WO2013166837A1 - 一种具有双平台的全自动视觉硅片印刷装置 - Google Patents

一种具有双平台的全自动视觉硅片印刷装置 Download PDF

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Publication number
WO2013166837A1
WO2013166837A1 PCT/CN2012/086894 CN2012086894W WO2013166837A1 WO 2013166837 A1 WO2013166837 A1 WO 2013166837A1 CN 2012086894 W CN2012086894 W CN 2012086894W WO 2013166837 A1 WO2013166837 A1 WO 2013166837A1
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WIPO (PCT)
Prior art keywords
silicon wafer
wafer
screen
platform
printing
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Application number
PCT/CN2012/086894
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English (en)
French (fr)
Inventor
张宪民
邝泳聪
欧阳高飞
陈家钊
韩佳鹏
Original Assignee
华南理工大学
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Publication of WO2013166837A1 publication Critical patent/WO2013166837A1/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • B41F15/0881Machines for printing on polyhedral articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/16Printing tables
    • B41F15/18Supports for workpieces
    • B41F15/26Supports for workpieces for articles with flat surfaces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Definitions

  • the present invention relates to a silicon wafer printing apparatus, and more particularly to a fully automatic visual silicon wafer printing apparatus capable of implementing dual-platform rotary printing.
  • Solar cell printing is an important process in the production line of cell sheets, which plays an important role in the quality of cell sheets.
  • Solar cell printing technology is an organic whole and is a combination of various technologies.
  • Solar cell crystallization silicon cells and thin film batteries, the current thin film battery technology has a comparative advantage in cost, but in terms of technology maturity, life and conversion efficiency are difficult to compare with crystalline silicon cells, crystalline silicon cells accounted for in the solar cell market Absolute monopoly position, the cost of unit power generation is still higher than the traditional power generation mode, so reducing costs is a key factor for the sustainable development of the crystalline silicon solar industry, and the production efficiency of crystalline silicon cells constitutes an important factor in the cost of the battery.
  • the existing printing device generally adopts a single bearing platform structure. As shown in FIG.
  • the printing device has only one carrying platform, and the silicon wafer is introduced into the silicon wafer loading device 101 from the upstream, and the silicon wafer loading device 101 There is a silicon wafer attitude adjustment function to make a preliminary correction of the silicon wafer attitude.
  • the silicon wafer then continues to pass forward along the wafer loading device 101.
  • the silicon wafer is transferred to the center of the wafer carrier platform 103, and the wafer carrier platform 103
  • the vacuum suction on the wafer is fixed.
  • the feed attitude camera 107 and the exit attitude camera 105 are movable from the wafer carrier platform 103 The two sides enter, take an image of the two edge portions of the diagonal of the silicon wafer, and take a picture of the rear entrance posture camera 107 and the exit posture camera 105.
  • Screen reference camera 102 Take a picture and get a screen printer 106 An image of the two reference points at the bottom of the screen, adjusting the screen to align the pattern on the screen with the wafer.
  • Screen Printing Machine 106 The lifting table is lowered and the ink is printed. After printing, the screen printer 106 The lifting platform is raised, the vacuum suction on the wafer carrying platform 103 is closed, and the wafer carrying platform 103 cooperates with the transport belt on the wafer unloading device 104 to move the silicon wafer from the wafer carrying platform 103 to the wafer unloading device. 104, along the wafer unloading device 104 Passed to the downstream.
  • the object of the present invention is to overcome the shortcomings of the prior art, and to provide a fully automatic visual silicon wafer printing device with dual platform, which has compact structure, high production efficiency, small floor space, and can realize parallel operation of changing and printing processes.
  • the technical solution adopted by the present invention is as follows.
  • a fully automatic visual silicon printing device with dual platforms including Two wafer carrying platforms, two in and out board inspection cameras, one screen lifting device, one screen attitude adjustment mechanism, two screen reference cameras, one ink scraping device, two sets Wafer loading device, two sets of silicon wafer unloading devices, two sets of buffer transport lines; two silicon wafer carrying platforms are mounted on a laterally moving base, alternating into the printing station for ink wiping operation
  • the ingress and egress detection camera is mounted above the changing station of the wafer carrying platform for acquiring images of the silicon wafer
  • the screen lifting device is mounted on the four support columns of the printing press for bringing the screen close to the silicon wafer and Leaving the silicon wafer to realize wafer printing, demoulding and cleaning the net bottom
  • the screen attitude adjustment mechanism is installed on the screen lifting device of the printing machine for realizing the screen XY Parallel movement and rotational positioning
  • two screen reference cameras are mounted below the screen attitude adjustment mechanism and symmetrically distributed on both sides of the wafer carrying platform at the printing station for obtaining two reference points at
  • each of the silicon wafer carrying platforms is provided with a transport belt, and a plurality of evenly distributed small holes are arranged in the middle portion of the platform, and a plurality of evenly distributed on the transport belt are also arranged.
  • Small holes which are used to suck the silicon wafer on the platform by vacuum suction; the transport belt covers the plane on the platform for supporting the silicon wafer, so that the bottom of the silicon wafer can be evenly supported during printing, thereby reducing the damage of the silicon wafer.
  • Below the platform there are slides that enable lateral movement. The structure can be implemented The change is in parallel with the printing process.
  • the screen attitude adjustment mechanism is a planar three-degree-of-freedom series mechanism capable of XY parallel movement and rotational positioning.
  • the ink wiping device comprises a scraper, a scraper back and forth motion mechanism, a scraper up and down motion mechanism and a ink return mechanism, and the scraper front and rear motion mechanism causes the scraper to move back and forth, and the scraper up and down motion mechanism causes the scraper to move up and down, the scraper up and down movement and before and after The movement achieves the imprinting of the coating onto the wafer.
  • each of the wafer loading devices is provided with two transport belts for adjusting the angle of the silicon wafer, and the vicinity of the transport belt is provided with three light senses for sensing the position of the silicon wafer, and is used under the silicon wafer loading device.
  • the bottom platform for the translational movement to adjust the lateral displacement of the wafer.
  • Each buffer transport line consists of three straight conveyor belts and two corner transfer conveyor belts.
  • the straight conveyor belt and the corner transfer conveyor belt cooperate to distribute the silicon wafer to two wafer loading devices or to the printed silicon wafer. Concentrate from two separate wafer unloaders to the same exit transport line.
  • the invention is an innovative design of a printing device on the basis of the existing single-bearing table process, and adopts a double-bearing platform structure, so that When one of the carrying platforms is changing the silicon wafer, the other carrying platform is performing silicon wafer printing, which ensures that the printing device can simultaneously perform the changing and wiping operations on the two silicon wafers, even if the printing and printing processes are parallel.
  • the present invention has the following advantages and benefits: (1)
  • the inlet and outlet plates of the invention adopt the belt transfer, the structure is simple, the movement is stable, the manufacture and installation are simple, and the maintenance is convenient;
  • the double-bearing platform structure is used to make the change of the printing process in parallel with the printing process, thereby reducing the production time and greatly improving the production efficiency per unit time of the production line; (3) The compact structure of the invention and the small occupied area of the device.
  • FIG. 1 is a schematic view of a conventional printing apparatus employing a single-bearing platform structure.
  • FIG. 2 is a schematic view showing the structure of a fully automatic visual silicon wafer printing apparatus having a dual platform according to the present invention.
  • FIG. 3 is a left side view of the fully automatic visual silicon wafer printing apparatus with dual platforms of the present invention.
  • FIG. 4 is a schematic right side view of a fully automatic vision silicon wafer printing apparatus having a dual platform of the present invention.
  • Figure 5 is a schematic view of the sheet feeding device of the present invention.
  • Figure 6 is a schematic view of the sheet discharging device of the present invention.
  • Figure 7 is a schematic illustration of a silicon wafer carrying platform of the present invention
  • Figure 8 is a front elevational view of the silicon wafer carrying platform of the present invention.
