WO2013179482A1 - Élément électroluminescent organique et son procédé de fabrication - Google Patents

Élément électroluminescent organique et son procédé de fabrication Download PDF

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Publication number
WO2013179482A1
WO2013179482A1 PCT/JP2012/064287 JP2012064287W WO2013179482A1 WO 2013179482 A1 WO2013179482 A1 WO 2013179482A1 JP 2012064287 W JP2012064287 W JP 2012064287W WO 2013179482 A1 WO2013179482 A1 WO 2013179482A1
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WO
WIPO (PCT)
Prior art keywords
organic
light emitting
elastic piece
electrode
light
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Application number
PCT/JP2012/064287
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English (en)
Japanese (ja)
Inventor
佑生 寺尾
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パイオニア株式会社
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Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to PCT/JP2012/064287 priority Critical patent/WO2013179482A1/fr
Publication of WO2013179482A1 publication Critical patent/WO2013179482A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling

Definitions

  • the present invention relates to an organic EL (Electro Luminescence) light emitting element having a heat dissipation structure and a method for manufacturing the same.
  • organic EL Electro Luminescence
  • Patent Document 1 discloses an organic EL display device including a conductive tape that connects a metal frame surrounding a substrate on which an organic EL light emitting element is formed and a terminal that supplies a predetermined potential to the conductive film. With this configuration, heat generated in the terminal is transmitted to the metal frame via the conductive tape and radiated.
  • Patent Document 2 a through hole is formed in the sealing substrate in order to connect the element electrode formed on the substrate and the conductive film on the back surface of the sealing substrate provided on the organic EL light emitting element.
  • a formed organic EL light emitting panel is disclosed. The element electrode and the conductive film are electrically connected via a conductive material filled in the through hole, and can effectively dissipate heat generated by the light-emitting panel.
  • the organic EL display device disclosed in Patent Document 1 requires a conductive tape that is a dedicated member for conduction. Further, as shown in FIG. 5B of Patent Document 1, a step of arranging the conductive tape so as to be wound from the terminal to the metal frame is required, which takes time and increases the cost.
  • the organic EL light emitting panel disclosed in Patent Document 2 requires a through hole and a conductive material filled therein.
  • a process for forming a through hole in the sealing substrate and a process for electrically connecting the element electrode and the conductive film by filling the through hole with a conductive substance are required, it takes time and cost. It will increase.
  • the present invention has been made in view of the above-described problems, and an object thereof is to provide an organic EL light-emitting element having a high heat dissipation effect and a simple heat dissipation structure, and a method for manufacturing such an element.
  • An organic EL light emitting device comprises a transparent substrate, an organic layer including an organic EL light emitting layer and first and second electrode layers sandwiching the organic layer, a light emitting portion provided on the transparent substrate, and the light emitting portion.
  • An organic EL light-emitting element including a heat sink bonded through an elastic piece, which is a part of the heat sink and includes an elastic piece installed in a space between the heat sink and the extraction electrode.
  • the organic EL light emitting device manufacturing method includes a transparent substrate, an organic layer including an organic EL light emitting layer, and a first and second electrode layers sandwiching the organic layer, a light emitting portion provided on the transparent substrate, and the light emission.
  • An organic EL light emitting device manufacturing method for manufacturing an element comprising: a preparation step of preparing the organic EL light emitting structure and a heat dissipation plate having an elastic piece in part; and only an end of the elastic piece is the drawer An adhesion step of adhering the heat radiating plate to an outer surface of the sealing body so as to be in contact with an electrode.
  • FIG.6 shows the structure of the organic electroluminescent light emitting element which is an Example of this invention. It is a figure which shows an example of the laminated structure of the light emission part of FIG. It is a perspective view of the elastic piece vicinity of FIG. It is a figure which shows the example of the area
  • FIG. 1 shows the configuration of an organic EL light emitting device 10 which is an embodiment of the present invention.
  • the light emitting part 3 is formed on the transparent substrate 1.
