK22.29gで希釈した。固形分40wt%の有機無機複合薄膜形成用溶液[B-2]を得た。 2-2. Preparation of organic / inorganic composite thin film forming solution [B-2]
Byron 600 (Toyobo Co., Ltd., amorphous polyester resin, SP value of about 10) / polysiloxane solution [B-1] = 90 wt% / 10 wt% 17.37 g of Byron 600 and polysiloxane solution [ B-1] 9.65 g was mixed. This mixture was diluted with 22.29 g of MIBK. An organic-inorganic composite thin film forming solution [B-2] having a solid content of 40 wt% was obtained.
ステンレス板上に5μmとなるようにバーコート成膜(Dip成膜でも可能)し、温風循環型乾燥機にて150℃で30分間加熱した。
得られたコーティング膜について、ESCAにより膜厚方向における各膜成分の分布を測定した。結果を図1に示す。 2-3. A bar coat film was formed on the thin film-formed stainless steel plate so as to have a thickness of 5 μm (Dip film formation is also possible), and the film was heated at 150 ° C. for 30 minutes with a hot air circulation dryer.
About the obtained coating film, distribution of each film | membrane component in a film thickness direction was measured by ESCA. The results are shown in FIG.
上記2-3で得られたコーティング膜に、UVオゾン洗浄装置(岩崎電機(株)製)を用いてUVオゾン洗浄を10分間行い、SAM形成溶液中に10分間浸漬させた。SAM形成溶液より引き上げ後、NSクリーン100で掛け洗いし、エアーブローによる液切りを行い、温風循環型乾燥機にて60℃で10分間加熱した。
※SAM形成溶液:SAMLAY(登録商標)日本曹達(株) 2-4. Formation of self-assembled monolayer (SAM) The coating film obtained in 2-3 above was subjected to UV ozone cleaning for 10 minutes using a UV ozone cleaning device (Iwasaki Electric Co., Ltd.), It was immersed in the SAM forming solution for 10 minutes. After lifting from the SAM forming solution, it was washed with
* SAM formation solution: SAMLAY (registered trademark) Nippon Soda Co., Ltd.
固形分が40wt%となるように、バイロン600(東洋紡績株式会社、非晶性ポリエステル樹脂)をMIBKで希釈した溶液を用いて、ステンレス板上に0.6μm以上となる様にDipコート成膜し、温風循環型乾燥機にて130~150℃で5~10分間加熱し、コーティング膜を形成した。
得られたコーティング膜に、UVオゾン洗浄装置(岩崎電機(株)製)を用いてUVオゾン洗浄を10分間行い、SAM形成溶液(SAMLAY(登録商標)日本曹達(株)製)中に10分間浸漬させた。SAM形成溶液より引き上げ後、NSクリーン100で掛け洗いし、エアーブローによる液切りを行い、温風循環型乾燥機にて60℃で10分間加熱した。 [Comparative Example 3]:
Using a solution obtained by diluting Byron 600 (Toyobo Co., Ltd., amorphous polyester resin) with MIBK so that the solid content is 40 wt%, a Dip coat film is formed on the stainless steel plate so that the thickness is 0.6 μm or more. Then, the coating film was formed by heating at 130 to 150 ° C. for 5 to 10 minutes with a hot air circulating dryer.
The obtained coating film is subjected to UV ozone cleaning for 10 minutes using a UV ozone cleaning device (manufactured by Iwasaki Electric Co., Ltd.) and then placed in a SAM forming solution (SAMLAY (registered trademark) Nippon Soda Co., Ltd.) for 10 minutes. Soaked. After lifting from the SAM forming solution, it was washed with
実施例2及び比較例3について評価を行った。測定方法は以下のとおりである。結果を表4に示す。 [Evaluation test]
Example 2 and Comparative Example 3 were evaluated. The measurement method is as follows. The results are shown in Table 4.
