WO2013190859A1 - Layered multi-core cable - Google Patents

Layered multi-core cable Download PDF

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Publication number
WO2013190859A1
WO2013190859A1 PCT/JP2013/052695 JP2013052695W WO2013190859A1 WO 2013190859 A1 WO2013190859 A1 WO 2013190859A1 JP 2013052695 W JP2013052695 W JP 2013052695W WO 2013190859 A1 WO2013190859 A1 WO 2013190859A1
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WO
WIPO (PCT)
Prior art keywords
signal line
axis direction
ground conductor
provided
portion
Prior art date
Application number
PCT/JP2013/052695
Other languages
French (fr)
Japanese (ja)
Inventor
加藤 登
真大 小澤
聡 石野
佐々木 純
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012-137616 priority Critical
Priority to JP2012137616A priority patent/JP5477422B2/en
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2013190859A1 publication Critical patent/WO2013190859A1/en
Priority claimed from US14/480,767 external-priority patent/US9781832B2/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026Coplanar striplines [CPS]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/085Triplate lines
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/088Stacked transmission lines
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/02Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224Patterned shielding planes, ground planes or power planes
    • H05K1/0225Single or multiple openings in a shielding, ground or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials

Abstract

Provided is a layered multi-core cable with which it is possible to ensure isolation between signal lines. A layered body (12) is configured by a plurality of dielectric sheets (18) being layered. A ground conductor (22) is disposed in the layered body (12). A ground conductor (24) is disposed in the layered body (12) in a different layer from the ground conductor (24). A signal circuit (20) is disposed between the ground conductor (22) and the ground conductor (24) in the layering direction. A signal circuit (21) is disposed between the ground conductor (22) and the ground conductor (24) in the layering direction, closer to the ground conductor (24) than the signal circuit (20), and extends along the signal circuit (20) in a parallel region (A1), when viewed in the layering direction. Apertures (30) are disposed in the ground conductor (22) which overlap the signal circuit (20) in the parallel region (A1), when viewed in the layering direction.

Description

Multilayer multi-core cable

The present invention relates to a laminated multicore cable, and more particularly to a laminated multicore cable provided with a plurality of signal lines used for transmission of a high-frequency signal.

As a conventional laminated multi-core cable, for example, a flexible flat cable described in Patent Document 1 is known. FIG. 19 is a cross-sectional structure diagram of the flexible flat cable 500 described in Patent Document 1.

As shown in FIG. 19, the flexible flat cable 500 includes a flat conductor 502, insulating adhesive sheets 504a and 504b, and metal thin films 506a and 506b.

A plurality of the rectangular conductors 502 are provided on the same layer at equal intervals. The flat rectangular conductor 502 is sandwiched between the insulating adhesive sheets 504a and 504b from above and below. In addition, a metal thin film 506a is provided on the upper layer of the insulating adhesive sheet 504a. A metal thin film 506b is provided below the insulating adhesive sheet 504b. The flexible flat cable 500 as described above has a structure in which a plurality of strip lines are arranged.

However, the flexible flat cable 500 described in Patent Document 1 has a problem that it is difficult to ensure isolation between the flat conductors 502 because the flat conductors 502 are close to each other.

JP 2009-277623 A

Therefore, an object of the present invention is to provide a laminated multi-core cable that can ensure isolation between a plurality of signal lines.

A multilayer multicore cable according to an aspect of the present invention includes a multilayer body configured by laminating a plurality of base material layers, a first ground conductor provided in the multilayer body, and the multilayer body. A second ground conductor provided in a different layer from the first ground conductor, and a first signal provided between the first ground conductor and the second ground conductor in the stacking direction. And a second line provided between the first ground conductor and the second ground conductor in the stacking direction and closer to the second ground conductor than the first signal line. And a second signal line extending along the first signal line when viewed in plan from the stacking direction in a predetermined region. There is a ground conductor in the predetermined area. , When viewed in plan from the lamination direction, the first opening overlapping the first signal line is provided, characterized by.

According to the present invention, isolation between a plurality of signal lines can be ensured.

1 is an external perspective view of a multilayer multicore cable according to an embodiment. It is a disassembled perspective view of the multilayer type multi-core cable which concerns on one Embodiment. FIG. 2 is a cross-sectional structure view taken along the line XX of the multilayer multicore cable of FIG. FIG. 2 is a plan view of a signal line and a ground conductor of the multilayer multicore cable of FIG. 1. It is the external appearance perspective view and cross-sectional structure figure of the connector of a lamination type multi-core cable. It is the figure which planarly viewed the electronic device using the multilayer type multi-core cable from the y-axis direction and the z-axis direction. It is an external appearance perspective view of the multilayer type multi-core cable which concerns on a 1st modification. It is a disassembled perspective view of the multilayer type multi-core cable which concerns on a 1st modification. It is the external appearance perspective view and cross-sectional structure figure of the connector of a lamination type multi-core cable. It is the figure which planarly viewed the electronic device using the multilayer type multi-core cable from the y-axis direction and the z-axis direction. It is the figure which planarly viewed the signal track | line and ground conductor of the multilayer type multi-core cable which concern on a 2nd modification. It is the figure which planarly viewed the signal track | line and ground conductor of the multilayer type multi-core cable which concern on a 3rd modification. It is an external appearance perspective view of the multilayer type multi-core cable which concerns on a 4th modification. It is a disassembled perspective view in the parallel running area | region of the lamination type multi-core cable which concerns on a 4th modification. It is the figure which planarly viewed the electronic device using the lamination type multi-core cable from the z-axis direction. It is a disassembled perspective view in the connection part of the lamination type multi-core cable which concerns on a 5th modification. It is a cross-section figure of the lamination type multi-core cable concerning other embodiments. It is a cross-section figure of the lamination type multi-core cable concerning other embodiments. 2 is a cross-sectional structure diagram of a flexible flat cable described in Patent Literature 1. FIG.

Hereinafter, a laminated multicore cable according to an embodiment of the present invention will be described with reference to the drawings.

(Configuration of laminated multi-core cable)
Hereinafter, a configuration of a multilayer multicore cable according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of a multilayer multicore cable 10 according to an embodiment. FIG. 2 is an exploded perspective view of the multilayer multicore cable 10 according to the embodiment. FIG. 3 is a cross-sectional view taken along the line XX of the multilayer multicore cable 10 of FIG. 4 is a plan view of the signal lines 20 and 21 and the ground conductors 22 and 24 of the multilayer multicore cable 10 of FIG. 1 to 4, the stacking direction of the multilayer multicore cable 10 is defined as the z-axis direction. Moreover, the longitudinal direction of the laminated multi-core cable 10 is defined as the x-axis direction, and the direction orthogonal to the x-axis direction and the z-axis direction is defined as the y-axis direction.

As shown in FIGS. 1 and 2, the laminated multi-core cable 10 includes a laminated body 12, external terminals 16a to 16d, signal lines 20, 21, ground conductors 22, 24, connectors 100a, 100b, and via-hole conductors b1-b18. It has.

The laminate 12 extends in the x-axis direction when viewed in plan from the z-axis direction, and includes a line portion 12a and connection portions 12b to 12e. As shown in FIG. 2, the laminate 12 includes a protective layer 14, dielectric sheets (base material layers) 18a to 18c, and a protective layer 15 laminated in this order from the positive side to the negative side in the z-axis direction. It is the flexible laminated body comprised. Hereinafter, the main surface on the positive direction side in the z-axis direction of the stacked body 12 is referred to as a front surface, and the main surface on the negative direction side in the z-axis direction of the stacked body 12 is referred to as a back surface.

The line portion 12a extends in the x-axis direction. The connecting portion 12b has a rectangular shape extending from the end portion on the negative direction side in the x-axis direction of the line portion 12a to the negative direction side in the x-axis direction. The connecting portion 12c has a rectangular shape extending from the end portion on the positive direction side in the x-axis direction of the line portion 12a to the positive direction side in the x-axis direction. The connecting portion 12d has a rectangular shape extending from the end portion on the negative direction side in the x-axis direction of the line portion 12a to the negative direction side in the y-axis direction. Thereby, the connection part 12b and the connection part 12d have comprised the structure branched into two from the edge part of the negative direction side of the x-axis direction of the line part 12a. The connecting portion 12e has an L shape extending from the end portion of the line portion 12a on the positive direction side in the x-axis direction to the negative direction side in the y-axis direction and then extending to the positive direction side in the x-axis direction. Yes. Thereby, the connection part 12c and the connection part 12e have comprised the structure branched into two from the edge part of the positive direction side of the x-axis direction of the track | line part 12a. The width in the y-axis direction of the connecting portions 12b to 12e is equal to the width in the y-axis direction of the line portion 12a.