  • Figure 9 is a schematic view of a screen attitude adjusting mechanism of the present invention.
  • Figure 10 is a schematic view of the ink wiping device of the present invention.
  • Figure 11 is a schematic view of a wafer loading device of the present invention
  • Figure 12 is an assembly view of a straight-through conveyor belt and a corner transfer conveyor belt of the present invention.
  • Figure 13 is a schematic flow chart of the present invention
  • Figure 14 is a control system of the present invention.
  • the fully automatic visual silicon wafer printing device with dual platforms comprises a first silicon wafer bearing platform 1, a second silicon wafer bearing platform 2, a screen attitude adjusting mechanism 3, a squeegee device 5, and a wire.
  • Net lifting device 4 first wafer loading device 6, second wafer loading device 7, first wafer unloading device 8, second wafer unloading device 9, first screen reference camera 10, second screen
  • the first straight transport belt 14, the second straight transport belt 16, the third straight transport belt 18, the first corner transfer transport belt 15, and the second corner transfer transport belt 17 constitute a first buffer transport line;
  • the straight transport belt 19, the fifth straight transport belt 21, the sixth straight transport belt 23 and the third corner transfer transport belt 20, and the fourth corner transfer transport belt 22 constitute a second buffer transport line.
  • the role of the wafer carrier platform is to provide a flat support for the wafer when it is applied to the wafer.
  • the printing device adopts a dual silicon wafer bearing platform structure: a first silicon wafer bearing platform 1 and a second silicon wafer bearing platform 2, which can realize the parallel printing and printing process.
  • the silicon wafer bearing platform is a flat platform.
  • a wide and thin flat transport belt 26 Above the platform is a wide and thin flat transport belt 26.
  • the driving wheel and the driven wheel of the flat transport belt 26 are distributed on both sides of the platform, and the motor is arranged. 27 drive.
  • the transport belt 26 covers the plane of the platform supporting the silicon wafer 25, so that the bottom of the silicon wafer 25 can be uniformly supported during printing, thereby reducing the breakage of the silicon wafer 25.
  • a slide rail 28 below the platform is a slide rail 28 that allows lateral movement of the platform.
  • the first silicon wafer bearing platform 1 and the second silicon wafer bearing platform 12 are identical and symmetrically distributed on the susceptor 24.
  • the platform When the first silicon wafer bearing platform 1 or the second silicon wafer bearing platform 2 is below the ink wiping device 5, the platform is referred to as a printing station (as shown in FIG. 2, the second wafer carrier platform 2 is at the printing station); First silicon wafer bearing platform 1 (or the second wafer carrying platform 2) is aligned with the transport belt of the first wafer loading device 6 (or the second wafer loading device 7) to implement the position of the change, which is called a change station (Fig. 2). The first silicon wafer bearing platform 1 is at the changing station).
  • the first silicon wafer carrying platform 1 and the second silicon wafer bearing platform 2 are mounted on the same laterally movable base 24, so when the first silicon wafer carrying platform 1 enters the printing station, the second silicon wafer carrying platform 2 Moving out to the changing station; likewise, when the second wafer carrying platform 2 enters the printing station, the first wafer carrying platform 1 is moved out to the changing station.
  • the first silicon wafer loading device 6 (or the second silicon wafer loading device 7) is matched with the transportation belt on the first silicon wafer bearing platform 1 (or the second silicon wafer bearing platform 2)
  • the printed silicon wafer is transferred to the first silicon wafer carrying platform 1 (or the second silicon wafer bearing platform 2).
  • the vacuum suction silicon wafer on the open platform is sucked to prevent platform motion.
  • the silicon wafer moves when the ink is scraped; when the printed silicon wafer is unloaded, passes through the first wafer carrier platform 1 (or the second wafer carrier platform 2) and the first wafer unloading device 8 (or the second wafer unloader) 9)
  • the upper transport belt cooperates to transfer the printed silicon wafer to the first wafer unloading device 8 (or the second wafer unloading device 9).
  • the screen attitude adjusting mechanism 3 is to adjust the posture of the screen according to the posture of the silicon wafer, so that the pattern on the screen is aligned with the silicon wafer, so that the paint can be correctly transferred onto the screen.
  • the screen attitude adjusting mechanism 3 is composed of a screen holder 29, a guide wheel 30, a guide block 31, a transmission plate 32, and the like.
  • the guide block 31 is fixed to the screen holder 29, and the drive plate 32 is coupled to the screen holder 29 by bolts.
  • the guide wheel 30 is positioned unchanged but rotatable. The fit between the guide block 31 and the guide wheel 30 is as shown in the partial view on the upper right side of FIG.
  • the drive is transmitted through the drive plate 32 to the screen mount 29 to enable the screen mount 29 to move in XY translation and rotation.
  • the screen attitude adjusting mechanism 3 shown in Fig. 9 is only one of the representative mechanisms, and there are other forms of screen attitude adjusting mechanism, which will not be described too much here. Since the screen 34 is mounted on the screen attitude adjusting mechanism 3, the screen 34 can realize XY parallel movement and rotational positioning. After the screen 34 is adjusted, the screen 34 is locked to the screen attitude adjusting mechanism 3 by the screen locking cylinder 33.
  • the squeegee device 5 imprints the paint onto the silicon wafer by the up and down movement and the forward and backward movement of the squeegee.
  • the squeegee device 5 includes a squeegee 35, a squeegee up and down movement mechanism 38, a blade forward and backward movement mechanism 36, an ink return mechanism 37, and the like.
  • the blade front and rear movement mechanism 36 is driven by the motor, and the blade up and down movement mechanism 38 is pushed by the cylinder.
  • Wire mesh lifting device 4 As shown in FIG. 2, the screen attitude adjusting mechanism 3 and the wiping device 5 are mounted on the screen lifting device 4, and the screen lifting device 4 is driven by a motor when the first silicon wafer carrying platform 1 (or the second silicon wafer is loaded). Platform 2) At the printing station, the screen 34 is brought close to and away from the silicon wafer on the first wafer carrier platform 1 (or the second wafer carrier platform 2) by the screen lifting device 4 to enable wafer printing or Clean the bottom of the net.
  • the first wafer loading device 6 and the second wafer loading device 7 The first wafer loading device 6 (or the second wafer loading device 7) is aligned with the first wafer carrier platform 1 (or the second wafer carrier platform 2) at the wafer changing station, the first wafer loading device 6 (or the second wafer loading device 7) cooperates with a transport belt on the first wafer carrier platform 1 (or the second wafer carrier platform 2) to pull the silicon wafer from the first wafer loading device 6 (or the second silicon wafer)
  • the loading device 7) is transported onto the first wafer carrier platform 1 (or the second wafer carrier platform 2).
  • the wafer loading device also has a wafer attitude adjustment function.
  • the wafer orientation can be adjusted to a certain extent by the independent movement of the two conveyor belts on the wafer loading device and the lateral movement of the bottom platform.
  • This attitude adjustment is such that the attitude of the silicon wafer into the wafer carrying platform does not exceed the working range of the screen attitude adjustment mechanism.
  • the silicon wafer 39 needs to be angularly adjusted.
  • the second light sensing 41 first senses the silicon wafer 39, the second motor 44 is stopped, and the first motor 43 is reversed (the motor is rotating forward, the silicon wafer is advanced), and then the two motors rotate forward at the same speed;
  • the third light sensing 42 first senses the silicon wafer 39, and then stops the first motor 43 while the second motor 44 is reversed (the motor is rotating forward, the silicon wafer is advanced), and then the two motors rotate forward at the same speed. It can be seen whether the second light sense 41 and the third light sense 42 can simultaneously sense the silicon wafer 39. If not, the corresponding adjustment is made, thereby circulating, until the second light sense 41 and the third light sense 42 can simultaneously sense the silicon wafer. 39.