  • the light emitting unit 3 includes an organic layer 31 and a first electrode layer (anode) 32 and a second electrode layer (cathode) 33 sandwiching the organic layer 31.
  • the light emitting unit 3 is formed such that the first electrode layer 32 is on the transparent substrate 1 side and the second electrode layer 33 is on the opposite side of the transparent substrate 1.
  • the organic layer 31 is typically formed by laminating a hole injection layer 31a, a hole transport layer 31b, a light emitting layer 31c, an electron transport layer 31d, and an electron injection layer 31e.
  • the light emitting layer 31c is made of an organic EL material.
  • the organic EL material for example, any known material such as a fluorescent material or a phosphorescent material can be applied.
  • Examples of fluorescent materials that emit blue light include naphthalene, perylene, and pyrene.
  • fluorescent materials that give green light emission include quinacridone derivatives, coumarin derivatives, and aluminum complexes such as Alq3 (tris (8-hydroxy-quinoline) aluminum).
  • Examples of fluorescent materials that give yellow light include rubrene and perimidone derivatives.
  • Examples of fluorescent materials that give red light emission include DCM (4- (dicyanomethylene) -2-methyl-6- (p-dimethylaminostyryl) -4H-pyran) compounds, benzopyran derivatives, rhodamine derivatives, and the like.
  • Examples of the phosphorescent material include ruthenium, rhodium, and palladium. Specific examples of the phosphorescent material include tris (2-phenylpyridine) iridium (so-called Ir (ppy) 3), tris (2-phenylpyridine) ruthenium, and the like.
  • the first electrode layer 32 is made of a light transmissive electrode layer
  • the second electrode layer 33 is made of a light reflective electrode layer.
  • the light transmissive electrode material for example, ITO (Indium-tin-oxide) or FTO (fluorine-tin-oxide) is used.
  • a material such as ZnO, ZnO—Al 2 O 3 (so-called AZO), In 2 O 3 —ZnO (so-called IZO), SnO 2 —Sb 2 O 3 (so-called ATO), RuO 2, or the like can also be used.
  • the light reflective electrode material Al, Ag, MgAg alloy or the like is used.
  • the transparent substrate 1 is made of a light transmissive material such as a resin film such as glass, polyester, polymethacrylate, polycarbonate, or polysulfone.
  • the light emitted from the light emitting unit 3 is output through the transparent substrate 1.
  • the sealing can 4 is a hollow sealing body having a hollow portion 41, contacts the transparent substrate 1 around the light emitting portion 3, and seals the light emitting portion 3 on the transparent substrate 1 in the hollow portion 41. To do.
  • the sealing body 4 has a flat outer surface 4a (hereinafter referred to as a bottom surface 4a).
  • the bottom surface 4 a can be formed parallel or substantially parallel to the surface of the transparent substrate 1.
  • the edge of the side surface 4 b of the sealing body 4 is bonded and fixed on the transparent substrate 1 by the sealing can adhesive layer 7.
  • the sealing can 4 is made of, for example, a synthetic resin such as plastic, or a metal such as glass or stainless steel.
  • the sealing method is not limited to hollow sealing, For example, solid sealing and film
  • the extraction electrode 2 is an electrode for electrically connecting an external circuit (not shown) such as a power source and the electrode layer (the anode 32 or the cathode 33 in FIG. 2) of the light emitting unit 3.
  • the extraction electrode 2 is drawn out of the sealing can 4 from the electrode layer of the light emitting unit 3 through the sealing can adhesive layer 7.
  • power is supplied to the electrode layer of the light emitting unit 3 from the power source (not shown) as an external circuit via the extraction electrode 2.
  • the extraction electrode 2 may be transparent or opaque.
  • the extraction electrode 2 can be formed using, for example, ITO (Indium-tin-oxide), FTO (fluorine-tin-oxide), Al, or Ag.
  • the heat radiating plate 6 is a member for radiating heat generated in the light emitting unit 3, and includes a heat radiating unit 60 and an elastic piece 61.