The dielectric sheets 18a to 18c have the same shape as the stacked body 12 when viewed in plan from the z-axis direction. The dielectric sheets 18a to 18c are made of a flexible thermoplastic resin such as polyimide. The thickness of the dielectric sheets 18a to 18c after lamination is, for example, 25 μm to 200 μm. Hereinafter, the main surface on the positive side in the z-axis direction of the dielectric sheets 18a to 18c is referred to as the front surface, and the main surface on the negative direction side in the z-axis direction of the dielectric sheets 18a to 18c is referred to as the back surface.

The dielectric sheet 18a includes a line portion 18a-a and connection portions 18a-b to 18a-e. The dielectric sheet 18b includes a line portion 18b-a and connection portions 18b-b to 18b-e. The dielectric sheet 18c includes a line portion 18c-a and connection portions 18c-b to 18c-e. The line portions 18a-a to 18c-a constitute the line portion 12a. The connecting portions 18a-b and 18c-b constitute the connecting portion 12b. The connecting portions 18a-c and 18c-c constitute a connecting portion 12c. The connecting portions 18a-d, 18b-d, and 18c-d constitute a connecting portion 12d. The connecting portions 18a-e, 18b-e, and 18c-e constitute a connecting portion 12e.

The ground conductor 22 (first ground conductor) is provided in the multilayer body 12 as shown in FIG. 2, and more specifically, is provided on the surface of the dielectric sheet 18a. The ground conductor 22 has substantially the same shape as the multilayer body 12 when viewed in plan from the z-axis direction, and is made of a metal material having a small specific resistance mainly composed of silver or copper.

Further, as shown in FIG. 2, the ground conductor 22 includes a line portion 22a and terminal portions 22b to 22e. The line portion 22a is provided on the surface of the line portion 18a-a and has a rectangular shape extending in the x-axis direction.

As shown in FIG. 2, the terminal portion 22b is provided on the surface of the connecting portion 18a-b, and is connected to the end of the line portion 22a on the negative side in the x-axis direction. The end portion on the negative direction side in the x-axis direction of the terminal portion 22b has a quadrangular frame shape. As shown in FIG. 2, the terminal portion 22c is provided on the surface of the connection portion 18a-c, and is connected to the end portion on the positive side in the x-axis direction of the line portion 22a. The end of the terminal portion 22c on the positive side in the x-axis direction has a square shape. As shown in FIG. 2, the terminal portion 22d is provided on the surface of the connection portion 18a-d, and is connected to the end portion on the negative direction side in the x-axis direction of the line portion 22a. The end of the terminal portion 22d on the negative direction side in the y-axis direction has a square shape. As shown in FIG. 2, the terminal portion 22e is provided on the surface of the connecting portion 18a-e, and is connected to the end portion on the positive side in the x-axis direction of the line portion 22a. The end of the terminal portion 22e on the positive side in the x-axis direction has a square shape.

As shown in FIG. 2, the ground conductor 24 (second ground conductor) is provided in a layer different from the ground conductor 22 in the multilayer body 12, and more specifically, provided on the back surface of the dielectric sheet 18c. Yes. The ground conductor 24 has substantially the same shape as the multilayer body 12 when viewed in plan from the z-axis direction, and is made of a metal material having a small specific resistance mainly composed of silver or copper.

Further, as shown in FIG. 2, the ground conductor 24 includes a line portion 24a and terminal portions 24b to 24e. The line portion 24a is provided on the back surface of the line portion 18c-a and has a rectangular shape extending in the x-axis direction.

As shown in FIG. 2, the terminal portion 24b is provided on the back surface of the connecting portion 18c-b, and is connected to the end portion of the line portion 24a on the negative side in the x-axis direction. As shown in FIG. 2, the terminal portion 24c is provided on the back surface of the connection portion 18c-c, and is connected to the end portion on the positive direction side in the x-axis direction of the line portion 22a. As shown in FIG. 2, the terminal portion 24d is provided on the back surface of the connection portion 18c-d, and is connected to the end portion on the negative direction side in the x-axis direction of the line portion 24a. As shown in FIG. 2, the terminal portion 24e is provided on the back surface of the connection portion 18c-e, and is connected to the end portion of the line portion 24a on the positive side in the x-axis direction.

As shown in FIGS. 2 and 3, the signal line 20 is provided between the ground conductor 22 and the ground conductor 24 in the z-axis direction, and more specifically, the line portion 18b− of the dielectric sheet 18b. a and connecting portions 18b-b and 18b-c are provided on the surface. The signal line 20 is a linear conductor extending in the x-axis direction on the positive side in the y-axis direction from the center in the y-axis direction on the surface of the line portion 18b-a. When this occurs, the ground conductors 22 and 24 overlap. As a result, the signal line 20 and the ground conductors 22 and 24 have a stripline structure. The signal line 20 is made of a metal material having a small specific resistance mainly composed of silver or copper.

Further, the distance D1 between the signal line 20 and the ground conductor 22 in the z-axis direction is smaller than the distance D2 between the signal line 20 and the ground conductor 24 in the z-axis direction, as shown in FIG. The distance D1 is approximately equal to the thickness of the dielectric sheet 18a, and the distance D2 is approximately equal to the total thickness of the dielectric sheets 18b and 18c.

As shown in FIGS. 2 and 3, the signal line 21 is provided between the ground conductor 22 and the ground conductor 24 in the z-axis direction and closer to the ground conductor 24 than the signal line 20. More specifically, it is provided on the surface of the line portion 18c-a and the connecting portions 18c-d and 18c-e of the dielectric sheet 18c. The signal line 21 is a linear conductor extending in the x-axis direction on the negative direction side in the y-axis direction from the center in the y-axis direction on the surface of the line portion 18c-a. When viewed from above, the signal line 20 does not overlap. As shown in FIG. 4, the signal line 21 extends along the signal line 20 when viewed in plan from the z-axis direction in the parallel region A <b> 1. The parallel running region A1 corresponds to the line portion 12a. Moreover, extending along means the state of being parallel and the state of being slightly inclined from the parallel. However, the signal line 21 overlaps the ground conductors 22 and 24 when viewed in plan from the z-axis direction. Thus, the signal line 21 and the ground conductors 22 and 24 have a stripline structure. The signal line 21 is made of a metal material having a small specific resistance mainly composed of silver or copper.

Further, the distance D3 between the signal line 21 and the ground conductor 22 in the z-axis direction is larger than the distance D4 between the signal line 21 and the ground conductor 24 in the z-axis direction, as shown in FIG. The distance D3 is substantially equal to the total thickness of the dielectric sheets 18a and 18b, and the distance D4 is substantially equal to the thickness of the dielectric sheet 18c.

Here, the ground conductor 22 is provided with a plurality of rectangular openings 30 as shown in FIG. The plurality of openings 30 are provided so as to overlap with the signal line 20 and to be arranged along the signal line 20 when viewed in plan from the z-axis direction. In the ground conductor 22, a portion provided between adjacent openings 30 is referred to as a bridge portion 32. Thereby, the openings 30 and the bridge portions 32 are alternately arranged in the x-axis direction. Openings 30 and bridge portions 32 alternately overlap with the signal line 20. The bridge portions 32 are provided along the signal line 20 at intervals shorter than half the half wavelength of the high-frequency signal transmitted through the signal line 20.

Further, the ground conductor 24 is provided with a plurality of rectangular openings 31 as shown in FIG. The plurality of openings 31 are provided so as to overlap the signal line 21 and to be arranged along the signal line 21 when viewed in plan from the z-axis direction. In the ground conductor 24, a portion provided between adjacent openings 31 is referred to as a bridge portion 33. Thereby, the openings 31 and the bridge portions 33 are alternately arranged in the x-axis direction. Openings 31 and bridge portions 33 alternately overlap with the signal line 21. The bridge portions 32 are provided along the signal line 21 at intervals shorter than half the half wavelength of the high-frequency signal transmitted through the signal line 21.

The external terminal 16a is a rectangular conductor provided on the surface of the connecting portion 18a-b, and is surrounded by the terminal portion 22b. The external terminal 16a overlaps the end of the signal line 20 on the negative direction side in the x-axis direction when viewed in plan from the z-axis direction. The external terminal 16a is made of a metal material having a small specific resistance mainly composed of silver or copper. The surface of the external terminal 16a is gold plated.

The external terminal 16b is a rectangular conductor provided on the surface of the connecting portion 18a-c, and is surrounded by the terminal portion 22c. The external terminal 16b overlaps the end of the signal line 20 on the positive direction side in the x-axis direction when viewed in plan from the z-axis direction. The external terminal 16b is made of a metal material having a small specific resistance mainly composed of silver or copper. The surface of the external terminal 16b is gold plated.