  • the silicon wafer loading device approaches the first light sensing 40 along the sliding rail 45.
  • the silicon wafer loading device stops moving. .
  • the wafer loading device can not only finely adjust the angle of the silicon wafer, but also adjust the lateral offset of the silicon wafer. In order to simplify the adjustment process, the wafer is first adjusted in angle and then laterally offset.
  • the first silicon wafer unloading device 8 (or the second silicon wafer unloading device 9) is symmetrically distributed with the first silicon wafer loading device 6 (or the second silicon wafer loading device 7) on the first silicon wafer carrying platform. 1 and transport on both sides of the second wafer carrying platform 2, the first wafer unloading device 8 (or the second wafer unloading device 9) and the first wafer carrying platform 1 (or the second wafer carrying platform 2)
  • the tape is transferred from the first wafer carrier platform 1 (or the second wafer carrier platform 2) to the first wafer unloader 8 (or the second wafer unloader 9).
  • the first screen reference point camera 10 and the second screen reference point camera 11 are mounted below the screen attitude adjustment mechanism 3, as shown in FIG. 9, there are two Mark points on the screen 34, and the first screen reference point
  • the camera 10 and the second screen reference point camera 11 are images for acquiring the two Mark points at the bottom of the screen 34, thereby calculating the posture of the screen 34.
  • the first entry and exit board detecting camera 12 and the second ingress and egress board detecting camera 13 As shown in FIG. 2, the first access panel detecting camera 12 (or the second access panel detecting camera 13) is mounted above the first wafer carrying platform 1 (or the second wafer carrying platform 2) at the changing station. It is used to obtain the image of the silicon wafer. According to the silicon wafer image, the posture of the silicon wafer and the damage can be analyzed when entering the board. Check whether the silicon wafer is damaged when the board is released.
  • the first buffer transport line and the second buffer transport line are vertically arranged with the first wafer unloading device 8 and the second wafer unloading device 9, from the first straight transport belt 14, the second straight transport belt 16, the third straight transport belt 18, and the first The corner transfer conveyor belt 15 and the second corner transfer conveyor belt 17 are formed.
  • the first straight transport belt 14, the second straight transport belt 16, and the third straight transport belt 18 are collinear;
  • the first corner transfer transport belt 15 is perpendicular to the first straight transport belt 14, and is connected to the first silicon wafer
  • the unloading device 8 is collinear;
  • the second corner transfer conveyor belt 17 is perpendicular to the third straight conveyor belt 18 and is collinear with the second wafer unloading device 9.
  • the second buffer transport line is vertically arranged with the first wafer loading device 6 and the second wafer loading device 7, and is composed of a fourth straight transport belt 19, a fifth straight transport belt 21, a sixth straight transport belt 23, and a third corner.
  • the transfer conveyor belt 20 and the fourth corner transfer conveyor belt 22 are constructed. Wherein, the fourth straight transport belt 19, the fifth straight transport belt 21, and the sixth straight transport belt 23 are collinear; the third corner transfer transport belt 20 is perpendicular to the fourth straight transport belt 19, and the first wafer loading device 6 collinear; the fourth corner transfer conveyor belt 22 is perpendicular to the sixth straight conveyor belt 23 and is collinear with the second wafer loading device 7.
  • the second buffer transport line receives wafers to be printed from upstream of the printer, and the first buffer transport line transports the printed wafers downstream of the printer.
  • the through conveyor belt 46 is vertically arranged with the corner transfer conveyor belt 47.
  • a lifting device 48 which, in combination with the upper conveyor belt, causes the corner transfer conveyor belt 47 to rise and fall within a certain range.
  • the intermediate position of the corner transfer conveyor belt 47 is symmetrically opened with two small grooves so that the two conveyor belts of the through conveyor belt 46 can pass without interference, and the groove depth should satisfy the lifting range of the corner transfer conveyor belt 47.
  • the rise and fall of the corner transfer conveyor belt 47 allows the wafers on the straight transport belt 46 and the corner transfer conveyor belt 47 to be transferred to each other: when the corner transfer conveyor belt 47 is above the straight conveyor belt 46, the corner transfer transport The belt 47 is lowered to allow the silicon wafer on the corner transfer conveyor belt 47 to fall onto the straight-through conveyor belt 46; when the corner-shifting conveyor belt 47 is below the straight-through conveyor belt 46, the corner-shifting conveyor belt 47 is raised to allow straight-through The wafer above the conveyor belt 46 is carried over the corner transfer conveyor belt 47. As shown in FIG. 5 and FIG. 6, the initial positions of the four corner transfer conveyor belts are: the third corner transfer transport belt 20 is below the fourth straight transport belt 19, and the fourth corner transfer transport belt 22 is at the sixth straight pass. Below the conveyor belt 23, the first corner transfer conveyor belt 15 is above the first straight conveyor belt 14, and the second corner transfer conveyor belt 17 is below the third straight conveyor belt 18.
  • a fully automatic visual silicon wafer printing device with dual platforms the specific action process is as follows:
  • the fourth through conveyor belt 19 receives wafers to be printed from upstream of the printing press, and the silicon wafers are conveyed forward along the fourth through conveyor belt 19 as the wafers are transferred to the third corner transfer conveyor belt 20 When it is directly above, the silicon wafer can continue to pass in two directions.
  • the first silicon wafer carrying platform 1 enters the board;
  • the fourth straight transport belt 19 stops rotating, and the third corner transfer transport belt 20 rises to lift the silicon wafer until the third corner transfer conveyor belt 20
  • the first wafer loading device 6 stops rising when it is high; the third corner transfer conveyor 20 and the motor on the first wafer loading device 6 rotate, transferring the silicon wafer from the third corner transfer conveyor 20 to the first The wafer loading device 6; when the silicon wafer is transferred to the first wafer loading device 6, the third corner transfer conveyor belt 20 is lowered and lowered to the initial position; while the third corner transfer conveyor belt 20 is lowered, the silicon wafer continues to When the front transfer is transmitted to the middle position of the first wafer loading device 6, if the silicon wafer has a certain angle and lateral offset, the first wafer loading device 6 adjusts the silicon wafer accordingly; after the silicon wafer is corrected, The wafer is then transported to the first wafer carrying platform 1.
  • the second silicon wafer carrying platform 2 enters the board; when the silicon wafer is transferred to the fifth straight transport belt 21, the third corner transfer transport belt 20 does not rise, and the silicon wafer continues along the fourth straight transport belt 19. Passing forward, passing through the fifth straight transport belt 21 to the sixth straight transport belt 23; when the silicon wafer is directly above the fourth corner transfer transport belt 22, the sixth straight transport belt 23 stops rotating, and the fourth corner shift The carrier belt 22 is raised, and the silicon wafer is lifted up until the fourth corner transfer conveyor belt 22 is lifted up with the second wafer loading device 7; the fourth corner transfer conveyor belt 22 and the second wafer loading device The motor on 7 rotates, transferring the silicon wafer from the fourth corner transfer conveyor 22 to the second wafer loading device 7; when the silicon wafer is transferred to the second wafer loading device 7, the fourth corner transfer conveyor 22 is lowered , descending to the initial position; while the fourth corner transfer conveyor 22 is lowered, the silicon wafer continues to pass forward, and when transferred to the middle position of the second wafer loading device 7, if the silicon wafer has
  • the second silicon wafer bearing platform 2 is moved out to the changing station; likewise, when the second silicon wafer carrying platform 2 enters the printing station, the first silicon carrying platform 1 Move out to the changing station.
  • the printing process The first silicon wafer carrying platform 1 and the second silicon wafer bearing platform 2 alternately enter the printing station to realize the ink wiping operation, and the control system alternately loads the first silicon wafer carrying platform 1 and the second silicon wafer bearing platform 2 with the silicon wafer.