  • the heat dissipating part 60 is formed in a plate shape, and one surface thereof is bonded to the bottom surface 4 a of the sealing can 4 by the metal plate adhesive layer 5. From the viewpoint of enhancing the heat dissipation effect, the heat dissipation portion 60 is desirably formed over the entire bottom surface 4a of the sealing can 4.
  • the elastic piece 61 is installed in the space between the heat radiation part 60 and the extraction electrode 2.
  • the elastic piece 61 has two bent portions 611 and 612 and a contact portion 613.
  • the contact portion 613 is pressed against the extraction electrode 2 by elasticity generated by at least one of the bent portions 611 and 612, and reliably contacts the extraction electrode 2. At this time, since the elastic piece 61 is deformed by the elastic force, a space is generated between the side surface 4 b of the sealing can and the elastic piece 61.
  • the heat radiation part 60 and the elastic piece 61 are made of a metal such as aluminum or copper, for example.
  • the heat radiation part 60 and the elastic piece 61 can be integrally formed.
  • the elastic piece 61 may be a part of the heat sink 6.
  • a part of the heat radiating plate 6 extends from the side of the heat radiating portion 60 to the outside of the side surface of the sealing can 4 to form the bent portions 611 and 612 and the contact portion 613, and at the end of the extended portion. It can also be said that the contact portion 613 located is in contact with the extraction electrode 2.
  • the surface of the heat sink 6 may be coated with a resin or an oxide film for rust prevention or insulation.
  • the upper surface of the heat dissipation portion 60 may be processed into an uneven shape.
  • the heat sink 6 can be formed using metal oxides, such as ceramics.
  • the heat sink 6 is not limited to metal or metal oxide, and a material having high thermal conductivity can be used.
  • FIG. 3 shows a perspective view of the vicinity of the elastic piece 61.
  • the elastic piece 61 is formed as a part of the heat radiating part 60, and the contact part 613 located at or near the tip of the elastic piece 61 is in contact with the extraction electrode 2.
  • the contact portion 613 is preferably in surface contact with the extraction electrode 2.
  • the contact portion 613 is pressed against and brought into contact with the extraction electrode 2 by elasticity generated by at least one of the bent portions 611 and 612.
  • two or more elastic pieces 61 may be formed, and each of the contact portions 613 may be in contact with the extraction electrode 2 separately.
  • the heat radiating portion 60 is provided on the bottom surface 4a of the sealing can 4 and the electrode layer 32 or 33 (FIG. 2) of the light emitting portion 3 is provided.
  • An elastic piece 61 is provided to connect the lead-out wiring 2 drawn from one side and the heat radiating portion 60.
  • the heat generated in the light emitting part 3 is transmitted to the sealing can 4 through the hollow part 41 in the sealing can 4 or the sealing can adhesive layer 7 and is radiated by the heat radiating part 60, and the drawing wiring 2 and elasticity It is transmitted to the heat radiating part 60 through the piece 61 and radiated.
  • the heat dissipation effect of the light emitting unit 3 can be enhanced.
  • the electrode layer has a higher thermal conductivity than the hollow portion 41 and the sealing can adhesive layer 7, the heat generated in the light emitting portion 3 can be effectively radiated.
  • the organic EL light emitting device 10 of the present embodiment there is an advantage that it is easy to manufacture at low cost because it does not require a separate part such as the conductive tape of Patent Document 1 and does not require a process of laying the separate part. is there. Further, in the organic EL light emitting device 10 of the present embodiment, there is no need to provide a through hole in the substrate and fill it with a conductive material as in Patent Document 2, for example, regardless of the material of the substrate, and the manufacturing process is simplified. There is also an effect that can be made.
  • the elastic piece 61 is also only on the one side.
  • the elastic piece 61 can also be provided on the two or more sides.
  • two or more lead wires 2 are provided for one side of the heat radiating unit 60, two or more elastic pieces 61 can be provided for the one side.