The external terminal 16c is a rectangular conductor provided on the surface of the connecting portion 18a-d, and is surrounded by the terminal portion 22d. The external terminal 16c overlaps the end of the signal line 21 on the negative direction side in the x-axis direction when viewed in plan from the z-axis direction. The external terminal 16c is made of a metal material having a small specific resistance mainly composed of silver or copper. The surface of the external terminal 16c is gold plated.

The external terminal 16d is a rectangular conductor provided on the surface of the connecting portion 18a-e, and is surrounded by the terminal portion 22e. The external terminal 16d overlaps the end of the signal line 21 on the positive direction side in the x-axis direction when viewed in plan from the z-axis direction. The external terminal 16d is made of a metal material having a small specific resistance mainly composed of silver or copper. The surface of the external terminal 16d is plated with gold.

The via-hole conductor b1 passes through the connecting portions 18a-b of the dielectric sheet 18a in the z-axis direction. The end portion on the positive side in the z-axis direction of the via-hole conductor b1 is connected to the external terminal 16a, and the end portion on the negative direction side in the z-axis direction of the via-hole conductor b1 is negative in the x-axis direction of the signal line 20. It is connected to the end on the direction side.

The via-hole conductor b2 passes through the connecting portions 18a-c of the dielectric sheet 18a in the z-axis direction. The end of the via-hole conductor b2 on the positive side in the z-axis direction is connected to the external terminal 16b, and the end of the via-hole conductor b2 on the negative side in the z-axis direction is the positive end of the signal line 20 in the x-axis direction. It is connected to the end on the direction side. Thereby, the signal line 20 is connected between the external terminals 16a and 16b.

The via-hole conductor b3 passes through the connecting portions 18a-d of the dielectric sheet 18a in the z-axis direction. The via-hole conductor b4 passes through the connection portion 18b-d of the dielectric sheet 18b in the z-axis direction. The via-hole conductors b3 and b4 constitute one via-hole conductor by being connected to each other. The end portion on the positive side in the z-axis direction of the via-hole conductor b3 is connected to the external terminal 16c, and the end portion on the negative direction side in the z-axis direction of the via-hole conductor b4 is negative in the x-axis direction of the signal line 21. It is connected to the end on the direction side.

The via-hole conductor b5 passes through the connecting portion 18a-e of the dielectric sheet 18a in the z-axis direction. The via-hole conductor b6 passes through the connection portion 18b-e of the dielectric sheet 18b in the z-axis direction. The via-hole conductors b5 and b6 constitute one via-hole conductor by being connected to each other. The positive end of the via-hole conductor b5 in the z-axis direction is connected to the external terminal 16d, and the negative end of the via-hole conductor b6 in the z-axis direction is the positive end of the signal line 21 in the x-axis direction. It is connected to the end on the direction side.

The via-hole conductor b7 passes through the line portion 18a-a and the connecting portions 18a-b and 18a-c of the dielectric sheet 18a in the z-axis direction, and is more than the signal line 20 when viewed in plan from the z-axis direction. On the positive direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via-hole conductor b8 passes through the line portion 18b-a and the connecting portions 18b-b and 18b-c of the dielectric sheet 18b in the z-axis direction, and is more than the signal line 20 when viewed in plan from the z-axis direction. On the positive direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via-hole conductor b9 passes through the line portion 18c-a and the connecting portions 18c-b and 18c-c of the dielectric sheet 18c in the z-axis direction, and is more than the signal line 20 when viewed in plan from the z-axis direction. On the positive direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via hole conductors b7 to b9 are connected to each other to constitute one via hole conductor. The end of the via-hole conductor b7 on the positive side in the z-axis direction is connected to the ground conductor 22. The end of the via-hole conductor b9 on the negative direction side in the z-axis direction is connected to the ground conductor 24.

The via-hole conductor b10 passes through the line portion 18a-a and the connection portions 18a-b and 18a-c of the dielectric sheet 18a in the z-axis direction, and is more than the signal line 20 when viewed in plan from the z-axis direction. On the negative direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via-hole conductor b11 passes through the line portion 18b-a and the connecting portions 18b-b and 18b-c of the dielectric sheet 18b in the z-axis direction, and is more than the signal line 20 when viewed in plan from the z-axis direction. On the negative direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via-hole conductor b12 penetrates the line portion 18c-a and the connecting portions 18c-b and 18c-c of the dielectric sheet 18c in the z-axis direction, and is more than the signal line 20 when viewed in plan from the z-axis direction. On the negative direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via-hole conductors b10 to b12 are connected to each other to constitute one via-hole conductor. The end of the via-hole conductor b10 on the positive side in the z-axis direction is connected to the ground conductor 22. The end of the via-hole conductor b12 on the negative side in the z-axis direction is connected to the ground conductor 24.

The via-hole conductor b13 penetrates the line portion 18a-a and the connecting portions 18a-d and 18a-e of the dielectric sheet 18a in the z-axis direction, and is more than the signal line 21 when viewed in plan from the z-axis direction. On the positive direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via-hole conductor b14 passes through the line portion 18b-a and the connecting portions 18b-d and 18b-e of the dielectric sheet 18b in the z-axis direction, and is more than the signal line 21 when viewed in plan from the z-axis direction. On the positive direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via-hole conductor b15 passes through the line portion 18c-a and the connection portions 18c-d and 18c-e of the dielectric sheet 18c in the z-axis direction, and is more than the signal line 21 when viewed in plan from the z-axis direction. On the positive direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via hole conductors b13 to b15 are connected to each other to constitute one via hole conductor. The end of the via-hole conductor b <b> 13 on the positive side in the z-axis direction is connected to the ground conductor 22. The end of the via-hole conductor b15 on the negative direction side in the z-axis direction is connected to the ground conductor 24.

The via-hole conductor b16 passes through the line portion 18a-a and the connecting portions 18a-d and 18a-e of the dielectric sheet 18a in the z-axis direction, and is more than the signal line 21 when viewed in plan from the z-axis direction. On the negative direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via-hole conductor b17 passes through the line portion 18b-a and the connecting portions 18b-d and 18b-e of the dielectric sheet 18b in the z-axis direction, and is more than the signal line 21 when viewed in plan from the z-axis direction. On the negative direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via-hole conductor b18 passes through the line portion 18c-a and the connecting portions 18c-d and 18c-e of the dielectric sheet 18c in the z-axis direction, and is more than the signal line 21 when viewed in plan from the z-axis direction. On the negative direction side in the y-axis direction, a plurality are provided so as to be aligned in a row in the x-axis direction. The via hole conductors b16 to b18 are connected to each other to constitute one via hole conductor. The end of the via-hole conductor b16 on the positive side in the z-axis direction is connected to the ground conductor 22. The end of the via-hole conductor b18 on the negative direction side in the z-axis direction is connected to the ground conductor 24. Thereby, the ground conductor 22 and the ground conductor 24 are connected by the via-hole conductors b7 to b18.

The via-hole conductors b1 to b18 are made of a metal material having a specific resistance mainly composed of silver or copper. Instead of the via hole conductors b1 to b18, a through hole in which a conductor layer such as plating is formed on the inner peripheral surface of the through hole may be used.

The protective layer 14 covers substantially the entire surface of the dielectric sheet 18a. Thereby, the protective layer 14 covers the ground conductor 22. The protective layer 14 is made of a flexible resin such as a resist material, for example.

Further, as shown in FIG. 2, the protective layer 14 includes a line portion 14a and connection portions 14b to 14e. The line portion 14a covers the line portion 22a by covering the entire surface of the line portion 18a-a.

The connecting portion 14b is connected to the end portion on the negative side in the x-axis direction of the line portion 14a and covers the surface of the connecting portion 18a-b. However, the connection portion 14b is provided with a rectangular opening Ha. The external terminal 16a and the terminal portion 22b are exposed to the outside through the opening Ha. The terminal portion 22b functions as an external terminal by being exposed to the outside through the opening Ha.

The connecting portion 14c is connected to the end portion on the positive side in the x-axis direction of the line portion 14a and covers the surface of the connecting portion 18a-c. However, the connection portion 14c is provided with a rectangular opening Hb. The external terminal 16b and the terminal portion 22c are exposed to the outside through the opening Hb. The terminal portion 22c functions as an external terminal by being exposed to the outside through the opening Hb.