  • the printing process is as follows:
  • the silicon wafer is transferred to the first silicon wafer carrying platform 1 through the first silicon wafer carrying platform 1 into the board.
  • the first silicon wafer carrying platform 1 is at the changing station, and the first silicon wafer carrying platform 1 has The silicon wafer is not on the second silicon wafer bearing platform 2.
  • the vacuum suction is opened, the silicon wafer is sucked, and the first entrance and exit panel detecting camera 12 takes a picture to obtain the silicon wafer. Attitude, and analyze whether the silicon wafer is damaged. If not, proceed to the next operation;
  • the first screen reference point camera 10 and the second screen reference point camera 11 take a Mark point of the screen 34 of the printing press, and adjust the posture of the screen 34 by the screen adjusting mechanism 3 to make the screen 34
  • the pattern is aligned with the silicon wafer, and the first wafer carrier platform 1 is moved from the changing station to the printing station.
  • the screen lifting device 4 is lowered to cause the screen 34 to be lowered.
  • the doctor device 5 applies the solder paste or the silver paste to the silicon wafer through the screen 34.
  • the screen lifting device 4 rises, and the silicon wafer on the first silicon wafer carrying platform 1 While being printed, the silicon wafer is transferred from the second wafer loading device 7 to the second wafer carrier platform 2.
  • the vacuum suction sheet is opened to attract the silicon wafer.
  • the second ingress and egress board detects the camera 13 to take a picture, obtains the posture of the silicon wafer, and analyzes whether the silicon wafer is damaged. If not, the next operation is performed;
  • the first screen reference point camera 10 and the second screen reference point camera 11 take a Mark point of the screen 34 of the printing press, and adjust the posture of the screen 34 by the screen adjusting mechanism 3 to make the screen 34
  • the pattern is aligned with the silicon wafer while the second wafer carrier platform 2 is moved from the changing station to the printing station.
  • the screen lifting device 4 is lowered to cause the screen 34 to be lowered.
  • the doctor device 5 applies the solder paste or the silver paste to the silicon wafer through the screen 34.
  • the screen lifting device 4 rises, and the silicon wafer on the second silicon wafer carrying platform 2 While being printed, the printed silicon wafer is transferred from the first wafer carrier platform 1 to the first wafer unloading device 8, and the unprinted silicon wafer on the first wafer loading device 6 is moved into the first wafer carrier.
  • Platform 1 when the silicon wafer reaches the center of the first silicon wafer bearing platform 1, the vacuum suction sheet is opened, the silicon wafer is sucked, the first entrance and exit panel detecting camera 12 takes a picture, and the posture of the silicon wafer is obtained, and at the same time, whether the silicon wafer is damaged or not is analyzed. If not, proceed to the next operation;
  • the first screen reference point camera 10 and the second screen reference point camera 11 take a Mark point of the screen 34 of the printing press, and adjust the posture of the screen 34 by the screen adjusting mechanism 3 to make the screen 34
  • the pattern is aligned with the silicon wafer, and the first wafer carrier platform 1 is moved from the changing station to the printing station.
  • the screen lifting device 4 is lowered to cause the screen 34 to be lowered.
  • the doctor device 5 applies the solder paste or the silver paste to the silicon wafer through the screen 34.
  • the screen lifting device 4 rises, and the silicon wafer on the first silicon wafer carrying platform 1 While being printed, the printed silicon wafer is transferred from the second wafer carrier platform 2 to the second wafer unloading device 9, and the unprinted silicon wafer on the second wafer loading device 7 is moved into the second wafer carrier.
  • Platform 2 when the silicon wafer reaches the center of the second silicon wafer bearing platform 2, the vacuum suction sheet is opened, the silicon wafer is sucked, and the second entrance and exit panel detecting camera 13 takes a picture to obtain the posture of the silicon wafer, and analyzes whether the silicon wafer is damaged or not. If not, proceed to the next operation;
  • the ejecting device is composed of a first buffer transport line, a first wafer unloading device 8, and a second wafer loading device 9.
  • the printed silicon wafer is transferred from both directions to the exit device.
  • the first silicon wafer bearing platform 1 exits the board;
  • the silicon wafer is transferred along the first wafer unloading device 8 to the first corner transfer conveyor belt 15;
  • the first corner transfer transport belt 15 stops rotating while the first corner transfer transport belt 15 descends;
  • the silicon wafer falls onto the first straight transport belt 14
  • the first corner transfer conveyor belt 15 continues to descend for a distance and then stops, while the first straight conveyor belt 14 rotates; the silicon wafer continues to travel forward along the first straight conveyor belt 14 through the second straight conveyor belt 16 It is transferred to the third straight conveyor belt 18, and the silicon wafer printed by the device is sent to the downstream of the printing machine, and the first corner transfer conveyor belt 15 is raised to return to the initial position.
  • the first wafer loading device 6 loading the unprinted silicon wafer into the first A silicon wafer is placed on the platform 1.
  • the silicon wafers in both directions are transmitted there, and the transmission in both directions should be staggered.
  • a sensor is installed at an appropriate position of the ejecting device, and according to the logic design method of the PLC control system, when the silicon wafer is conveyed along the second through conveyor belt 16 in the direction of the second corner transfer conveyor belt 17, the second corner is transferred and transported.
  • the belt 17 is below the third straight conveyor belt 18.
  • the second corner transfer conveyor 17 is again raised to the same level as the second wafer unloading device 9. It should be noted that after the printed silicon wafer is transferred from the second wafer carrying platform 2 to the second wafer unloading device 9, the second wafer loading device 7 is loaded with the unprinted silicon wafer.
  • the two silicon wafers are carried on the platform 2.
  • the printing device adopts a double-bearing platform structure, and two carrying platforms alternately enter the printing station to realize the squeegeing operation, so that one carrying platform performs the film changing while the other carrying platform performs the silicon printing to ensure the printing.
  • the printing device can realize the changing and squeegeing operations at the same time, even if the changing of the film is parallel with the printing process, thereby reducing the production time and greatly improving the production efficiency per unit time of the production line.
  • the entrance and exit boards are all transported by the transport belt, the structure is simple, the movement is stable, and the entrance and exit board detection camera can also realize the board damage detection.
  • the dual-view automatic visual silicon wafer printing installation also requires a positioning device, an image acquisition device, a camera controller, an image acquisition card, a positioning device controller, an image processing, a general-purpose computer, and a motion controller.
  • the positioning device includes a first light sense 40, a second light sense 41, and a third light sense 42.
  • the image capture device includes a first screen reference point camera 10, a second screen reference point camera 11, and a first entrance and exit board detection.
  • the camera 12 and the third access panel detect the camera 13; the camera controller controls image acquisition of the image capture device; the image capture card sends the image signal to the CPU for processing or saving to the memory; and the motion controller controls the action of the printing device.
  • the invention has the characteristics of compact structure, stable transmission, simple manufacture and installation, convenient maintenance, high printing quality, high production efficiency and small occupied area, and can be used for various printing of silicon wafers.