  • the effect of transferring the heat generated in the light emitting part 3 (FIG. 1) to the heat radiating part 60 is enhanced.
  • the effect can be further improved.
  • FIG. 5 shows another example of the shape of the elastic piece 61.
  • the elastic piece 61 in FIG. 3 extends in a direction perpendicular to the side of the heat radiating unit 60, but may be provided in parallel to the side of the heat radiating unit 60 as shown in FIG. 5.
  • the bent portions 611a and 612a and the bent portions 611b and 612b are formed in opposite directions, and two 613a and 613b are in contact with one extraction electrode 2.
  • the protruding length from the sealing can is determined by the width of the elastic piece 61, so that even when the bending radius of the bent portions 611 a, 611 b, 612 a, and 612 b is large, the space is saved. .
  • FIG. 6 shows an example of the cross-sectional shape of the elastic piece 61.
  • the elastic piece 61 can have two bent portions 611 and 612 that are bent in directions opposite to each other.
  • the elastic piece 61 may have two bent portions 611 and 612 that bend in the same direction.
  • the elastic piece 61 can have only one bent portion 611.
  • the elastic piece 61 has only one bent portion 611, and the contact portion 613 can make point contact with the extraction electrode 2 (FIG. 1). .
  • the thickness of the elastic piece 61 can be made thinner than the thickness of the heat radiating portion 60.
  • the contact portion 613 is pressed against the extraction electrode 2 (FIG. 1) by elasticity generated by the bent portion 611 and / or the bent portion 612.
  • the electrode 2 can be reliably contacted.
  • the contact portion 613 can be brought into point contact with the extraction electrode 2 as shown in FIG.
  • the contact portion 613 is chamfered, and the mobility on the extraction electrode 2 is increased.
  • the contact part 613 is pressed on the extraction electrode 2, the two bending parts 611 and 612 may substantially occur.
  • the elastic piece 61 is thinned as shown in FIG.
  • the bending radii of the bent portions 611 and 612 are reduced. Therefore, the length L1 of the elastic piece 61 in the direction perpendicular to the side of the heat radiating portion 60 can be reduced. Thereby, the mounting area of the organic EL light emitting element 10 can be increased.
  • FIG. 8 shows an organic EL light emitting device 10 having two heat radiating plates (hereinafter also referred to as heat radiating pieces) 6a and 6b.
  • the heat radiating portion 60 a of the heat radiating plate 6 a is bonded to a partial region of the bottom surface 4 a of the sealing can 4 via the adhesive layer 5.
  • the heat radiating portion 60 b of the heat radiating plate 6 b is bonded to a part of the region other than the region of the bottom surface 4 a of the sealing can 4 via the adhesive layer 5.
  • the heat radiation part 60a and the heat radiation part 60b are electrically insulated from each other.
  • the elastic piece 61a of the heat radiating plate 6a is installed in a space between the heat radiating portion 60a and the extraction electrode piece 2a drawn from the anode 32 (FIG. 2) of the light emitting portion 3. A part of the elastic piece 61a is in contact with the extraction electrode piece 2a.
  • the elastic piece 61b of the heat radiating plate 6b is installed in a space between the heat radiating portion 60b and the extraction electrode piece 2b from the cathode 33 (FIG. 2) of the light emitting portion 3. A part of the elastic piece 61b is in contact with the extraction electrode piece 2b.
  • the heat sink 6a and the heat sink 6b are electrically insulated from each other.
  • the heat generated in the light emitting unit 3 can be radiated by the heat radiating plates 6a and 6b through the anode 32 and the cathode 33 (FIG. 2), respectively. Therefore, the heat effect of the organic EL light emitting element 10 can be further enhanced.
  • FIG. 9 shows an example of the arrangement of the heat sinks 6a and 6b when the organic EL light emitting element 10 is viewed from above.
  • the heat radiating plate 6a and the heat radiating plate 6b can be arranged in parallel on the bottom surface 4a (FIG. 8) of the sealing can 4.