各試料の表面にマイクロシリンジから水2μl、又は、テトラデカン(以下、「TD」と略す。)7μlを滴下した後、60秒後に、Drop Master700(協和界面科学社製)を用いて接触角を測定した。 1) Liquid repellency (static contact angle measurement)
After 2 μl of water or 7 μl of tetradecane (hereinafter abbreviated as “TD”) is dropped from the microsyringe onto the surface of each sample, the contact angle is measured using Drop Master 700 (manufactured by Kyowa Interface Science Co., Ltd.) 60 seconds later. did.
3-1.ポリシロキサン溶液の調製[C-1]
140mLマヨネーズ瓶にメチルトリメトキシシラン(信越化学工業株式会社KBM-13)を17.00g仕込んだ。メチルトリメトキシシランに対してTiO2換算で5mol%となるようにジイソプロポキシビスアセチルアセトナートチタン(日本曹達株式会社、T-50、TiO2換算固形分量:16.5wt%)3.02gを添加した。次に、MIBK19.91gを仕込み、15分間攪拌した(攪拌速度:100r.p.m.)。
メチルトリメトキシシランに対して2倍molとなるように蒸留水4.50g仕込み、加水分解反応を行った(2時間、攪拌速度:100r.p.m.)。この時液温は40℃まで上昇した。反応終了後、反応液の液温が25℃になるまで30分間放置した。その後脱水留去により水、アルコールを除去し、ポリシロキサン溶液[C-1]を得た。 [Example 3]
3-1. Preparation of polysiloxane solution [C-1]
In a 140 mL mayonnaise bottle, 17.00 g of methyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd. KBM-13) was charged. Diisopropoxybisacetylacetonate titanium (Nihon Soda Co., Ltd., T-50, TiO 2 equivalent solid content: 16.5 wt%) 3.02 g so as to be 5 mol% in terms of TiO 2 with respect to methyltrimethoxysilane Added. Next, 19.91 g of MIBK was charged and stirred for 15 minutes (stirring speed: 100 rpm).
Distilled water (4.50 g) was added so as to be 2 mol per mol of methyltrimethoxysilane, and a hydrolysis reaction was carried out (2 hours, stirring speed: 100 rpm). At this time, the liquid temperature rose to 40 ° C. After completion of the reaction, the reaction solution was left for 30 minutes until the temperature of the reaction solution reached 25 ° C. Thereafter, water and alcohol were removed by dehydration to obtain a polysiloxane solution [C-1].
T-150(日本曹達株式会社、日曹チタボンド)+T-122(日本曹達株式会社、日曹チタボンド)/ポリシロキサン=90wt%/10wt%となるように、T150を16.73g、T-122を16.73gとポリシロキサン溶液[C-1]9.29gを混合撹拌した。それを、酢酸エチル5.90gで希釈した。固形分40wt%の有機無機複合薄膜形成用溶液[C-2]を得た。 3-2. Preparation of organic / inorganic composite thin film forming solution [C-2]
T-150 (Nippon Soda Co., Ltd., Nisso Chita Bond) + T-122 (Nippon Soda Co., Ltd., Nisso Tita Bond) / polysiloxane = 90 wt% / 10 wt% 16.73 g and 9.29 g of the polysiloxane solution [C-1] were mixed and stirred. It was diluted with 5.90 g of ethyl acetate. An organic-inorganic composite thin film forming solution [C-2] having a solid content of 40 wt% was obtained.
ステンレス板上に5μmとなるようにバーコート成膜(Dip成膜でも可)し、温風循環型乾燥機にて150℃で30分間加熱した。
得られたコーティング膜について、ESCAにより膜厚方向における各膜成分の分布を測定した。結果を図2に示す。 3-3. A bar coat film was formed on the thin film-formed stainless steel plate so as to have a thickness of 5 μm (Dip film formation was also possible), and the film was heated at 150 ° C. for 30 minutes with a hot air circulating dryer.
About the obtained coating film, distribution of each film | membrane component in a film thickness direction was measured by ESCA. The results are shown in FIG.