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Abstract

一种具有双平台的全自动视觉硅片印刷装置包括:两个硅片承载平台(1,2),两个进出板检测相机(12,13),一个丝网升降装置(4),一个丝网姿态调整机构(3),两个丝网基准点相机(10,11),一个刮墨装置(5),两套硅片装载装置(6,7),两套硅片卸载装置(8,9),以及两套缓冲运输线(14-18,19-23)。两个硅片承载平台安装在一个横向移动的基座(24)上,可交替进入印刷工位实现刮墨操作,未在印刷工位的硅片承载平台可同步装载、卸载硅片。该印刷装置采用双硅片承载平台结构,可实现换片与印刷工序并行,提高生产效率,且该装置结构紧凑,设备占用面积小。

Description

一种具有双平台的全自动视觉硅片印刷装置
技术领域
本发明 涉及一种硅片印刷装置,具体涉及能实现双平台的轮流印刷的全自动视觉硅片印刷装置。
背景技术
随着全球能源的日趋紧张 , 太阳能以无污染、市场空间大等独有的优势受到世界各国的广泛重视 , 国际上众多大公司投入太阳能电池研发和生产行业。从太阳能获得电力,需通过太阳能电池进行光电变换来实现,硅太阳能电池是一种有效地吸收太阳能辐射并使之转化为电能的半导体电子器件 , 广泛应用于各种照明及发电系统中。太阳能电池制造商当今面临的挑战正在开始两极分化成两大重点:提高太阳能电池的功率以增加单位面积的发电量;其次是无需增加相应投资而以现有的工艺提高生产力的愿望或需求。
太阳能电池印刷是电池片生产线的重要工序,对电池片的质量起着重要作用,太阳能电池印刷技术是一个有机的整体,是各种技术的组合。太阳能电池分晶硅电池和薄膜电池,目前薄膜电池技术在成本上有相对优势,但在技术成熟度、寿命和转换效率方面都难以和晶硅电池相提并论,晶硅电池在太阳能电池市场中占了绝对的垄断地位,单位发电量的成本仍高于传统的发电方式,因此降低成本是晶硅太阳能行业可持续发展的关键因素,而晶硅电池片生产效率构成电池片成本的一个重要因素。 现有印刷装置一般采用单一承载平台结构,如图 1 所示,该印刷装置只有一个承载平台,硅片从上游传入硅片装载装置 101 ,硅片装载装置 101 有硅片姿态调整功能,对硅片姿态做初步校正。然后,硅片沿着硅片装载装置 101 继续向前传递。硅片传递到硅片承载平台 103 的中央,硅片承载平台 103 上的真空吸把硅片定住。进板姿态相机 107 和出板姿态相机 105 可移动,从硅片承载平台 103 两侧进入,拍硅片对角的两个边沿部分的图像,拍照后进板姿态相机 107 和出板姿态相机 105 移出。丝网基准点相机 102 拍照,获取丝网印刷机 106 丝网底部两个基准点的图像 ,调整丝网 使丝网上的图案与硅片对准 。丝网印刷机 106 升降台下降,开始刮墨印刷。印刷完毕后,丝网印刷机 106 升降台上升,硅片承载平台 103 上的真空吸关闭,硅片承载平台 103 和硅片卸载装置 104 上的运输带配合,把硅片从硅片承载平台 103 移到硅片卸载装置 104 ,再沿着硅片卸载装置 104 传递到下游。不难看出,印刷装置只有一个硅片承载平台时,装载、拍照、调整、升降、印刷、卸载工序等串联衔接,印刷完成一张硅片所耗的时间比较多,限制了生产效率的提升。 有的印刷机还采用转台式结构,通过工位旋转,实现换片和印刷并行操作,但一是转台成本较高,二是转台较大,不利于减少机器占地面积。
发明内容
本发明的目的在于克服现有技术的缺点,提供一种结构紧凑、生产效率高,占地面积少,可以实现换片与印刷工序并行操作的具有双平台的全自动视觉硅片印刷装置。为实现本发明的目的,本发明采用的技术方案如下。
一种具有双平台的全自动视觉硅片印刷装置, 包括 两个硅片承载平台,两个进出板检测相机,一个丝网升降装置,一个丝网姿态调整机构,两个丝网基准点相机 , 一个刮墨装置,两套 硅片装载装置,两套硅片卸载装置,两套缓冲运输线 ;两个硅片承载平台安装在一个横向移动的基座上, 交替进入印刷工位实现刮墨操作 ;进出板检测相机安装在硅片承载平台的换片工位上方,用于获取硅片的图像;丝网升降装置安装在印刷机的四个支撑柱上,用于使丝网贴近硅片和离开硅片,以便实现硅片印刷、脱模以及清洗网底;丝网姿态调整机构安装在印刷机的丝网升降装置上,用于使丝网实现 XY 平行移动和旋转定位;两个丝网基准点相机安装在丝网姿态调整机构的下方,且对称分布于在印刷工位的硅片承载平台的两侧,用来获取丝网底部两个基准点的图像;刮墨装置安装在丝网姿态调整机构的上方,通过刮刀的上下运动和前后运动把涂料压印到硅片上;两套 硅片装载装置与未在印刷工位的硅片承载平台对齐,且对称分布在印刷机的两侧,能调整硅片的角度和横向偏移 ; 硅片卸载装置与硅片装载装置对称分布在硅片承载平台两侧;两套缓冲运输线均与硅片装载装置和硅片卸载装置呈垂直布置,用于 从上游接收需要印刷的硅片,或把印刷好的硅片传送到下游。
进一步的,上述具有双平台的全自动视觉硅片印刷装置中,每个硅片承载平台上方装有运输带,平台中间部位有多个均匀分布的小孔,运输带上面也有多个均匀分布的小孔,这些小孔通过真空吸功能把硅片吸附在平台上;运输带覆盖平台上用于支撑硅片的平面,这样可以令印刷时硅片底部获得均匀支撑,从而能减少硅片的破损。平台下方有能实现横向移动的滑轨。该结构可以实现 换片与印刷工序过程并行 。
进一步的,所述的丝网姿态调整机构是一个平面三自由度串联机构,能实现 XY 平行移动和旋转定位。
进一步的,所述的刮墨装置包括刮刀、刮刀前后运动机构、刮刀上下运动机构和回墨机构,刮刀前后运动机构使刮刀前后运动,刮刀上下运动机构使刮刀上下运动,刮刀的上下运动和前后运动实现把涂料压印到硅片上。
进一步的,每套硅片装载装置上方装有两条用于调整硅片角度的运输带,且该运输带的附近装有用于感应硅片位置的三个光感,硅片装载装置下方具有用于平移运动来调整硅片横向位移的底部平台。
进一步的,上述具有双平台的全自动视觉硅片印刷装置中, 每套缓冲运输线由三条直通运输带和两条转角移载运输带构成,直通运输带和转角移载运输带的配合,把硅片分配到两个硅片装载装置或把经过印刷的硅片从两套独立的硅片卸载装置集中到同一个出板运输线。
上述具有双平台的全自动视觉硅片印刷装置中,根据进出板检测相机、丝网基准点相机所得硅片、丝网姿态调整机构姿态信息,实现硅片和丝网的高精度对准。
本发明是 在现有单承载台工艺的基础上对印刷设备创新设计,采用双承载平台结构,使 一个承载平台在换硅片时,另外一个承载平台在进行硅片印刷,保证了印刷装置可以对两片硅片同时实现换片和刮墨操作,即 使换片与印刷工序过程并行 。
本发明与现有技术相比,具有如下优点和有益效果: ( 1 )本发明的进出板都采用带传递,结构简单,运动平稳,制造和安装简单,维护方便;
( 2 )本发明 采用双承载平台结构,使换片与印刷工序过程并行,从而减少了生产时间,大幅提高生产线单位时间的生产效率 ; ( 3 )本发明的结构紧凑,设备占用面积小。
附图说明
图1是现有采用单承载平台结构的印刷装置的示意图。
图2是本发明的具有双平台的全自动视觉硅片印刷装置结构示意图。
图3是本发明的具有双平台的全自动视觉硅片印刷装置左侧示意图。