The connecting portion 14d is connected to the end portion on the negative side in the x-axis direction of the line portion 14a and covers the surface of the connecting portion 18a-d. However, the connection portion 14d is provided with a rectangular opening Hc. The external terminal 16c and the terminal portion 22d are exposed to the outside through the opening Hc. The terminal portion 22d functions as an external terminal by being exposed to the outside through the opening Hc.

The connecting portion 14e is connected to the end portion on the positive side in the x-axis direction of the line portion 14a and covers the surface of the connecting portion 18a-e. However, the connection portion 14e is provided with a rectangular opening Hd. The external terminal 16d and the terminal portion 22e are exposed to the outside through the opening Hd. The terminal portion 22e functions as an external terminal by being exposed to the outside through the opening Hd.

The protective layer 15 covers substantially the entire back surface of the dielectric sheet 18c. Thereby, the protective layer 15 covers the ground conductor 24. The protective layer 15 is made of a flexible resin such as a resist material, for example.

The connectors 100a and 100b are mounted on the surfaces of the connecting portions 12b and 12c, and are electrically connected to the signal line 20 and the ground conductors 22 and 24, respectively. The connectors 100c and 100d are mounted on the surfaces of the connection portions 12d and 12e, respectively, and are electrically connected to the signal line 21 and the ground conductors 22 and 24. Since the connectors 100a to 100d have the same configuration, the configuration of the connector 100b will be described below as an example. FIGS. 5A and 5B are an external perspective view and a cross-sectional structure diagram of the connector 100b of the multilayer multicore cable 10. FIG.

The connector 100b includes a connector body 102, external terminals 104 and 106, a central conductor 108, and an external conductor 110 as shown in FIG. The connector body 102 has a shape in which a cylinder is connected to a rectangular plate, and is made of an insulating material such as a resin.

The external terminal 104 is provided at a position facing the external terminal 16b on the negative side surface in the z-axis direction of the connector main body 102. The external terminal 106 is provided at a position corresponding to the terminal portion 22c exposed through the opening Hb on the surface of the connector main body 102 on the negative side in the z-axis direction.

The center conductor 108 is provided at the center of the cylinder of the connector main body 102 and is connected to the external terminal 104. The center conductor 108 is a signal terminal that inputs or outputs a high-frequency signal transmitted through the signal line 20.

The external conductor 110 is provided on the cylinder of the connector body 102 and is connected to the external terminal 106. The outer conductor 110 is a ground terminal that is maintained at a ground potential.

The connector 100b configured as described above is mounted on the surface of the connection portion 12c such that the external terminal 104 is connected to the external terminal 16b and the external terminal 106 is connected to the terminal portion 22c. Thereby, the signal line 20 is electrically connected to the central conductor 108. The ground conductors 22 and 24 are electrically connected to the external conductor 110.

The laminated multi-core cable 10 is used as described below. FIG. 6 is a plan view of the electronic device 200 in which the laminated multicore cable 10 is used from the y-axis direction and the z-axis direction.

The electronic device 200 includes a multilayer multi-core cable 10, circuit boards 202a to 202d, receptacles 204a to 204d (receptacles 204c and 204d are not shown), a battery pack (metal body) 206, and a casing 210.

The battery pack 206 is a lithium ion secondary battery, for example, and has a structure in which the surface is covered with a metal cover. The circuit board 202a, the battery pack 206, and the circuit board 202b are arranged in this order from the negative direction side to the positive direction side in the x-axis direction. The circuit board 202c is provided on the negative direction side of the circuit board 202a in the y-axis direction. The circuit board 202d is provided on the negative direction side of the circuit board 202d in the y-axis direction.

The surface of the laminate 12 (more precisely, the protective layer 14) is in contact with the battery pack 206. The surface of the laminate 12 and the battery pack 206 are fixed with an adhesive or the like.

The receptacles 204a to 204d are provided on the main surfaces on the negative direction side in the z-axis direction of the circuit boards 202a to 202d, respectively. Connectors 100a to 100d are connected to receptacles 204a to 204d, respectively. Accordingly, a high frequency signal having a frequency of, for example, 0.8 GHz to 5 GHz transmitted between the circuit boards 202a and 202b is applied to the central conductor 108 of the connectors 100a and 100b via the receptacles 204a and 204b. Further, a high frequency signal having a frequency of, for example, 0.8 GHz to 5 GHz transmitted between the circuit boards 202c and 202d is applied to the central conductor 108 of the connectors 100c and 100d via the receptacles 204c and 204d. Further, the outer conductors 110 of the connectors 100a to 100d are kept at the ground potential via the circuit boards 202a to 202d, respectively. Thereby, the multilayer multicore cable 10 connects between the circuit board 202a and the circuit board 202b and between the circuit board 202c and the circuit board 202d.

Here, there is a step between the main surface of the battery pack 206 on the negative side in the z-axis direction and the receptacles 204a to 204d. Therefore, by bending both ends of the line portion 12a of the laminate 12, the connectors 100a to 100d are connected to the receptacles 204a to 204d, respectively.

(Manufacturing method of high frequency signal line)
Below, the manufacturing method of the laminated | multilayer type | mold multicore cable 10 is demonstrated, referring FIG. In the following, a case where one laminated multi-core cable 10 is manufactured will be described as an example. In practice, a large-sized dielectric sheet is laminated and cut, so that a plurality of laminated multi-core cables 10 are simultaneously formed. Is produced.

First, dielectric sheets 18a and 18b made of a thermoplastic resin having a copper foil formed on the entire surface are prepared. In addition, a dielectric sheet 18c made of a thermoplastic resin having a copper foil formed on the entire front and back surfaces is prepared. The surfaces of the copper foils of the dielectric sheets 18a to 18c are smoothed by applying, for example, zinc plating for rust prevention. The thickness of the copper foil is 10 μm to 20 μm.

Next, the external terminals 16a to 16d and the ground conductor 22 shown in FIG. 2 are formed on the surface of the dielectric sheet 18a by a photolithography process. Specifically, a resist having the same shape as the external terminals 16a to 16d and the ground conductor 22 shown in FIG. 2 is printed on the copper foil on the surface side of the dielectric sheet 18a. And the copper foil of the part which is not covered with the resist is removed by performing an etching process with respect to copper foil. Thereafter, the resist is removed. Thus, the external terminals 16a to 16d and the ground conductor 22 are formed on the surface of the dielectric sheet 18a as shown in FIG.

Next, the signal line 20 shown in FIG. 2 is formed on the surface of the dielectric sheet 18b by a photolithography process. Further, the signal line 21 shown in FIG. 2 is formed on the surface of the dielectric sheet 18c by a photolithography process. Further, the ground conductor 24 shown in FIG. 2 is formed on the back surface of the dielectric sheet 18c by a photolithography process. The method of forming the signal lines 20 and 21 and the ground conductor 24 is the same as the method of forming the external terminals 16a to 16d and the ground conductor 22, and thus the description thereof is omitted.

Next, a laser beam is irradiated from the back side to the positions where the via hole conductors b1 to b18 of the dielectric sheets 18a to 18c are formed, thereby forming through holes. Thereafter, the through-holes formed in the dielectric sheets 18a to 18c are filled with a conductive paste.

Next, the dielectric sheets 18a to 18c are stacked in this order from the positive direction side in the z-axis direction to the negative direction side. Then, by applying heat and pressure to the dielectric sheets 18a to 18c from the positive direction side and the negative direction side in the z-axis direction, the dielectric sheets 18a to 18c are softened to be crimped and integrated, and through holes The conductive paste filled in is solidified to form via-hole conductors b1 to b18 shown in FIG. The via-hole conductors b1 to b18 do not necessarily have to completely fill the through hole with the conductor, and may be formed, for example, by forming the conductor along only the inner peripheral surface of the through hole.

Finally, the protective layers 14 and 15 are formed on the front surface of the dielectric sheet 18a and the back surface of the dielectric sheet 18c by applying a resin (resist) paste, respectively.

(effect)
According to the laminated multi-core cable 10 configured as described above, it is possible to ensure isolation between the two signal lines 20 and 21. More specifically, the flexible flat cable 500 described in Patent Document 1 has a problem that it is difficult to ensure isolation between the flat conductors 502 because the flat conductors 502 are provided in the same layer.

Therefore, in the laminated multicore cable 10, the signal line 20 and the signal line 21 are provided in different layers. Thereby, the distance between the signal line 20 and the signal line 21 in the multilayer multicore cable 10 becomes larger than the distance between the flat conductors 502 in the flexible flat cable 500. Thereby, the capacitance formed between the signal lines 20 and 21 is smaller than the capacitance formed between the flat conductors 502. Thereby, it is suppressed that noise propagates between the signal lines 20 and 21. As a result, the isolation in the laminated multi-core cable 10 is ensured compared to the isolation in the flexible flat cable 500. In particular, when the two signal lines 20 and 21 are digital signal lines for differential transmission, crosstalk between the signal lines 20 and 21 is reduced.