上記3-3で得られたコーティング膜に、UVオゾン洗浄装置(岩崎電機(株)製)を用いてUVオゾン洗浄を10分間行い、SAM形成溶液中に10分間浸漬させた。SAM形成溶液より引き上げ後、NSクリーン100で掛け洗いし、エアーブローによる液切りを行い、温風循環型乾燥機にて60℃で10分間加熱した。
SAM形成薬剤:SAMLAY(登録商標) 日本曹達(株) 3-4. Formation of self-assembled monolayer (SAM) The coating film obtained in 3-3 above is subjected to UV ozone cleaning for 10 minutes using a UV ozone cleaning device (Iwasaki Electric Co., Ltd.) It was immersed in the SAM forming solution for 10 minutes. After lifting from the SAM forming solution, it was washed with
SAM-forming drug: SAMLAY (registered trademark) Nippon Soda Co., Ltd.
固形分が40wt%となるように、日曹チタボンドを酢酸エチルで希釈した溶液を用いて、ステンレス板上に0.6μm以上となる様にDipコート成膜し、温風循環型乾燥機にて130~150℃で5~10分間加熱し、コーティング膜を形成した。
得られたコーティング膜に、UVオゾン洗浄装置(岩崎電機(株)製)を用いてUVオゾン洗浄を10分間行い、SAM形成溶液(SAMLAY(R) 日本曹達(株)製)中に10分間浸漬させた。SAM形成溶液より引き上げ後、NSクリーン100で掛け洗いし、エアーブローによる液切りを行い、温風循環型乾燥機にて60℃で10分間加熱した。 [Comparative Example 4]
Using a solution obtained by diluting Nisso Titabond with ethyl acetate so that the solid content is 40 wt%, a Dip coat film is formed on a stainless steel plate so that the thickness is 0.6 μm or more, and a hot air circulation dryer is used. The coating film was formed by heating at 130-150 ° C. for 5-10 minutes.
The obtained coating film is subjected to UV ozone cleaning for 10 minutes using a UV ozone cleaning device (Iwasaki Electric Co., Ltd.) and immersed in a SAM forming solution (SAMLAY® Nippon Soda Co., Ltd.) for 10 minutes. I let you. After lifting from the SAM forming solution, it was washed with
実施例3及び比較例4について評価を行った。測定方法は以下のとおりである。結果を表5に示す。
1)撥液性
各試料の表面にマイクロシリンジから水、又は、テトラデカン(以下、「TD」と略す。)を5μl滴下した後、60秒後に、Drop Master700(協和界面科学社製)を用いて接触角を測定した。 [Evaluation test]
Example 3 and Comparative Example 4 were evaluated. The measurement method is as follows. The results are shown in Table 5.
1) Liquid repellency After 5 μl of water or tetradecane (hereinafter abbreviated as “TD”) was dropped from the microsyringe onto the surface of each sample, 60 seconds later, using Drop Master 700 (manufactured by Kyowa Interface Science Co., Ltd.). The contact angle was measured.
4-1.ポリシロキサン溶液の調製[D-1]
ジイソプロポキシビスアセチルアセトナートチタン15.0gに、有機ケイ素化合物であるビニルトリメトキシシラン28.93gと3-メタクリロキシプロピルトリメトキシシラン20.78gを加えて、約1分程度撹拌した。次に、[D-1]中の固形分量が30wt%になる様にMEKを36.71g加えた後、[D-1]中の成分(Ti+Si)molに対して1.5倍molの純水8.38gを添加した。この溶液を室温下で2時間撹拌し加水分解を行った。反応終了後、反応液の液温が室温程度になるまで放置し、固形分量が30wt%のポリシロキサン溶液[D-1]109.80gを得た。
※ビニルトリメトキシシラン(信越化学工業株式会社製 KBM-1003)
※3-メタクリロキシプロピルトリメトキシシラン(信越化学工業株式会社製 KBM-503)
※ジイソプロポキシビスアセチルアセトナートチタン(日本曹達株式会社 T-50、TiO2換算固形分量:16.5wt%)
※メチルエチルケトン(MEK)和光純薬工業(株) [Example 4]
4-1. Preparation of polysiloxane solution [D-1]
28.93 g of vinyltrimethoxysilane and 20.78 g of 3-methacryloxypropyltrimethoxysilane which are organosilicon compounds were added to 15.0 g of diisopropoxybisacetylacetonate titanium, and the mixture was stirred for about 1 minute. Next, 36.71 g of MEK was added so that the solid content in [D-1] was 30 wt%, and then 1.5 times mol of pure component (Ti + Si) mol in [D-1] was added. 8.38 g of water was added. This solution was stirred at room temperature for 2 hours for hydrolysis. After completion of the reaction, the reaction solution was allowed to stand until the temperature of the reaction solution reached about room temperature to obtain 109.80 g of a polysiloxane solution [D-1] having a solid content of 30 wt%.