图4是本发明的具有双平台的全自动视觉硅片印刷装置右侧示意图。
图5是本发明的进板装置的示意图; 图6是本发明的出板装置的示意图。
图7是本发明的硅片承载平台的示意图; 图8是本发明的硅片承载平台的前视图。
图9是本发明的丝网姿态调整机构的示意图; 图10是本发明的刮墨装置的示意图。
图11是本发明的硅片装载装置的示意图; 图12是本发明的直通运输带与转角移载运输带的装配图。
图13是本发明的流程示意图; 图14是本发明的控制系统。
具体实施方式
如图2~图4所示,具有双平台的全自动视觉硅片印刷装置包括第一硅片承载平台1,第二硅片承载平台2,丝网姿态调整机构3,刮墨装置5,丝网升降装置4,第一硅片装载装置6,第二硅片装载装置7,第一硅片卸载装置8,第二硅片卸载装置9,第一丝网基准点相机10,第二丝网基准点相机11,第一进出板检测相机12,第二进出板检测相机13,第一直通运输带14,第一转角移载运输带15,第二直通运输带16,第二转角移载运输带17,第三直通运输带18,第四直通运输带19,第三转角移载运输带20,第五直通运输带21,第四转角移载运输带22,第六直通运输带23。其中,第一直通运输带14、第二直通运输带16、第三直通运输带18和第一转角移载运输带15、第二转角移载运输带17组成第一缓冲运输线;第四直通运输带19、第五直通运输带21、第六直通运输带23和第三转角移载运输带20、第四转角移载运输带22组成第二缓冲运输线。 所述各个装置的构成和作用如下:
(1)第一硅片承载平台1和第二硅片承载平台2。硅片承载平台的作用是在往硅片上涂覆印刷时给硅片提供平整的支撑。该印刷装置采用双硅片承载平台结构:第一硅片承载平台1和第二硅片承载平台2,可以实现换片与印刷工序过程并行。
如图7、图8所示,硅片承载平台是一个平整的平台,平台上方是一条宽而薄的扁平运输带26,扁平运输带26的驱动轮和从动轮分布在平台两侧,由电机27带动。平台中间部位有许多均匀分布的小孔,运输带26上面也有许多均匀分布的小孔,这些小孔通过真空吸功能把硅片吸附在平台上。运输带26覆盖平台支撑硅片25的那个平面,这样可以令印刷时硅片25底部获得均匀支撑,从而能减少硅片25的破损。平台下方有滑轨28,可实现平台的横向移动。第一硅片承载平台1和第二硅片承载平台12完全相同,对称分布在基座24上。
当第一硅片承载平台1或第二硅片承载平台2在刮墨装置5下方时,称为平台在印刷工位(如图2中第二硅片承载平台2在印刷工位);而第一硅片承载平台1 (或第二硅片承载平台2)与第一硅片装载装置6(或第二硅片装载装置7)的运输带对准可以实施换片的位置,称为换片工位(如图2中第一硅片承载平台1在换片工位)。第一硅片承载平台1和第二硅片承载平台2安装在同一个可以横向移动的基座24上,因此当第一硅片承载平台1进入印刷工位时,第二硅片承载平台2移出到换片工位;同样,当第二硅片承载平台2进入印刷工位时,第一硅片承载平台1移出到换片工位。
装载新硅片时,通过第一硅片装载装置6(或第二硅片装载装置7)和第一硅片承载平台1(或第二硅片承载平台2)上的运输带配合,把未印刷的硅片传送到第一硅片承载平台1(或第二硅片承载平台2)上,当硅片传递到平台中央时,开启平台上的真空吸把硅片吸住,以防平台运动或刮墨时硅片移动;卸载印刷过的硅片时,通过第一硅片承载平台1(或第二硅片承载平台2)和第一硅片卸载装置8(或第二硅片卸载装置9)上的运输带配合,把印刷好的硅片传送到第一硅片卸载装置8(或第二硅片卸载装置9)上。
(2)丝网姿态调整机构3。 丝网姿态调整机构3的作用是根据硅片的姿态调整丝网的姿态,令丝网上的图案与硅片对齐,使涂料能正确转印到丝网上。 如图9所示,丝网姿态调整机构3由丝网固定架29、导向轮30、导向块31和传动板32等组成。导向块31固定在丝网固定架29上,传动板32与丝网固定架29通过螺栓联接。导向轮30定位不变,但可转动。导向块31与导向轮30之间的配合如图9右上侧的局部图所示。驱动通过传动板32传递到丝网固定架29,使丝网固定架29能在XY平移和旋转运动。 图9所示的丝网姿态调整机构3仅是其中的一种代表机构,还有其他形式的丝网姿态调整机构,这里不作过多说明。 因为丝网34安装在丝网姿态调整机构3上,从而丝网34能实现XY平行移动和旋转定位。丝网34调整后,通过丝网锁紧气缸33把丝网34锁紧在丝网姿态调整机构3上。
(3)刮墨装置5。 刮墨装置5通过刮刀的上下运动和前后运动把涂料压印到硅片上。如图10所示,刮墨装置5包括刮刀35、刮刀上下运动机构38、刮刀前后运动机构36和回墨机构37等。其中,刮刀前后运动机构36由电机驱动,刮刀上下运动机构38由汽缸推动。
(4)丝网升降装置4。 如图2所示,丝网姿态调整机构3和刮墨装置5安装在丝网升降装置4上,丝网升降装置4由电机驱动,当第一硅片承载平台1(或第二硅片承载平台2)在印刷工位时,通过丝网升降装置4使丝网34贴近和离开第一硅片承载平台1(或第二硅片承载平台2)上的硅片,以便实现硅片印刷或清洗网底。
(5)第一硅片装载装置6和第二硅片装载装置7。 第一硅片装载装置6(或第二硅片装载装置7)与第一硅片承载平台1(或第二硅片承载平台2)在换片工位时对齐,第一硅片装载装置6(或第二硅片装载装置7)和第一硅片承载平台1(或第二硅片承载平台2)上的运输带配合把硅片从第一硅片装载装置6(或第二硅片装载装置7)输送到第一硅片承载平台1(或第二硅片承载平台2)上。 硅片装载装置还有硅片姿态调整功能。当检测到硅片姿态偏离严重时,通过硅片装载装置上两个运输带的独立运动和底部平台的横向移动,可以把硅片姿态调整到一定的范围内。这种姿态调整是令硅片进入硅片承载平台时姿态不会超出丝网姿态调整机构工作范围。如图11所示,如果第二光感41和第三光感42不能同时感应硅片39,那么需要对硅片39进行角度调整。假如第二光感41先感应硅片39,则使第二电机44停转,同时使第一电机43反转(电机正转,硅片前进)一点,然后两电机以相同转速正转;假如第三光感42先感应硅片39,则使第一电机43停转,同时使第二电机44反转(电机正转,硅片前进)一点,然后两电机以相同转速正转。看第二光感41和第三光感42是否能同时感应硅片39,如果不能,则作相应的调整,以此循环,直至第二光感41和第三光感42能同时感应硅片39。如果第一光感40不能感应硅片39,则硅片装载装置沿着滑轨45向第一光感40靠近,当第一光感40一感应到硅片39,硅片装载装置就停止移动。基于以上原理,硅片装载装置不仅能微调硅片的角度,还能调整硅片的横向偏移。为了使调整过程简单化,先对硅片进行角度调整,再进行横向偏移调整。
(6)第一硅片卸载装置8和第二硅片卸载装置9。 如图2所示,第一硅片卸载装置8(或第二硅片卸载装置9)与第一硅片装载装置6(或第二硅片装载装置7)对称分布在第一硅片承载平台1和第二硅片承载平台2两侧,第一硅片卸载装置8(或第二硅片卸载装置9)和第一硅片承载平台1(或第二硅片承载平台2)上的运输带配合把硅片从第一硅片承载平台1(或第二硅片承载平台2)转移到第一硅片卸载装置8(或第二硅片卸载装置9)上。