Further, according to the laminated multicore cable 10, the isolation between the signal lines 20 and 21 can be secured also for the following reason. More specifically, in the laminated multicore cable 10, in the ground conductor 22, the opening 30 overlaps the signal line 20 when viewed in plan from the z-axis direction. Therefore, it is difficult to form a capacitance between the signal line 20 and the ground conductor 22, and noise radiated from the signal line 20 is not easily propagated to the ground conductor 22. Thereby, the noise radiated from the signal line 20 is suppressed from being transmitted to the signal line 21 via the ground conductor 22. As a result, the laminated multicore cable 10 further secures isolation.

Further, in the laminated multicore cable 10, the opening 31 of the ground conductor 24 overlaps the signal line 21 when viewed in plan from the z-axis direction. Therefore, it is difficult to form a capacitance between the signal line 21 and the ground conductor 24, and noise radiated from the signal line 21 is difficult to propagate to the ground conductor 24. Thereby, the noise radiated from the signal line 21 is suppressed from being transmitted to the signal line 20 through the ground conductor 24. As a result, the laminated multicore cable 10 further secures isolation.

Moreover, according to the laminated multicore cable 10, the laminated body 12 can be thinned. More specifically, in the laminated multicore cable 10, the opening 30 is provided in the ground conductor 22 and overlaps the signal line 20 when viewed in plan from the z-axis direction. Thereby, it is difficult to form a capacitance between the signal line 20 and the ground conductor 22. Therefore, the distance D1 between the signal line 20 and the ground conductor 22 can be reduced without increasing the capacitance formed between the signal line 20 and the ground conductor 22. That is, the signal line 20 and the ground conductor 22 can be brought close to each other without reducing the characteristic impedance of the signal line 20, so that the multilayer body 12 can be thinned.

Moreover, according to the laminated multicore cable 10, the laminated body 12 can be thinned. More specifically, in the laminated multicore cable 10, the opening 31 is provided in the ground conductor 24 and overlaps the signal line 21 when viewed in plan from the z-axis direction. This makes it difficult for a capacitance to be formed between the signal line 21 and the ground conductor 24. Therefore, the distance D4 between the signal line 21 and the ground conductor 24 can be reduced without increasing the capacitance formed between the signal line 21 and the ground conductor 24. That is, the signal line 21 and the ground conductor 24 can be brought close to each other without reducing the characteristic impedance of the signal line 21, so that the multilayer body 12 can be thinned. Further, when the laminated body 12 is thinned, the laminated multi-core cable 10 can be easily bent.

As described above, according to the laminated multicore cable 10, the opening 30 that overlaps the signal line 20 is provided in the ground conductor 22, and the opening 31 that overlaps the signal line 21 is provided in the ground conductor 24. It is possible to achieve both a reduction in the thickness of the laminate 12.

In addition, according to the laminated multicore cable 10, it is possible to suppress generation of low frequency noise from the signal line 20. More specifically, in the laminated multicore cable 10, the signal line 20 alternately overlaps the openings 30 and the bridge portions 32 when viewed in plan from the z-axis direction. As a result, the characteristic impedance Z1 of the signal line 20 that overlaps the opening 30 is smaller than the characteristic impedance Z2 of the signal line 20 that overlaps the bridge portion 32. As a result, the characteristic impedance of the signal line 20 periodically varies between the characteristic impedance Z1 and the characteristic impedance Z2. As a result, in the signal line 20, a standing wave having a short wavelength (that is, a high frequency) is generated between the bridge portions 32. On the other hand, a standing wave having a long wavelength (that is, a low frequency) is hardly generated between the external terminals 16a and 16b. As described above, in the multilayer multicore cable 10, it is possible to suppress the generation of low frequency noise from the signal line 20. For the same reason, it is possible to suppress the generation of low-frequency noise from the signal line 21 in the multilayer multicore cable 10.

In the multi-core cable 10, high frequency noise is generated due to standing waves generated between the bridge portions 32. Therefore, by designing the distance between the bridge portions 32 to be sufficiently short, the noise frequency can be set outside the band of the high-frequency signal transmitted through the signal line 20. For that purpose, the bridge part 32 should just be provided along the signal track | line 20 with the space | interval shorter than 1/2 wavelength of the high frequency signal transmitted through the signal track | line 20. For the same reason, the bridge section 32 only needs to be provided along the signal line 21 at an interval shorter than ½ wavelength of the high-frequency signal transmitted through the signal line 21.

Further, in the laminated multi-core cable 10, the characteristic impedance Z <b> 3 at both ends of the signal line 20 is the characteristic impedance Z <b> 1 of the signal line 20 that overlaps the opening 30 and the signal line 20 that overlaps the bridge portion 32. The size is preferably between the characteristic impedance Z2. Thereby, in the signal line 20, a standing wave having a short wavelength is easily generated between the bridge portions 32, and a standing wave having a long wavelength is hardly generated between both ends of the signal line 20. As a result, in the laminated multicore cable 10, generation of low frequency noise is more effectively suppressed. For the same reason, the characteristic impedance Z6 at both ends of the signal line 21 is equal to the characteristic impedance Z4 of the signal line 21 that overlaps the opening 31 and the characteristic impedance Z5 of the signal line 21 that overlaps the bridge portion 33. It is preferable that the size is between.

Further, when the signal lines 20 and 21 are used as differential transmission lines used as pair lines, the eye pattern can be prevented from deviating from the ideal value.

Further, when the signal lines 20 and 21 are used as lines of different types of high-frequency signals (for example, GSM (registered trademark) 900 and GSM (registered trademark) 1800), it is possible to ensure mutual isolation.

(First modification)
Next, a laminated multicore cable 10a according to a first modification will be described with reference to the drawings. FIG. 7 is an external perspective view of the multilayer multicore cable 10a according to the first modification. FIG. 8 is an exploded perspective view of the multilayer multicore cable 10a according to the first modification.

As shown in FIGS. 7 and 8, the laminated multicore cable 10a is different from the laminated multicore cable 10 in that it has a rectangular shape extending in the x-axis direction. That is, the laminated multicore cable 10a is not branched.

Further, in the laminated multicore cable 10a, connectors 300a and 300b are used instead of the connectors 100a to 100d. The connectors 300a and 300b are mounted on the surfaces of the connecting portions 12b and 12c, and are electrically connected to the signal lines 20 and 21 and the ground conductors 22 and 24, respectively. Since the configurations of the connectors 300a and 300b are the same, the configuration of the connector 300b will be described below as an example. FIG. 9 is an external perspective view and a cross-sectional structure diagram of the connector 300b of the laminated multicore cable 10a.

The connector 300b includes a connector main body 302, external terminals 304a, 304b, and 306, center conductors 308 and 310, and an external conductor 312 as shown in FIGS. The connector main body 302 has a shape in which a cylinder is connected to a rectangular plate, and is made of an insulating material such as a resin.

The external terminal 304a is provided at a position facing the external terminal 16b on the surface of the connector main body 302 on the negative side in the z-axis direction. The external terminal 304b is provided at a position facing the external terminal 16d on the surface of the connector main body 302 on the negative direction side in the z-axis direction. The external terminal 306 is provided at a position corresponding to the terminal portion 22c exposed through the opening Hb on the surface of the connector main body 302 on the negative side in the z-axis direction.

The center conductor 308 is provided at the center of the cylinder of the connector main body 302 and is connected to the external terminal 304a. The center conductor 308 is a signal terminal for inputting or outputting a high-frequency signal transmitted through the signal line 20.

The center conductor 310 is provided on the inner cylinder of the connector main body 302 and is connected to the external terminal 304b. The center conductor 310 is a signal terminal for inputting or outputting a high-frequency signal transmitted through the signal line 21.

The external conductor 312 is provided on the inner peripheral surface of the outer cylinder of the connector main body 302 and is connected to the external terminal 306. The external conductor 312 is a ground terminal that is maintained at a ground potential.

The connector 300b configured as described above has the connection portion 12c such that the external terminal 304a is connected to the external terminal 16b, the external terminal 304b is connected to the external terminal 16d, and the external terminal 306 is connected to the terminal portion 22c. Mounted on the surface of the. Thereby, the signal line 20 is electrically connected to the central conductor 308. The signal line 21 is connected to the center conductor 310. The ground conductors 22 and 24 are electrically connected to the external conductor 312.