  • the heat radiating plate 6 a and the heat radiating plate 6 b are electrically insulated on the bottom surface 4 a of the sealing can 4.
  • the elastic pieces 61a and 61b are freely provided according to the drawing position of the drawing wiring 2 (FIG. 1). For example, as shown in FIG.
  • one heat radiating plate 6a is provided with an elastic piece 61a at one end in the longitudinal direction of the heat radiating portion 60a, and the other heat radiating plate 6b is on the opposite side.
  • An elastic piece 61b can be provided at the end.
  • one heat radiating plate 6a is provided with an elastic piece 61a at the end in the longitudinal direction of the heat radiating portion 60a, and the other heat radiating plate 6b is also an end on the same side.
  • the elastic piece 61b can be provided on the surface. Further, as shown in FIG.
  • one heat radiating plate 6a is provided with an elastic piece 61a at the end portion in the short direction of the heat radiating portion 60a, and the other heat radiating plate 6b is on the opposite end.
  • the elastic piece 61b can be provided in the part.
  • bottom surface 4a (FIG. 8) is a square when the sealing can 4 is viewed from above, as shown in FIGS. 9 (d) and 9 (e), at least the two opposite sides of the square can be seen.
  • the heat sink 6a and / or the heat sink 6b may be formed in a portion corresponding to the side.
  • the elastic piece 61a1 and the elastic piece 61a2 are provided in two portions respectively corresponding to the two sides.
  • the elastic piece 61a1 is brought into contact with the extraction electrode piece 2a (FIG. 8) drawn from one of the two sides, and the elastic piece 61a2 is brought into contact with the extraction electrode piece 2b (FIG. 8) drawn from the other side.
  • the extraction electrode in contact with the elastic piece 61a1 and the extraction electrode in contact with the elastic piece 61a2 are the same electrode (for example, an anode).
  • the heat radiating portion 60b of the heat radiating plate 6b is disposed on the bottom surface 4a of the sealing can 4 so as to be electrically insulated from the heat radiating plate 6a.
  • the elastic piece 61b of the heat radiating plate 6b can be brought into contact with, for example, an extraction electrode (FIG. 8) extracted from the anode.
  • the heat radiating part 60a in FIG. 9 (e) has an E shape composed of two parts corresponding to the two sides and a part connecting the two parts.
  • the elastic piece 61a1 and the elastic piece 61a2 are provided in two portions respectively corresponding to the two sides.
  • the elastic piece 61a1 is brought into contact with the extraction electrode piece 2a (FIG. 8) drawn from one of the two sides, and the elastic piece 61a2 is brought into contact with the extraction electrode piece 2b (FIG. 8) drawn from the other side.
  • the extraction electrode in contact with the elastic piece 61a1 and the extraction electrode in contact with the elastic piece 61a2 are the same pole (for example, an anode).
  • the heat radiating portion 60b of the heat radiating plate 6b and the heat radiating portion 60c of the heat radiating plate 6c are disposed on the bottom surface 4a of the sealing can 4 so as to be electrically insulated from the heat radiating plate 6a.
  • the elastic piece 61b of the heat radiating plate 6b and the elastic piece 61c of the heat radiating plate 6c can be brought into contact with, for example, an extraction electrode (FIG. 8) drawn from the cathode.
  • the heat radiating plate 6a also has an effect as an auxiliary electrode for the electrode. That is, in general, the thin film electrode layer has a large sheet resistance, but the heat radiation part 60a made of a metal plate having a sufficient thickness compared to the electrode layer has a very small sheet resistance, so that a current flows easily. In particular, a transparent electrode such as ITO has a larger sheet resistance than a metal electrode, so that the auxiliary electrode effect is also increased.
  • FIG. 10 shows an organic EL light-emitting element 10 having two heat radiating plates (also referred to as heat radiating pieces) 6a and 6b.