(7)第一丝网基准点相机10和第二丝网基准点相机11。 第一丝网基准点相机10和第二丝网基准点相机11安装在丝网姿态调整机构3的下方,如图9所示,丝网34上有两个Mark点,第一丝网基准点相机10和第二丝网基准点相机11就是用来获取丝网34底部这两个Mark点的图像,从而计算出丝网34的姿态。
(8)第一进出板检测相机12和第二进出板检测相机13。 如图2所示,第一进出板检测相机12(或第二进出板检测相机13)安装在第一硅片承载平台1(或第二硅片承载平台2)在换片工位时的上方,用于获取硅片的图像,根据硅片图像,进板时可以分析硅片的姿态和是否破损,出板时检查硅片是否破损。
(9)第一缓冲运输线和第二缓冲运输线。 第一缓冲运输线与第一硅片卸载装置8和第二硅片卸载装置9呈垂直布置,由第一直通运输带14、第二直通运输带16、第三直通运输带18和第一转角移载运输带15、第二转角移载运输带17构成。其中,第一直通运输带14、第二直通运输带16、第三直通运输带18共线;第一转角移载运输带15与第一直通运输带14垂直,且与第一硅片卸载装置8共线;第二转角移载运输带17与第三直通运输带18垂直,且与第二硅片卸载装置9共线。 第二缓冲运输线与第一硅片装载装置6和第二硅片装载装置7呈垂直布置,由第四直通运输带19、第五直通运输带21、第六直通运输带23和第三转角移载运输带20、第四转角移载运输带22构成。其中,第四直通运输带19、第五直通运输带21、第六直通运输带23共线;第三转角移载运输带20与第四直通运输带19垂直,且与第一硅片装载装置6共线;第四转角移载运输带22与第六直通运输带23垂直,且与第二硅片装载装置7共线。 第二缓冲运输线从印刷机上游接收需要印刷的硅片,第一缓冲运输线把印刷好的硅片传送到印刷机下游。
如图12所示,直通运输带46与转角移载运输带47呈垂直布置。转角移载运输带47的下面有升降装置48,与上面的运输带结合在一起,使转角移载运输带47在一定范围内上升和下降。转角移载运输带47的中间位置对称的开有两个小槽,使直通运输带46的两根运输带能通过而不干涉,且槽深应满足转角移载运输带47的升降范围。转角移载运输带47的上升和下降可使直通运输带46和转角移载运输带47上面的硅片相互移载:当转角移载运输带47在直通运输带46上方时,转角移载运输带47下降,可使转角移载运输带47上面的硅片落到直通运输带46上面;当转角移载运输带47在直通运输带46下方时,转角移载运输带47上升,可把直通运输带46上面的硅片托到转角移载运输带47上面。 如图5、图6所示,四条转角移载运输带的初始位置为:第三转角移载运输带20在第四直通运输带19的下方,第四转角移载运输带22在第六直通运输带23的下方,第一转角移载运输带15在第一直通运输带14的上方,第二转角移载运输带17在第三直通运输带18的下方。
具有双平台的全自动视觉硅片印刷装置,具体的动作过程如下:
1.进板过程。 如图5所示,第四直通运输带19从印刷机上游接收需要印刷的硅片,硅片沿着第四直通运输带19向前传递,当硅片传递到第三转角移载运输带20的正上方时,硅片可有两个方向继续传递。
(1)第一硅片承载平台1进板; 当硅片向第一硅片装载装置6方向传递时,第四直通运输带19停止转动,第三转角移载运输带20上升,把硅片托起,直至第三转角移载运输带20与第一硅片装载装置6齐高时停止上升;第三转角移载运输带20和第一硅片装载装置6上的电机转动,把硅片从第三转角移载运输带20转移到第一硅片装载装置6;硅片传递到第一硅片装载装置6时,第三转角移载运输带20下降,下降到初始位置;第三转角移载运输带20下降的同时,硅片继续向前传递,传递到第一硅片装载装置6的中间位置时,如果硅片有一定角度和横向偏移,则第一硅片装载装置6作相应的调整把硅片摆好;硅片校正后,继续把硅片运输到第一硅片承载平台1。
(2)第二硅片承载平台2进板;当硅片向第五直通运输带21方向传递时,第三转角移载运输带20不升起,硅片沿着第四直通运输带19继续向前传递,经过第五直通运输带21传递到第六直通运输带23;当硅片处于第四转角移载运输带22的正上方时,第六直通运输带23停止转动,第四转角移载运输带22上升,把硅片托起,直至第四转角移载运输带22与第二硅片装载装置7齐高时停止上升;第四转角移载运输带22和第二硅片装载装置7上的电机转动,把硅片从第四转角移载运输带22转移到第二硅片装载装置7;硅片传递到第二硅片装载装置7时,第四转角移载运输带22下降,下降到初始位置;第四转角移载运输带22下降的同时,硅片继续向前传递,传递到第二硅片装载装置7的中间位置时,如果硅片有一定角度和横向偏移,则第二硅片装载装置7作相应的调整把硅片摆好;硅片校正后,继续把硅片运输到第二硅片承载平台2。
当第一硅片承载平台1进入印刷工位时,第二硅片承载平台2移出到换片工位;同样,当第二硅片承载平台2进入印刷工位时,第一硅片承载平台1移出到换片工位。
2.印刷过程。 第一硅片承载平台1和第二硅片承载平台2交替进入印刷工位实现刮墨操作,相应地控制系统交替给第一硅片承载平台1和第二硅片承载平台2装载硅片。如图2所示,印刷过程如下:
(1)硅片通过第一硅片承载平台1进板传递到第一硅片承载平台1,此时第一硅片承载平台1处在换片工位,第一硅片承载平台1上有硅片,第二硅片承载平台2上没有,当硅片到达第一硅片承载平台1的中央时,真空吸打开,吸住硅片,第一进出板检测相机12拍照,获取硅片的姿态,同时分析硅片是否破损,如果没有,则进行下一操作;
(2)第一丝网基准点相机10和第二丝网基准点相机11拍下印刷机的丝网34的Mark点,通过丝网调整机构3调整丝网34的姿态使丝网34上的图案与硅片对准,同时第一硅片承载平台1从换片工位向印刷工位移动,当第一硅片承载平台1到达印刷工位,丝网升降装置4下降,使丝网34与硅片贴近,刮刀装置5把锡浆或银浆透过丝网34涂覆在硅片上,刮墨完成后,丝网升降装置4上升,在第一硅片承载平台1上的硅片被印刷的同时,从第二硅片装载装置7传递硅片到第二硅片承载平台2上,当硅片到达第二硅片承载平台2的中央时,真空吸片打开,吸住硅片,第二进出板检测相机13拍照,获取硅片的姿态,同时分析硅片是否破损,如果没有,则进行下一操作;
(3)第一丝网基准点相机10和第二丝网基准点相机11拍下印刷机的丝网34的Mark点,通过丝网调整机构3调整丝网34的姿态使丝网34上的图案与硅片对准,同时第二硅片承载平台2从换片工位向印刷工位移动,当第二硅片承载平台2到达印刷工位,丝网升降装置4下降,使丝网34与硅片贴近,刮刀装置5把锡浆或银浆透过丝网34涂覆在硅片上,刮墨完成后,丝网升降装置4上升,在第二硅片承载平台2上的硅片被印刷的同时,印刷好的硅片从第一硅片承载平台1传递到第一硅片卸载装置8,而第一硅片装载装置6上未印刷的硅片被移入到第一硅片承载平台1,当硅片到达第一硅片承载平台1的中央时,真空吸片打开,吸住硅片,第一进出板检测相机12拍照,获取硅片的姿态,同时分析硅片是否破损,如果没有,则进行下一操作;