* Vinyltrimethoxysilane (KBM-1003, Shin-Etsu Chemical Co., Ltd.)
* 3-Methacryloxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd. KBM-503)
* Diisopropoxybisacetylacetonate titanium (Nippon Soda Co., Ltd. T-50, TiO 2 equivalent solid content: 16.5 wt%)
* Methyl ethyl ketone (MEK) Wako Pure Chemical Industries, Ltd.
YD-128:ポリシロキサン溶液[D-1]=80wt%:20wt%(固形分比)となる様に、YD-128を15.50gとポリシロキサン溶液[D-1]12.92gをそれぞれ計量した。次に、有機無機複合薄膜溶液[D-2]中の固形分濃度が、40wt%になる様にMEKを20.96g加えて混合した。この混合液にYD-128の固形分量に対して4wt%の2-エチル-4-メチルイミダゾール0.62gを添加し、室温下で1時間程度撹拌を行った。固形分濃度40wt%の有機無機複合薄膜形成用溶液[D-2]50.0gを得た。
※YD-128(新日鐵化学、BPA型エポキシ樹脂)
※2-エチル-4-メチルイミダゾール(四国化成工業(株))
※溶媒:メチルエチルケトン(MEK)、メチルイソブチルケトン(MIBK)、トルエン等(いずれも和光純薬工業(株)) 4-2. Preparation of organic / inorganic composite thin film forming solution [D-2]
YD-128: Weigh 15.50 g of YD-128 and 12.92 g of polysiloxane solution [D-1] so that the polysiloxane solution [D-1] = 80 wt%: 20 wt% (solid content ratio). did. Next, 20.96 g of MEK was added and mixed so that the solid concentration in the organic-inorganic composite thin film solution [D-2] was 40 wt%. To this mixed solution, 0.62 g of 4-ethyl-4-methylimidazole of 4 wt% based on the solid content of YD-128 was added and stirred at room temperature for about 1 hour. 50.0 g of an organic-inorganic composite thin film forming solution [D-2] having a solid content concentration of 40 wt% was obtained.
* YD-128 (Nippon Steel Chemical, BPA type epoxy resin)
* 2-Ethyl-4-methylimidazole (Shikoku Chemicals Co., Ltd.)
* Solvent: Methyl ethyl ketone (MEK), Methyl isobutyl ketone (MIBK), Toluene, etc. (all Wako Pure Chemical Industries, Ltd.)
アクリル基板及びポリカーボネート基板上に0.6μm以上となる様にDipコート成膜し、温風循環型乾燥機にて60~100℃で5~20分間加熱し、コーティング膜とした。 4-3. Thin film formation Dip coating is formed on an acrylic substrate and a polycarbonate substrate to a thickness of 0.6 μm or more, and heated at 60 to 100 ° C. for 5 to 20 minutes with a hot-air circulating drier. did.
上記4-3で得られたコーティング膜に、UVオゾン洗浄装置(岩崎電機(株)製)を用いてUVオゾン洗浄を10分間行い、SAM形成溶液中に10分間浸漬させた。SAM形成溶液より引き上げ後、NSクリーン100で掛け洗いおよび超音波洗浄し、エアーブローによる液切りを行い、温風循環型乾燥機にて60℃で10分間加熱した。
※SAM形成薬剤:SAMLAY(登録商標) 日本曹達(株) 4-4. Formation of self-assembled monolayer (SAM) The coating film obtained in 4-3 above is subjected to UV ozone cleaning for 10 minutes using a UV ozone cleaning device (Iwasaki Electric Co., Ltd.), It was immersed in the SAM forming solution for 10 minutes. After pulling up from the SAM forming solution, it was washed with
* SAM-forming drug: SAMLAY (registered trademark) Nippon Soda Co., Ltd.