The laminated multicore cable 10a is used as described below. FIG. 10 is a plan view of the electronic device 200 using the multilayer multicore cable 10a from the y-axis direction and the z-axis direction.

The electronic device 200 includes a laminated multi-core cable 10a, a circuit board 202a, a liquid crystal panel 203, receptacles 404a and 404b, a battery pack (metal body) 206, and a casing 210.

The circuit board 202a is provided with a drive circuit for driving the liquid crystal panel 203, for example. The battery pack 206 is a lithium ion secondary battery, for example, and has a structure in which the surface is covered with a metal cover. The circuit board 202a, the battery pack 206, and the liquid crystal panel 203 are arranged in this order from the negative direction side in the x-axis direction to the positive direction side.

The surface of the laminate 12 (more precisely, the protective layer 14) is in contact with the battery pack 206. The surface of the laminate 12 and the battery pack 206 are fixed with an adhesive or the like.

The receptacles 404a and 404b are provided on the main surface on the negative side of the z-axis direction of the circuit board 202a and the liquid crystal panel 203, respectively. Connectors 300a and 300b are connected to receptacles 404a and 404b, respectively. Accordingly, a high frequency signal having a frequency of, for example, 0.8 GHz to 5 GHz transmitted between the circuit board 202a and the liquid crystal panel 203 is applied to the central conductor 308 of the connectors 300a and 300b via the receptacles 404a and 404b. The Further, a high-frequency signal having a frequency of, for example, 0.8 GHz to 5 GHz transmitted between the circuit board 202a and the liquid crystal panel 203 is applied to the center conductor 310 of the connectors 300a and 300b via the receptacles 404a and 404b. . These two high-frequency signals are differential transmission signals having a phase difference of 180 °. Further, the external conductor 312 of the connectors 300a and 300b is kept at the ground potential via the circuit board 202a, the liquid crystal panel 203, and the receptacles 404a and 404b. Thereby, the multilayer multi-core cable 10a connects between the circuit board 202a and the liquid crystal panel 203.

Here, there is a step between the main surface of the negative side of the z-axis direction of the battery pack 206 and the receptacles 404a and 404b. Therefore, by bending both ends of the line portion 12a of the multilayer body 12, the connectors 300a and 300b are connected to the receptacles 404a and 404b, respectively.

According to the laminated multicore cable 10a configured as described above, the opening 30 that overlaps the signal line 20 is provided in the ground conductor 22 and the opening 31 that overlaps the signal line 21 is grounded, similarly to the laminated multicore cable 10. By providing the conductor 24, it is possible to achieve both the securing of the isolation and the thinning of the multilayer body 12.

Furthermore, according to the laminated multicore cable 10 a, it is possible to suppress the generation of low frequency noise from the signal lines 20 and 21, similarly to the laminated multicore cable 10.

(Second modification)
Next, a laminated multicore cable 10b according to a second modification will be described with reference to the drawings. FIG. 11 is a plan view of the signal lines 20 and 21 and the ground conductors 22 and 24 of the multilayer multicore cable 10b according to the second modification. In addition, FIG.1 and FIG.2 is used about the external appearance perspective view and exploded perspective view of the laminated | multilayer type multi-core cable 10b.

As shown in FIG. 11, the laminated multicore cable 10 b is different from the laminated multicore cable 10 in the shapes of the openings 30 and 31 and the shapes of the signal lines 20 and 21.

First, in the openings 30 and 31, a region at the center in the x-axis direction is defined as a region a1. In the openings 30 and 31, a region at the end on the negative direction side in the x-axis direction is defined as a region a2. In the openings 30 and 31, a region at the end on the positive direction side in the x-axis direction is defined as a region a3. A region between the region a1 and the region a2 is defined as a region a4. A region between the region a1 and the region a3 is defined as a region a5.

As shown in FIG. 11, the width of the opening 30 in the region a1 in the y-axis direction is the width W1. Further, the width in the y-axis direction of the opening 30 in the regions a2 and a3 is a width W2 smaller than the width W1. In the region a4, the opening 30 has a taper shape that becomes wider toward the positive side in the x-axis direction, so that the width of the opening 30 continuously increases. In the region a5, the opening 30 has a tapered shape that becomes narrower toward the positive side in the x-axis direction, whereby the width of the opening 30 continuously decreases.

As shown in FIG. 11, the width in the y-axis direction of the opening 31 in the region a1 is a width W1. Further, the width in the y-axis direction of the opening 31 in the regions a2 and a3 is a width W2 smaller than the width W1. And in the area | region a4, the opening 31 makes the taper shape which becomes wide as it goes to the positive direction side of an x-axis direction, and the width | variety of the opening 31 is increasing continuously. In the region a5, the opening 31 has a tapered shape that becomes narrower toward the positive side in the x-axis direction, whereby the width of the opening 31 continuously decreases.

Further, the line width of the signal line 20 varies periodically as shown in FIG. The line width W3 of the signal line 20 that overlaps the opening 30 is larger than the line width W4 of the signal line 20 that overlaps the bridge portion 32. Further, the end of the portion of the signal line 20 that overlaps the opening 30 on the negative side in the x-axis direction has a tapered shape that becomes wider toward the positive side in the x-axis direction. As a result, the line width of the signal line 20 continuously increases. Further, the end of the portion of the signal line 20 that overlaps the opening 30 on the positive direction side in the x-axis direction has a tapered shape that becomes narrower toward the positive direction side in the x-axis direction. As a result, the line width of the signal line 20 continuously decreases.

Further, the line width of the signal line 21 fluctuates periodically as shown in FIG. The line width W <b> 3 of the signal line 21 that overlaps the opening 31 is larger than the line width W <b> 4 of the signal line 21 that overlaps the bridge part 33. Further, the end of the portion of the signal line 21 that overlaps the opening 31 on the negative direction side in the x-axis direction has a tapered shape that becomes wider toward the positive direction side in the x-axis direction. As a result, the line width of the signal line 21 is continuously increased. Further, the end of the portion of the signal line 21 that overlaps the opening 31 on the positive direction side in the x-axis direction has a tapered shape that becomes narrower toward the positive direction side in the x-axis direction. As a result, the line width of the signal line 21 is continuously reduced.

According to the laminated multicore cable 10b configured as described above, similarly to the laminated multicore cable 10, the opening 30 that overlaps the signal line 20 is provided in the ground conductor 22, and the opening 31 that overlaps the signal line 21 is grounded. By providing the conductor 24, it is possible to achieve both the securing of the isolation and the thinning of the multilayer body 12.

Furthermore, according to the laminated multicore cable 10 b, it is possible to suppress the generation of low-frequency noise from the signal lines 20 and 21 as in the laminated multicore cable 10.

Further, according to the laminated multicore cable 10b, the width W1 of the openings 30 and 31 in the region a1 is larger than the width W2 of the openings 30 and 31 in the regions a2 and a3. For this reason, the capacitance formed between the signal lines 20 and 21 in the region a1 is smaller than the capacitance formed between the signal lines 20 and 21 in the regions a2 and a3. Therefore, the characteristic impedance of the signal lines 20 and 21 in the region a1 is larger than the characteristic impedance of the signal lines 20 and 21 in the regions a2 and a3. As a result, the characteristic impedance of the signal lines 20 and 21 increases and decreases in the openings 30 and 31 from the negative direction side to the positive direction side in the x-axis direction. Therefore, it is possible to suppress the characteristic impedance of the signal lines 20 and 21 from fluctuating greatly. As a result, the occurrence of high-frequency signal reflection in the signal lines 20 and 21 is suppressed.

Further, in the laminated multicore cable 10b, the width of the opening 30 in the regions a4 and a5 continuously changes. Thereby, in the regions a4 and a5, the width of the gap between the signal line 20 and the ground conductor 22 is gradually increased or decreased. Similarly, the width of the gap between the signal line 21 and the ground conductor 24 gradually increases or decreases. Therefore, the magnetic flux generated around the signal line 20 and passing through the gap between the signal line 20 and the ground conductor 22 gradually increases or decreases in the regions a4 and a5. The magnetic flux generated around the signal line 21 and passing through the gap between the signal line 21 and the ground conductor 24 gradually increases or decreases in the regions a4 and a5. That is, the magnetic field energy is prevented from greatly fluctuating in the regions a4 and a5. As a result, the occurrence of high-frequency signal reflection is suppressed in the vicinity of the boundary between the region a1 and the regions a2 and a3.