  • the heat radiating portion 60 a of the heat radiating plate 6 a is bonded to the bottom surface 4 a of the sealing can 4 via the adhesive layer 51.
  • the elastic piece 61a of the heat radiating plate 6a is installed in a space between the heat radiating part 60a and the extraction electrode piece 2a from the anode 32 (FIG. 2) of the light emitting part 3. A part of the elastic piece 61a is in contact with the extraction electrode piece 2a.
  • the heat radiating portion 60b of the heat radiating plate 6b is bonded to the upper surface of the heat radiating portion 60a of the heat radiating plate 6a through the adhesive layer 52.
  • the elastic piece 61b of the heat radiating plate 6b is installed in a space between the heat radiating portion 60b and the extraction electrode piece 2b from the cathode 33 (FIG. 2) of the light emitting portion 3. A part of the elastic piece 61b is in contact with the extraction electrode piece 2b.
  • the adhesive layer 52 is an insulator, and the heat sink 6a and the heat sink 6b are electrically insulated from each other.
  • the heat generated in the anode 32 (FIG. 2) of the light emitting unit 3 is radiated by the one heat radiating plate 6a and generated in the cathode 33 (FIG. 2) of the light emitting unit 3. Heat can be radiated by the other heat radiating plate 6b. Therefore, the heat effect of the organic EL light emitting element 10 can be further enhanced.
  • Method for Manufacturing Organic EL Light Emitting Element Hereinafter, the manufacturing process of the organic EL light emitting element 10 will be described with reference to FIG.
  • a heat radiating plate 6 having a plate-like heat radiating portion 60 and an elastic piece 61 integrally formed therewith, and a light emitting portion 3 are formed on the transparent substrate 1 and sealed.
  • a pre-adhesion light emitting element 11 sealed with a can 4 is prepared.
  • the heat sink 6 is made of a metal such as aluminum or copper.
  • the elastic piece 61 is formed to have bent portions 611 and 612 and a contact portion 613. From the electrode layer (for example, the anode 32 in FIG. 2) of the light emitting unit 3, the lead wiring 2 is led out to the outside of the sealing can 4 through the sealing can adhesive layer 7.
  • the light emitting element 11 before bonding is placed on the base 20 with the transparent substrate 1 side facing down.
  • the pedestal 20 is made of a material such as metal having a strength that can withstand pressing in a later process.
  • a resin film may be formed on the surface of the base 20.
  • an adhesive is applied on the bottom surface 4 a of the sealing can 4 to form the adhesive layer 5.
  • alignment is performed so that the contact portion 613 of the elastic piece 61 contacts the lead-out wiring 2, and the adhesive surface 6 c of the heat radiating portion 60 is placed on the adhesive layer 5.
  • the pressure plate 30 is placed on the heat radiating surface 6 d of the heat radiating portion 60 and pressure is applied from above the press plate 30.
  • the bonding surface 6 c of the heat radiating unit 60 and the bottom surface 4 a of the sealing can 4 are bonded via the bonding layer 5, and at the same time, the contact portion 613 of the elastic piece 61 is pressed onto the lead-out wiring 2.
  • a bending stress is generated in the elastic piece 61, and the contact portion 613 is reliably in contact with the lead-out wiring 2.
  • the press plate 30 is removed after the adhesive layer 5 is cured. It waits for a predetermined time such as 10 minutes until the adhesive 6 is cured. At this time, in order to accelerate the curing of the adhesive 6 and increase the adhesion, for example, a treatment such as heating from the base 40 side may be performed.
  • the contact portion 613 of the elastic piece 61 is reliably in contact with the lead-out wiring 2 due to the elasticity generated by the bent portions 611 and 612.
  • the heat dissipating part 60 is provided on the sealing can 4 and the elastic piece 61 connecting the heat dissipating part 60 and the extraction electrode 2 is provided.