実施例4において作製した有機無機複合薄膜形成用溶液[D-2]をアクリル基板上に0.6μm以上となる様にDipコート成膜し、温風循環型乾燥機にて60~100℃で5~20分間加熱し、コーティング膜とした。 [Comparative Example 5]
The solution [D-2] for forming the organic / inorganic composite thin film prepared in Example 4 was formed into a Dip coat film on the acrylic substrate so as to have a thickness of 0.6 μm or more, and was heated at 60 to 100 ° C. with a hot air circulation dryer. Heated for 5 to 20 minutes to form a coating film.
実施例4において作製した有機無機複合薄膜形成用溶液[D-2]をポリカーボネート樹脂基板上に0.6μm以上となる様にDipコート成膜し、温風循環型乾燥機にて60~100℃で5~20分間加熱し、コーティング膜とした。 [Comparative Example 6]
The solution [D-2] for forming an organic-inorganic composite thin film produced in Example 4 was formed into a Dip coat film on a polycarbonate resin substrate so as to be 0.6 μm or more, and was heated to 60 to 100 ° C. with a hot air circulation dryer. For 5 to 20 minutes to form a coating film.
実施例4及び比較例5~8について評価を行った。測定法は以下のとおりである。結果を表6に示す。ただし、実施例4-1はアクリル樹脂基板に積層したものであり、実施例4-2はポリカーボネート樹脂基板積層したものである。比較例7は未処理のアクリル樹脂基板、比較例8は未処理のポリカーボネート樹脂基板である。 [Evaluation test]
Example 4 and Comparative Examples 5 to 8 were evaluated. The measurement method is as follows. The results are shown in Table 6. However, Example 4-1 was laminated on an acrylic resin substrate, and Example 4-2 was laminated on a polycarbonate resin substrate. Comparative Example 7 is an untreated acrylic resin substrate, and Comparative Example 8 is an untreated polycarbonate resin substrate.
各試料の表面にマイクロシリンジから水2μl、又は、テトラデカン(以下、「TD」と略す。)7μl滴下した後、60秒後に、Drop Master700(協和界面科学社製)を用いて接触角を測定した。
2)耐溶剤性
基板上にトルエンを滴下し25分後の表面を観察した。
3)耐熱性
温風循環型乾燥機にて100℃で60分間加熱した。
4)ビッカース硬度測定
超微小硬さ試験システムピコデンター(Fischer)を用い、最大荷重0.5mN、クリープ速度20sで測定した。 1) Liquid repellency After 2 μl of water or 7 μl of tetradecane (hereinafter abbreviated as “TD”) is dropped from the microsyringe onto the surface of each sample, 60 seconds later, using Drop Master 700 (manufactured by Kyowa Interface Science Co., Ltd.) The contact angle was measured.
2) Solvent resistance Toluene was dropped on the substrate and the surface after 25 minutes was observed.
3) Heat resistance It heated at 100 degreeC with the warm air circulation type dryer for 60 minutes.
4) Vickers hardness measurement Using a super micro hardness test system Picodenter (Fischer), it was measured at a maximum load of 0.5 mN and a creep speed of 20 s.