(4)第一丝网基准点相机10和第二丝网基准点相机11拍下印刷机的丝网34的Mark点,通过丝网调整机构3调整丝网34的姿态使丝网34上的图案与硅片对准,同时第一硅片承载平台1从换片工位向印刷工位移动,当第一硅片承载平台1到达印刷工位,丝网升降装置4下降,使丝网34与硅片贴近,刮刀装置5把锡浆或银浆透过丝网34涂覆在硅片上,刮墨完成后,丝网升降装置4上升,在第一硅片承载平台1上的硅片被印刷的同时,印刷好的硅片从第二硅片承载平台2传递到第二硅片卸载装置9,而第二硅片装载装置7上未印刷的硅片被移入到第二硅片承载平台2,当硅片到达第二硅片承载平台2的中央时,真空吸片打开,吸住硅片,第二进出板检测相机13拍照,获取硅片的姿态,同时分析硅片是否破损,如果没有,则进行下一操作;
(5)此后,第一硅片承载平台1和第二硅片承载平台2交替进入印刷工位,循环过程如(3)、(4)所述。
3.出板过程。 如图6所示,出板装置由第一缓冲运输线、第一硅片卸载装置8和第二硅片装载装置9组成。印刷好的硅片从两个方向传到出板装置。
(1)第一硅片承载平台1出板; 当印刷好的硅片从第一硅片承载平台1传递到第一硅片卸载装置8时,硅片沿着第一硅片卸载装置8传递给第一转角移载运输带15;当硅片处在第一直通运输带14的正上方时,第一转角移载运输带15停止转动,同时第一转角移载运输带15下降;当硅片落到第一直通运输带14上时,第一转角移载运输带15继续下降一段距离后停止下降,同时第一直通运输带14转动;硅片沿着第一直通运输带14继续向前传递,经过第二直通运输带16传递到第三直通运输带18,再把本设备印刷过的硅片送到印刷机下游,同时第一转角移载运输带15上升,回到初始位置。
需要注意到是,当印刷好的硅片从第一硅片承载平台1传递到第一硅片卸载装置8后,紧随的就是第一硅片装载装置6把未印刷的硅片装载到第一硅片承载平台1上。
(2)第二硅片承载平台2出板; 当印刷好的硅片从第二硅片承载平台2传递到第二硅片卸载装置9时,硅片沿着第二硅片卸载装置9继续向前传递,同时第二转角移载运输带17上升,直至第二转角移载运输带17与第二硅片卸载装置9齐高时停止上升;第二转角移载运输带17转动,硅片从第二硅片卸载装置9传递到第二转角移载运输带17;硅片沿着第二转角移载运输带17运输,当硅片处在第三直通运输带18的正上方时,第二转角移载运输带17停止转动,同时第二转角移载运输带17下降;当硅片落到第三直通运输带18上时,第二转角移载运输带17继续下降一段距离后停止下降,下降到初始位置,同时第三直通运输带18转动;硅片沿着第三直通运输带18继续向前传递,把本设备印刷过的硅片送到印刷机下游。
在第二转角移载运输带17处,有两个方向的硅片向此处传递,应把两个方向的传递错开。在出板装置的适当位置装有传感器,根据PLC控制系统的逻辑设计法,使硅片沿着第二直通运输带16向第二转角移载运输带17方向传递时,第二转角移载运输带17处在第三直通运输带18的下方。当硅片沿着第二硅片卸载装置9向第二转角移载运输带17方向传递时,第二转角移载运输带17又上升到与第二硅片卸载装置9等高。需要注意的是,当印刷好的硅片从第二硅片承载平台2传递到第二硅片卸载装置9后,紧随的就是第二硅片装载装置7把未印刷的硅片装载到第二硅片承载平台2上。
综上所述,本印刷装置采用双承载平台结构,两个承载平台交替进入印刷工位实现刮墨操作,使一个承载平台在进行换片的同时,另外一个承载平台在进行硅片印刷,保证了印刷装置可以同时实现换片和刮墨操作,即使换片与印刷工序过程并行,从而减少了生产时间,大幅提高生产线单位时间的生产效率。而且进出板都采用运输带传递,结构简单,运动平稳,进出板检测相机还能实现出板破损检测。
如图14所示,为了配合本发明的印刷装置的工作,根据进出板检测相机、丝网基准点相机所得硅片、丝网姿态调整机构姿态信息,实现硅片和丝网的高精度对准。本具有双平台的全自动视觉硅片印刷装工作时还需定位装置、图像采集装置、摄像控制器、图像采集卡、定位装置控制器、图像处理、通用计算机和运动控制器等。其中,定位装置包括第一光感40、第二光感41和第三光感42;图像采集装置包括第一丝网基准点相机10、第二丝网基准点相机11、第一进出板检测相机12和第三进出板检测相机13;摄像控制器控制图像采集装置的图像采集;图像采集卡将图像信号送给CPU处理或保存到存储器;运动控制器控制印刷装置的动作。
为了更直观的了解该印刷装置的工作流程,可以参考图13。 本发明具有结构紧凑、传动平稳、制造和安装简单、维护方便、印刷质量高、生产效率高、占地面积小等特点,可用于硅片的各种印刷。
以上所述之具体实施方式仅为本发明的较佳实施方式,并非以此限定本发明的具体实施范围,凡依照本发明之形状、结构所作的等效变化均在本发明的保护范围内。

Claims (6)

  1. 一种具有双平台的全自动视觉硅片印刷装置,其特征在于包括两个硅片承载平台,两个进出板检测相机,一个丝网升降装置,一个丝网姿态调整机构,两个丝网基准点相机,一个刮墨装置,两套硅片装载装置,两套硅片卸载装置,两套缓冲运输线;两个硅片承载平台安装在一个横向移动的基座上,交替进入印刷工位实现刮墨操作;进出板检测相机安装在硅片承载平台的换片工位上方,用于获取硅片的图像;丝网升降装置安装在印刷机的四个支撑柱上,用于使丝网贴近硅片和离开硅片,以便实现硅片印刷、脱模以及清洗网底;丝网姿态调整机构安装在印刷机的丝网升降装置上,用于使丝网实现XY平行移动和旋转定位;两个丝网基准点相机安装在丝网姿态调整机构的下方,且对称分布于在印刷工位的硅片承载平台的两侧,用来获取丝网底部两个基准点的图像;刮墨装置安装在丝网姿态调整机构的上方,通过刮刀的上下运动和前后运动把涂料压印到硅片上;两套硅片装载装置与未在印刷工位的硅片承载平台对齐,且对称分布在印刷机的两侧,能调整硅片的角度和横向偏移;硅片卸载装置与硅片装载装置对称分布在硅片承载平台两侧;两套缓冲运输线均与硅片装载装置和硅片卸载装置呈垂直布置,用于从上游接收需要印刷的硅片,或把印刷好的硅片传送到下游。
  2. 根据权利要求1所述的具有双平台的全自动视觉硅片印刷装置,其特征在于每个硅片承载平台上方装有运输带,平台中间部位有多个均匀分布的小孔,运输带上面也有多个均匀分布的小孔,这些小孔通过真空吸功能把硅片吸附在平台上;运输带覆盖平台上用于支撑硅片的平面;平台下方有能实现横向移动的滑轨。
  3. 根据权利要求1所述用于印刷硅片的全自动视觉印刷装置,其特征在于所述的丝网姿态调整机构是一个平面三自由度串联机构,能实现XY平行移动和旋转定位。
  4. 根据权利要求1所述具有双平台的全自动视觉硅片印刷装置,其特征在于所述的刮墨装置包括刮刀、刮刀前后运动机构、刮刀上下运动机构和回墨机构,刮刀前后运动机构使刮刀前后运动,刮刀上下运动机构使刮刀上下运动,刮刀的上下运动和前后运动实现把涂料压印到硅片上。
  5. 根据权利要求1所述具有双平台的全自动视觉硅片印刷装置,其特征在于每套硅片装载装置上方装有两条用于调整硅片角度的运输带,该两条运输带分别由两个电机带动,且运输带的附近装有用于感应硅片位置的三个光感;硅片装载装置下方具有用于平移运动来调整硅片横向位移的底部平台。
  6. 根据权利要求1所述具有双平台的全自动视觉硅片印刷装置,其特征在于,套缓冲运输线由三条直通运输带和两条转角移载运输带构成,直通运输带和转角移载运输带的配合,把硅片分配到两个硅片装载装置或把经过印刷的硅片从两套独立的硅片卸载装置集中到同一个出板运输线。
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