  • the heat generated in the light emitting unit 3 of the organic EL light emitting element 10 is transmitted to the sealing can 4 and dissipated by the heat dissipating unit 60, and also transmitted to the heat dissipating unit 60 through the lead-out wiring 2 and the elastic piece 61. Is done. Therefore, the organic EL light emitting device 10 having a high heat dissipation effect can be easily manufactured.
  • the organic EL light-emitting element 10 that can effectively dissipate heat through an electrode layer having a high thermal conductivity can be easily manufactured.
  • the manufacturing method of the present embodiment has an advantage that it can be easily manufactured at low cost because there is no process of laying the separate part without using another part such as the conductive tape of Patent Document 1.
  • the manufacturing method of the present embodiment there is no need to provide a through hole in the substrate and fill it with a conductive material as in Patent Document 2, for example, so that it is possible to easily manufacture regardless of the material of the substrate. Play.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Cette invention concerne un élément électroluminescent organique présentant un effet de dissipation thermique élevé, et un procédé de fabrication dudit élément. Une plaque de dissipation thermique (6) est disposée sur un corps d'encapsulation (4) conçu pour encapsuler un élément électroluminescent organique avec un substrat transparent (1). Une partie de la plaque de dissipation thermique (6) est étirée de manière à former un élément élastique (61), et ledit élément élastique (61) est en contact avec le dessus d'une électrode d'extraction (2) extraite du corps d'encapsulation (4).
PCT/JP2012/064287 2012-06-01 2012-06-01 Élément électroluminescent organique et son procédé de fabrication WO2013179482A1 (fr)

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PCT/JP2012/064287 WO2013179482A1 (fr) 2012-06-01 2012-06-01 Élément électroluminescent organique et son procédé de fabrication

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Application Number Priority Date Filing Date Title
PCT/JP2012/064287 WO2013179482A1 (fr) 2012-06-01 2012-06-01 Élément électroluminescent organique et son procédé de fabrication

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017050630A1 (fr) * 2015-09-23 2017-03-30 Osram Oled Gmbh Composant luminescent plat et procédé de fabrication d'un composant luminescent plat
CN112820840A (zh) * 2021-01-07 2021-05-18 深圳市华星光电半导体显示技术有限公司 一种显示面板及显示装置

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JP2006236999A (ja) * 2005-02-22 2006-09-07 Lg Electronics Inc 有機ｅｌ素子及びその製造方法
JP2007287344A (ja) * 2006-04-12 2007-11-01 Koizumi Lighting Technology Corp Ｅｌ光源体およびｅｌ光源体の製造方法
JP2009152147A (ja) * 2007-12-21 2009-07-09 Rohm Co Ltd 有機発光装置
JP2010027934A (ja) * 2008-07-22 2010-02-04 Hitachi Displays Ltd 有機ｅｌ表示装置
JP2011165489A (ja) * 2010-02-10 2011-08-25 Lumiotec Kk 有機ｅｌ照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006236999A (ja) * 2005-02-22 2006-09-07 Lg Electronics Inc 有機ｅｌ素子及びその製造方法
JP2007287344A (ja) * 2006-04-12 2007-11-01 Koizumi Lighting Technology Corp Ｅｌ光源体およびｅｌ光源体の製造方法
JP2009152147A (ja) * 2007-12-21 2009-07-09 Rohm Co Ltd 有機発光装置
JP2010027934A (ja) * 2008-07-22 2010-02-04 Hitachi Displays Ltd 有機ｅｌ表示装置
JP2011165489A (ja) * 2010-02-10 2011-08-25 Lumiotec Kk 有機ｅｌ照明装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017050630A1 (fr) * 2015-09-23 2017-03-30 Osram Oled Gmbh Composant luminescent plat et procédé de fabrication d'un composant luminescent plat
CN112820840A (zh) * 2021-01-07 2021-05-18 深圳市华星光电半导体显示技术有限公司 一种显示面板及显示装置
CN112820840B (zh) * 2021-01-07 2022-08-23 深圳市华星光电半导体显示技术有限公司 一种显示面板及显示装置

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