In the opening 30, the signal line 20 and the ground conductor 22 do not face each other, so that the capacitance formed between the signal line 20 and the ground conductor 22 is very small. For this reason, even if the line width of the signal line 20 is increased, the capacitance formed between the signal line 20 and the ground conductor 22 is hardly increased, and the characteristic impedance of the signal line 20 is not lowered. Therefore, in the laminated multicore cable 10b, the line width W3 of the portion of the signal line 20 that overlaps the opening 30 when viewed in plan from the z-axis direction is equal to that of the portion of the signal line 20 that overlaps the bridge portion 32. It is larger than the line width W4. As a result, the resistance value of the signal line 20 is reduced, and the high-frequency resistance in the multilayer multicore cable 10b is reduced. For the same reason, the resistance value of the signal line 21 is also reduced.

(Third Modification)
Next, a laminated multicore cable 10c according to a third modification will be described with reference to the drawings. FIG. 12 is a plan view of the signal lines 20 and 21 and the ground conductors 22 and 24 of the multilayer multicore cable 10c according to the third modification. In addition, FIG.1 and FIG.2 is used about the external appearance perspective view and exploded perspective view of the laminated | multilayer type | mold multicore cable 10c.

The laminated multicore cable 10c differs from the laminated multicore cable 10 in that the openings 30, 31 do not match in the y-axis direction. More specifically, the bridge portion 32 is located at the center of the opening 31 in the x-axis direction (the direction in which the signal line 20 extends). The bridge portion 33 is located at the center of the opening 30 in the x-axis direction (the direction in which the signal line 21 extends).

According to the laminated multicore cable 10c configured as described above, the opening 30 that overlaps the signal line 20 is provided in the ground conductor 22 and the opening 31 that overlaps the signal line 21 is grounded, similarly to the laminated multicore cable 10. By providing the conductor 24, it is possible to achieve both the securing of the isolation and the thinning of the multilayer body 12.

Furthermore, according to the laminated multicore cable 10 c, it is possible to suppress the generation of low frequency noise from the signal lines 20 and 21, similarly to the laminated multicore cable 10.

Further, according to the laminated multi-core cable 10c, it is possible to ensure isolation for the following reasons. More specifically, in the laminated multicore cable 10c, the characteristic impedance Z1 of the signal line 20 in the portion overlapping the opening 30 is higher than the characteristic impedance Z2 of the signal line 20 in the portion overlapping the bridge portion 32. Therefore, when a high-frequency signal is transmitted through the signal line 20, the portion of the signal line 20 that overlaps the opening 30 becomes an antinode that maximizes the voltage amplitude. A portion of the signal line 20 that overlaps the bridge portion 32 becomes a node where the amplitude of the voltage is minimized. For the same reason, the portion of the signal line 21 that overlaps the opening 31 becomes an antinode that maximizes the voltage amplitude. A portion of the signal line 21 that overlaps the bridge portion 33 becomes a node where the amplitude of the voltage is minimized.

Here, in the laminated multicore cable 10c, as described above, the bridge portion 32 is located at the center of the opening 31 in the x-axis direction. Thereby, the node in the signal line 20 and the antinode in the signal line 21 are adjacent to each other in the y-axis direction. Further, in the laminated multicore cable 10c, the bridge portion 33 is located at the center of the opening 30 in the x-axis direction. Thereby, the antinodes in the signal line 20 and the nodes in the signal line 21 are adjacent to each other in the y-axis direction. At the nodes in the signal lines 20 and 21, the potential hardly fluctuates. Therefore, fluctuations in potential at nodes in the signal lines 20 and 21 have little effect on fluctuations in potential at the antinodes in the signal lines 20 and 21. Further, the fluctuation of the potential at the nodes of the signal lines 20 and 21 is hardly affected by the fluctuation of the potential at the antinodes of the signal lines 20 and 21. Therefore, the fluctuation of the potential of the signal line 20 and the fluctuation of the potential of the signal line 21 are hardly affected by each other. As a result, in the multilayer multicore cable 10c, it is possible to ensure isolation.

(Fourth modification)
The laminated multicore cable 10d according to the fourth modification will be described below with reference to the drawings. FIG. 13 is an external perspective view of a laminated multicore cable 10d according to a fourth modification. FIG. 14 is an exploded perspective view of the multi-core cable 10d according to the fourth modification in the parallel running region A1.

As shown in FIG. 13, the laminate 12 extends in the x-axis direction and has a structure branched into two at each of an end on the positive direction side and an end on the negative direction side in the x-axis direction. is doing. As shown in FIG. 14, the laminate 12 is configured by laminating a protective layer 14 and dielectric sheets (base material layers) 18a to 18e in this order from the positive direction side to the negative direction side in the z-axis direction. It is a flexible laminate. Hereinafter, the main surface on the positive direction side in the z-axis direction of the stacked body 12 is referred to as a front surface, and the main surface on the negative direction side in the z-axis direction of the stacked body 12 is referred to as a back surface.

The dielectric sheets 18a to 18e have the same shape as the stacked body 12 when viewed in plan from the z-axis direction. The dielectric sheets 18a to 18e are made of a flexible thermoplastic resin such as polyimide. The thickness of the dielectric sheets 18a to 18e after lamination is, for example, 25 μm to 200 μm. Hereinafter, the main surface on the positive side in the z-axis direction of the dielectric sheets 18a to 18e is referred to as the front surface, and the main surface on the negative direction side in the z-axis direction of the dielectric sheets 18a to 18e is referred to as the back surface.

The ground conductor 22 (first ground conductor) is provided in the multilayer body 12 as shown in FIG. 14, and more specifically, is provided on the surface of the dielectric sheet 18a. The ground conductor 22 has substantially the same shape as the multilayer body 12 when viewed in plan from the z-axis direction, and is made of a metal material having a small specific resistance mainly composed of silver or copper.

As shown in FIG. 14, the ground conductor 24 (second ground conductor) is provided in a layer different from the ground conductor 22 in the multilayer body 12, and more specifically, provided on the surface of the dielectric sheet 18e. Yes. The ground conductor 24 has substantially the same shape as the multilayer body 12 when viewed in plan from the z-axis direction, and is made of a metal material having a small specific resistance mainly composed of silver or copper.

As shown in FIG. 14, the signal line 20 is provided between the ground conductor 22 and the ground conductor 24 in the z-axis direction, and more specifically, is provided on the surface of the dielectric sheet 18b. The signal line 20 overlaps with the ground conductors 22 and 24 when viewed in plan from the z-axis direction. As a result, the signal line 20 and the ground conductors 22 and 24 have a stripline structure. The signal line 20 is made of a metal material having a small specific resistance mainly composed of silver or copper.

As shown in FIG. 14, the signal line 21 is provided between the ground conductor 22 and the ground conductor 24 in the z-axis direction and closer to the ground conductor 24 than the signal line 20. Is provided on the surface of the dielectric sheet 18d. The signal line 21 extends along the signal line 20 in the parallel region A1 when viewed in plan from the z-axis direction. However, the signal line 20 and the signal line 21 intersect at the center in the x-axis direction of the parallel region A1 when viewed in plan from the z-axis direction.

Here, the ground conductor 22 is provided with a plurality of rectangular openings 30 as shown in FIG. The plurality of openings 30 are provided so as to overlap with the signal line 20 and to be arranged along the signal line 20 when viewed in plan from the z-axis direction.

Further, in the ground conductor 22, a mesh portion 22 f is provided at a position overlapping the portion where the signal line 20 and the signal line 21 intersect when viewed in plan from the z-axis direction. Similarly, in the ground conductor 24, a mesh portion 24f is provided at a position overlapping the portion where the signal line 20 and the signal line 21 intersect when viewed in plan from the z-axis direction. The mesh portions 22f and 24f are configured by arranging a plurality of linear conductors extending in the x-axis direction and a plurality of linear conductors extending in the y-axis direction in a net shape.

The multi-core cable 10d is further provided with a ground conductor 50. The ground conductor 50 overlaps with a portion where the signal line 20 and the signal line 21 intersect when viewed in plan from the z-axis direction, and between the signal line 20 and the signal line 21 in the z-axis direction. Is provided. Specifically, the ground conductor 50 is provided on the surface of the dielectric sheet 18c. The ground conductor 50 is connected to the ground conductors 22 and 24 by via-hole conductors.

The protective layer 14 covers substantially the entire surface of the dielectric sheet 18a. Thereby, the protective layer 14 covers the ground conductor 22. The protective layer 14 is made of a flexible resin such as a resist material, for example.

The other configuration of the laminated multi-core cable 10d is the same as that of the laminated multi-core cable 10, and a description thereof will be omitted.

The laminated multi-core cable 10d is used as described below. FIG. 15 is a plan view of the electronic device 200 in which the laminated multicore cable 10d is used from the z-axis direction.