Claims (5)
- 基体上に、第1層、第2層の順に形成された薄膜積層体において、
第1層が、
a)式(I)
RnSiX4-n (I)
(式中、RはSiに炭素原子が直接結合した有機基を表し、Xは水酸基又は加水分解性基を表す。nは1又は2を表し、nが2のとき各Rは同一でも異なっていてもよく、(4-n)が2以上のとき各Xは同一でも異なっていてもよい。)で表される有機ケイ素化合物の縮合物、
b)熱硬化性化合物の硬化物
を含有する有機無機複合薄膜であって、
第2層が、金属界面活性剤の加水分解縮合物である自己組織化膜を含有する層であることを特徴とする薄膜積層体。 In the thin film laminate formed in the order of the first layer and the second layer on the substrate,
The first layer is
a) Formula (I)
R n SiX 4-n (I)
(In the formula, R represents an organic group in which a carbon atom is directly bonded to Si, X represents a hydroxyl group or a hydrolyzable group. N represents 1 or 2, and when n is 2, each R is the same or different. And each X may be the same or different when (4-n) is 2 or more.)
b) An organic-inorganic composite thin film containing a cured product of a thermosetting compound,
The thin film laminate, wherein the second layer is a layer containing a self-assembled film that is a hydrolysis condensate of a metal surfactant. - 第1層中のa)とb)との質量比が50:50~5:95であることを特徴とする請求項1に記載の薄膜積層体。 The thin film laminate according to claim 1, wherein the mass ratio of a) to b) in the first layer is 50:50 to 5:95.
- 式(I)中のRがビニル基である化合物の縮合物を有機ケイ素化合物の縮合物全体の55質量%以上含有することを特徴とする請求項1又は2に記載の薄膜積層体。 The thin film laminate according to claim 1 or 2, wherein the condensate of the compound in which R in the formula (I) is a vinyl group is contained in an amount of 55% by mass or more based on the total condensate of the organosilicon compound.
- 基体が樹脂であることを特徴とする請求項1~3のいずれかに記載の薄膜積層体。 4. The thin film laminate according to claim 1, wherein the substrate is a resin.
- 金属系界面活性剤が、式(II)
R1 mMX1 t-m (II)
〔式中、R1は、置換基を有していてもよい炭素数1~30の炭化水素基、置換基を有していてもよい炭素数1~30のハロゲン化炭化水素基、連結基を含む炭素数1~30の炭化水素基、又は連結基を含む炭素数1~30のハロゲン化炭化水素基を表し、Mは、ケイ素原子、ゲルマニウム原子、スズ原子、チタン原子、及びジルコニウム原子からなる群から選ばれる少なくとも1種の金属原子を表し、X1は、水酸基又は加水分解性基を表し、tはMの原子価を表す。mは、1から(t-1)のいずれかの正整数を表し、mが2以上の場合、R1は、互いに同一でも相異なっていてもよい。(t-m)が2以上の場合、X1は同一であっても、相異なっていてもよいが、X1のうち、少なくとも一個は加水分解性基である。〕で示される化合物である請求項1~4のいずれかに記載の薄膜積層体。 The metal surfactant is represented by the formula (II)
R 1 m MX 1 tm (II)
[Wherein, R 1 represents a hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, a halogenated hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, or a linking group. Represents a hydrocarbon group having 1 to 30 carbon atoms or a halogenated hydrocarbon group having 1 to 30 carbon atoms including a linking group, and M represents a silicon atom, a germanium atom, a tin atom, a titanium atom, and a zirconium atom. Represents at least one metal atom selected from the group consisting of X 1 represents a hydroxyl group or a hydrolyzable group, and t represents the valence of M. m represents a positive integer from 1 to (t−1). When m is 2 or more, R 1 s may be the same or different from each other. When (tm) is 2 or more, X 1 may be the same or different, but at least one of X 1 is a hydrolyzable group. The thin film laminate according to any one of claims 1 to 4, which is a compound represented by the formula:
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JP2015214721A (en) * | 2014-05-08 | 2015-12-03 | 日本曹達株式会社 | Sieve mesh and production method thereof |
WO2016006212A1 (en) * | 2014-07-11 | 2016-01-14 | 日本曹達株式会社 | Laminate |
JP2016022724A (en) * | 2014-07-24 | 2016-02-08 | セントラル硝子株式会社 | Composite silica film, coating liquid for forming the film, and method for forming the film by using the liquid |
WO2016035301A1 (en) * | 2014-09-05 | 2016-03-10 | 日本曹達株式会社 | Fishhook |
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