The electronic device 200 includes a laminated multicore cable 10d, circuit boards 202a and 202b, a battery pack (metal body) 206, a casing 210, and an antenna 212.

The battery pack 206 is a lithium ion secondary battery, for example, and has a structure in which the surface is covered with a metal cover. The circuit board 202a, the battery pack 206, and the circuit board 202b are arranged in this order from the negative direction side to the positive direction side in the x-axis direction. The antenna 212 is connected to the circuit board 202a.

The laminated multicore cable 10d connects between the circuit board 202a and the circuit board 202b. Further, the surface of the laminate 12 (more precisely, the protective layer 14) is in contact with the battery pack 206. The surface of the laminate 12 and the battery pack 206 are fixed with an adhesive or the like.

According to the laminated multicore cable 10d configured as described above, similarly to the laminated multicore cable 10, the opening 30 that overlaps the signal line 20 is provided in the ground conductor 22, and the opening 31 that overlaps the signal line 21 is grounded. By providing the conductor 24, it is possible to achieve both the securing of the isolation and the thinning of the multilayer body 12.

Further, according to the laminated multicore cable 10 d, it is possible to suppress the generation of low frequency noise from the signal lines 20 and 21 as in the laminated multicore cable 10.

Further, in the laminated multicore cable 10d, when viewed in plan from the z-axis direction, the signal line 20 and the signal line 21 overlap with a crossing portion, and the signal line 20 and the signal line in the z-axis direction are overlapped. 21 is provided with a ground conductor 50. Thereby, the isolation between the signal line 20 and the signal line 21 can be ensured.

Furthermore, in the laminated multi-core cable 10d, mesh portions 22f and 24f are provided at positions overlapping the portion where the signal line 20 and the signal line 21 intersect when viewed in plan from the z-axis direction. . Thereby, in the part where the signal line 20 and the signal line 21 intersect, it is difficult to form a capacitance between the signal lines 20 and 21 and the mesh portions 22f and 24f. Therefore, the line widths of the signal lines 20 and 21 can be increased in such portions. As a result, the resistance values of the signal lines 20 and 21 are reduced, and the high-frequency resistance in the laminated multicore cable 10d is reduced.

(Fifth modification)
The laminated multicore cable 10e according to the fifth modification will be described below with reference to the drawings. FIG. 16 is an exploded perspective view of the connecting portion 12c of the multilayer multicore cable 10e according to the fifth modification. FIG. 14 is used as an external perspective view of the multilayer multicore cable 10e.

The laminated multicore cable 10e is different from the laminated multicore cable 10d in that a floating conductor 60 is provided in the opening 30. More specifically, the floating conductor 60 is provided on the surface of the dielectric sheet 18 a and is located in the opening 30. The floating conductor 60 is not connected to the signal lines 20 and 21 (the signal line 20 is not shown) and the ground conductors 22 and 24 and is kept at a floating potential. The floating potential is a potential between the potential of the signal lines 20 and 21 (the signal line 20 is not shown) and the ground potential.

According to the laminated multicore cable 10e configured as described above, similarly to the laminated multicore cable 10, an opening 30 that overlaps the signal line 20 (the signal line 20 is not shown) is provided in the ground conductor 22. By providing the opening 31 that overlaps the signal line 21 in the ground conductor 24, it is possible to achieve both the securing of isolation and the reduction in thickness of the multilayer body 12.

Furthermore, according to the laminated multicore cable 10e, it is possible to suppress the generation of low-frequency noise from the signal line 20 (the signal line 20 is not shown) as in the laminated multicore cable 10.

Furthermore, the laminated multi-core cable 10 e is bonded to the battery pack 206 so that the protective layer 14 contacts the battery pack 206. Therefore, the ground conductor 22 faces the battery pack 206. Therefore, the floating conductor 60 is provided in the opening 30 of the ground conductor 22, thereby preventing the signal line 20 (the signal line 20 is not shown) and the battery pack 206 from facing each other through the opening 30. Thereby, it is reduced that noise is radiated from the opening 30. As a result, even if the material and interval of the laminate 12 vary, the high-frequency characteristics of the signal line 20 (the signal line 20 is not shown) are less likely to vary.

(Other embodiments)
The laminated multi-core cable according to the present invention is not limited to the laminated multi-core cables 10, 10a to 10e, and can be changed within the scope of the gist thereof.

FIG. 17 is a cross-sectional structure diagram of a laminated multicore cable 10f according to another embodiment. As shown in FIG. 17, signal lines 20a to 20c and signal lines 21a to 21c may be provided.

FIG. 18 is a cross-sectional view of a laminated multicore cable 10g according to another embodiment. As shown in FIG. 18, the laminated multicore cable 10g may have a structure in which the laminated multicore cable 10f is stacked in two stages in the z-axis direction.

In addition, you may use combining the structure of the laminated | multilayer type | mold multi-core cable 10, 10a-10e.

It should be noted that an area where the signal line 20 and the ground conductor 24 do not overlap may be provided in a part of the parallel running area A1 of the multilayer multicore cables 10, 10a to 10e. That is, in a part of the parallel region A1, the signal line 20 and the ground conductor 22 may have a microstrip line structure. Similarly, a region where the signal line 21 and the ground conductor 22 do not overlap may be provided in a part of the parallel running region A1 of the multilayer multicore cables 10 and 10a to 10e. Thereby, it becomes possible to bend the laminated body 12 easily in this area | region.

The present invention is useful for laminated multi-core cables, and is particularly excellent in that isolation can be secured.

10, 10a to 10e Multi-core cable 12 Laminated body 14, 15 Protective layer 16a to 16d External terminal 18a to 18e Dielectric sheet 20, 21 Signal line 22, 24 Ground conductor 30, 31 Opening 32, 33 Bridge part

Claims (6)

  1. A laminate in which a plurality of base material layers are laminated;
    A first ground conductor provided in the laminate;
    A second ground conductor provided in a different layer from the first ground conductor in the laminate;
    A first signal line provided between the first ground conductor and the second ground conductor in the stacking direction;
    A second signal line provided between the first ground conductor and the second ground conductor in the stacking direction and closer to the second ground conductor than the first signal line. The second signal line extending along the first signal line when viewed in plan from the stacking direction in the predetermined region;
    With
    The first ground conductor is provided with a first opening that overlaps the first signal line when viewed in plan from the stacking direction in the predetermined region.
    Multi-core cable that features
  2. The second ground conductor is provided with a second opening that overlaps the second signal line when viewed in plan from the stacking direction in the predetermined region.
    The laminated multi-core cable according to claim 1.
  3. A plurality of the first openings are arranged along the first signal line;
    A plurality of the second openings are arranged along the second signal line;
    The laminated multi-core cable according to claim 2.
  4. The first signal line is overlapped with a first bridge portion of the first ground conductor provided between the first openings adjacent to each other when viewed in plan from the stacking direction,
    The second signal line is overlapped with the second bridge portion of the second ground conductor provided between the adjacent second openings when viewed in plan from the stacking direction,
    The first bridge portion is located at the center of the second opening in the direction in which the first signal line extends,
    The second bridge portion is located at the center of the first opening in the direction in which the second signal line extends;
    The laminated multi-core cable according to claim 3.
  5. The first signal line and the second signal line intersect each other in the predetermined region when viewed in plan from the stacking direction,
    The laminated multi-core cable is
    When viewed in plan from the stacking direction, the first signal line and the second signal line overlap each other, and between the first signal line and the second signal line. The third ground conductor provided in the
    More
    The laminated multi-core cable according to any one of claims 1 to 4, wherein:
  6. The laminate has flexibility;
    The laminated multi-core cable according to any one of claims 1 to 5, wherein:
PCT/JP2013/052695 2012-01-06 2013-02-06 Layered multi-core cable WO2013190859A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012-137616 2012-06-19
JP2012137616A JP5477422B2 (en) 2012-01-06 2012-06-19 High frequency signal line

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201380012033.1A CN104205249B (en) 2012-06-19 2013-02-06 Cascade type multicore cable
US14/480,767 US9781832B2 (en) 2012-01-06 2014-09-09 Laminated multi-conductor cable

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/480,767 Continuation US9781832B2 (en) 2012-01-06 2014-09-09 Laminated multi-conductor cable

Publications (1)

Publication Number Publication Date
WO2013190859A1 true WO2013190859A1 (en) 2013-12-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/052695 WO2013190859A1 (en) 2012-01-06 2013-02-06 Layered multi-core cable

Country Status (2)

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CN (2) CN106602193B (en)
WO (1) WO2013190859A1 (en)

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CN106602193A (en) 2017-04-26
CN106602193B (en) 2020-01-17
CN104205249A (en) 2014-12-10

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